TW200843930A - Method of compression molding for electronic part and apparatus therefor - Google Patents

Method of compression molding for electronic part and apparatus therefor Download PDF

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Publication number
TW200843930A
TW200843930A TW097108668A TW97108668A TW200843930A TW 200843930 A TW200843930 A TW 200843930A TW 097108668 A TW097108668 A TW 097108668A TW 97108668 A TW97108668 A TW 97108668A TW 200843930 A TW200843930 A TW 200843930A
Authority
TW
Taiwan
Prior art keywords
resin
release film
resin material
cavity
electronic component
Prior art date
Application number
TW097108668A
Other languages
Chinese (zh)
Other versions
TWI355325B (en
Inventor
Tsuyoshi Amakawa
Shinji Takase
Yohei Onishi
Hiroshi Uragami
Naoki Takada
Osamu Otsuki
Mamoru Oda
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007063336A external-priority patent/JP4855307B2/en
Priority claimed from JP2007097346A external-priority patent/JP2008254266A/en
Priority claimed from JP2007122957A external-priority patent/JP4855329B2/en
Application filed by Towa Corp filed Critical Towa Corp
Publication of TW200843930A publication Critical patent/TW200843930A/en
Application granted granted Critical
Publication of TWI355325B publication Critical patent/TWI355325B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0003—Discharging moulded articles from the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0067—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other
    • B29C37/0075—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other using release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C43/183—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles the preformed layer being a lining, e.g. shaped in the mould before compression moulding, or a preformed shell adapted to the shape of the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
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    • H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
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    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3405—Feeding the material to the mould or the compression means using carrying means
    • B29C2043/3427—Feeding the material to the mould or the compression means using carrying means hopper, vessel, chute, tube, conveying screw, for material in discrete form, e.g. particles or powder or fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C43/183—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles the preformed layer being a lining, e.g. shaped in the mould before compression moulding, or a preformed shell adapted to the shape of the mould
    • B29C43/184—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles the preformed layer being a lining, e.g. shaped in the mould before compression moulding, or a preformed shell adapted to the shape of the mould shaped by the compression of the material during moulding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01004—Beryllium [Be]
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    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

First, a given amount of granular resin (6) is fed into a resin accommodation space (22) of plate (21). Secondly, the plate (21) is covered with a mold release film (11) so as to spread over the resin accommodation space (22). Thirdly, the resin accommodation space (22) is set to a given degree of vacuum. Fourthly, the plate (21) covered with the mold release film (11) is turned upside down. Finally, the plate turned upside down is moved into a cavity (5), so that the surface of the cavity (5) is covered with the mold release film (11). In this situation, the granular resin (6) is caused to fall from the resin accommodation space (22) into the cavity (5) covered with the mold release film (11).

Description

200843930 九、發明說明： 【發明所屬^^技領域2 發明領域200843930 IX. Description of the invention: [Technical field of invention] 2 Field of invention

本發明係有關於一種將IC (Integrated Circuit)等之 5 電子零件壓縮成形之方法及使用於該方法之裝置。 t先•前我牙;J 發明背景 以往’係如第7圖所示，安裝於基板82之電子零件83 係使用模組品81及顆粒樹脂84進行壓縮成形如下。 1〇 首先，準備用以將具有上模85與下模86之電子零件壓 成形之模組品81。又，於下模86設置模穴87。其次，離 型膜88被覆於模穴87。接著，將顆粒樹脂84供給至模穴87 内。然後，加熱顆粒樹脂84。藉此，將顆粒樹脂84熔融。 其次，關閉上模85與下模86。藉此，將安裝於基板82之電 5子零件83浸潰於模穴87内之熔融樹脂。結果，藉由對應於 模穴87之形狀之樹脂成形體填封電子零件83。藉此完成壓 縮成形。 上述壓縮成形方法中，係使用供給機構89以將顆粒樹 脂84供給至模穴87内。供給機構89係如第7圖所示，具有遮 2〇板9〇。又，供給機構89設有具有預定量之顆粒樹脂84之貫 通孔91。供給機構89在使用時，首先插入於上模％與下模 6之間的工間。其—人’打開供給機構89之遮板卯。藉此， 顆粒樹脂84由貫通孔91往模穴87落下。 【專利文獻1】日本專利公開公報特開2_—216558 5 200843930 上述壓縮成形中，藉由打開供給機構89之遮板9〇，使 顆粒樹脂84由貫通孔91往模穴87落下時，顆粒樹脂84之一 部份92會殘存於供給機構89之貫通孔91。因此，供給至模 穴87内之樹脂量容易發生不足。因此，會產生供給至模六 5 87内之樹脂量的信賴性低之問題。該問題在使用粉狀樹 脂，粉末樹脂，或者液狀樹脂等其他樹脂材料來取代顆粒 樹脂時也會發生。 本發明之目的在於提供一種可提高供給至模穴之樹脂 材料之量的信賴性之電子零件之樹脂成形方法。 10 【發明内容】 發明概要 本發明之電子零件之壓縮成形方法中，準備包含具有 模穴之下模之模組品。其次，準備包含具有對應於模穴之 開口之樹脂收容空間之模板。對樹脂收容空間供給樹脂材 料。將離型膜載置於模板，以覆蓋樹脂收容空間。藉由朝 模板吸引離型膜，樹脂材料的移動會因為離型膜而受到抑 制。然後，將模板翻轉。其次，模板移動到模穴之上方位 置。藉由變化樹脂收容空間的壓力㈣，模穴被覆離型膜。 此時，樹脂材料可由樹脂收容空間往被覆有離型膜之模穴 20 落下。 圖式簡單說明 第1圖係概略顯示實施例！之電子零件之壓縮成形方法 中所使用之用以收容樹脂之模板與供給樹脂材料之機構之 立體圖，且顯示樹脂材料供給至模板之狀態。 200843930 第2圖係概略顯示實施例1之模板之截面圖，且顯示離 型膜被覆於投入有樹脂材料之模板之狀態。 第3圖係概略顯示實施例1之模板之截面圖 ，且顯示第2 圖所示之被覆有離型膜之模板翻轉之狀態。 5 第4圖係概略顯示實施例1之模組品之截面圖，且顯示 第3圖所示之模板移送到模組品之狀態。 第5圖係概略顯示實施例1之模組品之截面圖，且顯示 樹脂材料由模板之貫通孔往模穴剛落下後之狀態。 第6圖係概略顯示實施例1之模組品之截面圖，且顯示 10 模組品關閉之狀態。 第7圖係概略顯示習知之電子零件之壓縮成形方法中 所使用之模組品之縱截面圖。 第8圖係顯示實施例2之電子零件之壓縮成形方法中， 將以框架挾持離型膜之前的狀態。 15 第9圖係顯示實施例2之電子零件之壓縮成形方法中， 樹脂材料剛往模板之樹脂收容空間投入後之狀態。 第10圖係顯示實施例2之電子零件之壓縮成形方法 中，以被框架挾持之離型膜關閉模板之開口之狀態。 第11圖係顯示實施例2之電子零件之壓縮成形方法 20中，被框架挾持之離型膜緊密附著於顆粒樹脂之狀態。 第U圖係顯示在實施例2之電子零件之壓縮成形方法 中，藉由吸附被覆離型膜之模板設置於内裝載機之狀態。 第13圖係顯示實施例2之電子零件的電子零件之壓縮 成形方法中，在模組品打開之狀態下，安裝於内裝載機之 7 200843930 模板在離型膜介於其中之狀態下，載置於下模上之狀態。 第14圖係顯示實施例2之電子零件的電子零件之壓縮 成形方法中，樹脂材料由模板之樹脂收容空間往下模之模 穴供給後之狀態。 5 第15圖係顯示實施例2之電子零件的電子零件之壓縮 成形方法中，樹脂材料由模板往下模供給後，使模板振動 之狀態。 第16圖係顯示實施例2之電子零件的電子零件之壓縮 成形方法中，模組品關閉之狀態。 10 第17圖係概略顯示用於說明實施形態之電子零件之壓 縮成形方法之預備加熱機構的平面圖。 第18圖係顯示實施例3之電子零件的電子零件之壓縮 成形方法中，使用預備加熱機構之狀態。 第19圖係顯示實施例3之電子零件的電子零件之壓縮 15 成形方法中，預先經過加熱之樹脂材料設置於離型膜上之 框架内之狀態。 第20圖係顯示實施例3之電子零件的電子零件之壓縮 成形方法中，具有均一厚度之樹脂材料殘存於離型膜上之 狀態。 20 第21圖係顯示其他例之電子零件之壓縮成形方法中所 使用之模組品。 第22圖係顯示習知之電子零件之壓縮成形方法中所使 用之模組品之截面圖，並顯示樹脂材料往模穴供給後之狀 態。 8 200843930 第23圖係概略顯示實施例4之成形機構之截面圖，且顯 示將要於離型膜形成凹部之狀態。 第24圖係概略顯示實施例4之成形機構之截面圖，且顯 示於離型膜形成凹部時之狀態。 5 第25圖係概略顯示實施例4之成形機構之戴面圖，且顯 示於離型膜形成凹部後之狀態。 第26圖係概略顯示實施例4之電子零件之壓縮成形裝 置之用以投入樹脂材料之機構之截面圖。 第27圖係概略顯示實施例4之電子零件之壓縮成开)穿 10 置之藉由振動使樹脂材料平坦化之機構之截面圖。 弟28圖係概略顯示實施例4之電子零件之壓縮成开^麥 置之猎由按壓使樹脂材料平坦化之工具之截面圖。 第29圖係顯示實施例4之電子零件之壓縮成形裝置 中’内裝載機將要吸附於凹部具有業已平坦化之顆粒樹脂 15 之離型膜之狀態。 第30圖係顯示實施例4之電子零件之壓縮成形裝置 中，内裝載機將吸附於凹部具有業已平坦化之顆粒樹脂之 膜後之狀態。 弟31圖係顯示貫施例4之電子零件之壓縮成形裝置 2〇中，於模穴之上方位置配置内裝載機狀態。 第32圖係顯示在實施例4之電子零件之壓縮成形裝置 中，吸附於内裝載機之離型膜的凹部插入模穴之狀態。 弟3 3圖係顯示實施例4之模組品打開之狀態。 第34圖係顯示實施例4之模組品關閉之狀態。 9 200843930 第3 5圖係顯示實施例5之電子零件之壓縮成形裝置 中内虞載機配置於模穴之上方位置之狀態。 第36圖係顯示實施例5之電子零件之壓縮成形裝置 中吸附於内裝載機之離型膜之凹部嵌入於模穴之狀態。 5 第37圖係顯示實施例6之電子零件之壓縮成形裝置 中’内裝載機配置於模穴之上方位置之狀態。 第3 8圖係顯示實施例6之電子零件之壓縮成形裝置 中，吸附於内裝載機之離型膜的凹部插入於模穴之狀態。 第39圖係顯示實施例7之電子零件之壓縮成形裝置 10中，供給機構之組裝步驟。 第4 0圖係顯示實施例7之電子零件之壓縮成形裝置 中，投入機構往模板之貫通孔投入樹脂材料之狀態。 第41圖係顯示實施例7之電子零件之壓縮成形裝置 中’模板之貫通孔内之業以平坦化之樹脂材料。 第42圖係顯示實施例7之電子零件之壓縮成形裝置 中，内裝载機將要吸附具有平面形狀之離型膜，即，不具 有凹部之離型膜之狀態。 第43圖係顯示實施例7之電子零件之壓縮成形裝置 中内I載機吸附具有平面形狀之離型膜時之狀態。The present invention relates to a method of compression molding a five-component electronic component such as an IC (Integrated Circuit), and an apparatus used therefor. BACKGROUND OF THE INVENTION As shown in Fig. 7, the electronic component 83 mounted on the substrate 82 is compression-molded by using the module 81 and the pellet resin 84 as follows. 1〇 First, a module product 81 for press molding an electronic component having an upper mold 85 and a lower mold 86 is prepared. Further, a cavity 87 is provided in the lower mold 86. Next, the release film 88 is applied to the cavity 87. Next, the particulate resin 84 is supplied into the cavity 87. Then, the particulate resin 84 is heated. Thereby, the particulate resin 84 is melted. Next, the upper mold 85 and the lower mold 86 are closed. Thereby, the electric component 5 attached to the substrate 82 is immersed in the molten resin in the cavity 87. As a result, the electronic component 83 is filled with a resin molded body corresponding to the shape of the cavity 87. This completes the compression forming. In the above compression molding method, the supply mechanism 89 is used to supply the particulate resin 84 into the cavity 87. The supply mechanism 89 has a cover 9 〇 as shown in Fig. 7. Further, the supply mechanism 89 is provided with a through hole 91 having a predetermined amount of the particulate resin 84. When in use, the supply mechanism 89 is first inserted into the work space between the upper mold % and the lower mold 6. It is the person's opening the shutter of the supply mechanism 89. Thereby, the granular resin 84 is dropped from the through hole 91 toward the cavity 87. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2-216558 5 200843930 In the above compression molding, when the particle resin 84 is dropped from the through hole 91 to the cavity 87 by opening the shutter 9 of the supply mechanism 89, the granular resin One of the portions 92 of 84 remains in the through hole 91 of the supply mechanism 89. Therefore, the amount of the resin supplied into the cavity 87 is liable to be insufficient. Therefore, there is a problem that the reliability of the amount of resin supplied into the mold 506 is low. This problem also occurs when a resin resin such as a powdery resin, a powdered resin, or a liquid resin is used in place of the particulate resin. SUMMARY OF THE INVENTION An object of the present invention is to provide a resin molding method for an electronic component which can improve the reliability of the amount of the resin material supplied to the cavity. [Explanation] SUMMARY OF THE INVENTION In the compression molding method for an electronic component of the present invention, a module product including a mold having a cavity is prepared. Next, a template containing a resin accommodating space corresponding to the opening of the cavity is prepared. A resin material is supplied to the resin accommodating space. The release film is placed on the template to cover the resin receiving space. By attracting the release film toward the template, the movement of the resin material is inhibited by the release film. Then, flip the template over. Second, the template is moved over the cavity. The cavity is covered with a release film by changing the pressure (4) of the resin accommodating space. At this time, the resin material may fall from the resin accommodating space to the cavity 20 covered with the release film. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing an embodiment! A perspective view of a mechanism for accommodating a resin and a mechanism for supplying a resin material used in the compression molding method of the electronic component, and showing a state in which the resin material is supplied to the template. 200843930 Fig. 2 is a cross-sectional view schematically showing the template of Example 1, and shows a state in which the release film is coated on a template into which a resin material is placed. Fig. 3 is a cross-sectional view schematically showing the template of the first embodiment, and shows a state in which the template coated with the release film shown in Fig. 2 is inverted. 5 Fig. 4 is a schematic cross-sectional view showing the module of the first embodiment, and shows the state in which the template shown in Fig. 3 is transferred to the module. Fig. 5 is a schematic cross-sectional view showing the module of the first embodiment, and shows a state in which the resin material is dropped from the through hole of the template to the cavity. Fig. 6 is a schematic cross-sectional view showing the module of the embodiment 1, and shows the state in which the module is turned off. Fig. 7 is a longitudinal sectional view showing a module product used in a conventional compression molding method for electronic parts. Fig. 8 is a view showing a state before the release film is held by the frame in the compression molding method of the electronic component of the second embodiment. 15 Fig. 9 is a view showing a state in which the resin material has just been put into the resin accommodating space of the stencil in the compression molding method of the electronic component of the second embodiment. Fig. 10 is a view showing a state in which the opening of the template is closed by the release film held by the frame in the compression molding method of the electronic component of the second embodiment. Fig. 11 is a view showing a state in which the release film held by the frame is closely adhered to the particulate resin in the compression molding method 20 of the electronic component of the second embodiment. Fig. U is a view showing a state in which the template for adsorbing the release film is placed on the inner loader in the compression molding method for the electronic component of the second embodiment. Figure 13 is a view showing a compression molding method for an electronic component of the electronic component of the second embodiment, in a state in which the module is opened, and mounted on the inner loader 7 200843930, the template is placed in a state in which the release film is interposed. Placed on the lower die. Fig. 14 is a view showing a state in which the resin material is supplied from the resin accommodating space of the stencil to the cavity of the lower mold in the compression molding method of the electronic component of the electronic component of the second embodiment. Fig. 15 is a view showing the compression of the electronic component of the electronic component of the second embodiment. In the molding method, the resin material is supplied from the template to the lower mold, and the template is vibrated. Fig. 16 is a view showing the state in which the module is closed in the compression molding method of the electronic component of the electronic component of the second embodiment. Fig. 17 is a plan view schematically showing a preliminary heating mechanism for explaining a compression molding method of an electronic component according to an embodiment. Fig. 18 is a view showing a state in which a preliminary heating mechanism is used in the compression molding method of the electronic component of the electronic component of the third embodiment. Fig. 19 is a view showing the compression of the electronic component of the electronic component of the embodiment 3. In the molding method, the previously heated resin material is placed in the frame on the release film. Fig. 20 is a view showing a state in which the resin material having a uniform thickness remains on the release film in the compression molding method of the electronic component of the electronic component of the third embodiment. 20 Figure 21 shows the module used in the compression molding method for electronic parts of other examples. Fig. 22 is a cross-sectional view showing a module used in a conventional compression molding method for an electronic component, and shows a state in which the resin material is supplied to the cavity. 8 200843930 Fig. 23 is a cross-sectional view schematically showing the forming mechanism of the embodiment 4, and shows a state in which a concave portion is to be formed in the release film. Fig. 24 is a cross-sectional view schematically showing the molding mechanism of the embodiment 4, and is shown in a state in which the release film is formed into a concave portion. Fig. 25 is a schematic view showing the wearing mechanism of the forming mechanism of the fourth embodiment, and is shown in a state in which the release film is formed into a concave portion. Fig. 26 is a cross-sectional view schematically showing a mechanism for inserting a resin material into a compression molding apparatus for an electronic component of the fourth embodiment. Fig. 27 is a cross-sectional view showing the mechanism for flattening the resin material by vibration by the compression of the electronic component of the fourth embodiment. Fig. 28 is a schematic cross-sectional view showing the compression of the electronic component of the embodiment 4 into a tool for flattening the resin material by pressing. Fig. 29 is a view showing a state in which the inner loader of the electronic component of the embodiment 4 is to be adsorbed to the concave portion and has the release film of the grained resin 15 which has been flattened. Fig. 30 is a view showing the compression molding apparatus for the electronic component of the fourth embodiment, in which the inner loader is adsorbed to the state in which the concave portion has a film of the planarized granular resin. Figure 31 shows a compression molding apparatus for an electronic component according to Embodiment 4, in which the inner loader state is disposed above the cavity. Fig. 32 is a view showing a state in which the concave portion of the release film adsorbed to the inner loader is inserted into the cavity in the compression molding apparatus for the electronic component of the fourth embodiment. The brother 3 3 shows the state in which the module of the embodiment 4 is opened. Fig. 34 is a view showing the state in which the module of the embodiment 4 is closed. 9 200843930 Fig. 5 is a view showing a state in which the inner loader is placed at a position above the cavity in the compression molding apparatus for the electronic component of the fifth embodiment. Fig. 36 is a view showing a state in which the concave portion of the release film adsorbed to the inner loader is embedded in the cavity in the compression molding apparatus for the electronic component of the fifth embodiment. Fig. 37 is a view showing a state in which the inner loader is disposed at a position above the cavity in the compression molding apparatus for the electronic component of the sixth embodiment. Fig. 3 is a view showing a state in which the concave portion of the release film adsorbed to the inner loader is inserted into the cavity in the compression molding apparatus for the electronic component of the sixth embodiment. Fig. 39 is a view showing the assembly procedure of the supply mechanism in the compression molding apparatus 10 of the electronic component of the seventh embodiment. Fig. 40 is a view showing a state in which the input mechanism puts a resin material into the through hole of the template in the compression molding apparatus for the electronic component of the seventh embodiment. Fig. 41 is a view showing a resin material which is flattened in the through hole of the template in the compression molding apparatus for the electronic component of the seventh embodiment. Fig. 42 is a view showing the compression molding apparatus for the electronic component of the seventh embodiment, in which the inner loader is to adsorb a release film having a planar shape, i.e., a release film having no concave portion. Fig. 43 is a view showing a state in which the inner I carrier adsorbs the release film having a planar shape in the compression molding apparatus for the electronic component of the seventh embodiment.

2〇 /rM 第44圖係顯示實施例7之電子零件之壓縮成形裝置 ’内裝載機藉由吸附保持具有平面形狀之離型膜並使之 移動之狀態。 第45圖係顯示實施例7之電子零件之壓縮成形裝置 中，内裝載機配置於模穴之上方位置之狀態。 10 200843930 第46圖係顯示實施例7之電子零件之壓縮成形裝置 中’吸附於内裝載機且具有平面形狀之離型膜插入模穴之 狀態。 第47圖係顯示習知之電子零件之壓縮成形裝置中，供 5給機構往模穴供給樹脂材料後之狀態。2〇 /rM Fig. 44 shows a compression molding apparatus for the electronic component of the embodiment 7. The inner loader holds the release film having a planar shape by adsorption and moves it. Fig. 45 is a view showing a state in which the inner loader is disposed at a position above the cavity in the compression molding apparatus for the electronic component of the seventh embodiment. 10 200843930 Fig. 46 shows a state in which the release film forming apparatus of the electronic component of the seventh embodiment is inserted into the cavity by the release film having a planar shape adsorbed to the inner loader. Fig. 47 is a view showing a state in which a supply mechanism for supplying a resin material to a cavity is provided in a conventional compression molding apparatus for an electronic component.

