JP6856314B2 - Resin molding mold - Google Patents

Description

The present invention relates to a technique that is effective when applied to a resin molding die.

Japanese Unexamined Patent Publication No. 2010-179507 (Patent Document 1) describes heaters built in each of the upper mold pressurizing block and the lower mold base (particularly, see paragraphs [0016] and [0018] thereof). ).

JP-A-2010-179507

The resin molding mold is configured by assembling a plurality of mold blocks (also referred to as mold plates) so as to have a cavity (resin molding space) in a closed state. In the resin molding mold, for example, a detachable (replaceable) mold block such as a chase or a clamper is attached to the base. Further, the resin molding mold has a built-in heater, and the entire mold including the removable mold block such as a chase is heated by the heater so that heat is applied to the resin filled in the cavity.

By the way, in the resin molding die, the cavity piece is fixedly held with respect to the chase held by the base containing the heater, while being separated and held via the spring member so that the clamper can move. There are some (see, for example, Patent Document 1). Since this resin molding die does not have a configuration in which heat from the base is directly transferred to the clamper, the clamper is less likely to receive heat from the heater, and a temperature difference between the clamper and the cavity piece occurs. That is, the cavity piece becomes larger than the clamper due to thermal expansion. In particular, the cavity piece for WLP (Wafer Level Package) is large, but it becomes larger than the clamper due to thermal expansion. Therefore, the gap between the cavity piece and the clamper is not secured with a desired size and becomes smaller. As a result, for example, the sliding resistance of the clamper may increase, causing a malfunction of the clamper.

An object of the present invention is to provide a technique capable of securing a gap between mold blocks. The above and other objects and novel features of the present invention will become apparent from the description and accompanying drawings herein.

The resin molding mold according to one solution of the present invention is a second mold block (for example, a cavity) which is fixedly assembled to a first mold block (for example, a base) and heats a resin. A piece), a third mold block (for example, a clamper) arranged adjacent to the cavity piece and surrounding the outer periphery and assembled separately from the base, and a base heater built in the base. built into the clamper, and Kuranpahita you heat the clamper so as to raise the temperature of the clamper when the sliding resistance of the clamper is high relative to the cavity piece, the gap between the cavity piece and the clamper A film suction mechanism that attracts the release film to the parting surface via the spring member and a spring member are provided, and the clamper is assembled to the base via the spring member so that the clamper can move. ..

According to this, since the third mold block becomes susceptible to heat and is thermally expanded together with the second mold block, a gap between the second mold block and the third mold block can be secured.

In the resin molding mold according to the one solution, the second mold block is surrounded by the third mold block formed in an annular shape, and the third mold block is formed in a linear shape. It is preferable that the heater is provided in an annular shape surrounding the second mold block. According to this, the entire third mold block can be heated around the second mold block.

In the resin molding mold according to the one solution, the third mold block includes a first division portion and a second division portion that are divided in the mold opening / closing direction, and the first division portion is provided with respect to the second division portion. It is more preferable that the dividing portion is provided on the side of the first mold block, and the second heater is housed in the first dividing portion. According to this, the second heater can be easily attached and detached.

E Bei the spring member as described above, according to the configuration in which the first mold block through the spring member and the (base) third mold block (clamper) are assembled spaced apart so as to movable, first Heat is transferred from both the 1st mold block (base) and the 3rd mold block (clamper), and the spring member can be stabilized.

The effects obtained by representative of the inventions disclosed in the present application will be briefly described as follows. According to the resin molding mold according to one solution of the present invention, it is possible to secure a gap between the second mold block (cavity piece) and the third mold block (clamper).

It is a schematic cross-sectional view of the resin molding die in one Embodiment of this invention. It is a schematic cross-sectional view of the resin molding die in the operation following FIG. It is a schematic cross-sectional view of the resin molding die in the operation following FIG. It is a schematic cross-sectional view of the resin molding die in the operation following FIG. It is explanatory drawing of the heater and the auxiliary heater of the resin molding mold shown in FIG. It is explanatory drawing of the heater and the auxiliary heater of the resin molding mold shown in FIG.

