TW202314872A - Resin sealing device and resin sealing method - Google Patents

Abstract

The present invention is characterized by providing a resin sealing device and a resin sealing method capable of improving molding quality by preventing the occurrence of molding defects caused by resin leakage and the like in a configuration having a cavity in a bottom mold. As the means for solving the problem, a resin sealing device (1) according to the present invention uses a sealing mold (202) comprising a top mold (204) and a bottom mold (206) having a cavity (208) and uses a resin (R) to seal a workpiece (W) where an electronic component (Wb) is mounted on a base material (Wa), and then process the workpiece into a molded product (Wp), the resin sealing device comprising: a resin guard (400) that holds a film (F) on which the resin (R) has been placed; a resin guard loader (212) that conveys the resin guard (400); and a plunger (214) that discharges the air inside the resin (R) to reduce bulk by pressing the resin (R) in a state in which the film (F) on which the resin (R) has been placed is stored and held in the cavity (208).

Description

Resin sealing device and resin sealing method

The invention relates to a resin sealing device and a resin sealing method.

As an example of a resin sealing device and a resin sealing method in which a workpiece (work) on which electronic components are mounted on a substrate is sealed with a sealing resin (hereinafter, sometimes simply referred to as "resin") to form a molded product, there are known compression molding method.

The compression molding method is a technology for resin sealing by supplying a predetermined amount of resin to the sealing area (cavity) of the sealing mold composed of an upper mold and a lower mold, and simultaneously The workpiece is configured and clamped by the upper mold and the lower mold. As an example, when using a sealed mold in which a cavity is provided in an upper mold, there is known a technique in which resin is collectively supplied to a center position on a workpiece to perform molding. On the other hand, when using a sealed mold with a cavity in the lower mold, a technique of supplying a film and resin covering the surface of the mold including the cavity to perform molding is known (refer to Patent Document 1: Japanese Patent Japanese Patent Laid-Open No. 2019-145550). [Prior art literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2019-145550

[Problem to be Solved by the Invention]

Here, in the compression molding method in which the lower mold has a cavity, in order to ensure good molding quality, it is important not to cause resin leakage (dripping) from the cavity. However, there is a problem that, especially, granular resin is accumulated in a state where there are gaps between the particles, and the resulting volume expansion causes foaming (defoaming) of the air contained in the gaps due to heating or decompression. , so resin leakage and the like are likely to occur. [Means to solve the problem]

The present invention is made in view of the above circumstances, and an object of the present invention is to provide a resin sealing device and a resin sealing method which can prevent occurrence of molding defects due to resin leakage and the like in a structure having a cavity in a lower mold and improve molding quality.

This invention solves the said subject by the solution means described as one embodiment below.

The resin sealing device of the present invention uses a sealing mold including an upper mold and a lower mold having a cavity, and processes a molded product by sealing a workpiece with an electronic component on a base material with a resin. The necessary conditions for the resin sealing device are that It includes: a resin cover for holding the film on which the resin is placed; a resin cover loader for transporting the resin cover; and a plunger accommodated in the film on which the resin is placed. The volume of the resin is reduced by squeezing the resin while being held in the cavity to discharge air in the resin.

Thereby, by conveying the film and the resin using the resin cover, when the resin is carried into the lower mold and accommodated and held in the cavity, it is possible to prevent resin leakage from occurring. Furthermore, by using the plunger to squeeze the resin accommodated and held in the cavity of the lower mold, volume expansion of the resin can be eliminated or reduced. Therefore, it is possible to prevent leakage of the resin due to foaming of the air contained in the gaps of the resin during molding.

In addition, it is preferable that the plunger is disposed on the resin shield mounter and has a pressing plate configured to hold the resin shield in the resin shield mounter. In the state of the lower surface, the resin can be pressed through the through hole serving as a holding space for the resin in the resin cover. Thereby, the resin introduced into the cavity of the lower die can be squeezed by the plunger while the resin shroud is held by the resin shroud holder and is in contact with the lower die.

In addition, it is preferable to further include a vibrating mechanism for vibrating the resin cover in a state holding the film on which the resin is placed. In this way, the resin cover is vibrated in a state where granular, pulverized, or powdery resin is placed on the upper surface of the film held by the resin cover, thereby enabling the load to The thickness of the resin placed on the upper surface of the film is uniformized.

In addition, the resin sealing method of the present invention uses a sealing mold including an upper mold and a lower mold having a cavity, and processes a molded product by sealing a workpiece with an electronic component on a base material with a resin. The resin sealing method requires The condition includes: a step of placing the resin on the lower surface of the resin cover, holding the film on the lower surface of the resin cover, and placing the resin on the film from a through hole provided in the resin cover; transporting the resin cover in the state of holding the film on which the resin is placed, and storing and holding the film in the state on which the resin is placed in the cavity; and resin extrusion In the pressing step, in the state where the film on which the resin is placed is accommodated and held in the cavity, the resin is squeezed by a plunger to discharge the air in the resin, so that Reduced volume. [Effect of the invention]

According to the present invention, in the resin sealing device and the resin sealing method having a cavity in the lower mold, it is possible to solve the problem that, in particular, granular resin is accumulated in a state where there are gaps between the grains, and the resulting volume Expansion causes air foaming (defoaming) in the gaps of the resin during molding, and resin leakage is likely to occur. Therefore, it is possible to prevent the occurrence of molding defects due to leakage of the resin, and to improve the molding quality.

