JP6867229B2 - Resin mold mold - Google Patents

Description

The present invention relates to a resin mold mold for resin molding a work.

A semiconductor that is cut into individual pieces after a semiconductor chip or the like (sometimes referred to simply as a "chip") is attached to a carrier plate, resin-molded, and then cut into pieces in order to improve the production efficiency of semiconductor devices as electronic devices become smaller and thinner. A method for manufacturing the device has been proposed. As an example, a semiconductor chip or the like is attached to the carrier plate using an adhesive tape and resin-molded. After that, the carrier plate and the adhesive tape are peeled off, and then electrode molding and polishing are performed to separate them into individual pieces to manufacture a semiconductor device (see Patent Document 1: Japanese Patent Application Laid-Open No. 2006-287235).

Japanese Unexamined Patent Publication No. 2006-287235 Japanese Unexamined Patent Publication No. 2012-126074

However, in the method for manufacturing a semiconductor device exemplified in Patent Document 1, when a heat-foamable heat-foamable adhesive tape is used as an adhesive tape for attaching a semiconductor chip or the like to a carrier plate, a carrier plate is formed on a heated mold mold. In the process of carrying in and molding the resin, when the heating progresses more than necessary due to heat conduction from the mold surface, the adhesive strength of the heat release tape decreases and the semiconductor chips etc. are misaligned due to the flow of resin etc. Problems may occur.

For the purpose of solving such a problem, the work was preheated by supporting the carrier plate to which the semiconductor chip or the like was attached by using the adhesive tape at a distance from the mold clamp surface by the work support portion. A technique for preventing heat from being transferred from the mold clamp surface to the adhesive tape when it is carried into a mold and preventing the position of a semiconductor chip or the like from shifting (see Patent Document 2: Japanese Patent Application Laid-Open No. 2012-126704) has been studied. I came.

As an example, as illustrated in FIG. 9 of Patent Document 2, when the work support mechanism is provided on the upper mold, the work is supported at a predetermined distance from the mold surface of the upper mold when the mold is opened, and the mold is opened. If a configuration that allows the work to be brought into close contact with the mold surface of the upper mold when closed can be realized, the above-mentioned problem of misalignment can be solved.

The present invention has been made in view of the above circumstances, in which a cavity is provided in the lower mold, a work support mechanism for supporting the work is provided in the upper mold, and the work is placed at a predetermined distance from the mold surface of the upper mold when the mold is opened by a simple mechanism. It is an object of the present invention to provide a resin mold mold which is supported by being separated from each other and allows the work to be brought into close contact with the mold surface of the upper mold when the mold is closed.

The present invention solves the above problems by means of a solution as described below as an embodiment.

The resin mold mold according to the present invention is a resin mold mold for resin-molding a work, and has an upper mold provided with a work support mechanism for supporting the work and a cavity for sealing a chip on the work. The work support mechanism includes a lower mold provided, a suction mechanism that sucks and holds the upper surface of the work, and a chucking mechanism that holds the outer edge of the work by sandwiching it. The suction mechanism is urged downward by the first urging member, and is moved up and down between the position where the lower end protrudes downward from the mold surface of the upper mold and the same position as the mold surface of the upper mold. It has a suction tube supported by the upper mold so as to be movable, and the chucking mechanism can move in contact with and separate from the outer edge of the work, and is only a predetermined distance from the mold surface of the upper mold. have a spaced supported chucking claws on the upper mold so as to be vertically movable between a release position of the workpiece in close proximity to the predetermined distance to the mold surface of the upper die and the holding position of the workpiece, It is a requirement that the chucking claw is configured to release the work at the release position when the mold is closed.