In the following embodiments of the present invention, if necessary, the description will be divided into a plurality of sections and the like, but in principle, they are not unrelated to each other, and one is related to a part or all of the other, such as modifications and details. It is in. Therefore, in all the drawings, members having the same function are designated by the same reference numerals, and the repeated description thereof will be omitted. In addition, the number of components (including the number, numerical value, quantity, range, etc.) is limited to a specific number unless otherwise specified or clearly limited to a specific number in principle. It is not a thing, and may be more than or less than a specific number. In addition, when referring to the shape of a component, etc., it shall include those that are substantially similar to or similar to the shape, etc., unless otherwise specified or when it is considered that this is not the case in principle. ..

The resin molding die 10 (also referred to as a resin molding die mechanism) according to the present embodiment will be described with reference to FIGS. 1 to 7. 1 to 4 are schematic cross-sectional views of the resin molding die 10, and show a series of operating states. According to the operation of the resin molding die 10, the work W is resin-molded from the state of the product to be molded to the state of the molded product 100 (see FIG. 4). Further, FIG. 5 is an explanatory view of the heater 20 and the auxiliary heater 50 of the resin molding die 10, and is a schematic plan view of the lower mold 14 in the parting plane view (plan view). Further, FIG. 6 is an explanatory view of the heater 20 and the auxiliary heater 50 of the resin molding die 10, and is a schematic cross-sectional view of the lower die 14.

The resin molding die 10 includes a pair of dies having a cavity C that can be opened and closed (for example, one in which a plurality of mold blocks made of alloy tool steel are assembled). In the present embodiment, of the pair of molds, one mold on the upper side in the vertical direction is the upper mold 12, and the other mold on the lower side is the lower mold 14. The resin molding die 10 is opened and closed when the upper die 12 and the lower die 14 are separated from each other or brought closer to each other. Therefore, the vertical direction is also the mold opening / closing direction. The cavity C in the resin molding die 10 is a resin molding space (see FIG. 4) when the mold is closed, and a recess (this recess) provided in the parting surface 14a of the lower mold 14 when the mold is opened. The time is composed of a cavity recess C'(see FIG. 1). That is, in the resin molding die 10, the opening of the cavity recess C'is closed in the closed state to form the cavity C.

Further, the resin molding mold 10 includes a known mold opening / closing mechanism (not shown) for opening / closing the mold. For example, the mold opening / closing mechanism includes a pair of platens, a plurality of tie bars on which the pair of platens are hung, a drive source (for example, an electric motor) for moving (elevating) the platens, and a drive transmission mechanism (for example, a toggle link). Be prepared. In this mold opening / closing mechanism, the resin molding mold 10 is provided between the pair of platens. In the present embodiment, the fixed upper mold 12 is assembled to the fixed platen (platen fixed to the tie bar), and the movable lower mold 14 is assembled to the movable platen 52 (platen that moves up and down along the tie bar). .. In opening and closing the resin molding mold 10, the upper mold 12 may be a movable mold and the lower mold 14 may be a fixed mold, or both the upper mold 12 and the lower mold 14 may be movable molds. It may be done manually without using.

Further, the resin molding die 10 includes a work set portion 16 in which the work W and the resin R are set (arranged), and a resin set portion (in this embodiment, the cavity recess C'is also used). The work W includes a substrate 102 (for example, a wiring board) and a plurality of mounting components 104 (for example, a semiconductor chip). For example, a plurality of mounting components 104 are surface-mounted (mounted) by arranging them in a matrix on the substrate 102. For example, when the substrate 102 has a circular shape in a plan view, the work W becomes a plate-like body having a circular shape in a plan view as a whole, and can be said to have a plurality of mounting components 104. The resin R is, for example, a thermosetting resin (for example, an epoxy resin containing a filler), and its state may be liquid, powdery, sheet-like, or granular.

