TWI689396B - Forming die, forming device, and method of manufacturing formed products - Google Patents

Abstract

Provide a technology that can improve the productivity of molded products.

The lower mold (12) is provided with a cavity mold (21) forming the bottom of the cavity concave portion (13), an overflow member (22) surrounding the cavity mold (21), and an overflow member (22) surrounding the mold The holder (23), the mold cavity module (21) and the holder (23) are arranged in such a manner that they can move forward and backward relative to the mold opening and closing direction, and the overflow member (22) can move forward and backward in the mold opening and closing direction Way setting. The workpiece holder (50) held by the mold surface (11a) of the upper mold (11) is provided with an adhesive tape (51), which is larger than the opening of the cavity recess (13) in the plan view and is held by the upper mold (11) ) And the lower die (12) are clamped and attached with a workpiece (W).

Description

Forming die, forming device, and method of manufacturing formed products

The present invention relates to a technique that is effectively applicable to a manufacturing method of a molding die, a molding device, a molded product, and a resin molding method.

Japanese Patent Laid-Open No. 2014-39065 (hereinafter referred to as "Patent Document 1") describes a lower die using an upper die and a cavity recess formed with a plurality of semiconductors evenly mounted on a forming area as a workpiece On the substrate of the element, a technique of sealing the resin portion of these semiconductor elements is formed. In this technique, since the outer peripheral area of the substrate that is adsorbed and held on the upper mold is sandwiched by the lower mold while using the support pins that support the substrate, no resin portion is formed in the outer peripheral area of the substrate.

Japanese Patent Laid-Open No. 2002-321239 (hereinafter referred to as "Patent Document 2") describes a technique related to a resin sealing device having an overflow cavity communicating with a mold cavity and provided on the outside thereof, constituting an overflow The pressure regulating plunger at the bottom of the flow cavity, and the spring that can always attach the pressure regulating plunger to the direction of the mold clamping.

[Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2014-39065

[Patent Document 2] Japanese Unexamined Patent Publication No. 2002-321239

For example, from a substrate (molded product) that is sealed using the technology described in Patent Document 1, after that, a product (semiconductor device) that is divided into pieces by semiconductor elements is taken out. Here, as one strategy for improving the productivity of products and reducing the cost of products, it is conceivable to increase the number of products processed from one molded product. For example, it is conceivable to seal the surface and side surfaces of the substrate in the cavity of the mold cavity (hereinafter, referred to as "full mold"), and install a plurality of semiconductor elements on the entire surface of the substrate to increase the number of products processed. However, when considering the full molding using the technology described in Patent Document 1, the support pin of the lower mold cannot be used, and the substrate is formed by only the upper mold to attract and hold the substrate, which may cause the substrate (especially large or thick) to fall off. The possibility of falling. Moreover, due to the damage (breakage, debris, etc.) caused by the drop to the substrate, the manufacturing yield of the molded product (product) decreases. In addition, in order to prevent the substrate from falling, it may be considered to provide a chuck on the upper mold in addition to the support pin, but in the case of full molding, it is not possible to continuously pull out a long-sized film and arrange it between the upper mold and the substrate Between the upper film supply mechanism.

In addition, when performing full molding, it may become difficult to apply a desired resin pressure (molding pressure) uniformly in the substrate surface. For example, in a substrate in which a plurality of semiconductor elements are unevenly mounted on a molding area as a workpiece, the resin pressure (resin density) applied to areas with and without semiconductor elements may be different. Therefore, in terms of a mechanism for adjusting the resin pressure in the cavity of the cavity, for example, it may also be considered to provide a transfer mechanism having a groove and a plunger inserted into the cavity in the cavity of the cavity outer. However, due to the installation of this mechanism, it is necessary to provide an overflow cavity to accommodate excess resin from the flow path (resin path) or cavity recessed portion that is tied from the groove to the cavity recess. Therefore, after molding, before the next step, it is necessary to remove unnecessary resin remaining in the runner or overflow cavity from the molded product, resulting in reduced productivity of the molded product and increased manufacturing cost of the molded product.

According to the technology described in Patent Document 2, it is conceivable to adjust the capacity of the overflow cavity according to the deviation of the amount of resin extruded from the cavity, and to securely contain the overflowing resin to complete the resin sealing. However, it is necessary to remove unnecessary resin from the molded product by arranging unnecessary resin remaining in the contact path (flow path) of the mold cavity with the overflow cavity or the overflow cavity outside the outer shape of the molded product. Therefore, the productivity of the molded product is reduced, resulting in an increase in the manufacturing cost of the molded product.

An object of the present invention is to provide a technology that can improve the productivity of molded products. The foregoing and other objects and novel features of the present invention should be clear from the description of this specification and the drawings of the accessories.

The following is a brief description of the representative ones of the inventions disclosed in this case. A forming die according to one solution of the present invention is characterized by comprising: a workpiece holder that holds the workpiece; an upper die that arranges the workpiece through the workpiece holder; and a lower die that has a housing for the workpiece when the mold is closed A cavity recess, the lower mold includes: a cavity die that constitutes the bottom of the cavity recess; an overflow member that surrounds the cavity die; and a holder that surrounds the overflow die and the cavity die The holder and the holder are relatively movable in the mold opening and closing direction, and the overflow The tool is provided to move forward and backward in the mold opening and closing direction. The workpiece holder is provided with an adhesive tape that is larger than the opening of the cavity recess in the plan view and is held and attached by the upper mold and the lower mold. The aforementioned artifacts. According to this, since the mechanism for adjusting the pressure of the resin (the overflow member that can move forward and backward) is provided in the cavity of the cavity, there is no need to remove the resin from the molded product, and the productivity of the molded product can be improved.

In addition, a forming mold according to a solution of the present invention is characterized by including: a work holder that holds a work among the upper mold and the lower mold to configure one of the molds; and the upper mold and the lower mold are provided for sealing the foregoing The other mold of the cavity filled with resin of the workpiece; and a decompression mechanism that decompresses the upper mold and the lower mold, and the workpiece holder includes an adhesive tape: the adhesive tape The cavity opening of the cavity is large, and is sandwiched between the upper mold and the lower mold and attached with the work piece. The one of the molds includes a tape suction mechanism that resists pressure reduction by the pressure reduction mechanism. The tape is sucked and held by the force of peeling the tape from the one mold. According to this, the voids or unfilling in the molded product is prevented, the manufacturing yield of the molded product is prevented from decreasing, and the productivity of the molded product can be improved.

Here, it is more preferable that the upper die system on which the workpiece is arranged includes a chuck, and the chuck is provided around the mold surface to hold the workpiece holder on the upper die. According to this, the workpiece can be prevented from falling from the upper die. Furthermore, it is more preferable that the work holder further includes a frame having an opening, and the tape is held in the frame so that the work attached to the tape in a plan view is positioned in the opening. According to this, the frame body can be easily transported by using it as a workpiece transport jig. Also, better Comprising a first and a second frame that can be disassembled, and the second frame is fitted to the first frame so that the first frame and the second frame sandwich the outer periphery of the tape To keep the aforementioned tape. According to this, it can be set in a state where the tape is tensioned.

Furthermore, it is more preferable that the workpiece holder is aligned with the opening of the frame body and the opening of the holder, and the tape is in close contact with the mold surface of the upper mold on which the workpiece is arranged. The mold and the holder of the lower mold hold the tape and the frame. According to this, the workpiece can be arranged (set) on the upper mold with adhesive tape in the frame. Moreover, it is more preferable that the workpiece holder has an opening of the frame larger than the holder, and the adhesive tape is in close contact with the mold surface of the upper mold on which the workpiece is arranged, and the upper mold and the The holder of the lower mold holds the tape. According to this, since the frame is arranged outside the holder, it is possible to clamp only the adhesive tape without clamping the frame. Furthermore, it is more preferable that the upper mold on which the workpiece is arranged is provided on a mold surface with a housing portion that houses the frame body, and the workpiece holder is configured to house the frame body in the housing portion and closely adhere the tape to the upper mold In the state of the mold surface, the tape is held by the holders of the upper mold and the lower mold. According to this, since the frame body (the structure for holding) does not protrude, the lower mold structure can be simplified.

Furthermore, it is more preferable that a forming apparatus uses a forming die, the forming apparatus comprising: a conveying part which conveys the workpiece before resin sealing combined with the workpiece holder; a pressing part which uses the forming die to The work is resin-sealed; and a storage portion that houses the resin-sealed work, that is, the molded product.

Moreover, it is more preferable that a method of manufacturing a molded product is a method of manufacturing a molded product using a molding die, which includes: gradually opening the upper mold and the lower mold from the state in which the molding mold is opened, and using the upper mold The step of clamping the workpiece holder with the holder of the lower mold, forming a cavity formed by the cavity concave portion, and enclosing the resin in the cavity; and further making the upper mold and the lower mold The step of gradually approaching and filling the cavity with the resin.

A molding die of another solution of the present invention includes a pair of molds that form cavities when the mold is closed, and thermally hardens the resin filled in the cavity. The molding die is characterized in that One of the molds includes: a base; a cavity mold, which is fixedly provided on the base, constituting the bottom of the mold cavity; and a holder, which is provided on the base so as to reciprocate in the mold opening and closing direction to constitute the cavity The side part of the surrounding of the cavity mold; the pressure regulating module, which is located between the cavity mold and the holder and surrounds the cavity mold and is reciprocable in the mold opening and closing direction The base adjusts the resin pressure in the mold cavity; and a mold closing limiter, which is fixedly installed on the base, restricts the movement of the holder when closing the mold. In this way, since the pressure regulating module, which is a mechanism for regulating the pressure of the resin, is provided in the cavity, it becomes unnecessary to remove unnecessary resin connected to the molded product, and the productivity of the molded product can be improved.

Moreover, it is more preferable that, in the molding die of the above-mentioned one solution, the mold closing limiter is provided between the base and the clamper, and abuts against the clamper to limit the clamping when the mold closing operation is performed The movement of the device. Here, it is more preferable that the aforementioned closed mold limiter has a thickness A plurality of adjustment members, the thickness adjustment member is detachable in a direction crossing the mold opening and closing direction. Or, more preferably, the mold closing limiter is provided so as to penetrate the holder, and abuts against the mold surface of the other mold of the pair of molds during the mold closing operation to restrict the clamping The movement of the device. In this way, the movement of the holder constituting the side of the cavity is restricted, so that the depth of the cavity, that is, the thickness of the molded product can be determined to a certain value.

Furthermore, it is more preferable that in the molding die of the above-mentioned one solution, the mold surface side end surface of the pressure regulating module is an inclined surface at a lowered position from the holder side toward the cavity mold side. According to this, it is possible to increase the area of the pressing surface that presses the resin, that is, the end surface of the mold surface side, and it is easy to adjust the resin pressure.

Furthermore, it is more preferable that the molding die of the above-mentioned one solution means is provided with a pressure regulating module limiter that is fixedly disposed on the base between the base and the pressure regulating module when the mold is closed When the operation is performed, it abuts on the pressure regulating module to restrict the movement of the pressure regulating module. In this way, because the movement of the pressure regulating module that regulates the resin pressure in the cavity is restricted, for example, the resin pressure at the time of holding pressure (forming pressure) can be determined to a certain value.

Moreover, it is more preferable that in the molding die of the above-mentioned one solution, the mold face shape of the cavity die is rectangular, and the mold face shape of the pressure regulating die is an annular rectangular shape. The ring width is that the corners are wider than the rectangular sides. More preferably, the mold surface shape of the cavity mold is a rectangular shape, the mold surface shape of the pressure regulating module is a ring-shaped rectangular shape, and the ring width of the pressure regulating module is a short side The part is wider than the rectangular long side part. In the absence of a pressure regulating module, the corners or short sides far away from the center of the cavity will result in a decrease in the resin fillability compared to the sides or long sides near the center of the cavity . In contrast, by providing a pressure regulating module, the ring width at the corner or short side is set to be wider than that at the side or long side, so that the resin pressure at the corner or short side The adjustment becomes easy, that is, the filling property of the resin can be improved.

Furthermore, it is more preferable that the molding die of the first solution means include a sealing member that seals between the pressure regulating mold and the cavity mold and between the pressure regulating mold and the holder. Even if resin has flowed between the pressure regulating module and the cavity module and between the pressure regulating module and the holder, the sealing member can prevent the resin from flowing into the base side.

Furthermore, it is more preferable that the molding die of the above-mentioned one solution means include: an ejector pin that is provided to penetrate the cavity die and reciprocate in the mold opening and closing direction; and a through hole that is provided in the cavity die The ejection pin penetrates; and an air flow path that communicates with the through hole on the base side. According to this, the workpiece can be blown with the ejector pin while pushing up the air, and the workpiece can be easily demolded from the forming die.

Here is a brief description of the effects obtained by the representative of the inventions disclosed in this case as follows. The forming die according to a solution of the present invention can improve the productivity of the formed product.

