JP3896274B2

JP3896274B2 - Semiconductor resin sealing device

Info

Publication number: JP3896274B2
Application number: JP2001331867A
Authority: JP
Inventors: 勇旗黒; 大福岡
Original assignee: Sumitomo Heavy Industries Ltd
Current assignee: Sumitomo Heavy Industries Ltd
Priority date: 2001-10-30
Filing date: 2001-10-30
Publication date: 2007-03-22
Anticipated expiration: 2021-10-30
Also published as: JP2003133352A

Description

【０００１】
【発明の属する技術分野】
本発明は、半導体チップを搭載した配線板（基板、リードフレーム）等を樹脂で封止する半導体樹脂封止装置に関する。
【０００２】
【従来の技術および発明が解決しようとする課題】
一般に半導体樹脂封止装置１０は、図２４ないし図２８に示すように、対向して配置された２つの金型、すなわち、第1の金型１１と昇降可能な第２の金型１２とから構成され、これら２つ金型の間に、配線基板１４に搭載された半導体チップ１３が電気的に接続されてなる被成形品１５を配置するようになっている。
【０００３】
上記第２の金型１２は枠状金型１９と圧縮金型２１から構成され、これらと第１の金型１１等の内部には図示しないがヒータを備え、このヒータでタブレット状に成形した熱硬化性エポキシ樹脂のような封止用樹脂１７を加熱溶融する。また、枠状金型１９の下部には昇降機構１６を備えており、この枠状金型１９を昇降させるようになっている。枠状金型１９の枠内には上下に貫通する矩形の貫通孔１９ａが開けられ、その中に圧縮金型２１が嵌め込まれている。この圧縮金型２１の下部には昇降機構２０を備えており、この圧縮金型２１を昇降させるようになっている。これらの両昇降機構１６，２０は図示しない制御器により駆動制御されるようなっている。
【０００４】
次に、この半導体樹脂封止装置１０の作用を説明する。まず、第1の金型１１と第２の金型１２とを図２４に示すように対向して配置する。封止用樹脂１７を圧縮金型２１の上面に載置し、被成形品１５を枠状金型１９の上面に載置して、図示しないヒータにより封止用樹脂１７を加熱し溶融状態にする。
【０００５】
しかる後、圧縮金型２１とともに枠状金型１９を昇降機構２０、１６により図２５に示すように上昇させ、枠状金型１９の上面と第1の金型１１の下面とで被成形品１５の配線基板１４の周縁部をクランプする。
【０００６】
このクランプ後、昇降機構２０により圧縮金型２１をさらに図２５に示すように上昇させ、溶融した封止用樹脂１７を押しつぶすことによって、配線基板１４と枠状金型１９と圧縮金型２１で形成されるキャビティＣ内に溶融した封止用樹脂１７を充満させることで樹脂封止がなされ、樹脂封止された成形品１８が完成する。
【０００７】
樹脂封止後、まず、昇降機構２０にて圧縮金型２１を図２６に示すように下降させる。この下降により圧縮金型２１の上面を成形品１８の封止樹脂部１８ａの封止樹脂部表面１８ｂａから分離する。
【０００８】
次に、枠状金型１９と圧縮金型２１とを図２７に示すように昇降機構１６、２０にて第1の金型１１から下降させることによって成形品１８の配線基板１４の上面が第１の金型１１の下面から分離する。この後、再度圧縮金型２１を図２８に示すように上昇させ、成型品１８を第２の金型１２からエジェクトし成形品を取り出す。この後、この樹脂封止した成形品１８を図２９に示すように２点鎖線部で切断し個々のパッケージに分離し最終の完成品にする。
【０００９】
なお樹脂封止時、溶融した封止用樹脂１７は圧縮金型２１で圧縮されることで被成形品１５に密着するが、同時に圧縮金型２１にも密着する。封止後、圧縮金型２１を成形品１８から分離するときの離型荷重は圧縮金型２１の上面と図２５に示す封止樹脂部表面１８ｂａとの間に掛かると同時に、配線基板１４と封止樹脂部１８ａとの樹脂界面１８ｂｂにも掛かる。ここで通常は、圧縮金型２１の上面と封止樹脂部表面１８ｂａとの密着力より上記樹脂界面１８ｂｂでの密着力が強いため、圧縮金型２１と封止樹脂部１８ａとは封止樹脂部表面１８ｂａで離型するが、このときの応力は当然、半導体チップ１３や配線基板１４に掛かるので、場合によっては樹脂界面１８ｂｂで剥離が生ずる。特に、成形品１８内の半導体チップ１３周縁部において配線基板１４と封止樹脂部１８ａが剥離すると、図２９のように分離切断した後、この剥離部から水分が浸透し製品不良を起こすことがある。
【００１０】
本発明では離型時、圧縮金型２１の上面と封止樹脂部１８aとの離型荷重が樹脂界面１８ｂｂに掛からないようにすることで、被成形品１５と封止樹脂部１８ａとの樹脂界面１８ｂｂに剥離を起こさせないようにすることを目的とする。
【００１１】
【課題を解決するための手段】
請求項１の発明は、第１の金型と、この第１の金型に対向して配置され、貫通孔を有する枠状金型とこの貫通孔に嵌合して昇降可能な圧縮金型からなる第２の金型と、前記第１または第２の金型を昇降させる昇降機構とから構成され、これら第１の金型と第２の金型の間に被成形品を配置し、前記第１の金型と枠状金型により被成形品の配線基板の周縁部をクランプし、前記昇降機構により前記圧縮金型が前記第１の金型側へ相対的に移動することで、加熱溶融した封止用樹脂を被成形品に圧縮成形により樹脂封止する半導体樹脂封止装置において、前記第２の金型には、樹脂封止後に前記圧縮金型を成形品から分離するときにこの成形品の封止樹脂周縁部分を保持する保持部を備え、前記保持部は、前記成形品の封止樹脂周縁部分のうち、前記成形品と前記第２の金型との樹脂界面に当接して保持するものであり、圧縮金型を成形品から分離するときに被成形品と圧縮成形した封止樹脂部が剥離しないようにしたものである。
【００１２】
請求項２の発明は、前記圧縮金型を成形品から分離するときにこの成形品の封止樹脂周縁部分全部もしくは一部を保持する保持部としての段部を前記枠状金型または前記圧縮金型に設け、圧縮金型を成形品から分離するときに被成形品と圧縮成形した封止樹脂部が剥離しないようにしたものである。
【００１３】
請求項３の発明は、前記圧縮金型は、前記枠状金型の貫通孔に昇降自在に嵌合させた凸字状からなり、この圧縮金型の下腕部と前記枠状金型との間に第１の弾性体を設け、前記枠状金型はこの第１の弾性体を介して前記圧縮金型の下腕部に支持されて圧縮金型に連動して昇降するとともに、前記貫通孔の内側面には樹脂封止後に前記圧縮金型を成形品から分離するときにこの成形品の封止樹脂周縁部分全部もしくは一部を保持する保持部としての段部を設けたものであり、圧縮金型を成形品から分離するときに被成形品と圧縮成形した封止樹脂部が剥離しないようにするとともに、枠状金型と圧縮金型の相対移動を１つの昇降機構により昇降できるようにしたものである。
【００１４】
請求項４の発明は、前記第1の金型には、樹脂封止時に受ける反力より大きい力で圧縮可能な弾性力を有する第２の弾性体と、この第２の弾性体を介して第1の金型本体に昇降可能に保持された可動金属板を備え、成形品のエジェクトを的確に行うようにしたものである。
【００１５】
請求項５の発明は、第1の金型と、この第1の金型に対向して配置され、貫通孔を有する枠状金型とこの貫通孔に嵌合して昇降可能な圧縮金型からなる第２の金型と、前記第１または第２の金型を昇降させる昇降機構とから構成され、これら第１の金型と第２の金型の間に被成形品を配置し、前記第１の金型と枠状金型により被成型品の配線基板の周縁部をクランプし、前記昇降機構により前記圧縮金型が前記第１の金型側へ相対的に移動することで、加熱溶融した封止用樹脂を被成形品に圧縮成形により樹脂封止する半導体樹脂封止装置において、圧縮金型の外側面または枠状金型の内側面に切り込み部を設け、この切り込み部に前記貫通孔と前記切り込み部に昇降自在に嵌合して昇降する可動ブロックを備え、この可動ブロックが樹脂封止後に前記圧縮金型を成形品から分離するときにこの成形品の封止樹脂周縁部分全部もしくは一部を保持するようにし、圧縮金型を成形品から分離するときに被成形品と圧縮成形した封止樹脂部が剥離しないようにするとともに、供給する封止用樹脂量の計量精度を緩和するようにしたものである。
【００１６】
請求項６の発明は、第1の金型と、この第1の金型に対向して配置され、貫通孔を有する枠状金型とこの貫通孔に嵌合して昇降可能な圧縮金型からなる第２の金型と、前記第１または第２の金型を昇降させる昇降機構とから構成され、これら第１の金型と第２の金型の間に被成形品を配置し、前記第１の金型と枠状金型により被成型品の配線基板の周縁部をクランプし、前記昇降機構により前記圧縮金型が前記第１の金型側へ相対的に移動することで、加熱溶融した封止用樹脂を被成形品に圧縮成形により樹脂封止する半導体樹脂封止装置において、圧縮金型または枠状金型内に可動ブロック挿入孔を設け、この可動ブロック挿入孔に昇降自在に嵌合して昇降する可動ブロックを備え、この可動ブロックが、樹脂封止後に前記圧縮金型を成形品から分離するときにこの成形品の封止樹脂部周縁部の一部を保持するようにし、圧縮金型を成形品から分離するときに被成形品と圧縮成形した封止樹脂部が剥離しないようにするとともに、供給する封止用樹脂量の計量精度を緩和し、また、可動ブロックを圧縮金型もしくは枠状金型内に入れることで圧縮金型と枠状金型が相対移動する時の影響を可動ブロックが受けないようにしたものである。
【００１７】
請求項７の発明は、前記可動ブロックは前記圧縮金型または前記枠状金型に設けられた切り込み部または可動ブロック挿入孔に樹脂封止圧力で圧縮可能な支持弾性体を介して圧縮金型または枠状金型に支持され、この圧縮金型または枠状金型に連動して昇降するようにし、可動ブロックを昇降するための昇降機構を省略して半導体樹脂封止装置の機構を簡略化したものである。
【００１８】
【発明の実施の形態】
以下添付の図面を参照して本発明の種々の好ましい実施の形態について説明する。
【００１９】
（第１の実施の形態）
図１ないし図５を参照して本発明の第１の実施の形態を説明する。なお、従来の半導体樹脂封止装置１０と同一部分には同一符号付して説明する。
【００２０】
この実施の形態の半導体樹脂封止装置３０は、対向して配置された２つの金型、すなわち、第1の金型１１と昇降可能な第２の金型３１とから構成され、これら２つ金型の間に被成形品１５を配置するようになっている。
