JP3529545B2 - Electronic component resin molding equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a resin molding apparatus for electronic parts, such as an IC, which is sealed and molded with a resin material (resin tablet).

[0002]

2. Description of the Related Art Conventionally, resin encapsulation molding of electronic parts has been carried out by a transfer molding method. This method is usually performed by using a resin molding device for electronic parts as follows. It is being appreciated.

That is, in advance, a mold comprising a fixed upper mold and a movable lower mold mounted on the above apparatus is heated to a resin molding temperature by a heating means, and the upper and lower molds are opened. Next, the lead frame on which the electronic components are mounted is supplied and set at a predetermined position on the mold surface of the lower mold, and the resin material is supplied into the lower mold pot. Next, the lower mold is moved upward to clamp the upper and lower molds. At this time, the electronic component and the lead frame around it are to be fitted and set in both upper and lower cavities opposite to the parting line surface (PL surface) of the upper and lower molds. The resin material is heated and sequentially melted. next,
When the molten resin material heated and melted in the pot is pressed by the plunger to inject and fill the molten resin material into the upper and lower cavities through the resin passage, the electronic components in the cavities and the lead frame around the electronic component are filled. Is
It will be sealed in a resin molded body (mold package) molded in accordance with the shapes of both cavities. Therefore, after the time required for curing the molten resin material elapses, the upper and lower molds are opened, and the resin moldings in the upper and lower cavities, the lead frame, and the cured resin in the resin passage are ejected by ejector pins. You can separate them from each other.

Further, when the above-mentioned upper and lower molds are clamped, moisture (for example, at least in the space inside the mold composed of the pot, the resin passage, and the upper and lower cavities described above).
Since air containing moisture in the atmosphere) remains, when the resin material heated and melted in the pot is injected into the upper and lower cavities through the resin passage by the plunger, the remaining Since the accumulated air is mixed into the molten resin material, voids (air bubbles) are easily formed inside the resin molded body molded in the upper and lower cavities and a defect portion is formed outside due to the mixed air. Therefore, in order to prevent the generation of internal voids and external defects in the resin molded body described above, at least the space inside the mold is cut off from the outside by an appropriate outside air cut-off means so that the outside air cut-off space is closed. Along with the formation, the air remaining in the outside air blocking space is forcibly sucked and discharged to the outside by a vacuuming mechanism (pressure reducing mechanism) such as a vacuum pump to perform resin sealing molding. There is.

[0005]

When the number of moldings is repeated in the above apparatus, the resin material that has been heated and melted penetrates into the gap between the pot and the plunger and is cured, so that the inner wall of the pot is cured. A thin cured product (that is, resin burr) is attached, and the resin burr is scraped by a plunger that reciprocates in the pot and drops from the gap between the pot and the plunger to the lower side of the pot. become. That is, in the above apparatus, at least the above-mentioned pot, the resin passage, and the cavity are formed in the mold to form an outside air blocking space by making the outside air blocking state with the outside, and the remaining space is retained in the outside air blocking space. Since air etc. are forcibly sucked and discharged to perform resin sealing molding,
The falling resin burr remains and accumulates as unnecessary foreign matter on the lower side of the lower mold pot in the outside air blocking space. Therefore, the above-mentioned device is stopped and the whole device is disassembled, and at the same time, outside the device, or
Frequently, foreign matter such as the resin burr is removed at least outside the outside air blocking space formed in the apparatus. However, since the above-mentioned device must be provided with the above-mentioned outside air blocking mechanism and vacuuming mechanism, the overall configuration of the device tends to be large and complicated, and the disassembling and assembling of the device and the resin burr removal work. It is becoming very time consuming and time consuming. Therefore, there is an adverse effect that the productivity of the product (resin molding) molded by the above-mentioned apparatus is lowered.