(the whole frame) Hereinafter, a first embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a plan view (schematic view) showing an example of a resin sealing device 1 according to the present embodiment. 2 is a side sectional view (schematic view) showing an example of a sealing mold 202 of the resin sealing device 1 , and FIG. 3 is a side sectional view (schematic view) showing an example of a resin boot loader 212 of the resin sealing device 1 . . In addition, for convenience of description, arrows may be used to illustrate the front and rear, left and right, and up and down directions of the resin sealing device 1 in the drawings. In addition, in all the drawings for describing the respective embodiments, members having the same functions may be assigned the same reference numerals, and repeated description thereof will be omitted.

The resin sealing device 1 of the present embodiment is a device for resin-sealing a workpiece (molded article) W using a sealing die 202 including an upper die 204 and a lower die 206 . Hereinafter, as the resin sealing device 1 , a compression molding device in which a workpiece W is held by an upper mold 204 and covered with a release film (hereinafter sometimes simply referred to as "film") F will be described as an example. The cavity 208 (including a part of the mold surface 206 a ) of the lower mold 206 is supplied with resin R, the upper mold 204 and the lower mold 206 are clamped, and the workpiece W is resin-sealed with the resin R.

First, the workpiece W to be molded has a structure in which a plurality of electronic components Wb are mounted on the base material Wa in a matrix. More specifically, as examples of the base material Wa, plate-shaped members (so-called elongated resin substrates, ceramic substrates, metal substrates, carrier plates, lead frames, wafers, etc.) formed in a long shape can be mentioned. workpiece). In addition, examples of the electronic component Wb include semiconductor wafers, micro electromechanical system (MEMS) wafers, passive elements, heat sinks, conductive members, spacers, and the like. In addition, as another example of the base material Wa, the structure which uses the said member (not shown) formed in circular shape, square shape, etc. is also possible.

As an example of a method of mounting the electronic component Wb on the base material Wa, there is a mounting method using wire bonding packaging, flip chip packaging, or the like. Alternatively, in the case of a structure in which the substrate (glass or metal pallet) Wa is peeled off from the molded product Wp after resin sealing, there is also a method of using a heat-peelable adhesive tape or by ultraviolet rays. The electronic component Wb is attached by irradiating and hardening the ultraviolet curable resin.

On the other hand, as examples of resin R, granular (including cylindrical, etc.), pulverized, or powdered (sometimes collectively referred to as "granular" in this application) thermosetting resins (such as those containing fillers) can be used. epoxy resin, etc.). In addition, the resin R is not limited to the said state, It may be other states (shape) such as liquid, plate-like, and sheet-like, and may be resin other than epoxy-type thermosetting resin.

In addition, as an example of the film F, a film material excellent in heat resistance, ease of peeling, flexibility, and stretchability, such as polytetrafluoroethylene (polytetrafluoroethylene, PTFE), ethylene-tetrafluoroethylene copolymer (ethylene -tetrafluoroethylene, ETFE) (polytetrafluoroethylene polymer), polyethylene terephthalate (polyethylene terephthalate, PET), fluorinated ethylene propylene (fluorinated ethylene propylene, FEP), fluorine impregnated glass cloth, polypropylene, polypropylene Vinylidene chloride, etc. In this embodiment, as the film F, a long film corresponding to the long work W can be used. However, it is not limited to the above structure.

Next, an outline of the resin sealing device 1 of this embodiment will be described. As shown in FIG. 1 , the resin sealing device 1 includes the following parts as a main structure: a workpiece processing unit 100A, which mainly supplies the workpiece W and stores the resin-sealed molded product Wp; and a pressing unit 100B, which mainly performs the processing of the workpiece W The molded article Wp is processed into a resin-sealed product; and the dispensing unit 100C mainly performs supply and storage (disposal) of the film F and supply of the resin R. Furthermore, in this embodiment, the following structure is cited as an example for description, that is, one lower mold 206 has two sets of cavities 208, and one upper mold 204 has two workpiece holding parts 205, and the two workpieces W (for example, long workpieces) are resin-sealed together to obtain two molded products Wp at the same time. However, it is not limited to the above structure.

In this embodiment, the workpiece processing unit 100A, the pressing unit 100B and the distributing unit 100C are arranged side by side in order from left to right along the left and right directions. In addition, an arbitrary number of guide rails (not shown) are linearly provided across each unit, and the first loader 210 for transporting the workpiece W and the molded product Wp, and the second loader 212 for transporting the film F and the resin R Installed so that it can move between predetermined units along any rail.

Furthermore, the resin sealing device 1 can change the overall structure by changing the structure of the unit. For example, the structure shown in FIG. 1 is an example in which two press units 100B are provided, but only one press unit 100B or a structure in which three or more press units 100B are provided may also be used. In addition, it is also possible to have a configuration in which other units are provided (none of them are shown).

