JP2017094521A - Compression molding method and compression molding apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a compression molding method capable of improving the molding quality when compression molding both surfaces of a workpiece and capable of improving the productivity.SOLUTION: While executing a mold-clamping action of mold dice that are clamping a workpiece W, at least either one of cavity blocks 14 is pushed and moved by a drive transmission unit U in a direction along which a capacity of a cavity 17 is decreased. Resin pressures inside upper and lower die cavities 11 and 17 are measured and, when reaching a prescribed pressure, the clamping action of the mold dice is completed. Then, the resin of the workpiece W is thermally cured while maintaining the final height of the pair of cavities.SELECTED DRAWING: Figure 8

Description

  The present invention relates to a compression molding method and a compression molding apparatus for compressing a workpiece having, for example, a plurality of semiconductor chips mounted on both sides of a substrate.

  For example, a plurality of semiconductor chips and electronic components are mounted on both surfaces of a SiP (System in Package) substrate by planar mounting or stacking in multiple stages. When such a workpiece is resin-molded, one side of the substrate must be resin-sealed with a primary mold, and the other side of the substrate must be resin-sealed with a secondary mold, which requires two steps as the resin molding step. It was.

  The present applicant has already proposed a compression molding method and a compression molding apparatus for resin-sealing a workpiece having chip parts mounted on both sides of a substrate by compression molding. In this method, a work is loaded into one mold surface by a work loader, and a release film and a resin are loaded into the other mold surface by a film loader and compression-molded (see Patent Document 1).

Japanese Patent Laying-Open No. 2015-13371

  In general, in order to resin mold both surfaces of a workpiece, when resin molding is performed through two steps of primary molding and secondary molding, productivity is low and cost is high. In addition, when both sides of the substrate are formed at the same time, a plurality of semiconductor chips and electronic components are mounted on the both sides of the substrate in a plane or stacked in multiple stages, so that the substrate can be clamped when warping occurs. In addition to being difficult, there is a problem that the substrate is easily deformed because of its relatively large size, and the resin filling balance on both surfaces of the substrate is likely to be unbalanced, resulting in a decrease in molding quality.

  An object of the present invention is to provide a compression molding method and a compression molding apparatus capable of solving the above-described problems of the prior art and improving molding quality and productivity when both surfaces of a workpiece are compression molded.

In order to achieve the above object, the present invention comprises the following arrangement.
Resin material for upper mold and lower mold cavities respectively formed in a pair of mold dies provided with a clamper for clamping a work and a cavity block disposed between the clampers and disposed so as to be relatively movable by mold opening / closing operation A method of supplying a first resin material onto the workpiece, and supplying a second resin material into the lower mold cavity of the mold mold that has been opened Carrying the workpiece into the lower mold supplied with the second resin material, clamping the mold to clamp the pair of clampers, and depressurizing the closed cavity space; and at least one of the steps A drive transmission unit that pushes the cavity block, and the drive transmission unit while the mold clamping operation of the mold that clamps the workpiece proceeds. Pressing at least one of the cavity blocks in a direction in which the cavity volume decreases, and measuring the resin pressure in the upper mold and the lower mold cavity to reach a predetermined resin pressure. Completing the mold clamping operation and pushing of the drive transmission unit, and heat-curing the resin of the workpiece while maintaining the final height positions of the upper mold and the lower mold cavity block, and To do.

According to the compression molding method described above, at least one of the cavity blocks is pushed by the drive transmission unit in a direction in which the cavity volume decreases while the mold clamping operation of the mold clamped with the workpiece proceeds, and the upper mold and When the resin pressure in the lower mold cavity is measured and it is detected that the predetermined pressure has been reached, the mold clamping operation of the mold and the cavity block pressing are completed. This reduces the volume of the upper and lower mold cavities while monitoring the resin pressure in the upper and lower mold cavities formed on both sides of the workpiece, so the resin is balanced while filling the resin in the upper and lower mold cavities. Can be molded. Therefore, the workpiece is not warped or deformed, the molding quality is improved, and both surfaces can be resin-molded in a single resin molding step, so that the production cost is reduced and the productivity is improved.
In addition, since the reduction of the volume of the upper and lower cavities can be realized by performing the mold clamping operation of the mold and the pushing of the cavity block by the drive transmission unit in parallel, the compression molding can be performed without making the apparatus configuration complicated and large.

At least one of the upper mold and the lower mold clamper arranged around the upper mold and the lower mold cavity block is supported by a coil spring, and the cavity volume is compressed by a mold clamping operation while the workpiece is clamped. It is preferable.
Thereby, the excessive clamping force and excessive resin pressure which act on a workpiece | work in the state which clamped the workpiece | work with the upper mold | type and the lower mold | type clamper can be absorbed by the bending of a coil spring.

The drive transmission unit may be provided corresponding to each of the upper mold cavity block and the lower mold cavity block.
In this case, the drive power can be transmitted from the drive source to the upper and lower mold cavity blocks via the drive transmission unit to reduce the upper and lower cavity volumes to the final cavity height, improving controllability. To do.

  Resin material for upper mold and lower mold cavities respectively formed in a pair of mold dies provided with a clamper for clamping a work and a cavity block disposed between the clampers and disposed so as to be relatively movable by mold opening / closing operation And a mold opening / closing unit for performing mold opening / closing operation of the mold, and at least one cavity block of the mold is pushed in such a direction that the cavity volume decreases. A drive transmission unit that moves, the first resin material is supplied onto the workpiece, the second resin material is supplied into the lower mold cavity, and the mold opening and closing unit is carried into the mold die by a clamping operation. Clamping operation in which a workpiece is clamped by the pair of clampers and driving of the drive transmission unit to the cavity block Reducing the volume of the upper and lower mold cavity by parallel reaches operation characterized by compression molding.

