JP6028465B2 - Resin molding method and resin molding apparatus - Google Patents

Description

The present invention relates to a resin molding method及beauty resins molding apparatus for resin molding by clamping the workpiece.

  For example, in a mold used for a compression molding apparatus or transfer compression mold (hereinafter referred to as “TCM”) apparatus, a part of a cavity recess is formed so as to push a sealing resin when clamping a workpiece. It has become. For this reason, in order to keep the molding resin from leaking from the movable part and preventing the sealing resin from entering the gap between the cavity recess and the molded product, and to improve the mold release from the cured resin, In order to eliminate the need for cleaning the clamping surface, the clamping surface including the cavity concave portion of the mold is covered with a release film so that the sealing resin does not directly contact the clamping surface of the mold. However, if a release film is used, a handling mechanism such as a supply mechanism and a recovery mechanism is added to the resin sealing device, which is expensive to manufacture and is replaced with a new film each time the resin is sealed. Since resin sealing is performed, running cost increases.

  Therefore, the present applicant has already proposed a compression molding apparatus that improves the mold releasability and durability of the mold and reduces the manufacturing cost and running cost. In this device, a composite plating film is formed on the mold clamping surface including the cavity recess of the mold, and the cavity block whose end surface forms a part of the cavity recess is retracted from the cavity recess and supported in an unclamped state. In the clamped state, the end surface is supported so as to be flush with the cavity recess (Patent Document 1).

JP 2001-160564 A

  However, when a light emitting device (LED) including a lens part (convex part) as a workpiece is resin-molded using a transparent resin (silicone resin, epoxy resin, urethane resin, acrylic resin, etc.), a normal semiconductor Because it has higher fluidity than the mold sealing resin, if resin molding is performed without using a release film, resin leakage may occur from the gap between the cavity piece forming the cavity recess and the movable part surrounding it. was there.

The present invention solves the problems of the prior art, simplified apparatus configuration used in the resin molding method及beauty the resin molding method of the resin leakage in the gap between the mold having a movable portion is not generated without using the release film An object of the present invention is to provide a resin molding apparatus that is reduced in running cost and improved in reliability.

In order to achieve the above object, the present invention comprises the following arrangement.
That is, a cavity piece that forms a cavity bottom portion of a cavity filled with a mold resin that seals a workpiece, and a clamper that is disposed so as to surround the cavity piece, the cavity piece and the clamper move up and down relatively. A resin molding method using one mold that is provided so as to be movable and the other mold that supports the workpiece so as to face the cavity , and a sliding surface between the cavity piece and the clamper A step of preparing the one mold in which a circumferential groove connected to the cavity recess is formed through a gap formed in an opening area smaller than an opening area connected to the cavity recess, and the other mold By holding the workpiece by suction and closing the mold in a state where mold resin is supplied into the cavity recess, the cavity recess and the gap are formed. Flip the molding resin filled into the circumferential groove to and cured by heating to form a molded article molded into the cavities and a step of molding a resin ring serving as a seal structure connected to this, which of the cavity piece and the clamper The separating means arranged so as to be able to protrude in the vicinity of the outer periphery of the cavity is protruded simultaneously with the opening of the mold, and the main surface of the molded product is pressed and peeled from the bottom of the cavity, whereby the molded product is separated from the resin ring. Separating from the connecting portion .

According to the above configuration, a sealing structure is formed in which a circumferential groove connected to the cavity recess is formed on one of the opposing surfaces where the cavity piece and the clamper slide, and a resin ring in which the mold resin is cured is embedded in the circumferential groove. Therefore, even if the cavity piece and the clamper are moved up and down relatively, or even if a mold resin with high fluidity is used, no resin leakage occurs due to the seal structure. Therefore, even if the device configuration is simplified, the reliability of the resin mold operation can be improved, and there is no need for a special process or mold equipment for providing a seal structure such as a release film, so consumable parts can be omitted. , Running costs can be reduced.
In this case, a sealing structure including a resin ring is formed by filling the peripheral groove with mold resin filled in the cavity recesses by pre-molding before mass-production of the molded product and curing it. Therefore, a seal structure can be easily formed only by performing pre-molding using a mold resin before mass production of a molded product without using a dedicated seal part or a release film. With this sealing structure including the resin ring, even when the cavity piece and the clamper are moved up and down relatively when mass-producing a molded product, resin leakage does not occur.
In particular, it is possible to form a seal structure including a resin ring by filling the peripheral groove with mold resin through a gap just by filling the cavity recess with mold resin, and forming by hardening into a narrow gap between the molds It is possible to easily separate the molded product from the resin ring at a certain position by concentrating stress on the connection portion between the resin ring and the molded product by the separating means from the connection portion with the resin ring.

