JP6371816B2 - Semiconductor device manufacturing method and semiconductor manufacturing apparatus - Google Patents

Description

Embodiments described herein relate generally to a method for manufacturing a semiconductor device, a semiconductor manufacturing apparatus, and a sheet-like resin for resin sealing.

A compression molding method is known as one of resin sealing methods for semiconductor chips. The compression molding method uses a mold divided into an upper mold and a lower mold, a semiconductor chip to be sealed in the upper mold, a resin in the lower mold, the upper mold and the lower mold are brought close to each other and melted. In this method, the upper semiconductor chip is immersed in the lower resin and the resin is sealed by compression molding. For example, compared to the transfer molding method in which resin is injected from the side of the mold, the compression molding method has less resin flow when the semiconductor chip is immersed in the resin, so that the wire is less likely to be deformed. There is an advantage that the resin is easily spread over the entire surface.

Examples of the resin used in the compression molding method include granular resins and sheet resins. In particular, a sheet-like resin is more preferable than a granular resin because the uniformity of the thickness of the resin can be improved and, for example, when a large substrate is sealed, a takt time can be improved.

When a sheet-shaped resin is used as the resin, for example, the melting of the sheet-shaped resin at the time of compression molding may become uneven, or the appearance quality may be deteriorated due to the occurrence of spots after compression molding. Further, the non-uniformity of melting and spots are likely to occur as the size and number of semiconductor chips to be sealed increase, for example. Therefore, in the compression molding method, it is required to make the sheet-like resin evenly melted and to suppress deterioration in appearance quality due to spots.

JP 2004-146556 A

The problem to be solved by the present invention is to provide a method of manufacturing a semiconductor device capable of suppressing at least one of non-uniform melting of a sheet-like resin and deterioration of appearance quality due to spots.

The method for manufacturing a semiconductor device according to the embodiment includes a step of preparing a sheet-like resin having a recess including a through hole, a step of arranging a circuit substrate provided with a semiconductor chip in a first mold for compression molding, and A step of disposing a sheet-shaped resin having a recess in the second mold for compression molding so as to face the semiconductor chip, a step of heating the sheet-shaped resin having a recess, a first mold and a second mold Sealing the semiconductor chip with a cured product of the molten resin by immersing the semiconductor chip in a molten resin that has been heated and melted and performing compression molding, The step of preparing a sheet-shaped resin having a recess is formed by hollowing out a part of the resin separated from a part of the resin serving as a supply source based on the amount of resin necessary for sealing the semiconductor chip. Multiple formed and separated Comprising the step of fine adjustment to the amount of fat Amount of the required resin. The volume of the recess is smaller than the volume of air bubbles remaining when the separated resin is placed in the second mold, and the interval between the plurality of recesses is narrower than the width of the air bubbles.

It is a schematic diagram which shows the semiconductor manufacturing apparatus and the manufacturing method of a semiconductor device in 1st Embodiment. It is a figure which shows the example of the sheet-like resin in 2nd Embodiment. It is a figure which shows the example of the sheet-like resin in 2nd Embodiment. It is a figure which shows the example of the sheet-like resin in 2nd Embodiment. It is a figure which shows the example of the sheet-like resin in 2nd Embodiment.

  The semiconductor device of the embodiment will be described below with reference to the drawings.

(First embodiment)
FIG. 1 is a schematic diagram illustrating a semiconductor manufacturing apparatus and a semiconductor device manufacturing method according to an embodiment.
The semiconductor manufacturing apparatus shown in FIG. 1 includes a resin processing part 31, a compression molding part 32, and a substrate (circuit base material).
A transport unit 33 and a resin transport unit 34 are provided.

The resin processing unit 31 measures the amount of resin necessary for sealing the semiconductor chip 18 and separates a part of the resin 10 serving as a supply source based on the measured amount of resin. Furthermore, in the resin processing part 31, the sheet-like resin 1 which has the recessed part 2 is formed by forming a recessed part in the separated sheet-like resin 1. FIG.

