JPH08168999A - Manufacture of semiconductor-sealing resin sheet - Google Patents

Abstract

PURPOSE: To allow air layers to be introduced between resin sheets for the prevention of adhesion when stacking the resin sheets, so as to prevent the trouble of taking numerous sheets at a time as a result of automation by softening and cutting a resin plate, and thickening part or the whole of a sheet edge. CONSTITUTION: A resin plate 1 of uniform thickness is prepared as a semiconductor sealing material, and is softened on a flat heating plate 2. To prevent deforming the overall shape of the resin plate 1 in this case, metal foil 11 is bonded to the lower portion of the resin plate 1. Next, the resin plate 1 softened is cut apart with an unheated double-edged blade 3. The portion of the resin plate 1 against which the blade 3 has been pressed is pushed apart by the blade 3 so that thick portions 4 are formed. These operations are repeated to manufacture a semiconductor-sealing sheet that is thickened 4 at its edge.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sheet-shaped resin used for semiconductor encapsulation, and to a method for producing a resin sheet for semiconductor encapsulation in which the peripheral portion of the sheet is thickened to prevent trouble in handling the resin sheet in automation. .

[0002]

2. Description of the Related Art With the recent diversification of semiconductor devices, there are various methods for manufacturing them. In particular, the resin sealing method using a thermosetting plastic such as an epoxy resin starts from the potting method in addition to the transfer molding method, and the types of sealing methods tend to increase. Recently, a molding method using a resin sheet is one of them, and it is used in a compression molding method or as a substitute for a potting sealing resin.

[0003]

The resin sheet used in these sealing methods is generally a resin sheet cut into a required shape such as a quadrangle or the like to have a uniform thickness. These are generally stacked and used when used with an automated line. However, when stacking resin sheets of uniform thickness, the upper and lower resin sheets will adhere due to atmospheric pressure, etc.
When this was fed to the automation line, problems such as taking two sheets occurred, which was a major obstacle to automation.

The present invention has been made in view of the above circumstances, and when stacked, an air layer is introduced between the resin sheets to eliminate the close contact and prevent troubles such as taking two sheets in automation. It is intended to provide a method for manufacturing a resin sheet for semiconductor encapsulation.

[0005]

DISCLOSURE OF THE INVENTION In the present invention, as a result of earnest studies to achieve the above object, as a result of thickening the peripheral portion of a resin sheet and introducing an air layer between the resin sheets when stacked. It was found that the above-mentioned object can be achieved by the above, and the present invention has been completed.

That is, according to the present invention, in manufacturing a resin sheet for semiconductor encapsulation by cutting a resin plate into a desired shape, the resin plate is softened and cut to cut a part or all of the peripheral portion of the sheet. A method for manufacturing a resin sheet for semiconductor encapsulation, which is characterized by increasing the thickness.

The resin sheet for semiconductor encapsulation is made by forming a flat resin plate with a uniform thickness of the semiconductor encapsulating material, and in the past, the resin plate was simply cut at room temperature, softened and sealed. The resin sheet is cut into a required size according to the semiconductor element to be stopped, and is a method of thickening a part or all of the peripheral portion of the sheet when this cutting is performed.

The semiconductor encapsulating material for molding the semiconductor encapsulating resin sheet may be any resin generally used in the production of resin-encapsulated semiconductor devices, and is not particularly limited and can be widely used. it can. As a concrete semiconductor encapsulating material, a material based on a thermosetting resin such as an epoxy resin or a polyimide resin, or a thermoplastic resin such as a polyphenylene sulfide resin can be used.

As a method of thickening a part or the whole of the peripheral portion of the sheet, a method of pressing a heated resin plate with a heating blade or a method of cutting a resin plate not heated with an ultrasonic cutter while softening the resin around the cutter is used. A method, a method of cutting by rolling a non-heated round blade on a heated resin plate, a method of cutting or molding a preheated resin plate with a mold designed to be thicker in the peripheral portion, etc., but are not particularly limited. Not something. The thickened peripheral part is at least the peripheral part on two sides or the peripheral part on three or four sides that face each other. Although it has been described that the peripheral portion of one surface of the resin sheet is thickened, the peripheral portions of both surfaces of the resin sheet may be thickened. Whether to attach to one side or both sides can be selected in consideration of the thickness of the resin sheet and the automation line.

[0010]

According to the method for manufacturing a resin sheet for semiconductor encapsulation of the present invention, since the air flow passages are formed between the sheets even when the sheets are stacked by thickening the peripheral portions of the sheets, the sheets adhere to each other. There is nothing to do, and it corresponds to automation of handling.

