JP5776093B2 - Resin sealing device - Google Patents

Description

  The present invention relates to a technique effective when applied to a resin sealing device.

  Japanese Unexamined Patent Publication No. 2009-190400 (Patent Document 1) discloses a transfer molding method including the following steps. First, the workpiece carried into the mold is moved to a retracted position where the cavity piece (also referred to as a cavity block) is retracted by a predetermined thickness from the thickness of the molded product, and is clamped by a clamper (also referred to as a clamper block). Next, the plunger is operated while the clamper clamps the workpiece, and the cavity is filled with molten resin to maintain a predetermined first holding pressure. After filling the resin, the cavity piece is further pushed out to the molding position corresponding to the thickness dimension of the molded product, and the excess resin in the cavity recess is pushed back from the gate to the pot side. Next, the plunger is operated again to heat and cure the sealing resin while maintaining the second holding pressure higher than the first holding pressure.

JP 2009-190400 A

  FIG. 11 schematically shows a cross-section of the main part of the resin sealing device 101 studied by the present inventors. The resin sealing device 101 performs transfer molding as disclosed in Patent Document 1. In this resin sealing device 101, the cavity block 7 forms the bottom of the cavity 11, and the clamper block 108 forms the side of the cavity 11, and the volume of the cavity 11 is increased by moving the clamper block 108 up and down according to the mold closing operation. It is designed to be variable. In the following description, the upper mold 103 is described as a fixed mold, and the lower mold 104 is described as a movable mold.

  In the resin sealing device 101, first, the workpiece W is carried into the mold 102 that has been opened, and the workpiece W is clamped by the clamper block 108. At this time, since the cavity block 7 is in the retracted position retracted from the molding position corresponding to the thickness dimension of the molded product, the volume of the cavity 11 is larger than when the cavity block 7 is in the molding position.

  Next, the plunger 131 is operated while the workpiece W is clamped, and the molten resin 35 is filled into the cavity 11 through the cull 114 and the gate 16 to maintain a predetermined first holding pressure. Next, after the resin 35 is filled in the cavity 11, the mold 102 is further clamped so as to push the cavity block 7 to the molding position, and the excess resin in the cavity 11 is pushed back from the gate 16 to the cal 114 side. Next, the plunger 131 is actuated again to heat and cure the resin 35 while maintaining the second holding pressure higher than the first holding pressure.

  Then, after the resin 35 is heated and cured, the lower mold 104 is moved downward while the clamper block 108 clamps the workpiece W, the cavity block 7 is first moved to the retracted position, and then the clamper block 108 is separated from the workpiece W. As a result, the molded product is released from the upper mold 103. Thereafter, the molded product is taken out from the lower mold 104, the clamp surface of the lower mold 104 is cleaned as necessary, and one molding operation is completed.

  However, in the resin sealing device 101, it is difficult to release the molded product from the lower mold 104, or the resin 35 hardened in the cull 114 or the pot 128 is cracked in an attempt to force release. Will occur. This is because the resin 35 in the cavity 11 is pushed back to the cylindrical pot 128 and hardens, that is, the resin 35 enters and cures in the depth direction of the pot 128, so that the pot 128 or the cal 114 is removed at the time of mold release. It is considered that the resin 35 inside is stressed and cracked. When such a problem arises, it is necessary to remove the resin 35 that cannot be released or the broken resin 35, which lowers the productivity of the molded product.

  Further, the resin sealing device 101 has a problem that the sliding resistance of the plunger 128 that moves up and down in the cylindrical pot 128 increases. This is because when the resin 35 is filled into the large volume cavity 11, the plunger 131 is moved further upward, so that the amount of movement of the plunger 131 is increased, and the resin 35 enters from the periphery of the tip of the plunger 131. This is thought to be due to an increase in the sliding resistance. When the sliding resistance increases, for example, excess resin in the cavity 11 cannot be pushed back from the gate 16 to the side of the cull 14, and the cavity block 7 cannot be moved to a molding position corresponding to the thickness dimension of the molded product. When such a problem arises, it is necessary to remove the resin 35 that has entered, and this reduces the productivity of the molded product.

  In the resin sealing device 101, the release film 18 is adsorbed to the clamp surface of the upper mold 103 in order to easily release the molded product from the upper mold 103. Since the release film 18 moves between the molding position in the cavity 11 and the retreat position retracted by a predetermined thickness from the molding position, there arises a problem that the release film 18 is torn. When such a problem arises, it is necessary to remove the torn release film 18, which reduces the productivity of the molded product.