The work set portion 16 is provided on the parting surface 12a of the upper mold 12 so as to face the cavity recess C'of the lower mold 14. The work set unit 16 includes a suction path (ventilation path) (not shown) and a suction device (for example, a vacuum pump) leading to the suction path (ventilation path). One end of the suction path leads to the parting surface 12a of the upper die 12, and the other end is connected to a suction device provided outside the upper die 12. According to the work set unit 16, the suction device outside the mold can be driven to suck the work W from the suction path, and the work W can be sucked and held on the parting surface 12a. Further, the work set portion 16 includes a grip portion 18 that grips the work W. By sandwiching the outer peripheral side surface of the work W and gripping the work W, the grip portion 18 can prevent the work W from falling and hold the work W on the parting surface 12a of the upper die 12.

Further, the resin molding die 10 includes a known decompression mechanism (not shown). This decompression mechanism includes, for example, a chamber containing the upper mold 12 and the lower mold 14, and a decompression device (for example, a vacuum pump) leading to the chamber. The decompression mechanism can drive a decompression device outside the chamber to depressurize the inside of the chamber. As a result, the cavity C can be degassed through the air vent groove (not shown) formed on the parting surface 14a of the lower mold 14 even when the mold is closed (see FIG. 3).

Further, the resin molding die 10 includes a heater 20 (for example, an electric heater). The heater 20 is built in each of the upper mold 12 and the lower mold 14. The resin molding die 10 is adjusted to a predetermined temperature (for example, 180 ° C.) by the heater 20 and heated. Further, the resin molding die 10 includes an auxiliary heater 50 (for example, an electric heater) in addition to the heater 20, and this point will be described later.

Further, the resin molding die 10 includes a film F (also referred to as a release film) (see FIG. 2). The film F is provided so as to cover the parting surface 14a of the lower mold 14 including the inner surface of the cavity recess C'. By providing the film F, the molded product 100 (work W) can be easily taken out from the resin molding die 10. The film F is a film material having heat resistance that can withstand the heating temperature of the resin molding die 10 and easily peeling off from the parting surface 14a of the lower mold 14 and having flexibility and extensibility. .. As the film F, for example, a resin film such as PTFE (polytetrafluoroethylene) or ETFE (polytetrafluoroethylene polymer) can be used.

Further, the resin molding die 10 includes a film suction mechanism that sucks the film F from the parting surface 14a side of the lower mold 14. This film suction mechanism includes suction paths 14b and 14c (ventilation paths) that penetrate the clamper 28 and a suction device (for example, a vacuum pump) that is not shown. One end of the suction paths 14b and 14c leads to the parting surface 14a of the lower mold 14, and the other end is connected to a suction device provided outside the lower mold 14. According to this film suction mechanism, the suction device outside the mold is driven to suck the film F from the suction paths 14b and 14c, and the film F is attracted to the parting surface 14a including the inner surface of the cavity recess C'. Can be held (pasted).

Next, the lower die 14 of the resin molding die 10 will be specifically described. The lower mold 14 includes a base 22, a chase 24, a cavity piece 26, a clamper 28, and a holder 30, and is configured by assembling these mold blocks.

The cavity piece 26 is fixedly assembled to the upper surface of the chase 24 (the surface on the upper die 12 side). Further, the clamper 28 is configured in an annular shape so as to surround the cavity piece 26, and is assembled so as to be adjacent to the cavity piece 26 and separated (floating) from the upper surface of the chase 24.

In the present embodiment, the lower mold 14 has a cavity recess C'recessed from the parting surface 14a, but the cavity piece 26 constitutes the inner portion (bottom portion) of the cavity recess C', and the clamper 28 is on the side of the cavity recess C'. Make up the part. Specifically, a parting plane view (plan view) circular through hole 28a is formed in the central portion of the clamper 28 in the thickness direction (mold opening / closing direction). The cavity piece 26 is inserted into the through hole 28a of the clamper 28 and assembled to form the cavity recess C'.

