WO2013136926A1 - Device for producing sealing resin sheet and method for producing sealing resin sheet - Google Patents

Device for producing sealing resin sheet and method for producing sealing resin sheet Download PDF

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Publication number
WO2013136926A1
WO2013136926A1 PCT/JP2013/054127 JP2013054127W WO2013136926A1 WO 2013136926 A1 WO2013136926 A1 WO 2013136926A1 JP 2013054127 W JP2013054127 W JP 2013054127W WO 2013136926 A1 WO2013136926 A1 WO 2013136926A1
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WO
WIPO (PCT)
Prior art keywords
resin
pressing
sealing
elastic member
resin sheet
Prior art date
Application number
PCT/JP2013/054127
Other languages
French (fr)
Japanese (ja)
Inventor
有彌 井田
裕樹 北山
彰夫 勝部
渡部　浩司
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to CN201380010995.3A priority Critical patent/CN104136191B/en
Priority to JP2014504751A priority patent/JP5748023B2/en
Publication of WO2013136926A1 publication Critical patent/WO2013136926A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/56—Compression moulding under special conditions, e.g. vacuum

Definitions

  • the present invention relates to a sealing resin sheet manufacturing apparatus and a sealing resin sheet manufacturing method used for insulating and sealing a plurality of electronic components mounted on a substrate.
  • an insulating resin layer is formed on the substrate so as to cover the electronic components in order to protect the electronic components from moisture, external contact, and the like.
  • the insulating resin layer is formed by embedding an electronic component in a semi-cured sealing resin sheet and then heat-curing the sealing resin sheet.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2009-29930 describes a method for producing this sealing resin sheet. According to the description of Patent Document 1, as shown in FIG. 19, a liquid resin composition 102 is applied to the upper surface of a support film 103 by a coating apparatus 101, and a release film 105 fed from a release film roller 104 is removed. The sealing resin sheet 205 is manufactured by overlapping the upper surface of the resin composition 102 and pressing the resin composition 102 with the pressing roller 106.
  • the liquid resin composition 102 is wet and spreads, and thus a thick sealing resin sheet 205 is manufactured. Difficult to do.
  • the problem to be solved by the present invention is to reduce the problems related to the production of the sealing resin sheet described above.
  • a sealing resin sheet manufacturing apparatus is for insulatingly sealing a plurality of electronic components mounted on a substrate, and is a semi-cured resin made of an insulating resin material.
  • a molding die for defining a space for molding a sealing resin sheet from the body, a heating mechanism for heating the resin body at a temperature lower than the curing temperature of the resin body, and for evacuating the inside of the molding die
  • a vacuum mechanism and a pressurizing mechanism for pressing the resin body and filling the molding die with a resin material. The molding die presses and seals the resin body with the pressing force from the pressing mechanism.
  • a pair of pressing plates for molding the resin sheet for use a rigid plate arranged between the pair of pressing plates for setting the thickness of the sealing resin sheet after molding, and a resin body inside the rigid plate It is arranged between a pair of pressing plates so as to surround it, rather than the thickness of the rigid plate Only large, and the deformable resilient member by a pressing force from the pressing plate, by.
  • the elastic member has a resin reservoir cut out from the surface on the resin body side toward the rigid plate.
  • the elastic member has a first resin reservoir portion penetrating from the surface on the resin body side to the surface of the rigid plate, and the rigid plate communicates with the first resin reservoir portion and is notched inside the rigid plate. It has a resin reservoir.
  • the rigid plate has a relief groove cut out along the inner periphery.
  • the pressing plate has a recess on the surface for pressing the resin body, and the elastic member is arranged in a state of being fitted in the recess.
  • the method for producing a sealing resin sheet according to the present invention is for insulatingly sealing a plurality of electronic components mounted on a substrate, and is a semi-cured resin composed of an insulating resin material.
  • Body, a pair of pressing plates for pressing the resin body to mold the sealing resin sheet, a rigid plate for setting the thickness of the sealing resin sheet after molding, and the thickness of the rigid plate A preparatory step for preparing an elastic member having a large thickness and being deformable by a pressing force from the pressing plate; a resin body is disposed between the pair of pressing plates; a rigid plate is disposed between the pair of pressing plates; Is disposed between a pair of pressing plates so as to surround the resin body inside the rigid plate, a space forming step for forming a space surrounding the resin body by the pair of pressing plates and the elastic member, and evacuating the space Depressurization step and the resin body is lower than the curing temperature of the resin body
  • the elastic member is deformed by pressing the pressing plate, and in the filling step, the resin material is dammed between the elastic member and the pressing plate.
  • a pair of protective films for protecting the main surface of the molded resin sheet after molding is prepared in the preparation step, and the elastic member and the upper surface of the rigid plate are formed from the bottom surface of the resin body in the space formation step.
  • One protective film is disposed so as to pass through, and the other protective film is disposed so as to face the upper surface of the resin body and the one protective film, thereby enclosing the resin body with the one and other protective films.
  • region is formed, the area
  • the elastic member has a resin reservoir portion cut out from the surface on the resin body side toward the rigid plate, and allows the resin material to enter the resin reservoir portion in the filling step.
  • the elastic member has a first resin reservoir portion penetrating from the resin body-side surface to the rigid plate-side surface, and the rigid plate communicates with the first resin reservoir portion and is cut out inside the rigid plate. It is preferable to have two resin reservoirs and to allow the resin material to enter the second resin reservoir through the first resin reservoir in the filling step.
  • the rigid plate preferably has a relief groove cut out along the inner periphery, and in the filling step, the elastic member is preferably bent toward the relief groove by a pressing force transmitted through the resin material.
  • the pressing plate has a recess on a surface for pressing the resin body, and the elastic member is arranged in a state of being fitted in the recess.
  • the sealing resin sheet manufacturing apparatus can manufacture a sealing resin sheet having a large film thickness at low cost without requiring expensive equipment. Further, the resin material can be prevented from leaking out of the molding die, and the thickness accuracy of the sealing resin sheet after molding can be improved.
  • the resin material can be prevented from leaking outside, and the thickness accuracy of the sealing resin sheet can be improved.
  • FIG. 2 it is the figure which showed the mode of the resin body 22 in the middle of shaping
  • a sealing resin sheet is used for insulating and sealing the electronic components.
  • the sealing resin sheet 11 has a flat plate shape and a thickness of 0.1 mm to 3.5 mm.
  • the sealing resin sheet 11 is made of a semi-cured insulating resin material 15 (for example, epoxy resin), and contains silica or alumina, for example, as a filler in order to increase mechanical strength.
  • Protective films 12 ⁇ / b> A and 12 ⁇ / b> B are attached to both main surfaces of the sealing resin sheet 11 in order to protect the surface of the sealing resin sheet 11.
  • the protective film 12 ⁇ / b> B formed on the upper surface of the sealing resin sheet 11 is flat, and the protective film 12 ⁇ / b> A formed on the lower surface is convex downward along the sealing resin sheet 11. It has a shape.
  • the material of the protective films 12A and 12B is, for example, PET (polyethylene terephthalate) or PTFE (polytetrafluoroethylene).
  • the surface of the protective films 12A and 12B is subjected to a release treatment with a silicone resin or the like.
  • the protective films 12A and 12B are peeled off and used. .
  • the sealing resin sheet manufacturing apparatus 30 (hereinafter referred to as the manufacturing apparatus 30) includes a molding die 40 for molding the sealing resin sheet 11 from the resin body 22.
  • the molding die 40 includes a pair of pressing plates 43 and 45, a side rigid plate 44, and an elastic member 48 disposed inside the rigid plate 44.
  • the resin body 22 is disposed inside the molding die 40.
  • the resin body 22 is a material for molding the sealing resin sheet 11.
  • the resin body 22 is composed of a semi-cured insulating resin material 15 and contains, for example, silica or alumina as a filler.
  • the pair of pressing plates 43 and 45 are for pressing the resin body 22.
  • the pressing plates 43 and 45 have a flat plate shape and are respectively disposed above and below the resin body 22 so as to sandwich the resin body 22.
  • the material of the pressing plates 43 and 45 may be any material that can maintain the shape even when pressed, and for example, stainless steel or aluminum is used.
  • the rigid plate 44 is for setting the thickness of the sealing resin sheet 11 to be molded.
  • the rigid plate 44 is a frame and is disposed between the pair of pressing plates 43 and 45 along the outer periphery of the pressing plates 43 and 45.
  • the material of the rigid plate 44 may be any material that can maintain the shape even when pressed, and for example, stainless steel or aluminum is used.
  • the elastic member 48 is for preventing the resin body 22 from leaking out of the molding die 40.
  • the elastic member 48 is a frame, and the thickness thereof is larger than the thickness of the rigid plate 44 and is disposed between the pair of pressing plates 43 and 45 so as to surround the resin body 22 inside the rigid plate 44.
  • the elastic member 48 can be deformed by the pressing force from the pressing plates 43 and 45, and the material is, for example, silicone resin.
  • the space 46 surrounding the resin body 22 is defined by the pair of pressing plates 43 and 45 and the elastic member 48 by configuring the molding die 40 in the positional relationship shown above.
  • a pair of protective film 12A, so that the resin body 22 may be enclosed in the space 46, 12B is inserted.
  • one protective film 12A is disposed so as to pass from the bottom surface of the resin body 22 to the upper surface of the elastic member 48 and the rigid plate 44, and so as to face the upper surface of the resin body 22 and the one protective film 12A.
  • the other protective film 12B is attached to the pressing plate 45.
  • an in-film region 47 that encloses the resin body 22 with the one and the other protective films 12A and 12B is defined.
  • the manufacturing apparatus 30 depressurizes the space 46 and the in-film region 47 of the molding die 40 and heats and presses the resin body 22.
  • the manufacturing apparatus 30 includes heating mechanisms 33A and 33B for heating the resin body 22.
  • the heating mechanisms 33 ⁇ / b> A and 33 ⁇ / b> B are incorporated in each of the pressure plate 32 installed on the upper side of the press plate 45 and the pressure receiving plate 31 installed on the lower side of the press plate 43.
  • the resin body 22 is heated via the pressing plates 43 and 45 by the heating mechanisms 33A and 33B.
  • the manufacturing apparatus 30 includes a vacuum mechanism 38 for decompressing the space 46 and the in-film region 47.
  • the vacuum mechanism 38 is installed so as to surround the pressure plate 32 and the pressure receiving plate 31.
  • the inside of the vacuum mechanism 38 is evacuated by a vacuum source (not shown), whereby the space 46 and the in-film region 47 are also decompressed.
  • the manufacturing apparatus 30 includes a pressurizing mechanism 34 for pressing the resin body 22.
  • the pressurizing mechanism 34 is installed at the center of the top plate 36, and the top plate 36 is fixed to a support column 37 that stands on the lower base 35.
  • the drive shaft 39 of the pressurizing mechanism 34 is connected to the upper side of the pressurizing plate 32, and the pressurizing plate 32 and the pressing plate 45 are pushed by lowering the drive shaft 39.
  • the resin body 22 is extended between the press plates 43 and 45 along the surface direction of a pair of protective films 12A and 12B.
  • the space 46 and the in-film region 47 defined by the molding die 40 are filled with the resin material 15, and the molding of the resin body 22 is completed.
  • 3 (A) and 3 (B) are views showing the state of the resin body 22 in the molding die 40.
  • a plan view is shown in FIG. 3 (A)
  • a front view is shown in FIG. 3 (B).
  • 3A is a Z1-Z1 cross section with respect to FIG. 3B
  • FIG. 3B is a Y1-Y1 cross section with respect to FIG. 3A.
  • the shape of the resin body 22 is a cylinder for easy understanding, and the protective film 12A is omitted.
  • the thickness of the elastic member 48 is larger than the thickness of the rigid plate 44. Therefore, as shown in FIG. 3B, the pressing plate 45 contacts the elastic member 48 via the protective films 12A and 12B before the rigid plate 44. Further, since the elastic member 48 can be deformed by the pressing force from the pressing plate 45, it deforms following the surface of the pressing plate 45. Therefore, as shown in FIGS. 3A and 3B, the resin material 15 that has flowed during the molding is dammed between the elastic member 48 and the pressing plate 45. As a result, leakage of the resin material 15 to the outside of the molding die 40 is suppressed, and the sealing resin sheet 11 having a desired shape is molded.
  • FIG. 4 (A) and FIG. 4 (B) are the figures which showed the comparative example at the time of shape
  • a top view is shown to (A).
  • a front view is shown at (B).
  • 4A is a Z2-Z2 cross section with respect to FIG. 4B
  • FIG. 4B is a Y2-Y2 cross section with respect to FIG. 4A.
  • the shape of the resin body 22 is a cylinder, and the protective film 12A is omitted.
  • the resin body 22 was demonstrated as a cylinder above, it is not limited to the shape. Depending on the position where the resin body 22 is arranged and the initial parallelism of the pressing plates 43 and 45, the state after the resin body 22 is extended is biased. There are challenges.
  • the resin material 15 being molded can be dammed between the elastic member 48 and the pressing plate 45. Thereby, the leakage of the resin material 15 to the outside of the molding die 40 can be suppressed, and the sealing resin sheet 11 having a desired shape can be molded.
  • the sealing resin sheet 11 can be manufactured without using expensive equipment. Further, if the manufacturing apparatus 30 is used, the sealing resin sheet 11 having a relatively large film thickness can be manufactured by setting the rigid plate 44.
  • a cylindrical cylinder 20 having a bottom is prepared, and a liquid resin 21 is put into the cylinder mold 20 to be semi-cured by heat treatment to produce a resin body 22.
  • the semi-cured state refers to a state at an intermediate stage of the curing reaction and is also called a B stage.
  • the liquid resin 21 in the case of an epoxy resin, it is heated in an oven at a temperature of 40 ° C. to 160 ° C. for 5 minutes to 120 minutes.
  • a resin body having a viscosity of 120 Pa ⁇ s to 2000 Pa ⁇ s at a temperature of 60 ° C. can be used as the resin body 22 .
  • the viscosity at this time is a value measured under the conditions of a tool size of ⁇ 8 mm, a measurement thickness of 550 ⁇ m, a frequency of 1 Hz, and a strain of 0.1% using an AR550 manufactured by TA Instruments.