As the resin 10 serving as the supply source, for example, a plate-shaped resin or a roll-shaped resin can be used. In the case of plate-shaped resin or roll-shaped resin, the amount of resin can be adjusted by the length of the resin to be separated. In FIG. 1, the case where roll-shaped resin is used is illustrated as an example. Examples of the resin 10 include an epoxy resin composition, a silicone resin composition, a polyimide resin composition, and the like. In addition, you may supply the plate-shaped resin processed into the resin amount required for sealing to the resin processing part 31 as the resin 10. FIG.

The recess 2 of the sheet-like resin 1 is formed using, for example, a recess forming device 20. Concave formation device 2
For example, as shown in FIG. 1, 0 is a structure in which a convex portion is provided.
You may form the recessed part 2 by pressing. In addition, it is not limited to this, For example, you may form the recessed part 2 by making the recessed part formation device 20 into the roller which has a some convex part, and pressing the sheet-like resin 1 with this roller, extending | stretching with the convex part. Also, the structure of the recess forming device 20 is
The structure may be such that a part of the sheet-like resin 1 can be hollowed out, and the concave part may be formed by hollowing out a part of the sheet-like resin 1. For example, when manufacturing various types of semiconductor devices, the amount of resin required for sealing varies depending on the size and number of semiconductor chips. In such a case, the amount of the sheet-like resin 1 may be adjusted so as to be a necessary amount of resin by hollowing out a part of the sheet-like resin 1 to form a recess. When the processed sheet-like resin 1 is supplied to the resin processing portion 31, it is effective to adjust the resin amount by the recess 2. By processing the sheet-like resin 1 and adjusting the amount of resin, the amount of the sheet-like resin 1 can be finely adjusted, so that excess resin can be reduced during sealing, and the manufacturing cost can be reduced. Can be suppressed.

Although the recessed part 2 is not specifically limited, For example, it is preferable to have at least one of a through hole or a non-through hole. During compression molding, the phenomenon that the appearance quality deteriorates due to non-uniform melting of the sheet-shaped resin 1 or generation of large spots after compression molding occurs between the sheet-shaped resin 1 and the compression molding mold. It was revealed that this was caused by relatively large bubbles remaining in the film. On the other hand, for example, by providing a through-hole as the concave portion 2, bubbles under the sheet-like resin 1 can escape during compression molding. By providing a non-through hole as the recess 2,
Air bubbles remaining under the sheet-like resin 1 during compression molding can be dispersed. In FIG. 1, the case where it has the some recessed part 2 which is a non-through hole as an example is illustrated.

The compression molding unit 32 includes a compression molding die using the compression molding die 12 and the die 13 and the heater 14 for heating the compression molding die. A cavity is formed by the mold 12 and the mold 13. A cavity block 16 is provided on the side surface of the cavity portion. In the compression molding unit 32, the semiconductor chip 1 is obtained by performing compression molding by bringing the mold 12 and the mold 13 close to each other.
8 is sealed with the sheet-like resin 1. Although FIG. 1 shows an example in which the substrate 19 provided with the semiconductor chip 18 is disposed in the mold 12 and the sheet-like resin 1 having the recess 2 is disposed in the mold 13, the present invention is not limited thereto. The sheet-like resin 1 having the recess 2 is placed in the mold 12,
A substrate 19 provided with a semiconductor chip 18 may be disposed in the mold 13.

In the substrate transport unit 33, the substrate 19 provided with the semiconductor chip 18 is arranged in one of the mold 12 and the mold 13 (first mold). In addition, as the board | substrate 19, circuit base materials, such as a wiring board and a lead frame, can be used, for example. Further, the semiconductor chip 18 may be electrically connected to a circuit substrate and a metal wire or the like via an internal wiring. The substrate transport unit 33 may be provided with, for example, a robot arm that can transport the substrate 19.

In the resin transport section 34, the sheet-like resin 1 having the recess 2 is disposed in the other of the mold 12 and the mold 13 (second mold) so as to face the semiconductor chip 18. In addition, when the recessed part 2 has a through-hole, the surface which contact | connects a 2nd type | mold may be any surface of the sheet-like resin 1, and also when the recessed part 2 has a non-through-hole, it is 2nd type | mold. Any surface of the sheet-like resin 1 may be in contact with the surface. For example, in order to suppress non-uniform melting of the sheet-shaped resin 1 based on bubbles remaining between the second mold and the sheet-shaped resin 1, the occurrence of spots, etc., the concave portion 2 of the sheet-shaped resin 1 is provided. It is preferable that the formed surface is arranged so as to contact the second mold. For example, a robot arm capable of transporting the sheet-like resin 1 may be provided in the resin transport unit 34.

