JP6170827B2 - Processing method of package substrate - Google Patents

Description

  The present invention relates to a method for processing a package substrate such as a CSP (Chip Size Package) or a QFN (Quad Flat Non-leaded Package).

  A package substrate such as CSP or QFN is formed in a substantially rectangular plate shape by arranging a plurality of semiconductor chips in which a circuit such as an IC or LSI is formed and sealing with a mold resin or the like. In the package substrate, a surplus area is provided around a device area to be a package device. For this reason, when the device region is cut along the division line, not only the package device but also the surplus region is separated from the package substrate as an end material. For this reason, a method has been proposed in which only the package device is extracted from the package substrate so that the end material is not mixed when the package device is collected (see, for example, Patent Document 1).

  In the method described in Patent Document 1, only the device region inside the surplus region is divided while leaving the surplus region of the package substrate. First, a division groove having a predetermined depth is formed on the surface side of the package substrate along a division division line so as to avoid an excessive region. Subsequently, a dividing groove is formed on the back surface side of the package substrate so as to communicate with the dividing groove on the front surface side of the entire package substrate including the surplus region. As a result, the surplus region is not completely cut, and only the device region of the package substrate in which the dividing groove communicates is divided into individual package devices and collected from the package substrate.

JP 2012-227485 A

  However, in the method described in Patent Document 1, only the package device can be collected from the package substrate, but there is a problem that the processing becomes complicated. That is, after processing the front surface side of the package substrate, the package substrate is turned upside down and the back surface side is processed, so that alignment has to be performed at each processing. Further, when the package substrate is supported by the annular frame via the dicing tape, it is necessary to reattach the dicing tape every time processing is performed.

  The present invention has been made in view of these points, and an object of the present invention is to provide a processing method of a package substrate that can recover only the package device from the package substrate without taking a complicated procedure.

  A processing method of a package substrate according to the present invention includes a device region in which a plurality of division lines are formed in a lattice shape on a surface, and devices are arranged in a plurality of regions partitioned by the plurality of division lines, and the device region A package that divides a package substrate comprising a metal plate having a surplus area to surround and a synthetic resin portion obtained by molding the device from the back side of the metal plate into individual package devices along the plurality of division lines. A method for processing a substrate, wherein a UV tape having an ultraviolet adhesive layer that is cured by ultraviolet rays is attached to the package substrate, and the UV tape is attached to the package substrate in the UV tape attaching step. A dicing tape having an adhesive layer that does not cure ultraviolet rays is attached to the UV tape, and an opening is provided through the dicing tape. A dicing tape attaching step for supporting the package substrate with a ring frame; and the dicing tape of the package substrate that has undergone the dicing tape attaching step is brought into contact with and held by a chuck table, and the device region and the A first groove forming step of forming a first groove in the package substrate at a depth that reaches the dicing tape located deeper than the UV tape from the surface of the package substrate along the boundary with the surplus region; A second groove forming step of forming a second groove on the package substrate at a depth reaching the UV tape from the surface of the package substrate along the division line by using the cutting blade; The excess region of the package substrate is removed together with the UV tape, and the UV region is removed in the excess region removal step. UV irradiation step of curing the UV adhesive layer by irradiating the UV tape attached to the package substrate from which the excess region has been removed together with the UV, and the UV adhesive layer in the UV irradiation step. The cured package substrate is divided by the second groove to obtain a package device.

  According to this configuration, the device region and the excess region are divided by the first groove, and the package substrate is divided into individual package devices by the second groove. Then, the package device is acquired from the package substrate in a state where the surplus area is removed from the package substrate first. Therefore, it is possible to collect only the package device in the case and prevent the surplus area from being mixed in the case. Further, since the UV tape is completely cut by the first groove, the surplus area is peeled off from the dicing tape together with the UV tape. In this case, since the excess area can be peeled off from the dicing tape by grasping the UV tape, the excess area can be removed from the package substrate relatively easily. Furthermore, since the UV tape is not cut by the second groove, only the package device can be easily obtained from the cured UV tape. In this case, the first and second grooves can be formed by one-time alignment, and a tape replacement operation or the like does not occur. Therefore, it is possible to recover only the package device from the package substrate without taking a complicated procedure.

