TWI601573B - Resin sealing material and its manufacturing method - Google Patents

Description

Resin sealing material and manufacturing method thereof

The present invention relates to a resin-sealing material used in powder or granular form used for resin-sealing a wafer-shaped electronic component using a molding die for compression molding, and a method for producing the same.

In the step of resin-sealing a wafer-shaped electronic component such as an IC (Integrated Circuit) wafer, an LED (Light Emitting Diode) wafer, or a wafer capacitor (hereinafter referred to as a "wafer"), the fluid resin is cured to form a cured layer. A sealing resin composed of a resin. Thereby, the wafer mounted on a lead frame, a printed board, or the like (hereinafter referred to as "substrate body") is sealed with a resin. In recent years, as a method of resin sealing, in addition to transfer molding, compression molding is also used (for example, refer to Patent Document 1). Compared with the transfer molding, the compression molding has an advantage that the pressure applied to the lead wire for bonding by the fluid resin is small, and the sealing resin can be made thinner. In the compression molding, as a raw material of the fluid resin, a powdery or granular resin sealing material made of a thermosetting resin or a resin sealing material (liquid resin) which is liquid at normal temperature is used.

The present invention is directed to the case of using a powdery or granular resin sealing material composed of a thermosetting resin. The resin sealing material is supplied to the chamber of the molding die of the resin sealing device, and the resin sealing material is heated and melted by a heater provided in the molding die to form a fluid resin (hereinafter referred to as " Fluid resin"). Then by The fluid resin is continuously heated and solidified, and a sealing resin composed of a cured resin is formed in the chamber.

However, in this technical field, the following needs have become more and more intense in recent years. The first demand is a demand for so-called thinness and thinness of electronic parts (hereinafter referred to as "electronic components") as finished products. Accordingly, there is a growing demand for a smaller diameter of the lead wire and a thinner sealing resin. The second demand is accompanied by the demand for the widespread use of LEDs, specifically as shown below. In other words, a light-emitting sealing resin is used for a light-emitting element represented by an LED in an electronic component. However, when air bubbles (voids) remain in the sealing resin, optical characteristics are impaired. The second requirement is that in the light-emitting element, there is no bubble in the sealing resin.

Patent Document 1: JP-A-2007-125783 (pages 5 to 9, FIG. 1)

A material for sealing a resin which is a raw material of a sealing resin, that is, a powder or a granular resin, is usually used as a raw material of a resin tablet which is a resin sealing material for transfer molding. The resin ingot is formed by pressing a raw material, that is, a powdery or granular resin sealing material into a columnar shape. In the transfer molding, a molten resin is produced by heating and melting a resin ingot supplied to a cylindrical space called a pot. The resulting molten resin is pressed by a plunger and injected into the chamber. The molten resin injected into the chamber is solidified by heating. By the steps up to this point, a sealing resin composed of a cured resin is formed.

In the transfer molding, a cylindrical resin ingot is heated in a crucible to form a molten resin. Therefore, the material for resin sealing which is a raw material of the resin ingot, that is, powder or granular, is not so much required to have a small variation in particle diameter (particle diameter). Thereby, the raw material of the resin ingot, that is, The particle diameter of the powdery or granular resin sealing material used for compression molding has a large variation in many cases. In addition, in the present application, the term "powdered or granulated" includes a shape of a fine powder, a granule, a granule, a short rod, a block, a small plate, a ball-like shape, that is, an indeterminate shape ( For example, a twisted shape, an irregular shape, a shape having irregularities, and the like. In the following, the term "granular resin" is used as a general term for "powder or granular resin sealing material".

However, the inventors of the present invention found the following. The first found that the particle diameter of the resin sealing material has a large variation from about μm to about 2 to 3 mm.

In the case of using the resin sealing material having the above-described large variation, the resin sealing material supplied to the chamber has a plaque disposed on the bottom surface of the chamber (the inner bottom surface of the chamber). The tendency to be disordered (unevenly confusing). In particular, a package having a large value of the resin sealing material and having a target value t of a thickness (refer to a size from the upper surface of the substrate body to the upper surface of the sealing resin) of the sealing resin is t=0.2 to 0.3 mm. In this case, the tendency is remarkable. In this case, the amount of the resin sealing material to be supplied to the chamber is small, and the tendency to be arranged in a patch shape is strong. In this case, the resin sealing material having a large variation in particle diameter is unevenly arranged on the bottom surface of the chamber. As a result, in the chamber, in the process in which the resin sealing material is melted and the wafer is immersed in the formed fluid resin, there is a case where the fluid resin which is unevenly distributed flows. The flow of the fluid resin causes deformation of the lead, and unfilled (in other words, bubbles) of the sealing resin.

In the case of a granular resin sealing material having a large and large particle diameter (for example, a degree of 10 t: t is a target value of the sealing resin as described above), the resin is sealed in the resin. In the stage where the material is not sufficiently melted, there is a case of contact with the lead. Such contact with the leads will cause deformation of the leads.

The fourth finding is that in the case of combining a shutter and a slit member and supplying a resin sealing material to a chamber (for example, refer to Patent Document 1), it has a large and large particle diameter. The presence of the resin sealing material will cause an increase in the weight of the fluid resin. According to this, the variation in the thickness t of the encapsulating sealing resin becomes large.

In the fifth, it is found that the resin sealing material having a small particle diameter is attached to the chamber when it is supplied to the chamber, and may adhere to a place where the original resin sealing material should not be present. In such a case, when the density of the resin sealing material is small, the resin sealing material having a small particle diameter floats. In addition, in the case where the resin sealing material is easily charged, there is a case where the resin sealing material having a small particle diameter is electrostatically charged. The adhesion of the resin sealing material to an unintended place causes the following drawbacks. The first drawback is that the resin sealing material is unevenly arranged on the bottom surface of the chamber. The second drawback is the staining of the forming mold. The third drawback is the occurrence of resin burrs caused by insufficient clamping.

The problem to be solved by the present invention is to eliminate the deformation of the lead wire caused by the variation in the particle diameter of the powder-like or granular resin sealing material which is a raw material of the sealing resin, the occurrence of bubbles in the sealing resin, and the thickness of the sealing resin. The disadvantage of the increase in deviations.

In order to solve the problem, the resin sealing material of the present invention is used as a seal when a mold for compression molding provided in a resin sealing device and having a chamber is used and resin is sealed by a sealing resin. In the resin sealing material, the resin sealing material is a powdery or granular resin sealing material. When the first specification is set to the target value t (mm) of the thickness of the sealing resin, the resin sealing material is granulated. The diameter D satisfies the second specification of D≦a×t (mm), and the first specification is 0.03 (mm) ≦t ≦ 1.2 (mm) (a is positive number).

Further, the method for producing a resin sealing material of the present invention is used as a sealing resin when a molding die for compression molding provided in a resin sealing device and having a chamber is used and resin sealing is performed on the electronic component by a sealing resin. And a method for producing a resin sealing material in a powder or granular form, comprising: a step of preparing a raw material group containing at least a powdery or granular resin material, an additive, and a filler; and kneading a step of the raw material group; a step of kneading the raw material group to form the first intermediate material; a step of pulverizing the intermediate material to form the second intermediate material; and setting the first specification to the target value t (mm) of the thickness of the sealing resin, The step of sorting the second intermediate material according to the second specification (a is a positive real number) of the particle diameter D of the resin sealing material is D≦a×t (mm); and determining that the second specification is satisfied among the raw material groups The material in the first specification is determined as a material for resin sealing; the first specification is 0.03 (mm) ≦ t ≦ 1.2 (mm).

According to the present invention, when the electronic component is resin-sealed by the sealing resin, the resin sealing material used as the material of the sealing resin satisfies the following first and second specifications. In the present invention, when the first specification is set to the target value t (mm) of the thickness of the sealing resin, the particle diameter D of the resin sealing material satisfies the second specification of D ≦ 3.0 × t (mm). These specifications are calculated by calculating the projected area from the image obtained by photographing the resin sealing material, and applying the area equivalent circular diameter processing of the projected area as the particle diameter D. When the resin sealing material satisfies these specifications, it is possible to suppress the occurrence of disadvantages caused by the presence of the granular resin having a large particle diameter D with respect to the target value t of the thickness. By setting the first specification to 0.03 (mm) ≦ t ≦ 1.2 (mm), the effect of suppressing the occurrence of the above drawbacks is increased.