According to this, in a resin mold mold in which a cavity is provided in the lower mold and a work support mechanism for supporting the work is provided in the upper mold, the work is separated from the mold surface of the upper mold by a predetermined distance when the mold is opened by a simple mechanism. The work can be brought into close contact with the mold surface of the upper mold when the mold is closed. Therefore, even when the upper mold is heated to a predetermined temperature to support the work when the mold is opened, heat is not easily transferred to the work from the mold surface of the upper mold, and the semiconductor chip or the like attached using the above-mentioned adhesive tape or the like. It is possible to prevent the misalignment of. On the other hand, when the mold is closed, it can be appropriately heated in a close contact state, so that high-quality resin molding can be performed.

Further, it is preferable that the chucking mechanism has a second urging member that urges the chucking claw in a direction approaching the outer edge of the work. According to this, the urging force of the second urging member can be applied to keep the chucking claw in contact with the outer edge of the work W, that is, in a state of sandwiching the work W.

Further, the chucking mechanism is provided with a pushing pin in which the chucking claw is rotatably supported by the upper mold and the chucking claw is rotated in a direction away from the outer edge of the work. Is preferable. According to this, the pushing pin is pushed by the lower die, and the pushing pin is brought into contact with the chucking claw to be pushed, thereby rotating the chucking claw 52 in a direction away from the outer edge of the work. be able to. Therefore, the work held by the chucking claw can be released.

Alternatively, in the chucking mechanism, the chucking claw is supported by the upper mold so as to be movable left and right, and the tapered surface provided on the chucking claw is pushed to move the chucking claw to the outer edge of the work. It is preferable that a push pin for moving the push pin in a direction away from the above is provided. According to this, the pushing pin is pushed by the lower die, and the pushing pin is brought into contact with the chucking claw to be pushed, so that the chucking claw 52 is moved in a direction away from the outer edge of the work. Can be done. Therefore, the work held by the chucking claw can be released.

According to the present invention, there is a resin mold mold that supports the work at a predetermined distance from the mold surface of the upper mold when the mold is opened and allows the work to be brought into close contact with the mold surface of the upper mold when the mold is closed. It can be realized by a simple mechanism. Therefore, for example, in a work to which a semiconductor chip or the like is attached using a heat-removable adhesive tape, it is possible to solve the problem that the semiconductor chip or the like is displaced due to heat.

It is the schematic (front view) which shows the example of the resin mold mold which concerns on 1st Embodiment of this invention. It is the schematic (bottom view) which shows the example of the upper mold of the resin mold mold which concerns on 1st Embodiment of this invention. It is the schematic (front view) which shows the example of the suction mechanism and chucking mechanism of the resin mold mold which concerns on 1st Embodiment of this invention. It is the schematic (bottom view) which shows the example of the suction tube of the suction mechanism of the resin mold mold which concerns on 1st Embodiment of this invention. It is the schematic (front view) which shows another example of the chucking mechanism of the resin mold mold which concerns on 1st Embodiment of this invention. It is the schematic (front view) which shows the example of the chucking mechanism of the resin mold mold which concerns on 2nd Embodiment of this invention. It is the schematic (front view) which shows the example of the resin mold mold which concerns on 3rd Embodiment of this invention. It is the schematic (bottom view) which shows the example of the upper mold of the resin mold mold which concerns on 3rd Embodiment of this invention. It is the schematic (bottom view) which shows the other example of the upper mold of the resin mold mold which concerns on 3rd Embodiment of this invention.

(First Embodiment)
Hereinafter, the first embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic view (front view) showing an example of the resin mold mold 10 according to the first embodiment of the present invention. Further, FIG. 2 is a schematic view (bottom view) showing an example of the upper mold of the resin mold mold 10 shown in FIG. Further, FIG. 3 is an enlarged view of part III of FIG. Here, for convenience of explanation, the vertical direction of the resin mold mold 10 may be described by the vertical direction of the paper surface in FIGS. 1, 3, 5, 6, and 7. In all the drawings for explaining each embodiment, members having the same function may be designated by the same reference numerals, and the repeated description thereof may be omitted.