1. W‧‧‧Workpiece

2. Wc‧‧‧Semiconductor components

3. 11‧‧‧ Upper mold

3a, 221‧‧‧Mold cavity module

3b‧‧‧ gripper

4, 12‧‧‧ lower die

5. C‧‧‧ mold cavity

6. F‧‧‧release sheet

7‧‧‧Sealing material

8‧‧‧ nozzle

9‧‧‧Injector device

10‧‧‧forming mold

11a, 12a, 212a‧‧‧mold surface

13, 213‧‧‧Cavity cavity

14, 214‧‧‧upper module

15, 215, 26, 27 ‧‧‧ suction device

16, 216, 30, 31, 230, 231‧‧‧ attraction path

17, 217‧‧‧ Chuck

20, 220‧‧‧ base

21‧‧‧Mould cavity module

22‧‧‧Overflow parts

23, 223‧‧‧ gripper

24, 25, 223b, 224, 225, 266

32, 33, 36, 232, 233, 236

34, 35, 234, 235

37、237‧‧‧Decompression device

38, 238‧‧‧ decompression path

50、250‧‧‧Workpiece holder

51, 251‧‧‧ tape

51a‧‧‧Opening hole

52, 252‧‧‧ opening

53, 253‧‧‧frame

54, 56‧‧‧ bracket

55‧‧‧Semiconductor components

57‧‧‧LED components

60‧‧‧1st frame

61‧‧‧2nd frame

62‧‧‧Pit

63‧‧‧ Containment Department

101‧‧‧Transport Department

101a‧‧‧Transport arm

102‧‧‧Works Supply Department

103‧‧‧Resin Supply Department

104‧‧‧ Stamping Department

105‧‧‧Post-processing department

106‧‧‧Formed product storage

210‧‧‧forming mold

211‧‧‧ Upper mold

211a‧‧‧mold surface

212‧‧‧ Die

217a‧‧‧rotation axis

217b‧‧‧Shaft

217c‧‧‧Elastic Department

217d‧‧‧Rotating elastomer

217e‧‧‧limiter

217f‧‧‧Elevation hole

217g‧‧‧Lifting elastomer

218‧‧‧ Upper mold base

222‧‧‧Modulation module

222a‧‧‧Mold surface side end surface

223a

226, 227‧‧‧ suction device

228‧‧‧Film in the avoid position

254‧‧‧ Containment Department

260‧‧‧Closed mould limiter

261‧‧‧ Regulator module limiter

262‧‧‧thickness adjusting member

263‧‧‧Sale

264‧‧‧Sale

265,281‧‧‧Through hole

270‧‧‧Sheung Wan

271‧‧‧ Lower Ring

272‧‧‧Gasket

273‧‧‧pin

280‧‧‧ top selling

282‧‧‧Air flow path

290‧‧‧Resin mounting bracket

Wa‧‧‧Semiconductor wafer

Wb‧‧‧chip mounting bracket

Wd‧‧‧LED component mounting bracket

Wm‧‧‧molded product

r1~r3‧‧‧radius

R‧‧‧Resin

Ra‧‧‧The first molded resin

Rb‧‧‧The second molded resin

Rc‧‧‧The third molded resin

P‧‧‧Inner mold position

[FIG. 1] A schematic cross-section of a main part of a molding die according to Embodiment 1 of the present invention Face map.

[FIG. 2] A schematic cross-sectional view showing the main part of the forming die in the operation following FIG. 1. [FIG.

[Fig. 3] A schematic cross-sectional view showing the main part of the forming die in the operation following Fig. 2.

[FIG. 4] A schematic cross-sectional view showing the main part of the forming die in the operation following FIG. 3.

[Fig. 5] A schematic cross-sectional view showing the main part of the forming die in the operation subsequent to Fig. 4.

[Fig. 6] A schematic cross-sectional view showing various workpieces, (A) is a semiconductor wafer, (B) is a wafer mounting bracket, (C) is a semiconductor element, and (D) is an LED element mounting bracket.

7 is a schematic cross-sectional view of the main part of the molding die according to Embodiment 2 of the present invention.

[Fig. 8] A schematic cross-sectional view of a main part of a molding die according to Embodiment 3 of the present invention.

[Fig. 9] A schematic cross-sectional view of a main part of a molding die according to Embodiment 4 of the present invention.

[Fig. 10] A schematic cross-sectional view of the main part of the forming die following the operation following Fig. 9.

[Fig. 11] A schematic view of the compression molding apparatus of the present invention.

[Fig. 12] A schematic cross-sectional view of a main part of a molding die according to Embodiment 5 of the present invention.

[Fig. 13] A schematic cross-sectional view showing the main part of the forming die in the operation subsequent to Fig. 12.

[Fig. 14] A schematic cross-sectional view showing the main part of the forming die in the operation subsequent to Fig. 13.

[Fig. 15] A schematic cross-sectional view showing the main part of the forming die in the operation following Fig. 14.

[Fig. 16] A schematic cross-sectional view showing the main part of the forming die in the operation subsequent to Fig. 15.

17 is a schematic cross-sectional view of the main part of a modified example of the molding die according to Embodiment 5 of the present invention.

[Fig. 18] A schematic plan view of the main part of the cavity of the cavity, and examples of the plane shapes are shown in (A), (B), (C), (D), and (E).

[Fig. 19] A schematic cross-sectional view of a main part of a molding die according to Embodiment 6 of the present invention.

[Fig. 20] A schematic cross-sectional view of a main part of a modification of the molding die according to Embodiment 6 of the present invention.

[Fig. 21] A schematic cross-sectional view of a main part of a molding die according to Embodiment 7 of the present invention.

22 is a schematic cross-sectional view of the main part of a modified example of the molding die according to the seventh embodiment of the present invention.

23 is a schematic cross-sectional view of the main part of the forming mold according to the eighth embodiment of the present invention, and (A) and (B) are schematic cross-sectional views showing the main part of the forming mold in operation.

24 is an explanatory diagram showing an example of a mold resin supplying step, an example of nozzle arrangement, and an example of a resin coating pattern according to Embodiment 9 of the present invention.

[Fig. 25] A view showing a resin molding procedure in Embodiment 9 of the present invention Ming Tu.

[Fig. 26] An explanatory diagram showing the filling procedure of the molded resin according to Embodiment 9 of the present invention.

In the following embodiments of the present invention, if necessary, it is divided into a plurality of parts to explain, but in principle, these are not irrelevant to each other, but one relationship is a part of or a modification of the other, details, etc. . Therefore, in all the drawings, members having the same functions are given the same symbols, and repeated explanations are omitted. In addition, the number of constituent elements (including the number, numerical value, quantity, range, etc.) is not limited to the specific number except for the case where it is specifically stated, the case where it is obviously limited to the specific number in principle, etc. It can be above or below a certain number. In addition, when referring to the shape of the constituent elements, etc., it includes substantially similar or similar to the shape, etc., except for the case where it is specifically stated and the case where it is conceivably not obvious in principle.

(Embodiment 1)

First, the configuration of the molding die 10 (molding die mechanism) that performs compression molding in the present embodiment will be described with reference to FIGS. 1 to 5. FIGS. 1 to 5 are schematic cross-sectional views of the main parts of the forming mold 10 in operation (in the process of forming a product) of the present embodiment, and only the edges of the cavity recesses 13 that form the cavity C when the mold is closed are extracted The vicinity (the right side of the paper surface not shown corresponds to the center side of the mold 10) is shown.

The forming mold 10 includes: a workpiece holder 50 that holds a workpiece W (for example, a semiconductor wafer); an upper mold 11 that arranges the workpiece W across the workpiece holder 50; and a cavity recess 13 that has a mold closed to accommodate the workpiece W under 模12。 12. The molding die 10 is, for example, constructed such that the upper die 11 is a fixed die, and the lower die 12 paired with the movable die is opened and closed. A well-known press mechanism (not shown) is used for the mold opening and closing system. In addition, the molding die 10 is constructed to include a heater (not shown) inside and can be heated to a predetermined temperature (for example, 180°C). In such a molding die 10, the cavity concave portion 13 is closed to form a cavity C in a state where the mold is closed, and the resin R filled in the cavity C is thermally cured and molded (see FIG. 5).

The workpiece holder 50 in the forming mold 10 is provided with a tape 51 that is larger than the opening of the cavity concave portion 13 in a plan view and has an adhesive surface on one side (for example, it may be adhesive and peeled off by heat or ultraviolet rays, for example) Heat/ultraviolet peeling sheet); frame body 53 having an opening 52 (for example, a ring frame made of stainless steel). The work W is attached to the center of the lower surface of the tape 51. This tape 51 is held by the frame 53 so that the workpiece W is positioned in the opening 52. In other words, the frame 53 is attached to the outer peripheral portion around the central portion of the tape 51. The tape 51 is held between the upper mold 11 and the lower mold 12 because it is larger than the opening of the cavity recess 13. Furthermore, the frame body 53 can be used as a workpiece transfer jig. By holding the frame body 53 holding the workpiece W attached to the tape 51 with the transfer arm 101a, for example, transport (supply) from the outside of the mold to the inside of the mold It becomes easier and can increase productivity. In addition, since it is not necessary to directly hold the workpiece W, even if the housing 53 is partially held, the workpiece W can be stably transported without being skewed. In addition, even if the workpiece W is extremely thin and undergoes large deformation due to its own weight or is difficult to hold partially, it can be stably conveyed while keeping it flat.

In addition, in the molding die 10, the upper die 11 includes an upper module 14. The upper module 14 is fixedly assembled on the lower end of the base (not shown) of the upper mold 11 surface. In addition, the upper mold 11 includes an upper mold suction and holding mechanism that suction-holds the workpiece holder 50 on the mold surface 11a. The upper mold suction and holding mechanism is provided with: a suction device 15 (for example, a vacuum pump) provided outside the mold; one end is opened in the mold surface 11a, and the other end is connected (connected) to the suction device 15 and a suction path 16 for sucking the workpiece holder 50 . With such a configuration, as a tape suction mechanism in the present invention, by driving the suction device 15, the tape 51 of the workpiece holder 50 arranged (set) on the mold surface 11a can be suction-held via the suction path 16 (refer to figure 2). In addition, the suction path 16 may be configured to have a pipe opening at a plurality of positions in the mold surface 11a as shown, or may be made from a small number of openings through an arbitrary depression or a mold surface 11a such as a satin surface The recess is attracted by air.

In addition, the upper die 11 includes a chuck mechanism that sandwiches the outer periphery of the upper die 11 and holds the workpiece holder 50. This chuck mechanism is provided with a plurality of chucks 17 (hook-shaped claws) arranged at predetermined intervals around the die surface 11a. The chuck 17 is rotatably provided on the upper mold 11 so as to protrude from the mold surface 11a. By rotating the chuck 17, the frame 53 of the workpiece holder 50 arranged (set) on the mold surface 11 a can be hung and held (see FIG. 2 ). According to this, it is possible to prevent the workpiece W from falling from the upper mold 11. In addition, for the chuck, in addition to the configuration for switching the held state by rotating the claw portion, the configuration for switching the held state by sliding in the horizontal direction may also be used. For example, an inclined surface may be provided on the top of the chuck facing downward, and the workpiece may be set on the upper mold and pressed upward and the inclined surface of the top may be pressed at the corner of the frame 53 to make it Open composition. In this case, when the workpiece W is detached from the upper mold 11, the inclined surface at the top can be opened and closed by a carrying-out device (not shown).

In addition, in this embodiment, since the tape 51 is used as the workpiece holder 50, there is no need to, for example, continuously pull out a long-sized film and arrange it between the upper die 11 and the workpiece W, and perforate the film for suction Upper mold film supply/adsorption mechanism. Therefore, the upper die 11 is provided with a chuck mechanism, and the chuck 17 can hold (clamp) the outer peripheral portion (end portion) of the workpiece holder 50 (tape 51 or frame 53).

In the forming mold 10, the lower mold 12 includes a base 20 (base block), a cavity mold 21 (cavity block), an overflow member 22 (overflow block), and a holder 23 (holder block). The cavity mold 21 is assembled on the upper end surface of the base 20. Moreover, the overflowing member 22 which surrounds the through cylindrical or annular shape (hereinafter, referred to as "through cylindrical shape, etc.") of the cavity die 21 on the upper end surface of the base 20 via an elastic member 24 (for example, a coil spring) is It is assembled to move forward and backward in the mold opening and closing direction. In addition, on the upper end surface of the base 20, a holder 23 that penetrates a cylindrical shape or the like surrounding the overflow member 22 is assembled by an elastic member 25 (for example, a coil spring) so as to be movable forward and backward in the mold opening and closing direction.

In this embodiment, in order to perform compression molding, the cavity mold 21 and the holder 23 are provided so as to be relatively movable in the mold opening and closing direction. The cavity mold 21 and the holder 23 are components of the cavity concave portion 13, and the upper end surface of the cavity mold 21 constitutes the bottom of the cavity concave portion 13 and penetrates the inner circumferential surface of the holder 23 of a cylindrical shape, etc. The side portions of the cavity recess 13 are formed. Furthermore, in this embodiment, as a pressure regulating mechanism for adjusting the resin pressure in the cavity C (cavity cavity 13), the overflow member 22 is provided so as to penetrate inside the holder 23 in the shape of a cylinder or the like in the mold opening and closing direction Move forward and backward. This overflowing member 22 is used substantially as a constituent member of the cavity recess 13 (part of the cavity recess 13) in the same manner as the cavity die 21. Therefore, the cavity C 13) Contains: the first space area corresponding to the cavity mold 21 that is larger than the workpiece W in the plan view (contains the workpiece W); and corresponds to the overflow member 22 around the cavity mold 21 in the plan view The second space area (which becomes the so-called overflow cavity). In this embodiment, the overflow cavity (corresponding to the second space area) based on the pressure regulating mechanism is provided in the cavity concave portion 13, so that the amount of resin and the amount of resin can be adjusted by adjusting the thickness of the resin R in the area of the overflow cavity Resin pressure. Therefore, for example, with respect to the resin R in the overflow cavity region, by supplying more resin R than necessary to simply seal the workpiece W, it is possible to seal with a desired thickness while applying an appropriate resin pressure. In addition, the resin R in the overflow cavity region is continuously connected in the lateral direction of the work W. Therefore, it is not necessary to remove the resin of the overflow cavity from the molded product to prevent it from falling as in the configuration of, for example, a separate overflow cavity connected to the mold cavity through the runner to prevent the molded product Wm (see FIG. 11) Productive.

In this embodiment, the work holder 50 aligns the opening of the holder 23 and the opening of the frame 53. For example, by making the center of the opening of the holder 23 coincide with the center of the opening of the frame body 53, the workpiece W is positioned in the cavity C. At this time, in a state where the tape 51 is in close contact with the mold surface 11 a of the upper mold 11, the tape 51 and the frame 53 are held by the holder 23 of the upper mold 11 and the lower mold 12 (refer to FIGS. 4 and 5) ). In addition, since at least the tape 51 is sandwiched, resin leakage can be prevented, so it is not necessary to sandwich the frame 53. In this way, even if the workpiece holder 50 has the frame 53, the workpiece W can be arranged (set) on the mold surface 11 a of the upper mold 11 by the tape 51. In addition, when the frame body 53 is not clamped, the recessed portion for escape of the frame body 53 is provided in the clamper 23, and the penetrating portion of the frame body 53 can be set larger than the outer shape of the clamper 23 . For example, if the structure is as shown in FIG. 4 and FIG. 5 Then, the inner peripheral surface of the opening 52 of the frame body 53 constitutes a side portion of the cavity recess 13 together with the inner peripheral surface of the holder 23. That is, the depth (height) of the cavity recess 13 can be adjusted by changing the thickness of the frame 53.