Further, according to the present invention, a resin sealing material supplied to a resin sealing device The material was sorted according to the specifications of D第 3.0 × t (mm) which is the second specification relating to the particle diameter D of the resin sealing material. The result of the sorting is judged to be the material of the first specification that satisfies the second specification, and is transferred to the forming mold. By the way, when the original resin sealing material is supplied, the resin sealing material which is determined by the material of the first specification which satisfies the second specification can be conveyed to the molding die. Therefore, it is possible to suppress the occurrence of a drawback caused by the presence of the granular resin having a large particle diameter D with respect to the target value t of the thickness.

Further, according to the present invention, the result of the sorting is determined to be that the material outside the specification that does not satisfy the second specification is pulverized, and the pulverized outer material is further sorted. The result of the sorting is judged to be the material of the second specification that satisfies the second specification, and is transferred to the forming mold. Therefore, it is possible to suppress the occurrence of the disadvantages caused by the presence of the granular resin having a large particle diameter D with respect to the target value t of the thickness. Further, the material for resin sealing is effectively utilized.

1‧‧‧下模

2‧‧‧上模

3‧‧‧1st means of supply

4‧‧‧ chamber

5‧‧‧Resin sealing materials

6‧‧‧ release film

7‧‧‧Outer frame members

8‧‧‧Cell components

9‧‧‧Attraction channel (attraction means)

10‧‧‧heater (heating means)

11‧‧‧ Sealing members (outside air isolation means)

12‧‧‧Attraction channel (decompression means)

13‧‧‧Substrate body

14‧‧‧ wafer (electronic parts)

15‧‧‧ Sealing the front substrate

16‧‧‧ lead

17‧‧‧ boundary line

18‧‧‧Area

19‧‧‧Front frame

20‧‧‧Supply baffle

21‧‧‧ Housing Department

22‧‧‧ molten resin

23‧‧‧External air isolation space

24‧‧‧Exhausted gases, etc.

25‧‧‧ sealing resin

26‧‧‧Formed body (resin seal)

27‧‧‧Rotating blade

28‧‧‧Electronic components

29‧‧‧unit substrate

30‧‧‧Unit sealing resin

31‧‧‧Material receiving means

32, 59‧‧‧Resin materials processing means

33‧‧‧ Forming means

34‧‧‧Forming means

35, 57‧‧‧Substrate receiving means

36, 58‧‧‧Receiving means for resin materials

37‧‧‧Transfer track

38‧‧‧Main transport means (first transport means)

39‧‧‧Substrate Receiving Department

40‧‧‧Substrate transport department

41‧‧‧Resin Receiving Department

42‧‧‧Measuring Department

43‧‧‧ Container

44‧‧‧1st resin transfer unit

45, 49‧‧ ‧ baffle (separation means)

46‧‧‧ sorting means

47‧‧‧Smashing means

48‧‧‧Second resin conveying unit (second conveying means)

50‧‧‧ dust collection means

51‧‧‧Chasing Keeper

52‧‧‧2nd means of supply

53‧‧‧Relief pump (decompression means)

54‧‧‧Formed body transport department

55‧‧‧Shaped container

56‧‧‧Formed body containment department

60‧‧‧Resin materials

A1, A2‧‧‧ resin sealing device

D‧‧‧particle size

T‧‧‧ target value of the thickness of the sealing resin

(1) to (3) of the present invention, in the method of manufacturing a resin sealing body using the resin sealing material of the present invention, the step of supplying a resin sealing material, the step of heating the resin sealing material, and the combination A schematic view of the steps of the mold forming mold.

(1) to (4) of FIG. 2 show a step of curing a fluid resin in a state of a mold clamping mold, a step of forming a mold after forming a sealing resin, and a molding comprising a resin sealing body. The step of singulation and the outline of the singulated electronic components.

3, in the case of the resin sealing material of the present invention, when the target value t of the thickness of the sealing resin is 0.19 mm and the supply amount w of the resin sealing material is 4.91 g, four of the particle diameters are set. The level of the condition that the resin sealing material is unevenly arranged on the bottom surface of the chamber An illustration of the experimental results of the system.

In the case of the resin sealing material of the present invention, when the target value t of the thickness of the sealing resin is 0.32 mm and the supply amount w of the resin sealing material is 7.91 g, four materials for the particle diameter are set. An explanatory diagram of the experimental results of the relationship between the level and the state in which the resin sealing material on the bottom surface of the chamber is unevenly arranged.

Fig. 5 is a plan view showing an example of a resin sealing device using the resin sealing material of the present invention.

Fig. 6 is a plan view showing another example of a resin sealing device using the resin sealing material of the present invention.

According to the present invention, in the case where the thickness of the sealing resin has a target value of 0.03 (mm) ≦ t ≦ 1.2 (mm) of t (mm), the particle size of the material for sealing with the resin is D ≦ 3.0 × t (mm), which is a second specification relating to the particle diameter D, is sorted and supplied to the resin sealing material of the molding die of the resin sealing device. The result of the sorting is determined to be that the material in the first specification that satisfies the second specification is transferred to the forming mold. On the other hand, the result of the sorting is judged to be that the material outside the specification of the second specification is not pulverized, and the material outside the pulverized specification is sorted. The result of the sorting is determined to be that the material in the second specification that satisfies the second specification is transferred to the forming mold.

[First Embodiment] A resin sealing method and a resin sealing device using the resin sealing material of the present invention will be described with reference to Figs. 1 to 4 . In addition, for the sake of easy understanding, any drawings in the present application are also appropriately omitted or exaggeratedly and schematically depicted. The same constituent elements are denoted by the same reference numerals, and the description is omitted as appropriate.

As shown in (1) of Fig. 1, the resin for the resin sealing material of the present invention is used. The sealing device has a lower die 1 and an upper die 2. The lower mold 1 and the upper mold 2 together form a forming mold. Between the lower mold 1 and the upper mold 2, the first supply means 3 for supplying a resin sealing material (described later) is provided to be movable forward and backward. In the lower mold 1, a chamber 4 composed of a recess is provided. In the first supply means 3, the resin sealing material 5 in the form of powder or pellets is supplied to the chamber 4. That is, the chamber 4 is used for the space in which the resin sealing material 5 is supplied. The release film 6 is supplied between the lower mold 1 and the upper mold 2 in a state of being stretched.

The lower mold 1 and the upper mold 2 can be lifted and lowered relatively. Thereby, the lower mold 1 and the upper mold 2 are relatively close to and closed, and are relatively far apart and open. In Fig. 1, there is disclosed an example in which the lower mold 1 is constituted by the outer frame member 7 and the chamber member 8, and the outer frame member 7 is elastically supported by an elastic member (scroll spring or the like; not shown). The outer frame member 7 constitutes the side of the chamber 4, and the chamber member 8 constitutes the bottom surface of the chamber 4. Not limited to this, the chamber 4 can also be engraved into the integrally formed lower mold 1. Instead of or in addition to the outer frame member 7, the chamber member 8 may be elastically supported by the elastic member.

In the lower mold 1, a suction passage 9 for sucking the release film 6 against the mold surface of the lower mold 1, in other words, for adsorbing the release film 6 to the mold surface of the lower mold 1, is provided. In Fig. 1, the downward two arrows, which are respectively depicted on the two suction passages 9, present an external suction mechanism (not shown) that attracts the release film 6. In the lower mold 1, a heater 10 for heating the resin sealing material 5 is provided. Further, the heater provided in the chamber member 8 is not shown.

In the upper mold 2, a sealing member 11 is provided so as to surround the chamber 4 in a plan view on a surface facing the lower mold 1 (hereinafter referred to as "profile of the upper mold 2"). In the die face of the upper die 2, a suction passage 12 for sucking a gas in a space including the chamber 4 is provided inside the sealing member 11 in a plan view.

The pre-sealed substrate 15 on which the plurality of wafers 14 are mounted on the substrate body 13 is fixed to the upper mold 2 by a known method such as adsorption. The front substrate 15 is sealed so as to be fixed in such a manner as to completely surround the chamber 4 in a plan view and located inside the sealing member 11 and the suction passage 12. The electrodes of the substrate body 13 and the electrodes of the wafer 14 (none of which are shown) are electrically connected by leads 16 such as gold wires. The substrate body 13 is divided into a plurality of regions 18 by a grid-shaped boundary line 17 that is virtually disposed. One or more wafers 14 are mounted in each region 18.

