JPH09123206A - Resin sealing molding machine electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently and effectively remove the mold surface contaminant such as a mold release agent included in resin a material adhered and stored on the mold surface of each resin sealing molding unit and a volatile gas produced by heating in a resin sealing molding machine of the form that a molding machine body is detachably coupled to a plurality of couplers (resin sealing molding units). SOLUTION: A cleaning UV emitting mechanism 17 for removing the mold surface contaminant adhered to and stored on a mold surface 16 is reciprocatively mounted at the retreated position for inhibiting to disturb the supplying operation of a lead frame 3 before sealing and a resin tablet 6 to each resin sealing molding unit 8 and the removing operation of a sealed lead frame 9 and at the near position of the surface 16 of the each resin sealing molding unit 8.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a molding apparatus for sealing and molding electronic parts such as ICs, LSIs, diodes and capacitors mounted on a lead frame with a resin material.

[0002]

2. Description of the Related Art Conventionally, electronic parts have been molded by resin molding by a transfer molding method, and a resin molding apparatus for carrying out this method includes:
Usually, it has the following basic configuration. That is, the resin encapsulation molding apparatus includes a material loading section for loading a pre-molding lead frame and a resin tablet, and a resin encapsulation molding section for encapsulating an electronic component mounted on the pre-molding lead frame with a resin material. (Mold for resin encapsulation molding), molded product accommodating section for accommodating the encapsulated lead frame molded by the resin encapsulation molding section, pre-molding lead frame of both material loading sections and resin tablet A material supply mechanism for transferring to the encapsulation molding unit, a molded product transfer mechanism for transferring the encapsulated lead frame molded by the resin encapsulation molding unit to the molded product storage unit, connected to the encapsulated lead frame In order to remove unnecessary resin molded product cutting and removing part for cutting and removing resin molded product which is not required as a product, and resin burrs adhering to the mold surface (PL surface) of the mold in the resin sealing molding part. The mold surface cree Ring mechanism, and the control mechanism or the like for automatically controlling these units are provided.

[0005] The resin sealing molding of an electronic component using such a resin sealing molding apparatus is performed, for example, as follows. That is, the molds (both upper and lower molds) in the resin encapsulation molding unit are heated in advance to the resin molding temperature by the heating means, and the upper and lower molds are opened. Next, the pre-molding lead frame of the material loading section is supplied and set at a predetermined position on the mold surface of the lower mold via the material supply mechanism, and the resin tablet is supplied into the lower mold pot. Next, the lower mold is moved upward to clamp the upper and lower molds. At this time, the electronic component and its surrounding lead frame are fitted and set in the upper and lower cavities facing the mold surfaces of the upper and lower molds, and the resin tablet in the pot is heated. It will be melted sequentially. Next, when the resin material in the pot is pressed by the plunger and the melted resin material is injected and filled into both upper and lower cavities through the passage portion, the electronic components in the both cavities and the lead frame in the periphery thereof are separated. The resin is molded in a resin molded body (mold package) molded according to the shapes of the cavities. Next, after the time required for curing the molten resin material has elapsed, the upper and lower molds are opened, and the sealed lead frame (that is, the resin molded body and the lead frame in the upper and lower cavities) and The above-mentioned unnecessary resin molded body in the connected and integrated state is projected between the two molds and released. Next, the sealed lead frame and the unnecessary resin molded body are simultaneously transferred to the unnecessary resin molded body cutting / removal section through the molded product transfer mechanism at the same time as the above-mentioned releasing action, and the unnecessary resin molded body is also removed. Cut off the part. Next, the sealed lead frame from which the unnecessary resin molded body is cut and removed is passed through the molded product transfer mechanism,
Transfer to the molded product storage section for storage. Furthermore, each time the molding cycle described above is completed, a mold surface cleaning mechanism is used to
The resin burr adhering to the mold surface of the resin molding die of the resin sealing molding part is removed.