Therefore, according to the present invention, the air remaining in the outside air shut-off space portion is formed by forming the outside air shut-off space portion by making the outside space of the mold, which is composed of at least the pot, the resin passage and the cavity, to be shut off from the outside. The purpose is to forcibly suck and discharge the resin etc. to perform resin sealing molding, and to efficiently remove unnecessary foreign matters such as resin burrs and the like generated in the pot at least outside the outside air blocking space. is there. Further, the present invention is at least a pot, a resin passage,
Efficient removal of unnecessary foreign matter such as resin burr generated in the pot from at least the outside of the outside air blocking space from inside the outside air blocking space formed by blocking the inside space of the mold from the outside. It is an object of the present invention to provide a resin molding apparatus for electronic parts, which can improve the productivity of products.

[0007]

A resin molding apparatus for an electronic component according to the present invention for solving the above technical problems comprises an upper die, a lower die arranged to face the upper die, and a lower die side. A plurality of required resin material supply pots are provided, a resin molding cavity that is opposed to the upper and lower mold parting line surfaces, and a molten resin material that is provided between the pot and the cavity. A resin passage to be transferred, a resin pressurizing plunger that is slidably fitted in each of the lower mold pots, a plunger holder that supports the lower end side of each plunger, and the plunger holder can be vertically moved. The lower mold side plunger holder fitting part to be fitted to the lower mold side, the lower mold side plunger insertion hole for inserting the plunger provided between the lower mold pot and the plunger holder, and the required upper and lower molds. Point And at least the above-mentioned pot, the resin passage and the cavity are shut off from the outside to form an outside air shut-off space, and an air remaining in the outside air shut-off space is forced. A resin molding apparatus for an electronic component, comprising: a vacuum drawing mechanism for sucking and discharging to an outside, a lid for sealing the entire outside air blocking means of the lower mold side plunger insertion hole forming the outside air blocking space described above. A body, a support hole for supporting the plunger provided in the lid, and a large diameter portion of the plunger provided below the upper end of the plunger fitted in the pot, and the support hole. And a receiving portion for accommodating foreign matters such as resin burrs falling from the inside of the pot around the support hole of the lid body. To In addition, a small plunger portion that fits loosely with the support hole is provided below the large plunger portion, and the small diameter portion is located in the support hole so that a space between the small diameter portion and the support hole is increased. In addition to forming a gap, the foreign matter is removed to the outside of the outside air blocking space by dropping the foreign matter through the gap toward the plunger holder fitting portion side.

Further, in the resin molding apparatus for electronic parts according to the present invention for solving the above technical problems, foreign matter such as resin burrs falling on the plunger holder fitting portion side is attached to the plunger holder fitting portion. A feature is that an air discharging mechanism for sucking and discharging is provided.

[0009]

According to the present invention, the plunger insertion hole provided on the lower die side between the pot on the lower die side and the plunger holder supporting the lower end portion side of the plunger fitted in the pot. A cover (outside air blocking member) that seals the outside air blocking means for sealing the entire insertion hole.
And a large-diameter portion of the plunger provided below the upper end of the plunger fitted in the pot, the support hole being provided in the lid to support the plunger. Since the large diameter part of the plunger can be slid up and down in a tightly fitted state, the space inside the mold consisting of at least the pot, resin passage, and cavity is blocked from the outside air and the outside air blocking space part. Can be formed. Therefore, it is possible to prevent the generation of internal voids and external defects in the resin molded body molded in the cavity by forcibly sucking and discharging the air and the like remaining in the outside air blocking space and molding the resin. You can

Further, according to the present invention, since the receiving portion is provided around the supporting hole of the lid, foreign matter such as resin burrs falling from the pot in the outside air blocking space is treated as described above. It can be accommodated in the receiving part. Further, according to the present invention, a small diameter portion that fits loosely with the support hole is provided below the large diameter portion of the plunger, and
By positioning the small diameter portion of the plunger in the support hole, a gap is formed between the small diameter portion and the support hole, and foreign matter such as resin burr in the receiving portion is dropped toward the plunger holder fitting portion side. be able to. Therefore, foreign matter such as the resin burr can be efficiently removed to the outside of the outside air blocking space.