The volume of the upper mold cavity and the lower mold cavity is obtained by paralleling the clamping operation in which the work carried into the mold die is clamped by the pair of clampers and the drive transmission operation to the cavity block of the drive transmission unit. Is reduced and compression molding is performed.
Thereby, the volume of the upper mold and the lower mold cavity can be simultaneously reduced to perform resin molding while keeping the resin filling balance, and the molding quality can be improved without warping or deformation of the workpiece. Further, resin molding can be performed in cavities that are partitioned by a work and formed on both surfaces of the work in a single molding step, and productivity can be improved.

Each cavity block is supported by a base block, and a plurality of pressing blocks protruding from a movable block are inserted into insertion holes provided in at least one of the base blocks, and the drive transmission unit is The moving position of the movable block includes a pressing standby position where a plurality of pressing blocks are in contact with the cavity block, and a pressing position where the pressing block projects from the insertion hole of the base block to push the cavity block. It is preferable to move between.
As a result, the pressing block moves the cavity block from the pressing standby position to the pressing position to reduce the cavity volume, so that the resin pressure can be applied to the molten resin in the cavity to make the molding quality uniform.

Pressure sensors are provided on the outer peripheral edges facing the cavities of the upper mold and the lower mold cavity block, respectively. When it is detected that the predetermined resin pressure is reached by the detected value of the pressure sensor, the mold of the mold opening / closing unit is detected. It is preferable to stop the tightening operation and the pushing of the drive transmission unit.
As a result, the cavity volume is reduced while monitoring the resin pressure of the upper mold and lower mold cavities formed on both surfaces of the workpiece by the pressure sensor, so that the resin mold is performed while balancing the filling of the resin into the upper mold and the lower mold cavities. be able to. Further, by applying resin pressure to the upper die and the lower die cavity, it is possible to eliminate the unfilled area and perform resin molding.

A pair of chamber blocks that are arranged around the mold and are opened and closed by a mold opening / closing operation, and are compressed by forming a decompression space in the chamber formed by the mold clamping operation of the mold You may make it shape | mold.
As a result, it is not necessary to form a suction path or the like for forming a decompression space in the mold, so that the mold configuration can be simplified and compression molded.

  If the compression molding method and the compression molding apparatus described above are used, it is possible to improve the molding quality and improve the productivity when both surfaces of the workpiece are compression molded.

It is sectional drawing of a workpiece | work and sectional drawing of a molded article. It is explanatory drawing which shows the pre-process which conveys a workpiece | work with a jig | tool. It is sectional drawing which shows the compression molding process of the compression molding apparatus which concerns on a 1st Example. It is sectional drawing which shows the compression molding process of the compression molding apparatus following FIG. It is sectional drawing which shows the compression molding process of the compression molding apparatus following FIG. It is sectional drawing which shows the compression molding process of the compression molding apparatus following FIG. It is sectional drawing which shows the compression molding process of the compression molding apparatus following FIG. It is sectional drawing which shows the compression molding process of the compression molding apparatus following FIG. It is sectional drawing which shows the compression molding process of the compression molding apparatus which concerns on a 2nd Example. It is sectional drawing which shows the compression molding process of the compression molding apparatus following FIG. It is sectional drawing which shows the compression molding process of the compression molding apparatus following FIG. It is sectional drawing which shows the compression molding process of the compression molding apparatus following FIG. It is sectional drawing which shows the compression molding process of the compression molding apparatus following FIG. It is sectional drawing which shows the compression molding process of the compression molding apparatus following FIG. It is sectional drawing which shows the compression molding process of the compression molding apparatus which concerns on a 3rd Example. It is sectional drawing which shows the compression molding process of the compression molding apparatus following FIG. It is sectional drawing which shows the compression molding process of the compression molding apparatus following FIG. It is sectional drawing which shows the compression molding process of the compression molding apparatus following FIG. It is sectional drawing which shows the compression molding process of the compression molding apparatus following FIG. It is sectional drawing which shows the compression molding process of the compression molding apparatus which concerns on 4th Example. It is sectional drawing which shows the compression molding process of the compression molding apparatus following FIG. It is sectional drawing which shows the compression molding process of the compression molding apparatus following FIG. It is sectional drawing which shows the compression molding process of the compression molding apparatus following FIG. It is sectional drawing which shows the compression molding process of the compression molding apparatus following FIG. It is sectional drawing which shows the compression molding process of the compression molding apparatus following FIG. It is sectional drawing of the compression molding apparatus which concerns on 5th Example. It is sectional drawing of the compression molding apparatus which concerns on 6th Example. It is sectional drawing of the compression molding apparatus which concerns on 7th Example.

  Hereinafter, a preferred embodiment of a compression molding apparatus according to the present invention will be described in detail with reference to the accompanying drawings together with the compression molding method. In the following, as a work W, for example, a SiP (System in Package) substrate 2 in which components 1 such as a plurality of semiconductor chips and electronic components are mounted on both surfaces of the substrate as shown in FIG. Shall be. In addition to SiP, a product in which one or more electronic components are mounted on the front and back of the substrate may be used. The electronic component and the substrate may be connected by wire bond or may be flip chip connected. good. Further, as shown in FIG. 1B, a compression molding apparatus in which the resin package part 3 is formed by compression molding both surfaces of the substrate 2 by one compression molding operation will be described. As an example, the compression molding apparatus will be described assuming that the lower mold is a movable mold and the upper mold is a fixed mold. The resin molding apparatus includes a mold opening / closing unit that lifts and lowers the movable platen by a toggle link or the like, but the illustration is omitted, and the configuration of the mold will be mainly described.

