TWI816472B - Resin sealing device and resin sealing method - Google Patents

Abstract

The present invention provides a resin sealing device and a resin sealing method that can prevent molding defects caused by leakage of resin and improve molding quality in a structure having a cavity in a lower mold. The resin sealing device 1 of the present invention uses a sealing mold 202 including an upper mold 204 and a lower mold 206 having a cavity 208 to seal the workpiece W on which the electronic component Wb is mounted on the base material Wa with the resin R to process it into a molded product Wp. , and the resin sealing device includes: a resin shield 400 that holds the film F on which the resin R is placed; a resin shield loader 212 that transports the resin shield 400; and a plunger 214 that holds the resin R. While the film F of the resin R is accommodated and held in the mold cavity 208, the resin R is squeezed to discharge the air in the resin R, thereby reducing the volume.

Description

Resin sealing device and resin sealing method

The present invention relates to a resin sealing device and a resin sealing method.

As an example of a resin sealing device and a resin sealing method in which a workpiece (work) on which electronic components are mounted on a base material is sealed with a sealing resin (hereinafter, sometimes simply referred to as "resin") and processed into a molded product, there are known Compression molding method.

The compression molding method is a technology that performs resin sealing by supplying a predetermined amount of resin to a sealing area (cavity) provided in a sealing mold composed of an upper mold and a lower mold, and simultaneously filling the sealing area in the sealing area. Arrange the workpiece and clamp it with the upper mold and lower mold. As an example, there is known a technique in which resin is supplied to a central position on a workpiece for molding when a sealed mold having a cavity is provided in an upper mold. On the other hand, when a sealed mold having a cavity in a lower mold is used, a technique is known for molding by supplying a film and resin to cover the surface of the mold including the cavity (see Patent Document 1: Japanese Patent) Special Publication No. 2019-145550). [Prior art documents] [Patent Document]

[Patent Document 1] Japanese Patent Application Laid-Open No. 2019-145550

[Problem to be solved by the invention]

Here, in the compression molding method in which the lower mold has a cavity, in order to ensure good molding quality, it is important that resin does not leak (drip) from the cavity. However, there is a problem in that, in particular, granular resin accumulates with gaps between the particles, and the resulting volume expansion causes the air contained in the gaps to foam (defoaming) due to heating or decompression. , so resin leakage may easily occur. [Means to solve the problem]

The present invention was made in view of the above situation, and an object thereof is to provide a resin sealing device and a resin sealing method that can prevent molding defects caused by resin leakage and the like in a structure having a cavity in a lower mold and improve molding quality.

The present invention solves the above-mentioned problems by means of solving the problems described below as an embodiment.

The resin sealing device of the present invention uses a sealing mold including an upper mold and a lower mold having a cavity to seal a workpiece with electronic components mounted on a base material using resin to process it into a molded product. The necessary conditions for the resin sealing device are: It includes: a resin shield that holds the film on which the resin is mounted; a resin shield loader that transports the resin shield; and a plunger that is accommodated in the film on which the resin is mounted. The resin is extruded while remaining in the mold cavity to discharge the air in the resin, thereby reducing the volume.

Thereby, by using the resin cover to transport the film and the resin, it is possible to prevent resin leakage when the resin is loaded into the lower mold and accommodated and held in the mold cavity. Furthermore, by using the plunger to squeeze the resin held in the cavity of the lower mold, the volume expansion of the resin can be eliminated or reduced. Therefore, it is possible to prevent the air contained in the gaps of the resin from foaming during molding and causing leakage of the resin.

In addition, it is preferable that the plunger is disposed in the resin shield loader and has a pressing plate configured to hold the resin shield in the resin shield loader. In the state of the lower surface, the resin can be squeezed through a through hole in the resin cover that serves as a holding space for the resin. Thereby, while the resin shield is held in the resin shield loader and in contact with the lower mold, the resin carried into the cavity of the lower mold can be pressed by the plunger.

In addition, it is preferable that the device further includes a vibration mechanism that vibrates the resin cover in a state in which the film on which the resin is mounted is held. Thereby, the resin shield is vibrated in a state where the granular, pulverized, or powdery resin is placed on the upper surface of the film held by the resin shield, so that the load can be vibrated at the stage before being loaded into the sealing mold. The thickness of the resin placed on the upper surface of the film is evened out.

In addition, the resin sealing method of the present invention uses a sealing mold including an upper mold and a lower mold having a mold cavity to seal a workpiece with electronic components mounted on a base material by resin to process it into a molded product. The necessity of the resin sealing method The condition includes: a resin placing step of holding a film on the lower surface of a resin guard, and placing the resin on the film from a through hole provided in the resin guard; and a resin conveying step of loading through the resin guard. transporting the resin shield holding the film on which the resin is placed, and storing and holding the film on which the resin is placed in the mold cavity; and resin extrusion In the pressing step, in a state where the film on which the resin is placed is accommodated and held in the mold cavity, the resin is squeezed by a plunger to discharge the air in the resin, thereby making the resin Volume reduction. [Effects of the invention]

According to the present invention, in a resin sealing device and a resin sealing method having a cavity in a lower mold, the following problems can be solved, namely, the volume generated by the accumulation of granular resin in a state where gaps exist between the granules. Expansion causes the air in the gaps between the resin to foam (defoaming) during molding, easily causing resin leakage. Therefore, molding defects caused by resin leakage can be prevented and molding quality can be improved.

