JP2022185184A - Resin sealing device and resin sealing method - Google Patents

Abstract

To provide a resin sealing device and a resin sealing method that solve problems that a lower die with a cavity may cause, give small damage to a work in resin sealing, and improve molding quality.SOLUTION: A resin sealing device 1 uses a sealing metal mold 202 which comprises an upper die 204 and a lower die 206 to process a work W having an electronic component Wb on a base material into a molding Wp by sealing the work with resin R, and comprises: a heating mechanism which heats the upper die 204 at predetermined temperature; a suction mechanism which sucktionally retains a film F in a cavity 208 arranged on a reverse side of the upper die 204; a press member 214 which has the resin R placed on its top surface 214a; and a moving and sticking mechanism 215 which moves the press member 214 upward and presses the placed resin R within the cavity 208 of the upper die 204 heated at the predetermined temperature to stick the resin on the reverse surface of the film F.SELECTED DRAWING: Figure 3

Description

The present invention relates to a resin sealing apparatus and a resin sealing method.

Examples of a resin encapsulation apparatus and a resin encapsulation method for encapsulating a workpiece having an electronic component mounted on a base material with encapsulation resin (hereinafter sometimes simply referred to as "resin") and processing it into a molded product include: A compression molding method is known.

In the compression molding method, a predetermined amount of resin is supplied to a sealing region (cavity) provided in a sealing mold configured with an upper mold and a lower mold, and a work is placed in the sealing region, This is a technique for resin sealing by clamping with an upper mold and a lower mold. As an example, when using a sealing mold having a cavity in the upper mold, there is known a technique of supplying resin to the central position of the work collectively for molding. On the other hand, when using a sealing mold having a cavity in the lower mold, there is known a technique of covering the mold surface including the cavity with a film and supplying resin with a uniform thickness for molding (Patent Document 1: See JP-A-2019-145550).

JP 2019-145550 A

In the conventional compression molding method, it is better to have a cavity in the lower mold and liquefy the resin in the cavity to seal it with resin, which causes damage especially to the work on which the electronic parts with wires are mounted. It was considered small and superior. On the other hand, in the case of a structure having a cavity in the lower mold, it is difficult to evenly supply (disperse) the resin to the outermost peripheral position in the cavity, which causes deterioration in molding quality. In addition, it is important to prevent the resin from leaking (spilling) from inside the cavity in order to maintain good molding quality. Since foaming occurs due to decompression, there is a problem that the resin tends to leak.

The present invention has been made in view of the above circumstances, and by adopting a structure having a cavity in the upper mold, the above problems in the structure having a cavity in the lower mold are solved, and damage to the work during resin sealing is reduced. It is also an object of the present invention to provide a resin sealing apparatus and a resin sealing method capable of improving molding quality.

The present invention solves the above-described problems by means of solving means described below as one embodiment.

A resin encapsulation apparatus according to the present invention uses a encapsulation mold having an upper mold and a lower mold to seal a workpiece having an electronic component mounted on a base material with a resin to process it into a molded product. An apparatus comprising: a heating mechanism for heating the upper mold to a predetermined temperature; a suction mechanism for sucking and holding a film in a cavity arranged on the lower surface side of the upper mold; and the resin is placed on the upper surface. a pressing member, and a movement for moving the pressing member upward to press the placed resin in the cavity of the upper mold heated to a predetermined temperature to adhere it to the lower surface of the film. and a sticking mechanism.

According to this, in the structure having a cavity in the conventional lower mold, it is difficult to prevent the granular resin from leaking from the cavity, and it is difficult to spread the resin to the outermost peripheral position in the cavity. Furthermore, the bulkiness of granular resin caused by piling up with gaps between the particles causes the air in the gaps in the resin to foam (defoam) during molding. However, by adopting a structure having a cavity in the upper mold, it is possible to solve these problems. In addition, when encapsulating with resin, the damage to the work, etc. on which the electronic component with wires is mounted is not inferior compared to the structure having the cavity in the lower mold, and the resin can be applied to the outermost peripheral position in the cavity. can be distributed evenly, so that the molding quality can be improved.

a guard having a peripheral wall portion surrounding the entire periphery of the pressing member to a position higher than the upper surface of the pressing member; and a guard moving mechanism for moving the guard upward with the pressing member, It is preferable that the pressing member is configured to be movable upward with respect to the guard when the peripheral wall portion of the guard is in contact with the upper die. According to this, it is possible to prevent the leakage (dropping) of the resin from occurring while the resin placed on the pressing member is being conveyed into the cavity. In addition, while the guard is in contact with the upper die, the pressing member is further moved upward to enter the cavity, and the resin is prevented from leaking out from the cavity, and the adhesion to the film is prevented. It can be carried out.

Moreover, it is preferable to further include a vibration mechanism for vibrating the pressing member on which the resin is placed. According to this, in a state in which granular, pulverized, or powdery resin is placed on the pressing member, the pressing member is vibrated within the guard at the time of sticking, thereby vibrating the resin placed on the upper surface of the pressing member. can be applied to the film with a uniform thickness. Therefore, it is possible to prevent the occurrence of molding defects and stabilize the molding quality.

Moreover, it is preferable to further include a preheating mechanism for heating the resin before being adhered to the lower surface of the film. According to this, by welding and integrating the resin grains, the resin can be adhered to the lower surface of the film in a short time, and the resin grains can be prevented from remaining on the pressing member.

Further, it is preferable that the upper surface of the pressing member is subjected to a surface treatment to prevent adhesion of the resin. According to this method, when the pressing member is moved (lowered) downward after the resin is pressed and adhered to the film, the resin adheres to the pressing member and cannot be set in the upper die. Problems can be prevented from occurring.

