JP6470599B2 - Mold - Google Patents

Description

  The present invention relates to a technique effective when applied to a molding die.

  In the plunger described in Japanese Patent Application Laid-Open No. 2004-134607 (hereinafter referred to as “Patent Document 1”), a circumferential groove is formed in the head portion (tip portion), and on the side surface of the plunger tip rather than the circumferential groove. A tapered portion is formed. According to this, resin remains in the circumferential groove by the resin sealing operation to form a resin ring, and the resin ring can prevent the resin debris from flowing on the plunger rear end side.

  The plunger described in Japanese Patent Application Laid-Open No. 2007-15119 (hereinafter referred to as “Patent Document 2”) is provided with a plunger ring made of a material (resin) having a thermal expansion coefficient larger than that of the metal constituting the pot in the head portion. It has been. According to this, the gap between the pot and the pot disappears due to the thermal expansion of the plunger ring, and the resin debris can be prevented from dropping below the plunger.

  In the plunger described in Japanese Patent Laid-Open No. 2003-175535 (hereinafter referred to as “Patent Document 3”), a sealing member made of resin is provided below the head portion. The sealing member is provided with a groove surrounding the head portion on the upper surface of the sealing member exposed from the head portion, and a small deformation portion is provided between the groove and the outer peripheral side surface of the sealing member. It has been. According to this, when the resin is pumped, the deformed portion is deformed so as to bend toward the outer peripheral side surface of the sealing member under pressure from the resin filling the groove, and the gap between the sealing member and the pot Occurrence can be suppressed.

  Japanese Patent Application Laid-Open No. 2012-166432 (hereinafter referred to as “Patent Document 4”) describes a pot provided on the bottom surface of a cavity recess and a relative advance and retreat (reciprocation) in the pot according to a mold closing operation. A molding die having a plunger provided to do so is described.

  In Japanese Patent No. 5174874 (hereinafter referred to as “Patent Document 5”), an upper mold, a lower mold comprising a frame member and a bottom member which can be moved up and down within the frame member, are arranged opposite to the upper mold. A compression mold is provided.

JP 2004-134607 A JP 2007-15119 A JP 2003-175535 A JP 2012-166432 A Japanese Patent No. 5174874

  For example, in recent years, thinning (miniaturization) has been demanded for molded products in which electronic components such as semiconductor chips are sealed with resin (resin-sealed products such as semiconductor devices). For this reason, when performing transfer molding in accordance with the reduction in thickness of a molded product, it is performed in a small-capacity cavity, and a resin having higher fluidity and higher adhesion has been used.

  When a highly fluid resin is used in transfer molding, the resin is likely to leak into the gap between the pot (penetrating member) and the plunger when the plunger (pressing member) moves forward and backward. As a result, galling occurred on the plunger sliding surface, causing malfunction of the plunger. Further, if the resin leaks into the gap, the resin hardens and the advance / retreat resistance (sliding resistance) of the plunger increases. As a result, the resin is deposited on the lower side of the resin plunger, resulting in malfunction of the plunger, and damage to the plunger or transfer unit. If the forward / backward resistance changes in this way, a difference occurs in the pressure with which the plunger pumps the resin into the cavity, which causes a void when the resin is sealed. Therefore, the quality (reliability) of the molded product is deteriorated. For this reason, it is required to prevent the resin from leaking through the gap between the pot and the plunger.

  In addition, when a highly adhesive resin is used, the cured resin tends to stick to the pressing surface (head upper surface) of the head portion that pumps the resin. If the resin sticks to the head part, it will be chipped when the molded product is released from the mold, and this will cause conveyance failure. Therefore, the productivity of the molded product is reduced. For this reason, it is required to improve the maintainability of the plunger.

  Also, in compression molding, when a plunger (for example, see Patent Document 4) or a bottom member (for example, see Patent Document 5) provided on the bottom surface of the cavity is used, a pressing member (movable) that moves forward and backward (up and down movement). Therefore, it is required to prevent the resin from leaking (entering) at the sliding portion (gap).

  The objective of this invention is providing the technique which can prevent that resin leaks around a press member. Another object of the present invention is to provide a technique capable of improving the maintainability of a movable member. The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

A molding die according to an embodiment of the present invention includes a penetrating member (pot or clamper) having a through hole, and a pressing member (plunger or cavity piece) having a pressing surface that is inserted into the through hole and presses the resin. A molding die in which the penetrating member and the pressing member are provided so as to be relatively movable back and forth. The pressing member has a flange portion at an end portion and a circumferential groove is formed on an outer peripheral side surface. A seal ring (plunger ring or cavity ring) is fitted into the circumferential groove so as to protrude from the outer peripheral side surface of the pressing member and close the gap with the inner peripheral surface of the penetrating member. Ho設of an annular groove made is formed, the annular groove, the shape extending from the opening edge of the flange portion side opening edge of the flange portion and the opposite side is radially inward The flange portion side opening edge is chamfered so that the opening is on the inner side in the predetermined dimension radial direction with respect to the opening edge opposite to the flange portion, and the flange portion The outer diameter of the annular groove is the same as the outer diameter of the opening edge on the flange portion side of the annular groove, and the outer diameter of the position that is not the circumferential groove of the head main body is the flange of the annular groove. It is characterized by being smaller than the outer diameter of the opening edge on the opposite side . According to this, since resin accumulates in the resin reservoir portion, it is possible to prevent the resin from leaking around the pressing member.

  In the molding die according to the one embodiment, it is more preferable that a resin ring is formed in the resin reservoir portion and the seal ring is deformed so as to expand its diameter. As described above, the seal ring is deformed in the diameter increasing direction, thereby closing (or reducing) the gap between the pressing member and the penetrating member, and the pressing member slides relatively. Therefore, it is possible to prevent the resin from leaking around the pressing surface.

  In the molding die according to the embodiment, a communication groove that communicates from the pressing surface to the resin reservoir portion is formed on the outer peripheral side surface of the pressing member so as to intersect the circumferential groove. preferable. According to this, when the resin is pressed by the pressing surface, the resin can enter the resin reservoir through the communication groove.

  A molding die according to another embodiment of the present invention includes a penetrating member having a through hole, and a pressing member having a pressing surface that is inserted into the through hole and presses the resin, and the penetrating member and the pressing member Is a molding die provided so as to be relatively movable back and forth, and a circumferential groove is formed on the outer peripheral side surface of the pressing member, and protrudes from the outer peripheral side surface of the pressing member with the inner peripheral surface of the penetrating member. A seal ring is fitted in the circumferential groove so as to close the gap, and the seal ring moves in the diameter-expanding direction by a reaction force of a pressing force pressing the resin by the pressing surface. Here, the seal ring is divided and laminated into a first ring and a second ring, and a dividing surface between the first ring and the second ring is formed as a tapered surface, or More preferably, the contact surface between the seal ring and the pressing member is a tapered surface. According to this, the seal ring moves in the diameter increasing direction, and the pressing member slides by closing (or reducing) the gap on the inner peripheral surface of the penetrating member, so that the resin leaks around the pressing surface. Can be prevented.

  A molding die according to another embodiment of the present invention includes a penetrating member having a through hole, and a pressing member having a pressing surface that is inserted into the through hole and presses the resin, and the penetrating member and the pressing member Is a molding die provided so as to be relatively movable back and forth, and a circumferential groove is formed on the outer peripheral side surface of the pressing member, and protrudes from the outer peripheral side surface of the pressing member with the inner peripheral surface of the penetrating member. A seal ring is fitted into the circumferential groove so as to close the gap, and a part of the seal ring is a porous material or a heat-resistant cloth. According to this, since resin accumulates in the porous material or the heat resistant cloth, it is possible to prevent the resin from leaking around the pressing member.

  In the molding die according to the embodiment, the pressing member includes a flange portion that presses resin, and a receiving portion of the seal ring to which the flange portion is assembled, and the seal ring includes the flange portion and the flange portion. It is more preferable that the peripheral groove formed between the receiving portion and the receiving portion is fitted and assembled. According to this, even if there is a defect in the seal ring, the seal ring can be easily replaced.

  Of the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows. According to one embodiment of the present invention, it is possible to prevent the resin from leaking around the pressing member.

It is an exploded view of the plunger which concerns on one Embodiment of this invention. It is a side view of the plunger shown in FIG. It is an expanded sectional view of the plunger shown in FIG. It is principal part sectional drawing of the resin sealing apparatus provided with the plunger which concerns on one Embodiment of this invention. It is operation | movement explanatory drawing of the resin sealing apparatus shown in FIG. It is an expanded sectional view of the plunger which concerns on other embodiment of this invention. It is an expanded sectional view of the plunger which concerns on other embodiment of this invention. It is an expanded sectional view of the plunger which concerns on other embodiment of this invention. It is an expanded sectional view of the plunger which concerns on other embodiment of this invention. It is an expanded sectional view in which the dimensional relationship of the plunger shown in FIG. 3 is understood. It is principal part sectional drawing of the resin sealing apparatus provided with the plunger which concerns on other embodiment of this invention. It is principal part sectional drawing of the resin sealing apparatus provided with the cavity piece which concerns on other embodiment of this invention. It is an exploded view of the cavity piece which concerns on other embodiment of this invention. It is explanatory drawing of the member which comprises the cavity piece shown in FIG. It is explanatory drawing of the member which comprises the cavity piece shown in FIG. It is explanatory drawing of the member which comprises the cavity piece shown in FIG. It is a side view of the cavity piece shown in FIG. It is an expanded sectional view of the cavity piece shown in FIG. It is principal part sectional drawing of the resin sealing apparatus provided with the cavity piece which the present inventors examined. It is an expanded sectional view of the cavity piece which concerns on other embodiment of this invention. It is explanatory drawing of the cavity piece which concerns on other embodiment of this invention. It is an exploded view of the cavity piece shown in FIG. It is explanatory drawing of the cavity piece which concerns on other embodiment of this invention. It is an exploded view of the cavity piece shown in FIG. It is explanatory drawing of the cavity piece which concerns on other embodiment of this invention. FIG. 26 is an exploded view of the cavity piece shown in FIG. 25. It is explanatory drawing of the member which comprises the cavity piece which concerns on other embodiment of this invention. It is explanatory drawing of the modification of the cavity piece shown in FIG. It is principal part sectional drawing of the resin sealing apparatus provided with the cavity piece which concerns on other embodiment of this invention.