  The objective of this invention is providing the technique which can improve the productivity of the molded article shape | molded by the resin sealing apparatus. The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows. In one embodiment of the present invention, the resin sealing device clamps the first and second molds provided facing each other up and down, and extrudes the resin supplied to the pot with a plunger that moves up and down, the resin was pumped into the cavity through the cull and gate, the work in the cavity a resin sealing apparatus for resin encapsulation, wherein the first mold is varied the volume of the cavity by the vertical movement, the first through hole And a first block formed with a second through hole, a second block inserted into the second through hole, and a third block inserted into the first through hole. And the cavity is formed by using the second mold side surface of the third block and the inner peripheral surface of the first through hole, and the pot is inclined toward the plunger side at an opening edge portion Te And tapered surface, and an inner peripheral surface continuous with the tapered surface, with the resin by moving the first block to reduce the volume of the cavity filled, pushed back resin on the local side through the gate, in conjunction to the pushed back resin while moving the second block and the plunger so as to increase the volume of the cull, the cull, the second mold side and the second through hole of the second block The first cull portion formed using the inner peripheral surface of the first and second cull portions formed using the first mold side surface of the plunger and the tapered surface of the pot are provided to face each other. It is what.

  Of the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows. Productivity of a molded product molded by the resin sealing device can be improved.

It is principal part sectional drawing which shows typically the resin sealing apparatus in operation | movement in one Embodiment of this invention. It is principal part sectional drawing which shows typically the resin sealing device in the operation | movement following FIG. It is principal part sectional drawing which shows typically the resin sealing device in the operation | movement following FIG. It is principal part sectional drawing which shows typically the resin sealing device in the operation | movement following FIG. It is principal part sectional drawing which shows typically the resin sealing device in the operation | movement following FIG. It is principal part sectional drawing which shows typically the resin sealing device in the operation | movement following FIG. It is principal part sectional drawing which shows typically the resin sealing device in the operation | movement following FIG. It is principal part sectional drawing which shows typically the resin sealing apparatus in operation | movement in other embodiment of this invention. It is principal part sectional drawing which shows typically the resin sealing device in the operation | movement following FIG. It is principal part sectional drawing which shows typically the resin sealing device in operation | movement in other embodiment of this invention. It is principal part sectional drawing which shows typically the resin sealing apparatus which the present inventors examined.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiments, and the repetitive description thereof may be omitted.

(Embodiment 1)
The cross section of the metal mold | die 2 which is the principal part of 1 A of resin sealing apparatuses in this embodiment is shown in FIGS. 1 to 7 show the mold 2 on the right side (one side) from the one-dot chain line, the left side has the same configuration.

  In this resin sealing device 1A, a workpiece W (molded product) is supplied from a workpiece supply section (not shown) by a loader to the mold 2 (press section) and sealed with resin, and then the workpiece W is unloaded by an unloader. The (molded product) is taken out from the mold 2 and stored in a molded product storage unit (not shown). In the work W, for example, a semiconductor chip is mounted on a wiring board, and the semiconductor chip and the wiring board are electrically connected by a bonding wire.

  The mold 2 is composed of an upper mold 3 (a fixed mold, a first mold) and a lower mold 4 (a movable mold, a second mold) which are provided facing each other in the vertical direction. And the lower mold 4 is brought close to and clamped (clamped). In the resin sealing device 1A, the lower mold 4 assembled to the movable platen (not shown) is brought close to the upper mold 3 assembled to the fixed platen (not shown) and placed on the lower mold 4. Clamp the placed workpiece W. The cavity 11 has a concave shape opened at the clamping surface of the upper mold 3, and the semiconductor chip and the bonding wire of the workpiece W are resin-sealed (resin mold) inside the cavity 11.

  The upper mold 3 of the mold 2 has a base block 5, a chase block 6, a cavity block 7, a clamper block 8 (first block), and a center block 9 (second block), and is assembled to a fixed platen. It is done. Specifically, the base block 5 that is fixed and assembled directly to the fixed platen is used as a base, and the cavity block 7, the clamper block 8, and the center are placed inside the concave chase block 6 that is fixed and assembled to the base block 5. Block 9 is arranged and assembled.

The cavity block 7 is fixedly assembled to the base block 5. The fixed surface of the cavity block 7 opposite face forms the bottom of the concave Cavity I 1 1.

