JP2016100587A - Method for dividing package substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for dividing a package substrate, by which high productivity of a device package can be maintained.SOLUTION: A method for dividing a package substrate comprises: a step of dividing a package substrate (11) including a device part (15) partitioned into a plurality of device package regions (21) by a division scheduled line (19) on the surface, and an extra part (17) surrounding the device part, into a plurality of device packages (25) by cutting the substrate along the division scheduled line. The method further comprises: a release agent coating step for coating a region on the backside of the package substrate, corresponding to the extra part, with a release agent (7); a tape sticking step for sticking an adhesive tape (31) to the backside of the package substrate; and a division step for dividing the package substrate into the plurality of device packages by cutting the substrate with a cutting blade (36). In the division step, the extra part is removed from the adhesive tape by scattering the extra part separated from the package substrate by the rotation of the cutting blade.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a method for dividing a package substrate in which a plurality of devices are sealed with resin or the like.

  In semiconductor package technologies such as CSP (Chip Size Package) and QFN (Quad Flat Non-leaded Package), a package substrate in which a plurality of devices (or device chips) are sealed with resin or the like is used. The package substrate includes a plurality of device units each including a plurality of devices and a surplus portion surrounding each device unit.

  Each device section is partitioned into a plurality of device package areas corresponding to each device by a division line on the front side. A plurality of device packages corresponding to each device (device chip) can be formed by dividing the package substrate along the division line.

  When the package substrate is divided by a method such as cutting, an adhesive tape is attached to the back side of the package substrate in order to prevent scattering of the device package formed by the division (see, for example, Patent Document 1). . However, simply by sticking an adhesive tape, various mechanisms for holding the package substrate or the like must be designed specifically for the package substrate.

  Therefore, generally, an annular frame is fixed to the outer peripheral portion of the adhesive tape attached to the back side of the package substrate (see, for example, Patent Document 2). In this manner, by fixing the frame to the adhesive tape, different types of package substrates can be appropriately divided without changing the configuration of the cutting device.

JP 2000-208445 A JP 2000-23080 A

  By the way, after dividing the package substrate, the device package is picked up (peeled) from the adhesive tape. At this time, if an attempt is made to pick up a plurality of device packages, an error such as erroneously picking up the surplus portion when the surplus portion remains on the adhesive tape may occur, which may hinder the work. is there. In particular, when a plurality of device packages are peeled at once, the hindrance to the work is remarkable. Therefore, the surplus portion is picked up and removed in advance.

  However, when the package substrate is divided along the division line, the surplus portion is also divided into small pieces. As a result, it takes a long time to pick up the surplus part, and the productivity of the device package decreases. This problem is particularly serious in a package substrate having a small device package size and a large number of lines to be divided.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a method for dividing a package substrate that can maintain high device package productivity.

  According to the present invention, a package substrate including a device part partitioned into a plurality of device package regions by a surface division planned line and an excess part surrounding the device part is cut along the division planned line, A method for dividing a package substrate into device packages, wherein a release agent coating step for coating a release agent on a region corresponding to the surplus portion on the back surface of the package substrate, and after performing the release agent coating step A tape adhering step for adhering the adhesive tape to the back surface of the package substrate; and after performing the tape adhering step, the cutting substrate positioned at a height to be cut into the adhesive tape along the planned dividing line. And dividing the package substrate into a plurality of device packages, and in the dividing step, The surplus portion separated from the over-di substrate by causing scattered by the rotation of the cutting blade, a method of dividing the package substrate, and removing the excess portion from the adhesive tape is provided.

  In the method for dividing a package substrate according to the present invention, a release agent coating step for coating the release agent in a region corresponding to the surplus portion of the back surface of the package substrate, and tape adhesion for adhering the adhesive tape to the back surface of the package substrate Since the dividing step of dividing the package substrate is performed after the steps are performed, the excess portion separated from the package substrate in the dividing step can be scattered by the rotation of the cutting blade and removed from the adhesive tape. That is, since it is not necessary to pick up the surplus part, the productivity of the device package can be maintained high.

