TWI746268B - Resin supply device and resin molding device - Google Patents

Abstract

Provides a technology that can prevent undesirable conditions such as air in the resin.

The inside (30a) of the chamber (30) is evacuated. Next, the liquid resin (R) is discharged from the nozzle (22) to the workpiece (W), which is the workpiece (W), in the interior (30a) of the chamber (30) in a vacuum state. Next, after stopping the discharge of the liquid resin (R) and stopping the vacuuming of the inside (30a) of the chamber (30), the nozzle (22) is reciprocated in the inside (30a) of the chamber (30).

Description

Resin supply device and resin molding device

The present invention relates to a resin supply technology, resin molding technology and resin placement technology.

Japanese Patent Application Laid-Open No. 2012-126075 (hereinafter referred to as "Patent Document 1") describes a liquid resin supply device. This liquid resin supply device discharges and supplies the liquid resin filled in the syringe from a tube nozzle to the workpiece.

Japanese Patent Application Laid-Open No. 2007-111862 (hereinafter referred to as "Patent Document 2") describes a vacuum distribution device. This vacuum distribution device arranges the product to be coated in a vacuum chamber and supplies liquid resin under a vacuum atmosphere. In addition, this vacuum distribution device is provided with a suspension liquid support container outside the vacuum chamber in order to prevent the device from being dirty due to the suspension of liquid from the nozzle.

Japanese Patent Application Laid-Open No. 2007-307843 (hereinafter referred to as "Patent Document 3") describes a method of resin-molding a workpiece (a molded article) using sheet resin. Here, after the molding die is opened and the workpiece is set, the sheet resin is supplied to the workpiece so as to cover the resin molding area of the workpiece.

[Prior Technical Literature] [Patent Literature]

Patent Document 1 Japanese Patent Application Publication No. 2012-126075

Patent Document 2 Japanese Patent Application Publication No. 2007-111862

Patent Document 3 Japanese Patent Application Publication No. 2007-307843

[The problem to be solved by the invention]

When resin molding is performed on an object (for example, a workpiece or a film), the liquid resin supply device described in Patent Document 1 can be used to supply liquid resin to the object. However, for example, when liquid resin is supplied to a substrate on which a plurality of chip components (wafer-shaped electronic components) are mounted as a workpiece, that is, a workpiece, the liquid resin covering the plurality of chip components may become water droplets. The situation of the shape of the block. In this regard, air will remain between the substrate and the liquid resin, and as a result, the molded product will easily become unfilled. In addition, there is a possibility that so-called underfilling may not be appropriately performed in wafer parts that are flip-chip bonded on a substrate as a work.

Therefore, for the supply of the liquid resin, the technique described in Patent Document 1 is not in an atmospheric environment, but the technique described in Patent Document 2 can be considered to be carried out under a vacuum atmosphere to remove residual air. However, the technique described in Patent Document 2 is a structure in which the liquid suspension container is moved under the nozzle after the vacuum chamber is opened to the atmosphere (refer to the paragraph [0026] of the specification in particular), so there may be a problem on the workpiece. Liquid resin may adhere to dust.

An object of the present invention is to provide a technology that can prevent the undesirable conditions such as air contained in the resin. One objective, other objectives, and novel features of the present invention can be understood from the description of this specification and the attached drawings.

For example, another object of the present invention is to provide a technique for suppressing air mixing during resin installation. As described in Patent Document 3, when sheet resin is supplied to a workpiece placed on a forming mold in an open state, the sheet resin is softened due to the radiant heat of the forming mold set to the molding temperature by a heater. Therefore, for example, when a substrate on which a plurality of wafer parts are mounted is used as a work having uneven portions, there is a possibility that the sheet resin may be softened in a state where air is drawn between the sheet resin covering the wafer parts and the substrate. In this case, air may enter the resin molded part of the molded product, which may cause voids. [Means to solve the problem]

A brief description of the representative ones of the inventions disclosed in this case is as follows.

The resin supply method related to a solution of the present invention is characterized by including: (a) The process of vacuuming the inside of the chamber; (b) A step of discharging liquid resin from a nozzle toward the object to be supplied from the inside of the chamber in a vacuum state; and (c) After stopping the discharge of the liquid resin and stopping the evacuation of the inside of the chamber, the process of shutting off the nozzle is performed in the inside of the chamber. More preferably, in the step (c), after stopping the discharge of the liquid resin and stopping the vacuuming of the inside of the chamber, the nozzle is reciprocated in the inside of the chamber. Accordingly, it is possible to prevent defects such as air in the resin.

Here, it is more preferable that in the step (b), the liquid resin is discharged while measuring the weight of the liquid resin by a weight meter provided in the interior of the chamber. According to this, the weight of the liquid resin can be accurately measured.

Furthermore, it is more preferable that in the step (b), the liquid resin is discharged while moving the nozzle in parallel with the object to be supplied. According to this, the liquid resin can be supplied into the surface of the object to be supplied at any discharge position.

The resin supply method according to another solution of the present invention is characterized by comprising: (a) a step of discharging liquid resin from a nozzle toward the object to be supplied in the inside of the chamber; (b) performing the inside of the chamber Step of vacuuming; and (c) after stopping the ejection of the liquid resin and stopping the vacuuming of the inside of the chamber, the step of shutting off the nozzle is performed in the inside of the chamber. Accordingly, it is possible to prevent defects such as air in the resin.

The resin sealing method according to one of the solutions of the present invention is characterized by comprising: using any one of the resin supply methods described above to supply the liquid resin to the object to be supplied; and using the object to be supplied and heating with a mold The process of pressing and sealing with resin into a predetermined shape. According to this, high-quality resin sealing can be performed to prevent voids or unfilled caused by air contained.

The resin supply device according to one of the solutions of the present invention is characterized by comprising: a chamber in which an object to be supplied is placed; a discharge portion having a nozzle for discharging liquid resin toward the object to be supplied, and the nozzle is provided in the chamber A vacuum part, which evacuates the inside of the chamber; a nozzle lift drive part that reciprocates the nozzle; and a control part, which controls the discharge part, the vacuum part and the nozzle lift drive part, in In the state where the ejection of the liquid resin from the ejection section is stopped and the vacuum is stopped by the vacuum section, the control section controls the nozzle elevation drive section to reciprocate the nozzle. According to this, the discharged liquid resin can be cut off from the object to be supplied in the inside of the chamber.

Here, it is more preferable that a weight meter is further provided, which is provided in the interior of the chamber so that the object to be supplied is placed, and the weight of the liquid resin discharged is measured. According to this, the weight of the liquid resin can be accurately measured.

Furthermore, it is more preferable that the chamber includes one and the other chamber part, and a sealing part that seals between the one chamber part and the other chamber part, and is configured to be openable and closable, and the discharge part is provided The one chamber part is further provided with a chamber driving part to make the one chamber part advance and retreat and move in parallel with the other chamber part. According to this, the liquid resin can be supplied to the surface of the object at any discharge position.

The resin supply device according to another solution of the present invention is a resin supply device that supplies liquid resin to an object to be supplied in a chamber set in a vacuum state, and is characterized by comprising: a chamber cover constituting the aforementioned chamber and The chamber body; a sealing ring provided on the opening edge of the chamber body to seal between the chamber cover and the chamber body; and the load support is provided on the chamber body along the sealing ring, in the chamber The chamber cover and the aforementioned chamber body bear a load. According to this, the resin can be supplied in a vacuum state in which air is removed. In addition, the seal ring is prevented from being excessively crushed by the load support, and the airtightness is ensured, so that the chamber can be placed in a vacuum state.

More preferably, in a state where the chamber is opened, the sealing ring is higher than the load support in the height from the chamber body to the chamber cover. According to this, when the chamber is closed, the hermeticity is ensured, and the chamber can be set to a vacuum state.

In the resin supply device, it is more preferable to further include a cover driving part, and it is more preferable to move the chamber cover to the chamber body in a state where the chamber is closed. According to this, the chamber cover can be moved in a vacuum state.

More preferably, in the resin supply device, the load support has a configuration in which a plurality of ball rollers are provided. Accordingly, the chamber cover can be easily moved in a vacuum state.

More preferably, the resin supply device is further provided with a weight scale, and is provided in the cavity and the object to be supplied is placed. According to this, the amount of resin supplied to the object can be measured immediately.

More preferably, the resin supply device is further provided with: a setting table provided in the chamber and for setting the object to be supplied; and a table driving unit that rotates the setting table. According to this, the moving range of the resin supply side (chamber cover) can be reduced to reduce the capacity of the chamber, so that a vacuum state of a predetermined pressure can be formed in a short time, or, for example, a vacuum pump with high attractive force can be not used, thereby reducing manufacturing costs.

Preferably, the resin supply device is further provided with a weight scale, and the object to be supplied is arranged outside the chamber and placed via a pin penetrating the chamber body. According to this, the amount of resin supplied to the object can be measured without a weight meter in the chamber.

A resin molding apparatus according to an embodiment of the present invention is characterized by including: the resin supply device; and a mold having a cavity and thermosetting the resin in the cavity. According to this, molding defects such as unfilled can be prevented.

The resin supply method according to another embodiment of the present invention is to supply a liquid resin to an object having a narrow portion, and the method is characterized by comprising: (a) the step of placing the object to be supplied into the chamber; (b) After the step (a), the step of depressurizing the chamber; (c) after the step (b), the step of supplying the resin to the narrow part; and (d) the step (c) After that, the step of pressurizing the aforementioned chamber. Accordingly, the pressurized resin can be injected into the reduced pressure narrow.

In the resin supply method, it is more preferable that in the step (b), the chamber is put in a vacuum state, and in the step (d), the chamber is opened to the atmosphere. According to this, resin can be injected again toward the narrow part.

In the aforementioned resin supply method, it is more preferable that the carrier to which the wafer component is flip-chip bonded is used as the object to be supplied, and it is more preferable that the narrow portion is provided between the carrier and the wafer component. According to this, underfilling can be easily performed.

One solution of the present invention relates to a resin placement method that heats and presses in a mold cavity of a forming mold and places a resin thermally hardened into the shape of the cavity on the object to be supplied. It is characterized by including:( a) The process of supplying resin to the object to be supplied; (b) After the step (a), the process of placing the object to be supplied in the open chamber; (c) After the step (b), the cavity The chamber is placed in a closed state to depressurize the inside of the chamber; (d) after the step (c), the pressure inside the chamber is increased; (e) after the step (d), The process of putting the chamber in an open state and taking out the object to be supplied. More preferably: the aforementioned supplied material is a workpiece. Moreover, it is more preferable that it is the said to-be-supply-type release sheet. According to this, it is possible to reduce the gap between the object to be supplied, that is, the release film or the workpiece, and the resin, and the molding can be performed to prevent defects such as unfilling.

Here, it is more preferable that in the step (a), the resin is supplied on the object having uneven portions so as to cover the uneven portions, and in the step (d), the resin is allowed to follow the object to be supplied. The aforementioned concavities and convexities. According to this, it is possible to prevent the occurrence of a gap between the uneven portion and the resin.

Furthermore, it is more preferable that in the step (c), the pressure of the inside of the cavity is reduced while heating the resin. According to this, it is possible to cover the object to be supplied with the resin in a softened state.

Furthermore, it is more preferable to cool the said resin after the said (c) process. According to this, it is possible to suppress the occurrence of resin reaction.

Furthermore, it is more preferable that in the step (a), a sheet resin is used as the resin. According to this, it is possible to form a state where the resin is uniformly supplied.

More preferably, the object to be supplied to which the resin is supplied by the resin placement method is carried into a molding die, and the resin is heated and pressurized in the cavity of the molding die to thermally harden it. Accordingly, in the resin molded part of the molded product, the generation of voids due to air mixing can be suppressed. [Effects of the invention]

A brief description of the effects that can be obtained by a representative of the inventions disclosed in this case is as follows. According to the solution of the present invention, it is possible to prevent undesirable conditions such as air contained in the resin.

In the following embodiments of the present invention, when necessary, the description will be divided into plural parts, etc., but in principle, they are not irrelevant to each other, but one is part or all of the modification of the other. And so on. Therefore, in all the drawings, the same reference numerals are given to members having the same function, and repeated descriptions thereof are omitted. In addition, the number of constituent elements (including number, numerical value, amount, range, etc.) is not limited to a specific number, and may be specific, except for the case where it is specifically stated or when it is clearly limited to a specific number in principle. The number above or below. In addition, when referring to the shape of the constituent elements, etc., except for cases where it is specifically stated and the principle is clearly considered to be otherwise, it is assumed to include those that are substantially similar to or similar to the shape or the like. (Embodiment 1)

The resin supply device 10 according to the embodiment of the present invention will be described with reference to FIGS. 1 to 8. 1 to 8 are diagrams for explaining the resin supply device 10 involved in the resin supply operation. In addition, assuming that the resin supply device 10 is in a three-dimensional (XYZ) orthogonal coordinate system, the vertical direction (vertical direction) in the figure corresponds to the direction along the Z axis, and the horizontal direction is along the X axis and Y axis. direction.

In this embodiment, the workpiece W is used as the object to which the liquid resin R is supplied. This work W is attached to a circular metal (SUS, etc.) carrier plate with a diameter of 12 inches (about 30 cm) with a thermally peelable adhesive sheet (adhesive tape), and a plurality of semiconductor chips are formed on the adhesive sheet Adherents in ranks. The liquid resin R is supplied to such a workpiece W, and the so-called E-WLP (Embedded Wafer Level Package) and eWLB (Embedded Wafer Lebel BGA) are performed. Resin molding. In addition, as the liquid resin R, for example, a thermosetting resin such as silicone resin or epoxy resin is used.

The resin supply device 10 includes a control unit 11. The control unit 11 is equipped with a CPU (central processing unit) and a memory unit such as ROM and RAM. The CPU reads and executes various control programs recorded in the memory unit to control the components of the resin supply device 10 action. The actions performed by these parts become actions of the resin supply device 10.

Moreover, the resin supply apparatus 10 is equipped with the discharge part 20 which discharges and supplies the liquid resin R. The discharge part 20 includes: a syringe 21 for storing the liquid resin R; a nozzle 22 provided at the tip of the syringe 21; and a plunger 23 inserted into the syringe 21 and capable of pressing the liquid resin R. Moreover, the discharge part 20 is provided with the pinch valve 24 which is provided so as to pinch the tubular nozzle 22 which consists of an elastic body, and opens and closes the nozzle 22 by the drive mechanism which is not shown in figure, for example. In addition, as for the nozzle 22, as long as the opening and closing of the nozzle 22 can be arbitrarily switched (in other words, whether the liquid resin can pass through), the nozzle 22 can be opened and closed by pinching the nozzle 22 made of an elastic body as described above. Pinch valve 24. For example, it can also be made into the structure equipped with the shutter at the nozzle tip, or the structure equipped with the opening-and-closing valve.

The discharging unit 20 opens and closes the pinch valve 24 by a driving mechanism not shown, and the plunger 23 moves downward to cause the liquid resin R in the syringe 21 to flow in the extrusion direction to discharge the liquid resin R from the nozzle 22. On the other hand, the discharge part 20 stops the plunger 23 from moving downward and the pinch valve 24 is closed to stop the discharge of the liquid resin R from the nozzle 22.

