JP6546767B2 - Resin mold - Google Patents

Description

  The present invention relates to a technology that is effective when applied to a resin molding die.

  JP-A-2014-43058 (hereinafter referred to as "patent document 1") is formed on the sliding surface of the cavity piece in order to prevent the resin from leaking into the gap where the cavity piece and the clamper slide relative to each other. There is described a technique of forming a resin ring (sealing material) by filling resin in the circumferential groove.

JP, 2014-43058, A

  Even in the case of using the technology described in Patent Document 1, in order to prevent the resin from being clogged in the gap between the cavity piece and the clamper to reduce the slidability, the sliding surface of the cavity piece (bottom surface of the cavity It is necessary to perform maintenance such as cleaning the entire circumference) or replacing the entire cavity piece. However, for example, in the case of resin molding with a large cavity recess corresponding to a large-sized substrate (work), the cavity piece constituting the bottom of the cavity recess is also large and heavy. In addition, when a cavity piece other than a round shape is used, resin leakage is likely to occur, and assembly becomes difficult. For this reason, it is difficult to perform maintenance such as cleaning the sliding surface of the cavity piece or replacing the whole cavity piece, and a situation in which efficient production is impeded can be assumed.

  An object of the present invention is to provide a technique capable of improving maintainability. The above and other objects and novel features of the present invention will be apparent from the description of the present specification and the accompanying drawings.

The outline of typical ones of the inventions disclosed in the present application will be briefly described as follows. A resin molding die according to one solution means of the present invention comprises a first block constituting at least a part of the bottom surface of a cavity recess filled with resin, and an outer periphery of the first block and disposed in the cavity recess. A second block constituting at least a part of the wall is configured to be relatively slidable, and a sealing material is provided in a gap between the first block and the second block to seal the resin. In the resin molding die, a part of the first block holding the sealing material is replaceable at the time of the first block constituting the entire bottom surface of the cavity recess, or one of the bottom surfaces of the cavity recess part Ri entirely replaceable der of the first block when the first block constituting a brush to clean the distal end of the first block, surrounding the brush And a cleaner mechanism having a shielding member that abuts against the second block during cleaning, the tip of the first block is exposed beyond the parting surface of the second block, and the cleaner The front end portion of the first block is cleaned by a mechanical portion . According to this, since all or a part of the first block (i.e., a small one) is replaced, maintenance can be easily performed. Also, the number of times of exchanging all or part of the first block can be reduced.

  Further, in the resin molding die according to the one solution means, a part of the first block holding the sealing material is an annular protrusion which protrudes from a tip surface of the first block which is a bottom surface of the cavity recess. More preferably, the end portion of the circumferential groove on which the resin ring as the sealing material is formed is disposed at a position higher than the bottom surface of the cavity recess. According to this, even if the protruding resin is formed, the protruding resin is formed at a place recessed from the surface of the resin molded portion. For this reason, even when the molded product is placed on the transport portion, it is possible to prevent the resin molded portion from coming into contact with the molded portion to generate resin waste.

  The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows. According to the resin mold of the present invention, the maintainability can be improved.

It is a schematic cross section which shows the resin molding metal mold | die in the manufacturing process which concerns on Embodiment 1 of this invention. It is a schematic cross section which shows the resin molding metal mold | die in the manufacturing process following FIG. FIG. 3 is a schematic cross-sectional view showing the resin molding die in the manufacturing process continued from FIG. 2; It is a schematic cross section which shows the resin molding metal mold | die in the manufacturing process following FIG. FIG. 5 is a schematic cross-sectional view of the resin molding die in the manufacturing process continued from FIG. 4; FIG. 6 is a schematic cross-sectional view showing the resin molding die in the manufacturing process continued from FIG. 5; FIG. 7 is a schematic cross-sectional view showing the resin molding die in the manufacturing process continued from FIG. 6; FIG. 8 is a schematic cross-sectional view showing the resin molding die in the manufacturing process continued from FIG. 7; FIG. 9 is a schematic cross-sectional view showing the resin molding die in the manufacturing process continued from FIG. 8; FIG. 10 is a schematic cross-sectional view showing the resin molding die in the manufacturing process continued from FIG. 9; It is a principal part typical sectional drawing of the resin molding metal mold | die shown in FIG. 1, (a), (b) shows various forms. It is a schematic cross section which shows the resin molding metal mold | die in the manufacturing process which concerns on Embodiment 2 of this invention. FIG. 13 is a schematic cross-sectional view showing the resin molding die in the manufacturing process continued from FIG. 12; FIG. 14 is a schematic cross-sectional view showing the resin molding die in the manufacturing process continued from FIG. 13; FIG. 15 is a schematic cross-sectional view showing the resin molding die in the manufacturing process continued from FIG. 14; FIG. 16 is a schematic cross-sectional view showing the resin molding die in the manufacturing process continued from FIG. 15; FIG. 17 is a schematic cross-sectional view showing the resin molding die in the manufacturing process continued from FIG. 16; FIG. 18 is a schematic cross-sectional view showing the resin molding die in the manufacturing process continued from FIG. 17; FIG. 19 is a schematic cross-sectional view showing the resin molding die in the manufacturing process continued from FIG. 18; FIG. 20 is a schematic cross-sectional view showing the resin molding die in the manufacturing process continued from FIG. 19; FIG. 21 is a schematic cross sectional view showing the resin molding die in the manufacturing process continued from FIG. 20; It is a modification of the resin molding metal mold | die shown in FIG. It is a modification of the resin molding metal mold | die shown in FIG. It is a schematic cross section which shows the resin molding metal mold | die in the manufacturing process which concerns on Embodiment 3 of this invention. FIG. 25 is a schematic cross sectional view showing the resin molding die in the manufacturing process continued from FIG. 24; FIG. 26 is a schematic cross sectional view showing the resin molding die in the manufacturing process continued from FIG. 25;

  The following embodiments of the present invention will be described by dividing them into a plurality of sections if necessary, but in principle, they are not unrelated to each other, and one is a relation such as some or all of modifications or details of the other. It is in. Therefore, in all the drawings, the members having the same function are denoted by the same reference numerals, and the repetitive description thereof will be omitted. In addition, the number of components (including the number, numerical value, amount, range, etc.) is limited to the specific number unless explicitly stated or the principle is clearly limited to a specific number. It may be more or less than a specific number. In addition, when referring to shapes such as components, it is to be understood that substantially similar or similar to the shapes etc. is included unless specifically stated otherwise and when it is considered that it is not clearly apparent in principle. .

