KR20150109283A - Method for providing resin sheet and method and device for encapsulating semiconductor - Google Patents

Method for providing resin sheet and method and device for encapsulating semiconductor Download PDF

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Publication number
KR20150109283A
KR20150109283A KR1020150037414A KR20150037414A KR20150109283A KR 20150109283 A KR20150109283 A KR 20150109283A KR 1020150037414 A KR1020150037414 A KR 1020150037414A KR 20150037414 A KR20150037414 A KR 20150037414A KR 20150109283 A KR20150109283 A KR 20150109283A
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South Korea
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resin
cavity
cavity bottom
sheet
frame
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KR1020150037414A
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Korean (ko)
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KR101718605B1 (en
Inventor
신지 다카세
다카시 다무라
요시히사 가와모토
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토와 가부시기가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container

Abstract

A proper amount of reins materials required for encapsulating a semiconductor device (17) with resins are supplied to a cavity part (25) of a semiconductor encapsulating frame (15). The movement of the resin is suppressed when the resin is compressed in the cavity part (25). The height of the upper side of a cavity bottom member (21) is higher than the height of the upper side of a cavity side member (22). A sheet resin (33) which is wider than the cavity bottom member (21) is arranged on the upper side of the cavity bottom member (21). The edge around the sheet resin (33) arranged on the upper side of the cavity bottom member (21) is extended to the upper side of the cavity side member (22) to overlap when the sheet resin is arranged. Suggested are a method for providing the resin sheet, a semiconductor encapsulating method, and a semiconductor encapsulating apparatus, capable of preventing an air gap of a resin non-filling state from being formed on the surrounding part of the cavity part (25) by performing a process of setting an overlap part (33a) of the sheet resin (33) on the edge around the outer side of the cavity bottom member (21).

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sheet sealing method,

The present invention relates to a method for supplying a sheet resin to a predetermined position of a semiconductor sealing frame in a semiconductor sealing apparatus, a method for supplying a sheet resin to a predetermined position of a semiconductor sealing frame, And thermally fusing the molten resin material to compress the molten resin material to resin-encapsulate the semiconductor element on the semiconductor substrate, and a semiconductor encapsulating device. More specifically, when feeding a sheet resin to a predetermined position of a semiconductor sealing frame, a predetermined amount of resin material necessary for resin-sealing the semiconductor element is set in the cavity portion of the semiconductor sealing frame, The flow of the molten resin material is suppressed at the time of compressing the material so that there is no problem such as displacement of the position of the semiconductor element mounted on the semiconductor substrate due to the flow action of the molten resin material, , And a semiconductor device can be sealed and formed in a resin package compression-molded in an even thickness.

BACKGROUND ART Conventionally, a semiconductor sealing method using a sheet resin and a semiconductor sealing apparatus have been known as disclosed in, for example, Patent Document 1.

Patent Document 1 discloses a semiconductor sealing device in which a lower frame and an upper frame are opposed to each other, and a transport mechanism for supplying sheet resin (plate-shaped resin material) to the lower frame cavity. This sheet resin is previously compacted (solidified) in correspondence with the shape of the lower mold cavity. Therefore, when such a sheet resin is supplied to fit into the lower mold cavity, the resin material can be uniformly supplied to the respective portions in the lower mold cavity.

However, even when such a sheet resin is fed into the lower mold cavity, the total size (area) of the sheet resin must necessarily be set to be smaller than the size (area) of the lower mold cavity. Therefore, when such a sheet resin is fed into the lower mold cavity, a predetermined gap is formed between the outer periphery of the sheet resin and the inner periphery edge of the lower mold cavity. When the molten resin material in the lower mold cavity is compressed by joining the upper and lower mats in this state, the molten resin material is pushed to the peripheral portion of the lower mold cavity and flows into the flowing molten resin material. . Therefore, the flow action of the molten resin material and the air inflow action can not be reliably prevented. As a result, there has been a serious problem in resin molding that the flowing molten resin material short-circuits the bonding wires in the semiconductor devices, or deforms or cuts the bonding wires.

In addition, due to the flow action of the molten resin, there arise problems such as misalignment of the semiconductor elements mounted on the semiconductor substrate, bubbles are generated in the resin package sealing the semiconductor elements, There is a problem that the resin package can not be compression molded with an even thickness. In addition, since the void portion in the periphery of the lower mold cavity is inevitably formed due to the reasons described above, it is practically difficult to match the sheet resin to the dimension and shape of the lower mold cavity. Therefore, There is a problem that an appropriate amount of the resin material can not be supplied into the lower mold cavity.

Patent Document 1: Japanese Patent Application Laid-Open No. 2004-174801 (paragraph [0019] and Fig. 1)

An object of the present invention is to more reliably prevent occurrence of voids in the resin-unfilled state in the peripheral portion of the cavity when supplying the sheet resin to the cavity portion in the semiconductor sealing frame. A further object of the present invention is to seal a semiconductor element on a semiconductor substrate in a resin package molded to an equal thickness at each portion of the semiconductor substrate by supplying the resin material uniformly and uniformly in the cavity.

The method for supplying a sheet resin according to the present invention comprises an upper frame 12 for setting a semiconductor substrate 18 on which a plurality of semiconductor elements 17 are mounted and a semiconductor element 17 on the semiconductor substrate 18 A cavity bottom surface member 21 provided on the lower mold frame 14 and serving as a resin pressing member and having a flat upper surface shape, And a cavity side face member 22 which is fitted in the outer periphery of the cavity bottom face member 21 and also serves as a vertical guide member of the cavity bottom face member 21, 33), comprising the steps of:

A height position of the upper surface of the cavity bottom surface member 21 is set to a height position of the cavity side surface member 22 including a height of the top surface of the cavity side surface member 22, A setting step,

A sheet resin (33) having an area larger than the area of the cavity bottom face member (21), which is performed after the step of positioning the cavity bottom face member (21), is disposed on the top face of the cavity bottom face member A batch process,

The peripheral edge portion of the sheet resin 33 disposed on the upper surface portion of the cavity bottom surface member 21 is overlapped with the upper surface of the cavity side surface member 22 and overlapped, A sheet resin overlap setting step of setting an overlap part (33a) of the sheet resin (33) on an outer peripheral edge part of the cavity bottom surface member (21)

And a control unit.

In the sheet resin supplying method according to the present invention, in the step of positioning the cavity bottom face member, the height position of the top face of the cavity bottom face member 21 is set to be equal to or more than the height of the top face of the cavity side face member 22 , And is set to be higher than the height corresponding to the thickness of the sheet resin (33) by three times or less as compared with the height position of the top surface of the cavity side member.

The sheet resin 33 is adhered to the mold release film 31 and the sheet resin 33 is disposed on the upper surface of the cavity bottom surface member 21, There is an embodiment further including a sheet resin arranging step of arranging the sheet resin 33 on the upper surface portion of the cavity bottom surface member 21 through the release film 31. [

A semiconductor encapsulation method according to the present invention comprises an upper frame 12 for setting a semiconductor substrate 18 on which a plurality of semiconductor elements 17 are mounted, A cavity bottom surface member 21 provided on the lower mold frame 14 and serving as a resin pressing member and having a flat upper surface shape, and a cavity bottom surface member 21 And a cavity side member (22) which is fitted in the outer periphery of the cavity bottom surface member (21) and also serves as a vertical guide member of the cavity bottom surface member (21) As a sealing method,

A height position of the upper surface of the cavity bottom surface member 21 is set to a height position of the cavity side surface member 22 including a height of the top surface of the cavity side surface member 22, A setting step,

A sheet resin 33 which is formed after the step of positioning the cavity bottom surface member 21 and has a larger area than the area of the cavity bottom surface member 21 is formed on the top surface of the cavity bottom surface member 21, A resin arrangement step,

The peripheral edge portion of the sheet resin 33 disposed on the upper surface portion of the cavity bottom surface member 21 is overlapped with the upper surface of the cavity side surface member 22 and overlapped, A sheet resin overlap setting step of setting an overlapping portion (33a) of the sheet resin (33) at an outer peripheral edge portion of the cavity bottom surface member (21)

A clamping step of bonding the upper frame 12 and the lower frame 14 to form a cavity 25 for resin molding between the upper and lower mats 12 and 14, ,

A sheet resin cutting step performed at the clamping step and cutting the sheet resin 33 along a fitting portion of the cavity bottom surface member 21 and the cavity side surface member 22;

The sheet resin 33b after cutting is housed in the cavity portion 25 and the cavity bottom surface member 21 is formed on the upper surface of the cavity bottom surface member 21, A sheet resin receiving step of accommodating the overlapped portion 33a as an excess resin of the sheet resin 33 in a resin storing portion 29 provided at an outer position of the sheet resin 33,

The sheet resin 33b after cutting is accommodated in the cavity 25 and heated and melted so that the semiconductor element 17 on the semiconductor substrate 18 is heated in the cavity The sheet resin 33b heated and molten in a state of being immersed in the heated and melted sheet resin 33b in the portion 25 is compressed so that the semiconductor element 17 on the semiconductor substrate 18 is heated to a predetermined uniform thickness A resin compression molding process for sealing the resin package 36 molded with

And a control unit.