  • a molding die 40 for molding the sealing resin sheet 11 is prepared.
  • the molding die 40 includes a pair of upper and lower pressing plates 43 and 45, a side rigid plate 44, and an elastic member 48 disposed inside the rigid plate 44.
  • a space 46 surrounding the resin body 22 is formed by the pair of pressing plates 43 and 45 and the elastic member 48.
  • a pair of protective films 12 ⁇ / b> A and 12 ⁇ / b> B are inserted into the space 46 to form an in-film region 47 that surrounds the resin body 22.
  • the pair of pressing plates 43 and 45 are moved in a direction approaching each other, and the pressing plate 45 and the elastic member 48 are brought into contact with each other through the protective films 12A and 12B. As a result, the resin body 22 flows and extends between the pair of pressing plates 43 and 45.
  • the resin body 22 When the resin body 22 is extended, the resin body 22 is heated, and the heating temperature is lower than the curing temperature of the resin body 22 (for example, 40 ° C. to 160 ° C.).
  • the space 46 and the in-film region 47 are depressurized by evacuation, and the pressure is 5000 Pa or less.
  • the lower protective film 12A is pressed by the resin material 15 of the extended resin body 22 to form the molding metal. It spreads along the inner wall of the mold 40. As a result, the space 46 and the in-film region 47 defined by the molding die 40 are filled with the resin material 15 and the molding of the resin body 22 is completed.
  • FIGS. 3A and 3 (B) are views showing the state of the resin material 15 in the middle of molding.
  • FIG. 5 the state between FIG. 5 (C) and FIG. 5 (D) is shown.
  • FIG. 3A and 3B the resin material 15 in the middle of molding reaches the center of the four sides inside the elastic member 48.
  • the elastic member 48 and the pressing plate 45 are in contact with each other via the protective films 12 ⁇ / b> A and 12 ⁇ / b> B, and the resin material 15 is dammed at the center of the four sides of the elastic member 48.
  • the resin material 15 flows toward the four corners inside the elastic member 48. Thereby, the resin material 15 is formed in a rectangular shape.
  • the pressing force by the pressing plates 43 and 45 is released, and the space 46 surrounded by the pressing plates 43 and 45 and the elastic member 48 is opened to the atmosphere.
  • the sealing resin sheet 11 with the protective films 12A and 12B on both sides as shown in FIG. since the heating temperature at the time of molding is lower than the curing temperature of the resin material 15, the sealing resin sheet 11 remains in a semi-cured state.
  • the resin material 15 in the middle of molding is dammed between the elastic member 48 and the pressing plate 45. As a result, leakage of the resin material 15 to the outside of the molding die 40 is suppressed, and the sealing resin sheet 11 having a desired shape is molded.
  • a cylindrical cylinder 20 having a bottom is prepared, and a liquid resin 21 is placed in the cylinder 20, and the resin body 22 is made into a semi-cured state by heat treatment.
  • a molding die 40 for molding the sealing resin sheet 11 is prepared.
  • the molding die 40 includes a pair of upper and lower pressing plates 43 and 45, a side rigid plate 44, and an elastic member 48 disposed inside the rigid plate 44.
  • the material of the elastic member 48 is a silicone resin.
  • the pressing plates 43 and 45 are subjected to a mold release process using a silicone resin or the like.
  • a space 46 surrounding the resin body 22 by the pair of pressing plates 43 and 45 and the elastic member 48 is formed.
  • the heating temperature when the resin body 22 is extended is lower than the curing temperature of the resin body 22, and the space 46 is evacuated.
  • the pair of pressing plates 43, 45 move in a direction approaching each other, and the resin body 22 is extended between the pair of pressing plates 43, 45. At this time, the fluidized resin material 15 is dammed between the elastic member 48 and the pressing plate 45.
  • the space 46 defined by the molding die 40 is filled with the resin material 15, and the molding of the resin body 22 is completed.
  • the sealing resin sheet 11 can be manufactured without using the protective films 12A and 12B. Therefore, the sealing resin sheet 11 can be manufactured at a lower cost.
  • the third embodiment is an embodiment in which the elastic member shown in the first embodiment is provided with a function of storing excess resin material 15. Detailed description of the configuration common to the first embodiment is omitted.
  • FIG. 7 (A) to 7 (C) are plan views sequentially showing the state of the resin body 22 in the molding die 50.
  • FIG. For ease of understanding, the shape of the resin body 22 is a cylinder, and the protective film 12A is omitted.
  • the molding die 50 includes a pair of upper and lower pressing plates 43 and 45 (the pressing plate 45 is not shown), a rigid plate 44 disposed on the outer periphery of the pressing plate 43, and a rigid body. And an elastic member 51 disposed inside the plate 44.
  • the four elastic members 51 of the quadrangular prism are arranged with a gap so as to surround the resin body 22.
  • notches are formed in the four corners of the elastic member 51 having a frame shape from the surface on the resin body 22 side toward the rigid plate 44.
  • This notch serves as a resin reservoir 52 for storing excess resin material 15.
  • the resin reservoir 52 can widen the allowable range of the amount of resin that can be charged into the molding die 50.
  • the resin material 15 of the resin body 22 extended by the pressing process reaches the center of the four sides inside the elastic member 51 and is dammed up by the elastic member 51. As shown in FIG. The dammed resin material 15 flows toward the four corners of the elastic member 51.
  • the space 46 and the in-film region 47 defined by the molding die 50 are filled with the resin material 15, and the surplus resin material 15 is filled. Enters the resin reservoir 52 at the four corners of the elastic member 51.
  • the resin sheet 11 for sealing which has the surplus part 53 of the resin material 15 in four corners is shape
  • the produced resin sheet 11 for sealing is used for manufacture of an electronic component module, after the surplus part 53 is removed by cutting
  • the sealing resin sheet 11 it is necessary to sufficiently fill the resin material 15 in the molding die 50, and the volume of the resin body 22 to be charged is larger than the volume in the molding die 50. It is set large. Therefore, surplus resin material 15 is generated during molding. If there is no place for the surplus resin material 15, the resin material 15 may leak out of the molding die 50.
  • the resin material 15 corresponding to the volume of the resin reservoir 52 can be accommodated in excess. Therefore, even if the volume of the resin body 22 is larger than the volume in the molding die 50, the sealing resin sheet 11 can be molded without any problem.
  • FIG. 8 to FIG. 11 are diagrams showing typical modifications thereof.
  • FIG. 8 is a view showing a first modified example related to the molding die 50.
  • the elastic member 51A of the molding die 50A is a frame that is integrally formed as a whole.
  • the four corners inside the elastic member 51A have cutouts 52A in which a part of the elastic member 51A is cut out.
  • This notch 52 ⁇ / b> A becomes a resin reservoir 52 for storing the resin material 15.
  • FIG. 9 is a view showing a second modified example related to the resin body 22.
  • the shape of the resin body 22B is a rectangular parallelepiped. Even in this case, the gap formed between the elastic members 51 becomes the resin reservoir 52.
  • FIG. 10 is a view showing a third modified example related to the molding die 50 and the resin body 22.
  • a notch 52C is provided at the center of the four sides of the elastic member 51C of the molding die 50C.
  • This notch 52 ⁇ / b> C serves as a resin reservoir 52 for storing the resin material 15.
  • the shape of the resin body 22C is a star shape, and when pressed, the resin material 15 is first filled into the four corners of the elastic member 51C, and then the resin material 15 is filled toward the notch 52C at the center of the four sides. Is done.
  • FIG. 11 is a view showing a fourth modified example related to the molding die 50.
  • the elastic member 51D and the rigid plate 44D of the molding die 50D have a ring shape.
  • the elastic member 51D has a notch 52D at every 90 ° angle. This notch 52D becomes a resin reservoir 52 for storing the resin material 15.
  • both the elastic member and the rigid plate shown in the first embodiment are provided with a function of storing excess resin material 15. Detailed description of the configuration common to the first embodiment is omitted.
  • FIGS. 12 to 14 are views sequentially showing the state of the resin body 22 in the molding die 60, and a plan view and a front view thereof are shown in FIG. 12A and FIG. 12A is a Z3-Z3 cross section with respect to FIG. 12B, and FIG. 12B is a Y3-Y3 cross section with respect to FIG. 12A.
  • FIG. 12A for easy understanding, the shape of the resin body 22 is a cylinder, and the protective film 12A is omitted. The same applies to FIGS. 13 and 14 below.
  • the molding die 60 includes a pair of upper and lower pressing plates 43 and 45, a rigid plate 62 disposed on the outer periphery of the pressing plate 43, and an inner side of the rigid plate 62. And an elastic member 51 disposed on the surface.
  • a space 46 surrounding the resin body 22 is formed by the pair of pressing plates 43 and 45 and the elastic member 51.
  • a pair of protective films 12 ⁇ / b> A and 12 ⁇ / b> B are inserted in the space 46 to form an in-film region 47 that surrounds the resin body 22.
  • the four elastic members 51 of the quadrangular prism are arranged with a gap so as to surround the resin body 22.
  • notches penetrating from the surface on the side of the resin body 22 toward the surface of the rigid plate 62 are formed at the four corners of the elastic member 51 having a frame shape. This notch serves as a first resin reservoir 63 for storing excess resin material 15.
  • a notch is formed along the inside of the rigid plate 62. This notch communicates with the first resin reservoir 63 and becomes the second resin reservoir 64 for storing the resin material 15.
  • the first and second resin reservoirs 63 and 64 can further widen the allowable width of the amount of resin that can be charged into the molding die 60.
  • the resin material 15 of the resin body 22 extended by the pressing process reaches the center of the four sides inside the elastic member 51 and is dammed by the elastic member 51. It is done. The dammed resin material 15 flows toward the four corners of the elastic member 51.
  • the resin material 15 enters the first resin reservoir 63 of the elastic member 51, and further the first resin. Part of the second resin reservoir 64 passes through the reservoir 63. Thereby, the resin sheet 11 for sealing which has the surplus 65 of the resin material 15 as shown to FIG. 14 (A) in four corners is shape
  • the resin material 15 corresponding to the volume of the first and second resin reservoirs 63 and 64 is further added. Can be accommodated. Therefore, even if the volume of the resin body 22 is larger than the volume in the molding die 600, the sealing resin sheet 11 can be molded without any problem.
  • FIG. 15 and FIG. 16 are views showing the state of the resin body 22 in the molding die 70.
  • the plan view is shown in (A) and the front view is shown in (B).
  • 15A is a Z6-Z6 cross section with respect to FIG. 15B
  • FIG. 15B is a Y6-Y6 cross section with respect to FIG. 15A.
  • the resin body 22 has a cylindrical shape for easy understanding, and the protective film 12A is omitted. The same applies to FIG.
  • the molding die 70 includes a pair of upper and lower pressing plates 43 and 45, a rigid plate 71 arranged on the outer periphery of the pressing plate 43, and a rigid plate 71. And an elastic member 48 disposed inside.
  • a space 46 surrounding the resin body 22 is formed by the pair of pressing plates 43 and 45 and the elastic member 48.
  • a pair of protective films 12 ⁇ / b> A and 12 ⁇ / b> B are inserted in the space 46 to form an in-film region 47 that surrounds the resin body 22.
  • the volume of the resin body 22 that is the material of the sealing resin sheet 11 usually varies to some extent. If the volume of the resin body 22 is larger than the volume in the molding die 70 due to the variation, excess resin material 15 is generated during molding.
  • the rigid plate 71 is formed with a relief groove 72 cut out along the inner periphery of the rigid plate 71.
  • the presence of the escape groove 72 allows a variation in the volume of the resin body 22 put into the molding die 70.
  • the excess resin material 15 presses the elastic member 48 to the side. Due to the pressing force transmitted through the resin material 15, the elastic member 48 is bent toward the escape groove 72 of the rigid plate 71, and outward bulges 73 are formed on the four sides of the elastic member 38. As a result, the resin material 15 of the swelled volume can be accommodated in excess, and even when the volume of the resin body 22 is slightly larger than the volume in the molding die 70, the sealing resin sheet 11 is molded without any problem. can do.
  • the produced sealing resin sheet 11 bulges outward on its four sides, but has a substantially rectangular shape, and can be used for manufacturing an electronic component module as it is.
  • the molding die 80 includes a pair of upper and lower pressing plates 81 and 45, a side rigid plate 44, and an elastic member 83 disposed inside the rigid plate 44.
  • the 6th Embodiment forms the groove-shaped recessed part 82 in the lower press board 81, and the elastic member 83 is arrange
  • the elastic member 83 is arranged in a state of being fitted in the concave portion 82 of the pressing plate 81, so that the above-described positional deviation can be prevented.
  • FIG. 18 shows a modification in which the cross section of the elastic member is elliptical.
  • the concave portion 82A of the pressing plate 81A is a tapered groove, and is arranged in a state in which the lower half or more of the elliptical elastic member 83A is fitted therein. Thereby, not only the displacement of the elastic member 83A but also the elastic member 83A can be prevented from coming out of the recess 82A.
  • cross section of the elastic member 83A may be circular instead of elliptical. If the cross section of the elastic member 83A is circular, a commercially available rubber packing can be used.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

The present invention enables inexpensive production of a sealing resin sheet for insulated sealing of a plurality of electrical components mounted onto a substrate, and enhanced precision in the thickness of the sealing resin sheet. A device (30) for producing a sealing resin sheet is provided with: a molding die (40) for molding a sealing resin sheet (11) from a resin body (22); heating mechanisms (33A, 33B); a vacuum mechanism (38); and a pressurizing mechanism (34). The molding die (40) comprises: a pair of pressing plates (43, 45); a rigid body plate (44) for setting the thickness of the sealing resin sheet (11); and an elastic member (48). The elastic member (48) is thicker than the rigid body plate (44) and can be deformed by a pressing force coming from the pressing plate (45). The resin body (22) is stretched by pressing but is dammed between a deformed elastic member (28) and the pressing plate (45), and thus the resin body is prevented from leaking to the outside of the molding die (40).

