TWI820358B - Resin molding method - Google Patents

Abstract

Provide a technology that prevents problems such as air inclusion in resin.

The interior (30a) of the chamber (30) is evacuated. Next, the liquid resin (R) is discharged from the nozzle (22) toward the workpiece (W), which is the object to be supplied, from the inside (30a) of the chamber (30) in the vacuum state. Next, after stopping the discharge of the liquid resin (R) and stopping the vacuuming of the inside (30a) of the chamber (30), the nozzle (22) is reciprocated in the inside (30a) of the chamber (30).

Description

Resin molding method

The present invention relates to a resin supply technology, a resin molding technology, and a resin placement technology.

Japanese Patent Application Publication No. 2012-126075 (hereinafter referred to as "Patent Document 1") describes a liquid resin supply device. This liquid resin supply device discharges and supplies the liquid resin filled in the syringe from a tube nozzle to the workpiece.

Japanese Patent Application Publication No. 2007-111862 (hereinafter referred to as "Patent Document 2") describes a vacuum distribution device. This vacuum distribution device places the object to be coated in a vacuum chamber and supplies liquid resin under vacuum ambient gas. In addition, this vacuum distribution device is provided with a hanging liquid support container outside the vacuum chamber in order to prevent the device from being soiled due to liquid hanging from the nozzle.

Japanese Patent Application Publication No. 2007-307843 (hereinafter referred to as "Patent Document 3") describes a method of resin molding a workpiece (formed article) using a sheet of resin. Here, after the molding die is opened and the workpiece is placed, a thin sheet of resin is supplied to the workpiece so as to cover the resin molding area of the workpiece.

[Prior technical literature] [Patent Document]

Patent Document 1 Japanese Patent Application Publication No. 2012-126075

Patent Document 2 Japanese Patent Application Publication No. 2007-111862

Patent Document 3 Japanese Patent Application Publication No. 2007-307843

[Problem to be solved by the invention]

When resin molding is performed on an object to be supplied (for example, a workpiece or a film), the liquid resin supply device described in Patent Document 1 can be used to supply liquid resin to the object to be supplied. However, for example, when liquid resin is supplied to a workpiece, which is a substrate on which a plurality of wafer components (wafer-shaped electronic components) are mounted as a supplied object, the liquid resin covering the plurality of wafer components may become water droplets. shaped block. In this regard, air may remain between the substrate and the liquid resin, resulting in an unfilled problem in the molded product. Furthermore, there is a risk that so-called underfill may not be performed appropriately on a wafer component that is flip-chip bonded on a substrate as a workpiece.

Therefore, as for the supply of liquid resin, instead of using the technology described in Patent Document 1 in an atmospheric environment, it may be considered that the technology described in Patent Document 2 is performed in a vacuum ambient gas to remove residual air. However, the technology described in Patent Document 2 is configured to open the vacuum chamber to the atmosphere and then move the liquid suspension container under the nozzle (especially refer to paragraph [0026] of the specification), so there is a problem on the workpiece. There is a risk of dust adhering to liquid resin.

An object of the present invention is to provide a technology that can prevent problems such as air inclusion in resin. One object, other objects, and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

For example, another object of the present invention is to provide a technology for suppressing air mixing during placement of resin. As described in Patent Document 3, when a sheet resin is supplied to a workpiece placed on a molding die with the mold open, the sheet resin softens due to radiant heat from the molding die whose molding temperature is preset to the molding temperature by the heater. Therefore, for example, when a substrate on which a plurality of wafer components are mounted is used as a workpiece having uneven portions, air may be trapped between the sheet resin covering the wafer components and the substrate, causing the sheet resin to soften. In this case, there is a risk that voids may be generated due to air being mixed into the resin molded portion of the molded product. [Means to solve the problem]

A brief summary of representative inventions disclosed in this case is as follows.

One solution of the present invention relates to a resin supply method, which is characterized by comprising: (a) The process of vacuuming the inside of the chamber; (b) The process of discharging the liquid resin from a nozzle toward the object to be supplied from the inside of the chamber in a vacuum state; and (c) After stopping the discharge of the liquid resin and stopping the evacuation of the inside of the chamber, a step of shutting off the liquid in the nozzle is performed in the inside of the chamber. More preferably, in the step (c), after stopping the discharge of the liquid resin and stopping the evacuation of the inside of the chamber, the nozzle is reciprocated in the inside of the chamber. This can prevent problems such as air inclusion in the resin.

Here, it is more preferable that in the step (b), the liquid resin is discharged while measuring the weight of the liquid resin with a weight meter installed in the inside of the chamber. Accordingly, the weight of the liquid resin can be accurately measured.

Furthermore, it is more preferable that in the step (b), the liquid resin is ejected while moving the nozzle parallel to the object to be supplied. According to this, the liquid resin can be supplied into the surface of the object to be supplied at any discharge position.

A resin supply method according to another solution of the present invention is characterized by including: (a) a process of discharging liquid resin from a nozzle toward an object to be supplied inside a chamber; (b) performing an onslaught on the inside of the chamber; The step of vacuuming; and (c) after stopping the ejection of the liquid resin and stopping the vacuuming of the inside of the chamber, performing a step of shutting off the liquid of the nozzle in the inside of the chamber. This can prevent problems such as air inclusion in the resin.

One solution of the present invention relates to a resin sealing method, which is characterized by including: a step of supplying the liquid resin to the object to be supplied using any of the resin supply methods mentioned above; and using the object to be supplied and heating it with a molding die The process of pressurizing and sealing with resin into a predetermined shape. This enables high-quality resin sealing that prevents voids or unfilled spaces due to air inclusion.

A resin supply device according to one of the solutions of the present invention is characterized by having: a chamber in which an object to be supplied is placed; and a discharge part having a nozzle for discharging liquid resin toward the object to be supplied, and the nozzle is provided in the chamber. the inside of the chamber; a vacuum part that evacuates the inside of the chamber; a nozzle lifting and lowering driving part that reciprocates the nozzle; and a control part that controls the discharge part, the vacuum part, and the nozzle lifting and lowering driving part from the In a state where the discharge of the liquid resin by the discharge part is stopped and the vacuuming by the vacuum part is stopped, the control part controls the nozzle lift drive part to reciprocate the nozzle. According to this, the discharged liquid resin can be cut off inside the chamber and separated from the object to be supplied.

Here, it is more preferable that the weight meter is further provided in the inside of the chamber so as to accommodate the object to be supplied, and the weight of the discharged liquid resin is measured. Accordingly, the weight of the liquid resin can be accurately measured.

Furthermore, more preferably, the chamber is provided with one and another chamber part, and a sealing part for sealing between the one chamber part and the other chamber part, and is configured to be openable and closable, and the discharge part is provided with The one chamber part is further provided with a chamber driving part to move the one chamber part forward, backward and parallel to the other chamber part. According to this, the liquid resin can be supplied to the surface of the object to be supplied at any discharge position.

Another solution of the present invention relates to a resin supply device that supplies liquid resin to a target object in a chamber that is in a vacuum state, and is characterized by including: a chamber cover constituting the chamber; The chamber body; a sealing ring, which is provided on the opening edge of the aforementioned chamber body to seal between the aforementioned chamber cover and the aforementioned chamber body; and a load support, which is provided on the aforementioned chamber body along the aforementioned sealing ring, in the aforementioned chamber The load is borne between the chamber cover and the aforementioned chamber body. According to this, the resin can be supplied in a vacuum state in which air is removed. In addition, the load support prevents the sealing ring from being excessively flattened, thereby ensuring sealing performance and allowing the chamber to be placed in a vacuum state.

More preferably, when the chamber is open, the sealing ring is higher than the load support at a height from the chamber body to the chamber cover. This ensures sealing when closing the chamber and puts the chamber into a vacuum state.

It is more preferable that the resin supply device further includes a cover driving unit for moving the chamber cover relative to the chamber body when the chamber is closed. Accordingly, the chamber cover can be moved in a vacuum state.

More preferably, in the resin supply device, the load support is provided with a plurality of ball rollers. Accordingly, the chamber cover can be easily moved in a vacuum state.

More preferably, the resin supply device further includes a weight gauge, is installed in the chamber, and is equipped with the supplied object. Accordingly, the amount of resin supplied to the object can be measured in real time.

More preferably, the resin supply device further includes: a placement table provided in the chamber for placement of the supplied object; and a table drive unit for rotating the placement table. Accordingly, the movement range of the resin supply side (chamber cover) is narrowed to reduce the capacity of the chamber. Therefore, a vacuum state of a predetermined pressure can be established in a short time. For example, manufacturing costs can be reduced without using a vacuum pump with a high suction force.

Preferably, the resin supply device further includes a weight gauge, which is provided outside the chamber and where the object to be supplied is placed via a pin penetrating the chamber body. According to this, the amount of resin supplied to the object to be supplied can be measured without installing a weight meter in the chamber.

A resin molding apparatus according to one embodiment of the present invention is characterized by including: the resin supply device; and a mold having a mold cavity and thermally hardening the resin in the mold cavity. This can prevent molding defects such as lack of filling.

Another embodiment of the present invention relates to a resin supply method for supplying liquid resin to a supplied object having a narrow portion, and the method is characterized by including: (a) a step of placing the supplied object into a chamber; (b) After the above-mentioned step (a), the step of decompressing the inside of the above-mentioned chamber; (c) after the above-mentioned step (b), the step of supplying the above-mentioned resin in such a manner as to be applied to the aforementioned narrow portion; and (d) the above-mentioned step (c) Thereafter, there is a process of pressurizing the chamber. Accordingly, the pressurized resin can be injected into the depressurized constriction.

In the resin supply method, it is more preferable that in the step (b), the chamber is placed in a vacuum state, and in the step (d), the chamber is opened to the atmosphere. Accordingly, resin can be injected into the narrow part again.

In the above-mentioned resin supply method, it is more preferable that a carrier to which the wafer component is flip-chip bonded is used as the supplied object, and the narrow portion is provided between the carrier and the wafer component. According to this, underfilling can be easily performed.

A resin placement method related to a solution of the present invention is a resin placement method in which heat and pressure are applied in a mold cavity of a forming mold and the resin that is thermally hardened into the shape of the mold cavity is placed on a supplied object, and is characterized by including: ( a) The process of supplying the resin to the object to be supplied; (b) After the aforementioned process (a), the process of placing the aforementioned object to be supplied into the open chamber; (c) After the aforementioned process (b), the process of placing the aforementioned chamber (d) After the above-mentioned step (c), the step of increasing the pressure inside the above-mentioned chamber; (e) After the above-mentioned step (d), The process of opening the chamber and taking out the supplied object. More preferably: the aforementioned supplied object is a workpiece. Moreover, it is more preferable that the said object to be supplied is a release sheet. According to this, the gap between the supplied object, that is, the release film or the workpiece, and the resin can be reduced, and molding can be performed to prevent defects such as lack of filling.

Here, it is more preferable that in the step (a), the resin is supplied to the object having the uneven portions so as to cover the uneven portions, and in the step (d), the resin is allowed to follow the object. The aforementioned concave and convex parts. This can prevent the occurrence of gaps between the concave and convex portions and the resin.

Furthermore, it is more preferable that in the step (c), the pressure inside the chamber is reduced while heating the resin. Accordingly, the object to be supplied can be covered with the resin in a softened state.

Furthermore, it is more preferable that after the above-mentioned step (c), the above-mentioned resin is cooled. According to this, conditions causing resin reaction can be suppressed.

Furthermore, it is more preferable that in the step (a), a flake resin is used as the resin. Accordingly, the resin can be supplied uniformly.

More preferably, the object to which the resin is supplied by the resin placing method is carried into a mold, and the resin is heated and pressurized in a cavity of the mold to be thermally cured. Accordingly, the generation of voids due to air mixing in the resin molded portion of the molded article can be suppressed. [Effects of the invention]

The following is a brief explanation of the effects achieved by representative ones of the inventions disclosed in this case. According to the solution of the present invention, undesirable conditions such as air inclusion in the resin can be prevented.

In the following embodiments of the present invention, the description will be divided into plural parts when necessary. However, in principle, they are not unrelated to each other, but are modifications and details of one part or all of the other part. etc. relationship. Therefore, in all the drawings, members having the same function are given the same symbols, and repeated descriptions thereof are omitted. In addition, the number of constituent elements (including number, numerical value, quantity, range, etc.) is not limited to a specific number and may be a specific number, except when it is specifically stated or when it is clearly limited to a specific number in principle. above or below the number. When referring to the shape of a component, etc., it is assumed to include those that are substantially similar or similar to the shape, etc., except for cases where it is specifically stated explicitly and cases where it is clearly not the case in principle. (Embodiment 1)

The resin supply device 10 according to the embodiment of the present invention will be described with reference to FIGS. 1 to 8 . 1 to 8 are diagrams for explaining the resin supply device 10 involved in the resin supply operation. In addition, assuming that the resin supply device 10 is in a three-dimensional (XYZ) orthogonal coordinate system, the up and down direction (vertical direction) in the figure corresponds to the direction along the Z axis, and the horizontal direction becomes along the X axis and the Y axis. direction.

In this embodiment, the workpiece W is used as the object to which the liquid resin R is supplied. This workpiece W is attached to a heat-releasable adhesive sheet (adhesive tape) on a circular metal (SUS, etc.) carrier plate with a diameter of 12 inches (about 30 cm), and a plurality of semiconductor wafers are arranged on the adhesive sheet. Row-like adherents. The liquid resin R is supplied to such a workpiece W, and what is called E-WLP (Embedded Wafer Level Package; Embedded Wafer Level Package) or eWLB (Embedded Wafer Level Ball Gate Array; embedded Wafer Lebel BGA) is performed Resin molding. As the liquid resin R, for example, a thermosetting resin such as silicone resin or epoxy resin is used.

The resin supply device 10 includes a control unit 11 . This control unit 11 is equipped with a CPU (central processing unit) and a memory unit such as ROM and RAM. The CPU reads out various control programs recorded in the memory unit and executes them to control the various parts constituting the resin supply device 10 . action. The operations performed by these respective parts become operations of the resin supply device 10 .

Moreover, the resin supply device 10 is provided with the discharge part 20 which discharges and supplies the liquid resin R. The discharge part 20 includes a syringe 21 for storing the liquid resin R; a nozzle 22 provided at the front end of the syringe 21; and a plunger 23 inserted into the syringe 21 to hold the liquid resin R. Furthermore, the discharge part 20 is provided with, for example, a pinch valve (pinch valve) 24 that is provided to pinch a tubular nozzle 22 made of an elastic body and that opens and closes the nozzle 22 by opening and closing a drive mechanism (not shown). In addition, as for the nozzle 22, as long as the opening and closing of the nozzle 22 can be switched arbitrarily (in other words, whether the liquid resin can pass through), it is not necessary to use the method of pinching the nozzle 22 made of an elastic body to open and close the nozzle 22 as described above. Pinch valve 24. For example, a gate plate may be provided at the front end of the nozzle or an on-off valve may be provided.

The discharge part 20 opens and closes the pinch valve 24 by a drive mechanism (not shown) and moves the plunger 23 downward so that the liquid resin R in the syringe 21 flows in the extrusion direction, and the liquid resin R is discharged from the nozzle 22 . On the other hand, the discharge unit 20 stops the downward movement of the plunger 23 and closes the pinch valve 24 to stop discharge of the liquid resin R from the nozzle 22 .

