JP2024139406A - Compression molding apparatus and compression molding method - Google Patents

Abstract

To provide a compression molding device and a compression molding method capable of preventing an occurrence of molding defects.SOLUTION: A compression molding device 1 according to the present invention uses a sealing mold 202 equipped with an upper mold 204 and a lower mold 206 to process a workpiece W having a configuration in which an electronic component Wb is mounted on a substrate Wa into a molded product Wp by sealing it with sealing resin R, wherein a first sealing resin Ra, which is a plate-shaped or block-shaped solid or semi-solid resin and has a first quantity, is used as the sealing resin R. The compression molding device includes a control calculation unit 150 that calculates a total amount of resin required based on data obtained by measuring the number of electronic components Wb mounted on the one substrate Wa for each workpiece W, and compares the total amount with a first quantity. When the first quantity is insufficient for the total amount, the control calculation unit 150 controls a supply of a second sealing resin R, which is a block-shaped solid or semi-solid resin or a highly viscous liquid resin and has a second quantity equivalent to a shortage, so that the second sealing resin R is additionally used as the sealing resin R.SELECTED DRAWING: Figure 6

Description

The present invention relates to a compression molding device and a compression molding method.

One example of a resin sealing device and resin sealing method that uses a compression molding method to seal a workpiece having electronic components mounted on a substrate with sealing resin and process it into a molded product.

The compression molding method is a technique in which a predetermined amount of sealing resin is supplied to a sealing area (cavity) provided in a sealing mold comprising an upper mold and a lower mold, a workpiece is placed in the sealing area, and the upper and lower molds are clamped to seal the workpiece with resin. As an example, when a sealing mold having a cavity in the upper mold is used, a technique is known in which the sealing resin is supplied all at once to the center position on the workpiece and molded. On the other hand, when a sealing mold having a cavity in the lower mold is used, a technique is known in which a release film (hereinafter sometimes simply referred to as "film") that covers the mold surface including the cavity and the sealing resin are supplied and molded (Patent Document 1: JP 2019-145550 A).

JP 2019-145550 A

For example, when resin-sealing a strip-type wire-connected electronic component (semiconductor chip) as the workpiece, the compression molding method in which a cavity is provided in the upper die has the problem that resin sealing is difficult because the wire portion of the workpiece held in the lower die comes into contact with the sealing resin previously supplied to the cavity or the sealing resin supplied onto the workpiece and deforms. For this reason, the compression molding method in which the workpiece is held in the upper die, a cavity is provided in the lower die, and sealing resin (granular resin, as an example) is supplied into the cavity has generally been adopted.

However, in a configuration in which a workpiece is held in the upper mold and a cavity is provided in the lower mold, when the workpiece is thin or large, there is a problem that it is difficult to hold it in the upper mold and it is easy to fall. In addition, although the sealing resin is usually supplied into the cavity of the lower mold through a film, when trying to form a thick molded product with a thickness (here, the thickness of the resin part after molding) exceeding 1 mm, the molding stroke becomes large, and there is a problem that the film is likely to be caught in the molded product, resulting in molding defects. Furthermore, when granular resin is used as the sealing resin, in addition to the problem of dust generation during molding and the problem of difficult handling, there is a problem that it is difficult to supply (spread) the sealing resin evenly to the entire area in the cavity provided in the lower mold, and uneven winding is likely to occur. In addition, there is a problem that the air contained in the gaps between the particles when the sealing resin is spread and the gas components due to degassing from the sealing resin when melted are not released, which is likely to cause molding defects. In particular, in the case of workpieces in which electronic components are mounted via wire connections, there is a risk of wire flow (deformation or breakage of the wire) due to the flow of resin inside the cavity during resin sealing.

Regardless of the cavity arrangement, if the workpiece to be sealed is missing electronic components (for example, not being mounted due to thinning out, or being lost after mounting), the total amount of resin required for sealing increases, resulting in a shortage of resin and molding defects.

The present invention has been made in consideration of the above circumstances, and aims to provide a compression molding device and a compression molding method that can solve the problems of a configuration in which a cavity is provided in the upper mold and the problems of a configuration in which a cavity is provided in the lower mold, can prevent molding defects caused by flow of the sealing resin, uneven winding, residual gas, and insufficient resin amount, can form molded products with large thickness dimensions, can easily handle the sealing resin, and can prevent the generation of dust during molding.

The present invention solves the above problems by the solution described below as one embodiment.

The compression molding device according to one embodiment is a compression molding device that uses a sealing die having an upper mold and a lower mold to seal a workpiece having a configuration in which electronic components are mounted on a substrate with sealing resin to process it into a molded product, and is equipped with a control calculation unit that calculates the total amount of resin required based on data measuring the presence or absence of the electronic components mounted on one of the substrates for each of the workpieces and compares the total amount with the first amount, and is required to control the supply of the sealing resin so that a second sealing resin, which is a block-shaped solid or semi-solid resin or a highly viscous liquid resin and has a second amount equivalent to the shortage amount, is additionally used as the sealing resin when the first amount is insufficient relative to the total amount.

According to the above embodiment, molding defects caused by flow of the sealing resin, uneven winding, and residual gas can be prevented. In particular, even if the total amount of resin required increases due to missing electronic components of the workpiece, the total amount of resin required can be easily and quickly secured, so molding defects caused by insufficient resin can be prevented. In addition, even when forming a thick molded product with a thickness dimension exceeding 1 mm, film jamming can be prevented. In addition, handling of the sealing resin can be facilitated, and dust generation during molding due to granular resin can be prevented.

As an example, when the upper mold has a cavity, it is preferable that the second sealing resin is placed on the electronic component mounting surface of the substrate, and the compression molding is performed with the first sealing resin placed on the second sealing resin. In that case, it is preferable that the first sealing resin is not in contact with the electronic components when the second sealing resin is placed on the electronic component mounting surface of the substrate, and the first sealing resin is placed on the second sealing resin.

As another example, when the lower mold has a cavity, it is preferable that the first sealing resin is placed on the bottom surface of the cavity, and compression molding is performed with the second sealing resin placed on the first sealing resin.

In addition, a compression molding method according to one embodiment is a compression molding method in which a workpiece having a configuration in which electronic components are mounted on a substrate is encapsulated with encapsulating resin to form a molded product using an encapsulating die having an upper die and a lower die, and includes a resin preparation step of preparing a first encapsulating resin that is a plate-shaped or block-shaped solid or semi-solid resin having a first amount as the encapsulating resin, a calculation step of calculating a total amount of resin required based on data obtained by measuring the number of electronic components mounted on one of the substrates for each of the workpieces and comparing the total amount with the first amount, and an additional resin preparation step of additionally preparing a second encapsulating resin that is a block-shaped solid or semi-solid resin or a highly viscous liquid resin having a second amount equivalent to the amount of deficiency as the encapsulating resin when the first amount is insufficient relative to the total amount.