In the semiconductor encapsulation method according to the present invention, the upper surface height position of the cavity bottom surface member (21) is set to be equal to or larger than the height of the upper surface of the cavity side surface member (22) , And height is set to be three times or more the height corresponding to the thickness of the sheet resin 33 as compared with the height position of the top surface of the cavity side member.

In the semiconductor encapsulation method according to the present invention, the thickness of the sheet resin 33 is equal to the thickness of the resin package 36 to be molded in the resin compression molding step.

In the semiconductor encapsulation method according to the present invention, the clamping step is performed by moving the cavity bottom face member 21 downward relative to the cavity side face member 22.

In the semiconductor encapsulation method according to the present invention, the resin sealing frame has an intermediate frame (28) for supporting the semiconductor substrate between the upper frame (12) and the lower frame (14)

In the clamping step, the resin reservoir 29 is formed between the intermediate frame 28 and the cavity side member 22.

In the semiconductor encapsulation method according to the present invention, the resin encapsulation frame has an intermediate frame (38) for supporting the semiconductor substrate between the upper frame (12) and the lower frame (14)

In the clamping step, the cavity portion 25 is formed between the intermediate frame 38 and the cavity bottom surface member 21.

In the semiconductor sealing method according to the present invention, in the sheet resin arranging step, the sheet resin 33 adhered to the elongate release film 31 is fed to the roll-to-roll mechanism 34 capable of automatically feeding the sheet resin, To the upper surface portion of the cavity bottom surface member 21 through the through holes.

In the semiconductor sealing method according to the present invention, in the sheet resin arranging step, the sheet resin adhered on the release film (31) of the short type corresponding to the shape of the mold of the lower frame (14) 33 are disposed on the upper surface portion of the cavity bottom surface member 21 through a loading frame mechanism 41 for artificially transporting the sheet resin 33.

The semiconductor encapsulation apparatus according to the present invention comprises an upper frame 12 for setting a semiconductor substrate 18 on which a plurality of semiconductor elements 17 are mounted and a semiconductor element 17 on the semiconductor substrate 18, A cavity bottom surface member 21 provided on the lower mold frame 14 and serving as a resin pressing member and having a flat upper surface shape and a cavity bottom surface member 21 provided on the cavity bottom surface member 21, And the cavity side face member 22 which is fitted in the outer periphery of the cavity bottom face member 21 and also serves as the upper and lower guide members of the cavity bottom face member 21. The semiconductor element 17, Is sealed with a resin,

An intermediate frame (28) for supporting the semiconductor substrate provided between the upper frame (12) and the lower frame (14)

A resin reservoir 29 for accommodating the surplus resin 33c,

Lt; / RTI &

The resin reservoir 29 is formed between the intermediate frame 28 and the cavity side member 22 by clamping the upper frame 12 and the lower frame 14.

In the semiconductor encapsulation apparatus according to the present invention, an embodiment in which the excess side resin capturing means 30 for capturing the excess resin 33c accommodated in the resin reservoir 29 is further provided on the cavity side member 22 have.

In the semiconductor encapsulation apparatus according to the present invention, the intermediate mold (28) is further provided with resin adhesion preventing means (37) for preventing the excess resin (33c) accommodated in the resin reservoir There is an aspect.

The semiconductor encapsulation apparatus according to the present invention comprises an upper frame 12 for setting a semiconductor substrate 18 on which a plurality of semiconductor elements 17 are mounted, A cavity bottom surface member 21 provided on the lower mold frame 14 and serving as a resin pressing member and having a flat upper surface shape, and a cavity bottom surface member 21 And a cavity side face member 22 which is fitted in the outer periphery of the cavity bottom face member 21 and serves as the upper and lower guide members of the cavity bottom face member 21. The semiconductor element 17, Is sealed with a resin,

An intermediate frame 38 for supporting the semiconductor substrate provided between the upper frame 12 and the lower frame 14,

The cavity portion 38a for resin molding

Lt; / RTI &

The cavity portion 38a is formed between the cavity bottom surface member 21 and the intermediate frame 38 by clamping the upper frame 12 and the lower frame 14. [

According to the present invention, it is possible to prevent the sheet resin supplied to the cavity portion from being suspended due to the magnetic weight, and to provide a large amount of resin material having a thickness equal to or greater than the thickness of the sheet resin at the peripheral portion in the cavity portion and at the portion corresponding to the depth of the cavity portion Can be prevented from being supplied.

Therefore, when supplying the sheet resin to the cavity portion, it is possible to more reliably prevent the void portion in the resin-unfilled state from occurring in the peripheral portion of the cavity portion.

In addition, since the resin material can be uniformly and uniformly supplied into the cavity portion, the semiconductor elements on the semiconductor substrate can be sealed in the resin package molded to the uniform thickness at each portion of the semiconductor substrate.

Fig. 1 schematically shows a main part of a semiconductor sealing frame in a semiconductor sealing device according to a first embodiment of the present invention. Fig. 1 is a partially cutaway front view showing a state in which a semiconductor substrate and a sheet resin are transported to a semiconductor sealing frame part.
Fig. 2 is an enlarged vertical cross-sectional view showing a main part of the semiconductor sealing frame corresponding to Fig. 1. Fig.
3 is an enlarged vertical cross-sectional view showing a main part of the semiconductor sealing frame corresponding to Fig.
Fig. 4 is a longitudinal sectional view of the semiconductor sealing frame corresponding to Fig. 3; Fig.
Fig. 5 is a longitudinal sectional view of the semiconductor sealing frame corresponding to Fig. 4;
Fig. 6 is an enlarged vertical cross-sectional view showing a main part of the semiconductor sealing frame corresponding to Fig. 5; Fig.
7 is a longitudinal sectional view of the semiconductor sealing frame corresponding to Fig.
8 is a longitudinal sectional view showing another modification of the semiconductor sealing frame corresponding to Fig.
Fig. 9 schematically shows a main part of a semiconductor sealing frame in a semiconductor sealing device according to a second embodiment of the present invention, and is a partially cutaway front view showing a state in which a semiconductor substrate and a sheet resin are transported to a semiconductor sealing frame part.
10 is an enlarged vertical cross-sectional view showing a main part of the semiconductor sealing frame corresponding to Fig.
11 is an enlarged vertical cross-sectional view showing a main part of the semiconductor sealing frame corresponding to Fig.
12 is a longitudinal sectional view of the semiconductor sealing frame corresponding to Fig.
13 is a longitudinal sectional view of the semiconductor sealing frame corresponding to Fig.
14 is a longitudinal sectional view of the semiconductor sealing frame corresponding to Fig.
15 is a longitudinal sectional view showing a main part of a semiconductor sealing frame in a semiconductor sealing device according to a third embodiment of the present invention.
16 is a longitudinal sectional view of the semiconductor sealing frame corresponding to Fig.
17 is a longitudinal sectional view of the semiconductor sealing frame corresponding to Fig.
Fig. 18 is a plan view showing the entirety of the loading frame of Fig. 18 (1), Fig. 18 (2) is a central longitudinal sectional view thereof, 18 (3) is a vertical sectional view enlarging and showing the main part thereof.
Fig. 19 is a vertical sectional view showing an example of use of the loading frame corresponding to Fig. 18, and a main part of the semiconductor sealing frame is shown in an exploded view.
Fig. 20 is a longitudinal sectional view showing a clamping state of the semiconductor sealing frame corresponding to Fig. 19;
21 (1) is a partially cut away front view schematically showing a lower frame of a semiconductor sealing frame, and (2) in FIG. 21 is an enlarged view of a main part of the lower frame; Front view.