Description

封止用樹脂シートの製造装置および封止用樹脂シートの製造方法Sealing resin sheet manufacturing apparatus and sealing resin sheet manufacturing method
　本発明は、基板上に搭載された複数の電子部品を絶縁封止するために用いられる封止用樹脂シートの製造装置および封止用樹脂シートの製造方法に関する。 The present invention relates to a sealing resin sheet manufacturing apparatus and a sealing resin sheet manufacturing method used for insulating and sealing a plurality of electronic components mounted on a substrate.
　基板上に複数の電子部品が搭載された電子部品モジュールにおいては、湿気、外部接触等から電子部品を保護するために、電子部品を覆うように基板上に絶縁樹脂層が形成される。この絶縁樹脂層は、電子部品を半硬化状態の封止用樹脂シートに埋設させた後、封止用樹脂シートを加熱硬化することにより形成される。 In an electronic component module in which a plurality of electronic components are mounted on a substrate, an insulating resin layer is formed on the substrate so as to cover the electronic components in order to protect the electronic components from moisture, external contact, and the like. The insulating resin layer is formed by embedding an electronic component in a semi-cured sealing resin sheet and then heat-curing the sealing resin sheet.
　特許文献１（特開２００９－２９９３０号公報）には、この封止用樹脂シートの製造方法が記載されている。特許文献１の記載によれば、図１９に示すように、塗布装置１０１によって液状の樹脂組成物１０２を支持フィルム１０３の上面に塗布し、離型フィルムローラ１０４から繰り出された離型フィルム１０５を樹脂組成物１０２の上面に重ね、押圧ローラ１０６で樹脂組成物１０２を押圧することにより封止用樹脂シート２０５を製造している。 Patent Document 1 (Japanese Patent Application Laid-Open No. 2009-29930) describes a method for producing this sealing resin sheet. According to the description of Patent Document 1, as shown in FIG. 19, a liquid resin composition 102 is applied to the upper surface of a support film 103 by a coating apparatus 101, and a release film 105 fed from a release film roller 104 is removed. The sealing resin sheet 205 is manufactured by overlapping the upper surface of the resin composition 102 and pressing the resin composition 102 with the pressing roller 106.
特開２００９－２９９３０号公報JP 2009-29930 A
　しかしながら、特許文献１に記載されている封止用樹脂シート２０５の製造方法では、塗布装置１０１、離型フィルムローラ１０４、押圧ローラ１０６等の高価な設備が必要となるため封止用樹脂シート２０５の製造コストが高くなるという問題がある。 However, since the manufacturing method of the sealing resin sheet 205 described in Patent Document 1 requires expensive equipment such as the coating device 101, the release film roller 104, and the pressing roller 106, the sealing resin sheet 205 is used. There is a problem that the manufacturing cost of the device becomes high.
　また、特許文献１に記載のように支持フィルム１０３の上面に液状の樹脂組成物１０２を塗布する方法では、液状の樹脂組成物１０２が濡れ広がるため、厚みの大きい封止用樹脂シート２０５を製造することが困難である。 Further, in the method of applying the liquid resin composition 102 on the upper surface of the support film 103 as described in Patent Document 1, the liquid resin composition 102 is wet and spreads, and thus a thick sealing resin sheet 205 is manufactured. Difficult to do.
　また、特許文献１に記載されている封止用樹脂シート２０５の製造方法では、成形途中に厚み方向を規制するものがなく、封止用樹脂シート２０５の厚み精度を確保することが困難である。近年、電子部品モジュールの低背化とともに厚み精度の向上が求められており、封止用樹脂シート２０５の厚み精度が低ければ、電子部品モジュールの低背化や厚み精度の向上は達成できない。 Moreover, in the manufacturing method of the sealing resin sheet 205 described in Patent Document 1, there is nothing that regulates the thickness direction during molding, and it is difficult to ensure the thickness accuracy of the sealing resin sheet 205. . In recent years, there has been a demand for improvement in thickness accuracy along with a reduction in the height of the electronic component module. If the thickness accuracy of the sealing resin sheet 205 is low, reduction in the height of the electronic component module and improvement in thickness accuracy cannot be achieved.
　本発明が解決しようとする課題は、上述した封止用樹脂シートの製造に関する問題を低減することである。 The problem to be solved by the present invention is to reduce the problems related to the production of the sealing resin sheet described above.
　本発明にかかる封止用樹脂シートの製造装置は、基板上に搭載された複数の電子部品を絶縁封止するためのものであって、絶縁性の樹脂材料により構成される半硬化状態の樹脂体から封止用樹脂シートを成形するための空間を規定する成形金型と、樹脂体を樹脂体の硬化温度より低い温度で加熱するための加熱機構と、成形金型内を真空引きするための真空機構と、樹脂体を押圧し成形金型内に樹脂材料を充填するための加圧機構と、を有し、成形金型は、押圧機構からの押圧力により樹脂体を押圧し封止用樹脂シートを成形するための１対の押圧板と、１対の押圧板の間に配置され成形後の封止用樹脂シートの厚みを設定するための剛体板と、剛体板の内側において樹脂体を囲むように１対の押圧板の間に配置され、剛体板の厚みよりも厚みが大きく、押圧板からの押圧力により変形可能な弾性部材と、により構成される。 A sealing resin sheet manufacturing apparatus according to the present invention is for insulatingly sealing a plurality of electronic components mounted on a substrate, and is a semi-cured resin made of an insulating resin material. A molding die for defining a space for molding a sealing resin sheet from the body, a heating mechanism for heating the resin body at a temperature lower than the curing temperature of the resin body, and for evacuating the inside of the molding die A vacuum mechanism and a pressurizing mechanism for pressing the resin body and filling the molding die with a resin material. The molding die presses and seals the resin body with the pressing force from the pressing mechanism. A pair of pressing plates for molding the resin sheet for use, a rigid plate arranged between the pair of pressing plates for setting the thickness of the sealing resin sheet after molding, and a resin body inside the rigid plate It is arranged between a pair of pressing plates so as to surround it, rather than the thickness of the rigid plate Only large, and the deformable resilient member by a pressing force from the pressing plate, by.
　好ましくは、弾性部材は、樹脂体側の面から剛体板の方向に向けて切り欠かれた樹脂溜まり部を有する。 Preferably, the elastic member has a resin reservoir cut out from the surface on the resin body side toward the rigid plate.
　あるいは、弾性部材は、樹脂体側の面から剛体板の面に貫通した第１樹脂溜まり部を有し、剛体板は、第１樹脂溜まり部と連通し剛体板の内側に切り欠かれた第２樹脂溜まり部を有する。 Alternatively, the elastic member has a first resin reservoir portion penetrating from the surface on the resin body side to the surface of the rigid plate, and the rigid plate communicates with the first resin reservoir portion and is notched inside the rigid plate. It has a resin reservoir.
　あるいは、剛体板は、内周に沿って切り欠かれた逃げ溝を有する。 Alternatively, the rigid plate has a relief groove cut out along the inner periphery.
　また、押圧板は、樹脂体を押圧する面に凹部を有し、弾性部材は、凹部に嵌められた状態で配置される。 Further, the pressing plate has a recess on the surface for pressing the resin body, and the elastic member is arranged in a state of being fitted in the recess.
　本発明にかかる封止用樹脂シートの製造方法は、基板上に搭載された複数の電子部品を絶縁封止するためのものであって、絶縁性の樹脂材料により構成される半硬化状態の樹脂体と、樹脂体を押圧して封止用樹脂シートを成形するための１対の押圧板と、成形後の封止用樹脂シートの厚みを設定するための剛体板と、剛体板の厚みより厚みが大きく押圧板からの押圧力により変形可能な弾性部材と、を準備する準備工程と、樹脂体を１対の押圧板の間に配置し、剛体板を１対の押圧板の間に配置し、弾性部材を剛体板の内側において樹脂体を囲むように１対の押圧板の間に配置し、これら１対の押圧板および弾性部材により樹脂体を囲む空間を形成する空間形成工程と、空間内を真空引きする減圧工程と、樹脂体を樹脂体の硬化温度より低い温度で加熱する加熱工程と、弾性部材および剛体板を押圧板により押圧するとともに、樹脂体を押圧板により押圧する押圧工程と、樹脂体を押圧して延ばすことにより、空間内に樹脂材料を充填する充填工程と、を有する。 The method for producing a sealing resin sheet according to the present invention is for insulatingly sealing a plurality of electronic components mounted on a substrate, and is a semi-cured resin composed of an insulating resin material. Body, a pair of pressing plates for pressing the resin body to mold the sealing resin sheet, a rigid plate for setting the thickness of the sealing resin sheet after molding, and the thickness of the rigid plate A preparatory step for preparing an elastic member having a large thickness and being deformable by a pressing force from the pressing plate; a resin body is disposed between the pair of pressing plates; a rigid plate is disposed between the pair of pressing plates; Is disposed between a pair of pressing plates so as to surround the resin body inside the rigid plate, a space forming step for forming a space surrounding the resin body by the pair of pressing plates and the elastic member, and evacuating the space Depressurization step and the resin body is lower than the curing temperature of the resin body A heating process for heating at a temperature, a pressing process for pressing an elastic member and a rigid plate with a pressing plate, a pressing process for pressing a resin body with a pressing plate, and a resin material being pressed and extended to fill the space with a resin material And a filling step.
　好ましくは、押圧工程において、弾性部材を押圧板の押圧により変形させ、充填工程において、樹脂材料を、弾性部材と押圧板の間で堰き止める。 Preferably, in the pressing step, the elastic member is deformed by pressing the pressing plate, and in the filling step, the resin material is dammed between the elastic member and the pressing plate.
　更に好ましくは、準備工程で、成形後の封止用樹脂シートの主面を保護するための１対の保護フィルムを準備し、空間形成工程で、樹脂体の底面から弾性部材および剛体板の上面を通るように一方の保護フィルムを配置し、かつ、樹脂体の上面および一方の保護フィルムと向かい合うように他方の保護フィルムを配置することにより、一方および他方の保護フィルムにより樹脂体を囲むフィルム内領域を形成し、減圧工程で、フィルム内領域を真空引きし、充填工程で、樹脂体を保護フィルムの面方向に延ばし、樹脂材料をフィルム内領域に充填する。 More preferably, a pair of protective films for protecting the main surface of the molded resin sheet after molding is prepared in the preparation step, and the elastic member and the upper surface of the rigid plate are formed from the bottom surface of the resin body in the space formation step. One protective film is disposed so as to pass through, and the other protective film is disposed so as to face the upper surface of the resin body and the one protective film, thereby enclosing the resin body with the one and other protective films. An area | region is formed, the area | region in a film is evacuated at a pressure reduction process, a resin body is extended in the surface direction of a protective film at a filling process, and the resin material is filled in the area | region in a film.
　また、弾性部材は、樹脂体側の面から剛体板の方向に向けて切り欠かれた樹脂溜まり部を有し、充填工程において、樹脂材料を樹脂溜まり部に入り込ませるのが好ましい。 Further, it is preferable that the elastic member has a resin reservoir portion cut out from the surface on the resin body side toward the rigid plate, and allows the resin material to enter the resin reservoir portion in the filling step.
　あるいは、弾性部材は、樹脂体側の面から剛体板側の面に貫通した第１樹脂溜まり部を有し、剛体板は、第１樹脂溜まり部と連通し剛体板の内側に切り欠かれた第２樹脂溜まり部を有し、充填工程において、樹脂材料を、第１樹脂溜まり部を通って第２樹脂溜まり部に入り込ませるのが好ましい。 Alternatively, the elastic member has a first resin reservoir portion penetrating from the resin body-side surface to the rigid plate-side surface, and the rigid plate communicates with the first resin reservoir portion and is cut out inside the rigid plate. It is preferable to have two resin reservoirs and to allow the resin material to enter the second resin reservoir through the first resin reservoir in the filling step.
　あるいは、剛体板は、内周に沿って切り欠かれた逃げ溝を有し、充填工程において、樹脂材料を介して伝わる押圧力により、弾性部材を逃げ溝側に撓ませるのが好ましい。 Alternatively, the rigid plate preferably has a relief groove cut out along the inner periphery, and in the filling step, the elastic member is preferably bent toward the relief groove by a pressing force transmitted through the resin material.
　また、押圧板は、樹脂体を押圧する面に凹部を有し、弾性部材は、凹部に嵌められた状態で配置されるのが好ましい。 Further, it is preferable that the pressing plate has a recess on a surface for pressing the resin body, and the elastic member is arranged in a state of being fitted in the recess.
　本発明にかかる封止用樹脂シートの製造装置によれば、高価な設備を必要とせず、膜厚の大きい封止用樹脂シートを安価に製造できる。また、樹脂材料が成形金型の外へ漏れることを防止でき、成形後の封止用樹脂シートの厚み精度を向上することができる。 The sealing resin sheet manufacturing apparatus according to the present invention can manufacture a sealing resin sheet having a large film thickness at low cost without requiring expensive equipment. Further, the resin material can be prevented from leaking out of the molding die, and the thickness accuracy of the sealing resin sheet after molding can be improved.
　本発明にかかる封止用樹脂シートの製造方法によれば、樹脂材料が外へ漏れることを防止でき、封止用樹脂シートの厚み精度を向上することができる。 According to the method for producing a sealing resin sheet according to the present invention, the resin material can be prevented from leaking outside, and the thickness accuracy of the sealing resin sheet can be improved.