FIG. 1A is a perspective view schematically showing a package substrate divided by the package substrate dividing method according to the present embodiment, and FIG. 1B is a cross-sectional view schematically showing the package substrate. is there. It is a partial cross section side view which shows a mold release agent coating | coated step typically. FIG. 3A is a perspective view schematically showing the tape sticking step, and FIG. 3B is a cross-sectional view schematically showing the tape sticking step. It is a perspective view which shows typically the cutting device used at a division | segmentation step. FIG. 5A is a partial cross-sectional side view schematically showing the dividing step, and FIG. 5B is a partial cross-sectional side view schematically showing the surplus portion scattered in the dividing step. . FIG. 6A is a partial cross-sectional side view schematically showing the tape curing step, and FIG. 6B is a partial cross-sectional side view schematically showing the device peeling step.

  Embodiments of the present invention will be described with reference to the accompanying drawings. The package substrate dividing method according to the present embodiment includes a release agent coating step, a tape attaching step, a dividing step, a tape curing step, and a device peeling step.

  In the release agent coating step, the release agent is coated in a region corresponding to the surplus portion on the back surface of the package substrate. In the tape attaching step, an adhesive tape is attached to the back surface of the package substrate. In the dividing step, the package substrate is cut along the planned dividing line, and the package substrate is divided into a plurality of device packages while removing excess portions.

  In the tape curing step, the adhesive tape is cured to reduce the adhesive force. In the device peeling step, the plurality of device packages are peeled from the adhesive tape. Hereinafter, the method for dividing the package substrate according to the present embodiment will be described in detail.

  FIG. 1A is a perspective view schematically showing a package substrate divided by the package substrate dividing method according to the present embodiment, and FIG. 1B is a cross-sectional view schematically showing the package substrate. is there. As shown in FIGS. 1A and 1B, the package substrate 11 includes a frame 13 having a substantially rectangular shape in plan view.

  The frame 13 is made of, for example, a metal material such as 42 alloy (an alloy of iron and nickel) or copper, and the surface 13a side has a plurality of device portions 15 (here, three device portions 15). ) And a surplus part 17 surrounding each device part 15.

  As shown in FIG. 1A, each device section 15 is further divided into a plurality of device package areas 21 (here, 36 device package areas 21) by a plurality of division lines (streets) 19 that intersect. ing.

  Devices (device chips) (not shown) such as ICs and LEDs are provided at positions corresponding to the respective device package regions 21 on the back surface 13b side of the frame 13. These devices (device chips) are sealed with a sealing portion 23 formed in a region corresponding to each device portion 15.

  As shown in FIG. 1B, the sealing portion 23 is formed with a predetermined thickness using a material such as resin, and protrudes from the back surface 13 b of the frame 13. In the present embodiment, the surface 23 a of the sealing portion 23 is referred to as the back surface of the package substrate 11, and the surface 13 a of the frame 13 is referred to as the surface of the package substrate 11.

  In the method for dividing a package substrate according to the present embodiment, first, a release agent coating step for coating the release agent in a region corresponding to the surplus portion 17 on the back surface of the package substrate 11 is performed. FIG. 2 is a partial cross-sectional side view schematically showing the release agent coating step.

  In the release agent coating step, first, a mask member 41 having a mask portion corresponding to the device portion 15 is disposed on the back surface side of the package substrate 11 (that is, the front surface 23a of the sealing portion 23). Thereby, the region corresponding to the device portion 15 on the back surface of the package substrate 11 is covered with the mask member 41, and the region corresponding to the surplus portion 17 is exposed.

  Next, the package substrate 11 is positioned below the nozzle 3 so that the back side is exposed upward. Then, as shown in FIG. 2, the release agent 7 is supplied from the nozzle 3 to the back surface of the package substrate 11 while relatively moving the nozzle 3 and the package substrate 11 in the horizontal direction.

  As a result, the release agent 7 can be covered in a region corresponding to the surplus portion 17 on the back surface of the package substrate 11. The release agent 7 includes, for example, a fluorine resin. After the release agent 7 is coated, the mask member 41 is removed.

  After the release agent coating step, a tape adhering step for adhering the adhesive tape to the back surface of the package substrate 11 is performed. FIG. 3A is a perspective view schematically showing the tape sticking step, and FIG. 3B is a cross-sectional view schematically showing the tape sticking step.