The resin mold mold 10 according to the present embodiment is used in a resin molding apparatus (not shown) that performs resin molding of a work (object to be molded) W with a mold resin (sometimes simply referred to as “resin”) R. It is a mold. Here, the case of a compression molding apparatus as the resin molding apparatus will be described.

First, as an example of the work W to be molded, a semiconductor chip or the like in which Wb is held on the carrier plate Wa is used. Such a work W is used, for example, in a resin sealing method called eWLP (embedded Wafer Level Package) or eWLB (embedded Wafer Level BGA). Specifically, for example, a plurality of adhesive tapes (not shown) having heat peelability are used on a carrier plate Wa made of a round metal (SUS, etc.) having a diameter of 12 inches (about 30 cm), which is the same size as a semiconductor wafer. A semiconductor chip or the like in which Wb is attached in a matrix is used. As will be described later, the carrier plate Wa may have a rectangular shape. The work W is not limited to the above configuration.

Here, the adhesive tape is a heat-release tape having heat foaming property, and has a property that the adhesiveness is lowered by heating. Therefore, there is an advantage that only the carrier plate Wa can be easily peeled off from the resin molded body obtained by molding the semiconductor chip Wb by heating after the resin molding. However, if the work W is excessively heated before the resin molding, as described above, problems such as misalignment of Wb such as a semiconductor chip on the carrier plate Wa may occur.

On the other hand, the mold resin R is, for example, a thermosetting resin (for example, an epoxy resin containing a filler), and its state is represented by a liquid, a powder, a sheet, a granule, and in some cases, a mini tablet. It may be solid.

Subsequently, the configuration of the resin mold mold 10 will be described.

The resin mold mold 10 includes a pair of molds having a cavity and opening and closing the mold (for example, one in which a plurality of mold blocks made of alloy tool steel are assembled). In the present embodiment, of the pair of molds, one mold on the upper side in the vertical direction is the upper mold 12, and the other mold on the lower side is the lower mold 14. The resin mold mold 10 is closed and opened by the upper mold 12 and the lower mold 14 approaching and separating from each other. Therefore, the vertical direction is also the mold opening / closing direction.

Further, the resin mold mold 10 is opened and closed by a known mold opening / closing mechanism (not shown). For example, the mold opening / closing mechanism includes a pair of platens, a plurality of tie bars on which the pair of platens are erected, a drive source (for example, an electric motor) for moving (elevating) the platens, a drive transmission mechanism (for example, a toggle link), and the like. (Neither is shown). Here, the resin mold mold 10 is arranged between a pair of platens of the mold opening / closing mechanism. In the present embodiment, the fixed upper mold 12 is assembled to the fixed platen (platen fixed to the tie bar), and the movable lower mold 14 is assembled to the movable platen (platen that moves up and down along the tie bar). ing. However, the present invention is not limited to this configuration, and the upper die 12 may be a movable type and the lower die 14 may be a fixed type, or both the upper die 12 and the lower die 14 may be a movable type.

First, the lower mold 14 of the resin mold mold 10 will be specifically described. The lower mold 14 includes a lower plate 24, a cavity piece 26, a clamper 28, and the like, and is configured by assembling these.

The cavity piece 26 is fixedly assembled to the upper surface of the lower plate 24 (the surface on the upper mold 12 side). Further, the clamper 28 is configured in an annular shape so as to surround the cavity piece 26, and is assembled so as to be adjacent to the cavity piece 26 and separated (floating) from the upper surface of the lower plate 24.

In the present embodiment, the lower mold 14 has a cavity 16 recessed from the mold surface (parting surface) 14a, but the cavity piece 26 constitutes the inner portion (bottom portion) of the cavity 16 and the clamper 28 is on the side of the cavity 16. Make up the part. Specifically, a parting plane view (plan view) circular through hole 28a is formed in the central portion of the clamper 28 in the thickness direction (mold opening / closing direction). By inserting the cavity piece 26 into the through hole 28a of the clamper 28 and assembling the cavity piece 26, the bottom surface and the side surface of the concave cavity 16 are formed. The upper surface of the cavity 16 is surrounded by the work W mounted on the upper mold 12.

