JP2023106682A - Resin sealing device - Google Patents

Abstract

To provide a resin sealing device which can remove dust attached on the surface of workpiece and a molding, and can prevent occurrence of a defective product.SOLUTION: A resin sealing device 1 includes a workpiece stocker 102 for storing workpiece W, a workpiece moving part 130 for moving the workpiece W from the workpiece stocker 102 to a workpiece set part 104, a molded article stocker 108 for storing a molded article Wp, and a molded article moving part 132 for moving the molded article Wp to the molded article stocker 108 from a molded article set part 114, and has at least one of a workpiece dust collection part 116 having a first duct part 117 for making suction force act on at least one of the upper surface and the lower surface of the workpiece W during moving by the workpiece moving part 130, and collecting dust, and a molded article dust collection part 118 having a second duct part 119 for making suction force act on at least one of the upper surface and the lower surface of the molded article Wp during moving by the molded article moving part 132, and collecting dust.SELECTED DRAWING: Figure 1

Description

The present invention relates to a resin sealing device.

As an example of a resin encapsulation device that seals a work having electronic components mounted on a base material with encapsulation resin (hereinafter sometimes simply referred to as “resin”) and processes it into a molded product, there are transfer molding method and compression molding method. A molding method is known.

In the transfer molding method, a pot is provided to supply a predetermined amount of resin to the sealing region (cavity) of two upper and lower molds provided in a sealing mold configured with an upper mold and a lower mold, and each of the In this technique, each work is placed at a position corresponding to the sealing area, clamped with an upper mold and a lower mold, and resin is sealed by an operation of pouring resin from a pot into a cavity. Also, in the compression molding method, a predetermined amount of resin is supplied to a sealing region (cavity) provided in a sealing mold configured with an upper mold and a lower mold, and a workpiece is placed in the sealing region. It is a technique of resin sealing by clamping with an upper mold and a lower mold. As an example, when using a sealing mold having a cavity in the upper mold, there is known a technique of supplying resin to the central position of the work collectively for molding. On the other hand, when using a sealing mold having a cavity in the lower mold, there is known a technique of supplying a film and a resin covering the mold surface including the cavity for molding.

JP 2011-18745 A

Here, in the conventional resin sealing apparatus, if dust adheres to the surface of the work, there is a problem that the sealing mold is caught during molding (during resin sealing), resulting in defective molding. In particular, in the case of an apparatus provided with a stocker that collectively stores a plurality of works as a supply mechanism, it is not uncommon for the stocker to be turned upside down when it is transported or set. For example, dust adhering to an electronic component of one work falls off and adheres to the base material of another work.

On the other hand, if dust adheres to the molded product after resin sealing, there is a problem that the product in which the molded product is incorporated may malfunction.

In order to solve these problems, a technique for removing dust by cleaning the sealing mold has been disclosed (Patent Document 1: Japanese Unexamined Patent Application Publication No. 2011-18745).

The present invention has been made in view of the above circumstances, and is capable of preventing the occurrence of defective molding by removing dust adhering to the surface of a workpiece, and also preventing the occurrence of defective operation by removing dust adhering to the surface of a molded product. It is an object of the present invention to provide a resin sealing device capable of

The present invention solves the above-described problems by means of solving means described below as one embodiment.

A resin sealing apparatus according to the present invention uses a sealing die having an upper mold and a lower mold to seal a workpiece with resin and process it into a molded product, wherein the workpiece is a workpiece stocker that stores the workpiece; a workpiece transfer unit that is disposed adjacent to the workpiece stocker and moves the workpiece from the workpiece stocker to a workpiece setting unit; a molded product stocker that stores the molded product; a molded product moving unit disposed adjacent to the product stocker for moving the molded product from the molded product setting unit to the molded product stocker; A workpiece dust collector having a first duct that collects dust by applying a suction force to at least one surface from a position separated by a predetermined distance, or the upper surface of the molded product during movement by the molded product moving unit, or At least one of the molded article dust collection section having a second duct section that collects dust by exerting a suction force on at least one of the lower surfaces from a position separated by a predetermined distance.

According to the configuration provided with the work dust collector, it is possible to apply a suction force to the suction target surface of the work, and to suction and remove the dust adhering to the surface and the dust floating in the surrounding space. In addition, according to the configuration including the molded product dust collecting unit, the suction force is applied to the suction target surface of the molded product, and the dust adhering to the surface and the dust floating in the surrounding space are removed by suction. be able to.