(workpiece handling unit) Next, the workpiece processing unit 100A included in the resin sealing apparatus 1 will be described in detail.

The workpiece processing unit 100A includes a supply cassette 102 that stores a plurality of workpieces W, and a storage cassette (not shown) that stores a plurality of molded products Wp. Here, for the supply magazine 102 and the storage magazine, known stack magazines, slit magazines, and the like can be used.

As an example, the workpiece processing unit 100A includes a supply rail 104 disposed behind the supply cassette 102 and on which the workpiece W taken out from the supply cassette 102 is placed. In the present embodiment, the workpiece W is supplied from the supply cassette 102 to the supply rail 104 via the relay rail 106 using a known pusher or the like (not shown). Furthermore, it includes a supply picker 120 that holds the workpiece W placed on the supply rail 104 and conveys it to a predetermined position.

In addition, the workpiece processing unit 100A includes a storage rail (not shown), which is arranged behind a storage cassette (not shown), and on which the molded product Wp taken out from the sealing mold 202 is placed. In this embodiment, the molded product Wp is stored in a storage cassette (both are not shown) from a storage rail via a relay rail using a known pusher or the like. Furthermore, a storage picker 122 and a storage elevator 124 are included which receive the resin-sealed molded product Wp and convey it to a storage rail (not shown).

Next, the workpiece processing unit 100A includes a first loader 210 that conveys the workpiece W and the molded product Wp. Specifically, the first loader 210 includes: a first holding portion 210A, which holds the workpiece W held in the state of being supplied to the picker 120 by a holding mechanism provided on the upper surface thereof, and holds the predetermined holding position of the upper die 204 Location transfer. In addition, the first loader 210 includes a second holding portion 210B, which holds the molded product Wp held in the upper mold 204 after resin sealing by a holding mechanism provided on the upper surface, and sends the molded product Wp to the outside of the sealed mold 202 . It is transported to a predetermined position (for example, held at a position where the picker 122 is housed, etc.). Here, the holding mechanism of the workpiece W in the first holding portion 210A has a structure in which two rows are arranged side by side in the left-right direction so as to be able to hold two elongated workpieces W. Similarly, the holding mechanism of the molded product Wp in the second holding unit 210B has a structure in which two rows are arranged side by side in the left-right direction so as to be able to hold two elongated molded products Wp. However, it is not limited to these structures. As the holding mechanism, a known holding mechanism (for example, a structure having holding claws for clamping, a structure having a suction hole communicating with a suction device for suction, etc.) can be used (not shown).

In addition, the workpiece processing unit 100A includes a workpiece heater 116 that heats the workpiece W conveyed by the first loader 210 from the lower surface side (base material Wa side). As an example, a known heating mechanism (for example, a heating wire heater, an infrared heater, etc.) can be used for the workpiece heater 116 . Thereby, preheating can be performed in advance before loading the workpiece W into the sealing mold 202 for heating. In addition, the structure which does not include the workpiece|work heater 116 is also possible.

(press unit) Next, the press unit 100B included in the resin sealing device 1 will be described in detail.

The pressing unit 100B includes: a sealed mold 202 , a pair of molds with opening and closing (for example, a plurality of mold blocks, mold plates, mold columns, etc. or other members assembled from alloy tool steel). In this embodiment, among a pair of molds, one mold on the upper side in the vertical direction is used as the upper mold 204 , and the other mold on the lower side is used as the lower mold 206 . The sealing mold 202 is closed and opened by the upper mold 204 and the lower mold 206 approaching and moving away from each other. That is, the vertical direction (vertical direction) becomes the mold opening and closing direction.

Furthermore, the sealed mold 202 is opened and closed by a known mold opening and closing mechanism (not shown). For example, a mold opening and closing mechanism is composed of a pair of platens, a plurality of connecting mechanisms (tie bars or columns) for erecting a pair of platens, and a drive for moving (elevating) the plates A source (such as an electric motor) and a drive transmission mechanism (such as a ball screw or a toggle link mechanism), etc. (not shown).

Here, the sealing mold 202 is disposed between a pair of die plates of the mold opening and closing mechanism. In this embodiment, the upper die 204 serving as a fixed die is assembled to a fixed die plate (a die plate fixed to a connecting mechanism), and the lower die 206 serving as a movable die is assembled to a movable die plate (a die plate raised and lowered along a connecting mechanism). However, the structure is not limited to the above, and the upper mold 204 may be assembled to the movable formwork and the lower mold 206 may be assembled to the fixed formwork, or both the upper mold 204 and the lower mold 206 may be assembled to the movable formwork.

Next, the lower mold 206 that seals the mold 202 will be described in detail. As shown in FIG. 2 , the lower mold 206 includes a lower plate 222 , a mold cavity insert 226 , a holder 228 , etc., and these parts are assembled to form a structure. In this embodiment, a cavity 208 is provided on the upper surface (surface on the side of the upper mold 204 ) of the lower mold 206 .