(Embodiment 1)
A resin molding apparatus 500 provided with the resin molding die 10 according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 10 are schematic cross-sectional views showing the resin molding die 10 in the manufacturing process. FIG. 11 is a schematic cross-sectional view of an essential part of the resin molding die 10. In the present embodiment, as in the resin molding apparatus 500 shown in FIG. 1, the direction D1 is set as the vertical direction (mold opening and closing direction), and the direction D2 is set as the horizontal direction. As a workpiece W to be molded (processed) by the resin molding apparatus 500, for example, a substrate S on which a plurality of mounted components P are mounted is used. In the resin molding apparatus 500, the workpiece W and the resin R are conveyed (supplied) from the outside of the mold to the inside of the mold by a conveyance unit (not shown) and set (disposed). By subjecting the workpiece W of the article to be molded to a molding process, a resin molded portion for resin sealing the plurality of mounted components P is molded on the substrate S, and the workpiece W becomes a molded article. In addition, as resin R which comprises the resin molding part of a molded article (workpiece | work W after shaping | molding), thermosetting resin (for example, epoxy resin), such as granular form, liquid, powder form, and a sheet form, is used, for example .

  The resin molding apparatus 500 includes a resin molding mold 10 (a pair of upper mold 12 and lower mold 14 capable of opening and closing a mold) having a cavity recess 18 and a mold opening and closing mechanism 16 for opening and closing the mold of the resin molding mold 10; A mold heating mechanism (not shown) having a heater or the like built in a mold block of the upper mold 12 or the lower mold 14 is provided. In the resin molding apparatus 500, the upper mold 12 and the lower mold 14 that make a pair are configured to be mold openable and closable by the mold opening and closing mechanism section 16, and the upper mold 12 and the lower mold 14 close the mold (clamping) The mold is opened by separation. In this embodiment, the upper mold 12 is a fixed mold, the lower mold 14 is a movable mold, and the lower mold 14 is close to the upper mold 12 to close the resin molding mold 10. The mold 14 is separated and the resin mold 10 is opened. The upper die 12 may be a movable die, the lower die 14 may be a fixed die, or the upper die 12 and the lower die 14 may be movable dies.

  The mold opening / closing mechanism unit 16 includes a base platen 19, a plurality of tie bars 20, a fixed platen 22, and a movable platen 24. The plurality of tie bars 20 are provided upright from each of the corner portions of the base platen 19 having a rectangular shape in a horizontal view, for example. The fixed platen 22 is fixedly provided at the tip of the tie bar 20 which stands up from the base platen 19. The movable platen 24 is reciprocated by being guided by the tie bar 20 at an intermediate portion of the tie bar 20 between the base platen 19 and the fixed platen 22. The upper mold 12 is fixedly provided on the lower surface (the movable platen 24 side) of the fixed platen 22, and the lower mold 14 is fixedly provided on the upper surface (the fixed platen 22 side) of the movable platen 24. Accordingly, the upper mold 12 is a fixed mold and the lower mold 14 is a movable mold.

  In the present embodiment, in order to configure the movable platen 24 so as to reciprocate, the mold opening / closing mechanism 16 includes a plurality of (three or more) ball screws 26 and a plurality (a number corresponding to the number of ball screws) For example, a servomotor) is provided. The plurality of ball screws 26 are provided between the base platen 19 and the movable platen 24 at equal intervals in the horizontal view. Each ball screw 26 is provided inside a plurality of tie bars 20 standing at a corner portion of the base platen 19, and is screw-engaged with a plurality of screw shafts 30 rotationally driven by the drive unit 28 and each of the screw shafts 30, And a fixed nut 32 fixed to the movable platen 24. The drive unit 28 also drives each of the ball screws 26. The mold opening / closing mechanism unit 16 configured as described above controls the speed of the movable platen 24 with high accuracy by synchronizing the respective drive units 28. The mold opening / closing mechanism 16 is not limited to the one using the plurality of ball screws 26, and may be one using one ball screw 26 or may be one using a toggle link.

  The resin molding die 10 has a set portion 34 in which the work W is set, a holding portion 36 which holds the work W at the set portion 34, and a cavity recess 18 in which a resin molded portion is formed. In the present embodiment, the setting portion 34 and the holding portion 36 are provided on the parting surface (also referred to as a clamp surface or a mold surface) of the upper mold 12 and the cavity recess 18 recessed from the parting surface of the lower mold 14 is provided. . The setting unit 34 is configured of, for example, the parting surface of the upper mold 12. Further, the holding portion 36 is constituted of, for example, a chuck claw which protrudes from the parting surface of the upper mold 12. The holding portion 36 may have a suction path and a suction mechanism (for example, a vacuum pump) for holding the workpiece W by suction on the parting surface of the upper mold 12. Moreover, these combinations may be sufficient.

  The lower mold 14 in which the cavity recess 18 is provided has a cavity piece 40 (for example, a mold block) which constitutes the bottom surface of the cavity recess 18 and an inner wall surface of the cavity recess 18 which is disposed on the outer periphery of the cavity piece 40. And a clamper 42 (e.g., a mold block). The lower mold 14 further includes a base 44 (e.g., a mold block) on which the cavity piece 40 and the clamper 42 are provided, and an elastic member 46 (e.g., a spring) provided between the clamper 42 and the base 44. The base 44 is provided on the upper surface of the movable platen 24. The cavity piece 40 is provided at the center of the upper surface of the base 44. The clamper 42 has a through hole 48 (piece hole) into which the cavity piece 40 is inserted, and is provided on the upper surface of the base 44 via an elastic member 46. In the present embodiment, the bottom surface of the cavity recess 18 is formed by the tip end surface of the cavity piece 40, and the side surface of the cavity recess 18 is formed by the inner wall surface of the through hole 48. The clamper 42 is configured to be capable of reciprocating in the mold opening and closing direction with respect to the base 44 by the action of the elastic member 46. Here, the relationship between the cavity piece 40 and the clamper 42 is such that the cavity piece 40 is slidable (reciprocable) relative to the clamper 42 in the mold opening / closing direction. Therefore, the outer peripheral surface (outside surface) of the cavity piece 40 and the inner wall surface of the through hole 48 of the clamper 42 become a sliding surface.

  A circumferential groove 41 (see FIG. 2) communicating with the cavity recess 18 is provided on the sliding surface of the cavity piece 40. A seal material 43 (for example, a seal ring such as a resin ring) is provided in the circumferential groove 41 of the cavity piece 40 to prevent the resin R from leaking from the gap between the cavity piece 40 and the clamper 42 to the base 44 side. (See Figure 4). As described above, the resin molding die 10 is provided with a mechanism for providing the sealing material 43 in the gap between the cavity piece 40 and the clamper 42 to seal the resin R.

  By the way, in this embodiment, the cavity piece 40 has the exchangeable (removable) holding member 45 which holds the sealing material 43 including the circumferential groove 41 (see FIG. 2 and FIG. 11A). Thereby, even if the cavity piece 40 is enlarged, the holding member 45 (i.e., small size) which is a part of the cavity piece 40 can be replaced. In addition, when the cavity piece 40 is rectangular, it is necessary to assemble so that the clearances between the rectangular members in plan view between the outer peripheral surface of the cavity piece 40 and the inner wall surface of the through hole 48 of the clamper 42 become uniform. Such assembly is not easy. However, an appropriate gap can be obtained only by fixedly assembling the holding member 45 in the cavity piece 40. Therefore, maintenance can be easily performed.