(overall structure) Hereinafter, the first embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a plan view (schematic view) showing an example of the resin sealing device 1 according to this embodiment. In addition, FIG. 2 is a side cross-sectional view (schematic view) showing an example of the sealing mold 202 of the resin sealing device 1 , and FIG. 3 is a side cross-sectional view (schematic view) showing an example of the resin shield loader 212 of the resin sealing device 1 . . In addition, for convenience of explanation, arrows may be used to illustrate the front and rear, left and right, and up and down directions of the resin sealing device 1 in the drawings. In addition, in all the drawings for explaining each embodiment, members having the same function are sometimes denoted by the same reference numerals, and repeated description thereof will be omitted.

The resin sealing device 1 of this embodiment is a device that seals a workpiece (formed product) W with resin using a sealing mold 202 including an upper mold 204 and a lower mold 206 . Hereinafter, as the resin sealing device 1 , a compression molding device in which a workpiece W is held by an upper mold 204 and covered with a release film (hereinafter sometimes referred to as “film”) F is explained as an example. The resin R is supplied to the mold cavity 208 (including a part of the mold surface 206 a ) of the lower mold 206 , the upper mold 204 and the lower mold 206 are clamped, and the workpiece W is sealed with the resin R.

First, the workpiece W as a molding target has a structure in which a plurality of electronic components Wb are mounted in a matrix on a base material Wa. More specifically, examples of the base material Wa include a long resin substrate, a ceramic substrate, a metal substrate, a carrier plate, a lead frame, a plate-shaped member such as a wafer (so-called long condition artifact). Examples of the electronic component Wb include a semiconductor wafer, a micro electromechanical system (MEMS) wafer, a passive element, a heat sink, a conductive member, a spacer, and the like. Furthermore, as another example of the base material Wa, a structure using the above-mentioned member (not shown) formed in a circular shape, a square shape, etc. may be used.

As an example of the method of mounting the electronic component Wb on the base material Wa, there are mounting methods using wire bonding packaging, flip-chip packaging, and the like. Alternatively, in the case of a structure in which the base material (glass or metal pallet) Wa is peeled off from the molded article Wp after resin sealing, there is also the following method: using a thermally releasable adhesive tape or using ultraviolet rays The electronic component Wb is attached by irradiating hardened ultraviolet curable resin.

On the other hand, as an example of the resin R, a granular (including cylindrical, etc.), pulverized or powdery (sometimes collectively referred to as "granular" in this application) thermosetting resin (for example, a filler-containing resin) can be used. Epoxy resin, etc.). In addition, the resin R is not limited to the above-mentioned state, and may be in other states (shapes) such as liquid form, plate form, sheet form, or other resins other than epoxy-based thermosetting resin.

In addition, as an example of the film F, a film material excellent in heat resistance, peelability, flexibility, and stretchability can be suitably used, such as polytetrafluoroethylene (PTFE), ethylene-tetrafluoroethylene copolymer (ethylene -tetrafluoroethylene (ETFE) (polytetrafluoroethylene polymer), polyethylene terephthalate (PET), fluorinated ethylene propylene (FEP), fluorine-impregnated glass cloth, polypropylene, polyethylene Vinylidene chloride, etc. In this embodiment, as the film F, a long film corresponding to the long workpiece W can be used. However, it is not limited to the above structure.

Next, the outline of the resin sealing device 1 of this embodiment will be described. As shown in FIG. 1 , the resin sealing device 1 includes the following parts as main components: a workpiece processing unit 100A, which mainly supplies the workpieces W and stores the resin-sealed molded products Wp; and a pressing unit 100B, which mainly processes the workpieces W. It is sealed with resin and processed into a molded product Wp; and the distribution unit 100C mainly performs supply and storage (disposal) of the film F and supply of the resin R. Furthermore, in this embodiment, the following structure is taken as an example for explanation, that is, one lower mold 206 has two sets of mold cavities 208, and one upper mold 204 has two workpiece holding parts 205. For two workpieces, W (for example, strip-shaped workpieces) are resin-sealed together to obtain two molded products Wp at the same time. However, it is not limited to the above structure.

In this embodiment, the workpiece processing unit 100A, the pressing unit 100B and the distribution unit 100C are arranged side by side in sequence from left to right in the left and right direction. Furthermore, an arbitrary number of guide rails (not shown) are linearly provided across each unit, a first loader 210 that transports the workpiece W and the molded product Wp, and a second loader 212 that transports the film F and the resin R. It is installed so that it can move between predetermined units along arbitrary guide rails.

Furthermore, the overall structural form of the resin sealing device 1 can be changed by changing the structure of the unit. For example, the structure shown in FIG. 1 is an example in which two pressing units 100B are provided, but it may also be a structure in which only one pressing unit 100B is provided, or three or more pressing units 100B are provided. In addition, a structure in which other units are provided is also possible (none of them is shown in the figure).

(Workpiece processing unit) Next, the workpiece processing unit 100A included in the resin sealing apparatus 1 will be described in detail.

