JP5065771B2 - Resin sealing device and resin sealing method - Google Patents

Description

  The present invention relates to a technical field of a resin sealing device that compresses and seals a molded product (a substrate, a lead frame, etc.) on which a semiconductor chip is mounted with a resin.

  Conventionally, as shown in FIG. 3, a plurality of semiconductor chips 15 arranged in different planes on the substrate 14 are arranged in one cavity 5, and a resin 17 is put into the cavity 5. A resin sealing device 1 for compression molding is known (see Patent Document 1). The resin sealing apparatus 1 is premised on a production method (MAP method) in which several tens of semiconductor chips are arranged in a matrix on a large substrate and dicing into each package after batch sealing.

  In the case of compression molding, the size of the molded product after resin sealing (particularly the size in the thickness direction) depends on the amount of resin supplied into the cavity. Therefore, when supplying the resin, the required amount is strictly measured and supplied after detecting the number of semiconductor chips mounted on the substrate. This is due to the fact that the semiconductor chip may not be mounted on the substrate when a defect of the semiconductor chip is confirmed in the upstream process.

JP 2004-174801 A

  However, in the conventional method, a “resin flow” exceeding the allowable range occurs during compression, which may cause a cutting or short circuit of the bonding wire (gold wire). This is because even when the required amount of resin 17 is accurately supplied to the cavity 5, the amount is only that the total amount of “as a whole cavity” is the same, and when the cavity 5 is partitioned. This is probably because the optimum amount of resin is not supplied for each section. In other words, since all the semiconductor chips are mounted in a certain section, the amount of resin required for the entire cavity is supplied even though the amount of resin required is small compared to other sections. On the other hand, despite the relatively large amount of resin required because the semiconductor chip is missing, the resin corresponding to the amount equally divided by the whole cavity is supplied, This is because the resin 17 flows from the excessive compartment A to the compartment B where the resin is insufficient (see FIG. 4).

  The present invention has been made to solve such a problem, and provides a resin sealing device and a method for the same, which cause less resin flow during compression.

The present invention relates to a resin sealing device in which a plurality of semiconductor chips arranged in different planes on a substrate or a lead frame are arranged in one cavity, resin is supplied into the cavity, and then compression molding is performed. And means for detecting the arrangement state of the semiconductor chips for each predetermined section of the substrate or the lead frame, and on the predetermined section of the substrate or the lead frame in the cavity based on the detection result of the detecting means. The above-mentioned problem is solved by providing a resin supply mechanism that supplies a desired amount of the resin to a corresponding position .

That is, by supplying the resin required at positions corresponding to predetermined compartments in key Yabiti, thereby suppressing the flow of the resin at the time of compression. The size and shape of the compartment are not particularly limited, and an optimum design can be freely made .

For example, the desired amount, wherein is arranged at a predetermined compartment is determined based on the volume of the semiconductor chip lever, as a result of the optimal amount of resin is supplied to each section, the resin flow reduction, are prevented .

  Further, when the resin is a preformed resin, the resin is managed by sorting (that is, the resin is divided here) to facilitate the handling of the resin and to place the resin on the mold surface. In addition, the possibility of entraining air under the resin can be reduced. At this time, if at least one of the adjacent sides in the preformed resin disposed in the adjacent section is convex at the center of the side, the preformed resin is compressed and the resin sealing is performed. Air can be discharged, and higher quality sealing becomes possible.

  In another aspect of the present invention, a plurality of semiconductor chips arranged in different planes on a substrate or a lead frame are arranged in one cavity, and resin is supplied into the cavity, followed by compression molding. A method for detecting the arrangement state of the semiconductor chips for each predetermined section of the substrate or the lead frame, and the substrate or the lead frame in the cavity based on a detection result of the detection step. And a step of supplying a desired amount of the resin to a position corresponding to the predetermined section.

  By applying the present invention, it becomes possible to reduce sealing abnormality, and it is possible to stably supply a high-quality molded product (sealed product).

  Hereinafter, an example of an embodiment of the present invention will be described with reference to the accompanying drawings.

  FIG. 1 is a plan view of a cavity 105 in a resin sealing device 100 to which the present invention is applied.

  The resin sealing device 100 includes a lower mold 102 and an upper mold (not shown), and the substrate 105 can be clamped between the lower mold 102 and the upper mold. A plurality of semiconductor chips 115 are arranged on the substrate 105 in a matrix, that is, at different positions in a plan view. The plurality of semiconductor chips 115 are all arranged so as to be accommodated in one cavity 105 formed on the surface of the lower mold 102. The cavity 105 is virtually divided into four sections (a first section 120, a second section 121, a third section 122, and a fourth section 123) in a plan view. In this embodiment, the example in which the semiconductor chip 115 is mounted on the substrate 105 has been described. However, the same applies to the case where the semiconductor chip 115 is mounted on a lead frame, for example.