The clamper block 8 is composed of a single plate-shaped mold, and through holes 8a and 8b for inserting the cavity block 7 and the center block 9 are formed in the plate-shaped mold. Since the cavity block 7 and the center block 9 are inserted into these, the clamper block 8 is disposed around the cavity block 7 and the center block 9. Thus, part of the inner peripheral surface of the through hole 8a of the cavity block 7 is inserted becomes as forming a concave Cavity I 1 1 side. Further, a part of the inner peripheral surface of the through hole 8b into which the center block 9 is inserted forms the side portion when the concave portion 14a is formed on the upper side of the cull 14 as shown in FIG. Become.

  Further, on the clamp surface side of the clamper block 8 extending from the through hole 8b to the through hole 8a, a cull 14, a runner 15 and a gate 16 communicating with the cavity 11 are formed. As shown in FIG. 2, in a state where the mold 2 clamps the workpiece W, the gate 16 serves as a flow path for the resin 35 at the side or corner of the cavity 11, and the runner 15 serves as a flow path for the resin 35. For this reason, in the clamper block 8, the center clamping surface where the cull 14, the runner 15, and the gate 16 are formed is recessed from the outer peripheral portion that clamps the workpiece W to form a flow path.

  The clamper block 8 forming the side portion of the cavity 11 is assembled to the base block 5 so as to move up and down by coil springs 13a and 13b. That is, coil springs 13 a and 13 b that extend in the vertical direction are assembled to the clamper block 8 and the base block 5. In the resin sealing device 1A, for example, as can be seen by comparing FIGS. 3 and 4, the volume of the cavity 11 is changed by the vertical movement of the clamper block 8.

  The cavity 11 having a variable volume will be specifically described. The clamper block 8 is suspended and supported by support members 12a and 12b assembled so as not to be detached by the chase block 6. The support members 12a and 12b include a shaft portion 12c that passes through the chase block 6 and is connected to the clamper block 8, and a flange portion 12d that prevents the shaft portion from coming off by the chase block 6 (FIG. 1). reference). Each of the flange portions 12 d of the support members 12 a and 12 b is urged downward by coil springs 13 a and 13 b elastically mounted in the recesses of the base block 5 and is abutted against the upper surface of the chase block 6.

  Therefore, for example, in the state shown in FIG. 3, the clamper block 8 is supported in a state of being separated from the chase block 6 via the coil springs 13a and 13b. On the other hand, for example, in the state shown in FIG. 4, the clamper block 8 is close to the chase block 6 via the coil springs 13a and 13b. When the clamper block 8 clamps the workpiece W and is pushed back so as to be close to the chase block 6, the volume of the cavity 11 is reduced. In this manner, in the resin sealing device 1A, the volume of the cavity 11 is made variable. In the cavity 11 whose volume is variable in the cavity block 7, the cavity block 7 is moved from the retracted position (see FIG. 3) that is retracted by a predetermined thickness from the thickness dimension of the molded product, and the molding position corresponding to the thickness dimension of the molded product. It can also be considered that the volume of the cavity 11 is reduced by moving to (see FIG. 4).

  The center block 9 is assembled to the base block 5 so as to move up and down by a coil spring 17. That is, the center block 9 is assembled with a coil spring 17 that expands and contracts in the vertical direction. The surface of the center block 9 opposite to the coil spring 17 side forms a part of the cull 14. Thereby, in the resin sealing device 1A, as can be seen by comparing FIG. 3 and FIG. 4, for example, the volume of the cull 14 is changed by the vertical movement of the center block 9.

  The cull 14 having a variable volume will be specifically described. The center block 9 is a block mold in which a shaft portion 9a that penetrates the through hole 8b of the clamper block 8 and a flange portion 9b that prevents the shaft portion 9a from coming off by the clamper block 8 are integrally formed (FIG. 1). reference). A coil spring 17 is mounted between the flange portion of the center block 9 and the recess of the base block 5 through the through hole of the chase block 6. For this reason, for example, in the state shown in FIG. 3, in the center block 9, the flange portion 9 b is close to the clamper block 8 by the biasing force of the coil spring 17. On the other hand, for example, in the state shown in FIG. 4, the center block 9 is separated from the clamper block 8 in the flange portion 9 b against the urging force of the coil spring 17. In this way, in the resin sealing device 1A, the volume of the cull 14 is made variable.

  Further, in the resin sealing device 1A, in the upper mold 2 having the clamper block 8 for changing the volume of the cavity 11 and the center block 9 for changing the volume of the cull 14, the cavity block 7 and the clamper block 8 (through hole 8a, and a film for sucking the release film 18 along the surface of the upper mold 3 between the center block 9 and the clamper block 8 (inner peripheral surface of the through hole 8b). A suction unit 21 is provided. Further, a seal member 22 for hermetically sealing is provided between the clamper block 8 and the chase block 6.

