JP4309234B2 - Lower mold chase replacement method for mold equipment for vacuum forming - Google Patents

Description

The present invention relates to a lower mold chase exchange method for a mold apparatus for pressure reduction molding capable of forming a work by clamping a work and decompressing the inside of a cavity.

  In recent years, the package part (resin sealing part) has become smaller and thinner, and in order to improve the adhesion between the substrate and the resin, air is sucked from the cavity formed in the mold that clamps the workpiece. Thus, while forming a reduced pressure space, a die apparatus compatible with reduced pressure molding is used, in which molten resin is pumped and filled by transfer molding, or the resin is directly supplied to a workpiece for compression molding.

For example, in a mold apparatus for transfer molding, a chase block (mold block) into which an upper mold insert or a lower mold insert is incorporated is attached to a base (see Patent Document 1). A sealing member is attached and clamped at an outer position of an air vent communicating with a cavity recessed in the surface of the chase block (mold block) so as to maintain the sealing performance.
In addition, because the vacuum pump exhausts the air in the cavity or pot to form a vacuum, the mold packing is fitted into the mold clamping surface, piston sliding surface (outer peripheral surface), piston shaft, etc. that form the cavity. (See Patent Document 2).

JP-A-4-37507 JP-A-63-7638

However, since the mold apparatus is configured by assembling mold blocks, air easily leaks from a gap formed on the clamp surface, and it is difficult to form a desired decompression space in the cavity. In particular, when performing pressure reduction molding by transfer molding, air leaks from the gap between the pot and base, the gap around the push-up rod that pushes up the ejector pin plate, and the desired pressure reduction space cannot be formed in the cavity. There was a problem.
Further, it is necessary to exchange the mold when the type of the molded product changes, and it is necessary to use a different mold apparatus when the molding method is changed between, for example, transfer molding and compression molding. In any case, since the package part is reduced in size and thickness, there is a high need for performing reduced pressure (or vacuum) molding in order to improve molding quality. For this reason, a dedicated mold apparatus is required for each molding type, and the manufacturing cost increases.
Furthermore, in the case of transfer molding, when the mold chase is changed by changing the product type, the seal material may be damaged when the mold chase is pulled out from the mold base or when an insert block such as a pot insert is pulled out. Considering the mold replacement work, it is difficult to provide a sealing material.

The object of the present invention is to solve the above-mentioned problems of the prior art, improve the sealing performance in the mold clamp state, form a desired decompression space in the cavity, and replace the lower mold chase without damaging the sealing material Another object of the present invention is to provide a method for exchanging the lower mold chase of a mold apparatus compatible with vacuum molding .