封止用樹脂シート１１を正面から見た断面図である。It is sectional drawing which looked at the resin sheet 11 for sealing from the front. 本発明の第１実施形態にかかる封止用樹脂シート１１の製造装置３０の概略図である。It is the schematic of the manufacturing apparatus 30 of the resin sheet 11 for sealing concerning 1st Embodiment of this invention. 図２において、成形途中の樹脂体２２の様子を示した図である。In FIG. 2, it is the figure which showed the mode of the resin body 22 in the middle of shaping | molding. 図３に対する比較例を示した図であり、弾性部材を用いずに封止用樹脂シート１１を成形した場合の樹脂体２２の様子を示した図である。It is the figure which showed the comparative example with respect to FIG. 3, and is the figure which showed the mode of the resin body 22 at the time of shape | molding the resin sheet 11 for sealing, without using an elastic member. 本発明の第１実施形態にかかる封止用樹脂シート１１の製造方法に備える工程を順に示した図である。It is the figure which showed in order the process with which the manufacturing method of the resin sheet 11 for sealing concerning 1st Embodiment of this invention is equipped. 本発明の第２実施形態を説明するためのもので、封止用樹脂シート１１の製造工程を順に示した図である。It is for demonstrating 2nd Embodiment of this invention, and is the figure which showed the manufacturing process of the resin sheet 11 for sealing in order. 本発明の第３実施形態を説明するためのもので、封止用樹脂シート１１の成形前、成形途中および成形後の段階を順に示した平面図である。It is for describing 3rd Embodiment of this invention, and is the top view which showed the step before shaping | molding of the resin sheet 11 for sealing, and the stage after shaping | molding in order. 図７に示した成形金型５０に関する第１変形例を示した図である。It is the figure which showed the 1st modification regarding the shaping die 50 shown in FIG. 図７に示した樹脂体２２に関する第２変形例を示した図である。It is the figure which showed the 2nd modification regarding the resin body 22 shown in FIG. 図７に示した成形金型５０および樹脂体２２に関する第３変形例を示した図である。It is the figure which showed the 3rd modification regarding the molding die 50 and the resin body 22 which were shown in FIG. 図７に示した成形金型５０に関する第４変形例を示した図である。It is the figure which showed the 4th modification regarding the shaping die 50 shown in FIG. 本発明の第４実施形態を説明するためのもので、封止用樹脂シート１１の成形前の段階を示した図である。It is for demonstrating 4th Embodiment of this invention, and is the figure which showed the step before shaping | molding of the resin sheet 11 for sealing. 図１２に示した段階から進んで、封止用樹脂シート１１の成形途中の段階を示した図である。It is the figure which advanced from the step shown in FIG. 12, and showed the step in the middle of shaping | molding of the resin sheet 11 for sealing. 図１３に示した段階から進んで、封止用樹脂シート１１の成形後の段階を示した図である。It is the figure which advanced from the step shown in FIG. 13, and showed the step after shaping | molding of the resin sheet 11 for sealing. 本発明の第５実施形態を説明するためのもので、封止用樹脂シート１１の成形途中の段階を示した図である。It is for demonstrating 5th Embodiment of this invention, and is the figure which showed the step in the middle of shaping | molding of the resin sheet 11 for sealing. 図１５に示した段階から進んで、封止用樹脂シート１１の成形後の段階を示した図である。It is the figure which advanced from the stage shown in FIG. 15, and showed the stage after shaping | molding of the resin sheet 11 for sealing. 本発明の第６実施形態を説明するためのもので、封止用樹脂シート１１を成形する成形金型８０を示した図である。It is for demonstrating 6th Embodiment of this invention, and is the figure which showed the shaping die 80 which shape | molds the resin sheet 11 for sealing. 図１７に示した成形金型８０の変形例を示した図である。It is the figure which showed the modification of the shaping die 80 shown in FIG. 従来技術における封止用樹脂シート２０５の製造方法を示した図である。It is the figure which showed the manufacturing method of the resin sheet 205 for sealing in a prior art.
　［第１実施形態］
（封止用樹脂シート）
　基板上に複数の電子部品が搭載された電子部品モジュールには、電子部品を絶縁封止するために封止用樹脂シートが用いられる。図１に示すように、封止用樹脂シート１１は平板形状をしており、厚みは０．１ｍｍ～３．５ｍｍである。封止用樹脂シート１１は半硬化状態の絶縁性の樹脂材料１５（たとえばエポキシ樹脂）により構成されており、機械的強度を高めるために、フィラーとして、たとえばシリカ又はアルミナが含有される。 [First Embodiment]
(Resin sheet for sealing)
In an electronic component module in which a plurality of electronic components are mounted on a substrate, a sealing resin sheet is used for insulating and sealing the electronic components. As shown in FIG. 1, the sealing resin sheet 11 has a flat plate shape and a thickness of 0.1 mm to 3.5 mm. The sealing resin sheet 11 is made of a semi-cured insulating resin material 15 (for example, epoxy resin), and contains silica or alumina, for example, as a filler in order to increase mechanical strength.
　封止用樹脂シート１１の両主面には、封止用樹脂シート１１の表面を保護するために保護フィルム１２Ａ、１２Ｂが取付けられる。図１に示すように、封止用樹脂シート１１の上面に形成された保護フィルム１２Ｂは平らであり、下面に形成された保護フィルム１２Ａは封止用樹脂シート１１に沿うように下向きに凸の形状をしている。保護フィルム１２Ａ、１２Ｂの材料は、たとえばＰＥＴ（ポリエチレンテレフタラート）、ＰＴＦＥ（ポリテトラフルオロエチレン）である。保護フィルム１２Ａ、１２Ｂの表面にはシリコーン樹脂等による離型処理が施されており、封止用樹脂シート１１を電子部品モジュールの製造過程で用いる場合は、保護フィルム１２Ａ、１２Ｂを剥離して用いる。 Protective films 12 </ b> A and 12 </ b> B are attached to both main surfaces of the sealing resin sheet 11 in order to protect the surface of the sealing resin sheet 11. As shown in FIG. 1, the protective film 12 </ b> B formed on the upper surface of the sealing resin sheet 11 is flat, and the protective film 12 </ b> A formed on the lower surface is convex downward along the sealing resin sheet 11. It has a shape. The material of the protective films 12A and 12B is, for example, PET (polyethylene terephthalate) or PTFE (polytetrafluoroethylene). The surface of the protective films 12A and 12B is subjected to a release treatment with a silicone resin or the like. When the sealing resin sheet 11 is used in the manufacturing process of the electronic component module, the protective films 12A and 12B are peeled off and used. .
　（封止用樹脂シートの製造装置）
　図２に示すように、封止用樹脂シートの製造装置３０（以下、製造装置３０と呼ぶ）は、樹脂体２２から封止用樹脂シート１１を成形するための成形金型４０を備える。成形金型４０は、１対の押圧板４３、４５と、側方の剛体板４４と、剛体板４４の内側に配置される弾性部材４８と、により構成される。 (Manufacturing device for sealing resin sheet)
As shown in FIG. 2, the sealing resin sheet manufacturing apparatus 30 (hereinafter referred to as the manufacturing apparatus 30) includes a molding die 40 for molding the sealing resin sheet 11 from the resin body 22. The molding die 40 includes a pair of pressing plates 43 and 45, a side rigid plate 44, and an elastic member 48 disposed inside the rigid plate 44.
　成形金型４０の内部には樹脂体２２が配置される。樹脂体２２は、封止用樹脂シート１１を成形するための材料である。樹脂体２２は、半硬化状態の絶縁性の樹脂材料１５で構成され、フィラーとしてたとえばシリカ又はアルミナが含有される。樹脂体２２の形状は、円柱、直方体、チップ状などの種々の形状を用いることができる。 The resin body 22 is disposed inside the molding die 40. The resin body 22 is a material for molding the sealing resin sheet 11. The resin body 22 is composed of a semi-cured insulating resin material 15 and contains, for example, silica or alumina as a filler. As the shape of the resin body 22, various shapes such as a cylinder, a rectangular parallelepiped, and a chip shape can be used.
　１対の押圧板４３、４５は、樹脂体２２を押圧するためのものである。押圧板４３、４５は平板形状をしており、樹脂体２２を挟むように樹脂体２２の上下にそれぞれ配置される。押圧板４３、４５の材質は、押圧しても形状を維持することのできるものであればよく、たとえばステンレス鋼やアルミニウムが用いられる。 The pair of pressing plates 43 and 45 are for pressing the resin body 22. The pressing plates 43 and 45 have a flat plate shape and are respectively disposed above and below the resin body 22 so as to sandwich the resin body 22. The material of the pressing plates 43 and 45 may be any material that can maintain the shape even when pressed, and for example, stainless steel or aluminum is used.
　剛体板４４は、成形される封止用樹脂シート１１の厚みを設定するためのものである。剛体板４４は枠体であり、押圧板４３、４５の外周に沿って１対の押圧板４３、４５の間に配置される。剛体板４４の材質は、押圧されても形状を維持することのできるものであればよく、たとえばステンレス鋼やアルミニウムが用いられる。 The rigid plate 44 is for setting the thickness of the sealing resin sheet 11 to be molded. The rigid plate 44 is a frame and is disposed between the pair of pressing plates 43 and 45 along the outer periphery of the pressing plates 43 and 45. The material of the rigid plate 44 may be any material that can maintain the shape even when pressed, and for example, stainless steel or aluminum is used.
　弾性部材４８は、樹脂体２２が成形金型４０の外へ向かって漏れ出すのを防止するためのものである。弾性部材４８は枠体であり、その厚みは剛体板４４の厚みより大きく、剛体板４４の内側において樹脂体２２を囲むように１対の押圧板４３、４５の間に配置される。弾性部材４８は押圧板４３、４５からの押圧力により変形可能であり、材質は、たとえばシリコーン樹脂が用いられる。 The elastic member 48 is for preventing the resin body 22 from leaking out of the molding die 40. The elastic member 48 is a frame, and the thickness thereof is larger than the thickness of the rigid plate 44 and is disposed between the pair of pressing plates 43 and 45 so as to surround the resin body 22 inside the rigid plate 44. The elastic member 48 can be deformed by the pressing force from the pressing plates 43 and 45, and the material is, for example, silicone resin.
　上記に示す位置関係で成形金型４０が構成されることにより、１対の押圧板４３、４５と弾性部材４８で樹脂体２２を囲む空間４６が規定される。 The space 46 surrounding the resin body 22 is defined by the pair of pressing plates 43 and 45 and the elastic member 48 by configuring the molding die 40 in the positional relationship shown above.
　なお、第１実施形態で作製する封止用樹脂シート１１には、表面に保護フィルム１２Ａ、１２Ｂを取り付ける必要があるため、空間４６内において樹脂体２２を囲むように１対の保護フィルム１２Ａ、１２Ｂが挿入される。具体的には、樹脂体２２の底面から弾性部材４８および剛体板４４の上面を通るように一方の保護フィルム１２Ａが配置され、かつ、樹脂体２２の上面および一方の保護フィルム１２Ａと向かい合うように他方の保護フィルム１２Ｂが押圧板４５に付着される。その結果、一方および他方の保護フィルム１２Ａ、１２Ｂにより樹脂体２２を包むように囲むフィルム内領域４７が規定される。この状態で、製造装置３０により成形金型４０の内部の空間４６およびフィルム内領域４７が減圧され、かつ、樹脂体２２が加熱、押圧される。 In addition, since it is necessary to attach protective film 12A, 12B to the surface in the resin sheet 11 for sealing produced in 1st Embodiment, a pair of protective film 12A, so that the resin body 22 may be enclosed in the space 46, 12B is inserted. Specifically, one protective film 12A is disposed so as to pass from the bottom surface of the resin body 22 to the upper surface of the elastic member 48 and the rigid plate 44, and so as to face the upper surface of the resin body 22 and the one protective film 12A. The other protective film 12B is attached to the pressing plate 45. As a result, an in-film region 47 that encloses the resin body 22 with the one and the other protective films 12A and 12B is defined. In this state, the manufacturing apparatus 30 depressurizes the space 46 and the in-film region 47 of the molding die 40 and heats and presses the resin body 22.
　製造装置３０は、樹脂体２２を加熱するための加熱機構３３Ａ、３３Ｂを備える。加熱機構３３Ａ、３３Ｂは、押圧板４５の上側に設置された加圧板３２と、押圧板４３の下側に設置された受圧板３１のそれぞれに内蔵される。この加熱機構３３Ａ、３３Ｂにより、押圧板４３、４５を介して樹脂体２２が加熱される。 The manufacturing apparatus 30 includes heating mechanisms 33A and 33B for heating the resin body 22. The heating mechanisms 33 </ b> A and 33 </ b> B are incorporated in each of the pressure plate 32 installed on the upper side of the press plate 45 and the pressure receiving plate 31 installed on the lower side of the press plate 43. The resin body 22 is heated via the pressing plates 43 and 45 by the heating mechanisms 33A and 33B.
　また、製造装置３０は、空間４６およびフィルム内領域４７を減圧するための真空機構３８を備える。真空機構３８は、加圧板３２および受圧板３１を取り囲むように設置される。真空機構３８の内部は、図示しない真空源により真空引きされ、これにより、空間４６およびフィルム内領域４７も減圧状態となる。 Moreover, the manufacturing apparatus 30 includes a vacuum mechanism 38 for decompressing the space 46 and the in-film region 47. The vacuum mechanism 38 is installed so as to surround the pressure plate 32 and the pressure receiving plate 31. The inside of the vacuum mechanism 38 is evacuated by a vacuum source (not shown), whereby the space 46 and the in-film region 47 are also decompressed.
　また、製造装置３０は、樹脂体２２を押圧するための加圧機構３４を備える。加圧機構３４は天板３６の中央に設置され、天板３６は下方のベース３５に立てられた支柱３７に固定される。加圧機構３４の駆動軸３９は加圧板３２の上側に接続され、この駆動軸３９が下降することにより、加圧板３２および押圧板４５が押される。これにより、樹脂体２２が１対の保護フィルム１２Ａ、１２Ｂの面方向に沿って押圧板４３、４５の間に延ばされる。その結果、成形金型４０が規定する空間４６およびフィルム内領域４７が樹脂材料１５によって充填され、樹脂体２２に対する成形が完了する。 Moreover, the manufacturing apparatus 30 includes a pressurizing mechanism 34 for pressing the resin body 22. The pressurizing mechanism 34 is installed at the center of the top plate 36, and the top plate 36 is fixed to a support column 37 that stands on the lower base 35. The drive shaft 39 of the pressurizing mechanism 34 is connected to the upper side of the pressurizing plate 32, and the pressurizing plate 32 and the pressing plate 45 are pushed by lowering the drive shaft 39. Thereby, the resin body 22 is extended between the press plates 43 and 45 along the surface direction of a pair of protective films 12A and 12B. As a result, the space 46 and the in-film region 47 defined by the molding die 40 are filled with the resin material 15, and the molding of the resin body 22 is completed.