  The release film 18 is sucked and held so as to cover the clamp surface of the upper mold 3 including the cavity 11 by the film suction mechanism 23 communicating with the film suction portion 21. For example, a long film material is used for the release film 18, and the release film 18 is provided so as to be drawn out from a feeding roll wound up in a roll shape, passed through an upper mold clamping surface, and wound up onto a winding roll. . In addition, you may use the release film 18 cut | disconnected in strip shape only the length required for one mold.

  Thus, in the resin sealing device 1 </ b> A, the film suction part 21, the film suction mechanism 23, and the release film 18 are provided, and the release film 18 follows changes in the volume of the cavity 11 and the cull 14. Accordingly, even when the clamper block 8 that is movable to change the volume of the cavity 11 or the center block 9 that is movable to change the volume of the cull 14 is used, the resin 35 is placed between the blocks when performing transfer molding. Is prevented from entering.

  The lower mold 4 includes a base block 25, a chase block 26, an insert block 27, and a pot 28, and is assembled to a movable platen. Specifically, the base block 25 fixed and assembled directly to the movable platen is used as a base, and the insert block 27 and the pot 28 are arranged inside a concave chase block 26 fixed and assembled to the base block 25. Are assembled. Note that a work placement portion on which the work W is placed is provided on the upper surface of the insert block 27.

  A through hole into which a cylindrical pot 28 is inserted is formed at the center of the chase block 26 and the insert block 27. In this through hole, a circumferential groove in which a protrusion on the outer peripheral surface of the pot 28 is located is formed so that the pot 28 does not come out of the lower mold 4. A plunger 31 that moves up and down by a known transfer drive mechanism is provided in the pot 28. The plunger 31 is provided to face the cull 14. When a plurality of pots 28 are provided, a multi-plunger in which a plurality of plungers are provided on the support block corresponding to each pot is used. A coil spring for equalizing the resin may be provided in each of the plungers at the lower part of the plurality of plungers.

  For example, as shown in FIG. 4, the cull 14 includes an upper cull portion 14A formed using the center block 9 on the upper mold 3 side and a lower cull portion formed using a pot 28 on the lower mold 4 side. 14B. In the resin sealing device 1A, the cull 14 is configured by forming the upper cull portion 14A and the lower cull portion 14B to face each other. As described above, the cull 14 has a concave portion 14a formed in the upper cull portion 14A by the vertical movement of the center block 9, and the volume thereof is variable. For this reason, as shown in FIG. 4, in the cull 14 (upper cull portion 14A), the resin 35 pushed back from the cavity 11 can be stored in the concave portion 14a.

  On the other hand, the lower cull portion 14 </ b> B is formed by the pot 28 and the plunger 31. The pot 28 into which the plunger 31 is inserted has a tapered surface 28a inclined toward the plunger 31 at the opening edge, and an inner peripheral surface 28b continuous with the tapered surface 28a. By forming the opening edge portion of the pot 28 as the tapered surface 28a, the lower cull portion 14B facing the upper cull portion 14A can be formed. For this reason, as shown in FIG. 4, the resin 14 pushed back from the cavity 11 can be stored in the cull 14 (lower cull portion 14 </ b> B).

  The lower mold 4 is provided with a seal member 32 for hermetically sealing the clamp surface with the clamper block 8 when clamped together with the upper mold 3. The lower mold 4 is formed with an air flow passage 33 for circulating air discharged from an air vent (not shown) on the clamp surface between the work mounting portion of the insert block 27 and the seal member 32. ing. The air flow passage 33 communicates with an air supply / discharge device 34 (decompression mechanism) that depressurizes the cavity 11 that is blocked from the outside.

  In the resin sealing device 1A having such a configuration, the upper mold 3 and the lower mold 4 provided facing each other in the vertical direction are brought close to each other to clamp the workpiece W, and the resin 35 supplied to the pot 28 is moved up and down. The resin 31 is pushed out by the plunger 31, and the resin 35 is pumped to the cavity 11 through the cull 14, the runner 15 and the gate 16, and the resin sealing is performed in the cavity 11. The operation of the resin sealing device 1A will be specifically described below. As an example, the thickness dimension of the molded product (sealing resin portion) will be described as 0.3 mm from the substrate surface.