The first supply means 3 has an outer frame 19 and a supply baffle 20 that is openably and closably provided at a lower portion of the outer frame 19. In a state where the supply baffle 20 is closed, the accommodating portion 21 accommodating the resin sealing material 5 is formed inside the outer frame 19.

The resin sealing material 5 of the present invention will be described. The resin sealing material 5 is produced as described below. First, a raw material group containing at least a powdery or granular resin material composed of a thermosetting resin, an additive, and a filler (filler) composed of cerium oxide or the like is prepared. Next, the raw material group is kneaded to form a first intermediate material. Next, the kneaded first intermediate material is pulverized to form a second intermediate material. Next, the second intermediate material is sorted according to a predetermined specification. Among the second intermediate materials, the material of the first specification that satisfies the predetermined specification is determined as the resin sealing material 5.

As the resin material, an epoxy resin or a lanthanoid resin may be contained. In the case where the resin sealing material 5 is used for the purpose of producing an optical element, the resin material has light transmissivity. Further, in the case of using the resin sealing material 5, a fluorescent material as an additive may be contained in the resin sealing material 5.

In the present invention, the resin sealing material 5 is used to form a sealing resin composed of a cured resin and having a target value t of thickness. As the specification of the target value t of the thickness (the first specification), For example, in consideration of the demand for thinness and thinning of electronic components in recent years, it is set to 0.1 (mm) ≦ t ≦ 1.2 (mm). In the case of considering a more intense demand related to thinness and lightness, the first specification is preferably 0.05 (mm) ≦ t ≦ 1.2 (mm), more preferably 0.05 (mm) ≦ t ≦ 1.0 (mm). In the case where the prediction of the wafer thickness is about 15 μm in consideration of the use of the electronic component, the first specification is preferably 0.03 (mm) ≦ t ≦ 1.0 (mm). Further, in the case of considering the effective use of the material, the first specification is preferably 0.03 (mm) ≦ t ≦ 1.2 (mm). From the viewpoint of practical demand, the first specification is preferably 0.2 (mm) ≦ t ≦ 1.0 (mm).

The resin sealing material 5 satisfies a predetermined specification (second specification) of 0.03 (mm) ≦ D ≦ 3 t (mm) in relation to the particle diameter (particle diameter) D and the target value t of the thickness of the sealing resin. The second specification is preferably 0.05 (mm) ≦ D ≦ 2 t (mm). These second specifications relating to the resin sealing material 5 will be described in detail later. In the present specification, the particle diameter D of the resin sealing material 5 refers to the area equivalent circular diameter of the projected area of the particles in the image obtained by photographing the resin sealing material 5 by optical means. Specifically, the projected area is calculated from the image obtained by photographing the resin sealing material 5, and the area equivalent circular diameter of the projected areas is treated as the particle diameter D. The particle diameter D is simply exhibited in (1) of Fig. 1 .

In addition, a case where the particle diameter D of the resin sealing material 5 is measured by a means other than an optical means, such as a centrifugal force generated by a gas flow, a screen, or the like, will be described. In this case, the measured value A of the particle diameter D measured by the optical means described above may be different from the measured value B of the particle diameter D measured by another means. Therefore, it is preferable to investigate the correlation between the measured value A and the measured value B in advance, and determine a new second standard based on the correlation. It is preferable to use a new second specification instead of the conventional second specification, and to determine the particle diameter D of the resin sealing material 5 based on the new second specification.

In the following, a method of manufacturing a resin sealing body in which a resin sealing body is produced by resin-sealing the wafer 14 by using the resin sealing material 5 of the present invention will be described with reference to FIGS. 1 and 2 . Next, a molded body formed by resin-sealing the wafer 14 , in other words, a method of manufacturing an electronic component in which an electronic component is manufactured from a resin sealed body will be described.

As shown in (1) of FIG. 1, between the lower mold 1 and the upper mold 2, the release film 6 is supplied to the upper side of the chamber 4 by stretching. Then, the release film 6 is attracted toward the bottom surface of the chamber 4 by the suction passage 9. Thereby, the release film 6 is adsorbed to the entire surface of the mold surface (hereinafter referred to as "chamber surface") constituting the chamber 4. At least the stage in which the lower mold 1 and the upper mold 2 are opened after the resin sealing of the wafer 14 is performed, the release film 6 is continuously adsorbed. Further, in the present application, the space for supplying the resin sealing material 5 in the state in which the release film 6 is adsorbed on the entire surface of the chamber surface is also referred to as a "chamber" for the sake of convenience.

Next, the first supply means 3 is moved between the lower mold 1 and the upper mold 2, and the first supply means 3 is stopped above the chamber 4. Then, the supply shutter 20 is opened in the left-right direction of the drawing, and the resin sealing material 5 is supplied to the chamber 4.

Next, as shown in (2) of FIG. 1, the resin sealing material 5 supplied to the chamber 4 is heated by the heater 10. Thereby, the first supply means 3 is melted to form a fluid resin (see the molten resin 22 of (3) of FIG. 1). The upper mold 2 is lowered in parallel with the material 5 for heating the resin sealing. In addition, the lower mold 1 can also be raised. The point is that if the lower mold 1 and the upper mold 2 are relatively close to each other.

Next, as shown in (3) of FIG. 1, the upper mold 2 is further lowered to bring the lower end of the sealing member 11 into contact with the mold surface of the lower mold 1. Thereby, a space including the chamber 4 and an outside air insulating space 23 isolated from the outside of the forming die are formed. Use a decompression pump (sucking) placed outside the forming die A pressure reducing means (not shown) such as a pump (a pump) or a pressure reducing groove is used to depressurize the external air insulating space 23. Thereby, the fine particles contained in the external air insulating space 23, the gas contained in the external air insulating space 23 and the molten resin 22, and the like are discharged to the outside of the forming mold. In (3) of Fig. 1, two upward arrows shown in the vicinity of the suction passage 12 indicate gas or the like 24 which is discharged to the outside of the forming mold by pressure reduction. It is preferable that the external air insulating space 23 is decompressed in a state in which the lower end of the sealing member 11 is in contact with the die surface of the lower mold 1 and the lower mold 1 and the upper mold 2 are completely closed (intermediate mold clamping state). A step of. Further, it is preferable to perform the step of decompressing the external air insulating space 23 until the molten resin 22 is completely solidified.

Next, as shown in (1) of FIG. 2, the upper mold 2 is continuously lowered. Thereby, the wafer 14 and the lead 16 are immersed (soaked) in the molten resin 22, and the lower mold 1 and the upper mold 2 are completely closed. The molten resin 22 is continuously heated while the lower mold 1 and the upper mold 2 pressurize the molten resin 22 in a state in which the lower mold 1 and the upper mold 2 are completely closed (completely closed). Thereby, the molten resin 22 is solidified, and as shown in FIG. 2 (2), the sealing resin 25 made of a cured resin is formed.

Next, as shown in (2) of FIG. 2, the upper mold 2 is raised to open the lower mold 1 and the upper mold 2. Thereafter, the molded body 26 composed of the resin sealing body (the sealed substrate) having the substrate body 13, the wafer 14, the lead 16 and the sealing resin 25 is taken out of the forming mold. The steps of resin sealing of the plurality of wafers 14 mounted on the substrate body 13 are completed by the steps up to now, and the molded body 26 in which the plurality of wafers 14 are resin-sealed is completed.

Next, as shown in (3) of FIG. 2, the molded body 26 is fixed to a table (not shown) by a known method such as an adhesive film or adsorption. Using the rotary blade 27, the formed body 26 is completely cut along the boundary line 17 (full cut). Specifically, the molded body 26 is completely cut along each boundary line 17 in the X direction and the boundary line 17 in the Y direction in (3) of FIG. 2 . borrow Thereby, singulation of the molded body 26 is performed. By the steps up to now, the molded body 26 is singulated in units of the respective regions 18, and the electronic component 28 shown in (4) of Fig. 2 is produced. Each of the electronic components 28 includes a unit substrate 29 in which the substrate main body 13 is diced in units of the respective regions 18, a wafer 14 , a lead 16 , and a sealing resin 25 which are diced in units of the respective regions 18 .

In addition, in the step of singulating the molded body 26, instead of the full cut, the groove may be formed in the middle of the thickness direction of the molded body 26 (after half-cut), and an external force may be applied to the molded body 26 to be singulated. Instead of the rotary blade 27, laser light, a water-jet, a wire saw, or the like can also be used.