The upper die with the upper die chase supported by the upper die base and the lower die base are assembled via the chase support plate, and the chase fixing member is assembled to the lower die base and fixed to the lower die base. A lower die chase, a lower die ejector pin plate suspended and supported by the lower die chase, a pot assembled to the lower die chase via a pot insert, and a relative to the lower die base by mold opening. A lower die having a push-up rod that protrudes upward and pushes the lower die ejector pin plate into close contact with the lower die chase, and has a gap that communicates with a plunger hole in which a plunger assembled to the lower die base moves up and down. A sealing material for sealing, a sealing material provided in a gap between the lower end of the pot and the chase support plate, and Workpiece semiconductor chip by a molding die in which the seal member for sealing a gap which communicates with the rod hole of the push-up rod pushes the mold ejector pin plate is provided each of which is mounted on a substrate is clamped, the upper die base The sealing material is clamped between the lower die base and the gap communicating with the clamping surface is cut off, and air is sucked through the gap between the mold blocks from the air vent provided at the peripheral edge of the cavity, so that the inside of the cavity A lower mold chase replacement method for a vacuum molding compatible mold apparatus in which vacuum molding is performed while exhausting air out of the mold , the step of removing the chase fixing member from the lower mold chase in a mold open state, and the lower mold By moving the mold base downward and projecting the push-up rod upward relative to the lower mold base, the lower mold The lower die chase is supported by pushing it up from the support surface of the lower die base via an ejector pin plate, and a gap is formed between the support surface and the lower die chase, and the lower end of the pot and the chase support A step of forming a gap with the plate, and a support rod is inserted into the gap between the support surface and the lower die chase from the front side, and the lower die base is moved upward to move the lower die base relative to the lower die base. The process of supporting the lower die chase together with the lower die ejector pin plate by supporting the lower die by moving the push-up rod downward, removing the mold block on the near side surrounding the lower die chase and pulling the lower die chase to the near side And exchanging them.
In addition, an upper die provided with an upper die chase supported by the upper die base, and a lower die chase fixed to the lower die base with a lower surface base supported by the lower die base and a chase fixing member assembled to the upper surface side. And a lower die ejector pin plate suspended and supported by the lower die chase, and a lower die ejector pin plate protruding upward relative to the lower die base by opening the die so as to closely contact the lower die chase. A lower die having a push-up rod and a seal member for sealing a gap communicating with a plunger hole in which a plunger assembled to the lower die base moves vertically and a rod hole of a push-up rod that pushes a lower die ejector pin plate the semiconductor chip with a molding die sealant is provided each for sealing a gap that is mounted on the substrate workpiece The lamp, the gap fixed outside air blocking member surrounds the outside of the upper mold chase to the upper die base are communicated with each other through the sealing member is clamped to the clamping surface between the upper die base and the lower mold base A mold apparatus for reduced pressure molding that is cut off and is vacuum-formed while air is sucked out of the mold by sucking air through the gap between the mold blocks from the air vent provided at the peripheral edge of the cavity. A lower die chase replacement method, the step of releasing the connection between the upper die base and the outside air blocking member while the mold die is clamped, and the lower die is moved downward to block the outside air to the chase fixing member A step of opening the mold with the member placed thereon, a step of removing the chase fixing member and the outside air blocking member from the lower die chase, and a push-up rod projecting by the drive mechanism A step of pushing up and supporting the lower die chase from the support surface of the lower die base via the lower die ejector pin plate, and inserting a support rod into the gap between the support surface and the lower die chase, and pushing up The process of supporting the lower die chase together with the lower ejector pin plate by supporting the lower die by moving the rod downward, removing the mold block on the front side surrounding the lower die chase and pulling the lower die chase to the front side And a step of exchanging.
The push-up rod pushes up so that the lower die ejector pin plate is brought into close contact with the lower die chase by pushing the lower die downward relative to the lower die base. The pushed-up rod is further moved up and down.

By using the above-described mold apparatus for pressure reduction molding, the outside air blocking member that is clamped between the upper mold base and the lower mold base via the sealing material and blocks the gap communicating with the clamp surface is provided with the upper mold chase and the lower mold base. Since the outer periphery of the mold chase is provided so as to be detachable, a desired pressure reduction molding can be performed by blocking the gap communicating with the clamp surface in the mold clamp state. As a result, the flowability of the resin is good and the deaeration can be performed effectively, so that it is possible to improve the molding quality of a package that is reduced in size and thickness.
In addition, since a plunger escape hole in which the plunger assembled to the lower die chase moves up and down and a seal member that seals the gap communicating with the rod hole of the push-up rod that pushes the ejector pin plate are provided, transfer molding and Even if the upper mold chase and the lower mold chase are exchanged in accordance with the compression molding, the upper mold base and the lower mold base can be shared, and the versatility of the mold can be improved and the manufacturing cost can be reduced.
Furthermore, if the lower die chase replacement method is used, the push-up rod is provided so that it can be supported by pushing the ejector pin plate further in the mold open state and pushing the lower die chase up from the lower die base. Therefore, the support member is interposed between the lower die chase and the support surface of the lower die base, and can be pulled out and replaced without interfering with the seal material, so that the seal material is not damaged.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the best embodiment of a lower mold chase replacement method according to the present invention will be described in detail with reference to the accompanying drawings. The mold equipment for vacuum molding is transfer molding that can carry out vacuum molding by discharging the air in the cavity to the outside of the mold after the work with the semiconductor chip mounted on the substrate is carried into the press part and clamped to the mold. It can be widely applied to resin sealing devices such as compression molding.