Furthermore, the resin supply device 10 is provided with the chamber 30 in which the workpiece W (object to be supplied) is placed inside 30a. The chamber 30 includes a pair of chamber parts 31 and 32 (one is an upper chamber part 31 and the other is a lower chamber part 32), and is configured to be openable and closable. Moreover, the resin supply device 10 is provided with the sealing part 33 (for example, an O ring) which seals between the upper chamber part 31 and the lower chamber part 32. Thereby, when the chamber 30 is in a closed state, the upper chamber part 31 and the lower chamber part 32 are in contact with each other via the sealing part 33, thereby forming the interior 30a of the chamber 30 (in a closed state). In addition, the chamber 30 is provided with a temperature adjustment unit (not shown) for arbitrarily adjusting the temperature inside the chamber 30 . In addition, the lower chamber portion 32 may be configured as, for example, a table portion of the device frame, or may be a plate-shaped member fixed to the device frame.

As will be described later, the liquid resin R is discharged from the nozzle 22 toward the workpiece W placed in the interior 30 a of the chamber 30 (see FIG. 3 ). For this reason, the resin supply device 10 is configured such that the discharge portion 20 is provided in the upper chamber portion 31 . Specifically, the resin supply device 10 is configured such that the nozzle 22 penetrates the upper chamber portion 31 and is installed in the interior 30 a of the chamber 30 while the syringe 21 is held outside the chamber 30 . Therefore, the resin supply device 10 is provided with the discharge holding part 34 and the sealing parts 35 and 36 (for example, an O ring). The discharge holding part 34 holds the syringe 21 with the nozzle 22 passing through it. Moreover, the discharge holding part 34 is provided as a cover part of the opening of the penetration protrusion part 31a so that it may cover the penetration protrusion part 31a of the upper chamber part 31. The sealing portion 35 seals between the syringe 21 and the discharge holding portion 34 . The sealing portion 36 seals between the penetrating protrusion 31 a of the upper chamber portion 31 and the discharge holding portion 34 . Therefore, the nozzle 22 is provided in the interior 30a formed by closing the chamber 30.

Moreover, the resin supply device 10 is equipped with the weight meter 40 which measures the weight of the liquid resin R discharged from the nozzle 22. The weight scale 40 is provided in the interior 30a of the chamber 30 for placement of the workpiece W. In this case, as shown in FIG. 1 , the lower chamber portion 32 may be provided with a sunken portion 32 b that is concave from the surface 32 a. The weight scale 40 is installed in a fixed state on the sinking part 32b. This weight gauge 40 measures the weight of the liquid resin R discharged to the workpiece W in a state where the workpiece W is placed. Accordingly, the weight meter 40 can stably measure the weight of the liquid resin R supplied to the workpiece W in the interior 30 a of the chamber 30 , and can measure it accurately. In addition, the weight meter 40 is electrically connected to the control unit 11 , and the control unit 11 processes the measurement data of the weight meter 40 .

Moreover, the resin supply apparatus 10 is equipped with the vacuum part 41 (for example, a vacuum pump) which evacuates the inside 30a of the chamber 30 into a vacuum state (or a reduced pressure state). The vacuum part 41 evacuates the interior 30a of the chamber 30 via the air path 42 provided in the chamber part 32, while the interior 30a of the chamber 30 is in a closed state, thereby forming a vacuum state. Since resin can be supplied in such a chamber 30, problems such as air inclusion in the resin can be prevented. In addition, the vacuum part 41 and the control part 11 are electrically connected, and the vacuum part 41 is controlled by the control part 11.

Moreover, the resin supply device 10 is provided with the chamber drive part 50 which opens and closes the chamber 30. The chamber driving part 50 opens and closes the chamber 30 by moving the upper chamber part 31 forward and backward (approaching, away from) the lower chamber part 32 in the direction along the Z axis. The chamber driving part 50 includes a holding part 51, a first rail 52, a first slider 53, and a first motor 54.

In the chamber driving part 50 , the holding part 51 is configured in a columnar shape and is provided so as to stand on the surface 32 a of the lower chamber part 32 . Here, the holding portion 51 is provided with a first rail 52 extending in the up-and-down direction (direction along the Z-axis, vertical direction). The first slider 53 is provided to be slidable on the first rail 52 . The first slider 53 is driven by the first motor 54 to slide on the first track 52 . Furthermore, in this embodiment, the upper chamber part 31 is provided on the first slider 53, and the upper chamber part 31 moves forward and backward with respect to the lower chamber part 32 by the first slider 53 sliding in the up and down direction ( move up and down). In addition, the first motor 54 is electrically connected to the control unit 11 , and the chamber driving unit 50 is controlled by the control unit 11 . In addition, in the following description, an example in which a plurality of drive units are formed with the same structure except for the chamber drive unit 50 will be described. However, these are not only structures as shown in the figures, but may also be provided with The constructor of any moving structure such as an articulated robot using a link structure.

Furthermore, the resin supply device 10 is provided with a nozzle lifting and lowering drive unit 70 that reciprocates the nozzle 22 . The nozzle lifting and lowering drive unit 70 reciprocates the nozzle 22 of the discharge unit 20 in the lifting and lowering direction in the interior 30 a of the chamber 30 . The nozzle lifting and lowering drive unit 70 includes a second rail 72 , a second slider 73 , and a second motor 74 .

In the nozzle lifting and lowering driving unit 70 , the second rail 72 extends in the vertical direction and is provided to the first slider 53 of the chamber driving unit 50 together with the upper chamber portion 31 . That is, the second rail 72 and the upper chamber portion 31 are held together with the first slider 53 . The second slider 73 is provided to be slidable on the second rail 72 . The second slider 73 is driven by the second motor 74 to slide on the second rail 72 . Here, the second slider 73 is provided with a discharge holding portion 34 . In this embodiment, the second slider 73 slides in the up-down direction, and the nozzle 22 of the discharge part 20 is reciprocated (raised and lowered) through the discharge holding part 34 . As will be described later, the liquid resin R can be cut off by reciprocating the nozzle 22 that discharges the liquid resin R. In addition, the second motor 74 is electrically connected to the control unit 11, and the control unit 11 controls the nozzle lifting and lowering driving unit 70.

Here, the liquid resin R is cut off. It means that when the liquid resin R is discharged downward from the nozzle 22 and supplied to the workpiece W, the liquid resin R with high viscosity is not separated from the nozzle 22 due to its own weight. In the case of being in an elongated state (drawing state), or in the case of being disconnected from the nozzle 22 . In the following embodiment, a method is assumed in which the nozzle 22 that has finished discharging the liquid resin R is raised and lowered and the distance from the workpiece W is repeatedly expanded and contracted to be disconnected from the nozzle 22 . However, the method of cutting off the liquid is not limited to this, and it may also be a method of physically cutting off the tip of the nozzle 22 .

Moreover, the discharge part 20 of the resin supply device 10 is equipped with the discharge drive part 80 which reciprocates the plunger 23. The discharge driving part 80 includes a third rail 82, a third slider 83, and a third motor 84.

In the discharge driving part 80, the third rail 82 extends in the up-and-down direction and is provided on the second slider 73. The third slider 83 is provided to be slidable on the third rail 82 . The third slider 83 is driven by the third motor 84 to slide on the third rail 82 . Here, the third slider 83 is provided with the plunger 23, and the plunger 23 reciprocates when the third slider 83 slides in the up and down direction. In this embodiment, the plunger 23 is inserted into the syringe 21 , and the liquid resin R is discharged from the nozzle 22 provided at the front end of the syringe 21 by pushing the liquid resin R stored in the syringe 21 . In addition, the third motor 84 is electrically connected to the control unit 11 , and the control unit 11 controls the discharge drive unit 80 of the discharge unit 20 .

In the resin supply device 10 , in a state where the discharge of the liquid resin R from the discharge part 20 is stopped and the vacuuming by the vacuum part 41 is stopped, the control part 11 controls the nozzle lifting and lowering driving part 70 so that the nozzle lifting and lowering driving part 70 is controlled inside the chamber 30 30a causes the nozzle 22 to reciprocate. Accordingly, the discharged liquid resin R can be disconnected from the workpiece W in the interior 30 a of the chamber 30 . By cutting off the fluid in the locked space (inside 30a), it is possible to prevent dust and the like from being drawn in.

Next, the operation method of the resin supply device 10 according to the embodiment of the present invention, that is, the resin supply method will be described.

The resin supply device 10 shown in FIG. 1 is in a state before the workpiece W is supplied. Here, chamber 30 is open. Furthermore, the nozzle 22 of the syringe 21 is closed by the pinch valve 24, and the plunger 23 waits upward. In this way, with the chamber 30 open, the workpiece W is transported by a transport device (for example, a loader), and as shown in FIG. 2 , the workpiece W is supplied to the resin supply device 10 . In this embodiment, the workpiece W is mounted on the weight scale 40 .

Next, as shown in FIG. 3 , the interior 30 a of the chamber 30 is formed to be in a closed state, and vacuuming of the interior 30 a of the chamber 30 is started. Here, the vacuum part 41 and the chamber driving part 50 are controlled by the control part 11. Specifically, according to the driving of the first motor 54 of the chamber driving part 50, the first slider 53 provided with the upper chamber part 31 gradually descends on the first rail 52, and the upper chamber part 31 and the lower chamber part 32 are in contact with each other via the sealing portion 33 . This forms the interior 30a of the chamber 30 in a closed state. Then, by driving the vacuum part 41, the interior 30a of the chamber 30 in which the workpiece W is placed is brought into a vacuum state. In addition, it is preferable to control the temperature adjustment unit so that the temperature inside the chamber 30 becomes a predetermined value before or in parallel with the operation of setting the vacuum state. In this case, it is sufficient to set only the chamber 30 to a predetermined temperature, not the entire device, so the temperature can be adjusted quickly.

Next, as shown in FIG. 4 , the liquid resin R is discharged toward the workpiece W from the nozzle 22 in the interior 30 a of the vacuum chamber 30 . Here, the discharge part 20 (discharge drive part 80) and the vacuum part 41 are controlled by the control part 11. Specifically, the interior 30 a of the chamber 30 is continuously brought into a vacuum state by driving the vacuum part 41 . Then, the third slider 83 provided with the plunger 23 gradually descends on the third rail 82 by driving the third motor 84 of the discharge part 20 . In this case, the plunger 23 presses the liquid resin R in the syringe 21, and the pinch valve 24 is opened by a driving mechanism not shown, so that the liquid resin R is discharged from the nozzle 22.

At this time, the liquid resin R is discharged while measuring the weight of the liquid resin R with the weight meter 40 installed in the interior 30 a of the chamber 30 . The control unit 11 processes the measurement data of the weight meter 40 and can stop the discharge of the liquid resin R, for example, when the weight of the liquid resin R reaches a predetermined value. In addition, if the inside 30a of the chamber 30 is brought to a predetermined temperature by the temperature regulator as described above, the liquid resin R can be accurately discharged or the weight can be measured, and the liquid resin R can be supplied more appropriately.

Next, after the discharge of the liquid resin R is stopped and the vacuuming of the interior 30a of the chamber 30 is stopped, the nozzle 22 is reciprocated in the interior 30a of the chamber 30 as shown in FIGS. 5 and 6 . Here, the control unit 11 controls the discharge unit 20, the vacuum unit 41, and the nozzle lifting and lowering driving unit 70. Specifically, by stopping the third motor 84 of the discharge unit 20 , the downward movement of the plunger 23 is stopped, the pinch valve 24 is closed, and the discharge of the liquid resin R from the nozzle 22 is stopped. Next, since the vacuuming by the vacuum part 41 is stopped, the vacuum state of the interior 30a of the chamber 30 is released. Thereby, for example, when there is a space below the liquid resin R supplied to the workpiece W that cannot be filled with the liquid resin R (in other words, when air is contained), the pressure of the surrounding ambient gas can be used to control the space. The gap is filled with liquid resin R.

Next, the nozzle 22 of the discharge part 20 is moved upward by driving the second motor 74 of the nozzle lifting and lowering driving part 70 (see FIG. 5 ). Next, the nozzle 22 of the discharge part 20 is moved downward by driving the second motor 74 of the nozzle lifting and lowering driving part 70 (see FIG. 6 ). Then, a liquid shutoff operation is performed in which the nozzle 22 of the discharge unit 20 repeats the reciprocating movement (lifting and lowering) a predetermined number of times. Although the vacuum state of the interior 30a of the chamber 30 is released, the discharge holding part 34 can be raised and lowered while maintaining the closed state of the chamber 30.

In this embodiment, the reciprocating operation of the nozzle 22 is performed while closing the chamber 30 and maintaining the state in which the interior 30a is formed (locked state). The discharge holding part 34 is reciprocally moved without moving the upper chamber part 31 by using the penetration protrusion 31a of the upper chamber part 31 as a guide part, so that the nozzle held by the discharge holding part 34 can be moved while maintaining a closed space. 22 reciprocating movement. In this way, the liquid resin R is cut off in the closed interior 30a. In this regard, for example, by raising and lowering the upper chamber portion 31, the nozzle 22 can also be raised and lowered to perform a liquid shutoff operation. However, when such an operation is to be performed, the components for lifting and lowering become larger. Furthermore, it is conceivable that when the upper chamber portion 31 moves up and down, the ambient gas around the workpiece W flows, and if dust exists in the surroundings, it may adhere to the liquid resin R. For such reasons, it is preferable to provide a sealing portion 36 between the upper chamber portion 31 and the discharge holding portion 34 and to move the syringe 21 having the nozzle 22 up and down as shown in this embodiment. In this way, the air contained can be eliminated and the adhesion of dust can be prevented. The resin supply device 10 shown in FIG. 7 is in a state where the liquid resin R has been cut off.

Next, the control unit 11 controls the chamber drive unit 50 to open the chamber 30 as shown in FIG. 8 so that the workpiece W to which the liquid resin R has been supplied is exposed to the atmosphere. Here, filling of the workpiece W with the liquid resin R is also accelerated by applying atmospheric pressure from around the liquid resin R. For example, when a chip component is mounted on a substrate or a wafer as a workpiece W by flip-chip bonding, the liquid resin R can be filled between a plurality of bumps connecting the chip and the substrate. Furthermore, even when flip-chip bonding is not performed, it is conceivable that the liquid resin R may be generated in the space at the corner of the workpiece W formed by the side surface of the wafer mounted on the substrate or the like and the plane of the substrate or the like. Inadequately spread (unfilled) parts. It is also conceivable to supply the liquid resin R so as to include such a portion (space) so as to be in a state containing air. However, such air-containing (area without liquid resin R) can be completely eliminated by applying atmospheric pressure from around the liquid resin R supplied in a vacuum state (under reduced pressure ambient gas).

Specifically, by driving the first motor 54 of the chamber driving part 50, the first slider 53 provided with the upper chamber part 31 is gradually raised on the first rail 52, and the upper chamber part 31 and the lower chamber part 31 are moved upward. The chamber portion 32 is separated and the chamber 30 is in an open state. Thereafter, the workpiece W to which the liquid resin R has been supplied is taken out and transported by a transport device (for example, a loader).