  First, in a state where the mold 2 is opened (see FIG. 1), the work W is placed on the insert block 27 of the lower mold 4 by a loader (not shown). Further, the release film 18 is attracted to the clamp surface of the upper mold 3 by the film suction mechanism 23. Further, the tablet-like resin 35 is supplied to the pot 28. Next, as shown in FIG. 1, the upper mold 3 and the lower mold 4 are brought close to each other, and the clamp surface is hermetically sealed by the seal member 32 to form a reduced pressure space in the mold. That is, the air between the pot 28 and the cavity 11 is discharged by the pressure reducing action by the air supply / discharge device 34, and volatile components such as a solvent, air, moisture and the like contained in the resin 35 are previously removed from the resin sealing device 1A. To the outside. As a result, the amount of bubbles contained in the resin 35 that is subsequently pumped into the cavity 11 can be reduced, and the molding quality can be improved.

  Subsequently, as shown in FIG. 2, the upper mold 3 and the lower mold 4 are further brought closer to each other from the state shown in FIG. 1, and the work W is clamped by the mold 2 with a predetermined first clamping force. Specifically, the wiring board of the workpiece W is clamped by the outer peripheral portion of the clamper block 8 and the insert block 27. At this time, the semiconductor chip and the bonding wire on the wiring board are enclosed in the cavity 11. The cavity block 7 is held at a retracted position that is retracted by a predetermined thickness (for example, 0.2 mm) from the thickness dimension (0.3 mm) of the molded product. The clamper block 8 is separated from the chase block 6 because the coil springs 13a and 13b have an elastic force that resists the first clamping force.

  Subsequently, as shown in FIG. 3, the molten resin 35 is pumped to the cavity 11 while the first clamping force is applied to the mold 2, and the cavity 11 is filled with the resin 35. Specifically, the plunger 31 is moved up so that the resin pressure becomes a predetermined first holding pressure (for example, 1 to 3 MPa) while the first clamping force is applied to the mold 2, and the cal 14, runner 15. The molten resin 35 is filled into the cavity 11 through the gate 16. At this time, the air suction operation by the air supply / discharge device 34 continues.

  Subsequently, as shown in FIG. 4, the upper die 3 and the lower die 4 are further brought close to each other by a predetermined thickness to reduce the volume of the cavity 11 filled with the resin 35, and through the gate 16, the side of the cull 14 and the pot The resin 35 is compressed and pushed back to the 28 side. Further, the center block 9 is moved so as to enlarge the container of the cal 14 in accordance with the resin 35 pushed back. Further, the center block 9 is moved by the resin pressure to increase the volume of the cull 14 and collect the resin 35. In the present embodiment, the center block 9 is moved by the resin 35 pushed out from the cavity 11 toward the cull 14 so as to increase the volume of the cull 14. The resin 35 pushed back is accumulated in the cull 14 and the pot 28.

  Specifically, the second mold force greater than the first clamp force is applied to the mold 2 by further bringing the upper mold 3 and the lower mold 4 closer to each other from the state shown in FIG. As a result, the cavity block 7 fixedly assembled to the base block 5 comes close to the lower mold 4. Further, the clamper block 8 assembled to the base block 5 via the coil springs 13 a and 13 b moves upward so that the coil springs 13 a and 13 b contract and come close to the chase block 6.

  In other words, when a second clamping force is applied to the mold 2 with the workpiece W clamped, the cavity block that forms the bottom of the cavity 11 with respect to the wiring substrate of the workpiece W placed on the lower mold 4 7 close to each other and the clamper block 8 forming the side of the cavity 11 remains stopped. That is, since the cavity block 7 changes from the retracted position (see FIG. 3) to the molding position (see FIG. 4), the depth of the bottom of the cavity 11 becomes shallow and the volume of the cavity 11 becomes small.

  When the volume of the cavity 11 is reduced with the resin 35 filled, the resin 35 (surplus resin) is pushed back to the cull 14 side through the gate 16. Further, in the present embodiment, since pressure is applied to the excess resin that is pushed back at the same time, the center block 9 assembled to the base block 5 via the coil spring 17 contracts with the base block 5 as the coil spring 17 contracts. It is pushed back to do.

  In other words, when the resin pressure from the surplus resin is applied to the center block 9, the bottom of the concave portion 14 a of the cull 14 (upper cull portion 14 </ b> A) is placed on the wiring board of the workpiece W placed on the lower mold 4. The center block 9 to be formed moves upward. At this time, the clamper block 8 forming the side portion of the recess 14a remains stopped. Therefore, the center block 9 moves upward to form the recess 14a, and the volume of the cull 14 increases. In the resin sealing device 1 </ b> A, the resin 35 (excess resin) pushed back from the cavity 11 filled with the resin 35 is stored in the cull 14 whose volume is increased in this way.