　図３（Ａ）および図３（Ｂ）は、成形金型４０内での樹脂体２２の様子を示した図であり、平面図を（Ａ）に、正面図を（Ｂ）の箇所に表している。なお、図３（Ａ）は、図３（Ｂ）に対するＺ１－Ｚ１断面であり、図３（Ｂ）は、図３（Ａ）に対するＹ１－Ｙ１断面である。図３（Ａ）においては、理解を容易にするため樹脂体２２の形状を円柱とし、また、保護フィルム１２Ａを省略して描いている。 3 (A) and 3 (B) are views showing the state of the resin body 22 in the molding die 40. A plan view is shown in FIG. 3 (A), and a front view is shown in FIG. 3 (B). ing. 3A is a Z1-Z1 cross section with respect to FIG. 3B, and FIG. 3B is a Y1-Y1 cross section with respect to FIG. 3A. In FIG. 3A, the shape of the resin body 22 is a cylinder for easy understanding, and the protective film 12A is omitted.
　第１実施形態では、弾性部材４８の厚みが剛体板４４の厚みより大きい。そのため、図３（Ｂ）に示すように、押圧板４５は剛体板４４より先に、保護フィルム１２Ａ、１２Ｂを介して弾性部材４８に当接する。また、弾性部材４８は押圧板４５からの押圧力により変形可能であるので、押圧板４５の表面に倣って変形する。したがって、図３（Ａ）および図３（Ｂ）に示すように、成形途中に流動した樹脂材料１５が、弾性部材４８と押圧板４５の間で堰き止められる。その結果、成形金型４０の外への樹脂材料１５の漏れ出しが抑制され、所望の形状をした封止用樹脂シート１１が成形される。 In the first embodiment, the thickness of the elastic member 48 is larger than the thickness of the rigid plate 44. Therefore, as shown in FIG. 3B, the pressing plate 45 contacts the elastic member 48 via the protective films 12A and 12B before the rigid plate 44. Further, since the elastic member 48 can be deformed by the pressing force from the pressing plate 45, it deforms following the surface of the pressing plate 45. Therefore, as shown in FIGS. 3A and 3B, the resin material 15 that has flowed during the molding is dammed between the elastic member 48 and the pressing plate 45. As a result, leakage of the resin material 15 to the outside of the molding die 40 is suppressed, and the sealing resin sheet 11 having a desired shape is molded.
　一方、図４（Ａ）および図４（Ｂ）は、弾性部材４８を用いずに封止用樹脂シート１１を成形した場合の比較例を示した図であり、平面図を（Ａ）に、正面図を（Ｂ）の箇所に表している。なお、図４（Ａ）は、図４（Ｂ）に対するＺ２－Ｚ２断面であり、図４（Ｂ）は、図４（Ａ）に対するＹ２－Ｙ２断面である。図４（Ａ）においても、理解を容易にするため樹脂体２２の形状を円柱とし、また、保護フィルム１２Ａを省略して描いている。 On the other hand, FIG. 4 (A) and FIG. 4 (B) are the figures which showed the comparative example at the time of shape | molding the resin sheet 11 for sealing, without using the elastic member 48, A top view is shown to (A). A front view is shown at (B). 4A is a Z2-Z2 cross section with respect to FIG. 4B, and FIG. 4B is a Y2-Y2 cross section with respect to FIG. 4A. Also in FIG. 4 (A), in order to facilitate understanding, the shape of the resin body 22 is a cylinder, and the protective film 12A is omitted.
　比較例では、弾性部材４８が無いので成形金型１４０の外への樹脂材料１５の漏れ出しを防止するのが困難である。なぜなら、成形途中に流動した樹脂材料１５が剛体板１４４の４辺中央に到達したときに、成形金型１４０は完全に閉じていないからである。図４（Ａ）および図４（Ｂ）に示すように、樹脂材料１５が剛体板１４４の４辺中央に到達したときに、押圧板１４５と剛体板１４４の間には隙間１５０があり、その状態で押圧されると樹脂材料１５が隙間１５０に入ってしまう。その結果、剛体板１４４と押圧板１４５の間に漏れ出した樹脂材料１５１が介在することになり、所望の厚み精度の封止用樹脂シート１１が成形されにくい。 In the comparative example, since there is no elastic member 48, it is difficult to prevent the resin material 15 from leaking out of the molding die 140. This is because the molding die 140 is not completely closed when the resin material 15 that has flowed during molding reaches the center of the four sides of the rigid plate 144. As shown in FIGS. 4A and 4B, when the resin material 15 reaches the center of the four sides of the rigid plate 144, there is a gap 150 between the pressing plate 145 and the rigid plate 144. When pressed in a state, the resin material 15 enters the gap 150. As a result, the leaked resin material 151 is interposed between the rigid plate 144 and the pressing plate 145, and the sealing resin sheet 11 having a desired thickness accuracy is hardly formed.
　なお、上記では樹脂体２２を円柱として説明したが、その形状に限定されるものでない。樹脂体２２の配置される位置や押圧板４３、４５の初期の平行度により、樹脂体２２が延ばされた後の状態に偏りが生じるため、樹脂体２２の形状が異なっていても同様の課題が存在する。 In addition, although the resin body 22 was demonstrated as a cylinder above, it is not limited to the shape. Depending on the position where the resin body 22 is arranged and the initial parallelism of the pressing plates 43 and 45, the state after the resin body 22 is extended is biased. There are challenges.
　第１実施形態では、樹脂体２２の形状が直方体やチップ状の小片であっても、成形途中の樹脂材料１５を弾性部材４８と押圧板４５の間で堰き止めることができる。これにより、成形金型４０の外への樹脂材料１５の漏れ出しを抑制し、所望の形状をした封止用樹脂シート１１を成形できる。 In the first embodiment, even when the shape of the resin body 22 is a rectangular parallelepiped or a chip-like piece, the resin material 15 being molded can be dammed between the elastic member 48 and the pressing plate 45. Thereby, the leakage of the resin material 15 to the outside of the molding die 40 can be suppressed, and the sealing resin sheet 11 having a desired shape can be molded.
　また、第１実施形態によれば、製造装置３０を準備すればよいので、高価な設備を使用せずに封止用樹脂シート１１を製造することができる。また、製造装置３０を使えば剛体板４４の設定により比較的膜厚の大きい封止用樹脂シート１１を製造することもできる。 Further, according to the first embodiment, since the manufacturing apparatus 30 may be prepared, the sealing resin sheet 11 can be manufactured without using expensive equipment. Further, if the manufacturing apparatus 30 is used, the sealing resin sheet 11 having a relatively large film thickness can be manufactured by setting the rigid plate 44.
　（封止用樹脂シートの製造方法）
　図５（Ａ）から図５（Ｅ）、図３（Ａ）および図３（Ｂ）を参照して、封止用樹脂シート１１の製造方法について説明する。 (Method for producing sealing resin sheet)
With reference to FIG. 5 (A) to FIG. 5 (E), FIG. 3 (A), and FIG. 3 (B), the manufacturing method of the resin sheet 11 for sealing is demonstrated.
　まず、図５（Ａ）に示すように、底を有する円筒状の円筒型２０を準備し、液状樹脂２１を円筒型２０に入れ、熱処理で半硬化状態にして樹脂体２２を作製する。半硬化状態とは、硬化反応の中間段階の状態を指し、Ｂステージとも呼ばれる。液状樹脂２１を半硬化状態にするためには、エポキシ樹脂の場合は４０℃～１６０℃の温度により５分～１２０分間、オーブンで加熱処理する。 First, as shown in FIG. 5A, a cylindrical cylinder 20 having a bottom is prepared, and a liquid resin 21 is put into the cylinder mold 20 to be semi-cured by heat treatment to produce a resin body 22. The semi-cured state refers to a state at an intermediate stage of the curing reaction and is also called a B stage. In order to bring the liquid resin 21 into a semi-cured state, in the case of an epoxy resin, it is heated in an oven at a temperature of 40 ° C. to 160 ° C. for 5 minutes to 120 minutes.
　樹脂体２２は、温度６０℃で１２０Ｐａ・ｓ～２０００Ｐａ・ｓの粘度を示す範囲のものを使うことができる。このときの粘度は、ＴＡ  Ｉｎｓｔｒｕｍｅｎｔｓ社製ＡＲ５５０を用いてツールサイズφ８ｍｍ、測定厚み５５０μｍ、周波数１Ｈｚ、歪み０．１％の条件で測定した値である。 As the resin body 22, a resin body having a viscosity of 120 Pa · s to 2000 Pa · s at a temperature of 60 ° C. can be used. The viscosity at this time is a value measured under the conditions of a tool size of φ8 mm, a measurement thickness of 550 μm, a frequency of 1 Hz, and a strain of 0.1% using an AR550 manufactured by TA Instruments.
　次に、図５（Ｂ）に示すように、封止用樹脂シート１１を成形するための成形金型４０を準備する。成形金型４０は上下１対の押圧板４３、４５と側方の剛体板４４と、剛体板４４の内側に配置される弾性部材４８と、により構成される。上記に示す構成により、１対の押圧板４３、４５と弾性部材４８で樹脂体２２を囲む空間４６が形成される。なお、第１実施形態では、空間４６内に１対の保護フィルム１２Ａ、１２Ｂが挿入され、樹脂体２２を包むように囲むフィルム内領域４７が形成される。 Next, as shown in FIG. 5B, a molding die 40 for molding the sealing resin sheet 11 is prepared. The molding die 40 includes a pair of upper and lower pressing plates 43 and 45, a side rigid plate 44, and an elastic member 48 disposed inside the rigid plate 44. With the configuration described above, a space 46 surrounding the resin body 22 is formed by the pair of pressing plates 43 and 45 and the elastic member 48. In the first embodiment, a pair of protective films 12 </ b> A and 12 </ b> B are inserted into the space 46 to form an in-film region 47 that surrounds the resin body 22.
　次に、図５（Ｃ）に示すように、１対の押圧板４３、４５を互いに近づく方向に移動させ、押圧板４５と弾性部材４８とを保護フィルム１２Ａ、１２Ｂを介して当接させる。これにより樹脂体２２が流動し、１対の押圧板４３、４５の間に延ばされる。 Next, as shown in FIG. 5C, the pair of pressing plates 43 and 45 are moved in a direction approaching each other, and the pressing plate 45 and the elastic member 48 are brought into contact with each other through the protective films 12A and 12B. As a result, the resin body 22 flows and extends between the pair of pressing plates 43 and 45.
　樹脂体２２が延ばされる際、樹脂体２２は加熱されており、その加熱温度は、樹脂体２２の硬化温度より低い温度（たとえば４０℃～１６０℃）である。空間４６およびフィルム内領域４７は真空引きにより減圧され、その圧力は５０００Ｐａ以下である。 When the resin body 22 is extended, the resin body 22 is heated, and the heating temperature is lower than the curing temperature of the resin body 22 (for example, 40 ° C. to 160 ° C.). The space 46 and the in-film region 47 are depressurized by evacuation, and the pressure is 5000 Pa or less.
　図５（Ｄ）に示すように、更に１対の押圧板４３、４５の移動が進行すると、延ばされた樹脂体２２の樹脂材料１５に押されて、下側の保護フィルム１２Ａが成形金型４０の内壁に沿うように広がる。これにより、成形金型４０が規定する空間４６およびフィルム内領域４７が樹脂材料１５によって充填され、樹脂体２２に対する成形が完了する。 As shown in FIG. 5D, when the movement of the pair of pressing plates 43 and 45 further proceeds, the lower protective film 12A is pressed by the resin material 15 of the extended resin body 22 to form the molding metal. It spreads along the inner wall of the mold 40. As a result, the space 46 and the in-film region 47 defined by the molding die 40 are filled with the resin material 15 and the molding of the resin body 22 is completed.
　図３（Ａ）および図３（Ｂ）は、成形途中の樹脂材料１５の様子を示した図であって、図５でいうと図５（Ｃ）と図５（Ｄ）の間の状態を示した図である。図３（Ａ）および図３（Ｂ）に示すように、成形途中の樹脂材料１５は、弾性部材４８の内側の４辺中央に到達する。しかし、弾性部材４８と押圧板４５が保護フィルム１２Ａ、１２Ｂを介して当接しており、樹脂材料１５は弾性部材４８の４辺中央にて堰き止められる。更に押圧されることにより成形が進行すると、樹脂材料１５は弾性部材４８の内側の４隅に向かって流動する。これにより樹脂材料１５は長方形状に成形される。 3 (A) and 3 (B) are views showing the state of the resin material 15 in the middle of molding. In FIG. 5, the state between FIG. 5 (C) and FIG. 5 (D) is shown. FIG. As shown in FIGS. 3A and 3B, the resin material 15 in the middle of molding reaches the center of the four sides inside the elastic member 48. However, the elastic member 48 and the pressing plate 45 are in contact with each other via the protective films 12 </ b> A and 12 </ b> B, and the resin material 15 is dammed at the center of the four sides of the elastic member 48. When the molding further proceeds by being pressed, the resin material 15 flows toward the four corners inside the elastic member 48. Thereby, the resin material 15 is formed in a rectangular shape.
　図５（Ｄ）で示した工程の後、押圧板４３、４５による押圧力が解除されるとともに押圧板４３、４５および弾性部材４８で囲まれた空間４６が大気開放される。これにより、図５（Ｅ）に示すような、両面に保護フィルム１２Ａ、１２Ｂの付いた封止用樹脂シート１１が作製される。なお、成形時の加熱温度は樹脂材料１５の硬化温度より低いので、封止用樹脂シート１１は半硬化状態のままである。 After the step shown in FIG. 5D, the pressing force by the pressing plates 43 and 45 is released, and the space 46 surrounded by the pressing plates 43 and 45 and the elastic member 48 is opened to the atmosphere. Thereby, the sealing resin sheet 11 with the protective films 12A and 12B on both sides as shown in FIG. In addition, since the heating temperature at the time of molding is lower than the curing temperature of the resin material 15, the sealing resin sheet 11 remains in a semi-cured state.