FIG. 2A shows an example of the transport unit 4 that carries the workpiece W into the compression molding apparatus. The transport unit 4 is carried into a mold of a compression molding apparatus to be described later while the outer peripheral edge of the substrate 2 is clamped by a pair of upper and lower clamps 4a and 4b.
The holding configuration of the workpiece W by the transport unit 4 is not limited to the clamp, and the workpiece W may be clamped by the outer peripheral edge chuck claw.

  FIG. 2B shows a state in which the first resin material R <b> 1 is supplied to the work upper surface side while the work W is clamped by the transport unit 4. As the first resin material R1, various types of mold resins such as a granular resin, a liquid resin, and a sheet resin are used. Although the first resin material R1 is supplied to the upper surface side of the work outside the compression molding apparatus, the first resin material R1 is supplied to the upper surface side of the work after the work W is loaded into the compression molding apparatus. Also good. Thus, since the first resin material R1 is supplied in advance onto the workpiece W and conveyed to the lower mold 12, the configuration for supplying the first resin material R1 to the upper mold 6 is not necessary, and the mold configuration is reduced. It can be simplified.

  FIG. 2 (C) shows a state in which the first resin material R1 is supplied to the workpiece upper surface side shown in FIG. 2 (B), the preheating unit 5 is placed on the transport unit 4, and the heater 5a makes the first resin. The process of preheating material R1 is shown. For example, a halogen heater is used as the heater 5a. You may make it carry in to a mold metal mold | die, with the preheating unit 5 mounted in this conveyance unit 4. FIG.

When the workpiece W is carried into the compression molding apparatus by the transport unit 4, a difference in heat capacity occurs between the first resin material R1 and the second resin material R2 previously placed in the mold, or the coefficient of thermal expansion Due to the difference, the substrate 2 may be stretched and warped. For this reason, you may make it reduce this malfunction by preheating the workpiece | work W (1st resin material R1) previously.
The conveyance unit 4 may carry only the workpiece W into the mold, or may carry the whole conveyance unit 4 into the mold and compress it.

[First embodiment]
Next, an example of a compression molding apparatus will be described with reference to FIG. The compression molding apparatus includes an upper mold 6 and a lower mold 12 (mold mold) that can be opened and closed.
The configuration of the upper mold 6 will be described. An upper mold cavity block 8 is supported on the upper mold base block 7. An upper mold clamper 9 is provided so as to surround the upper mold cavity block 8. The upper mold clamper 9 is supported by being suspended from the upper mold base block 7 via a coil spring 10. An upper mold cavity 11 is formed by the upper mold cavity block 8 and the upper mold clamper 9 disposed so as to surround the upper mold cavity block 8. The upper mold cavity block 8 is provided so as to be relatively movable with respect to the upper mold clamper 9 when the coil spring 10 is compressed and contracted by a mold opening / closing operation. The sliding surface between the upper mold clamper 9 and the upper mold cavity block 8 may be provided with a sealing material, a resin ring or the like, or the upper mold cavity 11 may be a release film (hereinafter simply referred to as “film”). "). The film has heat resistance and is easily peeled off from the mold surface and has flexibility and extensibility, such as PTFE, ETFE, PET, FEP film, fluorine-impregnated glass cloth, polypropylene film. A monolayer film or a multi-layer film mainly composed of polyvinylidine chloride or the like is preferably used.

  Next, the configuration of the lower mold 12 will be described. A lower mold cavity block 14 is supported on the lower mold base block 13. A lower mold clamper 15 is provided so as to surround the lower mold cavity block 14. The lower mold clamper 15 is floatingly supported on the lower mold base block 13 via a coil spring 16. A lower mold cavity 17 is formed by the lower mold cavity block 14 and the lower mold clamper 15 disposed so as to surround the lower mold cavity block 14. The lower mold cavity block 14 is provided so as to be relatively movable with respect to the lower mold clamper 15 by the coil spring 16 being pressed and shrunk by a mold opening / closing operation. The sliding surface between the lower mold clamper 15 and the lower mold cavity block 14 may be provided with a sealing material, a resin ring, or the like. Alternatively, the lower mold cavity 17 is formed on the film in the same manner as the upper mold cavity 11. It may be covered.

A sealing material 18 (O-ring or the like) is provided on the clamping surface of the lower mold clamper 15. When the sealing material 18 is clamped by the upper mold clamper 9 and the lower mold clamper 15, a space in which the upper mold cavity 11 and the lower mold cavity 17 are closed from the outside of the mold is formed.
In addition, an escape recess 15 a is formed on the clamp surface of the lower mold clamper 15 to escape when the transport unit 4 carries the workpiece W. In addition, the same spring force is used for the coil spring 10 that supports the upper mold clamper 9 and the coil spring 16 that supports the lower mold clamper 15. The lower mold cavity block 14 includes a heater 14a.

  The lower mold base block 13 is provided with insertion holes 13a at a plurality of locations. Each of the pressing blocks 19 is inserted into a plurality of insertion holes 13 a provided in the lower mold base block 13, and the upper end is in contact with the bottom of the lower mold cavity block 14. A plurality of pressing blocks 19 are provided on the movable block 20. The movable block 20 is moved up and down by the drive transmission unit U by a drive source different from the mold opening / closing unit. The drive transmission unit U is provided such that the movable block 20 screwed to a screw shaft that is rotationally driven by, for example, an electric motor is moved up and down. The drive transmission unit U moves the movable block 20 to a position where the plurality of pressing blocks 19 are in contact with the lower mold cavity block 14 and the pressing block 19 is above the insertion hole 13 a of the lower mold base block 13. The lower mold cavity block 14 is protruded and moved between the push-up positions where the lower mold cavity block 14 is pushed up. As a result, the lower mold cavity 15 can be pushed to compress the volume of the lower mold cavity 17.