  When separation means for separating the molded product molded in the cavity concave portion from either of the cavity piece and the clamper from the connecting portion with the resin ring is provided, it enters into a narrow gap between the molds and hardens. It becomes easy to separate the molded product from the connecting portion with the resin ring.

  In addition, the resin mold apparatus includes any one of the molds described above. Thereby, for example, even if compression molding or transfer compression molding is performed using a mold resin having high fluidity such as an LED without using a release film, resin leakage does not occur from the gap between the molds. Therefore, the apparatus configuration can be simplified and the reliability can be improved.

If the resin molding method is used, resin leakage does not occur in the gap between the molds having the movable part even if a mold resin having high fluidity is used without using a release film .
Moreover, in the resin molding apparatus used for the resin molding method , even if compression molding or transfer compression molding is performed without using a release film, resin leakage does not occur from the gap between the molds. Therefore, the apparatus configuration can be simplified, the running cost can be reduced, and the reliability can be improved.

It is a metal mold | die sectional view which shows the dummy mold operation | movement which forms a seal ring in the mold metal mold | die for compression molding. It is a metal mold | die sectional drawing explaining the compression molding operation | movement after forming the seal ring following FIG. It is metal mold | die sectional drawing which shows the dummy mold operation | movement which forms a seal ring in the mold metal for compression molding which concerns on another example. It is a metal mold | die sectional view explaining the compression molding operation | movement after forming the seal ring following FIG. It is a metal mold | die sectional view which shows the dummy mold operation | movement which forms a seal ring in the mold metal mold | die for TCM. FIG. 7 is a mold cross-sectional view illustrating a compression molding operation after forming a seal ring following FIG. 6. It is a fragmentary sectional view of a mold die showing a modification of a seal structure. It is a fragmentary sectional view of the mold die which shows the seal structure concerning other examples.

Hereinafter, preferred embodiments of the resin molding method及beauty resins molding apparatus according to the present invention will be described in detail in conjunction with the accompanying drawings.
The molds will be described for compression molding and TCM (Transfer Compression Mold), respectively. As the resin mold apparatus, the lower mold is described as a movable mold and the upper mold is described as a fixed mold as an example.

[Example 1]
First, FIG. 1 (A) shows a mold 1 for compression molding. The mold 1 includes an upper mold 2 and a lower mold 3. The configuration of the upper mold 2 (one mold) will be described. In the upper mold 2, an upper mold cavity piece 4 that forms a cavity bottom is fixed to an upper mold chase block (not shown). An upper mold movable clamper 5 is suspended and supported by a coil spring (not shown) around the upper mold cavity piece 4. An upper mold cavity recess 6 is formed by the upper mold cavity piece 4 and the upper mold movable clamper 5.

  In this case, the shape of the upper cavity cavity recess 6 in plan view can be, for example, a circular shape or a rectangular shape, and the shapes of the upper mold cavity piece 4 and the upper mold movable clamper 5 are appropriately determined according to this shape. For example, when a circular workpiece such as a wafer used for WLP (Wafer Level Package) molding or a circular carrier used for eWLP (embedded Wafer Level Package) is used, the upper cavity piece 4 becomes a columnar shape and the upper movable movable clamper 5 has a circular shape. A through hole is formed. Further, the upper cavity cavity 6 having a rectangular shape in plan view is formed such that, for example, when a rectangular workpiece such as a rectangular carrier used for a substrate, a lead frame, or eWLP is used, the upper mold cavity piece 4 has a rectangular parallelepiped shape and the upper mold movable clamper 5 has a rectangular shape. Through-holes are formed.

  A circumferential groove 7 is formed on the outer peripheral surface (sliding surface) facing the upper mold movable clamper 5 of the upper mold cavity piece 4. As will be described later, the circumferential groove 7 is provided with a seal structure including a resin ring 12 as a seal material that is pre-filled with mold resin and cured by heating.

  Next, the configuration of the lower mold 3 (the other mold) will be described. The lower mold 3 includes a lower mold block 8 supported by a lower mold chase (not shown). The upper surface of the lower mold block 8 is a work support portion 8a on which the work W is sucked and supported. The lower mold block 8 is provided with a lower mold suction hole 9 that communicates with the work support portion 8a and supports the work W by suction. The lower mold suction hole 9 is connected to a suction device (not shown). When the workpiece W is placed on the workpiece support portion 8a, the workpiece W is sucked into the lower mold suction hole 9 and sucked and held. The lower die 3 is a publicly known device that moves up and down a lower movable platen on which the lower die block 8 is placed via a drive transmission mechanism (link mechanism such as a toggle link or a screw shaft) driven by a drive source (electric motor) (not shown). The mold is opened and closed by a mold clamping mechanism.