  The adhesive tape 31 is formed in a substantially circular shape that is larger than the package substrate 11. The adhesive tape 31 includes a film-like base material layer 33 made of a material such as a resin, and an adhesive paste layer 35 having an adhesive force disposed on one surface (upper surface) of the base material layer 33.

  The adhesive tape 31 can be adhered to the package substrate 11 by bringing the adhesive layer 35 into close contact with the back surface of the package substrate 11 (that is, the front surface 23a of the sealing portion 23). As described above, since the release agent 7 is coated on the region corresponding to the surplus portion 17, the adhesive tape 31 is adhered only to the region corresponding to the device portion 15 of the package substrate 11.

  An annular frame 37 is fixed to the outer peripheral portion of the adhesive tape 31 by the adhesive force of the adhesive layer 35. That is, the package substrate 11 is supported by the annular frame 37 via the adhesive tape 31.

  After the tape sticking step, the package substrate 11 is cut along the planned dividing line 19 and the dividing step of dividing the package substrate 11 into a plurality of device packages while removing the surplus portion 17 is performed. FIG. 4 is a perspective view schematically showing a cutting device used in the dividing step. As shown in FIG. 4, the cutting device 2 includes a base 4 that supports each structure.

  On the upper surface of the base 4, a rectangular opening 4 a that is long in the X-axis direction (front-rear direction, processing feed direction) is formed. In this opening 4a, an X-axis moving table 6, an X-axis moving mechanism (processing feed means) (not shown) for moving the X-axis moving table 6 in the X-axis direction, and a dustproof and splash-proof cover that covers the X-axis moving mechanism 8 is provided.

  The X-axis movement mechanism includes a pair of X-axis guide rails (not shown) parallel to the X-axis direction, and an X-axis movement table 6 is slidably installed on the X-axis guide rails. A nut portion (not shown) is provided on the lower surface side of the X-axis moving table 6, and an X-axis ball screw (not shown) parallel to the X-axis guide rail is screwed to the nut portion.

  An X-axis pulse motor (not shown) is connected to one end of the X-axis ball screw. By rotating the X-axis ball screw with the X-axis pulse motor, the X-axis moving table 6 moves in the X-axis direction along the X-axis guide rail.

  On the X-axis moving table 6, a chuck table 10 for sucking and holding the package substrate 11 is provided. Around the chuck table 10, four clamps 12 for holding and fixing the annular frame 37 from four directions are provided.

  The chuck table 10 is connected to a rotation drive source (not shown) such as a motor, and rotates around a rotation axis parallel to the Z-axis direction (vertical direction). The chuck table 10 is processed and fed in the X-axis direction by the above-described X-axis moving mechanism.

  The surface (upper surface) of the chuck table 10 is a holding surface 10 a that holds the package substrate 11 by suction. The holding surface 10 a is connected to a suction source (not shown) through a flow path (not shown) formed inside the chuck table 10.

  On the upper surface of the base 4, a gate-type support structure 16 that supports a cutting unit (cutting means) 14 for cutting the package substrate 11 is disposed so as to straddle the opening 4 a. A cutting unit moving mechanism (index feed means) 18 for moving the cutting unit 14 in the Y-axis direction (index feed direction) and the Z-axis direction (vertical direction) is provided on the upper front surface of the support structure 16.

  The cutting unit moving mechanism 18 includes a pair of Y-axis guide rails 20 arranged on the front surface of the support structure 16 and parallel to the Y-axis direction. A Y-axis moving plate 22 constituting the cutting unit moving mechanism 18 is slidably installed on the Y-axis guide rail 20.

  A nut portion (not shown) is provided on the back surface side (rear surface side) of the Y-axis moving plate 22, and a Y-axis ball screw 24 parallel to the Y-axis guide rail 20 is screwed to the nut portion. Yes. A Y-axis pulse motor (not shown) is connected to one end of the Y-axis ball screw 24. If the Y-axis ball screw 24 is rotated by the Y-axis pulse motor, the Y-axis moving plate 22 moves in the Y-axis direction along the Y-axis guide rail 20.

  A pair of Z-axis guide rails 26 parallel to the Z-axis direction are provided on the surface (front surface) of the Y-axis moving plate 22. A Z-axis moving plate 28 is slidably installed on the Z-axis guide rail 26.