　第１実施形態によれば、弾性部材４８の厚みが剛体板４４の厚みより大きいので、成形途中の樹脂材料１５が、弾性部材４８と押圧板４５の間で堰き止められる。その結果、成形金型４０の外への樹脂材料１５の漏れ出しが抑制され、所望の形状をした封止用樹脂シート１１が成形される。 According to the first embodiment, since the thickness of the elastic member 48 is larger than the thickness of the rigid plate 44, the resin material 15 in the middle of molding is dammed between the elastic member 48 and the pressing plate 45. As a result, leakage of the resin material 15 to the outside of the molding die 40 is suppressed, and the sealing resin sheet 11 having a desired shape is molded.
　［第２実施形態］
　第２実施形態は、第１実施形態で示した保護フィルム１２Ａ、１２Ｂ（図５参照）を用いずに、押圧板４３、４５の間に直接、樹脂体２２を配置し封止用樹脂シート１１を製造する実施形態である。なお、第１実施形態と共通する構成については詳しい説明を省略する。 [Second Embodiment]
2nd Embodiment arrange | positions the resin body 22 directly between the press plates 43 and 45, without using the protective films 12A and 12B (refer FIG. 5) shown in 1st Embodiment, and the resin sheet 11 for sealing It is embodiment which manufactures. Detailed description of the configuration common to the first embodiment is omitted.
　図６（Ａ）に示すように、底を有する円筒状の円筒型２０を準備し、液状樹脂２１を円筒型２０に入れ、熱処理で半硬化状態にして樹脂体２２を作製する。 As shown in FIG. 6 (A), a cylindrical cylinder 20 having a bottom is prepared, and a liquid resin 21 is placed in the cylinder 20, and the resin body 22 is made into a semi-cured state by heat treatment.
　図６（Ｂ）に示すように、封止用樹脂シート１１を成形するための成形金型４０を準備する。成形金型４０は上下１対の押圧板４３、４５と側方の剛体板４４と、剛体板４４の内側に配置される弾性部材４８と、により構成される。弾性部材４８の材質はシリコーン樹脂である。押圧板４３、４５には、シリコーン樹脂等による離型処理が施される。 As shown in FIG. 6 (B), a molding die 40 for molding the sealing resin sheet 11 is prepared. The molding die 40 includes a pair of upper and lower pressing plates 43 and 45, a side rigid plate 44, and an elastic member 48 disposed inside the rigid plate 44. The material of the elastic member 48 is a silicone resin. The pressing plates 43 and 45 are subjected to a mold release process using a silicone resin or the like.
　上記に示す構成により、１対の押圧板４３、４５と弾性部材４８で樹脂体２２を囲む空間４６が形成される。なお、樹脂体２２が延ばされる際の加熱温度は、樹脂体２２の硬化温度より低い温度であり、空間４６は真空引きされる。 With the configuration described above, a space 46 surrounding the resin body 22 by the pair of pressing plates 43 and 45 and the elastic member 48 is formed. The heating temperature when the resin body 22 is extended is lower than the curing temperature of the resin body 22, and the space 46 is evacuated.
　図６（Ｃ）に示すように、１対の押圧板４３、４５が互いに近づく方向に移動して、樹脂体２２が１対の押圧板４３、４５の間に延ばされる。このとき、流動した樹脂材料１５は、弾性部材４８と押圧板４５の間で堰き止められる。樹脂体２２が延ばされることにより、図６（Ｄ）に示すように、成形金型４０が規定する空間４６が樹脂材料１５によって充填され、樹脂体２２に対する成形が完了する。 As shown in FIG. 6C, the pair of pressing plates 43, 45 move in a direction approaching each other, and the resin body 22 is extended between the pair of pressing plates 43, 45. At this time, the fluidized resin material 15 is dammed between the elastic member 48 and the pressing plate 45. By extending the resin body 22, as shown in FIG. 6D, the space 46 defined by the molding die 40 is filled with the resin material 15, and the molding of the resin body 22 is completed.
　図６（Ｄ）で示した工程の後、押圧板４３、４５による押圧力が解除されるとともに押圧板４３、４５および剛体板４４で囲まれた空間４６が大気開放される。これにより、図６（Ｅ）に示すような、封止用樹脂シート１１が作製される。 6D, the pressing force by the pressing plates 43 and 45 is released, and the space 46 surrounded by the pressing plates 43 and 45 and the rigid plate 44 is opened to the atmosphere. Thereby, the resin sheet 11 for sealing as shown in FIG.6 (E) is produced.
　第２実施形態によれば、保護フィルム１２Ａ、１２Ｂを用いずに封止用樹脂シート１１を製造することができる。そのため封止用樹脂シート１１をより安価に製造することができる。 According to the second embodiment, the sealing resin sheet 11 can be manufactured without using the protective films 12A and 12B. Therefore, the sealing resin sheet 11 can be manufactured at a lower cost.
　［第３実施形態］
　第３実施形態は、第１実施形態で示した弾性部材に、余剰の樹脂材料１５を溜める機能を設けた実施形態である。なお、第１実施形態と共通する構成については詳しい説明を省略する。 [Third Embodiment]
The third embodiment is an embodiment in which the elastic member shown in the first embodiment is provided with a function of storing excess resin material 15. Detailed description of the configuration common to the first embodiment is omitted.
　図７（Ａ）から図７（Ｃ）は、成形金型５０内での樹脂体２２の様子を順に示した平面図である。なお、理解を容易にするため樹脂体２２の形状を円柱とし、また、保護フィルム１２Ａを省略して描いている。 7 (A) to 7 (C) are plan views sequentially showing the state of the resin body 22 in the molding die 50. FIG. For ease of understanding, the shape of the resin body 22 is a cylinder, and the protective film 12A is omitted.
　図７（Ａ）に示すように、成形金型５０は、上下１対の押圧板４３、４５（押圧板４５は図示省略）と、押圧板４３の外周に配置される剛体板４４と、剛体板４４の内側に配置される弾性部材５１と、により構成される。 As shown in FIG. 7A, the molding die 50 includes a pair of upper and lower pressing plates 43 and 45 (the pressing plate 45 is not shown), a rigid plate 44 disposed on the outer periphery of the pressing plate 43, and a rigid body. And an elastic member 51 disposed inside the plate 44.
　第３実施形態では、４角柱の４つの弾性部材５１が、樹脂体２２を囲むように、それぞれ隙間をあけて配置されている。換言すれば、枠体形状となっている弾性部材５１の４つ角には、樹脂体２２側の面から剛体板４４の方向に向けて切り欠きが形成されている。この切り欠きが、余剰の樹脂材料１５を溜めるための樹脂溜まり部５２となる。樹脂溜まり部５２により、成形金型５０内に投入できる樹脂量の許容幅を広げることができる。 In the third embodiment, the four elastic members 51 of the quadrangular prism are arranged with a gap so as to surround the resin body 22. In other words, notches are formed in the four corners of the elastic member 51 having a frame shape from the surface on the resin body 22 side toward the rigid plate 44. This notch serves as a resin reservoir 52 for storing excess resin material 15. The resin reservoir 52 can widen the allowable range of the amount of resin that can be charged into the molding die 50.
　図７（Ｂ）に示すように、押圧工程により延ばされた樹脂体２２の樹脂材料１５は、弾性部材５１の内側の４辺中央に到達し、弾性部材５１により堰き止められる。堰き止められた樹脂材料１５は、弾性部材５１の４つ角に向かって流動する。 7B, the resin material 15 of the resin body 22 extended by the pressing process reaches the center of the four sides inside the elastic member 51 and is dammed up by the elastic member 51. As shown in FIG. The dammed resin material 15 flows toward the four corners of the elastic member 51.
　図７（Ｃ）に示すように、成形金型５０の押圧、充填工程が進行すると、成形金型５０が規定する空間４６およびフィルム内領域４７が樹脂材料１５によって充填され、余剰の樹脂材料１５が弾性部材５１の４つ角にある樹脂溜まり部５２に入り込む。これにより、樹脂材料１５の余剰分５３を４つ角に有する封止用樹脂シート１１が成形される。なお、作製された封止用樹脂シート１１は、余剰分５３が切断により除去された後、電子部品モジュールの製造に使用される。 As shown in FIG. 7C, when the pressing and filling process of the molding die 50 proceeds, the space 46 and the in-film region 47 defined by the molding die 50 are filled with the resin material 15, and the surplus resin material 15 is filled. Enters the resin reservoir 52 at the four corners of the elastic member 51. Thereby, the resin sheet 11 for sealing which has the surplus part 53 of the resin material 15 in four corners is shape | molded. In addition, the produced resin sheet 11 for sealing is used for manufacture of an electronic component module, after the surplus part 53 is removed by cutting | disconnection.
　通常は、封止用樹脂シート１１を成形するにあたり、成形金型５０内に十分に樹脂材料１５を充填させる必要があり、投入される樹脂体２２の体積は、成形金型５０内の容積より大きく設定される。そのため成形時に余剰の樹脂材料１５が発生する。仮に、余剰の樹脂材料１５の行き場がないと、成形金型５０の外へ樹脂材料１５が漏れ出す可能性もある。 Usually, in molding the sealing resin sheet 11, it is necessary to sufficiently fill the resin material 15 in the molding die 50, and the volume of the resin body 22 to be charged is larger than the volume in the molding die 50. It is set large. Therefore, surplus resin material 15 is generated during molding. If there is no place for the surplus resin material 15, the resin material 15 may leak out of the molding die 50.
　第３実施形態では、余剰の樹脂材料１５を樹脂溜まり部５２に溜めるので、樹脂溜まり部５２の体積に相当する樹脂材料１５を余分に収容できる。したがって、樹脂体２２の体積が成形金型５０内の容積より大きい場合であっても、問題なく封止用樹脂シート１１を成形することができる。 In the third embodiment, since the surplus resin material 15 is stored in the resin reservoir 52, the resin material 15 corresponding to the volume of the resin reservoir 52 can be accommodated in excess. Therefore, even if the volume of the resin body 22 is larger than the volume in the molding die 50, the sealing resin sheet 11 can be molded without any problem.
　なお、第３実施形態については、弾性部材５１の切り欠きの位置、切り欠きの数、樹脂体２２の形状などを任意に変更することができる。図８から図１１は、それらの代表的な変形例を示した図である。 In addition, about 3rd Embodiment, the position of the notch of the elastic member 51, the number of notches, the shape of the resin body 22, etc. can be changed arbitrarily. FIG. 8 to FIG. 11 are diagrams showing typical modifications thereof.
　図８は、成形金型５０に関する第１変形例を示した図である。図８に示すように、成形金型５０Ａの弾性部材５１Ａは、全体が一体的に構成された枠体である。弾性部材５１Ａの内側の４つ角には、弾性部材５１Ａの一部が切り欠かれた切り欠き５２Ａを有する。この切り欠き５２Ａが、樹脂材料１５を溜めるための樹脂溜まり部５２となる。 FIG. 8 is a view showing a first modified example related to the molding die 50. As shown in FIG. 8, the elastic member 51A of the molding die 50A is a frame that is integrally formed as a whole. The four corners inside the elastic member 51A have cutouts 52A in which a part of the elastic member 51A is cut out. This notch 52 </ b> A becomes a resin reservoir 52 for storing the resin material 15.
　図９は、樹脂体２２に関する第２変形例を示した図である。図９に示すように、樹脂体２２Ｂの形状は直方体である。この場合でも、弾性部材５１のそれぞれの間に形成された隙間が、樹脂溜まり部５２となる。 FIG. 9 is a view showing a second modified example related to the resin body 22. As shown in FIG. 9, the shape of the resin body 22B is a rectangular parallelepiped. Even in this case, the gap formed between the elastic members 51 becomes the resin reservoir 52.
　図１０は、成形金型５０および樹脂体２２に関する第３変形例を示した図である。図１０に示すように、成形金型５０Ｃの弾性部材５１Ｃの４辺中央には切欠き５２Ｃが設けられている。この切り欠き５２Ｃが、樹脂材料１５を溜めるための樹脂溜まり部５２となる。樹脂体２２Ｃの形状は星型であり、押圧された場合、弾性部材５１Ｃの４つ角に先に樹脂材料１５が充填され、その後、４辺中央の切り欠き５２Ｃに向かって樹脂材料１５が充填される。 FIG. 10 is a view showing a third modified example related to the molding die 50 and the resin body 22. As shown in FIG. 10, a notch 52C is provided at the center of the four sides of the elastic member 51C of the molding die 50C. This notch 52 </ b> C serves as a resin reservoir 52 for storing the resin material 15. The shape of the resin body 22C is a star shape, and when pressed, the resin material 15 is first filled into the four corners of the elastic member 51C, and then the resin material 15 is filled toward the notch 52C at the center of the four sides. Is done.
　図１１は、成形金型５０に関する第４変形例を示した図である。図１１に示すように、成形金型５０Ｄの弾性部材５１Ｄおよび剛体板４４Ｄはリング形状である。弾性部材５１Ｄは角度９０°ごとに切り欠き５２Ｄを有している。この切り欠き５２Ｄが、樹脂材料１５を溜めるための樹脂溜まり部５２となる。 FIG. 11 is a view showing a fourth modified example related to the molding die 50. As shown in FIG. 11, the elastic member 51D and the rigid plate 44D of the molding die 50D have a ring shape. The elastic member 51D has a notch 52D at every 90 ° angle. This notch 52D becomes a resin reservoir 52 for storing the resin material 15.
　［第４実施形態］
　第４実施形態は、第１実施形態で示した弾性部材および剛体板の両方に、余剰の樹脂材料１５を溜める機能を設けた実施形態である。なお、第１実施形態と共通する構成については詳しい説明を省略する。 [Fourth Embodiment]
In the fourth embodiment, both the elastic member and the rigid plate shown in the first embodiment are provided with a function of storing excess resin material 15. Detailed description of the configuration common to the first embodiment is omitted.