In order to automatically resin-mold the electronic parts on the lead frame, the material loading section as described above,
A resin sealing molding section, molded article storage section, material supply mechanism, molded article transfer mechanism, unnecessary resin molded article cutting and removing section, a mold surface cleaning mechanism, and an automatic control mechanism for each of these sections are required. As a basic configuration, the resin encapsulation / molding apparatus for a component is generally provided with a set of each part and each mechanism as described above.

[0005] By the way, using one resin encapsulation molding apparatus, for example, to produce the same kind of products simultaneously and in large quantities, and to produce small quantities of different kinds of products simultaneously, For the purpose of reducing the overall molding cost, the resin sealing molding apparatus is provided with a resin sealing molding apparatus main body and at least a plurality of resin sealing molding sections detachably connected to the apparatus main body. A new structure / form composed of a connected body composed of a resin sealing molding device has been developed. Then, by integrating the mold surface cleaning mechanism described above with the molded product transfer mechanism,
The mold surface cleaning mechanism is operated at the time of transferring the molded product by the molded product transfer mechanism, so that the molded product transfer step and the mold surface cleaning step are performed substantially at the same time. Furthermore, in this resin encapsulation molding apparatus, it is possible to operate all of the resin encapsulation molding sections connected to the apparatus main body, or to operate only a part thereof, through the automatic control mechanism. Therefore, there is an advantage that, for example, it is possible to configure a mode of the molding apparatus capable of promptly responding to a product type change, a production amount increase / decrease change, and the like.

[0006]

A resin encapsulation molding apparatus having a configuration in which a plurality of resin encapsulation molding sections are detachably connected to the apparatus body and the apparatus body has the above advantages. However, there are the following problems in terms of efficiency of molding work. That is, since the above-described mold surface cleaning mechanism is integrated with the molded product transfer mechanism, as described above, there is an advantage that the molded product transfer step and the mold surface cleaning step can be performed substantially at the same time. . The mold surface cleaning by the mold surface cleaning mechanism adheres to the mold surface by moving on the mold surface with the movement of the molded product transfer mechanism while the tip of the brush member is pressed against the mold surface. The removed resin burr is peeled off. However, if the resin molding operation is performed for a long time, for example, the mold surface of the mold, the resin filling portion (molding cavity), the inner surface of the passage portion (runner or gate) of the molten resin material, and the like are filled with the resin material. Mold surface contaminants such as a mold release agent and volatile gas generated by heating are deposited and accumulated,
It will be in a state called mold clouding. Leaving the above-mentioned mold surface contaminants causes poor appearance of the molded product and poor mold release, so it is necessary to remove the mold surface contaminants every predetermined number of molding shots. Further, since the mold surface contaminants are firmly attached to the mold surface, the mold surface contaminants are removed by the mold surface cleaning means described above, which moves the brush member while pressing the tip of the brush member against the mold surface. It cannot be removed reliably. In order to remove the mold surface contaminants, the mold is removed, and the mold surface is removed by physical means such as sandblasting, chemical means such as sulfuric acid solution, or combustion gas flame. It is conceivable to clean the mold surface by means such as spraying the mold surface. However, when these means are used, for example, the mold surface is scratched, the corners of the mold surface are not sufficiently cleaned, or the cleaning operation is long. There was a problem that it took time.

Therefore, the present invention is a resin encapsulation molding apparatus in which a plurality of resin encapsulation molding sections are detachably connected to the apparatus body and the apparatus body is molded by using both a material supply mechanism and a molded product transfer mechanism. Not only maintaining the effect of cost reduction and cleaning effect of removing resin burrs, but also efficiently and reliably removing the above-mentioned mold surface contaminants adhering and accumulated on the mold surface in each resin sealing molding part. To provide a resin encapsulation molding apparatus for electronic parts, which is provided with a cleaning mechanism for a mold surface contaminant that can be removed, and which can automatically control all working processes including the cleaning mechanism for the mold surface contaminant. It is intended.