  In the package substrate processing method of the present invention, the excess region removal step is performed after the first groove formation step, and the second groove formation step is performed after the excess region removal step.

  In the package substrate processing method of the present invention, in the first groove forming step, the device region and the surplus region are arranged along one of the planned division lines among the lattice-shaped division planned lines of the package substrate. After the first groove is formed at the boundary, in the excess region removing step, the package substrate is divided by the first groove along one division planned line, and a part of the excess region is removed from the package substrate. After the partial surplus area is removed, in the first groove forming step, the device area and the surplus along the other planned dividing line among the lattice-shaped planned dividing lines of the package substrate. After the first groove is formed at the boundary with the region, in the excess region removing step, the package substrate is divided by the first groove along the other division line, and the remaining excess from the package substrate Frequency is removed.

  According to the present invention, the package substrate is attached to the dicing tape via the UV tape, and the package device is obtained after removing the excess region together with the UV tape. Only package devices can be collected.

It is a perspective view of the cutting device concerning this embodiment. It is a perspective view of the package board | substrate which concerns on this Embodiment. It is explanatory drawing of the processing method of the package board | substrate which concerns on this Embodiment. It is explanatory drawing of the processing method of the package board | substrate which concerns on this Embodiment. It is explanatory drawing of the processing method of the package board | substrate which concerns on a 1st modification. It is explanatory drawing of the processing method of the package board | substrate which concerns on a 2nd modification.

  Hereinafter, with reference to the accompanying drawings, a cutting apparatus used in the processing method of the package substrate according to the present embodiment will be described. FIG. 1 is a perspective view of a cutting apparatus according to the present embodiment. FIG. 2 is a perspective view of the package substrate according to the present embodiment. Note that the cutting apparatus according to the present embodiment is not limited to the configuration shown in FIG. The present invention is applicable to any cutting device as long as it can cut the package substrate.

  As shown in FIG. 1, the cutting apparatus 1 moves the chuck table 13 relative to the processing means 17 so that the package substrate W held on the chuck table 13 is transferred to individual package devices 77 (see FIG. 4). It is configured to divide. 2A and 2B, the package substrate W is formed in a substantially rectangular plate shape in which a synthetic resin portion 62 is laminated on a metal plate 61 on which a device 63 is formed. The surface 65 of the metal plate 61 is divided into a plurality of regions by grid-like division planned lines 71, and is divided into a device region 72 in which a plurality of devices 63 are disposed and a surplus region 73 surrounding the device region 72. Yes.

  The plurality of devices 63 are molded by the synthetic resin portion 62 from the back surface side of the metal plate 61. By cutting the package substrate W along the scheduled division line 71, the surplus area 73 is divided as an end material, and the device area 72 is divided as individual package devices 77 (see FIG. 4). A dicing tape T2 is attached to the back surface 66 of the package substrate W via a UV tape T1. The UV tape T1 is formed in a substantially rectangular shape according to the package substrate W, and the dicing tape T2 is formed in a larger circular shape than the UV tape T1.

  An ultraviolet adhesive layer that is cured by ultraviolet rays is applied to the surface 68 of the UV tape T1, and an adhesive layer that is not cured by ultraviolet rays is applied to the surface 69 of the dicing tape T2. As the adhesive layer of the dicing tape T2, an adhesive having an adhesive strength weaker than that of the ultraviolet adhesive layer before curing and stronger than that of the ultraviolet adhesive layer after curing is used. A package substrate W is attached to the center of the dicing tape T2, and a ring frame F having an opening is attached to the outer periphery of the dicing tape T2. The package substrate W is carried into the cutting apparatus 1 while being supported on the inner side of the ring frame F via the dicing tape T2.

  The package substrate W is not limited to a substrate after the chip is mounted, such as a CSP (Chip Size Package) substrate or a QFN (Quad Flat Non-leaded package) substrate, but may be a substrate before the chip is mounted. Further, the adhesive layer of the dicing tape T2 is not limited to the one that is not completely cured by ultraviolet rays, and any adhesive layer that does not significantly reduce the adhesive strength by ultraviolet rays may be used. Returning to FIG. 1, a moving mechanism 12 is provided on the base 11 of the cutting apparatus 1 to process and feed the chuck table 13 holding the package substrate W in the X-axis direction.

