WO2014192456A1 - Resin molding device and resin molding method - Google Patents

Resin molding device and resin molding method Download PDF

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Publication number
WO2014192456A1
WO2014192456A1 PCT/JP2014/061014 JP2014061014W WO2014192456A1 WO 2014192456 A1 WO2014192456 A1 WO 2014192456A1 JP 2014061014 W JP2014061014 W JP 2014061014W WO 2014192456 A1 WO2014192456 A1 WO 2014192456A1
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WO
WIPO (PCT)
Prior art keywords
mold
resin
lower mold
film
clamper
Prior art date
Application number
PCT/JP2014/061014
Other languages
French (fr)
Japanese (ja)
Inventor
雅彦 藤沢
中沢　英明
吉和 村松
Original Assignee
アピックヤマダ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2013113222A external-priority patent/JP2014231185A/en
Priority claimed from JP2013115783A external-priority patent/JP2014233882A/en
Priority claimed from JP2013139424A external-priority patent/JP6180206B2/en
Application filed by アピックヤマダ株式会社 filed Critical アピックヤマダ株式会社
Priority to CN201480029820.1A priority Critical patent/CN105283294B/en
Priority to SG11201508166RA priority patent/SG11201508166RA/en
Priority to KR1020157036843A priority patent/KR102203781B1/en
Publication of WO2014192456A1 publication Critical patent/WO2014192456A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • the present invention relates to a technology that is effective when applied to a resin molding apparatus and a resin molding method.
  • a large-sized work for example, one in which a plurality of chip components mounted on a substrate is electrically connected to the substrate through a bonding wire
  • the upper mold is formed using a mold that constitutes a cavity recess (which becomes a cavity when clamping a workpiece).
  • the resin placed on the center of the work flows outward, so a molded article due to a void due to air entrapment or a wire sweep etc.
  • the release film is deformed according to the shape of the cavity recess outside the molding die, and the release film is supplied in a state where the resin is supplied to the preform portion (bottom) corresponding to the bottom of the cavity recess. And the technique of carrying in and arrange
  • a film having a certain degree of flexibility, stretchability and heat resistance is used for the release film as described in Patent Document 1.
  • a release film when heated at a certain temperature, causes heat shrinkage so as to shrink toward its center or heat shrinkage so as to form non-uniform wrinkles. Further, when the release film is deformed, for example, in accordance with the shape of the cavity recess, it can be said that the release film has a considerable amount of stored distortion.
  • the release film when the release film is placed in a preheated mold while being deformed, for example, in the shape of a cavity recess, the shape of the release film may be maintained in a desired shape. Can not.
  • the release film may be wrinkled, or the wrinkles may overlap to form a gap. When the release film is wrinkled or overlapped in this manner, problems occur such as transfer to the appearance of the molded product or leakage of resin from the overlapped portion.
  • An object of the present invention is to provide a technology capable of improving the quality of molded articles.
  • the resin mold apparatus is a resin mold apparatus that mold-closes an upper mold and a lower mold in which a cavity recess is formed, and resin-molds a work with the resin filled in the cavity recess.
  • the lower mold includes a lower mold cavity piece constituting a bottom portion of the cavity concave portion, a lower mold clamper constituting a side portion of the cavity concave portion, and a loader capable of holding and transporting a film on which the resin is mounted.
  • a suction unit for suctioning the film disposed (also referred to as a set) so as to cover the end face of the lower mold cavity piece and the end face of the lower mold clamper, wherein the lower mold cavity piece is the lower mold clamper
  • the loader is configured such that the end face of the lower mold cavity piece and the end face of the lower mold clamper are horizontal (both flush and at the same height).
  • the film is placed on the lower mold held in the lower mold so that the resin is positioned on the lower mold cavity piece, and the suction unit sucks the film following the inner surface of the cavity recess. And holding and supplying the resin to the cavity recess.
  • a resin mold apparatus is a resin mold apparatus that mold-closes a first mold and a second mold in which a cavity recess is formed, and resin-molds a work with the resin filled in the cavity recess.
  • the second mold includes a cavity piece that constitutes a bottom of the cavity recess, a clamper that constitutes a side of the cavity recess, and a movable part that moves the cavity piece relative to the clamper.
  • an adsorbing portion for adsorbing a film disposed so as to cover an end face of the cavity piece and an end face of the clamper, and conveying the film in a flat state, and also an end face of the cavity piece and an end face of the clamper Of the cavity piece while keeping the film flat while positioning it at an equivalent height (also referred to as horizontal or even).
  • the resin molding method uses a resin molding apparatus to mold-close the upper mold and the lower mold in which the cavity recess is formed, and resin-mold the work with the resin filled in the cavity recess.
  • the lower mold includes a lower mold cavity piece that constitutes the bottom of the cavity recess, a lower mold clamper that constitutes the side of the cavity recess, and a film on which the resin is mounted.
  • a suction portion for suctioning the film disposed so as to cover the end face of the lower mold cavity piece and the end face of the lower mold clamper, and (a) the end face of the lower mold cavity piece And the film so that the resin is positioned on the lower mold cavity piece by the loader in the lower mold in which the lower mold clamper and the end face of the lower mold clamper are horizontally held.
  • the film in a flat state and then deform the film following the shape of the cavity recess, for example, to prevent the occurrence of wrinkles in the film or to prevent the films from overlapping. can do. Therefore, it is possible to improve the quality of the molded product by preventing the appearance defect of the molded product from being formed or preventing the resin leakage from the overlapping portion.
  • a cavity recess in the lower mold, for example, by immersing a chip component (for example, a semiconductor chip, a chip capacitor) or a bonding wire in a resin melted in the cavity recess, molding by void or wire sweep etc. Defective products can be reduced.
  • the loader includes a holding surface for holding the film, and a recess that is recessed from the holding surface to release the resin mounted on the film. It is preferable to provide a hand portion having an air passage communicating with the holding surface around the recess and sucking the film.
  • the film can be held by suction so that the film is not bent by the weight of the resin in the concave portion mounted on the film.
  • the loader includes a rolled shutter portion capable of opening and closing the holding surface, and the film is supported by the shutter portion in a closed state of the shutter portion. It is preferable to convey and arrange the film in the lower mold in the open state of the shutter unit.
  • the film can be held flat by the shutter portion so that the film is not bent by the weight of the resin in the concave portion mounted on the film.
  • the shutter portion can be rolled up to save space.
  • the said loader is provided with a heating part and a cooling part.
  • the upper part of the lower mold cavity piece is provided so as to be separable, and the upper part of the lower mold clamper is provided so as to be separable.
  • the upper end of the lower mold cavity piece and the lower end of the lower mold cavity piece are connected such that the upper end of the lower mold cavity piece and the upper end face of the lower mold clamper are horizontal. It is preferable to convey the film arranged to cover the upper end face of the mold clamper.
  • the lower plate includes ring-shaped upper and lower plates, and the lower plate has a stepped portion which is recessed at a peripheral edge end from a surface on the upper plate side and extends in a circumferential direction Forming the film plate portion by interposing the film between the upper plate and the lower plate, the inner plate portion of the upper plate corresponding to the stepped portion of the lower plate, and the upper plate being fitted;
  • the lower clamper is formed with a stepped portion which is recessed from the end face at the peripheral edge end and extends in the circumferential direction, and the inner diameter portion of the lower plate corresponds to the stepped portion of the lower clamper. It is preferable to fit.
  • the film can be held flat with a simple configuration, and can be disposed in the lower mold as it is.
  • the upper end face of the lower mold cavity piece and the end face of the lower mold clamper in the state where the upper part of the lower mold cavity piece is provided separably and opened is provided separably and opened. It is preferable that the upper part of the lower mold cavity piece is floatingly supported so as to be horizontal.
  • the transport unit it is not necessary to push down the lower mold clamper by the transport unit to make the end surface of the lower mold cavity piece and the end surface of the lower clamper horizontal, and the operation and configuration of the transport unit can be simplified.
  • the upper part of the lower mold cavity piece is in a floating state, so the heat shrinkage of the film can be prevented, and the resin mounted on the film is prevented from overheating. It becomes easy to perform heating adjustment.
  • the lower clamper includes a plurality of pins floatingly supported so as to project from an end face of the lower clamper.
  • the plurality of pins preferably protrude from an end face of the lower clamper to support the workpiece, and in a state in which the workpiece is clamped, the plurality of pins are preferably accommodated in the lower clamper.
  • FIG. 5 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 4;
  • FIG. 6 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 5;
  • FIG. 7 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG.
  • FIG. 6 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 7;
  • FIG. 9 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 8; It is a typical sectional view of a press part in a resin mold process in a 2nd embodiment of the present invention.
  • FIG. 11 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 10;
  • FIG. 12 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 11;
  • FIG. 13 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 12;
  • FIG. 11 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 10;
  • FIG. 12 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 11;
  • FIG. 13 is a schematic
  • FIG. 14 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 13; It is a schematic cross section of the press part in the resin mold process in 3rd Embodiment of this invention.
  • FIG. 16 is a schematic cross-sectional view of a press portion in the resin molding process continued from FIG. 15;
  • FIG. 17 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 16;
  • FIG. 18 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 17;
  • FIG. 19 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG.
  • FIG. 21 is an exploded cross-sectional view of a film plate portion shown in FIG. 20.
  • FIG. 21 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 20;
  • FIG. 23 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 22;
  • FIG. 24 is a schematic cross-sectional view of the press portion in the resin molding process continued from FIG. 23; It is a schematic cross section of the press part in the resin mold process in 5th Embodiment of this invention.
  • FIG. 26 is a schematic cross-sectional view of the press portion in the resin molding process continued from FIG.
  • FIG. 25 It is typical sectional drawing of the press part in the resin mold process in 6th Embodiment of this invention. It is a schematic cross section of the press part in the resin mold process in the other structural example of this invention.
  • FIG. 29 is a schematic cross-sectional view of the press portion in the resin molding process continued from FIG. 28; It is a schematic cross section of the press part in the resin mold process in the other structural example of this invention.
  • FIG. 31 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 30;
  • FIG. 32 is a schematic cross-sectional view of the press portion in the resin molding process continued from FIG. 31; It is a typical sectional view of the press part in the resin mold process in a 7th embodiment of the present invention.
  • FIG. 36 is a schematic cross-sectional view of the press portion in the resin molding process continued from FIG. 35; It is front explanatory drawing of the type
  • FIG. 38 is a plan view of the movable platen of FIG. 37.
  • 39A and 39B are cross-sectional explanatory views of the molding die during the mold closing operation continued from FIG. 40A to 40C are cross-sectional explanatory views showing an example of a mold and a mold closing operation.
  • 41A to 41C are cross-sectional explanatory views showing another example of the mold and the mold closing operation.
  • the number of components is limited to the specific number unless explicitly stated or the principle is clearly limited to a specific number. It may be more or less than a specific number.
  • shape such as components, it is to be understood that substantially similar or similar to the shapes etc. is included unless specifically stated otherwise and when it is considered that it is not clearly apparent in principle. .
  • FIG. 1 is an overall configuration diagram showing the resin molding apparatus 100 in a planar layout.
  • the resin molding apparatus 100 includes not only a configuration for resin molding but also a configuration for heat curing (post curing) and storing a non-defective item after inspecting a work (molded product) after resin molding. It has become.
  • the resin mold apparatus 100 includes a work supply unit 110, a resin supply unit 120, a press unit 130, a work inspection unit / cooling unit 140, a cure unit 150 (cure furnace), and a work storage unit 160 as processing units that perform various processing steps. Is equipped. Moreover, the resin mold apparatus 100 is provided with the control part 170 which controls each processing process. As each processing part, at least one should just be comprised, and the case where the resin supply part 120 and the press part 130 are each comprised by two machines (plurality) is shown by this embodiment. As described above, the operation rate of the entire resin mold apparatus 100 can be improved by configuring a plurality of processing units that require longer processing time than other processing units.
  • the resin mold apparatus 100 includes a robot mechanism unit 180 provided with a transfer robot for transferring a work or resin between the processing units.
  • the transfer robot is, for example, a robot that can rotate and linearly move between the processing units, and has a hand at an end of an articulated joint.
  • each processing unit is disposed so as to surround the robot mechanism unit 180 (transport robot). For this reason, the movement distance of the work or resin between the processing units (the movement of the work or resin is indicated by a broken line in FIG. 1) is shortened, and the work can be efficiently transported.
  • a workpiece or resin may be transported between the processing units by a transport mechanism other than a transport robot configured by a linear motion mechanism such as an air cylinder or a linear motor.
  • the workpiece supply unit 110 (see FIG. 1) is a processing unit for supplying a workpiece to the press unit 130 where resin molding is performed.
  • the work supply unit 110 includes a magazine (not shown) capable of storing a plurality of works (formed products) before forming. The work supplied from this magazine is temporarily placed on a work placement unit (not shown) provided to the robot mechanism unit 180 by the transfer robot of the robot mechanism unit 180, and the loader 190 (transfer unit provided to the press unit 130 ) To the press unit 130.