  The first resin material R1 is supplied onto the workpiece W, and the second resin material R2 is supplied into the lower mold cavity 17, respectively. By parallelizing the clamping operation in which the workpiece W carried into the mold by the clamping operation of the mold opening / closing unit is clamped by the pair of clampers 9 and 15, and the drive transmission operation to the lower mold cavity block 14 of the drive transmission unit U. The pair of cavity volumes 11 and 17 are reduced to perform compression molding. As a result, the volume of the pair of cavities is simultaneously reduced, so that the resin mold can be performed while maintaining the resin filling balance, and the work quality can be improved without warping or deformation of the workpiece W. In addition, it is possible to perform resin molding on the upper mold and the lower mold cavities 11 and 17 formed on both surfaces of the work W by being partitioned by the work W in a single molding step, and productivity can be improved.

  As shown in FIG. 8, pressure sensors 21 are provided on the outer peripheral edge facing the upper mold cavity 11 of the upper mold cavity block 8 and the outer peripheral edge facing the lower mold cavity 17 of the lower mold cavity block 14. It is preferable. Although the illustration of the pressure sensor is omitted from FIG. 3 to FIG. 7, it is assumed that the pressure sensor is mounted. The same applies to the subsequent drawings. When the detection value of the pressure sensor 21 reaches a predetermined resin pressure, it can be determined that the upper mold cavity 11 and the lower mold cavity 17 are filled with melted resin, and the mold clamping operation and drive transmission of the mold opening / closing unit can be determined. The operation of the drive source of the unit U can be stopped and the clamping operation can be terminated. As a result, resin pressure is applied to the upper mold cavity 11 and the lower mold cavity 17 to eliminate the unfilled area of the mold resin, and the resin mold is performed while maintaining the resin filling balance in the upper mold cavity 11 and the lower mold cavity 17. be able to. Since the pressure sensor 21 measures the upper and lower cavity pressures, each sensor is measured to adjust the resin pressure in the upper and lower cavities.

Hereinafter, an example of the compression molding process will be described with reference to FIGS.
First, in FIG. 2B, the first resin material R1 is supplied onto the workpiece W clamped by the transport unit 4. Next, as shown in FIG. 2C, the work W and the first resin material R1 are preheated by superimposing the preheating unit 5 on the transport unit 4. This preheating step may be omitted.

  As shown in FIG. 3, the second resin material R2 is supplied into the lower mold cavity 17 of the mold mold that has been opened. The second resin material R2 is heated and melted by the heater 14a provided in the lower mold cavity block 14. As the second resin material R2, for example, various types of mold resins such as a granular resin, a liquid resin, and a sheet resin are used. The first resin material R1 and the second resin material R2 may use resins having the same form (eg, granule resin and granule resin), or may use different forms (eg, granule resin and sheet resin).

  In FIG. 4, the work W clamped by the transport unit 4 is carried into the lower mold 12 to which the second resin material R2 is supplied. It may be carried in with the preheating unit 5 placed on the transport unit 4 or may be preheated by the preheating unit 5 after the transport unit 4 is loaded. As a result, it is possible to reduce problems caused by the temperature difference between the workpiece W and the first resin material R1 and the mold (such as the progress of the heat curing of the resin material, the warp or deformation of the workpiece). Since the transport unit 4 (clamp portion 4a) is accommodated in a relief recess 15a provided in the lower mold clamper 15, the workpiece can be smoothly transferred to the lower mold clamper 15. Note that the mold may be clamped while the transport unit 4 is set on the lower mold 12 as it is.

  Next, proceeding to FIG. 5, a mold clamping operation of the mold opening / closing unit is started to clamp the mold. In this embodiment, the lower mold 12 is raised and the sealing material 18 comes into contact with the clamp surface of the upper mold clamper 9. An air suction hole 9 a and a decompression suction path 9 b continuous with the air suction hole 9 a are formed on the clamp surface of the upper mold clamper 9. The decompression suction path 9 b is connected to the air suction device 22.

When the sealing material 18 is clamped by the upper mold clamper 9 and the lower mold clamper 15, the upper mold cavity 11 and the lower mold cavity 17 are closed, and an air suction operation is started by the air suction device 22, and the upper mold cavity 11 and the lower mold cavity are started. A decompression space is formed in 17.
Further, when the lower mold clamper 15 is slightly lowered with respect to the lower mold cavity block 14 (the lower coil spring 16 is contracted by pressurization), the volume of the lower mold cavity 17 is reduced, and the second resin R2 starts to melt. At the same time, it begins to contact and bury the parts.

  FIG. 6 shows a state in which the substrate 2 of the workpiece W is clamped by the upper mold clamper 9 and the lower mold clamper 15 as the mold clamping operation proceeds. In FIG. 7, the coil spring 10 for supporting the upper mold clamper 9 by suspending it from the upper mold base block 7 is compressed and the coil for supporting the lower mold clamper 15 by floating from the lower mold base block 13 in FIG. Each of the springs 16 is compressed to absorb excessive clamping force and excessive resin pressure acting on the workpiece W, and push in such a direction that the volumes of the upper and lower mold cavities 11 and 17 are decreased.

  As shown in FIG. 7, pressure sensors 21 are provided on the outer peripheral edge portions of the upper mold cavity block 8 and the lower mold cavity block 14, respectively. The resin pressure in 17 is detected. The movable block 20 is in the push standby position, and the push block 19 is in contact with the bottom of the lower mold cavity block 14.

  In FIG. 8, while the mold closing operation of the mold opening / closing unit is proceeding, the movable block 20 is raised by the drive transmission unit U and moved to the pushing position where the pressing block 19 protrudes from the insertion hole 13 a of the lower mold base block 13. Then, the lower mold cavity block 14 is pushed in such a direction that the volume of the lower mold cavity 17 decreases.