  The moving mechanism 12 includes a pair of guide rails 21 arranged on the base 11 and parallel to the X-axis direction, and a motor-driven X-axis table 22 slidably installed on the pair of guide rails 21. Yes. A chuck table 13 is provided above the X-axis table 22. Nut portions (not shown) are formed on the back side of the X-axis table 22, and a ball screw 23 is screwed to these nut portions. A drive motor 24 is connected to one end of the ball screw 23. When the ball screw 23 is rotationally driven by the drive motor 24, the chuck table 13 is moved along the guide rail 21 in the X-axis direction.

  A holding surface 26 is formed of a porous ceramic material on the surface of the chuck table 13, and the package substrate W is sucked and held by the negative pressure generated on the holding surface 26. Around the chuck table 13, four air-driven clamp parts 27 are provided, and the ring frame F around the package substrate W is sandwiched and fixed by each clamp part 27. On the base 11, a standing wall portion 14 that is partially opened is provided so as to avoid the movement path of the chuck table 13. The standing wall portion 14 is provided with a moving mechanism 15 that indexes and feeds the processing means 17 in the Y-axis direction above the chuck table 13 and moves up and down in the Z-axis direction.

  The moving mechanism 15 includes a pair of guide rails 31 parallel to the front surface of the standing wall portion 14 in the Y-axis direction, and a motor-driven Y-axis table 32 slidably installed on the pair of guide rails 31. . The moving mechanism 15 includes a pair of guide rails 33 arranged in front of the Y-axis table 32 and parallel to the Z-axis direction, and a motor-driven Z-axis table 34 slidably installed on the guide rails 33. Have. At the lower part of the Z-axis table 34, processing means 17 is provided for processing the package substrate W along the scheduled division line 71 (see FIG. 2).

  A nut portion (not shown) is formed on the back side of the Y-axis table 32, and a ball screw 35 is screwed into the nut portion. A nut portion (not shown) is formed on the back side of the Z-axis table 34, and a ball screw (not shown) is screwed to the nut portion. Drive motors 36 and 37 are connected to one end of the ball screw 35 for the Y-axis table 32 and the ball screw for the Z-axis table 34, respectively. The ball screw 35 is rotationally driven by these drive motors 36 and 37, whereby the processing means 17 is moved along the guide rails 31 and 33 in the Y-axis direction and the Z-axis direction.

  The processing means 17 is configured by attaching a cutting blade 42 to the tip of the spindle 41. The cutting blade 42 is covered with a blade cover 43, and the blade cover 43 is provided with an injection nozzle that injects cutting water toward the cutting portion. Further, the spindle 41 is provided with the imaging unit 18, and the cutting blade 42 is aligned with the division line 71 (see FIG. 2) of the package substrate W based on the captured image of the imaging unit 18. In the processing means 17, cutting water is sprayed from a plurality of spray nozzles, and the package substrate W is cut along the planned dividing line 71 by the cutting blade 42, thereby being divided into individual package devices 77 (see FIG. 4). The

  In this case, a first groove 75 that separates the device region 72 and the surplus region 73 and a second groove 76 that separates the device region 72 into individual package devices 77 are formed in the package substrate W (FIG. 3C). And FIG. 3D). The depth of the first groove 75 reaches from the surface 65 of the package substrate W to the dicing tape T2 at the back (downward) of the UV tape T1, and cuts the package substrate W together with the UV tape T1. The depth of the second groove 76 reaches from the surface 65 of the package substrate W to the UV tape T1, and only the package substrate W is cut without completely cutting the UV tape T1.

  The processing method of the package substrate W according to the present embodiment uses the difference in the depths of the first and second grooves 75 and 76 and the difference in adhesive strength between the UV tape T1 and the dicing tape T2 as a package. The excess region 73 is removed before the device 77 is collected. By removing the surplus area 73 from the package substrate W in advance, even if the package device 77 is blown away and collected by compressed air or the like, only the package device 77 is collected without mixing the surplus area 73 as an end material. It is possible.