Here, the cavity 16 communicates with the decompression device (not shown) via an air vent groove (not shown) formed on the mold surface 14a on the upper surface of the clamper 28 of the lower mold 14. The entire mold mold 10 may be placed in a decompression chamber (not shown) to reduce the pressure, or a suction hole (not shown) leading to an air vent groove on the mold surface 14a is provided, and a suction hole on the mold surface 14a is further provided. The structure may be such that an all-around seal (not shown) is provided on the outside of the. According to this configuration, the inside of the cavity 16 can be degassed in a closed state by driving the decompression device to reduce the pressure. As an example of the decompression device, a known vacuum pump or the like is used.

Further, the resin mold mold 10 includes a film suction mechanism that sucks the release film (hereinafter abbreviated as “film”) F from the mold surface 14a side of the lower mold 14. This film suction mechanism communicates with a decompression device (not shown) via suction paths 14b and 14c arranged so as to penetrate the clamper 28. Specifically, one end of the suction paths 14b and 14c leads to the mold surface 14a of the lower mold 14, and the other end is connected to a decompression device arranged outside the lower mold 14. According to this configuration, the decompression device can be driven to suck the film F from the suction paths 14b and 14c, and the film F can be sucked and held (attached) to the mold surface 14a including the inner surface of the cavity 16. .. Similar to the above, a known vacuum pump or the like is used as an example of the decompression device.

By providing the film F that covers the mold surface 14a of the lower mold 14 including the inner surface of the cavity 16 in this way, the molded product (work W) can be easily peeled off from the resin, so that the resin mold mold 10 Can be easily removed from. As an example, the film F is a film material having heat resistance that can withstand the heating temperature of the resin mold mold 10, easily peeling from the resin, and having flexibility and extensibility. Specifically, for example, a resin film such as PTFE (polytetrafluoroethylene) or ETFE (polytetrafluoroethylene polymer) can be used.

Further, the resin mold mold 10 includes a fourth urging member (for example, a spring such as a coil spring) 32 as a movable member (elastic member). The fourth urging member 32 is provided between the lower plate 24 and the clamper 28. The clamper 28 is movably assembled to the lower plate 24 via the fourth urging member 32. That is, the cavity piece 26 is surrounded by the clamper 28, and the cavity piece 26 and the clamper 28 can reciprocate relatively in the mold opening / closing direction. At this time, the clamper 28 moves smoothly because the gap between the inner peripheral surface of the through hole 28a of the clamper 28 and the outer peripheral surface of the cavity piece 26 is secured with a predetermined dimension. In this way, in the resin mold mold 10, the cavity piece 26 is fixed and held with respect to the lower plate 24, while the clamper 28 is separated (floating) via the fourth urging member 32 so as to move. Is held.

By the way, the above-mentioned gap is included in the suction path 14c of the above-mentioned film suction mechanism, and the film F is sucked at the boundary between the cavity piece 26 and the clamper 28 (the corner portion of the cavity 16). Therefore, the film suction mechanism includes a sealing member 34 (for example, an O-ring). The seal member 34 is provided between the cavity piece 26 and the clamper 28 (lower part) so that the above gap serves as a suction path 14c so that air does not leak, and seals the member 34.