The present invention can solve the problems associated with a configuration in which a cavity is provided in the upper mold and the problems associated with a configuration in which a cavity is provided in the lower mold. It can also prevent molding defects caused by flow of the sealing resin, uneven winding, residual gas, and insufficient resin. It can also form thick molded products with a thickness of more than 1 mm. It can also facilitate the handling of the sealing resin and prevent the generation of dust during molding.

FIG. 1 is a plan view showing an example of a compression molding device according to an embodiment of the present invention. FIG. 2 is a side view showing an example of a press device of the compression molding apparatus according to the first embodiment of the present invention. 1 is a front cross-sectional view showing an example of a sealing mold of a compression molding apparatus according to a first embodiment of the present invention. FIG. 1 is an explanatory diagram of a compression molding method according to a first embodiment of the present invention. FIG. FIG. 5 is an explanatory diagram following FIG. 4 . FIG. 6 is an explanatory diagram following FIG. 5 . Fig. 7A is an enlarged view of part VII in Fig. 6. Fig. 7B is an explanatory view following Fig. 7A. FIG. 7B is an explanatory diagram following FIG. FIG. 9 is an explanatory diagram following FIG. 8 . FIG. 2 is a perspective view showing an example of a sealing resin (first sealing resin) used in the compression molding apparatus and compression molding method according to the embodiment of the present invention. 11A is a perspective view showing an example of a sealing resin (second sealing resin) used in the compression molding apparatus and the compression molding method according to the embodiment of the present invention, and FIG. 11B is another example of the second sealing resin, and FIG. 11C is another example of the second sealing resin. FIG. 11 is a side view showing an example of a press device of a compression molding apparatus according to a second embodiment of the present invention. FIG. 11 is a front cross-sectional view showing an example of a sealing mold of a compression molding apparatus according to a second embodiment of the present invention. FIG. 4 is an explanatory diagram of a compression molding method according to a second embodiment of the present invention. FIG. 15 is an explanatory diagram following FIG. 14 . FIG. 16 is an explanatory diagram following FIG. 15. FIG. 17 is an explanatory diagram following FIG. 16 . FIG. 18 is an explanatory diagram following FIG. 17. 1 is an explanatory diagram of a compression molding device and a compression molding method according to a conventional embodiment. 1 is an explanatory diagram of a compression molding device and a compression molding method according to a conventional embodiment.

[First embodiment]
(Overall composition)
Hereinafter, the first embodiment of the present invention will be described in detail with reference to the drawings. Fig. 1 is a plan view (schematic view) showing an example of a compression molding apparatus 1 according to this embodiment (a configuration diagram common to the second embodiment). For convenience of explanation, arrows in the drawing indicate the left-right direction (X direction), the front-back direction (Y direction), and the up-down direction (Z direction) in the compression molding apparatus 1. In addition, in all the drawings for explaining each embodiment, members having the same function are given the same reference numerals, and repeated explanations thereof may be omitted.

The compression molding apparatus 1 according to this embodiment is an apparatus that performs resin sealing (compression molding) of a workpiece (molded product) W using a sealing mold 202 that includes an upper mold 204 and a lower mold 206. The lower mold 206 is provided with one or more workpiece holding portions 205 that hold the workpiece W. The upper mold 204 is provided with one or more cavities 208 depending on the shape and number of the workpieces W. A film F is adsorbed and held within this cavity 208. However, this configuration is not limited to this.

First, the workpiece W to be molded has a configuration in which electronic components Wb are mounted on a substrate Wa. More specifically, examples of the substrate Wa include plate-shaped members such as resin substrates, ceramic substrates, metal substrates, carrier plates, lead frames, and wafers. Examples of the electronic components Wb include semiconductor chips, MEMS chips, passive elements, heat sinks, conductive members, spacers, and the like. The shape of the substrate Wa is rectangular (striped), square, circular, and the like. The number of electronic components Wb mounted on one substrate Wa is set to one or more (for example, in a matrix).

Examples of methods for mounting electronic components Wb on the substrate Wa include wire bonding and flip chip mounting. Alternatively, in the case of a configuration in which the substrate (glass or metal carrier plate) Wa is peeled off from the molded product Wp after resin sealing, the electronic components Wb can be attached using a thermally peelable adhesive tape or an ultraviolet-curable resin that is cured by exposure to ultraviolet light.

In this embodiment, the sealing resin R is a thermosetting resin (e.g., but not limited to, an epoxy resin containing a filler) and is a solid or semi-solid resin having a predetermined shape (details will be described later) that corresponds to the shape of the workpiece W. Note that the above "semi-solid" does not mean a completely solid state, but a state that has melted to the so-called B stage.

As examples of film F, film materials with excellent heat resistance, ease of peeling, flexibility, and extensibility, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene polymer), PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidine chloride, etc., are preferably used.

Next, an overview of the compression molding device 1 according to this embodiment will be described. As shown in FIG. 1, the compression molding device 1 mainly comprises a supply unit 100A for supplying the workpiece W, a press unit 100B for sealing the workpiece W with resin and processing it into a molded product Wp, and a storage unit 100C for storing the molded product Wp. As an example, the supply unit 100A, the press unit 100B, and the storage unit 100C are arranged in this order along the X direction in FIG. 1. However, the above configuration is not limited to this, and the equipment configuration within the unit, the number of units (particularly the number of press units), the arrangement order of the units, etc. can be changed. In addition, a configuration including units other than those described above (all not shown).

The compression molding device 1 also includes a resin supply unit 120 that supplies the sealing resin R. In this embodiment, a first sealing resin Ra and a second sealing resin Rb are used as the sealing resin R, which will be described in detail later. The resin supply unit 120 according to this embodiment is configured to detachably hold a stocker or the like that contains a plurality of preformed sealing resins R (i.e., the first sealing resin Ra and the second sealing resin Rb), and sequentially take out and supply the sealing resins R. However, this is not limited to this configuration, and a resin forming mechanism that forms the sealing resins R (i.e., the first sealing resin Ra and the second sealing resin Rb) may be provided to sequentially form and supply the sealing resins R (not shown).

As an example, the resin supply section 120 is arranged in the supply unit 100A, but it may also be arranged in the storage unit 100C or the press unit 100B, or in a separate unit other than those mentioned above when the storage unit 100C or the press unit 100B is provided (not shown). Alternatively, as another example, the resin supply section 120 may be arranged outside the compression molding device 1 and transported into the device using a transport device such as a belt conveyor or a robot hand (not shown).