Next, the seal structure will be described with reference to FIG.
On the outer peripheral surface of the upper mold cavity piece 4, there is a circumferential groove 7 connected to the cavity recess 6 through a gap (resin path 7 a) formed between the inner peripheral surface (sliding surface) of the upper movable clamper 5 that is opposed. Is formed. The resin path 7 a has a wedge-shaped (tapered) cross section so that the opening area connected to the circumferential groove 7 is smaller than the opening area connected to the cavity recess 6. Thus, as will be described later, the sealing resin ring can be formed by filling the peripheral groove 7 with the mold resin simply by performing pre-molding (dummy mold) using the mold resin before mass production of the molded product. In addition (see FIG. 1C), when mass-producing a molded product, stress can be concentrated on the connecting portion between the resin ring 12 and the molded product 13 so that the molded product can be easily separated from the mold at a certain site. (See FIG. 2 (F) ).

Next, a process for compression molding using the mold 1 described above will be described.
In FIG. 1A, a dummy substrate 10 (an organic substrate, a metal substrate, etc.) is placed on a work support portion 8a on a lower mold 3 of a mold mold 1 that is opened, and is sucked from a lower mold suction hole 9. Adsorb and hold. Mold resin 11 (liquid resin) is supplied onto the dummy substrate 10 by a dispenser (not shown) or the like. The dummy substrate 10 may be mounted with either a dummy chip or may have only irregularities corresponding to the semiconductor chip. Further, the mold resin 11 may be sucked and held on the work support portion 8a while being supplied to the dummy substrate 10 in advance.

  Next, as shown in FIG. 1B, a lower mold 3 is lifted by operating a mold opening / closing mechanism (not shown) to close the mold with the upper mold 2. The upper mold movable clamper 5 is clamped so as to clamp the dummy substrate 10 and press the spring. At this time, the mold resin 11 supplied onto the dummy substrate 10 is spread and filled in the cavity recess 6, filled into the circumferential groove 7 through the resin passage 7 a, and heated and cured (curing). Thereby, the resin ring 12 is formed in the circumferential groove 7. In this case, the mold resin 11 is filled in the circumferential groove 7 at a low pressure, and is molded at a high pressure after the viscosity has increased to some extent, so that the mold resin 11 does not enter the gap between the upper mold cavity piece 4 and the upper mold movable clamper 5. The resin ring 12 can be molded. According to this, it becomes possible to mold a seal structure that can withstand a high resin pressure during molding of the workpiece W while preventing resin leakage during molding of the resin ring 12.

  As shown in FIG. 1 (C), a mold opening / closing mechanism (not shown) is operated to lower the lower mold 3 to open the upper mold 2 and the mold. At this time, since the dummy substrate 10 that has been dummy-molded is opened while being sucked and held by the work support portion 8a of the lower mold 3, the molded product 13 filled in the resin path 7a connected to the resin ring 12 in a tapered shape Separates from certain sites. Thereby, the resin ring 12 can be molded in the circumferential groove 7 of the upper mold cavity piece 4 to fill the gap between the upper mold cavity piece 4 and the upper mold movable clamper 5. In this case, the mold resin 11 is left on the dummy substrate 10 side by the anchor effect of the uneven wall surface corresponding to the semiconductor chip of the dummy substrate 10, and a portion other than the resin ring 12 is prevented from remaining on the mold side. Is possible.

Next, the work W which is a mass-produced product is resin-molded using the mold 1 in which the resin ring 12 described above is formed. That is, in FIG. 2 (D), the workpiece W on which the semiconductor chip 15 is mounted on the substrate 14, the die opening was placed on the workpiece supporting portion 8a of the lower mold 3 of the molding die 1 by suction from the suction holes 9 By adsorbing and holding. Mold resin 11 (liquid resin) is supplied onto the work W by a dispenser (not shown) or the like. Note that the mold resin 11 may be sucked and held on the workpiece support portion 8a while being supplied to the workpiece W in advance.

Next, as shown in FIG. 2 (F) , a mold opening / closing mechanism (not shown ) is operated to raise the lower mold 3 and close the mold with the upper mold 2. The upper mold movable clamper 5 is clamped so as to clamp the workpiece W (substrate 14) and press the spring. At this time, the mold resin 11 supplied onto the workpiece W is expanded and filled in the cavity recess 6 due to the decrease in the cavity volume, and is filled up to the resin path 7a in which the resin ring 12 is formed, and is cured by heating. . At this time, since the resin ring 12 seals the gap between the upper mold cavity piece 4 and the upper mold movable clamper 5, the mold resin 11 does not leak out. For example, resin leakage can be prevented even when a highly fluid transparent resin used when sealing a light emitting device (LED) as the mold resin 11 is used.