In addition, the resin supply device 10 includes a chamber 30 in which a workpiece W (an object to be supplied) is placed inside 30a. The chamber 30 is provided with a pair of chamber parts 31, 32 (one is set as the upper chamber section 31, and the other is set as the lower chamber section 32) and is configured to be openable and closable. Moreover, the resin supply device 10 is equipped with the sealing part 33 (for example, O ring) which seals between the upper chamber part 31 and the lower chamber part 32. As shown in FIG. Thereby, when the chamber 30 is in a closed state, the upper chamber portion 31 and the lower chamber portion 32 are in contact with each other via the sealing portion 33, and the interior 30a of the chamber 30 is formed (in a closed state). In addition, a temperature adjustment unit (not shown) that arbitrarily adjusts the temperature inside the chamber 30 is provided. In addition, the lower chamber portion 32 may be configured as, for example, a table portion of the device frame, or a plate-shaped member may be fixed to the device frame.

As will be described later, the liquid resin R is discharged from the nozzle 22 to the work W placed in the interior 30a of the chamber 30 (refer to FIG. 3). For this reason, in the resin supply device 10, the upper chamber portion 31 is provided with the ejection portion 20. Specifically, the resin supply device 10 is configured such that the nozzle 22 penetrates the upper chamber portion 31 and is provided in the interior 30 a of the chamber 30 while the syringe 21 is held outside the chamber 30. Therefore, the resin supply device 10 includes a discharge holding portion 34 and sealing portions 35 and 36 (for example, O-rings). The discharge holder 34 is a person who holds the syringe 21 in a state where the nozzle 22 is penetrated. In addition, the ejection holding portion 34 is provided as a lid portion of the opening of the penetrating protrusion 31a so as to cover the penetrating protrusion 31a of the upper chamber portion 31. The sealing part 35 seals between the syringe 21 and the discharge holding part 34. The sealing portion 36 seals between the penetrating protrusion 31 a of the upper chamber portion 31 and the discharge holding portion 34. Therefore, the nozzle 22 is provided in the interior 30a formed by closing the chamber 30. As shown in FIG.

In addition, the resin supply device 10 includes a weight meter 40 that measures the weight of the liquid resin R discharged from the nozzle 22. The weight scale 40 is provided in the interior 30a of the chamber 30 in a manner for the workpiece W to be placed. In this case, as shown in FIG. 1, the lower chamber portion 32 may be provided with a sink portion 32b that is recessed from the surface 32a. The weight scale 40 is installed in a fixed state in the sink part 32b. With this weight meter 40, the weight of the liquid resin R discharged to the workpiece W is measured in a state where the workpiece W has been set. Accordingly, the weight meter 40 can stably measure the weight of the liquid resin R supplied to the workpiece W in the interior 30a of the chamber 30, and can accurately measure the weight. In addition, the weight meter 40 is electrically connected to the control unit 11, and the control unit 11 processes the measurement data of the weight meter 40.

Moreover, the resin supply apparatus 10 is equipped with the vacuum part 41 (for example, a vacuum pump) which evacuates the inside 30a of the chamber 30 to a vacuum state (or a reduced pressure state). The vacuum unit 41 evacuates the interior 30 a through the air passage 42 provided in the cavity 32 in a state where the interior 30 a of the chamber 30 is closed, thereby forming a vacuum state. Since the resin can be supplied in such a cavity 30, it is possible to prevent defects such as air in the resin. In addition, the vacuum unit 41 and the control unit 11 are electrically connected, and the vacuum unit 41 is controlled by the control unit 11.

In addition, the resin supply device 10 includes a chamber drive unit 50 that opens and closes the chamber 30. The chamber driving unit 50 opens and closes the chamber 30 by moving (approaching and leaving) the upper chamber part 31 to the lower chamber part 32 in a direction along the Z axis. The chamber driving unit 50 includes a holding unit 51, a first rail 52, a first slider 53, and a first motor 54.

In the chamber driving part 50, the holding part 51 is configured in a columnar shape and is provided so as to stand up on the surface 32 a of the lower chamber part 32. Here, the holding portion 51 is provided with a first rail 52 extending in the vertical direction (the direction along the Z axis, the vertical direction). The first slider 53 is provided so as to be slidable on the first rail 52. The first sliding member 53 is driven by the first motor 54 to slide on the first rail 52. Furthermore, in the present embodiment, the upper chamber portion 31 is provided on the first slider 53 and is configured to move the upper chamber portion 31 forward and backward with respect to the lower chamber portion 32 by sliding the first slider 53 in the vertical direction ( Moving up and down). In addition, the first motor 54 and the control unit 11 are electrically connected, and the chamber drive unit 50 is controlled by the control unit 11. In addition, in the following description, in addition to the chamber drive unit 50, an example in which a plurality of drive units are formed with the same configuration will be described. However, these are not only the configuration as shown in the figure, but also can be made with It is a structure of arbitrary movement structures such as articulated robots using a link structure.

In addition, the resin supply device 10 includes a nozzle raising/lowering drive unit 70 that reciprocates the nozzle 22. The nozzle raising/lowering drive unit 70 is provided in the interior 30a of the chamber 30 to reciprocate the nozzle 22 of the discharge unit 20 in the raising/lowering direction. The nozzle raising/lowering drive unit 70 includes a second rail 72, a second slider 73, and a second motor 74.

In the nozzle raising/lowering drive unit 70, the second rail 72 is a first slider 53 that extends in the vertical direction and is provided in the chamber drive unit 50 together with the upper chamber portion 31. That is, with respect to the first slider 53, the second rail 72 and the upper chamber portion 31 are held together. The second slider 73 is provided so as to be slidable on the second rail 72. The second sliding member 73 is driven by the second motor 74 to slide on the second rail 72. Here, the second slider 73 is provided with a discharge holding portion 34. In the present embodiment, the second slider 73 slides in the vertical direction, so that the nozzle 22 of the discharge section 20 is reciprocated (lifted and lowered) through the discharge holding section 34. As will be described later, the liquid resin R can be shut off by reciprocating the nozzle 22 that discharges the liquid resin R. In addition, the second motor 74 is electrically connected to the control unit 11, and the nozzle raising/lowering drive unit 70 is controlled by the control unit 11.

Here, the cut-off of the liquid resin R means that when the liquid resin R is ejected from the nozzle 22 downward and supplied to the workpiece W, the liquid resin R with high viscosity is not separated from the nozzle 22 due to its own weight. In the case of the drawn state (drawing state), the case is disconnected from the nozzle 22. In the following embodiment, it is assumed that the nozzle 22 that has finished discharging the liquid resin R is lifted and lowered, and the distance from the workpiece W is repeatedly expanded and contracted to separate the nozzle 22 from the nozzle 22. However, the method of cutting the liquid is not limited by this, and it may be a method of physically cutting off the tip of the nozzle 22.

Moreover, the discharge part 20 of the resin supply apparatus 10 is equipped with the discharge drive part 80 which reciprocates the plunger 23. As shown in FIG. The discharge drive unit 80 includes a third rail 82, a third slider 83, and a third motor 84.

In the discharge drive unit 80, the third rail 82 extends in the vertical direction and is provided on the second slider 73. The third slider 83 is provided so as to be slidable on the third rail 82. The third sliding member 83 is driven by the third motor 84 to slide on the third rail 82. Here, the third slider 83 is provided with a plunger 23, and the plunger 23 is reciprocated by sliding the third slider 83 in the vertical direction. In this embodiment, a plunger 23 is inserted in the syringe 21, and the plunger 23 presses the liquid resin R stored in the syringe 21 to discharge the liquid resin R from a nozzle 22 provided at the tip of the syringe 21. In addition, the third motor 84 is electrically connected to the control unit 11, and the discharge drive unit 80 of the discharge unit 20 is controlled by the control unit 11.

In the resin supply device 10, in the state where the ejection of the liquid resin R from the ejection section 20 is stopped and the vacuuming by the vacuum section 41 is stopped, the control section 11 controls the nozzle raising and lowering drive section 70 so as to be inside the chamber 30 30a makes the nozzle 22 reciprocate. According to this, in the interior 30a of the chamber 30, the discharged liquid resin R can be cut off and separated from the workpiece W. By shutting off the liquid in the locked space (inside 30a), it is possible to prevent the entrapment of dust and the like.

Next, the operating method of the resin supply device 10 according to the embodiment of the present invention, that is, the resin supply method will be described.

The resin supply device 10 shown in FIG. 1 is a state before the workpiece W is supplied. Here, the chamber 30 is opened. In addition, the nozzle 22 of the syringe 21 is closed by the pinch valve 24, and the plunger 23 stands by upward. In the state in which the chamber 30 is opened in this way, the workpiece W is transferred by the transfer device (for example, a loader), and as shown in FIG. 2, the workpiece W is supplied to the resin supply device 10. In this embodiment, the workpiece W is placed on the weight meter 40.

Next, as shown in FIG. 3, the inside 30a of the chamber 30 is formed so as to be in a closed state, and the inside 30a of the chamber 30 is evacuated. Here, the vacuum unit 41 and the chamber driving unit 50 are controlled by the control unit 11. Specifically, driven by the first motor 54 of the chamber drive part 50, the first slider 53 provided with the upper chamber part 31 gradually descends on the first rail 52, and the upper chamber part 31 and the lower chamber part 32 is in a state of contact via the sealing portion 33. Thereby, the inside 30a of the chamber 30 which has been in the closed state is formed. Then, by the driving of the vacuum unit 41, the inside 30a of the chamber 30 in which the workpiece W is placed is set to a vacuum state. In addition, it is preferable to control the temperature adjustment unit so that the temperature inside the chamber 30 becomes a predetermined value before or in parallel with the operation of setting this vacuum state. In this case, it is only necessary to set the chamber 30 to a predetermined temperature instead of the entire device, so that the temperature can be adjusted quickly.

Next, as shown in FIG. 4, the liquid resin R is discharged from the nozzle 22 toward the workpiece W in the interior 30 a of the chamber 30 in a vacuum state. Here, the discharge unit 20 (discharge drive unit 80) and the vacuum unit 41 are controlled by the control unit 11. Specifically, the interior 30a of the chamber 30 continues to be in a vacuum state by the driving of the vacuum unit 41. Then, the third slider 83 provided with the plunger 23 is gradually lowered on the third rail 82 by the driving of the third motor 84 of the discharge unit 20. In this case, the plunger 23 presses the liquid resin R in the syringe 21, and the pinch valve 24 is opened by a driving mechanism not shown, and the liquid resin R is discharged from the nozzle 22.

At this time, the liquid resin R is discharged while measuring the weight of the liquid resin R based on the weight 40 provided in the inside 30 a of the chamber 30. The control unit 11 processes the measurement data of the weight meter 40, and for example, when the weight of the liquid resin R reaches a predetermined value, the discharge of the liquid resin R can be stopped. In addition, if the inside 30a of the chamber 30 is brought to a predetermined temperature by the temperature adjustment unit as described above, the discharge of the liquid resin R or the weight measurement can be accurately performed, and the liquid resin R can be supplied more appropriately.

Next, after stopping the discharge of the liquid resin R and stopping the vacuuming of the interior 30a of the chamber 30, as shown in FIGS. 5 and 6, the nozzle 22 is reciprocated in the interior 30a of the chamber 30. Here, the discharge unit 20, the vacuum unit 41, and the nozzle raising and lowering drive unit 70 are controlled by the control unit 11. Specifically, the third motor 84 of the discharge unit 20 is stopped to stop the downward movement of the plunger 23 and the pinch valve 24 is closed to stop the discharge of the liquid resin R from the nozzle 22. Next, the vacuum state in the interior 30a of the chamber 30 is released by stopping the vacuuming by the vacuum unit 41. In this way, for example, under the liquid resin R supplied to the workpiece W, when there is a space that cannot be filled with the liquid resin R (in other words, when it contains air), the pressure of the ambient gas can be The gap is filled with liquid resin R.

Next, the nozzle 22 of the discharge unit 20 is moved upward by the driving of the second motor 74 of the nozzle elevation drive unit 70 (refer to FIG. 5). Next, the nozzle 22 of the discharge unit 20 is moved downward by the driving of the second motor 74 of the nozzle elevation drive unit 70 (refer to FIG. 6). Then, a liquid shut-off operation is performed in which the nozzle 22 of the discharge unit 20 reciprocates a predetermined number of times (up and down). Although the vacuum state of the interior 30a of the chamber 30 is released, the discharge holding portion 34 can be raised and lowered while maintaining the closed state of the chamber 30.

In the present embodiment, the reciprocating motion of the nozzle 22 is performed by closing the chamber 30 while maintaining the state in which the inner portion 30a has been formed (closed state). Without moving the upper chamber portion 31, by using the penetrating protrusion 31a of the upper chamber portion 31 as a guide, the ejection holding portion 34 is reciprocated, and the nozzle held by the ejection holding portion 34 is maintained while maintaining the closed space. 22 reciprocating movement. In this way, the liquid resin R is shut off in the closed interior 30a. In this regard, for example, by raising and lowering the upper chamber portion 31 together, the nozzle 22 may be raised and lowered to perform a liquid-cutting operation. However, when such an operation is to be performed, the component member for raising and lowering becomes larger. In addition, it is conceivable that when the upper chamber portion 31 moves up and down to cause the ambient air around the workpiece W to flow, and there is dust in the surroundings, it may adhere to the liquid resin R. For such reasons, as shown in the present embodiment, it is preferable to form a configuration in which a sealing portion 36 is provided between the upper chamber portion 31 and the discharge holding portion 34 and the syringe 21 having the nozzle 22 is raised and lowered. In this way, the air contained in it can be eliminated and the adhesion of dust can be prevented. The resin supply device 10 shown in FIG. 7 is in a state where the liquid resin R has been shut off.

Next, the chamber drive part 50 is controlled by the control part 11, and as shown in FIG. 8, the chamber 30 is opened, and the work W to which the liquid resin R has been supplied is opened to the atmosphere. Here, by applying atmospheric pressure from the periphery of the liquid resin R, the filling of the liquid resin R on the workpiece W is promoted. For example, when a wafer member is mounted on a substrate or a wafer as the workpiece W by flip-chip bonding, the liquid resin R may be filled between a plurality of bumps connecting the wafer and the substrate or the like. In addition, even when flip-chip bonding is not performed, it is conceivable that the corner space formed by the side surface of the wafer mounted on the substrate etc. and the plane of the substrate etc. in the workpiece W may generate liquid resin R The (unfilled) part is not sufficiently spread. It is also conceivable to supply the liquid resin R so as to include such a portion (space) so as to be in a state containing air. However, by applying atmospheric pressure from around the liquid resin R supplied in a vacuum state (under reduced pressure atmosphere), such air (areas without liquid resin R) can be completely eliminated.

Specifically, the first slider 53 provided with the upper chamber portion 31 is gradually raised on the first rail 52 by the driving of the first motor 54 of the chamber driving portion 50, and the upper chamber portion 31 is connected to the lower The chamber part 32 is separated and the chamber 30 is in an open state. After that, the work W to which the liquid resin R has been supplied is taken out and transported by a transport device (for example, a loader).