  In the following embodiments of the present invention, the description will be divided into a plurality of sections when necessary. However, in principle, they are not irrelevant to each other, and one of them is related to some or all of the other modifications, details, etc. It is in. For this reason, the same code | symbol is attached | subjected to the member which has the same function in all the figures, and the repeated description is abbreviate | omitted.

  In addition, the number of components (including the number, numerical value, quantity, range, etc.) is limited to that specific number unless otherwise specified or in principle limited to a specific number in principle. It may be more than a specific number or less. In addition, when referring to the shape of a component, etc., it shall include substantially the same or similar to the shape, etc., unless explicitly stated or in principle otherwise considered otherwise .

(Embodiment 1)
A plunger 10 according to an embodiment of the present invention will be described mainly with reference to FIGS. FIG. 1 is an exploded view of the plunger 10 before it is assembled. FIG. 2 is a side view after the plunger 10 is assembled. FIG. 3 is an enlarged cross-sectional view of the plunger 10 (head portion 11) surrounded by a circle A indicated by a one-dot chain line shown in FIG. For the sake of clarity, the inside of the plunger 10 is indicated by a broken line in FIGS. 1 and 2, and in particular, the rod portion 24 and the knock pin 19 are hatched in FIG.

  The plunger 10 is inserted into a cylindrical pot P (see FIGS. 4 and 5) so as to be movable back and forth (slidable), and has a pressing surface 21a that presses the resin R supplied to the pot P. (Tip). Here, since the plunger 10 has a pressing surface 21a that presses the resin R, it becomes a pressing member, and the pot P becomes a penetrating member because it has a through hole into which the plunger 10 is inserted. The head portion 11 is configured such that a flange portion 21 having a pressing surface 21a (head upper surface) for pressing the resin R and a head main body portion 31 can be divided. Specifically, the head portion 11 is configured by integrally assembling a first holder 20 having a flange portion 21 and a second holder 30 having a head main body portion 31.

  As shown in FIG. 1, the first holder 20 has a flange portion 21 and a rod portion 24. The flange portion 21 has a predetermined thickness and has an outer diameter slightly smaller than the inner diameter of the pot P. The rod portion 24 is connected to the lower surface (the surface opposite to the pressing surface 21a) of the flange portion 21 so as to extend in the direction of the plunger shaft 10a (see FIG. 2). The first holder 20 is made of, for example, alloy steel or cemented carbide steel so that the flange portion 21 and the rod portion 24 are integrated.

  On the pressing surface 21 a of the flange portion 21, a matte surface (not shown) is formed. Further, on the outer peripheral side surface of the flange portion 21, as an example, a taper surface (inclined surface) having a curve (curved surface) so as to narrow toward the pressing surface 21 a side and having a θ of about 15 to 20 degrees with respect to the vertical direction. It is formed (see FIG. 10). That is, a curved surface is formed at the outer peripheral edge 21b of the pressing surface 21a. For this reason, the head part 11 (flange part 21) becomes a dome shape. Further, the rod part 24 is formed with a knock pin hole 25 penetrating in the radial direction. The knock pin 19 is inserted into the knock pin hole 25 (see FIG. 2).

  Moreover, the 2nd holder 30 has the head main-body part 31 and the trunk | drum 32 (shaft part), as shown in FIG. The head main body 31 has a predetermined thickness as a receiving portion for the plunger ring 12 described later, and is formed to have an outer diameter slightly smaller than the inner diameter of the pot P. The body portion 32 is connected to the head main body portion 31 so as to extend in the direction of the plunger shaft 10 a, and is formed with a diameter smaller than that of the head main body portion 31. The second holder 30 is made of, for example, alloy steel or cemented carbide steel so that the head main body 31 and the body 32 are integrated.

  An insertion portion 33 into which the rod portion 24 of the first holder 20 is inserted is formed in the body portion 32 in the direction of the plunger shaft 10a. The body portion 32 is formed with a knock pin hole 34 penetrating in the radial direction of the body portion 32. The knock pin 19 is inserted into the knock pin hole 34 (see FIG. 2).

  Here, a method of assembling the first holder 20 and the second holder 30 will be described. First, the rod portion 24 of the first holder 20 is inserted into the insertion portion 33 from the upper end surface of the head main body portion 31 of the second holder (see the arrow in FIG. 1). At this time, the positions of the knock pin hole 34 of the body portion 32 and the knock pin hole 25 of the rod portion 24 inserted into the insertion portion 33 are matched. Next, the knock pin 19 is inserted from the outer peripheral side surface of the body portion 32 so as to pass through the knock pin hole 34 and the knock pin hole 25 (see FIG. 2). Accordingly, the first holder 20 is prevented from coming off by the knock pin 19 and the first holder 20 and the second holder 30 are assembled.

  Thus, the ring circumferential groove 14 is formed over the entire circumference of the outer peripheral side surface of the head portion 11 in the circumferential direction of the plunger shaft 10 a by assembling the first holder 20 and the second holder 30. In FIG. 1, the ring circumferential groove 14 formed in the head portion 11 is illustrated for clarity of explanation.

  In the present embodiment, an end surface circumferential convex portion 35 protruding from the upper end surface is provided on the upper end surface (end surface on the flange portion 21 side) of the head main body 31. For this reason, by assembling the first holder 20 and the second holder 30, an area surrounded by the lower surface of the flange portion 21, the upper end surface of the head main body portion 31, and the outer peripheral surface of the end surface circumferential convex portion 35 is It is formed as a groove 14. That is, in the head portion 11, the ring circumferential groove 14 is formed over the entire circumference of the outer peripheral side surface of the head portion 11 between the flange portion 21 and the head main body portion 31 and in the circumferential direction of the plunger shaft 10 a. . The end surface circumferential convex portion 35 can be provided not only on the upper end surface of the head main body portion 31 but also on the lower surface of the flange portion 21 (see FIG. 9).

  An annular plunger ring 12 is provided around (inserted into) the ring circumferential groove 14 formed in this way. In the present embodiment, the inner diameter of the through hole 12 b of the plunger ring 12 is the same as the outer diameter of the end surface circumferential convex portion 35. Therefore, when the first holder 20 and the second holder 30 are assembled, the annular plunger ring 12 is fitted into the end surface circumferential convex portion 35, and the plunger ring 12 is held (assembled) by the first holder 20 and the second holder 30. Can do.

  In the present embodiment, the plunger ring 12 is made thinner than the head main body 31. That is, since the head main body 31 is a receiving portion (supporting portion) for the plunger ring 12, the thickness of the head main body 31 is thicker than that of the flange portion 21. Further, since the plunger ring 12 is held by the flange portion 21, the thickness of the end surface circumferential convex portion 35 is made substantially the same or slightly thinner than the plunger ring 12.

  In this embodiment, an annular plunger ring 12 is provided in the ring circumferential groove 14 so as to protrude from the outer peripheral side surface of the head portion 11. As shown in FIG. 10, the outer diameter of the plunger ring 12 is larger than the outer diameter of the flange portion 21 and the head main body portion 31 by the dimension a, and is almost the same as the inner diameter of the pot P.

  Thus, by providing the plunger ring 12 protruding from the outer peripheral side surface of the head portion 11 and reducing the gap between the plunger 10 and the pot P, it is possible to prevent the resin R from leaking around the head portion 11. That is, it is possible to prevent the advance / retreat resistance of the plunger 10 from increasing due to resin leakage. Here, the plunger ring 12 serves as a seal ring for sealing the gap between the plunger 10 and the pot P.

  Further, by reducing the gap between the head portion 11 and the pot P and preventing resin leakage, the resin debris is prevented from dropping to the plunger rear end side (the body portion 32 side), and the number of maintenance is suppressed. be able to. Further, by reducing the thickness of the plunger ring 12, it is possible to prevent the advance / retreat resistance of the plunger 10 from increasing. Even if the plunger ring 12 has a problem, by dividing the flange portion 21 and the head main body portion 31, the plunger ring 12 can be easily replaced, and the maintainability can be improved.

  Moreover, in this embodiment, the pressing surface 21a of the flange part 21 is made into a pear ground. Since the resin wax component is held on the pressing surface 21a of the matte ground surface, it is possible to assist the mold release between the heat-cured resin R and the head portion 11 (to facilitate the mold release). That is, it is possible to prevent the thermosetting resin R from adhering to the head portion 11. Therefore, the maintenance frequency can be suppressed.

  Here, it is preferable to use a hard material with a small amount of wear even if the plunger ring 12 moves back and forth in the pot P. In the present embodiment, the plunger ring 12 made of metal (for example, a steel material such as stainless steel or spring steel) is used. By using the plunger ring 12 made of a metal, it becomes harder than that made of a resin, and its durability is improved. Therefore, the rate at which the plunger ring 12 is broken can be made extremely low, and the number of maintenance can be suppressed. In addition, the occurrence of poor advance / retreat failure of the plunger 10 can be prevented.

  Further, it is effective to subject the plunger ring 12 made of metal, for example, to a plating treatment as a surface treatment. By the plating process, for example, a hard Cr film, a CrN film, and a TiN film are formed on the surface of the plunger ring 12. For this reason, the whole plunger ring 12 becomes harder and the durability of the plunger 10 and the advance / retreat performance can be improved. The plunger ring 12 can also be improved in forward and backward movement by forming a nitride layer by performing, for example, nitriding as another surface treatment.

