JP2013247315A - Sealing resin molding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sealing resin molding device capable of scraping out resin burrs having entered an opening between a frame member and a bottom surface member.SOLUTION: A sealing resin molding device is composed of: an upper die having an electronic component mounting substrate held on the lower surface; and a lower die which is arranged opposite to the upper die and includes a frame member which is placed on a pressure member vertically driven by a first drive mechanism via an elastic member, and a bottom surface member which is driven inside the frame member so as to be vertically slidable.

Description

  The present invention relates to a resin sealing molding apparatus for resin sealing an electronic component mounted on a substrate.

  Conventionally, an electronic component such as a semiconductor chip mounted on a substrate is resin-sealed and compression-molded using a resin-sealing molding apparatus having a compression molding die composed of both upper and lower molds ( For example, see Patent Document 1).

  An example of a resin sealing molding apparatus used for such resin sealing compression molding is shown in FIG. A resin sealing molding apparatus 50 in FIG. 11 includes a compression molding die composed of an upper die 51 and a lower die 52. The upper mold 51 is fixed at a predetermined position on the upper side of the apparatus 50, and the substrate 70 on which the electronic component 71 is mounted is held on the lower surface. The lower mold 52 includes a frame member 55 and a bottom member 54 that slides up and down within the frame member 55, and seals a space (cavity 53) surrounded by the frame member 55 and the bottom member 54. Resin is contained. A plate-like pressure member 57 is provided below the lower mold 52, and an elastic member 58 such as a compression spring is provided between the pressure member 57 and the frame member 55. Below the pressure member 57, a drive mechanism (not shown) for moving the pressure member 57 in the vertical direction is provided.

  When resin sealing molding is performed by the resin sealing molding apparatus 50, first, granular resin is supplied to the cavity 53 of the lower mold 52 and is melted by heating. Thereby, the molten resin 72 is generated in the cavity 53. Further, the substrate 70 is attached to the lower surface of the upper mold 51. At this time, the board 70 is arranged so that the mounting surface of the electronic component 71 faces downward. Then, by raising the pressure member 57, the lower mold 52 placed thereon is raised, and the frame member 55 is brought into contact with the peripheral portion of the substrate 70 fixed to the upper mold 51 (FIG. 12 ( a)). Thereafter, when the pressurizing member 57 is further raised, the frame member 55 does not rise any more while being in contact with the substrate 70 by the elastic member 58, and the upper and lower molds 51 and 52 are clamped, while the bottom member 54 is Ascending while sliding inside the frame member 55. As a result, the electronic component 71 is immersed in the molten resin 72 and the molten resin 72 is pressurized. By maintaining the pressurized state for a predetermined time and curing the molten resin 72, compression molding is completed, and the electronic component 71 on the substrate 70 is resin-sealed (FIG. 12B).

JP 2008-296382 A

The conventional resin sealing molding apparatus has the following problems.
(1) In order to properly slide the bottom member in the frame member, a certain gap must be provided between them. For this reason, the molten resin in the cavity enters the gap during pressurization. The molten resin that has entered the gap is cured to become a resin burr, which reduces the slidability between the frame member and the bottom member. Also, the resin burr enters the cavity during the release process (mold release process) and enters the product (package to be compression-molded) during the next compression process (this is called “burr implantation”). ), Which may reduce the quality of the product.

  (2) In the conventional resin sealing molding apparatus, since the mold clamping and the pressurization of the molten resin 72 in the cavity are performed with one driving source, the elastic member is deformed by the movement distance of the bottom member in the frame member. It is limited to the range that can be. For this reason, the depth of the cavity at the time of compressing the resin is limited, and the thickness of the package to be compression-molded is limited.

  (3) In the conventional resin sealing molding apparatus, when the pressure member is moved downward after the compression molding, the force with which the frame member presses the substrate against the upper mold is weakened. In addition, as described above, the presence of burrs in the gap between the frame member and the bottom surface member causes the both members of the frame member and the bottom surface member to move down more integrally. Cannot be released stably (released)

  The objective of this invention is providing the resin sealing molding apparatus which can solve said subject.