In addition, the lower mold 12 includes a lower mold suction and holding mechanism that suction-holds the release sheet F on the mold surface 12a. The lower mold suction and holding mechanism is provided with: suction devices 26 and 27 (for example, vacuum pumps) provided outside the mold; and one end is opened on the mold surface 12a and the other end is connected (connected) to the suction devices 26 and 27 and sucks the release sheet The suction paths 30, 31 of F. By driving the suction devices 26 and 27, the release sheet F arranged on the mold surface 12a can be held by suction through the suction paths 30 and 31 (see FIG. 2). The suction path 30 includes, for example, a gap between the outer circumferential surface of the cavity mold 21 and the inner circumferential surface of the overflow member 22 and a gap between the outer circumferential surface of the overflow member 22 and the inner circumferential surface of the holder 23. Therefore, the lower mold suction and holding mechanism can be, for example, provided with a sealing member 32 (for example, an O-ring) provided on the base 20 side between the cavity mold 21 and the overflow member 22 and the overflow member 22 A seal member 33 (for example, an O-ring) provided on the base 20 side between the holder 23 and the structure.

In addition, for example, as shown in FIG. 3, the molding die 10 is provided with a cavity decompression mechanism that decompresses the inside of the die (between the upper die 11 and the lower die 12) as a cavity. This chamber decompression mechanism includes a penetrating cylindrical member 34 (chamber block) surrounding the upper module 14 and a penetrating cylindrical member 35 (chamber block) surrounding the holder 23. The chamber member 34 is fixedly assembled on the lower end surface of the base (not shown) of the upper mold 11. In addition, the chamber member 35 is fixedly assembled on the upper end surface of the base 20 of the lower mold 12. Furthermore, the chamber decompression mechanism includes: a sealing member 36 (for example, an O-ring) provided on the upper end surface of the chamber member 35; a decompression device 37 (for example, a vacuum pump) provided outside the mold; and one end in the mold It has an internal opening and the other end is connected (connected) to a decompression device 37 and a decompression path 38 that decompresses the chamber. The sealing member 36 is used when the upper mold 11 and the lower mold 12 are close to form a space surrounded by the chamber members 34 and 35, that is, when the chamber is sealed (formed). By driving the decompression device 37, the cavity formed in the mold is decompressed via the decompression path 38 as shown in FIG. 3, thereby preventing pores and unfilled situations.

In addition, as for the chamber decompression mechanism, as long as it is possible to decompress the upper mold 11 and the lower mold 12 inside the mold, the chamber members 34 and 35 and the sealing member 36 may be other than the above-mentioned configurations. For example, a sealing member 36 may be provided on either side of the chamber members 34, 35 that can be raised and lowered while maintaining the closed state, and the chamber members 34, 35 may be used to break the sealing member 36 through the mold closing to maintain the sealing. status. In addition, it may be configured to have cavity members 34 and 35 that are separate from the block (base) in which the upper mold 11 and the lower mold 12 are assembled and can be opened and closed individually.

Next, the operation of the forming mold 10 (including the arrangement method of setting the work W) in the present embodiment will be described and the manufacturing method of the molded product Wm using the forming mold 10 will be described. First, as shown in FIG. 1, the cavity die 21 is moved relatively to the holder 23 in advance so that the upper end surface of the cavity die 21 can come to the standby position in a state where the molding die 10 is opened. Therefore, with reference to the upper end surface of the base 20, the position of the upper end surface of the cavity die 21 is lower than that of the holder 23. If the position of the upper end surface of the overflow member 22 is lower than the upper end surface of the holder 23 based on the upper end surface of the base 20, it may also be higher than the upper end surface of the cavity module 21 (see FIG. 1). It can be in the same position or in a lower position. In other words, the standby position of the upper end surface of the overflow member 22 is relative to the upper end surface of the cavity mold 21 It can be in the same plane, it can be a protrusion, or it can be sinking. The standby position of the upper end face of the overflow member 22 should be set at a position relative to the upper end face of the cavity die 21, depending on the specifications related to the thickness of the molded product Wm, the amount of resin R used, etc. Arbitrary settings can be easily changed, for example, by adjusting the height of the elastic member 24 and the overflow member 22.

In addition, the suction devices 15, 26, and 27 and the decompression device 37 can be driven in advance in a state where the molding die 10 is opened. Then, the workpiece W held by the workpiece holder 50 is carried into the mold using a loader (not shown). Moreover, the resin R is arrange|positioned on the center part of the release sheet F, and the resin R is carried into the mold together with the release sheet F.

For the release sheet F, a film material that has heat resistance that can withstand the heating temperature of the forming mold 10, is easily peeled from the mold surface 12a of the lower mold 12, and has flexibility and stretchability. Specifically, for the release sheet F, for example, PTFE, ETFE, PET, FEP, fluorine-impregnated glass cloth, polypropylene, and polyvinylidene chloride are suitable. As for the resin R supplied to the release sheet F, for example, a liquid form, a powder form, or a sheet form is used. For example, a dispenser equipped with a syringe that can be filled with liquid resin and injected, and a dispenser equipped with a trough that can supply powdered resin as a surface by vibrating an electromagnetic feeder can be used. In addition, the sheet-like resin system can be supplied after peeling off the protective sheet provided to prevent deterioration such as oxidation. In addition, resins that are difficult to increase or decrease by a small amount like sheet-like resins can be appropriately molded by being configured to overflow as in this embodiment. In the case where such resin R is transported together with the release sheet F, since the resin R is not supplied to the release sheet F inside the mold, the preparation time of each molding die 10 can be shortened and suppressed in the mold Powdered resin R The scattering or heating of the dispenser. Of course, the resin R may be supplied to the release sheet F inside the mold.

Next, as shown in FIG. 2, in a state where the forming mold 10 is opened, the workpiece W is placed (set) on the mold surface 11 a of the upper mold 11 through the workpiece holder 50. In the state where the molding die 10 is opened, the resin R is arranged (set) in the cavity recess 13 of the lower die 12. Specifically, in the upper mold 11, first, the tape 51 of the workpiece holder 50 is suctioned from the suction path 16 to attract the workpiece holder 50 holding the workpiece W to the mold surface 11a. Then, by rotating the chuck 17, the frame 53 of the workpiece holder 50 adsorbed to the mold surface 11 a is hung and held. Therefore, the workpiece W is reliably arranged on the mold surface 11a without dropping. In addition, in this case, the work W can be positioned and set by fitting a not-shown pin (for example, a pin provided in the upper mold 11) and a hole (for example, a through hole provided in the frame 53)上模11。 11. Upper mold 11. At this time, after positioning the workpiece holder 50 on the mold surface 11a of the upper mold 11, the suction device 15 is driven, and the tape 51 can be adsorbed on the mold surface 11a to fix it after positioning. Moreover, it is preferable that such a pin or hole is provided at a position where the tape 51 is not interposed.

Also, in the lower mold 12, first, the release sheet F is arranged so as to cover the mold surface 12a containing the inner surface of the cavity concave portion 13, and the mold release sheet F is sucked from the suction paths 30, 31 to follow the cavity concave portion 13 The corner part with the segments attracts the release sheet F. At this time, since the resin R is arranged at the center of the release sheet F, the resin R is arranged on the upper end surface of the cavity die 21 in the cavity recess 13 via the release sheet F. This resin R is gradually melted from the part contacting the inner bottom surface of the cavity concave portion 13 because the molding die 10 is heated to a predetermined temperature by the built-in heater. In addition, in this embodiment, because the outer periphery of the release sheet F Since the chuck 17 holding the workpiece holder 50 is provided, it is possible to prevent the deflection (wrinkle) of the release sheet F due to the drying of the chuck 17.

For example, when a plurality of chucks are provided at predetermined intervals to directly hold the workpiece W, the chucks must be arranged at a position overlapping with the gripper because of the number of processes packaged in the workpiece W. In this case, it is necessary for the chuck to be accommodated in the holder when clamping the workpiece, and the part of the chuck 17 is pressed into the release sheet F attached to the holder, so that the release sheet F is skewed ( wrinkle). On the other hand, in this embodiment, since the tape 51 or the frame body 53 is sandwiched with a uniform thickness over the entire circumference, it is possible to prevent the release sheet F as described above from being skewed (wrinkled).

Next, as shown in FIG. 3, the upper mold 11 and the lower mold 12 are gradually brought closer from the state where the forming mold 10 is opened, so that the sealing member 36 provided on the upper end surface of the chamber member 35 and the lower end surface of the chamber member 35 Abut (ie, sealed contact). Thus, a cavity (closed space) is formed inside the mold. At this time, since the decompression device 37 is driven, the chamber is decompressed via the decompression path 38 and can be set to any degassing state. In this way, even if the lower surface side of the tape 51 of the work holder 50 is in a decompressed state, since the upper surface of the tape 51 is not completely held by the chuck 17 in this embodiment, the entire surface of the tape 51 is adsorbed to the mold surface 11a, so there is no sticking The case where the tape 51 of the work W not directly held by the chuck 17 sags.

Next, as shown in FIG. 4, the upper mold 11 and the lower mold 12 are gradually brought closer. The holders 23 of the upper mold 11 and the lower mold 12 sandwich the tape 51 and the frame 53 of the workpiece holder 50 via the release sheet F. Clamping. Therefore, since the opening of the cavity recess 13 is closed by the upper mold 11, a cavity C including the cavity recess 13 is formed, and the resin R is enclosed in the cavity C. In addition, by The illustrated vent hole is provided in the holder 23, and even after the release sheet F is sandwiched, the pressure can be reduced in the cavity concave portion 13.

Next, as shown in FIG. 5, the upper mold 11 and the lower mold 12 are gradually brought closer (gradual mold clamping) to fill the cavity C with the resin R. Specifically, when the forming mold 10 is gradually clamped, the elastic member 25 is compressed, and the holder 23 moves toward the base 20 side while being energized. The mold cavity 21 becomes a relative movement of this holder 23. At this time, the position of the upper end face of the cavity die 21 in the cavity recess 13 changes from a deep standby position to a shallower forming position, between the upper end face of the cavity die 21 and the workpiece W or the tape 51 The gap (first space area) becomes narrower. Therefore, the resin R disposed on the upper end surface of the cavity mold 21 is held by the workpiece W. In this case, for example, when the resin R is supplied only to the cavity mold 21, the resin R held by the workpiece W is substantially in the gap between the upper end surface of the overflow member 22 surrounding the cavity mold 21 and the tape 51 The overflow chamber (second space area) flows out. The resin R that has flowed into the overflow chamber is pressed by the upper end surface of the overflow member 22 that moves forward and backward by the elastic member 24. Therefore, the resin pressure in the cavity C is adjusted by the overflow member 22 (more specifically, the elastic member 24), and the resin R is filled in the cavity C. In this way, in this embodiment, as the mechanism for adjusting the resin pressure in the cavity C, the overflow member 22 that can move forward and backward is provided. In addition, resin R is supplied not only to the cavity mold 21 but also to the overflow 22. In this case, the resin pressure in the cavity C may be adjusted while suppressing the flow of the resin without flowing out of the overflow cavity.

Next, the resin R filled in the cavity C is thermally cured in a state of holding pressure (state of final mold closing) for a predetermined time. Next, the forming mold 10 is opened, and the upper mold 11 and the lower mold 12 are demolded. After the workpiece W is taken out of the mold, the tape 51 and the release sheet F are peeled from the sealed workpiece W. At this time, since the frame 53 can be held and peeled off, the tape 51 can be easily peeled from the sealed work W. In addition, in the configuration of the present embodiment, the edge portion of the release piece F in the sealed work W is in a state of overlapping with the frame 53. Therefore, the edge portion of the release sheet F overlapping the non-adhesive frame 53 can be easily held and peeled.

Then, by subjecting it to heat curing (post curing) for a predetermined time as a post-treatment, the molded product Wm after the work W is sealed (fully molded) by the resin R (resin sealing portion) is completed. In this way, the molded product Wm can be manufactured using the molding die 10 provided with the cavity recess 13 of the lower die 12.

Here, a specific example of the resin-sealed work W will be described with reference to FIG. 6. 6 is a schematic cross-sectional view of various workpieces W, (A) is a semiconductor wafer Wa, (B) is a wafer mounting bracket Wb, (C) is a semiconductor element Wc, (D) is an LED component mounting bracket Wd, respectively It is displayed together with the workpiece holder 50. That is, in the molding die 10 of the present embodiment of FIG. 1 and the like, although the semiconductor wafer Wa is applied as the workpiece W, it is not limited thereto, and may be a wafer mounting bracket Wb or the like. In addition, these workpieces W may have a circular or rectangular shape in plan view. The shape of each part of the forming mold 10 described above is determined according to the shape of such a work W.

As shown in FIG. 6(A), when the workpiece W is a semiconductor wafer Wa, for example, the back surface of the semiconductor wafer Wa on which bumps or pillars (not shown) are arranged is attached to the tape 51. Next, the frame 53 is attached to the tape 51 so that the semiconductor wafer Wa is located in the opening 52. In addition, the workpiece W may be attached after the frame 53 is attached to the tape 51. In the workpiece holder 50 holding the semiconductor wafer Wa, the lower surface side of the tape 51 is The mold surface 11a disposed (set) on the upper mold 11 is sealed with resin on the upper surface side of the same figure exposed from the opening 52, so that the semiconductor wafer Wa is fully molded.

In addition, the workpiece W to be fully molded may be a wafer mounting bracket Wb. As shown in FIG. 6(B), the wafer mounting bracket Wb is mounted with a plurality of semiconductor elements 55 (semiconductor wafers) in a matrix (row) of n rows×m columns, for example, on the bracket 54. For the bracket 54, as a plate-shaped member on which semiconductor elements are mounted, a wiring board (for example, a glass epoxy substrate), a semiconductor wafer, a lead frame, etc. can be applied, or a semiconductor can be sealed for resin sealing Temporary brackets such as stainless steel plates and glass plates on which components are temporarily mounted. In addition, the planar shape of the bracket 54 may be circular or quadrangular. In addition, the mounted chip may be an actuator element, a sensing element, or a passive element in addition to a semiconductor element such as a memory or an LED.

In addition, the workpiece W to be fully molded may be a plurality of semiconductor elements Wc (semiconductor elements 55), the wafer itself. As shown in FIG. 6(C), the plurality of semiconductor elements Wc are directly arranged and sealed on the tape 51 in a matrix without interposing members such as the wafer Wa and the holder 54 in a matrix. In addition, after a plurality of semiconductor elements Wc are fully molded, a wiring structure (rewiring layer) is formed on the surface where the tape 51 has been peeled off.