Before describing the embodiments of the present invention, the basic structure of a semiconductor sealing device embodying the present invention will be described. In this semiconductor sealing device, when the sheet resin is supplied to the lower mold cavity portion, the peripheral portion of the sheet resin is extended and overlapped with the mold face of the lower mold portion which becomes the outer peripheral edge portion of the lower mold cavity portion to set the overlap portion, The clamping pressure of the semiconductor sealing frame is cut and separated. By accommodating an appropriate amount of the sheet resin in the lower mold cavity portion except for the overlapping and separated overlapped portions, voids in an unfilled resin state are prevented from occurring in the peripheral portion of the lower mold cavity .

However, in the case where the height position of the bottom surface of the lower mold cavity portion is set to be lower than the mold surface (upper surface) of the lower mold in supplying the sheet resin to the lower mold cavity portion, Seems to occur. 21, a resin sealing frame 1b having a cavity bottom face member 1a having a flat top face shape and a cavity side face member 1b fitted to the outer periphery of the cavity bottom face member 1a The cavity bottom face member 1a is moved downward relative to the cavity side face member 1b to form a gap between the cavity bottom face member 1a and the cavity side face member 1b It is possible to configure the cavity portion 2 of the cavity. At this time, the height position of the bottom face of the cavity portion 2 (that is, the upper face of the cavity bottom face member 1a) is set to be lower than the face face of the lower frame (that is, the upper face of the cavity side face member 1b).

21 (1), the sheet resin 4 adhered on the release film 3 is fed to the cavity portion 2 through the release film 3, and the sheet resin (The upper surface of the cavity side member 1b), which is the outer peripheral edge portion of the cavity portion 2, and the overlap portion 4a is set, (4) is subjected to a picking operation by its own weight so as to be received. That is, the releasing film 3 and the sheet resin 4 have a predetermined flexibility and the overlapped portion 4a of the sheet resin is subjected to a clamping pressure by the bottom surface (not shown) of the upper frame The sheet resin 4 excluding the overlap portion 4a is accommodated in the cavity portion 2 in a state in which the sheet resin 4 is received under the influence of its own weight as shown in Fig. 21 (2). The portion of the sheet resin 4 excluding the overlap portion 4a is cut into the cavity portion 4b by cutting the sheet resin 4 along the peripheral edge portion of the cavity portion 2 (the engagement with the cavity side surface member 1b) 2). Therefore, it is possible to prevent voids in the resin portion 2 from being filled in the peripheral portion 2a of the cavity portion 2.

However, when the semiconductor device on the semiconductor substrate is compression-sealed by using the sheet resin 4 housed in the cavity 2, the following problems have been found. That is, in the semiconductor element on the semiconductor substrate, the sheet resin 4 in the cavity portion 2 is heated to be in a molten state, and then the semiconductor element on the semiconductor substrate is immersed in the molten resin. In this state, the cavity bottom portion member 1a is moved upward to a predetermined height position to compress the resin in the cavity portion 2, thereby compressing and sealing the semiconductor element in the resin package to be molded to a predetermined thickness. However, the peripheral portion of the resin package after molding, that is, the portion to be molded in the peripheral portion 2a in the cavity portion 2, is molded in a protruding shape higher than other portions. This tendency is particularly remarkable in a batch resin sealing using a large substrate. In this case, there is a possibility that the semiconductor elements on the semiconductor substrate can not be reliably sealed in the resin package molded at an equal thickness in each portion of the semiconductor substrate .

This problem is believed to be due to the following technical matters. That is, since each portion of the sheet resin 4 is formed as an even thickness, the portion accommodated in the bottom surface of the cavity portion 2 (that is, the upper surface of the cavity bottom surface member 1a) A large amount of resin material equal to or greater than the thickness of the sheet resin 4 is supplied to the peripheral portion 2a of the cavity portion 2 and the portion corresponding to the depth 2b of the cavity portion 2, . Since the thermosetting resin material is generally used as the sheet resin 4 of this kind, the thermosetting action of the heated cavity portion 2 is apt to be promoted. As a result, the sheet resin 4 accommodated in the cavity portion 2 is melted by the heating action, so that the flow action in the horizontal direction in the cavity portion 2 tends to occur. However, the sheet resin 4 is thermally cured In addition to the reaction, the extensive flow action in the cavity portion 2 tends to be suppressed. Therefore, the molding thickness of the peripheral portion 2a in the cavity portion 2 to which a large amount of the resin material is supplied is formed to be thicker than other portions. Hereinafter, each embodiment of the present invention in which such a problem is solved will be described.

First, the first embodiment shown in Figs. 1 to 8 will be described.

Fig. 1 shows an outline of the semiconductor encapsulation apparatus 10 according to the first embodiment.

The semiconductor sealing device 10 is provided with an upper frame 12 mounted on the lower face of the upper frame base 11 and a lower frame 14 mounted on the upper face of the lower frame base 13, The semiconductor sealing frame 15 is provided. A plurality of semiconductor elements 17 (in the illustrated example, a so-called flip chip type) are provided at predetermined positions of the substrate set portion 16 And the semiconductor substrate 18 mounted thereon can be supplied and set. The upper frame side seal member 19 is provided so as to be movable up and down at a position around the outer periphery of the upper frame base 11. [ The upper frame side seal member 19 is urged to protrude downward by the elasticity of the elastic member 20 provided between the upper frame side seal member 19 and the upper frame base 11. [

The lower frame 14 mounted on the lower frame base 13 side has a cavity bottom face member 21 serving also as a resin pressing member and having an upper face shape formed in a flat shape, And a cavity side member 22 serving as a vertically guiding member of the cavity bottom face member 21, which is fitted and fitted. The cavity bottom face member 21 is biased to protrude upward by the elasticity of the elastic member 23 provided between the cavity bottom face member 21 and the lower frame base 13 side. The cavity side member 22 is biased to protrude upward by the elasticity of the elastic member 24 provided between the cavity side member 22 and the lower frame base 13 side. The elasticity of the elastic member 23 for the cavity bottom face member is set to be weaker than the elasticity of the elastic member 24 for the cavity side face member, as described later.

Further, the cavity bottom face member 21 is fitted into the fitting hole 22a provided at the center of the cavity side face member 22. [ The upper peripheral portion of the fitting hole 22a is provided with an inclined surface 22b which is narrowed toward the upper side. Thus, the upper surface of the central portion of the cavity side surface member 22 is formed into a convex cross-sectional shape.

Further, as will be described later, the cavity bottom face member 21 is provided so as to move to a predetermined vertical position in the clamping action. The cavity bottom surface member 21 and the elastic member 23 are connected to the cavity bottom surface member 21 and the cavity side surface member 22, The resin compression mechanism for compressing and molding the resin material supplied to the resin molding cavity 25 is constituted.

A lower frame side seal member 26 is provided at a position facing the upper frame side seal member 19, which is the outer periphery of the lower frame base 13 side.

The upper frame base 11 is vertically movable through a frame opening / closing mechanism (not shown). When the upper frame 12 and the upper frame 14 shown in Fig. 1 are opened, The upper frame 12 can be moved downward, and conversely, the upper frame 12 can be moved downward to perform clamping, which will be described later.