[0011]

The present invention will be described in detail below with reference to the drawings of the embodiments. That is, in the resin molding apparatus shown in FIGS. 1 to 7, an upper mold 1 (fixed mold) mounted on an upper fixed plate (not shown) and a lower mold 2 mounted on a lower movable plate (not shown). (Movable type)
And are opposite. Further, as shown in FIGS. 1 and 2, an upper die chase block 4 is detachably mounted on the upper die base 3 on the upper die 1 side by a fitting means such as a dovetail groove, and the lower die A lower chase block 6 is detachably mounted on the lower mold base 5 on the second side by a fitting means such as a dovetail groove. Further, heating means 3a, 4a, 5a, 6a such as a heater are provided on both mold bases 3, 5 and both chase blocks 4, 6 in the above-mentioned upper and lower molds 1, 2, respectively.
A resin material (resin tablet) R is provided on the parting line surface (PL surface) of the chase block 6 on the lower die 2 side.
A plurality of required pots 7 for supplying
A required number of resin-forming lower cavities 8 are arranged at predetermined positions around each pot 7 (FIGS. 1, 2, and 3).
reference). Further, on the PL surface of the upper die chase block 4 on the upper die 1 side, upper cavities 9 corresponding to the positions and numbers of the lower cavities 8 provided on the lower die 2 side are provided oppositely. Plungers 10 for pressurizing the resin material heated and melted in the pots 7 are fitted in the pots 7 provided on the lower mold 2 side, and the plungers 10 are moved up and down. An appropriate vertical movement mechanism (not shown) is provided. Further, a cull portion 11 is provided on the PL surface of the chase block 4 on the upper die 1 side so as to face the pot 7 provided in the lower die chase block 6, and the cull portion 11 and the upper cavity 9 are separated from each other. Since they communicate with each other through the resin passage 12, when the upper and lower molds 1 and 2 are clamped, the pot 7 and the upper and lower cavities 8 and 9 are communicated with each other through the resin passages 11 and 12 including the cull portion. Is configured. Further, on the upper mold 1 side, a fitting portion 15 (space portion) in which an upper ejector plate 14 having a releasing ejector pin 13 is mounted is provided above the upper mold chase block 4, and On the lower die 2 side, below the lower die chase block 6, there is provided a fitting portion 18 (space portion) in which a lower ejector plate 17 having a releasing ejector pin 16 is mounted.

On the lower die 2 side, a plunger holder 19 for supporting the plunger 10 is provided on the lower end 10a side of each plunger 10, and the upper end 10b side of each plunger 10 is normally The lower mold pots 7 are fitted so as to be vertically slidable. On the lower die 2 side, a plunger holder fitting portion 22 (space portion) for vertically moving the plunger holder 19 is provided, and the lower die 2 is moved by moving the plunger holder 19 upward. The resin material heated and melted in the pot 7 is configured to be uniformly pressed by (the upper end portion 10b of) the plunger 10 respectively. Further, on the lower die 2 side described above, between the lower die pot 7 and the plunger holder 19 described above, an appropriate plunger insertion hole on the lower die 2 side for inserting the plunger 10 is provided. As shown in the example, the plunger 10 is attached to the lower die base 5 on the lower die 2 side.
An insertion hole 20 for inserting the lower die base 5 is provided.
Therefore, as shown in the example of FIG.
The side is fitted into the lower mold pot 7 from the plunger lower end 10a side supported by the plunger holder 19 through the insertion hole 20 of the lower mold base 5 and the insertion hole 21 of the ejector plate 17 described above. In addition, since the insertion hole 20 of the lower mold base 5 is formed in a long hole shape, for example, an arbitrary number of plungers are provided for high-mix low-volume production.
In the case where the plunger holder (19) supporting the (10) is replaced and the pitch intervals of the plungers (10) are changed and adjusted, it is possible to adapt to various pitch intervals of the plunger (10) (Fig. 4).