In addition, the forming die 10 can also be applied to a workpiece W having a different shape from the workpiece W described above. For example, as shown in FIG. 6(D), when the work W is the LED element mounting bracket Wd, there may be a lens that exposes the electrode exposed on the surface of the bracket and only the LED element is desired to be formed into a dome shape (hemispherical shape) Situation. At this time, the present invention can also be applied. That is, the LED element mounting bracket Wd is attached to the tape 51. LED component mounting bracket Wd series will be a plurality of LEDs The element 57 is mounted in a matrix on the bracket 56. For the bracket 56, for example, a metal substrate or the like can be applied. Here, a plurality of lens forming openings 51 a are formed in the tape 51 at positions corresponding to the mounted LED elements 57 to form lenses in a matrix, and the tape 51 is attached to the LED element mounting surface of the bracket 56. In this case, as shown in the same figure, on the bracket 56, the forming position of the lens including only the mounting position of the LED element is exposed from the adhesive tape 51.

Then, the frame 53 is attached to the tape 51 so that the bracket 56 is located in the opening 52. In addition, the frame 53 may be attached to the tape 51 in advance, and an opening hole 51a for forming a lens may be opened while holding the tape 51. In the workpiece holder 50 holding the LED mounting bracket Wd, the frame body 53 is not sandwiched by the tape 51 and is arranged (set) on the mold surface 11 a of the upper mold 11. For the LED exposed from the opening hole 51 a on the lower surface side of the tape 51 Element 57 shapes the lens. In this case, in such a lower mold 12 for sealing, cavity recesses (for example, hemispherical shapes) for lenses are provided at positions of the cavity mold 21 where the openings 51a are arranged, and the LED element 57 enters the mold for lenses The state of the cavity is sealed, and a hemispherical lens is formed by resin molding the LED element 57. In addition, in order to easily peel off unnecessary resin other than the lens portion after such sealing, it is preferable to shape the resin R other than the lens portion as thin as possible. Thereby, the resin R other than the lens portion can be peeled from the work W by simply peeling off the tape 51.

(Embodiment 2)

In the foregoing first embodiment, the case where the work holder 50 includes the tape 51 and the frame 53 has been described. In contrast, in this embodiment, the case where the workpiece holder 50 does not include the frame 53 will be described with reference to FIG. 7. 7 is a schematic cross-sectional view of the main part of the forming die 10 in the present embodiment. this In addition, in the drawings of the following embodiment including FIG. 7, the chamber decompression mechanism is omitted.

The workpiece holder 50 of this embodiment includes only the tape 51 that is larger than the opening of the cavity recess 13 in plan view and is sandwiched between the upper mold 11 and the lower mold 12. This workpiece holder 50 is carried in from the outside of the mold with the workpiece W attached to the tape 51. Then, the tape 51 of the workpiece holder 50 is attracted to the mold surface 11a. Then, by rotating the chuck 17, the tape 51 of the workpiece holder 50 adsorbed to the mold surface 11 a is hung and held. Thereby, the workpiece W is arranged (set) on the mold surface 11a. The present embodiment can also obtain the same effects as the aforementioned first embodiment in that the tape 51 is provided.

(Embodiment 3)

In the foregoing first embodiment, the case where the tape 51 and the frame 53 of the workpiece holder 50 are clamped by the clamper 23 between the upper mold 11 and the lower mold 12 has been described. In contrast, in this embodiment, the case where only the tape 51 is clamped will be described with reference to FIG. 8. FIG. 8 is a schematic cross-sectional view of the main part of the molding die 10 in this embodiment.

The workpiece holder 50 of this embodiment includes: an adhesive tape 51; and a frame body 53 having an opening 52 having an opening larger than that of the holder 23 in plan view. This workpiece holder 50 is carried in from the outside of the mold in a state where the workpiece W is attached to the tape 51. Next, the tape 51 of the workpiece holder 50 is attracted to the mold surface 11a. Then, by rotating the chuck 17, the frame 53 of the workpiece holder 50 adsorbed to the mold surface 11 a is hung and held. Thus, the workpiece W is arranged (set) on the mold surface 11a. Next, the upper mold 11 is made in a state where the tape 51 is in close contact with the mold surface 11a of the upper mold 11 Approach the lower die 12 gradually. Since the frame 53 is arranged outside the holder 23, only the tape 51 is held by the holder 23 of the upper mold 11 and the lower mold 12. In this embodiment, the same operations and effects can be obtained with the same configuration as in the first embodiment. Moreover, since the frame body 53 is not clamped by the clamper 23, the sealing thickness of the workpiece W, the management of the resin pressure, and the mold design become easy.

(Embodiment 4)

In the foregoing first embodiment, the case where the frame 53 is provided on the lower surface (the surface to which the workpiece W is attached) of the tape 51 in the workpiece holder 50 has been described. In contrast, in this embodiment, the case where the frame body 53 is provided on the upper surface of the tape 51 (the surface to which the mold surface 11a is attracted) is described with reference to FIGS. 9 and 10. 9 and 10 are schematic cross-sectional views of the main part of the mold 10 in this embodiment.

The workpiece holder 50 of this embodiment includes an adhesive tape 51 and an annular frame 53 having an opening 52. In addition, the upper mold 11 of the present embodiment includes an accommodating portion 63 that is recessed in a ring shape (annular shape) so as to accommodate the frame 53 on the mold surface 11 a. In the plan view, the opening of the frame 53 of the workpiece holder 50 is larger than the overflow member 22. In addition, the frame body 53 is provided with a ring-shaped first frame body 60 and a second frame body 61 and can be decomposed. Then, the second frame 61 is fitted into the recess 62 of the first frame 60 such that the first frame 60 and the second frame 61 of the frame 53 sandwich the outer peripheral edge of the tape 51. Keep the tape 51. Specifically, the second frame 61 is attached to the surface of the tape 51 to which the workpiece W is attached (the lower surface of the same figure), and the first frame 60 and the second frame 61 sandwich the outer periphery of the tape 51. The first frame 60. At this time, the outer periphery of the tape 51 enters the concave portion 62 of the first housing 60. Then, the second frame 61 被 Fitted into the concave portion 62. According to this, it can be set in a state in which the central portion of the tape 51 is more tensioned. In the tape 51 held in such a tensioned state, the work W is attached so as to be located at a predetermined position in the opening 52. This prevents the tape 51 from being deformed due to the weight of the work W.

As shown in FIG. 9, the workpiece holder 50 is carried in from outside the mold in a state where the workpiece W is attached to the tape 51. Next, as shown in FIG. 10, the workpiece holder 50 accommodates the frame 53 in the accommodating portion 63 so that the tape 51 is attracted to the mold surface 11 a of the upper mold 11. Next, by rotating the chuck 17, the frame 53 of the workpiece holder 50 adsorbed to the mold surface 11 a is hung and held. Thus, the workpiece W is arranged (set) on the mold surface 11a. Next, the upper mold 11 and the lower mold 12 are gradually brought close to each other with the tape 51 being in close contact with the mold surface 11 a of the upper mold 11. Thus, the holder 23 of the upper mold 11 and the lower mold 12 clamps the tape 51. According to this, since the frame 53 (retaining structure) does not protrude below the tape 51, the structure of the lower mold 12 can be simplified. In this embodiment, the same operations and effects can be obtained with the same configuration as in the first embodiment. In addition, since the frame body 53 is not clamped by the clamper 23, it is easy to manage the sealing thickness of the work W.

In addition, the molding die 10 of each of the above-described embodiments can be used as a compression molding device by a known press in a single body, and can also be equipped with a structure as shown in FIG. 11 and assembled in a compression molding device 100 that can be automatically molded. For use. In the same figure, the conveyance route of the workpiece W and the like is indicated by a dotted line, and the members indicated by the symbols in parentheses are conveyed at a predetermined timing.

This compression molding apparatus 100 is an example of a compression molding apparatus in the present invention, and includes a conveying section 101 that performs conveyance between various sections Build a workpiece supply section 102 that can house the workpiece W before resin sealing and supply the workpiece W combined with the workpiece holder 50; Build a resin supply section that houses the resin R and can supply the resin R and supply according to each release sheet 103; receiving the workpiece W conveyed by the conveying section 101 or the resin R, etc., and the stamping section 104 that is resin-sealed by the forming die 10; removing the release sheet F, the workpiece from the workpiece W sealed by the resin in the stamping section 104 The post-processing part 105 for the treatment at the time of holding the holder 50, the inspection process of the molded product Wm or the post-molding heat treatment (post curing), and the molded product storage part 106 for storing the molded product Wm after the post-processing . In addition, the functions of each part may be combined or separated, and the arrangement or number may be changed. The presence or absence of other configurations is not limited to the above, and other configurations may also be made.

Regarding the characteristic operation of this type of compression molding apparatus 100, in the configuration shown in the same figure, for example, the frame 53 is attached to the adhesive surface of the tape 51 cut to a predetermined length in the workpiece supply unit 102. The workpiece W is attached at an arbitrary position and an arbitrary number so as to be aligned with the frame 53. Of course, it may be configured to directly house the workpiece W that has been attached to the outside in the workpiece supply unit 102. Then, these are transported to the pressing unit 104 by the transport unit 101 equipped with a transport mechanism such as multiple indirect robots and linear guides.

In addition, the resin-sealed work W (molded product Wm) is transferred to the post-processing unit 105 together with the tape 51 and the release sheet F to peel off the tape 51 and the release sheet F. In addition, the step of peeling the adhesive tape 51 and the release sheet F from the molded product Wm may be performed in the stamping section 104 (forming mold 10). On the other hand, the frame 53 used for forming is cleaned and cooled after being separated from the tape 51, and can be reused by the conveying part 101 returning to the work supply part 102.

(Embodiment 5)

First, the configuration of the molding die 210 (molding die mechanism) that performs compression molding in this embodiment will be described with reference to FIGS. 12 to 18. 12 to 16 are schematic cross-sectional views of the main part of the forming mold 210 during the operation of the embodiment (during the process of forming a product), and only the vicinity of the edge of the cavity C (or cavity recess 213) is extracted (not The right side of the illustrated paper surface corresponds to the center side of the forming die 210). FIG. 17 is a schematic cross-sectional view of the main part of a modification of the forming die 210. FIG. 18 is a schematic plan view of the main part of the cavity concave portion 213, and examples of various planar shapes are shown in (A), (B), (C), (D), and (E).

First, the forming die 210 will be briefly described. The mold 210 is provided with a pair of molds (upper mold 211 and lower mold 212) that form a pair of mold cavities (the mold cavity recess 213 is closed). The forming mold 210 is configured such that the upper mold 211 is a fixed mold, and the lower mold 212 is a movable mold, and the mold can be opened and closed. For the mold opening and closing, a well-known press mechanism (not shown) is used. In addition, the molding die 210 has a heater (not shown) inside and can be heated to a predetermined temperature (for example, 180°C). In addition, the forming die 210 includes a workpiece holder 250 that holds the workpiece W. The workpiece W is placed on the upper die 211 via the workpiece holder 250. In addition, the molding die 210 is provided with a cavity recess 213 in which the lower die 212 is closed to accommodate the workpiece W (for example, a semiconductor wafer) and the resin R. In such a molding die 210, the workpiece W is clamped so that the resin R filled in the cavity C is thermally cured (see FIG. 16), and the surface and side surfaces of the workpiece W as a molded product are held in the cavity concave portion 213 by the resin Sealed (fully molded).

Next, each component of the forming die 210 will be described in detail. In the forming mold 210, the upper mold 211 includes an upper module 214. This upper module The 214 series is fixedly installed on the lower end surface of the base (not shown) of the upper mold 211. In addition, the upper mold 211 is provided with an upper mold suction and holding mechanism that suction-holds the workpiece holder 250 via the mold surface 211a. The upper mold suction and holding mechanism is provided with: a suction device 215 (for example, a vacuum pump) provided outside the mold; one end is opened on the mold surface 211a, and the other end is connected (connected) to the suction device 215 to suction the workpiece holder 250 and a suction path 216 . By driving the suction device 215, the tape 251 of the workpiece holder 250 arranged (set) on the mold surface 211a can be sucked and held through the suction path 216 (see FIG. 13).

In addition, the upper die 211 is provided with a chuck mechanism that sandwiches the outer periphery of the upper die 211 and holds the workpiece holder 250. This chuck mechanism has the same structure as the chuck mechanism shown in FIG. 3, and the same effect can be obtained.

The workpiece holder 250 is equipped with: an adhesive tape 251 that is larger than the opening of the cavity recess 213 in a plan view and has an adhesive surface on one side (for example, it may be adhesive/thermal and ultraviolet peeling that is peeled off by heat or ultraviolet rays, for example) Sheet); a frame body 253 having an opening 252 (for example, a ring frame made of stainless steel). The forming die 210 includes a housing portion 254 (an annular recessed portion) for escape of the frame 253 in the lower die 212. When the mold is closed (for example, refer to FIG. 16), the workpiece holder 250 is arranged (set) in the die Inside.

In the workpiece holder 250, the workpiece W is attached to the center of the lower surface of the tape 251. This tape 251 is held by the frame 253 so that the workpiece W is positioned in the opening 252. In other words, the frame 253 is attached to the outer peripheral portion around the central portion of the tape 251. The tape 251 is held between the upper mold 211 and the lower mold 212 because it is larger than the opening of the cavity recess 213. In addition, the frame 253 can be used as a workpiece transfer jig. As shown), the frame 253 for holding the workpiece W attached to the tape 251 is held, for example, making it easier to transport (supply) from the outside of the mold toward the inside of the mold, which can improve productivity. In addition, since it is not necessary to directly hold the workpiece W, by partially holding the frame 253, the workpiece W can be stably conveyed without distortion. In addition, even if the workpiece W is extremely thin and undergoes large deformation due to its own weight or is difficult to hold partially, it can be stably conveyed while keeping it flat.

In addition, in the forming mold 210, the lower mold 212 includes a base 220, a cavity mold 221, a pressure regulating mold 222, and a holder 223, and a cavity mold 221 and a pressure regulating mold are provided on the upper end surface of the base 220 222和HOLD器223. Therefore, the plane area (see FIG. 18) where the cavity mold 221, the pressure regulating module 222 and the holder 223 of the base 220 are provided has the cavity area, the pressure regulating mold area, and the holder area.