In the present embodiment, a depressurization-molding mold apparatus used for transfer molding will be described.
A configuration of the lower mold will be described with reference to FIGS. A lower mold base 1 is supported by a lower mold platen (not shown). A lower die ejector pin plate 3 and a lower die chase 4 are assembled to the lower die base 1 via a chase support plate 2. There is a support block (not shown) between the chase support plate 2 and the lower mold chase 4, and the lower mold chase 4 is supported by the lower mold base 1 via the chase support plate 2. The chase support plate 2 is replaced when the pot position and the number of pots change when the lower chase 4 is replaced. The lower die ejector pin plate 3 is provided with a lower die ejector pin (not shown) standing upright, and is fitted into the cavity insert 5 so as to protrude through the lower die chase 4. The lower die ejector pin plate 3 is suspended and supported with a slight space with respect to the lower die chase 4, and is pushed up by a push-up rod 12 that moves up relatively when a lower platen (not shown) moves downward by opening the die. Thus, the ejector pin protrudes from the cavity insert 5 in close contact with the lower surface of the lower die chase 4. The lower die chase 4 has a pot insert 7 provided with a plurality of pots 6, a cavity insert 5 provided with a cavity recess 8, an end block 9, and a lower die chase for adjusting the longitudinal setting position of the lower die chase 4. The set block 10 and the like are assembled (see FIG. 1A). Further, a lower chase guide block 44 is assembled outside the lower chase set block 10 on the front side. The lower die chase guide block 44 may be integrated with the lower die chase set block 10 on the front side. In this case, the lower die chase guide block 44 is removed together when the lower die chase 4 is pulled out. The lower die chase guide block 44 is in close contact with the chase fixing member 14 to form a sealed space. If the height of the lower chase set block 10 is increased to near the parting surface, the suction volume can be reduced.

  The lower mold base 1 is assembled with a plunger 11 that can pass through the chase support plate 2 and can move up in the pot 6. Further, a push-up rod 12 that can be brought into contact with the lower die ejector pin plate 3 through the chase support plate 2 is assembled to the lower die base 1. Further, the lower mold base 1 is provided with a lower mold chase 4 and a heater 13 for heating the insert (see FIG. 1B).

  In FIG. 1B, the lower mold chase 4 is fixed to the lower mold base 1 by a chase fixing member 14. A sealing material S <b> 1 is provided on the abutting surface between the chase fixing member 14 and the lower mold base 1. Further, a seal material S2 is provided in a gap between the lower mold base 1 and the chase support plate 2 communicating with the plunger escape hole 15 in which the plunger 11 moves up and down. Further, a seal material S3 is provided in a gap between the lower end portion of the pot 5 and the chase support plate 2 to seal the gap communicating with the pot hole. Further, a sealing material S4 capable of sealing a gap with the rod locking portion 17 is provided around the rod hole 16 of the lower mold base 1 in which the push-up rod 12 is fitted. The push-up rod 12 protrudes relatively upward with respect to the lower mold base 1 by the lower movement of the lower mold platen, but is provided so that it can be further moved up and down by a drive mechanism such as a cylinder drive or a motor drive. ing.

Next, the structure of the upper mold will be described with reference to FIGS.
In FIG. 2B, an upper mold base 18 is supported on an upper mold platen (not shown). An upper die ejector pin plate 20 and an upper die chase 21 are assembled to the upper die base 18 via a chase support plate 19. There is a support block (not shown) between the chase support plate 19 and the upper die chase 21, and the upper die chase 21 is supported by the upper die base 19 via the chase support plate 19.
The upper mold ejector pin plate 20 is provided with an upper mold ejector pin (not shown), and is inserted into the cavity insert 22 so as to protrude through the upper mold chase 21. The upper die ejector pin plate 20 is supported by being suspended with a slight space from the upper die chase 21 so that the ejector pin protrudes from the cavity insert 22 when the die is opened. When the mold is opened, the ejector pins that have operated so that the upper mold ejector pin plate 20 comes into close contact with the upper mold chase 21 are projected. The upper die ejector pin plate 20 is urged so as to be in close contact with the upper die chase 21, and the lower die ejector pin plate 3 is urged so as to be separated from the lower die chase 4.
The upper die chase 21 has a cavity recess 23, a die cull 33, a cavity insert 22 having a die runner gate 34 recessed therein, an end block 24, and an upper die chase that adjusts the longitudinal set position of the upper die chase 21. The set block 25 and the like are assembled (see FIG. 2A). An upper chase guide block 45 is assembled outside the upper chase set block 25 on the front side. The upper chase guide block 45 on the front side may be integrated with the upper chase set block 25. In this case, the upper chase guide block 45 is removed together when the upper chase 21 is pulled out.
Further, the upper chase guide block 45 on the front side is provided with a suction groove 32 b at a position corresponding to the suction hole 32 a communicating with the suction means 32 formed on the side surface of the outside air blocking member 29. If the heights of the upper chase set block 25 and the upper chase guide block 45 are increased close to the parting surface, the suction volume can be reduced.