[0008]

SUMMARY OF THE INVENTION A resin encapsulation molding apparatus for electronic parts according to the present invention for solving the above technical problems is a resin encapsulation for encapsulating and molding electronic parts such as semiconductor chips with a resin material. A main body of a resin encapsulation molding apparatus for an electronic component having a stopper molding section, and a connection body composed of a resin encapsulation molding apparatus having at least a resin encapsulation molding section are detachably attached to the main body. A resin encapsulation molding apparatus for configured electronic parts, comprising a UV (ultraviolet) irradiation mechanism for cleaning a mold surface of a mold in each of the resin encapsulation molding sections,
The cleaning UV irradiation mechanism can be reciprocally moved to a retracted position that does not hinder the material supply work and the molded product take-out work to each of the resin sealing molding parts, and the mold surface proximity position of each resin sealing molding part. It is characterized by being installed in the.

Further, in the resin encapsulation molding apparatus for electronic parts according to the present invention, the resin encapsulation molding section captures mold surface contaminants separated and scattered from the mold surface of the mold in the resin encapsulation molding section. In addition, a suction and discharge mechanism for the mold surface contaminants for forcibly sucking and discharging the mold surface contaminants is also provided.

In the resin encapsulation molding apparatus for electronic parts according to the present invention, the cleaning UV irradiation mechanism captures the mold surface contaminant separated and scattered from the mold surface of the mold in the resin encapsulation molding section. At the same time, a suction and discharge mechanism for the mold surface contaminants for forcibly sucking and discharging the mold surface contaminants is also provided.

Further, the resin encapsulation molding apparatus for electronic parts according to the present invention is provided with the resin encapsulation molding section and the cleaning U described above.
Each of the V irradiation mechanism captures mold surface contaminants separated and scattered from the mold surface of the mold in the resin sealing molding part, and
The present invention is characterized in that a structure for sucking and discharging the mold surface contaminants for forcibly sucking and discharging the mold surface contaminants is additionally provided.

[0012]

According to the present invention, the mold surface of each mold for molding resin is irradiated with UV to decompose and separate the mold surface contaminants adhering and accumulated on the mold surface to separate and scatter the mold surface contaminants. Surface contaminants can be reliably removed.

Further, according to the present invention, by using the suction and discharge mechanism, the mold surface contaminants which are decomposed by UV irradiation and separated and scattered from the mold surface of the mold are captured, and the mold surface contaminants are externally exposed. Can be forcibly sucked and discharged.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings. 1 is a schematic plan view of a resin encapsulation molding apparatus for electronic parts according to the present invention, and FIG. 2 is a schematic transverse plan view thereof.
3 and 4 are schematic vertical sectional views taken along the line AA of FIG.
5 is an enlarged side view showing an essential part of the resin encapsulation molding part, FIG. 6 is an enlarged vertical sectional view showing an essential part of the resin encapsulation molding part, and FIG. 7 is another resin encapsulation molding part according to the present invention. FIG. 8 is a vertical cross-sectional view showing the main part of FIG. 8, and FIG. 8 is an explanatory view of the cleaning action by the UV irradiation mechanism.

The resin encapsulation molding apparatus for electronic parts according to the present invention, as shown in FIGS.
On the other hand, in the case where a plurality of connecting bodies 2 made of a resin encapsulation molding device having a resin encapsulation molding part are installed in series and detachably (in the example shown, three connections are made to the main body 1). (When the body 2 is connected).