The compression molding device 1 also includes a measuring unit 140 that measures the number of electronic components Wb (mounted or missing, and may also include measuring the height of electronic components Wb) mounted on one substrate Wa for each workpiece W to be sealed. As an example, the measuring unit 140 is configured to calculate the number of electronic components Wb by measuring the weight of the workpiece W. However, the present invention is not limited to this configuration, and the measuring unit 140 may also be configured to image the electronic component mounting surface of the substrate Wa and calculate the number of electronic components Wb by image processing.

As an example, the measuring unit 140 is arranged in the supply unit 100A, but it may also be arranged in the storage unit 100C or the press unit 100B, or in a separate unit other than the above when a separate unit is provided (not shown). Alternatively, as another example, the measuring unit 140 may be arranged outside the compression molding device 1, and measurement data on the number of electronic components Wb present or absent for each work W may be transmitted to this device (compression molding device 1) (not shown).

In addition, the compression molding device 1 has a guide rail 130 that is linearly provided between each unit, and a transport device (first loader) 132 that transports the workpiece W and the sealing resin R, and a transport device (second loader) 134 that transports the molded product Wp are provided so as to be movable between predetermined units along the guide rail 130. However, the configuration is not limited to the above, and a configuration including a common (single) transport device (loader) that transports the workpiece W, the sealing resin R, and the molded product Wp (not shown) may also be used. In addition, the transport device may be configured to include a robot hand or the like instead of a loader.

In addition, in the compression molding device 1, a control calculation unit 150 that controls the operation of each mechanism in each unit is arranged in the supply unit 100A (it may also be arranged in another unit).

(Supply unit)
Next, the supply unit 100A included in the compression molding apparatus 1 will be described in detail.

The supply unit 100A includes a supply magazine 102 in which multiple workpieces W are stored. Here, the supply magazine 102 may be a known stack magazine, slit magazine, or the like.

The supply unit 100A may be configured to include a work stage (not shown) on which the work W removed from the supply magazine 102 is placed. The supply unit 100A may be configured to include a resin stage (not shown) on which the sealing resin R supplied from the resin supply section 120 is placed.

The workpiece W and sealing resin R are held by the first loader 132 and transported to the press unit 100B, where they are set in a predetermined position in the sealing mold 202. In this embodiment, the workpiece W is held by the workpiece holding portion 205 of the lower mold 206, and the sealing resin R is placed on the workpiece W held by the workpiece holding portion 205 (details of the process will be described later). Note that the holding mechanism for the workpiece W and sealing resin R in the first loader 132 uses a known holding mechanism (for example, a clamping configuration with holding claws, a suction hole communicating with a suction device and a suction configuration, etc.) (not shown).

As a variation of the above-mentioned conveying device, instead of the first loader 132 that moves in the X and Y directions, a separate conveying device (loader) that moves in the X direction to convey between units and a separate conveying device (loader) that moves in the Y direction to load and set into the sealing mold 202 may be provided (not shown).

The supply unit 100A also includes a preheater (not shown) that preheats the workpiece W and the sealing resin R. As an example, a known heating mechanism (e.g., an electric wire heater, an infrared heater, etc.) is used for the preheater. This allows the workpiece W and the sealing resin R to be preheated before being carried into the sealing mold 202. Note that a configuration without a preheater is also possible. Also, instead of or in addition to the preheater, a configuration in which a preheating heater (not shown) is provided in the first loader 132 may also be used.

(Press unit)
Next, the press unit 100B included in the compression molding apparatus 1 will be described in detail.

The press unit 100B is equipped with a sealing die 202 having a pair of dies (for example, a combination of multiple die blocks, die plates, die pillars, etc., made of alloy tool steel, and other components) that can be opened and closed. It is also equipped with a press device 250 that opens and closes the sealing die 202 to resin seal the workpiece W. As an example, a configuration is shown that includes one press device 250, but a configuration that includes multiple press devices (not shown) may also be used. A side view (schematic diagram) of the press device 250 provided in the press unit 100B is shown in FIG. 2, and a front cross-sectional view (schematic diagram) of the sealing die 202 is shown in FIG. 3.

Here, as shown in FIG. 2, the press device 250 is configured to include a pair of platens 254, 256, a plurality of tie bars 252 on which the pair of platens 254, 256 are supported, and a drive device for moving (raising and lowering) the platen 256. Specifically, the drive device is configured to include a drive source (e.g., an electric motor) 260 and a drive transmission mechanism (e.g., a ball screw or a toggle link mechanism) 262 (however, this is not limited to this). In this embodiment, the upper platen 254 in the vertical direction is set as a fixed platen (a platen fixed to the tie bars 252), and the lower platen 256 is set as a movable platen (a platen slidably held by the tie bars 252 and raised and lowered). However, this is not limited to this, and the platens may be set upside down, i.e., the upper side may be set as a movable platen and the lower side as a fixed platen, or both the upper and lower sides may be set as movable platens (neither is shown).

On the other hand, as shown in FIG. 3, the sealing mold 202 is provided with an upper mold 204 on the upper side in the vertical direction and a lower mold 206 on the lower side as a pair of molds arranged between the pair of platens 254, 256 in the press device 250. That is, the upper mold 204 is assembled to the upper platen (in this embodiment, the fixed platen 254), and the lower mold 206 is assembled to the lower platen (in this embodiment, the movable platen 256). The upper mold 204 and the lower mold 206 move toward and away from each other to close and open the mold (the vertical direction (up and down direction) is the mold opening and closing direction).

In addition, in this embodiment, as an example, a film supply mechanism 211 is provided that transports (supplies) a roll-shaped film F into the interior of the sealing die 202. Note that, depending on the configuration of the workpiece W, the film F may be in the form of a strip instead of a roll.

Next, the upper mold 204 of the sealing mold 202 will be described in detail. As shown in FIG. 3, the upper mold 204 includes an upper mold chase 210, a cavity piece 226 held by the upper mold chase, a clamper 228, and the like. The upper mold chase 210 is fixed to the lower surface of the support plate 214 via a support pillar 212. A cavity 208 is provided on the lower surface of the upper mold 204 (the surface facing the lower mold 206).

The clamper 228 is configured in an annular shape to surround the cavity piece 226, and is assembled to the underside of the support plate 214 via a push pin 222 and a clamper spring (a biasing member such as a coil spring) 224 so as to be spaced apart (floating) from the bottom surface of the support plate 214 and movable up and down (however, this assembly structure is not limited). The cavity piece 226 forms the inner part (bottom part) of the cavity 208, and the clamper 228 forms the side part of the cavity 208. The shape and number of cavities 208 provided in one upper mold 204 are appropriately set according to the shape and number of workpieces W (one or multiple).