In addition, in the case where the work dust collection unit is provided, the work moving unit has a configuration in which the work is moved by continuous feeding or sequential feeding. In the case of forward feeding, the workpiece is stopped at a position coinciding with the first duct portion in a plan view, and the dust is collected by the workpiece dust collecting portion. It is preferable to have a configuration for collecting dust from the work. In addition, in the case where the molded product dust collection unit is provided, the molded product moving unit has a configuration in which the molded product is moved by continuous or sequential feeding, and in the case of continuous feeding, the molded product is moved. In the case of forward feeding, the molded product is stopped at a position coinciding with the second duct portion in plan view. It is preferable that dust of the molded product is collected by the molded product dust collection unit. According to this, during continuous feeding, the suction force can be uniformly applied to the suction target surface along the movement direction, and in particular, insufficient suction at the ends in the movement direction can be prevented. Further, during forward feeding, the suction force can be applied to the surface to be sucked for a long time, and the dust collecting effect can be enhanced.

Moreover, it is preferable that the work dust collection section further includes a guard section that regulates the work so that it does not move vertically due to the suction force of the first duct section. Moreover, it is preferable that the molded article dust collection section further includes a guard section that regulates the molded article so that it does not move vertically due to the suction force of the second duct section. According to this, it is possible to prevent the workpiece or the molded product from deviating from the predetermined movement path during suction.

In addition, the work dust collection section may further include a brush section that slides on a surface to be collected to remove dust, a spray section that sprays compressed air or ionized air, or a radiation section that emits ultrasonic waves. preferable. In addition, the molded article dust collection section may further have a brush section that slides on the surface to be collected to remove dust, a spray section that sprays compressed air or ionized air, or a radiation section that emits ultrasonic waves. preferable. According to this, even dust that is difficult to remove only by suction can be removed by rubbing. Alternatively, the dust can be lifted and removed by blowing compressed air or ionized air, or by radiating ultrasonic waves.

According to the present invention, it is possible to remove dust adhering to the surface of the workpiece and prevent the occurrence of defective molding. In addition, it is possible to remove dust adhering to the surface of the molded product to prevent malfunction.

1 is a plan view showing an example of a resin sealing device according to an embodiment of the invention; FIG. FIG. 2 is a side view showing an example of a work dust collector of the resin sealing device of FIG. 1; 3 is a side view showing another example of the work dust collector of the resin sealing device of FIG. 1; FIG. 3 is a side view showing another example of the work dust collector of the resin sealing device of FIG. 1; FIG. FIG. 2 is a side view showing an example of a mold opening/closing mechanism, a sealing mold, and a loader of the resin sealing apparatus of FIG. 1; FIG. 2 is a side view showing an example of a molded product dust collecting portion of the resin sealing device of FIG. 1; FIG. 3 is a side view showing another example of the molded product dust collecting portion of the resin sealing device of FIG. 1; FIG. 3 is a side view showing another example of the molded product dust collecting portion of the resin sealing device of FIG. 1;

(overall structure)
BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a plan view (schematic diagram) showing an example of a resin sealing device 1 according to this embodiment. For convenience of explanation, arrows in the drawings may be used to indicate the front/rear, left/right, and up/down directions of the resin sealing device 1 . Further, in all the drawings for explaining each embodiment, members having the same functions are denoted by the same reference numerals, and repeated description thereof may be omitted.

As the resin sealing apparatus 1 according to the present embodiment, a sealing mold including an upper mold provided with a cavity and a lower mold is used, and a plurality of (for example, two) works are collectively molded with resin. A compression molding apparatus for forming a plurality of (for example, two) molded products will be described as an example. However, it is not limited to this configuration.

First, the workpiece W to be molded has a structure in which a plurality of electronic components are mounted on a base material. More specifically, examples of the base material include plate-like members such as resin substrates, ceramic substrates, metal substrates, carrier plates, lead frames, and wafers formed in a rectangular shape, a circular shape, or the like. Examples of electronic components include semiconductor chips, MEMS chips, passive elements, radiator plates, conductive members, spacers, and the like. However, it is not limited to these.

Examples of methods for mounting electronic components on a base material include mounting methods such as wire bonding mounting and flip chip mounting. Alternatively, in the case of a configuration in which the base material (a carrier plate made of glass or metal) is peeled off from the molded product Wp after resin sealing, an adhesive tape having heat peelability or an ultraviolet curable resin that is cured by ultraviolet irradiation is used. There is also a method of affixing electronic components on the substrate.