  • the resin supply unit 120 (see FIG. 1) is a processing unit for supplying the resin to the press unit 130 where resin molding is performed.
  • the resin supply unit 120 will be described with reference to FIG.
  • FIG. 2 is a diagram for explaining the operation of the resin supply unit 120 for supplying the granular type resin R (hereinafter referred to as granular resin).
  • the resin supply unit 120 supplies the granular resin R to the resin storage portion 121 capable of storing granular resin R, a plurality of small resin storage portions 122, and the resin supply region (supply target). And a plurality of troughs 123.
  • the resin storage part 122 and the trough 123 which make a pair are in communication, and are provided movably by an XY drive mechanism (not shown).
  • the resin storage portion 121 can be fixedly provided to store a large amount of granular resin R, and can supply the granular resin R by dividing into smaller resin storage portions 122 than this. Then, the granular resin R is sent out from the resin storage portion 122 to the trough 123 by an electromagnetic feeder (not shown), and dropped into a resin supply region in a predetermined shape (for example, a flat shape).
  • At least a pair of resin reservoir 122 and trough 123 may be provided, but by providing a plurality of pairs (three pairs in FIG. 2), it is possible to shorten the dropping time of granular resin R to the resin supply region. it can.
  • the three pairs of resin reservoirs 122 and troughs 123 are connected by a connecting member 124.
  • a connecting member 124 By this connection, even if an electromagnetic feeder is not provided in each pair, it is possible to simultaneously supply the same amount of resin to the resin supply region so as to have a desired shape by one electromagnetic feeder.
  • a plurality of dispensers for supplying liquid resin may be provided. Also in this case, the correct quantity of liquid resin can be quickly supplied.
  • the supply target of the resin supply unit 120 is the release film F.
  • the release film F for example, a film having a certain degree of flexibility, elasticity, heat resistance, such as FEP film, PET film, fluorine-impregnated glass cloth, polyvinylidene chloride, PTFE, ETFE, etc. is used.
  • the release film F to be supplied with the resin is pulled out by the one gripping member 126 on the support base 125 from the rolled state, and is gripped by the gripping members 126 and 126 at the predetermined width. It is cut by a cutting member 127 (e.g., a cutter) into a film width corresponding to the number of times of molding, to be in a predetermined shape (e.g., a strip shape).
  • a cutting member 127 e.g., a cutter
  • the resin supply to the release film F is performed by supplying granular resin R while moving each trough 123 in the extending direction (X direction) of the supply area in the first row, After the resin supply to the shape supply region is completed, it moves in the second row direction (Y direction). Next, granular resin R is supplied while each trough 123 moves in the extending direction (X direction) of the supply region in the second row, and after resin supply for one row is completed, the third row direction (Y direction) Move to). Next, granular resin R is supplied while each trough 123 moves in the extending direction (X direction) of the supply region in the third row, and resin supply for one row is completed, and resin to the entire resin supply region Supply ends.
  • the granular resin R can be supplied (mounted) on the release film F with a predetermined area (area) and a predetermined thickness (height) for a predetermined time. Then, the granular resin R supplied onto the release film F is transported to the loader 190 by the robot mechanical unit 180 together with the release film F, and is then carried into the inside of the press unit 130 by the loader 190. For this reason, the release film F is also a carrier film for transporting the resin R.
  • the press unit 130 (see FIG. 1) is a processing unit for performing resin molding on a work to form a mold resin unit (molding unit). This processing step will be described in detail later.
  • the workpiece after molding is temporarily placed on a workpiece placement unit (not shown) provided in the robot mechanical unit 180 by the loader 190, and passed to the transfer robot of the robot mechanical unit 180.
  • the workpiece inspection unit / cooling unit 140 (see FIG. 1) is a processing unit for inspecting the state of the workpiece (molded product) after molding, and is a processing unit for cooling the workpiece being heated. .
  • the cooling unit can be provided separately from the workpiece inspection unit, but the arrangement can be made compact by arranging the cooling unit in a vacant area of the workpiece inspection unit.
  • the inspection items of the workpiece inspection unit include, for example, thickness measurement of the workpiece and appearance inspection of the workpiece. These inspection results are transmitted to the control unit 170 and processed. For example, molded articles are collectively or divided and imaged, and it is inspected by appearance observation whether there is any molding defect such as unfilled. If there is a molding failure or failure, the type of failure or the captured image is stored in the storage unit of the control unit 170 as operation information. By stopping the operation of the entire apparatus and performing maintenance when an abnormality (such as an unfilled state more than expected) is detected, it is possible to prevent continuous production of defective products. When the inspection is completed, the workpiece is transported to the curing unit 150 by the transport robot from the workpiece delivery position of the workpiece inspection unit / cooling unit 140.
  • an abnormality such as an unfilled state more than expected
  • the curing unit 150 (see FIG. 1) is a processing unit for heat curing (post curing) the mold resin portion of the workpiece.
  • the curing unit 150 is closed to the outside by an open / close door (not shown), and the inside is heated to a predetermined temperature.
  • the open / close door is opened, and when the work is disposed inside and the transfer robot retracts, the open / close door is closed and heat curing is performed for a predetermined time. Thereafter, the work carried out of the curing unit 150 by the transfer robot is cooled by the work inspection unit / cooling unit 140 and then conveyed to the work storage unit 160.
  • the workpiece storage unit 160 (see FIG. 1) is a processing unit for storing a workpiece as a final process of the resin molding apparatus 100.
  • the workpiece storage unit 160 includes a magazine similar to the workpiece supply unit 110, and a workpiece (molded product) is stored in the magazine by the transport robot of the robot mechanism unit 180.
  • FIG. 3 is a schematic cross-sectional view of the press unit 130 in the present embodiment.
  • FIG. 3 also shows the workpiece W in the state of the article to be molded.
  • a chip component 11 for example, a semiconductor chip
  • a substrate 10 for example, a wiring substrate
  • the press unit 130 includes a mold 30 (a pair of upper mold 31 and lower mold 32).
  • the lower mold 32 is a movable mold and the upper mold 31 is a fixed mold, but the upper mold 31 is a movable mold, the lower mold 32 is a fixed mold, or the upper mold 31 and the lower mold 32 are movable. If you want to
  • the work W is held by the upper mold 31, and the lower mold 32 is provided with a cavity recess 33 (which constitutes the cavity C at the time of work clamping).
  • the mold 30 includes a lower mold cavity piece 34 constituting the bottom of the cavity recess 33 and a lower mold clamper 35 surrounding the lower mold cavity piece 34 and constituting the side (wall) of the cavity recess 33.
  • the depth (height) of the cavity recess 33 changes and the volume of the cavity C changes.
  • the upper mold 31 includes an upper mold base 36, an upper mold insert 37, and an upper clamper 40.
  • An upper mold insert 37 having a heater (not shown) and configured to be able to heat the work W is fixed and assembled on the lower surface of the upper mold base 36, and the upper mold clamper 40 is assembled movably in the vertical direction There is.
  • the upper clamper 40 is formed of a single plate-shaped die, and a through hole 41 is formed in the upper die.
  • the upper mold insert 37 is inserted into the through hole 41 of the upper clamper 40 and disposed. That is, the upper mold insert 37 is surrounded by the upper clamper 40.
  • the upper mold clamper 40 is vertically movably assembled to the upper mold base 36 via an elastic member 42 (for example, a spring) constituting a movable portion, and is suspended and supported (floating support). Therefore, with respect to the upper mold base 36, the relationship between the fixed upper mold insert 37 and the movable upper mold clamper 40 is such that the upper mold insert 37 is relative to the upper mold clamper 40 by the expansion and contraction of the elastic member 42. Will move to
  • the lower surface (lower end surface) of the upper mold insert 37 is the upper mold clamper 40. Is located higher (upper position) than the lower surface (lower end surface) of In other words, the lower surface of the upper clamper 40 is at a lower position (lower position) than the lower surface (lower end surface) of the upper mold insert 37.
  • the upper mold insert 37 so as to be movable relative to the upper mold clamper 40, the work W can be clamped at a uniform height position regardless of the thickness of the work W.
  • the upper die 31 includes a seal member 43 (for example, an O-ring) provided between the outer peripheral surface of the upper die insert 37 and the inner peripheral surface of the through hole 41 of the upper die clamper 40.
  • a seal member 43 for example, an O-ring
  • a gap between the outer peripheral surface of the upper mold insert 37 and the inner peripheral surface of the through hole 41 of the upper mold clamper 40 is an air path in order to reduce the pressure in the cavity C formed during workpiece clamping. It is sealed to be 41A (see FIG. 7).
  • the upper mold clamper 40 is formed with an air passage 44 communicating from the inner peripheral surface of the through hole 41 to the outside of the mold so as to communicate with the air passage 41A.
  • the air passage 44 is in communication with a pressure reducing portion 45 (for example, a pump) outside the mold.
  • a pressure reducing portion 45 for example, a pump
  • the upper mold 31 is provided with a workpiece holding unit that holds the workpiece W (see FIG. 27).
  • the work holding portion is provided with an air passage 90 communicating with the end face of the upper mold insert 37, and a pressure reducing portion 91 communicating with the air path 90 brings the back surface of the substrate 10 of the work W into alignment with the lower surface of the upper mold insert 37.
  • the work W is held by suction.
  • the workpiece holding portion may hold the workpiece W by a claw portion provided on the end face of the upper mold insert 37 or an electrostatic chuck.
  • the configuration of the lower mold 32 will be specifically described.
  • the lower mold 32 which is a movable mold, is manufactured by a known mold clamping mechanism that raises and lowers the lower mold movable platen via a drive transmission mechanism (a link mechanism such as a toggle link or a screw shaft) driven by a drive source (electric motor). Opening and closing is to be performed.
  • a drive transmission mechanism a link mechanism such as a toggle link or a screw shaft
  • a drive source electric motor
  • the lower mold 32 includes a lower mold base 46, a lower mold cavity piece 34, and a lower clamper 35.
  • a lower mold cavity piece 34 is fixedly mounted on the upper surface of the lower mold base 46, and a lower mold clamper 35 is mounted movably in the vertical direction.
  • the lower clamper 35 is composed of a single plate-like mold, and a through hole 47 is formed in this.
  • the lower mold cavity piece 34 is inserted into the through hole 47 of the lower clamper 35 and disposed. That is, the lower mold cavity piece 34 is surrounded by the lower mold clamper 35.
  • the lower mold cavity piece 34 is configured to be able to heat the resin R as described later by providing a heater (not shown).
  • the lower clamper 35 is vertically movably assembled to the lower mold base 46 via an elastic member 50 (e.g., a spring) constituting a movable portion, and is floatingly supported. Therefore, the relationship between the lower mold cavity piece 34 fixed relative to the lower mold base 46 and the movable lower mold clamper 35 is such that the lower mold cavity piece 34 is relative to the lower mold clamper 35 by the expansion and contraction of the elastic member 50. Will move in a
  • the upper surface (upper end surface) of the lower mold cavity piece 34 is the lower mold clamper 35.
  • the lower mold 32 is provided with a seal member 51 (for example, an O-ring) provided between the outer peripheral surface of the lower mold cavity piece 34 and the inner peripheral surface of the through hole 47 of the lower mold clamper 35.
  • the seal member 51 is disposed between the outer peripheral surface of the lower mold cavity piece 34 and the inner peripheral surface of the through hole 47 of the lower clamper 35 in order to suck the release film F disposed on the parting surface of the lower mold 32. Is sealed so as to form an air passage 47A (see FIG. 5).
  • the upper surface of the lower mold cavity piece 34 and the inner peripheral surface of the through hole 47 of the lower clamper 35 constitute the cavity recess 33, so the air passage 47 A communicates with the bottom of the cavity recess 33 and the corner between the side It will be done.
  • the lower mold clamper 35 is formed with an air passage 52 communicating from the inner peripheral surface of the through hole 47 to the outside of the mold so as to communicate with the air passage 47A.
  • the air passage 52 is in communication with a suction unit 53 (for example, a pump) outside the mold.
  • a suction unit 53 for example, a pump
  • an air passage 54 is formed which leads from the upper surface of the lower clamper 35 to the outside of the mold.
  • the air passage 54 is in communication with a suction unit 55 (for example, a pump) outside the mold.
  • a suction unit 55 for example, a pump
  • a loader 190 having a work loader 56 capable of transporting the work W to the upper die 31 and a film loader 57 capable of transporting the resin R and the release film F to the lower die 32 adjacent to each press portion 130 (see FIG. 1) provided.
  • the work loader 56 and the film loader 57 are configured to be able to deliver the work W and the release film F from the robot mechanical unit 180 to the inside of the press unit 130, and are driven by different systems by a drive mechanism not shown. It is possible to carry out the work W and the release film F to 130.
  • the film loader 57 may be configured to receive the resin R and the release film F from the robot mechanical unit 180 in the loader 190, or the robot mechanical unit 180 may convey the resin R and the release film F to the resin supply unit 120. It may be supplied.
  • the work loader 56 includes a support plate 60, a support portion 61, and a positioning portion 62.