  Furthermore, in this embodiment, as shown in FIG. 3, a resin reservoir 12 a (annular groove) is formed over the entire circumference on the outer peripheral side surface of the plunger ring 12 on the flange portion 21 side. On the lower side of the flange portion 21, there may or may not be a straight portion b dimension (see FIG. 10). The opening edge on the flange portion 21 side of the resin reservoir portion 12a is chamfered, and the opening of the resin reservoir portion 12a is widened by the dimension a on the flange portion 21 side. Further, as described above, the outer peripheral edge 21b of the pressing surface 21a is formed in a curved surface. For this reason, when the head part 11 presses the resin R, the resin reservoir 12a is filled (entered) with the resin R, and a resin ring RL made of the cured resin R is formed on the outer peripheral side surface of the plunger ring 12. . There may or may not be a slight straight portion c (see FIG. 10) between the contact portion of the plunger ring 12 with the flange portion 21 and the resin reservoir RL.

  Thus, by making the outer peripheral edge 21b of the pressing surface 21a into a curved surface, the resin R can be accumulated in the resin reservoir 12a to form the resin ring RL. Thus, by attaching the resin ring RL to the outer peripheral side surface of the plunger ring 12, the gap between the head portion 11 and the pot P can be closed (smaller), and the plunger 10 can be slid. Therefore, it is possible to further prevent the resin R from leaking around the head portion 11. After resin sealing, the resin R is divided (cut into pieces) at the narrow boundary between the plunger ring 12 and the flange portion 21 (see FIG. 3), so that one becomes the resin ring RL and remains on the plunger 10 side, and the other It becomes the Cal side.

  Further, when the resin ring RL is removed from the head portion 11, the plunger ring 12 can be exchanged with the resin ring RL attached by dividing the flange portion 21 and the head main body portion 31. Further, since the resin ring RL may be removed from the divided plunger ring 12, the plunger ring 12 can be easily cleaned.

  Next, a case where the above-described plunger 10 is applied to a resin sealing device 100 having a transfer mechanism will be described with reference to FIGS. 4 and 5. 4 and 5 are cross-sectional views of a main part (molding mold 60) of the resin sealing device 100 including the plunger 10. FIG. For clarity of explanation, FIGS. 4 and 5 show the plunger 10 in a side view.

  The resin sealing device 100 includes, for example, at least one press unit between a supply unit and a storage unit (not shown). Each press part is provided with at least one molding die 60 in which a cavity C is formed in a closed state, and a plunger 10 that pumps molten resin R into a resin path to the cavity C.

  A supply part is comprised by the well-known mechanism which supplies the workpiece | work W which is a to-be-molded product, and resin R for sealing to a press part using a loader (conveyance apparatus). In addition, the storage unit is configured by a known mechanism that takes out and stores the workpiece W, which is a molded product molded by resin sealing, using an unloader (conveying device) from the press unit. The resin sealing device 100 may be a manual type that includes only a press unit (molding die 60) without including a supply unit and a storage unit.

  For example, the workpiece W is mounted with a plurality of electronic components (for example, not only semiconductor chips but also electric and electronic components including capacitors, resistors, etc.) on a substrate (organic substrate, ceramic substrate, etc.) or a lead frame. Is. The resin R is a variety of sealing resins such as tablets, liquids, granules, powders, and sheets.

  The molding die 60 (press part) includes an upper die 61 (one die) and a lower die 62 (the other die), and a cylindrical pot P provided on the lower die 62 to which the resin R is supplied. And a plunger 10 accommodated in the pot P so as to be movable back and forth in the mold opening / closing direction (vertical direction). In the central portion of the lower mold 62, set portions 64 for setting the workpiece W are provided on both sides of the pot P that opens at the parting surface.

  A drive mechanism (not shown) for moving the plunger 10 back and forth in the mold opening / closing direction is provided below the lower mold 62. For example, the drive mechanism uses a drive force generated by a hydraulic pressure or an electric motor, and the drive mechanism and the plunger 10 include an upper end surface of a push rod provided in the drive mechanism and a rear end portion of the plunger 10. The key is engaged and connected in a retaining state.

  In order to manufacture a molded product using the molding die 60, first, in a state where the mold is opened, the resin R is supplied to the pot P and the work W (molded product) is supplied to the set portion 64. At this time, the head portion 11 of the plunger 10 in the pot P is in a position (standby position) retracted from the parting surface (see FIG. 4). Thereafter, as shown in FIG. 4, the workpiece W is clamped by the upper die 61 and the lower die 62 by closing the die. At this time, the cavity C is formed in the molding die 60. The cavity C and the pot P communicate with each other via a cull 65 and a runner gate 66.

  Subsequently, as shown in FIG. 5, the head portion 11 of the plunger 10 is advanced to the top dead center position while pressing the molten resin R. As a result, the resin R is pumped (injected) from the pot P into the cavity C through the cull 65 and the runner gate 66. And the work W is substantially completed as a molded article by filling the cavity C with the resin R and thermally curing it. In the present embodiment, the tip of the plunger 10 (the top dead center position of the head portion 11) is not advanced (not raised) into the cull 65.

  According to the resin sealing device 100 including the plunger 10, the resin leakage is prevented around the head portion 11, that is, in the gap between the head portion 11 and the pot P (inner peripheral surface of the pot P). It is possible to prevent the void from being generated when the resin is sealed in the cavity C by suppressing the increase / decrease resistance of the resin. Therefore, it is possible to prevent the quality of the molded product from being deteriorated.

  Further, by preventing resin leakage, it is possible to prevent the resin debris from dropping to the plunger rear end side (inside the mold) and to reduce the number of maintenance. Even if the plunger ring 12 has a problem, by dividing the flange portion 21 and the head main body portion 31, the plunger ring 12 can be easily replaced, and the maintainability can be improved. Therefore, the productivity of the molded product can be improved.

(Embodiment 2)
In the first embodiment, the case where the resin ring RL is formed on the outer peripheral side surface of the plunger ring 12 to close (or reduce) the gap between the head portion 11 and the pot P has been described. In the present embodiment, a case where a shape different from that of the plunger ring 12 is used will be described with reference to FIG. FIG. 6 is an enlarged cross-sectional view of the plunger 10 (head portion 11) according to the present embodiment.

  The plunger ring 12 </ b> A according to the present embodiment is provided around the ring circumferential groove 14 so as to protrude from the outer peripheral side surface of the head portion 11. On the end surface of the plunger ring 12A on the flange portion 21 side, a resin reservoir portion 12a (annular groove portion) that is cut over the entire circumference is formed. The end of the outer peripheral edge 21b of the pressing surface 21a overlaps the opening of the resin reservoir 12a.

  As described above, the outer peripheral edge 21b of the pressing surface 21a is formed in a curved surface. For this reason, the head part 11 becomes dome shape. When the head portion 11 presses the resin R, the resin R enters the resin reservoir 12a, and the outer peripheral portion of the plunger ring 12A is deformed so as to expand (fall down) to the pot P side (outside).

  Thus, the plunger ring 12A can be deformed by receiving pressure from the resin R by making the outer peripheral edge portion 21b of the pressing surface 21a a curved surface. Since the outer peripheral part of the plunger ring 12A is deformed in the diameter increasing direction, the gap between the head part 11 and the pot P can be closed (or reduced), and the plunger 10 can be slid. Therefore, it is possible to prevent the resin R from leaking around the head portion 11.

(Embodiment 3)
In the first embodiment, the case where the resin ring RL is formed on the outer peripheral side surface of the plunger ring 12 to close (or reduce) the gap between the head portion 11 and the pot P has been described. In the present embodiment, a case where a shape different from that of the plunger ring 12 is used will be described with reference to FIG. FIG. 7 is an enlarged cross-sectional view of the plunger 10 (head portion 11) according to the present embodiment.

  The plunger ring 12 </ b> B according to the present embodiment is provided around the ring circumferential groove 14 so as to protrude from the outer peripheral side surface of the head portion 11. In addition to the plunger ring 12B, a wedge ring 13 is provided around the ring circumferential groove 14 so as to be laminated with the plunger ring 12B. If the plunger ring 12B (first ring) and the wedge ring 13 (second ring) provided around the ring circumferential groove 14 are regarded as a plunger ring, they are divided and stacked.

  The wedge ring 13 is formed so that the outer diameter is slightly smaller than the inner diameter of the pot P and the inner diameter is substantially the same as the outer diameter of the end surface circumferential convex portion 35. The material of the wedge ring 13 may be the same material as the plunger ring 12 or may be a different material. Further, the wedge ring 13 may be an elastic body.

  The plunger ring 12B is formed with a tapered surface (inclined surface) at the lower end surface on the wedge ring 13 side so that the plunger ring 12B is thinner on the inner diameter side and thicker on the outer diameter side. On the other hand, the upper surface of the plunger ring 12B side is formed as a tapered surface (inclined surface) so that the wedge ring 13 is thicker on the inner diameter side and thinner on the outer diameter side.

  In this embodiment, the tapered surface (lower end surface) of the plunger ring 12B and the tapered surface (upper end surface) of the wedge ring 13 are opposed to each other, and the plunger ring 12B and the wedge ring 13 are combined into a wedge structure. That is, the dividing surface of the plunger ring 12B and the wedge ring 13 is formed into a tapered surface. As will be described later, this wedge structure moves the plunger ring 12B in the diameter expansion direction by the reaction force of the pressing force from the flange portion 21.

  In the present embodiment, the flange portion 21 is assembled so as not to contact the head main body portion 31 (end surface circumferential convex portion 35), and a gap G is formed between the flange portion 21 and the head main body portion 31 (end surface circumferential convex portion 35). ing. On the other hand, the flange portion 21 is assembled so as to contact the upper end surface of the plunger ring 12B.

  For this reason, when the head portion 11 presses the resin R, a resin pressure (pressurization) is applied to the pressing surface 21a of the flange portion 21, and the flange portion 21 slightly moves toward the head main body portion 31 within the gap G. Move down. Then, due to the reaction force of the pressing force from the flange portion 21, the plunger ring 12 </ b> B is moved (pushed apart) in the diameter increasing direction (pot P side).

  By moving the plunger ring 12B in the diameter expanding direction, the gap between the head portion 11 and the pot P can be closed (or reduced), and the plunger 10 can be slid. Therefore, it is possible to prevent the resin R from leaking around the head portion 11. In addition, if the plunger ring 12B is moved in the diameter expansion direction by the reaction force of the pressing force from the flange portion 21, the plunger ring 12B and the wedge ring 13 can be stacked upside down.