The workpiece processing unit 100A includes a supply cassette 102 for accommodating a plurality of workpieces W, and a storage cassette (not shown) for accommodating a plurality of molded products Wp. Here, as the supply cassette 102 and the storage cassette, known stack magazines, slit magazines, etc. can be used.

As an example, the workpiece processing unit 100A includes a supply rail 104 disposed behind the supply cassette 102 and on which the workpiece W taken out from the supply cassette 102 is placed. In the present embodiment, a known propeller or the like (not shown) is used to supply the workpiece W from the supply cassette 102 to the supply rail 104 via the relay rail 106 . Furthermore, a supply picker 120 is included, which holds the workpiece W placed on the supply rail 104 and transports it to a predetermined position.

In addition, the workpiece processing unit 100A includes a storage rail (not shown), which is disposed behind the storage cassette (not shown), and mounts the molded product Wp taken out from the sealing mold 202 . In this embodiment, a well-known propeller etc. are used to store the molded product Wp in a storage cassette from a storage rail via a relay rail (neither is shown). Furthermore, a storage picker 122 and a storage elevator 124 are included which receive the resin-sealed molded product Wp and convey it to a storage rail (not shown).

Next, the workpiece processing unit 100A includes the first loader 210 that transports the workpiece W and the molded product Wp. Specifically, the first loader 210 includes a first holding portion 210A, which holds the workpiece W in a state held by the supply picker 120 by a holding mechanism provided on the upper surface of the first holding portion 210A, and holds the workpiece W to a predetermined holding position of the upper mold 204 Location transfer. In addition, the first loader 210 includes a second holding portion 210B that holds the molded product Wp in a state of being held in the upper mold 204 after resin sealing by a holding mechanism provided on the upper surface, and holds the molded product Wp outside the sealing mold 202 . It is transported to a predetermined position (for example, the position held by the storage picker 122, etc.). Here, the holding mechanism of the workpiece W in the first holding part 210A has a structure in which two long workpieces W are arranged side by side in two rows in the left-right direction so as to be able to hold the two elongated workpieces W. Similarly, the holding mechanism of the molded product Wp in the second holding part 210B has a structure in which two rows are arranged side by side in the left-right direction so as to be able to hold two elongated molded products Wp. However, it is not limited to these structures. Furthermore, as the holding mechanism, a known holding mechanism (for example, a structure having holding claws for clamping, a structure having a suction hole communicating with a suction device for suction, etc.) can be used (not shown).

In addition, the workpiece processing unit 100A includes a workpiece heater 116 that heats the workpiece W transported by the first loader 210 from the lower surface side (the base material Wa side). As an example, a known heating mechanism (eg, electric wire heater, infrared heater, etc.) can be used as the workpiece heater 116 . Thereby, the workpiece W can be preheated before being loaded into the sealing mold 202 and heated. Furthermore, a structure that does not include the workpiece heater 116 may be used.

(suppression unit) Next, the pressing unit 100B included in the resin sealing device 1 will be described in detail.

The pressing unit 100B includes a sealing mold 202 and a pair of opening and closing molds (for example, a plurality of mold blocks, mold plates, mold columns, etc. or other components including alloy tool steel are assembled). In this embodiment, one of the molds on the upper side in the vertical direction of the pair of molds is set as the upper mold 204 , and the other mold on the lower side is set as the lower mold 206 . The sealing mold 202 closes and opens the mold as the upper mold 204 and the lower mold 206 approach and move away from each other. That is, the vertical direction (up-and-down direction) becomes the mold opening and closing direction.

In addition, the sealing mold 202 is opened and closed by a known mold opening and closing mechanism (not shown). For example, the mold opening and closing mechanism is composed of a pair of platens, a plurality of connecting mechanisms (tie bars or columns) for erecting the pair of platens, and a drive that moves (lifts and lowers) the platens. Source (such as electric motor) and drive transmission mechanism (such as ball screw or toggle link mechanism), etc. (neither shown).

Here, the sealing mold 202 is disposed between a pair of mold plates of the mold opening and closing mechanism. In this embodiment, the upper mold 204 serving as the fixed mold is assembled to the fixed mold plate (a mold plate fixed to the connecting mechanism), and the lower mold 206 serving as the movable mold is assembled to the movable mold plate (a mold plate that moves up and down along the connecting mechanism). However, the structure is not limited to the above structure. The upper mold 204 may be assembled to the movable mold plate and the lower mold 206 may be assembled to the fixed mold plate, or both the upper mold 204 and the lower mold 206 may be assembled to the movable mold plate.

Next, the lower mold 206 of the sealing mold 202 will be described in detail. As shown in FIG. 2 , the lower mold 206 includes a lower plate 222 , a cavity insert 226 , a holder 228 , etc., and is formed by assembling these parts. In this embodiment, a mold cavity 208 is provided on the upper surface of the lower mold 206 (the surface on the upper mold 204 side).