  • the size of the flat area of the support plate 60 is larger than, for example, the flat area of the through hole 41 of the upper clamper 40.
  • a support portion 61 in a ring shape in plan view is provided at a predetermined height.
  • a plurality of positioning portions 62 are provided at a predetermined height on the upper surface of the support plate 60 and outside the support portion 61.
  • the support portion 61 is provided along the inner side of the outer edge of the substrate 10 of the workpiece W so that the planar region is as similar as possible to the planar region of the substrate 10. Further, the support portion 61 is provided such that the height thereof is higher than the height of a member mounted on the substrate 10 of the workpiece W (for example, the thickness of the chip part 11 and the height of the bonding wire). Thus, the workpiece W is supported by the support portion 61 on the outer surface of the substrate 10 so that the support plate 60 does not contact (interfere with) the chip component 11 and the bonding wire (not shown).
  • the positioning portion 62 is configured to be able to position the work loader 56 with respect to the upper mold insert 37 by coming into contact with the inner peripheral surface of the through hole 41 of the upper mold clamper 40. It is provided in each corner of the through hole 41 having a rectangular shape in plan view. Further, the positioning portion 62 is provided such that its height is in contact with the inner peripheral surface of the through hole 41 before the workpiece W is transferred to the upper mold insert 37. Thereby, the workpiece W is positioned by the positioning portion 62 so as to be disposed in a predetermined area of the lower surface of the upper mold insert 37.
  • the work loader 56 transfers the work W to the upper mold 31 by bringing the back surface of the substrate 10 of the work W into contact with the lower surface of the upper mold insert 37. At this time, the substrate 10 is pressed against the lower surface of the upper mold insert 37 by the support portion 61, and the substrate 10 (work W) is held by the holding portion of the upper mold 31.
  • the film loader 57 is provided with a hand portion 63 for adsorbing and holding the release film F on which the resin R is mounted.
  • the hand portion 63 has a holding surface 64 (suction surface) for holding the release film F, an air passage 65 communicating with the holding surface 64, and a recess 66 recessed from the holding surface 64.
  • the holding surface 64 has a size (size of the flat area of the hand portion 63) which can be adsorbed along the outer periphery of the flat area of the strip-like release film F, for example.
  • a plurality of concave portions 66 are formed in the hand portion 63 so as to be arranged in a matrix of, for example, n rows and m columns (at least one of n and m is 2 or more) in the area of the holding surface 64.
  • the air passage 65 is formed in the hand portion 63 so as to communicate with the outside of the hand portion 63 from the holding surface 64 (for example, the outer peripheral portion of the holding surface 64 and the holding surface 64 between the concave portions 66) without interference with the concave portions 66. ing.
  • An air passage 65 leading to the holding surface 64 is provided around the recesses 66 (between the recesses 66).
  • the air passage 65 is in communication with a suction portion 67 (for example, a pump) outside the hand portion 63.
  • the release film F loaded with the resin R can be held while being tensioned at the outer periphery as necessary by attracting and absorbing the resin R, and the weight of the resin R causes the release film F to bend. It can be adsorbed and held flat so that it does not occur.
  • the flat state of the release film F means that the release film F is not bent or distorted, and is flat to the extent that there is no problem in transporting the resin R or setting it in the molding die 30. It does not have to be a perfect plane.
  • the release film F is suctioned from the air passage 65 around the recess 66 while securing the release of the resin R mounted on the release film F in the recess 66.
  • the resin R and the release film F are delivered to the lower mold 32 in a state where the release film F is held flat on the holding surface 64 (in a state without deformation).
  • the state (shape, amount) of the resin R mounted on the release film F can be maintained.
  • the resin R is mounted not in the entire surface of the release film F but in a plurality of areas (corresponding to a plurality of recesses 66).
  • FIGS. 3 to 9 are schematic cross-sectional views of the press unit 130 during the resin molding process in the present embodiment.
  • the resin mold apparatus 100 in the present embodiment includes a release film F disposed on the parting surface of the lower mold 32.
  • a release film F disposed on the parting surface of the lower mold 32.
  • resin leakage from the gap between the lower mold cavity piece 34 and the lower mold clamper 35 can be prevented.
  • resin clogging between the lower mold cavity piece 34 and the lower mold clamper 35 can be prevented, and relative movement of the lower mold cavity piece 34 with respect to the lower mold clamper 35 can be secured.
  • depending on the strength of the release film F and the weight of the resin R it is possible to suck and hold only the outer periphery of the release film F.
  • the workpiece W is carried in by the work loader 56 from the outside of the mold.
  • the film loader 57 carries in the resin R and the release film F.
  • the resin R is mounted (supplied) on the roll-shaped release film F, and the release film F is cut into a predetermined shape (for example, a strip shape) (see FIG. 2).
  • the release film F is sucked by the suction unit 67 and sucked by the holding surface 64 and carried in a flat state.
  • the suction operation of the suction unit 67 or the like is indicated by an arrow (see FIG. 3 and the like).
  • the work loader 56 is raised, and the work W is delivered to the upper die 31.
  • the positioning portion 62 is brought into contact with the inner peripheral surface of the through hole 41 of the upper clamper 40 by the lifting of the work loader 56
  • the back surface of the substrate 10 is brought into contact with the lower surface of the upper insert 37.
  • the substrate 10 (work W) is held on the lower surface of the upper mold insert 37 by the work holding portion (not shown).
  • the work W is delivered from the work loader 56 to the upper mold 31.
  • the film loader 57 is lowered to deliver the release film F having the resin R mounted on the lower mold 32 to start melting of the resin R.
  • the holding surface 64 is brought into contact with the upper surface of the lower clamper 35 via the release film F by lowering the film loader 57, and then the elastic member 50 is compressed (the movable portion is moved). . That is, the lower clamper 35 is pushed down by lowering the film loader 57.
  • the film loader 57 is lowered until the upper surface (upper end surface) of the lower mold cavity piece 34 and the upper surface (upper end surface) of the lower mold clamper 35 become horizontal.
  • the release film F may be delivered to the lower mold 32 by the operation of raising the lower mold 32.
  • the resin R on the release film F is heated by the inside of the lower mold cavity piece 34 to start melting.
  • the film loader 57 holds the flat release film F at the holding surface 64. That is, in the lower mold 32 in which the upper surface (upper end surface) of the lower mold cavity piece 34 and the upper surface (upper end surface) of the lower mold clamper 35 are horizontally held, the resin R is transferred by the film loader 57 to the lower mold cavity piece 34. Position the flat release film F so that it is positioned above.
  • the release film F may be flat when it is disposed (supplied) to the lower mold 32. In this case, as shown in FIG.
  • the film loader 57 when the holding surface 64 of the film loader 57 is shaped or sized to be pressed against the cavity recess 33 through the release film F, the film loader 57 is an end face of the cavity piece 34. It is possible to supply the release film F to the lower mold 32 in the horizontal state simply by performing the pressing operation until it abuts on the lower mold 32 and it is possible to easily supply it without causing the wrinkles and the like.
  • the release film in a flat state is disposed to cover the upper surface of the lower mold cavity piece 34 and the upper surface of the lower mold clamper 35.
  • F is adsorbed and held by the adsorption units 53 and 55.
  • the resin R and the release film F are delivered from the film loader 57 to the lower mold 32.
  • the suction units 53 and 55 may be separate systems or may be the same system.
  • the work loader 56 is lowered as shown in FIG. Thereby, the work loader 56 is separated from the work W. Then, the work W is held only by the upper mold 31.
  • the film loader 57 is lifted to extend the elastic member 50 (movable portion Move). Then, the lower mold cavity piece 34 is moved relative to the lower mold clamper 35 by the elastic member 50 to form the cavity recess 33. At this time, the outer peripheral portion of the release film F is adsorbed by the adsorption portion 55, and the portion corresponding to the corner portion of the cavity recess 33 of the release film F is adsorbed by the adsorption portion 53. While the release film F is deformed. As a result, the release film F follows the inner surface of the cavity recess 33 and is held by suction.
  • the release film F is adsorbed and held while following the inner surface of the cavity recess 33, and the resin R is supplied to the cavity recess 33 as it is. Since the resin R is disposed on the lower mold cavity piece 34 via the release film F by the film loader 57, the lower mold cavity piece 34 moves relative to the lower mold clamper 35 to form the cavity recess 33. Even if this is done, the resin R is supplied to the cavity recess 33 while maintaining the state as it is. Therefore, the shape of the resin R does not collapse, and the resin R can be supplied to the bottom of the cavity recess 33 without changing the position. As described above, supplying the resin R to the cavity recess 33 in a desired state works to reduce the quality defects of the molded product due to the void and the wire sweep.
  • the movable lower die 32 is raised to close the mold 30 (clamping). Specifically, the lower mold 32 is raised to a position where the release film F is clamped by the lower clamper 35 and the upper clamper 40. Thereby, the inside of the mold 30 including the cavity recess 33 is airtight. At this time, by driving the decompression unit 45, the inside of the mold 30 including the cavity recess 33 is decompressed (deaerated) through the air passage 41A and the air passage 44. By depressurizing the inside of the mold 30, the air mixed in the molten resin R in the subsequent resin mold is removed, and the generation of voids in the molded product can be prevented.
  • the movable lower die 32 is further raised to bring the upper surface of the lower clamper 35 into contact with the outer peripheral portion of the substrate 10 via the release film F.
  • the elastic member 42 is weaker than the elastic member 50, the elastic member 42 is compressed via the upper clamper 40 by the elevation of the lower die 32 (lower clamper 35).
  • the work W is clamped by the upper mold insert 37 (upper mold 31) and the lower mold clamper 35 (lower mold 32), and the surface of the substrate 10 and the lower surface of the upper mold clamper 40 become horizontal.
  • the work W can be clamped at a uniform height position regardless of the thickness of the work W.
  • the movable lower die 32 is further raised to immerse the chip part 11 in the resin R melted at the mold temperature, and then the cavity C (cavity recess 33) is filled.
  • the molten resin R thus obtained is heat-cured to resin-mold the workpiece W.
  • the elastic member 50 is compressed by the rise of the lower mold 32 (lower mold base 46).
  • the workpiece W (molded product) is held by the upper mold 31 by the workpiece holding unit, and the release film F is held open by the lower mold 32 by the suction units 53 and 55. At this time, by using the release film F, the work W can be easily released. Then, as described above, the workpiece W is stored in the workpiece storage unit 160 through the inspection unit / cooling unit 140 and the curing unit 150.
  • the release film F can be deformed following the shape of the cavity recess 33 after the release film F is disposed in a flat state.
  • the release film F is not supplied to the mold 30 in a wrinkled or overlapped state. Therefore, the transfer of the release film F to the appearance of the molded product due to wrinkles or the like can be prevented, or the resin leakage from the overlapping portion can be prevented, and the quality of the molded product can be improved.
  • the resin R supplied to the entire surface of the cavity recess 33 and melted is, for example, immersing the chip component 11 and the bonding wire (not shown), the resin R
  • the resin R By minimizing the flow of the resin, it is possible to reduce the quality defects of the molded articles such as voids and wire sweeps.
  • the work loader 56 arranges (sets) the work W together with the jig (the lower portion of the upper mold insert 37) in the upper mold 31, and the film loader 57 serves as a heating unit and cooling
  • the unit and the shutter unit are provided.
  • this difference will be mainly described with reference to FIGS. 10 to 14.
  • 10 to 14 are schematic cross-sectional views of the press unit 130 in the present embodiment.
  • the work loader 56 (supporting portion only at the outer surface of the substrate 10)
  • the substrate 10 is bent by its own weight, making it difficult to hold the substrate in the mold, or causing problems such as dropping during transport. Therefore, in the present embodiment, a plate-like jig 37A (member) is placed against the back surface of the large-sized substrate 10 to prevent the occurrence of bending, and the work W is transported by the work loader 56 together with the jig 37A.
  • the jig 37A is made of, for example, the same material (stainless steel) as the upper mold insert 37. For this reason, the jig 37A can be regarded as one in which the lower portion of the upper mold insert 37 is provided in a detachable manner.
  • the film loader 57 is provided with a plurality of recesses 66 as in the first embodiment, the region of the outer periphery of the recesses 66 (the air passage 65 communicating with the holding surface 64 is provided).
  • the resin R can not be mounted on the release film F.
  • the shutter part 70 which can hold
  • the film loader 57 in the present embodiment will be specifically described.
  • the film loader 57 includes a roll-shaped shutter unit 70 capable of opening and closing the holding surface 64.
  • the shutter portion 70 is wound up and retracted from the holding surface 64 in a state (open state) in which the holding surface 64 is opened by a driving unit (not shown), and in a state (closed state) in which the holding surface 64 is closed. It is delivered to the holding surface 64. Therefore, the film loader 57 can support and convey the release film F by the shutter unit 70 in the closed state of the shutter unit 70, and can arrange the release film F on the lower mold 32 in the open state of the shutter unit 70.
