KR101015586B1 - Apparatus for molding a electronic device - Google Patents

Abstract

The illustrated electronic component molding apparatus includes a lower mold, an upper mold and a clamping member. The lower mold is a cavity having a lower support, a lower die having an upper surface disposed on the lower support and covered by a release film, and inner surfaces surrounding the lower die and defining a cavity with an upper surface of the lower die. And a lower tube disposed to enclose the cavity member and elastically supported on the lower support. The upper die includes an upper die to which the electronic component is fixed and defines a space for molding the electronic component together with the lower die and the cavity member. The clamping member includes a lower clamp disposed on the lower tube and an upper clamp disposed between the release film and the upper mold and movably disposed to clamp the release film supplied by the film supply.

Description

Electronic component molding device {APPARATUS FOR MOLDING A ELECTRONIC DEVICE}

The present invention relates to a molding apparatus for an electronic component. More specifically, the present invention relates to an electronic component molding apparatus for molding an electronic component with a resin in a cavity using a release film.

The packaging process in the manufacturing process of a semiconductor device means sealing-molding the semiconductor chip mounted in the board | substrate using resin. In the said resin sealing molding, the electronic component molding apparatus provided with the metal mold | die which provides the resin sealing molding space of an electronic component, and a release film is used. Conventional electronic molding apparatus includes a release film supply unit for supplying a release film to the upper and lower molds while applying a constant tension to the mold and the release film consisting of the upper and lower molds. The lower mold is provided with a cavity filled with a resin. The electronic component is contained in a cavity filled with a resin so that the electronic component is resin molded. In addition, a release film may be coated on the cavity inner surfaces. Accordingly, the electronic component can be easily separated from the lower mold by molding an electronic component using a resin and then separating a release film from the cavity surfaces.

However, voids may occur in the resin when air remains in the cavity. In addition, when air remains in the cavity, the liquid resin may be prevented from flowing uniformly throughout the cavity. Accordingly, a conventional electronic component molding apparatus performs a vacuum molding process of molding an electronic component in a state in which a resin is filled in the cavity and vacuum evacuated inside the cavity. However, when molding the electronic component in the vacuum evacuation state in the cavity, a phenomenon may occur that is partially separated from the inner surface of the cavity of the release film.

Accordingly, in order to prevent the release film from deviating from the inner surface of the cavity in the vacuum molding process, Korean Patent Publication No. 2006-0052812 discloses not only the upper and lower molds but also the intermediate and the side and bottom surfaces of the cavity. A method of fixing a release film to cover is disclosed. According to the Republic of Korea Patent Publication No. 2006-0052812, a release film is sandwiched between the lower mold and the intermediate mold and the release film covers the cavity. Therefore, the phenomenon in which the release film attached to the cavity inner surface is partially separated from the cavity inner surface during the vacuum molding process by evacuating the inside of the cavity may be suppressed.

However, in the case of a mold used for resin sealing of electronic components disclosed in the Republic of Korea Patent Publication No. 2006-0052812, the time and cost required for the manufacture of the molding apparatus because the structure of the upper mold, intermediate mold and lower mold is very complicated This has a relatively high disadvantage. For this reason, a molding apparatus having a simpler structure is required.

An object of the present invention is to provide an electronic component molding apparatus that can easily clamp a release film and has a simple structure.

Electronic component molding apparatus according to an aspect of the present invention for achieving the above object, a lower support, a vacuum for sucking the release film having a top surface disposed on the lower support and covered by a release film A cavity member having a provided lower die, an inner surface surrounding the lower die and defining a cavity with an upper surface of the lower die, and disposed to enclose the cavity member and being elastically supported on the lower support. A lower mold including a lower tube, an upper mold including an upper die to which the electronic component is fixed and defining a space for molding the electronic component together with the lower die and the cavity member, and disposed on the lower tube. A lower clamp and an image disposed between the release film and the upper mold to clamp the release film Toward the lower clamp it may include a clamping member including an upper clamp movably disposed.

According to embodiments of the present invention, the upper mold may further include an upper tube disposed to surround the upper support and the upper die, and the upper die and the upper tube may be disposed on the lower surface of the upper support. have.