When the upper and lower cups 12 and 14 are clamped by the frame opening and closing mechanism, the upper frame side seal member 19 and the lower frame side seal member 26 are joined to each other so that the outer periphery of the upper and lower cups 12 and 14 is sealed It is possible to do. An air vent mechanism (not shown) configured to actively discharge the air within the sealing range by the upper frame side seal member 19 and the lower frame side seal member 26 through an appropriate decompression means is provided .

When the upper and lower cups 12 and 14 shown in Fig. 1 are opened, the substrate feeding / unloading mechanism 27 is moved to a predetermined position between the upper and lower cups 12 and 14, The semiconductor substrate 18 can be supplied and set at a predetermined position of the substrate set section 16 by supporting the semiconductor substrate 18 on the substrate set section 16 of the upper mold 12 by holding the semiconductor substrate 18 on the substrate set section 16 of the upper mold 12 have.

Further, an intermediate frame 28 for supporting the semiconductor substrate is provided between the upper and lower mouses 12 · 14. The upper surface of the intermediate frame 28 is provided with a fitting hole portion 28a for fittingly supporting the semiconductor substrate 18 and exposing the semiconductor element 17 on the semiconductor substrate 18 downward. The lower surface of the intermediate frame 28 is provided with a section inclined hole portion 28b for communicating with the fitting hole portion 28a and for fitting the central upper surface of the cavity side surface member 22 formed in a convex cross sectional shape. A resin reservoir 29 for accommodating a surplus resin to be described later is formed between the intermediate frame 28 and the cavity side member 22 at the time of clamping the upper frame 12 and the lower frame 14 (See FIG. 5).

An excess resin capturing means 30 for capturing excess resin, which will be described later, accommodated in the resin reservoir 29 is provided on the upper surface of the central portion of the cavity side member 22. A release film pressing means 32 for elastically pressing the release film 31 extending to the upper surface side of the cavity side member 22 against the bottom surface of the intermediate frame 28 is installed in the cavity side member 22 .

The surplus resin capturing means 30 is provided on the inclined surface 22b of the cavity side member 22. [ The surplus resin capturing means 30 captures the surplus resin 33c accommodated in the resin reservoir 29 through the release film 31 so that the surplus resin 33c contacts the inclined surface of the cavity side surface member 22 22b side (see Fig. 6).

The trapped excess resin 33c is simultaneously released in accordance with the projecting action of the molded product when the frame is opened after molding as described later. However, the surplus resin 33c, (30a).

The coating of the release film 31 against the mold surface (upper surface) of the lower frame 14 and the supply of the sheet resin 33 to the cavity portion 25 are carried out by a so-called roll- Lt; / RTI > That is, as shown in Fig. 1, the release film 31 is formed in an elongated shape. The release film 31 is supplied from the supply roll 34a to the mold face of the lower mold 14 via the supply side guide rolls 34b and the like and is subjected to a predetermined resin compression molding process in the semiconductor mold 15 And is then wound and taken up on the winding roll 34d through the winding-side guide roll 34c and the like.

Further, the sheet resin 33 has a predetermined flexibility. Then, the sheet resin 33 is adhered to the release film 31 at a predetermined interval. 1, the sheet resin 33 is fed to the supply roll 34a in the roll-to-roll mechanism 34 for the purpose of continuous automatic supply to the semiconductor sealing frame 15 side And is wound and mounted. On the release film 31, a protective film 35 (laminate film) for protecting the sheet resin 33 is adhered. The protective film 35 is peeled off before the sheet resin 33 is supplied to the semiconductor sealing frame 15 side. 1, before the sheet resin 33 adhered on the release film 31 and the release film 31 is supplied to the side of the semiconductor sealing frame 15, the sheet resin 33 is removed, The protective film 35 adhered to the upper surface of the protective film 35 is wound on the take-up roll (not shown) of the protective film via the guide roll 34e.

3, the thickness 33T of the sheet resin 33 is set to be approximately equal to the thickness 36T of the resin package 36 to be molded in the cavity portion 25. As shown in Fig. The depth 25D of the cavity 25 for molding the resin package 36 is set to be approximately the same as the thickness 33T of the sheet resin 33. [

The shape of the sheet resin 33 corresponds to the shape of the cavity 25 of the semiconductor sealing frame 15 and corresponds to the opening edge of the cavity 25 (Wide) than the circumferential edge portion. Therefore, when the sheet resin 33 is supplied to the cavity portion 25, alignment (positioning control) of both the center position of the sheet resin 33 and the center position of the cavity portion 25 is performed 3, the portion of the outer peripheral edge of the sheet resin 33 is extended by the portion of the outer peripheral edge of the cavity 25 (that is, the upper surface of the cavity side member 22) It is possible to set the portion 33a.

A supply side tension roll and a winding side tension roll are provided at predetermined positions between a supply side guide roll 34b and a take-up side guide roll 34c of the roll-to-roll mechanism 34 (not shown) The height position of the two-tension roll can be adjusted so that the covering state of the release film 31 is adjusted with respect to the mold face of the lower frame 14 or the tension of the release film 31 is adjusted .

A suction mechanism (not shown) of a release film configured to discharge the air in the cavity 25 from the fitting position of the cavity bottom face member 21 and the cavity side face member 22 to the outside through a suitable decompression means is provided do. Therefore, when the adsorption mechanism of the release film 31 is operated in a state that the release film 31 is coated on the mold surface (upper surface) of the lower mold 14, As shown in FIG.

Hereinafter, a case of supplying the sheet resin 33 to the upper surface portions of the lower frame 14 (the cavity bottom surface member 21 and the cavity side surface member 22) will be described.

The upper surface height position of the cavity bottom surface member 21 of the semiconductor sealing frame 15 is set to be the height position of the cavity side surface member 22 including the upper surface height position of the cavity side surface member 22 The height of the cavity bottom face member is set. The inclusion of the upper surface height position of the cavity side member 22 means that the height position of the upper surface of the cavity bottom member 21 and the height position of the upper surface of the cavity side member 22 are the same height position, And the upper surface is a smooth surface (see Fig. 3). The height position of the upper surface of the cavity bottom surface member 21 is set to a height of the upper surface height of the cavity bottom surface member 21 and the cavity side surface member 22, Height position higher than the height position of the upper surface.

In this embodiment, the upper surface height position of the cavity bottom surface member 21 and the upper surface height position of the cavity side surface member 22 are set to be smooth surfaces. The upper surface height position of the cavity bottom surface member 21 can be set to a height position higher than the upper surface height position of the cavity side surface member 22. [ This setting can be easily implemented by moving the cavity bottom surface member 21 upwardly and selecting its top surface height position through an appropriate up-down driving mechanism (not shown). The upper surface height position of the cavity bottom surface member 21 can be selected by effectively setting the overlapping portion 33a by overlapping the peripheral portion of the sheet resin 33 with the upper surface of the cavity side surface member 22, The height position of the sheet resin 33, the heat curing reaction time of the sheet resin 33, the relationship with the clamping operation, other molding conditions, and the like. As a result of the experiment based on these conditions, it was found that the height position of the top surface of the cavity bottom surface member 21 was changed from the height position of the top surface of the cavity side surface member 22 to 3 (height corresponding to the thickness of the sheet resin 33) Times or less, it could be carried out suitably. Therefore, the height position higher than the height position of the top surface of the cavity side member 22 may be set to be three times or less the height corresponding to the thickness of the sheet resin 33. [

Next, a sheet resin arranging step of arranging the molded sheet resin 33 as an area larger than the area of the cavity bottom face member 21 on the top face of the cavity bottom face member 21 (that is, the cavity portion 25) . In addition, as described above, the alignment of both the center of the sheet resin 33 and the center of the cavity bottom surface member 21 is performed during the sheet resin placement process.

The periphery of the sheet resin 33 disposed on the upper surface of the cavity bottom surface member 21 is overlapped with the upper surface of the cavity side surface member 22 and superposed on the upper surface of the cavity side surface member 22, A sheet resin overlap setting step of setting the overlapped portion 33a of the sheet resin 33 on the outer peripheral edge portion of the sheet 21 is performed (see Fig. 3).