More specifically, the cavity insert 226 is fixedly assembled relative to the upper surface of the lower plate 222 . On the other hand, the holder 228 is configured in an annular shape to surround the cavity insert 226 , and is assembled so as to be separated from (floating) relative to the lower surface of the lower plate 222 via the urging member 232 and capable of moving up and down. The cavity insert 226 forms the inner portion (bottom) of the mold cavity 208 , and the holder 228 forms the side of the mold cavity 208 . Here, in this embodiment, as shown in FIG. 1 , a structure is formed in which two sets of mold cavities 208 (208A and 208B in the figure) are arranged side by side in the left and right directions in one lower mold 206. The workpieces W are resin-sealed together. However, it is not limited to the above structure.

Here, a suction groove (not shown) is provided on the mold surface 204a of the upper mold 204 facing the holder 228, and is connected to a suction device (not shown). In addition, by providing a sealing structure surrounding these parts, the suction device is driven to reduce the pressure, thereby degassing the mold cavity 208 in a closed mold state.

In addition, in this embodiment, an adsorption mechanism is provided that sucks and holds the film F supplied from the distribution unit 100C (in this embodiment, resin is mounted) supplied from the distribution unit 100C to the lower mold 206 . As an example, the adsorption mechanism has a suction path 230a and a suction path 230b that are disposed through the holder 228 and communicated with a suction device (not shown), and are disposed through the lower plate 222 and the mold cavity insert 226. A suction path 230c is provided and communicated with a suction device (not shown). Specifically, one end of the suction path 230a, the suction path 230b, and the suction path 230c passes through the mold surface 206a of the lower mold 206, and the other end is connected to a suction device arranged outside the lower mold 206. Thereby, the suction device can be driven to suck the film F from the suction path 230a, the suction path 230b, and the suction path 230c, so that the film F can be adsorbed and held on the mold surface 206a including the inner surface of the mold cavity 208.

In this way, by providing the film F covering the inner surface of the mold cavity 208 and the mold surface 206a (a part) of the lower mold 206, the portion of the resin R on the lower surface of the molded article Wp can be easily peeled off, so that the molded product can be The product Wp self-sealing mold 202 (lower mold 206) can be easily removed.

Furthermore, a gap of a predetermined size provided between the inner peripheral surface of the holder 228 and the outer peripheral surface of the cavity insert 226 constitutes a part of the suction path 230a. Therefore, a sealing member 234 (for example, an O-ring) is disposed at a predetermined position in the gap to exert a sealing effect when the film F is sucked.

In addition, in this embodiment, a lower mold heating mechanism for heating the lower mold 206 to a predetermined temperature is provided. The lower mold heating mechanism includes a heater (such as an electric wire heater), a temperature sensor, a power supply, etc., and the control unit controls the heating (none of which are shown in the figure). As an example, the heater has a structure built in the lower plate 222 or a mold base (not shown) housing these parts, and mainly applies heat to the entire lower mold 206 and the resin R (described later). Thereby, the lower mold 206 is adjusted and heated to a predetermined temperature (for example, 100°C to 200°C).

Next, the upper mold 204 of the sealing mold 202 will be described in detail. As shown in FIG. 2 , the upper mold 204 includes an upper plate 224 , a holding plate 236 , and the like, and is constructed by assembling these parts. Here, the holding plate 236 is fixedly assembled with respect to the lower surface (surface on the lower mold 206 side) of the upper plate 224 .

In addition, in this embodiment, a workpiece holding part 205 for holding the workpiece W at a predetermined position on the lower surface of the holding plate 236 is provided. As an example, the workpiece holding part 205 has a suction path 240a that is disposed through the holding plate 236 and the upper plate 224 and communicates with a suction device (not shown). Specifically, one end of the suction path 240a passes through the mold surface 204a of the upper mold 204, and the other end is connected to a suction device arranged outside the upper mold 204. Thereby, the suction device can be driven to suck the workpiece W from the suction path 240a, and the workpiece W can be adsorbed and held on the mold surface 204a (here, the lower surface of the holding plate 236). Furthermore, a structure may be provided that is provided together with the structure including the suction path 240a and includes a holding claw (not shown) that clamps the outer periphery of the workpiece W.

In addition, in this embodiment, an upper mold heating mechanism is provided that heats the upper mold 204 to a predetermined temperature. The upper mold heating mechanism includes a heater (such as an electric wire heater), a temperature sensor, a power supply, etc., and the control unit controls the heating (none of which are shown in the figure). As an example, the heater has a structure built in the upper plate 224 or a mold base (not shown) housing these parts, and mainly applies heat to the entire upper mold 204 and the workpiece W. Thereby, the upper mold 204 is adjusted and heated to a predetermined temperature (for example, 100°C to 200°C).

(allocation unit) Next, the distribution unit 100C included in the resin sealing device 1 will be described in detail.

The distribution unit 100C includes a film supply mechanism 306 that supplies the film F, and a distributor 312 that supplies the resin R. Here, in this embodiment, when the film F and the resin R are transported to the sealing mold 202, a resin shield 400 (described later) can be used as a jig for holding and transporting the film F and the resin R.

As an example, the film supply mechanism 306 includes the following parts: two film rollers 306A and 306B, which have unwinding and winding mechanisms; and a cutting mechanism (such as a well-known fixed knife cutting machine, a hot melt cutting machine, etc.), Cut the long film F. Thereby, a strip-shaped single film F of a predetermined length can be supplied.