【００２１】
上記第２の金型３１は枠状金型３４と圧縮金型３３から構成され、これらと第１の金型１１等の内部には図示しないがヒータを備え、このヒータで封止用樹脂１７を加熱溶融するようになっている。これら枠状金型３４と圧縮金型３３は図示しない昇降機構により昇降するようになっている。また、枠状金型３４の枠内には上下に貫通する矩形の貫通孔３２が開けられ、その中に圧縮金型３３が嵌め込まれている。
【００２２】
枠状金型３４の上部の内側面には、その外周部の寸法がキャビティＣの外周部の寸法（L01×L02）（図２９参照）に相当する段部３５を設けている。この段部３５の底面３５ａは、圧縮金型３３の上面を封止樹脂部１８ａの表面から分離するときに成形品を保持する保持部となっている。次に、この半導体樹脂封止装置３０による樹脂封止方法を説明する。まず、第1の金型１１と第２の金型３１とを図１に示すように対向して配置する。封止用樹脂１７を圧縮金型３３の上面に載置し、被成形品１５を枠状金型３４の上面に載置して、図示しないヒータにより封止用樹脂１７を加熱し溶融状態にする。
【００２３】
しかる後、圧縮金型３３とともに枠状金型３４を図示しない昇降機構により図２に示すように上昇させ、枠状金型３４の上面と第1の金型１１の下面とで被成形品１５の配線基板１４の周縁部をクランプする。
【００２４】
このクランプ後、昇降機構により圧縮金型３３をさらに図２に示すように上昇させ、この圧縮金型３３で溶融した封止用樹脂１７を押しつぶすことによって、配線基板１４と枠状金型３４と圧縮金型３３で形成されるキャビティＣ内に溶融した封止用樹脂１７を充満させることで樹脂封止された成形品１８が完成する。
【００２５】
樹脂封止後、まず、昇降機構にて圧縮金型３３を図３に示すように下降させる。この下降により圧縮金型３３の上面を成形品１８の封止樹脂部表面１８ｂａから分離し離型する。
【００２６】
次に、枠状金型３４と圧縮金型３３とを図４に示すように昇降機構にて第1の金型１１から下降させることによって成形品１８の配線基板１４の上面が第１の金型１１の下面から分離する。この後、再度圧縮金型３３を図５に示すように上昇させ、成型品１８を第２の金型３１からエジェクトし成形品を取り出す。
【００２７】
離型のとき、圧縮金型３３と封止樹脂部１８ａの図２に示す封止樹脂部表面１８ｂａの密着力により、被成形品１５と封止樹脂部１８ａとの樹脂界面１８ｂｂにも離型荷重が掛かるが、枠状金型３４の貫通孔３２に設けた段部３５の底面３５ａが保持部となって封止樹脂部１８ａの周縁部を下から保持するためこの離型荷重を緩和する。
【００２８】
このように、成形品１８を保持した状態で離型することで、圧縮金型３３の上面と封止樹脂部１８ａの下面との離型荷重が配線基板１４や半導体チップ１３にかかるのを最小限に押さえることができるので、離型の際に樹脂界面１８ｂｂにおける封止樹脂部１８ａと配線基板１４との剥離を防ぐことができ、良質な成形品を供給することができる。
【００２９】
（第２の実施の形態）
次に、図６ないし図９を参照して本発明の第２の実施の形態を説明する。ここでは第1の実施の形態の半導体樹脂封止装置３０と同一部分は同一符号をもって説明する。
【００３０】
この実施の形態の半導体樹脂封止装置４０は第1の金型１１と第２の金型４１が対向して配置され、この第２の金型４１は枠状金型４３と圧縮金型４２から構成されている。これら枠状金型４３、圧縮金型４２、第１の金型１１等の内部には、封止用樹脂１７を加熱溶融するための図示しないヒータを備えている。また、圧縮金型４２は昇降機構４５により昇降するようになっている。
【００３１】
枠状金型４３は枠内に上下に貫通する矩形の貫通孔３２が開けられており、この貫通孔３２によって圧縮金型４２の外側に嵌め込まれている。圧縮金型４２はその垂直断面が凸字の形状で下部は突起状もしくは鍔状の下腕部４２ａとなっている。この下腕部４２ａと枠状金型４３との間には、枠状金型４３を上げる方向へ反力を発生させる第1の弾性体４４が設けられている。枠状金型４３はこの第１の弾性体４４を介して圧縮金型４２の下腕部４２ａに上方に支持されている。したがって、枠状金型４３は昇降機構４５により圧縮金型４２と連動して昇降するようになっている。
【００３２】
枠状金型４３の上部の内側面にはその外周部の寸法がキャビティＣの外周部の寸法（L01×L02）に相当する段部３５を設けている。この段部３５の底面３５ａは圧縮金型４２の上面を封止樹脂部１８ａの表面から分離するときに成形品を保持する保持部となっている。
次に、この半導体樹脂封止装置４０による樹脂封止方法を説明する。まず、封止用樹脂１７、被成形品１５を図６に示すように圧縮金型４２、枠状金型４３に載置し、封止用樹脂１７を図示しないヒータにより加熱溶融する。
【００３３】
次に、図７に示すように昇降機構４５により圧縮金型４２を上昇する。この上昇により枠状金型４３が第１の弾性体４４を介して圧縮金型４２の下腕部４２ａに押し上げられて上昇し、被成形品１５の配線基板１４の上面が第1の金型１１の下面に当接する。当接後、さらに、第１の弾性体４４の弾性力に抗して図８に示すように昇降機構４５により圧縮金型４２を上昇すると、第１の弾性体４４が圧縮し配線基板１４に所定のクランプ力を与える。それと同時に圧縮金型４２が溶融した封止用樹脂１７を押しつぶして被成形品１５の表面に均一に圧縮成形し、被成形品１５に封止用樹脂１７を樹脂封止して成形品１８を完成する。
【００３４】
樹脂封止後、昇降機構４５により圧縮金型４２を図９に示すように下降させて圧縮金型４２の上面を成形品１８の封止樹脂部１８ａの下面から分離して離型する。このとき、第１の弾性体４４は前記離型荷重以上の弾性力で第1の金型１１と枠状金型４３の段部３５の底面３５ａとの間に成形品１８を保持している。
【００３５】
この後さらに、昇降機構４５にて圧縮金型４２を下降させ成形品１８、枠状金型４３を第1の金型１１から分離する。分離が終了したら、たとえば、図示しない真空吸着装置などで成形品１８を吸着し第２の金型４１から半導体樹脂封止装置４０外へ搬出する。
【００３６】
このようにすると、圧縮金型４２の上面が封止樹脂部表面１８ｂａから離型するとき、第１の実施の形態と同様に段部３５の底面３５ａが保持部となって封止樹脂部１８ａの周縁部を保持するため、離型荷重を緩和するので、樹脂界面１８ｂｂでの剥離を防止することができ、良質な成形品を供給できる。さらに、この圧縮成形時等の圧縮金型４２、枠状金型４３の昇降を、第１の弾性体４４を介して１つの昇降機構４５により操作できるから昇降機構を簡略化することができる。
【００３７】
（第３の実施の形態）
次に、図１０ないし図１４を参照して本発明の第３の実施の形態を説明する。この第３の実施の形態の半導体樹脂封止装置５０は第２の実施の形態の半導体樹脂封止装置４０の第1の金型に可動金型板５３を設けて改良し成形品のエジェクトを確実にするようにしたものである。
【００３８】
この半導体樹脂封止装置５０の第1の金型５１はホルダ部５２ａを有する第1の金型本体５２と、このホルダ部５２ａに昇降自在に取り付けられた可動金型板５３と、両者の間にあって可動金型板５３を下方向に押し付けている第２の弾性体５４とで構成されている。この第２の弾性体５４は樹脂封止時の下型からの反力より強い初圧でセットされている。
【００３９】
次に、この半導体樹脂封止装置５０による樹脂封止方法を説明する。図１０から図１３における一連の動作は第２の実施の形態と同じなのでここでは省略する。図１３で圧縮金型４２の上面と成形品１８の封止樹脂部１８ａの下面を分離した後、再び昇降機構４５にて圧縮金型４２を封止樹脂部１８ａの下面に当接するまで上昇させる。さらに圧縮金型４２を上昇させると、昇降機構４５の押し上げ力が成形品１８を介して可動金型板５３に伝わり、第２の弾性体５４を撓ませながら第２の金型４１の枠状金型４３の上面と第1の金型本体５２のホルダ部５２ａの下面が当接する。ここから圧縮金型４２を図１４の位置まで上昇させ封止樹脂部１８ａの側面と枠状金型４３の内面を離型する。これら一連の動作において成形品１８はキャビティ面から完全に離型する。
その後、昇降機構４５にて圧縮金型４２、枠状金型４３、成形品１８を下げ、図示しない真空吸着装置などで成形品１８を取り出す。
【００４０】
この第３の実施の形態によれば、圧縮金型４２が封止樹脂部１８ａの下面から離型するときに発生する樹脂界面１８ｂｂでの剥離を第１の実施の形態と同様に防止することができるとともに、この圧縮成形時等の圧縮金型４２と枠状金型４３の昇降を、第１の弾性体４４を介して１つの昇降機構４５により昇降できることから昇降機構を簡略化することができる。また、成形品１８の側面を枠状金型４３の内側面から離型しておくため、成形品１８を図示しない真空吸着装置などで取り出すときの離型荷重が殆どなく、真空吸着装置を簡素化できる他、取り出し時の成形品１８へのダメージを防止することができる。
【００４１】
また、一連の動作において、先に図１４の動作を行った後、図１３のごとく圧縮金型４２の上面と封止樹脂部１８ａの下面の分離を行っても同様の効果が得られる。
【００４２】
（第４の実施の形態）
次に、図１５を参照して本発明の第４の実施の形態を説明する。これは第３の実施の形態の変形例で、以下に示す第1の金型６１の構成以外は第３の実施の形態と同様である。この実施の形態の半導体樹脂封止装置６０の第1の金型６１は第1の金型本体６２と第1の金型本体６２から下方に伸びたストッパピン６３、このストッパピン６３に挿入され昇降自在に保持された可動金型板６４、および両者の間にあって可動金型板６４を下方向に押し付けている第２の弾性体６５とで構成されている。この第２の弾性体６５は樹脂封止時の下型からの反力より強い初圧でセットされている。ここで、第３の実施の形態との違いは、第1の金型本体５２のホルダ部５２ａの代わりに、ストッパピン６３に設けられた鍔部６３ａで可動金型板６４の下方向への移動を抑制している点と、成形品１８の側面と第２の金型４１の枠状金型４３の内面との離型時に枠状金型４３が上昇するのをストッパピン６３の下面で抑制している点である。従って、作用、効果は第３の実施の形態と略同様であるが、本発明では第1の金型をより簡易に構成することができる。
【００４３】
（第５の実施の形態）
次に、図１６ないし図２２を参照して本発明の第５の実施の形態を説明する。なお、従来の半導体樹脂封止装置１０と同一部分には同一符号付して説明する。この実施の形態の半導体樹脂封止装置７０の第２の金型７１は圧縮金型７３と枠状金型７７と可動ブロック７６で構成され、これら圧縮金型７３と枠状金型７７は図示しない昇降機構により昇降するようになっている。また、枠状金型７７の枠内には上下に貫通する矩形の貫通孔７２が開けられ、その中に圧縮金型７３が嵌め込まれている。