Next, for example, the resin supply device 10 in this embodiment and a molding die (not shown) are installed in a molding device, and the liquid resin R supplied to the workpiece W in the molding die is ejected under a reduced pressure atmosphere. It is heated and pressurized to be sealed by resin into a predetermined shape. This enables high-quality resin sealing that prevents voids or unfilled spaces due to air inclusion. In this case, since the liquid resin R is supplied to the workpiece W while preventing problems such as inclusion of air as described above, unfilled resin sealing can be prevented. In addition, in this embodiment, the case where the workpiece W is applied as the object to be supplied has been described. However, unlike the workpiece W, the release sheet supplied to the molding die may be used as the object to be supplied and supplied in a liquid form. Resin R. (Embodiment 2)

The resin supply device 10A according to Embodiment 2 of the present invention will be described with reference to FIGS. 9 to 17 . 9 to 15 are diagrams for explaining the resin supply device 10A involved in the resin supply operation. 16 and 17 are respectively a top view and a side view of the workpiece W to which the liquid resin is supplied. This embodiment is different from the structure of the chamber driving unit 50 according to the first embodiment, so the following description will focus on this point.

The resin supply device 10A according to this embodiment is provided with a chamber drive unit 50A that configures the chamber 30 at any position in the plane direction and opens and closes the chamber. That is, the chamber driving part 50A is configured to move the upper chamber part 31 including the syringe 21 (nozzle 22) in the X direction or the Y direction in FIG. 9 . Moreover, the chamber driving part 50A opens and closes the chamber 30 by moving the upper chamber part 31 forward and backward with respect to the lower chamber part 32. With such a structure, in the state in which the chamber 30 is configured (for example, in a reduced pressure state), the nozzle 22 portion of the syringe 21 can move to any position in the XY direction with respect to the workpiece W.

Specifically, the chamber driving part 50A includes the holding part 51, the first rail 52, the first slider 53, the first motor 54, the upper seat part 60, the fourth rail 61, the fourth slider 62, the fourth motor 63, The fifth rail 64 , the fifth slider 65 and the fifth motor 66 . In addition, in the chamber driving unit 50A, the upper seat 60 is fixed to the device frame so as not to move. A fourth rail 61 extending in the Y-axis direction is provided on the lower surface of the upper seat 60 . The fourth slider 62 is provided to be slidable on the fourth rail 61 . The fourth slider 62 is driven by the fourth motor 63 to slide on the fourth track 61 . Furthermore, the fourth slider 62 is provided with a fifth rail 64 extending in the direction of the X-axis. The fifth slider 65 is provided to be slidable on the fifth rail 64 . The fifth slider 65 is driven by the fifth motor 66 to slide on the fifth track 64 . Furthermore, in the fifth slider 65, the holding portion 51 is provided in a suspended manner.

The holding part 51 is provided with a first rail 52 extending in the direction of the Z-axis, and the first slider 53 is provided so as to be slidable on the first rail 52 by the first motor 54 . Furthermore, the first slider 53 is provided with an upper chamber portion 31 . Therefore, the upper chamber part 31 is movable in the directions along the three axes (XYZ) by the chamber driving part 50A. That is, the chamber drive unit 50A can move the upper chamber part 31 forward and backward (move in the direction along the Z axis) and move parallelly (move in the direction along the X axis and the Y axis) relative to the lower chamber part 32 . For this reason, in the resin supply device 10A, the upper chamber portion 31 can be moved in parallel by the chamber driving portion 50A while maintaining the closed state of the chamber 30 .

Furthermore, as described in the first embodiment, the discharge portion 20 is provided in the upper chamber portion 31 . For this reason, in the resin supply device 10A, the liquid resin R can be discharged from the nozzle 22 while moving the discharge part 20 in parallel while maintaining the closed state of the chamber 30 . According to this, in addition to the effects of the above-described embodiment, the liquid resin R can be supplied to the surface of the workpiece W at an arbitrary discharge position (see FIGS. 16 and 17 ).

Next, the operation method of the resin supply device 10A according to the embodiment of the present invention, that is, the resin supply method will be described.

The resin supply device 10 shown in FIG. 9 is in a state in which the workpiece W is supplied with the chamber 30 open. Here, the nozzle 22 of the syringe 21 is closed by the pinch valve 24, and the plunger 23 waits above. In addition, the workpiece W is placed on the weight scale 40 .

Next, as shown in FIG. 10 , the interior 30 a of the chamber 30 is formed to be in a closed state, and vacuuming of the interior 30 a of the chamber 30 is started. Here, the vacuum part 41 and the chamber driving part 50A are controlled by the control part 11. Specifically, according to the driving of the first motor 54 of the chamber driving part 50A, the first slider 53 provided with the upper chamber part 31 gradually descends on the first rail 52, and the upper chamber part 31 and the lower chamber part 32 are in contact with each other via the sealing portion 33 . This forms the interior 30a of the chamber 30 in a closed state. Then, by driving the vacuum part 41, the inside 30a of the chamber 30 in which the workpiece W is placed is brought into a vacuum state.

Next, as shown in FIG. 11 , the upper chamber part 31 is moved in parallel with the lower chamber part 32 so that the nozzle 22 is at a predetermined position (discharge start position) with respect to the surface of the workpiece W. Here, the vacuum part 41 and the chamber driving part 50A are controlled by the control part 11. Specifically, the interior 30 a of the chamber 30 is continuously brought into a vacuum state by driving the vacuum part 41 . Then, at least one of the fourth slider 62 or the fifth slider 65 is driven by at least one of the fourth motor 63 or the fifth motor 66 of the chamber driving part 50A to slide, so that the upper chamber part 31 is parallel to the lower chamber part 32 Move. Thereby, the nozzle 22 can move parallel to the surface of the workpiece W to a predetermined position.

Next, while the chamber 30 is closed, the nozzle 22 is moved parallel to the workpiece W and discharges the liquid resin R. Here, the control unit 11 controls the discharge unit 20 (the discharge drive unit 80), the vacuum unit 41, and the chamber drive unit 50A. The liquid resin R can be discharged (supplied) to the workpiece W over the entire surface of the workpiece W. However, in this embodiment, as shown in FIGS. 16 and 17 , the liquid resin R is discharged (supplied) to the center portion of the surface of the workpiece W (maximum supply area 90 ). conduct. For example, as shown in FIG. 16 , the liquid resin R can be supplied in a spiral shape or a plurality of concentric circles. In the resin supply device 10A, since the upper chamber portion 31 constituting the interior 30a of the chamber 30 is moved together with the nozzle 22, the liquid resin R can be supplied to the central portion of the surface of the workpiece W to prevent the chamber from being blocked. Enlargement of size. Furthermore, by preventing the chamber from being enlarged, the vacuuming time can be shortened. Furthermore, by supplying the liquid resin R in a spiral shape or a plurality of concentric circles, the height of the supplied liquid resin R can be reduced.

Specifically, the interior 30 a of the chamber 30 is continuously brought into a vacuum state by driving the vacuum part 41 . Next, as shown in FIG. 12 , the plunger 23 is lowered by driving the third motor 84 of the discharge part 20 , and the liquid resin R in the syringe 21 is discharged from the nozzle 22 . Next, as shown in FIG. 13 , the liquid resin R is ejected from the nozzle 22 while the upper chamber part 31 is moved parallel to the lower chamber part 32 by the chamber driving part 50A. Finally, as shown in FIG. 14 , by moving the nozzle 22 in parallel to the center of the workpiece W and discharging the liquid resin R, the liquid resin R can be supplied to the workpiece W in a spiral shape. At this time, the liquid resin R is discharged while measuring the weight of the liquid resin R with the weight meter 40 installed in the interior 30 a of the chamber 30 .

Of course, the liquid resin R may be supplied over the entire workpiece W in a spiral shape or the like, and the supply amount of the resin on the workpiece W may be made uniform. In this case, the bottomed cylindrical upper chamber part 31 as shown in the above figure may be formed into a flat plate shape, and the flat plate shaped lower chamber part 32 may be formed into a bottomed cylindrical shape. In a chamber constructed with such a structure, not only the same effects as the above-mentioned structure can be obtained, but also the moving area of the nozzle 22 can be enlarged, which is preferable since the chamber size does not become larger.

In addition, the shape of the liquid resin R supplied to the workpiece W can be provided in any shape other than the above-mentioned spiral shape or concentric circular shape. For example, the workpiece W can be provided with a multi-point shape, a grid shape, a shape in which a plurality of lines are arranged, or any shape such as a radial shape.

Furthermore, an imaging device for imaging the liquid resin R supplied on the workpiece W may be provided. In this case, for example, an imaging window made of a translucent material is provided in the upper chamber 31, and the liquid resin R supplied to the workpiece W is imaged using an imaging unit (camera) or an illumination unit. The shape is preferably such that the supply status can be confirmed.

Next, as described in the aforementioned embodiment with reference to FIGS. 5 and 6 , after stopping the discharge of the liquid resin R and stopping the vacuuming of the interior 30 a of the chamber 30 , the nozzle 22 is reciprocated in the interior 30 a of the chamber 30 . Thereby, the liquid resin R can be cut off in the interior 30a. By cutting off the fluid in the locked space (inside 30a), it is possible to prevent dust and the like from being drawn in.

Next, as shown in FIG. 15 , the chamber 30 is opened, and the workpiece W to which the liquid resin R is supplied is exposed to the atmosphere. Here, the control unit 11 controls the chamber driving unit 50A. Specifically, according to the driving of the first motor 54 of the chamber driving part 50A, the first slider 53 provided with the upper chamber part 31 gradually rises on the first rail 52, and the upper chamber part 31 and the lower chamber part 32 is separated and the chamber 30 is opened. Thereafter, the workpiece W to which the liquid resin R has been supplied is taken out and transported by a transport device (for example, a loader). (Embodiment 3)

The resin supply device 110 (writing dispenser) according to the embodiment of the present invention will be mainly described with reference to FIGS. 19 to 21 . 19 to 21 are diagrams for explaining the resin supply device 110 involved in the resin supply operation. This resin supply device 110 is provided with a supply part 120 (discharge part) and a chamber 130, and supplies the liquid resin R from the supply part 120 to the workpiece W (the object to be supplied) in the chamber 130 which is in a vacuum state ( coating). In this embodiment, it is assumed that the resin supply device 110 is in a three-dimensional (XYZ) orthogonal coordinate system. The up-and-down direction (vertical direction) shown in FIG. 19 and others corresponds to the direction parallel to the Z-axis, and the lateral direction (horizontal direction) direction) becomes a direction parallel to the X-axis and Y-axis.

In this embodiment, as the workpiece W, for example, a disc-shaped carrier 201 (for example, a semiconductor wafer) in which a plurality of wafer components 200 (for example, semiconductor wafers) are flip-chip bonded (bump-connected) in a matrix is used. To this end, the workpiece W has a narrow portion 202 (between the wafer part 200 and the carrier 201). In addition, in this embodiment, as the resin R, a liquid (including a molten state) thermosetting resin such as a silicone resin or an epoxy resin is suitable. The workpiece W to which such resin R is supplied is subjected to resin molding in a molding process called eWLB (Embedded Wafer Level Ballgrid-Array Package) using the molding die 191 (see FIG. 27 ). .

The resin supply device 110 constitutes the supply unit 120 and includes: a syringe 121 for storing the liquid resin R; a nozzle 122 (nozzle) provided at the front end of the syringe 121 for discharging the resin R; and a nozzle 122 inserted into the syringe 121 and pressed. Plunger 123 of resin R. The syringe 121 is housed in a syringe housing 125 (cartridge holder). Thereby, the syringe 121 can be easily exchanged. Moreover, the plunger 123 is movable up and down (reciprocating movement) in the Z-axis direction by the driving part 180 (Z-axis driving mechanism). Thereby, the resin R held down by the plunger 123 can be ejected from the nozzle 122 . In addition, the syringe housing 125 is movable up and down (reciprocating movement) in the Z-axis direction by the drive unit 170 (Z-axis drive mechanism). Thereby, the nozzle 122 can move in the Z-axis direction via the syringe housing 125 and the syringe 121, and can complete the liquid shutoff described later. In addition, as the driving parts 170 and 180, any moving structure such as a slider that moves on a track by a motor or an articulated robot using a link structure can be used.

Furthermore, the resin supply device 110 is provided with: a pinch valve 124 that is provided to pinch a nozzle 122 (nozzle) made of an elastic body to open and close the nozzle 122; and a valve that drives the pinch valve 124. The driving part 126 (for example driven by a cylinder). The pinch valve 124 is provided in the valve driving part 126 , and the valve driving part 126 is provided in the syringe housing 125 . In the resin supply device 110 , when the pinch valve 124 is open, the plunger 123 moves downward to cause the resin R in the syringe 121 to flow in the extrusion direction, so that the resin R is discharged from the nozzle 122 . On the other hand, when the downward movement of the plunger 123 stops, the pinch valve 124 closes and the discharge of the resin R from the nozzle 122 stops.

After the discharge is stopped, the liquid resin R is cut off to prevent the resin R from hanging from the nozzle 122 . The cutting of the liquid resin R means that the liquid resin R is discharged downward from the nozzle 122 and supplied to the workpiece W. The resin R is in a stretched state (drawing) due to its own weight without being separated from the nozzle 122. ) state), disconnected from the nozzle 122. In this embodiment, a method is assumed in which the nozzle 122 that has finished discharging the resin R moves up and down and repeatedly expands and contracts the distance from the workpiece W to disconnect from the nozzle 122 . By cutting off the fluid while the chamber 130 is closed, it is possible to prevent dust and the like from being drawn in. In addition, the method of cutting off the liquid is not limited to this, and may be a method of actually cutting off the tip of the nozzle 122 or a method of introducing air through a branched path connected to the nozzle 122 to cut off the liquid.

Moreover, the resin supply device 110 is provided with the chamber 130 (for example, made of steel) which has a pair of chamber parts 131 and 132 (one is a chamber cover 131, and the other is a chamber body 132). In the resin supply device 110, the liquid resin R is ejected and supplied to the workpiece W placed in the chamber 130 from the nozzle 122 provided on the chamber cover 131 side. In addition, the resin supply device 110 may be equipped with a temperature adjustment unit (for example, a heater or a cooler) to adjust the internal temperature of the chamber 130 in advance, and may also adjust the temperature of the supplied resin R.

The chamber cover 131 can reciprocate in the XYZ axis direction by the cover driving part 150 (XYZ axis driving mechanism). As the cover driving part 150, one corresponding to each of the driving parts 170 and 180 for one axis (Z axis) mentioned above and the three axes (XYZ axis) can be used. Thereby, the chamber 130 can be opened and closed by moving the chamber cover 131 up and down (approaching, away from) the chamber body 132 in the direction along the Z axis (vertical direction). In addition, as will be described later, the chamber cover 131 can be moved (horizontally moved) relative to the chamber body 132 when the chamber 130 is closed by the cover driving unit 150 . Accordingly, even if the chamber 130 is in a vacuum state, the chamber cover 131 and the nozzle 122 provided thereon can be moved. That is, the resin R can be supplied into the surface of the workpiece W at any discharge position in a vacuum state.

In addition, the resin supply device 110 is provided with an opening edge 132a (for example, a circular shape in a plan view, a rectangular shape in a plan view, or a polygonal shape in a plan view) provided in the chamber body 132 (for example, a container constituting a bottomed cylindrical body), and has an opening edge 132a. A sealing ring 133 (such as an O-ring) is used to seal between the chamber cover 131 and the chamber body 132 . Thereby, the chamber cover 131 and the chamber body 132 are in contact with each other via the sealing ring 133, and the chamber 130 is in a closed state (the inside is sealed). In addition, an adjustment member (for example, a plate or a sheet) may be provided under the sealing ring 133 for height adjustment of the sealing ring 133 .