As shown in FIG. 2 (F) , a mold opening / closing mechanism (not shown ) is operated to lower the lower mold 3 to open the upper mold 2 and the mold. At this time, since the molded workpiece W (substrate 14) is opened while being sucked and held by the workpiece support portion 8a of the lower mold 3, the molded product filled in the resin path 7a connected to the resin ring 12 in a tapered shape. 13 are separated by stress concentration in the tapered portion. Thereby, the molded product 13 and the upper mold | type 2 can be isolate | separated in a fixed position. In addition, although the protrusion part 13a which consists of a protrusion is formed in the peripheral part in the molded article 13, since it is a part diced and excised later, it does not affect the molding quality of a product.

By using the mold 1 described above, it is possible to provide a mold 1 in which resin leakage does not occur in a gap between molds having movable parts even when a mold resin having high fluidity is used without using a release film. it can.
Further, in the resin molding apparatus using the mold 1 described above, even if compression molding is performed without using a release film, resin leakage does not occur from the gap between the molds. Therefore, the apparatus configuration can be simplified and the reliability can be improved while reducing the running cost.

[Example 2]
Next, a configuration of a molding die for compression molding according to another example will be described with reference to FIGS. In FIG. 3, a structure in which the structure of the mold, the lower mold, and the upper mold in FIG. 1 are replaced is adopted. In the following embodiments, the same configurations as those of the above-described embodiments may be omitted only as illustrated and redundant description may be omitted. The configuration of the upper mold 16 (one mold) will be described. The upper die 16 includes an upper die block 17 supported by an upper die chase (not shown). The upper mold block 17 is provided with an upper mold suction hole 18 that sucks and supports the workpiece W. The upper mold suction hole 18 is connected to a suction device (not shown). When the workpiece W is pressed against the parting surface of the upper die block 17, the workpiece W is sucked into the upper die suction hole 18 and held by suction. In addition, it may replace with adsorption | suction and a nail | claw-shaped fixing | fixed part may be provided and the workpiece W may be hung and hold | maintained.

Next, the configuration of the lower mold 19 (the other mold) will be described. In the lower mold 19, a lower mold cavity piece 20 that forms a cavity bottom is fixed to a lower mold chase block (not shown). A lower mold movable clamper 21 is urged and supported upward by a coil spring (not shown) around the lower mold cavity piece 20. A lower mold cavity recess 22 is formed by the lower mold cavity piece 20 and the lower mold movable clamper 21.
A circumferential groove 23 is formed on the outer peripheral surface (sliding surface) facing the lower mold movable clamper 21 of the lower mold cavity piece 20. As will be described later, the circumferential groove 23 is provided with a seal structure including a resin ring 12 that is preliminarily filled with a mold resin and heat-cured.

  The lower mold 19 is opened and closed by raising and lowering a lower mold movable platen on which the lower mold chase is placed via a drive transmission mechanism that is driven by a drive source (not shown).

Next, the seal structure will be described with reference to FIG.
A circumferential groove 23 is formed on the outer peripheral surface of the lower mold cavity piece 20 so as to continue to the lower mold cavity recess 22 through a gap (resin passage 20a) with the inner peripheral surface (sliding surface) of the opposed lower mold movable clamper 21. Yes. The resin path 20 a is formed in a wedge shape (tapered shape) so that the opening area connected to the circumferential groove 23 is smaller than the opening area connected to the lower mold cavity recess 22. As a result, stress can be concentrated on the connecting portion between the resin ring 12 and the molded product 13 in the same manner as in the above-described embodiment, so that the molded product 13 can be easily separated from the resin ring 12 at a certain site (FIG. 4F). reference).

Next, a process for compression molding using the mold 1 described above will be described.
In FIG. 3A, the dummy substrate 10 is pressed against the parting surface of the upper mold 16 of the mold mold 1 that has been opened, and is sucked and held by the upper mold suction hole 18. The lower mold cavity recess 22 is supplied with mold resin 11 (liquid resin, granular resin, etc.) by a resin supply mechanism (dispenser, etc.) (not shown). Further, the dummy substrate 10 and the mold resin 11 may be carried into the mold 1 by the same conveying device, or the mold resin 11 may be introduced in advance to promote heat reception.