【貧施方式I 較佳實施例之詳細說明 其次’說明本發明之實施形態之電子零件之壓縮成形 方法及使用於該方法之裝置。 10 實施例1 以下，參照圖式說明本發明之實施例丨之電子零件之壓 縮成形方法及使用於該方法之裝置。 (包含電子零件之壓縮成形用之模組品之裝置） 首先，說明包含本發明之電子零件之壓縮成形方法中 15 所使用之模組品之裝置。 如第4圖〜第6圖所示，模組品1具有··固定之上模2、 及配置成與上模2對向之可動下模3。上模2之模模面設有基 板裝設部4。下模3設有壓縮成形用之模穴5。 本實施例之壓縮成形裝置具有，内裝載機9、外裝載機 20 (未圖示）、加熱機構（未圖示）、及閉模機構（未圖示）。 内裝載機9係將裝著有顆粒樹脂6與電子零件7之基板8 (成 形前基板）同時或個別供給至上模2與下模3之間的空間。 外裝載機係由模組品取出經模組品！所壓縮成形、即經樹脂 填封之基板8。加熱機構係將模組以加熱到預定溫度。閉 11 200843930 模機構係以狀之壓力關閉上模2與下模 5 10 二者’電子零件7係在朝向下模3之狀態下裝設於基板 模穴5之開口 1G係朝向上模2。下模3設有用以將 離型膜U往模穴5吸附之吸引機構。又，吸引機構具有如 吸引孔、真空路徑、及真空吸引機構。吸引孔係設置於下 模3内部，通達下模3之模面及模穴5之表面。 、又’内裝載機9於其下部具有卡止部9a。卡止部9a係用 以卡止如第2圖所示之樹脂收容用之模板⑽。又，内裝栽 機9於其上部具有基板載置部％。基板8係呈使電子零件7朝 向下方之狀態載置於基板载置部9b。 本貝施例之縮成形裝置中，係使用如第2圖所示之離型 膜1卜離型膜li係被覆於下模3之模面及模穴5之表面。内 凌載機9可將顆粒樹脂6供給至被覆有離型膜丨丨之模穴5 内。又，内裝載機9可將裝著有電子零件7之基板8裝設於基 15 板裝設部4。 模組品1藉由閉模機構而以預定之壓力關閉。模穴5係 藉由加熱機構而加熱。又，樹脂材料6在模穴5内熔融。因 此，電子零件7會浸潰於熔融之樹脂材料6。又，施加預定 壓力於模穴5内之樹脂材料6。根據本實例之裝置，電子零 2〇件7填封於對應於模穴5形狀之樹脂成形體12内。又，供給 顆粒樹脂6至模組品1之機構係使用以第丨圖〜第3圖説明之 樹脂收容用模板21。 (樹脂收容用模板之構成） 如第1圖〜第3圖所示，樹脂收容用模板21，即托盤係 12 200843930 具有可收容預定量之顆粒樹脂6之樹脂收容空間（凹部） 22。樹脂收容空間22係具有開口 23。於開口 23之周圍設有 周緣部24。又，樹脂收容空間22係對應於模穴5之凹陷部。 供給至樹脂收容空間22之顆粒樹脂6由於全體係具有薄片 5 形狀，因此當落下時，適合模穴5之形狀。 執行壓縮成形時，首先如第1圖所示，在模板21上於樹 脂收容空間22收容預定量之顆粒樹脂6。其次，如第2圖所 示，於周緣部24及開口 23被覆預定大小之離型膜11。藉此， 收容有顆粒樹脂6之樹脂收容空間22之開口 23由離型膜11 1〇 封閉。 (模板内之真空吸引機構之構成） 雖然未圖示，但於模板21設有真空吸引機構。真空吸 引機構係強制將空氣由離型膜11所封閉之樹脂收容空間22 之内部往外部排出。真空吸引機構具有如真空泵等、設置 15 於模板21本體之開關閥、及使開關閥與真空泵等連通之真 空管等真空路徑。真空管設置成可安裝於開關閥或拆卸。 要使用真空吸引機構，首先打開開關閥。其次，藉由 真空泵且通過真空路徑由樹脂收容空間22強制將空氣往外 部排出。然後，關閉開關閥。藉此，樹脂收容空間22内之 20空間設定在預定之真空度。其結果，離型膜11被覆且固定 於模板21。藉此，形成樹脂供給完成之模板25。又，之後， 真空管亦可由模板25之開關閥拆卸。又，本發明係如後所 述，由第2圖及第3圖可知，經供給樹脂之模板25在翻轉後 插入上模2與下模3之間的空間。 13 200843930 又，於周緣部24設置多數吸引孔。樹脂收容空間湖 之空氣由吸引孔藉由真空吸引機構被強制排出。又，亦可 藉由使離型膜11吸附於周緣部24，模板21之開口 ^被覆於 離1膜11。又’離型膜11對模板21之被覆亦可藉由在模板 5 21内縣過延伸到樹脂收容空間22之吸引孔之真空吸引， 及自通過周緣部24到模面之吸引孔之真空吸引兩者來執 行。 又’模板21中之樹脂收容空間22内，或者透過通過周 緣部24到模面之吸引孔之真空吸引亦可如後述之持續執 1〇仃，直到已翻轉且樹脂供給完成之模板25插入上模2與下模 3之間的空間為止。 、 (樹脂材料之供給機構的構成） 為了將預疋里之顆粒樹脂6供給至模板21，係如第1圖 所示，使用供給機構31。供給機構31可計量顆粒樹脂6。又， 15供給機構31可供給均一厚度之顆粒樹脂、即每單位面積供 給一定量之樹脂量至模板21的樹脂收容空間22。又，供給 機構31具有可接收顆粒樹脂之接收機構31a，及可送出顆粒 樹脂之送出機構31b。 又，接收機構31a具有··將預定量之顆粒樹脂6投入模 20板21之樹脂收容空間22之投入機構32、及用以計量投入模 板21之預定量之顆粒樹脂6之進料計量機構（測力計/1〇以 cell) 33。又，如第1圖所示，投入機構32具有顆粒樹脂之 送料斗34、及使顆粒樹脂振動及移動然後投入模板21之線 性振動進給器35。 200843930 I出機構31b具有模板载置部（未圖示)、振動均 化機構（未圖不）、及模板計量機構（測力計）％。模板 載置部載置模板2丨。振動均_化機構係藉由使模板黯 動，而使樹脂收容空間22内之顆粒樹脂6振動 。藉此，顆粒 5树月日6朝X方向及γ方向移動。其結果，在樹脂收容空間a 内，顆粒職6之厚度均—化。其絲是形成每單位面積具 有一定量的顆粒樹脂。也就是說 顆粒樹脂6平坦化。模板 計量機構36伽以計量應投人域板2ι之齡樹脂6。 又’顆粒樹脂6亦可藉由使祕收機構m之進給計量 10機構33進行之計量程序、及樹月旨材料之接收機構爪之模板 計量機構36進行之計量程序兩者進行計量。又，亦可僅使 用該等兩計量程序中之任一者進行之。 又，亦可在由線性振動進給機％往模板21之樹脂收容 空間22投入顆粒樹脂6時，藉由模板載置機構移動模板21。 又，若模板21之樹純容空間22巾之祕_6殘存有 凹凸時’藉由於模板21施加振動作用，或者使關刀使該 顆粒樹脂6之凹凸成為平坦自，令顆粒樹脂⑽厚度均一化。 (電子零件之壓縮成形方法） 其-人，蒼知圖式，詳細說明本發明之電子零件之壓縮 20 成形方法。 本發明之電子零件之壓縮成形方法中，首先，如第ι 圖所示，供給機構31係使顆粒樹脂6少量少量地振動，由線 性振動進給機35往模板21之樹脂收容空間22落下。其次 使樹脂收容空間22内之顆粒樹脂6連續地振動，朝χ方向或 15 200843930 γ方向移動。藉此，顆粒樹脂6形成每單位面積具有一定量 之樹脂量。其結果是，顆粒树舳6之厚度均一化。顆粒樹脂 6在投入樹脂收容空間22之狀態下，分別由計量機構33及進 給計量機構36來計量。因此，預定量之顆粒樹脂6在樹脂收 5 容空間22内平坦地形成。 其次，如第2圖所示，離型膜Π载置於供給有顆粒樹脂 ό之模板21上，以堵塞開口 23。然後，空氣藉由真空吸引機 構由周緣部24附近之空間及樹脂收容空間22通過模板21之 吸引孔而強制往外部排出。其結果，樹脂收容空間22内之 1〇空間的真空度設定在預定値。藉此，開口23被離型膜11所 覆蓋，同時離型膜11緊密附著於周緣部24。因此，形成被 覆有離型膜11且投入有樹脂材料6之模板21，即樹脂供給完 成之模板25。模板25之樹脂材料6的移動係受離型膜η所抑 制。 15 又，接著，如第3圖所示，將樹脂供給完成之模板25 翻轉。然後，内裝載機9之卡止部9a卡止業經翻轉之模板 25。此時，安裝有電子零件7之基板8係在電子零件7朝向下 方之狀態下載置於内裝載機9之基板載置部9b。 其次，如第4圖所示，打開上模2與下模3，於其等之間 20的空間插入内裝載機9。此時，於模穴5的上方位置配置内 裝載機9。又，基板8在電子零件7朝向下方之狀態下裝設於 上模2之基板裝設部4。其次，模板25與下模3之模面抵接而 覆蓋模穴5之開口 10。此時，離型膜丨丨在被覆有模板21之狀 態下，緊密附著於下模3之模面，以堵塞模穴5之開口 1〇。 16 200843930 又，離型膜11之外周部吸附於下模3之模面。藉此，離型膜 11之外周部由下模3之模面與周緣部24所挾持。此時，模六 5之開口 1〇與模板21之開口 23位於大略相同之平面内。 其次，藉由打開開關閥，模板25之樹脂收容空間22的 5 狀態會由常壓狀態變化成真空狀態。此時，下模3附近的空 氣在下模3内通過分別延伸到模穴5之表面及下模3之模面 之吸引孔而被強制往外部排出。因此，如第5圖所示，離型 膜Η會緊密附著於下模3之模面及模穴5的表面。此時，離 型膜11中對應於模穴5之開口 10的部分往模穴5内移動。因 1〇此，模穴5表面由離型膜11被覆。在該狀態下，顆粒樹脂6 由上方位置之樹脂收容空間22往下方位置之模穴5落下，供 給至緊密附著有離型膜讥之模穴5内。 又，如第5圖所示，當模板21之樹脂收容空間22位於模 穴5之上方時，顆粒樹脂6保持在樹脂收容空間22内具有均 15厚度之薄片形狀。因此，可由樹脂收容空間往模穴$供 給預定量之顆粒樹脂6全部。 ^ f次，由模組品1取出内裝載機9。然後，如第6圖所示， 权、且係以預疋之壓力關閉。藉此，朝模穴5内之樹脂施 加預疋之壓力。此時，安裝於基板8之電子零件7浸潰於模 内之内。藉此，電子零件7由對應於模六5形狀 之樹脂成形體12所填封。 又，實施例之電子零件之壓縮成形方法中，係使用熱 之祕月曰材料’但本發明之電子零件之製造方法中亦 可使用熱可塑性之樹脂材料。 17 200843930 又’雖然實施例之電子零件之壓縮成形方法係使用顆 粒樹脂，但亦可使用具有預定之粒徑分布之粉狀樹脂、或 粉末樹脂等其他種種形狀。又，上述實施例中亦可使用在 常溫且常壓之環境氣體中為液體狀之液狀樹脂來取代顆粒 5 樹脂。 又’實施例之電子零件之壓縮成形方法中，亦可使用 如矽系之樹脂材料或環氧系之樹脂材料。又，實施例之電 子零件之壓縮成形方法中，亦可使用具有透明性之樹脂材 料、具有半透明性之樹脂材料、燐光物質、或含有螢光物 10質之樹脂材料等各種樹脂材料。 又’實施例之電子零件之壓縮成形方法中，亦可進行 將樹脂材料供給至模板21内，或者在將樹脂材料供給至模 板21内之前，計量樹脂材料之程序。 與前述背景技術欄中所述之習知技術相同的習知技術 15係如第2圖所示，使用電子零件之壓縮成形裝置1101，藉由 顆粒樹脂1104將安裝於基板1102之電子零件11〇3壓縮成 形、即樹脂填封之方法。該方法係如下進行之。 首先’準備電子零件之壓縮成形裝置1101。壓縮成形 裝置1101搭載有模組品。模組品具有上模1105與下模 20 1106。下模1106中設有模穴1107。其次，顆粒樹脂1104供 給至模穴1107内。然後，顆粒樹脂1104藉由加熱而熔融。 其次，關閉上模1105與下模1106。藉此，電子零件11〇3 浸潰於熔融之顆粒樹脂11〇4内。此時，構成模穴1107之底 面之按壓構件1108對模穴1107内之顆粒樹脂11〇4施加壓 200843930 力。藉此，形成對應於模穴1107形狀之樹脂成形體。又， 電子零件1103被樹脂成形體包覆在内。 如第2圖所示，顆粒樹脂11〇4供給至模六11〇7内。此 時，使用供給機構1109。供給機構11〇9具有由上側開口接 5收樹脂材料之貫通孔丨11〇與設置於其下部之遮板1111。 又，當供給機構1109插入上模11〇5與下模1丨〇6之間時，會 拉開遮板1111。藉此，打開貫通孔1110之下侧的開口。因 此，顆粒樹脂1104會落下由貫通孔111〇之位置到模穴11〇7 之位置的距離。其結果是顆粒樹脂11〇4供給至模穴11〇7。 10 使用第2圖說明之習知電子零件的壓縮成形方法中，若 顆粒樹脂1104供給至模穴11〇7内時，附著於顆粒樹脂11〇4 或顆粒樹脂1104之粉末飛散，附著於下模n〇6之模面。因 此，在上模1105與下模11〇6關閉後，於下模11〇6之模面或 基板1102容易形成樹脂屑等之異物（硬化物）1112。 15 因此，為了除去附著於模面之異物，必須進行清潔。 又，會產生因附著於基板之異物而引起之問題。結果是產 生製品之成品率變差的問題。也就是說，無法提昇製品之 生産性。又，為了解決該問題，檢討了使用如下之離型膜。 離型膜係由供給機構供給至模組品。供給機構具有離 20型膜送出輥子及離型膜捲取輥子。藉由該等輥子旋轉，離 型膜供給至上模1105與下模1106之間。藉此，離型膜被覆 於下模1106之模面及模穴1107的表面。又，顆粒樹脂ιι〇4 供給至被覆有離型膜之模穴1107。 然而，顆粒樹脂1104會附著於被覆於下模之模面 19 200843930 之離型膜。因此，樹脂屑等異物1112容易附著於基板1102。 因此’與不使用離型膜之情況相同，無法提昇製品之生産 性。 又’根據使用第2圖說明之習知電子零件之壓縮成形裝 5置’藉由拉開遮板1111，打開貫通孔1110之下側開口。藉 此’當顆粒樹脂1104往模六1107内落下時，顆粒樹脂1104 之一部份會附著於供給機構1109之貫通孔111〇之内周面。 其結果是往模穴1107供給之樹脂材料的量不足。因此，無 法提昇供給至模穴内之樹脂量的信賴性。 1〇 又’若根據使用第2圖所說明之習知方法，顆粒樹脂 1104會由貝通孔1110落下至模穴11〇7。此時，由於顆粒樹 脂1104會因為與模穴11〇7之表面碰撞而飛散，因此在模穴 1107内不會形成均_的厚度。例如，顆粒樹脂丨刚容易形 成為具有凸形或山形等不均一厚度之形狀。此種情況下， 15在模穴1107内，顆粒樹脂11〇4無法均一地加熱。因此，容 易發生在樹脂成形體内殘存有由其他部分分離之部分等不 良狀況。 驭液狀 、4噠在使用粉狀樹脂、粉末樹脂、 20 樹脂等其他_旨材料來取代獅樹料也會發生。 揭不於以下敎述之實施例2及3之發明係為了解決使用 第2圖所說明之習知裝置及方法的問題而作成者，該發明之 其中一目的係有效率地提昇製品之生産性。又，該發明之 "他目的係提幵仏給至模穴内之樹脂量的信賴性。又，該 t月之進v 〃他目細均_厚度之獅樹脂供給至模穴 20 200843930 内。 【實施例2】 以下’參照圖式說明實施例2之電子零件的壓縮成形方 法及使用於該方法之裝置。 5 (電子零件之壓縮成形用模組品的構成） 首先’使用第14圖〜第20圖說明電子零件之壓縮成形 裝置1001 (以下，也稱為「裝置1001」）。 裝置1001具有··模組品、内裝載機1013、及上裝載機 (未圖示）。内裝載機1〇13係將安裝有成形前之電子零件 10 1004之基板1005及樹脂材料供給至模組品。上裝載機由模 組品取出成形後之基板。模組品具有：固定位置之上模 1002、及與上模1002相對向之可動下模1003。又，模組品 具有用以加熱樹脂之機構（未圖示）、及以預定壓力將上模 1002與下模1〇〇3緊固之機構（未圖示）。 15 又，上模1002之模面包含有基板裝設部1006。基板1005 係在電子零件1004朝向下方之狀態下裝設於基板裝設部 1006。又，下模1〇〇3具有模穴1〇〇8。模穴1008具有朝向上 方之開口 1007。又，構成模穴1〇〇8之底面的構件係可將模 穴1008内之樹脂朝上方按壓。該構件稱為按壓構件1009。 20 又，作為樹脂材料之一例之顆粒樹脂1010係供給至下 模1003之模穴1008。又，上模1〇〇2與下模1003之間係由閉 模機構以預定之壓力關閉。藉此，電子零件1004浸潰於在 模穴1008内藉由加熱而熔融之樹脂材料中。再者，顆粒樹 脂1010係藉由用以加熱下模1003之機構而熔融。又，模穴 21 200843930 1008内之熔融樹脂係由按壓構件1〇〇9所按壓。此時，產生 預定之樹脂壓。最後，電子零件1004會填封於對應於模穴 1008之形狀之樹脂成形體1011内。也就是說，電子零件係 壓縮成形。 又，雖然未加以圖示，但在下模1003設有與下模1〇〇3 之模面及模穴1008之表面連通之多數吸引孔。真空泵等真 空吸引機構會由該吸引孔將空氣強制往外部排出。藉此， 後述之離型膜1012吸附於下模1〇〇3之模面及模穴1〇〇8之表 面。 10 又，内裝載機1013可將預定量之顆粒樹脂1010供給至 模穴1008内，並且可將基板1〇〇5供給至基板裝設部1〇〇6。 藉由内裝載機1013亦可同時進行將顆粒樹脂1〇1〇供給至模 穴1008與藉由内裝載機1013將基板1005供給至基板裝設部 1006，但亦可個別進行。又，外裝載機（未圖示）可由上 15模1002與下模1003之間的空間取出模穴1008内之樹脂成形 體1011及基板1005。 又，下模1003具有：後述之用以挾持離型膜之框架 1021、及使框架1021朝上下方向移動之移動機構1〇14。又， 移動機構ιοί4具有·可於前端安裝卡止具之桿部 20 1015、及使桿部1015朝上下方向移動之汽缸（驅動機構） 1016。 (離型膜及離型膜挾持用之框架） 其次，使用第8圖說明可挾持離型膜1〇12之框架1〇21。 如第8圖所示，框架1021於其内側具有貫通孔，且具 22 200843930 有：上框架部1021a，與上框架部1021a對向之下框架部 1021b 。 離型膜1012係由上框架部1021a與下框架部1021b所挾 持。藉此，離型膜1012以預定力被拉伸。以下，挾持有離 5 型膜1012之框架1021稱為附有薄膜之框架1022。又，離型 膜1012亦可延伸到附有薄膜之框架1〇22之外側。又，附有 薄膜之框架1022安裝有用以卡止其周緣部之卡止具1〇23。 進而，卡止具1023構成為可分別安裝於内裝載機1013 之移動機構1017 (桿部1018之前端）及下模1〇〇3之移動機 10 構1014 (桿部1015前端）或由該等處拆下。 使用裝置1001時，卡止具1023係由内裝載機1〇13之移 動機構1017交接到下模1〇〇3之移動機構1〇14。藉此，卡止 具1023及附有薄膜之框架1〇22沿著桿部1〇15往下方移動。 又，離型膜1012係由捲筒狀之膜所拉出之膜切斷成預 15定大小者。又，離型膜1012係切斷成對應於具有模穴1〇〇8 之下模1003之模面大小所須之最小限度的大小。又，離型 膜1012之大小只要係可完全被覆下模1〇〇3之模面左右之大 小即可，可考慮由上框架部1〇21a與下框架部1〇21b所挾持 之部分的大小來決定。因此，離型膜1〇12之大小會稍大於 2〇 下模1003之模面。 因此，實施例2之電子零件之壓縮成形方法中，相較於 離型膜由送出幸昆子往模組品送出並且藉由捲取幸昆子捲取之 捲繞供給方式，可減少丨次黯成形所需之離龍之大小。 具體而言，根據本實施例之電子零件的壓縮成形方法捲 23 200843930 取供給方式中所需之存在於送出輥子與模組品之間之離型 膜及存在於模組品與捲取輥子之間的離型膜大部分都變得 不需要。因此，可減少離型膜的消耗量。 (樹脂收容用模板） 5 其次，使用第9圖說明用以將顆粒樹脂1010供給至模穴 1008内之模板1031 (盤）。 模板1031具有收容預定量之顆粒樹脂1〇1〇之樹脂收容 空間（凹部）1032。樹脂收容空間丨〇32具有開口 1033。模 板1031具有收容開口 1〇33之周緣部1〇34。 1〇 預疋置之顆粒樹脂1〇1〇係如第9圖所示，藉由後述之供 給機構1041投入模板1031之樹脂收容空間1032。顆粒樹脂 1010具有在模板1031内為均一之厚度。又，由於顆粒樹脂 1010在樹脂收容空間1032中，在常溫具有保形性，因此具 有均一之厚度。也就是說，顆粒樹脂1010具有薄片形狀。 15然而，顆粒樹脂1010係彼此未熔接之多數顆粒之集合體。 因此，在顆粒之間形成有連通孔。也就是說，顆粒樹脂1〇1〇 係成海綿狀。又，樹脂收容空間1032係對應於模穴1〇〇8之 凹部。因此，如後所述，預定量之顆粒樹脂1〇1〇一面維持 具有均一厚度之狀態，並由樹脂收容空間1〇32供給至模穴 20 1008 。 又’如後所述，當模板10 31翻轉時，樹脂收容空間丨〇 3 2 内具有均一厚度之顆粒樹脂1010會由下模1〇〇3之模面的位 置落下至模穴麵之底面的位置。此時，顆粒樹脂麵會 韓持均-厚度之狀態下進行供給。因此，相較於顆粒樹 24 200843930 脂1010在模穴1〇08内具有凸狀之情況，顆粒樹脂1010在模 穴1008内由下面朝上面以均一的速度熔融。 進而，各個顆粒樹脂1〇1〇自體内部所含之空氣及水分 會通過構成顆粒樹脂1010之顆粒之間的連通孔（連通路 5 徑），由顆粒樹脂ι〇10之下面側往上面側均一且自然地移 動。因此，可防止在模穴1〇〇8内所成形之樹脂成形體1011 發生空隙等。 如第11圖所示，周緣部1〇34及開口 1033係由離型膜 1012所被覆。藉此，收容有顆粒樹脂1010之樹脂收容空間 10 1032會由離型膜1〇12所封閉。離型膜1012及附有薄膜之框 架1022則如第12圖所示，在翻轉後，藉由設置於内裝載機 1013之移動機構1017移動。 又’内裝載機1013係如第13圖所示，可將翻轉之模板 1031載置於下模1003上，使模穴1008與樹脂收容空間1〇32 15夾著離型膜1〇12相鄰。又，如第13圖所示，經翻轉之模板 1031之開口 1033、離型膜1012、及模穴1〇〇8之開口 1〇〇7實 貝上會重疊於同一位置。又，離型膜1012成為由下模1003 與經翻轉之模板1031挾持之狀態。 藉此，树脂收容空間1032與模穴1〇〇8内之空間形成封 20鎖空間。又，封鎖空間由離型膜1〇12所分隔。然後，離型 膜⑻2吸附於模穴刚8，成為沿著模穴麵之形狀的形 狀。也就是說，離型膜1012由開口删之位置移動到模穴 1008之表面的位置。 進而’隨著離型膜1012之移動，顆粒樹脂1〇1〇由樹脂 25 200843930 收容空間1032落下至模穴1〇〇8。因此，可防止顆粒樹脂1〇1〇 往樹脂收容空間1032及模穴1〇〇8之外部飛散。因此，可防 止顆粒樹脂1010因為落下於下模10〇3之模面上或落下於基 板1005上時之衝擊所造成之飛散而附著於模面上等。其結 5果可防止模面上等殘存有樹脂屑等異物。其結果可提升製 品之生産性。 (真空吸引機構之構成） 其次，說明使離型膜緊密附著於模板之真空吸引機構。 雖然沒有加以圖示，但樹脂收容用之模板1〇31設有— 10真空吸引機構，可由藉由離型膜1012所封閉之樹脂收容空 間1032強制將空氣朝外部排出。真空吸引機構係具有如真 空泵。模板1031之樹脂收容空間1032設有開關閥。開關閱 與真空吸引機構之間通過真空管等之真空路徑而連通。開 關閥可安裝於真空管及由該處拆下。 15 當打開模板1031之開關閥時，真空吸引機構會通過真 空管及開關閥而由樹脂收容空間丨〇 3 2往外部強制將空氣排 出。然後，當關閉開關閥時，樹脂收容空間1032會設定成 預定之真空度。藉此，離型膜1012可被覆且固定於模板 1031。又，其次，亦可由模板1〇31及開關閥拆下真空管。 20 在模板1031之開口 1033由離型膜1012被覆之狀態下， 對樹脂收容空間1032施行真空吸引。藉此，供給有顆粒樹 脂1010之樹脂收容空間1032設定成預定之真空度。結果， 第11圖所示’離型膜1〇12會緊密附著於樹脂收容空間1〇32 之顆粒樹脂1010。 26 200843930 又，雖然沒有加以圖示，但亦可採用將預定數之吸引 孔設置於周緣部1034，藉由真空吸引機構（包含真空管及開 關閥）使周緣部1034附近之空氣往外部強制排出之方法。藉 此，可藉由使離型膜1012吸附於周緣部1〇34，以離型膜1〇12 5堵基模板之開口 1〇33。又，可使用對樹脂收容空間丨〇32 亍真空吸引之方法，與通過設置於周緣部1034之吸引孔 施行真空吸引之方法兩者以使離型膜1012吸附於模板 1031。又，藉由通過周緣部1034之吸引孔施行真空吸引， 使離型膜1012吸附於模板1〇31之程序亦可持續執行到内裝 10載機1〇13進入上模1002與下模1〇〇3之間。又，若是藉由離 型膜1012之吸附而固定於模板1〇31，藉此抑制顆粒樹脂 1010之移動的話，亦可吸引孔連通於模穴1008，而不連通 於周緣部1034附近之空間。 (内裝載機之構成） 15 其次，說明用以將顆粒樹脂1010供給至模穴1〇08内之 内裝載機（成形前材料之供給機構）1013。 内裝載機1013係如第11圖〜第14圖所示，具有本體 1025、可安裝於本體1025及拆卸之裝卸台1〇26。又，本體 1025包含有載置安裝有電子零件1〇〇4之基板1005之基板載 20置部1027。裝卸台1026包含有··裝設模板1031之裝設部 1028、使附有薄膜之框架1022朝上下方向移動之移動機構 1017、設置成可安裝於本體1025及拆卸之基台部1〇29。又， 内裝載機1013可將安裝有電子零件1〇〇4之基板1〇〇5與顆粒 樹脂1010供給至上模1002及下模1〇〇3。 27 200843930 又，移動機構1017包含有：裝著有卡止具1〇23之桿部 1018、及使桿部;κ)18朝上下方向移動之汽缸（驅動機構） 1〇19。又，移動機構1017可使桿部1018之前端插入於卡止 具1023。又，汽缸1〇19可使卡止具1〇23朝上下方向移動。 5 又，模板1031在樹脂收容空間1032朝下方之狀態下， 裝著於裝卸台1026之裝設部1〇28。又，移動機構1〇 17可使 離型膜1012接觸模板1〇31以蓋住開口 1〇33。 又’如後所述，當顆粒樹脂1〇1〇往模穴1〇〇8供給時， 卡止具1023會卡止附有薄膜之框架1〇22，且由移動機構 ίο 1017 (桿部1〇18)交接到移動機構1014 (桿部1〇15)。顆粒 樹脂1010供給至模穴1〇08時，卡止具1〇23與附有薄膜之框 架1022—同往下方移動。 其次，說明由内裝載機1〇13拆卸之裝卸台1〇26。裝卸 台1026於其中一主表面上設有用以裝設模板1〇31之裝設部 15 1028。又’裝卸台娜於另-主表面上具有設置成本體1〇25 可拆卸之基台部1029。又，裝卸台1〇26係如第1〇圖所示， 在裝設部1028朝向上方之狀態下設置於基台部1〇29上。 然後’如第11圖所示，藉由移動機構1〇17使離型膜1〇12 朝下方移動，以盍上投入有顆粒樹脂1〇1〇之模板1〇31之開 20 口 1〇33。藉此，離型膜1012在由預定之拉伸力之狀態下被 覆於模板1031。 又，如第12圖所示，裝卸台1〇26安裝於内裝載機1〇13 後，裝設部1028安裝於内裝載機1〇13之下面。又，如第13 圖所示，當内裝載機1013插入於上模1〇〇2與下模1〇〇3之間 28 200843930 時，模穴1008之開口 1007與模板1031之開口 1〇33係相對向。 因此’使内t載機1013朝下方移動。藉此，模板 之開口 1033可在離型膜1012介於其中之狀態下，鄰接於下 模1003之開口 1007。此時，樹脂收容空間1〇32具有顆粒樹 5 脂 1010。 (樹脂材料之供給機構的構成） 其次，說明第9圖所示之供給機構1〇41。 供給機構1041係將預定量之顆粒樹脂1〇1〇供給至模板 1031之樹脂收容空間1032。供給機構1〇41具有一計量預定 10篁之顆粒樹脂1010後投入模板1031之計量投入部1042。 又，供給機構1041具有模板載置部1043。模板載置部1〇43 載置有裝著有模板1031之裴卸台1026。又，計量投入部1〇42 一面計量預定量之顆粒樹脂1〇1〇並使之振動且移動，並且 才又入模板1031之树月曰收谷空間1〇32。又，模板載置部1043 15使t卸台1026振動。藉此，模板1〇31之樹脂收容空間1〇32 内的顆粒樹脂1〇1〇可形成均一的厚度。也就是說，模板1〇31 之樹脂收容空間1032内，預定量之顆粒樹脂1〇1〇會平坦化。 又，該模板1031内具有均一厚度之顆粒樹脂1〇1〇與後 述之實施例3所揭示之經加熱後具有固定形狀之顆粒樹脂 20 1052不同，其顆粒之間係互不炼接之狀態。又，模板1031 内之顆粒樹脂1010亦可使用r刮刀」而形成均一厚度，來 取代模板載置部1043藉由振動而使顆粒樹脂1〇1〇之厚度均 〇 (使用模板内之顆粒樹脂之電子零件的壓縮成形方 29 200843930 法） 首先說明形成附有薄膜之框架1022之程序。 如第8圖所示，下框架部l〇21b之上載置預定大小之離 型膜1012。其次，離型膜1〇12之上載置上框架部i〇21a。然 5 後，上框架部1021a及下框架部1021b以預定之壓力挾持離 型膜1012。藉此，形成附有薄膜之框架1〇22。此時，挾持 於上框架部l〇21a及下框架部1021b之離型膜1〇12係以預定 之力拉伸。又，離型膜1012係可完全被覆於下模1〇〇3之模 面左右之大小，且只要具有包含挾持框架1〇2i所必要之部 1〇 分的大小即可。又，離型膜1012亦可由框架1〇21朝外方伸 出。又，上框架部1021a及下框架部l〇21b係由卡止具1〇23 所卡止。 其次’說明往樹脂收容用之模板1031供給顆粒樹脂 1010之程序。 15 如第9圖所示，裝卸台1026由内裝載機1013拆下，並使 裝設部1028朝上方載置於模板載置部1043之上。其次，模 板1031在開口 1033朝向上方之狀態下裝著於裝設部1〇28。 其次，在計量所需量之顆粒樹脂1〇1〇後，由計量投入 部1042往模板1031之樹脂收容空間1〇32投入。藉此，完成 20 供給有顆粒樹脂1010之模板1031。 此時，模板載置部1043施加振動於模板1〇31。养此， 樹脂收容空間1032内之顆粒樹脂ι010的厚度會均一。藉 此’顆粒樹脂1〇1〇形成薄片狀。此時，構成顆粒樹脂1〇19〇 之多數的顆粒同士係互不熔接。 30 200843930 其次，說明投入有顆粒樹脂1010之模板1031的開口 1033由離型膜1012被覆之程序。 首先，如第10圖所示，保持於附有薄膜之框架1022之 離型膜1012被覆於投入有顆粒樹脂1010之模板1〇31的上 面。此時，裝著於附有薄膜之框架1022之卡止具1023插入 於内裝載機1013 ( 1025)之移動機構1017之桿部1〇18之前 端0 其次，移動機構10175之汽缸1〇19往下方移動。藉此， 離型膜1012移動到供給有顆粒樹脂1010之模板1〇31的開口 10 1033。其結果是開口 1〇33由離型膜1〇12所封閉。 又，離型膜1012被覆於模板1〇31後，亦可於被覆有離 型膜1012之模板1〇31内之空間施行真空吸引。藉此，樹脂 收容空間1032設定為預定之真空度。其結果是離型膜1〇12 吸附於模板1031。 15 又’亦可與前述真空吸引同時施行用以通過周緣部 1034之吸引孔使離型膜1012往周緣部1〇34吸附之真空吸 弓卜又’亦可僅施行通過周緣部1〇34之吸引孔使離型膜1〇12 往周緣部1034吸附之真空吸引。 其次，裝卸台1026由模板載置部1〇43拆卸。此時，如 20第11圖所示，裝卸台1〇26具有：附有薄膜之框架1〇22、及 投入預定量之顆粒樹脂1010且施行真空吸引之模板1031。 其次，說明裝卸台1026在具有供給有顆粒樹脂1〇1〇之 板板1031、與挾持著離型膜之附有薄膜之框架1〇22之狀態 下，裝著於内裝載機1013之本體1025之程序。 31 200843930 首先，將第11圖所示之裝卸台1026翻面。此時，模板 1031被覆有離型膜1012之面定位於裝卸台1〇26之下側。其 次，在模板1031翻面之狀態下，於本體1〇25安裝裝卸台1026 之基台部1029。藉此，形成第12圖所示之内裝載機1013。 5此時，顆粒樹脂丨〇1〇在具有均一厚度之狀態下，存在於開 口 1033由離型膜1012封閉之樹脂收容空間1032内。 其次，使用第13圖及第14圖，說明顆粒樹脂供給至模 穴内之程序。 如第13圖所示，首先，内裝載機1〇13插入上模1〇〇2與 10下模1003之間。其次，内裝載機1〇13移動到上方。藉此， 基板1005在電子零件1004朝向下方之狀態下裝設於上模 1002之基板裝設部1006。其次，内裝載機1〇13朝下方移動。 藉此，内裝載機1013之下面接觸於下模1〇〇3之模面。又， 模板1031之開口 1033、模穴1008之開口 1〇〇7、及離型膜ι〇12 I5 係大略定位於同一平面内。 其次，如第14圖所示，卡止具1〇23在卡止附有薄膜之 框架1022之狀態下，由内裝載機1〇13之桿部1〇18的前端拆 卸，安裝於移動機構1014中之桿部1〇15的前端。也就是說， 卡止具1023係由桿部1018往桿部1015交接。 20 又，移動機構1014朝下方移動。藉此，離型膜1012在 施加預定拉伸力之狀態下被覆於下模1003之模面。然後， 由模穴1008將空氣強制排出。藉此，離型膜1012緊密附著 於模穴1008的表面。此時，設置於模板1〇31之真空泵停止 真空吸引，藉此模板1031之樹脂收容空間1〇32由真空狀能 32 200843930 變化成常壓狀態。 藉此，如第14圖所示，在離型膜1〇12被覆於模穴1〇〇8 表面之狀態下，顆粒樹脂1〇1〇由樹脂收容空間1032往模穴 1008落下。顆粒樹脂1010與離型膜1012在具有均一厚度之 5狀悲下，落下至模穴1〇〇8的底面。其次，如第15圖所示， 内裝載機1013朝上方移動後，由上模1〇〇2與下模1〇〇3之間 的空間取出。 又’必須除去殘存於樹脂收容空間1〇32内之顆粒樹脂 1010時，在下模1〇〇3之模面與模板1〇31下面之間形成了預 10疋空間之狀悲下，模板1031亦可朝水平方向或上下方向振 動。糟此，幾乎全部的顆粒樹脂1 〇 1 〇會由樹脂收容空間1032 往模穴1008落下。此種情況下，亦可具有内裝載機1〇32對 模板1031施與振動之機構。 其次’如第16圖所示，關閉上模1〇〇2與下模1〇〇3。此 15時，顆粒樹脂101〇在被覆有離型膜1012之模穴1〇〇8内因加 熱而熔融。因此，安裝於基板1〇05電子零件1〇〇4浸潰於熔 融樹脂。然後，按壓構件1009對模穴1〇〇8内之熔融樹脂施 加預定壓力。 在經過使熔融樹脂硬化所必須之時間後，打開上模 20 1002與下模1003。藉此，在模穴1008内形成對應於模穴ι〇08 之形狀的樹脂成形體1011。電子零件1004填封於樹脂成形 體1011内。藉此，完成壓縮成形。其次，上裝載機由裝置 1001取出成形完成基板、即基板1〇〇5及樹脂成形體loii。 根據上述方法，顆粒樹脂1〇1〇在由下模1〇〇3與模板 33 200843930 1031形成之密閉空間内，由樹脂收容空間1〇32往模穴1〇〇8 移動，顆粒樹脂1010不會飛散而往樹脂收容空間1032及模 穴1008以外的部位附著。因此，可防止顆粒樹脂1〇1〇殘存 於下模1〇〇3之模面或基板1〇〇5成為樹脂屑等的異物1112。 5因此，可提升作為製品之樹脂成形體ion的生産性。 又，根據上述方法，顆粒樹脂1〇1〇保持其形狀，然後 供給到模穴1008。因此，可提升供給至模穴1〇〇8之樹脂量 的信賴性。 又，根據上述方法，顆粒樹脂1〇1〇在具有均一厚度之 10狀怨下供給至模穴1〇〇8。因此，可使顆粒樹脂1〇1〇有效率 地在厚度方向上均一地溶融。 又，根據上述方法，樹脂收容空間1〇32中，顆粒樹脂 1010係具有連通孔。因此，當顆粒樹脂1010在模穴1〇〇8内 加熱而熔融時，顆粒樹脂1〇1〇内部所含之空氣及水分等會 15通過連通孔而自然往外部排出。結果，可防止空隙等殘存 於樹脂成形體。又，推測按壓各個顆粒樹脂1〇1〇後，成為 多數顆粒之間的間隙之多數連通孔會消失。 【實施例3】 以下，根據圖式，詳細說明本發明之實施例3之電子零 20 件的壓縮成形方法。 (模組品之構成） 首先，如第21圖所示，電子零件之壓縮成形裝置1〇5〇 中，基本的構成構件、特別是模組品的構成構件與實施例2 (參照第13圖〜第16圖）中所說明之模組品相同。因此， 34 200843930 该等之構成構件則標上互為相同之標號，不重複該等之構 成構件之說明。 (預備加熱機構） 如第17圖及第18圖所示，本實施例之電子零件的壓縮 5成开7叙置1050具有預備加熱機構1〇51。預備加熱機構1〇51 在將顆粒樹脂1〇10供給至模穴1〇〇8之前，不會按壓顆粒樹 脂1〇1〇，而是藉由將顆粒樹脂1〇1〇加熱而使顆粒樹脂ι〇ι〇 全體的厚度均一化。 如第17圖及第18圖所示，預備加熱機構1〇51具有：加 1〇熱°卩1〇53、藉由加熱部1〇53進行加熱之加熱面1〇56。加熱 面1056載置有已載置框架1054之離型膜1〇55。又，預備加 熱機構1051具有關閉框架1054之上側開口之蓋構件1057。 加熱部1053之加熱面1056通過離型膜1055將供給至離型膜 1055上之框架1054内且具有均一厚度之顆粒樹脂1〇1〇加 15 熱。結果形成具有均一厚度之顆粒樹脂1052。 又，如後所述，顆粒樹脂1010或1052與蓋構件1057之 間設有預定間隔。因此，蓋構件1057不會接觸到顆粒樹脂 1052。又，雖然沒有圖示，但預備加熱機構1051具有用以 將顆粒樹脂1010投入離型膜1055上之框架1054内之機構。 2〇 (顆粒樹脂） 框架1054内之顆粒樹脂1010藉由平坦化機構形成均一 的厚度。又，使樹脂材料平坦化之機構可使用利用振動之 機構、或「刮刀」等。又，如第17圖及第18圖所示，顆粒 樹脂1010係在離型膜1055介於其中之狀態下裝設於加熱面 35 200843930 1056上。框架1054内之顆粒樹脂1〇1〇可預先加熱，即可以 使用再加熱而再溶融程度的溫度加熱。此時，框架1〇54内 之顆粒樹脂1010形成均一的厚度。結果，形成薄片狀之顆 粒樹脂1052。 5 如此，由於顆粒樹脂1〇52的厚度均一化，因此顆粒樹 脂1052全體可均一地溶融。又，顆粒樹脂1〇52係顆粒之間 表面的一部藉由加熱而互相熔接之集合體。因此，顆粒樹 脂1052係海綿狀。又，海綿狀之顆粒樹脂1〇52與藉由加熱 熔融之樹脂材料、藉由按壓固定之樹脂材料、及混煉粉末 1〇樹脂等之樹脂材料不同，其特徵在於其内部具有連通孔。 又’如第20圖所示，亦可在未使用框架1〇54之狀態下， 將在離型膜1055上具有均一厚度之顆粒樹脂1〇52供給至第 21圖所不之壓縮成形裝置1〇5〇。又，顆粒樹脂（集合體） 1052亦可預先加熱到可藉由再加熱而再溶融之程度的溫 15度，亦可加熱到安裝於基板1005之電子零件1〇〇4可壓縮成 形之程度的溫度。 又，當顆粒樹脂1010加熱時，框架1054之上側開口亦 可以盍構件1057覆蓋。此種情況下，顆粒樹脂1〇1〇在框架 W54内由下層部均一地加熱到上層部。 2〇 又，亦可於框架1054之上側開口上設置加熱部1〇58取 代蓋構件1057。又，框架1054内之顆粒樹脂1010亦可在預 定間隔以加熱部進行加熱。此種情況下，與使用蓋構件1〇57 的6況相同，框架1054内之顆粒樹脂1〇1〇由其下層部均一 地加熱到上層部。 36 200843930 (藉由加熱顆粒樹脂進行之電子零件的壓縮成形方 法） 其次，如第21圖所示，說明使用顆粒樹脂1052實行壓 縮成形之方法。 5 首先，如第21圖所示，離型膜1055之端部由内裝載機 1059所挾持。此時，顆粒樹脂1〇52在離型膜1〇55上且存在 於載置於離型膜1055上之框架1054内。其次，内裝載機1059 插入上模1〇〇2與下模1〇〇3之間的空間。然後，内裝載機1〇59 往下方移動。藉此，離型膜1055與模穴1〇〇8的表面接觸。 10 與此同時，框架1〇54在離型膜1055置於其中之狀態下，載 置於下模1〇〇3之模面上。 其次，藉由真空吸引將空氣由下模1003之模面及模穴 1008内之空間強制排出。離型膜1055緊密附著於下模1〇〇3 之模面及模穴1008之表面。此時，顆粒樹脂1〇52在載置於 15離型膜1055之狀態下，由下模1〇〇3之模面落下到模穴1008 的底面。 其次，關閉上模1002與下模1003。藉此，裝著於基板 1005之電子零件刪在模穴麵内浸潰於藉由加熱而炼融 之樹脂材料内。然後，在經過熔融之樹脂材料硬化所必要 之時間後，打開上模1002與下模1003。藉此，電子零件腦 在模穴1008内填封於對應於模穴麵之形狀之樹脂成形體 1011 内。 藉由上述實施例3之電子零件的壓縮成形方法也可達 到與實施例2之電子零件的壓縮成形方法同樣之效果。 37 200843930 再者，使用於實施例3之離型膜1〇55與實施例2同樣具 有對應於具有模穴1008之下模1003之模面大小的大小: 又，該離型膜1055係藉由捲取狀之離型膜的拉出及切斷而 作成。 5 (其他實施例之顆粒樹脂） 亦可使用在常溫下保持一定形狀（厚度）之樹脂材料， 來取代上述實施例之顆粒樹脂。該樹脂材料也可藉由振動 而均一化。又，亦可使用刮刀等使樹脂材料之厚度均一化。 再者，使用在常溫保持一定形狀之樹脂材料時，係如使用 10在常溫下不會保持一定形狀之樹脂材料時，不需要使用預 備加熱機構1051進行預備加熱。再者，使用在常溫下保持 一疋形狀（厚度）之樹脂材料時，也可與使用在常溫下不 會保持一定形狀之樹脂材料時所得之效果同樣的效果。 又，各實施例中，亦可使用熱可塑性之樹脂材料來取 ^ 代熱硬化性之樹脂材料。又，各實施例中，亦可使用呈有 預定粒徑分布之粉狀狀樹脂材料或粉末狀樹脂材料等各種 樹脂材料來取代顆粒狀樹脂材料。進而，各實施例中，亦 可使用石夕系之樹脂材料或環氧系之樹脂材料來取代樹脂材 料。又，樹脂材料亦可使用具有透明性之樹脂材料、具有 〇半透明性之樹脂材料、含有燐光物資、及螢光物質之樹月匕 材料等任何樹脂材料。又，上述各實施例中，亦可使用在 常溫且在常壓之環境下為液體狀之液狀樹脂來取代顆粒樹 脂。 、 與在前述背景技術攔中所述之習知技術同樣之習知技 38 200843930 術，係如第47圖所示，進行使用電子零件之壓縮成形裝置 之模組品，藉由樹脂材料將安裝於基板之電子零件壓縮成 形之方法。 該方法中，使用搭載於電子零件之壓縮成形裝置21〇1 5之模組品。模組品具有上模2102與下模2103。該裝置中， 顆粒樹脂2106供給至被覆有離型膜21〇4之模穴21〇5内。在 該狀態下，顆粒樹脂2106可藉由加熱而熔融。然後，關閉 上模2102與下模2103。藉此，安裝於基板2121之電子零件 2122浸潰於模穴2105内之溶融的樹脂材料中。又，藉由底 10面構件2107對模穴2105内之熔融樹脂施加壓力。藉此，形 成對應於模八2105之形狀之樹脂成形體。其結果，藉由樹 脂成形體填封電子零件。 又，如第47圖所示，使用供給機構21〇8以將顆粒樹脂 2106供給至模穴2105内。供給機構2108具有貫通孔21〇9、 15與設置於其下部側之遮板2110。又，藉由供給機構21 〇8打 開遮板2110 ’顆粒樹脂2106由貫通孔2109内之空間往模穴 2105落下。 根據第47圖所示之習知之壓縮成形裝置，供給機構 2108與模穴2105之底面之間的距離相當大。因此，當顆粒 20 樹脂2106碰撞到模穴2105之底面時，附著於顆粒樹脂2106 之粉末容易飛散。又，附著於顆粒樹脂2106或顆粒樹脂2106 之粉末會因為碰撞到模穴2105之底面而飛散，因此，附著 於被覆於下模2103之模面之離型膜2104及未被覆有離型膜 之下模2103的一部分。結果，在下模2103之模面及基板2121 39 200843930 殘存有樹脂屑等之異物（硬化物）。因此，必須藉由清潔而 除去附著於下模21〇3之異物。又，會因附著於基板之異物 而使製品之成品率降低。結果製品的生産性降低。 又，也有因顆粒樹脂2106的附著而使遮板211〇沒有動 作因此，必須中斷壓縮成形裝置的使用。結果，製品之 生産性降低。 又，貫通孔2109之周面殘存有顆粒樹脂21〇6之一部份 2106a。因此，無法以高精確度將顆粒樹脂刀㈨往模穴 供給。結果，無法提昇對供給至模穴之顆粒樹脂21〇6之樹 10脂量的信賴性。 又模八2105内之顆粒樹脂21〇6的厚度會不均一。例 如，顆粒樹脂2106會形成凸狀等。此種情況下，無法在模 八2105内將顆粒樹脂21〇6均等地加熱。因此，會發生樹脂 材料中由其他部分分離之部分殘存等不良狀況發生。 15 又，前述問題在使用粉狀樹脂、粉末樹脂、或液狀樹 脂等其他樹脂材料以取代顆粒樹脂時也會發生。 以下所述之實施例4〜7所揭示之發明係為了解決使用 W述第47圖說明之習知裝置及法之問題而作成者，其發明 目的係提昇壓縮成形所製得之製品的生産性。又，本發明 2〇 之其他目的提昇往模穴供給之樹脂材料之樹脂量的信賴 性。又，本發明之其他目的係可以均一厚度將樹脂材料供 給至模穴内。又，本發明之其他目的可提升在模穴内壓縮 成形之樹脂成形體的品質及信賴性。 【實施例4】 200843930 以下，參照圖面詳細說明本發明之實施例之電子零件 的壓縮成形方法及使用於該方法之裝置。 (電子零件之壓縮成形裝置之構成） 首先，使用第31圖〜第34圖，說明電子零件之壓縮成 5形裝置2001 (以下，也單稱為「裝置2001」。）之模組品。 裳置2001具有：模組品、及將裝著有電子零件2005之 基板2006及顆粒狀之顆粒樹脂2007同時或個別供給至模組 品之内裝載機2002。又，裝置2001具有由模組品取出基板 2006之上裝載機（無圖示）。 0 又，模組品具有：位置固定之上模2003、及配置成與 上模2003對向之可動下模2004。裝置2001具有將上模2〇〇3 及下模2004加熱到預定溫度之機構（無圖示）。又，裝置2〇〇1 具有可以預定壓力關閉上模2003及下模2004之閉模機構 (無圖示）。 5 又，上模2003具有一基板裝設部2008，基板裝設部2008 係在電子零件2005朝向下方之狀態下裝設安裝有電子零件 2005之基板2006。又，下模2004設有具有朝上方之開口 2009 之模穴2010。又，模穴2〇1〇之底面係由朝上方按壓模穴2010 内之顆粒樹脂2007之底面構件2011所構成。 〇 裝置2001中，基板2〇〇6係在電子零件2005朝向下方之 狀態下裝設於上模2003之基板裝設部2008。又，顆粒樹脂 2007供給至下模2004O模穴2010内。又，上模2003及下模 2004係以預定之壓力關閉。藉此，電子零件2005浸潰於在 模穴2010内熔融之樹脂材料中。 200843930 又，模穴2010内之熔融樹脂係被底面構件2〇11所按 壓。藉此，對模穴2〇1〇内之熔融樹脂施加預定壓力。又， 在模穴2010内形成對應於模穴2〇1〇之形狀之樹脂成形體 2012。電子零件填封於該樹脂成形體2〇12内。 5 下模2004雖未加以圖示，但其兩端分別具有連通於模 穴2010及真空管之預定數的吸引孔。真空管為真空路徑之 一例。又，下模2004具有一經由吸引孔而將模穴2〇1〇内之 空氣強制往外部排出之真空泵。真空泵為真空吸引機構之 一例。真空吸引機構由模穴2010内之空間經由吸引孔而往 10外部空間強制將空氣排氣。藉此，具有凹部之薄膜2015之 凹部2014吸附於模穴2010。其結果是凹部2014插入模穴 2010。此時，顆粒樹脂2〇〇7在凹部2014内平坦化。 (供給機構） 又，裝置2001係如第23圖〜第28圖所示，於模組品的 15 外部具有供給機構2021，且供給機構2021係將顆粒樹脂 2007供給至具有凹部之薄膜2015之凹部2014。又，供給機 構2021具有：成形機構2022、投入機構2023、藉由振動使 顆粒樹脂2007平坦化之機構（無圖示）。 成形機構2022係如第23圖〜第25圖所示，於離型膜 20 2013形成對應於模穴2010形狀之凹部2014。投入機構2023 係如第26圖所示，計量顆粒樹脂2007後，往凹部2014供給 預定量之顆粒樹脂2007。藉由振動使顆粒樹脂2007平坦化 之機構係如第27圖所示，藉由使模2024振動，使凹部2014 内之顆粒樹脂2007振動。藉此，顆粒樹脂2007在凹部2014 42 200843930 内平坦化。凹部2014中預定量之顆粒樹脂2007呈具有均一 厚度之狀態。 (成形機構） 成形機構2022於離型膜2013形成具有對應於模穴2010 5之形狀之凹部2014之具有凹部之薄膜2〇15 °又’如第23圖 〜第25圖所示，成形機構2022具有：裝設有離型膜2013之 模2024、及藉由按壓使離型膜2013成形之沖壓機2025。又’ 模2024係設置於供給機構2021之基台上。又，模2024具有 用以使離型膜2013成形之凹部2026。又，模2024成為成形 10 面 2027。 成形機構2022中，如第23圖所示，在離型膜2013裝設 於成形面2027之狀態下，則如第24圖所示，沖壓機2025將 離型膜2013往凹部2026壓入。藉此，如第25圖所示，於離 型膜2013形成對應於模2024之凹部2026之凹部2014。也就 15 是說，執行離型膜2013之壓製成形。又，如第25圖所示， 凹部2014具有對應於模穴2010之形狀。 又，如後所述，供給有顆粒樹脂2007且具有凹部之薄 膜2015插入模穴2010。此時，顆粒樹脂2007在平坦化之狀 態下具有一定形狀。又，凹部2014藉由在模穴2〇1〇内之真 20 空吸引進行之吸附而伸長，因此宜小於模穴2010之形狀。 雖然沒有加以圖示，但由凹部2026之表面及成形面 2027經由模2024之内部往外部連通之吸引孔係延伸的。成 形機構2022具有一由凹部2026内之空間通過吸引孔往外部 空間將空氣強制排出之真空吸引機構。藉由該真空吸弓丨機 43 200843930 構之作用，離型膜2013形成具有對應於凹部2026之形狀之 凹部2014之具有凹部之薄膜2015。 (投入機構） 又，供給機構2021係如第26圖所示，具有一計量顆粒樹 5 脂2007，並將預定量之顆粒樹脂2007供給至凹部2014之投 入機構2023。再者，供給機構2021亦可具有計量機構（無 圖示），該計量機構與具有凹部之薄膜2015同時計量供給至 模頭2024之凹部2014之顆粒樹脂2007。 (振動使顆粒樹脂平坦化之機構） 10 又，裝置2001中雖然沒有圖式，但設有使供給機構2021 之基台朝水平方向或垂直方向振動之機構。如第27圖所 示，該機構係使基台振動。藉此，模2024振動。其結果是 顆粒樹脂2007藉由在具有凹部之薄膜2015之凹部2014内振 動而平坦化。其結果是，在凹部2014内形成具有預定量之 15 均一厚度之顆粒樹脂2007。 再者，如第28圖所示，亦可藉由按壓平坦具2028按壓 顆粒樹脂2007，凹部2014内之顆粒樹脂2007形成均一之厚 度。又，亦可使用「刮刀」作為使顆粒樹脂2〇〇7平坦化之 器具。 2〇 (内裝載機） 裝置2001具有將顆粒樹脂2007供給至模組品之内裝載 機2002。内裝載機2002具有作為將樹脂材料往模穴供給之 機構的機能。又，内裝載機2002係如第29圖所示，具有： 平板狀之本體2031、及用以使離型膜2013吸附於本體2〇31 44 200843930 之下面2032之機構（無圖示）。因此，如第3〇圖所示，具有 凹部之薄膜2015吸附於本體2031之下面2032。 又’用以吸附離型膜2013之機構雖然未加以圖示，但 具有··由本體2031之下面2032通過其内部而延伸之吸引 5孔、通過吸引孔將空氣強制排出之真空泵、及使吸引孔與 真空泵連通之真空管等。該等為真空吸引機構。真空吸引 機構由本體2031之下面2032之附近的空間經由吸引孔及真 空管往其他空間強制排出空氣。藉此，具有凹部之薄膜2〇15 吸附於本體2031之下面2032。 10 又，本體2031雖然未加以圖示，但具有可使本體2〇31 振動而使顆粒樹脂2007平坦化之機構。因此，該機構可藉 由使本體2031振動，而使凹部2014内之顆粒樹脂2007振 動。據此，凹部2014内之顆粒樹脂2007平坦化。其結果是 具有均一厚度之顆粒樹脂2007形成於凹部2014内。又，當 15 載置有顆粒樹脂2007之具有凹部之薄膜2015藉由内裝載機 2002搬送時，若顆粒樹脂2007之厚度為不均一時，亦可藉 由前述之機構使離型膜2013振動，使顆粒樹脂2007平坦化。 (樹脂材料之供給方法） 首先，如第23圖〜第25圖所示，說明設置於供給機構 20 2021之基台之成形機構2022形成具有凹部之薄膜2015之步 驟。 如第23圖所示，於模2024上裝設離型膜2013。其次， 如第24圖所示，沖壓機2025按壓離型膜2013。藉此，離型 膜2013由模2024之凹部2026與對應於凹部2026之沖壓機 45 200843930 2025所挾持。其結果如第25圖所示，於離型膜2013形成凹 部2014。 又，如第23圖〜第25圖所示，亦可僅使用模2024形成 薄膜來取代使用成形機構2022形成薄膜。又，在離型膜2013 5裝設於模2024之成形面2027之狀態下，亦可藉由凹部2026 内之空間通過在模2024内部延伸之吸引孔往外部空間強制 排出空氣，形成對應於凹部2026之形狀之凹部2014。 其次，如第26圖所示，投入機構2023將顆粒樹脂2007 投入凹部2014内。其次，如第27圖所示，用以令裝置2001 10所具有之顆粒樹脂平坦化之機構使供給機構2021之基台、 模2024、及具有凹部之薄膜2015振動。藉此，對凹部2014 内之顆粒樹脂2007施加振動。其結果，顆粒樹脂2007在凹 部2014内平坦化。因此，顆粒樹脂2〇〇7在凹部2〇14内具有 均一厚度。又，以後，設有具有均一厚度之顆粒樹脂2〇〇7 15供給之凹部2014之具有凹部之薄膜2015也稱為平坦化樹脂 載置膜2016。 (樹脂材料之搬送）[Delayed Mode I Detailed Description of Preferred Embodiments Next] A method of compression molding of an electronic component according to an embodiment of the present invention and an apparatus used therefor will be described.  10 Example 1 Below, A compression molding method for an electronic component according to an embodiment of the present invention and an apparatus used therefor will be described with reference to the drawings.  (Device including a module for compression molding of electronic parts) First, A device including the module used in the compression molding method of the electronic component of the present invention will be described.  As shown in Figure 4 to Figure 6, Module 1 has a fixed upper die 2  And a movable lower die 3 disposed opposite to the upper die 2. The mold surface of the upper mold 2 is provided with a substrate mounting portion 4. The lower mold 3 is provided with a cavity 5 for compression molding.  The compression molding apparatus of this embodiment has Internal loader 9, External loader 20 (not shown), Heating mechanism (not shown), And closed mold mechanism (not shown).  