  Hereinafter, the processing method of the package substrate according to the present embodiment will be described in detail with reference to FIGS. 3 and 4 are explanatory diagrams of the processing method according to the present embodiment. 3A shows the UV tape attaching step, FIG. 3B shows the dicing tape attaching step, FIG. 3C shows the first groove forming step, and FIG. 3D shows the second groove forming step. 4A shows the surplus area removing step, FIG. 4B shows the ultraviolet irradiation step, and FIG. 4C shows the package device acquisition step.

  As shown to FIG. 3A, a UV tape sticking process is first implemented. In the UV tape attaching step, the UV tape T1 is attached so as to cover the back surface 66 of the package substrate W. The surface 68 of the UV tape T1 is coated with an ultraviolet adhesive layer that is cured by ultraviolet rays, and the UV tape T1 is easily peeled off from the package substrate W after the ultraviolet adhesive layer is cured by ultraviolet light. The UV tape sticking step may be performed manually by an operator or may be performed by a not-shown sticking device.

  As shown to FIG. 3B, after a UV tape sticking process is implemented, a dicing tape sticking process is implemented. In the dicing tape attaching step, the dicing tape T2 is attached so as to cover the opening of the ring frame F, and the package substrate W is attached to the surface 69 of the dicing tape T2 via the UV tape T1. Unlike the UV tape T1, an adhesive layer that is not cured by ultraviolet rays is applied to the surface 69 of the dicing tape T2. The dicing tape sticking step may be performed manually by an operator or may be performed by an unillustrated sticking device. The package substrate W after the dicing tape T2 is attached is carried into the cutting device 1 (see FIG. 1).

  As shown to FIG. 3C, after a dicing tape sticking process is implemented, a 1st groove | channel formation process is implemented. In the first groove forming step, the package substrate W is held on the chuck table 13 by contacting the dicing tape T2 of the package substrate W, and the ring frame F around the package substrate W is held by the clamp portion 27. Then, after the cutting blade 42 is aligned with the package substrate W and aligned with the planned division line 71 that is the boundary between the device region 72 and the surplus region 73, cutting is performed by the cutting blade 42.

  In this case, the cutting blade 42 is adjusted to a height at which the cutting blade 42 can be cut halfway through the dicing tape T2, and the chuck table 13 is moved relative to the cutting blade 42 rotated at high speed. As a result, the first groove 75 is formed along the boundary between the device region 72 and the surplus region 73 at a depth reaching the dicing tape T2 located deeper than the UV tape T1 from the surface 65 of the package substrate W. . The UV tape T1 is completely cut together with the package substrate W by the first groove 75, and the package substrate W is divided into the device region 72 and the surplus region 73 together with the UV tape T1.

  As shown in FIG. 3D, after the first groove forming step is performed, the second groove forming step is performed. In the second groove forming step, the cutting blade 42 is aligned with the planned division line 71 in the device region 72, and then cutting is performed by the cutting blade 42. In this case, the cutting blade 42 is adjusted to a position where it can be cut halfway through the UV tape T1, and the chuck table 13 is moved relative to the cutting blade 42 rotated at high speed. As a result, the second groove 76 is formed along the planned division line 71 at a depth reaching the UV tape T1 from the surface 65 of the package substrate W. The UV tape T <b> 1 is not cut by the second groove 76, and only the package substrate W is divided into individual package devices 77. The package substrate W after cutting is carried into a peeling device (not shown).

  As shown in FIG. 4A, after the second groove forming step is performed, the surplus region removing step is performed. In the surplus area removing step, the package substrate W is held on the chuck table 52 of the peeling device via the dicing tape T2, and the ring frame F around the package substrate W is held by the clamp portion 53. Inside the chuck table 52 is provided a UV lamp 54 used in the subsequent ultraviolet irradiation process. As described above, the adhesive strength of the UV tape T1 before UV curing is stronger than the adhesive strength of the dicing tape T2, and the package substrate W is bonded together with the UV tape T1 from the dicing tape T2 rather than peeling the package substrate W from the UV tape T1. It is easier to remove.

  For this reason, the excess region 73 of the package substrate W is easily peeled off from the dicing tape T2 by grasping and curling up the end of the UV tape T1. In this way, the surplus region 73 of the package substrate W divided by the first groove 75 is removed together with the UV tape T1, and only the device region 72 (package device 77) of the package substrate W remains on the dicing tape T2. Has been. The surplus area 73 of the package substrate W peeled off from the dicing tape T2 is discarded as an end material. The surplus area removing step may be performed manually by an operator or may be performed by a removing device (not shown).