  • the shutter unit 70 is made of, for example, a thin sheet metal or a resin material capable of being wound up. Further, the material of the shutter portion 70 is preferably one having a material or a shape with low frictional resistance to the release film F. Thereby, the release film F can be wound without distortion.
  • the shutter 70 preferably has a core 71 such as a support bar extending in a direction perpendicular to the winding direction, in order to keep the release film F flat.
  • the release film F is held flat by the shutter unit 70 so that the weight of the resin R in the recess 66 mounted on the release film F does not bend ( Support).
  • the shutter portion 70 can be rolled up to save space.
  • the shutter unit 70 does not necessarily have to be configured to be able to be wound up, and can hold the release film F (that is, the resin R) even if it is configured to be able to open and close a plate-like member.
  • the film loader 57 includes a cooling unit 72 and a heating unit 73. According to this, it becomes easy to assist heating or cool the release film F and the resin R mounted thereon.
  • the heating portion in the shutter portion 70 the release film F can be preheated so that the release film F can be made to conform more reliably to the shape of the cavity recess 33.
  • a heating unit provided in the shutter unit 70 can be obtained.
  • the workpiece W is carried in together with the jig 37A by the work loader 56 from the outside of the mold.
  • the film loader 57 carries in the resin R and the release film F.
  • the cooling section 72 is turned on (or off) and the heating section 73 is turned off to release the release film F or resin. It is also possible to prevent R from being heated.
  • the resin R loaded on the release film F is held in the mold 30 by the shutter unit 70 in the closed state.
  • the release film F is sucked by the suction unit 67 and sucked by the holding surface 64 and carried in a flat state.
  • the work loader 56 is raised, and the work W is delivered to the upper die 31 together with the jig 37A.
  • the positioning portion 62 is made to abut on the inner peripheral surface of the through hole 41 of the upper clamper 40 by raising the work loader 56
  • the jig 37A holding the workpiece W is inserted into the upper mold insert 37. Abut the lower surface of the Next, the workpiece W and the jig 37A are held on the lower surface of the upper mold insert 37 by the workpiece holding portion (not shown).
  • the work W is delivered from the work loader 56 to the upper mold 31.
  • the film loader 57 is lowered. Specifically, first, the holding surface 64 is abutted against the upper surface of the lower clamper 35 via the release film F and the shutter portion 70 by lowering the film loader 57, and then the elastic member 50 is compressed (movable portion Move). That is, the lower clamper 35 is pushed down by lowering the film loader 57. Next, the film loader 57 is lowered until the upper surface of the lower mold cavity piece 34 and the upper surface of the lower clamper 35 become horizontal. When the cooling unit 72 is in the on state, it is preferable that the cooling unit 72 be in the off state in the process illustrated in FIG. 11 so as not to lower the temperature of the mold 30.
  • the work loader 56 is lowered. Thereby, the work loader 56 is separated from the work W. Then, the workpiece W is held by the upper die 31.
  • a release film F in which the resin R is mounted on the lower mold 32 is delivered. Specifically, first, the lower portion of the resin R is formed by the film loader 57 in the lower mold 32 in which the shutter portion 70 is wound up and the upper surface of the lower mold cavity piece 34 and the upper surface of the lower clamper 35 are held horizontally. A flat release film F is disposed to be positioned on the cavity piece 34. Next, the release film F in a flat state is adsorbed and held on the parting surface of the lower mold 32 in which the upper surface of the lower mold cavity piece 34 and the upper surface of the lower clamper 35 are horizontal by the suction portions 53 and 55.
  • the resin R and the release film F are delivered from the film loader 57 to the lower mold 32.
  • the resin R can also be heated from above, and the time for melting can be shortened. it can. This can improve the productivity.
  • the film loader 57 is lifted to extend the elastic member 50 (movable Move the part). Then, the lower mold cavity piece 34 is moved relative to the lower mold clamper 35 by the elastic member 50 to form the cavity recess 33. At this time, the outer peripheral portion of the release film F is adsorbed by the adsorption portion 55, and the portion corresponding to the corner portion of the cavity recess 33 of the release film F is adsorbed by the adsorption portion 53. While the release film F is deformed. As a result, the release film F follows the inner surface of the cavity recess 33 and is held by suction.
  • the resin R is supplied to the cavity recess 33 as it is by suction-holding the release film F while making the inner surface of the cavity recess 33 follow.
  • the resin R since the resin R is disposed on the lower mold cavity piece 34 via the release film F by the film loader 57, the lower mold cavity piece 34 moves relative to the lower mold clamper 35 and the cavity Even if the recess 33 is formed, the resin R is supplied to the cavity recess 33 while maintaining the state as it is. Therefore, the shape of the resin R does not collapse, and the resin R can be supplied to the bottom of the cavity recess 33 without changing the position.
  • the work loader 56 and the film loader 57 are retracted from the inside of the mold 30. Thereafter, through the steps described with reference to FIGS. 7 to 9 in the first embodiment, the molded article is substantially completed.
  • the case of using 70 has been described.
  • the present embodiment is different in that, as the film loader 57, a jig (member) which supports the resin R and the release film F and which is disposed (set) as it is on the lower mold 32 is used. In the following, this difference will be mainly described with reference to FIGS. 15 to 19 are schematic cross-sectional views of the press unit 130 in the present embodiment.
  • the shutter unit 70 supporting the release film F when arranging the release film F on the lower mold 32, it is necessary to wind up (remove) the shutter unit 70. At this time, the distribution of the resin R on the release film F may be biased due to breakage or the like. Therefore, in the present embodiment, a flat jig 34A is placed under the release film F to hold the flat release film F, and the release film F is transported by the film loader 57 together with the jig 34A, and the release film F is arranged.
  • the jig 34A as it is is used as the lower mold 32. That is, since the jig 34A is made of, for example, the same material (stainless steel) as the lower mold cavity piece 34, the upper portion of the lower mold cavity piece 34 can be regarded as being separable.
  • the film loader 57 includes a jig 34A in which the upper part of the lower mold cavity piece 34 is provided so as to be separated, and a jig 35A in which the upper part of the lower mold clamper 35 is provided so as to be separated. Further, the jig 34A is disposed in the through hole of the jig 35A, and the outer peripheral surface of the jig 34A and the inner peripheral surface of the jig 35A are connected by a plurality of connection members 74 so as to lift and support the jig 34A. ing.
  • the connection member 74 is also used as a movable portion which can move the jig 35A in the vertical direction with respect to the jig 34A like a leaf spring.
  • the thickness of the jig 34A is different from that of the jig 35, and the jig 34A is thinner than the jig 35A. And in the state where it has not received the influence from the outside, the end face of jig 34A and the end face of jig 35A are held horizontally by connecting member 74. Further, in the press unit 130, the lower upper surface of the lower mold cavity piece 34 and the lower surface thereof are not pressed in a state where the elastic member 50 is not biased as in the case of mold opening (state not affected by the outside). The lower upper surface of the mold clamper 35 can be at the same height position.
  • the jig 34A (upper part of the lower mold cavity piece 34) is attached to the jig 35A (upper part of the lower mold clamper 35) by providing such thickness difference (height difference) of the jigs 34A, 35A. Can be moved relatively to change the depth of the cavity recess 33 (volume of the cavity C).
  • the press unit 130 in the present embodiment is provided with pressing units 75 and 76 that press the release film F from the upper surface (the surface on which the resin R is mounted).
  • the pressing portion 75 is formed in a flange shape in which two square annular members having different outer shapes are combined so that the release film F can be pressed around the resin R, and faces the end face of the outer peripheral portion of the jig 34A.
  • the pressing portion 76 is provided so as to face the end face of the jig 35A so as to face the end face of the lower mold clamper 35 in the release film F to press the outer peripheral portion.
  • the release film F is conveyed flat by holding the release film F on these end faces. According to this, it is possible to arrange the release film F and the resin R mounted thereon in the mold 30 in a stable state.
  • the workpiece W is carried in by the work loader 56 from the outside of the mold. Further, in a state where the mold 30 is opened, the film loader 57 carries in the resin R and the release film F.
  • the roll-shaped release film F is sent out. Resin R is mounted (supplied). Then, the release film F is cut into a predetermined shape (for example, a strip shape) (see FIG. 2), and the release film F is disposed on the jig 34A and the jig 35A because the end faces are horizontal. The situation when being done is also flat. This is supplied to the press unit 130 via the robot mechanism unit 180 and the loader 190.
  • the work loader 56 is raised, and the work W is delivered to the upper die 31.
  • the film loader 57 is lowered. Specifically, the jig 35A is brought into contact with the upper surface of the lower clamper 35 by lowering the film loader 57.
  • the release film F is a film loader 57 in which the end face of the jig 34A (upper part of the lower mold cavity piece 34) and the end face of the jig 35A (upper part of the lower mold clamper 35) are held horizontally. Arranged flat by. At this time, the jig 34A is not in contact with the upper surface of the lower mold cavity piece 34.
  • the release film F is suctioned by the suction units 53 and 55. Specifically, the outer peripheral portion of the release film F is adsorbed by the adsorption portion 55, and the central portion of the release film F is adsorbed by the adsorption portion 53, and the jig 35A is vertically movable. The tool 34A is lowered by the connection member 74 (moves the movable portion).
  • the lower mold cavity piece 34 is moved relative to the lower mold clamper 35 by the connection member 74 to form the cavity recess 33.
  • the outer peripheral portion of the release film F is adsorbed by the adsorption portion 55, and the portion corresponding to the corner portion of the cavity recess 33 of the release film F is adsorbed by the adsorption portion 53.
  • the release film F is deformed. As a result, the release film F follows the inner surface of the cavity recess 33 and is held by suction.
  • the release film F is adsorbed and held while following the inner surface of the cavity recess 33, and the resin R is supplied to the cavity recess 33 as it is. Since the resin R is disposed on the jig 34A via the release film F by the film loader 57, even if the cavity recess 33 is formed, the resin R is supplied to the cavity recess 33 while maintaining the state as it is. . Therefore, the shape of the resin R does not collapse, and the resin R can be supplied to the bottom of the cavity recess 33 without changing the position.
  • the work loader 56 and the film loader 57 are retracted from the inside of the mold 30. Thereafter, through the steps described with reference to FIGS. 7 to 9 in the first embodiment, the molded article is substantially completed.
  • FIGS. 20 to 24 are schematic cross-sectional views of the press unit 130 in the present embodiment.
  • FIG. 21 is an exploded cross-sectional view of the film loader 57 (film plate portion) shown in FIG.
  • the film loader 57 is provided with a ring-shaped upper plate 80 and a lower plate 81, and is configured to be able to hold the release film F in a pulled state from the entire circumference by being sandwiched from above and below (in particular, refer to FIG. 21).
  • the lower plate 81 is formed with a stepped portion 82 extending in the circumferential direction, recessed from the surface on the upper plate 80 side at the peripheral edge end so as to be flange-like.
  • the upper plate 80 With the release film F interposed between the upper plate 80 and the lower plate 81, the upper plate 80 is fitted such that the inner diameter portion 80a of the upper plate 80 corresponds to the stepped portion 82 (small diameter portion) of the lower plate 81.
  • the plate portion (film loader 57) is configured (in particular, refer to FIG. 20). Then, the release film F is stretched so as to be flat on the inner peripheries of the upper plate 80 and the lower plate 81.
  • the holes penetrating at the peripheral portion thereof are fixed with bolts or the like (avoid release film F position) to configure the film plate portion
  • the lower clamper 35 is formed with a stepped portion 83 which is recessed in the end face at the peripheral edge end and extends in the circumferential direction. Then, the inner diameter portion 81a of the lower plate 81 is made to correspond to the stepped portion 83 of the lower clamper 35, and the film plate portion (film loader 57) is fitted and fixed.
  • the release film F can be held flat with a simple configuration, and the release film F can be disposed on the lower mold 32 in a flat state.
  • the workpiece W is carried in by the work loader 56 from the outside of the mold. Further, in a state where the mold 30 is opened, the film loader 57 carries in the resin R and the release film F.
  • a film plate portion is formed by sandwiching the release film F between the upper plate 80 and the lower plate 81, and the resin R is mounted on the release film F of the film plate portion. (Supplied).
  • the work loader 56 is raised and the work W is delivered to the upper die 31.
  • the film loader 57 is lowered, and the release film F having the resin R mounted on the lower mold 32 is delivered. Specifically, first, the lower surface of the lower plate 81 is brought into contact with and fixed to the upper surface of the stepped portion 83 of the lower clamper 35 by lowering the film loader 57, and then the elastic member 50 is compressed (moving the movable portion ). That is, the lower clamper 35 is pushed down by lowering the film loader 57. Next, the film loader 57 is lowered until the upper surface (upper end surface) of the lower mold cavity piece 34 and the upper surface (upper end surface) of the lower mold clamper 35 become horizontal.
  • the film loader 57 stretches and holds the flat release film F. That is, in the lower mold 32 in which the upper surface of the lower mold cavity piece 34 and the upper surface of the lower clamper 35 are held horizontally, a flat release film so that the resin R is positioned on the lower mold cavity piece 34 by the film loader 57. Place F.