  Further, in the resin sealing device 1A, when the resin 35 (surplus resin) is pushed back to the cull 14 side through the gate 16, the pot 31 is moved so that the plunger 31 (see FIG. 3) moved upward is removed from the lower cull portion 14B. Is pushed back to the inner peripheral surface 28b. For this reason, in the cal 14, the surplus resin can be stored in the lower cal part 14 </ b> B in addition to the upper cal part 14 </ b> A.

  As described above, in the resin sealing device 1A, the workpiece W is clamped by the mold 2, the resin 35 supplied to the pot 28 is pushed out by the plunger 31, and is pumped to the cavity 11 through the cull 14 and the gate 16, and then the resin The volume of the cavity 11 filled with 35 is reduced, and excess resin is pushed out toward the cull 14 and the pot 28 side. Next, the resin 35 filled in the cavity 11 is heat-cured and sealed with respect to the workpiece W. Specifically, while applying the second clamping force, a predetermined second holding pressure (for example, 8 to 12 MPa) is applied to a resin pressure higher than the first holding pressure (for example, 1 to 3 MPa), and heating is performed for a predetermined time. It hardens | cures and the workpiece | work W is resin-sealed.

  Subsequently, as shown in FIG. 5, the upper mold 3 and the lower mold 4 are opened. As a result, the cavity block 7 fixedly assembled to the base block 5 is separated from the lower mold 4, the volume of the cavity 11 is increased, and an area not filled with the resin 35 is formed. In addition, the clamper block 8 assembled to the base block 5 via the coil springs 13 a and 13 b moves downward so that the coil springs 13 a and 13 b extend and separate from the base block 5.

  Subsequently, as shown in FIG. 6, the mold opening operation of the upper mold 3 and the lower mold 4 further proceeds from the state shown in FIG. As a result, the center block 9 assembled to the base block 5 via the coil spring 17 moves downward so that the coil spring 17 extends and separates from the base block 5. In the state shown in FIG. 6, the workpiece W is started to be released from the upper mold 3.

  Subsequently, as shown in FIG. 7, the upper mold 3 and the lower mold 4 are further separated from the state shown in FIG. In the state shown in FIG. 7, the work W is completely released from the upper mold 3. Thereafter, in the resin sealing device 1A, the workpiece W is released from the lower mold 4 by an unloader (not shown), and unnecessary resin cured by the gate 16, the runner 15, and the cal 14 is separated from the workpiece (degateed). B) Only the molded product is collected.

  The resin sealing device 1A in this embodiment has a center block 9 that changes the volume of the cull 14 by vertical movement, pushes the resin 35 back to the cull 14 side through the gate 16, and moves the center block 9 to move the cull 14 The volume is increased, and the extruded resin 35 (excess resin) is stored therein. For this reason, it is not necessary for the pushed-in resin 35 to enter deeply in the depth direction of the pot 28, and it becomes difficult for the resin 35 cured in the pot 35 or the cal 14 to be stressed, and the resin cracks at the time of mold release. Can be prevented. If resin cracking does not occur, it is not necessary to remove resin that cannot be released or cracked resin. That is, the productivity of a molded product molded by the resin sealing device 1A can be improved.

  In the resin sealing device 1A, a coil spring 17 is assembled to the center block 9 as an elastic member that expands and contracts in the vertical direction. Assuming that the coil spring 17 is kept in a state where the plunger 31 is stopped, the elastic force that causes the center block 9 to move upward by a predetermined resin pressure that pushes the resin 35 (surplus resin) back to the cal 14 side through the gate 16. have.

  Here, in order to move the center block 9 up and down, for example, an actuator may be used instead of an elastic member. In this case, the control of the vertical movement of the center block 9 and the operation of the other members become complicated, causing a problem of reducing the productivity of the molded product. In addition, there is a problem that the device (mold) itself becomes large due to the actuator. However, by simply using an elastic member (coil spring 17) to move the center block 9 up and down, the center block 9 can be moved up in real time following a predetermined resin pressure. Can be improved. Moreover, since the coil spring 17 is assembled so as to be embedded in the mold itself, the apparatus is not enlarged.

  In the resin sealing device 1A, for example, as shown in FIG. 4, the cull 14 is formed on the upper mold 3 side using the clamper block 8 and on the lower mold 4 side. A lower cull portion 14 </ b> B formed using the pot 28 is provided so as to face. For this reason, when the resin 35 (surplus resin) is pushed back to the side of the cull 14 through the gate 16, more excess resin can be accumulated in the cull 14 compared to only the upper cull portion 14A (see also the cal 114 in FIG. 11). it can. Thereby, it is not necessary to penetrate the resin 35 deeply in the depth direction of the pot 28, and it is possible to prevent the occurrence of resin cracking at the time of mold release after the resin is cured.