Further, the resin molding die 10 includes a spring member 32 (for example, a coil spring) as a movable member (elastic member). The spring member 32 is provided between the chase 24 and the clamper 28. The clamper 28 is movably assembled to the chase 24 via the spring member 32. That is, the cavity piece 26 is surrounded by the clamper 28, and the cavity piece 26 and the clamper 28 are relatively movable (reciprocating) in the mold opening / closing direction. At this time, the clamper 28 moves smoothly because the gap g (see FIG. 6) between the inner peripheral surface of the through hole 28a of the clamper 28 and the outer peripheral surface of the cavity piece 26 is secured with a predetermined size. In this way, in the resin molding die 10, the cavity piece 26 is fixedly held with respect to the chase 24, while the clamper 28 is separated (floating) via the spring member 32 so as to move. ..

By the way, the gap g is included in the suction path 14c of the film suction mechanism described above, and the film F is sucked at the boundary between the cavity piece 26 and the clamper 28 (the corner portion of the cavity recess C'). Therefore, the film suction mechanism includes a sealing member 34 (for example, an O-ring). The seal member 34 is provided between the cavity piece 26 and the clamper 28 (lower part) so that the gap g serves as a suction path 14c and does not leak air, and seals the member 34.

In the lower mold 14, the chase 24, the cavity piece 26, and the clamper 28 are configured to be easily exchanged (attached / detached) with respect to the base 22 as a set of exchange blocks. Specifically, a holder 30 is provided on the upper surface of the base 22 (the surface on the upper mold 12 side), and the replacement block such as the chase 24 can be easily replaced by the holder 30. The holder 30 can fix (hold) or release the chase 24 (replacement block) by pressing the outer peripheral edge of the chase 24 toward the base 22 side. In the state where the chase 24 is fixed to the base 22, the cavity piece 26 is fixedly assembled to the base 22 via the chase 24, and the clamper 28 is separately assembled to the base 22 via the chase 24. ..

By the way, as shown in FIGS. 5 and 6, the lower mold 14 of the resin molding die 10 includes a heater 20, an auxiliary heater 50, temperature sensors 54 and 56, a control unit 58, and a power supply 60. The heater 20 (for example, an electric heater) of the lower mold 14 is built in the base 22 of the lower mold 14, and mainly applies heat to the entire lower mold 14. Further, the auxiliary heater 50 (for example, an electric heater) is built in the clamper 28, and auxiliary heat is applied to the clamper 28 in which the heat from the heater 20 of the lower mold 14 is difficult to be transferred. The heater 20 and the auxiliary heater 50 of the lower mold 14 receive electric power from the power source 60 to generate heat.

According to such a configuration of the lower mold 14, the clamper 28 is more susceptible to heat, and the temperature difference between the cavity piece 26 and the clamper 28 is reduced, and the clamper 28 is thermally expanded together with the cavity piece 26. Therefore, the gap g between the cavity piece 26 and the clamper 28 can be secured (not too narrow). Therefore, it is possible to prevent the clamper 28 from being immobile. Further, as compared with the configuration in which the auxiliary heater 50 is not provided, the clamper 28 is configured to be heated by the auxiliary heater 50 separately from the heater 20 of the lower mold 14, so that the heater 20 is required to raise the temperature of the clamper 28. It is not necessary to raise the temperature higher than that, and it does not take time to raise the temperature.

Further, by appropriately securing the gap g (suction path 14c) between the cavity piece 26 and the clamper 28, the film F is not sucked at the boundary between the cavity piece 26 and the clamper 28 (the corner portion of the cavity recess C'). Can be prevented. Therefore, the film F can be stably adsorbed on the parting surface 14a.