In addition, the resin sealing method according to the present invention uses a sealing mold having an upper mold and a lower mold to seal a work in which an electronic component is mounted on a base material with a resin to process it into a molded product. The sealing method includes a heating step of heating the upper mold to a predetermined temperature, a first adsorption step of sucking and holding the film in the cavity of the upper mold, and a mounting step of placing the resin on the upper surface of the pressing member. and a moving sticking step of moving upward the pressing member with the resin placed on the top surface to press the resin onto the film to stick it.

According to the present invention, by adopting the configuration in which the upper mold has the cavity, it is possible to solve the above-mentioned problems in the configuration in which the lower mold has the cavity. In addition, it is possible to realize a resin sealing apparatus and a resin sealing method capable of reducing damage to a workpiece during resin sealing and improving molding quality.

BRIEF DESCRIPTION OF THE DRAWINGS It is a top view which shows the example of the resin sealing apparatus which concerns on the 1st Embodiment of this invention. 2 is a cross-sectional view showing an example of a sealing mold of the resin sealing device of FIG. 1; FIG. 2 is a cross-sectional view showing an example of a pressing member and a guard of the resin sealing device of FIG. 1; FIG. FIG. 4 is an operation explanatory diagram of the resin sealing device according to the first embodiment of the present invention; FIG. 5 is an operation explanatory diagram following FIG. 4; FIG. 6 is an operation explanatory diagram following FIG. 5; FIG. 7 is an operation explanatory diagram following FIG. 6; FIG. 8 is an operation explanatory diagram following FIG. 7; FIG. 9 is an operation explanatory diagram following FIG. 8; FIG. 10 is an operation explanatory diagram following FIG. 9; FIG. 5 is a cross-sectional view showing an example of a resin sealing device according to a second embodiment of the present invention; FIG. 11 is an operation explanatory diagram of the resin sealing device according to the third embodiment of the present invention; FIG. 13 is an operation explanatory diagram following FIG. 12; FIG. 14 is an operation explanatory diagram following FIG. 13; FIG. 15 is an operation explanatory diagram following FIG. 14; FIG. 16 is an operation explanatory diagram following FIG. 15; FIG. 17 is an operation explanatory diagram following FIG. 16;

[First Embodiment]
(overall structure)
A first embodiment of the present invention will be described in detail below with reference to the drawings. FIG. 1 is a plan view (schematic diagram) showing an example of a resin sealing device 1 according to this embodiment. 2 is a side sectional view (schematic diagram) showing an example of the sealing mold 202 of the resin sealing device 1, and FIG. 3 shows an example of the pressing member 214 and the guard 216 of the resin sealing device 1. It is a side cross-sectional view (schematic diagram) showing. For convenience of explanation, arrows in the drawings may be used to indicate the front/rear, left/right, and up/down directions of the resin sealing device 1 . Further, in all the drawings for explaining each embodiment, members having the same functions are denoted by the same reference numerals, and repeated description thereof may be omitted.

A resin sealing apparatus 1 according to the present embodiment is an apparatus that resin-seals a work (molded article) W using a sealing mold 202 having an upper mold 204 and a lower mold 206 . Hereinafter, as the resin sealing apparatus 1, a workpiece W is held by a lower mold 206, and a cavity 208 (including part of the mold surface 204a) provided in the upper mold 204 is a release film (hereinafter simply referred to as "film"). A compression molding apparatus in which the workpiece W is sealed with the resin R by supplying the resin R while being covered with F, clamping the upper mold 204 and the lower mold 206, and sealing the workpiece W with the resin R will be described as an example.

First, a workpiece W to be molded has a structure in which a plurality of electronic components Wb are mounted in a matrix on a base material Wa. More specifically, examples of the base material Wa include plate-shaped members (so-called strip workpieces) such as strip-shaped resin substrates, ceramic substrates, metal substrates, carrier plates, lead frames, and wafers. . Examples of electronic components Wb include semiconductor chips, MEMS chips, passive elements, radiator plates, conductive members, spacers, and the like. As another example of the base material Wa, a configuration using the above members formed in a circular shape, a square shape, or the like may be used (not shown).

Examples of methods for mounting the electronic component Wb on the base material Wa include mounting methods such as wire bonding mounting and flip chip mounting. Alternatively, in the case of a configuration in which the base material (a carrier plate made of glass or metal) Wa is peeled off from the molded product after resin sealing, an adhesive tape having heat peelability or an ultraviolet curable resin that is cured by ultraviolet irradiation is used. There is also a method of sticking the electronic component Wb on the substrate.

On the other hand, examples of the resin R include granular (including columnar), pulverized, or powdered thermosetting resins (for example, filler-containing epoxy resin, etc.) is used. The resin R is not limited to the above state, and may be in other states (shapes) such as liquid, plate, sheet, etc., and is a resin other than epoxy thermosetting resin. good too.

Examples of the film F include film materials excellent in heat resistance, peelability, flexibility, and extensibility, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene polymer), PET, FEP, Fluorine-impregnated glass cloth, polypropylene, polyvinylidine chloride and the like are preferably used. In this embodiment, a roll-shaped film is used as the film F. As shown in FIG. As a modification, a strip-shaped film may be used (not shown). As the film F, a dense film impermeable to air may be used, or a porous film allowing air to permeate may be used.