According to embodiments of the present disclosure, the electronic component molding apparatus may include a first sealing member interposed between the lower support and the lower tube, a second sealing member interposed between the lower clamp and the upper clamp, and the upper clamp. It may further include a third sealing member interposed between the upper tube, by the upper support, the upper tube, the upper clamp, lower clamp, lower tube, lower support and the first, second and third sealing members An enclosed space may be formed to accommodate the upper die, the cavity member, and the lower die.

According to embodiments of the present disclosure, the electronic component molding apparatus may further include a driving unit for moving the upper mold or the lower mold to form the sealed space.

According to the embodiments of the present disclosure, the electronic component molding apparatus may further include an elastic member to elastically support the cavity member on the lower support.

According to embodiments of the present disclosure, the electronic component molding apparatus may further include a driving unit for moving the upper clamp to clamp the release film and to close the clamped release film to an upper portion of the cavity member. .

According to embodiments of the present invention, lower recesses may be formed in lower surface portions of the lower tube, and the lower tube is disposed on the lower support by elastic members partially inserted into the lower recesses. It can be elastically supported.

According to embodiments of the present invention, guide holes connected to the lower recesses are formed through the lower tube. The electronic component molding apparatus may further include lower guide members disposed on the lower support to be inserted into the guide holes through the elastic members and to guide the lower tube in a vertical direction.

According to embodiments of the present invention, upper recesses are formed in upper surface portions of the lower tube. The electronic component molding apparatus includes pistons disposed in the upper recesses, upper guide members extending downward from the lower surface of the upper clamp and connected to the pistons through the lower clamp, and the upper recess. It may further include an elastic member disposed in the reel to elastically support the piston.

According to embodiments of the present disclosure, the electronic component molding apparatus may further include a film supply unit supplying the release film between the lower mold and the upper mold.

According to the embodiments of the present invention as described above, the lower tube may be elastically supported on the lower support, the lower clamp may be disposed on the lower tube. The upper clamp may be disposed on the lower clamp, and the release film can be easily clamped by the downward movement of the upper clamp. In addition, since the electronic component molding apparatus according to the embodiments of the present invention has a clamping member having a simplified structure, manufacturing cost may be reduced.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. However, the present invention should not be construed as limited to the embodiments described below and may be embodied in various other forms. The following examples are provided to fully convey the scope of the invention to those skilled in the art, rather than to allow the invention to be fully completed.

When an element is described as being disposed or connected on another element or layer, the element may be placed or connected directly on the other element, and other elements or layers may be placed therebetween. It may be. Alternatively, where one element is described as being directly disposed or connected on another element, there may be no other element between them. Similar reference numerals will be used throughout for similar elements, and the term “and / or” includes any one or more combinations of related items.

Terms such as first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or parts, but the items are not limited by these terms. Will not. These terms are only used to distinguish one element from another. Accordingly, the first element, composition, region, layer or portion described below may be represented by the second element, composition, region, layer or portion without departing from the scope of the invention.

Spatially relative terms such as "bottom" or "bottom" and "top" may be used to describe the relationship of an element to other elements as described in the figures. Relative terms may include other orientations of the device in addition to the orientation shown in the figures. For example, if the device is reversed in one of the figures, the elements described as being on the lower side of the other elements will be tailored to being on the upper side of the other elements. Thus, the typical term "bottom" may include both "bottom" and "top" orientations for a particular orientation in the figures. Similarly, if the device is reversed in one of the figures, the elements described as "below" or "below" of the other elements will be fitted "above" of the other elements. Thus, a typical term "below" or "below" may encompass both orientations of "below" and "above."

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used below, what is shown in the singular also includes the plural unless specifically indicated otherwise. In addition, where the term "comprises" or "comprising" is used, it is characterized by the presence of the forms, regions, integrals, steps, actions, elements and / or components mentioned, and other It is not intended to exclude the addition of one or more forms, regions, integrals, steps, actions, elements, components, and / or groups thereof.

Unless defined otherwise, all terms including technical and scientific terms have the same meaning as would be understood by one of ordinary skill in the art having ordinary skill in the art. Such terms, such as those defined in conventional dictionaries, shall be construed as having meanings consistent with the meanings thereof in the context of the related art and the description of the invention, and ideally or excessively intuition unless otherwise specified. Will not be interpreted.