On the other hand, examples of the resin R include granular (including columnar), pulverized, or powdered thermosetting resins (for example, filler-containing epoxy resin, etc.) is used. The resin R is not limited to the above state, and may be in other states (shapes) such as liquid, plate, sheet, etc., and is a resin other than epoxy thermosetting resin. good too.

Next, an outline of the resin sealing device 1 according to this embodiment will be described. As shown in FIG. 1, the resin sealing apparatus 1 includes, from the left, a work supply unit 100A that mainly supplies the work W, a resin supply unit 100B that mainly supplies the resin R, and the work W that is sealed with resin. The press unit 100C (for example, two units) that mainly processes the molded product Wp as a main component, and the molded product storage unit 100D that mainly stores the molded product Wp after resin sealing are provided as main components. . However, the configuration is not limited to this configuration, and changes can be made as appropriate, such as changing the configuration of each unit or adding other units.

The resin sealing apparatus 1 also includes a transport device 100E that moves between the units and transports the work W, the resin R, and the molded product Wp. As an example, the transport device 100E is configured with a guide rail 126 and a loader 124 that reciprocates along the guide rail 126 . As a modified example, a configuration may be provided in which a loader for loading/unloading to/from the sealing mold 202 is provided separately from the loader 124 (not shown).

The loader 124 according to this embodiment includes a work holding portion 124A capable of holding a work W (in this embodiment, a state in which the resin R is placed) and a molded product holding portion 124B capable of holding a molded product Wp. ing. Here, the work holding portion 124A and the molded article holding portion 124B have a known holding mechanism (for example, a structure that has holding claws to hold and hold, a structure that has a suction hole communicating with a suction device and sucks, etc.). is used (not shown). However, it is not limited to this configuration. Regarding the loader 124, an unloader that can move independently in a loader shape having a molded product holding portion 124B that is separate from the workpiece holding portion 124A may be provided (not shown).

(work supply unit)
Next, the work supply unit 100A included in the resin sealing apparatus 1 will be described. Here, FIG. 2 shows a side view (schematic diagram) of the main configuration of the work supply unit 100A.

As shown in FIGS. 1 and 2, the work supply unit 100A includes a work stocker 102 used to store the work W, a work setting section (for example, a table) 104 for holding (placing) the work W, and a work stocker. 102 and a work moving unit 130 for moving the work W from the work stocker 102 to the work setting unit 104 . A known stack magazine, slit magazine, or the like is used for the work stocker 102, and a plurality of works W can be stored collectively. The number of works W placed on the work setting unit 104 is not limited to two.

Further, the work supply unit 100A has a first duct portion 117 that collects dust by applying a suction force from a position separated by a predetermined distance from the upper and lower surfaces of the work W that is being moved by the work moving portion 130. A portion 116 is provided. Specifically, the first duct portion 117 is formed using a tubular member, is connected to a suction device (not shown), and has an opening 117a at its tip that is positioned at a predetermined distance from the upper and lower surfaces of the workpiece W. placed in a spaced apart position. As a result, the suction force is applied to the suction target surface (here, the upper surface and the lower surface) of the work W, and the dust adhering to the surface and the dust floating in the surrounding space can be removed by suction. . As a modification, the first duct portion 117 may be provided only on one of the upper surface and the lower surface of the workpiece W (not shown). As another modification, one of the upper and lower sides may be used as the clean air blowing side, and the other may be used as the suction side (not shown).

As described above, since the suction force is applied to the work W, the work dust collecting portion 116 is a guard portion that regulates the work W so that it does not move vertically due to the suction force of the first duct portion 117. (not shown). As a result, it is possible to prevent the work W from deviating from the predetermined movement path during suction. Although the construction of the guard section is not particularly limited, a guard rail, a pressing roller, a gripping clip, or the like can be used.

On the other hand, the work moving part 130 is configured with a rail 130A, a pusher 130B, and a traction grip 130C. Thereby, the work W can be pushed out from the work stocker 102 using the pusher 130B, and then the work W can be moved on the rail 130A using the traction grip 130C. However, the work moving unit 130 is not limited to this configuration, and may have a configuration including a conveyor, a configuration including rollers and a belt, or the like. Furthermore, a configuration in which known pickups, elevators, and the like are arranged side by side (neither is shown) may be used.