(Embodiment 4)
In the third embodiment, a case where a wedge structure in which the plunger ring 12B and the wedge ring 13 are paired is used and the plunger ring 12B moves in the diameter expansion direction by the reaction force of the pressing force from the flange portion 21 has been described. In the present embodiment, a case where the shape of the ring circumferential groove 14 is changed instead of the wedge ring 13 will be described with reference to FIG. FIG. 8 is an enlarged cross-sectional view of the plunger 10 (head portion 11) according to the present embodiment.

  The plunger ring 12 </ b> B according to the present embodiment is provided around the ring circumferential groove 14 so as to protrude from the outer peripheral side surface of the head portion 11. The plunger ring 12B has a tapered lower end surface that is thin on the inner diameter side and thicker on the outer diameter side. And in this embodiment, the skirt part of the end surface surrounding convex part 35 in which this plunger ring 12B is fitted is formed in the taper surface corresponding to the taper surface of the plunger ring 12B.

  That is, the contact surface between the plunger ring 12B and the ring circumferential groove 14 (head portion 11) is formed as a tapered surface. Thus, in this embodiment, the tapered surface (lower end surface) of the plunger ring 12B and the tapered surface of the ring circumferential groove 14 are opposed to each other to form a wedge structure.

  For this reason, when the head portion 11 presses the resin R, a resin pressure (pressurization) is applied to the pressing surface 21a of the flange portion 21, and the flange portion 21 slightly moves toward the head main body portion 31 within the gap G. Move down. The plunger ring 12B is moved (pushed and expanded) in the diameter expansion direction (pot P side) by the reaction force of the pressing force from the flange portion 21. By moving the plunger ring 12B in the diameter expanding direction, the gap between the head portion 11 and the pot P can be closed (or reduced), and the plunger 10 can be slid. Therefore, it is possible to prevent the resin R from leaking around the head portion 11.

(Embodiment 5)
In the fourth embodiment, the case where the ring circumferential groove 14 is provided on the head main body 31 side and the tapered surface constituting the wedge structure is formed in the ring circumferential groove 14 has been described. In the present embodiment, a case where the ring circumferential groove 14 is provided on the flange portion 21 side and a tapered surface forming a wedge structure is formed in the ring circumferential groove 14 will be described with reference to FIG. FIG. 9 is an enlarged cross-sectional view of the plunger 10 (head portion 11) according to the present embodiment.

  The plunger ring 12 </ b> C according to the present embodiment is provided around the ring circumferential groove 14 so as to protrude from the outer peripheral side surface of the head portion 11. The plunger ring 12C is formed in a wedge structure in which the inner peripheral surface (the inner wall surface of the through hole 12b) is a tapered surface so that the inner diameter is large on the upper side in the thickness direction and smaller on the lower side in the thickness direction. Yes. In this embodiment, the end surface circumferential convex portion 35 into which the plunger ring 12C is fitted is provided on the lower end surface of the flange portion 21, and the outer peripheral side surface of the end surface circumferential convex portion 35 is a taper corresponding to the tapered surface of the plunger ring 12C. Formed on the surface.

  That is, the contact surface between the plunger ring 12C and the ring circumferential groove 14 (head portion 11) is formed into a tapered surface. Thus, in the present embodiment, the tapered surface (inner peripheral surface) of the plunger ring 12C and the tapered surface of the ring peripheral groove 14 are opposed to each other to form a wedge structure.

  For this reason, when the head portion 11 presses the resin R, a resin pressure (pressurization) is applied to the pressing surface 21a of the flange portion 21, and the flange portion 21 slightly moves toward the head main body portion 31 within the gap G. Move down. Then, due to the reaction force of the pressing force from the flange portion 21, the plunger ring 12 </ b> C moves (is pushed and expanded) in the diameter expansion direction (the pot P side). By moving the plunger ring 12C in the diameter increasing direction, the gap between the head portion 11 and the pot P can be closed (or reduced), and the plunger 10 can be slid. Therefore, it is possible to prevent the resin R from leaking around the head portion 11.

(Embodiment 6)
A compression-molding molding die 60, which is a main part of the resin sealing device 100 according to the embodiment of the present invention, will be described with reference to FIG. FIG. 11 is a cross-sectional view of a molding die 60 (a pair of an upper die 61 and a lower die 62) that is a main part of the resin sealing device 100. A plunger 10 (a side surface is shown) shown in FIG. 11 has the head portion 11 (end portion) described in the first to fifth embodiments, and has an opening (communication) at the bottom surface of the cavity C (cavity recess). It is inserted into a cylindrical pot P that can move forward and backward. The molding die 60 shown in FIG. 11 is in a state where the mold is opened by a known mold opening / closing mechanism (the upper mold 61 and the lower mold 62 are separated from each other). Resin R is set (arranged) in the cavity C. A workpiece W shown in FIG. 11 is obtained by surface-mounting a plurality of electronic components B (for example, semiconductor chips) in a matrix on one side of a substrate S (for example, a wiring substrate). Moreover, although resin R shown in FIG. 11 is a granular thing, it may be liquid, a powder form, and a tablet form. The number, size, and shape of the plunger 10 are not limited to those shown in FIG. 11, and the plunger 10 and the cavity C may be provided in the upper mold 61 with the mold configuration turned upside down.

  An upper mold 61 (one mold of the molding mold 10) shown in FIG. 11 includes a base 71, a chase 72, a guide 73, and an insert 74. These are mold blocks that are assembled to form the upper mold 61. The base 71 is fixed to a fixed platen (not shown). A chase 72 is fixed to the base 71. In the chase 72, a guide 73 is fixed to the outer peripheral portion opposite to the base 71 side. An insert 74 is supported by the guide 73 so as to contact the chase 72.

  The insert 74 is supported by guides 73 on both sides so as to protrude downward, a suction surface 74a (also referred to as a mold clamp surface 74a) for sucking and holding the workpiece W on the lower die 62 side, and a step on the outer peripheral side portion. The section 74b is formed with a convex section. Further, the guide 73 has a stepped portion 73a on the inner side and has an L-shaped cross section. For this reason, the insert 74 is supported by the guide 73 by the step 74 b of the insert 74 and the step 73 a of the guide 73 engaging with each other.

  In addition, an air suction path 76 communicating with the suction surface 74a is formed in the insert 74. The air suction path 76 is connected to an air suction path (not shown) formed in the chase 72, and further, a suction device (not shown) for sucking air provided outside the molding die 60. It is connected. In addition, a ring-shaped seal member 77 (for example, an O-ring) is sandwiched between the insert 74 and the chase 72 so as to ensure the airtightness of the air suction path 76. For this reason, when the suction device is activated, the workpiece W is sucked and held on the suction surface 74a of the insert 74 via the air suction path 76 and the like.

  A lower mold 62 (the other mold of the molding mold 10) shown in FIG. 11 includes a base 81, a chase 82, a clamper 83, a pot P, and a plunger 10. These are mold blocks that are assembled to form the lower mold 62. The base 81 is fixed to a movable platen (not shown). A chase 82 is fixed to the base 81.

  In this chase 82, the clamper 83 is always urged upward by an elastic member 84 elastically mounted between the chase 82. A through-hole penetrating in the thickness direction is formed in the center portion of the clamper 83, and the cylindrical pot P is secured to the through-hole so as not to come off. The clamper 83 of the lower mold 62 is formed with a cavity C that is recessed from the mold clamp surface 83a and opens. A pot P is provided on the bottom surface of the cavity C. The pot P has a plunger ring 12 (seal ring) that relatively moves forward and backward (reciprocates) in accordance with the mold closing operation. Is provided.

  Here, the configuration in which the plunger 10 moves forward and backward relative to the clamper 83 will be specifically described. A clamper 83 in which a cavity C (cavity recess) is formed is assembled to the chase 82 via an elastic member 84. The plunger 10 inserted into the through hole (pot P) of the clamper 83 is fixed and assembled to the chase 82. For this reason, when the mold 60 is closed, the plunger 10 can be relatively raised by moving the clamper 83 by pressing and contracting the elastic member 84. That is, in the pot P, the plunger 10 becomes a movable member and relatively moves back and forth (reciprocates) according to the mold closing operation.

  In this embodiment, as the plunger 10, for example, as shown in FIG. 3, the circumferential groove 14 provided in the circular head portion 11 in plan view (clamp surface view) has a larger outer shape than the head portion 11, and the resin pool What has the circular annular plunger ring 12 in which the part 12a (annular groove part) was formed is used. By using such a plunger ring 12, when the resin R is pressed by the plunger 10, the resin R is prevented from leaking from the sliding portion of the plunger 10 (movable member) (the gap between the plunger 10 and the pot P). can do. Moreover, when there is a malfunction in the plunger ring 12 (for example, sliding resistance increases), the plunger ring 12 itself can be easily replaced, and the maintainability of the plunger 10 (movable member) is improved. be able to. In addition, the plunger ring 12B as shown in FIG. 6, FIG. 7, FIG. 8, and FIG. 9 can also be used, and the same effect can be obtained.

  The operation method (resin molding method) of the molding die 60 (resin sealing device 100) provided with such a plunger 10 is as follows. First, the workpiece W and the resin R are set (arranged) inside the die while the mold is opened. To do. The workpiece W is carried (supplied) into the mold by a loader (not shown) and set on the suction surface 74a. Resin R is carried (supplied) into the mold by a loader (not shown), and set in pot P and cavity C (cavity recess) (see FIG. 11). Next, the mold is closed by the mold opening / closing mechanism, and the workpiece W is clamped by the upper mold 61 and the lower mold 62. As a result, the substrate S is sandwiched between the mold clamping surface 74a of the upper mold 61 and the mold clamping surface 83a of the lower mold 62, and the electronic component B is cavity C (the cavity recess is closed by the substrate S). ). Note that the inside of the cavity C is decompressed by a decompression mechanism (not shown).