Embodiments of the invention are described with reference to cross-sectional illustrations that are schematic illustrations of ideal embodiments of the invention. Accordingly, changes from the shapes of the illustrations, such as changes in manufacturing methods and / or tolerances, are those that can be expected. Accordingly, embodiments of the present invention are not to be described as limited to the particular shapes of the areas described as the illustrations but to include deviations in the shapes. For example, a region described as flat may generally have roughness and / or nonlinear shapes. Also, the sharp edges described as illustrations may be rounded. Accordingly, the regions described in the figures are entirely schematic and their shapes are not intended to describe the precise shapes of the regions and are not intended to limit the scope of the invention.

1 is a schematic configuration diagram illustrating an electronic component molding apparatus according to an exemplary embodiment of the present invention, FIG. 2 is a schematic side view illustrating the electronic component molding apparatus illustrated in FIG. 1, and FIG. It is an expanded sectional view for demonstrating the clamping member and lower tube shown in FIG.

1 to 3, the electronic component molding apparatus 100 according to the exemplary embodiment may include a lower mold 110 and an upper mold 130. The electronic component 10 according to the present invention may include a substrate 12 and at least one semiconductor chip 14 mounted on the substrate 12. The substrate 12 may be a printed circuit board. The semiconductor chip 14 may be mounted on the substrate 12 through a wire bonding process. Alternatively, the semiconductor chip 14 may be mounted on the substrate 12 through a solder reflow process.

The lower mold 110 may include a lower support 112, a lower die 114, a cavity member 116, and a lower tube 118. The lower support 112 may support the lower die 114, the cavity member 116, and the lower tube 118.

The lower die 114 may be disposed on the central portion of the lower support 112, and may form a bottom surface of the cavity 20 for molding the electronic component 10 into a resin, for example, an epoxy resin. It may have an upper surface constituting. In addition, the lower die 114 may have a rectangular block shape. However, the shape of the lower die 114 may vary depending on the shape of the electronic component 10 for resin molding.

The cavity member 116 may be disposed to surround the lower die 114. For example, it may have a ring shape configured to be adjacent to the sides of the lower die 114. In particular, the cavity member 116 may be disposed to protrude upward from the lower die 114, and may have inner surfaces defining the cavity 20 together with the lower die 114. In addition, the cavity member 116 may have an upper portion in close contact with the release film 30 to be described later. Here, the upper portion of the cavity member 116 may be formed to be inclined outward. This is to easily cover the release film 30 on the inner surface and the bottom surface of the cavity 20. Although not shown, a vacuum is applied to the lower die 114 to cover the upper surface of the lower die 114 and the inner surfaces of the cavity member 116 by sucking the release film 30. This may be provided. That is, the lower die 114 may have a plurality of vacuum holes (not shown) for providing the vacuum.

The cavity member 116 may be elastically supported on the lower support 112. This is to ensure that the cavity member 116 is in close contact with the upper die 132 to be described later. For example, first elastic members 120 may be interposed between the lower support 112 and the cavity member 116. Each of the first elastic members 120 may include a spring.

The lower tube 118 may be disposed on the lower support 112 to surround the cavity member 116. The lower tube 118 may have a rectangular tube shape and may be elastically supported on the lower support 112. That is, second elastic members 122 may be interposed between the lower support 112 and the lower tube 118 as shown in FIG. 3. For example, each of the second elastic members 122 may include a spring.

The upper die 130 may include an upper die 132 facing the lower die 114. The upper die 132 may define a space for molding the electronic component 10 together with the lower die 114 and the cavity member 116. That is, the upper die 132 may have a lower surface covering the cavity 20, and the electronic component 10 may be fixed on the lower surface of the upper die 132. For example, the electronic component 10 may be fixed on the lower surface of the upper die 132 by vacuum pressure or a holder (not shown). In this case, the bottom and side surfaces of the cavity 20, that is, the upper surface of the lower die 114 and the inner surfaces of the cavity member 116 may be covered by the release film 30. The molding space may be defined by the surfaces of the release film 30 coated on the lower die 114 and the cavity member 116 and the lower surface of the upper die 132.

In addition, the upper mold 130 may further include an upper support 136 and an upper tube 134. The upper tube 134 may be disposed to surround the upper die 132 and may correspond to the lower tube 118 in a vertical direction. The upper die 132 and the upper tube 134 may be disposed on the lower surface of the upper support 136.