Further, a spring member 32 is provided between the base 22 containing the heater 20 and the clamper 28 incorporating the auxiliary heater 50, and the spring member 32 allows the clamper 28 to be raised and lowered only by opening and closing the mold. There is. Therefore, the spring member 32 is contracted by tightening the mold, and the depth of the cavity C is variably configured. In such a configuration, if the gap g is not an appropriate width, the sliding resistance between the mold surfaces increases, and an appropriate resin pressure can be applied to the resin R in the cavity C with a specified mold closing force. It is possible that it cannot be done. As described above, even in the compression molding die in which the depth of the cavity C is made variable by the expansion and contraction of the spring member 32, the resin pressure can be made appropriate by appropriately maintaining the gap g, and the production quality. Can be maintained. It should be noted that the configuration in which the depth of the cavity C is variable is not limited to the spring member 32, but the cavity piece 26 and the clamper 28 are relative to each other by a motor other than the mold opening / closing mechanism, a power such as hydraulic pressure or air pressure. The position may be variable.

Further, since the auxiliary heater 50, which is a heat source, is built in the clamper 28 forming the side portion of the cavity recess C', temperature variation (temperature drop) on the cavity C surface due to heat dissipation from the cavity piece 26 can be suppressed. it can. In the configuration in which the cavity C is provided in the lower mold 14 as in the present embodiment, the heat on the surface of the cavity piece 26 is diffused upward, so that heat is easily dissipated. Further, assuming a configuration in which the clamper 28 is not provided with the auxiliary heater 50, it is easier to dissipate heat on the outside than on the center of the cavity piece 26, so that the temperature at the center of the cavity piece 26 is high and the temperature on the outside is high. It tends to be in a biased state such that it becomes low. On the other hand, by providing the auxiliary heater 50, it is possible to suppress heat dissipation on the outside of the cavity piece 26 and reduce the difference between the temperature at the center and the temperature on the outside in the cavity C. As a result, the thermosetting resin R filled in the cavity C can be optimally thermoset. That is, it is possible to manufacture a molded product 100 (work W) having excellent molding quality.

Further, the temperature sensor 54 (for example, a thermocouple) is provided so as to be inserted into a hole provided in the chase 24 of the lower mold 14, and the temperature of the base 22 heated by the heater 20 of the lower mold 14 is measured. As a result, the temperature of the chase 24 of the lower mold 14 that receives heat from the base 22 can be indirectly measured. Further, the temperature sensor 56 (for example, a thermocouple) is provided so as to be inserted into a hole provided in the clamper 28, and measures the temperature of the clamper 28 which is also heated by the auxiliary heater 50. These temperature sensors 54 and 56 are connected to the control unit 58 via an appropriate conversion function unit (not shown). Further, the control unit 58 controls the power supply 60 that operates the heater 20 and the auxiliary heater 50. The control unit 58 controls the power supply to the heater 20 and the auxiliary heater 50 of the lower mold 14 based on the measurement data of the temperature sensors 54 and 56. When the clamper 28 is awkward to slide with respect to the cavity piece 26 (sliding resistance is high), the control unit 58 raises the temperature of the auxiliary heater 50 in order to raise the temperature of the clamper 28. The power supply 60 may be controlled.

As the auxiliary heater 50 (shown by a broken line in FIG. 5), a linear (thin tubular) heater that can be deformed relatively freely (flexibly) in shape can be used. Such an auxiliary heater 50 is provided on the clamper 28 in an annular shape surrounding the cavity piece 26 by arranging the auxiliary heater 50 so as to be wound so as to be wound at a predetermined distance from the cavity piece 26. When the linear heater is wound to form an annular shape, it may be wound a plurality of times so as to have a spiral shape in a plan view, or it may be wound only once. The heater wires may be wound so as to overlap in the vertical direction. By using the annular auxiliary heater 50 in this way, the entire clamper 28 can be uniformly heated around the cavity piece 26. In this case, the temperature around the cavity recess C'can be adjusted to be uniform, whereby the thermosetting resin R can be uniformly heated. That is, it is possible to manufacture a molded product 100 (work W) having excellent molding quality.