  • the release film in a flat state is disposed to cover the upper surface of the lower mold cavity piece 34 and the upper surface of the lower mold clamper 35.
  • F is adsorbed and held by the adsorption unit 53.
  • the work loader 56 is lowered. Thereby, the work loader 56 is separated from the work W. Then, the work W is held only by the upper mold 31. Next, the work loader 56 is retracted from the inside of the mold 30.
  • the film loader 57 is lifted to extend the elastic member 50 (move the movable portion). .
  • the lower mold cavity piece 34 is moved relative to the lower mold clamper 35 by the elastic member 50 to form the cavity recess 33.
  • the outer peripheral portion of the release film F is fixed by the inner diameter portion 81a of the lower plate 81 and the stepped portion 83 of the lower clamper 35 being fitted, and the suction portion 53 fixes the corner of the cavity recess 33 of the release film F. Since the corresponding portion is adsorbed, the release film F deforms while making the inner surface of the cavity recess 33 follow. As a result, the release film F follows the inner surface of the cavity recess 33 and is held by suction.
  • the resin R is supplied to the cavity recess 33 as it is by suction-holding the release film F while making the inner surface of the cavity recess 33 follow.
  • the resin R since the resin R is disposed on the lower mold cavity piece 34 via the release film F by the film loader 57, the lower mold cavity piece 34 moves relative to the lower mold clamper 35 and the cavity Even if the recess 33 is formed, the resin R is supplied to the cavity recess 33 while maintaining the state as it is. Therefore, the shape of the resin R does not collapse, and the resin R can be supplied to the bottom of the cavity recess 33 without changing the position.
  • supplying the resin R to the cavity recess 33 in a desired state works to reduce the quality defects of the molded product due to the void and the wire sweep.
  • the movable lower die 32 is raised to close the mold 30 (clamping).
  • the release film F is clamped, that is, the film plate portion (film loader 57) is sandwiched between the upper mold 31 and the lower mold 32.
  • the molded article is substantially completed.
  • the press unit 130 in the present embodiment will be specifically described.
  • the press unit 130 includes a plate-like jig 34A in which the upper portion of the lower mold cavity piece 34 is provided so as to be separated.
  • the press unit 130 also includes a plurality of support pins 84 that support, for example, the four corners of the plate-like jig 34A. Further, the press unit 130 is assembled such that the support pin 84 is movable in the vertical direction with respect to the lower mold base 46, and includes the same number of elastic members 85 (for example, springs) as the support pin 84.
  • the support pin 84 and the elastic member 85 constituting the movable portion are arranged such that the upper surface of the jig 34A (the upper portion of the lower mold cavity piece 34) and the upper surface of the lower clamper 35 become horizontal in the mold open state.
  • the jig 34A is floatingly supported by this.
  • the plate-like jig 34A may be configured to be movable up and down using a drive mechanism such as an air cylinder or a servomotor without using the elastic member 85.
  • the resin R and the release film F are carried in and delivered to the lower mold 32 in a state where the mold 30 is opened.
  • the release film F is disposed flat by the film loader 57 on the lower mold 32 in which the upper surface of the jig 34A (the upper portion of the lower mold cavity piece 34) and the upper surface of the lower clamper 35 are held horizontally.
  • the suction unit 53, 55 starts to suck the release film F.
  • the release film F is sucked by the suction units 53 and 55. Specifically, the outer peripheral portion of the release film F is adsorbed by the adsorption portion 55, and the air in the space below the release film F is adsorbed by the adsorption portion 53, and is provided movably in the vertical direction with respect to the lower clamper 35.
  • the jig 34A is lowered while pressing the elastic member 85 (moving the movable portion).
  • the elastic member 85 moves the jig 34A (the upper portion of the lower mold cavity piece 34) relative to the lower mold clamper 35 to form the cavity recess 33.
  • the outer peripheral portion of the release film F is adsorbed by the adsorption portion 55, and the portion corresponding to the corner portion of the cavity recess 33 of the release film F is adsorbed by the adsorption portion 53.
  • the release film F is deformed. As a result, the release film F follows the inner surface of the cavity recess 33 and is held by suction.
  • the release film F is adsorbed and held while following the inner surface of the cavity recess 33, and the resin R is supplied to the cavity recess 33 as it is. Since the resin R is disposed on the jig 34A via the release film F by the film loader 57, even if the cavity recess 33 is formed, the resin R is supplied to the cavity recess 33 while maintaining the state as it is. . Therefore, the shape of the resin R does not collapse, and the resin R can be supplied to the bottom of the cavity recess 33 without changing the position. Thereafter, through the steps described with reference to FIGS. 7 to 9 in the first embodiment, the molded article is substantially completed.
  • the operation and configuration of the film loader 57 (for example, , The output of the drive motor, and the reduction of the stroke) can be simplified.
  • the jig 34A upper part of the lower mold cavity piece 34
  • the thermal contraction of the release film F can be prevented. It becomes easy to prevent overheating of the resin R mounted on the release film F and to perform heating adjustment.
  • the inside of the mold 30 is depressurized (degassed) in a state in which the inside of the mold 30 including the cavity recess 33 is closed by closing the mold.
  • the case was described.
  • the suction force for pressure reduction causes the substrate to be suctioned.
  • the suction force is reduced, and the substrate 10 may fall.
  • the lower clamper 35 is made to support a plurality of pins in a floating manner, and the substrate 10 is supported so as to be pressed against the upper die 31 in the formation state of the decompression space.
  • the difference is in the configuration. In the following, this difference will be mainly described with reference to FIG.
  • FIG. 27 is a schematic cross-sectional view of the press unit 130 in the present embodiment.
  • the press unit 130 includes a plurality of pins 86 provided inside the lower clamper 35 along the periphery of the through hole 47 of the lower clamper 35.
  • the press portion 130 is assembled to the inside of the lower mold clamper 35 so that the pin 86 can be moved in the vertical direction with respect to the lower mold clamper 35, and includes the same number of elastic members 87 (for example, springs) as the pins 86. .
  • an elastic member which constitutes the movable portion so as to support the work W by coming into contact with the surface of the substrate 10 via the release film F so as to project from the end face of the lower clamper 35 in a state of forming a decompression space.
  • a pin 86 is supported floating by 87. Then, in a state where the work W is clamped (see FIG. 8), the pin 86 is accommodated inside the lower clamper 35. Therefore, it is possible to prevent the workpiece W held by the upper die 31 from falling before clamping.
  • FIGS. 33 to 36 are schematic cross-sectional views of the press unit 130 during the resin molding process in the present embodiment.
  • the workpiece W in the present embodiment includes a substrate 10 having one surface 10 a and the other surface 10 b opposite thereto, and a plurality of ball-shaped bumps 11 A and 11 A provided on both surfaces 10 a and 10 b (first components, A second part) and is configured, for example, in a wafer shape (plate shape).
  • the respective bumps 11A and 11A of both surfaces 10a and 10b are resin-molded, and resin molded portions 14 and 15 are formed on both surfaces 10a and 10b (see FIG. 36), and the work W is a resin molded product (molded product) It will be almost complete.
  • the resin mold of such a wafer-like workpiece W is WLP (Wafer Level). It is called Package).
  • the parts provided on the work W are not limited to the bumps 11A, which are wiring parts, and may be chip parts (for example, semiconductor chips, MEMS chips, chip capacitors, etc.), or both of wiring parts and chip parts.
  • the substrate 10 not only a general substrate but also a plate-like member may be used, such as a carrier or a semiconductor wafer on which components are temporarily mounted.
  • the workpiece W is not resin-molded, and the parts (bumps 11A) on both sides are exposed (see FIG. 33), and only one side is resin-molded and the parts on the other side (bumps 11A) ) (See FIG. 35) are separately supplied by the robot mechanism unit 180 (see FIG. 1).
  • the press part 130 in this embodiment will be equipped with the plate-shaped 1st jig 12 (refer FIG. 33) and the 2nd jig 13 (refer FIG. 35).
  • the jigs 12 and 13 are provided so as to be replaced on the lower surface of the upper mold insert 37 when the workpiece W is clamped by the upper mold 31 and the lower mold 32.
  • the jig 12 has a first opening 12a (a plurality of which is shown in FIG. 33) larger than the mounting area of the bumps 11A mounted on the semiconductor chip manufactured as a product on the surface 10a.
  • the first opening 12a is formed so that the workpiece W and the jig 12 can be overlapped while avoiding the parts provided as the bumps 11A.
  • the jig 13 has a second opening 13a (one shown in FIG. 35) larger than the opening 12a.
  • the bump 11A is mounted on the surface 10a of the work W such that the bump 11A is accommodated in the opening 12a (that is, escape is secured to the bump 11A by the opening 12a). (See FIG. 33). Further, when using the jig 13, the work W is made such that the resin mold portion 15 is accommodated in the opening 13 a (that is, the escape is secured to the resin mold portion 15 by the opening 13 a). Is mounted on the face 10b of (see FIG. 35). In the present embodiment, by using the jigs 12 and 13, the work W can be clamped by avoiding (avoiding) the bumps 11A and the resin mold portion 15 (see FIGS. 34 and 36).
  • the mold 30 can be shared and another jig can be used.
  • the jigs 12 and 13 may be fixed to the upper mold 31 or may be used.
  • the loader 190 superimposes the jig 12 or the jig 13 on the workpiece W delivered from the robot mechanism unit 180 and then loads the same into the press unit 130. Further, the loader 190 removes the jig 12 or the jig 13 from the top of the resin-molded workpiece W delivered from the press unit 130 and carries it out to the robot mechanism unit 180. As described above, by preparing the jig 12 or the jig 13 in the loader 190, the workpiece W is delivered to the inside of the press unit 130 together with the jig 12 or the jig 13.
  • the jig 12 is mounted on one surface 10 a of the workpiece W so that the bumps 11 A are accommodated in the openings 12 a in the loader 190, with the workpiece W transported by the robot mechanism unit 180.
  • the robot mechanism unit 180 may transport only the work W, and the robot mechanism unit 180 having a small payload can be used, thereby reducing the manufacturing cost of the apparatus. be able to.
  • the work W and the jig 12 are carried in from the outside of the mold by the work loader 56 (see FIG. 3), and the work 12 is delivered to the upper mold 31 together with the jig 12 ( See Figure 33). Thereby, the work W is held by the mold surface of the upper mold 31.
  • the jig 12 is brought into contact with the lower surface of the upper mold insert 37 in a state in which the surface 10b of the workpiece W faces the lower mold 32, and the upper mold 31 (upper The workpiece W (substrate 10) is held by suction via the jig 12 on the mold surface of the mold insert 37).
  • the jig 12 is provided with the opening 12a for releasing the bump 11A mounted on the surface 10a of the workpiece W (substrate 10), so that the bump 11A can be protected, for example.
  • a recess may be engraved on the lower surface of the upper mold insert 37 without using the jig 12 to release the bump 11A.
  • the film loader 57 (see FIG. 3) carries in the resin R and the release film F, and delivers the resin R and the release film F from the film loader 57 to the lower mold 32 (see FIG. See 33).
  • the shape of the release film F is made to follow the deformation of the lower mold cavity recessed portion 33 from the flat, and the release film F is adsorbed and held on the mold surface of the lower mold 32 including the lower mold cavity recessed portion 33 It supplies to lower mold cavity crevice 33 as it is.
  • the release film F By using the release film F, resin leakage from the gap between the lower mold insert 34 and the lower mold clamper 35 can be prevented. However, when the resin R can be transported as it is without the influence of such a resin leak, the release film F may not be used.
  • the movable lower die 32 is raised to immerse all the bumps 11A provided on the surface 10b in the resin R melted at the die temperature, and then the upper die 31 and The lower mold insert 34 is moved to the forming position while clamping the work W with the lower mold 32. Then, the resin R filled in the lower mold cavity C is heated and cured, and the workpiece W is resin-molded. Thus, the resin mold portion 15 is formed on the surface 10 b of the workpiece W.
  • the workpiece W (molded product) is held by the upper mold 31 by the workpiece holding unit, and the release film F is held open by the lower mold 32 by the suction units 53 and 55. At this time, by using the release film F, the work W can be easily released. Then, as described above, the workpiece W is stored in the workpiece storage unit 160 through the inspection unit / cooling unit 140 and the curing unit 150 (see FIG. 1).
  • the magazine is moved to the work supply unit 110.
  • the process similar to the process which replaced the jig
  • the jig 13 is mounted on one surface 10 b of the work W such that the resin mold portion 15 of the work W carried into the loader 190 by the robot mechanism unit 180 fits in the opening 13 a.
  • the opening 13 a of the jig 13 is larger than the flat area of the resin mold portion 15, in other words, larger than the upper surface of the lower mold insert 34 constituting the lower mold cavity C forming the resin mold portion 15.
  • the work W and the jig 13 are carried in from the outside of the mold by the work loader 56 (see FIG. 3), and the work 13 is delivered to the upper mold 31 together with the jig 13 (See Figure 35).