In addition, suction paths (holes, grooves, etc.) that communicate with a suction device are provided (not shown) on the underside of the clamper 228 and at the boundary between the clamper 228 and the cavity piece 226. This allows the film F supplied from the film supply mechanism 211 to be adsorbed and held on the mold surface 204a, including the inner surface of the cavity 208. In addition, the cavity 208 can be degassed when the mold is closed and resin sealing is performed.

In addition, in this embodiment, an upper die heating mechanism (not shown) is provided that heats the upper die 204 to a predetermined temperature. This upper die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control and calculation unit 150. As an example, the heater is built into the upper die chase 210 and is configured to apply heat to the entire upper die 204 and the sealing resin R contained in the cavity 208. The heater heats the upper die 204 to a predetermined temperature (e.g., 100°C to 300°C).

Next, the lower die 206 of the sealing mold 202 will be described in detail. As shown in FIG. 3, the lower die 206 includes a lower die chase 240 and a lower plate 242 held by the chase.

In this embodiment, a workpiece holding section 205 is provided to hold the workpiece W at a predetermined position on the upper surface of the lower plate 242. As an example, the workpiece holding section 205 has a workpiece guide pin (not shown) and a suction passage (hole, groove, etc.) that is arranged to penetrate the lower plate 242 and communicates with a suction device (not shown). Specifically, one end of the suction passage is connected to the die surface 206a of the lower die 206, and the other end is connected to a suction device arranged outside the lower die 206. This makes it possible to drive the suction device to suck the workpiece W through the suction passage and hold the workpiece W by suction on the die surface 206a (here, the upper surface of the lower plate 242). Instead of the above-mentioned suction holding mechanism, or together with the suction holding mechanism, a configuration may be provided with holding claws that clamp the outer periphery of the workpiece W (not shown). The shape and number of the workpiece holding sections 205 provided on one lower die 206 are appropriately set according to the shape and number of the workpieces W (one or multiple).

In this embodiment, a lower die heating mechanism (not shown) is provided to heat the lower die 206 to a predetermined temperature. This lower die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control and calculation unit 150. As an example, the heater is built into the lower die chase 240 and is configured to apply heat to the entire lower die 206 and the workpiece W held by the workpiece holding unit 205. The heater heats the lower die 206 to a predetermined temperature (e.g., 100°C to 300°C).

(Storage unit)
Next, the storage unit 100C included in the compression molding apparatus 1 will be described in detail.

The molded product Wp is held by the second loader 134, removed from the sealing mold 202, and transported to the storage unit 100C. The second loader 134 uses a known holding mechanism for the molded product Wp (e.g., a clamping mechanism with holding claws, a suction hole that communicates with a suction device and a suction mechanism, etc.) (not shown).

As a variation of the above-mentioned conveying device, instead of the second loader 134 that moves in the X and Y directions, a separate conveying device (loader) that moves in the X direction to convey between units and a separate conveying device (loader) that moves in the Y direction to unload from the sealing mold 202 may be provided (not shown).

The storage unit 100C includes a storage magazine 104 in which multiple molded products Wp are stored. Here, the storage magazine 104 may be a known stack magazine, slit magazine, or the like.

The storage unit 100C may also be configured to include a molded product stage (not shown) on which the molded product Wp transported from the press unit 100B is placed.

(Resin sealing operation)
Next, the operation of performing resin sealing (compression molding) using the compression molding device 1 according to this embodiment (i.e., the compression molding method according to this embodiment) will be described. Here, Figs. 4 to 9 are explanatory views of each process, and are illustrated as front cross-sectional views in the same direction as Fig. 3.

First, as a preparation process, a heating process (upper die heating process) is carried out in which the upper die 204 is heated to a predetermined temperature (e.g., 100°C to 300°C) using the upper die heating mechanism. In addition, a heating process (lower die heating process) is carried out in which the lower die 206 is heated to a predetermined temperature (e.g., 100°C to 300°C) using the lower die heating mechanism. In addition, a film setting process is carried out in which the film supply mechanism 211 is operated to set a new film F in the sealing die 202.

Before, after, or in parallel with the above preparation process, a resin preparation process is carried out to prepare a first sealing resin Ra, which is a plate-shaped or block-shaped solid or semi-solid resin having a first amount (amount of resin, i.e., grams). Specifically, the resin supply unit 120 supplies the first sealing resin Ra, and makes it ready to be transported by a transport device (in this embodiment, the first loader 132). As an example, the first sealing resin Ra is configured so that one piece constitutes the first amount, but as another example, the first sealing resin Ra may be configured so that several pieces (e.g., two or three pieces) constitute the first amount. Examples of the configuration (shape) of the first sealing resin Ra will be described later.

Before, after, or in parallel with the resin preparation process and the calculation process, a workpiece holding process is carried out in which the workpiece W is held by the workpiece holding portion 205 of the lower die 206 (see FIG. 4). Specifically, the workpiece W supplied from the supply magazine 102 is held by the first loader 132 and carried into the sealing die 202, where it is held by the workpiece holding portion 205.

At some point before the workpiece holding step, the measuring unit 140 or the like measures the number of electronic components Wb (mounted or missing, and may also include measuring the height of the electronic components Wb or measuring their weight) mounted on one substrate Wa for each workpiece W. Next, the control and calculation unit 150 calculates the total amount of sealing resin R required to seal the measured workpiece W based on the measurement data, and performs a calculation step of comparing the total amount with the first amount. As described above, the measuring unit 140 may be arranged outside the compression molding device 1, and measurement data such as the number of electronic components Wb measured for each workpiece W may be transmitted to the control and calculation unit 150 of the device (not shown).

Next, when the calculation process results in a shortage of the first amount relative to the total amount, an additional resin preparation process is performed to additionally prepare a second sealing resin Rb, which is a block-shaped solid or semi-solid resin and has a second amount equivalent to the shortage, as the sealing resin R. Specifically, the control calculation unit 150 issues a command to additionally supply the second sealing resin Rb having the second amount equivalent to the shortage, and the resin supply unit 120 supplies the second sealing resin Rb, and the workpiece W can be transported by the transport device (in this embodiment, the first loader 132). Here, the shortage occurs due to the missing (not mounted or lost) electronic components Wb in the workpiece W. Therefore, it is preferable to form the second sealing resin Rb so that it has a second amount equivalent to the amount of resin that can satisfy the volume of one electronic component Wb. According to this, it is possible to supply the appropriate amount of resin to be added without excess or deficiency by simply supplying the same number of second sealing resins Rb as the number of missing electronic components Wb. However, the present invention is not limited to this configuration. An example of the configuration (shape) of the second sealing resin Rb will be described later.