  In the present embodiment, the tip of the cavity piece 40 is convex toward the upper die 12, and the holding member 45 is configured to be fixable to the tip of the cavity piece 40. Specifically, the holding member 45 has a through hole 47 into which the tip end of the cavity piece 40 is inserted and a fixing groove 49 for fixing at the tip end (see FIG. 11A). Further, the holding member 45 may be provided with an annular end surface protrusion 51 projecting from the end surface 37 (which is flush with the end surface of the cavity piece 40 in the state assembled to the cavity piece 40) which is the bottom surface of the cavity recess 18. it can. The end face projection 51 forms a resin passage (mold surface) 38 (see FIGS. 2 and 11A) communicating with the circumferential groove 41 in a state of being assembled in the mold, and an opening area connected to the cavity recess 18 It is formed so that the opening area connected to the circumferential groove 41 can be further reduced (tapered). Further, the circumferential groove 41 constitutes an undercut shape from the lower end position of the inclined surface constituting the resin passage 38, and is configured to be able to hold the sealing material 43 and the like. The tapered resin passage 38 communicates with the circumferential groove 41 at a position before reaching a position (shown by a broken line) from the top surface of the end surface projection 51 to the same plane as the end surface 37 (see FIG. 11A). . Therefore, in the state where the holding member 45 is assembled to the cavity piece 40, the resin passage 38 communicates with the circumferential groove 41 at a position before reaching the same plane as the tip end surface of the cavity piece 40.

  In the present embodiment, since the holding member 45 having the end surface protrusion 51 in which the resin passage 38 is formed is provided at the tip end of the cavity piece 40, the recess 45 is recessed from the surface (corresponding to the end surface 37) of the resin molded portion R. The end surface protrusion 51 is pushed to the end, and the resin R filled in the cavity recess 18 is thermally cured. For this reason, even if the projecting resin b (the molding resin corresponding to the resin passage 38) is formed in the resin passage 38, it is formed in the place recessed from the surface of the resin molding portion R. It is possible to prevent resin waste from being generated.

  Further, as shown in FIG. 2, the resin molding apparatus 500 includes a chamber mechanism unit 50 that seals the inside of the mold including the cavity recess 18. The chamber mechanism unit 50 includes chamber blocks 52 and 54, seal members 56 and 58 (for example, an O-ring), and an elastic member 60 (for example, a spring). The chamber blocks 52 and 54 are penetrating cylindrical mold blocks having different inner diameters, and are provided on the upper surface of the base 44 so as to surround the cavity piece 40 and the clamper 42. The outer chamber block 52 having a large inner diameter is provided on the upper surface of the base 44 in a floating manner via the elastic member 60. By the action of the elastic member 60, the chamber block 52 can be reciprocated in the mold opening and closing direction with respect to the base 44. Further, the inner chamber block 54 having a small inner diameter is fixed to the upper surface of the base 44. A seal member 58 is provided between the chamber block 52 and the chamber block 54 for preventing air (atmosphere) from leaking from the gap to the base 44 side. Further, a sealing material 56 is provided on the outer periphery of the parting surface of the upper mold 12 so as to face the chamber block 52. Therefore, when the mold closing is performed, the upper mold 12 and the lower mold 14 come close to each other, and the sealing material 56 and the chamber block 52 abut (sealing touch), so that the sealed space inside the mold including the cavity recess 18 Can be formed (see FIG. 2).

  Moreover, the resin molding apparatus 500 is provided with the pressure adjustment mechanism part 62 which adjusts the pressure in sealed space. The pressure adjusting mechanism 62 opens at a pressure reducing portion 64 (for example, a vacuum pump) and a parting surface of the upper die 12 at one end portion (a region surrounded by the sealing material 56 and out of the set portion 34). And an air flow path 66 whose other end is connected to the pressure reducing section 64. By reducing the pressure in a state where the sealed space is formed, it is possible to prevent the occurrence of voids or unfilled in the resin molded portion of the molded product, and to improve the quality of the molded product. In particular, when granular resin is used as the resin R, it is effective to discharge air between the individual particles.

  By the way, in the resin molding apparatus 500, as shown in FIG. 5, when the resin molding die 10 is opened by the mold opening / closing mechanism 16, the mold is first released from the clamper 42 while the cavity piece 40 is in contact with the molded article. Further, the mold can be released from the cavity piece 40 by further opening the mold (details will be described later). As an auxiliary role of such mold release, the resin molding apparatus 500 includes a mold release assisting mechanism 68. The mold release assist mechanism 68 includes a lift 70 that raises the cavity piece 40 from the base 44 during mold release, and an ejector 72 that releases the molded product (work W) from the cavity piece 40.

  The lift unit 70 includes, for example, a compression unit 74 (for example, a compressor) and an air flow passage 76 having one end opened to the upper surface of the base 44 and the other end connected to the compression unit 74. It is configured to be movable up and down. Further, the lift unit 70 is provided with an enlarged diameter portion 78 which is expanded in the middle of the air flow passage 76, and a head portion provided on the expanded diameter portion 78, and a convex shape in which a tip is provided at one end of the air flow passage 76 And a pin 80. The protruding pin 80 is provided so as to be able to project beyond the upper surface of the base 44 by the pressure feeding of air through the air flow path 76, and raises the cavity piece 40 by protruding. A member for raising and lowering the cavity piece 40 like the convex pin 80 may be driven by a drive source (for example, a motor) other than air. In addition, the lift portion 70 is an elastic member 82 (for example, a spring) provided between the cavity piece 40 and the base 44, and an enlarged diameter portion 78, which is closer to the cavity piece 40 than the head portion of the convex pin 80. And an elastic member 84 (for example, a spring) provided. The cavity piece 40 is lifted by the lift section 70. However, the pressure feeding of air is stopped by providing the elastic member 82, and when the convex pin 80 is pulled back, the cavity piece 40 is lowered and the base 44 Can be returned to the initial position. Further, when raising the cavity piece 40 by the lift unit 70, air is pressure-fed from the compression unit 74 and pressed against the head portion of the convex pin 80. Further, when the cavity piece 40 is lowered and brought into contact with the base 44, by stopping the pressure feeding of air, the convex pin 80 can be pushed down by the elastic member 84, and the cavity piece 40 can be surely lowered. According to the lift unit 70 that raises and lowers the cavity piece 40 as described above, when the molded product (work W) is going to be released from the lower mold 14 by mold opening, the lower mold 14 is lifted while the cavity piece 40 is lifted. By lowering the whole, the resin R can be released from the clamper 42 while maintaining the contact between the molded product and the cavity piece 40 (see FIG. 5). That is, it is possible to release the mold in the clamper 42 while holding most of the central position of the molded product in contact with the cavity piece 40 and applying pressure. According to this, for example, when the resin R is released from the clamper 42, the resin R is reliably prevented from peeling off from the work W even if an excessive force is applied to pull the resin R off from the work W. Can.