Further, in the apparatus body 1, a material loading portion 4 for loading the lead frame 3 before molding, an alignment portion 5 of the pre-molding lead frame 5, and an alignment portion 7 of the resin tablet 6.
A resin-sealed molded portion 8 for sealing-molding an electronic component mounted on the pre-molded lead frame 3 with a resin material; and a molded product molded by the resin-sealed molded portion 8 (sealed leads). Molded product storage unit 10 for storing the frame 9) and the above-mentioned both alignment units
The material supply mechanism 11 for transferring the pre-molding lead frame 3 and the resin tablet 6 of (5 · 7) to a predetermined position of the resin sealing molding portion 8 and the molded product molded by the resin sealing molding portion 8. A molded product transfer mechanism 12 for transferring to the molded product storage section 10, a mold surface cleaning mechanism 13 integrated with the molded product transfer mechanism 12 so as to reciprocate at the same time, and connected to the molded product. Molded products that are no longer needed as a finished product
Unnecessary resin molded body cutting and removing part 15 for cutting and removing 14
And a cleaning UV irradiation mechanism 17 for removing mold surface contaminants adhering to and accumulated on the mold surface 16 of the resin molding die in the resin sealing molding portion 8, and a U by the UV irradiation mechanism 17.
Suction and discharge mechanism that forcibly sucks and discharges mold surface contaminants that are decomposed by V irradiation and separated and scattered from the mold surface of the mold to the outside.
18 and a control mechanism 19 for automatically controlling each of these parts are provided.

In addition, a fixed upper die 20 and a movable lower die 21 for resin molding are arranged opposite to each other in the resin sealing molding portion 8 described above.

The lower mold 21 has a resin tablet 6
22 for supplying resin and cavity for resin molding
23 are provided. A plunger for pressurizing the resin tablet 6 supplied into the pot 22 is fitted in the pot 22, and a lead frame 3 before molding is provided on the mold surface 16 side of the lower mold cavity 23. Are provided (not shown).

A cull portion 25 is provided at a position facing the lower mold pot 22 in the upper mold 20 and the upper mold 20
An upper die cavity 26 is provided opposite to the lower die cavity 23 at the position. Further, the cull portion 25 and the upper mold cavity 26 are communicatively connected to each other through the gate portion 27, and thus the cull portion 25 and the gate portion 27 constitute a passage portion 24 for transferring the molten resin material. doing. The upper mold cavity 26 and the outside are connected to each other via an appropriate air vent 28. The air vent 28 described above
As will be described later, the vacuum source side such as a vacuum pump installed outside through the intake holes (29) and the intake passages (30) provided in the outer peripheral portions of the upper and lower cavities (23, 26). It is connected with. Therefore, when the vacuum source is activated during resin molding by clamping both upper and lower molds (20, 21), moisture and air remaining in the resin filling part and the passage part of the molten resin material and It constitutes a suction / discharge mechanism capable of forcibly sucking and discharging generated gases and the like to the outside.

Further, the pre-molding lead frame alignment section 5 described above can align a plurality of pre-molding lead frames 3 (two sheets in the illustrated example) transferred from the material loading section 4 in a predetermined direction. Is provided.

Further, the alignment portion 7 of the resin tablet 6 described above has the number of resin tablets 6 corresponding to the number of each pot 22 in the resin sealing molding portion 8 and the interval position (three in the illustrated example). And are provided so that they can be aligned in the spacing position.

Further, the above-mentioned material supply mechanism 11 attaches the plurality of pre-molding lead frames 3 and the resin tablets 6 aligned in the both aligning portions (5, 7), respectively, and, in this state, these The pre-molded lead frame 3 is simultaneously transferred to the resin encapsulation molding section 8 and the lower mold cavity 23
The resin tablets 6 are provided so as to be fitted and set in the recesses of the respective portions, and to be inserted and supplied into the respective pots 22. The resin tablets 6 supplied into the pot 22 are sequentially heated and melted by the upper and lower molds (20, 21) heated to the molding temperature. Further, the supply action of both to the resin sealing molding portion 8 is different only in the supply position / distance, and the other supply action is substantially the same as the above case.