Further, the clamper 28 containing the auxiliary heater 50 includes a split portion 28A and a split portion 28B that are divided in the mold opening / closing direction, and is composed of these. In other words, the clamper 28 is configured to be divisible into two upper and lower members. The division portion 28A is provided on the base 22 side with respect to the division portion 28B. Through holes forming the suction paths 14b and 14c are formed in the divided portion 28B. On the other hand, the auxiliary heater 50 is housed in the split portion 28A. Specifically, a groove is formed on the separation surface between the split portion 28A and the split portion 28B, and the auxiliary heater 50 is housed in the groove. Since the clamper 28 can be divided in this way, the auxiliary heater 50 can be easily attached / detached (replaced). Further, the position of the separation surface between the split portion 28A and the split portion 28B is preferably arranged below the center in the height direction as a whole in order to uniformly heat the clamper 28 itself.

Next, the upper die 12 of the resin molding die 10 will be specifically described. The upper mold 12 includes a base 22, a chase 24, an insert 36, and a holder 30, and is configured by assembling these mold blocks. In the upper mold 12, the insert 36 is used instead of the cavity piece 26 fixed to the base 22 (chase 24) of the lower mold 14 and the movable clamper 28 described above. The insert 36 is fixedly assembled to the lower surface of the chase 24 (the surface on the lower mold 14 side). In the upper mold 12, the chase 24 and the insert 36 are configured to be easily exchanged (attached / detached) with respect to the base 22 by the holder 30 as a set of exchange blocks.

Next, the operation (step of the resin molding method) of the resin molding die 10 as compression molding according to the present embodiment will be described.

First, as shown in FIG. 1, a resin molding die 10 including the above-mentioned pair of molds (upper mold 12 and lower mold 14) that can be opened and closed is prepared. In the resin molding die 10, the upper die 12 and the lower die 14 are heated to a predetermined temperature (for example, about 150 ° C.) by the heater 20 and the auxiliary heater 50. Here, with the resin molding die 10 opened, the temperatures at several points on the upper surface of the cavity piece 26 (the surface on the upper die 12 side) are measured. For example, when the temperature of the outer edge portion of the upper surface of the cavity piece 26 is lower than that of the central portion, that is, when the temperature difference between the facing cavity piece 26 and the clamper 28 becomes large, the output of the auxiliary heater 50 built in the clamper 28 is output. By adjusting the temperature by raising the temperature, it is possible to prevent the gap g from becoming narrow. Here, for example, by sucking air from the suction path 14c through the gap g, the gap g is calculated by measuring the resistance (output) of the motor that drives the pump of the suction device, and whether the gap g is appropriate or not. May be judged.

Further, the work W is set in the work set portion 16 in a state where the resin molding die 10 is opened. Specifically, the work W is transported to the parting surface 12a of the upper die 12 by, for example, a loader (conveying mechanism) (not shown). Then, the work W is sucked by a suction path (not shown) with the mounting component 104 facing the lower mold 14, and is gripped by the grip portion 18 and set in the work set portion 16.

Subsequently, as shown in FIG. 2, in a state where the resin molding die 10 is opened, the film F is set so as to cover the parting surface 14a of the lower die 14 including the inner surface of the cavity recess C'. Specifically, in the lower mold 14, the film F is provided so as to be drawn out from the feeding roll wound in a roll shape, pass through the parting surface 14a of the lower mold 14, and be wound on the winding roll. Be done. Then, the film F is sucked into the suction passages 14b and 14c of the film suction mechanism and is sucked and held (attached) to the parting surface 14a of the lower mold 14 including the inner surface of the cavity recess C'.