  In addition, when the resin R is released from the clamper 42, the pressure adjustment mechanism section 62 pressure feeds air to the sealed space inside the mold when the resin R is released from the cavity piece 40, the clamper 42. Air can be fed through the space between the cavity piece 40 and the molded article through the space between the cavity piece 40 and the outer periphery of the molded article. According to this, the releasability can be improved by the action of the air pressure, and even if the work W having the resin molding portion made of the resin R filled in the cavity concave portion 18 is enlarged, the separation is stably performed. It can be made to mold. In addition, such mold release of the cavity piece 40 and the clamper 42 is not limited to the order mentioned above, It is also possible to perform mold release of resin R in the cavity piece 40 first.

  Further, the ejector portion 72 is provided to assist the release of the resin R on the upper surface of the cavity piece 40. For example, as shown in FIG. 2, the ejector portion 72 is provided with a pin hole 86 penetrating the cavity piece 40 and an ejector provided in the pin hole 86 so as to open at the bottom surface of the cavity recess 18 (upper surface of the cavity piece 40). And a pin 88. Further, the ejector unit 72 supports a support plate 96 for supporting the plurality of ejector pins 88 upright, a storage recess 98 recessed from the upper surface of the base 44 so as to store the support plate 96, a cavity piece 40 and a support plate 96 And an elastic member 99 (for example, a spring) provided between the two. In addition, the ejector portion 72 is a through hole penetrating the base 44 at the bottom of the storage recess 98 and the sealing material 100 (for example, an O-ring) provided between the outer peripheral side surface of the support plate 96 and the inner wall surface of the storage recess 98 And a seal member 104 (for example, an O-ring) provided between the inner wall surface of the through hole 102 and the center pillar 114 (see FIG. 1) provided in the through hole 102. Further, the ejector unit 72 communicates with the compression unit 106 (for example, a compressor) and one end of the ejector unit 72 in the through hole 102 between the bottom surface of the storage recess 98 and the sealing material 104 and the other end is connected to the compression unit 106 And an air flow path 108. When a molded product (work W) is ejected (pushed out) by the ejector pin 88, air is pumped from the compression unit 106, and air is blown to the support plate 96 through the air flow path 108 and the through hole 102 ). By the action of the air pressure, the ejector pin 88 is raised via the support plate 96 and protrudes from the bottom surface of the cavity recess 18 (the top surface of the cavity piece 40). At this time, by providing the elastic member 99, the tip of the ejector pin 88 can be pulled back to the pin hole 86 when the air pressure feeding is stopped. According to such an ejector portion 72, the ejector pin 88 can be configured to be capable of reciprocating in the mold opening and closing direction. The ejector unit 72 may be driven by a drive source other than air.

  Further, the ejector portion 72 has a function of blowing out air from the gap between the ejector pin 88 and the pin hole 86. Specifically, the ejector unit 72 has a seal member 90 (for example, an O-ring) provided between the ejector pin 88 and the pin hole 86, a compression unit 92 (for example, a compressor), and one end portion The air flow passage 94 is in communication with the pin hole 86 between the bottom surface of the cavity recess 18 and the sealing material 90 and the other end is connected to the compression portion 92. When a molded product (work W) is ejected by the ejector pin 88, air is pumped from the compression unit 92, and air is blown (jetted) to the molded product through the air flow path 94 and the pin holes 86. As described above, by causing air to be ejected to the molded article in accordance with the ejection at the ejector pin 88, the entry of fluid (air) to the interface causes the molded article to be released by the action of air pressure mainly promoting the peeling. Release can be facilitated.

  The resin molding apparatus 500 further includes a maintenance mechanism unit 109 for maintaining the cavity recess 18 (see FIG. 9). Specifically, the resin molding apparatus 500 includes a maintenance mechanism unit 109 that maintains the cleaning of the cavity recess 18 and the sliding state of the gap between the cavity piece 40 and the clamper 42. For this purpose, the maintenance mechanism unit 109 moves the cavity piece 40 so as to expose the circumferential groove 41 (the tip of the cavity piece 40) beyond the parting surface of the lower mold 14 (clamper 42). A movable mechanism portion 110 and a cleaner mechanism portion 112 for cleaning the cavity piece 40 including the circumferential groove 41 are provided.

  As shown in FIGS. 1 and 8, the piece movable mechanism 110 lowers the movable platen 24 to push up the cavity piece 40 by the center pillar 114 of the base platen 19 to expose the cavity piece 40 from the clamper 42 for maintenance. It has a configuration that enables it. Specifically, the piece movable mechanism 110 includes a center pillar 114 fixedly provided at the center of the upper surface of the base platen 19. The center pillar 114 is inserted into the through hole 102, the tip of which passes through the base 44 and the movable platen 24, and is provided opposite to the lower surface of the support plate 96. For this reason, when the mold is opened and the movable platen 24 is lowered (moved to the base platen 19 side), the support plate 96 abuts on the center pillar 114 on the upper surface of the base platen 19, and then the cavity is formed in the support plate 96. The piece 40 abuts. Further, as the movable platen 24 is lowered, the cavity piece 40 is raised by the center pillar 114 via the support plate 96 (see FIG. 8). Therefore, the cavity piece 40 can be moved by the piece movable mechanism 110 so that the circumferential groove 41 is exposed beyond the parting surface of the lower die 14. In addition, as the piece movable mechanism part 110, it can also be set as the structure using a separate drive source like a servomotor.

  Further, as shown in FIG. 9, the cleaner mechanism 112 is provided on a cleaner body movable between the inside of the mold and the outside of the mold, and the circumferential groove 41 at the tip of the cavity piece 40 and its periphery are It has a brush 116 for cleaning (brushing), and a shielding member 118 provided on the cleaner body so as to surround the brush 116 and preventing scattering of debris during cleaning. The cleaner mechanism 112 also includes a suction unit (not shown) and a suction passage 120 having one end opened inside the shielding member 118 and the other end connected to the suction unit. In a state where the tip of the cavity piece 40 is exposed beyond the parting surface of the lower mold 14 (clamper 42) by the piece movable mechanism 110, the shielding member 118 is brought into contact with the clamper 42 by the cleaner mechanism 112. It is possible to form a closed space and clean the tip of the cavity piece 40 including the circumferential groove 41 while suctioning the closed space through the suction passage 120. Therefore, the tip of the cavity piece 40 can be cleaned to maintain the releasability of the resin R from the mold surface. In addition, the resin R attached to the cavity piece 40 is scraped off to prevent the gap between the cavity piece 40 and the clamper 42 from being narrowed, and the sliding resistance between the cavity piece 40 and the clamper 42 is set to a predetermined value or less. Can be held. Therefore, for example, the number of times of replacing the holding member 45 which is a part of the cavity piece 40 can be reduced.

  Next, a resin molding method (a method of manufacturing a molded product) according to Embodiment 1 of the present invention will be described with reference to the drawings. First, as shown in FIG. 1, a resin molding apparatus 500 provided with the above-described resin molding die 10 is prepared. In addition, since the resin molding method which concerns on this embodiment uses the resin molding apparatus 500, it is also an operation method of the resin molding apparatus 500. FIG.