  In the resin sealing device 100, the substrate 105 is supplied to the upper mold surface by a substrate supply mechanism (not shown) with the molds (the lower mold 102 and the upper mold) opened. The substrate 105 is sucked and held at a predetermined timing by a suction mechanism provided on the surface of the upper mold. Before the substrate 105 is supplied, the number and position of the semiconductor chips 115 existing on the substrate 105 are detected as parameters in advance. The detection may be detected by, for example, image processing. When a higher-level production information system (for example, CIM) including the resin sealing device 100 is constructed, information on the production information system is displayed. It can also be used. In addition, since information on what (for example, what volume) semiconductor chip is mounted at which position of the substrate 105 is known in advance, the semiconductor disposed in the cavity 105 based on this information. The volume of the entire chip 115 can be obtained. In other words, the amount of resin to be put into the cavity 105 can be calculated. Furthermore, in this embodiment, the cavity 105 is virtually partitioned, but the substrate 105 side is also partitioned so as to correspond to the partition, and the number of semiconductor chips 115 for each partition is grasped. It is also possible to calculate the amount of resin required for each of the sections 110, 111, 112, and 113 of the cavity 105.

  On the other hand, into the cavity 105 of the lower mold 102, tableting resins 110, 111, 112, and 113 preformed in a plate shape are supplied by a resin supply mechanism (not shown). The resin supplied here is approximately the size of the cavity 105 divided into four, and each of the resins 110, 111, 112, 113 has four virtual sections (first section 120, first section 120) of the cavity 105. 2 sections 121, 3rd sections 122, 4th sections 123).

  Each resin 110, 111, 112, 113 is classified and managed and adjusted to the amount of resin required for each section. A different number of semiconductor chips 115 are arranged in each section. That is, 0 pieces are arranged in the first section 120, three pieces are arranged in the second section, about 10.5 pieces are arranged in the third section, and about 9.5 pieces are arranged in the fourth section. Therefore, the amount of resin to be supplied to each compartment is as follows: the amount of resin 110 supplied to the first compartment 120> the amount of resin 111 supplied to the second compartment 121> the resin 113 supplied to the fourth compartment 123. The amount of the resin 112 supplied to the third compartment 122 is in this order.

  In such a state, the lower mold 102 and the upper mold are closed and compression-molded, so that a large resin flow does not occur beyond the section. Even if a resin flow occurs, it is theoretically small in each compartment. In addition, the size and shape of the compartment are not particularly limited, and an optimum design can be freely made. For example, if the compartments are set more finely, it is possible to prevent the resin flow with higher accuracy.

  Further, when the resin is a so-called “plate-shaped preformed resin” in which the resin is preformed as in the present embodiment, the resin is easily handled by dividing and managing (that is, dividing) the resin, When the resin is placed on the surface of the lower mold 102 (that is, in the cavity 105), the possibility of air being entrained under the resin can be reduced.

  In the above-described embodiment, the tableting resin in which the resin is preformed in a plate shape is described as an example, but other than that, for example, a powdery resin, a liquid resin, a granular resin, etc. The effect of can be demonstrated. In other words, it can be realized by classifying and managing as a set of powder, liquid, and grains corresponding to the cavity sections, and determining the resin amount of the section-controlled resin for each cavity section based on predetermined parameters. is there.

  Further, the tableting resins 110 to 113 are each substantially square in FIG. 1, but are not limited to this shape. For example, as shown in FIG. 2 (A), if the adjacent sides in the pre-molded resins 210 and 211 arranged in adjacent sections have a convex shape that rises in an arc shape at the center of the side, Air can be discharged in the process in which the molding resins 210 and 211 are compressed and resin sealing is performed (see FIG. 5B), and higher-quality sealing is possible. In addition, it may be a convex shape that rises in a triangular shape at the central portion of the adjacent side (see FIG. 10C), or a convex shape that rises in a trapezoidal shape at the central portion of the adjacent side (see FIG. Even in the case of D), the effect of prompting the discharge of air can be expected.

  The present invention can be widely applied to a resin sealing device that seals a molded product such as a substrate or a lead frame on which a semiconductor chip is mounted with a resin.

Plan view of cavity in resin sealing device to which the present invention is applied The figure which showed the example of composition of tableting resin (pre-forming resin) Schematic configuration diagram of a resin sealing device 1 described in Patent Document 1 Plan view of cavity in conventional resin sealing device

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Resin sealing apparatus 102 ... Lower mold 114 ... Substrate 105 ... Cavity 110-113 ... Divided resin 115 ... Semiconductor chip 120 ... 1st division 121 ... 2nd division 122 ... 3rd division 123 ... 4th division

Claims (5)

A resin sealing device in which a plurality of semiconductor chips arranged in different planes on a substrate or a lead frame are arranged in one cavity, and resin is supplied into the cavity and then compression molded,
Means for detecting the arrangement of the semiconductor chips for each predetermined section of the substrate or lead frame ;
A resin supply mechanism that supplies a desired amount of the resin to a position corresponding to a predetermined section of the substrate or the lead frame in the cavity based on a detection result of the detecting unit ;
Resin sealing apparatus comprising: a. In claim 1,
The desired amount, the resin sealing apparatus, characterized in that that will be determined based on the volume of the semiconductor chip disposed in the predetermined compartment. In claim 1 or 2,
The resin sealing device, wherein the resin is a preformed resin. In claim 3,
At least one of the adjacent sides in the preformed resin arranged in the adjacent compartments has a convex shape at the center of the side. A resin sealing method in which a plurality of semiconductor chips arranged in different planes on a substrate or a lead frame are arranged in one cavity, and a resin is supplied into the cavity, followed by compression molding.
Detecting the arrangement of the semiconductor chips for each predetermined section of the substrate or lead frame;
Supplying a desired amount of the resin to a position corresponding to a predetermined section of the substrate or the lead frame in the cavity based on the detection result of the detection step.

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