[0011]

EXAMPLES Examples of the present invention will now be specifically described with reference to the drawings, but the present invention is not limited to these examples.

Example 1 As shown in FIG. 1A, a resin plate 1 having a uniform thickness is prepared as a semiconductor sealing material, and this is softened on a flat heating plate 2. Reference numeral 11 denotes a metal foil attached to the lower portion of the resin plate 1 so as not to lose the overall shape of the resin plate in this case. The softened resin plate 1 is pushed down by a double-edged blade 3 which is not heated. The portion of the resin plate 1 against which the blade 3 is applied is pressed by the blade 3 to form a thick portion 4. By repeating this operation, as shown in FIGS. 1 (b) and 1 (c), a resin sheet for semiconductor encapsulation having a thickness of 4 around the sheet was manufactured.

Example 2 Using a heating blade 5 and an ultrasonic cutter 6 as shown in FIG. 2 (a) or 2 (b), the unheated resin plate 1 on the unheated flat plate 7 is pushed down. The portion of the resin plate 1 on which the heating blade 5 and the ultrasonic cutter 6 are applied is pressed to form a thick portion 4. Repeat this operation
As shown in (c), a resin sheet for semiconductor encapsulation having a thickness of 4 at the periphery of the sheet was manufactured.

Example 3 A resin plate 1 having a uniform thickness was prepared as a semiconductor encapsulating material, and this was softened on a flat heating plate 2 to produce a resin as shown in FIG.
As shown in FIG. 5, the circular plate-shaped circular blade 8 which is not heated is rolled to cut the resin plate 1. The portion to which the circular blade 8 is applied is pressed to form a thick portion 4. By repeating this operation, as shown in FIG. 3B, a resin sheet for semiconductor encapsulation having a thickness of 4 around the sheet was manufactured.

Example 4 A resin plate 1 having a uniform thickness was prepared as a semiconductor sealing material,
This is softened on the flat heating plate 2, and as shown in FIG. 4 (a), it is cut or molded by using a mold 9 having a pre-made resin escape path 10. When the resin plate 1 was cut or molded, the resin filled the escape route 10 and a resin sheet for semiconductor encapsulation having a thickness 4 portion as shown in FIG. 4B could be manufactured.

Comparative Example A semiconductor encapsulating resin sheet was manufactured by using a semiconductor encapsulating material as a resin plate having a uniform thickness and cutting it without forming a thick portion.

The semiconductor encapsulating resin sheets produced in Examples 1 to 4 and Comparative Example were tested for adhesion and automation adaptability. The results are shown in Table 1. The resin sheets for semiconductor encapsulation according to the present invention were all excellent, and the effects of the present invention could be confirmed.

[0018]

[Table 1] * 1: The degree of adhesion when the sheets were stacked was visually evaluated. * 2: The degree of trouble occurrence when applied to automation was evaluated. In these tests, ⊚ mark is excellent and X mark is inferior.

[0019]

As is apparent from the above description and Table 1, according to the method for manufacturing a resin sheet for semiconductor encapsulation of the present invention, the thick portion is formed in the peripheral portion of the resin sheet, so that air circulation is achieved. It was possible to manufacture a resin sheet for semiconductor encapsulation that is compatible with automation without forming a passage and preventing the sheets from sticking to each other.

[Brief description of drawings]

1 (a) to 1 (c) are schematic explanatory views illustrating a method for producing a resin sheet for semiconductor encapsulation of the present invention.

2 (a) to 2 (c) are schematic explanatory views illustrating another method for manufacturing a resin sheet for semiconductor encapsulation of the present invention.

3 (a) and 3 (b) are schematic explanatory views for explaining another method for manufacturing a resin sheet for semiconductor encapsulation of the present invention.

FIG. 4 (a) and FIG. 4 (b) are schematic explanatory views illustrating another method for producing a resin sheet for semiconductor encapsulation of the present invention.

[Explanation of symbols]

 1 Resin Plate 2 Heating Plate 3 Blade 4 Thickness Part 5 Heating Blade 6 Ultrasonic Cutter 7 Flat Plate 8 Round Blade 9 Mold 10 Resin Escape Route 11 Metal Foil

Claims (1)

[Claims] 1. When manufacturing a resin sheet for semiconductor encapsulation by cutting a resin plate into a desired shape, the resin plate is softened and cut to thicken a part or all of the peripheral portion of the sheet. A method for producing a resin sheet for semiconductor encapsulation, which is characterized.