Further, the above-mentioned molded product transfer mechanism 12 is a molded product molded by the above-mentioned resin sealing molding section 8 (sealed lead frame 9 and unnecessary resin molded body 14 integrally molded with this).
The unnecessary resin molded body cutting and removing unit 15
It is provided to be transferred to. Further, only the sealed lead frame 9 in which the unnecessary resin molded body 14 is cut and removed by the unnecessary resin molded body cutting / removing unit 15 can be transferred to and housed in the molded product storage unit 10. Has been.

The mold surface cleaning mechanism 13 described above is also used.
Is a state where the tip of a brush member (not shown) is pressed against the mold surfaces 16 of the upper and lower molds (20, 21), and
By moving on the mold surface 16 with the movement of 12,
It is provided so that the resin burr adhering to the mold surface 16 can be peeled off and the peeled resin burr can be sucked and removed to the outside through an appropriate vacuuming mechanism (resin burr suction / discharge mechanism). . This mold surface cleaning action is usually performed when the molded product transfer mechanism 12 engages the molded product of the resin sealing molding part 8 and transfers it to the unnecessary resin molded product cutting and removing part 15. Therefore, the normal resin burr is removed by the cleaning action of the mold surface cleaning mechanism 13, and the cleaning action is performed simultaneously with the above-described action of transferring the molded product by the molded product transport mechanism 12.

Further, the cleaning UV irradiation mechanism 17 described above includes the resin encapsulation molding section 8 by the material supply mechanism 11.
The retracted position (the position shown by the solid line in FIG. 3) that does not hinder the material supply work to the molded product and the molded product unloading work by the molded product transfer mechanism 12, and the upper and lower molds (20. 21) is provided so as to be reciprocally movable between a position close to the mold surface 16 (position shown by a chain line in FIG. 4). That is, the cleaning UV irradiation mechanism 17
Is used when cleaning the mold surfaces of the upper and lower molds in any of the resin encapsulation molding sections that have stopped the resin encapsulation molding operation. If encapsulation is being performed,
It has been moved / retracted to the retreat position that does not hinder the work. Then, on a regular basis, for example, by utilizing the molding cycle or the like, the work change time, the stop time of the molding apparatus, or the like, or when necessary, as shown in FIGS. Mold surface 16 of both upper and lower molds (20 ・ 21) in molding section
It is used by inserting it between them.

The cleaning UV irradiation mechanism 17 is also provided.
Is the same as the automatic control for the material supply mechanism 11 and the molded product transfer mechanism 12 via the control mechanism 19, and the upper and lower molds (20, 21) of the retreat position and each resin sealing molding part 8 are formed. It is provided so as to be capable of reciprocating between a position close to the surface 16 and, therefore, the mold surface cleaning action by the UV irradiation mechanism 17 can be automatically performed.

The main body 17a of the cleaning UV irradiation mechanism
5 to 6, a UV irradiation lamp (mercury lamp) 17b is provided, and the UV irradiation lamp is provided.
With 17b, UV irradiation can be performed on the mold surface 16 from a position close to the mold surface 16 of the upper and lower molds (20, 21).

The main body 17 of the UV irradiation mechanism shown in FIG.
In a, UV irradiation lamps 17b are arranged on both upper and lower surfaces so that the mold surfaces 16 of both upper and lower molds (20, 21) can be simultaneously irradiated with UV. Further, in addition to the structure shown in FIG. 6, the main body 17a of the UV irradiation mechanism shown in FIG. 7 captures mold surface contaminants separated and scattered from the mold surface 16 to be described later, and forces this to the outside. Suction and discharge mechanism for mold surface contaminants
It shows a configuration in which 18a is installed side by side.