【００４４】
圧縮金型７３の上部外周には切り込み部７４を設け、その上部の上部切り込み部７４ａは浅く切り込まれ、下部の下部切り込み部７４ｂは上部切り込み部７４ａより深く切り込まれている。圧縮金型７３と枠状金型７７の間には、可動ブロック７６が上部切り込み部７４ａと枠状金型７７の貫通孔７２に嵌合して昇降自在に配置されている。可動ブロック７６は切り込み部７４内に設けられたばね等の弾性体の支持弾性体７５を介して圧縮金型７３の下腕部７３ａの上面に上方に支持され、圧縮金型７３の昇降に連動して昇降できるようになっている。このときの支持弾性体７５の弾性力は所定の封止圧力付近にセットされている。圧縮金型７３、枠状金型７７、第１の金型１１の内部には図示しないがヒータが備えられ、封止用樹脂１７を加熱して溶融するようになっている。
【００４５】
次に、この半導体樹脂封止装置７０による樹脂封止方法を説明する。まず、図１６に示すように圧縮金型７３の上面に封止用樹脂１７を載置し、枠状金型７７の上面には被成形品１５を載置して、図示しないヒータにより封止用樹脂１７を加熱溶融する。しかる後、圧縮金型７３とともに枠状金型７７を図示しない昇降機構により図１７に示すように上昇させ、枠状金型７７の上面と第1の金型１１の下面とで被成形品１５の配線基板１４の周縁部をクランプする。
【００４６】
このクランプ後、昇降機構にて圧縮金型７３を所定の位置まで上昇させ、キャビティＣ内に溶融した封止用樹脂１７を充満させることで樹脂封止がなされ、樹脂封止された成形品１８が完成する。
【００４７】
このとき、可動ブロック７６は支持弾性体７５を介して下腕部７３ａに押し上げられて上昇するが、封止用樹脂１７の投入量の増減により、図１７から図１９の範囲内で支持弾性体７５により所定の樹脂封止圧力を加えられる位置で停止する。例えば、可動ブロック７６に支持弾性体７５のセット圧以上の樹脂封止圧力が加わることで、図１８に示すように支持弾性体７５を撓ませながら可動ブロック７６が圧縮金型７３に対して相対的に下方向に移動し、キャビティ内を所定の封止圧力に維持する。つまり、封止用樹脂１７の量が所定量より多い場合には、枠状金型７７の上部内側面と圧縮金型７３の上部外周面と可動ブロック７６の上面７６ａが形成する凹部７８がキャビティの容積を増加させて、この凹部７８が多すぎた余分の樹脂を吸収して樹脂封止が完了する。
【００４８】
また、樹脂１７が所定量より少ない場合は、所定の封止圧力では図１９に示すように可動ブロック７６の上部７６ｂが圧縮金型７３の上面より上に突出した状態になり、キャビティの容積を減少させた状態で樹脂封止が完了する。
【００４９】
図１７ないし図１９の状態で樹脂封止が完了した後、支持弾性体７５の反力により可動ブロック７６を介して成形品１８を第1の金型１１に当接しつつ圧縮金型７３を図２０に示すように昇降機構により下降させ、圧縮金型７３の上面を封止樹脂部１８ａの下面から分離し離型する。
【００５０】
この離型のとき、圧縮金型７３の上面と封止樹脂部１８ａの下面との密着力により、被成形品１５と封止樹脂部１８ａとの樹脂界面１８ｂｂにも離型荷重が掛かるが、可動ブロック７６の上面７６ａが保持部となって封止樹脂部１８ａの周縁部を保持するため、樹脂界面１８ｂｂに掛かる離型荷重を緩和する。特に封止樹脂部１８ａの周縁部では、この剥離荷重荷重を極小にすることができる。
【００５１】
しかる後、図２１に示すように昇降装置にて枠状金型７７、圧縮金型７３、可動ブロック７６、成形品１８を第1の金型１１から下降させる。その後、図２２に示すように圧縮金型７３を再度上昇させ、成形品１８を第２の金型７１からエジェクトする。
【００５２】
本実施の形態では、圧縮金型７３の上面と封止樹脂部１８ａの下面との離型荷重が配線基板１４や半導体チップ１３に掛かるのを最小限に押さえることができるので、離型の際の樹脂界面１８ｂｂでの剥離を防ぐことができ、良質な成形品を供給することができる。
【００５３】
また、供給する封止用樹脂量が所定量より増減した場合でも、可動ブロック７６の可動範囲内（図１７から図１９の様な位置）であれば所定の封止圧力を保ちつつ成形することが可能である。言い換えれば、供給する樹脂量は可動ブロック７６の可動範囲でカバーできる体積分変動してもよいことになり、供給する封止用樹脂量の計量精度を緩和することが可能である。
【００５４】
また、可動ブロック７６は支持弾性体７５を介して圧縮金型７３とともに昇降するので特別な昇降機構を必要とせず、装置を簡単にすることができる。
【００５５】
なお、この可動ブロック７６は環状の一体ものでもよいし、縦に分割された複数のものでもよい。また、本実施の形態では可動ブロック７６は支持弾性体７５を介して圧縮金型７３の下腕部７３ａに支持されて移動させるようにしたが、圧縮金型とは別の独立した昇降機構に取り付けて移動させるようにしてもよい。
【００５６】
また、可動ブロック７６、支持弾性体７５は圧縮金型７３側の切り込み部７４内で昇降するが、枠状金型内に同様の切り込みを設けて、枠状金型と連動して昇降するようにしても同様の効果を得ることができる。
【００５７】
（第６の実施の形態）
次に、図２３を参照して本発明の第６の実施の形態を説明する。これは、以下に示す第２の金型８１の構成以外は第５の実施の形態と同様である。この実施の形態の半導体樹脂封止装置８０の第２の金型８１は、圧縮金型８３と枠状金型８７と可動ブロック８６で構成され、これら圧縮金型８３と枠状金型８７は図示しない昇降機構により昇降するようになっている。また、枠状金型８７の枠内には上下に貫通する貫通孔８２が開けられ、その中に圧縮金型８３が嵌め込まれている。枠状金型８７の上部の内側面には、その外周部の寸法がキャビティＣの外周の寸法に相当する段部８５を設けている。段部８５の底面には上下に貫通する１つもしくは複数の可動ブロック挿入孔８８が開けられている。この可動ブロック挿入孔８８の下部にはねじ溝が切られ、蓋部８７ａが下から螺合されている。
【００５８】
この可動ブロック挿入孔８８に嵌合してピン状の可動ブロック８６が昇降自在に配置されている。可動ブロック８６は、支持弾性体７５を介して枠状金型８７の蓋部８７ａの上面に上方に支持され、枠状金型８７の昇降に連動して昇降できるようになっている。このときの支持弾性体７５の弾性力は所定の封止圧力付近にセットされている。
【００５９】
ここで、第５の実施の形態との違いは、枠状金型８７に可動ブロック挿入孔８８を設け、可動ブロック８６がこの可動ブロック挿入孔８８に嵌合して昇降するようになっている点である。従って、作用、効果は第５の実施の形態と略同様である。例えば、図２３は封止用樹脂が所定量より多い場合に樹脂封止がなされた状態を示しているが、可動ブロック挿入孔８８の上部の凹部８９が余分の樹脂の体積を吸収するようになっている。圧縮金型８３を封止樹脂部１８ａから分離するときには、可動ブロック８６の上面８６ａと段部８５の底面が封止樹脂部１８ａに対する保持部となっている。
【００６０】
この実施の形態では、枠状金型に可動ブロック挿入孔８８を設けたが、圧縮金型に可動ブロック挿入孔を設け、これに可動ブロックと支持弾性体を配置するようにしてもよい。
【００６１】
上記各実施の形態では第２の金型を可動にし第１の金型を固定としたが、第１の金型が可動側、第２の金型が固定側でもよいし、第１の金型を下、第２の金型を上にし、被成形品を第１の金型の上に載置して、その上に封止用樹脂を載置してもよい。また、被成形品の樹脂による封止を片方の表面にしたが、これを上下両面に封止してもほぼ同様に実施することはできる。さらに、金型の貫通孔は矩形にしたがこれを丸形、楕円形等にしても同様に実施することができる。
【００６２】
さらにまた、第１、第２の弾性体、支持弾性体は、ばねやゴム等の弾性材料のほか被成形品１５に応じて空圧装置、油圧装置、小形電動機等を用いた伸縮自在の部材に適宜変更してもほぼ同様に実施することができる。その他被成形品も複数の半導体チップを一体に封止するばかりか１個あるいは２、３個等の少量の単位で封止するものであってもよい。保持部を形成する段部の底面と可動ブロックの上面は水平な面であってもよいし、水平に対して角度を付けた平面や曲面であってもよい。
【００６３】
【発明の効果】
本発明は、第1の金型と、この第1の金型に対向して配置され、貫通孔を有する枠状金型とこの貫通孔に嵌合して昇降可能な圧縮金型からなる第２の金型と、前記第１または第２の金型を昇降させる昇降機構とから構成され、これら第１の金型と第２の金型の間に被成形品を配置し、前記第１の金型と枠状金型により被成型品の配線基板の周縁部をクランプし、前記昇降機構により前記圧縮金型が前記第１の金型側へ相対的に移動することで、加熱溶融した封止用樹脂を被成形品に圧縮成形により樹脂封止する半導体樹脂封止装置において、前記第２の金型には、樹脂封止後に前記圧縮金型を成形品から分離するときにこの成形品の封止樹脂周縁部分全部もしくは一部を保持する保持部を設け、圧縮金型を成形品から分離するときに被成形品と圧縮成形した封止樹脂部が剥離しないようにすることができる。
【００６４】
また、本発明は、前記圧縮金型を成形品から分離するときにこの成形品の封止樹脂周縁部分全部もしくは一部を保持する保持部としての段部を前記枠状金型または前記圧縮金型に設け、圧縮金型を成形品から分離するときに被成形品と圧縮成形した封止樹脂部が剥離しないようにすることができる。
【００６５】
さらに、本発明は、第1の金型と、この第1の金型に対向して配置され、貫通孔を有する枠状金型とこの貫通孔に嵌合して昇降可能な圧縮金型からなる第２の金型と、前記第１または第２の金型を昇降させる昇降機構とから構成され、これら第１の金型と第２の金型の間に被成形品を配置し、前記第１の金型と枠状金型により被成型品の配線基板の周縁部をクランプし、前記昇降機構により前記圧縮金型が前記第１の金型側へ相対的に移動することで、加熱溶融した封止用樹脂を被成形品に圧縮成形により樹脂封止する半導体樹脂封止装置において、前記枠状金型の貫通孔に昇降自在に嵌合させて凸字状の圧縮金型を備え、この圧縮金型の下腕部と前記枠状金型との間に第１の弾性体を設け、前記枠状金型はこの第１の弾性体を介して前記圧縮金型の下腕部に支持されて圧縮金型に連動して１つの昇降機構により昇降するとともに、前記貫通孔の内側面には樹脂封止後に前記圧縮金型を成形品から分離するときにこの成形品の封止樹脂周縁部分全部もしくは一部を保持する保持部としての段部を設け、圧縮金型を成形品から分離するときに被成形品と圧縮成形した封止樹脂部が剥離しないようにするとともに、枠状金型と圧縮金型の相対移動を１つの昇降機構により昇降できるようにすることができる。