  When the pressure sensor 21 measures the resin pressure in each of the upper and lower mold cavities 11 and 17 and detects that the predetermined resin pressure has been reached, the driving of the mold opening / closing unit is stopped and the mold is clamped. The operation is completed, and the pushing of the drive transmission unit U is completed. As a result, the work W is heated and pressurized while the final upper mold and lower mold cavity blocks 8 and 14 are maintained at the respective height positions, and the first resin material R1 and the second resin material R are heat-cured.

According to the compression molding method described above, at least one of the cavity blocks is pushed in the direction in which the cavity volume is reduced by the drive transmission unit U while the mold clamping operation of the mold that clamps the workpiece W is advanced, When the resin pressure in the mold and lower mold cavities 11 and 17 is measured and reaches a predetermined pressure, the mold clamping operation of the mold is completed. As a result, the volume of each cavity is reduced while monitoring the resin pressure of the upper mold and lower mold cavities 11 and 17 corresponding to both surfaces of the workpiece W, so that the resin filling balance of the upper mold and lower mold cavities 11 and 17 is maintained. Resin molding can be performed. Therefore, since the workpiece W is not warped or deformed, the molding quality is improved, and both surfaces can be resin-molded in a single resin molding step, so that the production cost is reduced and the productivity is also improved.
Further, the volume of the upper and lower cavities 11 and 17 can be reduced by the mold clamping operation of the mold and the pushing of the cavity block by the drive transmission unit, so that compression molding is performed without increasing the complexity and size of the apparatus configuration. Can be done.
Further, a stopper that stops at a constant interval may be inserted between the upper mold base block 7 and the upper mold clamper 9. Similarly, a stopper may be provided between the lower mold base block 13 and the lower mold clamper 15 so as to stop at a constant interval.

[Second Example]
Next, another example of the compression molding apparatus will be described with reference to FIGS. The same members as those in the first embodiment are denoted by the same reference numerals and the description thereof is incorporated. The compression molding apparatus includes an upper mold 6 and a lower mold 12 (mold mold) that can be opened and closed. The difference from the first embodiment is that among the upper and lower mold clampers 9 and 15 arranged so as to surround the upper mold and lower mold cavity blocks 8 and 14, the lower mold clamper 15 is the lower mold base block 13. Only the upper mold clamper 9 is suspended and supported by the coil spring 10 with respect to the upper mold base block 7.

  The compression molding operation will be described. As shown in FIG. 9, the second resin material R2 is supplied to the lower mold cavity 17, and as shown in FIG. 10, the workpiece W clamped by the transport unit 4 and supplied with the first resin R1. Is carried into the lower mold 12. A preheating unit 5 is mounted on the transport unit 4, and the workpiece W and the first resin material R1 are preheated.

  As shown in FIG. 12, when the mold opening / closing unit is operated to clamp the mold and the sealing material 18 is clamped by the upper mold clamper 9 and the lower mold clamper 15, the upper mold cavity 11 and the lower mold cavity 17 are closed, and the air An air suction operation is started by the suction device 22 to form a reduced pressure space in the upper mold cavity 11 and the lower mold cavity 17.

  As shown in FIG. 13, when the mold clamping operation proceeds, the substrate 2 of the workpiece W is clamped by the upper mold clamper 9 and the lower mold clamper 15, and when the mold clamping operation further proceeds, the upper mold clamper 9 is first moved to the upper mold. The coil spring 10 suspended and supported from the base block 7 is pressed and contracted to reduce the volume of the upper mold cavity 11 and absorb an excessive pressing force acting on the workpiece W.

  In FIG. 13, while the mold closing operation of the mold opening / closing unit proceeds, the movable block 20 is lifted by the drive transmission unit U, and the pressing block 19 is moved to the pressing position protruding from the insertion hole 13 a of the lower mold base block 13. Let As a result, the lower mold cavity block 14 is pushed in such a direction that the volume of the lower mold cavity 17 decreases.

  In FIG. 14, when the pressure sensor 21 measures the resin pressure in the upper mold and lower mold cavities 11 and 17 and detects that the predetermined resin pressure has been reached, the driving of the mold opening / closing unit is stopped and the mold of the mold mold is stopped. Complete the tightening operation. In a state where the final height positions of the upper mold and lower mold cavity blocks 8 and 14 are maintained, the work W is heated and pressurized to heat and cure the first resin material R1 and the second resin material R.

[Third embodiment]
Next, another example of the compression molding apparatus will be described with reference to FIGS. The same members as those in the first embodiment are denoted by the same reference numerals and the description thereof is incorporated. The compression molding apparatus includes an upper mold 6 and a lower mold 12 (mold mold) that can be opened and closed. The difference from the first embodiment is that in the coil springs 10 and 16 that support the upper and lower mold clampers 9 and 15 disposed so as to surround the upper mold and lower mold cavity blocks 8 and 14, the lower mold clamper 15 The difference is that the spring force of the coil spring 16 that supports and floats is larger than that of the coil spring 10 that supports the upper clamper 9 in a suspended manner.

  The compression molding operation will be described. As shown in FIG. 15, the second resin material R2 is supplied to the lower mold cavity 17, and as shown in FIG. 16, the workpiece W clamped by the transport unit 4 and supplied with the first resin R1. Is carried into the lower mold 12. A preheating unit 5 is mounted on the transport unit 4, and the workpiece W and the first resin material R1 are preheated.

  As shown in FIG. 17, when the mold opening / closing unit is operated to perform mold clamping and the upper mold clamper 9 and the lower mold clamper 15 clamp the sealing material 18, the upper mold cavity 11 and the lower mold cavity 17 are closed, and the air An air suction operation is started by the suction device 22 to form a reduced pressure space in the upper mold cavity 11 and the lower mold cavity 17.