  A nut portion (not shown) is provided on the back surface side (rear surface side) of the Z-axis moving plate 28, and a Z-axis ball screw 30 parallel to the Z-axis guide rail 26 is screwed into the nut portion. Yes. A Z-axis pulse motor 32 is connected to one end of the Z-axis ball screw 30. When the Z-axis ball screw 30 is rotated by the Z-axis pulse motor 32, the Z-axis moving plate 28 moves in the Z-axis direction along the Z-axis guide rail 26.

  A cutting unit 14 for cutting the package substrate 11 is provided below the Z-axis moving plate 28. A camera 34 that images the surface side of the package substrate 11 is installed at a position adjacent to the cutting unit 14. If the cutting unit moving mechanism 18 moves the Y-axis moving plate 22 in the Y-axis direction, the cutting unit 14 and the camera 34 are indexed, and if the Z-axis moving plate 28 is moved in the Z-axis direction, the cutting unit is moved. 14 and the camera 34 move up and down.

  The cutting unit 14 includes an annular cutting blade 36 attached to one end side of a spindle (not shown) that constitutes a rotation axis parallel to the Y-axis direction. A rotation drive source (not shown) such as a motor is connected to the other end side of the spindle, and rotates the cutting blade 36 attached to the spindle.

  FIG. 5A is a partial cross-sectional side view schematically showing the dividing step, and FIG. 5B is a partial cross-sectional side view schematically showing the surplus portion 17 scattered in the dividing step. is there. In the dividing step, first, the package substrate 11 is placed on the chuck table 10 so that the surface side is exposed upward, and the frame 37 is clamped and fixed by the clamp 12. Next, the negative pressure of the suction source is applied to the holding surface 10 a, and the package substrate 11 is sucked and held by the chuck table 10.

  Thereafter, the chuck table 10 and the cutting unit 14 are relatively moved and rotated to align the target division line 19 in parallel with the X-axis direction, and the cutting blade 36 is aligned on a straight line including the target division line 19. Position. Then, the lower end of the rotated cutting blade 36 is positioned at a position lower than the back surface of the package substrate 11 (that is, the front surface 23a of the sealing portion 23), and the chuck table 10 is moved (processed) in the X-axis direction.

  In this way, the cutting blade 36 is positioned at a height to be cut into the adhesive tape 31, and the package substrate 11 and the cutting blade 36 are moved relative to each other, as shown in FIG. Can be cut along the division line 19.

  In this embodiment, the release agent 7 is covered in a region corresponding to the surplus portion 17 on the back surface of the package substrate 11, and the adhesive tape 31 is not bonded to the region. Therefore, the surplus portion 17 separated from the package substrate 11 in the dividing step is scattered by the rotation of the cutting blade 36 as shown in FIG.

  On the other hand, since the adhesive tape 31 is bonded to the region corresponding to the device unit 15, the device unit 15 does not scatter. Thus, in this embodiment, since only the surplus part 17 is removed from the adhesive tape 31 in a division | segmentation step, it is not necessary to pick up the surplus part 17 later. When the package substrate 11 is cut along all the planned division lines 19 and divided into a plurality of device packages 25 (see FIG. 6A, etc.), the division step ends.

  After the dividing step, a tape curing step for reducing the adhesive strength of the adhesive tape 31 is performed. FIG. 6A is a partial cross-sectional side view schematically showing the tape curing step. As shown in FIG. 5A, in the tape curing step of the present embodiment, the light source 1 is disposed on the lower surface side of the adhesive tape 31 and ultraviolet light (ultraviolet light) is emitted from the light source 1. Thereby, an ultraviolet-ray is irradiated to the adhesive tape 31, the paste layer 35 is hardened, and adhesive force can be reduced.

  After the tape curing step, a device peeling step for peeling the plurality of device packages 25 from the adhesive tape 31 is performed. FIG. 6B is a partial cross-sectional side view schematically showing the device peeling step.

  As shown in FIG. 6B, in the device peeling step, the pickup device 5 sucks the plurality of device packages 25 and peels them from the adhesive tape 31. In this embodiment, since the adhesive force of the area | region corresponding to the device part 15 of the adhesive tape 31 is reduced in the tape hardening step, the device package 25 can be easily picked up from the adhesive tape 31.