Next, an outline of the resin sealing device 1 according to this embodiment will be described. As shown in FIG. 1, the resin sealing apparatus 1 includes a work processing unit 100A that mainly supplies the work W and stores the molded product Wp after resin sealing, supplies and stores (discards) the film F, and A press unit 100B that mainly seals the workpiece W with resin and processes it into a molded product Wp, and a dispensing unit 100C that mainly supplies the resin R are provided as main components. In this embodiment, two cavities 208 are provided in one upper mold 204, and two workpieces W (for example, strip-shaped workpieces) are arranged in one lower mold 206 and sealed together with resin. A configuration in which two molded products Wp are obtained at the same time by stopping is described as an example. However, the present invention is not limited to this, and one upper mold 204 is provided with one cavity, and one lower mold 206 is provided with one work W (for example, a circular or square work). A configuration may be adopted in which resin sealing is performed to obtain one molded product Wp (not shown).

In this embodiment, the work processing unit 100A, the press unit 100B, and the dispensing unit 100C are arranged side by side in that order from the right in the left-right direction. An arbitrary number of guide rails (not shown) are provided linearly across each unit, and a first loader 210 for transporting the workpiece W and the molded product Wp, and a second loader 210 for transporting the resin R 212 is provided movably between predetermined units along arbitrary guide rails.

It should be noted that the resin sealing device 1 can change the overall configuration mode by changing the configuration of the unit. For example, the configuration shown in FIG. 1 is an example in which three press units 100B are installed. Also, a configuration in which other units are installed is possible (neither is shown).

(Work processing unit)
Next, the work processing unit 100A provided in the resin sealing apparatus 1 will be described in detail.

The work processing unit 100A includes a supply magazine 102 that stores a plurality of works W, and a storage magazine 112 that stores a plurality of molded products Wp. Here, as the supply magazine 102 and the storage magazine 112, known stack magazines, slit magazines, etc. are used.

Next, the work processing unit 100A is provided with a supply rail 104 arranged behind the supply magazine 102 and on which the work W taken out from the supply magazine 102 is placed. In this embodiment, the work W is supplied from the supply magazine 102 to the supply rail 104 via the relay rail 106 using a known pusher or the like (not shown). Similarly, the work processing unit 100A includes a storage rail (not shown) disposed behind the storage magazine 112 and on which the molded product Wp taken out from the sealing mold 202 is placed. In this embodiment, using a known pusher or the like (not shown), the molded product Wp is stored in the storage magazine 112 from a storage rail (not shown) via a relay rail (not shown).

Next, the work processing unit 100A has a first loader 210 that transports the work W and the molded product Wp. Specifically, the first loader 210 has a first holding section 210A that has a holding mechanism on its lower surface to hold the work W on the supply rail 104 and conveys it to a predetermined holding position of the lower die 206 . Further, the first loader 210 has a holding mechanism on its lower surface to hold the resin-sealed molded product Wp on the lower mold 206 and hold it at a predetermined position outside the sealing mold 202 (for example, on a storage rail). ) is provided with a second holding portion 210B for transporting the wafer to the . Here, the work W holding mechanisms in the first holding portion 210A are arranged in two rows in the horizontal direction so as to be able to hold two works W on the supply rail 104 . In addition, the holding mechanism for the molded product Wp in the second holding part 210B is arranged in two rows in the horizontal direction so that the two molded products Wp on the lower mold 206 can be held. With these configurations, the first loader 210 can hold and transport both the work W and the molded product Wp side by side with their longitudinal directions parallel to each other. For the above holding mechanism, a known holding mechanism (for example, a structure having holding claws to clamp, a structure having a suction hole communicating with a suction device to suck, etc.) is used (not shown).

The work processing unit 100A also includes a work heater 116 that heats the work W transported by the first loader 210 from the lower surface side (base material Wa side). As an example, the work heater 116 uses a known heating mechanism (for example, an electric heating wire heater, an infrared heater, etc.). As a result, the workpiece W can be preheated before it is carried into the sealing mold 202 and heated. A configuration without the work heater 116 may be employed.

(press unit)
Next, the press unit 100B included in the resin sealing device 1 will be described in detail.

The press unit 100B is a sealed mold having a pair of dies that can be opened and closed (for example, a plurality of die blocks made of alloy tool steel, a die plate, a die pillar, and other members assembled together). 202. In this embodiment, of the pair of molds, one mold on the upper side in the vertical direction is the upper mold 204 and the other mold on the lower side is the lower mold 206 . The sealing mold 202 is closed and opened by the upper mold 204 and the lower mold 206 approaching and separating from each other. That is, the vertical direction (vertical direction) is the mold opening/closing direction.

The sealing mold 202 is opened and closed by a known mold opening/closing mechanism (not shown). For example, the mold opening/closing mechanism includes a pair of platens, a plurality of connecting mechanisms (tie bars and pillars) on which the pair of platens are installed, a drive source (for example, an electric motor) that moves (lifts and lowers) the platens, and a drive transmission mechanism. (for example, a toggle link), etc. (none of which is shown).

Here, the sealing mold 202 is arranged between a pair of platens of the mold opening/closing mechanism. In this embodiment, the fixed upper die 204 is attached to a stationary platen (a platen fixed to a coupling mechanism), and the movable lower die 206 is attached to a movable platen (a platen that moves up and down along the coupling mechanism). Assembled. However, the configuration is not limited to this, and the upper mold 204 may be a movable mold and the lower mold 206 may be a fixed mold, or both the upper mold 204 and the lower mold 206 may be movable.

Next, the upper mold 204 of the sealing mold 202 will be described in detail. As shown in FIG. 2, the upper die 204 comprises an upper plate 222, a cavity piece 226, a clamper 228, etc., which are assembled together. In this embodiment, a cavity 208 is provided on the lower surface of the upper mold 204 (the surface on the lower mold 206 side).