The cavity mold 221 and the holder 223 are components of the cavity recess 213. The cavity mold 221 is the upper end surface of the cavity mold 221 and forms the bottom of the cavity recess 213. In addition, the holder 223 is provided to surround the cavity mold 221, and the inner peripheral surface of the holder 223 penetrating into a cylindrical or annular shape (hereinafter, referred to as "penetrating cylindrical shape, etc.") constitutes a side portion of the cavity concave portion 213 . In addition, with respect to the pressure regulating mechanism for regulating the resin pressure in the cavity C, the pressure regulating mold 222 is provided inside the holder 223 penetrating a cylinder or the like so as to be movable back and forth in the mold opening and closing direction. The pressure regulating module 222 is substantially used as a constituent member of the cavity concave portion 213 (part of the cavity concave portion 213) to surround the cavity mold 221 between the cavity mold 221 and the holder 223.

The assembly of the blocks in the lower mold 212 is that, first, a cavity mold 221 is fixedly arranged on the upper end surface of the base 220. Next, at the base 220 The upper end surface of the pressure-regulating module 222, which penetrates the cylindrical shape and the like of the cavity module 221 via an elastic member 224 (for example, a coil spring), is provided so as to be able to move back and forth in the mold opening and closing direction. Therefore, the holder 223 which penetrates the cylindrical shape and the like of the pressure regulating module 222 on the upper end surface of the base 220 via the elastic member 225 (for example, a coil spring) is provided so as to be able to move back and forth in the mold opening and closing direction. Therefore, the cavity die 221 and the holder 223 can be relatively moved back and forth in the mold opening and closing direction. In addition, the pressure regulating module 222 provided by the elastic member 224 to be reciprocable is movable under the pressure of the resin in the cavity C, in other words, the pressure of the resin in the cavity C can be adjusted.

In addition, the forming mold 210 includes: a mold closing limiter 260 that abuts on the holder 223 to restrict the movement of the holder 223 when the mold closing operation is performed; and abuts on the pressure regulating module 222 to restrict the pressure regulating mold The movement of the member 222 is regulated by the pressure regulating module limiter 261. The regulator module limiter 261 is fixed between the base 220 and the regulator module 222 and fixedly disposed on the base 220 in the regulator module region (the plane region of the regulator module 222 shown in FIG. 18 ). According to the pressure regulating module limiter 261, since the movement of the pressure regulating module 222 for adjusting the resin pressure in the cavity C is restricted, for example, the resin pressure at the time of holding pressure (forming pressure) can be determined to a certain value.

The closed mold limiter 260 is fixedly installed on the base 220 in the gripper area (planar area of the gripper 223 shown in FIG. 18 ). That is, the mold closing limiter 260 is provided between the base 220 and the holder 223. According to the mold closing limiter 260, since the movement of the holder 223 constituting the side of the cavity C is restricted, the depth of the cavity C, that is, the thickness of the molded product can be determined to a certain value. The closed mold limiter 260 may be an exchangeable one member (block) fixedly provided on the base 220 (refer to FIG. 12), or may include a thickness The plural members of the adjustment member 262 (members of a predetermined thickness such as those shown in FIG. 17 and overlapping pads and the like). For example, if the thickness adjustment member 262 can be attached and detached in a direction (the side of the mold) that crosses the opening and closing direction of the mold, the thickness adjustment member 262 with a different height can easily adjust the shape of the molded product without removing the holder 223 thickness.

The cavity C (cavity cavity 213) configured in this way has a first space corresponding to the cavity area (planar area) and a second space corresponding to the pressure regulating module area (which becomes a so-called overflow cavity). In this embodiment, since the overflow cavity by the pressure regulating mechanism is provided in the cavity recess 213, the amount of resin and the resin pressure can be adjusted by adjusting the thickness of the resin R in the overflow cavity. According to this, for example, when the sheet-shaped resin R is used instead of the particulate resin R that is likely to generate dust and is difficult to be used in the clean room of the semiconductor factory for molding, the effect is particularly good. For example, regarding the molding using the sheet-shaped resin R, since the sheet-shaped resin R formed into a drum with a predetermined thickness, for example, is cut to match the shape of the cavity and used in any size, the adjustment of the amount of resin supplied is usually Will become difficult. On the other hand, the amount of resin R required for molding each workpiece W is not necessarily constant due to differences in the number of wafers mounted on the workpiece W and the like. Therefore, when the sheet-shaped resin R is used, it is difficult to set the resin R to an appropriate usage amount. In contrast, according to the above configuration, the amount of the resin R used can be adjusted, and the molding using the sheet-shaped resin R can be performed so as to maintain an appropriate resin pressure and form an appropriate molding thickness. In addition, the mold surface-side end surface 222a of the pressure regulating module is constructed as a (falling) inclined surface at a lowered position from the holder 223 side toward the cavity mold 221 side. Therefore, the mold surface side end surface 222a of the pressure regulating module can also be said to have a shape where the upper end portion of the pressure regulating module 222 has a defect. According to this, the pressing surface that is the pressing resin R can be enlarged In particular, the area of the face-side end surface 222a can be easily used to adjust the resin pressure on the first space side.

According to the molding die 210 of the present embodiment, when a predetermined amount of resin (necessary amount) is supplied to the cavity C without the pressure regulating module 222 and the resin is sealed (general compression molding die), the necessary amount is supplied. There is still a large amount of resin R, and it is possible to perform resin sealing with a desired thickness while applying an appropriate resin pressure. In addition, according to the molding die 210, compared with the case where an overflow cavity is provided outside the cavity through the flow channel (the molding die described in Patent Document 2), it is unnecessary to remove unnecessary resin molded outside the cavity, It can also improve the productivity of molded products.

In addition, the molding die 210 includes a lower die suction and holding mechanism that attracts and holds the release sheet F by the die surface 212a of the lower die 212, so as to improve the releasability of the molded product. For the release sheet F, a film material that has heat resistance that can withstand the heating temperature of the forming mold 210, is easily peeled from the mold surface 212a of the lower mold 212, and has flexibility and stretchability. Specifically, the release sheet F is suitable for PTFE, ETFE, PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidene chloride, and the like. Regarding the resin R supplied to the release sheet F, in addition to the above-mentioned sheet form, for example, a liquid form, a paste form, a powder form, or a bulk form may be used.

The lower mold suction and holding mechanism includes: suction devices 226 and 227 (for example, vacuum pumps) provided outside the mold; and one end opening on the mold surface 212a and the other end is connected (connected) to the suction devices 226 and 227 and attracts the release sheet F的Attraction paths 230, 231. By driving the suction devices 226 and 227, the release sheet F arranged on the mold surface 212a can be held by suction through the suction paths 230 and 231 (see FIG. 13). The suction path 230 includes, for example, a mold cavity The gap between the outer circumferential surface of the mold 221 and the inner circumferential surface of the pressure regulating module 222 and the gap between the outer circumferential surface of the pressure regulating module 222 and the inner circumferential surface of the holder 223 are configured. Therefore, an example of the lower mold suction and holding mechanism includes: a sealing member 232 (for example, an O-ring) provided between the cavity mold 221 and the pressure regulating mold 222 and provided on the base 220 side; A sealing member 233 (for example, an O-ring) provided between the module 222 and the holder 223 and provided on the base 220 side. According to the lower mold suction and holding mechanism, as shown in FIG. 18(A), the mold release sheet can be removed in such a manner as to avoid the film of the holder 223 being sandwiched into the avoidance position 228 and covering the cavity mold 221 and the pressure regulating mold 222 F is arranged (set) on the mold surface 212a of the lower mold 212 (see FIG. 13).

The forming mold 210 is, for example, as shown in FIG. 13 and includes a chamber decompression mechanism that decompresses the inside of the mold (between the upper mold 211 and the lower mold 212) as a chamber. This chamber decompression mechanism is provided with the same structure as the chamber decompression mechanism shown in FIG. 3 and described above. And each corresponding structure can obtain the same effect. Therefore, by driving the decompression device 237, the cavity formed inside the mold is decompressed via the decompression path 238, thereby preventing voids and unfilling of the molded product (resin portion).

As shown in FIG. 18, the planar shape of the cavity mold 221 (the shape of the mold surface on the upper mold 211 side) is such that a round shape can be used for wafer forming, and a rectangular shape (square shape) can be used for large substrates , Rectangular). In addition, in the pressure-regulating module 222 having a ring shape in a plan view surrounding the cavity module 221, a variety of mold surface shapes that arbitrarily set the outer shape and width can also be used. For example, FIG. 18(A) shows that a circular ring-shaped pressure regulating module 222 having a fixed ring width is used for the circular cavity mold 221. Fig. 18(B) shows that the square cavity mold 221 is adopted A ring-shaped rectangular pressure regulating module 222 having a fixed ring width. FIG. 18(C) shows that the square-shaped cavity mold 221 adopts a quadrangular ring-shaped pressure regulating module 222 whose ring width is wider at the corner than the side. FIG. 18(D) shows that the square-shaped cavity mold 221 adopts a quadrangular ring-shaped pressure regulating module 222 whose ring width is such that the sides between adjacent corners are wider than the corners. FIG. 18(E) shows that a rectangular ring-shaped pressure regulating module 222 having a short side portion wider than a long side portion is used for the rectangular cavity mold 221.

For example, the corners and short sides of the cavity C that are far from the center are more difficult to fill the resin R than the sides and long sides of the cavity C near the center. In this regard, as shown in FIGS. 18(C) and 18(E), by setting the pressure regulating module 222 whose ring width is wider at the corners and short sides than the side and long sides, the resin R It is difficult to overflow the sides and long sides of the cavity C near the center to prevent unnecessary overflow, which can promote the overall filling, and the adjustment of the resin pressure at the corners or short sides becomes easy. That is, the filling property of the resin can be improved. In addition, depending on factors such as the composition of the resin R or the arrangement of the wafers mounted on the workpiece W, the ring width is set as shown in FIG. 18(D). The side and long sides are more than the corner and short sides. A wide voltage regulator module 222 is the preferred case.

Next, the operation of the forming mold 210 (including the arrangement method of setting the work W) in the present embodiment will be described and the method of manufacturing a molded product using the forming mold 210 will be described. First, as shown in FIG. 12, the cavity mold 221 is relatively moved to the holder 223 in advance so that the upper end surface of the cavity mold 221 can come to the standby position in a state where the molding die 210 is opened. Therefore, based on the upper end surface of the base 220, the mold The position of the upper end surface of the cavity module 221 is lower than that of the holder 223. If the upper end surface of the base 220 is used as a reference, the mold surface side end surface 222a of the pressure regulating module 222 is located below the upper end surface of the holder 223, then it is located more than the upper end surface of the cavity mold 221 It does not matter whether it is high (see FIG. 12), the same or the lower position.

In addition, the suction devices 215, 226, 227 and the decompression device 237 can be driven in advance in a state where the molding die 210 is opened. Then, the workpiece W held by the workpiece holder 250 is carried into the mold using a loader (not shown). Moreover, the resin R is arrange|positioned on the center part of the release sheet F, and the resin R is carried into the mold together with the release sheet F. In the case where the resin R is transported together with the release sheet F, since the resin R is not supplied inside the mold, the preparation time of each molding die 210 can be shortened, and the scattering of the powdery resin R in the mold can be suppressed. Prevent heating of the dispenser. Of course, the resin R may be supplied to the release sheet F inside the mold.

The resin R is supplied to the release sheet F, for example, a dispenser equipped with a syringe that can be filled with liquid resin and injected or a surface feed of powdered resin can be provided by vibrating by an electromagnetic feeder The distributor of trough. In addition, according to the molding die 210 that can easily adjust the amount of resin, even a resin that is difficult to adjust in a small amount like a sheet-shaped resin can be used. In addition, the sheet-like resin can be supplied after peeling off the protective sheet provided to prevent deterioration such as oxidation.

Next, in a state where the molding die 210 is opened, the workpiece W is placed (set) on the die surface 211a of the upper die 211 through the workpiece holder 250, and the resin R is placed (set) on the cavity recess 213 of the lower die 212 (refer to FIG. 13). Specifically, in the upper mold 211, first, from the attraction path 216 The tape 251 of the tool holder 250 is fully attracted, so that the workpiece holder 250 holding the workpiece W is attracted to the mold surface 211a. Then, by rotating the chuck 217, the frame 253 of the workpiece holder 250 adsorbed to the mold surface 211a is hung and held. Therefore, the workpiece W is reliably arranged on the mold surface 211a without dropping.

Moreover, in the lower mold 212, the release sheet F is arranged so as to cover the mold surface 212a including the inner surface of the cavity recess 213, and by sucking the release sheet F from the suction paths 230 and 231, The mold surface side end surface 222a attracts the release sheet F (see FIG. 13). In this way, by making the release piece F conform to the mold surface side end surface 222a of the pressure regulating module 222 having an inclined surface between the upper end surface of the holder 223 and the upper end surface of the cavity module 221, compliance detachment is reduced The height of the step required by the die piece F can cover the die face 212a with a small amount of elongation. Therefore, the stress toward the release sheet F can be reduced. In addition, since the resin R is arranged at the center of the release sheet F, the resin R can be arranged on the upper end surface of the cavity mold 221 in the cavity recess 213 via the release sheet F. This resin R system is gradually melted from the part contacting the inner bottom surface of the cavity concave portion 213 because the molding die 210 is heated to a predetermined temperature by the built-in heater.

Next, the upper die 211 and the lower die 212 are gradually brought closer from the state where the forming die 210 is opened, as shown in FIG. 13, the sealing member 236 provided on the upper end surface of the chamber member 235 is brought into contact with the lower end surface of the chamber member 234 (Ie, sealed contact). Thus, a cavity (closed space) is formed inside the mold. At this time, since the decompression device 237 is driven, the chamber is decompressed through the decompression path 238, and a degassed state can be formed. In this way, even if the lower surface side of the tape 251 of the work holder 250 becomes a decompressed state, since this embodiment does not Since the upper surface of the tape 251 is held by the chuck 217 and the entire surface of the tape 251 is attracted to the mold surface 211a, the tape 251 to which the workpiece W not directly held by the chuck 217 is attached may not sag.