The inner loader 9 supplies the substrate 8 (formed front substrate) on which the granular resin 6 and the electronic component 7 are mounted, either simultaneously or individually, to a space between the upper mold 2 and the lower mold 3.  The external loader is taken out of the module by the module product! Compressed, That is, the resin-filled substrate 8 is used. The heating mechanism heats the module to a predetermined temperature. Closing 11 200843930 The mold mechanism closes the upper mold 2 and the lower mold 5 10 by the pressure of the shape. The electronic component 7 is attached to the opening 1G of the substrate cavity 5 in a state of facing the lower mold 3 toward the upper mold 2. The lower mold 3 is provided with a suction mechanism for adsorbing the release film U toward the cavity 5. also, The attraction mechanism has a suction hole, Vacuum path, And vacuum suction mechanism. The suction hole system is disposed inside the lower mold 3, The surface of the lower mold 3 and the surface of the cavity 5 are accessible.  , Further, the inner loader 9 has a locking portion 9a at its lower portion. The locking portion 9a is for locking the template (10) for resin accommodation as shown in Fig. 2 . also, The interior loader 9 has a substrate mounting portion % at its upper portion. The substrate 8 is placed on the substrate placing portion 9b with the electronic component 7 facing downward.  In the shrink forming device of the present embodiment, A release film 1 as shown in Fig. 2 is applied to the surface of the lower mold 3 and the surface of the cavity 5. The inner carrier 9 can supply the particulate resin 6 into the cavity 5 covered with the release film. also, The inner loader 9 can mount the substrate 8 on which the electronic component 7 is mounted to the base 15 mounting portion 4.  The module 1 is closed by a predetermined pressure by a mold closing mechanism. The cavity 5 is heated by a heating mechanism. also, The resin material 6 is melted in the cavity 5. Therefore, The electronic component 7 is immersed in the molten resin material 6. also, A predetermined pressure is applied to the resin material 6 in the cavity 5. According to the device of the present example, The electronic zero-piece 7 is filled in the resin molded body 12 corresponding to the shape of the cavity 5. also, The mechanism for supplying the pellet resin 6 to the module 1 is the resin containing template 21 described in the drawings to Fig. 3.  (Configuration of template for resin storage) As shown in Figs. 1 to 3, Resin housing template 21, That is, the tray system 12 200843930 has a resin accommodating space (concave portion) 22 which can accommodate a predetermined amount of the particulate resin 6. The resin accommodating space 22 has an opening 23. A peripheral portion 24 is provided around the opening 23. also, The resin accommodating space 22 corresponds to the recessed portion of the cavity 5.  The particulate resin 6 supplied to the resin accommodating space 22 has a sheet 5 shape due to the entire system. So when it falls, Suitable for the shape of the cavity 5.  When performing compression forming, First, as shown in Figure 1, A predetermined amount of the particulate resin 6 is accommodated in the resin accommodating space 22 on the template 21. Secondly, As shown in Figure 2, A release film 11 of a predetermined size is applied to the peripheral portion 24 and the opening 23. With this,  The opening 23 of the resin containing space 22 in which the particulate resin 6 is housed is closed by the release film 11 1〇.  (Composition of vacuum suction mechanism in the template) Although not shown, However, the template 21 is provided with a vacuum suction mechanism. The vacuum suction mechanism forcibly discharges air from the inside of the resin accommodating space 22 enclosed by the release film 11 to the outside. The vacuum suction mechanism has a vacuum pump, etc. Set 15 on the switch valve of the body of the template 21, And a vacuum path such as a vacuum tube that connects the switching valve to a vacuum pump or the like. The vacuum tube is configured to be mounted to an on-off valve or disassembled.  To use a vacuum suction mechanism, First open the on-off valve. Secondly, The air is forcibly discharged to the outside by the resin accommodating space 22 by a vacuum pump and through a vacuum path. then, Close the on/off valve. With this, The space in the resin accommodating space 22 is set at a predetermined degree of vacuum. the result, The release film 11 is coated and fixed to the template 21. With this, A template 25 in which the resin supply is completed is formed. also, after that,  The vacuum tube can also be removed by the on-off valve of the template 25. also, The present invention will be described later, As can be seen from Figures 2 and 3, The template 25 supplied with the resin is inserted into the space between the upper mold 2 and the lower mold 3 after being turned over.  13 200843930 Again, A plurality of suction holes are provided in the peripheral portion 24. The air of the resin accommodating space lake is forcibly discharged by the suction hole by the vacuum suction mechanism. also, It is also possible to adsorb the release film 11 to the peripheral portion 24, The opening of the template 21 is coated on the film 11. Further, the coating of the release film 11 on the template 21 can also be attracted by vacuum in the suction hole extending into the resin receiving space 22 in the template 51.  And the vacuum suction from the peripheral portion 24 to the suction hole of the die face is performed.  Further, in the resin accommodating space 22 in the template 21, Alternatively, the vacuum suction through the suction hole passing through the peripheral portion 24 to the die face can be continued as described later. The template 25 until the resin supply is completed is inserted into the space between the upper mold 2 and the lower mold 3.  ,  (Configuration of Supply Mechanism of Resin Material) In order to supply the pellet resin 6 in the pre-twist to the template 21, As shown in Figure 1, The supply mechanism 31 is used. The supply mechanism 31 can meter the particulate resin 6. also,  15 supply mechanism 31 can supply a uniform thickness of granular resin, That is, a certain amount of resin is supplied per unit area to the resin accommodating space 22 of the template 21. also, The supply mechanism 31 has a receiving mechanism 31a that can receive the particulate resin. And a delivery mechanism 31b for discharging the granular resin.  also, The receiving mechanism 31a has an input mechanism 32 for introducing a predetermined amount of the particulate resin 6 into the resin accommodating space 22 of the die 20 plate 21, And a feed metering mechanism (dynamometer / 1 〇 cell) 33 for metering the predetermined amount of the pellet resin 6 into the mold plate 21. also, As shown in Figure 1, The input mechanism 32 has a hopper 34 for granular resin, And the linear vibrating feeder 35 is caused to vibrate and move the granular resin and then to the template 21.  200843930 I-out mechanism 31b has a template mounting portion (not shown), Vibration equalization mechanism (not shown), And template metering mechanism (dynamometer)%. The template mounting unit mounts the template 2丨. The vibration equalization mechanism is caused by the template The particulate resin 6 in the resin accommodating space 22 is vibrated. With this, The particles 5 are moved in the X direction and the γ direction on the 6th, 6th, and 6th. the result, In the resin accommodating space a, The thickness of the granules 6 is uniform. The filaments are formed to have a certain amount of particulate resin per unit area. That is, the granular resin 6 is flattened. The stencil metering mechanism 36 is measurable to measure the resin 6 to be cast into the domain board.  Further, the granular resin 6 can also be subjected to a metering procedure by the feed meter 10 mechanism 33 of the secret mechanism m, The template of the receiving mechanism claw of the tree material is measured by both the measuring procedures performed by the measuring mechanism 36. also, It can also be performed using only either of these two metering procedures.  also, When the granular resin 6 is supplied from the linear vibrating feeder % to the resin containing space 22 of the template 21, The template 21 is moved by the template mounting mechanism.  also, If the tree 21 of the template 21 has a pure space 22 and the secret of the towel _6 has a concave and convex portion, the vibration is applied by the template 21, Or the knife is turned off to make the unevenness of the granular resin 6 flat. The thickness of the granular resin (10) was made uniform.  (compression forming method for electronic parts) Cangzhi pattern, The compression molding method of the electronic component of the present invention will be described in detail.  In the compression forming method of the electronic component of the present invention, First of all, As shown in Figure ι, The supply mechanism 31 causes the particulate resin 6 to vibrate in a small amount, The linear vibrating feeder 35 descends toward the resin accommodating space 22 of the template 21. Next, the particulate resin 6 in the resin accommodating space 22 is continuously vibrated. Move in the direction of the χ or 15 200843930 γ direction. With this, The particulate resin 6 forms a certain amount of resin per unit area. the result is, The thickness of the particle tree 6 is uniform. The granular resin 6 is put into the resin accommodating space 22, The measurement is performed by the metering mechanism 33 and the feed metering mechanism 36, respectively. therefore, A predetermined amount of the particulate resin 6 is formed flat in the resin receiving space 22.  Secondly, As shown in Figure 2, The release film is placed on the template 21 to which the granule resin is supplied, To block the opening 23. then, The air is forcibly discharged to the outside by the vacuum suction mechanism from the space in the vicinity of the peripheral portion 24 and the resin accommodating space 22 through the suction holes of the die plate 21. the result, The degree of vacuum of the space in the resin accommodating space 22 is set to a predetermined value. With this, The opening 23 is covered by the release film 11, At the same time, the release film 11 is closely attached to the peripheral portion 24. therefore, Forming a template 21 coated with the release film 11 and loaded with the resin material 6, That is, the template 25 in which the resin is supplied. The movement of the resin material 6 of the template 25 is suppressed by the release film η.  15 Again, then, As shown in Figure 3, The template 25 for supplying the resin is turned over. then, The locking portion 9a of the inner loader 9 locks the flipped template 25. at this time, The substrate 8 on which the electronic component 7 is mounted is downloaded to the substrate mounting portion 9b of the internal loader 9 while the electronic component 7 is facing downward.  Secondly, As shown in Figure 4, Open the upper die 2 and the lower die 3, The inner loader 9 is inserted into the space between them. at this time, The inner loader 9 is disposed above the cavity 5. also, The substrate 8 is mounted on the substrate mounting portion 4 of the upper mold 2 with the electronic component 7 facing downward. Secondly, The template 25 abuts against the die face of the lower die 3 to cover the opening 10 of the cavity 5. at this time, The release film is covered with the template 21, Tightly attached to the die face of the lower die 3, To block the opening of the cavity 5 1〇.  16 200843930 Again, The outer peripheral portion of the release film 11 is adsorbed to the die face of the lower mold 3. With this, The outer peripheral portion of the release film 11 is held by the die face of the lower die 3 and the peripheral edge portion 24. at this time, The opening of the die 6 5 is located in a plane substantially the same as the opening 23 of the template 21.  Secondly, By opening the on-off valve, The state of the resin accommodating space 22 of the template 25 changes from a normal pressure state to a vacuum state. at this time, The air in the vicinity of the lower mold 3 is forcibly discharged to the outside through the suction holes extending to the surface of the cavity 5 and the die surface of the lower mold 3 in the lower mold 3. therefore, As shown in Figure 5, The release film is adhered to the surface of the lower mold 3 and the surface of the cavity 5. at this time, A portion of the release film 11 corresponding to the opening 10 of the cavity 5 moves into the cavity 5. Because of this, The surface of the cavity 5 is covered by the release film 11. In this state, The granule resin 6 falls from the resin accommodating space 22 at the upper position to the cavity 5 at the lower position. It is supplied to the cavity 5 to which the release film is tightly attached.  also, As shown in Figure 5, When the resin receiving space 22 of the template 21 is located above the cavity 5, The pellet resin 6 is held in a sheet shape having a thickness of 15 in the resin accommodating space 22. therefore, A predetermined amount of the particulate resin 6 can be supplied from the resin accommodating space to the cavity $.  ^ f times, The inner loader 9 is taken out from the module product 1. then, As shown in Figure 6,  right, It is closed with pre-stressed pressure. With this, Apply pre-twisting pressure to the resin in cavity 5. at this time, The electronic component 7 mounted on the substrate 8 is immersed in the mold. With this, The electronic component 7 is filled with a resin molded body 12 corresponding to the shape of the die 6.  also, In the compression forming method of the electronic component of the embodiment, The hot secret material is used. However, a thermoplastic resin material can also be used in the method of manufacturing the electronic component of the present invention.  17 200843930 Further, although the compression molding method for electronic parts of the embodiment uses a granular resin, However, it is also possible to use a powdery resin having a predetermined particle size distribution, Or other various shapes such as powder resin. also, In the above embodiment, a liquid resin which is liquid in a normal temperature and a normal pressure atmosphere may be used instead of the particle 5 resin.  Further, in the compression molding method of the electronic component of the embodiment, A resin material such as a bismuth resin or an epoxy resin material may also be used. also, In the compression forming method of the electronic component of the embodiment, It is also possible to use a transparent resin material, a resin material having translucency, Twilight matter, Or various resin materials such as a resin material containing a fluorescent material.  Further, in the compression molding method of the electronic component of the embodiment, It is also possible to supply the resin material into the template 21, Or before the resin material is supplied into the template 21, Procedure for metering resin materials.  The prior art 15 which is the same as the prior art described in the background art column is as shown in Fig. 2, a compression forming device 1101 using an electronic component, The electronic component 11〇3 mounted on the substrate 1102 is compressed into a shape by the particle resin 1104. That is, the method of resin filling. This method is carried out as follows.  First, a compression molding apparatus 1101 for electronic parts is prepared. The compression molding apparatus 1101 is equipped with a module product. The module has an upper die 1105 and a lower die 20 1106. A cavity 1107 is provided in the lower die 1106. Secondly, The particulate resin 1104 is supplied into the cavity 1107. then, The particulate resin 1104 is melted by heating.  Secondly, The upper mold 1105 and the lower mold 1106 are closed. With this, The electronic component 11〇3 was immersed in the molten pellet resin 11〇4. at this time, The pressing member 1108 constituting the bottom surface of the cavity 1107 applies a pressure of 200843930 to the granular resin 11〇4 in the cavity 1107. With this, A resin molded body corresponding to the shape of the cavity 1107 is formed. also,  The electronic component 1103 is covered with a resin molded body.  As shown in Figure 2, The particulate resin 11〇4 is supplied into the mold 6 11〇7. at this time, A supply mechanism 1109 is used. The supply mechanism 11〇9 has a through hole 11丨 that receives the resin material from the upper side opening 5, and a shutter 1111 provided at a lower portion thereof.  also, When the supply mechanism 1109 is inserted between the upper mold 11〇5 and the lower mold 1丨〇6, The shutter 1111 will be opened. With this, The opening on the lower side of the through hole 1110 is opened. Therefore, The particle resin 1104 will fall by the distance from the position of the through hole 111〇 to the position of the cavity 11〇7. As a result, the particulate resin 11〇4 is supplied to the cavity 11〇7.  10 In the compression forming method of the conventional electronic component described in FIG. 2, If the granular resin 1104 is supplied into the cavity 11〇7, The powder attached to the particulate resin 11〇4 or the particulate resin 1104 is scattered, Attached to the die face of the lower die n〇6. Therefore, After the upper mold 1105 and the lower mold 11〇6 are closed, Foreign matter (cured material) 1112 such as resin chips is easily formed on the mold surface of the lower mold 11〇6 or the substrate 1102.  15 Therefore, In order to remove foreign matter attached to the die face, Must be cleaned.  also, There is a problem caused by foreign matter attached to the substrate. As a result, the yield of the produced product deteriorates. That is, It is impossible to improve the productivity of the product. also, In order to solve this problem, The release film used as follows was reviewed.  The release film is supplied to the module by a supply mechanism. The supply mechanism has a 20-type film feed roller and a release film take-up roller. By rotating the rollers, The release film is supplied between the upper mold 1105 and the lower mold 1106. With this, The release film is coated on the surface of the lower mold 1106 and the surface of the cavity 1107. also, The particulate resin ιι 4 is supplied to the cavity 1107 coated with the release film.  however, The particulate resin 1104 adheres to the release film coated on the die face 19 200843930 of the lower mold. therefore, Foreign matter 1112 such as resin chips easily adheres to the substrate 1102.  Therefore, the same as in the case of not using a release film, The productivity of the product cannot be improved.  Further, the compression molding device 5 of the conventional electronic component explained by using Fig. 2 is opened by opening the shutter 1111. The lower side opening of the through hole 1110 is opened. By this, when the granular resin 1104 falls into the mold 6107, One portion of the particulate resin 1104 adheres to the inner peripheral surface of the through hole 111 of the supply mechanism 1109.  As a result, the amount of the resin material supplied to the cavity 1107 is insufficient. therefore, It is impossible to increase the reliability of the amount of resin supplied into the cavity.  1〇 and ‘if according to the conventional method described using Figure 2, The particulate resin 1104 will fall from the shell hole 1110 to the cavity 11〇7. at this time, Since the granular resin 1104 will scatter due to the collision with the surface of the cavity 11〇7, Therefore, a uniform thickness is not formed in the cavity 1107. E.g, The granular resin ruthenium is easily formed into a shape having a non-uniform thickness such as a convex shape or a mountain shape. In this case,  15 in the cavity 1107, The particulate resin 11〇4 could not be uniformly heated. therefore, It is easy to occur in a state in which a portion separated from other portions remains in the resin molded body.  Sputum, 4哒 using powdered resin, Powder resin,  20 Other materials such as resin to replace the lion tree material will also occur.  The inventions of the second and third embodiments, which are not described below, are intended to solve the problems of the conventional apparatus and method described in the second drawing. One of the objects of the invention is to efficiently increase the productivity of the article. also, "The invention" His aim is to increase the reliability of the amount of resin in the cavity. also, The t-month of the v 〃 thickness of the lion resin is supplied to the cavity 20 200843930.  [Embodiment 2] Hereinafter, a compression molding method of an electronic component of Embodiment 2 and an apparatus used in the method will be described with reference to the drawings.  (Configuration of the module for compression molding of electronic components) First, the compression molding apparatus 1001 for electronic components will be described using Figs. 14 to 20 (hereinafter, Also referred to as "device 1001").  The device 1001 has a module product, Inner loader 1013, And the upper loader (not shown). The inner loader 1〇13 supplies the substrate 1005 and the resin material to which the electronic component 10 1004 before molding is attached, to the module product. The upper loader removes the formed substrate from the mold set. The module has: Fixed position over the mold 1002 And moving the lower mold 1003 opposite to the upper mold 1002. also, Module product has a mechanism for heating the resin (not shown), And a mechanism (not shown) for fastening the upper mold 1002 and the lower mold 1〇〇3 at a predetermined pressure.  15 Again, The molded bread of the upper mold 1002 contains a substrate mounting portion 1006. The substrate 1005 is mounted on the substrate mounting portion 1006 with the electronic component 1004 facing downward. also, The lower mold 1〇〇3 has a cavity 1〇〇8. The cavity 1008 has an opening 1007 that faces upward. also, The member constituting the bottom surface of the cavity 1 8 can press the resin in the cavity 1008 upward. This member is referred to as a pressing member 1009.  20 Again, The particulate resin 1010, which is an example of a resin material, is supplied to the cavity 1008 of the lower mold 1003. also, The upper mold 1〇〇2 and the lower mold 1003 are closed by a closing mechanism at a predetermined pressure. With this, The electronic component 1004 is immersed in a resin material which is melted by heating in the cavity 1008. Furthermore, The granulated resin 1010 is melted by a mechanism for heating the lower mold 1003. also, The molten resin in the cavity 21 200843930 1008 is pressed by the pressing member 1〇〇9. at this time, A predetermined resin pressure is produced. At last, The electronic component 1004 is filled in the resin molded body 1011 corresponding to the shape of the cavity 1008. That is, Electronic parts are compression molded.  also, Although not shown, However, the lower mold 1003 is provided with a plurality of suction holes that communicate with the surface of the lower mold 1〇〇3 and the surface of the cavity 1008. A vacuum suction mechanism such as a vacuum pump forcibly discharges air to the outside through the suction hole. With this,  The release film 1012 to be described later is adsorbed on the surface of the lower mold 1〇〇3 and the surface of the cavity 1〇〇8.  10 Again, The inner loader 1013 can supply a predetermined amount of the particulate resin 1010 into the cavity 1008. Further, the substrate 1〇〇5 can be supplied to the substrate mounting portion 1〇〇6.  