That is, as shown in FIG. 1, first, the lead frame 40 is supplied and set at a predetermined position of the lower mold 2 to clamp the upper and lower molds 1 and 2, and the upper and lower cavities 8 and 9 as well. An electronic component 41 mounted on the lead frame 40 is fitted and set therein. Next, the molten resin material heated and melted in the lower mold pot 7 is pressurized by the plunger 10 to inject the molten resin material into the upper and lower cavities 8 and 9 through the resin passages 11 and 12. As well as filling
The electronic component 41 fitted and set in the upper and lower cavities 8 and 9 can be sealed and molded in the resin molded body (mold package) 60. Therefore, after the time required for curing the molten resin material elapses, the upper and lower molds 1 and 2 are opened, and the resin molded body 60, the lead frame 40 and the resin in the upper and lower cavities 8 and 9 are also opened. The cured resin in the passages 11 and 12 can be released from the ejector pins 13 and 16.

The apparatus described above is also provided with a vacuuming mechanism 42 (pressure reducing mechanism) equipped with a vacuum source such as a vacuum pump. In addition, the required number of intake holes 43 are formed on the PL surface of the upper die base 3, and the intake holes 43 described above are also provided.
And the evacuation mechanism 42 are connected to each other through a vacuum path 44. The vacuuming mechanism 42, the intake hole portion (43), the vacuum path (44), and the like are attached to the fitting portion 18 of the lower ejector plate 17 on the lower die base 5 side, if necessary. It can be installed at 18.

Further, in the above-mentioned resin molding apparatus, a required space of the upper and lower molds 1 and 2 is sealed to form a space inside the mold composed of at least the pot 7, the resin passages 11 and 12, and the cavities 8 and 9. Appropriate outside air blocking means is provided for forming an outside air blocking space by setting the outside air blocking state with the outside. That is, as the outside air blocking means of the upper and lower molds 1 and 2 forming the above-mentioned outside air blocking space,
An appropriate sealing member such as an O-ring is provided on at least one PL surface of 1.2. For example, as shown in FIGS. 1 to 3, a rubber tube-shaped hollow seal member 45 surrounds the upper cavity 9 and the resin passages 11 and 12 on the PL surface of the upper die base 3 on the upper die 2 side. It is provided in the state,
The hollow seal member 45 has a pressurizing mechanism 46 such as a compressor.
Are connected through a pressurizing path 47. That is, the hollow seal member 45 is applied to the pressurizing path 47 by the pressurizing mechanism 46.
By pressurizing through, the hollow seal member 45 can be expanded and projected from the PL surface of the upper mold base 3. Therefore, when the upper and lower molds 1 and 2 are clamped, the inflating and projecting hollow seal member 45 is brought into contact with the PL surface of the lower mold 2 side (the lower mold base 5), and at least the pot 7 The space inside the mold consisting of the passages 11 and 12 and the upper and lower cavities 8 and 9 can be shut off from the outside air from the PL surface side of the upper and lower molds 1 and 2.