  As the mold clamping operation proceeds as shown in FIG. 18, first, the coil spring 10 that suspends and supports the upper mold clamper 9 from the upper mold base block 7 is compressed and compressed by the upper mold clamper 9 and the lower mold clamper 15. The substrate 2 of the workpiece W is clamped. As the mold clamping operation further proceeds, the volume of the upper mold cavity 11 decreases and the coil spring 10 absorbs excessive pressing force acting on the workpiece W.

  In FIG. 19, while the mold clamping operation of the mold opening / closing unit is proceeding, the movable block 20 is raised by the drive transmission unit U and moved to the pushing position where the pressing block 19 is protruded from the insertion hole 13 a of the lower mold base block 13. Then, the lower mold cavity block 14 is pushed in such a direction that the volume of the lower mold cavity 17 decreases.

  When the pressure sensor 21 measures the resin pressure in each of the upper and lower mold cavities 11 and 17 and detects that the predetermined resin pressure has been reached, the driving of the mold opening / closing unit is stopped and the mold is clamped. To complete. The work W is heated and pressurized while the final upper mold and lower mold cavity blocks 8 and 14 are maintained at the respective height positions to heat and cure the first resin material R1 and the second resin material R.

[Fourth embodiment]
Next, another example of the compression molding apparatus will be described with reference to FIGS. The same members as those in the first embodiment are denoted by the same reference numerals and the description thereof is incorporated. The compression molding apparatus includes an upper mold 6 and a lower mold 12 (mold mold) that can be opened and closed. The difference from the first embodiment is that the arrangement of the movable block 20 and the pressing block 19 is not the lower mold 12 but the upper mold 6.

  In FIG. 20, the upper mold base block 7 is provided with insertion holes 7a at a plurality of locations. Each of the pressing blocks 19 is inserted into a plurality of insertion holes 7 a provided in the upper mold base block 7, and the lower end is in contact with the upper mold cavity block 8. The pressing block 19 projects from the lower surface of the movable block 20. The movable block 20 is moved up and down by the drive transmission unit U by a drive source different from the mold opening / closing unit. The drive transmission unit U is provided such that the movable block 20 screwed to a screw shaft that is rotationally driven by, for example, an electric motor is moved up and down. The drive transmission unit U moves the movable block 20 to a position where the plurality of pressing blocks 19 come into contact with the upper mold cavity block 8 and the pressing block 19 moves upward from the insertion hole 7 a of the upper mold base block 7. The upper mold cavity block 8 is protruded and moved between the pushing positions where the upper mold cavity block 8 is pushed up with respect to the upper mold clamper 9. As a result, the volume of the upper mold cavity 11 can be pushed to compress.

  The compression molding operation will be described. As shown in FIG. 20, the second resin material R2 is supplied to the lower mold cavity 17, and as shown in FIG. 21, the workpiece W clamped by the transport unit 4 and supplied with the first resin R1. Is carried into the lower mold 12. A preheating unit 5 is mounted on the transport unit 4, and the workpiece W and the first resin material R1 are preheated.

  As shown in FIG. 22, when the mold opening / closing unit is operated and the mold is clamped, and the sealing material 18 is clamped by the upper mold clamper 9 and the lower mold clamper 15, the upper mold cavity 11 and the lower mold cavity 17 are closed, and the air An air suction operation is started by the suction device 22 to form a reduced pressure space in the upper mold cavity 11 and the lower mold cavity 17.

  Further, when the mold clamping operation proceeds as shown in FIG. 23, first, the coil spring 16 for floatingly supporting the lower mold clamper 15 from the lower mold base block 13 is compressed, and the workpiece W is moved by the upper mold clamper 9 and the lower mold clamper 15. The substrate 2 is clamped. As the mold clamping operation further proceeds, the volume of the lower mold cavity 17 decreases and the coil spring 16 absorbs excessive pressing force acting on the workpiece W.

  As shown in FIG. 24, pressure sensors 21 are provided on the outer peripheral edge portions of the upper mold cavity block 8 and the lower mold cavity block 14, respectively. The resin pressure in 17 is detected. The movable block 20 is in the push standby position, and the press block 19 is in contact with the upper portion of the upper mold cavity block 8.

  In FIG. 25, while the mold closing operation of the mold opening / closing unit is proceeding, the movable block 20 is raised by the drive transmission unit U and moved to the pushing position where the pressing block 19 protrudes from the insertion hole 7a of the upper mold base block 7. Let Thereby, the upper mold cavity block 8 is pushed in the direction in which the volume of the upper mold cavity 11 decreases.

  When the pressure sensor 21 measures the resin pressure in each of the upper and lower mold cavities 11 and 17 and detects that the predetermined resin pressure has been reached, the driving of the mold opening / closing unit is stopped and the mold is clamped. And the pushing of the drive transmission unit U is completed. The work W is heated and pressurized while the final upper mold and lower mold cavity blocks 8 and 14 are maintained at the respective height positions to heat and cure the first resin material R1 and the second resin material R.

[Fifth Example]
Next, another example of the compression molding apparatus will be described with reference to FIG. The same members as those in the first embodiment are denoted by the same reference numerals and the description thereof is incorporated. The compression molding apparatus includes an upper mold 6 and a lower mold 12 (mold mold) that can be opened and closed. The difference from the first embodiment is that the movable block 20 and the pressing block 19 are arranged not only on the lower mold 12 but also on the upper mold 6.

  In FIG. 26, the upper mold base block 7 is provided with insertion holes 7a at a plurality of locations. Each of the pressing blocks 19 is inserted into a plurality of insertion holes 7 a provided in the upper mold base block 7, and the lower end is in contact with the upper mold cavity block 8. The pressing block 19 projects from the lower surface of the movable block 20. The movable block 20 is moved up and down by the drive transmission unit U1 by a drive source different from the mold opening / closing unit. The drive transmission unit U1 is provided such that the movable block 20 screwed to a screw shaft that is rotationally driven by, for example, an electric motor is moved up and down. The drive transmission unit U1 moves the movable block 20 so that the plurality of pressing blocks 19 come into contact with the upper cavity block 8 and the pressing block 19 moves upward from the insertion hole 7a of the upper mold base block 7. The upper mold cavity block 8 is protruded and moved between the pushing positions where the upper mold cavity block 8 is pushed down with respect to the upper mold clamper 9. As a result, the volume of the upper mold cavity 11 can be pushed to compress.