  Subsequently, the mold member 60 is further closed (clamped) by the mold opening / closing mechanism, whereby the elastic member 84 is pressed and contracted, and the plunger 10 is raised relative to the clamper 83. Accordingly, the resin R melted in the cavity C is pressed by the plunger 10 and the resin R is filled in the cavity C. Next, the resin R filled in the cavity C is held at a predetermined resin pressure (that is, holding pressure), and the molding die 60 is heated to a predetermined temperature to cure (cure) the resin R. Thereafter, the molding die 60 is opened, and the workpiece W (molded product) is taken out from the molding die 60 and stored in the storage unit by an unloader (not shown).

(Embodiment 7)
A compression molding mold 60, which is a main part of the resin sealing device 100 according to the embodiment of the present invention, will be described with reference to FIG. FIG. 12 is a cross-sectional view of a molding die 60 (a pair of an upper die 61 and a lower die 62) that is a main part of the resin sealing device 100. The resin sealing device 100 includes, for example, a press unit having at least one molding die 60 between a supply unit and a storage unit (not shown). The mold 60 shown in FIG. 12 is closed so that a cavity C (cavity recess) in a plan view (clamp view) provided in the lower mold 62 is closed (upper mold 61 and lower mold). 62 is approaching, and the workpiece W is clamped). A workpiece W shown in FIG. 12 is obtained by wire bonding mounting a plurality of electronic components B (for example, semiconductor chips) in a matrix on one side of a substrate S (for example, a wiring substrate). ) Further, the resin R shown in FIG. 12 is in a melted state in the form of granules, liquid, powder, etc., and fills the cavity C of the lower mold 62. Note that the mold configuration may be turned upside down so that the cavity C is provided in the upper mold 61.

  The upper mold 61 shown in FIG. 12 has the same configuration as the upper mold 61 shown in FIG. On the other hand, the lower mold 62 shown in FIG. 12 includes a base 81, a chase 82, a clamper 83, and a cavity piece 110. These are mold blocks that are assembled to form the lower mold 62. The base 81 is fixed to a movable platen (not shown). A chase 82 is fixed to the base 81. In the chase 82, the clamper 83 is always urged upward by an elastic member 84 elastically mounted between the chase 82. In the center portion of the clamper 83, a through-hole 83b (storage portion) that penetrates in the thickness direction is formed. The cavity piece 110 to be inserted into the through hole 83 b of the mold clamper 83 is fixedly assembled to the chase 82. For this reason, when the mold 60 is closed, the cavity piece 110 can be relatively raised by pressing the elastic member 84 and moving the clamper 83. That is, in the through hole 83b of the clamper 83, the cavity piece 110 becomes a movable member and relatively moves back and forth (reciprocates) according to the mold closing operation. For this reason, the cavity piece 110 can press the resin R filled in the cavity C. In addition, since the depth (volume) of the cavity C (cavity recess) is changed by the forward and backward movement of the cavity piece 110, the cavity C is configured as a movable cavity.

  The clamper 83 of the lower mold 62 is provided with a cavity C (cavity recess) that is recessed from the mold clamping surface 83a and opens. Specifically, the bottom surface of the cavity C is constituted by the upper end surface of the cavity piece 110 inserted into the through hole 83b of the clamper 83, and the side surface (inner wall surface) of the cavity C extends from the through hole 83b of the clamper 83 to the mold clamping surface. It is composed of a tapered surface of a clamper 83 that expands to 83a. In this embodiment, the cavity C has a rectangular shape in plan view (clamp surface view), and the shape of the cavity piece 110 that forms the bottom surface of the cavity C also has a rectangular shape.

  Here, the cavity piece 110 according to the present embodiment will be described mainly with reference to FIGS. 13 to 18. FIG. 13 is an exploded view before the cavity piece 110 is assembled. 14-16 is explanatory drawing of the member which comprises the cavity piece 110. FIG. 14, (a) is a plan view of the arrow a in (b) and (c), (b) is a side view of the arrow b in (a) and (c), and (c) is (a) It is a front view of the arrow c view in () and (b). The same applies to each of FIGS. 15 and 16. FIG. 17 is a side view after the cavity piece 110 is assembled. 18 is an enlarged cross-sectional view of the cavity piece 110 (head portion 111) surrounded by a circle A (dashed line) shown in FIG. Note that in FIG. 13 to FIG. 17, a perspective view or a virtual view is indicated by a broken line.

  As described above, the cavity piece 110 (see FIGS. 12 and 17) that is inserted into the through hole 83b of the clamper 83 so as to be relatively movable back and forth presses the resin R supplied to the bottom surface of the cavity C. A head portion 111 (tip portion) having a surface 121a (head upper surface) is provided. The head portion 111 includes an upper holder 120 having a flange portion 121 having a pressing surface 121 a (head upper surface) for pressing the resin R, a lower holder 130 having a head main body portion 131, and the upper holder 120 and the lower holder 130. A cavity ring 112 sandwiched between them is integrally assembled. Here, the cavity piece 110 is a pressing member because it has a pressing surface 121a for pressing the resin R, and the clamper 83 is a penetration member because it has a through hole 83b into which the cavity piece 110 is inserted. The cavity ring 112 serves as a seal ring for sealing the gap between the cavity piece 110 and the clamper 83. In the present embodiment, as the bottom shape of the cavity C, the end surface of the head portion 111 of the cavity piece 110 is formed in a rectangular shape. Further, the cavity ring 112 (see FIGS. 13 and 15) assembled to the head portion 111 has a rectangular shape in a plan view and has a through hole 112b.

  Further, the upper holder 120 (see FIGS. 13 and 14) has a flange portion 121 and a projection portion 124 (rod portion) that are rectangular in plan view. The flange portion 121 has a predetermined thickness and is formed in a size slightly smaller than the size of the through hole 83 b of the clamper 83. The entire outer peripheral edge 121b of the flange 121 is formed with a tapered surface (inclined surface) with a curve (curved surface) so as to be narrowed toward the pressing surface 121a (for example, as shown in FIG. θ is about 15 to 20 degrees). The protrusion 124 protrudes (connects) from the lower surface of the flange 121 (the surface opposite to the pressing surface 121a) so as to extend in the direction of the central axis 110a (see FIG. 17). Further, the projection 124 is formed with a knock pin hole 125 penetrating in the longitudinal direction. A knock pin 119 is inserted into the knock pin hole 125 (see FIG. 17). The upper holder 120 is made of, for example, alloy steel or cemented carbide steel so that the flange portion 121 and the protruding portion 124 are integrated.

  Further, the lower holder 130 (see FIGS. 13 and 16) includes a head body 131 and a body 132 (shaft) that are rectangular in plan view. The head main body 131 has a predetermined thickness as a receiving portion of the cavity ring 112 and is formed slightly smaller than the size of the through hole 83b. The body portion 132 is connected to the head main body portion 131 so as to extend in the direction of the central axis 110a, and is formed to be slightly smaller than the head main body portion 131. The lower holder 130 is made of, for example, alloy steel or cemented carbide steel so that the head main body 131 and the body 132 are integrated. An insertion portion 133 into which the protrusion 124 of the upper holder 120 is inserted is formed in the body portion 132 in the direction of the central axis 110a. The body portion 132 is formed with a knock pin hole 134 that penetrates in the longitudinal direction of the body portion 132. A knock pin 119 is inserted into the knock pin hole 134 (see FIG. 17).

  In the present embodiment, an end surface circumferential convex portion 135 protruding from the upper end surface is provided on the upper end surface (end surface on the flange portion 121 side) of the head main body 131. For this reason, by assembling the upper holder 120 and the lower holder 130, a region surrounded by the lower surface of the flange portion 121, the upper end surface of the head main body portion 131, and the outer peripheral surface of the end surface circumferential convex portion 135 is a ring circumferential groove 114. Formed as. That is, a ring circumferential groove 114 having a rectangular shape in plan view is formed over the entire circumference of the outer peripheral side surface of the head portion 111 (see FIG. 13). A rectangular annular cavity ring 112 (see FIG. 15) is provided around (inserted into) the ring circumferential groove 114 formed in this manner. Specifically, when assembling the upper holder 120 and the lower holder 130, the rectangular annular cavity ring 112 is fitted into the end surface circumferential convex portion 135 that is rectangular in plan view, and the cavity ring 112 is held by the upper holder 120 and the lower holder 130. (Connected).

  In the present embodiment, the cavity ring 112 is thinner than the head main body 131. That is, since the head main body 131 is a receiving portion (supporting portion) for the cavity ring 112, the thickness of the head main body 131 is thicker than the flange portion 121. Further, since the cavity ring 112 is held by the flange portion 121, the thickness of the end surface circumferential convex portion 135 is made substantially the same or slightly thinner than the thickness of the cavity ring 112. A rectangular annular cavity ring 112 is provided in the ring circumferential groove 114 so as to protrude from the outer peripheral side surface of the head portion 111.

  For the cavity ring 112, it is preferable to use a hard material with a small amount of wear even if the cavity ring 112 moves back and forth (slides) in the through hole 83b. In the present embodiment, the cavity ring 112 made of metal (for example, a steel material such as stainless steel or spring steel) is used. By using the cavity ring 112 made of a metal, it becomes harder than that made of a resin, and its durability is improved. Therefore, the rate at which the cavity ring 112 is damaged can be made extremely low, and the number of maintenance can be suppressed. Further, it is possible to prevent the advancement / retraction failure of the cavity piece 110. Further, it is effective to subject the cavity ring 112 made of metal, for example, to plating as a surface treatment.

  Further, as shown in FIG. 18A, the cavity ring 112 has a resin reservoir portion 112a (annular groove portion recessed in an arc) formed over the entire circumference on the outer peripheral side surface on the flange portion 121 side. Yes. Further, the opening edge of the resin reservoir 112a on the flange 121 side is chamfered, and the opening of the resin reservoir 112a is widely formed on the flange 121 side. Therefore, when the head portion 111 presses the resin R, the resin reservoir portion 112a is filled (entered) with the resin R, and as shown in FIG. 18B, the resin cured on the outer peripheral side surface of the cavity ring 112. A resin ring RL made of R is formed. Thus, by forming the resin ring RL on the outer peripheral side surface of the cavity ring 112, the gap between the head portion 111 and the through hole 83b can be closed (reduced), and the cavity piece 110 can be slid. Therefore, it is possible to further prevent the resin R from leaking around the head portion 111.