More specifically, the cavity insert 226 is fixedly assembled relative to the upper surface of the lower plate 222 . On the other hand, the clamper 228 is configured in a ring shape to surround the cavity insert 226 , and is vertically movable away from (floats) the lower surface of the lower plate 222 via the biasing member 232 . The cavity insert 226 forms the inner part (bottom) of the cavity 208 and the holder 228 forms the sides of the cavity 208 . Here, in this embodiment, as shown in FIG. 1 , it has a structure in which two sets of cavities 208 (208A, 208B in the figure) are arranged side by side in the left-right direction on one lower mold 206, and the two The workpiece W is resin-sealed together. However, it is not limited to the above structure.

Here, a suction groove (not shown) is provided on the mold surface 204 a of the upper mold 204 facing the holder 228 , and is communicated with a suction device (not shown). In addition, by providing a sealing structure surrounding these parts, it is possible to degas the inside of the cavity 208 in a closed mold state by driving a suction device to depressurize.

In addition, in this embodiment, there is provided an adsorption mechanism for sucking and holding the film F (in this embodiment, the state in which the resin is mounted) supplied from a dispensing unit 100C described later on the lower mold 206 . As an example, the suction mechanism has a suction passage 230a, a suction passage 230b, which are arranged through the clamper 228 and communicated with a suction device (not shown), and are arranged through the lower plate 222 and the cavity insert 226. A suction path 230c is provided and communicated with a suction device (not shown). Specifically, one end of the suction passage 230 a , the suction passage 230 b , and the suction passage 230 c passes through the mold surface 206 a of the lower mold 206 , and the other end is connected to a suction device disposed outside the lower mold 206 . Thereby, the film F can be sucked from the suction path 230a, the suction path 230b, and the suction path 230c by driving the suction device, and the film F can be adsorbed and held on the mold surface 206a including the inner surface of the cavity 208 .

In this way, by providing the film F covering the inner surface of the cavity 208 and the mold surface 206a (part) of the lower mold 206, the lower surface of the molded product Wp, which is part of the resin R, can be easily peeled off, so that the molded product can be molded. The product Wp is easily taken out from the sealing mold 202 (lower mold 206).

Furthermore, a gap of a predetermined size provided between the inner peripheral surface of the holder 228 and the outer peripheral surface of the cavity insert 226 constitutes a part of the suction path 230a. Therefore, a sealing member 234 (such as an O-ring) is disposed at a predetermined position in the gap, and performs a sealing function when the membrane F is sucked.

In addition, in this embodiment, a lower mold heating mechanism for heating the lower mold 206 to a predetermined temperature is provided. The lower mold heating mechanism includes a heater (such as an electric heating wire heater), a temperature sensor, a power supply, etc., and the heating is controlled by a control unit (none of which are shown in the figure). As an example, the heater is built into the lower plate 222 or a mold base (not shown) that accommodates these parts, and mainly applies heat to the entire lower mold 206 and the resin R (described later). Thereby, the lower mold 206 is adjusted and heated to a predetermined temperature (for example, 100° C. to 200° C.).

Next, the upper mold 204 that seals the mold 202 will be described in detail. As shown in FIG. 2 , the upper die 204 includes an upper plate 224 , a holding plate 236 , and the like, and is configured by assembling these parts. Here, the holding plate 236 is fixedly assembled with respect to the lower surface (the surface on the lower die 206 side) of the upper plate 224 .

In addition, in this embodiment, the workpiece holding part 205 which holds the workpiece|work W at the predetermined position of the lower surface of the holding plate 236 is provided. As an example, the workpiece holding unit 205 has a suction passage 240 a disposed through the holding plate 236 and the upper plate 224 and communicated with a suction device (not shown). Specifically, one end of the suction path 240 a passes through the mold surface 204 a of the upper mold 204 , and the other end is connected to a suction device disposed outside the upper mold 204 . Thereby, the suction device can be driven to suck the workpiece W from the suction path 240 a, and the workpiece W can be sucked and held on the mold surface 204 a (here, the lower surface of the holding plate 236 ). Furthermore, a structure may be provided in which the structure including the suction path 240 a is provided together with holding claws (not shown) that clamp the outer periphery of the workpiece W. FIG.

In addition, in this embodiment, an upper mold heating mechanism for heating the upper mold 204 to a predetermined temperature is provided. The upper mold heating mechanism includes a heater (such as an electric heating wire heater), a temperature sensor, a power supply, etc., and the heating is controlled by a control unit (none of which are shown in the figure). As an example, the heater is built into the upper plate 224 or a mold base (not shown) that accommodates these parts, and mainly applies heat to the entire upper mold 204 and the workpiece W. Thereby, the upper mold 204 is adjusted and heated to a predetermined temperature (for example, 100° C. to 200° C.).

(allocation unit) Next, the dispensing unit 100C included in the resin sealing device 1 will be described in detail.

The dispensing unit 100C includes a film supply mechanism 306 that supplies the film F, and a dispenser 312 that supplies the resin R. FIG. Here, in this embodiment, when the film F and the resin R are conveyed to the sealing mold 202 , a resin cover 400 (described later) can be used as a jig for holding and conveying the film F and the resin R.

As an example, the film supply mechanism 306 includes the following parts: two film rolls 306A, 306B, with a winding out and winding mechanism; The long film F is cut. Thereby, the elongated single film F of predetermined length can be supplied.