Next, for example, the resin supply device 10 in this embodiment and a molding die not shown in the figure are set in a molding apparatus, and the liquid resin R supplied to the workpiece W in the molding die is heated under a reduced pressure atmosphere. It is heated and pressurized and sealed into a predetermined shape by resin. According to this, it is possible to perform high-quality resin sealing that can prevent voids or unfilling due to air content. In this case, since the liquid resin R is supplied to the workpiece W while preventing problems such as the inclusion of air as described above, it is possible to prevent unfilled resin sealing. In addition, in this embodiment, the case where the workpiece W is applied as the object to be supplied has been described, but the release sheet supplied to the molding die may be treated as the object to be supplied and supplied in liquid form different from the workpiece W. Resin R. (Embodiment 2)

The resin supply device 10A according to the second embodiment of the present invention will be described with reference to FIGS. 9 to 17. 9 to 15 are diagrams for explaining the resin supply device 10A related to the resin supply operation. 16 and 17 are respectively a plan view and a side view of the workpiece W to which the liquid resin is supplied. In this embodiment, the structure of the chamber drive unit 50 according to the aforementioned first embodiment is different, so the following description will focus on this point.

The resin supply device 10A according to the present embodiment is provided with a chamber drive unit 50A that constitutes the chamber 30 at an arbitrary position in the plane direction and opens and closes it. That is, the chamber drive unit 50A is configured to allow the upper chamber unit 31 including the syringe 21 (nozzle 22) to be movable in the X direction or the Y direction in FIG. 9. In addition, the chamber drive unit 50A opens and closes the chamber 30 by advancing and retreating the upper chamber part 31 with respect to the lower chamber part 32. With such a structure, in a state that constitutes the chamber 30 (for example, a reduced pressure state), the nozzle 22 portion of the syringe 21 is configured to be movable in an arbitrary position in the XY direction with respect to the workpiece W.

Specifically, the chamber drive unit 50A includes a holding portion 51, a first rail 52, a first slider 53, a first motor 54, an upper seat 60, a fourth rail 61, a fourth slider 62, a fourth motor 63, The fifth rail 64, the fifth slider 65, and the fifth motor 66. In addition, in the chamber driving portion 50A, the upper seat portion 60 is fixed to the device frame so as not to move. A fourth rail 61 extending in the direction along the Y axis is provided on the lower surface of the upper seat 60. The fourth slider 62 is provided so as to be slidable on the fourth rail 61. The fourth sliding member 62 is driven by the fourth motor 63 to slide on the fourth rail 61. In addition, the fourth slider 62 is provided with a fifth rail 64 extending in the direction along the X axis. The fifth slider 65 is provided so as to be slidable on the fifth rail 64. The fifth sliding member 65 is driven by the fifth motor 66 to slide on the fifth rail 64. In addition, in the fifth slider 65, the holding portion 51 is provided in a suspended manner.

Here, the holding portion 51 is provided with a first rail 52 extending in a direction along the Z axis, and a first slider 53 is provided so as to be slidable on the first rail 52 by the first motor 54. In addition, the upper chamber portion 31 is provided on the first slider 53. Therefore, the upper chamber portion 31 can be moved in the direction along the 3-axis (XYZ) by the chamber driving portion 50A. That is, the chamber driving unit 50A can move the upper chamber part 31 forward and backward (moving in the direction along the Z axis) and parallel movement (moving in the direction along the X axis and the Y axis) relative to the lower chamber part 32. For this reason, in the resin supply device 10A, the upper chamber portion 31 can be moved in parallel by maintaining the closed state of the chamber 30 by the chamber driving portion 50A.

Furthermore, as described in the first embodiment described above, the upper chamber portion 31 is provided with the discharge portion 20. For this reason, in the resin supply device 10A, the liquid resin R can be discharged from the nozzle 22 while maintaining the state in which the chamber 30 is closed. According to this, not only the effect in the aforementioned embodiment, but also the liquid resin R can be supplied into the surface of the workpiece W at an arbitrary discharge position (refer to FIGS. 16 and 17).

Next, the operating method of the resin supply device 10A according to the embodiment of the present invention, that is, the resin supply method will be described.

The resin supply device 10 shown in FIG. 9 is a state after the workpiece W is supplied in a state where the chamber 30 is opened. Here, the nozzle 22 of the syringe 21 is closed by the pinch valve 24, and the plunger 23 stands by upward. In addition, a workpiece W is placed on the weight meter 40.

Next, as shown in FIG. 10, the inside 30a of the chamber 30 is formed so as to be in a closed state, and the inside 30a of the chamber 30 is started to be evacuated. Here, the vacuum unit 41 and the chamber drive unit 50A are controlled by the control unit 11. Specifically, according to the drive of the first motor 54 of the chamber drive part 50A, the first slide 53 provided with the upper chamber part 31 gradually descends on the first rail 52, and the upper chamber part 31 and the lower chamber part 32 is in a state of contact via the sealing portion 33. Thereby, the inside 30a of the chamber 30 which has been in the closed state is formed. Then, by the driving of the vacuum unit 41, the inside 30a of the chamber 30 in which the workpiece W is placed is set to a vacuum state.

Next, as shown in FIG. 11, the upper chamber portion 31 and the lower chamber portion 32 are moved in parallel so that the nozzle 22 will be at a predetermined position (discharge start position) relative to the surface of the workpiece W. Here, the vacuum unit 41 and the chamber drive unit 50A are controlled by the control unit 11. Specifically, the interior 30a of the chamber 30 continues to be in a vacuum state by the driving of the vacuum unit 41. Then, at least one of the fourth slider 62 or the fifth slider 65 is slid by at least one of the fourth motor 63 or the fifth motor 66 of the chamber driving section 50A, so that the upper chamber portion 31 and the lower chamber portion 32 are parallel to each other. move. Thereby, the nozzle 22 can move parallel to the surface of the workpiece W to a predetermined position.

Next, the nozzle 22 is moved parallel to the workpiece W while the chamber 30 is closed, and the liquid resin R is discharged. Here, the discharge unit 20 (discharge drive unit 80), the vacuum unit 41, and the chamber drive unit 50A are controlled by the control unit 11. The discharge (supply) of the liquid resin R to the workpiece W can be performed on the entire surface of the workpiece W, but in this embodiment, as shown in FIGS. 16 and 17, it is to the center of the surface of the workpiece W (maximum supply area 90) conduct. For example, as shown in FIG. 16, the liquid resin R can be supplied in a spiral shape or a plurality of concentric circles. In the resin supply device 10A, since the upper chamber portion 31 constituting the interior 30a of the chamber 30 is moved together with the nozzle 22, it is possible to prevent the cavity by supplying the liquid resin R to the center portion of the surface of the workpiece W. Increase in size. In addition, by preventing an increase in the size of the chamber, the time for vacuuming can be shortened. In addition, by supplying the liquid resin R in a spiral shape or a plurality of concentric circles, the height of the supplied liquid resin R can be reduced.

Specifically, the interior 30a of the chamber 30 continues to be in a vacuum state by the driving of the vacuum unit 41. Next, as shown in FIG. 12, the plunger 23 is lowered by the driving of the third motor 84 of the discharge unit 20, and the liquid resin R in the syringe 21 is discharged from the nozzle 22. Next, as shown in FIG. 13, the upper chamber portion 31 is moved in parallel with the lower chamber portion 32 by the chamber driving portion 50A, and the liquid resin R is discharged from the nozzle 22. Finally, as shown in FIG. 14, by moving the nozzle 22 in parallel to the center of the workpiece W and discharging the liquid resin R, the liquid resin R can be supplied to the workpiece W in a spiral shape. At this time, the liquid resin R is discharged while measuring the weight of the liquid resin R based on the weight 40 provided in the inside 30 a of the chamber 30.

Of course, the liquid resin R may be supplied to the entire workpiece W in a spiral shape or the like, and the supply amount of resin on the workpiece W may be made uniform. In this case, the bottomed cylindrical upper chamber portion 31 as shown in the above-mentioned figure may be formed into a flat plate shape, and the flat bottom chamber portion 32 may be formed into a bottomed cylindrical shape. In a chamber constructed with such a structure, not only can the same effect as the above-mentioned structure be obtained, but the movement area of the nozzle 22 can also be enlarged, which is better because the chamber size is not increased.

In addition, with regard to the shape of the liquid resin R supplied to the workpiece W, any shape can be supplied in addition to the above-mentioned spiral shape or concentric shape. For example, the workpiece W can be supplied in a multi-dot shape or a grid shape, and a shape in which a plurality of lines are arranged, or an arbitrary shape such as a radial shape.

In addition, an imaging device for imaging the liquid resin R supplied to the workpiece W may be provided. In this case, for example, the upper chamber portion 31 is provided with a window portion for imaging made of a light-transmitting material, and the imaging portion (camera) or the illuminating portion is used to image the liquid resin R supplied to the workpiece W. The shape is better to make it possible to confirm the supply state.

Next, as described in the foregoing embodiment with reference to FIGS. 5 and 6, after stopping the discharge of the liquid resin R and stopping the vacuuming of the inside 30 a of the chamber 30, the nozzle 22 is reciprocated in the inside 30 a of the chamber 30. Thereby, the liquid resin R can be shut off in the interior 30a. By shutting off the liquid in the locked space (inside 30a), it is possible to prevent the entrapment of dust and the like.

Next, as shown in FIG. 15, the chamber 30 is opened, and the work W to which the liquid resin R is supplied is opened to the atmosphere. Here, the chamber drive unit 50A is controlled by the control unit 11. Specifically, according to the drive of the first motor 54 of the chamber drive part 50A, the first slider 53 provided with the upper chamber part 31 gradually rises on the first rail 52, and the upper chamber part 31 and the lower chamber part 32 is separated and the chamber 30 is opened. After that, the work W to which the liquid resin R has been supplied is taken out and transported by a transport device (for example, a loader). (Embodiment 3)

The resin supply device 110 (writing dispenser) according to the embodiment of the present invention will be described mainly with reference to FIGS. 19 to 21. 19 to 21 are diagrams for explaining the resin supply device 110 involved in the resin supply operation. This resin supply device 110 is provided with a supply unit 120 (discharge unit) and a chamber 130. The liquid resin R from the supply unit 120 is supplied to the workpiece W (the object to be supplied) in the chamber 130 set in a vacuum state. Coating). In this embodiment, the resin supply device 110 is described in a three-dimensional (XYZ) orthogonal coordinate system. The vertical direction (vertical direction) shown in Fig. 19 and the like corresponds to the direction parallel to the Z axis, and the horizontal direction (horizontal The direction) is a direction parallel to the X axis and the Y axis.

In this embodiment, as the workpiece W, for example, a plurality of wafer components 200 (for example, semiconductor wafers) are flip-chip bonded (bump-connected) disc-shaped carriers 201 (for example, semiconductor wafers) in rows and columns. For this reason, the workpiece W has a narrow portion 202 (between the wafer part 200 and the carrier 201). In addition, in this embodiment, as the resin R, for example, a liquid (including a molten state) thermosetting resin such as silicone resin or epoxy resin is used. For the workpiece W supplied with such resin R, the molding die 191 (refer to FIG. 27) is used, for example, resin molding of the molding process called eWLB (Embedded Wafer Level Ballgrid-Array Package) is performed .

When forming the supply unit 120, the resin supply device 110 is equipped with: a syringe 121 for storing liquid resin R; a nozzle 122 (nozzle) provided at the tip of the syringe 121 and ejecting the resin R; and inserted into the syringe 121 and held down Plunger 123 of resin R. The syringe 121 is housed in a syringe housing 125 (cartridge holder). Thereby, the syringe 121 can be exchanged easily. In addition, the plunger 123 can move up and down (reciprocate) in the Z-axis direction by the drive unit 180 (Z-axis drive mechanism). Thereby, the resin R held by the plunger 123 can be ejected from the nozzle 122. In addition, the syringe housing 125 can be moved up and down in the Z-axis direction (reciprocating movement) by the drive unit 170 (Z-axis drive mechanism). Thereby, the nozzle 122 can move in the Z-axis direction via the syringe housing 125 and the syringe 121, and the liquid stop described later can be completed. In addition, as the driving parts 170 and 180, any moving structure including a slider that moves on a rail by a motor or an articulated robot using a link structure can be used.

In addition, the resin supply device 110 is provided with: for example, a pinch valve 124 that is provided to pinch the nozzle 122 (nozzle) made of an elastic body to open and close the nozzle 122; and a valve that drives the pinch valve 124 The driving unit 126 (for example, driven by an air cylinder). The pinch valve 124 is provided in the valve driving part 126, and the valve driving part 126 is provided in the syringe housing 125. In the resin supply device 110, when the pinch valve 124 is opened, the plunger 123 moves downward to cause the resin R in the syringe 121 to flow in the extrusion direction, and the resin R is discharged from the nozzle 122. On the other hand, when the downward movement of the plunger 123 stops, the pinch valve 124 is closed and the discharge of the resin R from the nozzle 122 stops.

After the discharge is stopped, the liquid resin R is cut off, so that the resin R can be prevented from hanging down from the nozzle 122. The so-called breaking of the liquid resin R means that the liquid resin R is discharged from the nozzle 122 downward to be supplied to the workpiece W. The resin R is in a state of being drawn due to its own weight without breaking off the nozzle 122 (drawing ) State), it is disconnected from the nozzle 122. In this embodiment, it is assumed that the nozzle 122 is separated from the nozzle 122 by moving the nozzle 122 that has finished discharging the resin R up and down to repeatedly expand and contract the distance from the workpiece W. By cutting off the liquid with the chamber 130 closed, it is possible to prevent dust and the like from getting involved. In addition, the method of cutting the liquid is not limited to this, and may be a method of actually cutting off the tip of the nozzle 122 or a method of introducing air through a path communicating with the nozzle 122 and branching off.

In addition, the resin supply device 110 includes a chamber 130 (for example, made of steel) having a pair of chamber portions 131 and 132 (one is a chamber cover 131 and the other is a chamber body 132). In the resin supply device 110, the liquid resin R is discharged from the nozzle 122 provided on the side of the chamber cover 131 to the workpiece W placed in the chamber 130 and supplied. In addition, the resin supply device 110 may adjust the internal temperature of the chamber 130 in advance by providing a temperature adjustment unit (for example, a heater or a cooler), and may also adjust the temperature of the resin R to be supplied.

The chamber cover 131 can reciprocate in the XYZ axis direction by the cover driving part 150 (XYZ axis driving mechanism). As the cover drive unit 150, the aforementioned drive units 170 and 180 for one axis (Z axis) and each of the three axes (XYZ axis) can be used. Thereby, the chamber 130 can be opened and closed by moving the chamber cover 131 up and down (approaching and leaving) the chamber body 132 in the direction (vertical direction) along the Z axis. In addition, as will be described later, the cover driving unit 150 can move the chamber cover 131 to the chamber body 132 (horizontal movement) in a state where the chamber 130 is closed. Accordingly, even if the chamber 130 is in a vacuum state, the chamber cover 131 and the nozzle 122 provided thereon can be moved. That is, the resin R can be supplied to the surface of the workpiece W at any discharge position in a vacuum state.