In the resin sealing material 5 of the present invention, a predetermined specification relating to the target value t of the particle diameter D and the thickness of the sealing resin 25 will be described. First, the lower limit of the second specification for setting the particle diameter D of the resin sealing material 5 will be described. The lower limit of the second specification of the particle diameter D is not necessarily determined in the case where the target value t of the thickness of the sealing resin 25 is large or small. However, depending on the characteristics of the resin sealing material, there is a problem that the resin sealing material 5 adheres to the place where the original resin sealing material 5 should not be present because the resin sealing material floats or is charged. In order to prevent this problem, the lower limit of the second specification of the particle diameter D of the resin sealing material 5 is preferably a value which is somewhat large. According to the experience, when the value of the particle diameter D is less than 0.05 mm, it is recognized that the above-described floating or charging is likely to occur when the resin sealing material 5 is supplied or conveyed. Further, it has been found that when the value of the particle diameter D is less than 0.03 mm, the above-described floating or charging is more likely to occur. From the above, the lower limit of the second specification of the particle diameter D can be preferably 0.03 mm or more, and more preferably 0.05 mm or more. Therefore, when the lower limit is set for the second specification of the particle diameter D, the lower limit is determined to be 0.03 (mm) ≦D, It is preferably 0.05 (mm) ≦D.

Next, the upper limit of the second specification set by the particle diameter D will be described. The upper limit of the second specification is determined by the following procedure. In the first order, a specific range of a plurality of levels (four in the present embodiment) of the particle diameter D is set as the particle diameter D, so that the particle diameter D falls within the specific setting. The resin sealing material 5 is sorted in a range. Further, the specific ranges are different from the above-described second specifications. In the second order, two level values which are formed by values suitable as the target value t (mm) of the thickness of the sealing resin 25 are set. Further, the level values are different from the first specification described above. In the third order, the weight w (g) of the resin sealing material 5 corresponding to the target value t of the thickness of each sealing resin 25 is calculated, and the resin sealing material 5 of this weight is dispersed in the actual evaluation chamber. (Plan size: 233 × 67mm). The ratio of the dispersed resin sealing material 5 covering the bottom surface of the chamber (hereinafter referred to as "resin occupancy rate") was optically measured. In the fourth step, in the case where the resin sealing material 5 resin is used for sealing, it is possible to allow the actual thickness of the sealing resin 25 to be varied or the like in order to determine the degree of resin occupation. Regarding the particle diameter D of the resin sealing material 5, the upper limit of the second specification which is considered to be practically usable is determined in the above four orders.

In the following, the procedure of the upper limit of the second specification in which the particle diameter D of the resin sealing material 5 is determined will be described with reference to FIGS. 3 and 4 . In the first step, the resin sealing material 5 is sorted, and the resin sealing materials Ma, Mb, Mc, and Md in which the particle diameter D falls within the specific ranges 1 to 4 which are four levels are prepared. Wherein, the specific range 1 is D=1.0~2.0 (mm), the specific range 2 is D=0.2~2.0 (mm), the specific range 3 is D=0.2~1.0 (mm), and the specific range 4 is D=0.2~0.4. (mm).

Resin sealing material Ma: D=1.0~2.0(mm)

Resin sealing material Mb: D = 0.2 ~ 2.0 (mm)

Resin sealing material Mc: D = 0.2 ~ 1.0 (mm)

Resin sealing material Md: D = 0.2 ~ 0.4 (mm)

As the second order, two level values of t = 0.19 (mm) and t = 0.32 (mm) are set as the target values of the thickness of the sealing resin 25. The level value of t=0.19 (mm) is a level value set in consideration of the demand for the thinness and thinness of the electronic component 28 in recent years.

In the third order, in the case where the above two level values (the target values of the thicknesses of the sealing resin 25 are t=0.19 (mm) and 0.32 (mm)), the resin seals corresponding to the target values t are respectively calculated. The weight of material 5. The calculated weight is 4.91 (g) in the case of the level value 1 (target value t = 0.19 (mm)), and 7.91 (g) in the case of the level value 2 (target value t = 0.32 (mm)). Further, the value of the above weight is a calculated value (theoretical value) in the case where the wafer 14 is mounted.

In the experiment, in the state in which the wafer 14 is not attached to the substrate body 13, in other words, the resin sealing material 5 is supplied to the dummy substrate. The actual supply amount w is w=4.91 (g) instead of the level 1 (target value t = 0.19 (mm)), and the resin sealing material 5 of w = 6.03 (g) is dispersed. In the evaluation chamber, w=7.91 (g), which is equivalent to the level 2 (target value t=0.32 (mm)), and the resin sealing material 5 of w=10.16 (g) are respectively dispersed. In the evaluation chamber.

Then, in the third order, the resin sealing materials Ma, Mb, Mc, and Md corresponding to the resin sealing material 5 having a supply amount of w = 4.91 (g) are prepared, and these are sequentially dispersed in the evaluation chamber. . In the same manner, the resin sealing materials Ma, Mb, Mc, and Md corresponding to the resin sealing material 5 having a supply amount of w = 7.91 (g) are prepared, and these are sequentially dispersed in the evaluation. Used in the chamber. The state of the resin sealing material 5 to be dispersed is taken from above the evaluation chamber. The image obtained by the imaging was binarized to calculate the resin occupancy of the resin sealing material 5. Specifically, in an image having 256 gradations (level 0 is black and level 255 is white), the image is binarized using level 25 as a threshold. In the binarized image, the level 25 or less was judged as "the material for resin sealing", and the area ratio of the portion where the resin sealing material was present on the bottom surface of the evaluation chamber was calculated.

(1) to (4) of FIG. 3 show an image obtained by binarizing the state in which the resin sealing materials Ma to Md are dispersed, in the case where the supply amount w is 4.91 (g). A pie chart of resin occupancy. In the case of the supply amount w=7.91 (g), the image obtained by binarizing the state in which the resin sealing materials Ma to Md are respectively dispersed is shown in (1) to (4) of FIG. A pie chart of resin occupancy.

In the fourth order, the sealing resin 25 having the target value t=0.19 (mm) is formed by using the four kinds of resin sealing materials Ma to Md shown in (1) to (4) of FIG. 3 (see FIG. 2 ( 2)). According to the results of (1) to (3) of FIG. 3, it is determined that the sealing resin 25 is not allowed, and in the case of (4) of FIG. 3, it is determined that the sealing resin 25 is sufficiently sufficiently allowed.

According to the results shown in FIG. 3, first, as a lower limit of the second specification set for the particle diameter D (mm) of the resin sealing material 5, it is judged that D = 0.2 (mm). In the case where the lower limit of the second specification is D = 1.0 (mm), the resin sealing material 5 on the bottom surface of the evaluation chamber is strongly arranged in a patch shape (see (1) in Fig. 3). Therefore, it is clear that it is not allowed to function as the sealing resin 25.

According to the results shown in FIG. 3, the upper limit of the second specification of the particle diameter D (mm) of the resin sealing material 5 is expected to exist in D = 0.4 (mm) or more and 1.0 (mm). Within the scope below. In the range of the second specification of the particle size D, the lower limit of the second specification of the particle diameter D (mm) of the resin sealing material 5 is 0.2 mm, which is shown in (3) of FIG. 3 . In the case of the case shown in (4) of FIG. 3, the resin occupancy rate is in the range of 41% or more and 84% or less.

Then, as the fourth order, the sealing resin 25 having the target value t=0.32 (mm) of the thickness is formed by using the four kinds of resin sealing materials Ma to Md shown in (1) to (4) of FIG. 4 (see the figure). 2 (2)). In the case of the state shown in (1) and (2) of FIG. 4, it is determined that the sealing resin 25 is not allowed, and the state shown in (3) and (4) of FIG. 4 is obtained. In the case, it is judged that it is allowed to be the sealing resin 25. Further, in the case of the state shown in (3) of FIG. 4, it is determined that the limit is allowed. Therefore, in the case where the lower limit of the second specification of the particle diameter D (mm) of the resin sealing material 5 is 0.2 mm, the second specification is obtained as shown in Fig. 4 (especially, (3) of Fig. 4). The upper limit of the estimated D = 1.0 (mm) is appropriate. The value of D=1.0 (mm) which is the upper limit of the second specification corresponds to the target value t=0.32 (mm) and the D/t=3.125 with respect to the thickness of the sealing resin 25. Further, in the case of the state shown in (3) of FIG. 4 (D=0.2 to 1.0 mm), the resin occupancy rate was 72%.