In addition, the dispensing unit 100C includes: a resin mask picker 304 in which the resin mask 400 (and film F, resin R) is conveyed; and a second loader 212 (in this application, referred to as " Resin cap loader") transports the resin cap 400 (and the film F and resin R) delivered from the resin cap picker 304 into the sealing mold 202 , and simultaneously transports the used film Fd from the sealing mold 202 .

As an example, the resin cover loader 212 includes a third holding unit 212A, holds the resin cover 400 and conveys it into the sealing mold 202, and makes the film F held by the resin cover 400 (the state where the resin R is placed) It is held in the cavity 208 of the lower mold 206 (including a part of the mold surface 206 a ). Furthermore, the resin mask loader 212 of the present embodiment includes a fourth holding unit 212B, holds the used film Fd, and transports and discards the used film Fd from the inside of the sealing mold 202 to a disposer 316 . Furthermore, as for the holding mechanism of the resin mask 400 in the resin mask picker 304 and the resin mask loader 212, a known holding mechanism (for example, a structure with holding claws for clamping, a suction device and a suction device) can be used. connected suction holes for adsorption, etc.) (not shown). In addition, as the holding mechanism of the used film Fd in the resin mask loader 212, a known holding mechanism (for example, a structure having a suction hole communicating with a suction device for suction, etc.) (not shown) can be used. .

Furthermore, a plunger 214 for pressing the resin R in a state where the film F on which the resin R is placed is accommodated and held in the cavity 208 is provided in the resin mask loader 212 to make the film F The air in the resin R (here, the entire loaded predetermined amount of resin R) is exhausted to reduce the volume. Specifically, the plunger 214 has a pressing plate 216 configured to pass through the resin boot 400 to become Through-holes (resin injection holes to be described later) 400 a and 400 b in the holding space of the resin R are used to squeeze the resin R. That is, the pressing plate 216 is configured to be movable in the vertical direction (vertical direction). In addition, as a moving mechanism of the pressing plate 216, a well-known moving mechanism (for example, a ball screw or an air cylinder mechanism) etc. (not shown) can be used.

According to the above structure, by using the resin cover 400 to convey the resin R, it is possible to prevent the resin R from leaking during loading into the sealed mold 202 and before being placed on the lower mold 206 (specifically, the cavity 208 ). dripping) or flying of fine powder. Furthermore, in the state where the resin cover 400 is held on the lower surface of the resin cover holder 212 and placed (contacted) on the lower mold 206 (that is, the resin cover 400 is held by the resin cover holder 212 212 and the lower mold 206 ), the resin R carried into the lower mold 206 (cavity 208 ) can be squeezed by the plunger 214 . This eliminates or reduces the volume expansion caused by accumulation of particles of the resin R with gaps between them. Therefore, it is possible to solve the problem that leakage of the resin R tends to occur due to air foaming (defoaming) in the gaps of the resin R during molding due to the volume expansion of the resin R. Furthermore, in case there is a region where the resin R does not spread in the cavity 208 , the effect of being able to fill the region with the resin R can also be obtained at the same time.

Furthermore, the pressing plate 216 of the plunger 214 preferably has a structure in which a surface treatment for preventing the adhesion of the resin R is applied to the lower surface 216a in contact with the resin R. As shown in FIG. The reason for this is that when the extrusion plate 216 is moved (raised) upward after the resin R is extruded, it is possible to prevent the resin R from adhering to the extrusion plate 216 and being unable to be installed on the lower die 206 .

Here, as a modified example of the plunger 214, a structure including a heating mechanism that raises the temperature of the extrusion plate 216 to a predetermined temperature (a temperature at which the resin R is incompletely melted or melted (for example, 60°C) (not shown). According to the structure, since the resin R can be extruded by the extruding plate 216 heated to a predetermined temperature, especially the particles of the resin R on the surface (upper surface) can be fused to each other. Therefore, when the pressing plate 216 is moved upward (raised) to expose the surface (upper surface) of the resin R, it is possible to prevent the fine powdery resin R from flying in the sealing mold 202 .

Next, the dispensing unit 100C includes a vibration mechanism that vibrates the resin cover 400 holding the film F on which the resin R is placed in at least one direction of front and rear, left and right, and up and down (not shown). . As an example, a well-known vibration mechanism (for example, a vibration motor, an air vibrator, etc.) is used for the vibration mechanism, and it is arranged on the transfer table 310 . Thereby, the resin cover 400 can be vibrated in a state where the granular, pulverized, or powdery resin R is placed on the upper surface of the film F held by the resin cover 400, and therefore, the In the stage before 202, the thickness of the resin R mounted on the upper surface of the film F can be made uniform. Therefore, occurrence of molding defects can be prevented, and quality stabilization can be achieved. Furthermore, it is also possible to set it as the structure which does not include a vibration mechanism.