  By the way, as shown in FIG. 19, when the cavity piece 110 ′ provided in the lower mold 62 in the conventional molding die 60 ′ (resin sealing device 100 ′) is moved, the resin R is compressed and molded. The release film F was provided in order to prevent the movement failure due to resin leakage. In particular, in the case of the cavity piece 110 ′ having a rectangular shape in plan view (clamp surface view), a gap between the cavity piece 110 ′ and the through hole 83 b is likely to be formed at the corner portion, and the release film F is necessary. It was thought.

  On the other hand, in this embodiment, as the cavity piece 110, the outer shape of the circumferential groove 114 provided in the rectangular head portion 111 in plan view (clamp surface view) is larger than the head portion 111, and the resin reservoir portion 112a (annular) A rectangular ring-shaped cavity ring 112 having a groove) is used. By using such a cavity ring 112, when the resin R is pressed by the cavity piece 110 without using a release film, the sliding part of the cavity piece 110 (movable member) (the cavity piece 110 and the through hole 83b) It is possible to prevent the resin R from leaking from the gap. In addition, when there is a defect in the cavity ring 112 (for example, sliding resistance increases), the cavity ring 112 itself can be easily replaced, and the maintainability of the cavity piece 110 (movable member) is improved. Can be made.

  The operation method (resin molding method) of the molding die 60 (resin sealing device 100) provided with such a cavity piece 110 is first set (arranged) with the workpiece W and the resin R inside the die with the mold opened. ) The workpiece W is carried (supplied) into the mold by a loader (not shown) and set on the suction surface 74a. The resin R is carried (supplied) into the mold by a loader (not shown) and set in the cavity C (cavity recess). Next, the mold is closed, and the workpiece W is clamped by the upper mold 61 and the lower mold 62. As a result, the substrate S is sandwiched between the mold clamping surface 74a of the upper mold 61 and the mold clamping surface 83a of the lower mold 62, and the electronic component B is cavity C (the cavity recess is closed by the substrate S). ). Note that the inside of the cavity C is decompressed by a decompression mechanism (not shown).

  Subsequently, the elastic member 84 is further compressed by closing the mold 60 (clamping), and the cavity piece 110 is raised relative to the clamper 83. Accordingly, the resin R melted in the cavity C is pressed by the cavity piece 110 and the resin R is filled in the cavity C. Next, the resin R filled in the cavity C is held at a predetermined resin pressure (that is, holding pressure), and the molding die 60 is heated to a predetermined temperature to cure (cure) the resin R. Thereafter, the molding die 60 is opened, and the workpiece W (molded product) is taken out from the molding die 60 and stored in the storage unit by an unloader (not shown).

  When the mold is opened, as shown in FIG. 18B, the resin R is divided (cut into pieces) at the narrow boundary between the cavity ring 112 and the flange portion 121, so that one becomes the resin ring RL and the cavity It remains on the piece 110 side, and the other is the cull side. Further, when removing the resin ring RL from the head portion 111, the cavity ring 112 can be replaced with the resin ring RL attached by dividing the flange portion 121 and the head main body portion 131. Further, since the resin ring RL may be removed from the divided cavity ring 112, the cavity ring 112 can be easily cleaned.

(Embodiment 8)
In the seventh embodiment, the case where the resin ring RL is formed on the outer peripheral side surface of the cavity ring 112 to close (or reduce) the gap between the head portion 111 and the through hole 83b (see FIG. 12) has been described. In the present embodiment, a case where a shape different from that of the cavity ring 112 is used will be described with reference to FIG. FIG. 20 is an enlarged cross-sectional view of the cavity piece 110 (head portion 111). Modification examples of the cavity piece 110 are shown in (a), (b), (c), (d), (e), and (f). Shown in each.

  The cavity ring 112 </ b> A shown in FIG. 20A is provided around the ring circumferential groove 114 so as to protrude from the outer peripheral side surface of the head portion 111. On the end surface of the cavity ring 112A on the flange portion 121 side, a resin reservoir portion 112a (annular groove portion) that is cut over the entire circumference is formed. The end of the outer peripheral edge 121b (tapered surface) overlaps (communicates) with the opening of the resin reservoir 112a. For this reason, when the head portion 111 presses the resin R, the resin R enters the resin reservoir portion 112a, and the outer peripheral portion of the cavity ring 112A is deformed so as to fall outward (through the through hole 83b). That is, the cavity ring 112A can be deformed by receiving pressure from the resin R. Thereby, the cavity piece 110 can be slid by closing (or reducing) the gap between the head portion 111 and the through hole 83b. Therefore, it is possible to prevent the resin R from leaking around the cavity piece 110.

  The cavity ring 112 </ b> B shown in FIG. 20B is provided around the ring circumferential groove 114 so as to protrude from the outer peripheral side surface of the head portion 111. In addition to the cavity ring 112B, the ring circumferential groove 114 is provided with a rectangular ring-shaped wedge ring 113 similar to the cavity ring 112B in a laminated manner with the cavity ring 112B. In the cavity ring 112B, the lower end surface on the wedge ring 113 side is formed into a tapered surface (inclined surface) so that the thickness is thin on the inside and thick on the outside. On the other hand, the upper end surface of the wedge ring 113 on the cavity ring 112B side is formed into a tapered surface (inclined surface) so that the thickness is thick on the inside and thin on the outside. The tapered surface (lower end surface) of the cavity ring 112B and the tapered surface (upper end surface) of the wedge ring 113 are opposed to each other, and the cavity ring 112B and the wedge ring 113 are combined into a wedge structure.

  If the cavity ring 112B (first ring) and the wedge ring 113 (second ring) provided around the ring circumferential groove 114 are regarded as a plunger ring, they are divided and laminated. The wedge ring 113 is formed so that the outer size is slightly smaller than the through-hole 83 b and the inner size is substantially the same as the outer shape of the end surface circumferential convex portion 135. The material of the wedge ring 113 may be the same material as the cavity ring 112 or may be a different material. The wedge ring 113 may be an elastic body.

  Thus, in the cavity ring 112B shown in FIG. 20B, the flange portion 121 is assembled so as not to contact the head main body portion 131 (end surface circumferential convex portion 135), and the flange portion 121 and the head main body portion 131 (end surface circumferential convex portion 135) are assembled. A gap G is formed between them. On the other hand, the flange portion 121 is assembled so as to contact the upper end surface of the cavity ring 112B. For this reason, when the head portion 111 presses the resin R, a resin pressure (pressurization) is applied to the pressing surface 121a of the flange portion 121, and the flange portion 121 slightly moves toward the head main body portion 131 within the gap G. Move down. Then, the cavity ring 112B is moved to the outside (through the through hole 83b side) by the reaction force of the pressing force from the flange portion 121 (pushed out). By moving the cavity ring 112B in the outward direction, the cavity piece 110 can be slid by closing (or reducing) the gap between the head portion 111 and the through hole 83b. Therefore, it is possible to prevent the resin R from leaking around the head portion 111. If the cavity ring 112B is moved outward by the reaction force of the pressing force from the flange portion 121, the cavity ring 112B and the wedge ring 113 can be stacked upside down.

  The cavity ring 112 </ b> B shown in FIG. 20C is provided around the ring circumferential groove 114 so as to protrude from the outer peripheral side surface of the head portion 111. The cavity ring 112B has a tapered lower end surface that is thin on the inside and thick on the outside. In FIG. 20C, the skirt portion of the end surface circumferential convex portion 135 into which the cavity ring 112B is fitted is formed in a tapered surface corresponding to the tapered surface of the cavity ring 112B. That is, the contact surface between the cavity ring 112B and the ring circumferential groove 114 (head portion 111) is formed into a tapered surface. The tapered surface (lower end surface) of the cavity ring 112B and the tapered surface of the ring circumferential groove 114 are opposed to each other to form a wedge structure. For this reason, when the head portion 111 presses the resin R, a resin pressure (pressurization) is applied to the pressing surface 121a of the flange portion 121, and the flange portion 121 slightly moves toward the head main body portion 131 within the gap G. Move down. Then, due to the reaction force of the pressing force from the flange portion 121, the cavity ring 112B moves (is pushed and expanded) in the outer direction (through hole 83b side). By moving the cavity ring 112B in the outward direction, the cavity piece 110 can be slid by closing (or reducing) the gap between the head portion 111 and the through hole 83b. Therefore, it is possible to prevent the resin R from leaking around the head portion 111.

  The cavity ring 112 </ b> C shown in FIG. 20 (d) is provided in the ring circumferential groove 114 so as to protrude from the outer peripheral side surface of the head portion 111. The cavity ring 112C is formed in a wedge structure in which an inner peripheral surface (an inner wall surface of the through hole 112b) is a tapered surface so as to be wide on the upper side in the thickness direction and narrow on the lower side in the thickness direction. In FIG. 20D, the end surface circumferential convex portion 135 into which the cavity ring 112C is fitted is provided on the lower end surface of the flange portion 121, and the outer peripheral side surface of the end surface circumferential convex portion 135 corresponds to the tapered surface of the cavity ring 112C. It is formed on a tapered surface. That is, the contact surface between the cavity ring 112C and the ring circumferential groove 114 (head portion 111) is formed into a tapered surface. The tapered surface (inner peripheral surface) of the cavity ring 112C and the tapered surface of the ring peripheral groove 114 are opposed to each other to form a wedge structure. For this reason, when the head portion 111 presses the resin R, a resin pressure (pressurization) is applied to the pressing surface 121a of the flange portion 121, and the flange portion 121 slightly moves toward the head main body portion 131 within the gap G. Move down. Then, the cavity ring 112 </ b> C moves (is pushed and spread) in the outer direction (through hole 83 b side) by the reaction force of the pressing force from the flange portion 121. By moving the cavity ring 112C in the outward direction, the cavity piece 110 can be slid by closing (or reducing) the gap between the head portion 111 and the through hole 83b. Therefore, it is possible to prevent the resin R from leaking around the head portion 111.