In order to solve the above problems, the first embodiment of the resin sealing molding apparatus for electronic parts according to the present invention,
a) an upper mold on which the electronic component mounting board is held on the lower surface;
b) a lower mold disposed opposite to the upper mold,
b1) a frame member placed via an elastic member on a pressure member that is driven up and down by the first drive mechanism;
b2) a bottom member driven by a second drive mechanism so as to be slidable up and down inside the frame member;
It is characterized by providing.

  In the conventional resin sealing molding apparatus, only the first drive mechanism is provided, and when it pushes up the pressure member, only the elastic member provided between the frame member and the pressure member is deformed, and the bottom member is Slides up and down in the frame member. In the resin sealing molding apparatus according to the first aspect of the present invention, a second drive mechanism is additionally provided, and the second drive mechanism moves the bottom surface member up and down independently of the frame member. Therefore, the following operations are possible.

  (1) By performing vertical movement of the bottom member inside the frame member after resin sealing molding, the resin burrs that have entered these sliding surfaces can be scraped. After scraping out the resin burr, the resin burr may be sucked by a suction means provided separately in the apparatus. Thereby, it is possible to prevent the resin burr from entering the cavity and mixing into the package in the next step. In addition, the apparatus can be stably operated.

  (2) The height of the bottom surface member (that is, the depth of the cavity) inside the frame member can be arbitrarily set by the independently provided second drive mechanism. Thereby, since the freedom degree of the setting of the thickness of a package can be improved, it becomes possible to perform resin sealing molding of many kinds of electronic substrates with the same compression molding die.

  (3) Since the bottom member can be moved downward by the second drive mechanism while holding the substrate by the frame member, the package can be released stably.

  (4) Since the conventional resin sealing molding apparatus has one drive source, the press corresponding to each type of drive source (transfer drive source, air cylinder drive source, or servo motor drive source). Although it was necessary to manufacture a mold having a structure, in the resin sealing molding apparatus according to the present invention, a frame member drive source (mold clamping drive source) and a bottom member drive source (plunger drive source) are provided separately. Therefore, the mold according to the present invention can also be used for transfer molding.

  In this resin sealing molding apparatus, the bottom member is moved up and down, but the same function can be obtained even when the frame member is moved up and down.

That is, the thing of the 2nd form of the resin sealing molding apparatus of the electronic component based on this invention made in order to solve the said subject is
a) an upper mold on which the electronic component mounting board is held on the lower surface;
b) a lower mold disposed opposite to the upper mold,
b1) a bottom member placed on a pressure member that is driven up and down by the first drive mechanism;
b2) a frame member driven by a second drive mechanism so as to be slidable up and down on the outer periphery of the bottom member, and an elastic member provided between the pressurizing member;
It is characterized by providing.

  In the resin sealing molding apparatus according to the present invention, a second drive mechanism that directly moves a bottom member or a frame member that has conventionally been provided via an elastic member is provided on the lower mold side pressure member. Yes. As a result, the resin burr that has entered the gap between the bottom member and the frame member is scraped, the depth of the cavity surrounded by the frame member and the bottom member is changed, the package can be released stably, The mold according to the invention can also be used for transfer molding.

The schematic block diagram of 1st Example of the resin sealing molding apparatus which concerns on this invention. Explanatory drawing of the resin sealing process by the resin sealing molding apparatus of 1st Example. Explanatory drawing of the release process by the resin sealing molding apparatus of 1st Example. Explanatory drawing of the scraping process by the resin sealing molding apparatus of 1st Example. Sectional drawing which shows the modification of the bottom face member in the resin sealing molding apparatus of 1st Example. The schematic block diagram of 2nd Example of the resin sealing molding apparatus of the electronic component which concerns on this invention. Explanatory drawing of the resin sealing process by the resin sealing molding apparatus of 2nd Example. Explanatory drawing of the release process by the resin sealing molding apparatus of 2nd Example. Explanatory drawing of the scraping process by the resin sealing molding apparatus of 2nd Example. The schematic block diagram which shows the modification of the resin sealing molding apparatus of 2nd Example. The schematic block diagram which shows the prior art example of the resin sealing molding apparatus. Explanatory drawing of the resin sealing process by the resin sealing molding apparatus of a prior art example.