As described above, in the sheet resin placement step, the sheet resin 33 adhered to the upper surface of the release film 31 is supplied to the upper surface portion of the cavity bottom surface member 21, The sheet resin 33 may be disposed on the upper surface portion of the cavity bottom surface member 21. [

Hereinafter, the case where the semiconductor element 17 on the semiconductor substrate 18 is resin-sealed by using the sheet resin 33 supplied to the upper surface portion of the lower frame 14 will be described.

After the sheet resin overlap setting process is performed, the upper mold 12 and the lower mold 14 are clamped to form a clamping portion 25 (see FIG. 3) for forming the resin between the upper and lower chambers 12, .

In the clamping process of the upper and lower cups 12 and 14, along the peripheral edge portion of the cavity bottom face member 21 and the cavity side face member 22 (that is, the peripheral edge portion of the fitting hole 22a) (See Fig. 4 and Fig. 5). At this time, the overlapped portion 33a is cut, and the separated sheet resin 33b after cutting has a fixed capacity (see Fig. 3). 5, the overlapped portion 33a, which is cut and separated by heating and melted, is heated by the excess resin 33c (see FIG. 5) And is accommodated in the resin reservoir 29.

The sheet resin 33b is cut into the upper surface of the cavity bottom surface member 21 and the sheet resin 33b is accommodated in the cavity portion 25 so that the overlapping portion on the upper surface of the cavity side surface member 22 (See Fig. 5) in which the surplus resin 33c of the surplus resin 33a is accommodated in the resin storage 29 for surplus resin provided at the outer position of the cavity bottom surface member 21 (see Fig. 5). Further, by moving the cavity bottom surface member 21 downward relative to the cavity side surface member 22 through an appropriate vertical drive mechanism (not shown) as described above, the cavity bottom surface member 21 and the cavity side surface And the cavity portion 25 can be formed between the members 22. Therefore, the sheet resin 33b after the cutting is subjected to the sheet resin cutting process in a certain amount efficiently and securely in the cavity 25. [

5, the post-cut sheet resin 33b housed in the cavity portion 25 is heated and melted, and the semiconductor element 17 on the semiconductor substrate 18 is melted by heating the molten resin material 33 in the cavity portion 25. Then, A resin compression molding step for sealing the semiconductor element 17 on the semiconductor substrate 18 in the resin package 36 molded to a predetermined uniform thickness is carried out by compressing the molten resin material while immersed in the resin package 36.

In the resin compression molding step, a sheet resin 33b having a thickness 33T substantially equal to the thickness 36T of the resin package 36 can be supplied into the cavity 25, It is possible to effectively prevent the void portion in the unfilled state of the resin portion 25 from being generated in the peripheral portion of the cavity portion 25 evenly and uniformly in the cavity portion 25. Therefore, the resin material (sheet resin 33b) can be uniformly supplied and charged to the respective portions in the cavity portion 25. [ Therefore, the resin material in the cavity portion 25 can be uniformly heated and melted. Therefore, it is possible to effectively prevent or suppress the flow of the molten resin material in the cavity portion 25 to the peripheral portion or the like, in addition to not forming the void portion in the resin-unfilled state in the peripheral portion of the cavity portion 25 . Further, the action of compressing the molten resin material in the cavity portion 25 can be performed at a low pressure (low speed) by moving the cavity bottom face member 21 up to a predetermined height position. The semiconductor element 17 on the semiconductor substrate 18 is pressed and displaced due to the action of preventing or suppressing the resin flow in the cavity 25 and the effect of low compression of the molten resin material It can be surely prevented. In this way, since the semiconductor element 17 on the semiconductor substrate 18 can be resin-sealed in a proper state, the semiconductor element 17 is sealed in the resin package 36 compression-molded at an equal thickness in each portion .

After the resin compression molding process, the upper and lower cups 12 占 4 and the intermediate frame 28 are again unfolded (see Fig. 1) It is preferable to carry out the resin-sealed substrate in a state in which it is retained on the substrate set section 16 and supported. When the resin-sealed substrate is protruded from the cavity portion 25 through the release film 31 at the time of releasing the frame, the cavity bottom surface member 21 may be moved upward as shown in Fig. 7 , And an air blowing step in which the compressed air A is jetted from the fitting hole 22a may be performed.

The release film after use may be discharged to the outside of the frame through the winding roll 34d of the roll-to-roll mechanism 34 and wound and accommodated in the winding roll 34d. Further, since the sheet resin 33 is adhered to the elongated release film 31 at a predetermined interval, the release function of the release film after use and the supply operation of the release film before the next use are set to be performed automatically and continuously .

The height of the upper surface of the cavity bottom surface member 21 and the height of the upper surface of the cavity side surface member 22 So that the upper surface of the so-called both surfaces becomes a smooth surface. Therefore, it is possible to reliably prevent the previous adverse effect that the sheet resin 33b falls in the cavity portion 25. Therefore, it is possible to prevent the void portion in the resin-unfilled state from being generated in the peripheral portion of the cavity portion 25 constituted at the time of clamping and to secure the resin material in an appropriate amount for the resin sealing of the semiconductor element 17 to the cavity portion 25 ). Further, when the molten resin material in the cavity portion 25 is compressed, the flow action of the molten resin material can be prevented or effectively suppressed. Therefore, it is possible to effectively prevent the problem that the semiconductor element 17 is pressed and displaced on the semiconductor substrate 18 due to the flow action of the molten resin material in the cavity portion 25. It also shows a practical effect that the semiconductor element 17 on the semiconductor substrate 18 can be sealed in the resin package 36 molded in an even thickness on each part of the semiconductor substrate 18. [

The resin reservoir 29 for accommodating the excess resin 33c is formed between the intermediate frame 28 and the cavity side member 22 at the time of clamping the upper frame 12 and the lower frame 14 Therefore, the conventional resin reservoir provided on the upper surface of the lower mold can be omitted. Since the resin reservoir 29 can be provided at a position near the periphery of the cavity 25, it is possible to provide a clamp region (in the figure, middle) in the outer peripheral portion of the semiconductor substrate 18, The range of the substrate holding by the frame 28] is not wide.

In the above description, the elastic member 23 for the cavity bottom surface member 21 and the elastic member 24 for the cavity side surface member 22 are provided. However, the cavity bottom surface member 21, A vertical drive mechanism (not shown) for independently moving up and down the cavity bottom surface member 21 may be provided instead of the elastic member 23 for the elastic member 23 for use. In this case, the height position of the upper surface (that is, the bottom surface of the cavity) of the cavity bottom surface member 21 can be arbitrarily selected and set by independently moving the cavity bottom surface member 21 up and down through the up / down drive mechanism . The semiconductor element 17 on the semiconductor substrate 18 and the cavity bottom face member 21 can be moved downward to a predetermined height position by clamping the cavity bottom face member 21 in conjunction with the clamping action. It is possible to avoid contact of the upper surface (cavity bottom surface) Therefore, it is possible to suitably cope with the semiconductor element 17 even in the so-called wire bonding type.

The semiconductor substrate 18 on the substrate supply / dispensing mechanism 27 is supported on the substrate set portion 16 of the upper frame 12 by holding the semiconductor substrate 18 on the intermediate frame 28 The intermediate frame 28 may be mounted on the substrate set portion 16 of the upper frame 12. In this case,

As shown in Fig. 8, resin adhesion preventing means (not shown) for preventing the excess resin 33c contained in the resin storing portion 29 from adhering to the intermediate mold 28 side constituting the resin storing portion 29 (37) may be implemented. For example, the surface on the side of the intermediate frame 28 may be subjected to a surface treatment by nickel plating, or a surface treatment with a simple releasable material such as a fluorine-based or silicon-based resin may be performed on the surface or a structure in which the simple releasable layer is integrated The resin adhesion preventing means 37 may be used. As shown in Fig. 8, a so-called undercut portion 30b may be formed in the surplus resin capturing portion of the surplus resin capturing means 30 to enhance the surplus resin capturing effect.