  Next, as shown in FIG. 1, the work W is transported (supplied) from the outside of the mold to the inside of the mold by the transport unit (not shown) in the mold opened state (initial state). W is set. At this time, in order to prevent the work W from falling off from the set portion 34, the work W is held by the set portion 34 by the holding portion 36 (for example, a chuck claw). Further, in the mold-opened state, the resin R is transported (supplied) from the outside of the mold to the inside of the mold by a transport unit (not shown), and the resin R is set in the cavity recess 18 of the lower mold 14. Since the inside of the mold is heated by the mold heating mechanism, the resin R starts to melt when it is set in the cavity recess 18.

  Subsequently, the upper mold 12 and the lower mold 14 are brought close to each other, and as shown in FIG. 2, the sealing material 56 provided on the parting surface of the upper mold 12 abuts on the chamber block 52 (sealing touch ). As a result, the inside of the mold including the cavity recess 18 becomes a sealed space. Here, in order to form a decompression chamber (decompression space), the pressure adjustment mechanism unit 62 (decompression unit 64) sucks the air in the enclosed space to decompress the enclosed space.

  Subsequently, the upper die 12 and the lower die 14 are further brought close to each other, and as shown in FIG. 3, the work W provided on the set portion 34 of the upper die 12 is brought into contact with the clamper 42. That is, the workpiece W is clamped by the upper mold 12 and the lower mold 14. Thereby, the cavity recess 18 constitutes a cavity in which the opening is closed by the work W and the mounting component P is accommodated. Further, when an air groove (not shown) is formed on the upper surface of the clamper 42, the air in the cavity recess 18 closed via the air groove can be sucked by the pressure adjusting mechanism 62 (decompression part 64). .

  Subsequently, the upper mold 12 and the lower mold 14 are further brought close to each other, and as shown in FIG. 4, the resin R filled in the cavity recess 18 is thermally cured to form a molded product. As a result, a resin molded portion that seals the mounted component P with the resin R is formed on the work W (substrate S). Further, in the circumferential groove 41, the resin R which has flowed in via the resin passage 38 (see FIG. 11A) is thermally cured, and a resin ring as the sealing material 43 is formed. As described above, the sealing material 43 can be easily provided by using the resin R that constitutes the resin molding portion of the molded product without using a dedicated member (for example, a ring-shaped separate member) as the sealing material 43. . After the molded product is formed, the air suction by the pressure adjustment mechanism 62 (pressure reduction unit 64) is stopped.

  Subsequently, while the workpiece W (molded product) is held by the upper mold 12, the mold is opened, and the workpiece W is released from the lower mold 14. Specifically, first, as shown in FIG. 5, while the upper mold 12 and the lower mold 14 are separated, the mold W is first released from the clamper 42 while the cavity piece 40 is in contact with the work W. At this time, even if the mold piece is opened by raising the cavity piece 40 by the lift portion 70, the cavity piece 40 remains in contact with the work W. The lift unit 70 raises the cavity piece 40 by pressure-feeding air by the compression unit 74 to push up the convex pin 80. At this time, the ejector unit 72 may raise the ejector pin 88 together with the cavity piece 40 raised by the lift unit 70 by pumping air by the compression unit 106 to push up the support plate 96.

  Then, while the air pumping is performed by the compression unit 106 of the ejector unit 72, by stopping the air pumping from the compression unit 74 of the lift unit 70, the ejector protruding from the tip end surface of the cavity piece 40 as shown in FIG. The work W is ejected by the pin 88 and the work W is released from the cavity piece 40. According to this, the mold release is performed in the order of the outer peripheral portion of the workpiece W (molded product) corresponding to the inner wall surface (clamper 42) of the cavity recess 18 and the central portion of the workpiece W corresponding to the bottom surface (cavity piece 40) of the cavity recess 18 It can be done. At this time, the air is pumped by the compression unit 92 of the ejector unit 72, and the air is blown to the work W through the air flow path 94 and the pin holes 86. According to this, the work W can be released stably and easily. After the work W is released from the lower mold 14, the air pumping by the compression units 92 and 106 of the ejector unit 72 is stopped.

  In the present embodiment, as shown in FIG. 11A, in the holding member 45, the resin passage 38 communicating with the circumferential groove 41 of the sliding surface of the cavity piece 40 is formed in an undercut shape. For this reason, even if the work W is released from the lower mold 14, the resin ring molded as the sealing material 43 in the circumferential groove 41 remains in the circumferential groove 41 without being released. Further, in the holding member 45, the inner wall surface of the annular end surface protrusion 51 is such that the diameter of the region surrounded by the annular end surface protrusion 51 increases from the tip end surface of the cavity piece 40 to the top surface side of the protrusion. It is inclined. Therefore, the work W can be easily released from the cavity piece 40.

  Subsequently, the upper mold 12 and the lower mold 14 are further separated, and as shown in FIG. 7, the sealing material 56 provided on the parting surface of the upper mold 12 and the chamber block 52 are separated. , Release the type. Thereafter, the work W (formed product) is transferred from the inside of the mold to the outside of the mold by the transfer unit, whereby the forming of one work W (formed product) is completed.

  In the present embodiment, the resin molded portion R (the molded thickness t from the substrate S) is formed on the work W, but the projection resin b is also formed. The projecting resin b is formed at a position where it is recessed from the surface (surface on which the molding thickness t is secured) of the resin molded portion R of the workpiece W (molded product). For this reason, for example, when the work W (molded product) is transported (held) by the transport unit from the inside of the mold to the outside of the mold, the surface of the resin molded portion R contacts without being in contact with the projecting resin b. It is possible to prevent the generation of waste.

  Specifically, the cavity piece 40 has a holding member 45 for holding the sealing material 43 including the circumferential groove 41, and the tip end surface of the cavity piece 40 (the holding member 45 is the bottom of the cavity recess 18 (holding An annular end face protrusion 51 protruding from the end face 37 of the member 45 is provided (see FIG. 11A). Further, by arranging the upper end portion of the circumferential groove 41 higher than the bottom surface of the cavity recess 18, the surface of the resin molded portion R may be formed even if the projecting resin b (see FIG. 7) is formed on the resin passage 38. It is formed in the place where it was depressed. For this reason, even if the molded product is placed on the transport portion or the like, it is possible to prevent the resin molded portion R from coming in contact with it and generating resin scraps. Therefore, the generation of the unnecessary cleaning process in the resin molding apparatus 500 can be prevented, and the productivity can be improved.

  Subsequently, as a cleaning operation in the resin molding apparatus 500, the upper mold 12 (fixed platen 22) and the lower mold 14 (movable platen 24) are separated, and as shown in FIG. The support plate 96 is brought into contact with the cavity piece 40 to raise the cavity piece 40. At this time, it is possible to raise (move) the cavity piece 40 so as to expose the circumferential groove 41 beyond the parting surface of the lower mold 14 (the upper surface of the clamper 42). In other words, by moving the movable platen 24 up and down, the cavity piece 40 is moved up and down with respect to the clamper 42.