In addition, the distribution unit 100C includes: a resin shield picker 304, which transports the resin shield 400 (and the film F, and the resin R) in the unit; and a second loader 212 (referred to as " The resin shield loader ") transports the resin shield 400 (and the film F and the resin R) delivered from the resin shield picker 304 into the sealing mold 202, and at the same time transports the used film Fd from the sealing mold 202.

As an example, the resin shield loader 212 includes a third holding part 212A, and holds the resin shield 400 and transports it into the sealing mold 202 so that the film F held by the resin shield 400 (in a state where the resin R is placed) It is held in the mold cavity 208 of the lower mold 206 (including a part of the mold surface 206a). Furthermore, the resin shield loader 212 of this embodiment includes a fourth holding portion 212B, which holds the used film Fd, transports it from the inside of the sealing mold 202 to a disposer 316, and discards it. Furthermore, as a holding mechanism for the resin shield 400 in the resin shield picker 304 and the resin shield loader 212, a known holding mechanism (for example, a structure with holding claws for clamping, a structure with a suction device) can be used. A structure with connected suction holes for adsorption, etc.) (not shown). In addition, as a holding mechanism for the used film Fd in the resin shield loader 212, a known holding mechanism (for example, a structure having a suction hole communicating with a suction device for suction, etc.) can be used (not shown) .

Furthermore, the resin shield loader 212 is provided with a plunger 214 that presses the resin R while the film F on which the resin R is placed is accommodated and held in the mold cavity 208 to cause the resin. The air in the resin R (here, the entire predetermined amount of the resin R placed) is discharged, thereby reducing the volume. Specifically, the plunger 214 has a pressing plate 216 configured to pass through the resin shield 400 while the resin shield 400 is held on the lower surface of the resin shield loader 212 . Through-holes (resin injection holes to be described later) 400a and 400b hold the resin R, and the resin R is pressed. That is, the pressing plate 216 is configured to be movable in the up and down direction (vertical direction). In addition, as the moving mechanism of the pressing plate 216, a known moving mechanism (for example, a ball screw or a cylinder mechanism) or the like (not shown) can be used.

According to the above structure, by using the resin cover 400 to transport the resin R, leakage of the resin R can be prevented from occurring while the resin R is being transported into the sealing mold 202 and before being placed on the lower mold 206 (specifically, the mold cavity 208 ) ( dripping) or flying of fine powder. Furthermore, in a state where the resin shield 400 is held on the lower surface of the resin shield loader 212 and is placed (in contact with) the lower mold 206 (that is, the resin shield 400 is loaded by the resin shield loader). 212 and the lower mold 206), the resin R carried into the lower mold 206 (cavity 208) can be squeezed by the plunger 214. This can eliminate or reduce the volume expansion caused by the accumulation of resin R particles with gaps between them. Therefore, the problem that the air in the gap between the resin R foams (degasses) during molding due to the volume expansion of the resin R and the leakage of the resin R easily occurs can be solved. Furthermore, even if there is an area in the mold cavity 208 that is not covered by the resin R, the effect of filling the area with the resin R can also be obtained at the same time.

Furthermore, it is preferable that the pressing plate 216 of the plunger 214 has a structure in which a surface treatment for preventing the adhesion of the resin R is performed on the lower surface 216 a that is in contact with the resin R. The reason for this is that when the extrusion plate 216 is moved upward (raised) after extruding the resin R, it is possible to prevent the resin R from adhering to the extrusion plate 216 and failing to be installed in the lower mold 206 .

Here, as a modification of the plunger 214, a structure including a heating mechanism that heats the extrusion plate 216 to a predetermined temperature (a temperature at which the resin R is incompletely melted or melted (for example)) may be provided. 60°C) (not shown). According to the above structure, since the resin R can be extruded by the extrusion plate 216 heated to a predetermined temperature, in particular, the particles of the resin R on the surface (upper surface) can be fused to each other. Therefore, when the pressing plate 216 is moved upward (rising) and the surface (upper surface) of the resin R is exposed, it is possible to prevent the finely powdered resin R from flying in the sealing mold 202 .

Next, the distribution unit 100C includes a vibration mechanism that vibrates the resin cover 400 holding the film F on which the resin R is mounted in at least one direction of front and rear, left and right, and up and down (not shown). . As an example, a known vibration mechanism (such as a vibration motor, an air vibrator, etc.) is used as the vibration mechanism, and is arranged on the transfer table 310 . Thereby, in the state where the granular, pulverized, or powdery resin R is placed on the upper surface of the film F held by the resin cover 400, the resin cover 400 can be vibrated. Therefore, the resin cover 400 can be moved into the sealing mold. In the stage before step 202, the thickness of the resin R placed on the upper surface of the film F can be made uniform. Therefore, the occurrence of molding defects can be prevented and quality can be stabilized. Furthermore, the structure may not include a vibration mechanism.