  Further, in the resin sealing device 1A, the pot 28 into which the plunger 31 is inserted has a tapered surface 28a inclined toward the plunger 31 at the opening edge and an inner peripheral surface 28b continuous with the tapered surface 28a. For this reason, the movement amount of the plunger 31 that moves up and down on the inner peripheral surface 28 b of the pot 28 can be suppressed. Specifically, in the cylindrical pot 128 (see FIG. 11), the plunger 31 moves down to the depth D2, but in the cylindrical pot 28 (see FIG. 4) having the tapered surface 28a at the opening edge. The plunger 31 moves down to the depth D1 (<D2), and the amount of movement of the plunger 31 that moves up and down on the inner peripheral surface 28b is reduced.

  Therefore, it is possible to prevent the resin 35 from entering under the tip of the plunger 31 and increase the sliding resistance between the plunger 31 and the pot 28. When the resin 35 does not enter under the tip of the plunger 31, it is not necessary to remove the resin, and the sliding resistance at the initial stage of design can be maintained. That is, the productivity of a molded product molded by the resin sealing device 1A can be improved.

  Further, in the resin sealing device 1A, as shown in FIG. 3, a circumferential groove 31a provided with a seal ring in contact with the inner peripheral surface of the pot 28 is formed at the tip of the plunger 31. A seal ring is fastened to the inner peripheral surface 28 b of the resin to push out the resin into the cavity 11. For this reason, it is possible to prevent the resin 35 from entering under the seal ring of the plunger 31. That is, the productivity of a molded product molded by the resin sealing device 1A can be improved.

  Further, in the resin sealing device 1A, the tapered surface 28a is formed at the opening edge portion of the pot 28, but the shape of the tip portion of the plunger 31 is a truncated cone shape. That is, when the molten resin 35 is filled into the cavity 11, the resin 35 can be extruded along the truncated cone-shaped side surface so that the resin 35 flows along the tapered surface 28 a. Thus, since the fluidity | liquidity of the resin 35 improves, productivity of the molded article shape | molded by 1 A of resin sealing apparatuses can be improved.

(Embodiment 2)
In the first embodiment, as described with reference to FIG. 4, the case has been described in which the resin 35 is compressed and pushed back to the cull 14 side through the gate 16 and the recess 14 a is formed to increase the volume of the cull 14. . On the other hand, in this embodiment, when the second mold force is applied to the mold 2 by further bringing the upper mold 3 and the lower mold 4 closer from the state shown in FIG. Even if the resin 35 (surplus resin) is pushed back to the cal 14 side, the recess 14a is not formed. That is, the resin pressure from the surplus resin is applied to the center block 9, but the center block 9 does not move up.

  Thereafter, as shown in FIG. 9, when the second holding pressure is applied while the second clamping force is applied, the cull 14 (upper cull) is applied to the wiring board of the workpiece W placed on the lower mold 4. The center block 9 forming the bottom of the recess 14a of the part 14A) moves up. Further, the clamper block 8 forming the side portion of the recess 14a remains stopped. Therefore, the center block 9 moves upward to form the recess 14a, and the volume of the cull 14 increases.

  In the present embodiment, the center block 9 is configured to move upward so that the volume of the cull 14 increases in accordance with the resin 35 pushed back from the cavity 11. As described above, when compressing the resin 35 by applying the second clamping force, the center spring 9 does not move up, and the coil spring 17 has a large elastic force so as to move up when the second holding pressure is applied. Even if is used, the same effect as in the first embodiment can be obtained.

(Embodiment 3)
In FIG. 10, the cross section of the metal mold | die 2 which is the principal part of the resin sealing apparatus 1B in this embodiment is shown. In addition, in FIG. 10, although the right side (one side) metal mold | die 2 is shown from the dashed-dotted line, the left side also has the same structure. The cavity block 7 in the resin sealing device 1B is formed with a recess 7a that opens toward the lower mold 4 side, and an opening edge of the recess 7a is inclined inward to form a tapered surface. . Further, the center block 9 in the resin sealing device 1B is formed with a recess 9a that opens toward the lower mold 4 side, and the opening edge of the recess 9a is inclined inward to form a tapered surface. ing.