The resin supply device 110 discharges the liquid resin R toward the workpiece W from the nozzle 122 in the chamber 130 which is in a vacuum state, and supplies the liquid resin R to the workpiece W. For this reason, in the resin supply device 110, the nozzle 122 is provided in the chamber 130. Specifically, the resin supply device 110 includes a holding portion 134 (recessed portion) and a seal ring 136 (O-ring). The holding part 134 is recessed from the surface 131a of the chamber cover 131 (the surface 131a on the side of the chamber body 132) to accommodate the nozzle 122 in the center of the chamber cover 131, and holds the syringe shell penetrating through the chamber cover 131. 125 is maintained. Moreover, the sealing ring 136 seals between the syringe housing 125 and the holding part 134 (chamber cover 131). Thereby, even if the syringe housing 125 is moved up and down by the driving unit 170 while the chamber 130 is closed, the inside of the chamber 130 can be brought into a sealed state.

Here, the sizes of the chamber cover 131 and the chamber body 132 will be described. In order to keep the chamber 130 in a closed state, the opening of the chamber body 132 (inside the opening edge 132 a ) is blocked (covered) by the chamber cover 131 . That is, in a plan view (top view), the size of the chamber cover 131 is larger than the opening of the chamber body 132 . Specifically, the chamber cover 131 is sized such that the chamber cover 131 can move horizontally with respect to the chamber body 132 while maintaining the closed state of the chamber 130 . In other words, the chamber cover 131 has a size that allows the nozzle 122 to move in a range covering the workpiece W from one end to the other end while maintaining a vacuum in the Y-axis direction and the X-axis direction. For this reason, as shown in FIG. 21 , when the position of the nozzle 122 reaches the outermost periphery of the workpiece W placed in the chamber body 132 , the chamber cover 131 is greatly exposed in the Y-axis direction and the X-axis direction.

Furthermore, the resin supply device 110 is provided with: a pressure regulating part 141 that regulates the internal pressure of the chamber 130; and a path 142 (for example, a hole penetrating the bottom of the chamber body 132) that leads into the chamber 130 and communicates with the pressure regulating part 141. . In the resin supply device 110, air is exhausted from the closed state (sealed state) of the chamber 130 by, for example, the pressure regulator 141 provided with a vacuum pump, and becomes a vacuum state (reduced pressure state). In this way, since the chamber 130 in a vacuum state in which the air is discharged can be formed, a defective situation in which air is contained in the resin R when the resin R is supplied to the workpiece W can be prevented.

Furthermore, the resin supply device 110 is provided with a load support 137 (for example, made of steel) that supports a load between the chamber cover 131 and the chamber body 132 . The load support 137 is arranged on the chamber body 132 along the circular sealing ring 133 to prevent the sealing ring 133 from being excessively crushed. As the load support 137 , for example, a plurality of load supports 137 may be provided on the chamber body 132 along the circular seal ring 133 . In this case, the chamber cover 131 is positioned at an arbitrary height on the chamber body 132 while supporting the atmospheric pressure applied to the chamber cover 131 by the plurality of load supports 137 . This prevents the sealing ring 133 from being excessively flattened, prevents friction caused by the contact between the chamber cover 131 and the chamber body 132, ensures sealing performance, and sets the chamber 130 in a vacuum state. In addition, since the chamber cover 131 is supported at multiple points by a plurality of load supports 137, the load can be distributed. In addition, since the plurality of load supports 137 are provided outside the sealing ring 133, that is, there are no plurality of load supports 137 in the chamber 130, the air in the chamber 130 becomes easy to remove. In addition, when the chamber 130 is open, the sealing ring 133 is higher than the load support 137 at a height from the chamber body 132 toward the chamber cover 131 . In other words, when the chamber 130 is open, the sealing ring 133 is disposed closer to the chamber cover 131 than the load support 137 . Accordingly, when the chamber 130 is closed, the chamber cover 131 can be brought into a state of being reliably contacted with the sealing ring 133, and the chamber 130 can be placed in a vacuum state while ensuring sealing performance.

The resin supply device 110 is configured such that the chamber cover 131 moves in the horizontal direction relative to the chamber body 132 (the syringe 121 relative to the workpiece W) when the chamber 130 is closed (the chamber structure is maintained). Specifically, ball rollers are used as load supports 137 . The ball roller system is composed of, for example, a freely rotating sphere and a sphere support (seat) that rotates and holds the freely rotating sphere in a partially protruded state (thereby contacting the chamber cover 131 ). Accordingly, in a state where atmospheric pressure is applied to the chamber cover 131 by placing the inside of the chamber 130 in a vacuum state, the load support structure is configured to rotate in the ball roller of the inching body, and for example Compared with the load support structure in the sliding method, the chamber cover 131 can be moved in the horizontal direction extremely smoothly.

Especially when the size of the workpiece W is large and the chamber body 132 also needs to be enlarged, the force exerted on the chamber cover 131 by the atmospheric pressure becomes larger, so the force exerted on the load support 137 also becomes larger. Therefore, by providing a number of load supports 137 corresponding to the force applied to the load supports 137, the force applied to each load support 137 is dispersed and reduced, so that the chamber cover 131 can be moved smoothly. In addition, as the load support 137, not only a rolling load support such as a ball roller column applied to the chamber cover 131, but also a sliding load support may be used. In addition, in order to ensure easy sliding of the sealing ring 133 and the load support 137 with respect to the chamber cover 131, lubricant may also be applied in advance between them.

Moreover, the resin supply device 110 is equipped with the weight gauge 140 provided in the chamber 130. In the resin supply device 110, a workpiece W is placed on a weight gauge 140, and the weight gauge 140 measures the weight of the workpiece W. In this weight meter 140, the weight of the resin R discharged to the workpiece W is measured with the workpiece W being placed. Accordingly, the resin R discharged and supplied to the workpiece W in the chamber 130 in a vacuum state can be measured in real time.

In addition, the resin supply device 110 is provided with: a pin 143 provided through the bottom of the chamber body 132 and moved up and down (reciprocating movement) in the Z-axis direction by the driving part 144 (see FIG. 25 ); and the pin 143 is connected to the chamber. The sealing ring 145 seals between the chamber bodies 132 (refer to Figure 25). This pin 143 is used to deliver the workpiece W to the conveying device. When receiving the workpiece W from the conveyor, the pin 143 moves upward so that the front end protrudes from the chamber body 132 (see FIG. 19 ). When the workpiece W is placed from the pin 143 toward the weight scale 140, the pin 143 moves downward and retreats toward the bottom side of the chamber body 132 (see FIG. 20).

Next, the operation method of the resin supply device 110 (resin supply method) will be described. The resin supply device 110 is provided with a control unit (not shown) including a CPU (Central Processing Unit) and a memory unit such as ROM and RAM. The CPU reads out various control programs recorded in the memory unit and executes them to control the operations of each part (mechanism) constituting the resin supply device 110 . The operations performed by each part become operations of the resin supply device 110 . In addition, when the resin supply device 110 is incorporated in a resin molding device, the resin supply device 110 may be controlled by a control unit of the resin molding device.

The resin supply device 110 shown in FIG. 19 is in a state before the workpiece W is supplied to the chamber 130. Here, the chamber 130 is open, the nozzle 122 of the syringe 121 is closed by the pinch valve 124, and the plunger 123 is waiting above. In this way, when the chamber 130 is opened, the workpiece W transported by, for example, a transport device or an operator is placed in the chamber 130 . In this embodiment, the transfer device delivers the workpiece W to the pin 143, and the pin 143 that receives the workpiece W moves downward, so that the workpiece W is placed on the weight scale 140 (see FIG. 20).

Next, as shown in FIG. 20 , with the chamber 130 closed, the air inside the chamber 130 is exhausted to establish a vacuum state. Specifically, first, the chamber cover 131 is gradually moved downward by the cover driving part 150, and the chamber cover 131 contacts the load support 137 while flattening the sealing ring 133, thereby closing the chamber 130. Next, the pressure in the chamber 130 is gradually reduced by the pressure regulator 141 to achieve a vacuum state of a predetermined pressure. Here, by supporting the chamber cover 131 with the load support 137, the sealing ring 133 can be prevented from being excessively crushed. In addition, by controlling the temperature adjustment unit (not shown) so that the internal temperature of the chamber 130 reaches a predetermined value before or in parallel with the operation of setting the vacuum state, the influence of heat on the supplied resin R can be suppressed. .

Next, supply of the resin R to the workpiece W starts in the chamber 130 which is in a vacuum state. Specifically, the pressure regulator 141 keeps the chamber 130 in a vacuum state. Then, the pinch valve 124 is driven by the valve driving part 126 to open the nozzle 122, and the plunger 123 is moved downward by the driving part 180 to discharge the resin R from the nozzle 122, so that the resin R can be supplied to the workpiece W. At this time, the resin R is supplied while measuring the weight of the workpiece W, that is, the weight of the resin R, in real time using the weight meter 140 .

Next, as shown in FIG. 21 , the resin R is ejected from the nozzle 122 while moving so that the nozzle 122 faces a predetermined position of the workpiece W. Specifically, the pressure regulator 141 keeps the chamber 130 in a vacuum state. Then, the chamber cover 131 is moved horizontally by the cover driving unit 150 and the nozzle 122 provided on the chamber cover 131 is moved, and the plunger 123 is further moved downward by the driving unit 180 to cause the resin R to flow from the nozzle 122 spit out. At this time, even if the nozzle 122 reaches the outermost periphery of the workpiece W, the moving range of the nozzle 122 is smaller than the inner diameter of the seal ring 133 so that the sealed state (vacuum state) is maintained by the seal ring 133 . Here, the resin R is gradually supplied (coated) so as to be applied to the narrow portion 202 of the workpiece W (between the wafer component 200 and the carrier 201 ).

In this way, the resin R can be supplied (coated) to the surface of the workpiece W in a predetermined coating pattern. As a coating pattern, as shown in FIG. 22 , for example, the entire surface of the workpiece W can be formed into a spiral shape or a grid shape. Here, FIG. 22 is a diagram illustrating a coating pattern of applying resin R to a disk-shaped workpiece W. FIG. 22A shows a vortex, and FIG. 22B shows a grid state. When supplying a predetermined amount of resin R, the chamber cover 131 provided with the nozzle 122 is moved while supplying the resin R to the entire surface of the workpiece W. This is compared with the method of supplying the resin R only to the center of the surface of the workpiece W, for example. When the resin R is compressed in the cavity C using the molding die 191 (see FIG. 27 ), the flow distance (heat application time) of the resin R can be made the same, thereby preventing the inclusion of air.

In addition, the coating pattern shown in FIG. 22B may be made such that the side surfaces of the wafer component 200 are covered with the resin R. Alternatively, the entire surface of the wafer component 200 may be coated in a grid pattern or the like regardless of whether the side surfaces of the wafer component 200 are covered with the resin R. Supply resin R. Here, when the coating pattern shown in FIG. 22B is used to cover the side surface of the wafer component 200 with the resin R, the resin R can be quickly injected into the narrow portion 202 using the atmospheric pressure in a process described later to perform underfilling (equivalent to so-called capillary underfill). Furthermore, when resin molding is performed in the mold, underfilling can be performed more reliably by properly exhausting the air in the narrow portion 202 and by compressing the mold (pressurization by the molding die 191 ). In addition, even if the resin R filling between the wafer components 200 is not supplied as shown in FIG. 22B , as long as the resin R can be supplied to the entire circumference of the wafer component 200 , the line width of the resin R shown in FIG. 22B ( The resin R is supplied in such a way that the width between wafers) and the line width are narrow.

In addition, there are many considerations regarding the coating pattern of resin R. FIG. 23 is a diagram illustrating a coating pattern of resin R (including the discharge path of the nozzle 122 facing the workpiece W) for a workpiece W having a panel shape (rectangular shape) with a narrow portion on which a chip component (not shown) is mounted. picture. FIG. 23A shows a state in which the resin R is applied to the central portion of the workpiece W in a dot-like manner (center point). Even with such a simple coating method, for example, after the resin R is supplied under a vacuum atmosphere, the workpiece W is placed in an atmospheric environment, and the pressure difference can cause the resin R to be injected into the narrow portion. It can also shorten the coating time. FIG. 23B shows a state in which the resin R is applied in multiple spots on the surface of the workpiece W. In this state, the air can be easily discharged compared with the center point, and when the resin R is compressed in the cavity C, the distance over which the resin R flows can be made approximately the same.

FIG. 23C shows a state in which the resin R is applied to the surface of the workpiece W in a large vortex shape of approximately the size of a mold cavity. In this state, the vortex shape makes it easy to discharge the air, and by coating to the mold cavity size, when the resin R is compressed in the mold cavity C, the distance over which the resin R flows can be made equal. FIG. 23D shows a state in which, for example, the height of the resin R is lowered to be lower than the center point (FIG. 23A) (lowering of the center point), and a small swirl-like coating is performed on a small movable area. In this state, the air can be easily discharged by slowing down the timing of contact of the resin R with the mold surface to lengthen the time during which the air can be discharged during the mold closing operation. In addition, it is also conceivable that when the resin R is applied from one point, the resin R applied in a linear shape is stacked unevenly due to the high viscosity, making it difficult to apply the resin R in a uniform shape. However, it is also possible to use a small Apply in a swirl shape to form an appropriate circular shape. In addition, it is possible to prevent the resin R at a high position from being compressed and moving to a low position, causing problems such as air inclusion.

FIG. 23E shows a state in which the spiral coating is applied in a angular manner according to the corners of the rectangular workpiece W. In this state, the air can be easily discharged in a vortex shape according to the shape of the workpiece W. Figure 23F shows a state in which a rectangular workpiece is coated in a grid shape in one stroke. In this state, the resin R can be applied in a uniform width according to the shape of the workpiece W. 23G shows a state in which the resin R is applied radially on the surface of the workpiece W from the central portion toward the outer peripheral portion (the dotted line indicates a path without discharge from the nozzle 122). In this state, when the resin R is compressed in the mold cavity, air can be discharged from the central part toward the outer peripheral part.

In addition, various coating patterns for coating the wafer component 200 with the resin R can be considered. FIG. 24 is a diagram illustrating a coating pattern in which the resin R is applied to the main part of the workpiece W (the wafer component 200 ). FIG. 24A shows a state in which the resin R is applied in one stroke over the entire wafer component 200 . FIG. 24B shows a state in which only the outer periphery of the adjacent wafer components 200 is coated with the resin R in one stroke without covering the space between the adjacent wafer components 200 . FIG. 24C shows a state in which resin R is applied to cover the space between adjacent wafer components 200 (part of the resin R is located on the wafer components 200 ). As shown in FIG. 24 , by making the coating pattern into a ring shape, the resin R becomes easier to be injected into the narrow portion 202 located inside.

After the predetermined amount of resin R is supplied in this way (that is, after the coating pattern is completed), the discharge of the resin R from the nozzle 122 is stopped. Specifically, the downward movement of the plunger 123 by the driving unit 180 is stopped, and the nozzle 122 is closed by the pinch valve 124 to stop the discharge of the resin R. In addition, the plunger 123 may be pulled back to assist in stopping the discharge of the resin R.