Next, the structure of the resin shield 400 used for conveying the film F and the resin R in this embodiment will be described. As shown in FIG. 4 , the resin cover 400 has two film holding parts 400A and 400B, has a flat plate shape with a predetermined thickness and an upper surface and a lower surface formed as parallel planes, and holds the film F in the central part. . In addition, each of the film holding portions 400A and 400B has two resin injection holes formed as through holes at positions corresponding to the respective films F (positions where the respective films F are held) so that the respective films F are exposed when viewed from the upper surface. 400a, 400b. The resin injection hole 400a and the resin injection hole 400b are formed corresponding to the positions of the mold cavity 208A and the mold cavity 208B, respectively. However, it is not limited to the above structure.

According to the above structure, the resin cover 400 (that is, on the film F held by the film holding parts 400A and 400B) can hold (place) the two sets of resin R, and the two sets of resin R can be placed thereon. They are transported together into the sealing mold 202 and held (placed) via the film F in the cavities 208A and 208B at predetermined positions of the sealing mold 202 (lower mold 206 in this embodiment).

Furthermore, in the resin cover 400 of this embodiment, a plurality of suction holes 400c that generate a suction force and hold the film F are provided around the resin injection holes 400a and 400b. Furthermore, the resin shield pickup 304 or the resin shield loader 212 is provided with a mechanism (not shown) that communicates with the suction hole 400c to apply suction force. With this mechanism, the resin shield 400 can be conveyed in a state where the two films F are adsorbed and held side by side in the left-right direction on the lower surface of the resin shield 400 (with the resin R placed thereon).

(Resin sealing action) Next, the operation of resin sealing using the resin sealing device 1 of the present embodiment (ie, the resin sealing method of the present embodiment) will be described with reference to FIGS. 1 and 5 to 11 . Here, the following structure is taken as an example: one lower mold 206 has two sets of mold cavities 208, and two workpieces W (for example, strip-shaped workpieces) are arranged in one upper mold 204 and are resin-sealed together. Two molded products Wp are obtained simultaneously (however, the structure is not limited to the above). In addition, FIGS. 5 to 11 are side cross-sectional views in the same direction as FIGS. 2 and 3 .

First, a heating step (upper mold heating step) is performed in which the upper mold 204 is adjusted and heated to a predetermined temperature (for example, 100° C. to 200° C.) by the upper mold heating mechanism. In addition, a heating step (lower mold heating step) is performed in which the lower mold 206 is adjusted and heated to a predetermined temperature (for example, 100° C. to 200° C.) by the lower mold heating mechanism.

Next, the resin shield 400 cleaned on the preparation table 302 (the film F and the resin R are not retained) is held by the resin shield picker 304 and transported to the film work table 308 . At this time, on the film table 308, two long films F (refer to FIG. 1) stretched out from the two film rollers 306A and 306B and each cut into a predetermined length are prepared.

Next, as shown in FIG. 5 , a state is set in which the suction hole 400 c of the resin shield 400 generates suction force via the resin shield pickup 304 to adsorb and hold both the resin shield 400 and the lower surface of the resin shield 400 . A membrane F. In this state, the resin shield 400 is held by the resin shield picker 304 and transferred to the transfer table 310 .

Next, as shown in FIG. 6 , the transfer stage 310 on which the resin shield 400 is mounted is moved to a position directly below the nozzle 312 a of the distributor 312 . In this state, the resin R is simultaneously injected from the respective nozzles 312 a of the two distributors 312 into the two rows of through holes (resin injection holes) 400 a and 400 b of the resin shield 400 . In this way, the following step is performed: placing the resin R on the film held on the lower surface of the resin cover 400 from the through hole (resin input hole) 400a and the through hole (resin input hole) 400b (resin placing step) ).

In the resin placing step, when the resin R is dropped from the two nozzles 312a, the transfer table 310 on which the resin shield 400 is mounted is moved along an arbitrary pattern. Thereby, the resin R can be supplied in a corresponding pattern into each resin injection hole 400a, 400b.

Next, as shown in FIG. 7 , the following steps are performed, that is, the transfer table 310 is made to perform fine reciprocating movement in at least one direction of front and rear, left and right, and up and down, so as to hold the film F on which the resin R is placed. The resin shield 400 in the state vibrates (vibration step). Thereby, in the state where the granular, pulverized, or powdery resin R is placed on the upper surface of the film F held by the resin shield 400 , the resin shield 400 is vibrated, thereby moving it into the sealing mold 202 In the previous stage, the thickness of the resin R placed on the upper surface of the film F can be made uniform. Therefore, the occurrence of molding defects can be prevented and quality can be stabilized. In particular, by performing a vibrating step before the resin conveying step, the effect of making the thickness of the resin R uniform before conveying and flying and removing the fine powder of the resin R in advance can be obtained. Therefore, it is possible to further prevent (suppress) the flying of the fine powder of the resin R that may occur in the subsequent conveyance process. Furthermore, a structure that does not include the vibration step may be used.

Next, as shown in FIG. 8 , the resin shield loader 212 is moved downward (descended) to hold the resin shield 400 on the transfer table 310 . At this time, the following state is maintained, that is, the resin shield 400 is held by the holding claws by the third holding part 212A, and the suction hole 400c of the resin shield 400 generates suction force through the third holding part 212A. Two films F are adsorbed on the lower surface of the resin shield 400 . In this way, the resin shield 400 is held by the third holding part 212A of the resin shield loader 212 .