Hereinafter, a second embodiment of the present invention will be described with reference to Figs. 9 to 14. Fig.

In the first embodiment, the intermediate frame 28 provided between the upper and lower mats 12 · 14 is provided with a fitting hole portion 28a for fittingly supporting the semiconductor substrate 18, and a central upper surface of the cavity side member 22 A resin reservoir 29 for accommodating the excess resin 33c is formed between the intermediate frame 28 and the cavity side member 22 at the time of opening the frame Configuration was shown. An intermediate frame 38 is provided between the upper frame 12 and the lower frame 14 and a semiconductor element 17 on the semiconductor substrate 18 is fitted to the upper face of the intermediate frame 38 And the bottom surface of the cavity portion 38a is configured to constitute an engagement portion 38b of the sheet resin 33. The present embodiment is different from the first embodiment in this respect. In this embodiment, substantially the same components as those in the first embodiment are the same as those described in the first embodiment, and the components common to those in the first embodiment are denoted by the same reference numerals.

9 to 14, the lower frame 14 mounted on the lower frame base 13 side is composed of a cavity bottom face member 21 also serving as a resin pressing member, And a cavity side member 22 which is fitted to the outer periphery and also serves as a vertical guide member of the cavity bottom face member 21. [ The upper surface of the cavity bottom surface member 21 and the cavity side surface 22 are formed in a flat shape. The resin reservoir 29 of the surplus resin 33c is provided on the upper surface of the cavity side member 22 which is located around the outer periphery of the cavity bottom surface member 21. [

Further, the cavity bottom surface member 21 is provided so as to be able to independently move to a predetermined vertical position via an appropriate vertical drive mechanism (not shown). Therefore, similarly to the first embodiment, the height position of the top surface of the cavity bottom surface member 21 can be set to be the height position above the top surface height of the cavity side surface member 22, including the top surface height position of the cavity side surface member 22 have. The cavity side member 22 is biased to protrude upward due to the elasticity of the elastic member 24 provided between the cavity side member 22 and the lower mold base 13.

Further, at the time of clamping, the cavity bottom surface member 21 is moved upward, and the upper surface portion (i.e., cavity bottom surface) thereof is fitted into the cavity portion 38a of the intermediate mold 38, The depth 25D of the predetermined cavity portion 38a can be set by the upper surface portions of the intermediate frame 38 and the cavity bottom surface member 21 by moving to a predetermined height position (see FIG. 13). The cavity bottom surface member 21 constitutes a resin compression mechanism for compressing and molding the resin material supplied into the upper surface portion of the cavity bottom surface member 21 and the cavity portion 38a of the intermediate mold 38 have.

In the first embodiment, the cavity bottom portion member 21 is moved below the top surface position of the cavity side member 22 to form the cavity portion 25 for resin molding. On the other hand, in the present embodiment,

Moving the cavity bottom face member 21 upwards to a predetermined height position during clamping,

Cutting the sheet resin 33 in the fitting portion 38b by pushing up the upper surface portion (cavity bottom surface) of the cavity bottom surface member 21,

The sheet resin 33b after cutting is accommodated in the cavity portion 38a and the overlap portion 33a which is the peripheral portion of the sheet resin 33 is cut and separated to become the excess resin 33c and the cavity side member 22 (See Fig. 13) housed in and captured by the resin reservoir 29 provided on the upper surface of the housing (see Fig. 13).

In this embodiment, there are the differences as described above, but the same effects as those of the first embodiment can be achieved. That is, according to the present embodiment, when the sheet resin 33b is supplied into the cavity 25 through the release film 31, the height position of the cavity bottom surface member 21 and the height of the cavity side surface member 22 The upper surface height position is set at the same height position, and the so-called top surface is set to be a smooth surface. Therefore, the picking up operation for the sheet resin 33 as in the first embodiment can be ignored. Therefore, voids in the resin-unfilled state are not formed in the peripheral portion of the cavity portion 38a formed in the intermediate frame 38, and an appropriate amount of the resin material necessary for resin- Can be supplied in the portion 38a. Further, when the molten resin material in the cavity portion 38a is compressed, the flow action of the molten resin material can be prevented or effectively suppressed. Therefore, it is possible to effectively prevent a problem such as displacement of the semiconductor element 17 on the semiconductor substrate 18 due to the flow action of the molten resin material in the cavity portion 38a. It is also possible to achieve a practical effect that the semiconductor element 17 on the semiconductor substrate 18 can be sealed in the resin package 36 molded to an even thickness on each part of the semiconductor substrate 18. [

Next, a third embodiment of the present invention will be described with reference to Figs. 15 to 17. Fig.

When the sheet resin 33 is supplied to the upper surface portion of the lower frame 14, the height position of the upper surface of the cavity bottom surface member 21 and the height position of the cavity side surface member 22 Can be set at the same height position, that is, the upper surface of both members 21 and 22 becomes a smooth surface. In addition, in the present embodiment, the upper surface height position of the cavity bottom surface member 21 can be set to a height position higher than the upper surface height position of the cavity side surface member 22. In the present embodiment, when the sheet resin 33 is supplied to the upper surface of the lower frame 14, the height of the upper surface of the cavity bottom surface member 21 is set to be equal to or greater than the height of the upper surface of the cavity side surface member 22 The height position is described in detail. In the present embodiment, substantially the same components as those of the first and second embodiments are the same as those described in the first and second embodiments, and the components common to those of the first and second embodiments are denoted by the same reference numerals. In addition, since this embodiment can be carried out in the same way as in the first and second embodiments, a description will be given briefly in comparison with the first embodiment in order to avoid duplication of description.

15 shows a state in which the semiconductor substrate 18 is supplied and set to the upper frame 12 and the intermediate frame 28 and the sheet resin 33 is supplied to the upper face portion of the lower frame 14, 12 and the intermediate frame 28 are moved downward. At this time, the upper surface height position 21h of the cavity bottom surface member 21 is set to be higher than the upper surface height position 22h of the cavity side surface member 22. The height position above the upper surface height position 22h of the cavity side surface member 22 means that the upper surface height position 21h of the cavity bottom surface member 21 and the upper surface height position 22h of the cavity side surface member 22 are smooth Plane state. The upper surface height position 21h of the cavity bottom surface member 21 is set to be higher than the upper surface height position 22h of the cavity side surface member 22 so as to be disposed on the upper surface of the cavity bottom surface member 21 It is possible to prevent the sheet resin 33 from being floated by the magnetic weight.

In the first clamping state, the sheet resin 33 is disposed on the upper surface portion of the cavity bottom surface member 21, and the overlap portion 33a, which is the peripheral edge portion of the sheet resin 33, On the inclined surface 22b of the main body 22a. That is, the sheet resin 33 on the cavity bottom surface member 21 does not exhibit the receiving action due to its own weight, but the overlapped portion 33a is in a state of falling along the inclined surface 22b of the cavity side surface member 22 .

16 shows a second clamping state in which the upper frame 12 and the intermediate frame 28 are further moved downward from the first clamping state. At this time, the bottom surface of the semiconductor substrate 18 and the semiconductor element 17 mounted on the bottom surface are bonded to the upper surface of the sheet resin 33 on the cavity bottom surface member 21, and in this state, the upper frame 12 And the intermediate frame 28 together.

17 shows a third clamping state in which the upper frame 12 and the intermediate frame 28 are further moved downward from the second clamping state. At this time, the bottom surface of the semiconductor substrate 18 and the semiconductor element 17 are fixed to the elasticity of the elastic member 23 through the sheet resin 33 on the cavity bottom surface member 21, And is moved downward to a predetermined height position constituting the cavity portion 25 in opposition thereto.

At this time, the sheet resin 33 on the cavity bottom face member 21 is positioned at the position where the cavity bottom face member 21 and the cavity side face member 22 are fitted (that is, the peripheral edge portion of the fitting hole 22a) . The sheet resin 33b after being cut is compressed in response to the elastic pressure of the cavity bottom surface member 21 and is sealed in the resin package 36 molded by the cavity portion 25. [ Since the sheet resin 33 is heated and melted by the heating action from the heating means (not shown) attached to the semiconductor sealing frame 15, the sheet resin 33b after cutting is accommodated in the cavity portion 25 Is subjected to a predetermined clamping pressure by the cavity bottom surface member 21 while being melted.