As described above, since the auxiliary heater 50 is adjusted so that the temperature difference between the cavity piece 26 and the clamper 28 becomes small, the gap g constituting the suction path 14c is secured with a predetermined dimension. Therefore, the film suction mechanism can suck the film F through the suction paths 14b and 14c and stably suck the film F on the parting surface 14a.

Further, in the state where the resin molding die 10 is opened, the resin R is set in the cavity recess C'which is the resin setting portion. For example, when the resin R is in the form of granules, the resin R is dropped into the cavity recess C'by a dispenser (not shown). At this time, since the film F is adsorbed so as to cover the inner surface of the cavity recess C', the resin R does not leak from the gap g. Further, the film F and the resin R can be supplied integrally. That is, the film F is prepared outside the resin molding die 10, and the resin R is supplied onto the film F. Next, if the film F to which the resin R is supplied is held and conveyed and placed on the lower mold 14, the film F and the resin R can be integrally supplied.

Subsequently, the resin molding die 10 is closed (the upper die 12 and the lower die 14 are brought closer to each other), and as shown in FIG. 3, the upper surface of the clamper 28 (the upper surface of the clamper 28) is placed on the parting surface 12a of the upper die 12. That is, the parting surface 14a) of the lower mold 14 is applied to clamp the mold. As a result, the opening of the cavity recess C'recessed from the parting surface 14a of the lower mold 14 is closed to form the cavity C. By driving the decompression mechanism before the opening of the cavity recess C'is closed, the cavity C can be smoothly degassed.

By the way, since the work W is provided on the parting surface 12a of the upper mold 12 and the film F is provided on the parting surface 14a of the lower mold 14, the work is provided through the film F when the mold is clamped. W (board 102) is clamped by the clamper 28. Therefore, in reality, the opening of the cavity recess C'of the lower mold 14 is closed by the substrate 102 of the work W, and the mounting component 104 of the work W is housed in the cavity C.

Subsequently, the resin molding die 10 is further closed, and as shown in FIG. 4, the resin R is pressurized (compressed) so that the cavity C is filled with the resin R. Specifically, it is fixed to the base 22 of the lower mold 14 in a state where the upper surface of the clamper 28 of the lower mold 14 (parting surface 14a of the lower mold 14) is applied to the parting surface 12a of the upper mold 12. The resin R is pressurized when the cavity piece 26 is brought closer to the cavity piece 26. At this time, the clamper 28 held by the base 22 via the spring member 32 is moved (sliding) relative to the cavity piece 26 by the spring member 32 being urged (pressed and contracted). It becomes.

As described above, since the auxiliary heater 50 is adjusted so that the temperature difference between the cavity piece 26 and the clamper 28 becomes small, the gap g between the cavity piece 26 and the clamper 28 is secured with a predetermined dimension. Therefore, the clamper 28 can move smoothly (slide with respect to the cavity piece 26).

Next, the resin R filled in the cavity C is heat-cured in a state of holding pressure, and then the mold is opened and the work W is taken out from the resin molding die 10. After that, by further heat-curing (post-curing) the work W, the molded product 100 in which the mounting component 104 is sealed with the resin R is substantially completed. According to the resin molding die 10, the clamper 28 can be stably moved, so that the resin R can be compressed with an appropriate pressure to mold the resin.

Although the present invention has been specifically described above based on the embodiments, it goes without saying that the present invention is not limited to the above-described embodiments and can be variously modified without departing from the gist thereof.

In the above embodiment, the case where the auxiliary heater is built in the clamper has been described. Not limited to this, an auxiliary heater (heat source) may be built in the chase. According to this, it is possible to shorten the temperature rising time and reduce the temperature variation of the chase.