  Next, as shown in FIG. 3B, the lower mold 19 is raised and the upper mold 16 is closed. The lower mold movable clamper 21 is clamped so as to clamp the dummy substrate 10 and press the spring. At this time, the mold resin 11 supplied to the lower mold cavity recess 22 is heated and melted to be spread and filled in the lower mold cavity recess 22, filled into the circumferential groove 23 through the resin path 20 a, and heated and cured. The Thereby, the resin ring 12 is molded in the circumferential groove 23.

  As shown in FIG. 3C, the lower mold 19 is lowered to open the mold with the upper mold 16. At this time, the dummy substrate 10 that has been dummy-molded is opened while being attracted and held on the parting surface of the upper mold 16, so that the resin ring 12 and the molded product 13 filled in the resin path 20 a connected in a tapered shape are formed. The stress is concentrated on the tapered portion and separated. As a result, the resin ring 12 can be molded in the circumferential groove 23 of the lower mold cavity piece 20 to fill the gap between the lower mold cavity piece 20 and the lower mold movable clamper 21.

Next, the workpiece W is resin-molded using the mold 1 in which the resin ring 12 described above is formed. That is, in FIG. 4 (D), the adsorbed held by sucking from the upper die suction holes 18 is pressed against the workpiece W to the parting face of the upper die 16 of the die opening the mold 1. Further, the mold resin 11 is supplied to the lower mold cavity recess 22 by a dispenser or the like (not shown). The workpiece W and the mold resin 11 may be carried into the mold 1 by the same conveying device or may be carried individually.

Next, as shown in FIG. 4 (E), it is closed type out with the upper mold 16 is raised to the lower die 19. The lower mold movable clamper 21 is clamped so as to clamp the workpiece W (substrate 14) and press the spring. At this time, the mold resin 11 supplied to the lower mold cavity recess 22 is expanded and filled by the reduction of the cavity volume, and is filled to the resin path 20a in which the resin ring 12 is formed, and is cured by heating. At this time, since the resin ring 12 seals the gap between the lower mold cavity piece 20 and the lower mold movable clamper 21, the mold resin 11 is reliably prevented from leaking.

As shown in FIG. 4 (F) , the lower mold 19 is lowered to open the upper mold 16 and the mold. At this time, since the molded work W (substrate 14) is opened while being held by suction on the parting surface of the upper mold 16, the molded product 13 filled in the resin path 20a connected to the resin ring 12 in a tapered shape. And the stress concentrates on the tapered portion and separates. Thereby, the molded product 13 and the lower mold | type 19 can be isolate | separated in a fixed position.

[Example 3]
Next, the structure of a TCM mold according to another example will be described with reference to FIGS. TCM is a resin mold system that has both transfer molding and compression molding characteristics that involve pressure feeding of mold resin.

  The configuration of the upper mold 24 (one mold) will be described. In the upper mold 24, an upper mold cavity piece 25 that forms a cavity bottom portion is fixed to an upper mold chase block (not shown). An upper mold movable clamper 26 is suspended and supported by a coil spring (not shown) around the upper mold cavity piece 25. An upper mold cavity recess 27 is formed by the upper mold cavity piece 25 and the upper mold movable clamper 26. On the parting surface of the upper mold movable clamper 26, an upper mold cull 26a and an upper mold runner gate 26b are engraved so as to communicate with the upper mold cavity recess 27.

  A circumferential groove 28 is formed on the outer peripheral surface (sliding surface) facing the upper mold movable clamper 26 of the upper mold cavity piece 25. As will be described later, the circumferential groove 28 is provided with a seal structure including a resin ring 12 that is pre-filled with mold resin 11 and cured by heating.

  Next, the configuration of the lower mold 29 (the other mold) will be described. The lower mold 29 includes a lower mold block 30 supported by a lower mold chase (not shown). The lower mold block 30 is provided with a lower mold suction hole 31 for sucking and supporting the workpiece W. The lower mold suction hole 31 is connected to a suction device (not shown). When the workpiece W is placed on the workpiece support portion 30a of the lower mold block 30, it is sucked and held by the lower mold suction hole 31.

  In addition, a cylindrical pot 32 is assembled to the lower mold block 30 at a position facing the upper mold cull 26a. Mold resin 11 (resin tablet, liquid resin, granular resin, etc.) is supplied into the pot hole 32a by a loader (not shown). A plunger 33 that is moved up and down by a known transfer mechanism is inserted into the pot 32. The lower mold 29 is a known type that moves up and down the lower mold movable platen on which the lower mold chase is placed via a drive transmission mechanism (link mechanism such as a toggle link or a screw shaft) that is driven by a drive source (electric motor) (not shown). The mold is opened and closed by a mold clamping mechanism.