  Hereinafter, a first embodiment of a resin sealing molding apparatus for electronic parts according to the present invention will be described with reference to FIGS. As shown in FIG. 1, the resin sealing molding apparatus 10 of the present embodiment is disposed so as to face the upper mold 11 that holds a substrate 70 on which an electronic component 71 such as a semiconductor chip is mounted on the lower surface, and the upper mold 11. A resin sealing mold 101 composed of a lower mold 12 and a pressure member 17 for placing the lower mold 12 and moving it in the vertical direction are provided. The pressure member 17 is driven up and down by a first drive mechanism 18 provided below the pressure member 17.

  The lower mold 12 includes a frame member 15 and a bottom surface member 14 that can slide up and down within the frame member 15, and contains a resin material in a space (cavity 13) surrounded by the frame member 15 and the bottom surface member 14. It can be done. Here, the frame member 15 is placed on the pressure member 17 via the elastic member 20. Further, the bottom member 14 is driven to be slidable up and down inside the frame member 15 by a second drive mechanism 19 provided below the bottom member 14 (inside the pressure member 17 in FIG. 1). .

  Next, a resin sealing process of an electronic component using the resin sealing molding apparatus 10 will be described. First, as shown in FIG. 2A, the resin sealing mold 101 is opened, and the substrate 70 is fixed to the lower surface of the upper mold 11. At this time, the board 70 is arranged so that the mounting surface of the electronic component 71 faces downward. Similarly, as shown in FIG. 2A, a resin material 73 is supplied to the cavity 13 of the lower mold 12. The resin material 73 is for sealing the electronic component 71 and is, for example, an epoxy resin. The resin material 73 may be granular or liquid when supplied to the cavity 13, but in this embodiment, the granular resin material 73 is supplied into the cavity 13. After the granular resin material 73 is supplied into the cavity 13, the resin material 73 is melted by heating in the cavity 13 to form a molten resin 72 (FIG. 2B).

  At this time, since the volume of the resin is greatly reduced, the bottom member 14 is raised by the second drive mechanism 19, and the height from the top surface of the bottom member 14 to the top surface of the frame member 15 is appropriately adjusted (FIG. 2 (c)). . Next, the pressure member 17 is raised by the first drive mechanism 18 and the upper surface of the frame member 15 of the lower mold 12 is brought into contact with the peripheral portion of the substrate 70 (FIG. 2 (d)). Thereafter, the pressure member 17 is further raised, the electronic component 71 is immersed in the molten resin 72 in the cavity 13, and the molten resin 72 is pressurized by the bottom surface member 14 (FIG. 2 (e)).

  The state in which the molten resin 72 is pressurized is maintained at a predetermined temperature for a predetermined time, and the molten resin 72 is cured to form a cured resin. Thereby, a sealed molded product in which the electronic component 71 is sealed with the cured resin is formed.

  The timing for moving the bottom member 14 up and down by the second drive mechanism 19 may be any timing. For example, the bottom member 14 can be raised after the upper surface of the frame member 15 is brought into contact with the substrate 70. Further, when the granular resin 73 is charged into the cavity 13, the bottom member 14 may be moved up and down by the second drive mechanism 19 as appropriate depending on the amount to be charged.

  FIG. 3 is an explanatory diagram of a release process in the resin sealing molding apparatus 10 of the present embodiment. As shown in FIG. 3 (a), in the resin sealing molding apparatus 10 of the present embodiment, the bottom member 14 can be lowered by the second drive mechanism 19 while the substrate 70 is pressed by the frame member 15, The bottom member 14 can be stably released from the package. Thereafter, the pressure member 17 is lowered by the first drive mechanism 18 (FIG. 3B).