The inner resin loader 1013 can simultaneously supply the pellet resin 1〇1〇 to the cavity 1008 and supply the substrate 1005 to the substrate mounting portion 1006 by the inner loader 1013. But it can also be done individually. also, An external loader (not shown) can take out the resin molded body 1011 and the substrate 1005 in the cavity 1008 from the space between the upper mold 105 and the lower mold 1003.  also, The lower mold 1003 has: a frame for holding the release film 1011, which will be described later. And a moving mechanism 1〇14 that moves the frame 1021 in the vertical direction. also,  The moving mechanism ιοί4 has a rod portion 20 1015 that can be mounted on the front end, And a cylinder (drive mechanism) 1016 that moves the rod portion 1015 in the vertical direction.  (Framework for release film and release film holding) Second, The frame 1〇21 of the release film 1〇12 can be illustrated using Fig. 8.  As shown in Figure 8, The frame 1021 has a through hole on the inner side thereof. And with 22 200843930 have: Upper frame portion 1021a, The frame portion 1021b is opposed to the upper frame portion 1021a.  The release film 1012 is held by the upper frame portion 1021a and the lower frame portion 1021b. With this, The release film 1012 is stretched with a predetermined force. the following, The frame 1021 holding the 5-type film 1012 is referred to as a frame 1022 with a film attached thereto. also, The release film 1012 may also extend to the outside of the frame 1 22 to which the film is attached. also, The frame 1022 to which the film is attached is attached with a locking device 1〇23 for locking the peripheral portion thereof.  and then, The locking device 1023 is configured to be detachably attached to or detached from the moving mechanism 1017 of the inner loader 1013 (the front end of the rod portion 1018) and the moving machine 10 structure 1014 of the lower mold 1 3 (the front end of the rod portion 1015). under.  When the device 1001 is used, The card holder 1023 is transferred to the moving mechanism 1〇14 of the lower mold 1〇〇3 by the moving mechanism 1017 of the inner loader 1〇13. With this, The locking piece 1023 and the frame 1〇22 with the film are moved downward along the rod portion 1〇15.  also, The release film 1012 is cut into a predetermined size by a film drawn from a roll-shaped film. also, The release film 1012 is cut to a minimum size corresponding to the size of the die having the die 1003 below the cavity 1〇〇8. also, The size of the release film 1012 may be as large as possible to cover the left and right sides of the die of the lower die 1〇〇3. It is conceivable that the size of the portion held by the upper frame portion 1〇21a and the lower frame portion 1〇21b is determined. therefore, The size of the release film 1〇12 is slightly larger than that of the 2〇 lower mold 1003.  therefore, In the compression molding method of the electronic component of Embodiment 2, Compared to the release film, the coiled supply method is sent out by the lucky Kunzi to the module and by the take-up of the lucky Kunzi. It can reduce the size of the dragon that is needed for the formation of the defect.  in particular, The compression molding method for an electronic component according to the present embodiment, the volume 23 200843930, takes the release film existing between the delivery roller and the module product required for the supply mode, and the release type existing between the module product and the take-up roller Most of the film becomes unnecessary. therefore, It can reduce the consumption of release film.  (Resin accommodating template) 5 Secondly, The template 1031 (disc) for supplying the granular resin 1010 into the cavity 1008 is explained using Fig. 9.  The template 1031 has a resin accommodating space (concave portion) 1032 that accommodates a predetermined amount of the particulate resin 1〇1〇. The resin housing space 丨〇32 has an opening 1033. The template 1031 has a peripheral portion 1〇34 that accommodates the opening 1〇33.  1〇 Pre-installed granular resin 1〇1〇 is shown in Figure 9, The resin accommodating space 1032 of the template 1031 is put into the supply mechanism 1041 which will be described later. The particulate resin 1010 has a uniform thickness within the template 1031. also, Since the particulate resin 1010 is in the resin accommodating space 1032, It has shape retention at room temperature, Therefore, it has a uniform thickness. That is, The particulate resin 1010 has a sheet shape.  15 However, The particulate resin 1010 is an aggregate of a plurality of particles that are not welded to each other.  therefore, A communication hole is formed between the particles. That is, The granular resin 1〇1〇 is spongy. also, The resin accommodating space 1032 corresponds to the concave portion of the cavity 1〇〇8. therefore, As described later, The predetermined amount of the granular resin is maintained at a uniform thickness of 1 〇 1 ,. And supplied to the cavity 20 1008 by the resin accommodating space 1 〇 32.  And as will be described later, When the template 10 31 is flipped, The granular resin 1010 having a uniform thickness in the resin accommodating space 丨〇 3 2 is dropped from the position of the die surface of the lower mold 1〇〇3 to the bottom surface of the cavity surface. at this time, The surface of the resin is supplied in a state where the resin is in a state of a uniform thickness. therefore, Compared with the granule tree 24 200843930, the grease 1010 has a convex shape in the cavity 1〇08, The particulate resin 1010 is melted in the cavity 1008 from below toward the top at a uniform rate.  and then, The air and moisture contained in the interior of each of the granular resins 1〇1〇 pass through the communication holes (communication path 5) between the particles constituting the granular resin 1010. The particle resin ι 10 is uniformly and naturally moved from the lower side to the upper side. therefore, It is possible to prevent voids or the like from occurring in the resin molded body 1011 formed in the cavity 1〇〇8.  As shown in Figure 11, The peripheral portion 1〇34 and the opening 1033 are covered by the release film 1012. With this, The resin accommodating space 10 1032 containing the granule resin 1010 is closed by the release film 1〇12. The release film 1012 and the frame 1022 with the film attached are as shown in Fig. 12, After flipping, The movement mechanism 1017 is set by the inner loader 1013 to move.  Further, the internal loader 1013 is as shown in Fig. 13, The flipped template 1031 can be placed on the lower mold 1003. The cavity 1008 is adjacent to the resin receiving space 1〇32 15 with the release film 1〇12 interposed therebetween. also, As shown in Figure 13, The flipped template 1031 opening 1033, Release film 1012 And the opening of the cavity 1〇〇8 will overlap the same position on the shell. also, The release film 1012 is in a state of being held by the lower mold 1003 and the inverted template 1031.  With this, The resin accommodating space 1032 forms a sealed space with the space in the cavity 1〇〇8. also, The blocking space is separated by a release film 1〇12. then, The release film (8) 2 is adsorbed to the cavity just 8 It becomes a shape along the shape of the cavity face. That is, The release film 1012 is moved from the position where the opening is cut to the position of the surface of the cavity 1008.  Further, as the release film 1012 moves, The granule resin 1〇1〇 is dropped from the accommodating space 1032 to the cavity 1〇〇8 by the resin 25 200843930. therefore, It is possible to prevent the particulate resin 1〇1〇 from scattering to the outside of the resin accommodating space 1032 and the cavity 1〇〇8. therefore, It is possible to prevent the particulate resin 1010 from adhering to the die face or the like due to the scattering caused by the impact when it is dropped on the die face of the lower die 10〇3 or dropped on the substrate 1005. The result 5 prevents foreign matter such as resin chips from remaining on the mold surface. The result is improved productivity.  (Composition of vacuum suction mechanism) Second, A vacuum suction mechanism that closely bonds the release film to the template.  Although not shown, However, the template 1〇31 for resin storage is provided with a vacuum suction mechanism of -10. The air can be forced to be discharged to the outside by the resin accommodating space 1032 closed by the release film 1012. The vacuum suction mechanism has a vacuum pump such as a vacuum pump. The resin accommodating space 1032 of the template 1031 is provided with an on-off valve. The switch and the vacuum suction mechanism communicate with each other through a vacuum path such as a vacuum tube. The switch valve can be installed in and removed from the vacuum tube.  15 When the on/off valve of template 1031 is opened, The vacuum suction mechanism forcibly discharges air from the resin accommodating space 丨〇 3 2 through the vacuum tube and the on-off valve. then, When the on-off valve is closed, The resin accommodating space 1032 is set to a predetermined degree of vacuum. With this, The release film 1012 can be coated and fixed to the template 1031. also, Secondly, The vacuum tube can also be removed from the template 1〇31 and the on-off valve.  20 in a state where the opening 1033 of the template 1031 is covered by the release film 1012,  Vacuum suction is applied to the resin accommodating space 1032. With this, The resin accommodating space 1032 to which the granulated resin 1010 is supplied is set to a predetermined degree of vacuum. result,  The release film 1〇12 shown in Fig. 11 is adhered to the particulate resin 1010 of the resin accommodating space 1〇32.  26 200843930 Again, Although not shown, However, it is also possible to arrange a predetermined number of suction holes in the peripheral portion 1034. A method of forcibly discharging air in the vicinity of the peripheral portion 1034 to the outside by a vacuum suction mechanism (including a vacuum tube and a switching valve). By this, The release film 1012 can be adsorbed to the peripheral portion 1〇34, The opening of the base template is 1〇33 with a release film of 1〇12 5 . also, A method of vacuum suction of the resin accommodating space 丨〇32 , can be used. Both the method of applying vacuum suction through the suction holes provided in the peripheral portion 1034 are applied to the release film 1012 to the template 1031. also, Vacuum suction is performed by the suction hole of the peripheral portion 1034.  The process of adsorbing the release film 1012 to the template 1〇31 is also continuously performed until the internal load 10 carrier 13〇13 enters between the upper mold 1002 and the lower mold 1〇〇3. also, If it is fixed to the template 1〇31 by the adsorption of the release film 1012, Thereby, if the movement of the particulate resin 1010 is suppressed, The suction hole can also be connected to the cavity 1008. It is not connected to the space near the peripheral portion 1034.  (Composition of the internal loader) 15 Secondly, The inner loader (supply means for forming the material before forming) 1013 for supplying the granular resin 1010 to the cavity 1?08 will be described.  The inner loader 1013 is as shown in Figs. 11 to 14 . With body 1025, It can be mounted on the body 1025 and the detachable loading and unloading station 1〇26. also, The main body 1025 includes a substrate carrying portion 1027 on which the substrate 1005 on which the electronic component 1 is mounted is mounted. The loading and unloading station 1026 includes a mounting portion 1028 for mounting the template 1031. a moving mechanism 1017 that moves the frame 1022 with the film in the up and down direction, It is provided to be attached to the main body 1025 and the detached base portion 1〇29. also,  The inner loader 1013 can supply the substrate 1〇〇5 and the particulate resin 1010 on which the electronic component 1〇〇4 is mounted to the upper mold 1002 and the lower mold 1〇〇3.  27 200843930 Again, The moving mechanism 1017 includes: It is equipped with a rod with a locking device 1〇23, 1018, And the rod portion; κ)18 Cylinder (drive mechanism) moving in the up and down direction 1〇19. also, The moving mechanism 1017 allows the front end of the rod portion 1018 to be inserted into the card holder 1023. also, The cylinders 1〇19 can move the locking members 1〇23 in the up and down direction.  5 Again, The template 1031 is in a state in which the resin receiving space 1032 faces downward.  The mounting portion 1〇28 of the loading and unloading station 1026 is mounted. also, The moving mechanism 1 可使 17 allows the release film 1012 to contact the stencil 1 〇 31 to cover the opening 1 〇 33.  And as will be described later, When the granular resin is supplied to the cavity 1〇〇8,  The card holder 1023 will lock the frame 1〇22 with the film attached. And it is transferred to the moving mechanism 1014 (rod portion 1〇15) by the moving mechanism ίο 1017 (rod portion 1〇18). When the granule resin 1010 is supplied to the cavity 1〇08, The locking device 1〇23 and the frame 1022 with the film are moved downward.  Secondly, The loading and unloading station 1〇26 detached by the inner loader 1〇13 will be described. The loading and unloading station 1026 is provided with a mounting portion 15 1028 for mounting the template 1 于 31 on one of the main surfaces. Further, the loading and unloading platform has a detachable base portion 1029 on the other main surface. also, The loading and unloading station 1〇26 is as shown in the first figure.  The mounting portion 1028 is placed on the base portion 1〇29 in a state in which the mounting portion 1028 faces upward.  Then, as shown in Figure 11, The release film 1〇12 is moved downward by the moving mechanism 1〇17, The template 1〇31 of the granular resin 1〇1〇 is put into the top of the tray. With this, The release film 1012 is coated on the template 1031 in a state of being subjected to a predetermined tensile force.  also, As shown in Figure 12, The loading and unloading station 1〇26 is mounted on the inner loader 1〇13. The mounting portion 1028 is mounted below the inner loader 1〇13. also, As shown in Figure 13, When the inner loader 1013 is inserted between the upper die 1〇〇2 and the lower die 1〇〇3 28 200843930, The opening 1007 of the cavity 1008 is opposed to the opening 1〇33 of the template 1031.  Therefore, the inner t carrier 1013 is moved downward. With this, The opening 1033 of the template may be in a state in which the release film 1012 is interposed therebetween. Adjacent to the opening 1007 of the lower mold 1003. at this time, The resin accommodating space 1 〇 32 has a particle tree 5 grease 1010.  (Composition of a supply mechanism of a resin material) Next, The supply mechanism 1〇41 shown in Fig. 9 will be described.  The supply mechanism 1041 supplies a predetermined amount of the particulate resin 1〇1〇 to the resin receiving space 1032 of the template 1031. The supply mechanism 1 to 41 has a metering input portion 1042 into which a predetermined amount of the pellet resin 1010 is measured and put into the template 1031.  also, The supply mechanism 1041 has a template mounting portion 1043. The template mounting portion 1A 43 has a loading table 1026 on which the template 1031 is mounted. also, The metering input unit 1〇42 measures a predetermined amount of the particulate resin 1〇1〇 and vibrates and moves. And before entering the template 1031, the tree is filled with a space of 1〇32. also, The template mounting portion 1043 15 vibrates the t unloading table 1026. With this, The granular resin 1〇1〇 in the resin accommodating space 1〇32 of the template 1〇31 can form a uniform thickness. That is, In the resin accommodating space 1032 of the template 1〇31, A predetermined amount of the particulate resin 1〇1〇 will be flattened.  also, The granular resin 1〇1〇 having a uniform thickness in the template 1031 is different from the pelletized resin 20 1052 having a fixed shape as disclosed in Example 3, which will be described later. The particles are not in a state of reciprocal connection. also, The granular resin 1010 in the template 1031 can also be formed into a uniform thickness using an r scraper. In place of the template mounting portion 1043, the thickness of the granular resin 1〇1〇 is uniform by vibration (the compression molding method of the electronic component using the granular resin in the template 29 200843930 method) First, the formation of the frame 1022 with the film attached is explained. program.  As shown in Figure 8, A release film 1012 of a predetermined size is placed on the lower frame portion 10b. Secondly, The frame portion i〇21a is placed on the release film 1〇12. After 5, The upper frame portion 1021a and the lower frame portion 1021b hold the release film 1012 at a predetermined pressure. With this, A frame 1 22 with a film attached is formed. at this time, The release film 1〇12 held by the upper frame portion 110a and the lower frame portion 1021b is stretched with a predetermined force. also, The release film 1012 can be completely covered by the left and right sides of the lower mold 1〇〇3. It suffices to have a size of 1 part which is necessary for holding the frame 1〇2i. also, The release film 1012 can also be extended outward by the frame 1〇21. also, The upper frame portion 1021a and the lower frame portion 10b are locked by the locking devices 1〇23.  Next, the procedure for supplying the pellet resin 1010 to the template 1031 for resin accommodation will be described.  15 As shown in Figure 9, The loading and unloading station 1026 is detached by the inner loader 1013. The mounting portion 1028 is placed on the template mounting portion 1043 upward. Secondly, The mold plate 1031 is attached to the mounting portion 1〇28 with the opening 1033 facing upward.  Secondly, After measuring the required amount of granular resin 1〇1〇, The metering input unit 1042 is put into the resin accommodating space 1〇32 of the template 1031. With this, Finishing 20 is supplied with a template 1031 having a particulate resin 1010.  at this time, The template mounting portion 1043 applies vibration to the template 1〇31. Raise this,  The thickness of the particulate resin ι010 in the resin accommodating space 1032 is uniform. By this, the pellet resin was formed into a sheet shape. at this time, The majority of the particles constituting the particulate resin 1〇19〇 are not welded to each other.  30 200843930 Secondly, The procedure in which the opening 1033 of the template 1031 into which the particulate resin 1010 is applied is covered by the release film 1012 will be described.  First of all, As shown in Figure 10, The release film 1012 held by the film-attached frame 1022 is coated on the upper surface of the template 1〇31 to which the particulate resin 1010 is placed. at this time, The card holder 1023 attached to the frame 1022 to which the film is attached is inserted into the front end of the rod portion 1〇18 of the moving mechanism 1017 of the inner loader 1013 (1025). The cylinder 1〇19 of the moving mechanism 10175 moves downward. With this,  The release film 1012 is moved to the opening 10 1033 of the template 1〇31 supplied with the particulate resin 1010. As a result, the opening 1〇33 is closed by the release film 1〇12.  also, After the release film 1012 is coated on the template 1〇31, Vacuum suction may also be applied to the space in the template 1〇31 covered with the release film 1012. With this, The resin accommodating space 1032 is set to a predetermined degree of vacuum. As a result, the release film 1〇12 is adsorbed to the template 1031.  Further, the vacuum suction can be applied to the peripheral portion 1〇34 by the suction hole of the peripheral portion 1034 at the same time as the vacuum suction, and can also be performed only through the peripheral portion 1〇34. The suction hole attracts the vacuum of the release film 1〇12 to the peripheral edge portion 1034.  Secondly, The loading and unloading table 1026 is detached by the template mounting portion 1A. at this time, As shown in Figure 11, Figure 20, The loading dock 1〇26 has: Frame with film 1〇22, And a template 1031 for applying a predetermined amount of the particulate resin 1010 and performing vacuum suction.  Secondly, The loading and unloading station 1026 is provided with a plate 1031 to which a granular resin 1供给1〇 is supplied. In a state in which the film-attached frame 1〇22 of the release film is held, The program of the body 1025 of the inner loader 1013 is installed.  31 200843930 First of all, The loading and unloading station 1026 shown in Fig. 11 is turned over. at this time, The face of the die plate 1031 covered with the release film 1012 is positioned on the lower side of the loading and unloading station 1〇26. Secondly, In the state in which the template 1031 is turned over, The base portion 1029 of the loading and unloading table 1026 is attached to the main body 1〇25. With this, The inner loader 1013 shown in Fig. 12 is formed.  5 At this time, The granule resin 丨〇1〇 has a uniform thickness, The opening 1033 is present in the resin accommodating space 1032 which is closed by the release film 1012.  Secondly, Using Figures 13 and 14, A procedure for supplying the granular resin into the cavity is explained.  As shown in Figure 13, First of all, The inner loader 1〇13 is inserted between the upper die 1〇〇2 and the lower die 1003. Secondly, The inner loader 1〇13 moves to the top. With this,  The substrate 1005 is mounted on the substrate mounting portion 1006 of the upper mold 1002 with the electronic component 1004 facing downward. Secondly, The inner loader 1〇13 moves downward.  With this, The lower surface of the inner loader 1013 is in contact with the die face of the lower mold 1〇〇3. also,  The opening of the template 1031 is 1033, The opening of the cavity 1008 1〇〇7, And the release film ι〇12 I5 system is roughly positioned in the same plane.  Secondly, As shown in Figure 14, The locking device 1〇23 is in a state of locking the frame 1022 with the film attached thereto, The front end of the rod portion 1〇18 of the inner loader 1〇13 is detached, The front end of the rod portion 15 is mounted in the moving mechanism 1014. That is,  The catch 1023 is transferred from the rod portion 1018 to the rod portion 1015.  20 Again, The moving mechanism 1014 moves downward. With this, The release film 1012 is coated on the die face of the lower mold 1003 with a predetermined tensile force applied thereto. then,  The air is forcibly discharged by the cavity 1008. With this, The release film 1012 is closely attached to the surface of the cavity 1008. at this time, The vacuum pump set in the template 1〇31 stops vacuum suction, Thereby, the resin accommodating space 1?32 of the template 1031 is changed from the vacuum state 32 200843930 to a normal pressure state.  With this, As shown in Figure 14, In a state where the release film 1〇12 is coated on the surface of the cavity 1〇〇8, The pellet resin 1〇1〇 is dropped from the resin receiving space 1032 toward the cavity 1008. The granular resin 1010 and the release film 1012 have a uniform thickness of 5, Drop to the bottom surface of the cavity 1〇〇8. Secondly, As shown in Figure 15,  After the inner loader 1013 moves upward, It is taken out by the space between the upper mold 1〇〇2 and the lower mold 1〇〇3.  Further, when it is necessary to remove the particulate resin 1010 remaining in the resin accommodating space 1〇32, Between the die surface of the lower die 1〇〇3 and the lower surface of the template 1〇31, a pre-10疋 space is formed, The template 1031 can also vibrate in the horizontal direction or in the up and down direction. Worse, Almost all of the particulate resin 1 〇 1 落 will fall from the resin receiving space 1032 to the cavity 1008. In this case, It is also possible to have a mechanism for applying vibration to the template 1031 by the inner loader 1〇32.  