Then, the exhaust of air from the chamber 130 is stopped. Specifically, the vacuum state of the chamber 130 at a predetermined pressure is released by stopping the exhaust of air using the pressure regulator 141 . By stopping the pressure regulator 141, the inside of the chamber 130 is pressurized from the predetermined pressure in the vacuum state. With this, for example, when there is a narrow portion 202 (a space to be filled with the resin R) below the resin R supplied to the workpiece W, the depressurized narrow portion 202 is injected through the surroundings so as to be underfilled. Resin R after pressurization by ambient gas pressure.

Next, the nozzle 122 is moved up and down (raised and lowered) in the closed chamber 130 . Specifically, in a state where the chamber cover 131 is not moved and the chamber 130 is closed, the driving part 170 moves the nozzle 122 up and down through the syringe housing 125 (syringe 121). In this way, the liquid shutoff operation is performed by repeating the up and down movement of the nozzle 122 a predetermined number of times. In this embodiment, the fluid shutoff (up and down movement of the nozzle 122) is performed while the chamber 130 is closed and the inside is maintained.

Next, the chamber 130 is set to an open state. Specifically, by gradually moving the chamber lid 131 upward using the lid driving part 150, the chamber lid 131 is gradually separated from the chamber body 132 (the load support 137 and the sealing ring 133) and the chamber 130 becomes an open state (see Figure 19). Therefore, the resin R is injected (filled) into the narrow portion 202 by being open to the atmosphere and applying atmospheric pressure from the periphery of the resin R. As in this embodiment, when the chip component 200 is mounted on the carrier 201 as the workpiece W by flip-chip bonding, the resin R can be injected and filled between the plurality of bumps connecting the chip component 200 and the carrier 201. The inclusion of air (the area without resin R in the narrow portion 202) can be suppressed. In addition, even if the wafer component 200 is mounted on the workpiece W on the carrier 201 in a manner other than flip-chip bonding, even if there is accumulation in the corner space formed by the side surface of the wafer component 200 and the main surface of the carrier 201 In the case of air, resin R can also be filled.

In addition, after closing the chamber 130 again to bring the inside of the chamber 130 into a vacuum state (decompression), the process of opening the chamber 130 to the atmosphere (pressurization) may be repeated. Accordingly, the resin R can be injected into the narrow portion 202 more reliably. In addition, if the pressure regulator 141 is equipped with a pressurizing device such as a compressor, the chamber 130 can be pressurized even when the chamber 130 is closed, and the ambient air can be pressurized toward the narrow portion while eliminating the contained air. 202 injects resin R more reliably.

Thereafter, with the chamber 130 open, the workpiece W (to which the resin R is supplied) is taken out, for example, by a conveying device. At this time, the workpiece W placed on the weight scale 140 is supported (ejected) by the upwardly moving pin 143 and delivered to the conveying device. Thereafter, the workpiece W to which the resin R has been supplied is transported toward, for example, the molding die 191 (see FIG. 27 ) and placed therein. Next, the resin R is compressed in the cavity C formed by the molding die 191 so that the resin R is thermally hardened. By this compression, the resin R is pressurized and injected into the narrow portion 202, thereby enabling more reliable underfilling. In this way, since the above-described resin supply method is used to prevent defects such as air inclusion, a molded product can be manufactured in which defects such as lack of filling in the narrow portion 202 are suppressed. (Embodiment 4)

The resin supply device 110A according to the embodiment of the present invention will be mainly described with reference to FIGS. 25 and 26 . 25 and 26 are diagrams for explaining the resin supply device 110A involved in the resin supply operation. This embodiment is different from the above-mentioned Embodiment 3 in that the chamber cover 131 can be reduced in size and the device can be miniaturized, so the following description will focus on this point. In addition, the resin supply device 110A also uses the pressure regulator 141 (see FIG. 19 ) to bring the inside of the chamber 130 into a vacuum state like the above-mentioned Embodiment 3. However, the pressure regulator 141 is omitted in FIGS. 25 and 26 . For ease of explanation, hatching is attached to some parts.

The resin supply device 110A is provided with: a cover driving part 150A (XZ-axis driving mechanism or YZ-axis driving mechanism) that moves the chamber lid 131; a placement table 151 provided in the chamber 130 for placing the workpiece W; and a placement table 151 that moves the chamber cover 131. The stage drive unit 152 (rotation drive mechanism) rotates by 151 degrees. As the cover drive unit 150A, a drive unit 170 and 180 for the aforementioned one-axis (Z-axis) and two axes (XZ-axis or YZ-axis) can be used, which can move the chamber cover 131 (nozzle 122) in the horizontal direction. (X-axis or Y-axis direction) and vertical direction (Z-axis direction) movement. In addition, as the table driving part 152, the rotating shaft 153 attached to the setting table 151 can be rotated and driven by the motor 155 through the belt 154, so that the setting table 151 can be moved in the rotation direction (horizontal direction). In addition, since the rotating shaft 153 is provided through the bottom of the chamber body 132, the resin supply device 110A is provided with a sealing ring 157 that seals between the rotating shaft 153 and the chamber body 132.

Accordingly, even if the chamber 130 is in a vacuum state, the chamber cover 131 and the nozzle 122 provided thereon can move relative to the workpiece W. That is, the resin R can be supplied into the surface of the workpiece W at any discharge position. Furthermore, by providing the mounting table 151 that rotates as the workpiece mounting side, the movement range (movable range) of the chamber cover 131 provided with the nozzle 122 as the resin supply side can be narrowed. Specifically, while the horizontal movement range of the chamber cover 131 is the X-axis direction and the Y-axis direction in the third embodiment, in the present embodiment, it is any one of the Y-axis direction and the X-axis direction. The distance of the radius component is sufficient. That is, by rotating the workpiece W from the center to one end of the workpiece W in parallel with the movement of the moving nozzle 122 , the resin R can be applied to the entire workpiece W in a spiral shape. In addition, in such a structure, by combining the forward and backward motion of the nozzle 122 with the rotation of the workpiece W, it is possible to apply arbitrary linear or curved radial coating on the workpiece W. Therefore, in this embodiment, the chamber cover 131 can be made smaller than in the third embodiment. In addition, since the chamber cover 131 is reduced in size, the overall footprint of the resin supply device 110A can be reduced (space saving).

Furthermore, the resin supply device 110A is provided on the setting table 151 and includes a chuck 156 that is fixed to sandwich the workpiece W, for example. Therefore, the resin R discharged from the nozzle 122 to the workpiece W has adhesiveness. Even if the rotation of the workpiece W is hindered by the resin R, the workpiece W can be stably rotated in conjunction with the rotation of the mounting table 151 .

Furthermore, the resin supply device 110A is provided with a weight scale 160 that is provided outside the chamber 130 and holds the workpiece W via a pin 161 that penetrates the chamber body 132 , and a pin 161 that is provided to stand upright on the weight scale 160 . The weight scale 160 and the pin 161 can move up and down (reciprocate) in the Z-axis direction by the driving part 163 (Z-axis driving mechanism). According to this, the amount of resin supplied to the workpiece W can be measured without the weight meter 140 being installed in the chamber 130 as in the third embodiment. Therefore, the capacity of the chamber 130 can be reduced. In addition, because the weight gauge 160 is installed outside the chamber 130, measurement can be performed without waiting until the chamber 130 reaches a vacuum state and reaches a stable state where measurement is possible. From this point of view, in the aforementioned third embodiment, the weight meter 140 that can measure even in a vacuum state is used, but this will increase the price. Therefore, in the present embodiment, the low-price weight meter 160 can be used to reduce the load of the resin supply device 110A. Manufacturing costs. In addition, since the capacity of the chamber 130 is reduced, for example, the load applied to the vacuum pump serving as the pressure regulator 141 can be suppressed.

Moreover, the resin supply device 110A is provided with the shutter 162 which closes the hole 132b of the chamber body 132 penetrated by the pin 161 in the state in which the pin 161 is retracted toward the outside of the chamber 130. As the shutter 162, for example, a structure that can be slid by a driving part (not shown) can be used. By plugging (sealing) the hole 132b with the shutter 162 when the chamber 130 is closed, the inside of the chamber 130 can be placed in a sealed state.

The gate 162 has a hole 162a through which the pin 161 passes, and a hole 162b through which the rotation shaft 153 passes. The shutter 162 moves (exists) so that the hole 132b and the hole 162a are connected when the weight of the workpiece W is measured. Moreover, the shutter 162 moves (exists) between the state in which the workpiece W is measured and the state in which the resin R is supplied, but the hole 162a is formed in a size such that the rotation shaft 153 does not come into contact with the shutter 162 during this period.

When supplying the resin, it may be considered that the pin 161 can remain in the chamber 130 even if the pin 161 is not retracted outside the chamber 130 . In this case, since the inside of the chamber 130 is in a sealed state, there is no need to provide a sealing ring in advance in the hole 132b to seal between the chamber body 132 and the pin 161. Therefore, there is a risk that measurement using the weight gauge 160 with the pin 161 interposed therebetween may not be accurate. In this regard, in this embodiment, the shutter 162 is provided for sealing the hole 132b instead of using a sealing ring. Accordingly, even if the weight meter 160 is installed outside the chamber 130, the weight can be accurately measured. In addition, since the diameters of the holes 132b and 162a are larger than the diameter of the pin 161, the weight of the workpiece W is measured with the weight meter 160 through the pin 161 when the pin 161 is not in contact with the chamber body 132.

Next, the operation method (resin supply method) of the resin supply device 110A will be described. In addition, the steps that are the same as those in the above-mentioned Embodiment 3 are briefly described.

First, as shown in FIG. 25 , after measuring the weight of the workpiece W before the resin R is supplied, the workpiece W is placed on the placement table 151 . Specifically, when the chamber 130 is opened, the weight scale 160 and the pin 161 are moved upward in advance by the driving part 163 so that the front end of the pin 161 is positioned higher than the mounting table 151 . In this state, for example, the workpiece W transported by a transport device or an operator is placed on the pin 161 , and the weight of the workpiece W before the resin R is supplied is measured with the weight meter 160 . Next, the driving part 163 moves the weight scale 160 and the pin 161 downward, and after the workpiece W is delivered from the pin 161 to the setting table 151, the workpiece W is fixed by the chuck 156 and placed on the setting table 151.

Next, after the pin 161 is retracted from the chamber body 132, the shutter 162 is slid to close the hole 132b penetrated by the pin 161 (the shutter 162 is in a closed state). Thereafter, with the chamber 130 closed, the air in the chamber 130 is started to be discharged through the pressure regulator 141 to bring it into a vacuum state (reduced pressure state).

Next, as shown in FIG. 26 , in the chamber 130 set to a vacuum state, the resin R is ejected from the nozzle 122 while moving the nozzle 122 relative to the workpiece W. Specifically, the pressure regulator 141 keeps the chamber 130 in a vacuum state. Then, the mounting table 151 is rotated (horizontally moved) by the table driving unit 152 and the workpiece W mounted on the mounting table 151 is moved, and the chamber cover 131 is horizontally moved by the cover driving unit 150A to be installed in the chamber. The nozzle 122 of the cover 131 moves. At this time, unlike the above-mentioned Embodiment 3, the chamber cover 131 moves horizontally in either the Y-axis direction or the X-axis direction. The pinch valve 124 is driven by the valve driving part 126 to open the nozzle 122, and the plunger 123 is moved downward by the driving part 180, so that the resin R is discharged from the nozzle 122 to the workpiece W and supplied. The resin R can be supplied (coated) to the surface of the workpiece W in a predetermined coating pattern such as a spiral or radial coating pattern described in the third embodiment.

Then, the exhaust of air from the chamber 130 is stopped. Specifically, the vacuum state of the chamber 130 at a predetermined pressure is released by stopping the discharge of air by the pressure regulator 141 . Therefore, the resin R pressurized by the pressure of the ambient gas is injected into the depressurized narrow portion 202 . The nozzle 122 is moved up and down a predetermined number of times to cut off the fluid.

Next, the supply amount of resin R is measured in the closed chamber 130 . Specifically, the shutter 162 is slid to connect the hole 132b and the hole 162a (the shutter 162 is in an open state). Thereby, the chamber 130 is opened to the atmosphere, and the injection (filling) of the resin R into the narrow portion 202 is promoted. Then, the pin 161 can enter the chamber 130 . Next, the weight scale 160 and the pin 161 are moved upward by the driving part 163, and the workpiece W is lifted up by the pin 161 penetrating the chamber body 132. Thereby, the weight of the workpiece W is measured with the weight meter 160, and the supply amount of the resin R can be measured by comparing it with the weight before the resin is supplied. In addition, if the resin supply amount does not reach the predetermined amount, the workpiece W is placed on the mounting table 151 and the resin R is supplied again in the vacuum chamber 130 .

After the predetermined amount of resin R is supplied, the chamber 130 is set to an open state. Specifically, the chamber cover 131 is moved upward by the cover driving unit 150A, so that the chamber cover 131 is separated from the chamber body 132 and the chamber 130 is in an open state. Thereafter, the workpiece W (to which the resin R is supplied) is taken out, for example, by a conveying device, and is conveyed, for example, to the molding die 191 (see FIG. 27 ). At this time, after the chuck 156 is released, the workpiece W placed on the setting table 151 is supported (ejected) by the upwardly moving pin 143 and delivered to the conveying device. Then, the workpiece W to which the resin R has been supplied is placed toward the molding die 191, and the resin R is thermally hardened in the cavity C of the molding die 191. Since the above-mentioned resin supply method is used to prevent defects such as air inclusion, it is possible to produce a molded product in which molding defects such as lack of filling in the narrow portion 202 are suppressed. (Embodiment 5)

First, the resin molding device 190 according to the embodiment of the present invention will be described mainly with reference to FIG. 27 and FIG. 37 . Fig. 27 is a diagram (cross-sectional view) for explaining the resin molding method (resin molding device 190). Fig. 37 is a diagram (schematic configuration diagram) for explaining the resin molding device 190. In addition, the structure of such a resin molding device 190 can also be made to have the same structure in other embodiments, and a resin molding device as an automatic machine can be constructed.

The resin molding apparatus 190 is an automatic machine and includes a supply part 197, a press part 198, a storage part 199, and a transfer device 204 (transfer part) that transfers the workpiece W or the resin R therebetween. The supply part 197 is equipped with the resin supply device 110 mentioned above, and prepares to supply the workpiece W or the resin R to the press part 198, etc. Furthermore, the press section 198 is provided with a molding die 191 having a cavity C, and the resin R is thermally cured in the cavity C. This forming mold 191 is provided with a pair of molds (one is an upper mold 192 and the other is a lower mold 193) that can be opened and closed by a known press mechanism. The workpiece W is placed on the lower mold 193, and the workpiece W is placed on the upper mold 192. A cavity C (recessed portion) is provided to perform "upper cavity molding". Alternatively, the workpiece W may be placed on the upper mold 192 and a cavity C (recessed portion) may be provided on the lower mold 193 to perform "lower cavity molding". In addition, the storage unit 199 prepares and stores the resin-molded workpiece W (molded product). In addition, the resin molding apparatus 190 is provided with the control part 205 which controls each part. This control part 205 also serves as the control part of the resin supply apparatus 110 and 110A, but may be used separately.