Next, an example of a method for manufacturing a semiconductor device will be described with reference to FIG. The manufacturing method of the semiconductor device according to the present embodiment can be roughly divided into a weighing / processing step, a conveying step, and a compression molding step. When a semiconductor device is manufactured using the semiconductor manufacturing apparatus, a control unit is provided in the semiconductor manufacturing apparatus, and the operation of each process is controlled by the control unit.

First, in the weighing / processing step, the amount of resin necessary for sealing the semiconductor chip 18 is measured, and a part of the resin is separated from the resin 10 serving as a supply source. By forming the recessed part 2 in the separated sheet-like resin 1, the sheet-like resin 1 having the recessed part 2 is formed. At this time, you may adjust the quantity of resin by hollowing out a part of sheet-like resin 1 with the recessed part formation device 20. FIG. In addition, you may prepare beforehand the sheet-like resin which has the recessed part 2 separately, without providing the resin process part 31. FIG.

Next, in the transfer process, the substrate 1 on which the semiconductor chip 18 is provided via the substrate transfer unit 33.
9 is disposed in the first mold (one of the mold 12 and the mold 13) in the compression molding section 32. You may convey the sheet-like resin 1 to the resin conveyance part 34 using a belt conveyor etc., for example. The sheet-like resin 1 is disposed in the second mold (the other of the mold 12 and the mold 13) in the compression molding section 32 via the resin transport section 34. At this time, the sheet-shaped resin 1 is disposed in the second mold so that the surface having the concave portion 2 faces down and the sheet-shaped resin 1 faces the semiconductor chip 18.

Next, in the compression molding step, the mold 12 and the mold 13 are heated by the heater 14 to melt the sheet-like resin 1 to form a molten resin. Further, the mold 12 and the mold 13 are brought close to each other so that the semiconductor chip 18 is immersed in the molten resin and compression molding is performed. Semiconductor chip 1
8 is sealed with a cured product of molten resin. After sealing with resin, dicing is performed to separate each semiconductor chip 18 to obtain a semiconductor device.

When the sheet-shaped resin 1 is arranged in the second mold in the conveying step, air bubbles 50 may remain between the second mold and the sheet-shaped resin 1 as shown in FIG. If the bubbles 50 expand due to heating when the sheet-shaped resin 1 is melted, the heat conduction changes due to the bubbles 50 during compression molding, and the melting of the sheet-shaped resin 1 becomes non-uniform, and large spots are generated after compression molding. Doing so reduces the appearance quality. In the present embodiment, since the concave portion 2 is formed in the sheet-like resin 1, the bubbles 50 are allowed to escape to the outside through the through holes, or the bubbles 50 are formed into the plurality of concave portions 2 through the non-through holes.
The bubbles 50 can be reduced. Therefore, since the influence by the stain which arises after compression molding can be made small, appearance quality can be improved.

(Second Embodiment)
2-6 is a figure which shows the example of the sheet-like resin 1 which has the recessed part 2 as a sheet-like resin for resin sealing by compression molding. In addition, the sheet-like resin 1 having the recess 2 is, for example, the first
It can use as the sheet-like resin 1 which has the recessed part 2 of embodiment.

2A is a top view showing an upper surface of an example of the sheet-like resin 1, and each of FIGS. 2B-1 to 2B-5 is a line segment A in FIG. It is sectional drawing which shows an example of the cross section of -B.

As shown in FIG. 2A, the sheet-like resin 1 has a plurality of recesses 2. The recess 2 is shown in FIG.
As shown in (B-1), it may be a through hole. In addition, as shown in FIG.
The recess 2 may be a through hole, and the diameter of the through hole may be reduced in the depth direction. In addition, FIG.
As shown in B-3), the recess 2 may be a non-through hole, and the diameter of the non-through hole may be narrowed in the depth direction. Further, as shown in FIG. 2 (B-4), the recess 2 may be a non-through hole, the diameter of the non-through hole may be narrowed in the depth direction, and the periphery of the non-through hole may be raised. In addition, FIG.
As shown in 5), the recess 2 may be a non-through hole and the bottom surface of the non-through hole may be a curved surface.