Then, the fourth order is based on the resin occupancy ratio (72%) corresponding to the upper limit (D=1.0 (mm)) of the second specification of the particle diameter D (mm) estimated from FIG. 4, and is shown in FIG. The upper limit of the second specification of the particle diameter D (mm) in the case shown is examined. In (3) of Fig. 3, the particle diameter D (mm) is D = 0.2 to 1.0 mm, and the resin occupancy rate is 41%. In (4) of Fig. 3, the particle diameter D (mm) is D = 0.2~ 0.4mm, the resin occupancy rate is 84%. When the resin occupancy ratio was calculated to be 72% between these, the upper limit of the second specification of the particle diameter D (mm) was D=0.567 mm. The value of D=0.567mm corresponds to a resin occupancy rate of 72%. In the case of the target value t = 0.19 (mm) and D/t = 2.99 with respect to the thickness of the sealing resin 25.

As described above, in the second specification set for the particle diameter D (mm), the upper limit of the second specification in the case where the lower limit of the second specification is 0.2 mm and the target value t (mm) of the thickness of the sealing resin 25 are The relationship (D/t) is D/t = 3.125 in the case of Fig. 3 and D/t = 2.99 in the case of Fig. 4. In view of the above, the relationship between the upper limit of the second specification of the particle diameter D (mm) and the target value t (mm) of the thickness of the sealing resin 25 is determined to be approximately D/t=3.0.

In addition, the case of (4) of FIG. 3 is judged to be sufficiently sufficient as the sealing resin 25. In this case, it is preferable to determine the relationship between the upper limit of the second specification set for the particle diameter D (mm) and the target value t (mm) of the thickness of the sealing resin 25, as shown in (4) of FIG. 3 . It is the case of D/t≒2.11. Therefore, a preferable relationship between the upper limit of the second specification of the particle diameter D (mm) and the target value t (mm) of the thickness of the sealing resin 25 is determined to be approximately D/t = 2.0.

According to the description so far, the following specifications can be said to be appropriate regarding the particle diameter D (mm). First, in the case where the lower limit of the second specification of the particle diameter D is set, it is 0.03 (mm) ≦D, and preferably 0.05 (mm) ≦D. Second, the relationship between the upper limit of the second specification of the particle diameter D and the target value t (mm) of the thickness of the sealing resin 25 is D ≦ 3.0 × t, and preferably D ≦ 2.0 × t.

Therefore, the second specification set for the particle diameter D (mm) is as follows. In other words, the second specification is a specification of D ≦ 3.0 × t (mm) in which the particle diameter D is related to the target value t (mm) of the thickness of the sealing resin 25 . This second specification is preferable from the viewpoint of improving the yield (effective utilization rate) of the resin sealing material 5. On the other hand, from the viewpoint of corresponding to the thinner electronic component 28, the second specification of D ≦ 2.0 × t (mm) is preferable. According to the material for suppressing resin sealing 5 From the viewpoint of floating and charging, a specification of 0.03 (mm) ≦D or a specification of 0.05 (mm) ≦D may be added in the case where the lower limit is set for the second specification.

The resin sealing material 5 of the present embodiment has a specification (first specification) of the target value t of the thickness of the sealing resin 25, and satisfies the specification of 0.03 (mm) ≦ t ≦ 1.2 (mm) (preferably 0.05 (mm). The specification of ≦t≦1.0 (mm) is based on the premise and meets the following second specifications. The second dimension of D ≦ 3.0 × t (mm) in relation to the target value t of the thickness of the sealing resin 25 is the particle diameter D. From the viewpoint of corresponding to the thinner electronic component 28, the second specification of D ≦ 2.0 × t (mm) is preferable. In the case where the lower limit is set for the second specification, a specification of 0.03 (mm) ≦D or a specification of 0.05 (mm) ≦D may be added.

The resin sealing material 5 satisfies these specifications, and the following effects can be obtained. First, even in the case where the target value t of the thickness of the sealing resin 25 is small, in other words, even in the case where the resin sealing material 5 supplied to the chamber 4 is small, the resin sealing material 5 can be suppressed in the chamber. The case where the bottom surface is unevenly arranged. Thereby, in the chamber 4 shown in FIGS. 1 and 2, the fluid resin 22 generated by melting the resin sealing material 5 can be prevented from flowing. Therefore, the deformation of the lead 16 and the occurrence of unfilling or the like in the sealing resin 25 are suppressed.

Second, the upper limit of the particle diameter D can be controlled to an appropriate value. Therefore, it is possible to suppress the occurrence of the drawbacks caused by the presence of the granular resin having a large particle diameter with respect to the target value t of the thickness. Specifically, variations in the thickness of the sealing resin in the package can be suppressed.

Third, it is possible to suppress the resin sealing material 5 having a small particle diameter from floating, or the resin sealing material 5 caused by static electricity from adhering to an unintended place. Therefore, it is possible to suppress the occurrence of the drawbacks caused by the adhesion of the resin sealing material 5 as described above.

Further, in the present application, the lower limit of the second specification set for the particle diameter D is It does not mean that the resin sealing material 5 containing the particle diameter D smaller than the lower limit is excluded. In the process of transporting or measuring the resin sealing material 5 or the like, the resin sealing material 5 may be broken or defective, and minute powder or granules may be generated (fine particles caused by the resin sealing material 5, hereinafter referred to as It is "resin-based fine particles"). Such resin-based fine particles may have a particle diameter D which is smaller than the lower limit of the second specification of the particle diameter D. Therefore, it is not appropriate to determine that the resin-based fine particles having the particle diameter D having the smaller limit of the second specification of the second particle diameter D are not included in the resin sealing material 5 of the present invention.

[Embodiment 2] An embodiment of a resin sealing device using the resin sealing material 5 of the present invention will be described with reference to Fig. 5 . As shown in FIG. 5, the resin sealing device A1 includes a material receiving means 31, a resin material processing means 32, a plurality of (two in FIG. 5) forming means 33, and a molded body distributing means 34. The material receiving means 31 includes a substrate receiving means 35 for receiving the sealed front substrate 15, and a resin material receiving means 36 for receiving the resin sealing material 5. The material receiving means 31 sequentially supplies the conveying rail 37 to the formed body distributing means 34 via the resin material processing means 32 and the plurality of forming means 33. The main conveyance means 38 is provided in the conveyance rail 37. The main conveyance means 38 is movable in the horizontal direction of the drawing along the conveyance rail 37. Alternatively, the forming means 33 may be single.

The material receiving means 31 includes a substrate receiving portion 39 that receives the sealed front substrate 15 from the outside of the resin sealing device A1, and a substrate transfer portion 40 that transports the received sealed front substrate 15 to the main transfer means 38. The resin material receiving means 36 includes a resin receiving portion 41 that receives the resin sealing material 5 from the outside of the resin sealing device A1, and a measuring portion 42 that measures the weight, volume, and the like of the resin sealing material 5 that is received and received. The resin sealing material 5 to be measured or the resin sealing material 5 after the metering is housed, for example, in a container 43 made of a tray or the like. Contained in The resin sealing material 5 of the container 43 is transported to the main transport means 38 together with the respective containers 43 by the first resin transfer unit 44.

The substrate receiving means 35 and the resin material receiving means 36 are preferably separated by the opening and closing shutter 45 as needed when the first resin conveying unit 44 advances and retreats. Thereby, it is possible to suppress entry of fine particles containing resin-based fine particles into the substrate receiving means 35.

In the resin sealing device A1 using the resin sealing material 5 of the present embodiment, the following first configuration relating to the resin material processing means 32 is employed. That is, in the resin sealing device A1, the resin material processing means 32 is adjacent to the material receiving means 31 and is detachably provided. By adopting such a first configuration, the resin material processing means 32 is attached to the resin sealing device A1 as needed, or is detached from the resin sealing device A1 as needed.

The resin material processing means 32 has a sorting means 46 for sorting the resin sealing material 5 according to the second specification of the particle diameter D, and a pulverizing means 47 for determining that the particle diameter is larger than the outer material of the second specification by the result of the pulverization sorting. . In addition, the resin material processing means 32 has a second resin transfer portion 48 that transports the resin sealing material 5 and the specification material between the resin receiving portion 41, the sorting means 46, and the pulverizing means 47.