In addition, the resin supply device 110 is provided with an opening edge 132a (e.g., a circular shape in a plan view, a rectangular shape in a plan view, or a polygonal shape in a plan view) provided in the chamber body 132 (e.g., a container that constitutes a bottomed cylindrical body). A sealing ring 133 (for example, an O ring) for sealing between the chamber cover 131 and the chamber body 132. Thereby, the chamber cover 131 and the chamber main body 132 are in contact with each other via the seal ring 133, and the chamber 130 is in a closed state (in a state where the inside is sealed). In addition, in order to adjust the height of the seal ring 133, an adjustment member (for example, a plate or a sheet) may be provided under the seal ring 133.

The resin supply device 110 discharges the liquid resin R to the workpiece W from the nozzle 122 in the chamber 130 set in a vacuum state, and supplies it to the workpiece W. For this reason, in the resin supply device 110, the nozzle 122 is configured to be provided in the chamber 130. Specifically, the resin supply device 110 includes a holding portion 134 (recessed portion) and a seal ring 136 (O ring). The holding portion 134 is recessed from the surface 131a of the chamber cover 131 (the surface 131a on the side of the chamber body 132) so as to house the nozzle 122 in the center of the chamber cover 131, and penetrates the syringe housing of the chamber cover 131 125 to be maintained. Moreover, the sealing ring 136 seals between the syringe housing 125 and the holding part 134 (chamber cover 131). Thereby, even if the syringe housing 125 is moved up and down by the driving part 170 in the state where the chamber 130 is closed, the inside of the chamber 130 can be set in a sealed state.

Here, the size of the chamber cover 131 and the chamber body 132 will be described. In order to set the chamber 130 in a closed state, the opening of the chamber body 132 (inside the opening edge 132a) is blocked (covered) by the chamber cover 131. That is, in the top view (in the top view), the size of the chamber cover 131 is larger than the opening of the chamber body 132. Specifically, the size of the chamber cover 131 is such that the chamber cover 131 can be moved horizontally with respect to the chamber body 132 while maintaining the closed state of the chamber 130. In other words, the size of the chamber cover 131 is such that the nozzle 122 can be moved in the range from one end to the other end of the workpiece W while maintaining the vacuum in the Y-axis direction and the X-axis direction. For this reason, as shown in FIG. 21, when the position of the nozzle 122 reaches the outermost periphery of the workpiece W placed in the chamber body 132, the chamber cover 131 is largely exposed in the Y-axis direction and the X-axis direction.

In addition, the resin supply device 110 is provided with: a pressure adjusting part 141 that adjusts the internal pressure of the chamber 130; . In the resin supply device 110, the inside of the chamber 130 in the closed state (closed state) is discharged into a vacuum state (decompression state) by the pressure regulator 141 provided with a vacuum pump, for example. In this way, since the chamber 130 in a vacuum state in which air is exhausted can be made, it is possible to prevent the problem that the resin R contains air when the resin R is supplied to the workpiece W.

In addition, the resin supply device 110 is provided with a load support 137 (for example, made of steel) that supports a load between the chamber cover 131 and the chamber main body 132. The load support 137 is arranged on the chamber body 132 along the circular sealing ring 133 to prevent the sealing ring 133 from being excessively crushed. As the load support 137, for example, a structure in which a plurality of the chamber body 132 is provided along a circular sealing ring 133 can be made. In this case, the chamber cover 131 is positioned at an arbitrary height on the chamber body 132 while supporting the atmospheric pressure applied to the chamber cover 131 by a plurality of load supports 137. Thereby, the seal ring 133 is prevented from being excessively crushed, friction caused by the contact between the chamber cover 131 and the chamber body 132 is prevented, and the sealing property can be ensured and the chamber 130 can be set to a vacuum state. In addition, since the chamber cover 131 is supported at multiple points by a plurality of load supports 137, the load can be distributed. In addition, since the plurality of load supports 137 are provided outside the seal ring 133, that is, there is no plurality of load supports 137 in the chamber 130, the air in the chamber 130 can be easily removed. In the state where the chamber 130 is opened, the seal ring 133 is higher than the load support 137 in the height from the chamber body 132 toward the chamber cover 131. In other words, when the chamber 130 is opened, the seal ring 133 is arranged at a position closer to the chamber cover 131 than the load support 137. According to this, in the state where the chamber 130 is closed, the chamber cover 131 can be reliably brought into contact with the sealing ring 133, and the sealing property can be ensured and the chamber 130 can be set to a vacuum state.

In the resin supply device 110, in a state in which the chamber 130 is closed (a state in which the chamber structure is maintained), the chamber cover 131 is moved horizontally with respect to the chamber body 132 (the syringe 121 with respect to the workpiece W). Specifically, a ball roller is used as the load support 137. The ball roller system includes, for example, a freely rotating sphere and a sphere support (seating) that is rotatably held in a partially protruding state of the freely rotating sphere (in contact with the chamber cover 131). According to this, in a state where atmospheric pressure is applied to the chamber cover 131 by setting the chamber 130 in a vacuum state, by creating a rolling type load support structure in the ball roller of the inching body, and for example Compared with the load support structure in the sliding mode, the chamber cover 131 can be moved in the horizontal direction extremely smoothly.

In particular, when the chamber body 132 needs to be enlarged due to the large size of the workpiece W, the force applied to the chamber cover 131 by the atmospheric pressure increases, so the force applied to the load support 137 also increases. For this reason, by providing the number of load supports 137 corresponding to the force applied to the load supports 137, the force applied to the respective load supports 137 is dispersed and reduced, and the chamber cover 131 can be moved smoothly. In addition, as the load support 137, not only a rolling load support such as a ball roller column applied to the chamber cover 131, but also a sliding load support may be used. In addition, in order to ensure the slidability of the seal ring 133 and the load support 137 with respect to the chamber cover 131, a lubricant may be applied in advance between them.

In addition, the resin supply device 110 includes a weight gauge 140 provided in the cavity 130. In the resin supply device 110, a workpiece W is placed on a weight meter 140, and the weight meter 140 measures the weight of the workpiece W. In this weight meter 140, the weight of the resin R discharged to the workpiece W is measured in the state where the workpiece W is placed. According to this, it is possible to immediately measure the resin R discharged and supplied to the workpiece W in the chamber 130 in the vacuum state.

In addition, the resin supply device 110 is provided with a pin 143 provided to penetrate through the bottom of the chamber body 132 and move up and down (reciprocately) in the Z-axis direction by the drive unit 144 (refer to FIG. 25); this pin 143 is connected to the cavity A seal ring 145 for sealing between the chamber bodies 132 (refer to FIG. 25). This pin 143 is used to deliver the workpiece W to the conveying device. When the workpiece W is received from the conveying device, the pin 143 moves upward so that the front end protrudes from the chamber body 132 (refer to FIG. 19). When the workpiece W is set from the pin 143 to the weight scale 140, the pin 143 moves downward and retreats toward the bottom side of the chamber body 132 (refer to FIG. 20).

Next, the operation method (resin supply method) of the resin supply device 110 will be described. The resin supply device 110 is provided with a control unit (not shown) having a CPU (central arithmetic processing unit) and storage units such as ROM and RAM. The CPU reads and executes various control programs recorded in the memory unit to control the operations of the various parts (mechanisms) constituting the resin supply device 110. The actions performed by each part become actions of the resin supply device 110. In addition, when the resin supply device 110 is incorporated in a resin molding device, a configuration in which the resin supply device 110 is controlled by a control unit of the resin molding device may be adopted.

The resin supply device 110 shown in FIG. 19 is a state before the workpiece W is supplied to the cavity 130. Here, the chamber 130 is opened, and the nozzle 122 of the syringe 121 is closed by the pinch valve 124, and the plunger 123 is on standby. In such a state where the chamber 130 is opened, for example, the workpiece W conveyed by a conveying device or an operator is placed in the chamber 130. In this embodiment, the conveying device delivers the work W to the pin 143, and the pin 143 that has received the work W moves downward to place the work W on the weight scale 140 (refer to FIG. 20).

Next, as shown in FIG. 20, in a state where the chamber 130 is closed, the air inside the chamber 130 is exhausted to be in a vacuum state. Specifically, first, the chamber cover 131 is gradually moved downward by the cover driving part 150, and the chamber cover 131 contacts the load support 137 while crushing the seal ring 133 to close the chamber 130. Next, the pressure adjustment part 141 gradually reduces the pressure in the chamber 130 to create a vacuum state of a predetermined pressure. Here, by supporting the chamber cover 131 with the load support 137, the sealing ring 133 can be prevented from being excessively crushed. In addition, by controlling the temperature adjustment unit (not shown) to set the internal temperature of the chamber 130 to a predetermined value before or in parallel with the operation of setting the vacuum state, the influence of heat on the supplied resin R can be suppressed .

Next, the supply of resin R to the workpiece W is started in the chamber 130 set in a vacuum state. Specifically, the pressure adjusting part 141 keeps the chamber 130 in a vacuum state. Then, the pinch valve 124 is driven by the valve driving part 126 to open the nozzle 122, and the plunger 123 is moved downward by the driving part 180 and the resin R is discharged from the nozzle 122, so that the resin R can be supplied to the workpiece W. At this time, the weight 140 is to supply the resin R while measuring the weight of the workpiece W, that is, the weight of the resin R in real time.

Next, as shown in FIG. 21, the resin R is discharged from the nozzle 122 while moving the nozzle 122 so that the nozzle 122 opposes the predetermined position of the workpiece|work W. Specifically, the pressure adjusting part 141 keeps the chamber 130 in a vacuum state. Then, the cover driving part 150 moves the chamber cover 131 horizontally, and while moving the nozzle 122 provided on the chamber cover 131, the driving part 180 further moves the plunger 123 downward to move the resin R from the nozzle 122. Spit out. At this time, even if the nozzle 122 reaches the outermost periphery of the workpiece W, the sealing ring 133 maintains the sealed state (vacuum state) so that the movement range of the nozzle 122 is smaller than the inner diameter of the seal ring 133. Here, the resin R is gradually supplied (coated) so as to be applied to the narrow part 202 of the work W (between the wafer component 200 and the carrier 201).

In this way, the resin R can be supplied (coated) to the surface of the work W in a predetermined coating pattern. As the coating pattern, as shown in FIG. 22, for example, the entire surface of the workpiece W may be formed in a spiral shape or a lattice shape. Here, FIG. 22 is a diagram for explaining a coating pattern for coating the resin R on the disc-shaped workpiece W, FIG. 22A shows the vortex, and FIG. 22B shows the state of the grid. When supplying a predetermined amount of resin R, by moving the chamber cover 131 provided with the nozzle 122 while supplying the resin R to the entire surface of the workpiece W, for example, compared to the method of supplying the resin R only to the center of the surface of the workpiece W Next, when the resin R is compressed in the cavity C using the molding die 191 (refer to FIG. 27), the flow distance (heat application time) of the resin R can be made the same level, and the inclusion of air can be prevented.

In addition, the coating pattern shown in FIG. 22B in which the side surface of the wafer component 200 is covered with resin R can also be made. Regardless of whether the side surface of the wafer component 200 is covered with resin R or not, the entire surface of the wafer component 200 can be covered in a grid pattern. Supply resin R. Here, in the case of the coating pattern shown in FIG. 22B such that the side surface of the wafer component 200 is covered with resin R, the resin R is quickly injected into the narrow portion 202 by the atmospheric pressure in the process described later to perform underfilling (corresponding to the so-called The capillary underfill (capillary underfill)). In addition, when resin molding is performed in the mold, by appropriately discharging the air in the narrow portion 202, underfilling can be performed more reliably by compression in the mold (pressurization with the molding die 191). In addition, even if the resin R that fills the gap between the wafer components 200 is not supplied as shown in FIG. 22B, as long as the resin R can be supplied to the entire circumference of the wafer component 200, the line width ( The width between wafers) is also supplied with resin R in a narrow line width.

In addition, various considerations can be made regarding the coating style of the resin R. FIG. 23 is for explaining the coating pattern of the resin R (including the discharge path of the nozzle 122 facing the workpiece W) for the workpiece W with a narrow panel shape (rectangular shape) mounted with a wafer component (not shown)之图. FIG. 23A shows a state where the resin R is applied to the center of the workpiece W in a dot (one point) (center point). Even with such a simple coating style, for example, after the resin R is supplied under a vacuum atmosphere, by placing the workpiece W in the atmospheric environment, the resin R can be injected into the narrow part due to the pressure difference. It can also shorten the coating time. FIG. 23B shows a state where the resin R is applied in a multi-dot pattern to the surface of the workpiece W. In this state, compared with the center point, air can be easily discharged, and when the resin R is compressed in the cavity C, the flow distance of the resin R can be set to the same level.

FIG. 23C shows a state in which the resin R is applied to the surface of the workpiece W in a large spiral shape having a substantially cavity size, for example. In this state, it is made in a vortex shape to easily discharge air, and by coating to a cavity size, when the resin R is compressed in the cavity C, the distance that the resin R flows can be made the same. FIG. 23D shows, for example, a state in which the height of the resin R is lowered below the center point (FIG. 23A) (the center point is lowered) and the small movable area is applied in a whirlpool shape. In this state, by slowing down the timing of the contact of the resin R with the mold surface to lengthen the time during which the air can be discharged during the mold closing operation, the air can be easily discharged. In addition, it is also conceivable that when the resin R is applied from one point, the resin R applied in a linear shape is unevenly stacked while being applied due to its high viscosity, and it becomes difficult to apply a uniform shape. Swirl-shaped coating and coating into a suitable circular shape or the like. In addition, it is possible to prevent the occurrence of problems such as containing air when the resin R at a high position is compressed and moved to a low position.

FIG. 23E shows a state in which the spiral shape is applied to the corner of the rectangular workpiece W so as to be angled. In this state, according to the shape of the workpiece W, the air can be easily discharged in a spiral shape. FIG. 23F shows a state in which a rectangular workpiece W is applied in a grid with one stroke. In this state, the resin R can be coated with a uniform width in accordance with the shape of the workpiece W. FIG. 23G shows a state in which the resin R is applied radially in the surface of the workpiece W from the center to the outer periphery (the broken line shows the path not discharged from the nozzle 122). In this state, when the resin R is compressed in the cavity, air can be discharged from the central part to the outer peripheral part.

In addition, various coating patterns for applying the resin R to the wafer component 200 can be considered. FIG. 24 is a diagram for explaining a coating pattern in which the resin R is applied to the main part of the workpiece W (the wafer component 200). FIG. 24A shows a state where the resin R is applied across the entire circumference of the wafer component 200 in one stroke. FIG. 24B shows a state in which only the outer periphery of the resin R is coated with one stroke without covering between the adjacent wafer parts 200. FIG. 24C shows a state in which the resin R is applied so as to cover between adjacent wafer components 200 (a part of the resin R is located on the wafer component 200). As shown in FIG. 24, by making the coating pattern into a ring shape, the resin R becomes easy to inject toward the narrow part 202 located in the inner side.

In this way, after a predetermined amount of resin R is supplied (that is, after the coating pattern is completed), the discharge of resin R from the nozzle 122 is stopped. Specifically, the driving part 180 stops the plunger 123 from moving downward, and the pinch valve 124 closes the nozzle 122 to stop the discharge of the resin R. In addition, the plunger 123 may be pulled back to assist in stopping the discharge of the resin R.