Next, the structure of the resin cover 400 used for conveyance of the film F and the resin R in this embodiment is demonstrated. As shown in FIG. 4 , the resin cover 400 has two film holding parts 400A and 400B, the upper surface and the lower surface are formed in a flat plate shape with a predetermined thickness, and the film F is held in the central part. . In addition, each film holding part 400A, 400B has two resin injection holes formed as through holes so that each film F is exposed as viewed from the upper surface at a position corresponding to each film F (position where each film F is held). 400a, 400b. The resin injection holes 400a and the resin injection holes 400b are formed corresponding to the positions of the mold cavity 208A and the mold cavity 208B, respectively. However, it is not limited to the above structure.

According to this configuration, the resin cover 400 (that is, on the film F held by the film holding part 400A and the film holding part 400B) can hold (place) two sets of resin R, and the two sets of resin R can be They are conveyed together into the sealed mold 202 and held (placed) in the cavities 208A and 208B at predetermined positions of the sealed mold 202 (lower mold 206 in this embodiment) through the film F.

Furthermore, in the resin cover 400 of this embodiment, a plurality of suction holes 400c for generating suction force and holding the film F are provided around the resin injection hole 400a and the resin injection hole 400b. In addition, the resin mask picker 304 or the resin mask loader 212 is provided with a mechanism (not shown) that communicates with the suction hole 400 c and applies a suction force. With such a mechanism, the resin cover 400 can be transported in a state in which the two films F (state where the resin R is placed) are adsorbed and held side by side in the left-right direction on the lower surface of the resin cover 400 .

(resin sealing action) Next, the operation of performing resin sealing using the resin sealing device 1 of this embodiment (that is, the resin sealing method of this embodiment) will be described with reference to FIGS. 1 , 5 to 11 . Here, the following structure is cited as an example, that is, one lower mold 206 has two sets of cavities 208, and one upper mold 204 arranges two workpieces W (e.g., strip-shaped workpieces) to perform resin sealing together, Two molded products Wp are simultaneously obtained (however, it is not limited to the above structure). 5 to 11 are side cross-sectional views in the same direction as FIGS. 2 and 3 .

First, a heating step of adjusting and heating the upper mold 204 to a predetermined temperature (for example, 100° C. to 200° C.) by the upper mold heating mechanism (upper mold heating step) is implemented. In addition, a heating step (lower die heating step) of adjusting and heating the lower die 206 to a predetermined temperature (for example, 100° C. to 200° C.) by the lower die heating mechanism is performed.

Next, the resin mask 400 cleaned on the preparation table 302 (the state in which the film F and the resin R are not held) is held by the resin mask picker 304 and conveyed to the film table 308 . At this time, on the film stage 308, two long films F extending from the two film rolls 306A and 306B and cut into predetermined lengths are prepared (see FIG. 1 ).

Then, as shown in FIG. 5 , set the following state: make the suction hole 400c of the resin cover 400 generate a suction force via the resin cover picker 304, and absorb and hold the two parts on the lower surface of the resin cover 400. a membrane F. In this state, the resin mask 400 is held by the resin mask picker 304 and is transferred onto the transfer table 310 .

Next, as shown in FIG. 6 , the transfer table 310 on which the resin cover 400 is placed is moved to a position directly below the nozzle 312 a of the dispenser 312 . In this state, the resin R is simultaneously injected from the respective nozzles 312 a of the two distributors 312 into the insides of the two rows of through holes (resin injection holes) 400 a and 400 b of the resin cover 400 . In this way, the step of placing the resin R on the film held on the lower surface of the resin cover 400 from the through holes (resin injection holes) 400a and through holes (resin injection holes) 400b (resin placement step) ).

In the said resin placement process, when dropping resin R from the two nozzles 312a, the transfer table 310 mounted with the resin cover 400 is moved along an arbitrary pattern. Thereby, the resin R can be supplied in a corresponding pattern in each resin injection hole 400a, 400b.

Next, as shown in FIG. 7 , the following steps are carried out, that is, the transfer table 310 is finely reciprocated in at least one direction of front and rear, left and right, and up and down to hold the film F on which the resin R is placed. The resin shield 400 vibrates in the state (vibration step). In this way, the resin cover 400 is vibrated in a state where the granular, pulverized, or powdery resin R is placed on the upper surface of the film F held by the resin cover 400 , and it is carried into the sealing mold 202 In the previous stage, the thickness of the resin R mounted on the upper surface of the film F can be made uniform. Therefore, occurrence of molding defects can be prevented, and quality stabilization can be achieved. In particular, by performing the vibration step before the resin transfer step, the thickness of the resin R can be made uniform before transfer, and the fine powder of the resin R can be blown and removed in advance. Therefore, it is possible to further prevent (suppress) the flying of the fine powder of the resin R which may be generated in the subsequent conveying process. In addition, it is also possible to set it as the structure which does not include a vibration step.

Next, as shown in FIG. 8 , the resin mask loader 212 is moved downward (lowered) to hold the resin mask 400 on the transfer table 310 . At this time, while maintaining the state in which the resin cover 400 is held by the holding claws by the third holding portion 212A, suction force is generated in the suction hole 400c of the resin cover 400 through the third holding portion 212A, Two films F are adsorbed on the lower surface of the resin cover 400 . In this way, the resin mask 400 is held by the third holding portion 212A of the resin mask loader 212 .