Further, a mechanism for sucking and discharging the mold surface contaminants described above.
(18 ・ 18a) has the following structure. That is, FIG.
As shown in FIG. 7, the suction and discharge mechanism 18 for the mold surface contaminants provided in both the upper and lower molds (20, 21) has an intake hole 29 provided in the outer peripheral portion of both the upper and lower cavities (23, 26) and A vacuum source such as a vacuum pump (not shown), and an appropriate intake passage 30 for connecting the intake hole 29 and the vacuum source. Therefore, when the above-mentioned vacuum source is activated, both upper and lower molds are
It is provided so that the air near the mold surface 16 of (20 · 21) can be evacuated (sucked and exhausted) to the outside through the suction hole 29 and the suction passage 30. Also, as shown in FIG.
The suction and discharge mechanism 18a for the mold surface contaminants provided in the main body 17a of the V irradiation mechanism is the outer peripheral portion of the UV irradiation lamp 17b, and the position of the air intake hole 29 in both the upper and lower molds (20, 21) described above. An intake hole 29a arranged at a position substantially corresponding to, a vacuum source (not shown) such as a vacuum pump arranged outside, and the intake hole
29a and a vacuum source are communicatively connected to each other. Therefore, when the above-mentioned vacuum source is operated, the air around the mold surfaces 16 of the upper and lower molds (20, 21) can be evacuated to the outside through the intake holes 29a and the intake passages 30a.

As will be described later, the suction / discharging mechanism (18, 18a) for the mold surface contaminants may be installed together when the treatment of the mold surface contaminants can be performed more reliably and quickly. It is not always necessary. Further, the suction / discharging mechanism (18, 18a) for the mold surface contaminants may be configured to have at least one of them or to have both of them. Further, in the case where each resin encapsulation molding part 8 is provided with an appropriate vacuum evacuation mechanism for sucking and removing the resin burr peeled from the mold surface 16 to the outside, this vacuum evacuation mechanism is used for the above-mentioned mold surface contamination. It can also be used as a suction and discharge machine for objects.

Hereinafter, a case where an electronic component is resin-molded by using the above apparatus will be described. First, both upper and lower types (20
21) Open the mold. Next, the pre-molding lead frame 3 and the resin tablet 6 of both alignment parts (5, 7) are simultaneously transferred to the resin sealing molding part 8 via the material supply mechanism 11, and the pre-molding lead frame 3 is moved. The resin tablets 6 are fitted and set in the recesses of the lower mold cavity 23, and the resin tablets 6 are respectively charged and supplied into the pots 22. At this time, the resin tablets 6 in each pot 22 are sequentially heated and melted. Next, the lower mold 21 is moved upward and the upper and lower molds (20, 21) are clamped. Next, by pressing the resin tablet 6 in each pot 22 with each plunger, the resin tablet 6 is heated and melted, and the molten resin material is passed through the passage portion 24 into the upper and lower cavities (23, 26). Lead frame 3 which is filled by injection and set in the upper and lower cavities (23, 26)
The above electronic component is molded with resin. After the resin sealing molding of the electronic component described above, the lower mold 21 is moved downward again to open the upper and lower molds (20, 21). Next, the sealed lead frame 9 and the unnecessary resin molded body 14 are simultaneously released from the mold at the same time as the mold opening step. Next, the sealed lead frame 9 and the unnecessary resin molded body 14 are transferred to the unnecessary resin molded body cutting and removing section 15 via the molded product transfer mechanism 12, and the unnecessary resin molded body 14 portion is cut and removed. At this time, since the mold surface cleaning mechanism 13 is integrated with the molded product transfer mechanism 12, as described above, when the molded product transfer mechanism 12 moves to the unnecessary resin molded body cutting and removing section 15 side, The cleaning operation of the mold surface 16 by the mold surface cleaning mechanism 13 is performed. Therefore, the resin burr adhering to the mold surface 16 is sucked and removed to the outside through this cleaning action and the aforementioned vacuuming mechanism (see FIGS. 6 to 7). Next, the molded product (sealed lead frame 9) obtained by cutting and removing the unnecessary resin molded body 14 is transferred to the molded product storage unit 10 via the molded product transfer mechanism 12 and stored therein.