  • the jig 13 is provided with the opening 13a for releasing the resin mold portion 15 mounted on the surface 10b of the workpiece W (substrate 10), so that the resin mold portion 15 can be protected, for example.
  • the resin mold portion 15 may be released by engraving a recess on the lower surface of the upper mold insert 37 without using the jig 13.
  • the film loader 57 (see FIG. 3) carries in the resin R and the release film F, and delivers the resin R and the release film F from the film loader 57 to the lower mold 32 (see FIG. See 35).
  • the shape of the release film F is made to follow the deformation of the lower mold cavity recessed portion 33 from the flat, and the release film F is adsorbed and held on the mold surface of the lower mold 32 including the lower mold cavity recessed portion 33 It supplies to lower mold cavity crevice 33 as it is.
  • the resin R forms the resin mold portion 14, and by making the same amount and the same quality as the resin mold portion 15 formed previously, the bumps 11 A can be sealed in the same shape.
  • the heights of the components mounted on the substrate 10 shown as the bumps 11A are different, it is also possible to use an amount of resin R suitable for each. In this case, it is also possible to use a resin R having different properties depending on the purpose of preventing warpage due to the difference in thickness of resin molding and the function of the mounted component.
  • the lower die 32 which is a movable die, is raised to immerse all the bumps 11A provided on the surface 10a in the resin R melted at the die temperature.
  • the lower mold insert 34 is moved to the forming position while clamping the work W with the lower mold 32.
  • the resin R filled in the lower mold cavity C is heated and cured, and the workpiece W is resin-molded.
  • the resin mold portion 14 is formed on the surface 10 a of the work W.
  • the workpiece W (molded product) is held by the upper mold 31 by the workpiece holding unit, and the release film F is held open by the lower mold 32 by the suction units 53 and 55. At this time, by using the release film F, the work W can be easily released. Then, as described above, the workpiece W is stored in the workpiece storage unit 160 through the inspection unit / cooling unit 140 and the curing unit 150 (see FIG. 1).
  • connection terminal surfaces are formed on both surfaces by singulating each area equivalent to one chip.
  • One package resin mold product
  • the workpiece 10 is used as the work W by bonding one surface of the substrate 10 on one side of which the bumps 11A are disposed on one surface, the substrate 10 is separated and then singulated into an area corresponding to one chip.
  • a package having a connection terminal surface formed on one side can be formed efficiently.
  • both surfaces 10a and 10b of the plate-like work W can be resin-molded by the compression molding method. Further, since the resin R can be supplied to the lower mold cavity recess 33 (lower mold cavity C) for resin molding, even a large-sized work W can be efficiently molded.
  • the resin mold portion 14 is formed by carrying the work W into the press portion 130 without storing the work W in the work storage portion 160, It is also possible to mold 15 continuously.
  • the plate member for resin holding is used to hold the resin R flat.
  • the release film F may be conveyed while being sandwiched between the release film F and the release film F.
  • the plate-like member for resin retention may be, for example, various plate materials such as a metal plate, a glass plate, or a silicon wafer, or may be a structure such as a lead frame or a substrate.
  • the plate-like member for holding the resin may be peeled off after molding or left as it is in the package, whereby the heat dissipation layer, the electromagnetic shield layer, the filter layer, the lens layer, the wavelength conversion layer, the gas permeation preventing layer, Alternatively, it can be used as a functional layer such as a wiring layer.
  • a plate-shaped member for holding resin it is possible to perform flat conveyance of the resin R and the release film F with a plate-like member capable of achieving high functionality by being attached to the work W, and high Functional products can be easily manufactured.
  • the resin holding plate member and the shutter unit 70 may be used in combination.
  • the press portion of the resin mold apparatus in the first embodiment the case where mold opening and closing of the mold is performed by a known clamp mechanism has been described.
  • a resin mold apparatus provided with a clamp mechanism corresponding to the increase in size (WLP) of the workpiece W in the press portion will be described.
  • the molding quality can be enhanced by performing mold closing with high accuracy while maintaining the parallelism of the movable platen in the mold closing operation and by making the final resin pressure high.
  • the resin mold apparatus 201 includes a mold 204 having an upper mold 202 and a lower mold 203 and a clamp mechanism 205 for opening and closing the mold 204.
  • the clamp mechanism 205 is provided on a rectangular base portion 206.
  • the base portion 206 and the fixed platen 207 are connected by tie bars 208 disposed at each corner portion (four places; see FIG. 38).
  • the upper mold 202 is supported by the fixed platen 207, and the lower mold 203 is supported on the front (upper surface) side of the movable platen 209.
  • the movable platen 209 is guided by an associated tie bar 208 to move up and down.
  • a ball screw mechanism 210 (first type opening / closing mechanism) which cooperates with the movable platen 209 to mold-close the mold 204 to the first mold clamping force with the fixed platen 207. It is done.
  • screw shafts 211 are provided on the base portion 206 at four positions on the inner side of the tie bar 208, and first drive motors 212 (servo motors) for rotationally driving the screw shafts 211 are provided at four positions. There is.
  • the first drive motor 212 is driven in synchronization among the plurality of motors, and can perform speed control with high accuracy by servo control.
  • fixed nuts 213 screw-fitted to the screw shaft 211 are provided at four places.
  • the tie bars 208 and the screw shafts 211 are equally spaced from each other at diagonal positions of the base portion 206 (movable platen 209).
  • any number may be provided.
  • a toggle link mechanism 214 (second type opening and closing mechanism) is provided at the center on the back side of the movable platen 209.
  • the toggle link mechanism 214 cooperates with the movable platen 209 to close the mold to a second mold clamping force that further intensifies the clamping force than the first clamping force to maintain the final resin pressure.
  • a screw shaft 215 and a second drive motor 216 (servo motor) for rotationally driving the screw shaft 215 are provided at the central portion of the base portion 206.
  • a movable nut 217 is screwed on the screw shaft 215.
  • the link connection portion 218 is integrally provided on the movable nut 217.
  • the drive motors 216 and 212 may be arranged on the side of the base portion 206 by using a belt mechanism.
  • the toggle link mechanism 214 is a so-called power boosting mechanism, and is configured to increase (amplify) the output from the second drive motor 216 by the toggle link structure constituted by the following link members, and to be able to output to the movable platen 209 Be done.
  • one end of the connection link 219 is rotatably connected to the link connection portion 218.
  • the other end of the connection link 219 is rotatably connected to the apex portion of the triangular link 220.
  • One base corner portion of the triangular link 220 is pivotally connected to the base portion 206, and the other base corner portion is pivotally connected to one end of the slide link 221.
  • the other end of the slide link 221 is rotatably connected to a connecting portion 209 a provided on the back surface of the movable platen 209.
  • the connecting portion 209a provided on the back surface of the movable platen 209 is driven by the second drive motor 216 in which the movable nut 217 is screwed.
  • the first drive motor 212 and the second drive motor 216 are driven and controlled by the controller 222.
  • Each tie bar 208 is also provided with a pressure sensor 223.
  • the control unit 222 detects the clamp pressure of the mold die 204 from the pressure sensor 223 and controls the driving of the first drive motor 212 and the second drive motor 216 to thereby obtain a mold by the ball screw mechanism 210 and the toggle link mechanism 214. Control the clamping operation.
  • the control unit 222 synchronously drives the first drive motor 212 and the second drive motor 216 to supply the mold screw 204 from the ball screw mechanism 210 through the movable platen 209.
  • the clamped work is clamped with the first mold clamping force, and then the pressurized state of the ball screw mechanism 210 is transferred to the pressurized state by the toggle link mechanism 214, and the movable platen 209 is clamped with the first mold clamping force by the toggle link mechanism 214. Clamp to a larger second mold clamping force.
  • the upper mold base 202 a of the upper mold 202 is supported by the solid platen 7.
  • the upper mold insert 202b is assembled to the upper mold base 202a.
  • a work holding portion 202c is formed, which suctions and holds the work W of the upper mold insert 202b flush with the clamp surface.
  • the lower mold base 203 a of the lower mold 203 is supported by the movable platen 209.
  • a recess is formed in the clamp surface of the lower mold base 203a, and the lower mold cavity piece 203b is supported in the recess, and the lower clamper 203c is supported by being biased by a coil spring 203d around it.
  • the lower mold clamper 203c protrudes upward from the upper surface of the lower mold cavity piece 203b, and a lower mold cavity recess 203e is formed.
  • the release film F is held by suction so as to cover the lower mold cavity recess 203e.
  • the release film F is held by suction on the upper mold clamping surface.
  • the release film F has a heat resistance of about 0.5 mm in thickness and can be easily peeled from the mold surface, and has flexibility and extensibility, for example, PTFE, ETFE, PET, FEP
  • a film, a fluorine-impregnated glass cloth, a polypropylene film, a single layer or a multilayer film mainly composed of polyvinylidene chloride or the like is preferably used.
  • FIGS. 37, 39A and 39B, and FIGS. 40A to 40C An example of the opening / closing operation of the clamp mechanism 205 and the resin molding operation will be described with reference to FIGS. 37, 39A and 39B, and FIGS. 40A to 40C.
  • the mold die 204 when the mold die 204 is in the mold open state, the workpiece W is supplied to the mold die 204 by a supply device (not shown).
  • the lower mold cavity recess 203e of the lower mold 203 is covered with the release film F in advance and held by suction.
  • the workpiece W for example, a substrate on which a semiconductor chip is mounted, a semiconductor wafer, etc.
  • Mold resin R liquid resin, granular resin, granular resin (powder resin), sheet resin, tablet resin, etc.
  • the mold resin R may be supplied to the lower mold cavity recess 203e together with the release film F.
  • the control unit 222 drives the first drive motor 212 and the second drive motor 216 in synchronization with each other.
  • the screw shaft 211 of the ball screw mechanism 210 is rotated at four points by the drive of the first drive motor 212, and the movable platen 209 screw-engages with the fixed nut 213 with the rotation of the screw shaft 211. It rises while maintaining the parallelism with respect to the fixed platen 207. That is, the lower die 203 (specifically, the parting surface thereof) rises while maintaining parallelism with the upper die 202 (specifically, the parting surface thereof).
  • connection link 219 connected to both sides of the link connection portion 218 is horizontal. Tilting to both sides in the direction, the triangular link 220 rotates so as to stand up, and pushes up the slide link 221. At this time, the toggle link mechanism 214 does not receive the load through the movable platen 209 due to the gap provided between the slide link 221 and the connecting portion 209a.
  • the coil spring 203d is compressed while the lower clamper 203c is in contact with the work W (substrate) and the upper insert 202b via the release film F.
  • a sealed space (reduced pressure space, closed space) is formed in the mold die 204, and the resin R is filled in the cavity recess 203e (cavity).
  • the movable platen 209 rises while maintaining the parallelism, the movable platen 209 approaches the stationary platen 207 while maintaining the parallelism. Therefore, the clamping of the upper mold 202 and the lower mold 203 can also be performed while maintaining the parallelism.
  • FIG. 40B the coil spring 203d is compressed while the lower clamper 203c is in contact with the work W (substrate) and the upper insert 202b via the release film F.
  • the resin R is spread toward the outside of the lower mold cavity recess 203e as in the case of supplying the resin R to the center of the lower mold cavity recess 203e, thereby filling the inside of the cavity recess 203e (cavity).
  • the ball screw mechanism 210 can properly control the clamping speed.
  • the clamping is continued as it is, and when the four pressure sensors 223 detect the first clamping pressure (for example, a total of 36 tons; the resin pressure of the mold resin R), the driving of the first drive motor 212 is stopped and the second drive is performed. The driving of the motor 216 is continued. Thereby, the toggle link mechanism 214 takes over the pressurized state of the movable platen 209 by the ball screw mechanism 210, and each pressure sensor 223 has a second mold clamping force higher than the first mold clamping pressure (for example, 125 tons in total; final resin pressure). Pressurize until it detects. As a result, in FIG.
  • the movable nut 217 further moves upward along the screw shaft 215, and the slide link 221 coupled through the coupling portion 209a of the movable platen 209 is in an upright state with the triangular link 220.
  • the movable platen 209 may be pressurized by both the ball screw mechanism 210 and the toggle link mechanism 214 without stopping the driving of the first drive motor 212. Further, the ball screw mechanism 210 may not be pressurized while being driven.
  • the pressure on the movable platen 209 is intensified while the upper mold insert 202b and the lower mold clamper 203c are in contact with each other, so the coil spring 203d of the lower mold clamper 203c is By being compressed, the mold resin R is filled in the lower mold cavity recess 203 e and maintained at the final resin pressure, and the mold resin R is heat-cured.
  • the sealed space can be formed in the mold die 204 by clamping the work W supplied to the mold die 204 through the movable platen 209 by the ball screw mechanism 210 with the first mold clamping force.
  • the toggle link mechanism 214 takes over the pressurized state by the ball screw mechanism 210, and the movable platen 209 is clamped by the toggle link mechanism 214 to the second mold clamping force which is larger than the first mold clamping force, so that the final resin pressure is achieved.