The workpiece moving unit 130 according to the present embodiment is configured to be able to implement both "continuous feeding" and "progressive feeding". Therefore, in the case of "continuous feeding", the workpiece W can be dust-collected by the workpiece dust collector 116 while the workpiece W is being moved (that is, while being moved). As a result, the suction force can be uniformly applied along the movement direction of the work W, and in particular, insufficient suction at the ends of the work W in the movement direction can be prevented. Further, in the case of "progressive feeding", the workpiece W is stopped at a position where the opening 117a at the tip of the first duct portion 117 and the opening 117a at the tip of the first duct portion 117 match in plan view (for example, their centers match). The work W can be dust-collected by the dust section 116 . As a result, the suction force can be applied to the suction target surface of the workpiece W for a long time, and the dust removal effect can be enhanced.

Here, another embodiment of the work dust collector 116 is shown in FIG. Specifically, the opening 117a at the tip of the first duct portion 117 is expanded to the same size as the suction target surface of the workpiece W in a plan view. According to this configuration, particularly when the work W is forwarded, the suction force can be applied to the entire surface of the work W to be sucked, and the dust removing effect can be further enhanced.

Another embodiment of the work dust collector 116 is shown in FIG. Specifically, a brush portion 120 that removes dust by slidingly contacting the surface of the workpiece W to be collected is provided. According to this configuration, dust that is difficult to remove only by suction can be removed by rubbing. Furthermore, as another embodiment, a blowing portion for blowing compressed air or ionized air or a radiation portion for emitting ultrasonic waves may be provided (neither is shown). According to this configuration, for example, when the brush portion cannot be installed, or when the work W is not suitable for sliding contact with the brush portion, the dust is lifted by blowing compressed air or ionized air or by radiating ultrasonic waves. can be removed by The brush portion 120, the blowing portion, and the radiation portion may be provided at the tip of the first duct portion 117, or may be provided separately.

The operation outline of the work supply unit 100A having the above configuration is as follows. First, the workpiece W is moved from the workpiece stocker 102 by the workpiece moving unit 130 . During the movement, the work W is placed on the work setting section 104 after dust is removed by the work dust collector 116 . Next, the work W placed on the work setting section 104 is held by the loader 124 and conveyed to the resin supply unit 100B.

(resin supply unit)
Next, the resin supply unit 100B included in the resin sealing apparatus 1 will be described.

The resin supply unit 100B according to this embodiment includes a work setting section (for example, a table) 106 that holds (places) the work W, and a resin supply section 140 that supplies the resin R. As a result, the set amount of resin R is supplied from the resin supply unit 140 to the upper surface of the work W placed on the work setting unit 106 .

As another embodiment, a resin loader for directly loading the resin R into the sealing mold 202 may be provided separately from the workpiece W (not shown). Alternatively, without separately providing the resin supply unit 100B, the resin R may be supplied onto the work W while the work W is placed on the work set portion 104 of the work supply unit 100A (not shown). ).

The operation outline of the resin supply unit 100B having the above configuration is as follows. First, the work W loaded from the work supply unit 100A by the loader 124 is placed on the work setting section 106 . Next, a set amount of resin R is supplied from the resin supply unit 140 to the upper surface of the work W placed on the work setting unit 106 . Next, the work W with the resin R supplied (mounted) on its upper surface is held by the loader 124 and conveyed to the press unit 100C.

(press unit)
Next, the press unit 100C included in the resin sealing device 1 will be described. Here, FIG. 5 shows a side view (schematic diagram) of the mold opening/closing mechanism 250, the sealing mold 202, and the loader 124 of the resin sealing apparatus 1. As shown in FIG.

The press unit 100C includes a sealing mold 202 having an upper mold 204 on the upper side in the vertical direction and a lower mold 206 on the lower side as a pair of dies that are opened and closed. In this embodiment, a cavity 208 is provided on the lower surface of the upper mold 204 and a work holding portion 205 is provided on the upper surface of the corresponding lower mold 206 . However, it is not limited to this configuration, and instead of the upper mold 204, or together with the upper mold 204, a cavity may be provided on the upper surface of the lower mold 206 (not shown).

Also, the sealing mold 202 is opened and closed by a known mold opening/closing mechanism 250 . As an example shown in FIG. 5, the mold opening/closing mechanism 250 includes a pair of platens 252 and 254, a plurality of connecting mechanisms 256 on which the pair of platens 252 and 254 are installed, and a drive source for moving (lifting) the platen 254. (for example, an electric motor) 260, a drive transmission mechanism (for example, a ball screw or toggle link mechanism) 262, and the like.