  Subsequently, as shown in FIG. 9, the cavity piece 40 including the circumferential groove 41 is cleaned by the cleaner mechanism 112. Specifically, first, the cleaner mechanism 112 is made to enter the inside of the mold from the outside of the mold, and then the blocking member 118 of the cleaner mechanism 112 is brought into contact with the upper surface of the clamper 42 to form a closed space. Thereafter, while suctioning the closed space via the suction passage 120, the tip end of the cavity piece 40 including the circumferential groove 41 is cleaned by the brush 116. At this time, since the tip of the cavity piece 40 including the circumferential groove 41 is exposed beyond the parting surface (upper surface of the clamper 42) of the lower mold 14, the cavity piece 40 can be easily cleaned. After the cleaning, the cleaner mechanism 112 can be withdrawn from the inside of the mold to the outside of the mold to make it possible to perform the next resin molding. The resin R attached to the cavity piece 40 or the clamper 42 is opposed by repeating the operation of moving the cavity piece 40 up and down with respect to the clamper 42 without providing the cleaner mechanism 112 having the brush 116 as shown in FIG. It can also be configured to scrape off at each corner portion.

  Note that after the process shown in FIGS. 1 to 7 is one cycle and resin molding is performed for several cycles, as shown in FIGS. 8 and 9, the cavity piece 40 including the circumferential groove 41 may be cleaned. , May be cleaned every cycle. Further, as shown in FIG. 10, the sealing material 43 (a resin ring provided in the circumferential groove 41 (resin ring, etc.) when sufficient cleaning can not be performed in the cleaning operation as shown in FIG. 9 or when the predetermined cycle number is reached. And the holding member 45 is removed, and the peripheral groove 41 is replaced with the holding member 45 in which the resin ring as the sealing material 43 is not formed. According to this, by replacing the holding member 45, the periphery of the circumferential groove 41 can be cleaned reliably. Note that the holding member 45 may be replaced for each cycle.

Second Embodiment
In the first embodiment, the case where the whole of the bottom surface of the cavity recess 18 is configured by the cavity piece 40 has been described. In the second embodiment of the present invention, a case where a part of the bottom surface of the cavity recess 18 is configured by the plunger 40A will be described with reference to FIGS. 12 to 21 are schematic cross-sectional views showing the resin molding die 10A in the manufacturing process according to the present embodiment. 22 and 23 are schematic cross-sectional views of modifications of the resin molding die 10A. For example, a substrate S on which a plurality of mounted components P are mounted and terminals T are formed is used as a workpiece W to be molded (target to be processed) of the resin molding die 10A (see FIG. 13).

  The resin molding die 10A (the pair of upper mold 12 and lower mold 14 capable of opening and closing the mold) has a set portion 34 in which the work W is set, and a cavity recess 18 in which a resin molded portion is formed. In the present embodiment, the setting portion 34 is provided on the parting surface of the upper mold 12, and the cavity recess 18 is provided which is recessed from the parting surface of the lower mold 14.

  The lower mold 14 in which the cavity recess 18 is provided is, for example, a plunger 40A (for example, a mold block) having a circular outer shape that constitutes a part of the bottom of the cavity recess 18 and an outer periphery of the plunger 40A. And a clamper 42 (for example, a mold block) that constitutes (at least a part of) the wall surface. The lower mold 14 also includes a base 44 (e.g., a mold block) on which the plunger 40A and the clamper 42 are provided. In the present embodiment, a part (recessed surface) of the bottom surface of the cavity recess 18 is formed by the tip surface of the plunger 40A. Specifically, the clamper 42 is provided with a plurality of cavity recesses 18, and the plungers 40 </ b> A are provided on the bottom surfaces of the respective cavity recesses 18. In addition, the clamper 42 includes a pot 39 having a through hole 48 which is opened at the bottom of the cavity recess 18 and into which the plunger 40A is inserted. The clamper 42 is configured to be vertically dividable, and by assembling these components, the pot 39 can also be provided so as to be prevented from coming off. In addition, the clamper 42 has an annular bottom projection 51 </ b> A that protrudes from the bottom of the cavity recess 18 around the through hole 48. The bottom surface of the bottom projection 51A and the end face of the pot 39 are flush with each other. In other words, the tip of the pot 39 is provided to project from the bottom of the cavity recess 18. In addition, the clamper 42 is provided with a relief recess 17 in which the terminal T is accommodated so that the terminal T of the workpiece W is not crushed when the mold is closed. In the case where the mounting component is an LED chip and the resin molded portion is a work W serving as a lens for sealing the LED chip, a hemispherical concave portion recessed from the tip end surface of the plunger 40A may be provided. In addition to the configuration in which the plurality of cavity recesses 18 are provided in the clamper 42, a configuration in which one cavity recess 18 is provided may be employed.

  In addition, the lower mold 14 includes an elastic member 46 (for example, a spring) provided between the clamper 42 and the base 44. By the action of the elastic member 46, the clamper 42 is configured to be movable (reciprocable) relative to the base 44 in the mold opening and closing direction. Here, since the plunger 40A is fixed to the base 44 as a relationship between the plunger 40A and the clamper 42, the plunger 40A can be slidably driven (reciprocable) in the mold opening / closing direction relative to the clamper 42. It will be provided. Therefore, the outer peripheral side surface of the plunger 40A and the inner wall surface of the through hole 48 of the clamper 42 (pot 39) become a sliding surface.

  Around the tip of the plunger 40A, chamfering such as C chamfering or R chamfering is performed for insertion or sliding. Further, on the sliding surface of the plunger 40A, a circumferential groove 41 communicating with the cavity recess 18 below the chamfered portion is provided. The resin passage 38 communicating with the circumferential groove 41 in the assembled state is formed at the tip of the plunger 40A so that the opening area contiguous with the circumferential groove 41 becomes smaller (tapered) than the opening area contiguous with the cavity recess 18 Be done. A seal member 43 (for example, a resin ring) is provided in the circumferential groove 41 (see FIG. 16). That is, the resin molding die 10A has a mechanism for providing the sealing material 43 in the gap between the plunger 40A and the clamper 42 to seal the resin R. The present embodiment is characterized in that all of the plungers 40A in which the seal member 43 is held can be replaced. According to this, as compared with the general configuration in which the cavity piece itself constituting the entire bottom surface of the cavity is replaced, it is only necessary to replace the light and small plunger 40A, so maintenance is simplified. be able to. Also, even in the case where only the pot 39 is replaced, the maintainability can be enhanced compared to a configuration in which the entire clamper 42 is replaced. Further, when using the circular plunger 40A or the pot 39, the installation work such as positioning is easy, and the maintainability can be further enhanced. In addition, regarding the gap between the plunger 40A and the clamper 42, a seal structure other than the above-described configuration may be employed.