Second, as shown in Figure 16, Close the upper die 1〇〇2 and the lower die 1〇〇3. At 15 o'clock, The particulate resin 101 is melted by heating in the cavity 1〇〇8 covered with the release film 1012. therefore, The electronic component 1〇〇4 mounted on the substrate 1〇05 was immersed in the molten resin. then, The pressing member 1009 applies a predetermined pressure to the molten resin in the cavity 1〇〇8.  After the time necessary to harden the molten resin, The upper mold 20 1002 and the lower mold 1003 are opened. With this, A resin molded body 1011 corresponding to the shape of the cavity ι 08 is formed in the cavity 1008. The electronic component 1004 is filled in the resin molded body 1011. With this, The compression molding is completed. Secondly, The upper loader takes out the formed substrate by the device 1001, That is, the substrate 1〇〇5 and the resin molded body loii.  According to the above method, The granular resin 1〇1〇 is in a closed space formed by the lower mold 1〇〇3 and the template 33 200843930 1031, Moving from the resin receiving space 1〇32 to the cavity 1〇〇8, The particulate resin 1010 does not scatter and adheres to portions other than the resin accommodating space 1032 and the cavity 1008. therefore, It is possible to prevent the particulate resin 1〇1〇 from remaining on the mold surface of the lower mold 1〇〇3 or the substrate 1〇〇5 as a foreign matter 1112 such as resin chips.  5 Therefore, The productivity of the resin molded body ion as a product can be improved.  also, According to the above method, The particle resin retains its shape, 1〇1〇 It is then supplied to the cavity 1008. therefore, The reliability of the amount of resin supplied to the cavity 1〇〇8 can be improved.  also, According to the above method, The granule resin 1〇1〇 was supplied to the cavity 1〇〇8 under a uniform thickness of 10 〇. therefore, The granular resin 1 〇 1 可使 can be efficiently melted uniformly in the thickness direction.  also, According to the above method, The resin accommodating space is 1〇32, The particulate resin 1010 has a communication hole. therefore, When the particulate resin 1010 is heated and melted in the cavity 1〇〇8, The air, moisture, and the like contained in the inside of the granular resin 1〇1〇 are naturally discharged to the outside through the communication holes. result, It is possible to prevent voids and the like from remaining in the resin molded body. also, It is speculated that after pressing each particle resin 1〇1〇, Most of the connected holes that become the gap between the majority of the particles disappear.  [Embodiment 3] Hereinafter, According to the schema, The compression molding method of the electronic zero-piece of the third embodiment of the present invention will be described in detail.  (Composition of module products) First, As shown in Figure 21, Compression forming device for electronic parts 1〇5〇, Basic components, In particular, the components of the module are the same as those of the module described in the second embodiment (see FIGS. 13 to 16). therefore,  34 200843930 The constituent members of these are marked with the same reference numerals. The description of the constituent members of the components is not repeated.  (Preparation heating mechanism) As shown in Figures 17 and 18, The compression of the electronic component of the present embodiment is set to 1050 with a preliminary heating mechanism 1〇51. The preliminary heating mechanism 1〇51 before supplying the granular resin 1〇10 to the cavity 1〇〇8, Will not press the granule resin 1〇1〇, Rather, the thickness of the entire granule resin ι〇ι〇 is uniformized by heating the granule resin 1〇1〇.  As shown in Figures 17 and 18, The preliminary heating mechanism 1〇51 has: Add 1〇热°卩1〇53, The heating surface 1〇56 heated by the heating unit 1〇53. The heating surface 1056 is placed with a release film 1〇55 on which the frame 1054 has been placed. also, The preliminary heating mechanism 1051 has a cover member 1057 that closes the upper side of the frame 1054.  The heating surface 1056 of the heating portion 1053 is heated by the release film 1055 into the frame 1054 which is supplied onto the release film 1055 and has a uniform thickness of the pellet resin 1〇1〇. As a result, a particulate resin 1052 having a uniform thickness is formed.  also, As described later, A predetermined interval is provided between the granular resin 1010 or 1052 and the cover member 1057. therefore, The cover member 1057 does not come into contact with the particulate resin 1052. also, Although not shown, However, the preliminary heating mechanism 1051 has a mechanism for putting the particulate resin 1010 into the frame 1054 on the release film 1055.  2 〇 (Particulate Resin) The particulate resin 1010 in the frame 1054 is formed into a uniform thickness by a flattening mechanism. also, The mechanism for flattening the resin material can use a mechanism that utilizes vibration, Or "scraper" and so on. also, As shown in Figures 17 and 18, The pellet resin 1010 is attached to the heating surface 35 200843930 1056 in a state in which the release film 1055 is interposed therebetween. The pellet resin 1〇1〇 in the frame 1054 can be preheated. That is, it can be heated at a temperature which is reheated and remelted. at this time, The particulate resin 1010 in the frame 1〇54 forms a uniform thickness. result, A flaky granular resin 1052 is formed.  5 So, Since the thickness of the granular resin 1〇52 is uniform, Therefore, the entire granular resin 1052 can be uniformly melted. also, The granule resin is a collection of a surface of the surface between the particles of the 〇52 series particles which are welded to each other by heating. therefore, Granular resin 1052 is spongy. also, Sponge-shaped granule resin 1〇52 and a resin material which is melted by heating, By pressing a fixed resin material, And the kneaded powder is different from the resin materials such as resin. It is characterized in that it has a communication hole inside.  And as shown in Figure 20, Also in the state where the frame 1〇54 is not used,  The pellet resin 1〇52 having a uniform thickness on the release film 1055 is supplied to the compression molding apparatus 1〇5〇 which is not shown in Fig. 21. also, The particulate resin (aggregate) 1052 may also be preheated to a temperature of 15 degrees which can be remelted by reheating. It is also possible to heat to a temperature at which the electronic component 1 4 mounted on the substrate 1005 can be compressed and formed.  also, When the granular resin 1010 is heated, The upper opening of the frame 1054 can also be covered by the member 1057. In this case, The pellet resin 1〇1〇 is uniformly heated in the frame W54 by the lower layer portion to the upper layer portion.  2〇 Again, A heating portion 1 〇 58 may be provided on the upper opening of the frame 1054 to replace the cover member 1057. also, The particulate resin 1010 in the frame 1054 may also be heated by a heating portion at a predetermined interval. In this case, Same as the 6 cases using the cover member 1〇57, The particulate resin 1〇1〇 in the frame 1054 is uniformly heated to the upper portion by the lower portion thereof.  36 200843930 (Compression forming method of electronic parts by heating pellet resin) Secondly, As shown in Figure 21, A method of performing compression molding using the pellet resin 1052 will be described.  5 First, As shown in Figure 21, The end of the release film 1055 is held by the inner loader 1059. at this time, The particulate resin 1〇52 is on the release film 1〇55 and is present in the frame 1054 placed on the release film 1055. Secondly, The inner loader 1059 is inserted into the space between the upper die 1〇〇2 and the lower die 1〇〇3. then, The inner loader 1〇59 moves down. With this, The release film 1055 is in contact with the surface of the cavity 1〇〇8.  10 At the same time, The frame 1〇54 is placed in a state in which the release film 1055 is placed therein. It is placed on the die surface of the lower die 1〇〇3.  Secondly, The air is forcibly discharged from the die face of the lower mold 1003 and the space in the cavity 1008 by vacuum suction. The release film 1055 is closely attached to the surface of the lower mold 1〇〇3 and the surface of the cavity 1008. at this time, The particulate resin 1〇52 is placed in a state of being placed on the release film 1055. The die surface of the lower die 1〇〇3 is dropped to the bottom surface of the cavity 1008.  Secondly, The upper mold 1002 and the lower mold 1003 are closed. With this, The electronic component mounted on the substrate 1005 is immersed in the surface of the cavity to be immersed in the resin material fused by heating. then, After the time necessary for the molten resin material to harden, The upper mold 1002 and the lower mold 1003 are opened. With this, The electronic component brain is filled in the cavity 1008 in the resin molded body 1011 corresponding to the shape of the cavity face.  The compression molding method of the electronic component of the above-described third embodiment can also achieve the same effects as the compression molding method of the electronic component of the second embodiment.  37 200843930 Furthermore, The release film 1〇55 used in the embodiment 3 has the same size as the embodiment 2 corresponding to the die face size of the die 1003 having the cavity 1008:  also, The release film 1055 is formed by drawing and cutting the take-up release film.  5 (Particle Resin of Other Embodiments) A resin material which maintains a certain shape (thickness) at a normal temperature can also be used.  Instead of the particulate resin of the above examples. The resin material can also be homogenized by vibration. also, The thickness of the resin material can also be uniformized using a doctor blade or the like.  Furthermore, When using a resin material that maintains a certain shape at normal temperature, For example, when using a resin material that does not retain a certain shape at normal temperature, It is not necessary to use the preparatory heating mechanism 1051 for preliminary heating. Furthermore, When using a resin material that maintains a shape (thickness) at normal temperature, It is also possible to have the same effect as that obtained when a resin material which does not have a constant shape at a normal temperature is used.  also, In various embodiments, A thermoplastic resin material may also be used to obtain a thermosetting resin material. also, In various embodiments, Instead of the particulate resin material, various resin materials such as a powdery resin material or a powdery resin material having a predetermined particle size distribution may be used. and then, In various embodiments, It is also possible to use a resin material of Shih-tung or an epoxy-based resin material instead of the resin material. also, The resin material may also use a resin material having transparency, Resin material with 〇 translucency, Containing twilight materials, And any resin material such as the material of the fluorescent material. also, In the above embodiments, It is also possible to use a liquid resin which is liquid at normal temperature and under normal pressure to replace the granular resin.  ,  The same as the prior art described in the foregoing background art, 38 200843930, As shown in Figure 47, a module product for a compression forming device using an electronic component, A method of compressing an electronic component mounted on a substrate by a resin material.  In the method, A module product of a compression molding device 21〇15 mounted on an electronic component is used. The module has an upper mold 2102 and a lower mold 2103. In the device,  The pellet resin 2106 is supplied into the cavity 21〇5 covered with the release film 21〇4. In this state, The particulate resin 2106 can be melted by heating. then, The upper mold 2102 and the lower mold 2103 are closed. With this, The electronic component 2122 mounted on the substrate 2121 is immersed in the molten resin material in the cavity 2105. also, Pressure is applied to the molten resin in the cavity 2105 by the bottom 10 member 2107. With this, A resin molded body corresponding to the shape of the die VIII 2105 is formed. the result, The electronic parts are filled by a resin molded body.  also, As shown in Figure 47, The supply mechanism 21〇8 is used to supply the particulate resin 2106 into the cavity 2105. The supply mechanism 2108 has a through hole 21〇9,  15 and a shutter 2110 disposed on a lower side thereof. also, The shutter 2110 is opened by the supply mechanism 21 ’8. The granular resin 2106 is dropped from the space in the through hole 2109 toward the cavity 2105.  According to the conventional compression forming device shown in Fig. 47, The distance between the supply mechanism 2108 and the bottom surface of the cavity 2105 is quite large. therefore, When the particles 20 resin 2106 collide with the bottom surface of the cavity 2105, The powder attached to the particulate resin 2106 is easily scattered. also, The powder attached to the particulate resin 2106 or the particulate resin 2106 may scatter due to collision with the bottom surface of the cavity 2105. therefore, The release film 2104 adhered to the mold surface of the lower mold 2103 and a portion of the lower mold 2103 which are not covered with the release film are attached. result, Foreign matter (cured material) such as resin chips remains on the mold surface of the lower mold 2103 and the substrate 2121 39 200843930. therefore, The foreign matter attached to the lower mold 21〇3 must be removed by cleaning. also, The yield of the product is lowered due to foreign matter adhering to the substrate. As a result, the productivity of the product is lowered.  also, There is also no movement of the shutter 211 due to the adhesion of the granular resin 2106. The use of the compression forming device must be interrupted. result, The productivity of the product is reduced.  also, A portion 2106a of the particulate resin 21〇6 remains on the peripheral surface of the through hole 2109. therefore, It is not possible to supply the granular resin knife (9) to the cavity with high precision. result, It is impossible to increase the reliability of the amount of the resin of the pellet resin 21〇6 supplied to the cavity.  The thickness of the pellet resin 21〇6 in the mold 8105 may be non-uniform. E.g, The particulate resin 2106 is formed into a convex shape or the like. In this case, The granular resin 21〇6 could not be uniformly heated in the mold 8105. therefore, A problem such as a residual portion of the resin material separated by other parts may occur.  15 Again, The aforementioned problem is the use of powdered resin, Powder resin, It may also occur when other resin materials such as liquid resin are substituted for the granular resin.  The inventions disclosed in the fourth to seventh embodiments described below are intended to solve the problems of the conventional apparatus and method described in the description of Fig. 47. The object of the invention is to improve the productivity of a product obtained by compression molding. also, The other object of the present invention is to improve the reliability of the resin amount of the resin material supplied to the cavity. also, Another object of the invention is to supply the resin material to the cavity in a uniform thickness. also, Another object of the present invention is to improve the quality and reliability of a resin molded body which is compression molded in a cavity.  [Embodiment 4] 200843930 A compression molding method of an electronic component and an apparatus used therefor according to an embodiment of the present invention will be described in detail with reference to the drawings.  (Composition of a compression forming device for electronic parts) First, Using pictures 31 to 34, Describe the compression of electronic parts into a 5-shaped device 2001 (below, Also referred to as "device 2001". ) The module product.  Sangju 2001 has: Module product, And the substrate 2006 containing the electronic component 2005 and the granular pellet resin 2007 are simultaneously or individually supplied to the internal loader 2002 of the module. also, The device 2001 has a loader (not shown) on which the substrate 2006 is taken out from the module.  0 again, The module has: Position fixed upper mold 2003, And configured to move the lower die 2004 opposite the upper die 2003. The device 2001 has a mechanism (not shown) for heating the upper mold 2〇〇3 and the lower mold 2004 to a predetermined temperature. also, The device 2〇〇1 has a closed mold mechanism (not shown) that can close the upper mold 2003 and the lower mold 2004 at a predetermined pressure.  5 Again, The upper mold 2003 has a substrate mounting portion 2008, In the substrate mounting portion 2008, the substrate 2006 on which the electronic component 2005 is mounted is mounted with the electronic component 2005 facing downward. also, The lower mold 2004 is provided with a cavity 2010 having an opening 2009 facing upward. also, The bottom surface of the cavity 2 is formed by pressing the bottom member 2011 of the granular resin 2007 in the cavity 2010 upward.  〇 In the device 2001, The substrate 2〇〇6 is mounted on the substrate mounting portion 2008 of the upper mold 2003 in a state where the electronic component 2005 faces downward. also, The granule resin 2007 is supplied to the lower mold 2004O cavity 2010. also, The upper mold 2003 and the lower mold 2004 are closed at a predetermined pressure. With this, The electronic component 2005 is immersed in the resin material that is melted in the cavity 2010.  200843930 Again, The molten resin in the cavity 2010 is pressed by the bottom member 2〇11. With this, A predetermined pressure is applied to the molten resin in the cavity 2〇1〇. also,  A resin molded body 2012 corresponding to the shape of the cavity 2〇1〇 is formed in the cavity 2010. The electronic component is filled in the resin molded body 2〇12.  5 The lower mold 2004 is not shown, However, the two ends have a predetermined number of suction holes that communicate with the cavity 2010 and the vacuum tube. The vacuum tube is an example of a vacuum path. also, The lower mold 2004 has a vacuum pump that forcibly discharges the air in the cavity 2〇1〇 to the outside through the suction hole. The vacuum pump is an example of a vacuum suction mechanism. The vacuum suction mechanism forcibly vents air from the space in the cavity 2010 through the suction hole to the 10 external space. With this, The recessed portion 2014 of the film 2015 having the recess is adsorbed to the cavity 2010. As a result, the recessed portion 2014 is inserted into the cavity 2010. at this time, The particulate resin 2〇〇7 is planarized in the recess 2014.  (supply agency) The device 2001 is as shown in Figures 23 to 28, There is a supply mechanism 2021 on the outside of the module product 15 , Further, the supply mechanism 2021 supplies the particulate resin 2007 to the concave portion 2014 of the film 2015 having the concave portion. also, The supply mechanism 2021 has: Forming mechanism 2022 Institution 2023, A mechanism for flattening the particulate resin 2007 by vibration (not shown).  The forming mechanism 2022 is as shown in Fig. 23 to Fig. 25, A recessed portion 2014 corresponding to the shape of the cavity 2010 is formed in the release film 20 2013. The input organization 2023 is as shown in Figure 26, After metering granular resin 2007, A predetermined amount of the particulate resin 2007 is supplied to the recessed portion 2014. The mechanism for flattening the granular resin 2007 by vibration is as shown in Fig. 27, By vibrating the mold 2024, The particulate resin 2007 in the recessed portion 2014 is vibrated. With this, The particulate resin 2007 is planarized in the recess 2014 42 200843930. The predetermined amount of the particulate resin 2007 in the recessed portion 2014 is in a state of having a uniform thickness.  (Forming Mechanism) The forming mechanism 2022 forms a film having a concave portion having a concave portion 2014 corresponding to the shape of the cavity 2010 5 in the release film 2013, and is shown in FIGS. 23 to 25, Forming mechanism 2022 has: Equipped with a release film 2013 model 2024, And a press machine 2025 that forms the release film 2013 by pressing. Further, the mold 2024 is provided on the base of the supply mechanism 2021. also, The mold 2024 has a recess 2026 for shaping the release film 2013. also, The mold 2024 is formed into a 10 face 2027.  In the forming mechanism 2022, As shown in Figure 23, In the state in which the release film 2013 is mounted on the forming surface 2027, Then as shown in Figure 24, The punch 2025 presses the release film 2013 into the recess 2026. With this, As shown in Figure 25, A recessed portion 2014 corresponding to the recess 2026 of the die 2024 is formed in the release film 2013. That is to say, 15 is that The press forming of the release film 2013 is performed. also, As shown in Figure 25,  The recess 2014 has a shape corresponding to the cavity 2010.  also, As described later, The film 2015 supplied with the particulate resin 2007 and having a recess is inserted into the cavity 2010. at this time, The particulate resin 2007 has a shape in a flat state. also, The concave portion 2014 is elongated by the adsorption of the true air in the cavity 2〇1〇, Therefore, it should be smaller than the shape of the cavity 2010.  Although not shown, However, the surface of the recess 2026 and the forming surface 2027 extend through the suction hole that communicates with the outside through the inside of the die 2024. The forming mechanism 2022 has a vacuum suction mechanism for forcibly discharging air from the space in the recess 2026 through the suction hole to the outer space. By the function of the vacuum suction bow machine 43 200843930, The release film 2013 forms a film 2015 having a concave portion having a concave portion 2014 corresponding to the shape of the concave portion 2026.  (investment agency) The supply mechanism 2021 is as shown in Fig. 26, Has a metered particle tree 5 lipid 2007, A predetermined amount of the particulate resin 2007 is supplied to the dispensing mechanism 2023 of the recess 2014. Furthermore, The supply mechanism 2021 can also have a metering mechanism (not shown). The metering mechanism is metered into the granule resin 2007 of the recess 2014 of the die 2024 simultaneously with the film 2015 having the recess.  (Mechanism that flattens the particle resin by vibration) 10 Again, Although there is no schema in the device 2001, However, there is provided a mechanism for vibrating the base of the supply mechanism 2021 in the horizontal direction or the vertical direction. As shown in Figure 27, This mechanism vibrates the abutment. With this, The mold 2024 vibrates. As a result, the particulate resin 2007 is flattened by vibration in the concave portion 2014 of the film 2015 having the concave portion. the result is, A particulate resin 2007 having a predetermined thickness of 15 uniform thickness is formed in the recessed portion 2014.  Furthermore, As shown in Figure 28, The granular resin 2007 can also be pressed by pressing the flat member 2028, The particulate resin 2007 in the recess 2014 forms a uniform thickness. also, A "scraper" can also be used as an apparatus for flattening the granular resin 2?7.  