  As shown in FIG. 4B, after the surplus region removing process is performed, an ultraviolet irradiation process is performed. In the ultraviolet irradiation process, ultraviolet rays are irradiated from a UV lamp 54 provided inside the chuck table 52. In this case, the chuck table 52 is formed of a translucent material or the like, and ultraviolet rays irradiated from the UV lamp 54 pass through the chuck table 52 and are irradiated onto the UV tape T1. As a result, the UV adhesive layer of the UV tape T1 is cured, and the adhesive strength of the UV tape T1 to the package substrate W is greatly reduced. The adhesive strength of the UV tape T1 after UV curing becomes weaker than the adhesive strength of the dicing tape T2, and the device region 72 (package device 77) of the package substrate W is easily peeled off from the UV tape T1.

  As shown in FIG. 4C, after the ultraviolet irradiation process is performed, a package device acquisition process is performed. In the package device acquisition step, compressed air is blown from the high pressure nozzle 55 to the package device 77, and the package device 77 divided by the second groove 76 is blown off toward the case 56. At this time, since the adhesive force of the dicing tape T2 is stronger than the adhesive force of the UV tape T1, only the package device 77 peeled off from the UV tape T1 is blown away without the UV tape T1 being peeled off from the dicing tape T2. Further, since the surplus area 73 of the package substrate W is previously removed from the dicing tape T2, the surplus area 73 of the package substrate W is not collected in the case 56.

  Thus, only the package device 77 peeled off from the UV tape T1 is collected in the case 56. Therefore, as in the case where the end material (excess region 73) of the package substrate W and the package device 77 are mixed, the product sorting operation becomes unnecessary, and only the package device 77 can be efficiently collected in the case 56. . The package device 77 collected in the case 56 is taken out from the case 56 after cleaning. In the present embodiment, the package device 77 is collected by compressed air. However, the present invention is not limited to this configuration. In the package device acquisition step, for example, air may be ejected from the holding surface 57 of the chuck table 52 to blow off the package device 77 and may be collected, or the package device 77 may be collected by a pickup mechanism.

  In the above-described embodiment, the first groove forming process and the second groove forming process are performed by the cutting apparatus 1 (see FIG. 1), and the excess region removing process, the ultraviolet irradiation process, and the package device acquiring process are performed. Although it was set as the structure implemented with a peeling apparatus, it is not limited to this structure. For example, as long as the cutting device 1 can irradiate ultraviolet rays, all the steps may be performed by the cutting device 1.

  As described above, in the processing method of the package substrate W according to the present embodiment, the device region 72 and the surplus region 73 are divided by the first groove 75, and the package substrate W is individually packaged by the second groove 76. Divided into devices 77. Then, the package device 77 is acquired from the package substrate W with the surplus area 73 removed from the package substrate W first. Therefore, it is possible to collect only the package device 77 in the case 56 and prevent the surplus area 73 from being mixed into the case 56. Further, since the UV tape T1 is completely cut by the first groove 75, the excess region 73 can be peeled off from the dicing tape T2 by grasping the UV tape T1. Furthermore, since the UV tape T1 is not cut by the second groove 76, only the package device 77 can be easily obtained from the cured UV tape T1. In this case, the first and second grooves 75 and 76 can be formed by one-time alignment, so that a tape replacement operation or the like does not occur. Therefore, only the package device 77 can be collected from the package substrate W without taking a complicated procedure.

  In addition, this invention is not limited to the said embodiment, It can change and implement variously. In the above-described embodiment, the size, shape, and the like illustrated in the accompanying drawings are not limited to this, and can be appropriately changed within a range in which the effect of the present invention is exhibited. In addition, various modifications can be made without departing from the scope of the object of the present invention.

  For example, in the above embodiment, the UV tape attaching process, the dicing tape attaching process, the first groove forming process, the second groove forming process, the surplus area removing process, the ultraviolet irradiation process, and the package device obtaining process are performed in this order. However, the present invention is not limited to this configuration. For example, as a first modification, the excess region removing step may be performed after the first groove forming step, and the second groove forming step may be performed after the excess region removing step.