  In the above description, the first drive mechanism 18 raises the pressure member 17 to press the molten resin 72 in the cavity 13, but the second drive mechanism 19 raises the bottom member 14 to raise the cavity. The molten resin 72 in 13 can also be pressurized. Moreover, you may use both together. The elastic member 20 compensates for the inclination of the frame member 15 and can apply pressure uniformly over the entire surface of the bottom member 14, so that the pressure is applied by the first drive mechanism 18 or the first drive mechanism 18 and the second drive member 18. Pressurization by using both of the drive mechanisms 19 is desirable for uniform resin sealing molding.

  As described above, in the resin sealing molding apparatus 10 of the present embodiment, the bottom member 14 is raised by the second drive mechanism 19 and the depth of the cavity 13 is adjusted at an arbitrary timing, so that the stroke width of the elastic member 58 is increased. Can be made larger than a certain level. Therefore, even a relatively thick resin mold (for example, a semiconductor package having a thickness of about 5 mm with a built-in power transistor for controlling a large current) can be compression-molded with a sufficiently high pressure. .

  Moreover, in the resin sealing molding apparatus 10 of a present Example, the vertical movement of the bottom face member 14 is repeated by the 2nd drive mechanism 19 after resin sealing molding is complete | finished. Thereby, the resin burr | penetration which permeated into the sliding surface of the frame member 15 and the bottom face member 14 can be scraped out (FIG. 4). In this case, in order to easily scrape off the resin burr, it is desirable that a groove 14A is provided on the side periphery of the bottom member 14 (FIGS. 5A and 5B). After scraping out the resin burr, the resin burr is sucked by a suction means (not shown) and removed. Thereby, the resin sealing molding apparatus 10 can be operated stably.

  Next, a second embodiment of the resin sealing molding apparatus for electronic parts according to the present invention will be described with reference to FIGS. The resin sealing molding apparatus 30 of the present embodiment moves the frame member 15 up and down by the second drive mechanism 19. The frame member 15 is connected to a connecting member 32, and the connecting member 32 is connected to the frame-shaped movable plate 31 via an elastic member 33. The movable plate 31 moves up and down by the second drive mechanism 19 placed inside the pressure member 17 (FIG. 6). Other configurations are the same as those in FIG. 1, and the pressure member 17 is driven up and down by a first drive mechanism 18 (not shown) provided below the pressure member 17.

  The resin sealing process of the electronic component using the resin sealing molding apparatus 30 will be described. First, as shown in FIG. 7A, the resin sealing mold 101 is opened, and the substrate 70 is fixed to the lower surface of the upper mold 11. At this time, the board 70 is arranged so that the mounting surface of the electronic component 71 faces downward. Further, a granular resin material 73 is supplied to the cavity 13 of the lower mold 12. After the granular resin material 73 is supplied into the cavity 13, the resin material 73 is melted by heating in the cavity 13 to form a molten resin 72 (FIG. 7B). At this time, since the bulk volume of the resin decreases, the frame member 15 is lowered by the second drive mechanism 19 and the heights of the upper surface of the bottom surface member 14 and the upper surface of the frame member 15 are appropriately adjusted (FIG. 7C).

  Next, the pressure member 17 is raised by the first drive mechanism 18 and the upper surface of the frame member 15 of the lower mold 12 is brought into contact with the peripheral portion of the substrate 70 (FIG. 7D). Thereafter, the pressure member 17 is further raised, the electronic component 71 is immersed in the molten resin 72 in the cavity 13, and the molten resin 72 is pressurized by the bottom surface member 14 (FIG. 7 (e)). This pressurized state is maintained at a predetermined temperature for a predetermined time, and the molten resin 72 is cured to form a cured resin. Thereby, a sealed molded product in which the electronic component 71 is sealed with the cured resin is formed.

  The timing for moving the frame member 15 up and down by the second driving mechanism 19 may be any timing. For example, when the molten resin 72 is pressurized, the frame member 15 can be lowered by the second drive mechanism 19 in synchronization with the rise of the pressure member 17. In addition, when the granular resin 73 is charged into the cavity 13, the frame member 15 can be moved up and down by the second drive mechanism 19 as appropriate depending on the amount to be charged.