More specifically, the cavity piece 226 is fixedly attached to the lower surface of the upper plate 222 . On the other hand, the clamper 228 is configured in an annular shape so as to surround the cavity piece 226 , and is attached to the lower surface of the upper plate 222 via a biasing member 232 so as to be separated (floating) and vertically movable. The cavity piece 226 forms the inner part (bottom part) of the cavity 208 , and the clamper 228 forms the side part of the cavity 208 . In this embodiment, as shown in FIG. 1, two cavities 208 are arranged side by side in the left-right direction in one upper mold 204 so that two workpieces W are simultaneously sealed with resin. . However, it is not limited to this configuration.

A suction groove (not shown) is provided on the mold surface 206a of the lower mold 206 facing the clamper 228, and communicates with a suction device (not shown). In addition, by providing a seal structure surrounding them, it is possible to deaerate the cavity 208 while the mold is closed by driving the suction device to reduce the pressure.

Further, in the present embodiment, a suction mechanism is provided for suctioning and holding the film F supplied from a film supply mechanism 250 (described later) to the upper die 204 . For example, this suction mechanism includes a suction device (non-contact) via suction paths 230a and 230b provided through the clamper 228 and a suction path 230c provided through the upper plate 222 and the cavity piece 226. shown). Specifically, one end of each of the suction paths 230 a , 230 b , 230 c communicates with the mold surface 204 a of the upper mold 204 , and the other end is connected to a suction device arranged outside the upper mold 204 . As a result, the film F can be sucked from the suction paths 230a, 230b, and 230c by driving the suction device, and the film F can be held on the mold surface 204a including the inner surface of the cavity 208 by suction.

Thus, by providing the film F covering the inner surface of the cavity 208 and the mold surface 204a (a part) of the upper mold 204, the resin R portion on the upper surface of the molded article Wp can be easily peeled off. , the molded product Wp can be easily removed from the sealing mold 202 (upper mold 204).

A gap of a predetermined size provided between the inner peripheral surface of the clamper 228 and the outer peripheral surface of the cavity piece 226 constitutes part of the suction path 230a. Therefore, a sealing member 234 (for example, an O-ring) is arranged at a predetermined position of the gap to perform a sealing function when the film F is sucked.

Further, in this embodiment, an upper mold heating mechanism is provided to heat the upper mold 204 to a predetermined temperature. The upper die heating mechanism includes a heater (for example, a heating wire heater), a temperature sensor, a control section, a power supply, etc. (none of which are shown), and performs heating and control thereof. As an example, the heater is built in the upper plate 222 and a mold base (not shown) that accommodates them, and mainly applies heat to the entire upper mold 204 and the resin R (described later). Thereby, the upper mold 204 is adjusted to a predetermined temperature (for example, 100° C. to 200° C.) and heated.

Further, in this embodiment, a film supply mechanism 250 is provided for conveying (supplying) the roll-shaped film F having no openings (holes) on the sheet surface to the inside of the sealing mold 202 . The film supply mechanism 250 includes an unwinding section 252 and a winding section 254 and is configured to convey the film F from the unwinding section 252 to the winding section 254 . As a result, the film F is supplied to the sealing mold 202 arranged between the unwinding section 252 and the winding section 254 . That is, as shown in FIG. 1, the unused film F sent out from the unwinding section 252 is supplied to the mold-opened sealing mold 202, and is used for resin sealing by the sealing mold 202. The finished film F is wound by the winding section 254 . A series of steps are controlled by a controller (not shown) provided in the resin sealing apparatus 1 .

Next, the lower mold 206 of the sealing mold 202 will be described in detail. As shown in FIG. 2, the lower mold 206 includes a lower plate 224, a cavity plate 236, etc., which are assembled together. Here, the cavity plate 236 is fixedly attached to the upper surface of the lower plate 224 (the surface on the upper die 204 side).

Further, in this embodiment, a work holding mechanism is provided to hold the work W at a predetermined position on the lower surface of the cavity plate 236 . As an example, this workpiece holding mechanism communicates with a suction device (not shown) via a suction path 240a arranged through the cavity plate 236 and the lower plate 224 . Specifically, one end of the suction path 240 a communicates with the mold surface 206 a of the lower mold 206 , and the other end is connected to a suction device arranged outside the lower mold 206 . As a result, the suction device is driven to suck the workpiece W from the suction path 240a, and the workpiece W can be attracted and held on the mold surface 206a (here, the upper surface of the cavity plate 236). Furthermore, a configuration may be employed in which holding claws for holding the outer periphery of the work W are provided in parallel with the configuration including the suction path 240a (not shown).

In this embodiment, one lower mold 206 has two workpiece holding mechanisms in the horizontal direction, corresponding to the structure of the upper mold 204 (the structure in which two cavities 208 are arranged side by side in the horizontal direction). They are arranged side by side, and two workpieces W are sealed with resin at a time. However, it is not limited to this configuration.

Further, in this embodiment, a lower mold heating mechanism is provided to heat the lower mold 206 to a predetermined temperature. The lower mold heating mechanism includes a heater (for example, a heating wire heater), a temperature sensor, a control section, a power supply, etc. (none of which are shown), and performs heating and control thereof. As an example, the heater is built in the lower plate 224 and a mold base (not shown) that accommodates them, and mainly applies heat to the entire lower mold 206 and the workpiece W. Thereby, the lower mold 206 is adjusted to a predetermined temperature (for example, 100° C. to 200° C.) and heated.