Further, an appropriate outside air blocking member for sealing the entire insertion hole 20 is provided as an outside air blocking means for the plunger insertion hole 20 of the lower die base 5 forming the above outside air blocking space. That is, as shown in the figure, the elongated hole insertion hole 20 is provided on the upper side of the elongated hole insertion hole 20 of the lower mold base 5.
A lid 30 (outside air blocking member) that seals the entire 20 is provided, and a support hole 31 that individually supports each plunger 10 described above corresponds to the position and number of the plungers. Is provided. In addition, an appropriate number of sealing members 32 such as O-rings are provided around the inner wall surface of the above-described support hole 31, and the upper end portion 10b of the plunger 10 is provided.
Below the above, the plunger that is closely fitted to the support hole 31 is provided.
Ten large diameter portions 10c are provided. Therefore, the above support holes
31 is the plunger large diameter portion 10c (and the sealing member 3
The large diameter portion 10c of the plunger is configured to slide up and down in the support hole 31 with a required movement stroke while being sealed by closely fitting in 2). That is, as shown in FIG. 5, when the resin material is supplied into the pot 7, the large diameter portion of the plunger 10 described above is supplied.
The supporting hole 31 is sealed by 10c, and as shown in FIG. 6, when the plunger 10 pressurizes the resin material heated and melted in the pot 7, the large diameter portion 10c of the plunger is pressed. The support hole 31 is sealed. In addition, O is provided between the lid 30 and the lower die base 5 described above.
An appropriate seal member 33 such as a ring is provided, and the seal member 33 is configured to seal the space between the lid 30 and the lower mold base 5. Therefore, the above and below both types 1
The support hole 31 of the lid 30 can be sealed by the large diameter portion 10c of the plunger 10 at the time of the resin sealing molding of 2, and at least the pot 7 Resin passage 11 ・ 12 ・ Cavity 8 ・ 9 space inside mold (and lower ejector plate fitting part)
It is possible to form the outside air blocking space by making 18) the outside air blocking state with the outside.

In addition, a suitable number of sealing members 71, 72 such as O-rings are provided in the fitting holes of the ejector pins 13 and 16 in the upper and lower molds 1 and 2 and the ejector pins 13 and 16 are provided. From the side, at least the space inside the mold, which is composed of the pot 7, the resin passages 11 and 12, and the cavities 8 and 9, is set to the outside air blocking state to form the outside air blocking space portion.

That is, first, the lower mold 2 described above is moved upward to perform intermediate mold clamping for forming a required space between the PL surfaces of the upper and lower molds 1 and 2, and at the same time, to the upper mold 1 side. The inflating and projecting hollow seal member 45 is brought into contact with the PL surface on the lower mold 2 side.
At this time, the space between the PL surfaces of the upper and lower molds 1 and 2 surrounded by the above-mentioned inflating and projecting hollow seal member 45 and the space inside the mold consisting of at least the above pot 7, resin passages 11 and 12, and upper and lower cavities 8 and 9 Above, the outside air blocking space can be formed in a state where the outside air is blocked from the outside thereof. Further, next, the remaining amount is retained from the intake hole portion 43 provided on the PL surface of the upper mold base 3 in the space inside the mold including at least the pot 7, the resin passages 11 and 12, and the upper and lower cavities 8 and 9. Air and the like can be forcibly sucked and discharged, and the outside air blocking space can be set to a predetermined vacuum degree. next,
The lower mold 2 can be moved upward to perform the complete mold clamping of the upper and lower molds 1 and 2, and the electronic component 41 fitted and set in the upper and lower cavities 8 and 9 can be resin-sealed and molded. . Therefore, it is possible to prevent the internal voids and the external defect portions of the resin molded body molded in the upper and lower cavities 8 and 9 from being formed.

Further, as shown in the drawing, around the support hole 31 on the upper side of the lid 30, foreign matters such as resin burrs 34 falling from the gap between the pot 7 and the plunger 10 are properly accommodated. The receiving portion 35 (concave portion) having a different shape is provided, and at the time of resin sealing molding of the upper and lower molds 1 and 2, foreign matters such as resin burrs 34 falling from the lower mold pot 7 are received by the receiving portion 35.
Can be accommodated at. Therefore, since the support hole 31 is sealed by the large diameter portion 10c of the plunger at the time of the resin sealing molding described above, the pot 7
The resin burr 34 falling from the inside is deposited in the receiving portion 35 (that is, in the outside air blocking space portion) (see FIG. 6). In the above embodiment, the inner bottom surface of the receiving portion 35 is configured to be inclined downward toward the peripheral portion of the support hole 31, but, for example, the entire inner bottom surface of the receiving portion 35 is It can be formed on a horizontal surface.