The lower mold base block 13 is provided with insertion holes 13a at a plurality of locations. Each of the pressing blocks 19 is inserted into a plurality of insertion holes 13 a provided in the lower mold base block 13, and the upper end is in contact with the lower mold cavity block 14. The pressing block 19 protrudes on the movable block 20. The movable block 20 is moved up and down by the drive transmission unit U2 by a drive source different from the upper drive source. The drive transmission unit U2 is provided such that the movable block 20 screwed to a screw shaft that is rotationally driven by, for example, an electric motor is moved up and down. The drive transmission unit U moves the movable block 20 to a position where the plurality of pressing blocks 19 are in contact with the lower mold cavity block 14 and the pressing block 19 is above the insertion hole 13 a of the lower mold base block 13. The lower die cavity block 14 is projected and moved between the pushing positions where it is pushed up with respect to the lower die clamper 15. As a result, the volume of the lower mold cavity 17 can be pushed to be compressed.
In this case, the drive power is transmitted from the drive source to the upper mold and lower mold cavity blocks 8 and 14 via the drive transmission units U1 and U2 to reduce the volumes of the upper mold and lower mold cavities 11 and 17, respectively. In addition, each of the lower mold cavity blocks 8 and 14 can be set to a final cavity height position, and controllability is improved.

[Sixth embodiment]
Next, another example of the compression molding apparatus will be described with reference to FIG. The same members as those in the fifth embodiment are denoted by the same reference numerals, and the description is incorporated. The compression molding apparatus includes an upper mold 6 and a lower mold 12 (mold mold) that can be opened and closed, and the movable block 20 and the pressing block 19 are arranged not only on the lower mold 12 but also on the upper mold 6.

The difference from the fifth embodiment is that an upper mold film F1 covering the upper mold cavity 11 and a lower mold film F2 covering the lower mold cavity 17 are provided. An air suction hole 9c for adsorbing and holding the upper mold film F1 and a film suction path 9d connected thereto are formed on the clamp surface of the upper mold clamper 9. The film suction path 9 d is connected to the air suction device 23. An air suction hole 15 a and a decompression suction path 15 b are provided on the clamp surface of the lower mold clamper 15. The decompression suction path 15 b is connected to the air suction device 24. Further, an air suction hole 15c for adsorbing and holding the lower mold film F2 and a film suction path 15d connected thereto are formed on the clamping surface of the lower mold clamper 15. The film suction path 15 d is connected to the air suction device 25. The upper mold and the lower mold films F1 and F2 have heat resistance and are easily peeled off from the mold surface, and have flexibility and extensibility, such as PTFE, ETFE, PET, and FEP films. A monolayer film or a multi-layer film mainly composed of fluorine-impregnated glass cloth, polypropylene film, polyvinyl chloride or the like is preferably used. The film may be in any form that is continuous in a long shape or cut into a rectangular or circular sheet (also referred to as a strip or sheet).
According to the above configuration, the mold maintenance is facilitated since the upper mold cavity 11 and the lower mold cavity 17 are free from resin contamination and resin leakage.

[Seventh embodiment]
Next, another example of the compression molding apparatus will be described with reference to FIG. The same members as those in the fifth embodiment are denoted by the same reference numerals, and the description is incorporated. The compression molding apparatus includes an upper mold 6 and a lower mold 12 (mold mold) that can be opened and closed, and the movable block 20 and the pressing block 19 are arranged not only on the lower mold 12 but also on the upper mold 6.

  The difference from the fifth embodiment is that the upper mold 6 and the lower mold 12 are accommodated in the chamber C and provided. That is, the upper mold platen 26 supporting the upper mold base block 7 is provided with the annular upper mold chamber block 27, and the lower mold platen 28 supporting the lower mold base block 13 is clamped with the annular lower mold chamber block 29 in the mold clamped state. It arrange | positions so that it may mutually overlap (overlap). A gap between the upper mold chamber block 27 and the lower mold chamber block 29 that overlap each other is sealed with a sealing material 30 (such as an O-ring). The lower mold chamber block 29 is provided with a suction hole 29a, to which a decompression suction hose 31 is connected. The suction hole and the hose may be provided in the upper mold chamber block 27.

  In the chamber C, the upper mold 6 and the lower mold 12 are separated from each other when the mold is open. When the mold is clamped, the mold opening / closing unit starts a mold clamping operation, and the upper mold chamber block 27 and the lower mold 12 are separated. A closed space is formed at a position where the chamber blocks 29 overlap. At this time, a vacuum space is formed by sucking air through the suction hole 29a and the vacuum suction hose 31. Thus, by providing the chamber C outside the mold, it is not necessary to provide an air suction path in the upper mold clamper 9 and / or the lower mold clamper 15, thereby simplifying the mold structure.

As described above, according to the present invention, the volume of the upper mold and the lower mold cavity is decreased while monitoring the resin pressure of the upper mold and the lower mold cavities 11 and 17 corresponding to both surfaces of the workpiece W, so that the resin filling balance Resin molding can be performed while taking Therefore, since the workpiece W is not warped or deformed, the molding quality is improved, and both surfaces can be resin-molded in a single resin molding step, so that the production cost is reduced and the productivity is also improved.
Further, the volume of the upper mold and the lower mold cavities 11 and 17 can be reduced by performing the mold clamping operation of the mold and the pushing of the cavity blocks 8 and 14 by the drive transmission unit U in parallel. Compression molding can be performed without increasing complexity and size.