(dispense unit)
Next, the dispensing unit 100C included in the resin sealing device 1 will be described in detail.

The dispensing unit 100</b>C includes a dispenser 312 that supplies resin R and a second loader 212 that conveys the supplied resin into the sealing mold 202 . In this embodiment, two dispensers 312 are provided so that the resin R can be simultaneously supplied to two pressing members 214 (described later) provided corresponding to the two cavities 208 .

Further, the dispensing unit 100C is provided with a resin heater 314 that heats the resin R transported by the second loader 212 at a position adjacent to the dispenser 312 or the like. As an example, the resin heater 314 uses a known heating mechanism (for example, an electric heating wire heater, an infrared heater, etc.). As a result, the surface of the granular resin R placed on the pressing member 214 can be heated to be melted or softened. It is possible to prevent the occurrence of defective molding and malfunction of the device. A configuration without the resin heater 314 may be employed.

Here, the second loader 212 includes a pressing member 214 for placing the resin R dropped from the dispenser 312 on the upper surface 214a, and a peripheral wall portion surrounding the entire circumference of the outer peripheral portion to a position higher than the upper surface 214a of the pressing member 214. A guard 216 having 216a is provided. In this embodiment, two cavities 208 are provided in one upper mold 204, two works W (for example, strip-shaped works) are placed in one lower mold 206, and resin sealing is performed collectively. Since it is configured to obtain two molded products Wp at the same time, two pressing members 214 corresponding to the positions of the cavities 208 and guards 216 surrounding the entire periphery of the pressing members 214 are provided. That is, the guard 216 is configured as a frame provided around each pressing member 214 . As an example, the two pressing members 214 are surrounded by one guard 216, but as a modification, two guards 216 may be provided to surround the two pressing members 214 (not shown).

Further, the second loader 212 includes a moving sticking mechanism 215 that moves a pressing member 214 upward to press the placed resin R against the film F in the cavity 208 , and a guard 216 that moves along with the pressing member 214 . and a guard moving mechanism 217 for moving upward. At this time, when the peripheral wall portion 216a of the guard 216 is in contact with the upper mold 204 (for example, the mold surface 204a of the clamper 228), the pressing member 214 is configured to be movable upward with respect to the guard 216. It is

According to the above configuration, the pressing member 214 can be moved upward by the moving sticking mechanism 215 and the guard 216 can be moved upward by the guard moving mechanism 217 at the same time. Next, the movement of the guard 216 is stopped while the peripheral wall portion 216 a of the guard 216 is in contact with the upper die 204 , and the pressing member 214 can be moved upward by the moving sticking mechanism 215 . Next, in the cavity 208 of the upper mold 204 heated to a predetermined temperature, the resin R placed on the pressing member 214 is pressed against the film F, and the resin R is pressed against the lower surface of the film F (lower mold 206 side) can be attached.

It is preferable that the pressing member 214 is subjected to a surface treatment to prevent adhesion of the resin R on the upper surface 214a. The reason for this is that after the resin R is pressed and adhered to the film F, when the pressing member 214 is moved downward (lowered), the resin R adheres to the pressing member 214, causing the upper die to 204 can be prevented from being set.

(resin sealing operation)
Next, the operation of performing resin sealing using the resin sealing apparatus 1 according to this embodiment (that is, the resin sealing method according to this embodiment) will be described with reference to FIGS. 4 to 10. FIG. Here, two cavities 208 are provided in one upper mold 204, two workpieces W (for example, strip-shaped workpieces) are placed in one lower mold 206, and resin sealing is performed at once. A configuration for obtaining two molded products Wp will be taken as an example.

First, a heating process (upper mold heating process) is performed by adjusting and heating the upper mold 204 to a predetermined temperature (for example, 100° C. to 200° C.) by the upper mold heating mechanism. Further, a heating process (lower mold heating process) is performed by adjusting and heating the lower mold 206 to a predetermined temperature (for example, 100° C. to 200° C.) by the lower mold heating mechanism.

Next, as shown in FIG. 4, the second loader 212 transports the two pressing members 214 together with the guards 216 surrounding the pressing members 214 so that the two pressing members 214 are directly below the nozzles 312a of the two dispensers 312, respectively. At this time, the guard 216 (peripheral wall portion 216a) surrounds the entire periphery of the pressing member 214 to a position higher than the upper surface 214a. In this state, a placement step is performed in which a prescribed amount of resin R is dropped (supplied) onto the upper surface 214a of each of the pressing members 214 from the two nozzles 312a and placed thereon. As described above, the guard 216 is a frame that surrounds the entire periphery of the pressing member 214 . Therefore, when dropping the resin R, it is possible to prevent the resin R from falling from the pressing member 214 .

After the above mounting step, as shown in FIG. 5, the pressing member 214 and the guard 216 are vibrated to spread the resin R placed on the upper surface 214a of the pressing member 214 to the outermost peripheral position. It is preferred to carry out a step of leveling the thickness. Incidentally, the resin R may be supplied evenly from the beginning.

Next, the resin heater 314 may heat (preheat) the resin R being transported by the second loader 212 . For example, the resin R can be preheated to a temperature (for example, 60° C.) at which the resin R is not completely melted or melted by pressing a heated part or by radiant heat, and the particles of the resin R can be welded and integrated.

Next, the film F is conveyed (sent out) from the unwinding section 252 to the winding section 254 by the film supply mechanism 250, and placed at a predetermined position (a position between the upper mold 204 and the lower mold 206) in the sealing mold 202. A step of supplying the film F (film supplying step) is carried out.