Next, the seal structure will be described with reference to FIG.
On the outer peripheral surface of the upper mold cavity piece 25, a circumferential groove 28 is formed which is continuous with the upper mold cavity concave portion 27 through a gap (resin passage 25a) between the upper mold movable clamper 26 and the inner peripheral surface (sliding surface). Yes. The resin path 25 a has a wedge-shaped (tapered) cross section so that the opening area connected to the circumferential groove 28 is smaller than the opening area connected to the upper mold cavity recess 27. As a result, the molded product 13 can be easily separated from the resin ring 12 at a certain site by stress concentration on the connecting portion between the resin ring 12 and the molded product 13 as in the above-described embodiment. (See FIG. 6G).

  Next, a process for TCM molding using the mold 1 described above will be described. In FIG. 5A, a dummy substrate 10 (an organic substrate, a metal substrate, etc.) is placed on the work support portion 30a on the lower mold 29 of the mold mold 1 which is opened, and is sucked from the lower mold suction hole 31. Adsorb and hold. Further, the mold resin 11 (for example, a resin tablet) is supplied into the pot hole 32 a of the pot 32 of the lower mold 29.

  Next, as shown in FIG. 5B, the lower die 29 is raised and closed with the upper die 24. The upper mold movable clamper 26 is clamped so as to clamp the dummy substrate 10 and press the spring. At the stage where the upper mold movable clamper 26 clamps the dummy substrate 10, the transfer mechanism is operated, the mold resin 11 melted by the plunger 33 is pressure-fed, and the upper mold cavity recess 27 is passed through the upper mold cull 26a and the upper mold runner gate 26b. Filled. At this time, the mold resin 11 is filled up to the circumferential groove 28 through the resin path 25a and cured by heating. Thereby, the resin ring 12 is formed in the circumferential groove 28.

  As shown in FIG. 5C, the lower mold 29 is lowered and the upper mold 24 and the mold are opened. At this time, since the dummy substrate 10 that has been dummy-molded is opened while being held by the work support portion 30a of the lower mold block 30, the molded product 13 that is filled in the resin path 25a that is taperedly connected to the resin ring 12 is formed. And the stress concentrates on the tapered portion and separates. As a result, the resin ring 12 can be molded in the circumferential groove 28 of the upper mold cavity piece 25 to fill the gap between the upper mold cavity piece 25 and the upper mold movable clamper 26.

  Next, the workpiece W is resin-molded using the mold 1 in which the resin ring 12 described above is formed. That is, in FIG. 6D, the work W is placed on the work support portion 30a of the lower mold block 30 of the mold mold 1 that has been opened, and is sucked and held by suction from the lower mold suction hole 31. Further, the mold resin 11 (for example, a resin tablet) is supplied into the pot hole 32 a of the pot 32 of the lower mold 29.

  Next, as shown in FIG. 6 (E), the lower die 29 is raised and the upper die 24 is closed. The upper mold movable clamper 5 is clamped so as to clamp the workpiece W (substrate 14) and press the spring. When the upper mold movable clamper 26 clamps the workpiece W (substrate 14), the transfer mechanism is operated, and the molten mold resin 11 is pressure-fed by the plunger 33, and the upper mold cavity 26a and the upper mold runner gate 26b are passed through the upper mold cavity. The recess 27 is filled (first holding pressure). At this time, since the resin ring 12 seals the gap between the upper mold cavity piece 25 and the upper mold movable clamper 26, it is certain that the mold resin 11 enters the resin path 25a and leaks from the gap between the molds. To be prevented.

  As shown in FIG. 6 (F), the lower mold 29 is further raised while the lower mold 29 and the upper mold 24 are closed, and the volume of the cavity filled with the mold resin 11 is reduced, so that the excess resin is removed. A reverse flow is made toward the pot 3 through the runner gate 26b and the upper die 26a. At this time, the plunger 33 in the pot 32 is slightly pushed down to absorb excess resin. Finally, the transfer mechanism is operated again, and the mold resin 11 is heated and cured while the plunger 33 is pushed up to the final resin pressure (second holding pressure) higher than the first holding pressure.

  In FIG. 6G, the lower mold 29 is lowered and the upper mold 24 and the mold are opened. At this time, since the molded workpiece W (substrate 14) is opened while being sucked and held by the workpiece support portion 30a of the lower mold 29, the molded product filled in the resin path 25a connected to the resin ring 12 in a tapered shape. 13 are separated by stress concentration in the tapered portion. Thereby, the molded product 13 and the upper mold | type 24 can be isolate | separated in a fixed position.

By using the mold 1 described above, it is possible to provide a mold 1 in which resin leakage does not occur in a gap between molds having movable parts even when a mold resin having high fluidity is used without using a release film. it can.
Further, in the resin molding apparatus using the mold 1 described above, even if TCM molding is performed without using a release film, resin leakage does not occur from the gap between the molds. Therefore, the apparatus configuration can be simplified, the running cost can be reduced, and the reliability can be improved.