As the sorting means 46, for example, a known means such as selecting or suitably combining an optical means, a centrifugal force generated by a gas flow, or a screen is used. As the pulverizing means 47, for example, a known means such as stirring or a roll mill is used. The sorting means 46 and the pulverizing means 47 are included in the resin material processing means 32.

In order to prevent the resin-based fine particles or the like from entering the substrate receiving means 35, it is preferable to provide the following constituent elements in the resin material processing means 32. The constituent elements include a space that operates together with the baffle 45 to include the resin material receiving means 36, the sorting means 46, and the pulverizing means 47. A baffle 49 that is isolated from other spaces, and a dust collecting means 50 that sucks and collects dust particles present in the space isolated by the baffle 45 and the baffle 49.

As the second specification of the particle diameter D to be applied to the sorting means 46, the following specifications can be used in association with the first specification for setting the target value t of the thickness of the sealing resin 25. The first specification of the target value t of the thickness is, for example, a specification of 0.03 (mm) ≦ t ≦ 1.2 (mm) (preferably a specification of 0.05 (mm) ≦ t ≦ 1.0 (mm)). As a second specification for setting a specific range of the particle diameter D, for example, a specification of 0.03 (mm) ≦D ≦ 3.0 × t (mm) is used (preferably 0.05 (mm) ≦ D ≦ 2.0 × t (mm) specification).

Each of the plurality of forming means 33 has the following constituent elements. In other words, the present invention is a chase holder 51, a lower mold 1 having the chamber 4 attached to the chasing holder 51, and a lower mold 1 disposed opposite to the lower mold 1 and fixedly sealing the front substrate 15. The upper mold 2 (not shown in FIG. 5), the second supply means 52 for supplying and winding the release film 6 between the lower mold 1 and the upper mold 2, and the second supply means 52 formed between the lower mold 1 and the upper mold 2 The external air isolation space (see the external air isolation space 23 shown in (3) of Fig. 1) is a decompression pump 53 that decompresses.

The molded body distribution unit 34 is provided with a molded body transport portion 54 that transports the molded body 26, and a molded body storage portion 56 in which the molded body container 55 including the tray or the like that houses the molded body 26 is disposed.

In the resin sealing device A1 using the resin sealing material 5 of the present embodiment, in addition to the aforementioned first configuration relating to the resin material processing means 32, there are also one or more (two in FIG. 5). The following second configuration related to the forming means 33. That is, the forming means 33 on the left side shown in FIG. 5 is adjacent to the resin material processing means 32 and adjacent to the forming means 33 on the right side (in other words, the resin material processing means 32 and the right side forming means) 33 is sandwiched) and is detachably provided in the resin sealing device A1. Further, the right forming means 33 is adjacent to the left forming means 33 and adjacent to the formed body distributing means 34 (in other words, the left forming means 33 and the formed body distributing means 34 are interposed), and the resin sealing means is provided. A1 is set to be detachable.

Further, in the case where the resin sealing device A1 is provided with a single molding means 33, the molding means 33 is mounted so as to be sandwiched by the resin material processing means 32 and the molded body distributing means 34. When the molded body distributing means 34 is detached from the resin sealing device A1, the other forming means 33 can be attached and detached to the right side of the single forming means 33 in the resin sealing device A1.

The resin sealing device A1 using the resin sealing material 5 of the present embodiment exhibited the following effects. First, the result of the sorting by the sorting means 46 is pulverized by the pulverizing means 47, and it is judged that the material of the specification of the second specification is not satisfied. The pulverized outer material is sorted by the sorting means 46. The result of the sorting is determined to be that the material in the second specification that satisfies the second specification is transferred to the forming mold. Therefore, the resin sealing material 5 supplied to the resin sealing device A1 can be effectively utilized.

Secondly, in the resin material processing means 32, the resin material processing means 32 can be attached to the resin sealing device A1 afterwards, or the resin material processing means 32 can be removed from the resin sealing device afterwards. A1 disassembly. By this, the resin material processing means 32 can be attached to the resin sealing device A1 after the specification of the resin sealing material 5, the target value t (see FIG. 2) of the thickness of the sealing resin 25 of the electronic component 28, and the like. The resin material processing means 32 is detached from the resin sealing device A1 afterwards. In addition, the resin material processing means 32 detached from the resin sealing device A1 in the first factory can be transferred to the second factory which requires the resin material processing means 32, and can be attached to the resin sealing device held in the second factory. A1. Therefore, the manufacturer of the electronic component 28 (see (4) of FIG. 2) using the resin sealing device A1 can easily seal the resin according to changes in the market direction, the resin sealing material 5, and the specifications of the electronic component 28. The apparatus A1 attaches and detaches the resin material processing means 32.

Third, each of the forming means 33 is attached to the resin sealing device A1 as needed by the second configuration described above, or is detached from the resin sealing device A1 as needed. By this means, the molding means 33 can be attached and added to the resin sealing device A1 in accordance with the trend of the market or the increase or decrease in demand, and the molding means 33 can be detached from the resin sealing device A1 to reduce the number of the molding means 33. In addition, the molding means 33 that has been detached from the resin sealing device A1 in the first factory can be transferred to a second factory located in another area where demand is strong, and can be attached to the resin sealing device A1 held in the second factory. Therefore, the manufacturer using the electronic component 28 of the resin sealing device A2 (refer to (4) of FIG. 2) can easily adjust the productivity of the electronic component 28 in accordance with the market trend or the increase or decrease of demand.

Fourth, a dust collecting means 50 is provided which isolates the space including the resin material receiving means 36, the sorting means 46 and the pulverizing means 47 from other spaces by the baffle 45 and the baffle 49, Resin-based fine particles or the like existing in the isolated space are sucked and collected. Thereby, the fine particles containing the resin-based fine particles can be collected. Therefore, it is possible to suppress the disadvantage that the foreign matter containing the resin-based fine particles adheres to the pre-sealed substrate 15 or the like.

Fifth, by using the release film 6, the molded body 26 can be easily released from the lower mold 1 (see (2) of Fig. 2). Further, the release film 6 can reliably transfer the fine unevenness provided on the chamber surface to the sealing resin 25. By the above, in the case of manufacturing the electronic component 28 (see (4) of FIG. 2), the quality can be improved. In particular, when manufacturing an optical element having a lens (for example, a Fresnel lens or the like) including fine unevenness, the quality can be remarkably improved. improve.

Sixth, the external air insulating space 23 is formed at least in the intermediate mold clamping state, and the external air insulating space 23 is decompressed (refer to (3) of Fig. 1). Thereby, the occurrence of bubbles in the sealing resin 25 can be suppressed. Therefore, in the case of manufacturing the electronic component 28 (see (4) of FIG. 2), the quality can be improved. In particular, in the case of manufacturing an optical element of the light-transmitting sealing resin 25, the quality can be remarkably improved.

[Embodiment 3] Another embodiment of a resin sealing device using the resin sealing material 5 of the present invention will be described with reference to Fig. 6 . As shown in Fig. 6, in the resin sealing device A2, the following first to third configurations are employed.

The first configuration is as follows. That is, the forming means 33 on the left side shown in FIG. 6 is adjacent to the substrate receiving means 57, and is adjacent to the forming means 33 on the right side (in other words, the substrate receiving means 57 is sandwiched between the forming means 33 on the right side), and It is detachably provided in the resin sealing device A2. Further, the forming means 33 on the right side is adjacent to the forming means 33 on the left side, and is adjacent to the formed body distributing means 34 (in other words, the forming means 33 on the left side is sandwiched between the forming means 34), and is in the resin sealing means. A2 is set to be detachable.

The second configuration is as follows. In the resin sealing device A1 shown in FIG. 5, the resin material receiving means 36 is included in the material receiving means 31, and the resin material receiving means independently from the substrate receiving means 57 in the resin sealing device A2. 58 is disposed adjacent to the resin material processing means 59. In Fig. 6, the resin material receiving means 58 and the resin material processing means 59 are adjacent to each other in the vertical direction of the drawing. The resin material receiving means 58 and the resin material processing means 59 constitute a resin material means 60. Further, the resin material receiving means 58 and the resin material processing means 59 are separate modules, and can be used for a resin material. The means 60 are configured to be attached and detached. In other words, the resin material processing means 59 can be attached to the resin material means 60 having the resin material receiving means 58 afterwards.