The volume of the recess 2 is preferably smaller than the volume of air bubbles remaining when the sheet-like resin 1 is disposed in the mold 13 of the compression molding section 32. Moreover, it is preferable that the space | interval of the some recessed part 2 is narrower than the width | variety of the bubble of air. As a result, the remaining air bubbles become one recess 2.
It becomes easy to disperse | distribute to the several recessed part 2 without accumulating only, and the bubble of the remaining air can be made small. Therefore, since the influence by the stain which arises after compression molding can be made small, appearance quality can be improved.

Further, in FIG. 2A, the shape and arrangement interval of the plurality of recesses 2 are uniform, but the present invention is not limited to this. Each of FIGS. 3A to 3C is a top view illustrating another example of the top surface of the sheet-like resin 1.

As shown in FIG. 3A, the positions of the plurality of recesses 2 may be non-uniform. In addition, FIG.
As shown in B), the diameters of the plurality of recesses 2 may be non-uniform, for example, the recess 2a at the center.
The diameter may be larger than the diameter of the recess 2b at the peripheral edge. Accordingly, air bubbles that are likely to remain in the central portion can be easily released to the recesses 2a and 2b, so that the remaining air bubbles can be dispersed to reduce the bubbles. Moreover, as shown in FIG.3 (C), you may increase the number of the recessed parts 2 of a center part from the number of the recessed parts 2 of a peripheral part. As a result, it is possible to make it easier for the remaining air bubbles that are likely to be generated in the central portion to escape to the concave portion 2,
The influence of air bubbles can be reduced. Moreover, the thermal conductivity of the sheet-like resin 1 can be increased by the amount of the number of recesses 2 at the peripheral edge.

Moreover, the sheet-like resin 1 is not limited to the structure shown in FIG. 2 and FIG. FIG. 4 (A)
It is a top view which shows the upper surface of the other example of the sheet-like resin 1, and is FIG. 4 (B-1) thru | or FIG. 4 (B-3).
) Are cross-sectional views showing an example of the cross section of the line segment CD in FIG.

As shown in FIG. 4A, the sheet-like resin 1 has recesses 2 provided in a lattice shape extending so as to intersect vertically and horizontally. As shown in FIG. 4 (B-1), the recess 2 is a groove, and the width of the groove may be narrowed in the depth direction. Further, as shown in FIG. 4B-2, the recess 2 may be a groove, the width of the groove may be narrowed in the depth direction, and the periphery of the groove may be raised. In addition, FIG.
As shown in 3), the recess 2 may be a groove, and the bottom surface of the groove may be a curved surface. The groove width may be non-uniform.

Further, in FIG. 4A, the recesses 2 are formed in a lattice shape that intersects vertically and horizontally, but the present invention is not limited to this. Each of FIG. 5A to FIG. 5C is a top view illustrating another example of the top surface of the sheet-like resin 1. As shown in FIG. 5A, a plurality of the recesses 2 may be provided in a lattice shape extending in the vertical direction. Further, as shown in FIG. 5B, a plurality may be provided in a lattice shape extending in an oblique direction. Further, as shown in FIG. 5C, the recesses 2 may be provided in a lattice shape in which two straight lines extending in an oblique direction intersect.

By providing the concave portion in the sheet-like resin 1, it is possible to disperse the remaining bubbles generated when the sheet-shaped resin 1 is arranged in the mold of the compression molding portion, and to reduce the bubbles. Therefore, since the influence by the stain which arises after compression molding can be made small, appearance quality can be improved.

In addition, although several embodiment of this invention was described, these embodiment is shown as an example and is not intending limiting the range of invention. These novel embodiments are:
Various other forms can be implemented, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

DESCRIPTION OF SYMBOLS 1 ... Sheet-like resin, 2 ... Recessed part, 2a ... Recessed part, 2b ... Recessed part, 10 ... Resin, 12 ... Mold, 13
DESCRIPTION OF SYMBOLS ... Type | mold, 14 ... Heater, 18 ... Semiconductor chip, 19 ... Substrate, 20 ... Concave formation device, 31 ... Resin processing part, 32 ... Compression molding part, 33 ... Substrate conveyance part, 34 ... Resin conveyance part, 50 ... Air bubbles.