The mold surface cleaning action of removing the mold surface contaminants 32 adhered and accumulated on the mold surface 16 by using the cleaning UV irradiation mechanism 17 will be described below. As described above, the mold surface cleaning operation using the UV irradiation mechanism 17 is performed regularly or by utilizing the down time of the molding apparatus, or when necessary, through the control mechanism 19 through the UV irradiation mechanism. The main body 17a of 17 is the upper and lower molds in the resin molding part 8.
It is carried out by fitting it between the mold surfaces 16 of (20 ・ 21). The U
UV irradiation lamp 17b provided on the main body 17a of the V irradiation mechanism 17
When UV irradiation 31 is performed on the mold surface 16 from a position close to the mold surfaces 16 of the upper and lower molds (20, 21) by the method, as shown in FIG. Mold surface contaminants 32 consisting of release agent contained and volatile gas generated by heating 32
Will be decomposed and separated and scattered from the mold surface 16.
That is, by performing UV irradiation 31 on the mold surface 16,
Since the mold surface contaminant 32 adhered and accumulated on the mold surface 16 can be decomposed and separated and scattered from the mold surface 16, by performing UV irradiation 31 for the required time (for example, 30 minutes) on the mold surface 16,
The mold surface 16 can be cleaned efficiently and surely.

An appropriate vacuuming mechanism for sucking and removing the resin burr provided on each resin sealing molding portion 8 to the outside,
By using the above-mentioned mold surface contaminant suction / discharge mechanism (18, 18a) together, the mold surface contaminants 32 separated and scattered from the mold surface 16 are reliably captured, and the mold surface contaminants 32 are forced to the outside. Can be sucked and discharged. Therefore, there is an advantage that the mold surface contaminant 32 can be surely treated.

Further, in the above-mentioned structure, since it is not necessary to remove the mold from the apparatus main body or the like for the purpose of cleaning work for removing the mold surface contaminants 32, for example, in a heated state immediately after resin molding. The UV irradiation 31 can be immediately performed on the mold surface of the mold. Therefore, in this case, the decomposition action of the mold surface contaminants 32 of the heated mold can be promoted, so that the cleaning operation for removing the mold surface contaminants 32 can be performed more efficiently and quickly. There is an advantage that can be done.

The present invention is not limited to the above-mentioned embodiments, but can be arbitrarily and appropriately modified / selected as necessary within the scope of the gist of the present invention. Is.

For example, in addition to the molded product transfer mechanism 12 described above, a dedicated transfer mechanism for transferring only the sealed lead frame 9 obtained by cutting and removing the unnecessary resin molded body 14 to the molded product storage section 10 for storage. (Not shown) may be installed side by side.

Further, the suction / discharge mechanism 18 for the mold surface contaminants 32 described above is shown as being integrally provided in the resin sealing molding portion 8. However, the suction / discharge mechanism 18 is molded by resin sealing. It may be configured separately from the unit 8.

[0038]

According to the present invention, in the resin encapsulation molding apparatus in which a molding apparatus main body and a plurality of resin encapsulation molding portions are detachably connected to the main body, the material supply mechanism and the molded product transfer mechanism are combined. The effect of reducing the molding cost by
Not only the effect and the mold surface cleaning action and effect of removing resin burrs can be maintained, but also the mold surface contaminants accumulated and accumulated on the mold surface in each resin encapsulation molding portion are decomposed to decompose the mold surface. It is possible to efficiently and surely perform the mold surface cleaning work for separating and scattering from the mold. Further, it has an excellent practical effect that it is possible to provide a resin encapsulation molding apparatus for electronic parts capable of automatically controlling all the work steps including the work of cleaning the mold surface contaminants.

[Brief description of the drawings]

FIG. 1 is a partially cut-away schematic plan view of a resin encapsulation / molding apparatus for an electronic component according to the present invention, showing a resin encapsulation apparatus having a resin encapsulation section with respect to a main body of the encapsulation apparatus FIG. 2 shows a state in which a plurality of connected bodies are connected to each other.