【００６６】
さらに、本発明は、前記第1の金型には、樹脂封止時に受ける反力より大きい力で圧縮可能な弾性力を有する第２の弾性体と、この第２の弾性体を介して第1の金型本体に昇降可能に保持された可動金属板を備え、成形品のエジェクトを的確に行うようにすることができる。
【００６７】
さらに、本発明は、第1の金型と、この第1の金型に対向して配置され、貫通孔を有する枠状金型とこの貫通孔に嵌合して昇降可能な圧縮金型からなる第２の金型と、前記第１または第２の金型を昇降させる昇降機構とから構成され、これら第１の金型と第２の金型の間に被成形品を配置し、前記第１の金型と枠状金型により被成型品の配線基板の周縁部をクランプし、前記昇降機構により前記圧縮金型が前記第１の金型側へ相対的に移動することで、加熱溶融した封止用樹脂を被成形品に圧縮成形により樹脂封止する半導体樹脂封止装置において、圧縮金型の外側面または枠状金型の内側面に切り込み部を設け、この切り込み部に前記貫通孔と前記切り込み部に昇降自在に嵌合して昇降する可動ブロックを備え、この可動ブロックが樹脂封止後に前記圧縮金型を成形品から分離するときにこの成形品の封止樹脂周縁部分全部もしくは一部を保持するようにし、圧縮金型を成形品から分離するときに被成形品と圧縮成形した封止樹脂部が剥離しないようにするとともに、供給する封止用樹脂量の計量精度を緩和するようにすることができる。
【００６８】
さらに、本発明は、第1の金型と、この第1の金型に対向して配置され、貫通孔を有する枠状金型とこの貫通孔に嵌合して昇降可能な圧縮金型からなる第２の金型と、前記第１または第２の金型を昇降させる昇降機構とから構成され、これら第１の金型と第２の金型の間に被成形品を配置し、前記第１の金型と枠状金型により被成型品の配線基板の周縁部をクランプし、前記昇降機構により前記圧縮金型が前記第１の金型側へ相対的に移動することで、加熱溶融した封止用樹脂を被成形品に圧縮成形により樹脂封止する半導体樹脂封止装置において、圧縮金型または枠状金型内に可動ブロック挿入孔を設け、この可動ブロック挿入孔に昇降自在に嵌合して昇降する可動ブロックを備え、この可動ブロックが、樹脂封止後に前記圧縮金型を成形品から分離するときにこの成形品の封止樹脂部の周縁部の一部を保持するようにし、圧縮金型を成形品から分離するときに被成形品と圧縮成形した封止樹脂部が剥離しないようにするとともに、供給する封止用樹脂量の計量精度を緩和し、また、可動ブロックを圧縮金型もしくは枠状金型内に入れることで圧縮金型と枠状金型が相対移動する時の影響を可動ブロックが受けないようにすることができる。
【００６９】
さらに、本発明は、前記可動ブロックは前記圧縮金型または前記枠状金型に設けられた切り込み部または可動ブロック挿入孔に樹脂封止圧力で圧縮可能な支持弾性体を介して圧縮金型または枠状金型に支持され、この圧縮金型または枠状金型に連動して昇降するようにし、可動ブロックを昇降するための昇降機構を省略して半導体樹脂封止装置の機構を簡略化することができる。
【図面の簡単な説明】
【図１】本発明半導体樹脂封止装置の第１の実施の形態の第１工程を示す説明図。
【図２】本発明半導体樹脂封止装置の第１の実施の形態の第２工程を示す説明図。
【図３】本発明半導体樹脂封止装置の第１の実施の形態の第３工程を示す説明図。
【図４】本発明半導体樹脂封止装置の第１の実施の形態の第４工程を示す説明図。
【図５】本発明半導体樹脂封止装置の第１の実施の形態の第５工程を示す説明図。
【図６】本発明半導体樹脂封止装置の第２の実施の形態の第１工程を示す説明図。
【図７】本発明半導体樹脂封止装置の第２の実施の形態の第２工程を示す説明図。
【図８】本発明半導体樹脂封止装置の第２の実施の形態の第３工程を示す説明図。
【図９】本発明半導体樹脂封止装置の第２の実施の形態の第４工程を示す説明図。
【図１０】本発明半導体樹脂封止装置の第３の実施の形態の第１工程を示す説明図。
【図１１】本発明半導体樹脂封止装置の第３の実施の形態の第２工程を示す説明図。
【図１２】本発明半導体樹脂封止装置の第３の実施の形態の第３工程を示す説明図。
【図１３】本発明半導体樹脂封止装置の第３の実施の形態の第４工程を示す説明図。
【図１４】本発明半導体樹脂封止装置の第３の実施の形態の第５工程を示す説明図。
【図１５】本発明半導体樹脂封止装置の第４の実施の形態を示す説明図。
【図１６】本発明半導体樹脂封止装置の第５の実施の形態の第１工程を示す説明図。
【図１７】本発明半導体樹脂封止装置の第５の実施の形態の第２工程を示す説明図。
【図１８】本発明半導体樹脂封止装置の第５の実施の形態の第２工程の変形例を示す説明図。
【図１９】本発明半導体樹脂封止装置の第５の実施の形態の第２工程の他の変形例を示す説明図。
【図２０】本発明半導体樹脂封止装置の第５の実施の形態の第３工程を示す説明図。
【図２１】本発明半導体樹脂封止装置の第５の実施の形態の第４工程を示す説明図。
【図２２】本発明半導体樹脂封止装置の第５の実施の形態の第５工程を示す説明図。
【図２３】本発明半導体樹脂封止装置の第６の実施の形態を示す説明図。
【図２４】従来の半導体樹脂封止装置の第１工程を示す説明図。
【図２５】従来の半導体樹脂封止装置の第２工程を示す説明図。
【図２６】従来の半導体樹脂封止装置の第３工程を示す説明図。
【図２７】従来の半導体樹脂封止装置の第４工程を示す説明図。
【図２８】従来の半導体樹脂封止装置の第５工程を示す説明図。
【図２９】一般的な成形品の平面図。
【符号の説明】
１０、３０、４０、５０、６０、７０、８０半導体樹脂封止装置
１１、５１、６１第1の金型
１２、３１、４１、７１、８１第２の金型
１３半導体チップ
１４配線基板
１５被成形品
１６、２０、４５昇降機構
１７封止用樹脂
１８成形品
１８ａ封止樹脂部
１９、３４，４３、７７、８７枠状金型
１９ａ、３２、７２、８２貫通孔
２１、３３、４２、７３、８３圧縮金型
３５段部
４４第１の弾性体
５２、６２第1の金型本体
５２ａホルダ部
５３、６４可動金型板
５４、６５第２の弾性体
６３ストッパピン
７４切り込み部
７５支持弾性体
７６、８６可動ブロック
８８可動ブロック挿入孔[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor resin sealing device that seals a wiring board (substrate, lead frame) or the like on which a semiconductor chip is mounted with resin.
[0002]
[Background Art and Problems to be Solved by the Invention]
In general, as shown in FIGS. 24 to 28, the semiconductor resin sealing device 10 includes two molds arranged to face each other, that is, a first mold 11 and a second mold 12 that can be raised and lowered. The molded product 15 is configured such that the semiconductor chip 13 mounted on the wiring board 14 is electrically connected between the two molds.
[0003]
The second mold 12 is composed of a frame-shaped mold 19 and a compression mold 21, and these and the first mold 11 and the like are provided with a heater (not shown), and are molded into a tablet shape with this heater. A sealing resin 17 such as a thermosetting epoxy resin is heated and melted. Further, an elevating mechanism 16 is provided at the lower part of the frame-shaped mold 19, and the frame-shaped mold 19 is moved up and down. A rectangular through hole 19a penetrating vertically is opened in the frame of the frame-shaped mold 19, and a compression mold 21 is fitted therein. A lowering mechanism 20 is provided below the compression mold 21 so that the compression mold 21 can be moved up and down. These elevating mechanisms 16 and 20 are driven and controlled by a controller (not shown).
[0004]
Next, the operation of the semiconductor resin sealing device 10 will be described. First, the first mold 11 and the second mold 12 are arranged to face each other as shown in FIG. The sealing resin 17 is placed on the upper surface of the compression mold 21, the molded product 15 is placed on the upper surface of the frame-shaped mold 19, and the sealing resin 17 is heated by a heater (not shown) to a molten state. To do.