  • the mold resin R is heated and cured.
  • the molding quality can be enhanced by performing mold closing with high accuracy while maintaining the parallelism of the movable platen 209 in the mold closing operation and increasing the final resin pressure. That is, until the filling of the mold resin R where parallelism and mold clamping speed are particularly important, the mold is clamped while controlling the driving amount with high precision by the ball screw mechanism 210, and the pressing force is particularly important for the mold resin R. After filling, by pressing and pressing the mold with the toggle link mechanism 214 that increases the output of the second drive motor 216, it is possible to realize the required performance before and after the mold closing of the mold 204, respectively.
  • the toggle link mechanism 214 for increasing the output by the second drive motor 216 as the clamp mechanism 205 for opening and closing the mold die 204, for example, using only the linear movement mechanism without using the mechanism for increasing the output.
  • the servomotors (the first drive motor 212 and the second drive motor 216) for driving the mechanism can be smaller in output than in the case of performing the mold opening / closing operation, and the diameter of the screw shaft 211 is also reduced.
  • the size of the device can be reduced, the power consumption can be reduced, and the manufacturing cost can be reduced. Therefore, it is possible to cope with the increase in size of the work W more inexpensively.
  • the work W is held by the upper mold 202 of the molding die 204, and the mold resin R is supplied to the cavity formed in the lower mold 203, but the configuration may be reversed. Good.
  • the upper mold base 202 a of the upper mold 202 is supported by the fixed platen 207.
  • a recess is formed on the clamp surface of the upper mold base 202a, and the upper mold cavity piece 202d is supported in the recess, and the upper mold clamper 202e is biased and supported by a coil spring 202f around it.
  • the upper mold clamper 202e protrudes downward from the lower surface of the upper mold cavity piece 202d, and an upper mold cavity recess 202g is formed.
  • the release film F is held by suction so as to cover the upper mold cavity recess 202g.
  • the lower mold base 203 a of the lower mold 203 is supported by the movable platen 209.
  • a lower mold insert 203f is assembled to the lower mold base 203a.
  • the lower mold insert 203f is formed with a work holding portion 203g for attracting and holding the work W flush with the clamp surface.
  • a workpiece W for example, a substrate on which a semiconductor chip is mounted, a semiconductor wafer, etc.
  • a workpiece W for example, a substrate on which a semiconductor chip is mounted, a semiconductor wafer, etc.
  • mold resin R Liquid resin, granular resin, granular resin (powder resin), sheet resin, tablet resin, etc. are supplied.
  • the mold resin R may be supplied to the workpiece W in advance and then supplied to the workpiece holding unit 203g.
  • the upper mold cavity recess 202 g of the upper mold 202 is covered with the release film F and held by suction.
  • the upper clamper 202e remains in contact with the work W (substrate) and the lower insert 203f via the release film F.
  • the coil spring 202f is compressed.
  • the mold resin R is filled in the upper mold cavity recess 202g while the sealed space (reduced pressure space, closed space) is formed in the molding die 204.
  • the mold die 204 When the mold die 204 reaches the first mold clamping force and shifts from pressurization by the ball screw mechanism 210 to pressurization of the toggle link mechanism 214, as shown in FIG. 41C, the mold die 204 is inserted into the lower mold insert.
  • the pressure applied to the movable platen 209 is intensified while the upper clamper 202e is in contact with the upper clamper 202e, so that the coil spring 202f of the upper clamper 202e is compressed and the resin pressure in the cavity recess rises and the final clamp
  • a predetermined resin pressure is kept applied to the mold resin R, and the mold resin R is heat-cured.
  • the control unit 222 synchronously drives the ball screw mechanism 210 and the toggle link mechanism 214 and supplies the mold screw 204 via the movable platen 209 by the ball screw mechanism 210.
  • the mold die 204 can be closed and an enclosed space can be formed in the mold die 204.
  • the toggle link mechanism 214 takes over the pressurized state by the ball screw mechanism 210, and the movable platen 209 is clamped by the toggle link mechanism 214 to the second mold clamping force which is larger than the first mold clamping force, so that the final resin pressure is achieved.
  • the mold resin R can be heat-cured.
  • a resin mold device that can be compacted at low cost and at low cost while maintaining the parallelism and mold clamping speed of the mold 204 accurately in response to the increase in size of the work W 201 can be provided.
  • a hydraulic press mechanism may be provided instead of the toggle link mechanism 214.
  • the molding quality can be enhanced by performing mold closing with high accuracy while maintaining the parallelism of the movable platen 209 in the mold closing operation and by increasing the final resin pressure.
  • another boosting mechanism may be provided instead of the toggle link mechanism 214.
  • the movable platen 209 is driven by the ball screw mechanism 210 as described above to perform mold opening and closing operation to perform mold clamping, and the toggle link mechanism 214 described above applies pressure and drives only the lower mold cavity piece 203b shown in FIG. It may be configured to In this case, while providing a through hole in lower mold base 203a and movable platen 209, a pressing member for pressing lower mold cavity piece 203b penetrates the through hole and is connected to connecting portion 209a, thereby forming the lower mold cavity piece. 203 b can be driven separately.
  • the die clamping force can be suppressed while arbitrarily increasing the resin pressure, and the whole apparatus can It is also possible to mold without lowering the resin pressure even if the output of.
  • the drive state can be switched between the drive by the ball screw mechanism 210 alone and the drive by the ball screw mechanism 210 and the toggle link mechanism 214.
  • the lower mold cavity piece 203b may be raised alone and projected from the lower mold 203 to facilitate mold cleaning.
  • the case where granular resin was used as resin R was demonstrated.
  • a film-like resin may be used, or a film-like resin having different sizes may be laminated so as to form a mountain-like shape.
  • FIGS. 28 and 29 molding using a workpiece W and a resin R as shown in FIGS. 28 and 29 can be employed.
  • the work W one in which the chip component 11 is flip-chip mounted on the substrate 10 can be used.
  • the resin R it is possible to use a film-like resin formed in a middle-high shape, or a granular resin supplied in a middle-high position.
  • the resin R in which the chip part 11 is melted as shown in FIG.
  • the resin R is dipped sequentially from the chip component 11 on the center side.
  • the melted resin R flows from the center of the substrate 10 to the outer peripheral side. Therefore, when the chip part 11 seals the work W on which the flip chip mounting is performed, the underfill between the chip part 11 and the substrate 10 becomes easy.
  • the resin supply unit 120 simultaneously supplies (mounts) the resin R of the same amount on the release film F which is the resin supply region by using the plurality of troughs 123 .
  • a dispenser having multiple nozzles capable of supplying a flowable resin such as granular resin or liquid resin may be used. According to this, it is possible to prevent an increase in the supply time caused by the increase in the resin supply amount (the enlargement of the resin supply region).
  • the nozzles can be distributed and arranged in the resin supply region so that the resin supply can be uniformly performed, whereby the resin can be uniformly supplied.
  • the case where the lower mold cavity piece 34 is moved relative to the lower mold clamper 35 by expanding and contracting the elastic member 50 with the mold opening and closing of the mold clamping mechanism has been described.
  • the invention is not limited to this, and a mechanism for varying the height of the lower clamper 35 which is driven separately from the mold clamping mechanism may be used.
  • the lower mold cavity piece 34 is connected to a drive source and movably assembled to the lower mold base 46 of the mold 30 and the lower mold clamper 35 is fixed to the lower mold base 46 It may be configured to be assembled.
  • a plate thickness adjustment block (taper block) having an interface formed on a tapered surface (inclined surface) is superimposed between the lower mold cavity piece 34 and the lower mold base 46
  • a wedge portion may be provided, and one of the plate thickness adjustment blocks may be slidable by a drive source such as an air cylinder or a motor.
  • the film loader 57 is connected to the suction unit 67 only from the holding surface 64 to perform air suction (see FIG. 3).
  • the film loader 57a may be configured to be capable of air suction in the recess 66, or may be configured to be capable of being filled with air and pressurizing it.
  • a film loader 57a as shown in FIGS. 30 to 32 can be used. In FIGS. 30 to 32, the upper mold 31 (see FIG. 3) is omitted.
  • an air channel 65a having the same function as the air channel 65 shown in FIG. Suction or pressurization is performed from an air passage 65 b connecting the suction / pressurization unit 67 b of another system and the recess 66. Specifically, the deflection of the release film F is prevented by the weight of the resin R by equalizing the pressure on the release film F by the weight of the resin R and the suction force (negative pressure) by the adsorbing portion 67a. it can.
  • the film loader 57a when the release film F is disposed in the cavity recess 33, air is supplied from the suction / pressurizing portion 67b and air is supplied into the recess 66. It is also possible to stretch the wrinkles of the release film F by filling and pressing. According to this, while making the release film F conform to the shape of the cavity recess 33 by suction from a position corresponding to the corner of the cavity recess 33, the wrinkles of the release film F are pushed while pushing outward on the end face of the cavity piece 34 Since it can also be crushed, the occurrence of wrinkles can be prevented more reliably.
  • heated air can be used as air to be filled in the concave portion 66, and generation of wrinkles can be prevented without lowering the mold temperature. Further, since the release film F is also heated, the release film F can be made to conform more reliably to the shape of the cavity recess 33.
  • the film loader 57 has described the example in which the release film F on which the resin R is mounted is disposed on the lower mold 32.
  • the present invention is not limited thereto, and is disposed on the upper mold 31. It can also be done.
  • the mold 30 in the resin molding apparatus 100 is configured such that the lower mold 32 and the upper mold 31 are vertically inverted, and the lower mold (corresponding to the first mold in the present invention) and the cavity recess are formed.
  • the upper mold (corresponding to the second mold in the present invention) is closed and the work W can be resin-molded with the resin filled in the cavity recess.
  • this upper mold has a cavity piece constituting the bottom of the cavity recess, a clamper constituting the side portion of the cavity recess, and a cavity piece relative to the clamper.
  • a configuration may be employed that includes a movable portion to be moved, and a suction portion that sucks and sucks the release film F disposed so as to cover the end face of the cavity piece and the end face of the clamper.
  • the film loader conveys the release film F in a flat state as well as the film loader 57 in the first embodiment, and the release film is positioned while the end face of the cavity piece and the end face of the clamper are positioned at the same height.
  • the F is placed flat on the end face of the cavity piece and the end face of the clamper. According to such a resin mold apparatus 100, even when the resin R and the resin R are not carried into the press unit 130, the resin mold apparatus 100 can be disposed while preventing the occurrence of wrinkles.
  • the resin supply unit 120 can also supply a liquid resin R.
  • the robot mechanism unit 180 may carry the workpiece W into the press unit 130.
  • the resin supply unit 120 can also supply a sheet-like resin R. In this case, even if the robot mechanism unit 180 superposes the sheet-like resin R supplied by the resin supply unit 120 on the release film F or the work W, or carries it into the press unit 130 with only this resin R. Good.
  • the work W may be a plate-like member such as a wafer itself on which the chip parts 11 and the bumps 11A are not mounted as long as there is a surface to be protected.
  • the surface of such a plate-like member may have a concavo-convex shape or may be a flat surface.

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Abstract

The present invention addresses the problem of providing technology that is capable of improving the quality of moldings. As a solution, the lower mold (32) is provided with: a lower mold cavity piece (34) for configuring the bottom of a cavity (33); lower mold clampers (35) for configuring the sides of the cavity (33); a film loader (57) capable of holding and conveying a film (F) on which a resin (R) has been loaded; and a suction section (67) for picking up the film (F), which is disposed so as to cover the edges of the lower mold cavity piece (34) and the edges of the lower mold clampers (35). The lower mold cavity piece (34) moves relative to the lower mold clampers (35). The film loader (57) disposes the film (F) on the lower mold (32), in which the edges of the lower mold cavity piece (34) are held level with the edges of the lower mold clampers (35), so that the resin (R) is positioned above the lower mold cavity piece (34). The suction section (67) picks up and holds the film (F) so as to conform to the inner surface of the cavity (33) and supplies the resin (R) to the cavity (33).

Description

樹脂モールド装置および樹脂モールド方法Resin molding apparatus and resin molding method
　本発明は、樹脂モールド装置および樹脂モールド方法に適用して有効な技術に関する。 The present invention relates to a technology that is effective when applied to a resin molding apparatus and a resin molding method.