In the above embodiment, the plan view shape of the work is circular, but it may be rectangular or polygonal. In addition to the wiring board, the substrate is used for manufacturing wafers used for manufacturing WLP and the like, and FOWLP (Fan-Out Wafer Level Package) such as eWLB (embeded Wafer Level Ball Grid Array). It may be a plate-shaped carrier (metal, glass) on which the semiconductor chip to be mounted is mounted. In such a case, the outer shape of the cavity piece 26 may be rectangular and the clamper 28 may be rectangular. In this case, as for the auxiliary heater 50, the linear heaters are arranged in a rectangular ring in the clamper 28. Further, in addition to the semiconductor chip, the mounting component may be, for example, an active component such as an electronic component, a passive component, a wiring pattern such as a lead frame that requires an exposed terminal, or a wiring block body (for example, a post).

In the above-described embodiment, the case where the cavity piece is fixedly assembled to the base and the clamper is separated and assembled so as to be movable by the spring member has been described. Not limited to this, there may be a case where the clamper is fixedly assembled to the base and the cavity piece is separated and assembled so as to be movable by the spring member. Further, the clamper or the like may be moved by a drive mechanism such as a ball screw without using a spring member.

Further, in the above-described embodiment, the configuration in which a predetermined gap g between the molds can be secured in the lower mold 14 has been described, but the present invention is not limited to this. For example, when the depth of the cavity C is variably configured in the upper mold 12, a predetermined gap g may be secured, and the gap g may be arbitrarily set in both the upper mold 12 and the lower mold 14. It can also be configured to be secured in.

Further, in the above-described embodiment, an example in which the resin molding die 10 is configured as compression molding has been described. However, the resin molding die to which the present invention is applied may be a transfer molding die. That is, even in the transfer molding die in which the resin supplied to the pot is injected into the cavity C, the depth of the cavity C may be variably configured by providing the cavity piece 26 and the clamper 28. Even in such a case, it is possible to appropriately maintain these gaps g so that smooth sliding is possible.

10 Resin molding mold 20 Heater 22 Base 26 Cavity piece 28 Clamper 50 Auxiliary heater

Claims (6)

With the base
A cavity piece that is fixed to the base and assembled to heat the resin,
A clamper that is adjacent to the cavity piece and is arranged around the outer circumference and is assembled separately from the base.
The base heater built into the base and
Built into the clamper, and Kuranpahita you heat the clamper so as to raise the temperature of the clamper when the sliding resistance is high in the clamper with respect to the cavity piece,
A film suction mechanism that attracts the release film to the parting surface through the gap between the cavity piece and the clamper.
With a spring member,
A resin molding die characterized in that the clamper is movably assembled to the base via the spring member. With the base
A cavity piece that is fixed to the base and assembled to heat the resin,
A clamper that is adjacent to the cavity piece and is arranged around the outer circumference and is assembled separately from the base.
The base heater built into the base and
Built into the clamper, and Kuranpahita you heat the clamper so as to raise the temperature of the clamper when the sliding resistance is high in the clamper with respect to the cavity piece,
A film suction mechanism that attracts the release film to the parting surface through the gap between the cavity piece and the clamper.
With a motor, either hydraulic or pneumatic power source,
A resin characterized in that the clamper is movably assembled to the base by the power source, and the depth of the cavity formed to be recessed with respect to the parting surface is variable. Molding mold. In the resin molding die according to claim 1 or 2.
A resin molding die characterized in that the cavity piece and the clamper are assembled to a chase, and the chase is assembled to the base. In the resin molding die according to any one of claims 1 to 3,
The cavity piece is surrounded by the clamper formed in an annular shape, and the cavity piece is surrounded by the clamper.
A resin molding die characterized in that the clamper is provided with the linear clamper heater in an annular shape surrounding the cavity piece. In the resin molding die according to any one of claims 1 to 4.
The clamper includes a first division portion and a second division portion that are divided in the mold opening / closing direction.
The first division is provided on the base side with respect to the second division.
A resin molding die characterized in that the clamper heater is housed in the first divided portion. In the resin molding die according to any one of claims 1 to 5,
A resin molding die further comprising a temperature sensor for measuring the temperature of the base and a temperature sensor for measuring the temperature of the clamper.

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