The operation outline of the press unit 100C having the above configuration is as follows. First, the work W carried in from the resin supply unit 100B by the loader 124 is held at a predetermined position (in this embodiment, the work holding portion 205 of the lower mold 206) inside the sealing mold 202. As shown in FIG. Next, the mold is closed, the work W is sealed with resin, and the molded product Wp is processed. Next, the molded article Wp taken out from the opened sealing mold 202 is held by the loader 124 and transported to the molded article storage unit 100D. Incidentally, a known release film (not shown) may be appropriately used at the time of resin sealing.

(molded product storage unit)
Next, a molded product storage unit 100D included in the resin sealing device 1 will be described. Here, FIG. 6 shows a side view (schematic diagram) of the main configuration of the molded product storage unit 100D.

As shown in FIGS. 1 and 6, the molded product storage unit 100D includes a molded product stocker 108 used to store the molded product Wp, and a molded product setting section (for example, a table) that holds (places) the molded product Wp. 114 , and a molded product moving section 132 arranged adjacent to the molded product stocker 108 to move the work W from the molded product setting section 114 to the molded product stocker 108 . A known stack magazine, slit magazine, or the like is used for the molded product stocker 108, and a plurality of molded products Wp can be collectively accommodated. The number of molded products Wp placed on the molded product setting unit 114 is not limited to two.

The molded article storage unit 100D also has a second duct section 119 that collects dust by applying a suction force from a position separated by a predetermined distance from the upper and lower surfaces of the molded article Wp during movement by the molded article moving section 132. A molded product dust collector 118 is provided. Specifically, the second duct portion 119 is formed using a tubular member, is connected to a suction device (not shown), and has an opening portion 119a at the tip thereof which is predetermined for the upper and lower surfaces of the molded article Wp. placed at a distance. As a result, the suction force is applied to the suction target surface (here, the upper surface and the lower surface) of the molded product Wp, and the dust adhering to the surface and the dust floating in the surrounding space can be removed by suction. can. As a modification, the second duct portion 119 may be provided only on one of the upper surface and the lower surface of the molded article Wp (not shown). As another modification, one of the upper and lower sides may be used as the clean air blowing side, and the other may be used as the suction side (not shown).

As described above, since the suction force is applied to the molded product Wp, the molded product dust collecting unit 118 regulates the vertical movement of the molded product Wp by the suction force of the second duct unit 119. It is preferable to have a configuration provided with a guard portion (not shown) that does so. As a result, it is possible to prevent the molded product Wp from deviating from the predetermined movement path during suction. Although the construction of the guard section is not particularly limited, a guard rail, a pressing roller, a gripping clip, or the like can be used.

On the other hand, the molded product moving section 132 is configured with a rail 132A and a pusher 132B. As a result, the pusher 132B can be used to push the molded product Wp to move it from the rail 132A and store it in the molded product stocker 108 . However, the molded product moving unit 132 is not limited to this configuration, and may be configured to include a conveyor, or may include rollers and belts. Furthermore, a configuration in which known pickups, elevators, and the like are arranged side by side (neither is shown) may be used.

The molded article moving unit 132 according to this embodiment is configured to be able to implement both the "continuous feeding" and the "progressive feeding" moving methods. Therefore, in the case of "continuous feed", the molded article dust collector 118 can collect dust from the molded article Wp while the molded article Wp is being moved (that is, while being moved). As a result, the suction force can be applied uniformly along the moving direction of the molded article Wp, and in particular, insufficient suction at the ends of the molded article Wp in the moving direction can be prevented. Further, in the case of "progressive feeding", the molded product Wp is stopped at a position where it coincides with the opening 119a at the tip of the second duct portion 119 in plan view (for example, the centers of the two coincide). The product dust collector 118 can collect dust from the molded product Wp. As a result, the suction force can be applied to the suction target surface of the molded article Wp for a long time, and the dust removal effect can be enhanced.

Here, another embodiment of the molded product dust collecting section 118 is shown in FIG. Specifically, the opening 119a at the tip of the second duct portion 119 is expanded to a size approximately equal to the suction target surface of the molded article Wp in a plan view. According to this configuration, particularly when the molded article Wp is fed forward, the suction force can be applied to the entire suction target surface of the molded article Wp, and the dust removing effect can be further enhanced.