Further, the lower mold 14 is provided with a heater (for example, an electric heater), an auxiliary heater (for example, an electric heater), a temperature sensor, a control unit, a power supply, and the like (all not shown), and heating and control thereof are performed. As an example, the heater of the lower mold 14 is built in the lower plate 24 of the lower mold 14 and mainly applies heat to the entire lower mold 14. Further, the auxiliary heater is built in the clamper 28, and auxiliary heat is applied to the clamper 28 in which the heat from the heater of the lower mold 14 is difficult to be transferred. The heater and auxiliary heater of the lower mold 14 receive electric power from a power source to generate heat. As an example, the lower mold 14 is adjusted to a predetermined temperature (for example, 180 ° C.) by a heater and an auxiliary heater and heated. As another example, an upper mold base is provided on the upper mold 12, a lower mold base is provided under the lower mold 14, a heater is provided in the mold base, and the lower plate 24, the cavity piece 26, and the clamper 28 are provided. May not be provided with a heater (not shown).

Next, the upper mold 12 of the resin mold mold 10 will be specifically described. The upper mold 12 includes a lower plate 24, a cavity plate 36, and the like, and is configured by assembling these.

In the upper mold 12, the cavity plate 36 is used instead of the cavity piece 26 fixed to the lower plate 24 of the lower mold 14 and the movable clamper 28 described above. The cavity plate 36 is fixedly assembled to the lower surface of the lower plate 24 (the surface on the lower mold 14 side).

Further, the upper mold 12 is provided with a heater (for example, an electric heater), a temperature sensor, a control unit, a power supply, and the like (all not shown), and heating and control thereof are performed. As an example, the heater of the upper mold 12 is built in the upper plate 22 of the upper mold 12 and mainly applies heat to the entire upper mold 12. The heater of the upper mold 12 receives electric power from a power source and generates heat. As an example, the upper mold 12 is adjusted to a predetermined temperature (for example, 180 ° C.) by a heater and heated. As described above, there are cases where a heater is provided in the upper mold base and no heater is provided in the cavity plate 36 and the upper plate 22. In this case, since the mold mold 10 is not provided with a heater, there is an advantage that the mold mold 10 can be easily replaced when the product type is replaced.

Further, the upper die 12 includes a work support mechanism 20 that supports the work W. The work support mechanism 20 is provided on the cavity plate 36 facing the cavity 16 as an example. The work support mechanism 20 according to the present embodiment includes a suction mechanism 40 that sucks and holds the upper surface of the work W, and a chucking mechanism 50 that holds the outer edge of the work W by sandwiching it.

Here, the suction mechanism 40 is urged downward by a first urging member (for example, a spring such as a coil spring) 42 that generates an urging force, and the lower end 44a is the mold surface of the upper mold 12 when the mold is opened. (Parting surface) Supported by the upper mold 12 so that the lower end 44a can move up and down between the position protruding below 12a and the same position as the mold surface 12a of the upper mold 12 when the mold is closed. A suction pipe 44 is provided. The suction pipe 44 communicates with a decompression device (not shown) via a suction path 46 arranged so as to penetrate the cavity plate 36 and the lower plate 24. According to this configuration, the decompression device is driven to suck the work W from the suction pipe 44, and the work W is held at a position protruding downward from the mold surface (parting surface) 12a of the upper mold by the lower end 44a thereof. it can. Similar to the above, a known vacuum pump or the like is used as an example of the decompression device.

The shape of the lower end of the suction pipe 44 that abuts on the work W and performs suction may be an annular shape having a pipe line in the center as in the example shown in FIG. 4 (a), or as shown in FIG. 4 (b). As in the other example shown, it may have a rectangular shape having a pipeline in the center and a counterbore in the periphery thereof. Although an example in which one hole of the pipeline is provided in the center is described, a plurality of holes may be provided (not shown).