  In addition, the upper and lower sides supported by the upper die base block 7 and the lower die base block 13 with a coil spring or the like between the upper die cavity block 8 and the upper die clamper 9 and between the lower die cavity block 14 and the lower die clamper 15. Each of the pressure adjusting pieces may be provided. The height positions of the pressure receiving surfaces of the upper and lower pressure adjusting pieces are set back from the height positions of the clamp surfaces of the upper mold clamper 9 and the lower mold clamper 15, and the clamp surfaces (cavity bottom surfaces) of the upper mold cavity block 8 and the lower mold cavity block 14. It is provided to be at a further advanced height position. These upper and lower pressure adjusting pieces apply sufficient resin pressure to the first resin material R1 and the second resin material R2 filled in the upper mold cavity 11 and the lower mold cavity 17 at the final clamping position of the mold die. Alternatively, it is provided for releasing excess resin pressure (excess resin).

In the above-described compression molding apparatus, the lower mold is described as a movable mold and the upper mold as a fixed mold as an example. However, the present invention is not limited to this, and the upper mold may be a movable mold and the lower mold may be a fixed mold. It is good also as a type.
In the above-described embodiment, the first resin material R1 is placed on the substrate 2 and then conveyed to the mold. However, after the substrate 2 is set in the mold, the first resin material R1 is applied onto the substrate 2. May be.

  DESCRIPTION OF SYMBOLS 1 Component 2 Board | substrate 3 Resin package part W Work 4 Transfer unit 4a, 4b Clamp part R1 1st resin material R2 2nd resin material 5 Preheating unit 5a, 14a Heater 6 Upper mold 7 Upper mold base block 8 Upper mold cavity block 9 Upper Mold clamper 9a, 9c, 15a, 15c Air suction hole 9b, 15b Vacuum suction path 9d, 15d Film suction path 10, 16 Coil spring 11 Upper mold cavity 12 Lower mold 13 Lower mold base block 7a, 13a Insert hole 14 Lower mold Cavity block 15 Lower mold clamper 15a Escape recess 17 Lower mold cavity 18, 30 Sealing material 19 Press block 20 Movable block 21 Pressure sensor 22, 23, 24, 25 Air suction device U Drive transmission unit F1 Upper mold film F2 Lower mold film C Chamber 26 Upper mold platen 27 Upper mold chamber block 28 Lower mold platen 29 Lower mold block 29a Suction hole 31 Vacuum suction hose

Claims (7)

Resin material for upper mold and lower mold cavities respectively formed in a pair of mold dies provided with a clamper for clamping a work and a cavity block disposed between the clampers and disposed so as to be relatively movable by mold opening / closing operation A compression molding method in which each is supplied and compression molded,
Supplying a first resin material on the workpiece;
Supplying a second resin material into the lower mold cavity of the mold mold that has been opened;
Carrying the workpiece into the lower mold supplied with the second resin material, clamping the mold to clamp the pair of clampers and depressurizing the closed cavity space;
A drive transmission unit that pushes at least one of the cavity blocks, and at least one of the cavity blocks is moved by the drive transmission unit while performing a mold clamping operation of the mold mold that clamps the workpiece; Pushing in the direction of decreasing the cavity volume;
When the resin pressure in the upper mold and lower mold cavities is measured to reach a predetermined resin pressure, the mold clamping operation of the mold and the drive transmission unit are completed, and the final upper mold and lower mold are completed. Heat curing the resin of the workpiece while maintaining the height position of the cavity block;
The compression molding method characterized by including.   At least one of the upper mold and the lower mold clamper arranged so as to surround the upper mold and the lower mold cavity block is supported by a coil spring, and the cavity volume is relatively increased by the mold clamping operation while the workpiece is clamped. The compression molding method of Claim 1 which compresses.   The compression molding method according to claim 1, wherein the drive transmission unit is provided corresponding to each of the upper mold cavity block and the lower mold cavity block. Resin material for upper mold and lower mold cavities respectively formed in a pair of mold dies provided with a clamper for clamping a work and a cavity block disposed between the clampers and disposed so as to be relatively movable by mold opening / closing operation Each of which is a compression molding apparatus for compressing and molding,
A mold opening / closing unit that performs a mold opening / closing operation of the mold, and a drive transmission unit that pushes at least one cavity block of the mold in a direction in which the cavity volume decreases,
The first resin material is supplied onto the workpiece, the second resin material is supplied into the lower mold cavity, and the workpiece carried into the mold die by the clamping operation of the mold opening / closing unit is clamped by the pair of clampers. The compression molding apparatus is characterized in that compression molding is performed by reducing the volume of the upper mold and the lower mold cavity by paralleling the clamping operation performed and the drive transmission operation of the drive transmission unit to the cavity block.   Each cavity block is supported by a base block, and a plurality of pressing blocks protruding from a movable block are inserted into insertion holes provided in at least one of the base blocks, and the drive transmission unit is The moving position of the movable block includes a pressing standby position where a plurality of pressing blocks are in contact with the cavity block, and a pressing position where the pressing block projects from the insertion hole of the base block to push the cavity block. The compression molding apparatus according to claim 4, which is moved between the two.   Pressure sensors are provided on the outer peripheral edges facing the cavities of the upper mold and the lower mold cavity block. When a predetermined resin pressure is reached by the detected value of the pressure sensor, the mold clamping operation of the mold opening / closing unit and the The compression molding apparatus according to claim 5, wherein the pushing of the drive transmission unit is stopped.   A pair of chamber blocks that are arranged around the mold and are opened and closed by a mold opening / closing operation, and are compressed by forming a decompression space in the chamber formed by the mold clamping operation of the mold The compression molding apparatus of any one of Claims 4 thru | or 6 which shape | molds.

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