Next, as shown in FIG. 14, the upper mold 211 and the lower mold 212 are gradually brought closer. The upper module 214 of the upper mold 211 and the holder 223 of the lower mold 212 sandwich the tape 251 of the workpiece holder 250 via the release sheet F. Clamping. The opening of the cavity concave portion 213 is closed by the upper mold 211 due to clamping, and a cavity C composed of the cavity concave portion 213 is formed so that the resin R is wrapped in the cavity C. In the gap (first space) between the upper end surface of the cavity mold 221 and the work W or the tape 251, the resin R disposed on the upper end surface of the cavity mold 221 is pressed by the work W and pressed The expanded resin R starts to enter the mold surface side end surface 222a of the pressure regulating module 222. That is, a substantial overflow cavity (second space) flows out of the gap between the mold surface side end surface 222a of the pressure regulating module 222 surrounding the cavity mold 221 and the upper mold 211 (tape 251). In addition, by providing a vent hole (not shown) in the holder 223, the pressure in the cavity C can be reduced even after the release sheet F is held.

Next, as shown in FIG. 15, the upper mold 211 and the lower mold 212 are gradually brought closer to fill the cavity C with the resin R. Specifically, first, the elastic member 225 is pressed short, and the holder 223 moves toward the base 220 side while being energized. The cavity mold 221 moves the holder 223 relatively. At this time, the position of the upper end face of the cavity die 221 in the cavity recess 213 is changed from a deeper standby position to a shallower forming position, between the upper end face of the cavity die 221 and the workpiece W or with the tape 251 The gap (first space) becomes narrower. Therefore, the resin R disposed on the upper end surface of the cavity mold 221 is further held down by the workpiece W, toward the pressure regulating mold 222 surrounding the cavity mold 221 The substantial overflow cavity (second space), which is the gap between the mold surface side end surface 222a and the tape 251, flows in and fills the overflow cavity. Then, the pressure regulating module 222 (elastic member 224) is pressed down by the resin R that has flowed into the overflow chamber. In other words, the resin R that has flowed into the overflow chamber is pressed by the mold surface side end surface 222a of the pressure regulating module 222 that reciprocates according to the elastic member 224. Therefore, the cavity C is filled with the resin R while the resin pressure in the cavity C is adjusted by the pressure regulating module 222. In addition, since the mold surface side end surface 222a of the pressure regulating module 222 is constructed as an inclined surface, the resin pressure applied to the mold surface side end surface 222a by the resin R is not only a downward pressing force for the pressure regulating module 222. The pressure regulating module 222 may also be pushed toward the outside. According to this, the pressure regulating module 222 provided so as to surround the entire circumference of the cavity cavity module 221 can be uniformly applied with a pushing force toward the outside, so that the pressure regulating module 222 can be made relatively to the holder 223 and the mold The cavity module 221 maintains a uniform gap. According to this, it is possible to prevent slippage between the cavity die 221, the pressure regulating die 222, and the holder 223.

Next, as shown in FIG. 16, the upper mold 211 and the lower mold 212 are gradually brought closer, and the closed mold limiter 260 abuts on the clamper 223 to restrict (stop) the movement of the clamper 223. With this, the depth of the cavity C, that is, the thickness of the molded product can be determined to a certain value. Next, the resin R filled in the cavity C is thermally cured for a predetermined time in a state of holding pressure (state of final mold closing). In addition, when the thickness of the molded product is changed by sandwiching the release sheet F, a member (protruding member) for resisting may be provided at the avoidance position 228 (see FIG. 18(A)) that is not covered by the release sheet F ).

Furthermore, as shown in FIG. 16, the pressure regulating module 222 may also be brought into contact with the pressure regulating module limiter 261 to restrict movement. Therefore, based on resin pressure The pressure regulating module 222 becomes inoperative, and relatively speaking, the resin pressure when the pressure regulating module 222 is pushed up and held (forming pressure) can be determined to a certain value. On the other hand, when the pressure regulating module limiter 261 is not in contact with the pressure regulating module 222, an arbitrary resin pressure can be set according to the elastic coefficient of the elastic member 224. In addition, instead of the combination of the elastic member 224 and the pressure regulating module limiter 261, by providing another driving mechanism (for example, an air cylinder) that allows the pressure regulating module 222 to move back and forth in the mold opening and closing direction, further holding pressure can be performed ( Secondary holding pressure, etc.).

Next, the forming mold 210 is opened to release the upper mold 211 and the lower mold 212, and after the sealed work W is taken out of the mold, the tape 251 and the release sheet F are peeled from the sealed work W. At this time, since the housing 253 can be held and peeled off, the tape 251 can be easily peeled from the sealed work W. Then, it is subjected to heat curing (post curing) as a post-processing for a predetermined time to complete a molded product in which the workpiece W is sealed (full-molded) by the resin R (resin sealing portion).

(Embodiment 6)

In the foregoing fifth embodiment, the case where the release sheet F is used has been described. In this embodiment, the case where the release sheet F is not used will be described with reference to FIGS. 19 and 20. FIG. 19 is a schematic cross-sectional view of the main part of the forming die 210 of this embodiment. 20 is a schematic cross-sectional view of a main part of a modification of the molding die 210 of this embodiment.

The pressure regulating module 222 of the molding die 210 shown in FIG. 19 is provided with an upper ring 270 and a lower ring 271 (for example, stainless steel), a sealing gasket 272 (for example, fluororesin) as a sealing member, and a pin 273, which are assembled Posed. Specifically, the protrusions arranged on the upper ring 270 at predetermined intervals The part is inserted into the concave portion arranged at a predetermined interval in the lower ring 271 in a state where the gasket 272 is arranged at a predetermined interval, by penetrating the convex portion of the upper ring 270 and the concave portion of the lower ring 271 from the side of the lower ring 271 The pin 273 is used to assemble the voltage regulating module 222. In this pressure regulating module 222, between the pressure regulating module 222 and the cavity mold 221 and between the pressure regulating module 222 and the holder 223 are sealed by the gasket 272, respectively. Therefore, when the mold is closed, even if the resin R has flowed between the pressure regulating module 222 and the cavity mold 221 and between the pressure regulating module 222 and the holder 223, the resin can be prevented by the sealing gasket 272 R flows into the base 220 side. Therefore, even if the release sheet F is not used, it is possible to prevent the resin from leaking between the molds and causing a sliding failure. In addition, a driving mechanism (not shown) capable of pushing up the pressure regulating module 222 may be provided, so that the pressure regulating module 222 can be easily taken out, and the components can be easily disassembled and exchanged. In addition, according to the configuration shown in FIG. 19, since resin pressure is applied to the upper ring 270, a force is applied in the direction of crushing the gasket 272 made of an elastic body, for example. Therefore, the width of the gasket 272 in the plane direction becomes wider, the gap is reliably closed, and the resin leakage is more reliably prevented. In addition, the gasket 272 may use an elastomer of a resin material such as fluororesin, but it may also be a metal material.

In addition, the molding die 210 shown in FIG. 19 is provided with an ejector pin 280 that penetrates through the cavity die 221 and can be moved back and forth in the mold opening and closing direction by a driving source (for example, an air cylinder) and has an enlarged front end width. This ejector pin 280 is inserted into the through hole 281 formed in the cavity die 221. According to this, even if the mold release piece F covering the mold surface 212a of the lower mold 212 is not used, the molded product (workpiece W) sealed with the resin by the ejector pin 280 can be released from the lower mold 212. Also, for example, while applying vibration to the ejector pin 280 Pushing can promote demolding from the lower mold 212.

In addition, the molding die 210 of the present embodiment includes an air flow path 282 communicating with the through hole 281 on the base 220 side and an unillustrated air blowing device communicating with the air flow path 282. The air can be injected, and the work W can be promoted to be released from the lower mold 212. Moreover, if the workpiece W is pushed up by the ejector pin 280, air can be injected into the workpiece W while pulsating, for example, and the mold release can be further promoted. In addition, by ensuring the multiplication effect with the air supply by the space pushed up by the ejector pin 280, it is possible to demold (peel) more smoothly and surely.

In the molding die 210 shown in FIG. 19, for example, the resin R is directly supplied into the cavity recess 213 of the lower die 212. However, as shown in FIG. 20, even if the resin R is set in the resin mounting bracket 290 Supplying (carrying in) can also achieve the same effect. For the resin mounting bracket 290, for example, a metal plate such as a heat radiation plate or a shield plate used as a molded product can be used. The resin mounting bracket 290 can prevent the resin portion of the molded product from directly contacting the mold surface 212a of the lower mold 212, can ensure mold release properties, and can improve the productivity of the molded product. In addition, when the resin mounting bracket 290 is used, the ejector pin 280 may be straight (refer to FIG. 20) instead of the widened tip (refer to FIG. 19 ).

(Embodiment 7)

In the foregoing fifth embodiment, the case where the closed mold limiter 260 abuts on the clamper 223 and restricts the movement of the clamper 223 has been described. In this embodiment, the case where the mold closing limiter 260 abuts on the mold surface 211a of the upper mold 211 and restricts the movement of the holder 223 will be described with reference to FIGS. 21 and 22. 21 is a schematic view of the main part of the forming mold 210 of this embodiment Profile view. 22 is a schematic cross-sectional view of a main part of a modification of the molding die 210 of this embodiment.

The closed mold limiter 260 of the forming mold 210 shown in FIG. 21 is fixedly erected on the base 220 so as to have a predetermined height. This mold closing limiter 260 is, for example, as shown in FIG. 18(A), and is provided at a position avoiding the mold release sheet F, and can regulate the height of the mold cavity so that it becomes the correct forming thickness regardless of the thickness of the mold release sheet F. . In addition, the mold closing limiter 260 is provided with an upper pin 263 and a lower pin 264, and is assembled in a lock-in manner by combining a pair of these pins into a straight pin. Specifically, in a state where the mold is opened, first, the lower pin 264 is fixedly provided on the base 220. Next, in this way, the pin 264 can be inserted into the through hole 265 formed in the holder 223 so that the holder 223 is assembled so as to be able to move back and forth in the mold opening and closing direction. Next, the upper pin 263 is inserted from the upper end surface of the holder 223 (the mold surface 212a of the lower die 212), and the upper pin 263 and the lower pin 264 are fitted to assemble the closed mold limiter 260.

In the forming mold 210 shown in FIG. 21, although the upper mold 211 will press the holder 223 because of mold closing, the mold closing limiter 260 will abut the mold surface of the upper mold 211 according to further mold closing. 211a (the molding die 210 is fixed), so the movement of the holder 223 is restricted. In this way, the movement of the holder 223 constituting the side portion of the cavity C is restricted, so that the depth of the cavity C, that is, the thickness of the molded product can be determined to a certain value. In addition, the lower pin 264 can be screwed into the upper pin 263 from the mold surface 212a side of the lower mold 212 without removing the mold block of the holder 223 or the like from the base 220. 263 can easily adjust the thickness of the molded product. In addition, the upper pin 263 can also be provided on the upper die 211, and the upper pin 263 and the lower pin 264 are opposed to each other when the mold is closed, so that the thickness of the molded product is fixed to a certain value.

In addition, in the molding die 210 shown in FIG. 21, although the closed mold limiter 260 is in contact with the upper module 214 fixedly provided on the upper mold base (not shown), as shown in FIG. The mold limiter 260 abuts on the cavity member 234 that can be moved back and forth in the mold opening and closing direction, and the same effect can be obtained. In terms of the configuration in which the cavity member 234 can be moved back and forth in the mold opening and closing direction, the molding die 210 shown in FIG. 22 includes an elastic member 266 (for example, a coil spring) and a cavity member restrictor 267. In such assembly, first, the upper module 214 is fixedly arranged on the lower end surface of the upper mold base 218. Then, through the elastic member 266 on the lower end surface of the upper mold base 218, a cavity member 234 that surrounds the upper mold base 218, such as a cylindrical shape, is provided to be movable back and forth in the mold opening and closing direction. In addition, the chamber member limiter 267 is fixedly provided on the base 220 between the upper mold base 218 and the chamber member 234. In addition, since the chamber member 234 moves, the chamber mechanism that decompresses the inside of the mold is provided with a sealing member 268 (for example, an O-ring) provided between the upper module 214 and the chamber member 234.

In the forming mold 210 shown in FIG. 22, although the mold closing restrictor 260 presses the cavity member 234 because of mold closing, the cavity member 234 abuts the cavity member restrictor 267 because further mold closing (The forming mold 210 is fixed), so the movement of the holder 223 is restricted. In this way, the movement of the holder 223 constituting the side portion of the cavity C is restricted, so that the depth of the cavity C, that is, the thickness of the molded product can be determined to a certain value.

(Embodiment 8)

In the foregoing fifth embodiment, the configuration in which the pressure regulating module 222 and the holder 223 are provided as separate bodies has been described. In this embodiment, referring to FIG. 23 for the case where the pressure regulating module 222 and the holder 223 are integrated Instructions. Specifically, as shown in FIG. 23(A), in the lower mold 212, a sunken segment 223a may be provided on the inner periphery of the upper surface of the holder 223, and a pressure regulating die may be provided to the segment 223a via the elastic member 223b 222. According to this, as shown in FIG. 23(B), when the workpiece W is clamped and resin pressure is applied, the pressure regulating module 222 can be raised and lowered in the segment 223a of the clamper 223, which can be realized in a space-saving manner. The pressure regulating module 222 is provided.

In addition, the forming die 210 in this embodiment includes an upper die 211 equipped with a chuck mechanism (a mechanism including the chuck 217) configured to hold the workpiece W, and a cavity recess 213 (cavity) C) The lower mold 212 is compression molded. The chuck mechanism is equipped with a plurality of chucks 217. The front end (lower end) is a chuck 217 that protrudes from the mold surface 211a (lower surface) of the upper mold 211 and can be rotated. Hold the chuck 217 on the side of the workpiece W to hold the workpiece W. At the lower end of the chuck 217, an elastic portion 217c held by the workpiece W may be provided.

Specifically, as shown in FIG. 23(A), the upper mold 211 may include a chuck mechanism configured to hold the workpiece W by pressing a predetermined member against the workpiece W. This chuck mechanism includes a plurality of chucks 217 as shown in the same figure (for example, six, eight, etc.) at positions corresponding to the outer periphery of the workpiece W in the mold surface 211a. The front end of the chuck 217 protrudes rotatably from the mold surface 211a (lower surface) of the upper mold 211, and presses the side surface of the workpiece W from the outside to hold the side surface of the workpiece W to prevent falling. The chuck 217 is, for example, a shaft portion 217b that rotatably supports a rotating shaft 217a provided in the upper die 211, an elastic portion 217c provided at this lower end and held by the workpiece W, and a shaft portion 217b is a structure of a rotating elastic body 217d that is pressed in the direction of rotation. Therefore, the elastic portion 217c is moved from the side of the work W When pressed, the workpiece W invades, and part of the position is supported under the workpiece W. Therefore, according to such a chuck 217, the elastic portion 217c of the shaft portion 217b holds the workpiece W on the upper die 211 and can be prevented from falling. Moreover, the outer peripheral position of the cavity C can be extended to a position close to the outer peripheral position of the workpiece W, and the number of treatments can be increased to improve productivity.