Claims (8)

Preparing a sheet-like resin having a recess including a through hole;
Placing a circuit substrate provided with a semiconductor chip in a first mold for compression molding;
Disposing a sheet-like resin having the recess in the second mold for compression molding so as to face the semiconductor chip;
Heating the sheet-shaped resin having the recesses;
The semiconductor chip is sealed with a cured product of the molten resin by bringing the first mold and the second mold close to each other and immersing the semiconductor chip in a molten resin heated and melted to perform compression molding. A process of stopping,
The step of preparing a sheet-like resin having the concave portion
The resin separated from a part of the resin serving as a supply source based on the amount of the resin necessary for sealing the semiconductor chip is hollowed out to form a plurality of the recesses. comprising the step of fine adjustment to the amount amount of the required resin,
The volume of the recess is smaller than the volume of air bubbles remaining when the separated resin is disposed in the second mold, and the interval between the plurality of recesses is narrower than the width of the air bubbles. Manufacturing method.   The resin serving as the supply source is a plate-shaped resin or a roll-shaped resin, and the step of preparing the sheet-shaped resin having the concave portion is a step of adjusting the amount of the separated resin according to the length of the separated resin. A method of manufacturing a semiconductor device according to claim 1. The step of forming a plurality of the recesses includes:
2. The method of manufacturing a semiconductor device according to claim 1, further comprising forming a diameter of the recess formed in a central portion of a surface of the sheet-like resin in which the plurality of recesses are formed larger than a diameter of the recess in the peripheral portion. . Preparing a sheet-like resin having a recess including a non-through hole;
Placing a circuit substrate provided with a semiconductor chip in a first mold for compression molding;
As the sheet-like resin having the recess in the second mold for compression molding is opposed to the semiconductor chip, the non-through hole is formed a surface of the sheet-like resin is contact with the second mold Arranging, and
Heating the sheet-shaped resin having the recesses;
The semiconductor chip is sealed with a cured product of the molten resin by bringing the first mold and the second mold close to each other and immersing the semiconductor chip in a molten resin heated and melted to perform compression molding. A process of stopping,
The step of preparing a sheet-like resin having the concave portion
A plurality of the recesses are formed by pressing the resin separated from a part of the resin serving as a supply source based on the amount of the resin necessary for sealing the semiconductor chip with a protrusion provided in the recess forming device. Comprising the step of forming,
The volume of the recess is smaller than the volume of air bubbles remaining when the separated resin is disposed in the second mold, and the interval between the plurality of recesses is narrower than the width of the air bubbles. Manufacturing method.   The resin serving as the supply source is a plate-shaped resin or a roll-shaped resin, and the step of preparing the sheet-shaped resin having the concave portion is a step of adjusting the amount of the separated resin according to the length of the separated resin. A method for manufacturing a semiconductor device according to claim 4, comprising: The step of forming a plurality of the recesses includes:
5. The method of manufacturing a semiconductor device according to claim 4, further comprising forming a diameter of the concave portion formed at a central portion of the surface of the sheet-like resin on which the plurality of concave portions are formed larger than a diameter of the concave portion at the peripheral portion. . A resin processed part that forms a recess including a through hole in the sheet-like resin;
A compression mold having a first mold and a second mold; and a heating section for heating the compression mold; and compression molding by bringing the first mold and the second mold closer to each other , A compression molding part for sealing the semiconductor chip with the sheet-like resin,
A circuit base material transport unit for disposing the circuit base material provided with the semiconductor chip in the first mold;
A resin-conveying section that arranges the sheet-shaped resin having the concave portion in the second mold so as to face the semiconductor chip;
Comprising
The resin processing part is
The resin separated from a part of the resin serving as a supply source based on the amount of the resin necessary for sealing the semiconductor chip is hollowed out to form a plurality of the recesses. Tweak the amount ,
The volume of the recess is smaller than the volume of air bubbles remaining when the sheet-like resin is disposed in the second mold, and the interval between the plurality of recesses is narrower than the width of the air bubbles. . The semiconductor manufacturing according to claim 7, wherein the supply source resin is a plate-shaped resin or a roll-shaped resin, and the resin processing unit adjusts the amount of the separated resin according to a length of the separated resin. apparatus.

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