8 shows another embodiment of the molded product dust collecting section 118. As shown in FIG. Specifically, a brush portion 121 is provided that removes dust by slidingly contacting the surface of the molded article Wp that is to be dust-collected. According to this configuration, dust that is difficult to remove only by suction can be removed by rubbing. Furthermore, as another embodiment, a blowing portion for blowing compressed air or ionized air or a radiation portion for emitting ultrasonic waves may be provided (neither is shown). According to this configuration, for example, when the brush portion cannot be installed, or when the molded product Wp does not have appropriate sliding contact with the brush portion, the dust can be removed by blowing compressed air or ionized air or by radiating ultrasonic waves. Can be lifted and removed. The brush portion 121, the blowing portion, and the radiation portion may be provided at the tip of the second duct portion 119, or may be provided separately.

The outline of the operation in the molded article storage unit 100D having the above configuration is as follows.
First, the molded article Wp is placed on the molded article setting section 114 by the loader 124 . Next, the molded product Wp placed on the molded product setting unit 114 is moved by the molded product moving unit 132 . During the movement, the molded product Wp is stored in the molded product stocker 108 after dust is removed by the molded product dust collector 118 .

As described above, according to the resin sealing apparatus of the present invention, it is possible to remove dust adhering to the surface of the workpiece and prevent the occurrence of defective molding. In addition, it is possible to remove dust adhering to the surface of the molded product to prevent malfunction.

It should be noted that the present invention is not limited to the above-described embodiments, and can be modified in various ways without departing from the scope of the present invention. For example, in the above embodiment, the configuration including both the workpiece dust collecting section and the molded product dust collecting section was described as an example, but a configuration including only one of them may be employed.

Further, in the above embodiments, the compression molding apparatus having the cavity in the upper mold has been described as an example, but it is also applicable to the compression molding apparatus having the cavity in the lower mold. Furthermore, the present invention is not limited to compression molding equipment, and can also be applied to transfer molding equipment.

1 resin sealing device 116 workpiece dust collection unit 117 first duct unit 118 molded product dust collection unit 119 second duct unit 130 work moving unit 132 molded product moving unit

Claims (7)

A resin encapsulation device for encapsulating a workpiece with resin and processing it into a molded product using a encapsulation mold having an upper mold and a lower mold,
a work stocker that stores the work;
a work moving section disposed adjacent to the work stocker for moving the work from the work stocker to a work setting section;
a molded product stocker that stores the molded product;
a molded product moving unit disposed adjacent to the molded product stocker for moving the molded product from the molded product setting unit to the molded product stocker;
A workpiece dust collector having a first duct that collects dust by applying a suction force from a position separated by a predetermined distance from at least one of the upper surface and the lower surface of the workpiece during movement by the workpiece moving unit;
or,
A molded article dust collecting section having a second duct section that collects dust by applying a suction force from a position separated by a predetermined distance from at least one of the upper surface and the lower surface of the molded article that is being moved by the molded article moving section. ,
A resin sealing device comprising at least one of In the case of including the work dust collecting part,
The work moving unit has a configuration for moving the work by continuous or sequential feeding,
In the case of continuous feeding, the work dust collection unit collects dust from the work while the work is being moved,
2. In the case of forward feeding, the work is stopped at a position coinciding with the first duct in plan view, and dust is collected from the work by the work dust collector. 2. The resin sealing device according to 1. In the case of including the molded product dust collection part,
The molded product moving unit has a configuration for moving the molded product by continuous or sequential feeding,
In the case of continuous feeding, the dust is collected from the molded product by the molded product dust collecting unit while the molded product is being moved,
In the case of progressive feeding, the dust is collected from the molded article by the molded article dust collecting section while the molded article is stopped at a position coinciding with the second duct section in a plan view. The resin sealing device according to claim 1. 2. The resin sealing device according to claim 1, wherein the work dust collection section further has a guard section for regulating the work so that the work is not moved vertically by the suction force of the first duct section. 2. The resin sealing device according to claim 1, wherein said molded article dust collection section further has a guard section for regulating said molded article so as not to move vertically due to the suction force of said second duct section. The work dust collection unit further has a brush unit that slides on a surface to be collected to remove dust, a blow unit that blows compressed air or ion air, or a radiation unit that radiates ultrasonic waves. The resin sealing device according to claim 1. The molded product dust collection section further includes a brush section for slidingly contacting a surface to be collected to remove dust, a spray section for spraying compressed air or ionized air, or a radiation section for emitting ultrasonic waves. 2. The resin sealing device according to claim 1.

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