On the other hand, the chucking mechanism 50 is urged downward by a third urging member (for example, a spring such as a coil spring) 56 that generates an urging force, and can be brought into contact with and separated from the outer edge of the work W (for example). In this embodiment, a chucking claw 52 that is rotatable) and holds the outer edge by sandwiching the outer edge is provided. As an example, the chucking claw 52 is provided with a holding portion 52a (groove in the present embodiment) that abuts on the outer edge of the work W near the lower end 52b, and the holding portion 52a is the mold surface of the upper mold 12 when the mold is opened. The work W is held at a position separated from the (parting surface) 12a by a predetermined distance, and the work W is released at a position close to the mold surface 12a of the upper mold 12 when the mold is closed. That is, the chucking claw 52 is at least a holding position of the work W separated from the mold surface 12a of the upper mold 12 by a predetermined distance and a release position of the work W approaching the mold surface 12a of the upper mold 12 by a predetermined distance. It is configured to be supported by the upper mold 12 so that it can move up and down between the two. When the resin mold is performed, the mold surface 14a of the lower mold 14 and the mold surface 12a of the upper mold 12 come into contact with each other (here, they come into contact with each other via the film F). The chucking claw 52 has a configuration in which the lower end 52b of the king claw 52 can be moved to the same position as the mold surface 12a of the upper mold 12, or a relief groove (not shown) is provided in the clamper 28 of the lower mold 14. It is preferable that the lower end 52b is movable to a position below the mold surface 14a of the lower mold 14.

Here, the chucking mechanism 50 uses a second urging member (for example, a spring such as a coil spring) 54 that urges the holding portion 52a of the chucking claw 52 in a direction of approaching (contacting) the outer edge of the work W. Have. According to this configuration, the chucking claw 52 can be kept in a state in which the holding portion 52a is in contact with the outer edge of the work W, that is, the work W is sandwiched.

Further, the chucking mechanism 50 has a push pin 60 that rotates the holding portion 52a of the chucking claw 52 in a direction away from the outer edge of the work W. As an example, the push pin 60 is supported so as to be vertically movable by a support frame 58 that supports the chucking claw 52, and the upper end 60a hits a projecting portion 52c that causes the chucking claw 52 to generate the above-mentioned rotational power. The lower end 60b is arranged so as to be in contact with the lower mold 14 (as an example, the clamper 28) so as to be in contact with the lower die 14 (here, the contact is made via the film F). According to this configuration, when the lower mold 14 approaches the upper mold 12 when the mold is closed, the lower mold 14 (here, the clamper 28) comes into contact with the lower end 60b of the push pin 60, and the push pin 60 is moved. Pushed upwards. As a result, the upper end 60a of the pushing pin 60 is pushed while being in contact with the protruding portion 52c of the chucking claw 52, and the holding portion 52a of the chucking claw 52 is rotated in a direction away from the outer edge of the work W. Therefore, when the approach distance between the lower die 14 and the upper die 12 reaches a predetermined dimension, the holding portion 52a of the chucking claw 52 separates from the work W, and an action of releasing the work W can be obtained.

As a modification, as shown in FIG. 5, the chucking claw 52 and the second urging member 54 may be arranged, and the same effect as described above can be obtained.

As described above, when the mold is opened, the work W can be held at a position separated from the mold surface (parting surface) 12a of the upper mold 12 by a predetermined distance, so that the upper mold 12 can be preheated to a predetermined temperature. Even when heated, it is difficult for heat to be transferred from the mold surface 12a of the upper mold 12 to the adhesive tape of the work W, and the displacement of Wb such as a semiconductor chip can be prevented. On the other hand, when the mold is closed, the work W supported by the work support mechanism 20 (here, the chucking mechanism 50) is released by simply bringing the lower mold 14 closer to the upper mold 12. The work W can be brought into close contact with the mold surface 12a of the upper mold 12, and high-quality resin molding can be performed under predetermined temperature conditions. As described above, it has great technical significance in that the above effects are achieved by an extremely simple mechanical mechanism without requiring a complicated mechanism or complicated electrical control.

(Second embodiment)
Subsequently, the resin mold mold 10 according to the second embodiment of the present invention will be described. The resin mold mold 10 according to the present embodiment has the same basic configuration as the resin mold mold 10 according to the first embodiment described above, but is particularly different in the configuration of the chucking mechanism. Hereinafter, the present embodiment will be described with a focus on the differences.