Also, as shown in the same figure, the chuck 217 may be configured to limit the rotation angle of the shaft portion 217b by the limiter 217e provided in the upper die 211. Accordingly, the area partitioned by the inner circumferential position P of the mold at the lower end of the elastic portion 217c of the plurality of chucks 217 can also be made larger than the outer circumferential shape of the work W. In other words, the lower end of the shaft portion 217b may be opened toward the outside of the device. According to this, when setting the workpiece W to the upper die 211 from below, the setting operation is not hindered by the chuck 217, and the mechanism for setting the workpiece W can be simplified.

In addition, the chuck 217 can be raised and lowered. In this case, for example, the chuck 217 may be configured to have a long hole-shaped lifting hole 217f into which the rotating shaft 217a is inserted, and to be raised and lowered by the lifting elastic body 217g provided in the upper die 211. According to this configuration, as shown in FIG. 23(B), when the workpiece W is clamped and the shaft portion 217b is pushed up by the clamper 223, since the rotating shaft 217a is guided on the side of the lifting hole 217f, the shaft While the portion 217b is raised, the elastic body for lifting 217g is compressed. Thereby, since the chuck 217 is accommodated in the upper mold 211, the workpiece W can be clamped without the chuck 217 being pressed into the release piece F. According to this, since it becomes unnecessary to provide the accommodating concave portion of the chuck 217 in the holder 223, the mold configuration can be simplified. In addition, the mold release sheet F is prevented from being deformed to ensure stable adhesion. In addition, the chuck mechanism in this embodiment is not only other embodiments, as long as it is a mold on the upper mold 211 A compression molding die having a configuration in which the workpiece 211a (lower surface) holds the workpiece W and has a cavity C in the lower die 212 can be arbitrarily applied.

(Embodiment 9)

This embodiment relates to a resin molding method for resin molding a large-sized rectangular workpiece, for example.

In recent years, there are, for example, WLP (Wafer Level Package) for large-sized workpieces. This is a resin molding of wiring layers and terminals formed on a semiconductor wafer. In addition, other examples include EWLP (Embedded Wafer Level Package), which is to embed semiconductor devices directly into a printed wiring board and resin molding including the built-in semiconductor devices. In addition, a plurality of semiconductor elements are adhered to a stainless steel bracket and a thermal release sheet to perform resin molding in a unified manner. These systems are cut into individual sheets after the resin is molded to each semiconductor element.

Also, a large-size (for example, 300 mm × 300 mm, 500 mm × 500 mm, etc.) rectangular workpiece with a plurality of semiconductor elements arranged in a matrix of n rows × m columns on a bracket member such as a resin substrate is subjected to a resin mold system.

For example, it has been proposed to supply mold resin on the release sheet covering the lower mold cavity in a linear shape along the arrangement direction of the semiconductor wafer and in a diagonal shape to prevent entrapment of air due to resin flow 3. Resin molding by linear flow (refer to Japanese Patent Laid-Open No. 2005-225067).

When molding a semiconductor element mounted on a rectangular workpiece into a molding die (molding die) with an upper die cavity, the resin is molded In this case, the molding resin (liquid resin, granular resin, sheet resin) is supplied to the workpiece to perform resin molding. However, the applicant of the present application has conducted a resin supply step experiment in order to supply molding resin to a large rectangular workpiece for resin molding, even if, for example, the molding resin is supplied to the center of the workpiece in a simplified manner, or for example In order to prevent unfilled and scattered supply to the workpiece, the problem of air trap and unfilled caused by multiple molded resin busses cannot be solved. In addition, there is also a problem that the corners of the rectangular workpiece are prone to unfilled molding resin, and it takes time to bury the unfilled area to reduce productivity.

The purpose of this embodiment is to provide a solution to the problem of the above-mentioned conventional technology. For a large rectangular workpiece, there is no gas trap and the flow rate of the resin does not vary, and there is no unfilled area to improve the productivity of the resin molding method .

This embodiment has the following structure in order to achieve the above object.

A resin molding method that supplies molding resin to a rectangular workpiece for resin molding. The resin molding method is characterized by including: supplying the first molding with the first resin amount to the center of the rectangular workpiece The step of resin; on the diagonal line connecting the corners of the rectangular workpiece to each other, the second resin amount less than the first resin amount is supplied to the second side with the second resin amount less than the first resin amount A step of molding resin; and a step of sandwiching the rectangular-shaped workpiece with a molding die to melt and merge the first molding resin and the second molding resin into the cavity and heat-harden it.

Alternatively, it may be prepared to include the step of supplying the third molding resin between the second molding resin and the third molding resin in an amount less than the second resin quantity and separated from the first molding resin. The rectangular workpiece is sandwiched by a molding die so that the melted and merged first molding resin and third molding resin are filled in the cavity to be cured by heating.

According to the above-mentioned resin molding method, the first molding resin is supplied to the center of the rectangular workpiece with the largest amount of first resin, and the diagonal line connecting the corners of the rectangular workpiece to each other is larger than that of the first molding resin. The second molded resin is supplied with a second resin quantity less than the first resin quantity outside or alienated, or a third resin quantity less than the second resin quantity between the second molded resin and the first resin quantity The third molding resin is supplied detached from the molding resin.

Therefore, when the workpiece is clamped by the forming mold, the first molding resin and the second molding resin merge diagonally and are supplied with the third molding resin, because they merge with the first molding resin. The outside is filled into the cavity like a spread, so the molded resin can be filled while letting air escape outside without generating an air trap. Also, the largest amount of the first resin is supplied to the center of the rectangular workpiece with the largest resin flow and the second molded resin is supplied with a smaller amount of the second resin, if necessary, between the second molded resins The third resin amount smaller than the second resin amount can eliminate the variation in the resin flow amount of the molding resin filled in the cavity.

Therefore, for larger rectangular workpieces, there will be no unfilled areas of molded resin including corners, which can be applied efficiently and productivity can be improved.

In addition, when the granular resin or the liquid resin is used for the supply of the molded resin, a single nozzle or multiple nozzles can be used.

Preferably, the second molding resin and the third molding resin are arranged on concentric circles around the first molding resin and supplied.

Therefore, the supply positions of the second mold resin and the third mold resin are determined as concentric circles around the supply position of the first mold resin, so that the resin supply process can be performed uniformly and efficiently.

Alternatively, the first molded resin may intersect the second molded resin supplied diagonally of the rectangular workpiece and intersect the second molded resin at the center of the rectangular workpiece The aforementioned third molding resin is supplied so as to overlap.

Therefore, by supplying the second molding resin while scanning along the diagonal of the workpiece without separately supplying the first molding resin to the third molding resin, and scanning while crossing the center of the rectangular workpiece The third molding resin is supplied, and the first molding resin can be supplied so as to overlap at the center of the intersection, so that the resin supply step can be performed uniformly and efficiently.

The invention can provide a resin molding method which can improve productivity without generating an air trap for a large rectangular workpiece without deviation in the resin flow rate and without an unfilled area.

Hereinafter, a preferred embodiment of the resin molding method of this embodiment will be described in detail together with the attachment drawings (FIGS. 24 to 26 ). Hereinafter, for the workpiece, for example, a rectangular substrate in which a plurality of semiconductor elements are mounted on a rectangular resin substrate is used. In addition, the molding apparatus (resin molding apparatus) is explained by taking the compression molding apparatus, the lower mold as a movable mold, and the upper mold as a fixed mold as an example. In addition, although the molding device includes a mold opening and closing mechanism, the illustration is omitted, and the configuration of the molding mold will be mainly described.

The workpiece 1 is a rectangular resin substrate, and the semiconductor element 2 is mounted in a row/column shape (matrix shape or area pattern shape) of plural rows/plural columns, for example.

In FIG. 25(A), the compression molding apparatus includes an upper die 3 and a lower die 4. The workpiece 1 is mounted on the lower mold 4 and the cavity 5 is formed on the upper mold 3.

The upper mold 3 includes a cavity mold 3a forming a cavity bottom and a holder 3b around it.

The cavity mold 3a and the holder 3b can also be constructed so that either or both can move. Specifically, it may be provided to be supported by a coil spring or supported by a splitting mechanism actuated by a driving source to be movable.

The upper mold surface (clamping surface) containing the mold cavity 5 is covered by the release sheet 6. The release sheet 6 is sucked and held by the upper mold surface by a suction mechanism (not shown). In addition, a sealing material 7 (for example, an O-ring) may be provided on the lower die surface facing the holder 3b. The sealing material 7 may also be provided on a slidable block arranged on the outer peripheries of the upper die 3 and the lower die 4 on.

The resin molding process will be described with reference to FIGS. 24 and 25.

As shown in FIG. 24(A), the rectangular-shaped workpiece 1 placed on the lower mold 4 of the opened mold is supplied with molding resin. In addition, the molded resin may be supplied to the workpiece 1 outside the forming die and carried into the forming die.

In the case of, for example, liquid resin, the supply of the molded resin is supplied from the syringe device 9 through the nozzle 8 directly above the work 1. The nozzles 8 may be supplied together in a single-nozzle scanning method or in a multi-nozzle method. It is possible to adopt an appropriate configuration in accordance with the simplicity or productivity of the device.

The step of supplying the molded resin to the work 1 will be described in detail later.

In FIG. 25(A), the upper mold surface (clamping surface) of the upper mold 3 attracts and holds the release sheet 6. When the work 1 placed on the lower mold 4 is supplied with the molding resin R At this time, the lower mold 4 is raised to start mold closing.

In FIG. 25(B), when the mold closing operation is performed, the sealing material 7 hits the holder 3b of the upper mold 3 to seal the inside of the mold, and when the mold closing operation is further performed, the sealing material 7 is deformed and clamped The device 3b sandwiches the outer peripheral edge of the workpiece 1 via the release sheet 6 on one side. Therefore, the molded resin R is pressed and expanded toward the peripheral portion in the cavity 5. In addition, the air remaining in the cavity 5 is preferably exhausted by a decompression mechanism (not shown) that sucks the cavity.

As shown in FIG. 25(C), when the mold closing operation is completed, the molding resin R heated and melted while the rectangular mold 1 is sandwiched and held by the forming mold is hardened.

Here, an example of the resin supply step will be described with reference to FIGS. 24 and 26.

In FIG. 24(B), first, the first mold resin Ra is supplied to the center portion O of the rectangular workpiece 1 at the radius r1 with the first resin amount.

In addition, on the diagonal line connecting the corners of the rectangular workpiece 1 to each other, with a second resin amount separated from the first molding resin Ra and smaller than the first resin amount, the radius r2( <r1) Four parts are supplied with the second molding resin Rb. The actual resin coating pattern is shown in Fig. 24(C).

Also, regarding other methods, as shown in FIG. 24(D), between the second molding resin Rb, a third resin amount less than the second resin amount is concentrically separated from the first molding resin Ra It is also possible to supply the third molding resin Rc at four locations on the circle with a radius r3 (<r2). The distance from the center portion O of the rectangular workpiece 1 is that, because the diagonal is to be filled, the supply position of the second molding resin Rb is located at a position higher than that of the third molding resin Rc The supply is performed while the supply position is outside. The actual resin coating pattern is shown in Fig. 24(E).

According to this, since the supply position (nozzle position) of the second mold resin Rb and the third mold resin Rc is determined to be a concentric circle centering on the supply position (nozzle position) of the first mold resin Ra, the resin The supply steps can be performed uniformly and efficiently.

Further, as shown in FIG. 24(F), the first molding resin Ra and the second molding resin Rb and the second molding resin Rb supplied on the diagonal of the rectangular workpiece 1 may be prepared. The third molding resin Rc supplied crosswise at the center O of the work 1 is supplied so as to overlap. The second mold resin Rb is supplied so that the nozzle 8 intersects the center portion O of the rectangular workpiece 1 while scanning in the diagonal direction indicated by the arrow in the figure. The third molding resin Rc is supplied so that the position of the nozzle 8 and the second molding resin Rb are offset by 45°, for example, and crosses the center portion O of the rectangular workpiece 1 while scanning.

Thereby, without separately supplying the first molding resin Ra, the second resin molding resin Rb, and the third molding resin Rc, the second molding resin Rb is supplied while scanning along the diagonal of the work 1 Furthermore, the third molding resin Rc is supplied while scanning across it, so that the first molding resin Ra can be supplied so as to overlap at the center O of the rectangular workpiece 1, and the resin supply step can be performed uniformly and efficiently. The actual resin coating pattern is shown in Fig. 24(G).

FIGS. 26(A) to (C) schematically show the process of filling the cavity 5 with the second mold resin Rb shown in FIG. 24(B)(C) as the mold closes. (Refer to FIG. 26(A)), the second molding resin Rb is tied around the first molding resin Ra, diagonally and in a rectangular shape The workpiece 1 is supplied on a concentric circle centered on the center portion O.

As the mold closing operation progresses, although the first molding resin Ra and the second molding resin Rb expand and converge along the diagonal direction (see FIG. 26(B)), the direction is Since the outer peripheral portion of the cavity is pressed and expanded, no gas trap is generated and no unfilled area is generated (see FIG. 26(C)).

Specifically, since the adjacent second molding resins Rb are arranged to be sufficiently separated from each other, even if the second molding resin Rb gradually expands in diameter as the mold is closed, its outer edge is included in the gradually expanding first 1 The molded resin Ra prevents the outer edges of the arc-shaped second molded resin Rb from coming into contact with each other to form an air trap. In addition, since the second molding resin Rb is supplied to the corner portion side of the cavity 5, as compared with the case where only the first molding resin Ra is supplied, the flow amount when filling the resin can be reduced. Therefore, it is possible to prevent flow marks or unfilling from occurring near the corners of the cavity 5. In addition, since the supply can be performed in a shorter time than in the case where the mold cavity 5 is fully supplied, the productivity can be improved by reducing the comparative flow volume and making the supply step more efficient.