The electronic component molding apparatus 100 may further include a film supply unit for supplying the release film 30 between the lower mold 110 and the upper mold 130. As shown in FIG. 2, the film supply part returns the supply roller 140 for supplying the release film 30 and the part of the release film 30 used after the molding process for the electronic component 10 is completed. The winding roller 142 may be included.

In addition, the electronic component molding apparatus 100 may further include a member 150 for clamping the release film 30. For example, the clamping member 150 may include an upper clamp 152 and a lower clamp 154 disposed in the vertical direction. Each of the upper and lower clamps 152 and 154 may be a plate in the form of a square ring.

The lower clamp 154 may be disposed on the lower tube 118 and extend toward the cavity member 116, and the upper clamp 152 may be disposed on the lower tube 154. May extend toward 116.

The upper clamp 152 may be disposed above the lower clamp 154, and the release film 30 may be disposed between the upper clamp 152 and the lower clamp 154. The upper clamp 152 may have an edge extending outward compared to the lower clamp 154, and may be connected to the first driver 160 as shown. A hydraulic or pneumatic cylinder may be used as the first driving unit 160, and the upper clamp 152 may be moved in the vertical direction to clamp the release film 30.

Referring to FIG. 3, the lower tube 118 is movable in the vertical direction by the second elastic members 122, and guides the vertical movement of the lower tube 118 on the lower support 112. Lower guide members 170 may be disposed in a vertical direction. In addition, the lower tube 118 may be provided with guide holes 172 into which the lower guide members 170 are inserted in the vertical direction through the lower tube 118.

Upper guide members 174 inserted into the guide holes 172 of the lower tube 118 may be disposed on the lower surface of the upper clamp 152, and the upper clamp 152 may include the upper guide members. 174 may be guided in the vertical direction.

The lower tube 118 may have upper recesses 176 and lower recesses 178 corresponding to each other. The guide holes 172 may pass through the lower tube 118 in the vertical direction, and may connect the upper recesses 176 and the lower recesses 178 with each other.

The second elastic members 122 may be partially inserted into the lower recesses 178, and the lower guide members 170 may pass through the guide holes through the second elastic members 122. 172 may be inserted.

In addition, third elastic members 124 may be disposed in the upper recesses 176. For example, springs may be disposed in the upper recesses 176, respectively, and the upper guide members 174 extend downward from the lower surface of the upper clamp 152 and the lower clamp 154. ) And the third elastic members 124 may be inserted into the guide holes 172. In this case, pistons 180 may be mounted on the upper guide members 174 to allow the upper clamp 152 to be elastically supported by the third elastic members 124. That is, the third elastic members 124 and the pistons 180 may be disposed in the upper recesses 176, and the pistons 180 may be disposed in the upper recesses 176. The upper clamp 152 may move in the vertical direction.

However, the upper guide members 174 may extend downward from the lower surface of the upper clamp 152 through the lower clamp 154 and may be connected to the upper portions of the pistons 180. In this case, the upper clamp 152 may be guided by the vertical movement of the pistons 180 in the upper recesses 176, and the third elastic members 124 may be the pistons. It may be disposed in the upper recesses 176 to elastically support 180. That is, the upper guide members 174 may not extend into the guide holes 172.

The release film 30 may be clamped between the upper clamp 152 and the lower clamp 154 by moving the upper clamp 152 toward the lower clamp 154 by the first driver 160. Can be. Subsequently, when the upper clamp 152 and the lower clamp 154 move downward by the first driving unit 160, the clamped release film 30 portion moves downward, and thus the release film 30 may be in close contact with the upper portion of the cavity member 116. Meanwhile, the step of clamping the release film 30 and the step of bringing the clamped release film 30 into close contact with the upper portion of the cavity member 116 may be continuously performed or may be performed stepwise.

As a result, the cavity 20 may be sealed by the release film 30, and the release film 30 may be sealed by the vacuum pressure provided through the lower die 114. Inner surfaces of the lower die 114, that is, the upper surface of the lower die 114 and the inner surfaces of the cavity member 116.

Referring back to FIGS. 1 and 2, a first sealing member 190 may be interposed between the lower support 112 and the lower tube 118, and between the lower clamp 154 and the upper clamp 152. A second sealing member 192 may be interposed therebetween, and a third sealing member 194 may be interposed between the upper clamp 152 and the upper tube 134. As each of the first, second, and third sealing members 190, 192, and 194, an O-ring, a packing, and the like may be used.