  In FIG. 2B, the upper die chase 21 is supported on the upper die base 18 by a chase support block 26 and a chase fixing member 27. The upper mold base 18 is provided with an upper mold chase 21 and a heater 28 for heating the insert. The upper mold base 18 is provided with an outside air blocking member 29 that can be clamped between the upper mold chase 21 and the lower mold chase 1 so as to be detachable. The outside air blocking member 29 is assembled so as to be integrally connected to the upper mold base 21 by a link member (attachment rail) 30 having a U-shaped cross section in a mold-closed state. Thereby, the installation removal operation | work of the external air blocking member 29 when pulling out the upper mold chase 21 can be simplified.

  In FIG. 2 (b), the sealing material S 5 and the sealing material S 6 are fitted into the clamp surface of the outside air blocking member 29. Specifically, the sealing material S5 is fitted on the upper surface of the outside air blocking member 29, and the sealing material S6 is fitted on the lower surface of the outside air blocking member 29. These sealing materials S5 and S6 block the gap communicating with the inside of the mold. The sealing materials S5 and S6 are fitted in the outside air blocking member 29 in advance, but may be fitted in a movable block that is biased in a direction that protrudes up and down from the outside air blocking member 29. In FIG. 2A, air in the cavity recess 23 of the cavity insert 22 is sucked by the suction means 32 such as a vacuum pump through the gap between the mold blocks through the air vent 31, and the inside of the cavity is decompressed. Thereby, the volume of the mold space for air suction is reduced as much as possible (preferably 1 liter or less), and the pressure can be reduced efficiently.

  With the mold device clamping the work, the suction means 32 is operated to decompress the inside of the cavity, and the molten resin is pumped from the pot 6 into the cavity through the mold cull 33 and the mold runner gate 34. The At this time, the closed space surrounded by the outside air blocking member 29 including the cavity space is sealed in a portion where air easily leaks, such as the periphery of the pot 6 and the periphery of the push-up rod 12, and the decompressed state is maintained well. As a result, the flowability of the resin is good and the deaeration can be performed effectively, so that it is possible to improve the molding quality of a package that is reduced in size and thickness.

Next, a method for exchanging the mold chase of the above-described mold apparatus for decompression molding will be described with reference to FIGS.
In FIG. 3A, the mounting rail 30 is removed while the mold apparatus is in a clamped state, and the connection between the upper mold base 18 and the outside air blocking member 29 is released. Next, the lower mold, which is a movable mold, is moved, and the mold is opened while the outside air blocking member 29 is placed on the lower chase fixing member 14. When the mold is opened, the upper chase 21 can be pulled out by removing the chase set block 25 and the upper chase guide block 45.

  In FIG. 3B, the outside air blocking member 29 is removed from the chase fixing member 14, and the chase fixing member 14 is removed from the lower mold base 1. When the push-up rod 12 is pushed up by a drive mechanism (not shown) in this mold open state, the lower die chase 4 is slightly pushed up from the support surface 35 of the lower die base 1 and is temporarily supported by the push-up rod 12. At this time, the support rod 36 is inserted into the gap formed on both sides between the lower die chase 4 and the lower die base 1. After inserting the rod, the push-up rod 12 is moved downward to retract the lower die 4 until it is supported by the support rod 36 together with the lower die ejector pin plate 3. In this state, the lower mold chase 4 can be pulled out by removing the chase set block 10 and the lower mold chase guide block 44. When the lower die chase 4 is pulled out, a sufficient space can be secured between the lower end of the pot 6 and the chase support plate 2, so that there is no possibility of damaging the sealing material S3.