Then, the exhaust of air from the chamber 130 is stopped. Specifically, the vacuum state of the chamber 130 at a predetermined pressure is released by stopping the discharge of air by the pressure regulator 141. When the pressure adjusting unit 141 is stopped, the inside of the chamber 130 is pressurized from a predetermined pressure in a vacuum state. In this way, for example, if there is a narrow part 202 (a space where the resin R should be filled) below the resin R supplied to the workpiece W, the pressure-reduced narrow part 202 is injected so as to be underfilled. Resin R pressurized by the pressure of the ambient gas.

Next, the nozzle 122 is moved up and down (up and down) in the chamber 130 in the closed state. Specifically, in a state where the chamber 130 is closed without moving the chamber cover 131, the nozzle 122 is moved up and down by the drive unit 170 through the syringe housing 125 (syringe 121). In this way, a liquid cut operation is performed in which the up and down movement of the nozzle 122 is repeated a predetermined number of times. In the present embodiment, the liquid is cut off (the up and down movement of the nozzle 122) while the chamber 130 is closed and the inside is maintained.

Next, the chamber 130 is set to an open state. Specifically, by using the cover driving part 150 to gradually move the chamber cover 131 upward, the chamber cover 131 gradually separates from the chamber body 132 (the load support 137 and the sealing ring 133) and the chamber 130 is opened (refer to Figure 19). Therefore, the resin R is injected (filled) toward the narrow part 202 by opening to the atmosphere and applying atmospheric pressure from the periphery of the resin R. As in the present embodiment, when the wafer component 200 is mounted on the carrier 201 as the workpiece W by flip chip bonding, resin R can be injected and filled between the plurality of bumps connecting the wafer component 200 and the carrier 201. It is possible to suppress the inclusion of air (the area where there is no resin R in the narrow part 202). In addition, even if the wafer component 200 is mounted on the workpiece W on the carrier 201 in a flip-chip bonding manner, even if it is accumulated in the corner space formed by the side surface of the wafer component 200 and the main surface of the carrier 201 Resin R can also be filled in the case of air.

In addition, after the chamber 130 is closed again to set the inside of the chamber 130 to a vacuum state (reduced pressure), the process of opening the chamber 130 to open to the atmosphere (pressurized) may be repeated. According to this, the resin R can be injected into the narrow part 202 more reliably. In addition, if the pressure regulating unit 141 is equipped with a pressurizing device such as a compressor, the pressure in the chamber 130 can be pressurized while the chamber 130 is closed, and the ambient gas can be pressurized toward the narrow part while depleting the air. 202 injects the resin R more reliably.

After that, in a state in which the chamber 130 is opened, the workpiece W (to which the resin R is supplied) is taken out by, for example, a conveying device. At this time, the work W placed on the weight scale 140 is supported (ejected) by the pin 143 that moves upward, and is delivered to the conveying device. After that, the workpiece W to which the resin R has been supplied is transported and placed toward the forming die 191 (see FIG. 27), for example. Next, it is compressed in the cavity C formed by the molding die 191 so that the resin R is thermally cured. By this compression, the resin R is pressurized and injected into the narrow part 202, so that underfilling can be performed more reliably. In this way, since the aforementioned resin supply method is used to prevent defects such as the inclusion of air, a molded product in which molding defects such as unfilling in the narrow part 202 are suppressed is manufactured. (Embodiment 4)

The resin supply device 110A according to the embodiment of the present invention will be described mainly with reference to FIGS. 25 and 26. 25 and FIG. 26 are diagrams for explaining the resin supply device 110A related to the resin supply operation. In this embodiment, compared with the third embodiment described above, the chamber cover 131 can be reduced and the device can be downsized in that it is different, so the following description will focus on this point. In addition, the resin supply device 110A also uses the pressure adjustment unit 141 (see FIG. 19) to set the inside of the chamber 130 into a vacuum state as in the aforementioned third embodiment, but the pressure adjustment unit 141 is omitted in FIGS. 25 and 26. And for ease of explanation, part of it is hatched.

The resin supply device 110A is provided with: a cover driving unit 150A (XZ-axis drive mechanism or YZ-axis drive mechanism) that moves the chamber cover 131; a placement table 151 provided in the chamber 130 for the workpiece W to be placed; and a placement table 151 Rotating table driving unit 152 (rotation driving mechanism). As the cover driving unit 150A, the aforementioned driving units 170, 180 for one axis (Z axis) and two axes (XZ axis or YZ axis) can be used respectively, so that the chamber cover 131 (nozzle 122) can be in the horizontal direction. (X-axis or Y-axis direction) and vertical direction (Z-axis direction) movement. In addition, as the table driving unit 152, a rotating shaft 153 attached to the setting table 151 can be rotated and driven by a motor 155 through a belt 154, so that the setting table 151 can be moved in the rotation direction (horizontal direction). In addition, since the rotating shaft 153 is penetratingly provided at the bottom of the chamber body 132, the resin supply device 110A is provided with a seal ring 157 that seals between the rotating shaft 153 and the chamber body 132.

Accordingly, even if the chamber 130 is in a vacuum state, the chamber cover 131 and the nozzle 122 provided thereon can be moved relative to the workpiece W. That is, the resin R can be supplied into the surface of the workpiece W at any discharge position. In addition, by providing the mounting table 151 that rotates as the workpiece mounting side, the moving range (moving range) of the chamber cover 131 on which the nozzle 122 is mounted as the resin supply side can be reduced. Specifically, compared to the horizontal movement range of the chamber cover 131 in the X-axis and Y-axis directions in the third embodiment, in this embodiment, it is only in either the Y-axis direction or the X-axis direction. The distance of the radius is enough. That is, by rotating the workpiece W from the center to one end of the workpiece W in parallel with the movement of the moving nozzle 122, the entire surface of the workpiece W can be coated with the resin R in a spiral shape. Moreover, in such a configuration, by combining the forward and backward movement of the nozzle 122 and the rotation of the workpiece W, it is also possible to apply an arbitrary straight line or a curved radial pattern to the workpiece W. Therefore, in this embodiment, the chamber cover 131 can be made smaller than in the third embodiment described above. In addition, since the chamber cover 131 becomes smaller, the footprint of the entire resin supply device 110A can be reduced (space saving).

In addition, the resin supply device 110A is provided with a chuck 156 which is provided on the mounting table 151 and is fixed so as to clamp the work W, for example. Therefore, the resin R discharged from the nozzle 122 to the workpiece W has adhesiveness, and even if the rotation of the workpiece W is blocked by the resin R, the workpiece W can be rotated stably in accordance with the rotation of the mounting table 151.

In addition, the resin supply device 110A is provided with a weight meter 160 provided outside the chamber 130 and placing the workpiece W via a pin 161 penetrating the chamber body 132; The weight 160 and the pin 161 can be moved up and down (reciprocatingly) in the Z-axis direction by the drive part 163 (Z-axis drive mechanism). According to this, the amount of resin supplied to the workpiece W can be measured without the weight meter 140 of the aforementioned third embodiment being installed in the cavity 130. Therefore, the capacity of the chamber 130 can be reduced. In addition, since the weight 160 is provided outside the chamber 130, measurement can be performed without having to wait until the chamber 130 becomes a vacuum state and reaches a stable state that can be measured. According to this point, in the foregoing embodiment 3, a measurable weight scale 140 is used even in a vacuum state, but this will increase the price. Therefore, in this embodiment, the low-cost weight scale 160 is used, which reduces the cost of the resin supply device 110A. manufacturing cost. In addition, since the volume of the chamber 130 becomes smaller, for example, the load applied to the vacuum pump as the pressure regulator 141 can be suppressed.

In addition, the resin supply device 110A includes a shutter 162 that plugs the hole 132 b of the chamber body 132 through which the pin 161 penetrates in a state where the pin 161 is retracted toward the outside of the chamber 130. As the shutter 162, for example, a structure that can be slid by a drive unit (not shown) can be used. By plugging (sealing) the hole 132b with the shutter 162 in the state where the chamber 130 is closed, the inside of the chamber 130 can be sealed.

The shutter 162 is provided with a hole 162a through which the pin 161 penetrates, and a hole 162b through which the rotating shaft 153 penetrates. The shutter 162 moves (exists) such that the hole 132b and the hole 162a will communicate with each other in a state where the weight of the workpiece W is measured. In addition, the shutter 162 moves (exists) between the state where the workpiece W is measured and the state where the resin R is supplied, but the hole 162a is formed so that the rotating shaft 153 does not contact the shutter 162 therebetween.

When the resin is supplied, it can be considered that the pin 161 can be left in the cavity 130 even if the pin 161 is not allowed to escape from the cavity 130. In this case, since the inside of the chamber 130 is in a sealed state, it is not necessary to provide a seal ring for sealing between the chamber body 132 and the pin 161 in the hole 132b in advance. Therefore, there is a possibility that the measurement performed by the weight meter 160 through the pin 161 may not be accurate. In this regard, in the present embodiment, a shutter 162 is provided for the sealing system of the hole 132b instead of using a seal ring. Accordingly, even if the weight meter 160 is provided outside the chamber 130, the weight can be accurately measured. In addition, since the diameters of the holes 132b and 162a are larger than the diameter of the pin 161, the weight of the workpiece W is measured with the weight meter 160 through the pin 161 under the pin 161 not in contact with the chamber body 132.

Next, the operating method (resin supply method) of the resin supply device 110A will be described. In addition, the steps overlapped with the third embodiment described above are briefly explained.

First, as shown in FIG. 25, after measuring the weight of the workpiece W before the resin R is supplied, the workpiece W is placed on the setting table 151. Specifically, when the chamber 130 is opened, the drive unit 163 moves the weight 160 and the pin 161 upward in advance in such a way that the tip of the pin 161 will be higher than the position of the placement table 151 in advance. In this state, for example, the workpiece W transported by a transport device or an operator is set on the pin 161, and the weight of the workpiece W before the resin R is supplied is measured with a weight 160. Next, the weight 160 and the pin 161 are moved downward by the driving part 163, and after the workpiece W is delivered from the pin 161 to the setting table 151, the workpiece W is fixed and placed on the setting table 151 by the chuck 156.

Next, after the pin 161 is retracted from the chamber body 132, the shutter 162 is slid to plug the hole 132b through which the pin 161 penetrates (the shutter 162 is in a closed state). After that, in a state where the chamber 130 is closed, the air in the chamber 130 is started to be exhausted by the pressure adjusting part 141, and the air in the chamber 130 is set to a vacuum state (decompression state).

Next, as shown in FIG. 26, in the chamber 130 set in a vacuum state, the nozzle 122 is relatively moved to the workpiece W while the resin R is discharged from the nozzle 122 for supply. Specifically, the pressure adjusting part 141 keeps the chamber 130 in a vacuum state. Then, the table driving unit 152 rotates (horizontally move) the setting table 151, and while moving the workpiece W placed on the setting table 151, the lid driving unit 150A moves the chamber cover 131 horizontally to be installed in the chamber. The nozzle 122 of the cap 131 moves. At this time, unlike the third embodiment described above, the chamber cover 131 moves horizontally in either the Y-axis direction or the X-axis direction. The pinch valve 124 is driven by the valve driving part 126 to open the nozzle 122, and the driving part 180 moves the plunger 123 downward to discharge the resin R from the nozzle 122 and the workpiece W for supply. The resin R can be supplied (coated) to the surface of the workpiece W in a spiral or radial coating pattern in the predetermined coating pattern described in the third embodiment.

Then, the exhaust of air from the chamber 130 is stopped. Specifically, the vacuum state of the chamber 130 at a predetermined pressure is released by stopping the air discharge by the pressure adjusting part 141. Therefore, the resin R pressurized by the pressure of the surrounding atmosphere is injected into the reduced pressure narrow portion 202. And the nozzle 122 is moved up and down for a predetermined number of times to cut off the liquid.

Next, the supply amount of the resin R is measured in the chamber 130 in the closed state. Specifically, the shutter 162 is slid to connect the hole 132b and the hole 162a (the shutter 162 is in an open state). Thereby, the cavity 130 is opened to the atmosphere, and the injection (filling) of the resin R into the narrow part 202 is promoted. In addition, the pin 161 can enter the cavity 130. Next, the weight 160 and the pin 161 are moved upward by the driving part 163, and the work W is lifted up by the pin 161 penetrating the chamber body 132. Thereby, the weight of the workpiece W is measured by the weight 160, and the supply amount of the resin R can be measured by comparing with the weight before the resin supply. In addition, if the resin supply amount has not reached the predetermined amount, the workpiece W is set on the mounting table 151, and the resin R is supplied again in the chamber 130 in a vacuum state.

After the predetermined amount of resin R is supplied, the chamber 130 is set to an open state. Specifically, the chamber cover 131 is moved upward by the cover driving part 150A, and the chamber cover 131 is moved away from the chamber body 132 and the chamber 130 is opened. After that, the workpiece W (to which the resin R is supplied) is taken out by, for example, a conveying device, and is conveyed to the forming die 191 (see FIG. 27 ), for example. At this time, after the chuck 156 is released, the workpiece W placed on the placement table 151 is supported (ejected) by the pin 143 that moves upward, and is delivered to the conveying device. In addition, after that, the workpiece W to which the resin R has been supplied is set toward the molding die 191, and the resin R is thermally cured in the cavity C of the molding die 191. Since the aforementioned resin supply method is used to prevent defects such as air being included, it is possible to manufacture molded products in which the occurrence of molding defects such as unfilling in the narrow part 202 is suppressed. (Embodiment 5)

First, the resin molding apparatus 190 according to the embodiment of the present invention will be described mainly with reference to FIGS. 27 and 37. Fig. 27 is a diagram (cross-sectional view) for explaining the resin molding method (resin molding apparatus 190). FIG. 37 is a diagram for explaining the resin molding apparatus 190 (a schematic configuration diagram). In addition, the structure of such a resin molding apparatus 190 may be provided with the same structure in other embodiments, and a resin molding apparatus as an automatic machine can be configured.

As an automatic machine, the resin molding apparatus 190 includes a supply unit 197, a press unit 198, a storage unit 199, and a conveying device 204 (conveying unit) that conveys the workpiece W or the resin R therebetween. The supply unit 197 is provided with the aforementioned resin supply device 110 to perform preparations for supplying the workpiece W or the resin R to the press unit 198 and the like. In addition, the press section 198 is provided with a molding die 191 having a cavity C, and the resin R is thermally cured in the cavity C. This forming mold 191 is equipped with a pair of molds (one is set as an upper mold 192 and the other is set as a lower mold 193) capable of opening and closing the mold by a known press mechanism. The workpiece W is placed on the lower mold 193, and the upper mold 192 A cavity C (recess) is provided, and "upper cavity molding" is performed. In addition, it is also possible to create a mold structure in which the upper mold 192 is provided with a workpiece W and the lower mold 193 is provided with a cavity C (recess) to perform "lower cavity forming". In addition, the accommodating part 199 performs preparations and the like for accommodating the workpiece W (molded product) molded by the resin. Moreover, the resin molding apparatus 190 is equipped with the control part 205 which controls each part. This control part 205 is also used as a control part of the resin supply apparatus 110, 110A, but it may be used separately.

In addition, as another configuration of the resin molding apparatus 190, which is an automatic machine, a supply unit 197 that can accommodate the workpiece W, a resin R supply unit that includes the aforementioned resin supply device 110, and a press unit 198 and The structure of the conveying device 204 (conveying part) that conveys the workpiece W or the resin R between these. The supply unit 197 prepares to supply the workpiece W to the press unit 198, and stores the workpiece W after being formed. In addition, the resin R supply unit can arbitrarily supply the resin R to the workpiece W or the release sheet.