Next, as shown in FIG. 6, an adsorption process (first adsorption process) is performed in which the film F is adsorbed and held on the mold surface 204a including the inner surface of the cavity 208 by the adsorption mechanism. At the same time (or before or after), the pressing member 214 and the guard 216 are conveyed into the sealing mold 202 (between the upper mold and the lower mold) by the second loader 212 .

From this state, the following moving sticking process is carried out. Specifically, as shown in FIG. 7, the pressing member 214 is moved upward by the moving sticking mechanism 215 and the guard 216 is moved upward by the guard moving mechanism 217 . Here, when the peripheral wall portion 216a of the guard 216 comes into contact with the upper die 204 (in this case, the mold surface 204a of the clamper 228), the movement of the guard 216 stops.

From this state, as shown in FIG. 8, only the pressing member 214 is further moved upward (that is, into the cavity 208) by the moving sticking mechanism 215, and the resin R placed on the upper surface 214a is transferred to the film F. A step of pressing and adhering to the lower surface is carried out.

According to this configuration, the resin R placed on the pressing member 214 can be pressed against the film F within the cavity 208 in the upper mold 204 heated to a predetermined temperature. Therefore, the heat of the upper die 204 can be transferred to the resin R through the film F, so that the resin R softens (melts) and an adhesive force is generated, and the effect of sticking to the lower surface of the film F is obtained. be done. It should be noted that the sticking process is preferably carried out in a short period of time so that the moving sticking mechanism 215 is not heated by radiant heat or heat transfer through the resin R. In this regard, the step of attaching the resin R to the lower surface of the film F can be efficiently performed by performing the step of integrating the resin R in advance as described above. Specifically, since the resin R is integrated, the resin R can be adhered to the lower surface of the film F in a short time. Further, since the resin R is integrated, it is possible to prevent particles of the resin R from remaining on the pressing member 214 .

From this state, as shown in FIG. 9, a step of moving the pressing member 214 downward by the moving sticking mechanism 215 and moving the guard 216 downward by the guard moving mechanism 217 is performed.

Next, a step of conveying the workpiece W into the sealing mold 202 by the first loader 210 is performed. In advance, the workpiece W being conveyed by the first loader 210 is preheated by the work heater 116, and then, as shown in FIG. It is held at a predetermined position on the lower mold 206 . In this embodiment, two workpieces W are held side by side. The step of conveying the workpiece W into the sealing mold 202 by the first loader 210 may be performed before the step of attaching the resin R.

The subsequent steps are the same as in the conventional resin sealing method, and the steps of closing the sealing mold 202 and clamping the two workpieces W between the upper mold 204 and the lower mold 206 are performed. At this time, in the two cavities 208, the cavity pieces 226 are relatively lowered to heat and press the resin R against the two works W. As shown in FIG. As a result, the resin R is thermally cured and resin sealing (compression molding) is completed. Next, a step of opening the sealing mold 202 and separating the two molded products Wp and the used film F is performed. Next, a step of conveying the two molded products Wp from the sealing mold 202 by the first loader 210 is performed. In addition, the film feeding mechanism 250 conveys the film F from the unwinding section 252 to the winding section 254 to carry out a step of sending out the used film F (film discharging step).

The above is the main operation of resin sealing performed using the resin sealing apparatus 1 . However, the order of the steps described above is only an example, and it is possible to change the order of the steps before and after or perform them in parallel as long as there is no problem. For example, in the present embodiment, a resin encapsulation device equipped with a plurality of press units (three as an example) is used, so by performing the above operations in parallel, it is possible to efficiently form a molded product. becomes.

In the present embodiment, the film F is previously adsorbed and held on the mold surface 204a including the inner surface of the cavity 208 by the adsorption mechanism described above, and then the pressing member is moved by the moving attachment mechanism 215. 214 is moved upward to press the resin R against the film F so that the resin R is adhered to the lower surface of the film F. As shown in FIG. However, the present invention is not limited to this configuration, and the following configuration may be employed as a modified example. Specifically, the film F is placed on the inner surface of the cavity 208 at a predetermined position between the upper mold 204 and the lower mold 206 (specifically, the position between the upper surface 214a of the pressing member 214 and the inner surface of the cavity 208). It is prepared in a state in which it is not adsorbed to the mold surface 204a including. Next, by moving the pressing member 214 upward by the moving sticking mechanism 215, the pressing member 214 comes into contact with the film F and moves the film F upward. Next, while causing the film F to adhere to the mold surface 204a including the inner surface of the cavity 208, the resin R placed on the pressing member 214 (upper surface 214a) is pressed against the film F and adhered to the lower surface of the film F. Configuration.

Further, as another modified example, a vibration mechanism (not shown) for vibrating the pressing member 214 is provided in the second loader 212, and in the above-described moving sticking process, that is, the pressing member 214 (upper surface 214a) is placed thereon. When the resin R in the folded state is pressed and adhered to the film F, a vibrating step of vibrating the pressing member 214 may be performed. According to this, the resin R is applied to the film F with a more uniform thickness by vibrating the pressure member 214 within the guard 216 during application while the resin R is placed on the pressure member 214 . can be worn. Therefore, it is more effective from the viewpoint of preventing occurrence of defective molding and stabilizing quality.