Next, another example of the mold apparatus for pressure reduction molding will be described. In the above-described embodiment, the transfer molding mold apparatus has been described. However, the present invention is not limited to this, and may be a compression molding mold apparatus. In the following, a description will be given focusing on the configuration different from the mold apparatus for transfer molding.
In FIG. 4, the structure of the lower mold will be described. The lower mold base 1 and the chase support plate 2 are the same as in FIG. 1, but the pot 6 and the plunger 11 are not equipped for compression molding. Is different. Since the lower die base 1 is provided with a push-up rod 12 and a plunger escape hole 15, the lower die base 1 can be used for transfer molding. The lower die base 1 is similarly provided with a push-up rod 12 and a lower die ejector pin plate 3. The lower die chase 40 is not provided with an insert because the upper surface of the chase is a workpiece mounting surface, and the lower die ejector pin plate 3 is provided with a work ejector pin for pushing up when a workpiece is taken out after molding. . Similarly, the lower die chase 40 is fixed to the lower die base 1 by the chase fixing member 14. A seal material S2 is provided in the gap between the lower die base 1 communicating with the plunger escape hole 15 and the chase support plate 2, and a rod locking portion 17 is provided around the rod hole 16 into which the push-up rod 12 is fitted. A sealing material S4 that can seal the gap between them is provided.

Next, the structure of the upper mold will be described. The upper mold base 18 and the chase support plate 19 similar to those in FIG. 2 are used, and the upper mold ejector pin plate 20 is similarly provided. The upper chase 41 is not provided with an insert because the lower surface of the chase forms a cavity recess. A movable block 42 that forms a cavity recess is suspended and supported on the outer peripheral side of the upper chase 41. A spring 43 is mounted between the upper chase 41 and the movable block 42, and the movable block 42 is urged downward. The upper die chase 41 is supported on the upper die base 18 by the chase support block 26 and the chase fixing member 27. The outside air blocking member 29 is similarly clamped between the upper mold base 18 and the chase fixing member 14 of the lower mold base 1, and the arrangement of the sealing material is also the same. The configuration in which the outside air blocking member 29 is connected to the upper mold base 18 by the mounting rail 30 and the configuration in which the sealing material S5 and the sealing material S6 are fitted on the clamp surface of the outside air blocking member 29 are the same.

  The workpiece is placed on the lower die chase 40, and resin (solid, granular, liquid resin, etc.) is supplied onto the workpiece and clamped between the movable block 42 of the upper die chase 41. In this state, the melted resin is compression-molded in a state where the suction means (not shown) is operated to decompress the cavity including the cavity. At this time, the closed space surrounded by the outside air blocking member 29 including the cavity space is sealed in a place where air easily leaks, such as the periphery of the plunger escape hole 15 and the periphery of the push-up rod 12, and the decompressed state is maintained well. The

  The upper chase 41 can be replaced in the same manner with the mold opened, and the lower chase 40 can be replaced with the lower die chase 40 suspended from the lower mold base 1 by the push-up rod 12. The same applies to the point that the support rod 36 is inserted into the surface 35.

  Thus, as long as the sealing performance can be maintained using the outside air blocking member 30 and the sealing material, the lower mold base 1 and the upper mold base 18 can be shared in the transfer molding and the compression molding when performing the reduced pressure molding. Manufacturing cost can be reduced by improving the versatility of the mold.

  In the above-described embodiment, the mold for the double-sided package is exemplified in the transfer molding, but the mold for the single-sided package may be used, and the work may be any of a lead frame, a resin substrate, a tape, a film, and the like. The work for compression molding can be variously modified without departing from the spirit of the invention, such as either a wafer or a resin substrate.

It is the top view and sectional view of the lower mold for transfer molding. It is the top view and sectional drawing of the upper mold for transfer molding. It is operation | movement explanatory drawing which shows the replacement | exchange procedure of a die chase. It is sectional drawing of the metal mold apparatus for compression molding.