Specifically, a first groove (not shown) into which the first sealing member 190 is inserted may be formed in an upper surface portion of the lower support 112, and in an upper surface portion of the lower clamp 154. A second groove (not shown) may be formed into which the second sealing member 192 is inserted, and a third groove (3) into which the third sealing member 194 is inserted is formed at a lower surface portion of the upper tube 134. Not shown) may be formed. However, the first, second and third grooves may be formed in the lower surface portion of the lower tube 118, the lower surface portion of the upper clamp 152 and the upper surface portion of the upper clamp 152, respectively. have. In particular, the first sealing member 190 may be disposed inside the lower guide members 170, and the second sealing member 192 may be disposed outside the upper guide members 174. This is to prevent vacuum leakage from the sealed space to be described later.

The electronic component molding apparatus 100 may further include a second driver (not shown) connected to the lower mold 110 or the upper mold 130 to move the lower mold 110 or the upper mold 130 in the vertical direction. Can be. That is, the second driving unit may move the lower mold 110 or the upper mold 130 in the vertical direction so that the lower mold 110 and the upper mold 130 are in close contact with each other.

When the lower mold 110 and the upper mold 130 are in close contact with each other by the second driving part, the lower support 112, the first sealing member 190, the lower tube 118, the lower clamp 154, and the second A sealing space may be formed by the sealing member 192, the upper clamp 152, the third sealing member 194, the upper tube 134, and the upper support 136, and the sealing space may include the electronic component 10. It may be formed in a vacuum state to remove the defect caused by the air during the molding process of). The vacuum state of the closed space may be achieved by a vacuum system (not shown) connected to the upper mold 130 or the lower mold 110.

A method of molding the electronic component 10 using the electronic component molding apparatus 100 as described above will be described below.

As shown in FIGS. 1 and 2, the release film 30 may be supplied between the lower mold 110 and the upper mold 130 by the supply roller 140 and the winding roller 142.

4 to 7 are schematic configuration diagrams for describing a method of molding an electronic component by using the electronic component molding apparatus illustrated in FIG. 1.

Referring to FIG. 4, the first driving unit 160 may move the upper clamp 152 downward to clamp the release film 30. After the release film 30 is clamped between the upper clamp 152 and the lower clamp 154, the first driving unit 160 continuously moves the upper clamp 152 and the lower clamp 154 downward. You can. Accordingly, the clamped release film 30 may be in close contact with the upper portion of the cavity member 116.

Vacuum pressure may be provided to the inner space of the cavity 20 sealed by the release film 30 through the lower die 114, and thus the release film 30 may be provided in the cavity 20. ) May be coated on the inner surfaces of the upper surface of the lower die 114 and the inner surfaces of the cavity member 116.

Referring to FIG. 5, a substrate 12 on which at least one semiconductor chip 14 is mounted may be transferred below the upper die 132 by a substrate transfer part (not shown), and then the upper die 132. It can be fixed on the bottom surface of the). Here, the electronic component 10 may be fixed by a vacuum pressure or a holder (not shown) provided through the upper die 132.

In addition, a powdery resin material may be supplied to the cavity 20 covered by the release film 30, and the supplied resin material is melted by a heater (not shown) connected to the lower mold 110. Can be. However, the molten resin 40 may be directly supplied into the cavity 20.

Referring to FIG. 6, the lower mold 110 may move upward by the second driving part, and thus the sealed space may be closed by the first, second, and third sealing members 190, 192, and 194. Can be formed. The sealed space may include the lower support 112, the first sealing member 190, the lower tube 118, the lower clamp 154, the second sealing member 192, the upper clamp 152, and the third sealing member ( 194, upper tube 134, and upper support 136. In this case, the substrate 12 fixed to the upper die 132 and the release film 30 in close contact with the upper portion of the cavity member 116 may not be contacted. That is, the electronic component 10 may be partially immersed in the molten resin 40.

After the sealed space is formed as described above, the sealed space may be evacuated by a vacuum system (not shown).

Referring to FIG. 7, the lower mold 110 may ascend until the electronic component 10 is sufficiently immersed in the molten resin 40 while the sealed space is maintained in a vacuum state by the vacuum system. . In this case, the cavity member 116 supported by the first elastic members 120 may move downward until the electronic component 10 is completely immersed in the molten resin 40.