Further, in the case where the resin sealing device A2 is provided with a single molding means 33, the molding means 33 is mounted so as to be sandwiched by the substrate receiving means 57 and the formed body distributing means 34. When the resin material means 60 and the molded body distributing means 34 are detached from the resin sealing device A2, the other forming means 33 can be attached and detached to the right side of the single forming means 33 in the resin sealing device A2.

The third structure is as follows. In other words, the resin material means 60 is disposed on the opposite side of the substrate receiving means 57 in a plan view by sandwiching a single or a plurality of forming means 33 (two in FIG. 6). Therefore, in the resin sealing device A2, the substrate receiving means 57 for sealing the front substrate 15 and the resin material for receiving and sorting the resin sealing material 5 in powder or granular form and pulverizing the material outside the specification as needed are used. 60, in the farthest position.

According to the first configuration, each molding means 33 is attached to the resin sealing device A2 as needed, or is detached from the resin sealing device A2 as needed. Therefore, the manufacturer using the electronic component 28 of the resin sealing device A2 (refer to (4) of FIG. 2) can easily adjust the productivity of the electronic component 28 in accordance with the market trend, the increase or decrease of demand, and the like.

According to the second configuration, the resin material processing means 59 can be attached to the resin material means 60 having the resin material receiving means 58 afterwards. Therefore, with the change in the technical direction such as the progress of the thinning of the unit sealing resin 30 (see (4) of FIG. 2) of the electronic component 28, it is possible to add a resin afterwards depending on the desire of the manufacturer of the electronic component 28. Material handling means 59.

According to the third configuration, it is possible to prevent the resin-based fine particles or the like from entering the substrate receiving means. 57. Therefore, it is possible to prevent the disadvantage that foreign matter containing the resin-based fine particles adheres to the pre-sealed substrate 15 or the like.

In addition, since the sorting means 46 and the pulverizing means 47 are provided in the resin sealing device A2, the resin sealing material supplied to the resin sealing device A2 can be effectively utilized in the same manner as in the case of the resin sealing device A1 shown in Fig. 5 . 5.

Further, since the dust collecting means 50 is provided, the dust collecting means 50 isolates the space including the resin material receiving means 58, the sorting means 46, and the pulverizing means 47 from the other space by the baffle 45, and isolates it from the other space. In the same manner as in the case of the resin sealing device A1 shown in FIG. 5, it is possible to suppress the occurrence of defects in which the foreign matter containing the resin-based fine particles adheres to the sealing front substrate 15 or the like.

Further, in the resin sealing device A2, since the release film 6 is used, similarly to the case of the resin sealing device A1 shown in Fig. 5, in the case of manufacturing the electronic component 28 (see (4) of Fig. 2), Improve quality.

Further, in the resin sealing device A2, since the external air insulating space 23 is formed at least in the intermediate mold clamping state, and the external air insulating space 23 is decompressed (refer to (3) of FIG. 1), FIG. 5 In the case of the resin sealing device A1 shown in the same manner, in the case of manufacturing the electronic component 28 (see (4) of FIG. 2), the quality can be improved.

Further, in the resin sealing device A2 shown in Fig. 6, the planar position of the molded body distributing means 34 and the resin material means 60 can be exchanged. In the case of such exchange, the resin material means 60 is adjacent to the right side forming means 33 shown in Fig. 6, and is adjacent to the formed body distributing means 34 (in other words, the right side forming means 33 and the formed body distributing means) 34 is sandwiched) and is detachably mounted in the resin sealing device A2.

The particle diameter D described in the present specification refers to the area equivalent circle diameter of the projected area of the particles in the image obtained by photographing the resin sealing material 5 by optical means. Therefore, the same resin sealing material 5 is used, and other measurement methods other than the measurement (calculation) of the area equivalent circle diameter, for example, the measurement of the Feret diameter, the shading method, or the screening method, are used to measure the particle diameter D. It is possible to obtain a measurement value different from the particle diameter D in the present application. When the particle diameter D is measured by another measurement method, it is judged whether or not it is included in the second specification of the particle diameter D described in the present specification by replacing it with the measurement value measured by the measurement method in the present application. In other words, it is not appropriate to directly compare the measured value obtained by using another measurement method with the second specification of the particle diameter D described in the present specification.

In the case of measuring the particle diameter D of the resin sealing material 5, a method of photographing the resin sealing material 5 dispersed on the tray from above, and a method of photographing the resin sealing material 5 freely dropped from a feeder from the side is used. Wait. However, it is not limited to these. The particle diameter D can be measured for the entire number of the resin sealing materials 5 to be supplied. Alternatively, a part of the sample may be taken out from the resin sealing material 5 set to be supplied, and the particle diameter D may be measured for the sample.

In the description of the resin sealing devices A1 and A2, the sorting means 46 for sorting the resin sealing material 5 according to the second specification set for the particle diameter D, and the result of the pulverization sorting have been provided. An example of the pulverizing means 47 which determines that the particle diameter D is larger than the second specification is described (see Figs. 5 and 6). Not limited to this, as a modification, both the sorting means and the pulverizing means may be provided outside the resin sealing device. In this case, the resin sealing material 5 which is previously sorted outside the resin sealing device and pulverized as needed may be supplied to the resin sealing device.

As another modification, a sorting means may be provided inside the resin sealing device, and a pulverizing means for pulverizing the material of the second specification which does not satisfy the particle diameter D may be provided outside the resin sealing device. The step of transferring the material outside the specification to the pulverizing means may be performed manually by the operator, or may be performed by using a conveying means that moves along the rail or a conveying means having an arm that reciprocates.

In the configuration described so far, instead of the supply baffle 20, the drop port of the resin sealing material 5 may be provided in the first supply means 3. In this configuration, the first sealing means 3 is moved while the resin sealing material 5 is dropped into the chamber 4, and the resin sealing material 5 is supplied to the chamber 4. As the drop port of the resin sealing material 5, it is preferable to provide a drop port having a groove shape almost horizontally. Further, it is preferable that the first supply means 3 is moved such that the orientation in which the resin sealing material 5 is dropped in plan view does not overlap with each other and the mold faces of the chamber 4 do not overlap each other. Further, it is preferable that the resin sealing material 5 is dropped against the mold surface of the chamber 4 while vibrating the resin sealing material 5 by applying vibration to the dropping port by using the vibration applying means.

In the configuration described so far, the following first and second variation configurations may be employed. In the first variation, the first supply means having the outer frame is provided, and the rectangular release film 6 is adsorbed on the lower surface of the first supply means so as to cover the inner side of the outer frame and the outer frame in plan view, and The resin sealing material 5 is supplied to the accommodating portion including the space surrounded by the outer frame and the release film 6. According to this configuration, the first supply means is moved above the chamber 4 in a state in which the resin sealing material 5 is housed in the accommodating portion. The release film 6 is adsorbed on the inner surface of the chamber 4 while releasing the adsorption of the release film 6. Thereby, the release film 6 and the resin sealing material 5 are supplied to the chamber 4.

In the second variation, the first supply means having the concave portion is provided, and the resin sealing material 5 is supplied to the concave portion, and the rectangular release film 6 is adsorbed on the upper surface of the first supply means to reverse the first supply means. Composition. According to this configuration, the inverted first supply means is moved above the chamber 4. The release film 6 is adsorbed on the inner surface of the chamber 4 while releasing the adsorption of the release film 6. Thereby, the release film 6 and the resin sealing material 5 are supplied to the chamber 4.

In any of the above-described two variations, the vibration applying means can be used when the resin sealing material 5 is supplied to the first supply means. In addition, the resin sealing material 5 can be vibrated by applying vibration to the dropping port which the resin sealing material 5 falls to the first supply means. In this case, it is preferable that the resin sealing material 5 is dropped toward the first supply means while vibrating the resin sealing material 5 above the first supply means.

In the above-described description, the transfer system that transports the front substrate 15 and the molded body 26 and the transport system that transports the resin sealing material 5 are collectively described as an example of the main transport means 38 (see FIG. 5). , 6). In place of such a configuration, the transport system that transports the sealed front substrate 15 and the molded body 26 and the transport system that transports the resin sealing material 5 may be set to another system.