  FIG. 8 is an explanatory diagram of a release process in the resin sealing molding apparatus 30 of the present embodiment. In FIG. 8A, the pressure member 17 is lowered by the first drive mechanism 18 and the frame member 15 is raised by the second drive mechanism 19 by the distance by which the pressure member 17 is lowered. As a result, the bottom member 14 can be lowered by the second drive mechanism 19 while the substrate 70 is pressed by the frame member 15, so that the bottom member 14 can be stably released from the package. Thereafter, the pressure member 17 is further lowered by the first drive mechanism 18 (FIG. 8B).

  As described above, also in the resin sealing molding apparatus 30 of this embodiment, the depth of the cavity 13 after the volume of the resin is reduced can be appropriately adjusted by the second drive mechanism 19. Therefore, the resin sealing molding apparatus 30 of the present embodiment is also suitable for sealing molding of a relatively thick resin mold (for example, a semiconductor package having a thickness of about 5 mm with a built-in power transistor for controlling a large current). Can be used.

  Moreover, in the resin sealing molding apparatus 30 of the present embodiment, the vertical movement of the frame member 15 is repeated by the second drive mechanism 19 after the resin sealing molding is completed. Thereby, the resin burr | penetration which permeated into the sliding surface of the frame member 15 and the bottom face member 14 can be scraped off (FIG. 9). Further, similarly to the resin sealing molding apparatus 10 of the first embodiment, it is desirable that the bottom surface member 14 is provided with a circumferential groove 14A.

  It should be noted that the above embodiment is merely an example, and it is obvious that modifications and corrections can be made as appropriate in accordance with the spirit of the present invention.

  For example, as a modification of the resin sealing molding apparatus 30 of the second embodiment, the intermediate plate 75 can be connected to the frame member 15 and moved up and down by the air cylinder 76 (FIG. 10). The resin sealing step and the resin burr scraping step after the resin sealing step in the resin sealing mold apparatus of FIG. 10 are the same as in the second embodiment.

DESCRIPTION OF SYMBOLS 10, 30, 50 ... Resin sealing molding apparatus 101 ... Resin sealing molding die 11, 51 ... Upper die 12, 52 ... Lower die 13, 53 ... Cavity 14, 54 ... Bottom member 14A ... Circumferential groove 15, 55 ... Frame Members 17, 57 ... pressure member 18 ... first drive mechanism 19 ... second drive mechanism 20, 33, 58 ... elastic member 30 ... resin sealing molding device 31 ... movable plate 32 ... connecting member 70 ... substrate 71 ... electronic component 72 ... Molten resin 73 ... Resin material 75 ... Intermediate plate 76 ... Air cylinder

Claims (6)

a) an upper mold on which the electronic component mounting board is held on the lower surface;
b) a lower mold disposed opposite to the upper mold,
b1) a frame member placed via an elastic member on a pressure member that is driven up and down by the first drive mechanism;
b2) a bottom member driven by a second drive mechanism so as to be slidable up and down inside the frame member;
A resin sealing molding apparatus comprising:   The resin sealing molding apparatus according to claim 1, wherein the bottom member is moved up and down after the resin sealing step.   The resin sealing molding apparatus according to claim 1, wherein a groove is provided on a side periphery of the bottom surface member. a) an upper mold on which the electronic component mounting board is held on the lower surface;
b) a lower mold disposed opposite to the upper mold,
b1) a bottom member placed on a pressure member that is driven up and down by the first drive mechanism;
b2) a frame member driven by a second drive mechanism so as to be slidable up and down on the outer periphery of the bottom member, and an elastic member provided between the pressurizing member;
A resin sealing molding apparatus comprising:   The resin sealing molding apparatus according to claim 4, wherein the frame member is moved up and down after the resin sealing step.   The resin sealing molding apparatus according to claim 4, wherein a groove is provided on a side periphery of the bottom surface member.

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