As explained above, conventionally, a method in which a cavity is provided in the lower mold and the resin is liquefied in the cavity and then sealed with resin is particularly effective in resin sealing products with wires, as it causes damage to the wires. was considered small and dominant. In response to this, the inventors of the present application have made intensive research and devised a method of providing a cavity 208 in the upper mold 204 and sealing with resin R in the cavity 208 in a state of being softened and adhered. We have realized a resin sealing device and method that is not inferior to the method in which a cavity is provided in the

As a result, the method of providing the cavity 208 in the upper mold 204 can be adopted without inferiority, and the problem of the method of providing the cavity in the lower mold can be solved. Specifically, in the method of providing a cavity in the lower mold, it is difficult to prevent granular resin from leaking out of the cavity. Furthermore, the bulkiness of granular resin caused by piling up with gaps between the granules causes the air in the gaps of the resin to foam (defoam) during molding, causing the resin to leak. However, it is possible to solve these problems. In addition, when encapsulating with resin, the damage to the workpiece on which the electronic component with wires is mounted is not inferior to that of the method in which the cavity is provided in the lower mold, and the outermost position in the cavity 208 is not inferior. Since the resin can be evenly distributed, molding quality can be further improved.

In addition, since the resin R placed on the pressing member 214 can be transferred into the sealing mold 202 while being surrounded by the guard 216, leakage of resin from the pressing member 214 (upper surface 214a) during transfer can be prevented. (overflow) can be prevented from occurring. Furthermore, since the pressing member 214 can be further moved upward to enter the cavity 208 while the guard 216 is in contact with the upper die 204, leakage (spilling) of the resin R from the cavity 208 does not occur. can be made Therefore, it is possible to prevent deterioration of molding quality due to leakage (spillage) of resin R, and to stabilize molding quality (maintain high quality).

[Second embodiment]
Next, a second embodiment of the invention will be described. This embodiment is a configuration example in the case of resin-sealing a workpiece W to be a product (molded article Wp) on which a heat spreader H is provided. Specifically, the molded article Wp is formed such that the heat spreader H is exposed on one side (the side opposite to the side on which the substrate Wa is provided). The following description focuses on differences from the first embodiment described above. Here, FIG. 11 is a side cross-sectional view (schematic diagram) corresponding to FIG. 3 of the above-described first embodiment.

In the resin sealing device 1 according to the present embodiment, as the release film F, a roll-shaped film having a plurality of holes (suction holes) Fa formed on the sheet surface is used. Further, the upper mold 204 is configured to be able to suck and hold the heat spreader H with the film F interposed in the cavity 208 by the suction mechanism described above. Specifically, first, a needle-shaped perforating member is used to form holes Fa, and as shown in FIG. The film F can be adsorbed and held on the mold surface 204a including the inner surface of the . Furthermore, in a state in which the film F is adsorbed to the mold surface 204a, a suction force is applied by the suction path 230c through the suction holes Fa of the film F, and the heat spreader H is moved in a state in which the film F is interposed in the cavity 208. It can be adsorbed and held.

Next, the operation of performing resin sealing using the resin sealing apparatus 1 according to this embodiment (that is, the resin sealing method according to this embodiment) will be described. The basic steps are the same as those of the first embodiment described above, but in this embodiment, after the first adsorption step described above, the heat spreader is applied while the film F is interposed in the cavity 208 of the upper mold 204 . An adsorption step (second adsorption step) of sucking and holding H is further provided. After that, while the heat spreader H is sufficiently heated, the resin R is adhered to the lower surface of the heat spreader H as described above, and the resin sealing process can be performed.

As described above, according to the present embodiment, even when resin-sealing the workpiece W to be the molded product Wp on which the heat spreader H is provided, resin sealing is performed using an apparatus having the same basic configuration as that of the first embodiment. It is possible to do

[Third Embodiment]
Next, a third embodiment of the invention will be described. This embodiment differs from the above-described first embodiment in that the resin R is supplied and conveyed into the sealing mold 202 (specifically, into the cavity 208 of the upper mold 204). . 12 to 17, the resin sealing device 1 and the resin sealing method according to the present embodiment will be described with a focus on the points of difference.

As a configuration example of this embodiment, as in the first embodiment, two workpieces W are collectively sealed with resin for one sealing mold 202, and two molded products Wp are obtained at the same time. For example.

First, as shown in FIG. 12, the carrier 400 with the film F held on its lower surface side is prepared and transported to a position directly below the nozzle 312a of the dispenser 312 by a transport mechanism (not shown). As an example, the carrier 400 is formed as a frame having a holding mechanism (not shown) that holds the film F on its lower surface and two rows of resin injection holes (through holes) 400a. Here, as the film F according to the present embodiment, a sheet-fed release film is used in place of the roll-shaped release film in the first embodiment.

Next, as shown in FIG. 13 , the resin R is dropped (supplied) from the nozzles 312 a of the two dispensers 312 into the two resin charging holes 400 a of the carrier 400 .

Next, as shown in FIG. 14, the carrier 400 holding the film F and the resin R is transported by the transport mechanism and placed on the heater table 310 to heat the resin R through the film F. I do. As a result, the resin R is melted or softened. Therefore, the entire resin R is welded and clumped together to adhere to the film F. As shown in FIG.

Next, as shown in FIG. 15, the pressing member 214 is inserted into each of the two resin injection holes 400a so that the plate surface 214a (the lower surface in this state) is brought into close contact with the molten or softened resin R. and

Next, as shown in FIG. 16, the carrier 400 and the pressing member 214 are turned upside down by a turnover mechanism (not shown). At this time, the resin R is in close contact with the film F.