As shown in FIG. 7, a small diameter portion 10d is provided below the large diameter portion 10c of the plunger 10 and the small diameter portion 10d of the plunger 10 is loose with respect to the support hole 31. Is configured to fit.
In addition, as shown in FIG. 7, when the upper and lower molds 1 and 2 are opened, the plunger 10 is moved upward so that the small diameter portion 10d of the plunger 10 is positioned at the position of the support hole 31. A gap 31a is formed between the hole 31 and the small diameter portion 10d.
That is, foreign matters such as the resin burr 34 remaining / accumulated on the receiving portion 35 can be dropped from the gap 31a to the plunger holder fitting portion 22 side through the insertion hole 20 of the lower mold base 5. Therefore, foreign matter such as the resin burr 34 can be removed from the outside air blocking space. Further, removal of foreign matters such as the resin burr 34 to the outside of the outside air blocking space can be appropriately performed. For example, it can be carried out when a foreign substance such as the resin burr 35 is excessively deposited on the receiving portion 35, or it is incorporated into the molding cycle of the resin sealing molding by the upper and lower molds 1 and 2.

Further, as shown in FIGS. 1 and 2, the plunger holder fitting portion 22 is provided with an air discharging mechanism 48 for discharging and removing foreign matters such as the falling resin burr 34 along with the air. . Therefore, the support hole 31 and the small diameter portion 10d described above are
Foreign substances such as resin burrs 34 that fall into the plunger holder fitting portion 22 through the gap between and can be removed to the outside of the plunger holder fitting portion 22 (that is, the device) by the air discharge mechanism 48.

Further, as shown in FIG.
In the above, by sliding the upper end portion 10b, in which the circumferential groove 50 of the plunger 10 is arranged, up and down a plurality of times, the circumferential groove
At 50, the resin burr (34) attached to the inner wall of the pot 7 can be scraped off. That is, when the upper and lower molds 1 and 2 are opened, the plunger 10 is moved upward to move the upper end of the plunger.
When 10b is moved upward above the PL surface of the lower die chase block 6, the resin burr 34 in the pot 7 can be scraped out and the resin burr 34 can be discharged to the PL surface of the lower die chase block 6. (See Figure 7). Further, the resin burr 34 discharged to the PL surface can be forcibly removed to the outside of the mold by using, for example, a mold surface cleaning means equipped with an ordinary rotating brush and a vacuum mechanism. Therefore, as shown in FIG. 7, when the upper and lower molds 1 and 2 are opened, foreign matters such as resin burrs 34 on the PL surface of the lower mold chase block 6 on the plunger upper end 10b side are removed.
It is possible to remove foreign matters such as the resin burr 34 on the small diameter portion 10d side of the plunger. Since the upper end portion 10b side of the plunger 10 fitted in the above-mentioned pot is greatly worn and damaged by sliding up and down in the pot 7, it can be detachably replaced by an appropriate detaching means. It is configured to be able to.

The present invention is not limited to the above-mentioned embodiments, but can be arbitrarily and appropriately changed and selected as necessary within the scope of the gist of the present invention. Is.

[0024]

According to the present invention, the space inside the mold, which is composed of at least the pot, the resin passage, and the cavity, is cut off from the outside to form an outside air blocking space, so that the outside air blocking space remains. An excellent effect that the accumulated air is forcibly sucked and discharged to perform resin sealing molding and unnecessary foreign matters such as resin burrs generated in the pot are efficiently removed at least to the outside of the outside air blocking space. Play.

Further, according to the present invention, at least the pot
Unnecessary foreign matter such as resin burrs or the like generated in the pot is formed at least outside the outside air blocking space from the outside air blocking space formed by blocking the inside space of the resin passage / cavity from the outside. It is possible to provide a resin molding apparatus for electronic components that can be efficiently removed and that can improve the productivity of products.