After the workpiece holding step, a resin placing step is performed in which the prepared sealing resin R (i.e., the first sealing resin Ra prepared in the resin preparation step and the second sealing resin Rb prepared in the additional resin preparation step) is placed in a predetermined position. In this embodiment, the second sealing resin Rb supplied from the resin supply unit 120 is held by the first loader 132 and carried into the sealing die 202, and placed on the workpiece W held by the workpiece holding unit 205 (specifically, on the electronic component mounting surface of the substrate Wa) (see FIG. 5). Next, the first sealing resin Ra supplied from the resin supply unit 120 is held by the first loader 132 and carried into the sealing die 202, and placed on the second sealing resin Rb (see FIG. 6). According to this, even if the total amount of resin required increases due to missing electronic components Wb of the workpiece W, the total amount of resin required can be easily and quickly secured, so that molding defects caused by a shortage of resin can be prevented.

Alternatively, as another example of the resin placing step, the sealing resin R (first sealing resin Ra, second sealing resin Rb) may be placed on the workpiece W before the above-mentioned workpiece holding step. In that case, the workpiece holding step is a step of holding the workpiece W in a state where the sealing resin R is placed (i.e., the second sealing resin Rb is placed on the electronic component mounting surface of the substrate Wa, and the first sealing resin Ra is placed on the second sealing resin Rb) in the workpiece holding section 205. That is, the first loader 132 holds the workpiece W in a state where the sealing resin R is placed, carries it into the sealing die 202, and holds it in the workpiece holding section 205. There is an advantage in that the workpiece W and the sealing resin R (first sealing resin Ra, second sealing resin Rb) are carried into the sealing die 202 at one time, rather than separately. In addition, since they are placed in the sealing die 202 at the same time, there is also an advantage in that the thermal history of the first sealing resin Ra and the second sealing resin Rb is the same.

After the resin placement process, a resin sealing process is performed in which the workpiece W is sealed with sealing resin R (first sealing resin Ra, second sealing resin Rb) and processed into a molded product Wp. Specifically, the sealing mold 202 is closed, and the cavity piece 226 is lowered relatively within the cavity 208 to perform a mold closing process in which the sealing resin R is heated and pressurized against the workpiece W. This causes the sealing resin R to thermally harden, completing the resin sealing (compression molding) (see FIG. 8).

As mentioned above, for example, in a conventional compression molding apparatus in which a cavity is provided in the upper die for a workpiece W on which a strip-type wire-connected electronic component (semiconductor chip) Wb is mounted, there is a problem that resin sealing is difficult when the wire portion of the workpiece held in the lower die comes into contact with the sealing resin previously supplied to the cavity or the sealing resin supplied onto the workpiece during the mold closing process and becomes deformed. For this reason, compression molding apparatuses in which a cavity is provided in the lower die have generally been used for such workpieces W. However, there are also problems (mentioned above) due to the configuration in which a cavity is provided in the lower die.

In this embodiment, the above problem can be solved by adopting a configuration in which the sealing resin R (first sealing resin Ra, second sealing resin Rb) formed as a solid or semi-solid resin is placed in the above-mentioned state. In particular, it is preferable that the second sealing resin Rb is placed on the electronic component mounting surface of the substrate Wa, and the first sealing resin Ra is placed on the second sealing resin Rb so that the first sealing resin Ra does not come into contact with the electronic components Wb (electronic components Wb having wires include the wires).

Here, as a specific example of the configuration (shape) of the sealing resin R (first sealing resin Ra, second sealing resin Rb), the first sealing resin Ra is formed in a plate shape that becomes the "main body" as shown in FIG. 10. Alternatively, it may be a shape other than a plate shape, for example, a block shape having concaves and convexities (not shown). However, it is not limited to these shapes. The first sealing resin Ra is sized to fit inside the cavity 208 in a plan view, and considering the resin flow, it is preferable that the size is slightly smaller than the shape of the cavity 208 (particularly the cavity piece 226). In FIG. 10, the four corners are rounded, but they may be angular.

As shown in FIG. 11, the second sealing resin Rb is formed in a block shape with multiple "legs" that are intermittently (or continuously) erected on one surface of the first sealing resin Ra (the surface facing the electronic component Wb of the work W). For example, it is formed in a cylindrical shape as shown in FIG. 11A, a rectangular column shape as shown in FIG. 11B, a rectangular column shape with one side long as shown in FIG. 11C, etc. (combinations of these are also possible). However, it is not limited to these shapes. In addition, in order to prevent the main body part (first sealing resin) Ra from contacting the electronic component Wb, the leg part (second sealing resin) Rb needs a height H, but this does not exclude contact to the extent that the wire is not plastically deformed. In addition, the second sealing resin Rb is arranged at a position where it does not contact the electronic component Wb in a plan view of the first sealing resin Ra, and where the first sealing resin Ra does not tilt when placed on the work W. Furthermore, it is preferable that the second sealing resin Rb is arranged between the electronic components Wb or at the outer periphery of the electronic components Wb so as not to damage the wiring (particularly the wires) of the work W even a little during molding. The second sealing resin Rb is also prepared in a number of types, each having a length, width, height, and weight (1 g, 3 g, 5 g, etc.), and the number of the types is calculated according to the weight of the second sealing resin Rb corresponding to the shortage amount, and the position to arrange it on the work W is determined and placed. As much as possible, it is preferable that the first sealing resin Ra and the second sealing resin Rb are resins of the same resin properties. In addition, the second sealing resin Rb is provided to prevent the first sealing resin Ra from contacting the electronic components, and may be configured to gain height and provide a predetermined resin amount by using a liquid resin with high viscosity. When the second sealing resin Rb is a liquid resin, the resin properties may be slightly different from the solid/semi-solid resin of the first sealing resin Ra, but there is an advantage that the resin amount and arrangement can be freely combined by moving the supply nozzle in the X-Y direction.