　図１２から図１４は、成形金型６０内での樹脂体２２の様子を順に示した図であり、それぞれ平面図を（Ａ）に、正面図を（Ｂ）の箇所に表している。なお、図１２（Ａ）は、図１２（Ｂ）に対するＺ３－Ｚ３断面であり、図１２（Ｂ）は、図１２（Ａ）に対するＹ３－Ｙ３断面である。図１２（Ａ）では理解を容易にするため樹脂体２２の形状を円柱とし、また、保護フィルム１２Ａを省略して描いている。以下、図１３、図１４も同様である。 FIGS. 12 to 14 are views sequentially showing the state of the resin body 22 in the molding die 60, and a plan view and a front view thereof are shown in FIG. 12A and FIG. 12A is a Z3-Z3 cross section with respect to FIG. 12B, and FIG. 12B is a Y3-Y3 cross section with respect to FIG. 12A. In FIG. 12A, for easy understanding, the shape of the resin body 22 is a cylinder, and the protective film 12A is omitted. The same applies to FIGS. 13 and 14 below.
　図１２（Ａ）および図１２（Ｂ）に示すとおり、成形金型６０は上下１対の押圧板４３、４５と、押圧板４３の外周に配置される剛体板６２と、剛体板６２の内側に配置される弾性部材５１と、により構成される。上記に示す構成により、１対の押圧板４３、４５と弾性部材５１で樹脂体２２を囲む空間４６が形成される。なお、第４実施形態でも、空間４６内において１対の保護フィルム１２Ａ、１２Ｂが挿入され、樹脂体２２を包むように囲むフィルム内領域４７が形成される。 12A and 12B, the molding die 60 includes a pair of upper and lower pressing plates 43 and 45, a rigid plate 62 disposed on the outer periphery of the pressing plate 43, and an inner side of the rigid plate 62. And an elastic member 51 disposed on the surface. With the configuration described above, a space 46 surrounding the resin body 22 is formed by the pair of pressing plates 43 and 45 and the elastic member 51. In the fourth embodiment, a pair of protective films 12 </ b> A and 12 </ b> B are inserted in the space 46 to form an in-film region 47 that surrounds the resin body 22.
　第４実施形態では、４角柱の４つの弾性部材５１が、樹脂体２２を囲むように、それぞれ隙間をあけて配置されている。換言すれば、枠体形状となっている弾性部材５１の４つ角には、樹脂体２２側の面から剛体板６２の面に向けて貫通した切り欠きが形成されている。この切り欠きが、余剰の樹脂材料１５を溜めるための第１樹脂溜まり部６３となる。 In the fourth embodiment, the four elastic members 51 of the quadrangular prism are arranged with a gap so as to surround the resin body 22. In other words, notches penetrating from the surface on the side of the resin body 22 toward the surface of the rigid plate 62 are formed at the four corners of the elastic member 51 having a frame shape. This notch serves as a first resin reservoir 63 for storing excess resin material 15.
　更に第４実施形態では、剛体板６２の内側に沿って切り欠きが形成されている。この切り欠きは、第１樹脂溜まり部６３と連通しており、樹脂材料１５を溜めるための第２樹脂溜まり部６４となる。第１および第２樹脂溜まり部６３、６４により、成形金型６０内に投入できる樹脂量の許容幅を更に広げることができる。 Furthermore, in the fourth embodiment, a notch is formed along the inside of the rigid plate 62. This notch communicates with the first resin reservoir 63 and becomes the second resin reservoir 64 for storing the resin material 15. The first and second resin reservoirs 63 and 64 can further widen the allowable width of the amount of resin that can be charged into the molding die 60.
　図１３（Ａ）および図１３（Ｂ）に示すとおり、押圧工程により延ばされた樹脂体２２の樹脂材料１５は、弾性部材５１の内側の４辺中央に到達し、弾性部材５１により堰き止められる。堰き止められた樹脂材料１５は、弾性部材５１の４つ角に向かって流動する。 As shown in FIGS. 13A and 13B, the resin material 15 of the resin body 22 extended by the pressing process reaches the center of the four sides inside the elastic member 51 and is dammed by the elastic member 51. It is done. The dammed resin material 15 flows toward the four corners of the elastic member 51.
　図１４（Ａ）および図１４（Ｂ）に示すように、成形金型６０の押圧、充填工程が進行すると、樹脂材料１５は弾性部材５１の第１樹脂溜まり部６３に入り込み、更に第１樹脂溜まり部６３を通って第２樹脂溜まり部６４の一部に入り込む。これにより、図１４（Ａ）に示すような樹脂材料１５の余剰分６５を４つ角に有する封止用樹脂シート１１が成形される。なお、作製された封止用樹脂シート１１は、余剰分６５が切断により除去された後、電子部品モジュールの製造に使用される。 As shown in FIGS. 14A and 14B, when the pressing and filling process of the molding die 60 proceeds, the resin material 15 enters the first resin reservoir 63 of the elastic member 51, and further the first resin. Part of the second resin reservoir 64 passes through the reservoir 63. Thereby, the resin sheet 11 for sealing which has the surplus 65 of the resin material 15 as shown to FIG. 14 (A) in four corners is shape | molded. In addition, the produced resin sheet 11 for sealing is used for manufacture of an electronic component module, after the excess part 65 is removed by cutting | disconnection.
　第４実施形態では、余剰の樹脂材料１５を第１および第２樹脂溜まり部６３、６４に溜めるので、第１および第２樹脂溜まり部６３、６４の体積に相当する樹脂材料１５を更に余分に収容できる。したがって、樹脂体２２の体積が成形金型６００内の容積より大きい場合であっても、問題なく封止用樹脂シート１１を成形することができる。 In the fourth embodiment, since the surplus resin material 15 is accumulated in the first and second resin reservoirs 63 and 64, the resin material 15 corresponding to the volume of the first and second resin reservoirs 63 and 64 is further added. Can be accommodated. Therefore, even if the volume of the resin body 22 is larger than the volume in the molding die 600, the sealing resin sheet 11 can be molded without any problem.
　［第５実施形態］
　第５実施形態は、第１実施形態で示した弾性部材を撓ませることにより、余剰の樹脂材料１５を収容することのできる実施形態である。なお、第１実施形態と共通する構成については詳しい説明を省略する。 [Fifth Embodiment]
5th Embodiment is embodiment which can accommodate the excess resin material 15 by bending the elastic member shown in 1st Embodiment. Detailed description of the configuration common to the first embodiment is omitted.
　図１５および図１６は、成形金型７０内での樹脂体２２の様子を示した図であり、それぞれ平面図を（Ａ）に、正面図を（Ｂ）の箇所に表している。なお、図１５（Ａ）は、図１５（Ｂ）に対するＺ６－Ｚ６断面であり、図１５（Ｂ）は、図１５（Ａ）に対するＹ６－Ｙ６断面である。図１５（Ａ）においては、理解を容易にするため樹脂体２２の形状を円柱とし、また、保護フィルム１２Ａを省略して描いている。以下、図１６も同様である。 FIG. 15 and FIG. 16 are views showing the state of the resin body 22 in the molding die 70. The plan view is shown in (A) and the front view is shown in (B). 15A is a Z6-Z6 cross section with respect to FIG. 15B, and FIG. 15B is a Y6-Y6 cross section with respect to FIG. 15A. In FIG. 15 (A), the resin body 22 has a cylindrical shape for easy understanding, and the protective film 12A is omitted. The same applies to FIG.
　図１５（Ａ）および図１５（Ｂ）に示すように、成形金型７０は上下１対の押圧板４３、４５と、押圧板４３の外周に配置される剛体板７１と、剛体板７１の内側に配置される弾性部材４８と、により構成される。上記に示す構成により、１対の押圧板４３、４５と弾性部材４８で樹脂体２２を囲む空間４６が形成される。なお、第５実施形態でも、空間４６内において１対の保護フィルム１２Ａ、１２Ｂが挿入され、樹脂体２２を包むように囲むフィルム内領域４７が形成される。 As shown in FIGS. 15A and 15B, the molding die 70 includes a pair of upper and lower pressing plates 43 and 45, a rigid plate 71 arranged on the outer periphery of the pressing plate 43, and a rigid plate 71. And an elastic member 48 disposed inside. With the configuration described above, a space 46 surrounding the resin body 22 is formed by the pair of pressing plates 43 and 45 and the elastic member 48. Also in the fifth embodiment, a pair of protective films 12 </ b> A and 12 </ b> B are inserted in the space 46 to form an in-film region 47 that surrounds the resin body 22.
　封止用樹脂シート１１の材料となる樹脂体２２の体積は、通常は、ある程度のばらつきがある。そのばらつきにより樹脂体２２の体積が成形金型７０内の容積より大ければ、成形時に余剰の樹脂材料１５が発生する。 The volume of the resin body 22 that is the material of the sealing resin sheet 11 usually varies to some extent. If the volume of the resin body 22 is larger than the volume in the molding die 70 due to the variation, excess resin material 15 is generated during molding.
　第５実施形態では、剛体板７１に、剛体板７１の内周に沿って切り欠かれた逃げ溝７２が形成されている。この逃げ溝７２があることにより、成形金型７０内に投入される樹脂体２２の体積のばらつきを許容することができる。 In the fifth embodiment, the rigid plate 71 is formed with a relief groove 72 cut out along the inner periphery of the rigid plate 71. The presence of the escape groove 72 allows a variation in the volume of the resin body 22 put into the molding die 70.
　図１６（Ａ）および図１６（Ｂ）に示すように、封止樹脂シート１１の成形後においては、余剰の樹脂材料１５が弾性部材４８を側方へ押圧することになる。樹脂材料１５を介して伝わる押圧力により、弾性部材４８は剛体板７１の逃げ溝７２側に撓み、弾性部材３８の４辺に外向きの膨らみ７３ができる。これにより、膨らんだ分の体積の樹脂材料１５を余分に収容でき、樹脂体２２の体積が成形金型７０内の容積より多少大きい場合であっても、問題なく封止用樹脂シート１１を成形することができる。 16A and 16B, after molding the sealing resin sheet 11, the excess resin material 15 presses the elastic member 48 to the side. Due to the pressing force transmitted through the resin material 15, the elastic member 48 is bent toward the escape groove 72 of the rigid plate 71, and outward bulges 73 are formed on the four sides of the elastic member 38. As a result, the resin material 15 of the swelled volume can be accommodated in excess, and even when the volume of the resin body 22 is slightly larger than the volume in the molding die 70, the sealing resin sheet 11 is molded without any problem. can do.
　また、作製された封止用樹脂シート１１は４辺が外向きに膨らむが、ほぼ四角形状をしているので、そのままの状態で電子部品モジュールの製造に使用することができる。 Also, the produced sealing resin sheet 11 bulges outward on its four sides, but has a substantially rectangular shape, and can be used for manufacturing an electronic component module as it is.
　［第６実施形態］
　第６実施形態は、第１実施形態で示した押圧板に凹部を設けた実施形態である。なお、第１実施形態と共通する構成については詳しい説明を省略する。 [Sixth Embodiment]
6th Embodiment is embodiment which provided the recessed part in the press plate shown in 1st Embodiment. Detailed description of the configuration common to the first embodiment is omitted.
　図１７に示すとおり、成形金型８０は上下１対の押圧板８１、４５と側方の剛体板４４と、剛体板４４の内側に配置される弾性部材８３と、により構成される。 17, the molding die 80 includes a pair of upper and lower pressing plates 81 and 45, a side rigid plate 44, and an elastic member 83 disposed inside the rigid plate 44.
　第６実施形態は、下側の押圧板８１に溝状の凹部８２を形成し、弾性部材８３が、凹部８２に嵌められた状態で配置される。仮に、平らな押圧板８１の上に弾性部材８３を置いたままだと、押圧板８１、４５から押圧力を受けたときに弾性部材８３が変形し、初期に配置した位置からずれてしまう可能性がある。第６実施形態では、弾性部材８３が押圧板８１の凹部８２に嵌められた状態で配置されることにより、上記のような位置ずれを防止できる。 6th Embodiment forms the groove-shaped recessed part 82 in the lower press board 81, and the elastic member 83 is arrange | positioned in the state fitted by the recessed part 82. FIG. If the elastic member 83 is left on the flat pressing plate 81, the elastic member 83 may be deformed when it receives a pressing force from the pressing plates 81 and 45, and may be displaced from the initial position. There is. In the sixth embodiment, the elastic member 83 is arranged in a state of being fitted in the concave portion 82 of the pressing plate 81, so that the above-described positional deviation can be prevented.
　図１８は、弾性部材の断面を楕円形状にした変形例である。押圧板８１Ａの凹部８２Ａはテーパ溝であり、そこに楕円形状の弾性部材８３Ａの下半分以上が嵌め込まれた状態で配置される。これにより、弾性部材８３Ａの位置ずれのみならず、弾性部材８３Ａが凹部８２Ａから抜けることを防止できる。 FIG. 18 shows a modification in which the cross section of the elastic member is elliptical. The concave portion 82A of the pressing plate 81A is a tapered groove, and is arranged in a state in which the lower half or more of the elliptical elastic member 83A is fitted therein. Thereby, not only the displacement of the elastic member 83A but also the elastic member 83A can be prevented from coming out of the recess 82A.
　なお、弾性部材８３Ａの断面は楕円形状とする代わりに円形状とすることもできる。弾性部材８３Ａの断面を円形状とすれば、市販されているゴム製のパッキンを使用することができる。 Note that the cross section of the elastic member 83A may be circular instead of elliptical. If the cross section of the elastic member 83A is circular, a commercially available rubber packing can be used.