[0005]
Thereafter, the frame-shaped mold 19 is lifted together with the compression mold 21 as shown in FIG. 25 by the elevating mechanisms 20, 16, and the molded product is formed between the upper surface of the frame-shaped mold 19 and the lower surface of the first mold 11. The peripheral portion of the 15 wiring boards 14 is clamped.
[0006]
After this clamping, the compression mold 21 is further raised by the lifting mechanism 20 as shown in FIG. 25 and the molten sealing resin 17 is crushed, whereby the wiring substrate 14, the frame-shaped mold 19, and the compression mold 21 are used. Resin sealing is performed by filling the melted sealing resin 17 in the cavity C to be formed, and the resin-sealed molded product 18 is completed.
[0007]
After the resin sealing, first, the compression mold 21 is lowered by the elevating mechanism 20 as shown in FIG. By this lowering, the upper surface of the compression mold 21 is separated from the sealing resin portion surface 18ba of the sealing resin portion 18a of the molded product 18.
[0008]
Next, the frame-shaped mold 19 and the compression mold 21 are lowered from the first mold 11 by the lifting mechanisms 16 and 20 as shown in FIG. 1 is separated from the lower surface of the mold 11. Thereafter, the compression mold 21 is raised again as shown in FIG. 28, the molded product 18 is ejected from the second mold 12, and the molded product is taken out. Thereafter, the resin-sealed molded product 18 is cut at a two-dot chain line portion as shown in FIG. 29 and separated into individual packages to obtain a final finished product.
[0009]
At the time of resin sealing, the molten sealing resin 17 is compressed by the compression mold 21 to be in close contact with the article 15 to be molded, but is also in close contact with the compression mold 21 at the same time. After sealing, the mold release load when separating the compression mold 21 from the molded product 18 is applied between the upper surface of the compression mold 21 and the sealing resin portion surface 18ba shown in FIG. It is also applied to the resin interface 18bb with the sealing resin portion 18a. Here, since the adhesion force at the resin interface 18bb is usually stronger than the adhesion force between the upper surface of the compression mold 21 and the sealing resin portion surface 18ba, the compression mold 21 and the sealing resin portion 18a are sealed resin. Although the mold is released at the part surface 18ba, the stress at this time is naturally applied to the semiconductor chip 13 and the wiring substrate 14, and in some cases, peeling occurs at the resin interface 18bb. In particular, if the wiring substrate 14 and the sealing resin portion 18a are peeled off at the periphery of the semiconductor chip 13 in the molded product 18, moisture may permeate from the peeling portion and cause product defects after being separated and cut as shown in FIG. is there.
[0010]
In the present invention, the resin between the molded product 15 and the sealing resin portion 18a is formed by preventing the release load between the upper surface of the compression mold 21 and the sealing resin portion 18a from being applied to the resin interface 18bb at the time of release. The object is to prevent peeling at the interface 18bb.
[0011]
[Means for Solving the Problems]
The invention according to claim 1 is a first mold, a frame-shaped mold that is disposed opposite to the first mold, has a through hole, and a compression mold that can be raised and lowered by fitting into the through hole. And a lifting mechanism for raising and lowering the first or second die, and placing a molded product between the first die and the second die, Clamping the peripheral edge of the wiring board of the molded product by the first mold and the frame-shaped mold, and by moving the compression mold relatively to the first mold side by the lifting mechanism, In a semiconductor resin sealing device that seals a heat-sealed sealing resin to a molded product by compression molding, when the second mold is separated from the molded product after resin sealing A holding portion that holds the peripheral portion of the sealing resin of the molded product, the holding portion of the peripheral portion of the sealing resin of the molded product, Resin interface between the molded product and the second mold The molded article and the compression-molded sealing resin portion are prevented from being peeled off when the compression mold is separated from the molded product.
[0012]
The invention according to claim 2 is characterized in that when the compression mold is separated from the molded product, a stepped portion as a holding portion that holds all or part of the peripheral portion of the sealing resin of the molded product is used as the frame-shaped mold or the compression mold. It is provided in the mold so that the molded article and the compression-molded sealing resin portion are not separated when the compression mold is separated from the molded product.
[0013]
The invention of claim 3 The compression mold has a convex shape fitted to the through hole of the frame-shaped mold so as to be movable up and down, A first elastic body is provided between the lower arm portion of the compression mold and the frame-shaped mold, and the frame-shaped mold is attached to the lower arm portion of the compression mold through the first elastic body. It is supported and moved up and down in conjunction with the compression mold, and when the compression mold is separated from the molded product after resin sealing on the inner surface of the through hole, all or one part of the sealing resin peripheral portion of the molded product A stepped portion is provided as a holding portion for holding the portion, and when the compression mold is separated from the molded product, the molded product and the compression-molded sealing resin portion are prevented from being separated, and the frame-shaped metal The relative movement between the mold and the compression mold can be moved up and down by one lifting mechanism.
[0014]
According to a fourth aspect of the present invention, the first mold includes a second elastic body having an elastic force that can be compressed with a force larger than a reaction force received during resin sealing, and the second elastic body. The first metal mold body is provided with a movable metal plate that can be moved up and down so that the molded product can be ejected accurately.
[0015]
The invention according to claim 5 is a first mold, a frame-shaped mold disposed opposite to the first mold and having a through hole, and a compression mold that can be raised and lowered by fitting into the through hole. And a lifting mechanism for raising and lowering the first or second die, and placing a molded product between the first die and the second die, Clamping the peripheral portion of the wiring board of the molded product by the first mold and the frame-shaped mold, and the compression mold is moved relatively to the first mold side by the lifting mechanism, In a semiconductor resin sealing device for sealing a heat-melted sealing resin to a molded product by compression molding, a notch is provided on the outer surface of the compression mold or the inner surface of the frame mold, and the notch A movable block that moves up and down by fitting to the through hole and the notch is freely movable. When the compression mold is separated from the molded product, all or part of the peripheral portion of the sealing resin of the molded product is retained, and when the compression mold is separated from the molded product, the molded product is compression molded. The sealing resin portion is prevented from peeling off, and the measurement accuracy of the amount of sealing resin to be supplied is relaxed.
[0016]
The invention according to claim 6 is a first mold, a frame-shaped mold that is disposed opposite to the first mold and has a through hole, and a compression mold that can be moved up and down by fitting into the through hole. And a lifting mechanism for raising and lowering the first or second die, and placing a molded product between the first die and the second die, Clamping the peripheral portion of the wiring board of the molded product by the first mold and the frame-shaped mold, and the compression mold is moved relatively to the first mold side by the lifting mechanism, In a semiconductor resin sealing device that seals heat-melted sealing resin to a molded product by compression molding, a movable block insertion hole is provided in the compression mold or frame mold, and the movable block insertion hole is moved up and down. It is equipped with a movable block that can be freely fitted and moved up and down, and this movable block forms the compression mold after resin sealing. When separating from the molded product, a part of the peripheral portion of the sealing resin portion of the molded product is retained, and when the compression mold is separated from the molded product, the molded product and the molded sealing resin portion are not separated. In addition, the measurement accuracy of the amount of sealing resin to be supplied is relaxed, and when the movable block is placed in the compression mold or the frame-shaped mold, the compression mold and the frame-shaped mold are moved relative to each other. The movable block is not affected.
[0017]
According to a seventh aspect of the present invention, the movable block is a compression mold through a support elastic body that can be compressed by a resin sealing pressure in a cut portion or a movable block insertion hole provided in the compression mold or the frame-shaped mold. Or it is supported by a frame-shaped mold and can be moved up and down in conjunction with this compression mold or frame-shaped mold, and the mechanism of the semiconductor resin sealing device is simplified by omitting the lifting mechanism for moving up and down the movable block It is a thing.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, various preferred embodiments of the present invention will be described with reference to the accompanying drawings.
[0019]
(First embodiment)
A first embodiment of the present invention will be described with reference to FIGS. The same parts as those of the conventional semiconductor resin sealing device 10 will be described with the same reference numerals.
[0020]
The semiconductor resin sealing device 30 of this embodiment is composed of two molds arranged opposite to each other, that is, a first mold 11 and a second mold 31 that can be raised and lowered. A molded product 15 is arranged between the molds.
[0021]
The second mold 31 is composed of a frame-shaped mold 34 and a compression mold 33, and these and the first mold 11 and the like are provided with a heater (not shown). It is designed to melt by heating. The frame mold 34 and the compression mold 33 are moved up and down by a lifting mechanism (not shown). Further, a rectangular through hole 32 penetrating vertically is opened in the frame of the frame-shaped mold 34, and a compression mold 33 is fitted therein.
[0022]
On the inner side surface of the upper part of the frame-shaped mold 34, a step portion 35 whose outer peripheral portion corresponds to the outer peripheral portion (L01 × L02) of the cavity C (see FIG. 29) is provided. The bottom surface 35a of the step portion 35 is a holding portion that holds a molded product when the upper surface of the compression mold 33 is separated from the surface of the sealing resin portion 18a. Next, a resin sealing method using the semiconductor resin sealing device 30 will be described. First, the first mold 11 and the second mold 31 are arranged to face each other as shown in FIG. The sealing resin 17 is placed on the upper surface of the compression mold 33, the molded product 15 is placed on the upper surface of the frame-shaped mold 34, and the sealing resin 17 is heated by a heater (not shown) to a molten state. To do.
[0023]
Thereafter, the frame-shaped mold 34 is raised together with the compression mold 33 as shown in FIG. 2 by a lifting mechanism (not shown), and the molded product 15 is formed between the upper surface of the frame-shaped mold 34 and the lower surface of the first mold 11. The peripheral edge of the wiring board 14 is clamped.
[0024]
After this clamping, the compression mold 33 is further raised as shown in FIG. 2 by an elevating mechanism, and the sealing resin 17 melted by the compression mold 33 is crushed, whereby the wiring substrate 14 and the frame-shaped mold 34 are By filling the melted sealing resin 17 into the cavity C formed by the compression mold 33, the resin-sealed molded product 18 is completed.
[0025]
After the resin sealing, first, the compression mold 33 is lowered by the lifting mechanism as shown in FIG. By this lowering, the upper surface of the compression mold 33 is separated from the sealing resin portion surface 18ba of the molded product 18 and released.
[0026]
Next, the frame-shaped mold 34 and the compression mold 33 are lowered from the first mold 11 by the lifting mechanism as shown in FIG. Separate from the lower surface of the mold 11. Thereafter, the compression mold 33 is raised again as shown in FIG. 5, and the molded product 18 is ejected from the second mold 31 to take out the molded product.