  As shown in FIGS. 22 and 23, the plunger 40A is supported without being fixed to the base 44, so that the plurality of plungers 40A can be molded by uniformly applying pressure to the resin R in each cavity recess 18 You may The lower mold 14 shown in FIG. 22 is a configuration example in which the height of the plunger 40A can be adjusted by the elastic member 142. Specifically, a plunger 40A having a head portion 138 on the opposite side to the tip end, a retaining recess 140 which opens on the upper surface of the base 44, holds the plunger 40A, and accommodates the head portion 138; An elastic member 142 provided between the bottom surface of the locking recess 140 and the proximal end surface (end surface on the head portion 138 side) of the plunger 40A. By the action of the elastic member 142, the plunger 40A is disposed so as to be able to move up and down while receiving a pressure corresponding to the amount of crushing of the elastic member 142. The lower die 14 shown in FIG. 23 is an example of a configuration in which the height of the plunger 40A can be adjusted by hydraulic pressure. Specifically, a plunger 40A having a head portion 138, a retaining recess 140, an oil pressure portion 144, and a seal member 146 provided between the outer peripheral side surface of the head portion 138 and the inner wall surface of the retaining recess 140; One end portion is opened to the bottom surface of the retaining recess 140, and the other end portion is provided with a flow path 148 connected to the hydraulic portion 144. The hydraulic pressure from the hydraulic unit 144 is configured to be vertically movable while applying pressure so that the pressure applied to the plunger 40A becomes uniform. According to the equal pressure mechanism illustrated in these, by equalizing the resin pressure applied to the resin R in the plurality of cavity concave portions 18, for example, even if the supply amount of the resin R is not uniform, the resin pressure is uniformly applied. Thus, the molding quality can be made uniform.

  As will be described later, when heat curing the resin R, the circumferential groove 41 of the plunger 40A reaches the molding position where the depth of the cavity recess 18 corresponds to the molding thickness t (see FIG. 17) (see FIG. 16) . That is, the tip end portion of the plunger 40A is pushed to a point recessed from the surface of the resin molded portion R of the molded product (the main surface in the thickness direction of the molded product). In the present embodiment, since the bottom projection 51A is provided on the bottom surface of the cavity recess 18 of the clamper 42, the tip portion of the plunger 40A (the portion where the resin passage 38 is formed to the position surrounded by the bottom projection 51A) ) Can be pushed. Then, the resin R filled in the cavity recess 18 is thermally cured in a state in which the end (upper end in this example) of the circumferential groove 41 is at a position higher than the same plane as the bottom surface of the cavity recess 18. Therefore, even if the protruding resin b (see FIG. 17) is formed in the resin passage 38 configured by the chamfering of the plunger 40A, the resin resin is formed because it is recessed from the surface of the resin molded portion R. Can be prevented. Therefore, the generation of the unnecessary cleaning process in the resin molding apparatus 500 can be prevented, and the productivity can be improved.

  Next, a resin molding method (a method of producing a molded product) according to Embodiment 2 of the present invention will be described with reference to the drawings. First, as shown in FIG. 12, the resin molding die 10A described above is prepared. Next, as shown in FIG. 13, the work W is transported (supplied) from the outside of the mold to the inside of the mold by the transport unit (not shown) in the mold opened state (initial state), and the work is set in the set portion 34 of the upper mold 12 W is set. Further, in the mold-opened state, the resin R is transported (supplied) from the outside of the mold to the inside of the mold by a transport unit (not shown), and the resin R is set in the cavity recess 18 of the lower mold 14. In the present embodiment, when the resin R is set, the tip end surface of the plunger 40A is retracted from the bottom surface of the cavity recess 18, and the volume of the cavity recess 18 is increased. When granular resin is used as the resin R, a gap is formed between the resin particles and the volume at the time of supply is increased, but the volume of the cavity recess 18 is made larger than at the time of molding to set a predetermined amount of resin R. be able to.

  Subsequently, the upper mold 12 and the lower mold 14 are brought close to each other, and as shown in FIG. 14, the seal material 56 provided on the parting surface of the upper mold 12 abuts on the clamper 42 (sealing touch) Let As a result, the inside of the mold including the cavity recess 18 becomes a sealed space. Here, in order to form a decompression chamber (decompression space), the pressure adjustment mechanism unit 62 sucks the air of the enclosed space via the air flow path 66 to decompress the enclosed space.

  Subsequently, the upper die 12 and the lower die 14 are further brought close to each other, and as shown in FIG. 15, the workpiece W provided in the set portion 34 of the upper die 12 is brought into contact with the clamper 42. That is, the workpiece W is clamped by the upper mold 12 and the lower mold 14. Thereby, the cavity recess 18 becomes a cavity in which the opening is closed by the work W and the component P is accommodated. Further, when an air groove (not shown) is formed on the upper surface of the clamper 42, the air in the cavity can be sucked through the air groove by the pressure adjusting mechanism portion 62.

  Subsequently, the upper mold 12 and the lower mold 14 are further brought close to each other, and as shown in FIG. 16, filling is carried out in the cavity recess 18 with the circumferential groove 41 in the same plane as the bottom of the cavity recess 18. The resin R is thermally cured to form a molded article. At this time, in the circumferential groove 41, the resin R which has flowed in through the resin passage 38 is thermally cured, and a resin ring as the sealing material 43 is formed. Thereafter, while the work W is held by the upper mold 12, the mold is opened, and the work W is released from the lower mold 14 as shown in FIG.

  In the present embodiment, when the resin R is thermally cured, the upper end of the circumferential groove 41 of the plunger 40A is made flat until the bottom surface of the cavity recess 18 (the forming position where the depth of the cavity recess 18 corresponds to the forming thickness t) The plunger 40A is moved so that the position is exceeded. For this reason, even if the protruding resin b is formed in the resin passage 38 configured by the chamfering of the plunger 40A, the protruding resin b is formed at a position recessed from the surface of the resin molded portion R Because it does not occur, it can be prevented from coming into contact with other objects to generate resin waste. Therefore, the same effect as that of the above-described embodiment can be obtained.

  In the present embodiment, the work W molded by the above steps is used as a primary molded product, and a secondary molded product in which the resin molded portion R of the primary molded product is sealed is molded by the same process. For example, a molded article in which the resin R of the primary molded article is an insulating resin and the resin R 'of a secondary molded article is a conductive resin can also be manufactured. The resin molded portion made of the resin R ′ is made of, for example, a shielding resin (conductive resin) containing a large amount of metal particles so as to have a shielding function against electromagnetic waves and the like. Further, as the resin R ', since it is not necessary to consider wire flow and the like, it is possible to use a resin having high functionality such as moisture resistance and environmental resistance such as mechanical strength. In addition, you may complete | finish a process with a primary molded article and may take out resin molding metal mold 10A, without shape | molding a secondary molded article.