The forming mold 191 is provided with a cavity piece 194 (first mold block) for forming the cavity C (recess) and a clamp 195 (second mold block) surrounding the cavity. In the forming mold 191, since the upper mold 192 is provided with a cavity C, the bottom of the cavity C is below the cavity member 194, and the side of the cavity C is formed by the inner wall surface of the holder 195. In addition, the forming mold 191 includes a seal ring 196 (for example, an O ring) that seals between the upper mold 192 and the lower mold 193 (inside the mold). In addition, although not shown, the resin molding apparatus 190 includes a pressure regulator (e.g., vacuum pump) that adjusts the internal pressure of the molding die 191 or a temperature regulator (e.g., heater) that adjusts the internal temperature (molding temperature).

Next, the resin molding method (the operating method of the resin molding apparatus 190) will be described. First, for example, the resin R is supplied to the workpiece W using the aforementioned resin supply device 110 (FIG. 27A ). Next, the workpiece W to which the resin R has been supplied is transferred from the resin supply device 110 to the forming mold 191 in the opened mold state by the transfer device 204, and the workpiece W is placed on the forming mold with the wafer part 200 facing the cavity C side 191 (top of lower mold 193) (Figure 27B).

Next, the forming mold 191 is gradually closed, and the cavity C is brought into a reduced pressure (vacuum) state (FIG. 27C ). Specifically, the lower mold 193 and the upper mold 192 are gradually approached by the press mechanism. Therefore, the seal ring 196 provided in the lower mold 193 contacts the holder 195 of the upper mold 192, and the wafer component 200 and the resin R on the workpiece W (carrier 201) are accommodated in the cavity C. At this time, by discharging air through a pressure regulator (not shown), the inside of the mold can be brought into a reduced pressure state.

Next, the molding die 191 is further closed, and the workpiece W (carrier 201) is clamped between the upper die 192 and the lower die 193 (FIG. 27D), and compression molding is performed (FIG. 27E). At this time, since the molding die 191 is heated to the molding temperature by the temperature adjustment part (not shown), the resin R is thermally cured (heated, hardened) in the cavity C. The resin R is compressed (pressurized) and injected into the narrow part 202, but because the aforementioned resin supply method is used to prevent defects such as air, etc., the formation of the narrow part 202 has been suppressed such as unfilled molding defects. Product (workpiece W). After that, the forming mold 191 is placed in the mold open state, and the workpiece W (molded product) is taken out from the forming mold 191 by the conveying device 204 and carried out to the storage portion 199.

In this embodiment, the aforementioned resin supply method is used to prevent air from being mixed between the workpiece W and the resin R before resin molding. Therefore, in the resin molded part of the workpiece W (molded product), the occurrence of voids due to air mixing can be suppressed. In addition, in the work W, the intrusion of air is also suppressed in the narrow part 202, so that the occurrence of voids is suppressed and the underfill is performed. (Embodiment 6)

First, the resin molding apparatus 190A according to the embodiment of the present invention will be described mainly with reference to FIG. 28. FIG. 28 is a diagram (cross-sectional view) for explaining the resin molding method (resin molding apparatus 190A). In addition, the schematic configuration of the resin molding apparatus 190A is the same as the aforementioned resin molding apparatus 190 (FIG. 37 ).

The molding die 191A included in the resin molding apparatus 190A is equipped with a pair of dies (an upper die 192 and the other lower die 193) that can be opened and closed by a known press mechanism, and the upper die 192 is provided with a workpiece W, the lower mold 193 is provided with a cavity C (recess) to perform "lower cavity forming". In this embodiment, the point of performing "lower cavity molding" and the point of molding using two different types of resins R and Ra are different from the above-mentioned fifth embodiment, so the following description will focus on this point.

Next, the resin molding method (the operating method of the resin molding apparatus 190A) will be described. First, for example, the resin R is supplied to the workpiece W using the aforementioned resin supply device 110 (FIG. 28A ). Furthermore, according to the resin supply device 110, the resin R pressurized by the pressure of the ambient gas can be injected into the depressurized narrow part 202 (FIG. 28B). Here, it is also possible to complete molding by filling the narrow part 202 of the workpiece W with resin R to seal the connection part of the wafer component 200 and the carrier 201.

However, if the outer periphery of the chip component 200 is also sealed by resin and integrated to maintain mechanical strength, and the outer periphery of the chip component 200 is preferably sealed by resin, the following steps are performed. Specifically, the workpiece W to which the resin R has been supplied is transported by the transport device 204 from the resin supply device 110 to the molding die 191A in the mold open state, and the workpiece W is placed on the molding die 191A with the wafer part 200 facing the cavity C side (Under the upper mold 192) (Figure 28C). This workpiece W is sucked and held on the lower surface of the upper mold 192 by a suction device, for example, through a passage (hole) that is opened under the upper mold 192. In addition, resin Ra different from the resin R supplied to the workpiece W is supplied into the cavity C. Here, the other resin Ra means one supplied in a process different from the process in which the resin supply device 110 is used, and the material may be the same or different. In addition, the resin R in the resin supply device 110 is liquid, but the resin Ra may be liquid, pellet, powder, or flake. In addition, the resin Ra can be conveyed by an appropriate conveying device 204, and for example, the resin Ra can be supplied into the cavity C with the resin Ra mounted on a release sheet covering the mold surface to prevent contact between the mold surface and the resin Ra.

Next, the forming mold 191A is gradually closed, and the cavity C is brought into a reduced pressure (vacuum) state (FIG. 28D ). Thereby, the seal ring 196 provided in the upper mold 192 contacts the holder 195 of the lower mold 193, and the wafer component 200 and the resins R and Ra are accommodated in the cavity C.

Next, the molding die 191A is further closed gradually, the workpiece W (carrier 201) is clamped between the upper die 192 and the lower die 193, and compression molding is performed (FIG. 28E). At this time, since the molding die 191A is heated to the molding temperature by the temperature adjusting part (not shown), the resins R and Ra are thermally cured (heated, hardened) in the cavity C. However, because the aforementioned resin supply method is used to prevent defects such as the inclusion of air, a molded product (work W) with poor molding such as unfilled in the narrow part 202 is formed. In addition, for example, resin R suitable for filling the narrow part 202 and resin Ra suitable for sealing of the wafer component 200 with excellent heat dissipation and shielding properties can be used to form a molded product. After that, the forming mold 191A is placed in the mold open state, and the workpiece W (molded product) is taken out from the forming mold 191A by the conveying device 204 and carried out to the storage portion 199. (Embodiment 7)

The resin molding method of the embodiment of the present invention will be described mainly with reference to FIGS. 29 to 32. Figures 29 to 32 are diagrams (perspective views) for explaining the resin molding method. In this embodiment, for example, in supplying resin R to the workpiece W, the aforementioned resin supply apparatuses 110 and 110A can be used, and in terms of resin molding, the aforementioned resin molding apparatuses 190 and 190A can be used, but the resin molding can be carried out. The "upper cavity molding" resin molding device 190 is preferable.

First, the work W (the object to be supplied) before the resin R is supplied is prepared (FIG. 29 ). As the work W, a plurality of wafer parts 200 (for example, semiconductor wafers, etc.) are applied to be flip-chip bonded (bump-connected) a disc-shaped carrier 201 (for example, a glass plate on which semiconductor wafers and wiring layers are formed). ).

Next, for example, the resin R is supplied to the workpiece W using the resin supply device 110 (FIG. 30 ). Here, by applying and supplying the liquid resin R in a spiral shape to the entire surface of the workpiece W (carrier 201) with a gap, the wafer component 200 is formed without being covered by the resin R on the workpiece W.

Next, after the workpiece W to which the resin R has been supplied is set to the opened mold 191, the mold 191 is closed, the seal ring 196 is brought into contact with the holder 195, and the workpiece W is further clamped. At this time, the inside of the mold containing the closed cavity C is decompressed. In this way, the air between the wafer component 200 and the carrier 201 (the narrow part 202 shown in FIG. 19) is exhausted by depressurizing the ambient air, thereby preventing voids in the resin R after underfilling. In addition, in order to improve the air discharge effect, it is preferable to supply the resin R to the workpiece W at a height where the resin R does not contact the lower surface of the cavity member 194 when the seal ring 196 is in contact (FIG. 27C ).

Next, by further closing the mold, the liquid resin R is compressed (FIG. 31 ), so that the resin R filled in the cavity C is hardened and molded (FIG. 32 ). The liquid resin R coated in a spiral shape (a plurality of linear shapes) is expanded by the forming die 191 to flow only the distance between adjacent linear resin R, which is, for example, accumulated in the center of the workpiece W in order to shorten the coating time. Compared with the case where the resin R supplied at one point flows to the outer periphery, the flow distance of the resin R can be reduced. Thereby, it is possible to suppress the occurrence of defects such as wafer shift due to the resin flow of the resin that flows while being cured by the crosslinking reaction. In addition, flow marks caused by resin flow can also be reduced. In addition, when the distance is long, the resin R is prevented from hardening due to heat during flow, and the underfilling property on the outer periphery of the workpiece W can be improved.

When the resin R is applied only in a spiral shape and supplied to the workpiece W, when the resin R is gradually compressed by the molding die 191, the adjacent linear resins R will merge with each other, so there may be insufficient pressure reduction. Cause the air to be contained in the confluence. Thus, for example, by creating a coating pattern in which air can flow out of a predetermined portion of the workpiece W as shown in FIGS. 33 to 36, the air can be discharged sufficiently when the resin R is gradually compressed by the molding die 191, which can prevent Poor forming. In addition, when the resin supply devices 110 and 110A are used to supply the resin R to the workpiece W, even if the inside of the cavity 130 is not set to a vacuum state, the description will be given of a coating pattern of the resin R that can prevent defects such as air in the resin R.

FIG. 33 shows the state of the workpiece W after the fine resin R is supplied to a part of the spiral shape (the predetermined position 203). Here, when the liquid resin R is supplied in a spiral shape, the surface of the workpiece W is reduced in a predetermined direction (predetermined position 203) such as the cross direction shown in FIG. The height of R, or reduce the resin R. As such a resin supply method, for example, by increasing the moving speed of the nozzle 122, the coating amount at that position can be lower than other positions. In addition, as another method, the amount of resin R applied from the nozzle 122 can be reduced. For example, a method of reducing the opening degree of the nozzle 122 (pinching the nozzle 122) or a method of slowing down the movement speed of the plunger 123 can be considered. Thereby, when the resin R is compressed by the molding die 191, since the air can pass through the predetermined position 203, the air can be discharged smoothly, and the generation of voids can be prevented.

FIG. 34 shows the state of the workpiece W after the resin R is intermittently supplied in a spiral shape. Here, in order to provide a space in which air can flow, a multi-point coating method is essentially used. In this case, regarding the nozzle 122 that is moving so as to become a spiral coating pattern, an operation in which the resin R is discharged when approaching the workpiece W is repeated, and the resin R that has been discharged when leaving is disconnected. Therefore, by moving down to the next discharge point before the coating is completely finished, the action of moving to the next discharge point can be performed in real time. Thereby, since the resin R can be repeatedly discharged at high speed when it reaches the discharge point and approaches the workpiece W, the resin R can be supplied at a high speed. In addition, since air can flow between the points where the resin R is applied, the occurrence of voids can be prevented. In addition, since the resin R is discharged little by little from the nozzle 122, the resin R can be applied to the entire surface of the workpiece W up to a predetermined supply amount. According to this, for example, since it is possible to complete the coating in which the vortex lines are arranged at a high density, reducing the flow amount of the resin R can also reduce the flow mark.

FIG. 35 shows the state of the work W after the resin R is supplied intermittently in a straight line. Here, the method described with reference to FIG. 34 is used to provide a space in which air can flow, and a linear coating pattern is created such that multi-point coating is substantially performed. In addition, by supplying the resin R in a straight line, it can also be applied to the case of supplying between the wafers. For example, it can also be applied to the case of coating between a plurality of wafers cut as a package area at the end as shown in FIG. 24B.

FIG. 36 shows the state of the workpiece W after the resin R is supplied at multiple points between the wafer parts 200. Here, the method described with reference to FIG. 34 is used. For example, by applying resin R between four adjacent wafer parts 200, when the resin R is compressed by the molding die 191, air flow can be ensured and the resin R can be placed in the cavity. C is easy to fill. (Embodiment 8)

The resin placement device 310 and the resin molding device 350 equipped with the resin placement device 310 according to the embodiment of the present invention will be described with reference to FIGS. 38 to 46. 38 to 42 are diagrams for explaining the resin placement device 310 in operation. FIGS. 43 to 46 are diagrams for explaining the main parts of the resin molding apparatus 350 in operation. In this embodiment, the workpiece W is used as the object to which the resin R is supplied.

First, the structure of the resin installation device 310 will be described. As shown in FIG. 38 etc., the resin installation apparatus 310 is equipped with the chamber 311 in which resin R and the workpiece|work W (to-be-supply) are placed. The chamber 311 is provided with a pair of chamber parts (one is the upper chamber part 312 and the other is the lower chamber part 313) and is configured to be openable and closable. The workpiece W is set on the surface 313a (set surface) of the lower chamber portion 313.

In this resin installation device 310, the lifting part is controlled by the control part which is not shown in figure. This control unit is a computer composed of a memory unit such as CPU (central arithmetic processing unit), ROM, RAM, etc. The CPU reads out and executes various control programs recorded in the memory unit to control the resin placement device 310 The actions of the constituent elements of each part. In addition, in the present embodiment, the resin molding apparatus 350 provided with the resin placement device 310 is described as having a control unit, but the resin placement device 310 may be separately provided with the control unit.

The upper chamber portion 312 and the lower chamber portion 313 are made of materials that can withstand any pressure state in the chamber 311, such as metal. When the chamber 311 is in the closed state, the upper chamber portion 312 having the recessed portion contacts the lower chamber portion 313 to form the inner portion 311a of the chamber 311 (in a closed state) (see FIG. 39). Although not shown in the figure, an appropriate sealing mechanism may be provided between the upper chamber portion 312 and the lower chamber portion 313.

In addition, the resin installation device 310 includes a decompression unit 314 (for example, a vacuum pump) that sucks air into the interior 311a of the chamber 311 to form a decompressed state. In a state where the interior 311a of the cavity 311 has been formed, the decompression portion 314 sucks air into the interior 311a through the air passage 315 provided in the upper cavity portion 312 to form a decompression state. In addition, the decompression unit 314 is controlled by the control unit.

In addition, the resin installation device 310 includes a heating unit 316 that heats the cavity 311. The heating part 316 (for example, a cartridge heater) is provided in plural so as to extend in parallel with the surface 313 a of the lower chamber part 313. In addition, the resin installation device 310 includes a cooling unit 317 that cools the cavity 311. A plurality of cooling parts 317 (for example, cooling pipes through which a refrigerant circulates) is provided so as to extend parallel to the surface 313a of the lower chamber part 313. Thereby, the resin R of the work W placed on the surface 313a can be heated or cooled. In addition, the heating part 316 and the cooling part 317 are controlled by the control part. In addition, the heating part 316 and the cooling part 317 may be provided in the upper chamber part 312, or may be provided in both the upper chamber part 312 and the lower chamber part 313.