FIG. 2 is a partially cut-away schematic cross-sectional plan view of the forming apparatus corresponding to FIG. 1;

FIG. 3 is a molding apparatus corresponding to FIG.
It is a partial notch schematic longitudinal cross-sectional view in the A line.

FIG. 4 is a schematic vertical sectional view of a part of the molding apparatus corresponding to FIG. 3;

FIG. 5 is a partially cut-away side view showing a molding device corresponding to FIG. 1 and showing an enlarged main part of a resin-sealed molding portion;
It shows a state in which a cleaning UV irradiation mechanism is fitted between the opened molds.

FIG. 6 is a partially cutaway longitudinal sectional view showing a resin sealing molded portion corresponding to FIG. 5 and showing a main portion thereof in an enlarged manner.

FIG. 7 is a partially cutaway vertical sectional view showing a main part of another resin sealing molding portion according to the present invention.

FIG. 8 is an explanatory diagram of a cleaning action by a cleaning UV irradiation mechanism.

[Explanation of symbols]

 1 Molding Device Main Body 2 Connected Body 3 Pre-Molding Lead Frame 4 Material Loading Section 5 Pre-Molding Lead Frame Alignment Section 6 Resin Tablet 7 Alignment Section 8 Resin Sealing Molding Section 9 Sealed Lead Frame 10 Molded Product Storage Section 11 Material Supply Mechanism 12 Molded product transfer mechanism 13 Mold surface cleaning mechanism 14 Unnecessary resin molding 15 Unnecessary resin molding cutting and removing section 16 Mold surface 17 UV irradiation mechanism 17a Main body 17b UV irradiation lamp 18 Suction and discharge mechanism 18a Suction and discharge mechanism 19 Control mechanism 20 Fixed upper mold 21 Movable lower mold 22 Pot 23 Cavity 24 Passage 25 Cull 26 Cavity 27 Gate 28 Air vent 29 Air intake 29a Air intake 30 Air intake 30a Air intake 31 UV irradiation 32 Surface contaminants

Claims (4)

[Claims] 1. A body of a resin encapsulation molding apparatus for an electronic component, comprising a resin encapsulation molding unit for encapsulating an electronic component such as a semiconductor chip with a resin material, and at least resin encapsulation molding for the body. A resin encapsulation molding apparatus for electronic parts, which is configured to detachably mount a connected body composed of a resin encapsulation molding apparatus including a mold, wherein the mold surface cleaning of the mold in each resin encapsulation molding section is performed. A UV irradiating mechanism for cleaning the UV irradiating mechanism for cleaning, and the cleaning UV irradiating mechanism is provided at a retreat position that does not hinder the material supply work to the resin sealing molding part and the molding product unloading work and the gold in the resin sealing molding part. A resin encapsulation molding apparatus for electronic parts, wherein the resin encapsulation molding apparatus is configured so as to be reciprocally movable at positions close to a mold surface. 2. The resin encapsulation molding part captures mold surface contaminants separated and scattered from the mold surface of the mold in the resin encapsulation molding part, and forcibly sucks and discharges the mold surface contaminants to the outside. The resin encapsulation molding apparatus for an electronic component according to claim 1, further comprising a suction and discharge mechanism for the mold surface contaminants. 3. The cleaning UV irradiation mechanism captures mold surface contaminants separated and scattered from the mold surface of the mold in the resin encapsulation molding portion, and forcibly sucks and discharges the mold surface contaminants to the outside. The resin encapsulation molding apparatus for an electronic component according to claim 1, further comprising a suction and discharge mechanism for the mold surface contaminants. 4. The mold sealing material separated and scattered from the mold surface of the mold in the resin sealing molding portion and the UV irradiation mechanism for cleaning is trapped in each of the resin sealing molding portion and the mold surface contamination. The resin encapsulation molding apparatus for an electronic component according to claim 1, further comprising a suction and discharge mechanism of a mold surface contaminant for forcibly sucking and discharging an object to the outside.