In the description so far, it has been set for a forming means 33 The configuration of a group of forming dies has been described (see Figs. 5 and 6). Instead of such a configuration, a plurality of sets of forming dies including the lower mold 1 and the upper mold 2 may be prepared for one forming means 33, and a plurality of forming dies may be disposed in the upper and lower stages, respectively. In this configuration, by operating the common mold opening and closing mechanism, it is possible to substantially and simultaneously clamp and mold a group of forming dies of the upper stage and a group of forming dies of the lower stage. As a common mold opening and closing mechanism, for example, a drive source such as a servo motor or a hydraulic cylinder, and a transmission means such as a rack and a pinion are used. According to this configuration, the use has the same In the case of the forming means 33 of the exclusive area, it is possible to achieve twice the production efficiency.

In the description so far, the embodiment using the release film 6 has been described (refer to (2), 5, and 6 of Fig. 2). However, the release film 6 may not be used depending on the combination of the physical properties of the material used for the molding die and the physical properties of the sealing resin 25.

In the description so far, an example has been described in which the external air insulating space 23 is formed at least in the intermediate mold clamping state, and the external air insulating space 23 is decompressed (refer to (3) of FIG. 1). . However, the external air insulating space 23 may not be formed according to the quality level related to the air bubbles or the like required for the sealing resin 25, and the external air insulating space 23 may not be decompressed.

In the description so far, as shown in (3) and (4) of FIG. 2, the molded body 26 is singulated in units of the respective regions 18. For example, in the case where there are four in the X direction in FIG. 2 (3) and four regions 18 exist in the Y direction, the molded body 26 is singulated into 16 electronic components 28 each composed of one region 18. However, the molded body 26 may be formed into a single region in the X direction and a total of four in the Y direction (hereinafter referred to as "1 × 4"), or the molded body 26 may be formed into a single piece. The total is 4 x 1 area. In this way, four electronic components 28 each composed of four regions 18 can be manufactured. Further, the molded body 26 can be singulated into a 2 × 2 region, and four electronic components 28 each composed of four regions 18 can be manufactured. Further, an unnecessary portion in the end portion can be removed from the formed body 26, the formed body 26 can be singulated into a 4x4 region, and sixteen electronic components 28 composed of the region 18 can be fabricated. Therefore, in the case where the wafer 14 is an LED wafer, it is possible to easily manufacture a columnar or planar optical element (illuminant).

The present invention is not limited to the above-described embodiments, and may be arbitrarily and appropriately combined, changed, or selected as needed, without departing from the spirit and scope of the invention.

1‧‧‧下模

2‧‧‧上模

3‧‧‧1st means of supply

4‧‧‧ chamber

5‧‧‧Resin sealing materials

6‧‧‧ release film

7‧‧‧Outer frame members

8‧‧‧Cell components

9‧‧‧Attraction channel (attraction means)

10‧‧‧heater (heating means)

11‧‧‧ Sealing members (outside air isolation means)

12‧‧‧Attraction channel (decompression means)

13‧‧‧Substrate body

14‧‧‧ wafer (electronic parts)

15‧‧‧ Sealing the front substrate

16‧‧‧ lead

17‧‧‧ boundary line

18‧‧‧Area

19‧‧‧Front frame

20‧‧‧Supply baffle

21‧‧‧ Housing Department

22‧‧‧ molten resin

23‧‧‧External air isolation space

24‧‧‧Exhausted gases, etc.

D‧‧‧particle size

Claims (16)

A resin sealing material is used as the sealing resin when a molding die for compression molding provided in a resin sealing device and having a chamber is used, and an electronic component mounted on the substrate body is resin-sealed by a sealing resin. a raw material comprising a resin material and being in the form of powder or granules, wherein the thickness of the sealing resin is from a surface on which the electronic component is mounted in the substrate body to an upper surface of the sealing resin In the case where the first specification is set to the target value t (mm) of the thickness of the sealing resin, the particle diameter D of the resin sealing material satisfies the second specification of D≦a×t (mm); The first specification is 0.03 (mm) ≦ t ≦ 1.2 (mm), where a is a positive real number; the coefficient a satisfies 2.99 ≦ a ≦ 3.125. The resin sealing material according to claim 1, wherein the first specification is 0.05 (mm) ≦ t ≦ 1.0 (mm). The resin sealing material according to claim 1 or 2, wherein the second specification calculates a projected area by an image obtained by photographing the resin sealing material, and the area of the projected area is equivalent The circular diameter treatment is applied as the particle diameter D, and the value of a is 3.0. The resin sealing material according to claim 1 or 2, wherein the resin sealing material is used to determine whether or not the resin sealing material satisfies the second specification by a centrifugal force generated by a gas flow or by a sieve. The resin sealing material according to claim 1 or 2, wherein the resin material has It has thermosetting properties. The resin sealing material according to claim 5, wherein the resin material contains an epoxy resin or a lanthanum resin. The resin sealing material according to claim 1 or 2, wherein the resin material has light transmissivity. The resin sealing material according to claim 1 or 2, wherein the resin sealing material comprises a material of a first specification having at least the resin material, an additive, and a filler; the resin material is powder or granule The material of the first specification is obtained by kneading at least the resin material, the additive, and the filler, and the pulverized material is pulverized according to the second specification (D≦a×t(mm)). The result of the sorting was judged to be a material satisfying the second specification. The resin sealing material according to claim 1 or 2, wherein the resin sealing material comprises a material of a second specification having at least the resin material, an additive, and a filler; the resin material is powder or granule The material of the second specification is a first pulverized material obtained by kneading and pulverizing at least the resin material, the additive, and the filler according to the second specification (D≦a×t (mm) And the result of the sorting is determined to be that the material other than the specification of the second specification is further pulverized to generate the second pulverized material, and the second pulverized material is judged to be satisfactory according to the result of the second specification sorting. The material of the second specification. The resin sealing material according to claim 1 or 2, wherein the resin sealing is used The material includes a material in the first specification; and the resin sealing material is supplied between the resin sealing device and the chamber to the chamber according to the second specification (D≦a×t(mm)). The result of the sorting was judged to be a material satisfying the second specification. The resin sealing material according to the first or second aspect of the invention, wherein the resin sealing material comprises a material of a second specification; and the material of the second specification is a material for sealing the resin. When the resin sealing device is supplied to the chamber and sorted according to the second specification (D≦a×t(mm)), it is determined that the material that does not satisfy the specification of the second specification is pulverized. When the pulverized material was produced, the pulverized material was sorted according to the second specification, and it was judged that the material of the second specification was satisfied. A method for producing a resin sealing material which is obtained by resin-sealing an electronic component mounted on a substrate body by a sealing resin using a molding die for compression molding provided in a resin sealing device and having a chamber When it is used as a raw material of the sealing resin, and is in the form of powder or granules, the method for producing a resin sealing material is characterized by comprising: preparing a resin material containing at least powder or granules, an additive, and a step of a raw material group of the filler; a step of kneading the raw material group; a step of kneading the raw material group to form a first intermediate material; and a step of pulverizing the intermediate material to form a second intermediate material; The thickness of the sealing resin is a size from a surface on which the electronic component is mounted in the substrate body to an upper surface of the sealing resin, and a target value t (mm) to a thickness of the sealing resin. When the first specification is set, the step of sorting the second intermediate material is based on the second specification of the particle diameter D of the resin sealing material being D≦a×t (mm) (where a is a positive real number). And a step of determining, as the resin sealing material, a material in the first specification that satisfies the second specification among the raw material groups; the first specification is 0.03 (mm) ≦t ≦ 1.2 (mm) The coefficient a satisfies 2.99≦a≦3.125. The method for producing a resin sealing material according to claim 12, wherein the first specification is 0.05 (mm) ≦t ≦ 1.0 (mm). The method for producing a resin sealing material according to claim 13, wherein in the step of sorting the raw material group, a projected area is calculated by an image obtained by photographing the resin sealing material, and The area equivalent circular diameter process of the projected area is applied to the second specification as the particle diameter D; the value of a is 3.0. The method for producing a resin sealing material according to claim 13, wherein in the step of sorting the raw material group, whether the resin sealing material satisfies the first portion by using a centrifugal force generated by a gas flow or using a sieve 2 specifications. The method for producing a resin sealing material according to any one of claims 12 to 15, wherein the method further comprises: a step of smashing the result of sorting according to the second specification in the step of sorting the raw material group, and determining that the material of the second specification (D≦a×t(mm)) is not satisfied; The step of sorting the pulverized outer material of the specification in the second specification; and determining the material in the second specification that satisfies the second specification among the pulverized outer materials as the resin seal The steps of using materials.