  A cavity ring 112 </ b> D shown in FIG. 20 (e) is provided in the ring circumferential groove 114 so as to protrude from the outer peripheral side surface of the head portion 111. An annular groove 112a is formed on the end surface of the cavity ring 112D on the flange 121 side over the entire circumference, and a Y-shaped packing 112c that opens to the flange 121 is provided in the annular groove 112a. An example of the Y-shaped packing is made of heat-resistant silicone. The end of the outer peripheral edge 121b (tapered surface) of the pressing surface 121a overlaps the opening of the packing 112c. For this reason, when the head part 111 presses the resin R, the resin R enters the packing 112c, and the opening of the packing 112c is deformed so as to expand outward (through hole 83b side). That is, the cavity ring 112D can be deformed by receiving pressure from the resin R. Thereby, the cavity piece 110 can be slid by closing (or reducing) the gap between the head portion 111 and the through hole 83b. Therefore, it is possible to prevent the resin R from leaking around the cavity piece 110.

  The cavity ring 112E shown in FIG. 20 (f) is provided around the ring circumferential groove 114 so as to protrude from the outer peripheral side surface of the head portion 111. An annular groove 112a is formed over the entire periphery of the end surface of the cavity ring 112E on the flange 121 side, and a resin absorbing member 112d is provided in the annular groove 112a. The resin absorbing member 112d is, for example, a metal or ceramic porous material, or a heat resistant cloth (glass cloth) such as a plain weave or a twill weave. For this reason, when the head portion 111 presses the resin R, the resin R enters the resin absorbing member 112d (for example, a gap between the porous material or the heat-resistant cloth) and hardens, so that the resin R does not fall off and the cavity ring 112E is removed. Part of According to the cavity ring 112E, the cavity piece 110 can be slid by closing (or reducing) the gap between the head portion 111 and the through hole 83b. Accordingly, since the resin R accumulates in the resin absorbent 112d, it is possible to prevent the resin R from leaking around the cavity piece 110.

  In the present embodiment, the case where various cavity rings 112A, 112B, 112C, 112D, and 112E are applied to the cavity piece 110 as seal rings has been described. However, similar seal rings may be used in the plunger described in the first embodiment, for example. The ring 12 can be applied to the plunger 10.

(Embodiment 9)
In the seventh embodiment, the connection structure of the cavity piece 110 (see FIGS. 13 and 17) that is divided into the upper holder 120, the cavity ring 112, and the lower holder 130 has been described. In the present embodiment, a connection structure of the cavity pieces 110A, 110B, and 110C that are divided into the upper holder 120, the cavity ring 112, the middle holder 130A, and the lower holder 130B will be described with reference to FIGS. 21 and 22 are explanatory views of members constituting the cavity piece 110A, FIGS. 23 and 24 are explanatory views of members constituting the cavity piece 110B, and FIGS. 25 and 26 are explanatory views of members constituting the cavity piece 110C. It is. In the cavity piece 110A after assembly shown in FIG. 21, (a) is a plan view as seen from the arrow a in (b) and (c), and (b) is a side view as seen from the arrow b in (a) and (c). FIG. 4C is a front view as viewed in the direction of arrow c in FIGS. The same applies to the cavity piece 110B after assembly shown in FIG. 23 and the cavity piece 110C after assembly shown in FIG. Moreover, in the cavity piece 110A before the assembly shown in FIG. 22, (a) is a side view corresponding to FIG. 21 (b), and (b) is a front view corresponding to FIG. 21 (c). The same applies to the cavity piece 110B before assembly shown in FIG. 24 and the cavity piece 110C before assembly shown in FIG. In FIG. 21 to FIG. 26, what is seen through is indicated by a broken line.

  First, a schematic configuration of the cavity pieces 110A, 110B, and 110C will be described. Cavity pieces 110A, 110B, and 110C having a head portion 111 replace the cavity piece 110 in the molding die 60 (see FIG. 12) to form the bottom surface of the cavity C, and are relatively within the through hole 83b of the clamper 83. It is inserted so that it can move forward and backward. The cavity pieces 110A, 110B, and 110C include an upper holder 120 having a flange portion 121 having a pressing surface 121a for pressing the resin R, a cavity ring 112, a middle holder 130A having a head main body portion 131, and a body portion 132. The lower holder 130 </ b> B is configured to be integrally assembled using a knock pin 119. The cavity pieces 110A, 110B, and 110C divided into four parts do not need to have a large distance for separating the upper mold 61 and the lower mold 62 as compared with the cavity piece 110 divided into three parts. The cavity ring 112 can be easily separated by removing the knock pin 119 from the side or front side.

  The cavity pieces 110A and 110B use two knock pins 119 extending in the short direction in plan view (clamp surface view), and the cavity piece 110C uses one knock pin 119 extending in the longitudinal direction. Further, in the cavity pieces 110A and 110C, a knock pin 119 is provided by being inserted into the head main body part 131 on the body part 132 side, and in the cavity piece 110B, the knock pin 119 is provided by being inserted into the head main body part 131 on the flange part 121 side. It is done. For example, when removing the cavity ring 112, the knock pin 119 is extracted and then divided, but the cavity pieces 110A, 110B, and 110C that allow the knock pin 119 to be easily inserted and removed can be selected depending on the structure of the molding die 60. .

  Next, a specific configuration of the cavity piece 110A will be described with reference to FIGS. The upper holder 120 of the cavity piece 110A has a flange 121 and a projection 124A that are rectangular in plan view. The flange portion 121 has a predetermined thickness and is formed in a size slightly smaller than the size of the through hole 83b (see FIG. 12) of the clamper 83. A tapered surface (inclined surface) with a curve (curved surface) is formed on the outer peripheral edge portion 121b of the flange portion 121 so as to be narrowed toward the pressing surface 121a. The protruding portion 124A is formed so as to protrude from the lower surface of the flange portion 121 (the surface opposite to the pressing surface 121a) into an L-shaped steel shape (L shape when viewed from the front). A knock pin hole 125A penetrating in the short direction is formed in the protruding portion 124A (a portion protruding further).

  Further, the lower holder 130B of the cavity piece 110A has a body part 132 and a protrusion part 124B that are rectangular in plan view. The protrusion 124B is formed to protrude in a prismatic shape (rectangular shape in front view) from the upper surface of the body portion 132 (the prismatic protrusion 124B lies down). The protrusion 124B is formed with a knock pin hole 125B penetrating in the short direction. When the cavity piece 110A is assembled, the protrusion 124A (L-shaped steel) of the upper holder 120 and the protrusion 124B (square column shape) of the lower holder 130B are fitted together, and the knock pin hole 125A of the protrusion 124A and the protrusion The knock pin 125B of 124B is communicated.

  The middle holder 130A of the cavity piece 110A has a head main body 131 that is rectangular in plan view. The head main body 131 has a predetermined thickness as a receiving portion of the cavity ring 112, is formed slightly smaller than the size of the through hole 83 b (see FIG. 12) of the clamper 83, and is slightly larger than the body portion 132. . Further, the head main body 131 has an insertion portion 133 (through hole) into which the protrusion 124A of the upper holder 120 and the protrusion 124B of the lower holder 130B are fitted and inserted. The head main body 131 is formed with a knock pin hole 134 that penetrates in the lateral direction of the body portion 132. When the cavity piece 110A is assembled, the knock pin hole 134, the knock pin hole 125A of the protrusion 124A, and the knock pin 125B of the protrusion 124B communicate with each other, and the knock pin 119 is inserted into these.

  An end surface circumferential convex portion 135 protruding from the upper end surface is provided on the upper surface (end surface on the flange portion 121 side) of the head main body 131. By assembling the upper holder 120 and the middle holder 130 </ b> A, a region surrounded by the lower surface of the flange portion 121, the upper surface of the head main body portion 131, and the outer peripheral surface of the end surface circumferential convex portion 135 is formed as the ring circumferential groove 114. . That is, the ring circumferential groove 114 having a rectangular shape in plan view is formed over the entire circumference of the outer peripheral side surface of the head portion 111. A rectangular annular cavity ring 112 is provided around (inserted into) the ring circumferential groove 114. Specifically, when the upper holder 120 and the middle holder 130A are assembled, the rectangular annular cavity ring 112 is fitted into the end surface circumferential convex portion 135 that is rectangular in plan view, and the cavity ring 112 is held by the upper holder 120 and the middle holder 130A. (Connected).

  As for the specific configuration of the cavity piece 110B, as shown in FIGS. 23 and 24, the upper holder 120 is provided with a prismatic protrusion 124A, and the lower holder 130B is provided with an L-shaped steel protrusion 124B. The configuration is the same as that of the cavity piece 110A except that a knock pin 119 is provided in the short direction. As for the specific configuration of the cavity piece 110B, as shown in FIGS. 25 and 26, the upper holder 120 is provided with a bifurcated protrusion 124A, and the lower holder 130B is provided with a prismatic protrusion 124B. The configuration is the same as that of the cavity piece 110A except that the knock pin 119 is provided.

(Embodiment 10)
In the seventh embodiment, the case where the entire outer peripheral edge 121b of the flange 121 is a tapered surface has been described. In the present embodiment, the case where the communication groove 136 having a tapered surface is formed in a part of the outer peripheral edge 121b will be described with reference to FIGS. FIG. 27 is an explanatory view of members constituting the cavity piece 110, (a) is a plan view of the upper holder 120, (b) is a side view of the upper holder 120, and (c) is a main part of the cavity piece 110 ( It is sectional drawing of the head part 111). FIG. 28 is an explanatory diagram of a modified example of the cavity piece 110 shown in FIG. 27, and (a), (b), and (c) are cross-sectional views of the main part (head portion 111) of the different cavity piece 110. .