１１：封止用樹脂シート
１２Ａ、１２Ｂ：保護フィルム
１５：樹脂材料
２２：樹脂体
３０：製造装置
３１：受圧板
３２：加圧板
３３Ａ、３３Ｂ：加熱機構
３４：加圧機構
３５：ベース板
３６：天板
３７：支柱
３８：真空機構
４０、５０、６０、７０、８０：成形金型
４３、４５、８１：押圧板
４４、６２、７１：剛体板
４６：空間
４７：フィルム内領域
４８、５１、８３：弾性部材 11: Sealing resin sheet 12A, 12B: Protective film 15: Resin material 22: Resin body 30: Manufacturing apparatus 31: Pressure receiving plate 32: Pressure plate 33A, 33B: Heating mechanism 34: Pressure mechanism 35: Base plate 36: Top plate 37: Support column 38: Vacuum mechanism 40, 50, 60, 70, 80: Molding dies 43, 45, 81: Press plates 44, 62, 71: Rigid plate 46: Space 47: In- film regions 48, 51, 83: Elastic member

Claims (12)

  1. 　基板上に搭載された複数の電子部品を絶縁封止するための封止用樹脂シートの製造装置であって、
    　絶縁性の樹脂材料により構成される半硬化状態の樹脂体から封止用樹脂シートを成形するための空間を規定する成形金型と、
    　前記樹脂体を前記樹脂体の硬化温度より低い温度で加熱するための加熱機構と、
    　前記成形金型内を真空引きするための真空機構と、
    　前記樹脂体を押圧し前記成形金型内に前記樹脂材料を充填するための加圧機構と、を有し、
    　前記成形金型は、
    　前記押圧機構からの押圧力により前記樹脂体を押圧し封止用樹脂シートを成形するための１対の押圧板と、
    　前記１対の押圧板の間に配置され成形後の封止用樹脂シートの厚みを設定するための剛体板と、
    　前記剛体板の内側において前記樹脂体を囲むように前記１対の押圧板の間に配置され、
    　前記剛体板の厚みよりも厚みが大きく、前記押圧板からの押圧力により変形可能な弾性部材と、
    　により構成されることを特徴とする封止用樹脂シートの製造装置。     An apparatus for producing a sealing resin sheet for insulatingly sealing a plurality of electronic components mounted on a substrate,
    A molding die that defines a space for molding a sealing resin sheet from a semi-cured resin body composed of an insulating resin material;
    A heating mechanism for heating the resin body at a temperature lower than the curing temperature of the resin body;
    A vacuum mechanism for evacuating the inside of the molding die;
    A pressure mechanism for pressing the resin body and filling the molding material with the resin material,
    The molding die is
    A pair of pressing plates for pressing the resin body with a pressing force from the pressing mechanism to form a sealing resin sheet;
    A rigid plate arranged between the pair of pressing plates to set the thickness of the molded resin sheet after molding;
    Arranged between the pair of pressing plates so as to surround the resin body inside the rigid plate,
    An elastic member having a thickness larger than the thickness of the rigid plate and deformable by a pressing force from the pressing plate;
    The manufacturing apparatus of the resin sheet for sealing characterized by comprising by these.
  2. 　前記弾性部材は、前記樹脂体側の面から前記剛体板の方向に向けて切り欠かれた樹脂溜まり部を有することを特徴とする請求項１に記載された封止用樹脂シートの製造装置。 2. The sealing resin sheet manufacturing apparatus according to claim 1, wherein the elastic member has a resin reservoir portion cut out from a surface on the resin body side toward the rigid plate.
  3. 　前記弾性部材は、前記樹脂体側の面から前記剛体板の面に貫通した第１樹脂溜まり部を有し、
    　前記剛体板は、前記第１樹脂溜まり部と連通し前記剛体板の内側に切り欠かれた第２樹脂溜まり部を有することを特徴とする請求項１に記載された封止用樹脂シートの製造装置。     The elastic member has a first resin reservoir portion penetrating from the surface on the resin body side to the surface of the rigid plate,
    2. The resin sheet for sealing according to claim 1, wherein the rigid plate has a second resin reservoir portion that communicates with the first resin reservoir portion and is cut out inside the rigid plate. apparatus.
  4. 　前記剛体板は、内周に沿って切り欠かれた逃げ溝を有することを特徴とする請求項１に記載された封止用樹脂シートの製造装置。 2. The apparatus for producing a sealing resin sheet according to claim 1, wherein the rigid plate has a relief groove cut out along an inner periphery.
  5. 　前記押圧板は、前記樹脂体を押圧する面に凹部を有し、
    　前記弾性部材は、前記凹部に嵌められた状態で配置されることを特徴とする請求項１ないし４のいずれか１項に記載された封止用樹脂シートの製造装置。     The pressing plate has a recess on a surface that presses the resin body,
    The said elastic member is arrange | positioned in the state fitted by the said recessed part, The manufacturing apparatus of the resin sheet for sealing described in any one of Claim 1 thru | or 4 characterized by the above-mentioned.
  6. 　基板上に搭載された複数の電子部品を絶縁封止するための封止用樹脂シートの製造方法であって、
    　絶縁性の樹脂材料により構成される半硬化状態の樹脂体と、前記樹脂体を押圧して封止用樹脂シートを成形するための１対の押圧板と、成形後の封止用樹脂シートの厚みを設定するための剛体板と、前記剛体板の厚みより厚みが大きく前記押圧板からの押圧力により変形可能な弾性部材と、を準備する準備工程と、
    　前記樹脂体を前記１対の押圧板の間に配置し、前記剛体板を前記１対の押圧板の間に配置し、前記弾性部材を前記剛体板の内側において前記樹脂体を囲むように前記１対の押圧板の間に配置し、これら前記１対の押圧板および前記弾性部材により前記樹脂体を囲む空間を形成する空間形成工程と、
    　前記空間内を真空引きする減圧工程と、
    　前記樹脂体を前記樹脂体の硬化温度より低い温度で加熱する加熱工程と、
    　前記弾性部材および前記剛体板を前記押圧板により押圧するとともに、前記樹脂体を前記押圧板により押圧する押圧工程と、
    　前記樹脂体を押圧して延ばすことにより、前記空間内に前記樹脂材料を充填する充填工程と、
    　を有することを特徴とする封止用樹脂シートの製造方法。     A method of manufacturing a sealing resin sheet for insulatingly sealing a plurality of electronic components mounted on a substrate,
    A semi-cured resin body made of an insulating resin material, a pair of pressing plates for pressing the resin body to form a sealing resin sheet, and a sealing resin sheet after molding A preparation step of preparing a rigid plate for setting a thickness, and an elastic member having a thickness larger than the thickness of the rigid plate and deformable by a pressing force from the pressing plate;
    The resin body is disposed between the pair of pressing plates, the rigid plate is disposed between the pair of pressing plates, and the elastic member is disposed inside the rigid plate so as to surround the resin body. A space forming step that is arranged between the plates and forms a space surrounding the resin body by the pair of pressing plates and the elastic member;
    A decompression step of evacuating the space;
    A heating step of heating the resin body at a temperature lower than the curing temperature of the resin body;
    A pressing step of pressing the elastic member and the rigid plate with the pressing plate, and pressing the resin body with the pressing plate;
    Filling the resin material into the space by pressing and extending the resin body; and
    The manufacturing method of the resin sheet for sealing characterized by having.
  7. 　前記押圧工程において、前記弾性部材を前記押圧板の押圧により変形させ、
    　前記充填工程において、前記樹脂材料を、前記弾性部材と前記押圧板の間で堰き止めることを特徴とする請求項６に記載された封止用樹脂シートの製造方法。     In the pressing step, the elastic member is deformed by pressing the pressing plate,
    The method for producing a sealing resin sheet according to claim 6, wherein in the filling step, the resin material is dammed between the elastic member and the pressing plate.
  8. 　前記準備工程で、成形後の封止用樹脂シートの主面を保護するための１対の保護フィルムを準備し、
    　前記空間形成工程で、前記樹脂体の底面から前記弾性部材および前記剛体板の上面を通るように一方の保護フィルムを配置し、かつ、前記樹脂体の上面および前記一方の保護フィルムと向かい合うように他方の保護フィルムを配置することにより、前記一方および前記他方の保護フィルムにより前記樹脂体を囲むフィルム内領域を形成し、
    　前記減圧工程で、前記フィルム内領域を真空引きし、
    　前記充填工程で、前記樹脂体を前記保護フィルムの面方向に延ばし、前記樹脂材料を前記フィルム内領域に充填することを特徴とする請求項６または７に記載された封止用樹脂シートの製造方法。     In the preparation step, a pair of protective films for protecting the main surface of the molded resin sheet after molding is prepared,
    In the space forming step, one protective film is disposed so as to pass from the bottom surface of the resin body to the upper surface of the elastic member and the rigid plate, and so as to face the upper surface of the resin body and the one protective film. By disposing the other protective film, an area in the film surrounding the resin body is formed by the one and the other protective film,
    In the depressurization step, the area in the film is evacuated,
    The resin sheet for sealing according to claim 6 or 7, wherein, in the filling step, the resin body is extended in a surface direction of the protective film, and the resin material is filled in a region in the film. Method.
  9. 　前記弾性部材は、前記樹脂体側の面から前記剛体板の方向に向けて切り欠かれた樹脂溜まり部を有し、
    　前記充填工程において、前記樹脂材料を前記樹脂溜まり部に入り込ませることを特徴とする請求項６ないし８のいずれか１項に記載された封止用樹脂シートの製造方法。     The elastic member has a resin reservoir cut out from the surface on the resin body side toward the rigid plate,
    The method for producing a sealing resin sheet according to any one of claims 6 to 8, wherein, in the filling step, the resin material enters the resin reservoir.
  10. 　前記弾性部材は、前記樹脂体側の面から前記剛体板側の面に貫通した第１樹脂溜まり部を有し、
    　前記剛体板は、前記第１樹脂溜まり部と連通し前記剛体板の内側に切り欠かれた第２樹脂溜まり部を有し、
    　前記充填工程において、前記樹脂材料を、前記第１樹脂溜まり部を通って前記第２樹脂溜まり部に入り込ませることを特徴とする請求項６ないし８のいずれか１項に記載された封止用樹脂シートの製造方法。     The elastic member has a first resin reservoir portion penetrating from a surface on the resin body side to a surface on the rigid plate side,
    The rigid plate has a second resin reservoir portion that is in communication with the first resin reservoir portion and is notched inside the rigid plate;
    9. The sealing according to claim 6, wherein in the filling step, the resin material is allowed to enter the second resin reservoir through the first resin reservoir. Manufacturing method of resin sheet.
  11. 　前記剛体板は、内周に沿って切り欠かれた逃げ溝を有し、
    　前記充填工程において、前記樹脂材料を介して伝わる押圧力により、前記弾性部材を前記逃げ溝側に撓ませることを特徴とする請求項６ないし８のいずれか１項に記載された封止用樹脂シートの製造方法。     The rigid plate has a relief groove cut out along the inner periphery,
    The sealing resin according to any one of claims 6 to 8, wherein, in the filling step, the elastic member is bent toward the escape groove by a pressing force transmitted through the resin material. Sheet manufacturing method.
  12. 　前記押圧板は、前記樹脂体を押圧する面に凹部を有し、
    　前記弾性部材は、前記凹部に嵌められた状態で配置されることを特徴とする請求項６ないし１１のいずれか１項に記載された封止用樹脂シートの製造方法。     The pressing plate has a recess on a surface that presses the resin body,
    The method for producing a sealing resin sheet according to any one of claims 6 to 11, wherein the elastic member is disposed in a state of being fitted in the recess.
PCT/JP2013/054127 2012-03-16 2013-02-20 Device for producing sealing resin sheet and method for producing sealing resin sheet WO2013136926A1 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017170729A (en) * 2016-03-23 2017-09-28 パナソニックＩｐマネジメント株式会社 Production method of molded article
GB2589655A (en) * 2019-05-21 2021-06-09 Airbus Defence & Space Gmbh Pressure plate arrangement, production arrangement, device and method for producing a transition region between aerodynamic profile elements
JP2021159856A (en) * 2020-03-31 2021-10-11 株式会社テクノラボ Resin molding production method and resin molding

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015046573A (en) * 2013-07-31 2015-03-12 日東電工株式会社 Attachment jig and method for manufacturing electronic device
CN106356437B (en) * 2016-09-30 2019-07-26 广东晶科电子股份有限公司 A kind of white light LED packaging device and preparation method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05291322A (en) * 1992-04-07 1993-11-05 Toshiba Corp Manufacturing for sealing resin sheet and resin sealing-type semiconductor device
JPH08168999A (en) * 1994-12-16 1996-07-02 Toshiba Chem Corp Manufacture of semiconductor-sealing resin sheet
JP2012054363A (en) * 2010-08-31 2012-03-15 Kyocera Chemical Corp Sealing method of electronic component

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0966523A (en) * 1995-08-30 1997-03-11 Toshiba Chem Corp Manufacture of semiconductor sealing resin molding
JP3795790B2 (en) * 2001-10-26 2006-07-12 株式会社サイネックス Resin sealing method
JP2006256195A (en) * 2005-03-18 2006-09-28 Towa Corp Compression-molding method of electronic component and resin material
JP5382693B2 (en) * 2009-02-04 2014-01-08 アピックヤマダ株式会社 Compression molding method
JP5055326B2 (en) * 2009-06-29 2012-10-24 Ｔｏｗａ株式会社 Resin sealing mold and resin sealing method
JP5203317B2 (en) * 2009-08-06 2013-06-05 住友重機械工業株式会社 Compression molding sealing device
JP5385886B2 (en) * 2010-11-02 2014-01-08 Ｔｏｗａ株式会社 Resin sealing molding method and apparatus for electric circuit parts

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05291322A (en) * 1992-04-07 1993-11-05 Toshiba Corp Manufacturing for sealing resin sheet and resin sealing-type semiconductor device
JPH08168999A (en) * 1994-12-16 1996-07-02 Toshiba Chem Corp Manufacture of semiconductor-sealing resin sheet
JP2012054363A (en) * 2010-08-31 2012-03-15 Kyocera Chemical Corp Sealing method of electronic component

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017170729A (en) * 2016-03-23 2017-09-28 パナソニックＩｐマネジメント株式会社 Production method of molded article
GB2589655A (en) * 2019-05-21 2021-06-09 Airbus Defence & Space Gmbh Pressure plate arrangement, production arrangement, device and method for producing a transition region between aerodynamic profile elements
GB2589655B (en) * 2019-05-21 2021-12-22 Airbus Defence & Space Gmbh Pressure plate arrangement, production arrangement, device and method for producing a transition region between aerodynamic profile elements
US11946264B2 (en) 2019-05-21 2024-04-02 Airbus Defence and Space GmbH Pressure plate arrangement, production arrangement, device and method for producing a transition region between aerodynamic profile elements
JP2021159856A (en) * 2020-03-31 2021-10-11 株式会社テクノラボ Resin molding production method and resin molding
JP7026408B2 (en) 2020-03-31 2022-02-28 株式会社テクノラボ Resin molded product manufacturing method and resin molded product

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