[Brief description of drawings]

FIG. 1 is a partially cutaway vertical cross-sectional view showing a resin molding device for electronic parts according to the present invention, showing a mold open state of both upper and lower molds provided in the device.

FIG. 2 is a partially cutaway vertical sectional view showing a resin molding device corresponding to FIG. 1, showing a mold clamping state of upper and lower molds provided in the device.

FIG. 3 is a plan view showing a mold surface of a lower mold provided in the apparatus shown in FIG.

4 is a plan view showing a lower mold side lid body provided in the apparatus shown in FIG. 1. FIG.

5 is a partially cutaway vertical cross-sectional view showing the main parts of the upper and lower molds provided in the apparatus shown in FIGS. 1 and 2, and the position of the plunger when the resin material is supplied in the lower mold pot. Is shown.

FIG. 6 is a partially cutaway vertical cross-sectional view showing the main parts of the upper and lower molds corresponding to FIG. 5, showing the position of the plunger during resin pressurization in the lower mold pot.

FIG. 7 is a partially cutaway vertical sectional view showing the main parts of the upper and lower molds corresponding to FIG. 5, showing the position of the plunger when removing foreign matters such as resin burrs that have fallen from inside the lower mold pot. Shows.

[Explanation of symbols]

1 Upper mold 2 Lower mold 3 Upper mold base 4 Upper model chase block 5 Lower mold base 6 Lower chase block 7 pots 8 lower cavity 9 Upper cavity 10 Plunger 10a Lower end of plunger 10b Top end of plunger Large diameter part of 10c plunger Small diameter part of 10d plunger 11 Cull part 12 Resin passage 19 Plunger holder 20 Lower base insertion hole 22 Plunger holder fitting 30 lid 31 Support hole 31a interval 32 Seal member 34 Resin burr 35 Receiver 42 Vacuuming mechanism 47 Air discharge mechanism

Claims (2)

(57) [Claims] 1. An upper mold and a lower mold arranged to face the upper mold,
A plurality of required resin material supply pots provided on the lower mold side, a resin molding cavity opposed to the parting line surfaces of the upper and lower molds, and a pot provided between the pot and the cavity. A resin passage for transferring the molten resin material, a resin pressurizing plunger that is vertically slidably fitted in each of the lower mold pots, a plunger holder that supports the lower end side of each plunger, and the plunger. A lower mold side plunger holder fitting portion for fitting the holder in a vertically movable manner; a lower mold side plunger insertion hole for inserting the plunger provided between the lower mold pot and the plunger holder; An outside air shut-off hand that forms an outside air shut-off space by sealing the required parts of the upper and lower molds and keeping at least the above-mentioned pot, resin passage, and cavity from the outside. And a vacuum molding mechanism for forcibly sucking and discharging air and the like remaining in the outside air blocking space, and a lower mold side plunger forming the outside air blocking space. The outside air blocking means of the insertion hole is provided below the upper end portion of the plunger fitted in the pot, the lid body for sealing the entire insertion hole, the support hole for supporting the plunger provided in the lid body. The large diameter portion of the provided plunger is provided, and the large diameter portion is provided so as to be slidable up and down in the state that the large diameter portion is tightly fitted in the support hole. A receiving portion for accommodating foreign matters such as resin burrs falling from the pot is provided, and a small diameter portion of the plunger that fits loosely with the support hole is provided below the large diameter portion of the plunger. Position the small diameter part As a result, a gap is formed between the small diameter portion and the support hole, and the foreign matter is removed to the outside of the outside air blocking space by dropping the foreign matter to the plunger holder fitting portion side through the gap. A resin molding device for electronic parts, which is configured as described above. 2. The electronic component according to claim 1, wherein the plunger holder fitting portion is provided with an air discharging mechanism for sucking and discharging foreign matters such as resin burrs falling on the plunger holder fitting portion side. Resin molding equipment.