  In this embodiment, by using the fixed upper mold cavity piece 25 and the upper mold movable clamper 26 suspended and supported by a coil spring, the end face of the upper mold cavity piece 25 is moved up and down by the lower mold 29. Although the configuration of moving up and down relatively with respect to the end face of 26 has been described, the present invention is not limited to this. For example, the upper mold movable clamper 26 may be fixed to the mold chase, and the upper mold cavity piece 25 may be moved up and down by a driving mechanism different from the mold clamping operation. As this drive mechanism, for example, a wedge mechanism that increases or decreases the thickness by moving one of the pair of tapered blocks assembled with the inclined surfaces facing each other, or directly driven by a drive source such as a servo motor, etc. Also good.

  Further, in the above-described embodiment, the configuration example in which the TCM molding is performed has been described. However, it can also be used in the molding in which the upper mold cavity piece 25 is moved up and down. For example, the end face of the semiconductor chip 15 mounted on the substrate 14 as the work W is clamped by the upper mold cavity piece 25 to expose the end face of the semiconductor chip 15, or in the case of the flip chip type semiconductor chip 15, only the underfill is performed. It can also be used when performing.

  Next, another example of the sealing structure of the mold 1 will be described with reference to FIGS. In each of the above-described embodiments, the resin ring 12 is formed in the circumferential groove of the cavity piece to seal the gap with the opposed movable clamper. However, even if a seal structure using a seal member 34 used in combination with other members is employed. Good.

  For example, as shown in FIG. 7A, a ring member 34 a may be embedded in advance as a seal member in the circumferential groove 7 of the upper mold cavity piece 4 separately from the resin ring 12. The ring member 34a may be made of a fluororesin resin or a metal having a lower hardness than the mold material. A ring member 34a having a thickness that does not fill the entire circumferential groove 7 is provided on the end side (upper end side) of the circumferential groove 7 to dam the mold resin 11 and thereby the resin ring 12 may be molded. . According to this, the life of the resin ring 12 can be extended by supporting the resin ring 12 by the ring member 34a.

Further, for example, as shown in FIG. 7B, the ring member 34 a is placed on the inner wall of the upper mold movable clamper 5 so as to face the ring member 34 a filled in the circumferential groove 7 of the upper mold cavity piece 4. A concave portion 5a corresponding to the corresponding height may be formed, and a ring member 34b having a higher linear expansion coefficient than the mold material may be embedded in the concave portion 5a. The seal member 34b can be made of the same material as the ring member 34a.
As a result, in addition to the ring member 34a, the ring member 34b also linearly expands due to the heating of the mold 1 so that the gap between the upper mold cavity piece 4 and the upper mold movable clamper 5 is eliminated as much as possible to prevent resin leakage. Can do. The seal member 34 as shown in the figure can also be used when the resin ring 12 is molded and used.

  7C and 7D, the molded product 13 formed by the upper mold cavity recess 6 in either the upper mold cavity piece 4 or the upper mold movable clamper 5 is connected to the resin ring 12 (seal ring). Separation means (for example, an ejector pin 35) for separating from the portion may be provided. FIG. 7C illustrates a structure in which the ejector pin 35 is provided so as to protrude from the upper mold cavity piece 4 side, and FIG. 7D illustrates that the ejector pin 35 is provided to protrude from the upper mold movable clamper 5 side. The structure is illustrated. The ejector pin 35 protrudes at the same time as the mold opening near the outer periphery of the cavity and presses and peels the main surface of the molded product from the bottom of the cavity, so that the ejector pin 35 is reliably separated in the vicinity of the circumferential groove 7.

  As a result, not only when the resin ring 12 is molded by the dummy mold but also when a mass-produced product is molded, the molded product 13 that has entered the narrow gap between the molds as in the resin path 7a is cured with the resin ring 12. It becomes easy to separate from the connection part. Further, when the mass-produced product is molded, the influence on the resin on the cavity side can be reduced as much as possible, and peeling of the mold resin 11 from the workpiece W is reliably prevented. The ejector pins 35 may be provided on both the upper mold cavity piece 4 and the upper mold movable clamper 5. In this case, even a resin having flexibility after curing, such as silicone rubber, can be reliably released by applying pressure from both sides of the circumferential groove 7 and peeling it.