  In this way, by forming the concave portions 7a and 9a having tapered surfaces on the clamp surface of the upper mold 3 on which the release film 18 is adsorbed, in order to change the volume of the cavity 11 and the cull 14, Even if the center block 9 is moved, the release film 18 can be prevented from being torn. If the release film 18 is not torn, it is not necessary to replace the release film 18. That is, the productivity of the molded product molded by the resin sealing device 1B can be improved.

  The center block 9 is assembled to the base block 5 so as to move up and down by a coil spring 17. For this reason, the center block 9 comes into contact with the coil spring 17 at the outer peripheral portion of the surface facing the base block 5. Since the coil spring 17 resists the pressing force from the resin 35, it is desirable that the pressing force from the resin 35 acts on the outer peripheral portion in contact with the coil spring 17. Therefore, in the present embodiment, the concave portion 9a is formed in the center block 9, and a tapered surface that is inclined inwardly (center side) is formed on the opening edge portion (outer peripheral portion). Thereby, the pressing force from the resin 35 suitably acts on the center block 9, and the productivity of the molded product molded by the resin sealing device 1B can be improved.

  Although the present invention has been specifically described above based on the embodiments, it is needless to say that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention.

  In the above-described embodiment, a case has been described in which a cavity having a variable volume is formed by assembling a fixed cavity block and a vertically moving clamper block to the base block. Not limited to this, for example, by fixing the clamper block to the base block and supporting it by hanging via a coil spring and assembling the cavity block so as to move up and down, a cavity with variable volume is formed. Also good.

  Further, in the above-described embodiment, the case where the concave cavity opened at the clamp surface of the upper mold is provided has been described. However, the present invention is not limited thereto, and the configuration of the upper mold and the lower mold may be reversed to provide a concave cavity that opens at the clamp surface of the lower mold.

  Moreover, the center block 9 is good also as a round shape according to a pot shape. Moreover, it is good also as a round-shaped 2nd center block movable within the fixed 1st center block.

1A Resin sealing device 3 Upper die 4 Lower die 8 Clamper block 9 Center block 11 Cavity 14 Cull 16 Gate 28 Pot 31 Plunger 35 Resin W Workpiece

Claims (6)

The first and second molds provided opposite to each other are clamped close to each other, the resin supplied to the pot is pushed out by a plunger that moves up and down, and the resin is pumped to the cavity through the cull and the gate. A resin sealing device for resin sealing the workpiece with
The first mold varies the volume of the cavity by moving up and down, varies the volume of the cull by moving up and down with the first block formed with the first through hole and the second through hole, and the second mold . A second block inserted into the through hole; and a third block inserted into the first through hole ;
The cavity is formed using the second mold side surface of the third block and the inner peripheral surface of the first through hole,
The pot has a tapered surface inclined toward the plunger side at an opening edge, and an inner peripheral surface continuous with the tapered surface,
The first block is moved to reduce the volume of the cavity filled with resin, and the resin is pushed back to the cull side through the gate, and the volume of the cull is increased in accordance with the pushed back resin. in moving state of the two blocks and the plunger, and the cull is first cull portion formed using the inner peripheral surface of the second mold side and the second through hole of the second block, the plunger A resin sealing device , wherein the first mold side surface and the second cull portion formed using the tapered surface of the pot are provided to face each other . The resin sealing device according to claim 1,
When the resin is pushed back to the cull side, the tip of the plunger is moved to a depth reaching the inner peripheral surface of the pot. In the resin sealing device according to claim 1 or 2 ,
Tip of the plunger, Ri frustoconical der, circumferential grooves are formed,
The resin sealing device , wherein the circumferential groove is provided with a seal ring in contact with the inner peripheral surface of the pot . The first and second molds provided opposite to each other are clamped close to each other, the resin supplied to the pot is pushed out by a plunger that moves up and down, and the resin is pumped to the cavity through the cull and the gate. A resin sealing device for resin sealing the workpiece with
The first mold has a first block that varies the volume of the cavity by vertical movement, and a second block that varies the volume of the cull by vertical movement,
The second block has a recess that is open toward the second mold side,
The opening edge of the recess is inclined;
Move the first block to reduce the volume of the cavity filled with resin, and push the resin back to the cull side through the gate,
A resin sealing device, wherein the second block is moved so as to increase the volume of the cull in accordance with the resin pushed back. The resin sealing device according to claim 4 ,
The cull is opposed to a first cull portion formed using the second block on the first mold side and a second cull portion formed using the pot on the second mold side. A resin sealing device characterized by being provided. In the resin sealing device according to claim 4 or 5 ,
The pot into which the plunger is inserted has a tapered surface inclined toward the plunger side at an opening edge, and an inner peripheral surface continuous with the tapered surface.

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