Here, as shown in FIG. 39, the cooling part 317 may be provided on the side closer to the surface 313 a than the heating part 316. Thereby, the cooling part 317 is actuated on the surface 313a of the lower chamber part 313 to shield the heat from the heating part 316. For example, the resin R of the workpiece W placed on the surface 313a can be quickly moved from the heated state to the cooled state.

Next, the configuration of the resin molding apparatus 350 shown in FIG. 43 and later will be described. The resin molding apparatus 350 is provided with a press unit including a molding die 360 configured to be opened and closed by a well-known die opening and closing mechanism. This forming mold 360 is configured by including a pair of molds (one is set as an upper mold 361 and the other is set as a lower mold 362) that is opened and closed by a press section.

Moreover, in the resin molding apparatus 350 which is an automatic machine, the press part is provided with the supply part and the storage part which are not shown in figure. As for the supply part, preparation and processing for supplying the workpiece W (here, the molded product) or the resin R toward the press part are performed. A resin installation device 310 is provided in this supply part. In addition, the accommodating portion prepares and processes for accommodating the resin-molded workpiece W (here, a molded product). In addition, for the transfer of the workpiece W or resin R between the supply unit, the press unit, and the storage unit, a loader (not shown) for carrying in to the press unit and unloading from the press unit are used. Machines (not shown), these are constituted by well-known mechanisms. In addition, the mold opening and closing mechanism, loader and unloader are controlled by the control unit. In this way, for the reason at the time of transportation as described later, it is preferable to have a configuration in which the resin placement device 310 and the resin molding device 350 are integrally provided, but these may be installed separately.

The upper mold 361 is provided with an upper holder 363, a cavity member 364, and an upper seat 365, and is constituted by assembling these mold blocks (for example, made of alloy tool steel). In the upper holder 363, a through hole 363a is formed in the thickness direction, and a cavity member 364 is provided in the through hole 363a. The cavity member 364 is fixed to the upper base 365 and supported. In this embodiment, the upper mold 361 is provided with the cavity recess 367, but the side portion of the cavity recess 367 is formed by the upper clamp 363, and the deep portion of the cavity recess 367 is formed by the cavity member 364. In addition, the upper mold 361 is provided with an elastic member 366 (for example, a spring) provided between the upper holder 363 and the upper seat 365. The upper holder 363 is assembled to the upper base 365 via this elastic member 366, and it is comprised so that it may reciprocate in the mold opening and closing direction. In the state where the molding die 360 is closed, the cavity recess 367 is closed to form a cavity C (see FIG. 44). In addition, in such a forming mold 360, by covering the mold surface of the cavity recess 367 to prevent contact between the resin R and the mold surface to promote mold release, a release sheet that prevents resin leakage from the sliding portion can be used.

In addition, the upper mold 361 includes a sealing member 370 (for example, an O ring), and is provided between the inner peripheral surface of the through hole 363 a of the upper holder 363 and the outer peripheral surface of the cavity member 364. In addition, the resin molding apparatus 350 includes a vacuum unit 371 (for example, a vacuum pump) that sucks air into the cavity C to form a vacuum state. In a state where the cavity C is formed by closing the mold, the vacuum unit 371 suctions the cavity C through the air passage 372 provided in the upper holder 363 of the upper mold 361 to form a vacuum state. In addition, the resin molding apparatus 350 includes a heating unit 368 that heats the upper mold 361. A plurality of heating parts 368 (for example, a cartridge heater) are provided so as to extend in parallel with the lower surface of the cavity member 364 (the inner side of the cavity recess 367). In addition, the vacuum unit 371 and the heating unit 368 are controlled by the control unit.

The lower mold 362 is provided with a lower holder 373, an insert 374, and a lower seat 375, and is constituted by placing these mold blocks. In the lower holder 373, a through hole 373a is formed in the thickness direction, and an insert 374 is provided in the through hole 373a. The insert 374 is fixed to the lower base 375 and supported. In this lower mold 362, a workpiece W is placed on the upper surface of the insert 374. In addition, the lower mold 362 is provided with an elastic member 376 (for example, a spring), and is provided between the lower holder 373 and the lower seat 375. The structure is such that the lower clamper 373 is assembled to the lower seat 375 via this elastic member 376 and is capable of reciprocating movement in the mold opening and closing direction.

In addition, the lower mold 362 includes a sealing member 379 (for example, an O ring), and is provided between the inner peripheral surface of the through hole 373 a of the lower holder 373 and the outer peripheral surface of the insert 374. In addition, the lower mold 362 is provided with a sealing member 380 (for example, an O-ring), is provided on the upper surface of the lower clamp 373, and contacts the lower surface of the upper clamp 363 of the upper mold 361 when the mold is closed. In addition, the resin molding apparatus 350 includes a vacuum unit 381 (for example, a vacuum pump) that sucks air into the cavity C to be in a vacuum state. The vacuum part 381 is in a state where the mold is closed and the mold cavity C has been formed, and the mold cavity C is air sucked through the air passage 382 provided in the lower holder 373 of the lower mold 362 to form a vacuum state. In addition, the resin molding apparatus 350 includes a heating unit 378 that heats the lower mold 362. A plurality of heating parts 378 (for example, cartridge heaters) are provided so as to extend in parallel with the upper surface of the insert 374. In addition, the vacuum unit 381 and the heating unit 378 are controlled by the control unit.

Next, the resin installation method (the operating method of the resin installation device 310) will be described. First, after the resin R is supplied (mounted) on the work W, as shown in FIG. 38, the work W to which the resin R has been supplied is placed in the opened chamber 311. The placement of the workpiece W toward the cavity 311 is performed by a loader.

As the workpiece W on which the resin R is placed, for example, a plurality of chip parts 400 (semiconductor wafers, etc.) are used. The substrate 401 (for example, a temporary carrier formed with a wiring structure, a wiring substrate, and a wafer) is flip-chip packaged by fine bumps. Wait). In such a workpiece W, a narrow portion (a bump height portion or a gap between bumps with a narrow gap) is formed between the wafer component 400 and the substrate 401. In this case, the workpiece W has uneven portions 402 due to the plurality of wafer components 400 being packaged on the substrate 401. In this embodiment, the resin R is supplied to the workpiece W having the uneven portion 402 so as to cover the uneven portion 402. In addition, as the resin R, a sheet resin (thermosetting resin such as a sheet-like epoxy resin) is used. According to the sheet resin, even if the size of the workpiece W is a large size (for example, a 12-inch wafer level or a large panel-like object with a side length of more than 300 mm), the workpiece W can be covered and uniformly supplied.

Here, as the sheet resin, that is, the resin R, for example, what is protected by the protective sheet can be used. In this case, when one side is protected by a protective sheet, the protective sheet may be arranged on the opposite side of the workpiece W, and the protective sheet may be placed on the workpiece W together with the protective sheet. In this case, the protection sheet can prevent deterioration or contamination of the resin R. In this case, it is only necessary to peel off the protective sheet after placing the resin R on the work W. In addition, a plurality of sheets of resin R, that is, resin R, may be stacked and used. In addition, the resin R system can also be used by arranging a plurality of sheets of resin (resin R) having an arbitrary area on the workpiece W.

Next, as shown in FIG. 39, in a state where the chamber 311 is closed, the inside 311a of the chamber 311 is brought into a reduced pressure state. At this time, the pressure of the interior 311a of the cavity 311 is reduced while the resin R is being heated. Specifically, the upper chamber part 312 and the lower chamber part 313 are gradually approached by the lifting part. At this time, by starting air suction in advance by the decompression part 314, the inner portion 311a can be formed and the pressure can be directly reduced. In addition, by heating the interior 311a of the cavity 311 by the heating part 316 in advance, the workpiece W and the resin R are heated, and the resin R can be softened. Here, by providing the heating portion 316 in the lower chamber portion 313 where the workpiece W is placed, the workpiece W can be directly heated by heat conduction and quickly heated. In this way, by heating the resin R on the workpiece W by the heating part 316, the heating time in the resin molding apparatus 350 can be shortened to shorten the molding time. In addition, by heating the lower chamber portion 313 in advance, the entire chamber 311 including the upper chamber portion 312 can be heated by its radiant heat, and the resin R can also be heated from above to make it easy to soften.

Thereby, it can be set as the state which covered the workpiece|work W with the resin R in the softened state (soft state) in the cavity 311 which was decompressed. In this case, as shown in FIG. 39, for example, the resin R may be in a state where the resin R is in close contact with the substrate 401 on the outer periphery of the workpiece W, and the space enclosed by the resin R and the substrate 401 is in a decompressed state. At this time, after decompression and heating are appropriately performed, the heating portion 316 is stopped at a predetermined timing so that the crosslinking reaction of the resin R does not proceed excessively in the decompressed state of the interior 311a. In addition, if the sheet resin used as the resin R is in a soft state in an atmospheric environment, the heating part 316 may not be used for heating.

Next, as shown in FIG. 40, in a state where the chamber 311 is closed, the pressure in the interior 11a of the chamber 311 is increased. Specifically, it is only necessary to stop the decompression part 314 to open the chamber 311 to open the inside 311a of the chamber 311 to the atmosphere. Here, when the pressure in the interior 311a of the chamber 311 is increased, not only the method of opening to the atmosphere, but also the method of releasing the decompression state or releasing the decompression state in order to be higher than the pressure of the interior 311a in the decompression state as described with reference to FIG. 39 The case of positive pressure. In this way, the pressure of the inside 311a of the cavity 311 is relatively high, so that the resin R is pressed against the workpiece W side. In addition, the gap between the workpiece W and the resin R can be reduced at this time. In this embodiment, the resin R can be brought into close contact with the workpiece W so as to follow the uneven portion 402. Accordingly, it is possible to prevent the occurrence of a gap between the uneven portion 402 and the resin R.

In addition, a pressurizing part (for example, a compressor) different from the depressurizing part 314 may be connected to the air path 315 in advance, and after the depressurizing part 314 is stopped, the pressure of the interior 311a of the chamber 311 can be increased by the pressurizing part. . In addition, a flow meter may be connected to the air path 315 in advance, and the pressure in the interior 311a of the chamber 311 may be adjusted while measuring the flow meter.

Next, as shown in FIG. 41, in the state where the cavity 311 is closed, the workpiece W and the resin R may also be cooled. Specifically, by cooling the lower chamber portion 313 with the cooling portion 317, the resin R of the workpiece W on the surface 313a is cooled, even if the resin R has heat, the crosslinking reaction can be suppressed, and the workpiece can be secured The transfer of W and resin R to the forming die 360 is delayed. In addition, after heating the resin R to soften it and covering the workpiece W, the resin R may be cooled by the cooling part 317.

Next, as shown in FIG. 42, the chamber 311 is set to an open state. After that, the workpiece W is taken out from the chamber 311 by the loader. According to such a resin placement method, the resin R can be placed on the workpiece W in a state where air has been removed from between the workpiece W and the resin R. That is, it is possible to prevent air from being mixed in when the resin is installed. In other words, it can be set in a state where no air is contained between the workpiece W and the resin R when the resin is placed. As shown in the figure, it is also conceivable that there is a space not filled with the resin R between the wafer component 400 and the substrate 401. However, since this area is covered with molten resin R after depressurizing, it is possible to maintain a state where components (air or water vapor) contained in the atmosphere can be removed from the space under the wafer component 400.

Next, the resin molding method (the operating method of the resin molding apparatus 350) will be described. First, as shown in FIG. 43, the workpiece W supplied with the resin R by the aforementioned resin placement method is carried into the forming mold 360. Specifically, the workpiece W is transferred from the resin placement device 310 to the forming mold 360 whose mold has been opened by a loader, and is placed on the upper surface of the lower gripper 373. In this case, as described above, if the resin R is cooled by the cooling part 317, even if a thermosetting resin that cures at a predetermined temperature is used, it can prevent the curing from progressing during transportation and causing it to be in the mold 360. It becomes difficult to flow when heated and pressurized.

Next, as shown in FIG. 44, the molding die 360 is gradually closed, and the cavity C of the molding die 360 is brought into a reduced pressure (vacuum) state. Specifically, the upper mold 361 gradually approaches the lower mold 362 by the mold opening and closing mechanism. Thereby, the resin R is accommodated in the cavity C. As shown in FIG. At this time, when the vacuum unit 371 starts air suction in advance, the cavity C can be formed and the pressure can be directly reduced to a vacuum state.

Then, until the predetermined molding pressure is reached, as shown in FIG. 45, the molding die 360 is further closed and compression molding is performed. At this time, since the molding die 360 is heated to the molding temperature by the heating unit 378, the resin R-based is heated and pressurized by the molding die 360. In this case, in the workpiece W, a narrow portion (a portion of the bump height or a gap between bumps with a narrow gap) is formed between the wafer component 400 and the substrate 401. Even if there is such a narrow part, as mentioned above, since the components (air or water vapor) contained in the atmosphere are removed from the space under the wafer part 400, it can be filled without filling, and the occurrence of voids can be suppressed and performed. Underfill. After that, heating and pressurization is performed sufficiently as necessary to thermally harden the resin R and complete the shape of the cavity C of the forming mold 360.

Next, as shown in FIG. 46, the molding die 360 is set to the mold open state, and the workpiece W (molded product) is carried out from the molding die 360. Specifically, the upper mold 361 is gradually separated from the lower mold 362 by the mold opening and closing mechanism. The workpiece W is taken out from the forming mold 360 whose mold is opened by the unloader and carried out to the storage section.

In this embodiment, the aforementioned resin installation method is used to prevent air from entering between the workpiece W and the resin R before resin molding. Therefore, in the resin molded part of the workpiece W (molded product), the occurrence of voids due to air mixing can be suppressed. In addition, even in the workpiece W, even if there is a narrow part between the wafer part 400 and the substrate 401, the mixing of air is suppressed (air or water vapor contained in the atmosphere is removed), so the occurrence of voids can be suppressed and the process can be performed reliably. Underfill.

As mentioned above, the present invention has been specifically described based on the embodiments, and the present invention is not limited to the foregoing embodiments, and of course various changes can be made without departing from the scope of the gist. In addition, the steps or the constituent elements of the method or apparatus of the present invention specifically shown in the above-mentioned embodiments are not necessarily required at all, as long as they do not deviate from the scope of the invention that can obtain the various effects, they can be appropriately selected. choose.

For example, when a wafer component that is flip-chip bonded to a substrate is used as a workpiece, when the liquid resin is supplied to the substrate, the pressure can be reduced between the substrate and the wafer component. Therefore, for example, in compression molding, it becomes easy to fill the space between the substrate and the wafer component with resin, and so-called underfilling can be appropriately performed.

In addition, the example in which the liquid resin R is supplied in a vacuum state (under reduced pressure atmosphere) in the above-mentioned first embodiment has been described, but the present invention is not limited to this. That is, according to the resin supply device shown in the above-mentioned first embodiment, after the liquid resin is ejected (supply) from the nozzle to the object to be supplied from the inside of the chamber, the air is discharged in a vacuum state (under reduced pressure atmosphere), It can also prevent undesirable conditions such as air in the resin.