The overlapped portion 33a is separated from the sheet resin 33b after cutting to become an excess resin 33c and then the inclined face 28b of the intermediate frame 28 and the inclined face 28b of the cavity side face member 22 22b of the resin reservoir 29,

Although the present embodiment has the above-described differences, the same effects as those of the first embodiment can be exhibited. That is, in the present embodiment, when the sheet resin 33 is supplied to the upper surface portion of the lower frame 14, the upper surface height position 21h of the cavity bottom surface member 21 is set to the upper surface height of the cavity side surface member 22 The sheet resin 33 disposed on the upper surface of the cavity bottom surface member 21 can be prevented from being floated by the magnetic weight. The overlapped portion 33a is in a state of being abraded along the inclined surface 22b of the cavity side surface member 22 but this portion becomes a surplus resin 33c so that the resin that is formed on the outer side of the cavity bottom surface member 21 And is accommodated in the storage section 29. Therefore, it is possible to prevent the void portion in the resin-unfilled state from being generated in the peripheral portion of the cavity portion 25 constituted at the time of clamping and to secure the resin material in an appropriate amount for the resin sealing of the semiconductor element 17 to the cavity portion 25 ). Further, when the molten resin material in the cavity portion 25 is compressed, the flow action of the molten resin material can be prevented or effectively suppressed. Therefore, it is possible to effectively prevent the problem that the semiconductor element 17 on the semiconductor substrate 18 is pushed and displaced due to the flow action of the molten resin material in the cavity portion 25. It is also possible to achieve a practical effect that the semiconductor element 17 on the semiconductor substrate 18 can be sealed in the resin package 36 molded to an even thickness on each part of the semiconductor substrate 18. [

Next, a fourth embodiment of the present invention will be described with reference to Figs. 18 to 20. Fig.

In the first to third embodiments, the coating of the release film 31 with respect to the mold surfaces of the lower mold frame 14 (the cavity bottom face member 21 and the cavity side face member 22) The sheet resin 33 is fed to the rollers 38a and 38a automatically by the roll-to-roll mechanism 34. [ On the other hand, in the present embodiment, the sheet resin 40 adhered on the release film 39 of the short cut type corresponding to the shape of the mold of the lower mold 14 is pressed against the upper face of the cavity bottom face member 21 And the loading frame mechanism 41 for artificially supplying the air to the load frame mechanism 41. In this respect, the present embodiment is different from the first embodiment to the third embodiment. Further, the loading frame mechanism 41 described in this embodiment can be similarly used corresponding to the configuration of the semiconductor sealing frame 15 shown in the first to third embodiments. Therefore, in order to avoid duplication of description, this embodiment will be described with reference to the configuration of the second embodiment. In the present embodiment, substantially the same configurations as those of the first to third embodiments are the same as those described in the first to third embodiments, and the same reference numerals are used for the configurations common to the first to third embodiments .

Fig. 18 schematically shows the entire loading frame mechanism 41. Fig. The loading frame mechanism 41 is provided with a detachable upper and lower frames 41a and 41b and a gripping portion 41c for closing and transporting the upper and lower frames 41a and 41b. The sheet resin 40 is adhered to the upper surface of the release film 39 of the short type which is pre-cut corresponding to the mold surface shape (square in the figure) of the lower mold 14. In addition, the release film 39 is provided so as to be detachable from the mating surfaces of the upper and lower frames 41a and 41b.

Reference numeral 42 in the drawing denotes a support for mounting and supporting a loading frame mechanism 41 provided on the cavity side member 22. [ 20, when the loading frame mechanism 41 is fitted and mounted on the support table 42, the height of the mating surfaces of the upper and lower frames 41a and 41b and the lower surface of the lower frame 14 is So as to have the same height position.

Next, a case will be described in which the sheet resin 40 on the release film 39 is supplied to the mold surface (upper surface portion of the cavity bottom surface member 21) of the lower mold 14 through the loading frame mechanism 41 . First, the upper and lower frames 41a and 41b are opened, and the release film 39 is sandwiched between the upper and lower frames 41a and 41b, as shown in Fig. 18 (2). At this time, the sheet resin 40 is adhered to the central portion of the upper surface of the release film 39. The protective film (not shown) adhered to the upper surface of the sheet resin 40 is formed so as to be peeled off before or after the sheet resin 40 is sandwiched between the upper and lower frames 41a and 41b It is good to do.

Next, the upper surface height position of the cavity bottom surface member 21 and the upper surface height position of the cavity side surface member 22 are set to the same height position. 19 and 20, the loading frame mechanism 41 holding the sheet resin 40 through the release film 39 is mounted on a support table 42 provided on the cavity side member 22 Fit and mount. At this time, the upper surface height position of the cavity bottom surface member 21 and the upper surface height position of the cavity side surface member 22 are set to the same height position as the smooth surface. Therefore, the sheet resin 40 on the release film 39 sandwiched by the loading frame mechanism 41 can be formed in the same manner as the sheet resin of the second embodiment, The resin 33b) can be prevented from being damaged. Further, the peripheral portion of the sheet resin is extended over the upper surface of the cavity side member 22 to overlap the upper side of the cavity side member 22 (see Fig. 10).

Further, in this embodiment,

Moving the cavity bottom face member 21 up to a predetermined height position during clamping,

Cutting the sheet resin 40 in the fitting portion 38b by pushing up the upper surface portion (cavity bottom surface) of the cavity bottom surface member 21,

The overlapping portion 33a of the sheet resin which becomes the excess resin 33c is cut and separated and is stored in the resin storage portion 33a provided on the upper surface of the cavity side member 22, (29)

Are the same as in the second embodiment.

According to this embodiment, since the upper surface height position of the cavity bottom surface member 21 and the upper surface height position of the cavity side surface member 22 are set to the same height position, the loading frame mechanism 41 It is possible to reliably prevent the previous adverse effect that the sheet resin 40 supplied through the through hole 38 is supplied into the cavity portion 38a. Therefore, voids in the resin-unfilled state are not formed in the peripheral portion of the cavity portion 38a formed at the time of clamping, and the resin material in an appropriate amount for sealing the semiconductor element 17 is sealed in the cavity portion 38a ). Further, when the molten resin material in the cavity portion 38a is compressed, the flow action of the molten resin material can be prevented or effectively suppressed. Therefore, it is possible to effectively prevent a problem such as displacement of the semiconductor element 17 on the semiconductor substrate 18 due to the flow action of the molten resin material in the cavity portion 38a. It is also possible to achieve a practical effect that the semiconductor element 17 on the semiconductor substrate 18 can be sealed in the resin package 36 molded to an even thickness on each part of the semiconductor substrate 18. [

The present invention is not limited to the above-described embodiments, and can be appropriately changed and selected as necessary within the scope of the present invention.

As described above, in the present invention, the coating of the release film against the mold surface of the lower mold (cavity bottom member and cavity side member) and the supply of the sheet resin to the cavity portion (upper surface of the cavity bottom member) , And can be automatically performed by a roll-to-roll mechanism. Further, in the present invention, as described above, for example, a long releasing film is taken out from a roll on which a long releasing film is wound, and a short releasing film (pre-cut) Can be used. In this case, the sheet resin is adhered onto the entirety of the release film formed by pre-cutting in correspondence with the shape of the mold of the lower mold, and the mold of the lower mold is covered with the release film of the short- The sheet resin can be supplied to the cavity portion through the film.