  Further, in the present embodiment, since the surplus portion 17 is removed from the adhesive tape 31 in the dividing step, the surplus portion 17 is not picked up by mistake when picking up a plurality of device packages 25. The picked-up device package 25 is accommodated in an arbitrary case (not shown).

  As described above, in the method for dividing the package substrate according to the present embodiment, the release agent coating step for coating the release agent 7 in the region corresponding to the surplus portion 17 on the back surface of the package substrate 11 and the adhesive tape 31 are packaged. After performing the tape adhering step for adhering to the back surface of the substrate 11, the dividing step for dividing the package substrate 11 is performed. Therefore, the surplus portion 17 separated from the package substrate 11 in the dividing step is rotated by the cutting blade 36. Can be removed from the adhesive tape 31 by scattering. That is, since it is not necessary to pick up the surplus part 17, the productivity of the device package 25 can be maintained high.

  In addition, this invention is not limited to description of the said embodiment, A various change can be implemented. For example, in the above embodiment, the mask member 41 is used in the release agent coating step. However, the release agent may be coated by a method such as an ink jet that does not use the mask member 41.

  Moreover, in the said embodiment, although the ultraviolet curing adhesive tape 31 is used, this invention is not limited to this. For example, a thermosetting pressure-sensitive adhesive tape can be used. In that case, in the tape curing step, the adhesive tape is cured by applying heat.

  Moreover, in the said embodiment, although the cyclic | annular flame | frame 37 is being fixed to the outer peripheral part of the adhesive tape 31, it is not necessary to necessarily fix an annular frame to an adhesive tape. When the annular frame is not fixed to the adhesive tape, for example, in the tape attaching step, an adhesive tape having the same size as the package substrate 11 is attached to the package substrate 11.

  In the dividing step, for example, the package substrate 11 is sucked and held by a chuck table (not shown) corresponding to the package substrate 11 and cut along the scheduled division line 19. Thereby, the surplus portion 17 separated from the package substrate 11 can be scattered and removed by the rotation of the cutting blade.

  Thereafter, in the tape curing step, the adhesive tape is cured to reduce the adhesive force, and in the device peeling step, the plurality of device packages 25 are peeled from the adhesive tape. Also in this case, since the surplus portion 17 is removed from the adhesive tape in the dividing step, the surplus portion 17 is not mistakenly picked up when the plurality of device packages 25 are picked up.

  In addition, the configurations, methods, and the like according to the above-described embodiments can be appropriately modified and implemented without departing from the scope of the object of the present invention.

DESCRIPTION OF SYMBOLS 11 Package board 13 Frame 13a Front surface 13b Back surface 15 Device part 17 Surplus part 19 Divided line (street)
DESCRIPTION OF SYMBOLS 21 Device package area 23 Sealing part 23a Surface 25 Device package 31 Adhesive tape 33 Base material layer 35 Glue layer 37 Frame 41 Mask member 1 Light source 3 Nozzle 5 Pickup device 7 Mold release agent 2 Cutting device 4 Base 4a Opening 6 X axis Moving table 8 Dustproof and drip-proof cover 10 Chuck table 10a Holding surface 12 Clamp 14 Cutting unit (cutting means)
16 Support structure 18 Cutting unit moving mechanism (index feed means)
20 Y-axis guide rail 22 Y-axis moving plate 24 Y-axis ball screw 26 Z-axis guide rail 28 Z-axis moving plate 30 Z-axis ball screw 32 Z-axis pulse motor 34 Camera 36 Cutting blade

Claims (1)

A package that cuts a package substrate including a device portion partitioned into a plurality of device package regions by a surface division planned line and a surplus portion surrounding the device portion along the division planned line, and divides the package substrate into a plurality of device packages. A method of dividing a substrate,
A release agent coating step for coating the release agent in a region corresponding to the surplus portion of the back surface of the package substrate;
After performing the release agent coating step, a tape adhering step of adhering the adhesive tape to the back surface of the package substrate;
After performing the tape adhering step, the dividing step of cutting the package substrate along the planned dividing line with a cutting blade positioned at a height to be cut into the adhesive tape, and dividing the package substrate into a plurality of device packages; Including
In the dividing step, the surplus portion separated from the package substrate is scattered by the rotation of the cutting blade, thereby removing the surplus portion from the adhesive tape.