[0027]
At the time of mold release, due to the adhesion between the compression mold 33 and the sealing resin portion surface 18ba of the sealing resin portion 18a shown in FIG. 2, the resin interface 18bb between the molded product 15 and the sealing resin portion 18a is also released. Although a load is applied, the bottom surface 35a of the step portion 35 provided in the through hole 32 of the frame-shaped mold 34 serves as a holding portion to hold the peripheral edge portion of the sealing resin portion 18a from below, so that the release load is reduced. .
[0028]
In this way, by releasing the mold 18 while holding the molded product 18, it is possible to minimize the release load between the upper surface of the compression mold 33 and the lower surface of the sealing resin portion 18 a on the wiring substrate 14 and the semiconductor chip 13. Therefore, it is possible to prevent peeling between the sealing resin portion 18a and the wiring board 14 at the resin interface 18bb at the time of release, and a high-quality molded product can be supplied.
[0029]
(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIGS. Here, the same parts as those of the semiconductor resin sealing device 30 of the first embodiment will be described with the same reference numerals.
[0030]
In the semiconductor resin sealing device 40 of this embodiment, the first mold 11 and the second mold 41 are arranged to face each other, and the second mold 41 includes a frame-shaped mold 43 and a compression mold 42. It is composed of Inside the frame-shaped mold 43, the compression mold 42, the first mold 11 and the like, a heater (not shown) for heating and melting the sealing resin 17 is provided. The compression mold 42 is moved up and down by a lifting mechanism 45.
[0031]
The frame-shaped mold 43 has a rectangular through-hole 32 penetrating vertically in the frame, and is fitted into the outer side of the compression mold 42 by the through-hole 32. The compression die 42 has a convex shape in the vertical cross section, and the lower part is a protrusion-like or hook-like lower arm portion 42a. Between the lower arm portion 42 a and the frame-shaped mold 43, a first elastic body 44 that generates a reaction force in the direction of raising the frame-shaped mold 43 is provided. The frame-shaped mold 43 is supported upward by the lower arm portion 42 a of the compression mold 42 via the first elastic body 44. Therefore, the frame-shaped mold 43 is moved up and down in conjunction with the compression mold 42 by the lifting mechanism 45.
[0032]
On the inner side surface of the upper part of the frame-shaped mold 43, a step portion 35 is provided whose outer peripheral dimension corresponds to the outer peripheral dimension (L01 × L02) of the cavity C. The bottom surface 35a of the step portion 35 is a holding portion that holds a molded product when the upper surface of the compression mold 42 is separated from the surface of the sealing resin portion 18a.
Next, a resin sealing method using the semiconductor resin sealing device 40 will be described. First, the sealing resin 17 and the molded product 15 are placed on the compression mold 42 and the frame-shaped mold 43 as shown in FIG. 6, and the sealing resin 17 is heated and melted by a heater (not shown).
[0033]
Next, as shown in FIG. 7, the compression mold 42 is raised by the elevating mechanism 45. As a result of this rise, the frame-shaped mold 43 is pushed up by the lower arm portion 42a of the compression mold 42 via the first elastic body 44, and the upper surface of the wiring substrate 14 of the molded product 15 is the first mold. 11 is in contact with the lower surface. After the contact, when the compression mold 42 is raised by the elevating mechanism 45 as shown in FIG. 8 against the elastic force of the first elastic body 44, the first elastic body 44 is compressed to the wiring board 14. A predetermined clamping force is applied. At the same time, the sealing resin 17 melted in the compression mold 42 is crushed and uniformly compressed and molded on the surface of the molded product 15, and the molded resin 18 is sealed with the sealing resin 17 on the molded product 15. Complete.
[0034]
After the resin sealing, the compression mold 42 is lowered as shown in FIG. 9 by the lifting mechanism 45 so that the upper surface of the compression mold 42 is separated from the lower surface of the sealing resin portion 18a of the molded product 18 and released. At this time, the first elastic body 44 holds the molded product 18 between the first mold 11 and the bottom surface 35 a of the step portion 35 of the frame-shaped mold 43 with an elastic force greater than the release load. .
[0035]
Thereafter, the compression mold 42 is further lowered by the lifting mechanism 45 to separate the molded product 18 and the frame-shaped mold 43 from the first mold 11. When the separation is completed, for example, the molded product 18 is adsorbed by a vacuum adsorbing device (not shown) and carried out of the semiconductor resin sealing device 40 from the second mold 41.
[0036]
In this way, when the upper surface of the compression mold 42 is released from the sealing resin portion surface 18ba, the bottom surface 35a of the stepped portion 35 becomes a holding portion as in the first embodiment, and the sealing resin portion 18a. Since the release load is eased to hold the peripheral edge of the resin, peeling at the resin interface 18bb can be prevented, and a high-quality molded product can be supplied. Furthermore, since the raising / lowering of the compression mold 42 and the frame-shaped mold 43 at the time of this compression molding can be operated by one raising / lowering mechanism 45 via the first elastic body 44, the raising / lowering mechanism can be simplified.
[0037]
(Third embodiment)
Next, a third embodiment of the present invention will be described with reference to FIGS. The semiconductor resin sealing device 50 according to the third embodiment is improved by providing a movable mold plate 53 on the first mold of the semiconductor resin sealing device 40 according to the second embodiment, and ejecting the molded product. I tried to make sure.
[0038]
The first mold 51 of the semiconductor resin sealing device 50 includes a first mold body 52 having a holder portion 52a, a movable mold plate 53 attached to the holder portion 52a so as to be movable up and down, and the first mold body 51 between them. And a second elastic body 54 pressing the movable mold plate 53 downward. The second elastic body 54 is set with an initial pressure stronger than the reaction force from the lower mold during resin sealing.
[0039]
Next, a resin sealing method using the semiconductor resin sealing device 50 will be described. A series of operations in FIG. 10 to FIG. 13 is the same as that in the second embodiment, and is omitted here. In FIG. 13, after separating the upper surface of the compression mold 42 and the lower surface of the sealing resin portion 18 a of the molded product 18, the compression mold 42 is raised again until it comes into contact with the lower surface of the sealing resin portion 18 a by the lifting mechanism 45. . When the compression mold 42 is further raised, the push-up force of the elevating mechanism 45 is transmitted to the movable mold plate 53 via the molded product 18, and the frame shape of the second mold 41 while bending the second elastic body 54. The upper surface of the mold 43 and the lower surface of the holder portion 52a of the first mold body 52 abut. From here, the compression mold 42 is raised to the position shown in FIG. 14, and the side surface of the sealing resin portion 18 a and the inner surface of the frame-shaped mold 43 are released. In this series of operations, the molded product 18 is completely released from the cavity surface.
Thereafter, the compression mold 42, the frame-shaped mold 43, and the molded product 18 are lowered by the lifting mechanism 45, and the molded product 18 is taken out by a vacuum suction device (not shown).
[0040]
According to the third embodiment, the separation at the resin interface 18bb that occurs when the compression mold 42 is released from the lower surface of the sealing resin portion 18a is prevented in the same manner as in the first embodiment. In addition, since the compression mold 42 and the frame-shaped mold 43 can be moved up and down by the single lifting mechanism 45 via the first elastic body 44, the lifting mechanism can be simplified. it can. Further, since the side surface of the molded product 18 is released from the inner side surface of the frame-shaped mold 43, there is almost no release load when the molded product 18 is taken out by a vacuum suction device (not shown), and the vacuum suction device is simplified. In addition, it is possible to prevent damage to the molded product 18 at the time of taking out.
[0041]
Further, in the series of operations, the same effect can be obtained by performing the operation of FIG. 14 first and then separating the upper surface of the compression mold 42 and the lower surface of the sealing resin portion 18a as shown in FIG.
[0042]
(Fourth embodiment)
Next, a fourth embodiment of the present invention will be described with reference to FIG. This is a modification of the third embodiment, and is the same as the third embodiment except for the configuration of the first mold 61 shown below. The first mold 61 of the semiconductor resin sealing device 60 of this embodiment is inserted into the first mold body 62, a stopper pin 63 extending downward from the first mold body 62, and the stopper pin 63. The movable mold plate 64 is held so as to be movable up and down, and the second elastic body 65 is interposed between them and presses the movable mold plate 64 downward. The second elastic body 65 is set with an initial pressure stronger than the reaction force from the lower mold during resin sealing. Here, the difference from the third embodiment is that instead of the holder portion 52a of the first mold body 52, the flange portion 63a provided on the stopper pin 63 causes the movable mold plate 64 to move downward. The lower side of the stopper pin 63 raises the frame-shaped mold 43 when the side surface of the molded product 18 and the inner surface of the frame-shaped mold 43 of the second mold 41 are released. It is a point that is suppressed. Therefore, the operation and effect are substantially the same as those of the third embodiment, but the first mold can be configured more simply in the present invention.
[0043]
(Fifth embodiment)
Next, a fifth embodiment of the present invention will be described with reference to FIGS. The same parts as those of the conventional semiconductor resin sealing device 10 will be described with the same reference numerals. The second mold 71 of the semiconductor resin sealing device 70 of this embodiment is composed of a compression mold 73, a frame-shaped mold 77, and a movable block 76. The compression mold 73 and the frame-shaped mold 77 are illustrated. It is raised and lowered by a lifting mechanism that does not. Further, a rectangular through-hole 72 penetrating vertically is opened in the frame of the frame-shaped mold 77, and a compression mold 73 is fitted therein.
[0044]
A cut portion 74 is provided on the outer periphery of the upper portion of the compression mold 73, the upper cut portion 74a on the upper portion thereof is cut shallower, and the lower cut portion 74b on the lower portion is cut deeper than the upper cut portion 74a. Between the compression mold 73 and the frame-shaped mold 77, a movable block 76 is disposed so as to be movable up and down by fitting into the upper cut portion 74a and the through-hole 72 of the frame-shaped mold 77. The movable block 76 is supported on the upper surface of the lower arm portion 73a of the compression mold 73 via a support elastic body 75 such as a spring provided in the cut portion 74, and interlocks with the elevation of the compression mold 73. Can be moved up and down. At this time, the elastic force of the supporting elastic body 75 is set in the vicinity of a predetermined sealing pressure. Although not shown, a heater is provided inside the compression mold 73, the frame-shaped mold 77, and the first mold 11, and the sealing resin 17 is heated and melted.