FIG. 6 shows a schematic view of the resin mold mold 10 according to the present embodiment (a diagram of the position corresponding to FIG. 3 in the above-mentioned first embodiment).

As shown in FIG. 6, the chucking mechanism 70 in the resin mold mold 10 of the present embodiment is urged downward by a third urging member (for example, a spring such as a coil spring) 56 that generates an urging force. In addition, a chucking claw 72 that can move in contact with and separate from the outer edge of the work W (in this embodiment, can move back and forth (left and right)) and holds the outer edge in between is provided. .. As an example, the chucking claw 72 is provided with a holding portion 72a that abuts on the outer edge of the work W near the lower end 72b, and the holding portion 72a starts from the mold surface (parting surface) 12a of the upper mold 12 when the mold is opened. The work W is held at a position separated by a predetermined distance, and the work W is released at a position close to the mold surface 12a of the upper mold 12 when the mold is closed. That is, the chucking claw 72 is at least a holding position of the work W separated from the mold surface 12a of the upper mold 12 by a predetermined distance and a release position of the work W approaching the mold surface 12a of the upper mold 12 by a predetermined distance. It is configured to be supported by the upper mold 12 so that it can move up and down between the two. When the resin mold is performed, the mold surface 14a of the lower mold 14 and the mold surface 12a of the upper mold 12 come into contact with each other (here, they come into contact with each other via the film F). The lower end 72b of the king claw 72 can be moved to the same position as the mold surface 12a of the upper mold 12, or the lower end of the chucking claw is provided with a relief groove (not shown) in the clamper 28 of the lower mold 14. It is preferable that the 72b is movable to a position below the mold surface 14a of the lower mold 14.

Here, the chucking mechanism 70 uses a second urging member (for example, a spring such as a coil spring) 54 that urges the holding portion 72a of the chucking claw 72 in a direction of approaching (contacting) the outer edge of the work W. Have. According to this configuration, the chucking claw 72 can be kept in a state where the holding portion 72a is in contact with the outer edge of the work W, that is, the work W is sandwiched. The holding portion 72a according to the present embodiment has a configuration in which an anti-slip member using rubber or the like is fitted to the lower end 72b of the chucking claw 72. According to this configuration, the holding portion 72a can be pressed against the work W to hold the chucking claw 72 by applying a predetermined urging force to the chucking claw 72 by the second urging member 54.

Further, the chucking mechanism 70 has a pushing pin 80 that moves the holding portion 72a of the chucking claw 72 in a direction away from the outer edge of the work W. As an example, the push pin 80 is supported (fixed) by the clamper 28 of the lower mold 14 and is configured to be vertically movable along with the lower mold 14, and the upper end 80a applies the above-mentioned moving force to the chucking claw 72. It is arranged so as to be in contact with the tapered surface 72c to be generated. According to this configuration, when the lower mold 14 approaches the upper mold 12 when the mold is closed, the upper end 80a of the push pin 80 supported by the lower mold 14 (here, the clamper 28) tapers the chucking claw 72. By pushing while abutting against the surface 72c, the holding portion 72a of the chucking claw 72 is moved in a direction away from the outer edge of the work W. Therefore, when the approach distance between the lower die 14 and the upper die 12 reaches a predetermined dimension, the holding portion 72a of the chucking claw 72 separates from the work W, and an action of releasing the work W can be obtained.

As described above, the resin mold mold 10 according to the present embodiment can also obtain the same action and effect as the resin mold mold 10 according to the first embodiment described above.

(Third embodiment)
Subsequently, the resin mold mold 10 according to the third embodiment of the present invention will be described. The resin mold mold 10 according to the present embodiment has the same basic configuration as the resin mold mold 10 according to the first embodiment described above, but is particularly different in the configuration of the upper mold. Hereinafter, the present embodiment will be described with a focus on the differences.