2〇 (Inner Loader) The apparatus 2001 has an internal loader 2002 that supplies the pellet resin 2007 to the module. The inner loader 2002 has a function as a mechanism for supplying a resin material to a cavity. also, The internal loader 2002 is as shown in Figure 29, have:  Flat body 2031 And a mechanism (not shown) for adsorbing the release film 2013 to the lower surface 2032 of the body 2〇31 44 200843930. therefore, As shown in Figure 3, The film 2015 having the recess is adsorbed to the lower surface 2032 of the body 2031.  Further, although the mechanism for adsorbing the release film 2013 is not shown, However, it has a 5 hole that is extended by the lower surface 2032 of the body 2031 through the inside thereof. a vacuum pump that forcibly discharges air through a suction hole, And a vacuum tube that connects the suction hole to the vacuum pump. These are vacuum suction mechanisms. The vacuum suction mechanism forcibly discharges air from the space near the lower surface 2032 of the main body 2031 to the other space via the suction hole and the vacuum tube. With this, The film 2〇15 having a recess is adsorbed to the lower surface 2032 of the body 2031.  10 Again, Although the body 2031 is not illustrated, However, there is a mechanism for causing the body 2〇31 to vibrate to planarize the granular resin 2007. therefore, The mechanism can vibrate the body 2031 by The granular resin 2007 in the recessed portion 2014 is caused to vibrate. According to this, The particulate resin 2007 in the recess 2014 is flattened. As a result, the particulate resin 2007 having a uniform thickness is formed in the recessed portion 2014. also, When the film 2015 having the concave portion of the particulate resin 2007 is carried by the internal loader 2002, If the thickness of the granular resin 2007 is not uniform, The release film 2013 can also be vibrated by the aforementioned mechanism. The particulate resin 2007 is planarized.  (Method of supplying resin material) First, As shown in Figure 23 to Figure 25, The step of forming the film 2015 having the recesses by the forming mechanism 2022 provided on the base of the supply mechanism 20 2021 will be described.  As shown in Figure 23, A release film 2013 is mounted on the mold 2024. Secondly,  As shown in Figure 24, The punch 2025 presses the release film 2013. With this, The release film 2013 is held by the recess 2026 of the die 2024 and the punch 45 200843930 2025 corresponding to the recess 2026. The result is shown in Figure 25, A concave portion 2014 is formed in the release film 2013.  also, As shown in Figure 23 to Figure 25, It is also possible to form a film using only the mold 2024 instead of forming the film using the forming mechanism 2022. also, In a state where the release film 2013 5 is mounted on the molding surface 2027 of the mold 2024, The air in the recess 2026 can also be forced to discharge air to the external space through the suction hole extending inside the die 2024. A recess 2014 corresponding to the shape of the recess 2026 is formed.  Secondly, As shown in Figure 26, The input mechanism 2023 puts the particulate resin 2007 into the recessed portion 2014. Secondly, As shown in Figure 27, The mechanism for flattening the granular resin of the device 2001 10 causes the base of the supply mechanism 2021,  Mold 2024, And the film 2015 with a concave portion vibrates. With this, Vibration is applied to the particulate resin 2007 in the recessed portion 2014. the result, The particulate resin 2007 is planarized in the recess 2014. therefore, The particulate resin 2〇〇7 has a uniform thickness in the recess 2〇14. also, after, The film 2015 having the concave portion 2014 provided with the concave portion 2014 supplied with the uniform thickness of the particulate resin 2〇〇7 15 is also referred to as a flattening resin mounting film 2016.  (transport of resin material)

平坦化樹脂載置膜2016供給至模組品之步驟。 如第29圖所示，内裝載機2002朝下方移動。藉The step of supplying the flattening resin mounting film 2016 to the module product. As shown in Fig. 29, the inner loader 2002 moves downward. borrow

下，内裝載機2002往上方移動。其次， 之下面2032之狀態 如第31圖所示，固 46 200843930 定有平坦化樹脂載置薄膜2016之内裝載機2002搬送到模穴 2010。此時，平坦化樹脂載置薄膜2016吸附之内裝載機2002 插入上模2003與下模2004之間。藉此，内裝載機2002會定 位於下模2004之模穴2010的上方。 5 其次，如第32圖所示，具有凹部之薄膜2015之凹部2014 插入模穴2010。其次，内裝載機2002結束具有凹部之薄膜 2015之吸附。然後，如第33圖所示，内裝載機2002朝上方 移動。藉此，在具有凹部之薄膜2015結束被覆於模穴2010 及下模2004之模面之步驟。 1〇 (壓縮成形） 其次，使用第34圖說明裝著於基板2006之電子零件 2005在模穴2010内藉由樹脂材料壓縮成形之步驟。在被覆 有凹部2014之模穴2010内，顆粒樹脂2007藉由加熱而溶 融。然後，如第34圖所示，關閉上模2003與下模2004。藉 15此，在基板2006裝設於上模2003之狀態下，安裝於基板2006 之電子零件2005浸潰於模穴2010内之熔融的樹脂材料。然 後’模穴之底面構件2011按壓模穴2010内之熔融樹脂。藉 此，對模穴2010内之熔融樹脂施加預定壓力。在經過用以 使熔融樹脂硬化所必須之時間後，打開上模2003與下模 20 2004。藉此，安裝於基板2006之電子零件2005填封於對應 於模穴2010之形狀之樹脂成形體2012内。 (作用效果） 根據本實施例之電子零件的壓縮成形方法，顆粒樹脂 2007係在載置於離型膜2〇13之狀態下供給於模穴2〇1〇。因 47 200843930 此，將樹脂材料供給於模穴之機構不會殘存有顆粒樹脂 2007。其結果是供給於模穴2〇1〇之顆粒樹脂2〇〇7之量的信 賴性高。 又，可對模穴2010供給具有均一厚度之顆粒樹脂 5 2007。因此，可在模穴201〇内將顆粒樹脂2007均等地加熱 溶融化。結果，可防止在模穴2〇1〇之樹脂材料中發生由其 他部分分離之部分。因此，可提升樹脂成形體2〇12之品質 及信賴性。 又，本實施例之電子零件的壓縮成形方法中，内裝載 10機2002使載置有顆粒樹脂2007之離型膜2013由模穴2〇1〇之 上方位置往模穴2010移動，藉此顆粒樹脂2〇〇7供給於模穴 2010。因此，根據本實施例之電子零件之壓縮成形方法， 不會像使顆粒樹脂2007往模穴2010落下之習知方法，在顆 粒樹脂2007碰撞到模穴2〇1〇時產生顆粒樹脂2〇〇7等飛散。 15藉此，可防止異物殘存於下模或基板表面上。因此，不需 要異物之清潔，並且可防止附著於基板之異物導致製品之 成品率低下。因此，可提升構成製品之一部份份之樹脂成 形體2012的生產性。 又’由於不需要在習知之顆粒樹脂2007的供給機構設 2〇置遮板等機構’因此可防止遮板因為顆粒樹脂的附著而無 法動作等問題發生。因此，可提升製品的生産性。 又’模六2010内之顆粒樹脂2007具有均一的厚度。因 此’熱會由顆粒樹脂2〇〇7的下面以均一的速度傳導到上 面。藉此，由於構成顆粒樹脂2〇〇7之顆粒之間存在有連通 48 200843930 孔，因此顆粒樹脂2007中所含之空氣及水分通過連通孔往 外部放出。因此，可防止空隙於樹脂成形體内形成。 【實施例5】 其次，使用第35圖及第36圖，說明實施例5之電子零件 5 的壓縮成形方法及使用於該方法之裝置。 又，第35圖及第36圖所示之電子零件之壓縮成形裝置 之模組品、與第33圖等所示之實施例4之模組品之間基本上 具有相同構造。因此，該等相同構造則賦與相同標號，不 重複說明。 1〇 如第35圖及第36圖所示，裝置2041具有下模2004。下 模2004具有模穴2010。模穴2010之底面係由底面構件2011 所構成。模穴2010嵌入有具有凹部之薄膜2015之凹部 2014。顆粒樹脂2007供給至凹部2014。顆粒樹脂2007呈平 坦化且具有均一之厚度。又，具有凹部之薄膜2015可藉由 15 内裝載機2042插入模穴2010。 又’内裝載機2042具有：具有貫通孔2043之本體2044、 及關閉貫通孔2043、及可防止樹脂飛散之蓋構件2045。如 第35圖及第36圖所示，蓋構件2045嵌入於貫通孔2043。又， 與實施例4相同，雖然内裝載機2042之本體2044未圖示，但 20 其具有一由下面2047通過本體2044之内部之吸引孔。又， 由於平坦化樹脂載置薄膜2016 (具有凹部之薄膜2015)係 通過連通於模穴2010之吸引孔而吸引模穴2〇1〇内之空氣， 因此緊密附著於模穴2010。 又’為了使複數之電子零件能夠在1個模穴2010内一次 49 200843930 壓縮成形’因此具有本實施例之蓋構件2045之内裝載機 2042宜使用於模穴2〇1〇的底面非常大之情況。 又，内裝載機2042吸附於平坦化樹脂載置薄膜2016 日守’如第36圖所示，蓋構件2045之下面2047與業經平坦化 5之顆粒樹脂2007的上面之間存在有間隔S。也就是說，蓋 構件2045的下面2047與顆粒樹脂2007的上面未接觸。因 此，可防止顆粒樹脂2007附著於蓋構件2045的下面2047。 根據實施例4之裝置，當内裝載機2〇〇2吸附平坦化樹脂 載置薄膜2016時，恐怕凹部2014内之顆粒樹脂2007會飛散 10而附著於本體2031的下面2032。然而，根據實施例5之裝 置’由於有前述間隔S，因此可防止顆粒樹脂2007附著於 盍構件2045的下面2047。又，蓋構件2045的下面2047相當 於實施例4所示之内裝載機2002之本體2031的下面2032。 其他’根據本實施例之電子零件的壓縮成形方法及使 15用於该方法之裝置，可達到與實施例4之裝置所可得到之效 果同樣的效果。 【實施例6】 其次，使用第37圖及第38圖，說明實施例6之電子零件 的壓縮成形裝置及方法。第37圖及第38圖所示之電子零件 2〇的壓縮成形裝置之模組品、與第33圖等所揭示之實施例4之 Μ組品之間基本上具有相同構造。因此，該等相同構造之 間則賦與相同標號，不重複說明。 如第37圖及第38圖所示，本實施例之裝置2051具有下 核2004及内裝載機2052。下模2004具有模六2010。模穴2010 50 200843930 之底面係由底面構件2011所構成。又，内裝載機2052係搬 運將顆粒樹脂2007供給至之凹部2014之具有凹部之薄膜 2015。内裝載機2052具有：本體2054、按壓平坦化機構 2055、及薄膜固定具2057。本體2054具有貫通孔2053。按 5 壓平坦化機構2055可藉由按壓而使凹部2014内之顆粒樹脂 2007平坦化。薄膜固定具2057將供給顆粒樹脂2007於凹部 2014之具有凹部之薄膜2015固定於本體2054之下面2056。 又，按壓平坦化機構2055具有··使貫通孔2053内朝上 下方向移動之按壓平坦化構件2058、及設置於本體2054與 10 按壓平坦化構件2058之間之彈簧等彈性構件2059。按壓平 坦化構件2058之按壓面可藉由按壓使凹部2014内之顆粒樹 脂2007平坦化。結果，顆粒樹脂2007之厚度會變得均一。 又，亦可於按壓平坦化構件2058之按壓面設置如鐵就龍（登 録商標）等對於樹脂之離型性良好之樹脂離型層2〇6〇。又， 15亦可在具有凹部之薄膜2015拉開之狀態下緊密附著於内裝 載機2052之本體2054的下面2056。 根據上述本實施例之電子零件的壓縮成形裝置，可得 到與實施例4之電子零件之壓縮成形裝置所獲得之效果同 樣的效果。 20 又，本實施例中，當内裝載機2052搬運具有凹部之薄 膜2015，亦可藉由以按壓平坦化構件2058按壓凹部2014内 之顆粒樹脂2007，使顆粒樹脂2007平坦化。又，本實施例 中，當内裝載機2052搬運具有凹部之薄膜2〇15時，或者是 内裝載機2052將顆粒樹脂2007供給至模穴2〇1〇内時，若顆 51 200843930 粒樹脂2007的形狀崩壞時，則可藉由按壓平坦化構件2〇58 按壓凹部2014内之顆粒樹脂2007,使顆粒樹脂2007平坦化。 【實施例7】 其次’使用第39圖〜第46圖說明實施例7之電子零件的 5壓縮成形裝置及方法。 第39圖〜第41係顯示用以供給樹脂材料之機構，第42 圖〜第44圖係顯示内裝載機，第45圖及第46圖係顯示電子 零件之壓縮成形裝置。 第39圖〜第46圖所示之電子零件的壓縮成形裝置之模 10組品、與第33圖等所示之實施例4之模組品之間基本上具有 相同構造。因此，對於該等相同構造則賦與相同標號，不 重複說明。又，實施例7之方法並非是於供給顆粒樹脂2〇〇7 月(J，於離型膜2013形成凹部2〇14，此點與前述之實施例4〜 實施例6的方法不同。 15 更具體而言，本實施例之電子零件的壓縮成形方法 中，當顆粒樹脂2007供給至模穴2〇1〇時，具有平面形狀之 離型膜2013朝模穴2〇1〇被吸引。藉此，離型膜2〇13緊密附 著於模穴2010。結果，對應於模穴2〇1〇之形狀之凹部震 與同等之凹部成形於離型膜2〇丨3。 0 (電子零件之壓縮成形裳置） 本實施例之電子零件之壓縮成形裝置2〇61(以下，單稱 為「裝置2061」。）具有：與第33圖及第34圖所示者同樣之 上模2003及下模2004。又，裝置2〇61具有一可由呈捲取狀 態之離型膜切取具有預定大小之平面形狀之離型膜则之 52 200843930 切斷機構（未圖示）。 又，裝置2061係如第39圖〜第43所示，於模組品之外 部具有供給機構（基台）2062。供給機構（基台）2〇62將 顆粒樹脂2007投入離型膜2013上後，在離型膜2013上使顆 5粒樹脂2007平坦化。又，裝置2〇61具有一將載置於離型膜 2013上之顆粒樹脂2007搬運到模組品之内裝載機2063。 (才吴組品） 本實施例之下模2004係如第45圖及第46圖所示，具有 模穴2010。模穴2010具有開口 2009。模穴2010之底面係由 10底面構件2〇11所構成。雖然沒有圖示，但裝置2061由模穴 2010内之空間往外部將空氣強制排出之真空吸引機構（未 圖示），以使離型膜2013被覆模穴2010。真空吸引機構可藉 由該吸引作用使離型膜2013緊密附著於模穴;2010。 (供給機構） 15 又，本實施例之供給機構2062具有：薄膜載置構件 2064、基台、框架2065、及投入機構2023及用以使顆粒樹 脂2007平坦化之機構（未圖示）。薄膜載置構件2064上載置 有離型膜2013。基台上載置有薄膜載置構件2064。框架2065 載置於離型膜2013上。投入機構2023在計量顆粒樹脂2007 20 後投入至框架2065内。用以使顆粒樹脂2007平坦化之機構 使基台振動。 又，框架2065具有貫通孔2066。貫通孔2066為供給顆 粒樹脂2007之空間。因此，貫通孔2066皆對應於模穴2010 之形狀。又，貫通孔2066具有上側開口與下模開口。如第 53 200843930 40圖所示，貫通孔2〇66之下側開口係由離型膜2〇13所封閉。 又，與實施例4〜實施例6同樣，使顆粒樹脂2007平坦 化之機構可藉由使供給機構2062之基台、薄膜載置構件 2064、離型膜2013及框架2065振動而在貫通孔2066内使顆 5粒樹脂2〇〇7振動。結果，顆粒樹脂2007平坦化。又，該進 行平坦化之機構係亦可藉由按壓貫通孔2066内之顆粒樹脂 2007而進行平坦化之機構。藉由該等之平坦化機構，顆粒 樹脂2007的厚度成均一。再者，顆粒樹脂2〇〇7在除去框架 2065後，在平坦化狀態下殘存於離型膜2013上。 1〇 (内裝載機） 如前所述，如第42圖〜第44圖所示，本實施例之裝置 2061與實施例4〜6之裝置同樣具有將顆粒樹脂2007供給至 模穴2010内之内裝載機2063。内裝載機2063具有：本體、 及固定於本體之下面之模板2067。又，模板2067之下部設 15 有作為對應於模穴2010之形狀之凹部之樹脂收容空間 2068。 因此，模板2067之下部由樹脂收容空間2068的開口 2069、 及包圍開口2069之周緣部2070而構成。又，如第42 圖及第43圖所示，當用以保持模板2067之内裝載機2063往 下方移動時，載置有業經平坦化之顆粒樹脂2007之離型膜 20 2013接觸模板2067的下面、即周緣部2070。藉此，顆粒樹 脂2007收容於模板2067之樹脂收容空間2068。也就是說， 顆粒樹脂2007由離型膜2013與模板2067包覆於内。因此， 模板2067及顆粒樹脂2007搬送到模穴2010時，顆粒樹脂 2007則不會飛散。又，顆粒樹脂2007係在收容於樹脂收容 54 200843930 空間2068内之狀態下被搬送，因此可保持其平坦性。 又’雖然沒有圖示，但周緣部2070設有用以吸附離型 膜2013之吸引孔。又，吸引孔係通過真空管與真空泵連通。 真空泵為真空吸引機構之一例，真空管為真空路徑之一 5例。因此，離型膜2013利用真空泵之吸引作用吸附於模板 2067之周緣部2070。藉此，開口2069被離型膜2013封閉。 因此，將内含顆粒樹脂2007附有薄膜之模板2071可藉由内 裝載機2063往模穴2010搬送。 再者，當離型膜2013吸附於模板2067時，樹脂收容空 10間2068内之空氣亦可通過連通模板2〇67之樹脂收容空間 2068之吸引孔往外部排出。藉此，可輔助離型膜2〇13對模 板2067的吸附。 又，連通於模板2071之吸引孔之真空管設有開關閥。 開關閥係成可拆卸地設置在真空管。因此，在真空吸引結 15 束後，關閉開關閥，並由開關閥拆卸真空管管。另一方面， 實行真空吸引時，打開開關閥。藉此，内裝載機2063可利 用真空泵的作用藉由吸附來保持附有薄膜之模板2〇71並可 搬運到模穴2010。 又，如第45圖所示，附有薄膜之模板2071係藉由内裝 20 載機2063抵接於下模2004。藉此，模穴2010内之空間及樹 脂收容空間2068由下模2004及模板2071所密閉。此時，保 持顆粒樹脂2007之模板2071在離型膜2013挾持於其間之狀 態下，載置於下模2004之模面上以封住開口 2009。又，模 板2067之開口 2069、模穴2010之開口 2009及離型膜2013大 55 200843930 略位於同一平面内。 在此狀恶下，模穴2〇1〇内之空間的空氣可藉由真空吸 引而往外部排出。藉此，離型膜2013在模穴2010内移動。 其結果是，離型膜2013對應於模穴2010之形狀而吸附於模 5穴2010之表面。此時，樹脂收容空間2068内之顆粒樹脂2007 與離型膜2013 —同落下到模穴2〇1〇之底面。其結果是具有 均一厚度之顆粒樹脂2007會供給至被覆有離型膜2013之模 穴2010内。 (將電子零件壓縮成形之壓縮成形方法） 10 其次’說明本實施例之電子零件之壓縮成形方法。首 先，如第39圖所示，準備離型膜2013。其次，離型膜2013 載置於放置於供給機構2062上之薄膜載置構件2〇64的上 面。然後，於離型膜2013上設置框架2065。其次，如第40 圖所不’投入機構2023计ϊ顆粒樹脂2007，並將顆粒樹脂 15 2007投入框架2065之貫通孔2066。此時，顆粒樹脂2007係 形成如凸形。接著，如第41圖所示，用以使樹脂平坦化之 機構（未圖示）係藉由振動使框架2065之貫通孔2066内之 顆粒樹脂2007平坦化。結果，形成具有均一厚度之顆粒樹 脂2007 。 2〇 其次，框架2065由離型膜2013上之位置除去。顆粒樹 脂2007在具有均一厚度之狀態下殘存於離型膜2013上。其 次，如第42圖及第43圖所示，使保持模板2067之内裝載機 2063往下方移動。藉此，模板2067之開口 2069與離型膜2013 位於大略同一平面内。又’模板2067之周緣部2070與離型 56 200843930 膜2013接觸。結果，顆粒樹脂2〇〇7被離型膜2〇i3與模板2〇67 包覆於内。此時，顆粒樹脂2〇〇7維持著在模板2〇67之樹脂 收容空間2068内平坦化之狀態。 其次，空氣由離型膜2013與周緣部2〇7〇之間的空間通 5過模板2067之周緣部2070的吸引孔往外部排出。結果，離 型膜2013吸附於周緣部2〇7〇。藉此，形成保持顆粒樹脂2〇〇7 之模板2071。 其次，内裝載機2063往上方移動。藉此，如第44圖所 示，附有薄膜之模板2071在由内裝載機2063保持之狀態下 10 插入上模與下模2004之間。 其次’如第45圖所示，内裝載機2063由模穴2010上方 的位置往下方移動。藉此，保持顆粒樹脂2007之模板2071 抵接於下模2004以封住模穴2010。此時，模板2067之開口 2069、模穴2010之開口 2009、及離型膜2013係位於大略同 15 一平面内。 其次，模穴2010内之空氣藉由真空吸引機構而往外部 排出。藉此，如第46圖所示，離型膜2013對應於模穴2010 之形狀而吸附於模穴2010的表面。結果，形成如前述實施 例4〜實施例6所示之具有對應於具有凹部之薄膜2〇15之凹 20 部2014之離型膜2013。 此時，顆粒樹脂2007在該形狀維持在離型膜2〇13上之 狀態下由模板2067的樹脂收容空間2068落下到模穴2〇 1 〇之 底面。也就是說，顆粒樹脂2007維持具有均一厚度之狀態 並落下。換言之’顆粒樹脂2007的平坦性在落下之前後仍 57 200843930 可維持。又，若顆粒樹脂2007之平坦性在模穴2010内崩壞 日守，亦可藉由利用振動使顆粒樹脂平坦化之機構使内裝載 機2063振動，顆粒樹脂2〇〇7在模穴2〇1〇内成平坦化。 其次，停止使離型膜2013吸附於模板2067之真空吸 5引。然後，内裝載機2063往上方移動後，由上模與下模2〇〇4 之間的空間往外部朝水平方向移動。 其次，與實施例4〜實施例6同樣加熱下模2〇〇4。藉此， 顆粒樹脂2007由模穴2010之底面受熱。其熱會由顆粒樹脂 2007之下面以均一的速度傳導到上面。又，業經平坦化之 10顆粒樹脂2007之顆粒之間存在有間隙。該間隙係作為連通 孔。因此，顆粒樹脂2007中所含之空氣及水分會通過連通 孔而朝外部排氣。可防止空隙殘存於在模穴2〇1〇内壓縮成 形之樹脂成形體2012。 其次，關閉上模與下模2004。此時，基板2006會裝設 15於上模之基板裝設部2008。因此，安裝於基板2〇〇6之電子 零件2005會浸潰於熔融之樹脂材料中。其次，底面構件2〇11 對模穴2010内之溶融樹脂施加壓力。然後，經過硬化所必 要之時間，安裝於基板2006之電子零件2005會填封於對應 於模穴2010之形狀之樹脂成形體2012内。 20 根據上述本實施例之電子零件的壓縮成形裝置及方 法，可達到與上述實施例之電子零件的壓縮成形裝置及方 法所得效果相同之效果。 又，本實施例中，顆粒樹脂2007亦可藉由按壓而平坦 化，來取代對模板2067之樹脂收容空間2068的顆粒樹脂 58 200843930 2007施加振動以使顆粒樹脂2007平坦化，或者是對被 離型膜2013之模穴2010内之顆粒樹脂2007施加振動以:有 粒樹脂2007平坦化。 顆 又’在各實施例中係使用熱硬化性之樹脂材料， ’，隹亦 10 可使用熱可塑性之樹脂材料來取代之。又，各實施例中 係使用顆粒狀之樹脂材料，但亦可使用具有預定之极押八 布之粉狀樹脂材料、或者是粉末狀之樹脂材料等各種汛= 之树月曰材料來取代之。又，各實施例中，亦可使用如石夕、 之樹脂材料或環氧系之樹脂材料。又，各實施例中，亦可 使用具有透明性之樹脂材料、具有半透明性之樹脂材料、 含有燐光物質及螢光物質之樹脂材料。又，上述各實施例 中，亦可使用在常溫且為常壓之環境氣體中成液體狀之液 狀樹脂來取代顆粒樹脂。 15 【圖式簡單說明】 第1圖係概略顯示用以收容實施例丨之電子零件之壓縮 成形方法中所使用之樹脂之模板與供給樹脂材料之機構之 立體圖，且顯示樹脂材料供給至模板之狀態。 第2圖係概略顯示實施例丨之模板之截面圖，且顯示離 20型膜被覆於投入有樹脂材料之模板之狀態。 第3圖係概略顯示實施例丨之模板之截面圖，且顯示第2 圖所示之被覆有離型膜之模板翻過來之狀態。 第4圖係概略顯示實施例丨之模組品之截面圖，且顯示 第3圖所示之模板移送到模組品之狀態。 59 200843930 第5圖係概略顯示實施例1之模組品之截面圖，且顯示 樹脂材料由模板之貫通孔往模穴剛落下後之狀態。 第6圖係概略顯示實施例1之模組品之截面圖，且顯示 模組品關閉之狀態。 5 第7圖係概略顯示習知之電子零件的壓縮成形方法中 所使用之模組品之縱截面圖。 第8圖係顯示實施例2之電子零件的壓縮成形方法中， 離型膜即將被框架挾持之前的狀態。 ι〇 第9圖係顯示實施例2之電子零件的壓縮成形方法中， 樹脂材料剛往模板之樹脂收容空間投入後之狀態。 第10圖係顯示實施例2之電子零件的壓縮成形方法，模 板之開口被挾持於框架之離型膜封閉之狀態。 第11圖係顯示實施例2之電子零件的壓縮成形方法 15中，抉持於框架之離型膜緊密附著於顆粒樹脂之狀態。 第12圖係顯示在實施例2之電子零件的壓縮成形方法 中，離型膜藉由吸附被覆之模板設置於内裝載機之狀態。 、第13圖係顯示實施例2之電子零件之電子零件的壓縮 成形方法中，在模組品打開之狀態下，裝著於内裝載機之 扣拉板^離型膜介於其中之狀態下，載至於下模上之狀態。 、第14圖係顯示實施例2之電子零件之電子零件的壓縮 成形方法中，樹脂材料由模板之樹脂收容空間往下模之模 穴供給後之狀態。 果 、第15圖係顯示實施例2之電子零件之電子零件的壓縮 成形方法中，樹脂材料由模板往下模供給後，使模板振動 200843930 之狀態。 第16圖係顯示實施例2之電子零件之電子零件的壓縮 成形方法中，模組品關閉之狀態。 第17圖係概略顯示使用於說明實施形態之電子零件的 5 壓縮成形方法之預備加熱機構之平面圖。 第18圖係顯示實施例3之電子零件之電子零件的壓縮 成形方法中，使用預備加熱機構之狀態。 第19圖係顯示實施例3之電子零件之電子零件的壓縮 成形方法中，預先經過加熱之樹脂材料設置於離型膜上之 10 框架内之狀態。 第20圖係顯示實施例3之電子零件之電子零件的壓縮 成形方法中，具有均一厚度之樹脂材料殘存於離型膜上之 狀態。 第21圖係顯示其他例之電子零件之壓縮成形方法中所 15 使用之模組品。 第22圖係顯示習知之電子零件的壓縮成形方法中所使 用I、之模組品之截面圖，並顯示樹脂材料往模穴供給後之 狀態。 第23圖係概略顯示實施例4之成形機構之截面圖，且顯 20 示了即將於離型膜形成凹部之狀態。 第24圖係概略顯示實施例4之成形機構之截面圖，且顯 示了於離型膜形成凹部時之狀態。 第25圖係概略顯示實施例4之成形機構之截面圖，且顯 示了於離型膜形成凹部後之狀態。 61 200843930 第26圖係概略顯示實施例4之電子零件之壓縮成形裝 置之用以投入樹脂材料之機構。 第27圖係概略顯示實施例4之電子零件之壓縮成形裝 置之藉由振動使樹脂材料平坦化之機構。 5 第28圖係概略顯示實施例4之電子零件之壓縮成形裝 置之藉由按壓使樹脂材料平坦化之工具之截面圖。 第29圖係顯示實施例4之電子零件的壓縮成形裝置 中，内裝載機即將吸附於凹部具有業已平坦化之顆粒樹脂 之離型膜之狀態。 10 第30圖係顯示實施例4之電子零件的壓縮成形裝置中， 内裝載機即將吸附於凹部具有業已平坦化之顆粒樹脂之7 4小Λ後之狀態。 第31圖係顯示實施例4之電子零件的壓縮成形裝置 中，於模穴之上方位置配置内裝載機狀態。 15 第32圖係顯示在實施例4之電子零件的壓縮成形裝置 中，吸附於内裝載機之離型膜的凹部插入模穴之狀態。 第33圖係顯示實施例4之模組品打開之狀態。 第34圖係顯示實施例4之模組品關閉之狀態。 第35圖係顯示實施例5之電子零件之壓縮成形裝置 20 中，内裝載機配置於模穴之上方位置之狀態。 第36圖係顯示實施例5之電子零件之壓縮成形裝置 中，吸附於内裝載機之離型膜之凹部嵌入於模穴之狀態。 第37圖係顯示實施例6之電子零件之壓縮成形裝置 中，内裝載機配置於模穴之上方位置之狀態。 62 200843930 第38圖係顯示實施例6之電子零件之壓縮成形裝置 中，吸附於内裝載機之離型膜的凹部嵌入於模穴之狀態。 第39圖係顯示實施例7之電子零件之壓縮成形裝置 中，供給機構之組裝步驟。 5 第40圖係顯示實施例7之電子零件之壓縮成形裝置 中，投入機構往模板之貫通孔投入樹脂材料之狀態。 第41圖係顯示實施例7之電子零件之壓縮成形裝置 中，模板之貫通孔内之業以平坦化之樹脂材料。 第42圖係顯示實施例7之電子零件之壓縮成形裝置 10 中，内裝載機即將吸附具有平面形狀之離型膜，即，不具 有凹部之離型膜之狀態。 第43圖係顯示實施例7之電子零件之壓縮成形裝置 中，内裝載機吸附具有平面形狀之離型膜時之狀態' 第44圖係顯示實施例7之電子零件之壓縮成形裝置 15 中，内裝載機藉由吸附保持具有平面形狀之離型膜一面使 之移動之狀態。 第45圖係顯示實施例7之電子零件之壓縮成形裝置 中，内裝載機配置於模穴之上方位置之狀態。 第46圖係顯示實施例7之電子零件之壓縮成形裝置 20 中，吸附於内裝載機且具有平面形狀之離型膜插入模穴之 狀態。 第47圖係顯示習知之電子零件之壓縮成形裝置中，供 給機構往模穴供給樹脂材料後之狀態。 63 200843930 主要元件符號說明】 1...模組品 31a...送出機構 2…上模 3 lb…接收機構 3...下模 32…投入機構 4…基板裝設部 33...進給計量機構 5...模穴 34...送料斗 6…顆粒樹脂 35…線性振動進給器 7...電子零件 36…模板計量機構 8…反 81...模組品 9...内裝載機 82…勒反 9a...卡止部 83...電子零件 %..·基板載置部 84…顆粒；f紂脂 10. · ·開口 85…上模 11...離型膜 1下模 12...相丨脂成形體 87··.模穴 21…模板 88...離型膜 22...桔i脂收容空間 89…供給機構 23 · · ·開口 90·.·遮板 24·.·周緣部 91…貫通孔 25…模板 92…顆粒樹脂之一部份 31.··供給機構 1001···模組品（裝置） 64 200843930 1002···上模 1003.. .下模 1004.. .電子零件 1005.. .基板 1006…基板裝設部 1007···開口 1008.. .模六 1009…按壓構件（模六底面構件） 1010…顆粒樹脂 1011…樹脂成形體 1012.. .離型膜 1013···内裝載機（供給機構） 1014…移動機構 1015···桿部 1016···汽缸 1017.. .移動機構 1018···桿部 1019···汽缸 1021.. .框架 1021a...上框架部 1021b...下框架部 1022…附有薄膜之框架 1023.. .卡止具 1025···本體 1026.. .裝卸台 1027…基板載置部 1028·.·裝設部 1029.··基台部 1031.. .模板 1032.. .樹脂收容空間 1033···開口 1034···周緣部 1041…供給機構 1042.. .計量投入部 1043.. .模板載置部 1050.. .電子零件之壓縮成形裝置 1051·.·預先加熱機構 1052…顆粒樹脂 1053.. .加熱部 1054.. .框架 1055.. .離型膜 1056···加熱面（裝設面） 65 200843930 1057…蓋構件 1058…加熱機構 1059…内裝載機 2001.. .電子零件之壓縮成形裝置 2002…内裝載機 2003··.上模 2004.. .下模 2005.. .電子零件 2006.. .¾¾ 2007···顆粒樹脂 2008…基板裝設部 2009···開口 2010.. .模穴 2011…底面構件 2012.. .樹脂成形體 2013.. .離型膜 2014.··凹部 2015…具有凹部之薄膜 2016.. .平坦化樹脂載置薄膜 2021···供給機構（基台） 2022…成形機構 2023…投入機構 2024···模 2025.. .沖壓機 2026.. .凹部 2027.. .成形面 2028.. .按壓平坦具 2031···本體 2032.. .下面 2041.. .電子零件之壓縮成形裝置 2042…内裝載機 2043.. .貫通孔 2044···本體 2045…蓋構件 2046.. .下面 2047…下面 2051.. .電子零件之;樹脂填封成形 裝置 2052…内裝載機 2053···貫通孔 2054···本體 2055…按壓平坦化機構 66 200843930 2056.. .下面 2057.. .薄膜固定具 2058…按壓平坦化構件 2059…彈性構件 2060.. .樹脂離型層 2061.. .電子零件之壓縮成形裝置 2062···供給機構（基台） 2063.. .内裝載機 2064…薄膜載置構件 2065.··薄膜 2066···貫通孔 2067.. .模板 2068…樹脂收容空間 2069···開口 2070···周緣部 2071…附有薄膜之模板 2101…電子零件之壓縮成形裝置 2102···上模 2103.. .下模 2104.. .離型膜 2105.··模穴 2106…顆粒樹脂 2106a…顆粒樹脂之一部份 2107…底面構件 2108···供給構件 2109.··貫通孔 2110···遮板 2121···鉍 2122.. .電子零件 5.. .間隔 67Next, the inner loader 2002 moves upward. Next, the state of the lower surface 2032 is as shown in Fig. 31, and the loader 2002 of the flattening resin mounting film 2016 is transported to the cavity 2010. At this time, the inner loader 2002 which is adsorbed by the flattening resin mounting film 2016 is inserted between the upper mold 2003 and the lower mold 2004. Thereby, the inner loader 2002 will be positioned above the cavity 2010 of the lower die 2004. 5 Next, as shown in Fig. 32, the recessed portion 2014 of the film 2015 having the recessed portion is inserted into the cavity 2010. Next, the inner loader 2002 ends the adsorption of the film 2015 having the recess. Then, as shown in Fig. 33, the inner loader 2002 moves upward. Thereby, the film covering the recessed portion 2015 ends the step of covering the die faces of the cavity 2010 and the lower die 2004. 1 〇 (Compression molding) Next, the step of compression molding of the electronic component 2005 mounted on the substrate 2006 by the resin material in the cavity 2010 will be described using FIG. In the cavity 2010 covered with the recessed portion 2014, the particulate resin 2007 is melted by heating. Then, as shown in Fig. 34, the upper mold 2003 and the lower mold 2004 are closed. By the way, in the state in which the substrate 2006 is mounted on the upper mold 2003, the electronic component 2005 mounted on the substrate 2006 is immersed in the molten resin material in the cavity 2010. Then, the bottom member 2011 of the cavity presses the molten resin in the cavity 2010. Thereby, a predetermined pressure is applied to the molten resin in the cavity 2010. After the time necessary for hardening the molten resin, the upper mold 2003 and the lower mold 20 2004 are opened. Thereby, the electronic component 2005 mounted on the substrate 2006 is filled in the resin molded body 2012 corresponding to the shape of the cavity 2010. (Operation and Effect) According to the compression molding method of the electronic component of the present embodiment, the particulate resin 2007 is supplied to the cavity 2〇1〇 while being placed on the release film 2〇13. As a result of 47 200843930, the mechanism for supplying the resin material to the cavity does not leave the particulate resin 2007. As a result, the amount of the particulate resin 2〇〇7 supplied to the cavity 2〇1〇 is high. Further, the mold hole 2010 can be supplied with the particulate resin 5 2007 having a uniform thickness. Therefore, the particulate resin 2007 can be uniformly melted and melted in the cavity 201〇. As a result, it is possible to prevent a portion separated from the other portion from occurring in the resin material of the cavity 2〇1〇. Therefore, the quality and reliability of the resin molded body 2〇12 can be improved. Further, in the compression molding method of the electronic component of the present embodiment, the internal loading machine 2002 moves the release film 2013 on which the particulate resin 2007 is placed from the upper position of the cavity 2〇1〇 to the cavity 2010, whereby the particles are moved. Resin 2〇〇7 is supplied to the cavity 2010. Therefore, the compression molding method of the electronic component according to the present embodiment does not produce a granular resin 2 when the particle resin 2007 collides with the cavity 2〇1〇 as in the conventional method of dropping the granular resin 2007 to the cavity 2010. 7 and so on. 15 Thereby, foreign matter can be prevented from remaining on the surface of the lower mold or the substrate. Therefore, it is not necessary to clean foreign matter, and foreign matter adhering to the substrate can be prevented from causing a low yield of the product. Therefore, the productivity of the resin molded body 2012 constituting a part of the product can be improved. Further, since it is not necessary to provide a mechanism such as a shutter in the supply mechanism of the conventional granular resin 2007, it is possible to prevent the shutter from being incapable of operating due to adhesion of the particulate resin. Therefore, the productivity of the product can be improved. Further, the granular resin 2007 in the mold 6 2010 has a uniform thickness. Therefore, the heat is conducted to the upper surface by the lower surface of the granular resin 2?7 at a uniform speed. Thereby, since the pores constituting the granule resin 2〇〇7 are connected to each other, the air and moisture contained in the granule resin 2007 are discharged to the outside through the communication hole. Therefore, it is possible to prevent voids from being formed in the resin molded body. [Embodiment 5] Next, a compression molding method of the electronic component 5 of the fifth embodiment and an apparatus used in the method will be described using Figs. 35 and 36. Further, the module product of the compression molding apparatus for electronic parts shown in Figs. 35 and 36 has substantially the same structure as the module product of the fourth embodiment shown in Fig. 33 and the like. Therefore, the same configurations are assigned the same reference numerals and the description is not repeated. 