Next, as shown in FIG. 9 , the resin shield 400 holding the film F on which the resin R is mounted is transported by the resin shield loader 212 so that the resin R is mounted thereon. The film F in the state is accommodated and held in the mold cavity 208 (resin transfer step).

Next, as shown in FIG. 10 , the following steps are performed: in a state where the film F on which the resin R is placed is accommodated and held in the mold cavity 208 , the resin (i.e., the placed film F) is pressed by the plunger 214 . A group of resins) R are extruded to expel the air in the resin R, thereby reducing the volume (resin extrusion step).

In this way, in a series of steps from the resin transfer step to the resin extrusion step, the resin R in the through hole (resin input hole) 400a and the through hole (resin input hole) 400b (in the state of being placed on the film F ) is conveyed in a state of being sealed by the resin shield 400 and the lower surface of the resin shield loader 212 (specifically, the pressing plate 216 ). Thereby, leakage (drip) of the resin R or flying of fine powder can be prevented while being carried into the sealing mold 202 and before being placed in the mold cavity 208 of the lower mold 206 . Furthermore, while the resin shield 400 is held on the lower surface of the resin shield loader 212 and placed on the lower mold 206, it can be loaded into the lower mold 206 (cavity 208) by the pair of plungers 214. ) is pressed with the resin R in it. This can eliminate or reduce the volume expansion caused by the accumulation of resin R particles with gaps between them. As a result, it is possible to prevent the air in the gaps between the resin R from foaming (defoaming) during molding due to the volume expansion of the resin R, thereby preventing the resin R from leaking. Through the above synergistic effect, it is possible to prevent the occurrence of molding defects caused by leakage of the resin R, etc., thereby further improving the molding quality. Furthermore, even if there is an area in the mold cavity 208 that is not covered by the resin R, the effect of filling the area with the resin R can also be obtained at the same time.

Furthermore, as a modification of the resin extrusion step, the extrusion plate 216 may be heated to a predetermined temperature (a temperature at which the resin R is incompletely melted or melted (for example, 60° C.)). Thereby, the particles of the resin R on the surface (upper surface) in contact with the extrusion plate 216 can be fused to each other and integrated. Therefore, when the pressing plate 216 is moved upward (rising) and the surface (upper surface) of the resin R is exposed, it is possible to prevent the fine powdery resin R from flying in the sealing mold 202 .

Next, as shown in FIG. 11 , the resin shield 400 is transported (unloaded) to the outside of the sealing mold 202 by the resin shield loader 212 (third holding portion 212A).

The subsequent steps are the same as the previous resin sealing method, and the following steps are performed: closing the sealing mold 202 and clamping the two workpieces W using the upper mold 204 and the lower mold 206. At this time, in the two sets of mold cavities 208 , each cavity insert 226 rises relatively, and the resin R is heated and pressurized for the two workpieces W. Thereby, the resin R is thermally hardened and resin sealing (compression molding) is completed. Next, the sealing mold 202 is opened to separate the two molded products Wp from the used film Fd. Next, a step of transporting (unloading) the two molded products Wp from the sealing mold 202 by the first loader 210 (second holding part 210B) is performed. In addition, a step of transporting (unloading) the two used films Fd from the sealing mold 202 via the resin shield loader 212 (third holding portion 212A) is performed.

The above is the main operation of resin sealing using the resin sealing device 1 . However, the above-described sequence of steps is an example, and the sequence can be changed or implemented in parallel as long as there are no obstacles. For example, in this embodiment, since an apparatus structure including a plurality of (for example, two) pressing units 100B is adopted, a molded product can be efficiently formed by executing the above operations in parallel.

As described above, according to the present invention, resin can be transported in a state of sealing with the resin shield and the resin shield loader. This prevents leakage (drips) of resin or flying of fine powder during the process of being moved into the sealed mold and when placed in the cavity of the lower mold. Furthermore, while the resin shield is held on the lower surface of the resin shield loader and placed on the lower mold, the resin (a group of resins) carried into the cavity of the lower mold can be moved by the plunger. ) to press. This can eliminate or reduce the volume expansion caused by the accumulation of resin particles with gaps between them. Therefore, it is possible to solve the problem that the air in the gap between the resins foams (defoamates) during molding due to the volume expansion of the resin, thereby easily causing leakage of the resin. That is, it is possible to prevent deterioration of molding quality due to resin leakage (dripping), etc., thereby achieving stabilization of molding quality (maintenance of high quality).

In addition, the present invention is not limited to the above-described embodiment, and various changes can be made without departing from the scope of the present invention. Particularly, as the sealing resin, granular, pulverized, and powdery thermosetting resins are exemplified and explained, but the invention is not limited thereto, and liquid, plate-like, sheet-like resins, etc. may also be used. structure.

In addition, the following description has been given as an example of a structure in which two sets of cavities are provided in the upper mold, and two workpieces are arranged in the lower mold and resin-sealed together to obtain two molded products at the same time. However, it is not limited to this. , can also be applied to the following structure, that is, a set of (or more than three sets of) mold cavities are provided in the upper mold, and one (or more than three sets of) workpieces are arranged in the lower mold for resin sealing. Obtain one (or more than three) molded products.