Next, as shown in FIG. 9 , the following steps are carried out: the resin cover 400 in the state where the film F on which the resin R is placed is transported by the resin cover loader 212, and the film F on which the resin R is placed The film F in a state of being held in the cavity 208 (resin transfer step).

Next, as shown in FIG. 10 , the following step is carried out: in the state where the film F on which the resin R is placed is housed and held in the cavity 208, the resin (that is, the placed film F) is pressed by the plunger 214 A group of resins) R is extruded to expel the air in the resin R, thereby reducing the volume (resin extrusion step).

In this way, in a series of steps from the resin conveying step to the resin extrusion step, the resin R in the through hole (resin injection hole) 400a and the through hole (resin injection hole) 400b (the state placed on the film F) ) is transported in a state sealed by the resin cover 400 and the lower surface of the resin cover loader 212 (specifically, the pressing plate 216 ). This prevents leakage (dripping) of the resin R and flying of fine powder during loading into the sealed mold 202 and before placement in the cavity 208 of the lower mold 206 . Furthermore, in the state where the resin mask 400 is held on the lower surface of the resin mask loader 212 and placed on the lower mold 206, it can be carried into the lower mold 206 (cavity 208) by the plunger 214 pair. ) in resin R for pressing. This eliminates or reduces the volume expansion caused by accumulation of particles of the resin R with gaps between them. As a result, leakage of the resin R due to air foaming (defoaming) in the gaps of the resin R during molding due to volume expansion of the resin R can be prevented. By virtue of the above synergistic effect, it is possible to prevent the occurrence of molding defects due to leakage of the resin R, etc., thereby further improving the molding quality. Furthermore, in case there is a region where the resin R does not spread in the cavity 208 , the effect of being able to fill the region with the resin R can also be obtained at the same time.

In addition, as a modified example of the above-mentioned resin extrusion step, it may be performed in a state where the temperature of the extrusion plate 216 is raised to a predetermined temperature (a temperature at which the resin R is not completely melted or melted (for example, 60° C.)). Thereby, the particles of the resin R on the surface (upper surface) that the pressing plate 216 contacts can be fused and integrated. Therefore, when the pressing plate 216 is moved upward (raised) to expose the surface (upper surface) of the resin R, it is possible to prevent the fine powdery resin R from flying up in the sealing mold 202 .

Next, as shown in FIG. 11 , the resin boot 400 is conveyed (unloaded) to the outside of the sealing mold 202 by the resin boot loader 212 (third holding portion 212A).

Subsequent steps are the same as the previous resin sealing method, and the following steps are implemented: the sealing mold 202 is closed, and the two workpieces W are clamped by the upper mold 204 and the lower mold 206 . At this time, in the two groups of cavities 208 , the cavity inserts 226 are relatively raised, and the resin R is heated and pressurized for the two workpieces W. As shown in FIG. In this way, the resin R is thermally cured to complete resin sealing (compression molding). Next, a step of opening the sealed mold 202 to separate the two molded products Wp from the used film Fd is carried out. Next, a step of transferring (unloading) the two molded products Wp from the inside of the sealing mold 202 by the first loader 210 (second holding unit 210B) is performed. Moreover, the process of conveying (carrying out) the two used films Fd from the inside of the sealing mold 202 by the resin mask loader 212 (3rd holding part 212A) is implemented.

The above is the main operation of resin sealing using the resin sealing device 1 . However, the order of the steps described above is an example, and the order can be changed or implemented in parallel as long as there is no obstacle. For example, in the present embodiment, since the apparatus configuration including a plurality of (two as an example) press units 100B is employed, the above operations can be performed in parallel to efficiently form a molded product.

As explained above, according to this invention, resin can be conveyed in the state sealed by the resin cover and the resin cover loader. This prevents leakage (dripping) of resin and flying of fine powder during loading into the sealed mold and when it is placed in the cavity of the lower mold. Furthermore, in the state where the resin cover is held on the lower surface of the resin cover holder and placed on the lower mold, the resin (a group of resins) introduced into the cavity of the lower mold can be controlled by the plunger. ) to press. This eliminates or reduces the volume expansion caused by accumulation of resin particles with gaps between them. Therefore, it is possible to solve the problem that the air in the gaps between the resins is foamed (degassed) during molding due to volume expansion of the resin, and leakage of the resin tends to occur. That is, it is possible to prevent deterioration of molding quality due to leakage (dripping) of resin, etc., and to achieve stabilization of molding quality (maintenance of high quality).

In addition, this invention is not limited to the said embodiment, Various changes are possible in the range which does not deviate from this invention. In particular, as the sealing resin, granular, pulverized, and powdery thermosetting resins have been described as examples, but not limited thereto, liquid, plate, sheet, and other resins can also be used suitably. Structure.

In addition, the following description was given as an example in which two sets of cavities are provided in the upper mold, and two workpieces are placed in the lower mold to perform resin sealing together to obtain two molded products at the same time, but it is not limited to this , can also be applied to the following structure, that is, a set (or more than three sets) of mold cavities is arranged on the upper mold, and one (or more than three) workpieces are arranged on the lower mold for resin sealing, Obtain one (or more than three) shaped products.