As described above, it is preferable that the second sealing resin Rb is placed on the electronic component mounting surface of the substrate Wa, and the first sealing resin Ra is placed on the second sealing resin Rb so that the first sealing resin Ra does not come into contact with the electronic component Wb. To achieve this, it is important that the second sealing resin Rb, which becomes the leg, can be erected. Specifically, the resin amount of the first sealing resin Ra (i.e., the "first amount") is set to be smaller than the total amount (i.e., the "maximum amount") required to seal the workpiece W when there is no missing electronic component Wb mounted on the substrate Wa, and the resin amount (second amount) of the second sealing resin Rb is set so that the difference between the maximum amount and the first amount is at least the amount that can erect the number of legs (second sealing resin) Rb that can separate the main body portion (first sealing resin) Ra, thereby realizing the above state. In addition, if a further shortage occurs due to missing electronic components Wb, it can be dealt with by simply increasing the second sealing resin Rb. Therefore, the first sealing resin Ra may be manufactured and supplied in advance by the resin manufacturer in multiple types (width, length, thickness, resin properties, etc.) in the same way as mini tablets used in existing transfer molding.

According to the above configuration, during the mold closing process, the sealing resin R is softened and melted by heating, as shown in the transition from FIG. 7A to FIG. 7B (note that FIG. 7A and FIG. 7B are shown as enlarged views of part VII in FIG. 6). At this time, the resin (specifically, the first sealing resin Ra) comes into contact with all the wires uniformly and substantially simultaneously (see FIG. 7B). As a result, the effect of suppressing wire flow is obtained.

The inventors of the present application actually conducted experiments using the compression molding device 1 according to this embodiment, and confirmed that wire flow was suppressed and molding quality was improved compared to a conventional compression molding device in which a workpiece is held in the upper die, a cavity is provided in the lower die, and sealing resin (specifically, granular resin) is supplied to the cavity.

Furthermore, by using a solid or semi-solid resin as the sealing resin R, it is possible to solve the problems of uneven winding, residual gas, and dust generation during molding that were previously caused by granular resin, as well as the difficulty of handling. In addition, even when forming a thick molded product with a thickness exceeding 1 mm, it is possible to prevent the film F from getting caught in the molded product Wp.

The steps following the mold closing step are the same as those in conventional compression molding methods. In summary, the mold opening step is performed to open the sealing mold 202 and separate the molded product Wp from the used film F so that the molded product Wp can be removed (see FIG. 9). Next, the molded product removal step is performed to remove the molded product Wp from the sealing mold 202 by the second loader 134 and transport it to the storage unit 100C. After or in parallel with the molded product removal step, the film supply mechanism 211 is operated to send out the used film F from the sealing mold 202 and feed new film F into the sealing mold 202, performing a film setting step.

The above are the main steps of the compression molding method performed using the compression molding device 1. However, the above order of steps is only an example, and the order of steps can be changed or steps can be performed in parallel as long as there are no problems.

Second Embodiment
Next, a second embodiment of the present invention will be described. The compression molding apparatus 1 and the compression molding method according to this embodiment are basically the same as those of the first embodiment described above, but have differences in the configuration of the press unit 100B (particularly, the configuration of the press apparatus and the sealing mold) and the process performed mainly by the press unit 100B. Hereinafter, this embodiment will be described focusing on the differences.

The press unit 100B according to this embodiment includes a sealing die 302 having a pair of dies (for example, a pair of dies made of alloy tool steel, die plates, die pillars, and other components assembled thereto) that are opened and closed. The press unit 100B also includes a press device 350 that opens and closes the sealing die 302 to resin seal the workpiece W. As an example, the press unit 100B is configured to include one press device 350 (shown in FIG. 1 as being the same as the press device 250), but may include multiple press devices (not shown). A side view (schematic diagram) of the press device 350 is shown in FIG. 12, and a front cross-sectional view (schematic diagram) of the sealing die 302 is shown in FIG. 13.

Here, as shown in FIG. 12, the press device 350 is configured to include a pair of platens 354, 356, a plurality of tie bars 352 on which the pair of platens 354, 356 are supported, and a drive device for moving (raising and lowering) the platen 356. Specifically, the drive device is configured to include a drive source (e.g., an electric motor) 360 and a drive transmission mechanism (e.g., a ball screw or a toggle link mechanism) 362 (however, this is not limited to this). In this embodiment, the upper platen 354 in the vertical direction is set as a fixed platen (a platen fixed to the tie bars 352), and the lower platen 356 is set as a movable platen (a platen slidably held by the tie bars 352 and raised and lowered). However, this is not limited to this, and the platens may be set upside down, i.e., the upper side may be set as a movable platen and the lower side as a fixed platen, or both the upper and lower sides may be set as movable platens (neither is shown).

On the other hand, as shown in FIG. 13, the sealing mold 302 includes an upper mold 304 on the upper side in the vertical direction and a lower mold 306 on the lower side as a pair of molds arranged between the pair of platens 354, 356 in the press device 350. That is, the upper mold 304 is assembled to the upper platen (in this embodiment, the fixed platen 354), and the lower mold 306 is assembled to the lower platen (in this embodiment, the movable platen 356). The upper mold 304 and the lower mold 306 move toward and away from each other to close and open the mold (the vertical direction (up and down direction) is the mold opening and closing direction).

In addition, in this embodiment, as an example, a film supply mechanism 311 is provided that transports (supplies) a roll-shaped film F into the interior of the sealing die 302. Note that, depending on the configuration of the workpiece W, the film F may be in the form of a strip instead of a roll.

Next, the lower mold 306 of the sealing mold 302 will be described in detail. As shown in FIG. 13, the lower mold 306 includes a lower mold chase 310, a cavity piece 326 held by the lower mold chase, a clamper 328, and the like. The lower mold chase 310 is fixed to the upper surface of the support plate 314 via a support pillar 312. A cavity 308 is provided on the upper surface of the lower mold 306 (the surface facing the upper mold 304).

The clamper 328 is configured in a ring shape to surround the cavity piece 326, and is assembled to be movable up and down while being spaced (floating) from the upper surface of the support plate 314 via a push pin 322 and a clamper spring (a biasing member such as a coil spring) 324 (however, this assembly structure is not limited). The cavity piece 326 forms the inner part (bottom part) of the cavity 308, and the clamper 328 forms the side part of the cavity 308. The shape and number of cavities 308 provided in one lower mold 306 are appropriately set according to the shape and number of workpieces W (one or multiple).

In addition, suction paths (holes, grooves, etc.) that communicate with a suction device are provided (not shown) on the top surface of the clamper 328 and at the boundary between the clamper 328 and the cavity piece 326. This allows the film F supplied from the film supply mechanism 311 to be adsorbed and held on the mold surface 306a, including the inner surface of the cavity 308. In addition, the cavity 308 can be degassed when the mold is closed and resin sealing is performed.