[0045]
Next, a resin sealing method using the semiconductor resin sealing device 70 will be described. First, as shown in FIG. 16, the sealing resin 17 is placed on the upper surface of the compression mold 73, and the molded product 15 is placed on the upper surface of the frame-shaped mold 77, and sealed by a heater (not shown). The resin 17 is heated and melted. Thereafter, the frame-shaped mold 77 is raised together with the compression mold 73 by a lifting mechanism (not shown) as shown in FIG. 17, and the molded product 15 is formed by the upper surface of the frame-shaped mold 77 and the lower surface of the first mold 11. The peripheral edge of the wiring board 14 is clamped.
[0046]
After this clamping, the compression mold 73 is raised to a predetermined position by the lifting mechanism, and the cavity C is filled with the molten sealing resin 17 so that the resin sealing is performed. Is completed.
[0047]
At this time, the movable block 76 is pushed up and raised by the lower arm portion 73a via the support elastic body 75, but the support elastic body is within the range of FIGS. 75 stops at a position where a predetermined resin sealing pressure can be applied. For example, when the resin sealing pressure equal to or higher than the set pressure of the support elastic body 75 is applied to the movable block 76, the movable block 76 is relative to the compression mold 73 while bending the support elastic body 75 as shown in FIG. Accordingly, the inside of the cavity is maintained at a predetermined sealing pressure. That is, when the amount of the sealing resin 17 is larger than a predetermined amount, the concave portion 78 formed by the upper inner surface of the frame-shaped mold 77, the upper outer peripheral surface of the compression mold 73, and the upper surface 76a of the movable block 76 is a cavity. In this case, the resin sealing is completed by absorbing the excessive resin in which the concave portions 78 are excessive.
[0048]
If the amount of resin 17 is less than a predetermined amount, the upper portion 76b of the movable block 76 protrudes above the upper surface of the compression mold 73 as shown in FIG. Resin sealing is completed in the reduced state.
[0049]
After the resin sealing is completed in the state of FIGS. 17 to 19, the compression mold 73 is illustrated while the molded product 18 is brought into contact with the first mold 11 through the movable block 76 by the reaction force of the support elastic body 75. As shown in FIG. 20, it is lowered by an elevating mechanism, and the upper surface of the compression mold 73 is separated from the lower surface of the sealing resin portion 18a and released.
[0050]
At the time of this release, due to the adhesion between the upper surface of the compression mold 73 and the lower surface of the sealing resin portion 18a, a release load is also applied to the resin interface 18bb between the molded product 15 and the sealing resin portion 18a. Since the upper surface 76a of the movable block 76 serves as a holding portion and holds the peripheral portion of the sealing resin portion 18a, the release load applied to the resin interface 18bb is reduced. In particular, the peeling load can be minimized at the peripheral edge of the sealing resin portion 18a.
[0051]
Thereafter, as shown in FIG. 21, the frame-shaped mold 77, the compression mold 73, the movable block 76, and the molded product 18 are lowered from the first mold 11 by the lifting device. Thereafter, as shown in FIG. 22, the compression mold 73 is raised again, and the molded product 18 is ejected from the second mold 71.
[0052]
In the present embodiment, it is possible to minimize the release load between the upper surface of the compression mold 73 and the lower surface of the sealing resin portion 18a from being applied to the wiring substrate 14 and the semiconductor chip 13, so that at the time of mold release Peeling at the resin interface 18bb can be prevented, and a high-quality molded product can be supplied.
[0053]
Further, even when the amount of sealing resin to be supplied is increased or decreased from a predetermined amount, molding is performed while maintaining a predetermined sealing pressure within the movable range of the movable block 76 (position as shown in FIGS. 17 to 19). Is possible. In other words, the amount of resin to be supplied may vary in the volume of the body that can be covered by the movable range of the movable block 76, and the measurement accuracy of the amount of sealing resin to be supplied can be relaxed.
[0054]
Further, since the movable block 76 moves up and down together with the compression mold 73 via the support elastic body 75, a special lifting mechanism is not required, and the apparatus can be simplified.
[0055]
The movable block 76 may be an annular one or a plurality of vertically divided blocks. In the present embodiment, the movable block 76 is supported and moved by the lower arm portion 73a of the compression mold 73 via the support elastic body 75. However, the movable block 76 is an independent lifting mechanism different from the compression mold. It may be attached and moved.
[0056]
The movable block 76 and the support elastic body 75 are lifted and lowered in the notch 74 on the compression mold 73 side, but the same cut is provided in the frame-shaped mold so that the movable block 76 and the support elastic body 75 are lifted and lowered in conjunction with the frame-shaped mold. However, the same effect can be obtained.
[0057]
(Sixth embodiment)
Next, a sixth embodiment of the present invention will be described with reference to FIG. This is the same as the fifth embodiment except for the configuration of the second mold 81 described below. The second mold 81 of the semiconductor resin sealing device 80 of this embodiment is composed of a compression mold 83, a frame-shaped mold 87, and a movable block 86. The compression mold 83 and the frame-shaped mold 87 are It is moved up and down by a lifting mechanism (not shown). Further, a through-hole 82 penetrating vertically is opened in the frame of the frame-shaped mold 87, and a compression mold 83 is fitted therein. On the inner side surface of the upper part of the frame-shaped mold 87, a step portion 85 is provided whose outer peripheral dimension corresponds to the outer peripheral dimension of the cavity C. One or a plurality of movable block insertion holes 88 penetrating vertically are formed in the bottom surface of the stepped portion 85. A screw groove is cut in the lower portion of the movable block insertion hole 88, and the lid portion 87a is screwed from below.
[0058]
A pin-shaped movable block 86 is disposed so as to be movable up and down by fitting into the movable block insertion hole 88. The movable block 86 is supported on the upper surface of the lid portion 87a of the frame-shaped mold 87 via the support elastic body 75, and can move up and down in conjunction with the elevation of the frame-shaped mold 87. At this time, the elastic force of the supporting elastic body 75 is set in the vicinity of a predetermined sealing pressure.
[0059]
Here, the difference from the fifth embodiment is that a movable block insertion hole 88 is provided in the frame-shaped mold 87, and the movable block 86 is fitted into the movable block insertion hole 88 to move up and down. Is a point. Therefore, the operation and effect are substantially the same as in the fifth embodiment. For example, FIG. 23 shows a state where the resin is sealed when the amount of the sealing resin is larger than a predetermined amount, but the concave portion 89 on the upper part of the movable block insertion hole 88 absorbs the volume of the excess resin. It has become. When the compression mold 83 is separated from the sealing resin portion 18a, the upper surface 86a of the movable block 86 and the bottom surface of the step portion 85 serve as holding portions for the sealing resin portion 18a.
[0060]
In this embodiment, the movable block insertion hole 88 is provided in the frame-shaped mold. However, the movable block insertion hole may be provided in the compression mold, and the movable block and the supporting elastic body may be disposed in this.
[0061]
In each of the above embodiments, the second mold is movable and the first mold is fixed. However, the first mold may be the movable side and the second mold may be the fixed side. The mold may be on the bottom, the second mold on the top, the product to be molded may be placed on the first mold, and the sealing resin may be placed thereon. Further, although the molded product is sealed with resin on one surface, it can be carried out in substantially the same manner even if this is sealed on both upper and lower surfaces. Further, although the through hole of the mold is rectangular, it can be similarly implemented even if it is round, oval or the like.
[0062]
Furthermore, the first and second elastic bodies and the support elastic body are elastic members using a pneumatic device, a hydraulic device, a small electric motor or the like in accordance with the molded article 15 in addition to an elastic material such as a spring or rubber. Even if it changes suitably, it can implement substantially similarly. In addition, the molded product may be one that seals a plurality of semiconductor chips together, or may be sealed in small units such as one, two, or three. The bottom surface of the stepped portion forming the holding portion and the upper surface of the movable block may be horizontal surfaces, or may be flat surfaces or curved surfaces that are angled with respect to the horizontal.
[0063]
【The invention's effect】
The present invention comprises a first mold, a frame-shaped mold disposed opposite to the first mold and having a through hole, and a compression mold that can be raised and lowered by fitting into the through hole. 2 molds and an elevating mechanism for raising and lowering the first or second mold, and a molded product is disposed between the first mold and the second mold, and the first The peripheral part of the wiring substrate of the molded product is clamped by the mold and the frame-shaped mold, and the compression mold is moved relatively to the first mold side by the lifting mechanism, so that it is heated and melted. In a semiconductor resin sealing apparatus that seals a sealing resin to a molded product by compression molding, the second mold is formed when the compression mold is separated from the molded product after resin sealing. A holding part that holds all or part of the peripheral part of the sealing resin of the product is provided, and when the compression mold is separated from the molded product, Can sealing resin portion was reduced molding to prevent delamination.
[0064]
Further, the present invention provides a stepped portion as a holding portion for holding all or part of the sealing resin peripheral portion of the molded product when the compressed mold is separated from the molded product. When the compression mold is provided from the mold and separated from the molded product, the molded product and the compression-molded sealing resin portion can be prevented from peeling off.
[0065]
Furthermore, the present invention includes a first mold, a frame-shaped mold disposed opposite to the first mold and having a through hole, and a compression mold that can be raised and lowered by fitting into the through hole. A second mold, and a lifting mechanism for raising and lowering the first or second mold, and placing a product to be molded between the first mold and the second mold, Clamping the peripheral portion of the wiring board of the molded product with the first mold and the frame-shaped mold, and the compression mold is relatively moved toward the first mold by the lifting mechanism, thereby heating In a semiconductor resin sealing device for sealing a molten sealing resin to a molded product by compression molding, a convex-shaped compression mold is provided by being fitted to the through hole of the frame-shaped mold so as to be movable up and down. A first elastic body is provided between the lower arm portion of the compression mold and the frame-shaped mold, and the frame-shaped mold is compressed through the first elastic body. This is supported by the lower arm of the mold and is moved up and down by one lifting mechanism in conjunction with the compression mold, and when the compression mold is separated from the molded product after resin sealing on the inner surface of the through-hole, Provide a step as a holding part to hold all or part of the sealing resin peripheral part of the molded product, so that the molded product and the compression molded sealing resin part do not peel when separating the compression mold from the molded product In addition, the relative movement of the frame-shaped mold and the compression mold can be raised and lowered by one lifting mechanism.
[0066]
Further, according to the present invention, the first mold includes a second elastic body having an elastic force compressible with a force larger than a reaction force received at the time of resin sealing, and a second elastic body via the second elastic body. A movable metal plate that can be moved up and down is provided on one mold body, and the molded product can be ejected accurately.