Explanation of symbols

1 Lower mold base 2, 19 Chase support plate 3 Lower mold ejector pin plate 4, 40 Lower mold chase 5, 22 Cavity insert 6 Pot 7 Pot insert 8, 23 Cavity recess 9, 24 End block 10, 25 Chase set block 11 Plunger 12 Push-up rod 13, 28 Heater 14, 27 Chase fixing member 15 Plunger escape hole 16 Rod hole 17 Rod locking part 18 Upper mold base 20 Upper mold ejector pin plate 21, 41 Upper chase 26 Chase support block 29 Outside air blocking member 30 Mounting rail 31 Air vent 32 Suction means 32a Suction hole 32b Suction groove 33 Mold cull 34 Mold runner gate 35 Support surface 36 Support rod 42 Movable block 43 Spring 44, 45 Chasega Id block

Claims (3)

The upper die with the upper die chase supported by the upper die base and the lower die base are assembled via the chase support plate, and the chase fixing member is assembled to the lower die base and fixed to the lower die base. A lower die chase, a lower die ejector pin plate suspended and supported by the lower die chase, a pot assembled to the lower die chase via a pot insert, and a relative to the lower die base by mold opening. A lower die having a push-up rod that protrudes upward and pushes the lower die ejector pin plate into close contact with the lower die chase, and has a gap that communicates with a plunger hole in which a plunger assembled to the lower die base moves up and down. A sealing material for sealing, a sealing material provided in a gap between the lower end of the pot and the chase support plate, and Workpiece semiconductor chip by a molding die in which the seal member for sealing a gap which communicates with the rod hole of the push-up rod pushes the mold ejector pin plate is provided each of which is mounted on a substrate is clamped, the upper die base The sealing material is clamped between the lower die base and the gap communicating with the clamping surface is cut off, and air is sucked through the gap between the mold blocks from the air vent provided at the peripheral edge of the cavity, so that the inside of the cavity A lower mold chase replacement method for a vacuum molding compatible mold apparatus in which vacuum molding is performed while exhausting air out of the mold ,
Removing the chase fixing member from the lower chase in a mold open state;
The lower mold base is moved downwardly to project the push-up rod relatively upward with respect to the lower mold base, thereby allowing the lower mold chase to support the lower mold base via the lower mold ejector pin plate. Supporting by pushing up more, forming a gap between the support surface and the lower mold chase and forming a gap between the lower end of the pot and the chase support plate;
A support rod is inserted into the gap between the support surface and the lower die chase from the front side, the lower die base is moved upward, and the push-up rod is moved downward relative to the lower die base to move the lower die Supporting the chase together with the lower ejector pin plate by a support rod;
And a step of removing the mold block on the near side surrounding the lower mold chase and exchanging the lower mold chase toward the front side for replacement. An upper die provided with an upper die chase supported by the upper die base, a lower die chase fixed to the lower die base with a lower surface base supported by the lower die base and a chase fixing member assembled to the upper surface side; Lower die ejector pin plate suspended and supported by the lower die chase, and a push-up rod that protrudes upward relative to the lower die base by opening the die so as to stick the lower die ejector pin plate to the lower die chase And a seal material that seals a clearance communicating with a plunger hole in which a plunger assembled to the lower mold base moves up and down, and a clearance communicating with a rod hole of a push-up rod that pushes a lower mold ejector pin plate Clan semiconductor chip is mounted on a substrate with a molding die sealing material for sealing is provided, each work is It is, cut off a gap that communicates clamped to the clamping surface via the sealing material between the upper mold chase outside the enclosing fixed ambient air shutoff member the upper die base and the lower mold base to the upper die base Under the reduced pressure molding-compatible mold apparatus in which vacuum suction is performed while the air in the cavity is exhausted outside the mold by sucking air through the gap between the mold blocks from the air vent provided at the peripheral edge of the cavity. A type chase replacement method ,
Releasing the connection between the upper mold base and the outside air blocking member when the mold is clamped;
Lowering the lower mold and opening the mold with the outside air blocking member placed on the chase fixing member; and
Removing the chase fixing member and the outside air blocking member from the lower mold chase;
A step of pushing up a push-up rod by a driving mechanism and pushing the lower die chase up from a support surface of the lower die base via the lower die ejector pin plate;
Inserting a support rod into the gap between the support surface and the lower die chase, moving the push-up rod downward and supporting the lower die chase together with the lower die ejector pin plate by the support rod;
And a step of removing the mold block on the near side surrounding the lower mold chase and exchanging the lower mold chase toward the front side for replacement. The push-up rod is pushed up so that the lower die ejector pin plate is brought into close contact with the lower die chase by raising the lower die relatively upward from the lower die base, and the drive mechanism is pushed up. The lower mold chase replacement method according to claim 2, wherein the push rod is further moved up and down.

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