In addition, in this embodiment, a lower mold heating mechanism (not shown) is provided that heats the lower mold 306 to a predetermined temperature. This lower mold heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control and calculation unit 150. As an example, the heater is built into the lower mold chase 310 and is configured to apply heat to the entire lower mold 306 and the sealing resin R contained in the cavity 308. The heater heats the lower mold 306 to a predetermined temperature (e.g., 100°C to 300°C).

Next, the upper mold 304 of the sealing mold 302 will be described in detail. As shown in FIG. 13, the upper mold 304 includes an upper mold chase 340 and an upper plate 342 held by the chase.

In this embodiment, a workpiece holding section 305 is provided to hold the workpiece W at a predetermined position on the lower surface of the upper plate 342. As an example, the workpiece holding section 305 has a workpiece guide pin (not shown) and a suction passage (hole, groove, etc.) that is arranged to penetrate the upper plate 342 and communicates with a suction device (not shown). Specifically, one end of the suction passage is connected to the die surface 304a of the upper die 304, and the other end is connected to a suction device arranged outside the upper die 304. This makes it possible to drive the suction device to suck the workpiece W through the suction passage and hold the workpiece W by suction on the die surface 304a (here, the lower surface of the upper plate 342). Instead of the above-mentioned suction holding mechanism, or together with the suction holding mechanism, a configuration may be provided with holding claws that clamp the outer periphery of the workpiece W (not shown). The shape and number of the workpiece holding sections 305 provided on one upper die 304 are appropriately set according to the shape and number of the workpieces W (one or multiple).

In this embodiment, an upper die heating mechanism (not shown) is provided that heats the upper die 304 to a predetermined temperature. This upper die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control and calculation unit 150. As an example, the heater is built into the upper die chase 340 and is configured to apply heat to the entire upper die 304 and the workpiece W held by the workpiece holding unit 305. The heater heats the upper die 304 to a predetermined temperature (e.g., 100°C to 300°C).

Next, the steps of the compression molding method according to this embodiment, which is carried out using the compression molding device 1 having the above configuration, will be described. Here, Figures 14 to 18 are explanatory diagrams of each step, and are illustrated as front cross-sectional views in the same direction as Figure 13.

First, a preparation process is performed in the same manner as in the first embodiment. Specifically, a heating process (upper die heating process) is performed in which the upper die 304 is adjusted to a predetermined temperature (e.g., 100°C to 300°C) and heated by the upper die heating mechanism (upper die heating process). In addition, a heating process (lower die heating process) is performed in which the lower die 306 is adjusted to a predetermined temperature (e.g., 100°C to 300°C) and heated by the lower die heating mechanism (lower die heating process). In addition, a film setting process is performed in which the film supply mechanism 311 is operated to set a new film F in the sealing die 302.

Before, after, or in parallel with the above preparation process, a resin preparation process is carried out to prepare a first sealing resin Ra that is a plate-shaped or block-shaped solid or semi-solid resin having a first quantity (amount of resin, i.e., grams). The specific process is the same as in the first embodiment.

Before, after, or in parallel with the above-mentioned resin preparation process and calculation process, a workpiece holding process is carried out in which the workpiece W is held by the workpiece holding portion 305 of the upper die 304 (see FIG. 14). Specifically, the workpiece W supplied from the supply magazine 102 is held by the first loader 132 and carried into the sealing die 302, where it is held by the workpiece holding portion 305.

At some point before the workpiece holding step, the measuring unit 140 or the like measures the number of electronic components Wb present or absent (the number of mounted or missing electronic components, and may also include measuring the height of electronic components Wb) mounted on one substrate Wa for each workpiece W. Next, the control and calculation unit 150 calculates the total amount of sealing resin R required to seal the measured workpiece W based on the measurement data, and performs a calculation step in which the total amount is compared with the first amount. As described above, the measuring unit 140 may be arranged outside the compression molding device 1, and the measurement data of the number of electronic components Wb present or absent measured for each workpiece W may be transmitted to the control and calculation unit 150 of the device (not shown).

Next, if the calculation step results in a shortage of the first amount relative to the total amount, an additional resin preparation step is performed to additionally prepare a second sealing resin Rb, which is a block-shaped solid or semi-solid resin and has a second amount equivalent to the shortage, as the sealing resin R. The specific steps are the same as those in the first embodiment.

After the workpiece holding process, a resin placing process is performed in which the prepared sealing resin R (i.e., the first sealing resin Ra prepared in the resin preparation process and the second sealing resin Rb prepared in the additional resin preparation process) is placed in a predetermined position. In this embodiment, the first sealing resin Ra supplied from the resin supply unit 120 is held by the first loader 132 and carried into the sealing mold 302, and placed on the bottom surface of the cavity 308 of the lower mold 306 (i.e., on the upper surface of the cavity piece 326) (see FIG. 15). Next, the second sealing resin Rb supplied from the resin supply unit 120 is held by the first loader 132 and carried into the sealing mold 302, and placed on the first sealing resin Ra (see FIG. 16). According to this, even if the total amount of resin required increases due to missing electronic components Wb of the workpiece W, the total amount of resin required can be easily and quickly secured, so that molding defects caused by a shortage of resin can be prevented.

Alternatively, as another example of the resin placement process, the second sealing resin Rb supplied from the resin supply unit 120 may be placed on the first sealing resin Ra supplied from the resin supply unit 120, and then the first loader 132 may hold them and carry them into the sealing die 302, and place them on the bottom surface of the cavity 308 of the lower die 306 (i.e., on the upper surface of the cavity piece 326). This has the advantage that the sealing resin R (first sealing resin Ra, second sealing resin Rb) is carried in one go, rather than being carried in separately. In addition, since they are placed in the sealing die 302 at the same time, there is also the advantage that the thermal history of the first sealing resin Ra and the second sealing resin Rb is the same.

After the resin placement process, a resin sealing process is carried out in which the workpiece W is sealed with sealing resin R (first sealing resin Ra, second sealing resin Rb) and processed into a molded product Wp. Specifically, the sealing mold 302 is closed, and the cavity piece 326 is raised relatively within the cavity 308 to carry out a mold closing process in which the sealing resin R is heated and pressurized against the workpiece W. This causes the sealing resin R to thermally harden, completing the resin sealing (compression molding) (see FIG. 17).

In a conventional compression molding apparatus in which a cavity is provided in the lower mold, when granular resin is used as the sealing resin, the particle size and height (lamination thickness) of the sealing resin (granular resin) contained in the cavity are not uniform. Therefore, for example, depending on the type and melting state of the granular resin, it may not be completely liquid (low viscosity state). When performing a mold closing process on a workpiece W on which a strip-type wire-connected electronic component (semiconductor chip) Wb is mounted, as shown in FIG. 19, depending on the position, the wire portion of the workpiece held in the upper mold may come into strong (large) contact with the sealing resin (granular resin) and may be deformed. Furthermore, as shown in FIG. 20, a large resin flow may occur in the cavity, causing the wire portion to be cut or deformed.