Also, it is conceivable that the pressure is reduced so that the interior 30a of the chamber 30 becomes a high vacuum degree. Even if the nozzle 22 is closed by the pinch valve 24, the liquid resin R stored in the syringe 21 will still flow into the interior 30a of the chamber 30. Spit out such a situation. In such a case, it is preferable to have a structure that pulls the liquid resin R back into the syringe 21. This prevents the liquid resin R from being discharged unexpectedly. For example, as shown in FIG. 18, it is also possible to balance the pressure of the space (upper space) without the liquid resin R in the syringe 21 with the force required to draw out the liquid resin R by the pressure reduction in the chamber 30 .

Specifically, as shown in FIG. 18, the plunger 23 provided with the plunger shaft 23a and the plunger sealing part 23b is produced. The plunger shaft 23a has a diameter enlarged at its tip and presses the syringe cap 21a provided on the syringe 21 to eject the liquid resin R. The plunger seal 23b has an annular structure in which the plunger shaft 23a is inserted in the center. By combining with the cylindrical syringe body 21b, the space between the syringe body 21b and the syringe cap 21a is set as a predetermined sealed space. In addition, the plunger sealing portion 23b includes: a seal 23b1 to ensure the sealing performance with the edge of the syringe body 21b; a seal 23b2 to maintain the sealing performance with the plunger shaft 23a; The suction path 23b3 for air suction. As a result, the syringe cap 21a, the syringe body 21b, the plunger shaft 23a, and the plunger seal 23b form an annular closed space inside the syringe 21. In a state where such a closed space is formed, by sucking air through the suction path 23b3 provided in the plunger seal portion 23b with a piping or a vacuum pump not shown, the space can be decompressed and pulled back to the syringe cover portion 21a. A force to pull the liquid resin R back into the syringe 21 is applied.

In addition, the syringe 21 is supplied into the device with the liquid resin R stored in the syringe body 21b and the syringe cap 21a. Therefore, for example, in a state where the unused syringe 21 is set in a position as shown in FIG. 1, the plunger 23 is lowered and the tip of the plunger shaft 23a is inserted into the syringe body 21b. In addition, at this time, the opening of the upper end of the syringe body 21b is closed by the plunger seal 23b, and a force for returning the liquid resin R to the syringe 21 can be applied after proper resin ejection. According to this, in addition to preventing the liquid resin R from being discharged unexpectedly, even if the liquid resin R is not discharged unexpectedly, the liquid resin R can be shut off by using the force that returns the liquid resin R into the syringe 21.

In addition, as a configuration for pulling the liquid resin R back into the syringe 21, not only the method of reducing pressure as described above, but also a configuration for pulling the syringe cap 21a back mechanically. In this case, by making the tip of the plunger shaft 23a screw or fit the syringe cap 21a to arbitrarily engage with each other, the syringe cap 21a can be directly pulled back by the plunger shaft 23a. For example, a male screw may be provided at the front end of the plunger shaft 23a and a female screw may be provided on the main surface of the syringe cap 21a, so that these can be screwed together. Of course, if it can be arbitrarily engaged, it is not limited by this structure. The tip of the plunger shaft 23a can be made into a T-shape, and it can be rotated and engaged with a groove provided on the syringe cover 21a. .

For example, the various resin supply methods shown in Fig. 16, Fig. 17, Fig. 22, Fig. 23, Fig. 33 to Fig. 36, as the workpiece W is not only the carrier 201 on which the wafer component 200 is mounted, but also for a flat workpiece or as shown in Fig. 28 The mold release sheet used for the purpose of securing separation formation or preventing resin leakage in such lower cavity molding can also be applied.

In the foregoing embodiment 3 and other embodiments, the configuration in which the position of the nozzle 122 for discharging the resin R is moved after the pressure is reduced has been described, but the present invention is not limited to this. For example, in a configuration in which the resin R is applied to the workpiece W or the release sheet in an arbitrary shape by moving the position of the nozzle 122 that discharges the resin R, the resin R may be supplied without reduced pressure. In addition, for example, the resin R can be applied to the release sheet in an arbitrary shape, and thereby the air trapped in the gap between the release sheet and the resin R or the air in the resin R can also be discharged. In addition, as a configuration provided with a plurality of syringes 121 or nozzles 122, a configuration that shortens the coating time may also be adopted. For example, by providing a plurality of syringes 121 or nozzles 122 and coating the release sheet while relatively moving, the coating time for the release sheet can be shortened.

In addition, for example, various resin supply methods as shown in FIGS. 33 to 36, etc., are coating patterns in which a predetermined portion of the workpiece W has a portion through which air can flow. Even if the pressure is not reduced when the resin R is being discharged, for example, by Molding is performed while air is flowing out (discharged) in the decompressed mold, and molding can be performed to prevent the occurrence of voids.

In the third embodiment described above, the ball roller is used as the load support of the chamber cover, but for example, a configuration in which the load is received by the air from the compressor can be used. In addition, it is also possible to use a resin supply device as shown in FIGS. 1 to 15 for the structure in which the load support provided with the chamber cover is provided. For example, by setting the ball roller as a load bearing on the inner or outer circumference of the sealing portion 33 provided in the upper chamber portion 31 that moves in a predetermined direction, the sealing portion 33 can also be prevented in the structure shown in the same figure. The squash and smooth movement.

In addition, although the configuration example in which the syringe 21 and the like are arranged in the vertical direction (vertical direction) in any of the foregoing embodiments has been described, the present invention is not limited to this. For example, the syringe 21 etc. may be arrange|positioned in the horizontal direction (lateral direction). In this way, the height of the device can be reduced.

In the above-mentioned Embodiment 8, the case where a sheet resin is used as the resin covering the workpiece has been described. However, it is not limited by this. For the resin, granular resin is used, and it can also be made to cover the workpiece in a state (average state) integrated by surface tension after heating and melting. According to this, air can be removed from the granular resin and the workpiece can be covered with resin. In addition, the pelletized resin may be previously pressurized and formed into a flake shape to be used as a flake resin.

In addition, in the above-mentioned Embodiment 8, the case where the workpiece as an example of the supply is a substrate in which a plurality of chip parts are flip-chip mounted is used. However, it is not limited by this, and a flat heat radiating plate or shielding plate can also be used as a workpiece, and these can also be those having uneven portions for heat conduction or electrical conduction. Furthermore, as a workpiece, it may be a wafer without a chip but only bumps, and it can also be configured such that an adhesive film is attached to a single side of the ring member and a chip member is attached to the adhesive film. In these cases, it is also possible to prevent gaps between the workpiece and the sheet resin, and even if there are gaps, it is possible to remove the air or water vapor contained in the atmosphere to prevent unfilling.

Furthermore, the object to be supplied may be a release sheet. In this case, for example, as a configuration in which the resin molding apparatus 350 shown in FIG. 43 is reversed up and down, a configuration in which the release sheet is supplied to the lower mold can be considered. In this case, it is conceivable that after placing a sheet of resin, that is, resin R, on the release sheet, it is loaded into the resin molding device 350 and the workpiece W that has been loaded separately is resin-molded. Even in this case, even if the air trapped between the release sheet and the resin R can be removed, it is possible to prevent the occurrence of residual air expansion and the formation of defects that leave marks on the molded product.

22: Nozzle 30: Chamber 30a: internal R: Liquid resin W: Workpiece (Supply)

Fig. 1 is a diagram for explaining a resin supply device according to an embodiment of the present invention. FIG. 2 is a diagram for explaining the operation of the resin supply device following FIG. 1. Fig. 3 is a diagram for explaining the resin supply device following the operation of Fig. 2; Fig. 4 is a diagram for explaining the resin supply device following the operation of Fig. 3; Fig. 5 is a diagram for explaining the resin supply device following the operation of Fig. 4; Fig. 6 is a diagram for explaining the resin supply device following the operation of Fig. 5; FIG. 7 is a diagram for explaining the resin supply device following the operation of FIG. 6; FIG. 8 is a diagram for explaining the resin supply device following the operation of FIG. 7. Fig. 9 is a diagram for explaining a resin supply device according to another embodiment of the present invention. Fig. 10 is a diagram for explaining the resin supply device following the operation of Fig. 9; Fig. 11 is a diagram for explaining the resin supply device following the operation of Fig. 10; Fig. 12 is a diagram for explaining the resin supply device following the operation of Fig. 11; Fig. 13 is a diagram for explaining the resin supply device following the operation of Fig. 12; Fig. 14 is a diagram for explaining the resin supply device following the operation of Fig. 13. Fig. 15 is a diagram for explaining the resin supply device following the operation of Fig. 14; Fig. 16 is a plan view of the object to which the liquid resin has been supplied. Fig. 17 is a side view of the object to which the liquid resin has been supplied. Fig. 18 is a diagram for explaining an example of the structure of the syringe. Fig. 19 is a diagram for explaining a resin supply device according to another embodiment of the present invention, and shows a state in which an object to be supplied is supplied to the chamber. Fig. 20 is a diagram for explaining the operation of the resin supply device following Fig. 19, showing a state in which the chamber is closed. Fig. 21 is a diagram for explaining the operation of the resin supply device following Fig. 20, showing a state in which resin is being supplied. FIG. 22 is a diagram for explaining a coating pattern of resin toward the object to be supplied in the shape of a disc, FIG. 22A shows the vortex, and FIG. 22B shows the state of the grid. Figure 23 is a diagram for explaining the coating pattern of the resin facing the supplied object in the shape of the panel. Figure 23A is the center point, Figure 23B is the multi-point, Figure 23C is the large vortex, Figure 23D is the small vortex, and Figure 23E is the corner For the vortex, Fig. 23F is a grid, and Fig. 23G is a state of radiation. Fig. 24 is a diagram for explaining the coating pattern of the resin facing the main part (wafer part) of the object to be supplied. Fig. 24A shows the coating on the whole circumference of the chip part, and Fig. 24B shows the coating without covering the adjacent wafer parts. , Figure 24C shows the state of covering and coating adjacent wafer parts. Fig. 25 is a diagram for explaining a resin supply device according to another embodiment of the present invention, showing a state in which weight measurement is performed. Fig. 26 is a diagram for explaining the resin supply device following the operation of Fig. 25, showing the state of applying resin. Fig. 27 is a diagram for explaining a resin molding method related to another embodiment of the present invention. Fig. 27A is a state where the object has been supplied with resin, Fig. 27B is a state where the object is placed in the molding die, and Fig. 27C is The state in which the pressure in the molding die is decompressed, FIG. 27D shows the state in which the object to be supplied is clamped, and FIG. 27E shows the state in which the resin is thermally cured in the cavity. Fig. 28 is a diagram for explaining a resin molding method related to another embodiment of the present invention. Fig. 28A is a state in which the object has been supplied with resin, Fig. 28B is in a state where the object is underfilled, and Fig. 28C is in Fig. 28D shows a state in which the mold is decompressed, and Fig. 28E shows a state in which the resin is thermally cured in the mold cavity. Fig. 29 is a diagram for explaining a resin molding method according to another embodiment of the present invention, showing the state of the object before the resin is supplied. Fig. 30 is a diagram for explaining the resin molding method following Fig. 29, showing the state of the object to be supplied after the spiral resin is supplied. Fig. 31 is a diagram for explaining the resin molding method following Fig. 30, showing the state of the object being supplied while being compressed by the resin. Fig. 32 is a diagram for explaining the resin molding method following Fig. 31, showing the state of the resin molded object. FIG. 33 is a diagram for explaining a resin molding method according to another embodiment of the present invention, and shows a state where a part of a spiral shape is thinly supplied with resin. FIG. 34 is a diagram for explaining a resin molding method according to another embodiment of the present invention, and shows the state of the object to be supplied after the resin is supplied intermittently in a spiral shape. 35 is a diagram for explaining a resin molding method according to another embodiment of the present invention, showing the state of the object to be supplied after the resin is supplied intermittently in a straight line. FIG. 36 is a diagram for explaining a resin molding method according to another embodiment of the present invention, and shows the state of the object to be supplied after the resin is supplied to the chip parts at multiple points. Fig. 37 is a diagram for explaining a resin molding apparatus according to another embodiment of the present invention. Fig. 38 is a diagram for explaining a resin placement device according to another embodiment of the present invention. FIG. 39 is a diagram for explaining the resin placement device in the operation subsequent to FIG. 38. FIG. FIG. 40 is a diagram for explaining the resin placement device in the operation subsequent to FIG. 39. FIG. Fig. 41 is a diagram for explaining the resin installation device in operation following Fig. 40; FIG. 42 is a diagram for explaining the resin placement device in operation following FIG. 41. FIG. Fig. 43 is a diagram for explaining the main part of a resin molding apparatus according to another embodiment of the present invention. FIG. 44 is a diagram for explaining the main part of the resin molding apparatus in operation subsequent to FIG. 43. FIG. 45 is a diagram for explaining the main part of the resin molding apparatus in operation subsequent to FIG. 44. FIG. Fig. 46 is a diagram for explaining the main part of the resin molding apparatus in operation subsequent to Fig. 45;

10: Resin supply device

11: Control Department

20: Discharge part

21: Syringe

22: Nozzle

23: Plunger

24: Pinch valve

30: Chamber

30a: internal

31: Upper chamber

31a: Through protrusion

32: Lower chamber

32a: surface

32b: sinking part

33: Sealing part

34: spit out holding part

35: Sealing part

36: Sealing part

40: weight meter

41: Vacuum Department

42: Air Way

50: Chamber drive unit

51: holding part

52: Track 1

53: Slide 1

54: 1st motor

70: Nozzle lifting drive

72: Track 2

73: Slide 2

74: 2nd motor

80: Discharge drive part

82: Track 3

83: Slide 3

84: 3rd motor

W: Workpiece

R: Liquid resin

Claims (7)

A resin supply device is a resin supply device that supplies liquid resin to an object to be supplied in a chamber set in a vacuum state, and is characterized by comprising: a chamber cover and a chamber body constituting the aforementioned chamber; a sealing ring, Is provided on the opening edge of the chamber body to seal between the chamber cover and the chamber body; and a load support is provided on the chamber body along the sealing ring, between the chamber cover and the chamber Loads are placed between the chamber bodies, and the resin supply device is further equipped with a cover driving part that moves the chamber cover to the chamber body when the chamber is closed, and the chamber cover is configured to be horizontally movable, as The load support of the aforementioned chamber cover is configured with a rolling load support or a sliding load support. The resin supply device of claim 1, wherein in the state where the chamber is opened, the seal ring is higher than the load support in the height from the chamber body to the chamber cover. The resin supply device of claim 1 or 2, wherein the load support is a structure in which a plurality of ball rollers are provided. Such as the resin supply device of claim 1 or 2, which is further equipped with a weight scale, which is arranged in the aforementioned chamber and is provided for the aforementioned objects to be placed. For example, the resin supply device of claim 1 or 2 is further provided with: a setting table, which is provided in the chamber and is used for setting the object to be supplied; and a table driving part, which rotates the setting table. Such as the resin supply device of claim 5, which is further equipped with a weight meter, designed The object to be supplied is placed outside the chamber and via a pin penetrating the chamber body. A resin molding device characterized by comprising: a resin supply device according to any one of claims 1 to 6; and a mold having a cavity and thermally hardening the resin in the cavity.

Images