[0067]
Furthermore, the present invention includes a first mold, a frame-shaped mold disposed opposite to the first mold and having a through hole, and a compression mold that can be raised and lowered by fitting into the through hole. A second mold, and a lifting mechanism for raising and lowering the first or second mold, and placing a product to be molded between the first mold and the second mold, Clamping the peripheral portion of the wiring board of the molded product with the first mold and the frame-shaped mold, and the compression mold is relatively moved toward the first mold by the lifting mechanism, thereby heating In a semiconductor resin sealing device for sealing a molten sealing resin to a molded product by compression molding, a cut portion is provided on an outer surface of a compression mold or an inner surface of a frame-shaped mold, and the cut portion is provided with the above-described cut portion. It has a movable block that can be moved up and down by fitting it through the through hole and the notch, and this movable block is resin-sealed. When the compression mold is separated from the molded product, all or part of the peripheral portion of the sealing resin of the molded product is retained, and when the compression mold is separated from the molded product, the molded product is compression molded. While preventing the sealing resin part from peeling off, the measurement accuracy of the amount of sealing resin to be supplied can be relaxed.
[0068]
Furthermore, the present invention includes a first mold, a frame-shaped mold disposed opposite to the first mold and having a through hole, and a compression mold that can be raised and lowered by fitting into the through hole. A second mold, and a lifting mechanism for raising and lowering the first or second mold, and placing a product to be molded between the first mold and the second mold, Clamping the peripheral portion of the wiring board of the molded product with the first mold and the frame-shaped mold, and the compression mold is relatively moved toward the first mold by the lifting mechanism, thereby heating In a semiconductor resin sealing device that seals molten sealing resin to a molded product by compression molding, a movable block insertion hole is provided in the compression mold or frame mold, and the movable block insertion hole can be raised and lowered freely. And a movable block that moves up and down by fitting into the mold. When separating from the molded product, a part of the peripheral portion of the sealing resin portion of the molded product is held, and when the compression mold is separated from the molded product, the molded product and the compression molded sealing resin portion do not peel off. In addition, the measurement accuracy of the amount of sealing resin to be supplied is eased, and when the compression mold and the frame mold move relative to each other by placing the movable block in the compression mold or the frame mold It is possible to prevent the movable block from being affected.
[0069]
Further, according to the present invention, the movable block may be a compression mold or a cut-out part provided in the compression mold or the frame-shaped mold or a movable block insertion hole through a support elastic body that can be compressed with a resin sealing pressure. The mechanism of the semiconductor resin sealing device is simplified by being supported by the frame-shaped mold and moving up and down in conjunction with the compression mold or the frame-shaped mold, and omitting the lifting mechanism for moving up and down the movable block. be able to.
[Brief description of the drawings]
FIG. 1 is an explanatory view showing a first step of a first embodiment of a semiconductor resin sealing device of the present invention.
FIG. 2 is an explanatory view showing a second step of the first embodiment of the semiconductor resin sealing device of the present invention.
FIG. 3 is an explanatory view showing a third step of the first embodiment of the semiconductor resin sealing device of the present invention.
FIG. 4 is an explanatory view showing a fourth step of the first embodiment of the semiconductor resin sealing device of the present invention.
FIG. 5 is an explanatory view showing a fifth step of the first embodiment of the semiconductor resin sealing device of the present invention.
FIG. 6 is an explanatory view showing a first step of the second embodiment of the semiconductor resin sealing device of the present invention.
FIG. 7 is an explanatory view showing a second step of the second embodiment of the semiconductor resin sealing device of the present invention.
FIG. 8 is an explanatory view showing a third step of the second embodiment of the semiconductor resin sealing device of the present invention.
FIG. 9 is an explanatory view showing a fourth step of the second embodiment of the semiconductor resin sealing device of the present invention.
FIG. 10 is an explanatory view showing a first step of the third embodiment of the semiconductor resin sealing device of the present invention.
FIG. 11 is an explanatory view showing a second step of the third embodiment of the semiconductor resin sealing device of the present invention.
FIG. 12 is an explanatory view showing a third step of the third embodiment of the semiconductor resin sealing device of the present invention.
FIG. 13 is an explanatory view showing a fourth step of the third embodiment of the semiconductor resin sealing device of the present invention.
FIG. 14 is an explanatory view showing a fifth step of the third embodiment of the semiconductor resin sealing device of the present invention.
FIG. 15 is an explanatory view showing a fourth embodiment of the semiconductor resin sealing device of the present invention.
FIG. 16 is an explanatory view showing a first step of the fifth embodiment of the semiconductor resin sealing device of the present invention.
FIG. 17 is an explanatory view showing a second step of the fifth embodiment of the semiconductor resin sealing device of the present invention.
FIG. 18 is an explanatory view showing a modification of the second step of the fifth embodiment of the semiconductor resin sealing device of the present invention.
FIG. 19 is an explanatory view showing another modification of the second step of the fifth embodiment of the semiconductor resin sealing device of the present invention.
FIG. 20 is an explanatory view showing a third step of the fifth embodiment of the semiconductor resin sealing device of the present invention.
FIG. 21 is an explanatory view showing a fourth step of the fifth embodiment of the semiconductor resin sealing device of the present invention.
FIG. 22 is an explanatory view showing a fifth step of the fifth embodiment of the semiconductor resin sealing device of the present invention.
FIG. 23 is an explanatory view showing a sixth embodiment of the semiconductor resin sealing device of the present invention.
FIG. 24 is an explanatory view showing a first step of a conventional semiconductor resin sealing device.
FIG. 25 is an explanatory view showing a second step of a conventional semiconductor resin sealing device.
FIG. 26 is an explanatory view showing a third step of a conventional semiconductor resin sealing device.
FIG. 27 is an explanatory view showing a fourth step of a conventional semiconductor resin sealing device.
FIG. 28 is an explanatory view showing a fifth step of a conventional semiconductor resin sealing device.
FIG. 29 is a plan view of a general molded product.
[Explanation of symbols]
10, 30, 40, 50, 60, 70, 80 Semiconductor resin sealing device
11, 51, 61 First mold
12, 31, 41, 71, 81 Second mold
13 Semiconductor chip
14 Wiring board
15 Molded product
16, 20, 45 Lifting mechanism
17 Sealing resin
18 Molded products
18a Sealing resin part
19, 34, 43, 77, 87 Frame mold
19a, 32, 72, 82 Through hole
21, 33, 42, 73, 83 Compression mold
35 steps
44 First elastic body
52, 62 First mold body
52a Holder part
53, 64 Movable mold plate
54, 65 second elastic body
63 Stopper pin
74 Notch
75 Supporting elastic body
76, 86 Movable block
88 Movable block insertion hole

Claims

A second mold comprising a first mold, a frame-shaped mold disposed opposite to the first mold and having a through hole, and a compression mold that can be raised and lowered by fitting into the through hole And an elevating mechanism for elevating and lowering the first or second mold, a product to be molded is disposed between the first mold and the second mold, and the first mold Sealing resin which is heated and melted by clamping the peripheral edge portion of the wiring substrate of the molded product with a frame-shaped mold and moving the compression mold relatively to the first mold side by the lifting mechanism. In a semiconductor resin sealing device that seals a molded product with resin by compression molding,
The second mold includes a holding portion that holds a peripheral portion of the sealing resin when the compression mold is separated from the molded product after resin sealing,
The holding part holds and abuts on a resin interface between the molded product and the second mold among the sealing resin peripheral portion of the molded product .

When the compression mold is separated from the molded product, a step portion as a holding unit that holds all or part of the peripheral portion of the sealing resin of the molded product is provided in the frame-shaped mold or the compression mold. The semiconductor resin sealing device according to claim 1, wherein:

The compression mold has a convex shape fitted to the through hole of the frame-shaped mold so as to be movable up and down,
A first elastic body is provided between the lower arm portion of the compression mold and the frame mold,
The frame-shaped mold is supported by the lower arm portion of the compression mold via the first elastic body, and moves up and down in conjunction with the compression mold, and the inner surface of the through hole is sealed with resin. 2. A semiconductor resin seal according to claim 1, further comprising a step portion as a holding portion for holding all or part of a peripheral portion of the sealing resin of the molded product when the compression mold is separated from the molded product. Stop device.

The first mold includes a second elastic body having an elastic force that can be compressed with a force larger than a reaction force received during resin sealing, and the first mold body via the second elastic body. 4. The semiconductor resin sealing device according to claim 1, further comprising a movable metal plate held so as to be movable up and down.

A second mold comprising a first mold, a frame-shaped mold disposed opposite to the first mold and having a through hole, and a compression mold that can be raised and lowered by fitting into the through hole And an elevating mechanism for elevating and lowering the first or second mold, a product to be molded is disposed between the first mold and the second mold, and the first mold Sealing resin which is heated and melted by clamping the peripheral edge portion of the wiring substrate of the molded product with a frame-shaped mold and moving the compression mold relatively to the first mold side by the lifting mechanism. In a semiconductor resin sealing device that seals a molded product with resin by compression molding,
A notch is provided on the outer surface of the compression mold or the inner surface of the frame mold,
It is equipped with a movable block that can be moved up and down by fitting to this notch,
A semiconductor resin sealing device, wherein the movable block is a holding portion that holds all or part of the peripheral portion of the sealing resin of the molded product when the compression mold is separated from the molded product after resin sealing. .

A second mold comprising a first mold, a frame-shaped mold disposed opposite to the first mold and having a through hole, and a compression mold that can be raised and lowered by fitting into the through hole And an elevating mechanism for elevating and lowering the first or second mold, a product to be molded is disposed between the first mold and the second mold, and the first mold Sealing resin which is heated and melted by clamping the peripheral edge portion of the wiring substrate of the molded product with a frame-shaped mold and moving the compression mold relatively to the first mold side by the lifting mechanism. In a semiconductor resin sealing device that seals a molded product with resin by compression molding,
A movable block insertion hole is provided in the compression mold or frame mold,
It is equipped with a movable block that can be moved up and down by fitting in this movable block insertion hole,
The semiconductor resin sealing, wherein the movable block is a holding portion that holds a part of the peripheral portion of the sealing resin portion of the molded product when the compression mold is separated from the molded product after the resin sealing. apparatus.

The movable block is supported by the compression mold or the frame-shaped mold through a support elastic body that can be compressed by a resin sealing pressure in a cut portion or a movable block insertion hole provided in the compression mold or the frame-shaped mold 7. The semiconductor resin sealing device according to claim 5, wherein the semiconductor resin sealing device is moved up and down in conjunction with the compression mold or the frame mold.