  Subsequently, as shown in FIG. 18, in the mold open state, an intermediate mold 130 having an expansion hole 132 (through hole) for expanding the volume of the cavity recess 18 is set on the parting surface of the lower mold 14. Further, the intermediate mold 130 is provided with a relief recess 134 for accommodating the terminal T so that the terminal T of the workpiece W is not crushed when the mold is closed, and the electricity provided in the conductive resin R ′ and the workpiece W And a terminal recess 136 for forming a connecting portion with the connecting portion. Here, the opening center of the cavity recess 18 and the opening center of the expansion hole 132 are set to coincide with each other. Thereby, the depth of the cavity recess 18 is increased by the thickness of the intermediate mold 130 (that is, the volume of the cavity recess 18 is expanded). Further, in a state where the mold is opened, the resin R ′ is conveyed (supplied) from the outside of the mold to the inside of the mold by a conveyance unit (not shown), and the resin R ′ is set in the cavity recess 18 of the lower mold 14. The resin R 'is set in a predetermined amount suitable to cover the resin molding portion R.

  Subsequently, the upper mold 12 and the lower mold 14 are brought close to each other, and the seal material 56 provided on the parting surface of the upper mold 12 and the clamper 42 are brought into contact (sealing touch). The lower mold 12 and the lower mold 14 are brought close to each other, and as shown in FIG. 19, the work W provided in the set portion 34 of the upper mold 12 is brought into contact with the intermediate mold 130. That is, the workpiece W is clamped by the upper mold 12 and the lower mold 14 through the intermediate mold 130. Thus, the cavity recess 18 and the expansion hole 132 become a cavity in which the opening of the expansion hole 132 is closed by the work W and the resin molded portion R is accommodated.

  Subsequently, the upper die 12 and the lower die 14 are further brought close to each other, and as shown in FIG. 20, the plunger 40A is advanced to surround the outer periphery of the resin R of the primary molded product. By filling ', the resin R' filled in the cavity recess 18 and the expansion hole 132 is thermally cured to form a secondary molded article. Thereafter, while the work W is held by the upper mold 12, the mold is opened, and as shown in FIG. 21, the work W (secondary molded product) is released from the lower mold 14. In the secondary molded product (work W), the resin R ′ flowing into the terminal recess 136 is thermally cured, and a resin portion is formed as a connecting portion T ′ connected to, for example, the GND terminal.

  In this embodiment, in addition to the same effects as the molding described above, since only the intermediate mold 130 may be added when molding the resin R ′ which is a functional resin, high value-added molding can be performed by an inexpensive device. It can be performed.

(Embodiment 3)
In the second embodiment, when the resin R in the cavity recess 18 is thermally cured, the circumferential groove 41 reaches the same plane as the bottom surface of the cavity recess 18 in the pot 39 whose tip projects from the bottom surface of the cavity recess 18. The case of moving the plunger 40A has been described. In the third embodiment of the present invention, when heating / pressurizing the resin R into the cavity recess 18, the case of advancing the plunger 40A beyond the position of the bottom surface of the cavity recess 18 will be described with reference to FIGS. Refer to the description. 24 to 26 are schematic cross-sectional views showing the resin molding die 10B in the manufacturing process according to the present embodiment.

  The resin molding die 10B is the same as the resin molding die 10A shown in FIG. 12 except for the position of the upper end face of the pot 39. Specifically, the resin molding die 10B has a simpler configuration in which the position of the pot 39 is flush with the bottom surface of the cavity recess 18.

  Next, a resin molding method (a method of producing a molded product) according to Embodiment 3 of the present invention will be described with reference to the drawings. First, as shown in FIG. 24, a resin molding die 10B is prepared. Next, in a mold opened state (initial state), the workpiece W is transported (supplied) from the outside of the mold to the inside of the mold by a transport unit (not shown), and the workpiece W is set in the set portion 34 of the upper mold 12. Further, in the mold-opened state, the resin R is transported (supplied) from the outside of the mold to the inside of the mold by a transport unit (not shown), and the resin R is set in the cavity recess 18 of the lower mold 14 (see FIG. 25).

  In this case, the upper mold 12 and the lower mold 14 are brought close to each other, and as shown in FIG. 25, the resin filled in the cavity recess 18 with the circumferential groove 41 in the same plane as the bottom of the cavity recess 18. Heat cure R to form a molded article. Thereafter, while the work W is held by the upper mold 12, the mold is opened, and the work W is released from the lower mold 14 as shown in FIG.

  In the present embodiment, when heat curing the resin R, the circumferential groove 41 of the plunger 40A reaches the same plane as the bottom surface of the cavity recess 18 (the forming position where the depth of the cavity recess 18 corresponds to the forming thickness t). To move the plunger 40A. For this reason, even if the molding resin corresponding to the resin passage 38 configured by the chamfering of the plunger 40A is formed, it is included in the resin molding portion R when it is recessed from the surface of the resin molding portion R. As a result, generation of resin waste can be prevented.

  As mentioned above, although the present invention was concretely explained based on an embodiment, the present invention is not limited to the above-mentioned embodiment, and it can be variously changed in the range which does not deviate from the gist as follows. Nor.

  In the embodiment described above, the case where the present invention is applied to a resin molding die provided with a work setting portion in the upper mold and a cavity recess in the lower mold has been described. The present invention is not limited to this, and the present invention can be applied to the case where the mold configuration is reversed and the upper surface is provided with the cavity recess, and the lower surface is provided with the work set portion. In this case, the resin supplied into the mold can be set on the work.

  Further, in the above embodiment, the resin R or the like is supplied to the cavity, and compression molding for resin-molding the work W by compressing the resin R has been described, but the present invention is not limited thereto. For example, in a transfer molding configuration in which the resin R is supplied to the cavity through the pot, the plunger and the pot with the resin R provided outside the cavity, the resin molding gold having the mold structure according to the embodiment It may be a type.

18 cavity recess 40 cavity piece 42 clamper 43 seal material R resin

Claims (2)

A first block constituting at least a part of the bottom surface of the cavity recess filled with resin and a second block disposed on the outer periphery of the first block and constituting at least a part of the inner wall surface of the cavity recess are relative to each other A resin molding die having a mechanism that is configured to be slidable, has a sealing material provided in a gap between the first block and the second block, and seals the resin,
At the time of the first block constituting the whole of the bottom surface of the cavity recess, a part of the first block holding the sealing material is replaceable, or the above-mentioned part forming the portion of the bottom surface of the cavity recess all replaceable der of the first block when a block is,
A cleaner mechanism having a brush for cleaning the tip of the first block, and a shielding member provided around the brush and abutting against the second block during the cleaning;
A resin molding die characterized in that a tip portion of the first block is exposed beyond a parting surface of the second block, and the tip portion of the first block is cleaned by the cleaner mechanism . In the resin mold according to claim 1,
A part of the first block holding the sealing material has an annular protrusion which protrudes from a tip end surface of the first block which is a bottom surface of the cavity recess,
An end portion of a circumferential groove in which a resin ring as the sealing material is formed is disposed at a position higher than a bottom surface of the cavity recess .

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