FIG. 7 and 8 show schematic views of the resin mold mold 10 according to the present embodiment (figures of positions corresponding to FIGS. 1 and 2 in the above-mentioned first embodiment).

As described above, the upper mold 18 of the resin mold mold 10 according to the present embodiment is a configuration example used for the work W when the carrier plate Wa to which the semiconductor chip or the like Wb is attached is rectangular. Since the other basic configurations and working effects are the same as those of the resin mold mold 10 according to the first embodiment described above, the description thereof will be omitted.

A modified example of the upper mold 18 is shown in FIG. As described above, the configuration of the upper die 18 may be appropriately changed according to the size and shape of the work W (particularly the carrier plate Wa or the like).

As described above, according to the resin mold mold according to the present invention, the work support mechanism is provided on the upper mold, and the work is supported by being separated from the mold surface of the upper mold by a predetermined distance when the mold is opened. In addition, a simple mechanism can be used to realize a configuration in which the work can be brought into close contact with the mold surface of the upper mold when the mold is closed. Therefore, in the process of carrying the work in which the semiconductor chip or the like is attached to the carrier plate using the heat-removable adhesive tape into the heated mold and molding the resin, heat conduction from the mold surface is performed. Since it is possible to prevent a decrease in the adhesive strength of the adhesive tape, it is possible to prevent a problem that the semiconductor chip or the like is misaligned due to the flow of the resin or the like.

The present invention is not limited to the examples described above, and various modifications can be made without departing from the present invention. In particular, the configuration in which the semiconductor chip is mounted on the carrier plate as the work has been described as an example, but the present invention is not limited to this. For example, a work using another substrate or the like instead of a carrier plate as a mounted member, or a work using another element or the like instead of a semiconductor chip as a mounted member can be similarly resin-molded. ..

10 Resin mold molds 12, 18 Upper mold 14 Lower mold 16 Cavity 20 Work support mechanism 22 Upper plate 24 Lower plate 26 Cavity piece 28 Clamper 32 Fourth urging member 36 Cavity plate 40 Suction mechanism 42 First urging member 44 Suction Tube 46 Suction path 50, 70 Chucking mechanism 52, 72 Chucking claw 54 Second urging member 56 Third urging member 60, 80 Pushing pin F Film R Mold resin W Work Wa Carrier plate Wb Semiconductor chip

Claims (4)

A resin mold that molds the work with resin.
An upper mold provided with a work support mechanism for supporting the work, and
A lower mold provided with a cavity for sealing the insert on the work is provided.
The work support mechanism has a suction mechanism that sucks and holds the upper surface of the work, and a chucking mechanism that holds the outer edge of the work by sandwiching it.
The suction mechanism is urged downward by the first urging member, and between a position where the lower end protrudes downward from the mold surface of the upper mold and a position which is the same as the mold surface of the upper mold. It has a suction tube supported by the upper mold so that it can move up and down.
The chucking mechanism is movable in contact with and detached from the outer edge of the work, and is separated from the mold surface of the upper mold by a predetermined distance from the holding position of the work and a predetermined distance to the mold surface of the upper mold. state until have a supported chucking claws on the upper mold so as to be vertically movable between a release position of the workpiece in close proximity, the chucking pawls when the mold is closed to release the workpiece at said release position A resin mold mold characterized by being configured to be <br />. The resin mold mold according to claim 1, wherein the chucking mechanism has a second urging member that urges the chucking claw in a direction approaching the outer edge of the work. The chucking mechanism is provided with a pushing pin in which the chucking claw is rotatably supported by the upper die and the chucking claw is rotated in a direction away from the outer edge of the work. The resin mold mold according to claim 1 or 2, wherein the resin mold mold is characterized. In the chucking mechanism, the chucking claw is supported by the upper mold so as to be movable left and right, and the tapered surface provided on the chucking claw is pushed to separate the chucking claw from the outer edge of the work. The resin mold mold according to claim 1 or 2, wherein a pushing pin for moving in a direction is provided.

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