1A As shown in Figs. 35 and 36, the device 2041 has a lower mold 2004. The lower mold 2004 has a cavity 2010. The bottom surface of the cavity 2010 is composed of the bottom member 2011. The cavity 2010 is embedded with a recess 2015 of the film 2015 having a recess. The particulate resin 2007 is supplied to the recessed portion 2014. The particulate resin 2007 is flat and has a uniform thickness. Further, the film 2015 having the concave portion can be inserted into the cavity 2010 by the 15 inner loader 2042. Further, the inner loader 2042 has a main body 2044 having a through hole 2043, a closing through hole 2043, and a cover member 2045 capable of preventing resin from scattering. As shown in Figs. 35 and 36, the cover member 2045 is fitted in the through hole 2043. Further, in the same manner as in the fourth embodiment, although the main body 2044 of the inner loader 2042 is not shown, it has a suction hole which passes through the inside of the main body 2044 from the lower surface 2047. Further, since the flattened resin-mounted film 2016 (the film 2015 having the concave portion) attracts the air in the cavity 2〇1〇 by the suction hole that communicates with the cavity 2010, it adheres closely to the cavity 2010. Further, in order to enable the plurality of electronic components to be compression-molded once in one cavity 2010, the final loader 2042 of the cover member 2045 of the present embodiment is preferably used for the bottom surface of the cavity 2〇1〇. Happening. Further, the inner loader 2042 is adsorbed to the flattening resin mounting film 2016. As shown in Fig. 36, a gap S exists between the lower surface 2047 of the lid member 2045 and the upper surface of the granular resin 2007 which is planarized 5. That is, the lower surface 2047 of the cover member 2045 is not in contact with the upper surface of the particulate resin 2007. Therefore, the particulate resin 2007 can be prevented from adhering to the lower surface 2047 of the cover member 2045. According to the apparatus of the fourth embodiment, when the inner loader 2〇〇2 adsorbs the flattening resin mounting film 2016, it is feared that the granular resin 2007 in the concave portion 2014 is scattered by 10 and adheres to the lower surface 2032 of the main body 2031. However, the apparatus according to Embodiment 5 can prevent the particulate resin 2007 from adhering to the lower surface 2047 of the crucible member 2045 due to the aforementioned interval S. Further, the lower surface 2047 of the cover member 2045 corresponds to the lower surface 2032 of the body 2031 of the inner loader 2002 shown in the fourth embodiment. Others' compression molding method of the electronic component according to the present embodiment and the apparatus for using the same can achieve the same effects as those obtainable by the apparatus of the fourth embodiment. [Embodiment 6] Next, a compression molding apparatus and method for an electronic component according to Embodiment 6 will be described using Figs. 37 and 38. The module of the compression molding apparatus of the electronic component 2 shown in Figs. 37 and 38 has substantially the same configuration as the assembly of the embodiment 4 disclosed in Fig. 33 and the like. Therefore, the same reference numerals are given between the same structures, and the description is not repeated. As shown in Figs. 37 and 38, the apparatus 2051 of this embodiment has a lower core 2004 and an inner loader 2052. The lower mold 2004 has a mold six 2010. The bottom surface of the cavity 2010 50 200843930 is composed of the bottom member 2011. Further, the inner loader 2052 transports the film 2015 having the concave portion of the concave portion 2014 to which the granular resin 2007 is supplied. The inner loader 2052 has a main body 2054, a pressing flattening mechanism 2055, and a film holder 2057. The body 2054 has a through hole 2053. The pressing of the granular resin 20 in the concave portion 2014 by pressing the pressing flattening mechanism 2055 can be flattened. The film holder 2057 fixes the film 2015 having the concave portion of the granule resin 2007 in the concave portion 2014 to the lower surface 2056 of the body 2054. Further, the pressing flattening mechanism 2055 includes a pressing flattening member 2058 that moves the inside of the through hole 2053 in the vertical direction, and an elastic member 2059 such as a spring that is provided between the main body 2054 and the 10 pressing flattening member 2058. Pressing the pressing surface of the flattening member 2058 can flatten the particulate resin 2007 in the recess 2014 by pressing. As a result, the thickness of the particulate resin 2007 becomes uniform. Further, a resin release layer 2〇6〇 which is excellent in release property from resin such as Tielong (registered trademark) may be provided on the pressing surface of the pressing flattening member 2058. Further, 15 may be closely adhered to the lower surface 2056 of the body 2054 of the internal carrier 2052 in a state in which the film 2015 having the concave portion is pulled apart. According to the compression molding apparatus for an electronic component of the present embodiment described above, the same effects as those obtained by the compression molding apparatus for the electronic component of the fourth embodiment can be obtained. Further, in the present embodiment, when the inner loader 2052 conveys the film 2015 having the concave portion, the granular resin 2007 can be flattened by pressing the granular resin member 2007 in the concave portion 2014 by pressing the flattening member 2058. Further, in the present embodiment, when the inner loader 2052 transports the film 2〇15 having the concave portion, or the inner loader 2052 supplies the granular resin 2007 to the cavity 2〇1〇, if the particle 51 200843930 granule resin 2007 When the shape of the shape collapses, the granular resin 2007 can be flattened by pressing the planarizing member 2〇58 to press the particulate resin 2007 in the concave portion 2014. [Embodiment 7] Next, a 5 compression molding apparatus and method for an electronic component of Embodiment 7 will be described using Figs. 39 to 46. Figs. 39 to 41 show the mechanism for supplying the resin material, and Figs. 42 to 44 show the internal loader, and Figs. 45 and 46 show the compression molding apparatus for the electronic component. The mold assembly 10 of the electronic component compression molding apparatus shown in Figs. 39 to 46 has substantially the same structure as the module product of the fourth embodiment shown in Fig. 33 and the like. Therefore, the same reference numerals are given to the same structures, and the description is not repeated. Further, the method of the seventh embodiment is not to supply the pellet resin for 2 〇〇 7 months (J, the recess 2 〇 14 is formed in the release film 2013, which is different from the methods of the above-described Embodiments 4 to 6. 15 Specifically, in the compression molding method of the electronic component of the present embodiment, when the particulate resin 2007 is supplied to the cavity 2〇1〇, the release film 2013 having a planar shape is attracted toward the cavity 2〇1〇. The release film 2〇13 is closely attached to the cavity 2010. As a result, the concave portion corresponding to the shape of the cavity 2〇1〇 and the same concave portion are formed on the release film 2〇丨3. 0 (Compression molding of the electronic component The electronic component compression molding apparatus 2〇61 (hereinafter, simply referred to as "device 2061") has the same upper mold 2003 and lower mold 2004 as those shown in Figs. 33 and 34. Further, the apparatus 2〇61 has a release mechanism (not shown) which can cut a release film having a planar shape of a predetermined size from a release film in a wound state. Further, the device 2061 is the 39th. As shown in Fig. 43, there is a supply mechanism (base) 2062 outside the module. After the mechanism (base) 2〇62 puts the granular resin 2007 on the release film 2013, the five resins 2007 are flattened on the release film 2013. Further, the device 2〇61 has a load on the release film. The pellet resin in 2013 was transported to the loader 2063 in the module product. (Key Wu product) The lower mold 2004 of this embodiment has a cavity 2010 as shown in Fig. 45 and Fig. 46. The cavity 2010 has an opening. 2009. The bottom surface of the cavity 2010 is composed of 10 bottom members 2〇11. Although not shown, the device 2061 is a vacuum suction mechanism (not shown) for forcibly discharging air from the space in the cavity 2010 to the outside. The release film 2013 is covered with the cavity 2010. The vacuum suction mechanism can adhere the release film 2013 to the cavity by the attraction; 2010. (Supply mechanism) 15 Further, the supply mechanism 2062 of the present embodiment has a film loading The member 2064, the base, the frame 2065, and the input mechanism 2023 and a mechanism (not shown) for flattening the granular resin 2007. The release film 2013 is placed on the film mounting member 2064. The film is placed on the base. Mounting member 2064. Frame 2065 is placed on the release In 2013, the input mechanism 2023 is put into the frame 2065 after the measurement of the granular resin 2007 20. The mechanism for flattening the granular resin 2007 vibrates the base. Further, the frame 2065 has a through hole 2066. The through hole 2066 is a supply of granular resin. Therefore, the through hole 2066 corresponds to the shape of the cavity 2010. Further, the through hole 2066 has an upper opening and a lower die opening. As shown in Fig. 53 200843930 40, the lower opening of the through hole 2〇66 is It is closed by the release film 2〇13. Further, similarly to the fourth to sixth embodiments, the mechanism for flattening the particulate resin 2007 can be made to pass through the through hole 2066 by vibrating the base of the supply mechanism 2062, the film mounting member 2064, the release film 2013, and the frame 2065. The inside of the 5 resin 2 〇〇 7 vibrates. As a result, the particulate resin 2007 is flattened. Further, the mechanism for flattening can also be a mechanism for flattening by pressing the particulate resin 2007 in the through hole 2066. With these flattening mechanisms, the thickness of the particulate resin 2007 is uniform. Further, after removing the frame 2065, the particulate resin 2〇〇7 remains on the release film 2013 in a planarized state. 1〇 (internal loader) As described above, as shown in FIGS. 42 to 44, the apparatus 2061 of the present embodiment and the apparatus of the embodiments 4 to 6 have the same supply of the granular resin 2007 to the cavity 2010. Inner loader 2063. The inner loader 2063 has a body and a template 2067 fixed to the underside of the body. Further, a lower portion of the template 2067 is provided with a resin accommodating space 2068 as a concave portion corresponding to the shape of the cavity 2010. Therefore, the lower portion of the template 2067 is constituted by the opening 2069 of the resin accommodating space 2068 and the peripheral edge portion 2070 surrounding the opening 2069. Further, as shown in Figs. 42 and 43, when the loader 2063 for holding the template 2067 is moved downward, the release film 20 2013 on which the planarized granular resin 2007 is placed contacts the lower surface of the template 2067. That is, the peripheral portion 2070. Thereby, the granule resin 2007 is housed in the resin accommodating space 2068 of the stencil 2067. That is, the particulate resin 2007 is covered by the release film 2013 and the template 2067. Therefore, when the template 2067 and the particulate resin 2007 are transferred to the cavity 2010, the particulate resin 2007 does not scatter. Further, since the particulate resin 2007 is transported in a state of being housed in the resin housing 54 200843930 space 2068, the flatness can be maintained. Further, although not shown, the peripheral portion 2070 is provided with a suction hole for adsorbing the release film 2013. Further, the suction hole is connected to the vacuum pump through a vacuum tube. The vacuum pump is an example of a vacuum suction mechanism, and the vacuum tube is one of five vacuum paths. Therefore, the release film 2013 is adsorbed to the peripheral edge portion 2070 of the template 2067 by the suction action of the vacuum pump. Thereby, the opening 2069 is closed by the release film 2013. Therefore, the template 2071 to which the film resin 2007 is attached with a film can be transferred to the cavity 2010 by the internal loader 2063. Further, when the release film 2013 is adsorbed to the stencil 2067, the air in the room 20068 of the resin accommodating space can be discharged to the outside through the suction hole of the resin accommodating space 2068 of the stencil 2 〇 67. Thereby, the adsorption of the mold film 2067 by the release film 2〇13 can be assisted. Further, a vacuum tube that communicates with the suction hole of the template 2071 is provided with an on-off valve. The switching valve is detachably disposed in the vacuum tube. Therefore, after the vacuum suctions the bundle 15, the on-off valve is closed, and the vacuum tube is removed by the on-off valve. On the other hand, when vacuum suction is applied, the on-off valve is opened. Thereby, the inner loader 2063 can hold the film-attached template 2〇71 by suction by the action of the vacuum pump and can be carried to the cavity 2010. Further, as shown in Fig. 45, the template 2071 with the film attached thereto is brought into contact with the lower mold 2004 by the internal 20-carrier 2063. Thereby, the space in the cavity 2010 and the resin accommodating space 2068 are sealed by the lower mold 2004 and the template 2071. At this time, the template 2071 holding the particulate resin 2007 is placed on the mold surface of the lower mold 2004 to seal the opening 2009 while the release film 2013 is held therebetween. Further, the opening 2069 of the template 2067, the opening 2009 of the cavity 2010, and the large release film 2013 55 200843930 are located in the same plane. Under this circumstance, the air in the space inside the cavity can be discharged to the outside by vacuum suction. Thereby, the release film 2013 moves within the cavity 2010. As a result, the release film 2013 is adsorbed on the surface of the die hole 2010 in accordance with the shape of the cavity 2010. At this time, the granular resin 2007 in the resin accommodating space 2068 is dropped to the bottom surface of the cavity 2〇1〇. As a result, the particulate resin 2007 having a uniform thickness is supplied to the cavity 2010 covered with the release film 2013. (Compression molding method for compression molding of electronic parts) 10 Next, the compression molding method of the electronic component of the present embodiment will be described. First, as shown in Fig. 39, the release film 2013 is prepared. Next, the release film 2013 is placed on the upper surface of the film mounting member 2〇64 placed on the supply mechanism 2062. Then, a frame 2065 is provided on the release film 2013. Next, as shown in Fig. 40, the input mechanism 2023 counts the granule resin 2007, and the granule resin 15 2007 is put into the through hole 2066 of the frame 2065. At this time, the particulate resin 2007 is formed into a convex shape. Next, as shown in Fig. 41, a mechanism (not shown) for flattening the resin flattens the granular resin 2007 in the through hole 2066 of the frame 2065 by vibration. As a result, a granulated resin having a uniform thickness was formed. 2〇 Next, the frame 2065 is removed from the position on the release film 2013. The particulate resin 2007 remains on the release film 2013 in a state of uniform thickness. Next, as shown in Figs. 42 and 43, the loader 2063 of the holding template 2067 is moved downward. Thereby, the opening 2069 of the template 2067 is located in substantially the same plane as the release film 2013. Further, the peripheral portion 2070 of the template 2067 is in contact with the release film 56 200843930 film 2013. As a result, the particulate resin 2〇〇7 was coated with the release film 2〇i3 and the template 2〇67. At this time, the granular resin 2〇〇7 is maintained in a state of being flattened in the resin accommodating space 2068 of the template 2〇67. Next, the air is discharged to the outside from the space between the release film 2013 and the peripheral portion 2〇7〇 through the suction hole of the peripheral edge portion 2070 of the template 2067. As a result, the release film 2013 was adsorbed to the peripheral portion 2〇7〇. Thereby, the template 2071 holding the particulate resin 2〇〇7 is formed. Next, the inner loader 2063 moves upward. Thereby, as shown in Fig. 44, the film-attached template 2071 is inserted between the upper mold and the lower mold 2004 in a state of being held by the inner loader 2063. Next, as shown in Fig. 45, the inner loader 2063 is moved downward from the position above the cavity 2010. Thereby, the template 2071 of the particulate resin 2007 is held in contact with the lower mold 2004 to seal the cavity 2010. At this time, the opening 2069 of the template 2067, the opening 2009 of the cavity 2010, and the release film 2013 are located in a plane similar to the 15th. Next, the air in the cavity 2010 is discharged to the outside by the vacuum suction mechanism. Thereby, as shown in Fig. 46, the release film 2013 is adsorbed to the surface of the cavity 2010 in accordance with the shape of the cavity 2010. As a result, the release film 2013 having the concave portion 20 corresponding to the film 2〇15 having the concave portion as shown in the above-described Embodiments 4 to 6 was formed. At this time, the granule resin 2007 is dropped from the resin accommodating space 2068 of the stencil 2067 to the bottom surface of the cavity 2 〇 1 在 in a state where the shape is maintained on the release film 2〇13. That is, the particulate resin 2007 maintains a state of uniform thickness and falls. In other words, the flatness of the particulate resin 2007 is maintained after the fall of 57 200843930. Further, if the flatness of the particulate resin 2007 collapses in the cavity 2010, the inner loader 2063 can be vibrated by a mechanism for flattening the granular resin by vibration, and the granular resin 2〇〇7 is in the cavity 2〇 1〇 is flattened. Next, the vacuum suction of the release film 2013 to the template 2067 is stopped. Then, after the inner loader 2063 moves upward, the space between the upper mold and the lower mold 2〇〇4 moves to the outside in the horizontal direction. Next, the lower mold 2〇〇4 was heated in the same manner as in the fourth to sixth embodiments. Thereby, the particulate resin 2007 is heated by the bottom surface of the cavity 2010. The heat is conducted to the top by a uniform velocity below the granular resin 2007. Further, there is a gap between the particles of the planarized 10 granule resin 2007. This gap serves as a communication hole. Therefore, the air and moisture contained in the particulate resin 2007 are exhausted to the outside through the communication holes. It is possible to prevent voids from remaining in the resin molded body 2012 which is compressed and formed in the cavity 2〇1〇. Next, the upper and lower molds 2004 are closed. At this time, the substrate 2006 is mounted with the substrate mounting portion 2008 of the upper mold. Therefore, the electronic component 2005 mounted on the substrate 2〇〇6 is immersed in the molten resin material. Next, the bottom member 2〇11 applies pressure to the molten resin in the cavity 2010. Then, the electronic component 2005 mounted on the substrate 2006 is filled in the resin molded body 2012 corresponding to the shape of the cavity 2010, after the hardening time. According to the compression molding apparatus and method of the electronic component of the present embodiment described above, the same effects as those obtained by the compression molding apparatus and method of the electronic component of the above-described embodiment can be obtained. Further, in the present embodiment, the particulate resin 2007 may be planarized by pressing, instead of applying vibration to the particulate resin 58 200843930 2007 of the resin receiving space 2068 of the template 2067 to planarize the granular resin 2007, or to be separated. The particle resin 2007 in the mold hole 2010 of the film 2013 applied vibration to: the granular resin 2007 was flattened. Further, in each of the examples, a thermosetting resin material is used, and 隹10 can be replaced with a thermoplastic resin material. Further, in each of the examples, a granular resin material is used, but it is also possible to use a powdery resin material having a predetermined extreme pressure, or a powdery resin material, and the like. . Further, in each of the examples, a resin material such as a stone material or an epoxy resin material may be used. Further, in each of the examples, a resin material having transparency, a resin material having translucency, and a resin material containing a fluorescent material and a fluorescent material may be used. Further, in each of the above embodiments, a liquid resin which is liquid in an ambient gas at normal temperature and normal pressure may be used instead of the particulate resin. 15 [Brief Description of the Drawings] Fig. 1 is a perspective view schematically showing a mechanism for accommodating a resin used in a compression molding method for an electronic component of the embodiment and a mechanism for supplying a resin material, and showing that the resin material is supplied to the template. status. Fig. 2 is a cross-sectional view schematically showing a template of the embodiment, and shows a state in which the 20-type film is coated on the template into which the resin material is placed. Fig. 3 is a cross-sectional view schematically showing a template of the embodiment, and shows a state in which the template coated with the release film shown in Fig. 2 is turned over. Fig. 4 is a schematic cross-sectional view showing the module of the embodiment, and shows the state in which the template shown in Fig. 3 is transferred to the module. 59 200843930 Fig. 5 is a schematic cross-sectional view showing the module of the first embodiment, and shows the state in which the resin material has just fallen from the through hole of the template to the cavity. Fig. 6 is a schematic cross-sectional view showing the module of the embodiment 1 and showing the state in which the module is closed. 5 Fig. 7 is a longitudinal sectional view showing a module product used in a conventional compression molding method for electronic parts. Fig. 8 is a view showing a state before the release film is held by the frame in the compression molding method of the electronic component of the second embodiment. Fig. 9 is a view showing a state in which the resin material is put into the resin accommodating space of the stencil in the compression molding method of the electronic component of the second embodiment. Fig. 10 is a view showing a compression molding method of the electronic component of the embodiment 2, in which the opening of the template is held in a state in which the release film of the frame is closed. Fig. 11 is a view showing a compression molding method for the electronic component of the second embodiment, in which the release film held by the frame is in close contact with the granular resin. Fig. 12 is a view showing a state in which the release film is placed on the inner loader by the adsorption-coated template in the compression molding method of the electronic component of the second embodiment. And Fig. 13 is a view showing a compression molding method for the electronic component of the electronic component of the second embodiment, in a state in which the module product is opened, the buckle plate of the inner loader is placed in a state in which the release film is interposed therebetween. , the state of loading on the lower mold. Fig. 14 is a view showing a state in which the resin material is supplied from the resin accommodating space of the stencil to the cavity of the lower mold in the compression molding method of the electronic component of the electronic component of the second embodiment. In the compression molding method of the electronic component of the electronic component of the second embodiment, the resin material is supplied from the template to the lower mold, and the template is vibrated in the state of 200843930. Fig. 16 is a view showing a state in which the module is closed in the compression molding method of the electronic component of the electronic component of the second embodiment. Fig. 17 is a plan view schematically showing a preliminary heating mechanism used in the 5 compression molding method for explaining an electronic component of the embodiment. Fig. 18 is a view showing a state in which a preliminary heating mechanism is used in the compression molding method of the electronic component of the electronic component of the third embodiment. Fig. 19 is a view showing a state in which the resin material previously heated is placed in a frame of 10 on the release film in the compression molding method of the electronic component of the electronic component of the third embodiment. Fig. 20 is a view showing a state in which the resin material having a uniform thickness remains on the release film in the compression molding method of the electronic component of the electronic component of the third embodiment. Fig. 21 is a view showing a module used in the compression molding method of the electronic parts of other examples. Fig. 22 is a cross-sectional view showing a module product used in a conventional compression molding method for electronic parts, and showing a state in which the resin material is supplied to the cavity. Fig. 23 is a cross-sectional view schematically showing the molding mechanism of the embodiment 4, and shows a state in which the concave portion is formed in the release film. Fig. 24 is a cross-sectional view schematically showing the molding mechanism of the embodiment 4, and shows a state in which the recessed portion is formed in the release film. Fig. 25 is a cross-sectional view schematically showing the molding mechanism of the embodiment 4, and shows a state after the concave portion is formed in the release film. 61 200843930 Fig. 26 is a view schematically showing a mechanism for introducing a resin material into a compression molding apparatus for an electronic component of Embodiment 4. Fig. 27 is a view schematically showing a mechanism for flattening a resin material by vibration of the compression molding apparatus for an electronic component of the fourth embodiment. Fig. 28 is a cross-sectional view schematically showing a tool for flattening a resin material by press-molding of the electronic component compression molding apparatus of the fourth embodiment. Fig. 29 is a view showing the state of the compression molding apparatus for the electronic component of the fourth embodiment in which the inner loader is adsorbed to the recessed portion of the granular resin which has been flattened. 