For example, in the case of the cavity piece 4 having a circular shape in plan view, as shown in FIG. 8, an outer ring member 34 c made of resin is disposed on the outer periphery of the upper mold cavity piece 4 and a plurality of outer ring members made of metal are disposed on the outer periphery thereof. 34d may be assembled. The outer ring member 34d is formed in an outer diameter larger than the hole diameter of the upper mold movable clamper 5 and partly cut off. Specifically, the outer ring member 34d is formed in a size that fits into the hole of the upper mold movable clamper 5 by being compressed so as to narrow the gap of the notch. Further, the outer ring member 34d is arranged so that the notch is not connected in the state where it is assembled in the circumferential groove 7, so that leakage of the mold resin 11 through the notch is prevented. Further, the inner ring member 34c is not damaged even if the inner diameter of the outer ring member 34d that is compressed by being molded by a resin having flexibility at the molding temperature is reduced. In this case, penetration of the mold resin 11 is prevented by filling the circumferential groove 7 with the inner ring member 34c and the outer ring member 34d. These are supported by an annular ring fixing member 36 so as not to drop off.
In addition, by providing a groove on the cavity side where the resin ring 12 can be molded, a seal structure that achieves both resin leakage prevention by the resin ring 12 and mold slidability (wear resistance) by the outer ring 34d is realized. Can do.

  The above-described TCM molding apparatus has been described using an upper mold cavity and a lower mold pot arrangement type mold mold, but may be a lower mold cavity, or an upper mold pot and a lower mold cavity arrangement mold metal. It may be a mold.

In each of the above-described embodiments, the circumferential groove in which the resin ring is formed is provided on the outer peripheral surface of the cavity piece. However, the peripheral groove in which the resin ring is formed on the inner peripheral surface of the movable clamper may be provided. Further, although the upper mold is described as a fixed mold and the lower mold as a movable mold, the present invention is not limited to this, and the lower mold may be a fixed mold, the upper mold may be a movable mold, or both may be movable molds.
Also, the work W is a light emitting element such as a white LED in which a semiconductor chip is wire-bonded to a substrate or a semiconductor chip is flip-chip connected to a substrate, and a phosphor is mixed into a mold resin. Can also be applied.

  DESCRIPTION OF SYMBOLS 1 Mold metal mold | die 2,16,24 Upper mold | type 3,19,29 Lower mold | type 4,25 Upper mold cavity piece 5,26 Upper mold movable clamper 5a Concave part 6,27 Upper mold cavity concave part 7,23,28 Circumferential groove 7a, 25a Resin path 8 Lower mold block 8a, 30a Work support part 9 Lower mold suction hole 10 Dummy substrate 11 Mold resin 12 Resin ring 13 Molded product 13a Projection part 14 Substrate 15 Semiconductor chip 17 Upper mold block 18 Upper mold suction hole 20 Lower mold Cavity piece 21 Lower mold movable clamp 22 Lower mold cavity recess 26a Upper mold cull 26b Upper mold runner gate 30 Lower mold block 31 Lower mold suction hole 32 Pot 32a Pot hole 33 Plunger 34 Seal members 34a, 34b Ring member 34c Inner ring member 34d Outer ring Material 35 ejector pin 36 ring fixing member

Claims (3)

A cavity piece that forms a cavity bottom of a cavity filled with a mold resin that seals a workpiece, and a clamper that is disposed so as to surround the cavity piece, the cavity piece and the clamper can be moved up and down relatively. A resin mold method using one mold provided on the other mold and the other mold for supporting the workpiece against the cavity ,
The one mold having a circumferential groove formed in a sliding surface between the cavity piece and the clamper and having a circumferential groove formed in an opening area smaller than an opening area continuous with the cavity depression formed in the opening. A process to prepare;
The workpiece is sucked and held on the other mold and the mold resin is closed in a state where the mold resin is supplied into the cavity recess, so that the mold resin is filled into the circumferential groove through the cavity recess and the gap, and is heated and cured. A step of molding a molded product molded into the cavity recess and a resin ring that becomes a seal structure connected to the molded product,
By separating the separating means arranged so as to be able to protrude in the vicinity of the outer periphery of the cavity on either the cavity piece or the clamper at the same time as the mold is opened, the main surface of the molded product is pressed from the bottom of the cavity and peeled off, Separating the molded product from the connecting portion with the resin ring;
A resin molding method comprising: The resin molding method according to claim 1, wherein a mold recess is formed facing the resin ring filled in the circumferential groove, and a seal member having a higher linear expansion coefficient than the mold resin is embedded in the mold recess. . 3. A resin mold used in the resin molding method according to claim 1 or 2 , further comprising: a mold mold having separation means arranged so as to be able to protrude in the vicinity of the outer periphery of the cavity on either the cavity piece or the clamper. A resin molding apparatus characterized by the above.

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