1: Resin sealing device 100A: Workpiece processing unit 100B: Pressing unit 100C: Distribution unit 102:Supply box 104: Supply track 106:Relay track 116: Work piece heater 120: Supply Picker 122: Storage pickup 124: Storage lift 202:Sealing mold 204: Upper mold 204a:Mold surface 205: Workpiece holding part 206:Lower mold 206a:Mold surface 208, 208A, 208B: Mold cavity 210:First loader 210A: First holding part 210B: Second maintenance part 212: Resin shield loader (second loader) 212A: The third maintenance part 212B: The fourth maintenance department 214:Plunger 216:Extrusion board 216a: Lower surface 222: Lower board 224:On the board 226:Mold cavity insert 228: Gripper 230a, 230b, 230c: suction path 232:Forcing member 234:Sealing component 236:keep board 240a:Suction path 302: Preparing the workbench 304:Resin shield pickup 306: Film supply mechanism 306A: Film roller 306B: Film roller 308: Membrane workbench 310:Transporting workbench 312:Distributor 312a:Nozzle 316: Disposer 400:Resin shield 400a, 400b: Through hole (resin injection hole) 400c: Suction hole 400A, 400B: Film holding part F: Membrane (released film) R:Resin Fd: used membrane W: Workpiece (formed product) Wa: base material Wb: electronic parts Wp: Molded product

FIG. 1 is a plan view showing an example of a resin sealing device according to an embodiment of the present invention. FIG. 2 is a cross-sectional view showing an example of the sealing mold of the resin sealing device of FIG. 1 . FIG. 3 is a cross-sectional view showing an example of a resin shield loader of the resin sealing device of FIG. 1 . FIG. 4 is a plan view showing an example of a resin shield of the resin sealing device of FIG. 1 . FIG. 5 is an operation explanatory diagram of the resin sealing device according to the embodiment of the present invention. FIG. 6 is an operation explanatory diagram subsequent to FIG. 5 . FIG. 7 is an operation explanatory diagram subsequent to FIG. 6 . FIG. 8 is an operation explanation diagram subsequent to FIG. 7 . FIG. 9 is an operation explanatory diagram subsequent to FIG. 8 . FIG. 10 is an operation explanatory diagram subsequent to FIG. 9 . FIG. 11 is an operation explanatory diagram subsequent to FIG. 10 .

1: Resin sealing device

100A: Workpiece processing unit

100B: Pressing unit

100C: Distribution unit

102:Supply box

104: Supply track

106:Relay track

116: Work piece heater

120: Supply Picker

122: Storage pickup

124: Storage lift

202:Sealing mold

208A, 208B: Mold cavity

210:First loader

210A: First holding part

210B: Second maintenance part

212: Second loader

212A: The third maintenance part

212B: The fourth maintenance department

302: Preparing the workbench

304:Resin shield pickup

306: Film supply mechanism

306A: Film roller

306B: Film roller

308: Membrane workbench

310:Transporting workbench

312:Distributor

316: Disposer

400:Resin shield

F: Membrane (release film)

R:Resin

Fd: used membrane

W: Workpiece (formed product)

Wp: Molded product

Claims (6)

A resin sealing device that uses a sealing mold including an upper mold and a lower mold having a mold cavity to seal a workpiece with electronic components on a base material using resin to process it into a molded product. The resin sealing device is characterized by including: A resin shield holds the film on which the resin is mounted; a resin shield loader transports the resin shield; and a plunger holds the film on which the resin is mounted. The resin is extruded while in the mold cavity to discharge the air in the resin, thereby reducing the volume; and a vibration mechanism maintains the film on which the resin is placed. The resin shield vibrates. The resin sealing device according to claim 1, wherein the plunger is provided on the resin shield loader and has a pressing plate, and the pressing plate is configured to be attached to the resin shield. While being held on the lower surface of the resin shield loader, the resin can be squeezed through a through hole in the resin shield that serves as a holding space for the resin. The resin sealing device according to Claim 1 or 2, wherein the resin is in a granular, pulverized or powdered form when placed on the film. A resin sealing method that uses a sealing mold including an upper mold and a lower mold having a mold cavity to seal a workpiece with electronic components mounted on a base material by resin to process it into a molded product. The resin sealing method is characterized by including: In the resin placement step, a film is held on the lower surface of the resin shield and placed on the tree The resin is placed on the film through the through hole of the grease guard; and the resin conveying step is to convey the resin guard in a state where the film on which the resin is placed is held by a resin guard loader. , the film in a state where the resin is placed is accommodated and held in the mold cavity; and a resin extrusion step is performed in which the film with the resin placed is accommodated and held in the mold cavity. state, the resin is squeezed by the plunger to discharge the air in the resin, thereby reducing the volume. After the resin placing step and before the resin conveying step, a vibration step is further included. In the vibration step, the resin cover holding the film on which the resin is mounted is vibrated. The resin sealing method according to claim 4, wherein the resin extruding step includes the step of providing an extrusion plate that is movable up and down in a plunger disposed on the resin shield loader. The resin is pressed through the through hole of the resin shield held in the resin shield loader. The resin sealing method according to Claim 4 or 5, wherein the resin is in a granular, pulverized or powdered form when placed on the film.

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