From this state, the same steps as the adsorption step (first adsorption step) and the moving sticking step in the above-described first embodiment are performed. That is, the pressing member 214 having the upper surface 214a (corresponding to the lower surface before reversal) with the resin R (the film F in close contact with the upper surface of the resin R) is moved upward by the moving sticking mechanism 215. (specifically, into the cavity 208 of the upper mold 204). At this time, a step of adsorbing and holding the film F to the mold surface 204a including the inner surface of the cavity 208 is performed by the adsorption mechanism. In this state, the pressing member 214 is further moved upward by the moving sticking mechanism 215 to press the resin R placed on the upper surface 214a to the lower surface of the film F for sticking. In this manner, the film F is adsorbed in the cavity 208 and the resin R is adhered to the film F. As shown in FIG.

The subsequent steps are the same as those of the first embodiment described above. , the step of opening the sealing mold 202 and taking out the molded product Wp is performed.

As described above, according to the present invention, by adopting the configuration in which the upper mold has the cavity, it is possible to solve the above-described problems in the configuration in which the lower mold has the cavity. In addition, it is possible to realize a resin sealing apparatus and a resin sealing method capable of reducing damage to a workpiece during resin sealing and improving molding quality.

It should be noted that the present invention is not limited to the above-described embodiments, and can be modified in various ways without departing from the scope of the present invention. In particular, although thermosetting resins in the form of granules, pulverized, and powder have been exemplified as sealing resins, they are not limited to these, and liquid, plate-like, sheet-like resins, etc. are used. configuration can also be applied. For example, in a structure using a sheet-shaped resin, the sheet-shaped resin R, which is originally flat and integrated, may be adhered to the lower surface of the film F, and preparation for resin sealing can be easily performed.

In the above-described embodiment, the heat of the upper mold 204 is transmitted to the resin R through the film F, and the resin R is softened (melted) to generate an adhesive force, thereby bonding the resin R to the lower surface of the film F. In the above description, the porous film F is used, and the film F is sucked from the suction paths 230b and 230c by driving the suction device, whereby the resin R is sucked and adhered to the lower surface of the film F. configuration may be employed.

In addition, while two cavities are provided in the upper mold, two workpieces W are placed in the lower mold and resin-sealed together to obtain two molded products Wp at the same time. It is not limited to this, and one (or a plurality of three or more) cavities are provided in the upper mold, and one (or a plurality of three or more) workpieces are placed in the lower mold and sealed with resin. to obtain one (or a plurality of three or more) molded products.

1 Resin sealing device 204 Upper mold 206 Lower mold 208 Cavity 214 Pressing member 215 Moving sticking mechanism 216 Guard W Work

Claims (12)

A resin encapsulation device that uses a encapsulation mold that includes an upper mold and a lower mold to seal a work in which an electronic component is mounted on a base material with a resin and processes the molded product,
a heating mechanism for heating the upper mold to a predetermined temperature;
a suction mechanism for sucking and holding the film in a cavity provided on the lower surface side of the upper mold;
a pressing member having the resin placed on its upper surface;
a moving sticking mechanism that moves the pressing member upward to press the placed resin in the cavity of the upper mold heated to a predetermined temperature to stick it to the lower surface of the film; A resin sealing device comprising: a guard having a peripheral wall portion that surrounds the entire periphery of the outer peripheral portion to a position higher than the upper surface of the pressing member;
a guard moving mechanism that moves the guard upward with the pressing member,
2. The resin sealing device according to claim 1, wherein the pressing member is configured to be movable upward with respect to the guard when the peripheral wall portion of the guard is in contact with the upper die. 3. The resin sealing device according to claim 1, wherein the resin is in the form of granules, pulverized or powder when placed on the pressing member. 4. The resin sealing device according to claim 3, further comprising a vibration mechanism for vibrating the pressing member on which the resin is placed. The resin sealing device according to any one of claims 1 to 4, further comprising a preheating mechanism for heating the resin before being adhered to the lower surface of the film. The resin sealing device according to any one of claims 1 to 5, wherein the upper surface of the pressing member is subjected to a surface treatment to prevent adhesion of the resin. The film is provided with a plurality of suction holes,
The upper mold according to any one of claims 1 to 6, wherein the upper mold is configured to be able to suck and hold the heat spreader with the film interposed in the cavity by the suction mechanism. resin sealing equipment. A resin encapsulation method for forming a molded product by encapsulating a workpiece having an electronic component mounted on a base material with a resin using a encapsulation mold having an upper mold and a lower mold,
a heating step of heating the upper mold to a predetermined temperature;
a first adsorption step of sucking and holding the film in the cavity of the upper mold;
a placing step of placing the resin on the upper surface of the pressing member;
and a moving sticking step of moving upward the pressing member having the resin placed on the upper surface, and pressing the resin onto the film to stick it. The placing step includes placing the resin on the upper surface of the pressing member in a state in which the entire periphery of the outer peripheral portion is surrounded by a guard to a position higher than the upper surface of the pressing member,
In the moving sticking step, the pressing member surrounded by the guard and the guard are moved upward at the same time, and after the guard abuts against the upper die, only the pressing member is further moved upward. 9. The resin sealing method according to claim 8, further comprising the step of moving the mold into the cavity of the upper mold. 10. The resin sealing method according to claim 8, wherein the resin is in the form of granules, pulverized or powder when placed on the pressing member. 8 to 10, further comprising a vibrating step of vibrating a pressing member on which the resin is placed when the resin is pressed and stuck to the film in the moving sticking step. The resin sealing method according to any one of 1. The film is provided with a plurality of suction holes,
12. The method according to any one of claims 8 to 11, further comprising a second adsorption step of sucking and holding the heat spreader with the film interposed in the cavity of the upper mold after the first adsorption step. 1. The resin encapsulation method according to item 1.

Images