10: Semiconductor sealing device 11: Upper mold base
12: upper frame 13: lower frame base
14: lower frame 15: semiconductor sealing frame
16: substrate set section 17: semiconductor element
18: semiconductor substrate 19: upper frame side seal member
20: elastic member 21: cavity bottom surface member
21h: upper surface height position 22: cavity side member
22a: fitting hole 22b: inclined surface
22h: upper surface height position 23: elastic member
24: elastic member 25:
25D: depth of the cavity portion 26: lower frame side seal member
27: substrate supply / dispensing mechanism 28: intermediate mold
28a: fitting hole portion 28b:
29: Resin storage section 30: Surplus resin capturing means
30a: projecting mechanism 30b: undercut portion
31: release film 32: release film pressing means
33: sheet resin 33a: overlapped portion
33b: Sheet resin after cutting 33c: Surplus resin
33T: Thickness of sheet resin 34: Roll-to-roll mechanism
34a: Feed roll 34b: Feed side guide roll
34c: a winding side guide roll 34d: a winding roll
34e: guide roll 35: protective film
36: Resin package 36T: Resin package thickness
37: resin sticking prevention means 38: intermediate mold
38a: Cavity portion 38b:
39: release film 40: sheet resin
41: loading frame mechanism 41a: upper frame
41b: Lower frame 41c:
42: Support A: Compressed air

Claims (15)

An upper frame for setting a semiconductor substrate on which a plurality of semiconductor elements are mounted, a lower frame for compressing and sealing the semiconductor elements on the semiconductor substrate with resin, and a flat plate- A resin sealing frame comprising at least a cavity bottom face member provided in a mold and a cavity side member fitted in the outer periphery of the cavity bottom face member and serving also as a vertical guide member of the cavity bottom face member, A method for supplying a sheet resin to supply a resin,
A cavity bottom surface member height setting step of setting a height position of a top surface of the cavity bottom surface member to a height position of a height of a top surface height of the cavity side surface member,
A sheet resin arranging step of arranging a sheet resin, which is performed after the cavity bottom surface member height setting step and has an area larger than that of the cavity bottom surface member, on the top surface of the cavity bottom surface member;
Wherein a peripheral edge portion of the sheet resin disposed on an upper surface portion of the cavity bottom face member is overlapped with an upper face of the cavity side face member to overlap the outer peripheral edge portion of the cavity bottom face member, A sheet resin overlap setting step of setting an overlapped portion of the sheet resin on a portion
The method of supplying a sheet resin according to claim 1, 2. The method according to claim 1, wherein in the step of positioning the cavity bottom surface member, the height position of the top surface of the cavity bottom surface member is equal to or more than the height of the top surface of the cavity side surface member, Is set to be 3 times or more as high as the height corresponding to the thickness of the sheet resin. The method according to claim 1,
The sheet resin is adhered onto the release film and the sheet resin is disposed on the upper surface of the cavity bottom surface member so that the sheet resin is disposed on the upper surface of the cavity bottom surface member through the release film,
Further comprising a step of supplying the sheet resin. A lower mold for compressing and sealing the semiconductor element on the semiconductor substrate with a resin; and a lower mold having a flat upper surface shape which also functions as a resin pressing member, A cavity bottom face member provided in the lower mold and a cavity side face member fitted in the outer periphery of the cavity bottom face member and serving also as a vertical guide member of the cavity bottom face member, A semiconductor sealing method for resin-sealing the semiconductor element,
A cavity bottom surface member height setting step of setting a height position of a top surface of the cavity bottom surface member to a height position of a height of a top surface height of the cavity side surface member,
A sheet resin arranging step of arranging a sheet resin, which is performed after the cavity bottom surface member height setting step and has an area larger than that of the cavity bottom surface member, on the top surface of the cavity bottom surface member;
Wherein a peripheral edge portion of the sheet resin disposed on an upper surface portion of the cavity bottom surface member is extended and overlapped on an upper surface of the cavity side surface member so as to overlap the outer peripheral edge of the cavity bottom surface member A sheet resin overlap setting step of setting an overlapped portion of the sheet resin on the sheet,
A clamping step of clamping the upper frame and the lower frame to form a cavity for resin molding between the upper and lower frames,
A sheet resin cutting step performed at the clamping step and cutting the sheet resin along a fitting portion of the cavity bottom member and the cavity side member;
Wherein the sheet resin is cut in the sheet resin cutting step and the sheet resin after cutting is housed in the cavity portion on the upper surface of the cavity bottom face member, and in the resin storage portion provided at the outer position of the cavity bottom face member, A sheet resin receiving step of receiving the sheet resin as an excess resin,
Melting the sheet resin after cutting the sheet resin accommodated in the cavity portion and heating the sheet resin so that the semiconductor element on the semiconductor substrate is immersed in the heated and molten sheet resin in the cavity portion, A resin compression molding process for sealing the semiconductor element on the semiconductor substrate to a resin package molded to a predetermined uniform thickness by compressing the sheet resin
Wherein the semiconductor encapsulation method comprises the steps of: 5. The method according to claim 4, wherein in the step of positioning the cavity bottom surface member, the height position of the top surface of the cavity bottom surface member is equal to or more than the height of the top surface of the cavity side surface member, Is set to be three times or more as high as the height corresponding to the thickness of the sheet resin. The semiconductor encapsulation method according to claim 4, wherein the thickness of the sheet resin and the thickness of the resin package molded in the resin compression molding step are equalized. The semiconductor encapsulation method according to claim 4, wherein the clamping step is performed by moving the cavity bottom member relatively downward relative to the cavity side member. The semiconductor device according to claim 4, wherein the resin sealing frame has an intermediate frame for supporting a semiconductor substrate between the upper frame and the lower frame,
Wherein in the clamping step, the resin reservoir is formed between the intermediate mold and the cavity side member. The semiconductor device according to claim 4, wherein the resin sealing frame has an intermediate frame for supporting a semiconductor substrate between the upper frame and the lower frame,
Wherein in the clamping step, the cavity portion is formed between the intermediate mold and the cavity bottom surface member. 5. The method according to claim 4, wherein in the step of arranging the sheet resin, the sheet resin adhered to the elongate release film is disposed on the top surface portion of the cavity bottom face member through a roll-to- Wherein the semiconductor encapsulation method comprises the steps of: 5. The method according to claim 4, wherein in the step of arranging the sheet resin, a sheet resin adhered to a release film of a precut type corresponding to the shape of the mold surface of the lower mold is fed to a loading frame for artificially conveying the sheet resin Wherein the cavity is disposed on an upper surface portion of the cavity bottom surface member through a mechanism. A lower mold for compressing and sealing the semiconductor element on the semiconductor substrate with a resin; and a lower mold having a flat upper surface shape which also functions as a resin pressing member, A cavity bottom face member provided on the lower frame and a cavity side face member mounted on the outer periphery of the cavity bottom face member and serving also as a vertical guide member of the cavity bottom face member, A semiconductor sealing device for resin-sealing the semiconductor device,
An intermediate frame for supporting the semiconductor substrate provided between the upper frame and the lower frame,
The resin reservoir for accommodating the excess resin
Lt; / RTI &
Wherein the resin reservoir is formed between the intermediate frame and the cavity side member by clamping the upper frame and the lower frame. 13. The semiconductor sealing apparatus according to claim 12, further comprising: surplus resin capturing means for capturing the surplus resin accommodated in the resin reservoir, to the cavity side member. 13. The semiconductor encapsulation apparatus according to claim 12, further comprising resin adhering prevention means for preventing the excess resin accommodated in the resin storage section from adhering to the intermediate mold. A lower mold for compressing and sealing the semiconductor element on the semiconductor substrate with a resin; and a lower mold having a flat upper surface shape which also functions as a resin pressing member, A cavity bottom face member provided on the lower frame and a cavity side face member mounted on the outer periphery of the cavity bottom face member and serving also as a vertical guide member of the cavity bottom face member, A semiconductor sealing device for resin-sealing the semiconductor device,
An intermediate frame for supporting the semiconductor substrate provided between the upper frame and the lower frame,
The cavity portion for resin molding
Lt; / RTI &
Wherein the cavity is formed between the cavity bottom member and the intermediate mold by clamping the upper mold and the lower mold.
KR1020150037414A 2014-03-19 2015-03-18 Method for providing resin sheet and method and device for encapsulating semiconductor KR101718605B1 (en)

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