In addition, as another structure of the automatic resin molding apparatus 190, it may be provided with a supply part 197 capable of accommodating the workpiece W, a supply part for the resin R including the aforementioned resin supply device 110, and a press part 198 and The structure of the conveying device 204 (conveying part) which conveys the workpiece W or the resin R among these. The supply unit 197 prepares to supply the workpiece W to the press unit 198 and accommodates the formed workpiece W. In addition, the resin R supply unit can arbitrarily supply the resin R to the workpiece W or the release sheet.

The forming mold 191 is provided with a cavity material 194 (first mold block) for forming a cavity C (recessed portion) and a clamper 195 (second mold block) surrounding the cavity C (recessed portion). In the forming mold 191, since the upper mold 192 is provided with a cavity C, the bottom of the cavity C is formed by the lower surface of the cavity member 194, and the side portions of the cavity C are formed by the inner wall surface of the holder 195. Furthermore, the molding die 191 is provided with a seal ring 196 (for example, an O-ring) that seals between the upper mold 192 and the lower mold 193 (inside the mold). In addition, although not shown in the figure, the resin molding apparatus 190 includes a pressure regulator (for example, a vacuum pump) that regulates the internal pressure of the mold 191 or a temperature regulator (for example, a heater) that regulates the internal temperature (molding temperature).

Next, the resin molding method (the operation method of the resin molding device 190) will be described. First, the resin R is supplied to the workpiece W using, for example, the aforementioned resin supply device 110 ( FIG. 27A ). Next, the workpiece W to which the resin R has been supplied is carried from the resin supply device 110 to the molding mold 191 in the opened state using the transfer device 204, and the workpiece W is placed in the molding mold with the wafer component 200 facing the cavity C side. 191 (the upper surface of the lower mold 193) (Fig. 27B).

Next, the forming mold 191 is gradually closed, and the mold cavity C is brought into a reduced pressure (vacuum) state (Fig. 27C). Specifically, the lower mold 193 is gradually brought closer to the upper mold 192 through the press mechanism. Therefore, the sealing ring 196 provided on the lower mold 193 contacts the holder 195 of the upper mold 192, so that the wafer component 200 and the resin R on the workpiece W (carrier 201) are accommodated in the mold cavity C. At this time, the inside of the mold can be brought into a depressurized state by discharging air through a pressure regulator (not shown).

Next, the molding die 191 is further closed, and the workpiece W (carrier 201) is clamped (FIG. 27D) between the upper mold 192 and the lower mold 193, and compression molding is performed (FIG. 27E). At this time, since the molding die 191 is heated to the molding temperature by the temperature regulator (not shown), the resin R is thermally hardened (heated and hardened) in the cavity C. The resin R is compressed (pressurized) and injected into the narrow portion 202. However, since the resin supply method described above is used to prevent defects such as inclusion of air, molding defects such as lack of filling in the narrow portion 202 are suppressed. Product(workpiece W). Thereafter, the molding die 191 is brought into the mold open state, and the workpiece W (molded product) is taken out from the molding die 191 using the transfer device 204 and carried out to the accommodating part 199 .

In this embodiment, the aforementioned resin supply method is used to prevent air from being mixed between the workpiece W and the resin R before resin molding. Therefore, the occurrence of voids due to air mixing in the resin molded portion of the workpiece W (molded article) can be suppressed. In addition, in the workpiece W, the mixing of air is also suppressed in the narrow portion 202, so the occurrence of voids is suppressed and underfilling is performed. (Embodiment 6)

First, the resin molding apparatus 190A according to the embodiment of the present invention will be described mainly with reference to FIG. 28 . FIG. 28 is a diagram (cross-sectional view) for explaining the resin molding method (resin molding device 190A). In addition, the schematic structure of the resin molding apparatus 190A is the same as the resin molding apparatus 190 mentioned above (FIG. 37).

The molding mold 191A included in the resin molding apparatus 190A is provided with a pair of molds (one is an upper mold 192 and the other is a lower mold 193) that can be opened and closed by a known press mechanism. The upper mold 192 is equipped with a workpiece. W. The lower mold 193 is provided with a cavity C (recessed portion) to perform "lower cavity molding". This embodiment is different from the aforementioned Embodiment 5 in that "lower cavity molding" is performed and that two different types of resins R and Ra are used for molding. Therefore, the following description will focus on this point.

Next, the resin molding method (the operation method of the resin molding device 190A) will be described. First, the resin R is supplied to the workpiece W using, for example, the aforementioned resin supply device 110 (Fig. 28A). Furthermore, according to the resin supply device 110, the resin R pressurized by the pressure of the ambient air can be injected into the depressurized narrow portion 202 (FIG. 28B). Here, molding can also be completed by filling the narrow portion 202 of the workpiece W with the resin R to seal the connection portion between the chip component 200 and the carrier 201 .

However, in the case where the outer periphery of the chip component 200 is also sealed with resin and integrated to maintain mechanical strength, and it is preferable that the outer periphery of the chip component 200 is also sealed with resin, the following process is performed. Specifically, the workpiece W to which the resin R has been supplied is transported from the resin supply device 110 to the molding die 191A in the open state by the transport device 204, and the workpiece W is placed in the molding die 191A with the wafer component 200 facing the cavity C side. (Underside of the upper mold 192) (Fig. 28C). This workpiece W is suctioned and held on the lower surface of the upper mold 192 by a suction device through a path (hole) opened on the lower surface of the upper mold 192, for example. Furthermore, a resin Ra different from the resin R supplied to the workpiece W is supplied into the cavity C. Here, the other resin Ra refers to one supplied in a process different from the process using the resin supply device 110, and the material may be the same or different. In addition, the resin R in the resin supply device 110 is in liquid form, but the resin Ra may be in liquid form, granular form, powder form, or flake form. In addition, the resin Ra can be transported by an appropriate transport device 204. For example, the resin Ra can be supplied into the mold cavity C with the resin Ra mounted on a release sheet that covers the mold surface and prevents contact between the mold surface and the resin Ra.

Next, the forming mold 191A is gradually closed, and the mold cavity C is brought into a reduced pressure (vacuum) state (Fig. 28D). Thereby, the sealing ring 196 provided in the upper mold 192 comes into contact with the holder 195 of the lower mold 193, and the wafer component 200 and the resins R and Ra are accommodated in the mold cavity C.

Next, the molding die 191A is further gradually closed, and the workpiece W (carrier 201 ) is sandwiched between the upper mold 192 and the lower mold 193 to perform compression molding ( FIG. 28E ). At this time, since the molding die 191A is heated to the molding temperature by the temperature regulator (not shown), the resins R and Ra are thermally hardened (heated and hardened) in the cavity C. However, since the above-mentioned resin supply method is used to prevent defects such as inclusion of air, the narrow portion 202 is not filled with a defective molded product (workpiece W). Furthermore, for example, the molded product can be formed using a resin R suitable for filling the narrow portion 202 and a resin Ra which is excellent in heat dissipation properties, shielding properties, etc. and suitable for sealing the wafer component 200 . Thereafter, the molding die 191A is brought into the mold open state, and the workpiece W (molded product) is taken out from the molding die 191A using the transfer device 204 and carried out to the storage part 199 . (Embodiment 7)

The resin molding method according to the embodiment of the present invention will be mainly described with reference to FIGS. 29 to 32 . 29 to 32 are diagrams (perspective views) for explaining the resin molding method. In this embodiment, for example, to supply the resin R to the workpiece W, the aforementioned resin supply devices 110 and 110A can be used, and to perform resin molding, the aforementioned resin molding devices 190 and 190A can be used. However, in resin molding, " The resin molding device 190 of "upper cavity molding" is preferred.

First, the workpiece W (object to be supplied) before the resin R is supplied is prepared (Fig. 29). As the workpiece W, a plurality of wafer parts 200 (for example, semiconductor wafers, etc.) are used, which are disk-shaped carriers 201 (for example, semiconductor wafers, wiring layers, etc., formed on a glass plate) that are flip-chip bonded (bump-connected) in a matrix. ).

Next, the resin R is supplied to the workpiece W using, for example, the resin supply device 110 (Fig. 30). Here, the liquid resin R is applied and supplied in a spiral shape to the entire surface of the workpiece W (carrier 201) with a gap, so that the wafer component 200 on the workpiece W is not covered with the resin R.

Next, after the workpiece W to which the resin R has been supplied is placed toward the opened molding die 191, the molding die 191 is closed and the seal ring 196 is brought into contact with the holder 195 to further clamp the workpiece W. At this time, the pressure inside the mold including the closed mold cavity C is reduced. In this way, by depressurizing the ambient air and expelling the air between the chip component 200 and the carrier 201 (the narrow portion 202 shown in FIG. 19 ), the generation of voids in the resin R after underfilling can be prevented. In addition, in order to improve the air discharge effect, it is preferable to supply the resin R to the workpiece W at a height such that the resin R does not come into contact with the lower surface of the cavity member 194 when the seal ring 196 comes into contact (Fig. 27C).

Next, the liquid resin R is compressed by further closing the mold (Fig. 31), so that the resin R filled in the mold cavity C is hardened and formed (Fig. 32). The liquid resin R applied in a spiral shape (plural lines) is expanded by the molding die 191 and flows only to the extent of the distance between adjacent linear resins R, and is accumulated in the center of the workpiece W to shorten the coating time, for example. Compared with the case where the resin R supplied at one point flows to the outer periphery, the flow distance of the resin R can be reduced. This can suppress the occurrence of problems such as wafer deflection due to resin flow of the resin that flows while curing due to the cross-linking reaction. In addition, flow marks caused by resin flow can also be reduced. In addition, when the distance is long, hardening of the resin R due to heat during flow can be prevented, thereby improving the underfilling properties around the outer circumference of the workpiece W.

When the resin R is applied only in a spiral shape and supplied to the workpiece W, when the resin R is gradually compressed with the molding die 191, the adjacent linear resin R will merge with each other, so the pressure reduction may not be sufficient. There is a risk of air being included in the confluence. Therefore, for example, by creating a coating pattern in which a predetermined portion of the workpiece W has a portion where air can flow out as shown in FIGS. 33 to 36 , when the resin R is gradually compressed with the molding die 191 , the air can be fully discharged, thereby preventing Poor forming. In addition, when the resin supply devices 110 and 110A are used to supply the resin R to the workpiece W, a coating method of the resin R that can prevent problems such as air inclusion in the resin R even if the inside of the chamber 130 is not put into a vacuum state will be described.

FIG. 33 shows the state of the workpiece W after the fine resin R is supplied to a part of the spiral shape (predetermined position 203). Here, when the liquid resin R is supplied in a spiral shape, the resin is lowered on the surface of the workpiece W in a predetermined direction (predetermined position 203) such as the cross direction, the 6-direction, and the 8-direction shown in FIG. 33, or at arbitrary intervals. The height of R, or reduce the resin R. As such a resin supply method, for example, by increasing the moving speed of the nozzle 122, the coating amount at this position can be reduced compared to other positions. As another method, the amount of resin R applied from the nozzle 122 can be reduced. For example, a method of lowering the opening of the nozzle 122 (pinch the nozzle 122) or a method of slowing down the operating speed of the plunger 123 can be considered. Thereby, when the resin R is compressed by the molding die 191, since the air can pass through the predetermined position 203, the air can be discharged smoothly, and the generation of voids can be prevented.

FIG. 34 shows the state of the workpiece W after the resin R is intermittently supplied in a spiral shape. Here, in order to provide a space through which air can flow, a multi-point coating method is essentially used. In this case, the nozzle 122 that is moving in a swirling coating pattern is configured to repeatedly eject the resin R when approaching the workpiece W and to disconnect the ejected resin R when moving away from the workpiece W. Therefore, by moving to the next discharge point before coating is completely completed, the movement to the next discharge point can be performed immediately. Thereby, when the resin R reaches the discharge point and approaches the workpiece W, the resin R can be repeatedly discharged at a high speed, so the resin R can be supplied at a high speed. In addition, since air can flow between the points where the resin R is coated, the occurrence of voids can be prevented. In addition, since the resin R is discharged little by little from the nozzle 122, the entire workpiece W can be coated with the resin R until a predetermined supply amount is reached. According to this, for example, since it is possible to complete coating in which the lines of vortices are arranged at a high density, reducing the flow amount of the resin R can also reduce flow marks.

FIG. 35 shows the state of the workpiece W after the resin R is intermittently supplied linearly. Here, the method described with reference to FIG. 34 is used to create a linear coating pattern that allows for substantial multi-point coating by providing a space that allows air to flow. In addition, by supplying the resin R in a linear shape, it is also applicable to the case of supplying between wafers. For example, it is also applicable to the case of coating between a plurality of wafers that are finally cut as one package area as shown in FIG. 24B.

FIG. 36 shows the state of the workpiece W after the resin R is supplied between the wafer components 200 at multiple points. Here, the method described with reference to FIG. 34 is used, for example, by applying resin R between four adjacent wafer parts 200. When compressing the resin R with the mold 191, air flow can be ensured and the resin R can be placed in the mold cavity. C is easy to fill. (Embodiment 8)

The resin placement device 310 and the resin molding device 350 provided with the resin placement device 310 according to the embodiment of the present invention will be described with reference to FIGS. 38 to 46 . 38 to 42 are diagrams for explaining the resin placement device 310 in operation. 43 to 46 are diagrams for explaining the main parts of the resin molding device 350 in operation. In this embodiment, the workpiece W is used as the object to be supplied with the resin R.

First, the structure of the resin placement device 310 will be described. The resin placement device 310 is equipped with a chamber 311 in which the resin R and the workpiece W (to-be-supplied object) are placed, as shown in FIG. 38 and others. The chamber 311 includes a pair of chamber parts (one is an upper chamber part 312 and the other is a lower chamber part 313) and is configured to be openable and closable. The workpiece W is placed on the surface 313a (seating surface) of the lower chamber part 313.

This resin placement device 310 controls the lifting part through a control part not shown in the figure. This control unit is a computer composed of a CPU (central processing unit), a memory unit such as ROM and RAM, and the CPU reads out various control programs recorded in the memory unit and executes them to control the resin placement device 310 The actions of the constituent elements of each part. In addition, in this embodiment, the resin molding device 350 including the resin placement device 310 is described as having a control unit, but the resin placement device 310 may have a separate control unit.

The upper chamber part 312 and the lower chamber part 313 are made of materials that can withstand any pressure state in the chamber 311, such as metal. When the chamber 311 is in a closed state, the upper chamber part 312 having a recess comes into contact with the lower chamber part 313, thereby forming the interior 311a of the chamber 311 (in a closed state) (see FIG. 39). Although not shown in the figure, a suitable sealing mechanism may be provided between the upper chamber part 312 and the lower chamber part 313.

Furthermore, the resin placement device 310 is provided with a decompression part 314 (for example, a vacuum pump) that sucks air into the interior 311a of the chamber 311 to create a decompressed state. In a state where the interior 311a of the chamber 311 is formed, the decompression part 314 sucks air into the interior 311a through the air path 315 provided in the upper chamber part 312 to create a decompressed state. In addition, the pressure reducing part 314 is controlled by the control part.

Moreover, the resin placement device 310 is provided with the heating part 316 which heats the chamber 311. A plurality of heating parts 316 (for example, cartridge heaters) are provided so as to extend in parallel with the surface 313 a of the lower chamber part 313 . Moreover, the resin placement device 310 is provided with the cooling part 317 which cools the chamber 311. A plurality of cooling parts 317 (for example, cooling pipes through which refrigerant circulates) are provided to extend parallel to the surface 313 a of the lower chamber part 313 . Thereby, the resin R of the workpiece W placed on the surface 313a can be heated or cooled. In addition, the heating part 316 and the cooling part 317 are controlled by the control part. In addition, the heating part 316 and the cooling part 317 may be provided in the upper chamber part 312, or may be provided in both the upper chamber part 312 and the lower chamber part 313.