Figs. 26(D) to (F) schematically show the second molding resin Rb and the third molding resin Rc shown in Fig. 24(D)(E) as the mold closes the mold cavity In the process of filling in 5 (refer to FIG. 26(D)), the second molding resin Rb is around the first molding resin Ra, diagonally and centered on the center portion O of the rectangular workpiece 1 The supply is performed on concentric circles; the third molding resin Rc is supplied between the second molding resin Rb and on a concentric circle different from the second molding resin Rb.

As the mold closing operation progresses, the first molding resin Ra and the second molding resin Rb expand to converge along the diagonal direction, and then the first molding resin Ra Confluence with the third molding resin Rc (refer to FIG. 26(E)), as it is pressed and widened toward the outer periphery of the cavity without opening the air, no air trap is generated and no unfilled area is generated ( (See FIG. 26(F)).

Specifically, although the adjacent second molding resin Rb and third molding resin Rc are arranged closer to each other, the third molding resin Rc is supplied in a relatively small amount. Therefore, even if the second molding resin Rb and the third molding resin Rc gradually expand in diameter as the mold is closed, in the first molding resin Ra that starts to expand in diameter by performing a larger supply, air is trapped. Press to flow to the periphery. At this time, since the outer edges of the second molding resin Rb and the third molding resin Rc are included in the first molding resin Ra whose diameter is gradually expanded, there is no outer periphery of the molding resins Ra, Rb, and Rc. An air trap is formed to allow resin filling. In addition, the third molding resin Rc supplies the position close to the side of the cavity 5, as compared with the case where only the first molding resin Ra and the second molding resin Rb are supplied, the filling can be further reduced The flow of resin. Therefore, it is possible to prevent flow marks or unfilling in the vicinity of the side of the cavity 5.

FIGS. 26(G) to (I) schematically show the third molding resin Rc shown in FIG. 24(F)(G) and the second molding resin Rb supplied on the diagonal of the workpiece 1 in a cross-supply The process of overlapping the center O of the rectangular workpiece 1 to supply the first mold resin Ra and filling the cavity 5 as the mold closing operation proceeds (see FIG. 26(G)). At this time, it is preferable that the second molding resin Rb supplied diagonally is supplied to the opposite side such that the length of the second molding resin Rb is longer than the third molding resin Rc in order to make the amount of resin flow in the cavity 5 uniform. Near the corner. Further, it is preferable that the end of the second molding resin Rb is formed into a protruding pointed shape (refer to arrow J in FIG. 26(G)) to prevent the flow marks of the corner portion and the second molding resin Rb is made Being supplied To a location close to the corner.

In this case, since the second molding resin Rb and the third molding resin Rc are previously supplied so as to overlap (converge) at the central portion O of the rectangular workpiece 1, the molding resin is performed as the mold closing operation proceeds R expands radially outward from the central portion O (refer to FIG. 26(H)), and is compressed and expanded toward the outer peripheral portion of the mold cavity without air intake, so no air trap is generated and no unfilled area is generated. (See Fig. 26(I)).

According to the resin molding method described above, even if the workpiece 1 is sandwiched by the molding die and supplied to the plural parts of the molding resin, no air trap is generated, and the molding resin is filled while allowing air to escape. In addition, a larger amount of the first resin is supplied to the central portion O of the rectangular workpiece 1 with the largest resin flow and a second amount of the second molding resin is supplied with a smaller amount of the second resin. The amount of the third resin that is less than the amount of the second resin is supplied between them, whereby the variation in the amount of resin flow of the first to third molding resins can be eliminated.

Therefore, for the larger rectangular-shaped workpiece 1, no unfilled area of the molding resin R containing corners is generated, and it can be coated efficiently, and productivity can be improved.

The above examples have described the case where the molding resin R uses a liquid resin, but it can also be a granular resin, and furthermore, the sheet resin can be cut and processed to an appropriate size (resin amount) for use .

In addition, in the case where the nozzle 8 feeds the molding resin R directly downward without scanning the rectangular workpiece 1, the resin supply position is preferably at least five, and any more resin supply positions can be arbitrarily increased.

Also, it is preferable that the second resin is supplied diagonally when the nozzle 8 scans the rectangular workpiece 1 and supplies the molding resin R The length of the mold resin Rb is supplied so as to be longer than the length of the third mold resin Rc that is supplied crosswise at the center O of the rectangular workpiece 1. Therefore, there is no deviation in the amount of resin flow and an air trap can be prevented.

In addition, when the semiconductor element 2 mounted on the workpiece 1 is defective, it is necessary to adjust the amount of the defect of the buried semiconductor element 2 for the molding resin R system to supply. In this case, the supply amount can be adjusted by any of the first molding resin Ra, the second molding resin Rb, and the third molding resin Rc. In addition, the example in which the molded resin R is supplied to the workpiece 1 has been described. However, the molded resin R is supplied to the release sheet 6 and the forming die provided with the cavity 5 in the lower die 4 is also provided according to the release sheet 6. The same effect can be obtained.

In the above, the present invention has been specifically described based on the embodiments, but the present invention is not limited to the foregoing embodiments, and of course various modifications can be made within a range not departing from the gist thereof.

For example, in the first embodiment described above, in a configuration in which the cavity mold and the holder are assembled so as to move forward and backward relatively in the mold opening and closing direction, the cavity mold is fixed to the base to make the holder movable The situation is explained. However, without being limited to this, it may also be a case where the cavity mold is movable relative to the base and the holder is fixed, or both the cavity mold and the holder are movable.

In addition, instead of the tape 51 as described above, a tape having a predetermined width and an opening in which a predetermined amount of weight is attached at the outer peripheral position of the work W may be used. Accordingly, the amount of peeling tape can be reduced to simplify peeling, and even if there are irregularities in the center of the back surface of the work W, it can be stably attached regardless of it, and the back surface of the work W can be prevented from being caused by the force of peeling off the tape Damage such a situation. Also, when using this type of tape, An upper die may be formed in which a recess for absorbing the difference in thickness between the outer periphery of the workpiece W to which the tape is applied and the inner side thereof is provided at the outer peripheral position of the upper die to form a protruding segment of the inner peripheral portion.

In addition, the one aspect of the invention described in this specification is not limited to the above-mentioned configuration, and it may be made as follows: the upper mold 11 and the lower mold 12 are provided, and the reduction between the upper mold 11 and the lower mold 12 is performed. In the forming mold 10 of the pressure reduction mechanism, the upper mold 11 is configured with a tape suction mechanism that absorbs the force caused by the pressure reduction mechanism to decompress the tape 51 from the upper mold 11 due to the pressure reduction mechanism. Holding tape 51, in which the upper mold 11 uses a workpiece holder 50 holding a workpiece W and arranges the workpiece W, the lower mold 12 has a cavity recess 13 to which the resin R is supplied. In this case, in the same way as in the above-described embodiment, it is possible to prevent a defect in which the tape 51 is inadvertently peeled off from the upper mold 11 due to the reduced pressure to prevent the occurrence of voids or the like, and the workpiece W and the lower mold 12 side come into contact. In order to achieve such an effect, it is not necessary that the overflow member 22 surrounding the cavity mold 21 is surrounded by the holder 23. In addition, even if the cavity recess 13 is provided in the upper die 11 and the workpiece holder 50 is set upside down as in the lower die 12, a corresponding effect can be obtained.

In addition, the overflow member 22 does not necessarily need to have an annular structure surrounding the outer periphery of the cavity die 21, as long as it can be raised and lowered at a position surrounding the cavity die 21. For example, it may be configured such that the outer peripheral shape of the cavity mold 21 is partially recessed in plan view, and the block is accommodated by the recessed portion. In this case, for example, a plurality of such blocks are provided at equal intervals, and the same effect as the configuration in which the annular overflow member 22 is arranged can be achieved at low cost.

In addition, various configurations as shown in FIG. 6 have been described for the workpiece W, but it is not limited thereto. For example, the size of the workpiece W may be any. For example, not only a rectangular shape of about 70 mm×240 mm like a so-called interposer, but in terms of the size above it, for example, it may be one with a side of 500 mm or more. In addition, in order to handle any number of the workpieces, the tape W may be formed in a row or a plurality of rows, and the workpieces W are arranged in a plurality of rows and columns in a plurality of rows and rows, and the whole molding is performed in a unified manner. As an example, if it is a rectangular mold cavity C of 500 mm on each side, it can be performed by taking a 70 mm×240 mm rectangular workpiece W with an appropriate gap and arranging 12 rows of 2 rows×6 columns for a total molding. Highly productive manufacturing. Of course, if it is a mold cavity C of this size, a rectangular-shaped workpiece W of 18 inches (approximately 450 mm)×18 inches can also be fully molded. Therefore, by changing the arrangement and the number of attachments of the workpiece W in the tape 51, a single cavity C (forming mold) can be used to perform various types of molding. According to such a configuration, productivity is extremely high, and unnecessary resin generation can be prevented, and various types of molding can be performed while reducing the amount of resin used. Furthermore, instead of providing one cavity recess 13 for a plurality of workpieces W, a mold configuration may be provided in which cavity recesses 13 are provided according to the number of workpieces W.

In addition, the upper mold 211 and the lower mold 212 in the forming mold 210 may be inverted up and down. In this case, the resin W can be simultaneously supplied while the work W is mounted. According to this, the transport mechanism can be eliminated and the device structure can be simplified. In addition, the pressure regulating module 222 does not necessarily need to be provided between the cavity mold 221 and the holder 223, and may be provided repeatedly with the holder 223. In this case, for example, a groove portion for the resin R to overflow is arranged on the mold surface (end surface) of the holder 223 over the entire circumference. The pin-shaped pressure regulating module 222 that is partially pressurized can be formed so as to have an appropriate molding thickness while maintaining the resin pressure.

In addition, an elastic body layer may be provided on the end surface of the cavity mold 221 to prevent the occurrence of resin burrs toward the end surface of the wafer component (see FIG. 19) mounted on the workpiece W. In this case, for example, the resin R may be arranged in a lattice between the wafer parts, and the wafer parts may be sealed while being pressed against the elastic body.

In addition, the invention disclosed in this specification is not limited to the configuration of the embodiment shown in the above figures, and can be established in any device or method including the minimum necessary configuration corresponding to each operational effect. As an example, when the pressure regulating module 222 as shown in FIG. 19 is used to prevent the resin from leaking between the molds, the mold release mechanism including the ejector pin 280 is not necessarily required, and any configuration may be used.

10: Forming mold

11: Upper die

12: Lower die

11a, 12a: mold surface

13: Mold cavity recess

14: Upper module

15, 26, 27: attraction device

16, 30, 31: attraction path

17: Chuck

20: Base

21: Mold cavity module

22: overflow piece

23: gripper

24, 25: elastic member

32, 33, 36: sealing member

34, 35: chamber parts

37: Pressure relief device

38: Decompression path

50: workpiece holder

51: tape

52: opening

53: Frame

101: Transport Department

101a: Transport arm

W: Workpiece

R: resin

F: release sheet

Claims (7)

A forming mold is characterized by comprising: a workpiece holder which holds a workpiece; an upper mold which is arranged with the workpiece in place through the workpiece holder; a lower mold which has a cavity recess for accommodating the workpiece when the mold is closed; and A decompression device that decompresses by using the space between the upper mold and the lower mold as a cavity, the lower mold includes: a cavity mold that constitutes the bottom of the cavity recess; an overflow member that surrounds the cavity mold ; A holder, which surrounds the overflow member; and a lower mold suction holding mechanism, which has a suction path opening in the mold surface and a suction device communicating with the suction path, and the mold surface is sucked to hold the release sheet, as described above The cavity mold and the holder are provided to move forward and backward relative to the mold opening and closing direction, the overflow member is provided to move forward and backward in the mold opening and closing direction, and the workpiece holder includes: an adhesive tape, which is in a plan view Is larger than the opening of the cavity of the mold cavity, is sandwiched between the upper mold and the lower mold, and the workpiece is attached to the center of the lower surface; and the frame body with the opening is made to be attached to the aforesaid in plan view The workpiece of the tape is located in the opening, and the frame is attached to the outer peripheral portion of the lower surface of the tape. The upper mold for the workpiece is provided with a chuck and an upper mold suction and holding mechanism. The chuck is provided The frame body is held on the upper mold by sandwiching the outer peripheral end of the frame body around the mold surface. The mold suction and holding mechanism has a suction path that opens at a plurality of places on the mold surface and a suction device that communicates with the suction path, and the tape is attached to the mold surface in a state where the work piece is attached. The molding die according to claim 1, wherein the frame body includes decomposable first and second frame bodies, and the second frame body is sandwiched between the first frame body and the second frame body so as to sandwich the outer periphery of the tape The frame body is fitted into the concave portion of the first frame body to hold the tape. The forming die according to claim 1 or 2, wherein the workpiece holder is in such a state that the opening of the frame body and the opening of the holder are aligned, and the tape is in close contact with the mold surface of the upper mold where the workpiece is arranged Next, the tape and the frame are held by the holders of the upper mold and the lower mold. The forming mold according to claim 1 or 2, wherein the workpiece holder has an opening of the frame larger than the holder, and the adhesive tape is in close contact with the mold surface of the upper mold where the workpiece is arranged, The holders of the upper mold and the lower mold hold the adhesive tape. The forming mold according to claim 1 or 2, wherein the upper mold on which the workpiece is disposed is provided on a mold surface with a housing portion that houses the frame body, and the workpiece holder is configured to house the frame body in the housing portion and use the tape The tape is held by the holders of the upper mold and the lower mold in a state of being in close contact with the mold surface of the upper mold. A forming device that uses the forming according to any one of claims 1 to 5 A mold, the forming apparatus includes: a conveying section that conveys the workpiece before resin sealing combined with the workpiece holder; a stamping section that resin-seales the workpiece with the forming mold; and a storage section that stores the warp The resin-sealed workpiece is a molded product. A method for manufacturing a molded product using the molding die according to any one of claims 1 to 5, the method for manufacturing the molded product includes: gradually opening the upper mold and the lower mold from the state of the mold opening, The step of holding the workpiece holder by the holders of the upper mold and the lower mold, forming a cavity formed by the cavity recesses, and enclosing the resin in the cavity; and further making the upper mold The step of gradually approaching the lower mold and filling the cavity with the resin.

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