  Hereinafter, a first modification will be described with reference to FIG. FIG. 5A shows the first groove forming step, and FIG. 5B shows the second groove forming step. Note that the first modification is different from the above embodiment only in a part of the steps, and therefore the differences will be mainly described. In FIG. 5, the chuck table is omitted for convenience of explanation.

  As shown to FIG. 5A, a 1st groove | channel formation process is implemented after a UV tape sticking process and a dicing tape sticking process. In the first groove forming step, the package substrate W is held by the chuck table via the dicing tape T2, and the ring frame F around the package substrate W is held by the clamp portion 27. Then, as shown by the broken line, the depth is reached by the cutting blade 42 along the boundary between the device region 72 and the surplus region 73 and reaching the dicing tape T2 on the package substrate W from the surface 65 to the back (downward) of the UV tape T1. Thus, the first groove 75 (see FIG. 3C) is formed. As a result, the package substrate W is divided into a device region 72 and a surplus region 73.

  In the excess area removing step, the excess area 73 around the device area 72 is peeled off from the dicing tape T2 by grasping and curling up the end of the UV tape T1. As a result, only the device region 72 of the package substrate W is left on the dicing tape T2. As shown in FIG. 5B, in the second groove forming step, the cutting blade 42 cuts along the planned dividing line 71 as shown by the broken line, and reaches the UV tape T1 from the surface 65 of the package substrate W. A second groove 76 (see FIG. 3D) is formed. Thereby, the package substrate W is divided into the individual package devices 77.

  At this time, since the surplus area 73 has already been removed from the dicing tape T2, only the device area 72 remaining on the dicing tape T2 is cut. That is, in the second groove forming step of the above-described embodiment, the second groove 76 is also formed in the surplus region 73. However, in the second groove forming step of the first modification, the second region 76 is formed in the surplus region 73. The groove 76 is not formed. Therefore, the processing amount of the cutting blade 42 can be reduced by the amount of removal of the surplus region 73, and consumption of the cutting blade 42 can be suppressed. After the second groove forming step, an ultraviolet irradiation step and a package device acquisition step are performed as in the above embodiment.

  In the first modification, after all the boundaries between the device region 72 and the surplus region 73 are divided in the first groove forming step, all the surplus regions 73 are removed in the surplus region removing step. However, it is not limited to this configuration. For example, as a second modification, after the boundary between the device region 72 and the surplus region 73 along one of the planned division lines 71 in the lattice-shaped division planned line 71 is divided in the first groove forming step, the surplus A part of the surplus area may be removed in the area removing step. Further, after the boundary between the device region 72 and the surplus region 73 along the other splitting line 71 is divided in the first groove forming step, the remaining surplus region may be removed in the surplus region removing step.

  Hereinafter, a second modification will be described with reference to FIG. 6A shows a first groove forming step and a surplus region removing step for one division planned line, FIG. 6B shows a first groove forming step and a surplus region removing step for the other division planned line, and FIG. 6C shows a second groove forming. Each process is shown. Note that the second modification is different from the above embodiment only in a part of the steps, and therefore the difference will be mainly described. In FIG. 6, the chuck table is omitted for convenience of explanation.

  As shown to FIG. 6A, a 1st groove | channel formation process is implemented after a UV tape sticking process and a dicing tape sticking process. In the first groove forming step, the package substrate W is held by the chuck table via the dicing tape T2, and the ring frame F around the package substrate W is held by the clamp portion 27. As indicated by the broken line, the first groove 75 (see FIG. 3C) is formed at the boundary between the device region 72 and a part of the surplus region 73a along one of the lattice-scheduled planned lines 71. It is formed. In the surplus area removing step, a part of the surplus area 73a is peeled off from the dicing tape T2 by grasping and curling up the end of the UV tape T1.