Here, as shown in FIG. 39 , the cooling part 317 may be provided closer to the surface 313 a than the heating part 316 . Thereby, the cooling part 317 acts on the surface 313a of the lower chamber part 313, so as to shield the heat from the heating part 316. For example, the resin R of the workpiece W placed on the surface 313a can be quickly moved from a heated state to a cooled state.

Next, the structure of the resin molding device 350 shown in FIG. 43 and later will be described. The resin molding device 350 includes a press section including a molding die 360 that can be opened and closed by a known die opening and closing mechanism. This molding die 360 is composed of a pair of dies (one is an upper die 361 and the other is a lower die 362) that are opened and closed by a press unit.

Moreover, in the resin molding apparatus 350 which is an automatic machine, the press part is provided together with the supply part and the storage part which are not shown in figure. The supply section performs preparation and processing for supplying the workpiece W (here, the molded article) or the resin R to the press section. The supply unit is provided with a resin placement device 310 . In addition, the accommodating part performs preparation and processing for accommodating the resin-molded workpiece W (here, a molded product). In addition, in order to transport the workpiece W or the resin R between the supply section, the press section and the storage section, a loader (not shown) for loading into the press section and unloading for carrying out from the press section are used. machine (not shown), which are composed of well-known mechanisms. In addition, the mold opening and closing mechanism, loader and unloader are controlled by the control department. In this way, for reasons during transportation as described later, it is preferable to have a structure in which the resin placement device 310 and the resin molding device 350 are integrally provided, but they may be provided separately.

The upper mold 361 is provided with an upper holder 363, a cavity piece 364 and an upper seat 365, and is composed of these mold blocks (for example, made of alloy tool steel) assembled therewith. The upper holder 363 has a through hole 363a formed in the thickness direction, and a cavity member 364 is provided in the through hole 363a. The mold cavity piece 364 is fixed to the upper base 365 and supported. In this embodiment, the upper mold 361 is provided with a cavity recess 367 , but the side portions of the cavity recess 367 are formed by the upper clamper 363 , and the deep portion of the cavity recess 367 is formed by the cavity member 364 . In addition, the upper mold 361 is provided with an elastic member 366 (for example, a spring) provided between the upper holder 363 and the upper seat 365 . The upper holder 363 is assembled to the upper seat 365 via the elastic member 366 and is configured to be reciprocally movable in the mold opening and closing direction. In addition, when the molding die 360 is closed, the cavity recess 367 is closed to form the cavity C (see FIG. 44 ). In addition, in such a molding die 360, the mold surface of the mold cavity recess 367 is covered to prevent contact between the resin R and the mold surface to promote demolding, and a release sheet that prevents resin leakage from the sliding portion can be used.

Furthermore, the upper mold 361 is provided with a sealing member 370 (for example, an O-ring) provided between the inner peripheral surface of the through hole 363 a of the upper holder 363 and the outer peripheral surface of the cavity 364 . Moreover, the resin molding apparatus 350 is provided with the vacuum part 371 (for example, a vacuum pump) which sucks air into the mold cavity C and establishes a vacuum state. When the mold cavity C is formed by closing the mold, the vacuum part 371 sucks air into the mold cavity C through the air path 372 provided in the upper clamper 363 of the upper mold 361 to form a vacuum state. Moreover, the resin molding apparatus 350 is provided with the heating part 368 which heats the upper mold 361. A plurality of heating parts 368 (for example, cartridge heaters) are provided so as to extend parallel to the lower surface of the cavity member 364 (the back surface of the cavity recess 367 ). In addition, the vacuum part 371 and the heating part 368 are controlled by the control part.

The lower mold 362 is provided with a lower holder 373, an insert 374 and a lower seat 375, and is formed by placing these mold blocks. The lower holder 373 has a through hole 373a formed in the thickness direction, and an insert 374 is provided in the through hole 373a. The insert 374 is fixed to the lower seat 375 and supported. In this lower mold 362, the workpiece W is placed on the insert 374. In addition, the lower mold 362 is provided with an elastic member 376 (for example, a spring) and is provided between the lower clamper 373 and the lower seat 375 . The lower clamper 373 is assembled to the lower seat 375 via the elastic member 376 and is configured to be reciprocally movable in the mold opening and closing direction.

Furthermore, the lower mold 362 is provided with a sealing member 379 (for example, an O-ring) provided between the inner peripheral surface of the through hole 373 a of the lower holder 373 and the outer peripheral surface of the insert 374 . In addition, the lower mold 362 is provided with a sealing member 380 (for example, an O-ring), which is provided on the upper surface of the lower holder 373 and contacts the lower surface of the upper holder 363 of the upper mold 361 when the mold is closed. Moreover, the resin molding apparatus 350 is provided with the vacuum part 381 (for example, a vacuum pump) which sucks air into the mold cavity C and brings it into a vacuum state. When the mold is closed and the mold cavity C is formed, the vacuum part 381 sucks air into the mold cavity C through the air path 382 of the lower holder 373 of the lower mold 362 to form a vacuum state. Moreover, the resin molding apparatus 350 is provided with the heating part 378 which heats the lower mold 362. A plurality of heating parts 378 (for example, cartridge heaters) are provided to extend parallel to the upper surface of the insert 374 . In addition, the vacuum part 381 and the heating part 378 are controlled by the control part.

Next, the resin placement method (the operation method of the resin placement device 310) will be described. First, after the resin R is supplied (mounted) on the workpiece W, as shown in FIG. 38 , the workpiece W to which the resin R has been supplied is placed in the opened chamber 311 . The placement of the workpiece W toward the chamber 311 is performed by a loader.

As the workpiece W on which the resin R is mounted, for example, a plurality of chip components 400 (semiconductor wafers, etc.) are used, and a substrate 401 (for example, a temporary carrier on which a wiring structure is formed, a wiring substrate, and a wafer) is flip-chip packaged using fine bumps. wait). In such a workpiece W, a narrow portion (a gap corresponding to a bump height or a narrow gap between bumps) is formed between the wafer component 400 and the substrate 401 . In this case, the workpiece W has the uneven portion 402 because a plurality of chip components 400 are packaged on the substrate 401 . In this embodiment, on the workpiece W having the uneven portion 402 , the resin R is supplied so that the outer end of the resin R is outside the position where the chip component 400 is sealed (see FIG. 38 ) and covers the uneven portion 402 . In addition, as the resin R, a sheet resin (a thermosetting resin such as a sheet-shaped epoxy resin) is used. According to the sheet resin, even if the size of the workpiece W is large (for example, a 12-inch wafer level or a large panel-shaped object with a side length exceeding 300 mm), the workpiece W can be covered to achieve a uniform supply state.

Here, the sheet resin, that is, the resin R, may be protected by a protective sheet, for example. In this case, when one side is protected by a protective sheet, the protective sheet can also be arranged on the opposite side of the workpiece W, and the protective sheet can be placed on the workpiece W together. In this case, the protective sheet can prevent the resin R from deterioration, contamination, and the like. In this case, it is sufficient to peel off the protective sheet after placing the resin R on the workpiece W. Alternatively, a plurality of sheets of resin R, that is, resin R, may be stacked on each other and used. In addition, the resin R system can also be used by arranging a plurality of thin resin sheets (resin R) having any area on the workpiece W.

Next, as shown in FIG. 39 , with the chamber 311 closed, the interior 311 a of the chamber 311 is brought into a reduced pressure state. At this time, while heating the resin R, the inside 311a of the chamber 311 is decompressed. Specifically, the upper chamber part 312 gradually approaches the lower chamber part 313 by the lifting part. At this time, by starting air suction in advance by the decompression part 314, the interior 311a can be formed and the pressure can be directly reduced. Furthermore, by heating the interior 311a of the chamber 311 in advance with the heating unit 316, the workpiece W and the resin R can be heated, so that the resin R can be softened. Here, by providing the heating portion 316 in the lower chamber portion 313 on which the workpiece W is placed, the workpiece W can be directly heated by heat conduction and rapidly heated. In this way, by heating the resin R on the workpiece W by the heating unit 316, the heating time in the resin molding device 350 can be shortened, thereby shortening the molding time. In addition, by heating the lower chamber part 313 in advance, the entire chamber 311 including the upper chamber part 312 can be heated by its radiant heat, and the resin R can also be heated from above to make it easier to soften, so that the outer end of the resin R can be on the wafer. The outer side of the component 400 is in contact with the substrate of the workpiece W (see FIG. 39 ).

Thereby, the workpiece W can be covered with the resin R in the softened state (soft state) in the depressurized chamber 311 . In this case, as shown in FIG. 39 , for example, the resin R may be in close contact with the substrate 401 on the outer periphery of the workpiece W or the like, and the space sandwiched between the resin R and the substrate 401 may be in a depressurized state. At this time, the heating unit 316 may be stopped at a predetermined timing after decompression and heating are appropriately performed, so that the cross-linking reaction of the resin R does not proceed excessively in the depressurized state of the interior 311a. In addition, if the sheet resin used as the resin R is in a soft state under the atmospheric environment, heating by the heating unit 316 does not need to be performed.

Next, as shown in FIG. 40 , with the chamber 311 closed, the pressure in the interior 11 a of the chamber 311 is increased. Specifically, it suffices to open the chamber 311 by stopping the pressure reducing unit 314 so that the interior 311a of the chamber 311 is opened to the atmosphere. Here, when raising the pressure in the interior 311a of the chamber 311, not only the method of opening it to the atmosphere, but also the method of releasing the decompressed state in order to make the pressure higher than the pressure of the interior 311a in the decompressed state as described with reference to FIG. 39 or Aggressively pressurize the situation. In this way, the pressure in the interior 311a of the unchamber 311 becomes relatively high, so that the resin R is pressed against the workpiece W side. In addition, at this time, the gap between the workpiece W and the resin R can be reduced. In this embodiment, the resin R can be brought into close contact with the workpiece W along the uneven portion 402 . Accordingly, the occurrence of gaps between the uneven portion 402 and the resin R can be prevented.

In addition, a pressurizing part (such as a compressor) different from the decompressing part 314 may also be connected to the air path 315 in advance, and after the decompressing part 314 is stopped, the pressure in the interior 311a of the chamber 311 can be increased by the pressurizing part. . Alternatively, a flow meter may be connected to the air path 315 in advance, and the pressure in the interior 311a of the chamber 311 may be adjusted while measuring using the flow meter.

Next, as shown in FIG. 41 , the workpiece W and the resin R can also be cooled while the chamber 311 is closed. Specifically, by cooling the lower chamber portion 313 with the cooling portion 317 to cool the resin R of the workpiece W located on the surface 313a, even if the resin R has heat, the cross-linking reaction can be suppressed and the workpiece can be ensured to be W and resin R are transferred to the molding die 360 in a delayed manner. In addition, after heating the resin R to soften it and covering the workpiece W, the cooling unit 317 may be used to cool the resin R.

Next, as shown in FIG. 42 , the chamber 311 is opened. After that, the workpiece W is taken out from the chamber 311 by the loader. According to such a resin placement method, the resin R can be placed on the workpiece W in a state where air has been removed from between the workpiece W and the resin R. That is, air can be suppressed from being mixed in when placing the resin. In other words, when setting the resin, it is possible to set the state in which air is not contained between the workpiece W and the resin R. As shown in the figure, it can also be imagined that there is a space that is not filled with the resin R between the chip component 400 and the substrate 401 . However, since this area is covered with the molten resin R after depressurizing, the state in which components (air or water vapor) contained in the atmosphere can be maintained is removed from the space under the wafer component 400 .

Next, the resin molding method (the operation method of the resin molding device 350) will be described. First, as shown in FIG. 43 , the workpiece W to which the resin R is supplied by the aforementioned resin placement method is loaded into the molding die 360 . Specifically, the workpiece W is transported from the resin placement device 310 to the molded mold 360 of which the mold has been opened by a loader, and is placed on the upper surface of the lower clamper 373 . In this case, as described above, if the resin R is cooled by the cooling unit 317, even if a thermosetting resin is used that hardens at a predetermined temperature, it can be prevented from being hardened in the mold 360 during transportation. A state in which it becomes difficult to flow when heated and pressurized.

Next, as shown in FIG. 44 , the molding die 360 is gradually closed, and the cavity C of the molding die 360 is brought into a reduced pressure (vacuum) state. Specifically, the upper mold 361 gradually approaches the lower mold 362 through the mold opening and closing mechanism. Thereby, the resin R is accommodated in the cavity C. At this time, by starting air suction in advance by the vacuum part 371, the mold cavity C can be formed and the pressure can be directly reduced to a vacuum state.

Next, until the predetermined molding pressure is reached, as shown in FIG. 45 , the molding die 360 is further closed to perform compression molding. At this time, since the molding die 360 is heated to the molding temperature by the heating unit 378 , the resin R is heated and pressurized by the molding die 360 . In this case, in the workpiece W, a narrow portion (a gap corresponding to the bump height or a narrow gap between the bumps) is formed between the wafer component 400 and the substrate 401 . Even if there is such a narrow place, as mentioned above, since the components (air or water vapor) contained in the atmosphere are removed from the space under the wafer component 400, it can be filled without being filled, and the occurrence of voids can be suppressed and carried out. Bottom padding. Then, necessary and sufficient heating and pressure are applied to thermally harden the resin R and complete the shape of the cavity C of the mold 360 .

Next, as shown in FIG. 46 , the molding die 360 is set to the mold open state, and the workpiece W (molded product) is unloaded from the molding die 360 . Specifically, the upper mold 361 gradually moves away from the lower mold 362 through the mold opening and closing mechanism. The workpiece W is taken out from the molding die 360 opened by the unloader and carried out to the storage portion.

In this embodiment, the above-mentioned resin placement method is used to prevent air from being mixed between the workpiece W and the resin R before resin molding. Therefore, the occurrence of voids due to air mixing in the resin molded portion of the workpiece W (molded article) can be suppressed. In addition, in the workpiece W, even if there is a narrow place between the wafer component 400 and the substrate 401, since the mixing of air is suppressed (air, water vapor, etc. contained in the atmosphere are removed), the occurrence of voids can be suppressed and the work can be performed reliably. Bottom padding.

As mentioned above, the present invention has been specifically described based on the embodiments. However, the present invention is not limited to the above-mentioned embodiments, and various changes can be made without departing from the gist of the invention. In addition, not all of the steps or components of the method or device of the present invention specifically shown in the above embodiments are required, and they can be appropriately selected without departing from the scope of the invention that can achieve the respective effects. select.

For example, when a wafer component flip-chip bonded to a substrate is used as the workpiece, the pressure between the substrate and the wafer component can be reduced when supplying the liquid resin to the substrate. Therefore, for example, in compression molding, resin can be easily filled between the substrate and the wafer component, and so-called underfilling can be appropriately performed.

Furthermore, in the above-mentioned Embodiment 1, the example in which the liquid resin R is supplied in a vacuum state (under reduced pressure ambient gas) has been described, but the present invention is not limited thereto. That is, according to the resin supply device shown in the above-described Embodiment 1, after the liquid resin is discharged (supplied) from the nozzle to the object to be supplied inside the chamber, the air is discharged in a vacuum state (under reduced pressure ambient air), It can also prevent undesirable conditions such as air contained in the resin.