In this embodiment, the above problem is solved by adopting a configuration in which the sealing resin R (first sealing resin Ra, second sealing resin Rb) formed as a solid or semi-solid resin is placed in the above state. In particular, when the sealing mold 302 is closed, the upper mold 304 is gradually brought closer to the lower mold 306, and the first sealing resin Ra is placed on the bottom surface of the cavity 308 so that the body part (first sealing resin) Ra of the sealing resin R does not come into contact with the electronic component Wb of the work W (electronic component Wb having wires includes the wires) when the tip part (upper end part) of the leg part (second sealing resin) Rb of the sealing resin R contained in the cavity 308 abuts against the base material Wa of the work W held by the work holding part 305.

To achieve this, it is important to be able to erect the second sealing resin Rb, which will become the legs, as in the first embodiment described above. Specifically, the amount of resin of the first sealing resin Ra (i.e., the "first amount") is set to be less than the total amount (i.e., the "maximum amount") required to seal the workpiece W when there are no missing electronic components Wb mounted on the substrate Wa, and the amount of resin of the second sealing resin Rb (second amount) is set so that the difference between the maximum amount and the first amount is at least an amount that can erect a number of legs (second sealing resin) Rb that can separate the main body portion (first sealing resin) Ra. In addition, if a further shortage occurs due to missing electronic components Wb, it can be dealt with simply by increasing the amount of the second sealing resin Rb.

The specific configuration (shape) of the sealing resin R is the same as the specific example in the first embodiment described above (Figures 10, 11A to 11B). However, it is not limited to these configurations.

The steps following the mold closing step are the same as those in conventional compression molding methods. In summary, the mold opening step is performed to open the sealing mold 302 and separate the molded product Wp from the used film F so that the molded product Wp can be removed (see FIG. 18). Next, the molded product removal step is performed to remove the molded product Wp from the sealing mold 302 by the second loader 134 and transport it to the storage unit 100C. After or in parallel with the molded product removal step, the film supply mechanism 311 is operated to send out the used film F from the sealing mold 302 and to feed and set a new film F into the sealing mold 302.

The rest of the configuration of this embodiment is the same as that of the first embodiment described above, so repeated explanations will be omitted.

As described above, according to the present invention, it is possible to solve the problems of a configuration in which a cavity is provided in the upper mold and to solve the problems of a configuration in which a cavity is provided in the lower mold. In addition, it is possible to prevent molding defects caused by the flow of the sealing resin, uneven winding, and residual gas. In particular, even if the total amount of resin required increases due to missing electronic components of the work, the total amount of resin required can be easily and quickly secured, so that molding defects caused by a shortage of resin can be prevented. In addition, it is possible to facilitate handling of the sealing resin and prevent the generation of dust during molding. In addition, it is possible to form not only thin molded products (thickness dimension less than 1 mm) but also thick molded products (thickness dimension 1 mm or more). It is considered that the upper limit of the thickness dimension can be formed up to about 10 mm, although it depends on various setting conditions.

The present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the scope of the present invention.

REFERENCE SIGNS LIST 1 Compression molding device 202, 302 Sealing mold 204, 304 Upper mold 205, 305 Workpiece holder 206, 306 Lower mold 208, 308 Cavity 250, 350 Press device F Release film R Sealing resin Ra First sealing resin Rb Second sealing resin W Workpiece Wa Substrate Wb Electronic component Wp Molded product

Claims (8)

A compression molding apparatus that uses a sealing die having an upper die and a lower die to seal a workpiece having a configuration in which electronic components are mounted on a substrate with a sealing resin and process the workpiece into a molded product,
As the sealing resin, a first sealing resin is used which is a plate-shaped or block-shaped solid or semi-solid resin and has a first amount,
a control and calculation unit that calculates a total amount of resin required based on data obtained by measuring the number of electronic components mounted on one of the substrates for each of the workpieces and compares the total amount with the first amount;
The compression molding apparatus is characterized in that, when the first amount is insufficient relative to the total amount, the control calculation unit controls the supply of a second sealing resin, which is a block-shaped solid or semi-solid resin or a highly viscous liquid resin and has a second amount equivalent to the shortage, so that the second sealing resin is additionally used as the sealing resin. The compression molding apparatus according to claim 1, characterized in that, when the upper mold has a cavity, the second sealing resin is placed on the electronic component mounting surface of the substrate, and compression molding is performed with the first sealing resin placed on the second sealing resin. The compression molding device according to claim 2, characterized in that the second sealing resin is placed on the electronic component mounting surface of the base material, and when the first sealing resin is placed on the second sealing resin, the first sealing resin is configured not to contact the electronic components. The compression molding apparatus according to claim 1, characterized in that, when the lower mold has a cavity, the first sealing resin is placed on the bottom surface of the cavity and the second sealing resin is placed on the first sealing resin, and compression molding is performed in that state. A compression molding method for processing a workpiece having a configuration in which an electronic component is mounted on a substrate into a molded product by encapsulating the workpiece with an encapsulating resin using an encapsulating die having an upper die and a lower die,
a resin preparation step of preparing a first sealing resin as the sealing resin, the first sealing resin being a plate-shaped or block-shaped solid or semi-solid resin having a first amount;
a calculation step of calculating a total amount of resin required based on data obtained by measuring the number of electronic components mounted on one of the substrates for each of the workpieces, and comparing the total amount with the first amount;
an additional resin preparation step of additionally preparing, as the sealing resin, a second sealing resin which is a block-shaped solid or semi-solid resin or a highly viscous liquid resin and has a second amount corresponding to the shortage amount when the first amount is insufficient with respect to the total amount;
A compression molding method comprising: The compression molding method according to claim 5, further comprising a resin sealing process in which, when the upper mold has a cavity, the second sealing resin is placed on the electronic component mounting surface of the base material, and the first sealing resin is placed on the second sealing resin and compression molded in that state. In the resin sealing step, the first sealing resin is not in contact with the electronic component.
7. The compression molding method according to claim 6, further comprising the steps of placing the second sealing resin on the electronic component mounting surface of the base material, and placing the first sealing resin on the second sealing resin. The compression molding method according to claim 5, further comprising a resin sealing process in which, when the lower mold has a cavity, the first sealing resin is placed on a bottom surface of the cavity, and the second sealing resin is placed on the first sealing resin, and compression molding is performed in that state.

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