  As shown in FIG. 27C, a circumferential groove 114 is formed on the outer peripheral side surface of the cavity piece 110, and a cavity ring 112 having a resin reservoir 112 a (annular groove) is fitted into the circumferential groove 114. As shown in FIGS. 27A and 27B, in the flange 121 having a rectangular shape in plan view, the outer peripheral edge 121b has a straight shape (vertical surface shape) in the thickness direction. At a predetermined portion (corner portion or side portion) of the outer peripheral edge portion 121b (the outer peripheral side surface of the cavity piece 110), from the pressing surface 121a (the bottom surface of the cavity C) to the resin reservoir portion 112a so as to intersect the peripheral groove 114. A plurality of communication grooves 113 (vertical grooves) that communicate with each other are formed. In the communication groove 136, a tapered surface (inclined surface) with a curve (curved surface) is formed so as to be narrowed toward the pressing surface 121a side. Further, a resin reservoir portion 112a (annular groove portion) that is recessed in an arc shape over the entire periphery is formed on the end surface of the cavity ring 112 on the flange portion 121 side. The end of the communication groove 136 that narrows on the resin reservoir 112a side overlaps (communicates) with the opening of the resin reservoir 112a. For this reason, when the head portion 111 presses the resin R with the pressing surface 121a, the resin R is filled (entered) into the resin reservoir portion 112a via the communication groove 136, and the resin hardened on the outer peripheral side surface of the cavity ring 112. A resin ring RL made of R is formed. Thus, by forming the resin ring RL on the outer peripheral side surface of the cavity ring 112, the gap between the head portion 111 and the through hole 83b (see FIG. 12) is closed (reduced), and the cavity piece 110 is slid. be able to. Therefore, it is possible to prevent the resin R from leaking around the head portion 111.

  Further, as shown in FIG. 28 (a), a cavity ring 112 in which a resin reservoir 112a (annular groove) that is recessed in a rectangular shape is formed on the entire end surface on the flange 121 side is used. Also good. Further, as shown in FIG. 28B, the communication groove 136 may be a straight shape (vertical surface shape) in the thickness direction of the flange portion 121 instead of the tapered surface (inclined surface). In addition, as shown in FIG. 28C, the communication groove 136 may have a tapered surface that becomes wider on the resin reservoir 112a side. Also in the cavity piece 110 as shown in FIG. 28, when the head portion 111 presses the resin R with the pressing surface 121a, the resin R is filled (enters) into the resin reservoir portion 112a via the communication groove 136, and the cavity A resin ring RL made of the cured resin R is formed on the outer peripheral side surface of the ring 112. For this reason, even if the cavity piece 110 slides, the resin R can be prevented from leaking around the head portion 111.

(Embodiment 11)
A molding die 60 combining a transfer molding method and a compression molding method, which is a main part of the resin sealing device 100 according to the embodiment of the present invention, will be described with reference to FIG. FIG. 29 is a cross-sectional view of a molding die 60 (a pair of an upper die 61 and a lower die 62) that is a main part of the resin sealing device 100. The resin sealing device 100 includes, for example, a press unit having at least one molding die 60 between a supply unit and a storage unit (not shown). The molding die 60 shown in FIG. 29 is in a state where the mold is opened (the upper mold 61 and the lower mold 62 are separated) by a known mold opening / closing mechanism. The molding die 60 has a rectangular cavity C (cavity recess) in plan view (clamp surface view) provided in an upper mold 61, a work W in a lower mold 62, and a resin R set in a pot P (arrangement). Yes. A workpiece W shown in FIG. 29 is obtained by surface-mounting a plurality of electronic components B (for example, semiconductor chips) in a matrix on one side of a substrate S (for example, a wiring substrate). Moreover, although resin R shown in FIG. 29 is a tablet-like thing, a liquid, a powder form, a granular form, and a sheet-like thing may be sufficient. Note that the mold configuration may be turned upside down so that the cavity C is provided in the upper mold 61.

  Also in this embodiment, the cavity piece 110 having the cavity ring 112 is used as described in the seventh embodiment. By using the cavity ring 112, when the resin R is pressed by the cavity piece 110, the resin R leaks from the sliding portion of the cavity piece 110 (movable member) (the gap between the cavity piece 110 and the through hole 83b). It is preventing. In addition, when there is a defect in the cavity ring 112 (for example, sliding resistance increases), the cavity ring 112 itself can be easily replaced, and the maintainability of the cavity piece 110 (movable member) is improved. Can be made.

  The operation method (resin molding method) of the molding die 60 (resin sealing device 100) provided with such a cavity piece 110 is first set (arranged) with the workpiece W and the resin R inside the die with the mold opened. ) The workpiece W is carried (supplied) into the mold by a loader (not shown) and set on the suction surface 74a. Further, the resin R is carried (supplied) into the mold by a loader (not shown) and set in the pot P. The resin R set in the pot P is heated and melted by a heater incorporated in the mold. Next, the mold is closed by the mold opening / closing mechanism, and the workpiece W is clamped by the upper mold 61 and the lower mold 62. As a result, the substrate S is sandwiched between the mold clamp surface 83a of the upper mold 61 and the mold clamp surface 74a of the lower mold 62, and the electronic component B is cavity C (the cavity recess is closed by the substrate S). ). Note that the inside of the cavity C is decompressed by a decompression mechanism (not shown).

  Next, the plunger 10 is driven by a drive unit (not shown), the molten resin R is pressed, and injected into the cavity C through the cull 65 and the runner gate 66. At this stage, there is a sufficient gap between the upper surface of the electronic component B and the bottom surface of the cavity C, and the molten resin R is satisfactorily filled to every corner in the cavity C. Next, the mold member 60 is further closed (clamped) by the mold opening / closing mechanism, whereby the elastic member 84 is pressed and contracted, and the plunger 10 is lowered relative to the clamper 83. Accordingly, the clamper 83 approaches the lower mold 62 and the space (volume) in the cavity C is narrowed, so that the molten resin R in the cavity C is pushed back into the pot P. Next, the resin R filled in the cavity C is held at a predetermined resin pressure (that is, holding pressure), and the molding die 60 is heated to a predetermined temperature to cure (cure) the resin R. Thereafter, the molding die 60 is opened, and the workpiece W (molded product) is taken out from the molding die 60 and stored in the storage unit by an unloader (not shown). According to the molding die 60 according to the present embodiment, unfilling of the resin R can be prevented even in a thin molded product.

  Although the present invention has been specifically described above based on the embodiments, it is needless to say that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention.

  For example, in the first embodiment, the case where the plunger ring 12 made of metal is used has been described. Not only this but the plunger ring 12 which consists of resin materials, such as a plastic (for example, fluorine resin) and rubber | gum (for example, synthetic rubber, Y packing, or silicone rubber) can also be used. Alternatively, a plunger ring 12 made of an elastic material having a large thermal expansion coefficient (or linear expansion coefficient) such that the diameter of the plunger ring 12 is expanded by thermal expansion at the molding temperature can be used.

  For example, in the first embodiment, the case where the outer peripheral edge 21b of the pressing surface 21a is a curved surface (R-shaped tapered surface) has been described. Not limited to this, the outer peripheral edge 21b of the pressing surface 21a may be a simple flat taper surface (inclined surface) or a C-surface taper surface.

  Further, for example, in the first embodiment, the case where the plunger 10 is used for the resin sealing device 100 has been described. The plunger according to the present invention can be used not only for this but also for a device that presses a liquid such as a resin and pumps the liquid to a predetermined location.

DESCRIPTION OF SYMBOLS 10 Plunger 11 Head part 12 Plunger ring 12a Resin pool part 14 Ring circumferential groove P Pot R Resin

Claims (8)

A molding die provided with a penetrating member having a through hole and a pressing member having a pressing surface that is inserted into the through hole and presses the resin, and the penetrating member and the pressing member are provided so as to be relatively movable back and forth. Because
The pressing member has a flange portion at the end, and a circumferential groove is formed on the outer peripheral side surface.
A seal ring is fitted in the circumferential groove so as to protrude from the outer peripheral side surface of the pressing member and close the gap with the inner peripheral surface of the penetrating member,
The seal ring is formed with an annular groove serving as a resin reservoir ,
The annular groove portion is formed in a groove shape in which a shape extending from the opening edge on the flange portion side to the opening edge on the opposite side to the flange portion is digged radially inward, and the opening on the flange portion side The edge is chamfered and the opening is formed so that the opening is inward in the predetermined dimension radial direction from the opening edge opposite to the flange portion,
The outer diameter dimension of the flange portion is the same as the outer diameter dimension of the opening edge of the annular groove portion on the flange portion side, and the outer diameter dimension at a position other than the circumferential groove of the head main body portion is the same as that of the annular groove portion. A molding die characterized by being smaller than the outer diameter dimension of the opening edge opposite to the flange portion . The molding die according to claim 1,
A molding die, wherein a resin ring is formed in the resin reservoir, and the seal ring is deformed so as to expand its diameter. The molding die according to claim 1 or 2,
A molding die characterized in that a communication groove that communicates from the pressing surface to the resin reservoir is formed on the outer peripheral side surface of the pressing member so as to intersect the circumferential groove. In the molding die according to any one of claims 1 to 3 ,
The pressing member includes a flange portion that presses resin, and a receiving portion of the seal ring to which the flange portion is assembled,
The mold according to claim 1, wherein the seal ring is fitted and assembled in the circumferential groove formed between the flange portion and the receiving portion. In the molding die according to any one of claims 1 to 4 ,
The molding die, wherein the pressing member is a plunger and the penetrating member is a pot. In the molding die according to any one of claims 1 to 5 ,
The pressing mold is a cavity piece, and the penetrating member is a clamper. In the molding die according to any one of claims 1 to 6,
The pressing member is configured by connecting an upper holder, a middle holder, and a lower holder,
The upper holder includes the flange portion, and a first protrusion portion protruding from the flange portion and having a first knock pin hole,
The lower holder includes a body part, and a second protrusion part protruding from the body part and having a second knock pin hole,
The middle holder includes a through hole into which the first protrusion of the upper holder and the second protrusion of the lower holder are fitted together, and the first protrusion and the second protrusion in the through hole. A third knock pin hole communicating with the first knock pin hole and the second knock pin hole in a state in which the portion is fitted and inserted.
Mold characterized by In the molding die according to any one of claims 1 to 7,
The flange portion is formed with a plurality of longitudinal grooves communicating with the resin reservoir portion from the pressing surface at a predetermined location on the outer peripheral edge portion.
Mold characterized by

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