10 is a view showing a state in which the inner loader is about to be adsorbed to the recessed portion with the flattened granular resin after 7 hours of the compression molding apparatus of the electronic component of the fourth embodiment. Fig. 31 is a view showing the state in which the inner loader is placed above the cavity in the compression molding apparatus for the electronic component of the fourth embodiment. Fig. 32 is a view showing a state in which the concave portion of the release film adsorbed to the inner loader is inserted into the cavity in the compression molding apparatus for the electronic component of the fourth embodiment. Fig. 33 is a view showing the state in which the module of the embodiment 4 is opened. Fig. 34 is a view showing the state in which the module of the embodiment 4 is closed. Fig. 35 is a view showing a state in which the inner loader is disposed at a position above the cavity in the compression molding apparatus 20 of the electronic component of the fifth embodiment. Fig. 36 is a view showing a state in which the concave portion of the release film adsorbed to the inner loader is embedded in the cavity in the compression molding apparatus for the electronic component of the fifth embodiment. Fig. 37 is a view showing a state in which the inner loader is disposed at a position above the cavity in the compression molding apparatus for the electronic component of the sixth embodiment. 62 200843930 Fig. 38 is a view showing the compression molding apparatus for the electronic component of the embodiment 6, in which the concave portion of the release film adsorbed to the inner loader is embedded in the cavity. Fig. 39 is a view showing the assembly procedure of the supply mechanism in the compression molding apparatus for the electronic component of the seventh embodiment. Fig. 40 is a view showing a state in which the input mechanism puts a resin material into the through hole of the template in the compression molding apparatus for the electronic component of the seventh embodiment. Fig. 41 is a view showing the resin material which is flattened in the through hole of the template in the compression molding apparatus for the electronic component of the seventh embodiment. Fig. 42 is a view showing a state in which the inner loader is about to adsorb a release film having a planar shape, i.e., a release film having no concave portion, in the compression molding apparatus 10 of the electronic component of the seventh embodiment. Fig. 43 is a view showing a state in which the inner loader adsorbs the release film having a planar shape in the compression molding apparatus for the electronic component of the seventh embodiment. Fig. 44 is a view showing the compression molding apparatus 15 for the electronic component of the seventh embodiment. The inner loader is moved while holding the release film having a planar shape while being adsorbed. Fig. 45 is a view showing a state in which the inner loader is disposed at a position above the cavity in the compression molding apparatus for the electronic component of the seventh embodiment. Fig. 46 is a view showing a state in which the release film forming device 20 of the electronic component of the seventh embodiment is inserted into the cavity by the release film which is adsorbed to the inner loader and has a planar shape. Fig. 47 is a view showing a state in which the supply mechanism supplies the resin material to the cavity in the compression molding apparatus of the conventional electronic component. 63 200843930 Explanation of main component symbols] 1...module product 31a...feeding mechanism 2...upper die 3 lb...receiving mechanism 3...lower die32...input mechanism 4...substrate mounting section 33... Feeding mechanism 5... mold cavity 34...feed hopper 6...granular resin 35...linear vibrating feeder 7...electronic part 36...template measuring mechanism 8...reverse 81...module product 9.. The inner loader 82...the reverse 9a...the locking portion 83...the electronic component %..the substrate mounting portion 84...the granules; the f blush 10. · the opening 85...the upper mold 11...the distance Type film 1 lower mold 12... phase resin molded body 87·. mold cavity 21... template 88... release film 22... orange fat storage space 89... supply mechanism 23 · · · opening 90· .. shutter 24·. peripheral edge 91...through hole 25...template 92...one part of granular resin 31.·Supply mechanism 1001···Module product (device) 64 200843930 1002···上模1003 .. . Lower mold 1004.. . Electronic parts 1005.. Substrate 1006... Substrate mounting part 1007 · · · Opening 1008.. Mold six 1009... Pressing member (Mold six bottom member) 1010...Particle resin 1011...Resin Shaped body 1012.. Release film 1013 ···Internal loader (supply mechanism) 1014...moving mechanism 1015···rod 1016···cylinder 1017..moving mechanism 1018···rod 1019···cylinder 1021.. frame 1021a.. The upper frame portion 1021b...the lower frame portion 1022 is attached with a film frame 1023.. The locking device 1025···body 1026.. loading and unloading table 1027...substrate mounting portion 1028·.·mounting portion 1029 .. base table 1031.. template 1032.. resin storage space 1033 · · opening 1034 · · peripheral portion 1041 ... supply mechanism 1042.. metering input portion 1043.. template loading portion 1050. .. Compression forming device for electronic parts 1051·.·Preheating mechanism 1052...Particle resin 1053.. Heating part 1054.. Frame 1055.. Release film 1056···Heating surface (mounting surface) 65 200843930 1057... Cover member 1058... Heating mechanism 1059... Internal loader 2001.. Compression forming device for electronic parts 2002... Internal loader 2003··. Upper mold 2004.. Lower mold 2005.. . Electronic parts 2006.. . 3⁄43⁄4 2007···Particle Resin 2008... Substrate Mounting Department 2009··· Opening 2010.. Moulding 2011...Bottom member 2012.. Resin molded body 2013.. Film 2014.··Concave part 2015...film having a recessed portion 2016.. Flattening resin mounting film 2021···supply mechanism (base) 2022...forming mechanism 2023...injection mechanism 2024···mold 2025.. Machine 2026.. recessed portion 2027... forming surface 2028.. pressing flat tool 2031 ··· body 2032.. below 2041.. electronic component compression molding device 2042... internal loader 2043.. through hole 2044··· Body 2045... Cover member 2046.. Next 2047... Bottom 2051.. Electronic parts; Resin seal molding device 2052... Internal loader 2053... Through hole 2054··· Body 2055... Press flat Chemical mechanism 66 200843930 2056.. Next 2057.. film fixing device 2058... pressing flattening member 2059... elastic member 2060.. resin release layer 2061.. compression forming device for electronic parts 2062 · supply mechanism (Base) 2063.. Inner loader 2064... Film mounting member 2065. · Film 2066···through hole 2067.. Template 2068...Resin receiving space 2069··· Opening 2070···Circumference part 2071 ...with a template 2101...compression forming device for electronic parts 2102 ··上模2103.. . Lower mold 2104.. Release film 2105.··Mould 2106...Particle resin 2106a...Part of the particle resin 2107...Bottom member 2108···Supply member 2109.·· Hole 2110···shading plate 2121···铋2122.. .electronic parts 5.. interval 67

Claims (1)

200843930 十、申請專利範圍： 1. 一種電子零件之壓縮成形方法，包含下述步驟： 準備包含具有模穴之下模之模組品； 模板準備具有對應於前述模穴之樹脂收容空間之 5 模板； 對如述樹脂收容空間供給樹脂材料， 將離型膜載置於前述模板，以覆蓋前述樹脂收容空 間； 藉由使前述離型膜吸附於前述模板，以前述模板與 10 前述離型膜内含前述樹脂材料； 在將内含前述樹脂材料之前述離型膜及前述模板 翻轉後，朝前述模穴移動；及 藉由變化前述樹脂收容空間之壓力狀態，以前述離 型膜被覆前述模穴，並且由前述樹脂收容空間將前述樹 15 脂材料供給至被覆有前述離型膜之前述模穴。 2. 如申請專利範圍第1項之電子零件之壓縮成形方法，更 具有一在對前述樹脂收容空間供給前述樹脂材料之步 驟中，或者在對前述樹脂收容空間供給前述樹脂材料之 步驟前，計量前述樹脂材料之步驟。 20 3.如申請專利範圍第1項之電子零件之壓縮成形方法，更 具有一在對前述樹脂收容空間供給前述樹脂材料之步 驟後，使前述樹脂材料平坦化之步驟。 4.如申請專利範圍第1項之電子零件之壓縮成形方法，其 中前述樹脂材料係具有預定之粒徑分布之粉狀樹脂材 68 200843930 料。 5. 如申請專利範圍第1項之電子零件之壓縮成形方法，其 中前述樹脂材料為顆粒狀之樹脂材料。 6. 如申請專利範圍第1項之電子零件之壓縮成形方法，其中 5 前述樹脂材料為粉末狀之樹脂材料。 7. 如申請專利範圍第1項之電子零件之壓縮成形方法，其 中前述樹脂材料為液體狀之樹脂材料。 8. —種電子零件之壓縮成形方法，包含有下述步驟： 準備具有模穴之下模、具有樹脂收容空間之模板、 10 及離型膜； 將樹脂材料投入前述樹脂收容空間； 在前述樹脂收容空間内使前述樹脂材料平坦化； 以框架挾持前述離型膜； 以前述離型膜被覆前述模板，以利用前述離型膜封 15 閉包含業經平坦化之前述樹脂材料之前述樹脂收容空 間； 將以前述離型膜被覆之前述模板翻轉； 使前述離型膜接觸前述下模，以利用被覆於業經翻 轉之前述模板之前述離型膜封閉前述模穴；及 20 以前述離型膜被覆前述模穴，並且使前述樹脂材料 由前述樹脂收容空間往前述模穴落下。 9. 如申請專利範圍第8項之電子零件之壓縮成形方法，其 中在以前述離型膜被覆前述模板之步驟中，前述樹脂收 容空間係設定為預定之真空狀態，且在以前述離型膜被 69 200843930 覆前述模穴之步驟中，使前述樹脂收容空間由真空狀態 變化成常壓狀態。 10. 如申請專利範圍第8項之電子零件之壓縮成形方法，其 中在使前述樹脂材料落下之步驟中，使業經翻轉之前述 5 模板振動。 11. 一種電子零件之壓縮成形方法，包含有下述步驟： 準備具有模穴之下模、及離型膜； 將框架載置於前述離型膜上； 將樹脂材料投入至前述框架内之前述離型膜上；及 10 以前述離型膜被覆前述模穴並且使前述樹脂材料 往前述模穴落下。 12. 如申請專利範圍第11項之電子零件之壓縮成形方法，更 具有一使前述離型膜上之前述樹脂材料平坦化之步 驟，並在使前述樹脂材料平坦化之步驟後，除去前述框 15 架。 13. 如申請專利範圍第11項之電子零件之壓縮成形方法，更 具有一使前述離型膜上之前述樹脂材料平坦化之步 驟，且在前述樹脂材料平坦化之步驟中，藉由預先加熱 前述框架内之樹脂材料之製程，使前述樹脂材料平坦 20 化。 14. 如申請專利範圍第13項之電子零件之壓縮成形方法，其 中在前述預先加熱之製程後，除去前述框架。 15. 如申請專利範圍第13項之電子零件之壓縮成形方法，其 中前述樹脂材料為顆粒狀之樹脂材料，且在前述預先加 70 200843930 熱之製程中，構成前述顆粒狀之樹脂材料之顆粒互相熔 接。 16. 如申請專利範圍第8或11項之電子零件之壓縮成形方 法，其中前述樹脂材料係具有預定之粒徑分布之粉狀樹 5 脂材料。 17. 如申請專利範圍第8或11項之電子零件之壓縮成形方 法，其中前述樹脂材料係顆粒狀之樹脂材料。 18. 如申請專利範圍第8或11項之電子零件之壓縮成形方 法，其中前述樹脂材料係粉末狀之樹脂材料。 10 19.如申請專利範圍第8或11項之電子零件之壓縮成形方 法，其中前述樹脂材料係液體狀之樹脂材料。 20. —種電子零件之壓縮成形裝置，包含有： 下模，係具有模穴者； 框架，係挾持離型膜者； 15 模板，係具有收容樹脂材料之樹脂收容空間者； 移動機構，係將被覆有前述離型膜之前述模板翻 轉，然後，使業經翻轉之前述模板朝前述模六移動，以 使前述樹脂材料可往被前述離型膜被覆之前述模穴落 下者；及 20 真空吸引機構，係吸引前述離型膜，使前述離型膜 緊密附著於前述模穴者。 21. —種電子零件之壓縮成形裝置，包含有： 下模，係具有模穴者； 投入機構，係將樹脂材料投入載置於離型膜上之框 71 200843930 架内者； 移動機構，係使前述離型膜朝前述模穴移動，使前 述模穴被前述離型膜被覆，且前述樹脂材料可往前述模 穴落下者；及 5 真空吸引機構，係吸引前述離型膜，使前述離型膜 緊密附著於前述模穴者。 22· —種電子零件之壓縮成形方法，包含有下述步驟： 準備具有模穴之下模； 準備離型膜； 1〇 於前述離型膜形成對應於前述模穴形狀之凹部； 將樹脂材料投入前述凹部；及 將於前述凹部具有前述樹脂材料之前述離型膜裝 設於前述下模，使前述凹部插入前述模穴。 23·如申請專利範圍第22項之電子零件之壓縮成形方法，其 15 中在前述投入之步驟後，在將前述離型膜裝設於前述下 模之步驟結束之間，使前述樹脂材料平坦化。 24·如申清專利範圍第22項之電子零件之壓縮成形方法，其 中在將前述離型膜裝設於前述下模之步驟結束後，使前 述樹脂材料平坦化。 20 25·如申請專利範圍第23或24項之電子零件之壓縮成形方 法，其中前述樹脂材料的平坦化係藉由振動前述樹脂材 料來實現。 26_如申請專利範圍第23或24項之電子零件之壓縮成形方 法，其中前述樹脂材料的平坦化係藉由按壓前述樹脂材 72 200843930 料來實現。 27. —種電子零件之壓縮成形方法，包含有下述步驟： 準備具有模穴之下模； 模板準備具有樹脂收容空間之模板； 5 準備離型膜； 將框架載置於前述離型膜上； 將樹脂材料投入至前述框架内之前述離型膜上； 藉由從前述離型膜上拆下前述框架，使前述樹脂材 料殘存於前述離型膜上； 10 以前述模板覆蓋前述離型膜上之前述樹脂材料，使 前述樹脂材料插入前述樹脂收容空間； 藉由使前述離型膜吸附於前述模板，以前述模板與 前述離型膜内含前述樹脂材料； 將内含有前述樹脂材料之前述模板及前述離型膜 15 朝前述模穴搬送；及 使前述離型膜緊密附著於前述模穴，並且使前述樹 脂材料由前述核板之前述樹脂收容空間往前述核穴内之 空間落下。 28. 如申請專利範圍第27項之電子零件之壓縮成形方法，更 20 具有一於前述離型膜上使框架内之前述樹脂材料平坦 化之步驟。 29. 如申請專利範圍第22或27項之電子零件之壓縮成形方 法，其中前述樹脂材料係具有預定之粒徑分布之粉狀樹 脂0 73 200843930 30. 如申請專利範圍第22或27項之電子零件之壓縮成形方 法，其中前述樹脂材料係顆粒樹脂。 31. 如申請專利範圍第22或27項之電子零件之壓縮成形方 法’其中前述樹脂材料係粉末樹脂。 5 32.如申請專利範圍第22或27項之電子零件之壓縮成形方 法，其中前述樹脂材料係液體狀之樹脂材料。 33. —種電子零件之壓縮成形裝置，包含有： 下模，係具有模穴者； 離型膜，係用以覆蓋前述模穴者； 10 形成機構，係於前述離型膜形成對應於前述模穴之 形狀之凹部者； 投入機構，係將樹脂材料投入前述凹部内者；及 搬送機構，係將具有前述凹部之離型膜朝前述模穴 搬送者。 15 34.如申請專利範圍第33項之電子零件之壓縮成形裝置，更 具有一用以使前述凹部内之前述樹脂材料平坦化之機 構。 35. —種電子零件之壓縮成形裝置，包含有： 下模，係具有模穴者； 20 離型膜，係用以覆蓋前述模穴之表面者； 框架，係被載置於前述離型膜上者； 投入機構，係將樹脂材料投入至前述框架内之前述 離型膜上者； 模板，係藉由吸附前述離型膜，與前述離型膜一同 74 200843930 内含前述樹脂材料者； 搬送機構，係將與前述離型膜一同内含前述樹脂材 料之前述核板朝纟!j述核穴搬送者，及 真空吸引機構，係使前述離型膜緊密附著於前述模 5 穴者。 36. 如申請專利範圍第35電子零件之壓縮成形裝置，更具有 一使投入前述離型膜上之前述框架内之前述樹脂材料 平坦化之機構。 37. 如申請專利範圍第34或36項之電子零件之壓縮成形裝 10 置，其中使前述樹脂材料平坦化之機構係對前述樹脂材 料施加振動之機構。 38. 如申請專利範圍第34或36項之電子零件之壓縮成形裝 置，其中使前述樹脂材料平坦化之機構係按壓前述樹脂 材料之機構。 75200843930 X. Patent application scope: 1. A compression forming method for electronic parts, comprising the steps of: preparing a module product comprising a mold having a cavity; a template preparing a template for a resin receiving space corresponding to the cavity; Supplying a resin material to the resin accommodating space, and placing a release film on the template to cover the resin accommodating space; and adsorbing the release film on the template to form the template and 10 in the release film And comprising the resin material; after the inversion film and the template containing the resin material are inverted, moving toward the cavity; and changing the pressure state of the resin receiving space to cover the cavity with the release film And the tree 15 fat material is supplied to the aforementioned cavity covered with the release film by the resin accommodating space. 2. The compression molding method for an electronic component according to the first aspect of the invention, further comprising the step of supplying the resin material to the resin accommodating space or the step of supplying the resin material to the resin accommodating space. The step of the aforementioned resin material. The method of compression molding of an electronic component according to the first aspect of the invention, further comprising the step of flattening the resin material after the step of supplying the resin material to the resin accommodating space. 4. The compression molding method for an electronic component according to the first aspect of the invention, wherein the resin material is a powdery resin material having a predetermined particle size distribution 68 200843930. 5. The compression molding method for an electronic component according to the first aspect of the invention, wherein the resin material is a granular resin material. 6. The method of compression molding of an electronic component according to claim 1, wherein the resin material is a powdery resin material. 7. The compression molding method for an electronic component according to the first aspect of the invention, wherein the resin material is a liquid resin material. 8. A compression molding method for an electronic component comprising the steps of: preparing a mold having a mold cavity, a mold having a resin receiving space, 10 and a release film; and feeding the resin material into the resin receiving space; The resin material is flattened in the accommodating space; the release film is sandwiched by the frame; and the template is coated with the release film to cover the resin accommodating space including the planarized resin material by the release film seal 15; Inverting the template coated with the release film; contacting the release film with the lower mold to seal the cavity with the release film coated with the template that has been inverted; and 20 coating the release film with the release film The cavity is formed, and the aforementioned resin material is dropped from the resin receiving space to the aforementioned cavity. 9. The compression molding method of an electronic component according to claim 8, wherein in the step of coating the template with the release film, the resin housing space is set to a predetermined vacuum state, and the release film is used In the step of covering the mold cavity by 69 200843930, the resin accommodating space is changed from a vacuum state to a normal pressure state. 10. The compression molding method of an electronic component according to the eighth aspect of the invention, wherein in the step of dropping the resin material, the fifth template which is inverted is vibrated. 11. A method of compression molding an electronic component, comprising the steps of: preparing a mold having a cavity under mold, and a release film; placing the frame on the release film; and feeding the resin material into the frame On the release film; and 10, the mold cavity is covered with the release film and the resin material is dropped to the mold cavity. 12. The method of compression molding an electronic component according to claim 11 further comprising the step of flattening said resin material on said release film, and removing said frame after said step of planarizing said resin material 15 frames. 13. The method of compressing an electronic component according to claim 11 further comprising the step of flattening said resin material on said release film, and in the step of planarizing said resin material, by preheating The process of the resin material in the aforementioned frame makes the aforementioned resin material flat. 14. The compression molding method for an electronic component according to claim 13, wherein the frame is removed after the preheating process. 15. The compression molding method for an electronic component according to claim 13, wherein the resin material is a granular resin material, and in the foregoing process of adding 70 200843930 heat, the particles constituting the granular resin material are mutually Welding. 16. The compression molding method of an electronic component according to claim 8 or 11, wherein the resin material is a powdery tree material having a predetermined particle size distribution. 17. The compression molding method of an electronic component according to claim 8 or 11, wherein the resin material is a granular resin material. 18. The compression molding method of an electronic component according to claim 8 or 11, wherein the resin material is a powdery resin material. 10. The compression molding method of an electronic component according to claim 8 or 11, wherein the resin material is a liquid resin material. 20. A compression molding apparatus for an electronic component, comprising: a lower mold having a cavity; a frame for holding the release film; 15 a template having a resin receiving space for accommodating a resin material; And rotating the template coated with the release film, and then moving the inverted template to the die 6, so that the resin material can be dropped to the die covered by the release film; and 20 vacuum suction The mechanism attracts the release film to adhere the release film to the cavity. 21. A compression molding apparatus for an electronic component, comprising: a lower mold having a cavity; and an input mechanism for placing a resin material on a frame placed on the release film 71 200843930; Moving the release film toward the cavity, causing the cavity to be covered by the release film, and the resin material may fall to the cavity; and 5 vacuum suction mechanism attracting the release film to cause the separation The film is closely attached to the aforementioned cavity. A compression molding method for an electronic component, comprising the steps of: preparing a mold having a cavity; preparing a release film; and forming a concave portion corresponding to the cavity shape in the release film; The recessed portion is inserted into the recessed portion, and the release film having the resin material in the recessed portion is attached to the lower mold, and the recessed portion is inserted into the cavity. 23. The method of compression molding of an electronic component according to claim 22, wherein after the step of inputting, the resin material is flattened between the step of mounting the release film on the lower mold. Chemical. 24. The compression molding method for an electronic component according to claim 22, wherein the resin material is planarized after the step of mounting the release film on the lower mold is completed. The method of compression molding of an electronic component according to claim 23 or 24, wherein the flattening of the resin material is achieved by vibrating the resin material. The method of compression molding of an electronic component according to claim 23 or 24, wherein the flattening of the resin material is carried out by pressing the resin material 72 200843930. 27. A compression forming method for an electronic component comprising the steps of: preparing a mold having a cavity; preparing a template having a resin receiving space; 5 preparing a release film; and placing the frame on the release film a resin material is placed on the release film in the frame; the resin material remains on the release film by removing the frame from the release film; 10 covering the release film with the template In the resin material, the resin material is inserted into the resin accommodating space; and the release film is adsorbed to the template, and the resin material is contained in the template and the release film; and the resin material is contained therein. The template and the release film 15 are conveyed toward the cavity; and the release film is closely adhered to the cavity, and the resin material is dropped from the resin accommodation space of the core plate into a space inside the core cavity. 28. The method of compression molding of an electronic component according to claim 27, further comprising the step of planarizing said resin material in said frame on said release film. 29. The compression molding method for an electronic component according to claim 22 or 27, wherein the resin material is a powdery resin having a predetermined particle size distribution. 0 73 200843930 30. The electron of claim 22 or 27 A compression molding method for a part, wherein the resin material is a particulate resin. 31. The compression molding method of an electronic component according to claim 22 or 27 wherein the resin material is a powder resin. The method of compression molding of an electronic component according to claim 22 or 27, wherein the resin material is a liquid resin material. 33. A compression molding apparatus for an electronic component, comprising: a lower mold having a cavity; a release film for covering the cavity; 10 forming means for forming the release film corresponding to the foregoing The recessed portion of the shape of the cavity; the input mechanism is for inserting the resin material into the recess; and the transport mechanism is for transporting the release film having the recess toward the cavity. A 34. The compression molding apparatus for an electronic component according to claim 33, further comprising a mechanism for flattening the resin material in the recess. 35. A compression forming apparatus for an electronic component, comprising: a lower mold having a cavity; a release film for covering a surface of the cavity; and a frame placed on the release film The input mechanism is a method of putting a resin material into the release film in the frame; the template is formed by adsorbing the release film together with the release film 74 200843930 containing the resin material; The mechanism is such that the nuclear plate containing the resin material together with the release film described above is a nuclear transfer device and a vacuum suction mechanism, and the release film is adhered to the mold 5. 36. The compression molding apparatus of the 35th electronic component of the patent application, further comprising a mechanism for flattening the resin material in the frame placed on the release film. 37. The compression molding apparatus for an electronic component according to claim 34 or 36, wherein the mechanism for flattening the resin material is a mechanism for applying vibration to the resin material. 38. The compression molding apparatus for an electronic component according to claim 34 or 36, wherein the mechanism for flattening the resin material is a mechanism for pressing the resin material. 75
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CN102971127A (en) * 2010-07-08 2013-03-13 东和株式会社 Method for producing resin sealed electronic component and resin sealing device for electronic component
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