  As shown in FIG. 6B, when a part of the surplus region 73a is removed, the chuck table 13 is rotated 90 degrees, and the first groove forming step is performed again. In the first groove forming step, as shown by a broken line, the first groove 75 (on the boundary between the device region 72 and the remaining surplus region 73b along the other divided planned line 71 of the lattice-shaped divided planned lines 71). 3C) is formed. At this time, since the surplus area 73a has already been removed from the dicing tape T2, the surplus area 73a is not cut when the surplus area 73b is cut. Therefore, the machining amount of the cutting blade 42 can be reduced by the amount that the surplus area 73a has been removed in advance, and consumption of the cutting blade 42 can be suppressed. Then, the surplus area removing step is performed again, and the remaining surplus area 73b is peeled off from the dicing tape T2 by grasping and scooping up the end of the UV tape T1. As a result, only the device region 72 of the package substrate W is left on the dicing tape T2.

  As shown in FIG. 6C, in the second groove forming step, the second groove 76 is formed along the planned dividing line 71 in the device region 72, and the device region 72 is divided into individual package devices 77. At this time, since the surplus area 73 has already been removed from the dicing tape T2, the surplus area 73 is not cut in the second groove forming step. Therefore, the processing amount of the cutting blade 42 can be reduced by the amount of removal of the surplus region 73, and consumption of the cutting blade 42 can be suppressed. After the second groove forming step, an ultraviolet irradiation step and a package device acquisition step are performed as in the above embodiment.

  As described above, the present invention has an effect that only the package device can be recovered from the package substrate without taking a complicated procedure, and in particular, CSP (Chip Size Package), QFN (Quad Flat Non- This is useful for processing package substrates such as leaded packages.

DESCRIPTION OF SYMBOLS 1 Cutting device 13 Chuck table 17 Processing means 42 Cutting blade 51 Peeling device 54 UV lamp 56 Case 61 Metal plate 62 Synthetic resin part 63 Device 65 Surface of package substrate 71 Planned division line 72 Device region 73 Surplus region 75 First groove 76 Second groove 77 Package device F Ring frame T1 UV tape T2 Dicing tape W Package substrate

Claims (3)

A metal plate having a device area in which a plurality of division lines are formed in a lattice pattern on the surface and devices are arranged in a plurality of areas partitioned by the plurality of division lines, and a surplus area surrounding the device area; A package substrate processing method for dividing a package substrate formed of a synthetic resin portion obtained by molding the device from the back side of the metal plate into individual package devices along the plurality of division lines,
A UV tape attaching step of attaching a UV tape having an ultraviolet adhesive layer curable with ultraviolet rays to the package substrate;
A dicing tape having an adhesive layer that is not UV-cured is attached to the UV tape attached to the package substrate in the UV tape attaching step, and the package is attached to the ring frame having an opening through the dicing tape. A dicing tape attaching process for supporting the substrate;
The dicing tape of the package substrate that has undergone the dicing tape attaching process is brought into contact with and held by a chuck table, and the UV is applied from the surface of the package substrate along the boundary between the device region and the surplus region using a cutting blade. A first groove forming step of forming a first groove in the package substrate at a depth reaching the dicing tape at a position deeper than the tape;
A second groove forming step of forming a second groove on the package substrate at a depth reaching the UV tape from the surface of the package substrate along the division line using the cutting blade;
A surplus area removing step of dividing by the first groove and removing the surplus area of the package substrate together with the UV tape;
An ultraviolet irradiation step of curing the ultraviolet adhesive layer by irradiating the UV tape attached to the package substrate from which the excessive region has been removed together with the UV tape in the excess region removing step;
A package substrate processing method for obtaining a package device by dividing the package substrate having the ultraviolet adhesive layer cured in the ultraviolet irradiation step by the second groove.   The method of processing a package substrate according to claim 1, wherein the excess region removing step is performed after the first groove forming step, and the second groove forming step is performed after the excess region removing step. In the first groove forming step, after the first groove is formed at the boundary between the device region and the surplus region along one of the lattice-divided scheduled lines of the package substrate. In the surplus area removing step, the package substrate is divided by the first groove along one of the division lines, and a part of the surplus area is removed from the package substrate.
After the part of the surplus region is removed, in the first groove forming step, the device region and the surplus region are arranged along the other planned division line among the lattice-shaped division planned lines of the package substrate. After the first groove is formed at the boundary, in the excess region removing step, the package substrate is divided by the first groove along the other division line and the remaining excess region is removed from the package substrate. A method for processing a package substrate according to claim 2.

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