1: Resin sealing device 100A: Workpiece handling unit 100B: pressing unit 100C: distribution unit 102: supply box 104: Supply track 106: Relay track 116: workpiece heater 120: supply picker 122: storage picker 124: storage lift 202: sealing mold 204: upper mold 204a: mold surface 205: Workpiece holding part 206: Lower mold 206a: mold surface 208, 208A, 208B: cavity 210: First loader 210A: The first holding part 210B: the second holding part 212: Resin Shield Loader (Second Loader) 212A: The third holding department 212B: The fourth holding part 214: plunger 216: extrusion board 216a: lower surface 222: lower board 224: upper board 226: Mold cavity insert 228: Holder 230a, 230b, 230c: suction path 232: Force member 234: sealing member 236: holding plate 240a: suction path 302: Preparing the Workbench 304: Resin Shield Pickup 306: Membrane supply mechanism 306A: film roll 306B: film roller 308: Membrane Workbench 310: Transfer workbench 312: Allocator 312a: Nozzle 316: Processor 400: resin shield 400a, 400b: through hole (resin injection hole) 400c: suction hole 400A, 400B: Membrane holding part F: film (release film) R: Resin Fd: used film W: workpiece (formed product) Wa: Substrate Wb: electronic parts Wp: molded product

FIG. 1 is a plan view showing an example of a resin sealing device according to an embodiment of the present invention. 2 is a cross-sectional view showing an example of a sealing mold of the resin sealing device of FIG. 1 . 3 is a cross-sectional view showing an example of a resin boot loader of the resin sealing device of FIG. 1 . 4 is a plan view showing an example of a resin cover of the resin sealing device of FIG. 1 . Fig. 5 is an explanatory view showing the operation of the resin sealing device according to the embodiment of the present invention. FIG. 6 is an explanatory diagram of operations subsequent to FIG. 5 . FIG. 7 is an explanatory diagram of operations subsequent to FIG. 6 . FIG. 8 is an explanatory view of operations subsequent to FIG. 7 . FIG. 9 is an explanatory diagram of operations subsequent to FIG. 8 . FIG. 10 is an explanatory diagram of operations subsequent to FIG. 9 . FIG. 11 is an explanatory view of operations subsequent to FIG. 10 .

1: Resin sealing device

100A: Workpiece handling unit

100B: pressing unit

100C: distribution unit

102: supply box

104: Supply track

106: Relay track

116: workpiece heater

120: supply picker

122: storage picker

124: storage lift

202: sealing mold

208A, 208B: mold cavity

210: First loader

210A: The first holding part

210B: the second holding part

212:Second loader

212A: The third holding department

212B: The fourth holding part

302: Preparing the Workbench

304: Resin Shield Pickup

306: Membrane supply mechanism

306A: film roll

306B: film roller

308: Membrane Workbench

310: Transfer workbench

312: Allocator

316: Processor

400: resin shield

F: film (release film)

R: Resin

Fd: used film

W: Workpiece (formed product)

Wp: molded product

Claims (8)

A resin sealing device, which uses a sealing mold including an upper mold and a lower mold having a cavity, and processes a molded product by sealing a workpiece with an electronic component on a base material with a resin. The resin sealing device is characterized in that it includes: a resin cover for holding the film on which the resin is placed; a resin shield loader for transferring the resin shield; and The plunger squeezes the resin in a state where the film on which the resin is placed is accommodated and held in the cavity to discharge air in the resin to reduce its volume. The resin sealing device according to claim 1, wherein the plunger is disposed on the resin cover loader and has a pressing plate, and the pressing plate is configured to be mounted on the resin cover. The resin can be pressed through the through hole serving as a holding space for the resin in the resin cover while being held on the lower surface of the resin cover holder. The resin sealing device according to claim 1 or claim 2, wherein the resin is in a granular, pulverized, or powdered form when placed on the film. The resin sealing device as described in claim 3, is characterized in that it further comprises: The vibration mechanism vibrates the resin cover holding the film on which the resin is placed. A resin sealing method, which uses a sealing mold including an upper mold and a lower mold having a cavity, and processes a molded product by sealing a workpiece with an electronic component on a base material with a resin, wherein the resin sealing method is characterized by comprising, The step of placing the resin, holding the film on the lower surface of the resin cover, and placing the resin on the film from a through hole provided in the resin cover; In the resin transporting step, a resin cover loader transports the resin cover holding the film on which the resin is placed, and accommodates the film in the state on which the resin is placed. retained in the mold cavity; and In the resin extrusion step, in a state where the film on which the resin is placed is housed and held in the cavity, the resin is extruded by a plunger to discharge air in the resin, thereby reducing the volume. The resin sealing method as described in claim 5, wherein, The resin pressing step includes a step of passing a pressing plate vertically movably provided in a plunger provided on the resin shroud loader through a body held in the resin shroud loader. The resin is pressed through the through hole of the resin cover. The resin sealing method according to claim 5 or claim 6, wherein the resin is in a granular, pulverized or powdered form when placed on the film. The resin sealing method according to claim 7, further comprising a vibrating step after the resin placing step and before the resin conveying step, in which the pair on which the resin is placed The resin shield vibrates in a state where the membrane is held.

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