Furthermore, it is conceivable that even if the nozzle 22 is blocked with the pinch valve 24 due to the pressure reduction in the interior 30a of the chamber 30, the liquid resin R stored in the syringe 21 will still flow into the interior 30a of the chamber 30. Spit out situations like that. In such a case, it is preferable to have a structure that draws the liquid resin R back into the syringe 21 . This prevents the liquid resin R from being discharged unexpectedly. For example, as shown in FIG. 18 , the space (the space on the upper side) without the liquid resin R inside the syringe 21 can be decompressed to equalize the force to extract the liquid resin R by depressurizing the chamber 30 . .

Specifically, as shown in FIG. 18 , the plunger 23 including the plunger shaft 23 a and the plunger seal portion 23 b is produced. The front end of the plunger shaft 23a is enlarged in diameter and presses the syringe cap 21a provided on the syringe 21 to discharge the liquid resin R. The plunger seal 23b has an annular structure in which the plunger shaft 23a is inserted into the center. By being combined with the cylindrical syringe body 21b, the space between the syringe body 21b and the syringe cap 21a is set as a predetermined sealed space. In addition, the plunger seal portion 23b is provided with: a seal 23b1 for ensuring sealing with the edge of the syringe body 21b; a seal 23b2 for maintaining sealing with the plunger shaft 23a; and a seal for sealing the inside of the syringe body 21b. Carry out air suction suction path 23b3. Thereby, an annular sealed space is formed inside the syringe 21 by the syringe cover 21a, the syringe body 21b, the plunger shaft 23a, and the plunger sealing portion 23b. With such a sealed space formed, air is sucked through the suction path 23b3 provided in the plunger sealing portion 23b using a pipe or a vacuum pump (not shown) to depressurize the space and pull it back to the syringe cap 21a. A force is applied to draw the liquid resin R back into the syringe 21 .

In addition, the syringe 21 is supplied into the device in a state where the liquid resin R is stored in the syringe body 21b and the syringe cap 21a. Therefore, for example, with the unused syringe 21 placed at the position shown in FIG. 1 , the plunger 23 is lowered and the tip of the plunger shaft 23 a is inserted into the syringe body 21 b. At this time, by blocking the opening at the upper end of the syringe body 21b with the plunger sealing portion 23b, a force can be applied to return the liquid resin R into the syringe 21 after appropriate resin discharge. Accordingly, in addition to preventing the liquid resin R from being discharged unexpectedly, even if the liquid resin R is not discharged unexpectedly, the liquid resin R can be cut off by utilizing the force that returns the liquid resin R into the syringe 21 .

Furthermore, as a structure for drawing the liquid resin R back into the syringe 21, not only the pressure reduction method as described above, but also a structure in which the syringe cap 21a is drawn back mechanically may be used. In this case, by arbitrarily engaging the tip of the plunger shaft 23a with the syringe cap 21a by screwing or fitting the plunger shaft 23a, the syringe cap 21a can be directly pulled back by the plunger shaft 23a. For example, these can be screwed together by providing a male thread on the front end of the plunger shaft 23a and a female thread on the main surface of the syringe cap 21a. Of course, if it can be arbitrarily engaged, it is not limited to this structure. The front end of the plunger shaft 23a can also be made into a T-shape, and the front end of the plunger shaft 23a can be rotated and engaged with a groove portion appropriately provided on the syringe cover 21a. .

For example, in various resin supply methods as shown in FIGS. 16 , 17 , 22 , 23 , and 33 to 36 , the workpiece W is not only the carrier 201 on which the wafer component 200 is mounted, but also a flat workpiece or a flat workpiece as shown in FIG. 28 A release sheet used for the purpose of ensuring separation formation or preventing resin leakage in such lower cavity molding can also be applied.

In the embodiments such as Embodiment 3 described above, the structure in which the position of the nozzle 122 that discharges the resin R is moved after the pressure is reduced has been described, but the present invention is not limited thereto. For example, in a structure in which the resin R is applied to the workpiece W or the release sheet in an arbitrary shape by moving the position of the nozzle 122 that discharges the resin R, the resin R may be supplied without reducing the pressure. Furthermore, for example, the resin R can be coated on the release sheet in any shape, and thereby the air trapped in the gap between the release sheet and the resin R or the air in the resin R can be discharged. Moreover, as a structure provided with a plurality of syringes 121 or nozzles 122, it is also possible to shorten the coating time. For example, by providing a plurality of syringes 121 or nozzles 122 and coating the release sheet while moving relative to each other, the coating time for the release sheet can be shortened.

In addition, various resin supply methods such as those shown in FIGS. 33 to 36 are coating patterns in which a predetermined portion of the workpiece W has a portion through which air can flow out. Even if the pressure is not reduced when the resin R is ejected, for example, by By allowing air to flow out (discharge) from the depressurized mold while molding, molding can be performed to prevent the occurrence of voids.

In the above-mentioned Embodiment 3, the ball roller is used as the load support of the chamber cover. However, for example, a structure in which the load is received by air from the compressor may be used. In addition, a resin supply device as shown in FIGS. 1 to 15 may be used to provide a load support for the chamber cover. For example, by providing a ball roller as a load support on the inner or outer periphery of the sealing portion 33 provided in the upper chamber portion 31 that moves in a predetermined direction, the sealing portion 33 can be prevented from being prevented in the structure as shown in the figure. of flattening and smooth movement.

Moreover, although the structure example in which the syringe 21 etc. are arrange|positioned in the vertical direction (longitudinal direction) was demonstrated in any of the said embodiments, this invention is not limited to this. For example, the syringe 21 and the like may be arranged in the horizontal direction (lateral direction). Thereby, the height of the device can be reduced.

In the eighth embodiment described above, the case where a sheet resin is used as the resin covering the workpiece has been described. However, it is not limited to this. For resin, granular resin can be used to cover the workpiece in a state (average state) that is heated, melted and integrated by surface tension. This removes air from between the resin particles and covers the workpiece with resin. Alternatively, the granular resin may be pressed in advance and formed into a sheet shape to be used as a sheet resin.

Furthermore, in the eighth embodiment described above, the case where the workpiece as an example of the object to be supplied is a substrate flip-chip packaged using a plurality of chip parts. However, it is not limited to this. As the workpiece, a flat heat radiation plate or a shielding plate can also be used. Furthermore, these can also have concave and convex portions for heat conduction or electrical conduction. Furthermore, the workpiece may be a wafer on which only bumps are mounted without a chip. Alternatively, an adhesive film may be attached to one side of the ring member and the chip member may be attached to the adhesive film. In such cases, gaps between the workpiece and the resin sheet can be prevented. Even if there is a gap, air, water vapor, etc. contained in the atmosphere can be removed to prevent non-filling.

Furthermore, the object to be supplied may also be a release sheet. In this case, for example, as a structure in which the resin molding device 350 shown in FIG. 43 is turned upside down, a structure in which the release sheet is supplied to the lower mold can be considered. In this case, it is conceivable to place the sheet of resin, that is, the resin R on the release sheet, and then carry the workpiece W into the resin molding device 350 to perform resin molding on the workpiece W that has been carried separately. Even in this case, even if there is air trapped between the release sheet and the resin R, it can be removed. Therefore, it is possible to prevent the occurrence of molding defects such as residual air expanding and leaving marks on the molded product.

22:Nozzle 30: Chamber 30a: Internal R: liquid resin W: workpiece (supplied object)

FIG. 1 is a diagram illustrating a resin supply device according to an embodiment of the present invention. FIG. 2 is a diagram for explaining the resin supply device following the operation of FIG. 1 . FIG. 3 is a diagram for explaining the resin supply device following the operation following FIG. 2 . FIG. 4 is a diagram for explaining the resin supply device following the operation following FIG. 3 . FIG. 5 is a diagram for explaining the resin supply device following the operation following FIG. 4 . FIG. 6 is a diagram for explaining the resin supply device following the operation after FIG. 5 . FIG. 7 is a diagram for explaining the resin supply device following the operation of FIG. 6 . FIG. 8 is a diagram for explaining the resin supply device following the operation following FIG. 7 . FIG. 9 is a diagram illustrating a resin supply device according to another embodiment of the present invention. FIG. 10 is a diagram for explaining the resin supply device following the operation after FIG. 9 . FIG. 11 is a diagram for explaining the resin supply device following the operation following FIG. 10 . FIG. 12 is a diagram for explaining the resin supply device following the operation after FIG. 11 . FIG. 13 is a diagram for explaining the resin supply device following the operation of FIG. 12 . FIG. 14 is a diagram for explaining the resin supply device following the operation following FIG. 13 . FIG. 15 is a diagram for explaining the resin supply device following the operation following FIG. 14 . Fig. 16 is a top view of the object to which liquid resin has been supplied. Fig. 17 is a side view of the object to which liquid resin has been supplied. Fig. 18 is a diagram illustrating an example of the structure of a syringe. FIG. 19 is a diagram illustrating a resin supply device according to another embodiment of the present invention, showing a state in which a material to be supplied is supplied to the chamber. Fig. 20 is a diagram for explaining the operation of the resin supply device following Fig. 19, showing a state in which the chamber is closed. FIG. 21 is a diagram for explaining the operation of the resin supply device after FIG. 20 , showing a state in which resin is being supplied. FIG. 22 is a diagram illustrating a pattern of applying resin to a disk-shaped object to be supplied. FIG. 22A shows a vortex, and FIG. 22B shows a grid state. Fig. 23 is a diagram illustrating the coating pattern of resin toward a panel-shaped object to be supplied. Fig. 23A is a center point, Fig. 23B is a multi-point, Fig. 23C is a large vortex, Fig. 23D is a small vortex, and Fig. 23E is a corner. For the vortex, Figure 23F shows the grid, and Figure 23G shows the state of radiation. Figure 24 is a diagram illustrating the coating pattern of resin toward the main part of the object to be supplied (wafer component). Figure 24A shows coating of the entire circumference of the wafer component, and Figure 24B shows coating without covering the adjacent wafer components. , Figure 24C shows a state in which adjacent wafer parts are covered and coated. FIG. 25 is a diagram illustrating a resin supply device according to another embodiment of the present invention, showing a state in which weight measurement is performed. FIG. 26 is a diagram for explaining the operation of the resin supply device after FIG. 25 , showing a state in which resin is applied. Fig. 27 is a diagram for explaining a resin molding method according to another embodiment of the present invention. Fig. 27A shows a state in which the object to be supplied has been supplied with resin, Fig. 27B shows a state in which the object to be supplied is placed in the molding die, and Fig. 27C shows The pressure inside the mold is reduced. Figure 27D shows a state in which the object to be supplied is clamped. Figure 27E shows a state in which the resin is thermally hardened in the cavity. FIG. 28 is a diagram for explaining a resin molding method according to another embodiment of the present invention. FIG. 28A shows a state in which the object to be supplied has been supplied with resin, FIG. 28B shows a state in which the object to be supplied is underfilled, and FIG. 28C shows a state in which the object to be supplied is underfilled. The molding die is in a state where the object to be supplied is placed. FIG. 28D shows a state in which the pressure in the molding die is reduced, and FIG. 28E shows a state in which the resin is thermally hardened in the mold cavity. FIG. 29 is a diagram for explaining a resin molding method according to another embodiment of the present invention, showing the state of the object before the resin is supplied. Fig. 30 is a diagram for explaining the resin molding method following Fig. 29, showing the state of the object after the spiral resin is supplied. Fig. 31 is a diagram for explaining the resin molding method following Fig. 30, showing the state of the object being supplied being compressed by the resin. Fig. 32 is a diagram for explaining the resin molding method following Fig. 31, showing a state in which the resin is molded into the supplied object. 33 is a diagram for explaining a resin molding method according to another embodiment of the present invention, showing a state in which resin is supplied to a spiral portion in a finer shape. 34 is a diagram for explaining a resin molding method according to another embodiment of the present invention, showing the state of the object after resin is intermittently supplied in a spiral shape. 35 is a diagram for explaining a resin molding method according to another embodiment of the present invention, showing the state of the object after resin is intermittently supplied linearly. 36 is a diagram for explaining a resin molding method according to another embodiment of the present invention, showing the state of the object to be supplied after resin is supplied between wafer parts at multiple points. Fig. 37 is a diagram illustrating a resin molding device according to another embodiment of the present invention. Fig. 38 is a diagram illustrating a resin placement device according to another embodiment of the present invention. Fig. 39 is a diagram for explaining the resin placement device in the operation following Fig. 38. Fig. 40 is a diagram for explaining the resin placement device in the operation following Fig. 39. Fig. 41 is a diagram for explaining the resin placement device in the operation following Fig. 40. Fig. 42 is a diagram for explaining the resin placement device in the operation following Fig. 41. Fig. 43 is a diagram illustrating the main part of a resin molding apparatus according to another embodiment of the present invention. Fig. 44 is a diagram for explaining the main part of the resin molding device in the operation following Fig. 43. Fig. 45 is a diagram for explaining the main part of the resin molding device in the operation following Fig. 44. Fig. 46 is a diagram for explaining the main part of the resin molding device in the operation following Fig. 45.

10: Resin supply device

11:Control Department

20: spitting part

21: syringe

22:Nozzle

23:Plunger

24:Pinch valve

30: Chamber

30a: Internal

31: Upper chamber part

31a: Penetrating protrusion

32: Lower chamber part

32a: Surface

32b: sinking part

33:Sealing part

34: spit out holding part

35:Sealing part

36:Sealing part

40: Weight meter

41:Vacuum Department

42:Air path

50: Chamber drive unit

51:Maintenance Department

52:Track 1

53: 1st slider

54: 1st motor

70: Nozzle lift drive unit

72:Track 2

73: 2nd slider

74: 2nd motor

80: Discharge drive unit

82:Track 3

83: 3rd slider

84:3rd motor

W: workpiece

R: liquid resin

Claims (1)

A resin molding method, characterized by the following steps: carrying a supplied object supplied with resin into a molding mold by a resin placement method, and contacting and heating the resin in a cavity of the molding mold before being heated to a molding temperature. In the process of pressing and thermally hardening, the resin placement method is to heat and press the cavity of the molding mold and thermally harden the cavity into the shape of the mold cavity by filling the space of the mold cavity. The resin placement method includes: (a) the step of supplying the sheet resin used as the resin to the supplied object; (b) after the step (a), placing the resin in the opened chamber. The process of supplying the object; (c) After the aforementioned process (b), the chamber is closed, the inside of the chamber is depressurized while heating the resin, and the heating is stopped at a predetermined timing to cool the resin. , a process so that the cross-linking reaction of the resin does not proceed excessively; (d) after the process (c), a process of increasing the pressure inside the chamber; and (e) after the process (d), , the process of opening the chamber and taking out the supplied object. The workpiece is composed of a substrate on which a chip component is packaged. In the process (a), the outer end of the resin sheet is made larger than the one on which the chip component is packaged. The resin sheet is supplied so that the position of the wafer component is outward, and in the step (c), the outer end of the heated resin sheet contacts the substrate of the workpiece on the outside of the wafer component, In the step (d), by applying pressure to the resin sheet while the outer end of the resin sheet is in contact with the substrate, the resin sheet conforms to the unevenness formed by the substrate and the wafer component. The status of the department.