The molten resin 40 in which the electronic component 10 is immersed may be cured after a predetermined time, and thus the electronic component 10 may be molded by the cured resin. The molded electronic component may be separated from the inner surfaces of the cavity 20 by air or gas supplied through the lower die 112.

According to the embodiments of the present invention as described above, the lower tube may be elastically supported on the lower support, the hub clamp may be disposed on the lower tube. The upper clamp may be disposed on the lower clamp, and the release film can be easily clamped by the downward movement of the upper clamp. In addition, since the electronic component molding apparatus according to the embodiments of the present invention has a clamping member whose structure is simplified, the manufacturing cost thereof may be greatly reduced.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims It can be understood that

1 is a schematic diagram illustrating an electronic component molding apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic side view for explaining the electronic component molding apparatus illustrated in FIG. 1.

3 is an enlarged cross-sectional view illustrating the clamping member and the lower tube illustrated in FIG. 1.

4 to 7 are schematic configuration diagrams for describing a method of molding an electronic component by using the electronic component molding apparatus illustrated in FIG. 1.

Explanation of symbols on the main parts of the drawings

10 electronic component 12 substrate

14 semiconductor chip 20 cavity

30: release film 40: molten resin

100: electronic component molding device 110: lower mold

112: lower support 114: lower die

116: cavity member 118: lower tube

120, 122, 124: 1st, 2nd, 3rd elastic member

130: upper die 132: upper die

134: upper tube 136: upper support

140: feed roller 142: winding roller

150: clamping member 152: upper clamp

154: lower clamp 160: first drive unit

170: lower guide member 172: guide hole

174: upper guide member 176: upper recess

178: lower recess 180: piston

190, 192, 194: first, second and third sealing members

Claims (10)

A lower die, a lower die disposed on the lower support and covered by a release film and provided with a vacuum for sucking the release film, surrounding the lower die and covering the cavity with the upper surface of the lower die; A lower mold including a cavity member having a defined inner surface, and a lower tube disposed to enclose the cavity member and elastically supported on the lower support; An upper mold including an upper die to which an electronic component is fixed and defining a space for molding the electronic component together with the lower die and the cavity member; And A clamping member including a lower clamp disposed on the lower tube and an upper clamp disposed between the release film and the upper mold and movably disposed toward the lower clamp to clamp the release film, Upper recesses are formed in upper surface portions of the lower tube, Pistons disposed in the upper recesses, upper guide members extending downward from the lower surface of the upper clamp and connected to the pistons through the lower clamp, and disposed in the upper recesses to ride the pistons. Electronic component molding apparatus further comprising sexually supporting elastic members. The electronic component of claim 1, wherein the upper mold further comprises an upper tube disposed to surround the upper support and the upper die, wherein the upper die and the upper tube are disposed on a lower surface of the upper support. Molding device. 3. The method of claim 2, wherein the first sealing member is interposed between the lower support and the lower tube, the second sealing member is interposed between the lower clamp and the upper clamp, and the third sealing member is interposed between the upper clamp and the upper tube. More, The upper support, the upper tube, the upper clamp, the lower clamp, the lower tube, the lower support and the first, second and third sealing members form a sealed space in which the upper die, the cavity member and the lower die are accommodated. Electronic component molding apparatus, characterized in that. 4. The electronic component molding apparatus according to claim 3, further comprising a driving unit for moving the upper mold or the lower mold to form the sealed space. The electronic component molding apparatus of claim 1, further comprising an elastic member to elastically support the cavity member on the lower support. The electronic component molding apparatus of claim 1, further comprising a driving unit configured to move the upper clamp to clamp the release film and to close the clamped release film to an upper portion of the cavity member. The lower surface portions of the lower tube are formed with lower recesses, and the lower tube is elastically supported on the lower support by elastic members partially inserted into the lower recesses. Electronic component molding apparatus, characterized in that. The method of claim 7, wherein the guide holes connected to the lower recesses are formed through the lower tube, And lower guide members disposed on the lower support to be inserted into the guide holes through the elastic members and for guiding the lower tube in a vertical direction. delete The electronic component molding apparatus of claim 1, further comprising a film supply unit configured to supply the release film between the lower mold and the upper mold.

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