　例えばＷＬＰ（Wafer Level Package）等のモールド成形において、下型に大判のワーク（例えば、基板に実装された複数のチップ部品が基板とボンディングワイヤを介して電気的接続がなされたもの。）を配置し、上型にキャビティ凹部（ワークのクランプ時にはキャビティとなる。）を構成するモールド金型を用いて行われる。しかしながら、このようなモールド金型を用いてワーク上に樹脂を供給して圧縮成形を行うときには、ワーク中央に載せられた樹脂が外側に流れるため、エアの巻き込みによるボイドやワイヤスイープなどによる成形品の品質不良の問題が生じやすい。 For example, in mold molding such as WLP (Wafer Level Package), a large-sized work (for example, one in which a plurality of chip components mounted on a substrate is electrically connected to the substrate through a bonding wire) is arranged in the lower mold. Then, the upper mold is formed using a mold that constitutes a cavity recess (which becomes a cavity when clamping a workpiece). However, when carrying out compression molding by supplying a resin onto a work using such a mold die, the resin placed on the center of the work flows outward, so a molded article due to a void due to air entrapment or a wire sweep etc. Problem of quality defects
　他方、下型にキャビティ凹部（下型キャビティ）を構成するモールド金型を用いることで、そのキャビティ凹部に樹脂を供給し、そこで溶融した樹脂に上型で保持されたワークのチップ部品やボンディングワイヤを浸漬させて樹脂モールドすることができる。このような下型キャビティでの樹脂モールドは、ボイドやワイヤスイープなどの成形品の品質不良を低減することができる。このような下型キャビティを構成するモールド金型としては、例えば、特開２００４－１４８６２１号公報（特許文献１）に記載されている。 On the other hand, by using a mold for forming the cavity recess (lower die cavity) in the lower die, the resin is supplied to the cavity recess, and the chip part of the workpiece held by the molten resin in the upper die and the bonding wire Can be dipped and resin molded. Such resin molds in the lower mold cavity can reduce the quality defects of molded articles such as voids and wire sweeps. As a mold for forming such a lower mold cavity, for example, it is described in Japanese Patent Application Laid-Open No. 2004-148621 (Patent Document 1).
　この特許文献１には、モールド金型の外部でリリースフィルムをキャビティ凹部の形状に合わせて変形させて、キャビティ凹部の底部に対応するプリフォーム部（底部）に樹脂を供給した状態で、リリースフィルムおよび樹脂をモールド金型の内部に搬入して配置する技術が記載されている。 In this patent document 1, the release film is deformed according to the shape of the cavity recess outside the molding die, and the release film is supplied in a state where the resin is supplied to the preform portion (bottom) corresponding to the bottom of the cavity recess. And the technique of carrying in and arrange | positioning resin inside a molding die is described.
特開２００４－１４８６２１号公報Unexamined-Japanese-Patent No. 2004-148621
　特許文献１に記載のようなリリースフィルムには、例えば、一定の柔軟性、伸縮性、耐熱性のフィルムが用いられる。このようなリリースフィルムは、ある程度の温度で加熱されることで、その中央に向かって収縮するように熱収縮したり、不均一なシワとなるように熱収縮したりすることが起こる。また、リリースフィルムは、例えばキャビティ凹部の形状に合わせて変形させた場合、少なからず歪みを蓄えた状態であるといえる。 For the release film as described in Patent Document 1, for example, a film having a certain degree of flexibility, stretchability and heat resistance is used. Such a release film, when heated at a certain temperature, causes heat shrinkage so as to shrink toward its center or heat shrinkage so as to form non-uniform wrinkles. Further, when the release film is deformed, for example, in accordance with the shape of the cavity recess, it can be said that the release film has a considerable amount of stored distortion.
　このため、リリースフィルムが、例えばキャビティ凹部の形状のように変形した状態のまま、予め加熱されているモールド金型に配置される際には、所望の形状にリリースフィルムの形状を維持することができない。例えば、リリースフィルムにシワができたり、シワが重なって隙間ができてしまったりしてしまう場合がある。このようにリリースフィルムにシワができたり、重なりができたりすると、成形品の外観に転写されたり、重なった箇所から樹脂が漏れてしまったりする問題が生じる。 For this reason, when the release film is placed in a preheated mold while being deformed, for example, in the shape of a cavity recess, the shape of the release film may be maintained in a desired shape. Can not. For example, the release film may be wrinkled, or the wrinkles may overlap to form a gap. When the release film is wrinkled or overlapped in this manner, problems occur such as transfer to the appearance of the molded product or leakage of resin from the overlapped portion.
　本発明の目的は、成形品の品質性を向上することのできる技術を提供することにある。本発明の前記ならびにその他の目的と新規な特徴は、本明細書の記述および添付図面から明らかになるであろう。 An object of the present invention is to provide a technology capable of improving the quality of molded articles. The above and other objects and novel features of the present invention will be apparent from the description of the present specification and the accompanying drawings.
　本願において開示される発明のうち、代表的なものの概要を簡単に説明すれば、次のとおりである。 The outline of typical ones of the inventions disclosed in the present application will be briefly described as follows.
　本発明の一実施形態における樹脂モールド装置は、上型とキャビティ凹部が形成される下型とを型閉じして、前記キャビティ凹部に充填された樹脂でワークを樹脂モールドする樹脂モールド装置であって、前記下型は、前記キャビティ凹部の底部を構成する下型キャビティ駒と、前記キャビティ凹部の側部を構成する下型クランパと、前記樹脂が搭載されたフィルムを保持して搬送可能なローダと、前記下型キャビティ駒の端面および前記下型クランパの端面を覆うように配置（セットともいう。）された前記フィルムを吸着する吸着部と、を備え、前記下型キャビティ駒は、前記下型クランパに対して相対的に移動可能に構成され、前記ローダは、前記下型キャビティ駒の端面と前記下型クランパの端面とが水平（面一、同等な高さともいう。）に保持された前記下型に、前記樹脂が前記下型キャビティ駒上に位置するように前記フィルムを配置し、前記吸着部は、前記キャビティ凹部の内面に追従して前記フィルムを吸着保持し、前記キャビティ凹部に前記樹脂を供給することを特徴とする。 The resin mold apparatus according to an embodiment of the present invention is a resin mold apparatus that mold-closes an upper mold and a lower mold in which a cavity recess is formed, and resin-molds a work with the resin filled in the cavity recess. The lower mold includes a lower mold cavity piece constituting a bottom portion of the cavity concave portion, a lower mold clamper constituting a side portion of the cavity concave portion, and a loader capable of holding and transporting a film on which the resin is mounted. A suction unit for suctioning the film disposed (also referred to as a set) so as to cover the end face of the lower mold cavity piece and the end face of the lower mold clamper, wherein the lower mold cavity piece is the lower mold clamper The loader is configured such that the end face of the lower mold cavity piece and the end face of the lower mold clamper are horizontal (both flush and at the same height). The film is placed on the lower mold held in the lower mold so that the resin is positioned on the lower mold cavity piece, and the suction unit sucks the film following the inner surface of the cavity recess. And holding and supplying the resin to the cavity recess.
　本発明の他の実施形態における樹脂モールド装置は、第一型とキャビティ凹部が形成される第二型とを型閉じして、前記キャビティ凹部に充填された樹脂でワークを樹脂モールドする樹脂モールド装置であって、前記第二型は、前記キャビティ凹部の底部を構成するキャビティ駒と、前記キャビティ凹部の側部を構成するクランパと、当該クランパに対して当該キャビティ駒を相対的に移動させる可動部と、前記キャビティ駒の端面と前記クランパの端面とを覆うように配置されたフィルムを吸着する吸着部と、を備え、前記フィルムをフラットな状態で搬送すると共に、前記キャビティ駒の端面と前記クランパの端面とを同等な高さ（水平、面一ともいう。）に位置させながら前記フィルムをフラットな状態のままで前記キャビティ駒の端面と前記クランパの端面とに配置するローダを備えることを特徴とする。 A resin mold apparatus according to another embodiment of the present invention is a resin mold apparatus that mold-closes a first mold and a second mold in which a cavity recess is formed, and resin-molds a work with the resin filled in the cavity recess. The second mold includes a cavity piece that constitutes a bottom of the cavity recess, a clamper that constitutes a side of the cavity recess, and a movable part that moves the cavity piece relative to the clamper. And an adsorbing portion for adsorbing a film disposed so as to cover an end face of the cavity piece and an end face of the clamper, and conveying the film in a flat state, and also an end face of the cavity piece and an end face of the clamper Of the cavity piece while keeping the film flat while positioning it at an equivalent height (also referred to as horizontal or even). Characterized in that it comprises a loader disposed in a plane with the end face of the clamper.
　本発明の一実施形態における樹脂モールド方法は、樹脂モールド装置を用いて、上型とキャビティ凹部が形成される下型とを型閉じして、前記キャビティ凹部に充填された樹脂でワークを樹脂モールドする樹脂モールド方法であって、前記下型は、前記キャビティ凹部の底部を構成する下型キャビティ駒と、前記キャビティ凹部の側部を構成する下型クランパと、前記樹脂が搭載されたフィルムを保持して搬送可能なローダと、前記下型キャビティ駒の端面と前記下型クランパの端面とを覆うように配置された前記フィルムを吸着する吸着部と、を備え、（ａ）前記下型キャビティ駒の端面と前記下型クランパの端面とが水平に保持された前記下型に、前記ローダによって前記樹脂が前記下型キャビティ駒上に位置するように前記フィルムを配置する工程と、（ｂ）前記吸着部によって前記フィルムを吸引しながら、前記下型クランパに対して前記下型キャビティ駒を相対的に移動して前記キャビティ凹部を形成することで、前記キャビティ凹部の内面に追従させながら前記フィルムを吸着保持すると共に、前記樹脂をそのまま前記キャビティ凹部に供給する工程と、を含むことを特徴とする。 The resin molding method according to an embodiment of the present invention uses a resin molding apparatus to mold-close the upper mold and the lower mold in which the cavity recess is formed, and resin-mold the work with the resin filled in the cavity recess. The lower mold includes a lower mold cavity piece that constitutes the bottom of the cavity recess, a lower mold clamper that constitutes the side of the cavity recess, and a film on which the resin is mounted. And a suction portion for suctioning the film disposed so as to cover the end face of the lower mold cavity piece and the end face of the lower mold clamper, and (a) the end face of the lower mold cavity piece And the film so that the resin is positioned on the lower mold cavity piece by the loader in the lower mold in which the lower mold clamper and the end face of the lower mold clamper are horizontally held. (B) arranging the lower mold cavity piece relative to the lower mold clamper to form the cavity concave section while suctioning the film by the suction section; And holding the film by suction while following the inner surface of the film, and supplying the resin as it is to the cavity recess.
　本発明によれば、フラットな状態でフィルムを配置してからキャビティ凹部の形状に追従してフィルムを変形することができ、例えば、フィルムのシワ発生を防止したり、フィルムの重なりを防止したりすることができる。したがって、成形品の外観不良が形成されるのを防止したり、重なった箇所からの樹脂漏れを防止したりして、成形品の品質性を向上することができる。また、下型にキャビティ凹部を構成することで、キャビティ凹部で溶融した樹脂に、例えば、チップ部品（例えば、半導体チップ、チップコンデンサ）やボンディングワイヤを浸漬させることで、ボイドやワイヤスイープなどによる成形品の品質不良を低減することができる。 According to the present invention, it is possible to arrange the film in a flat state and then deform the film following the shape of the cavity recess, for example, to prevent the occurrence of wrinkles in the film or to prevent the films from overlapping. can do. Therefore, it is possible to improve the quality of the molded product by preventing the appearance defect of the molded product from being formed or preventing the resin leakage from the overlapping portion. In addition, by forming a cavity recess in the lower mold, for example, by immersing a chip component (for example, a semiconductor chip, a chip capacitor) or a bonding wire in a resin melted in the cavity recess, molding by void or wire sweep etc. Defective products can be reduced.
　また、本発明の一実施形態における樹脂モールド装置において、前記ローダは、前記フィルムを保持する保持面と、前記フィルムに搭載された前記樹脂の逃がしとなる、前記保持面から凹んだ凹部と、前記凹部の周囲の前記保持面に通じ、前記フィルムを吸引するエア路とを有するハンド部を備えることが好ましい。 Further, in the resin mold device according to one embodiment of the present invention, the loader includes a holding surface for holding the film, and a recess that is recessed from the holding surface to release the resin mounted on the film. It is preferable to provide a hand portion having an air passage communicating with the holding surface around the recess and sucking the film.
　これによれば、フィルムに搭載された樹脂の状態（形状、量）を保持して、キャビティ凹部に樹脂を供給することができる。また、フィルム上に搭載されている凹部内の樹脂の重みによってフィルムが撓まないように吸着保持することができる。 According to this, it is possible to supply the resin to the cavity recess while maintaining the state (shape, amount) of the resin mounted on the film. Further, the film can be held by suction so that the film is not bent by the weight of the resin in the concave portion mounted on the film.
　また、本発明の一実施形態における樹脂モールド装置において、前記ローダは、前記保持面を開閉可能なロール状のシャッタ部を備え、前記シャッタ部の閉状態で前記フィルムを前記シャッタ部で支持して搬送し、前記シャッタ部の開状態で前記下型に前記フィルムを配置することが好ましい。 Further, in the resin mold device according to one embodiment of the present invention, the loader includes a rolled shutter portion capable of opening and closing the holding surface, and the film is supported by the shutter portion in a closed state of the shutter portion. It is preferable to convey and arrange the film in the lower mold in the open state of the shutter unit.
　これによれば、フィルム上に搭載されている凹部内の樹脂の重みによってフィルムが撓まないように、シャッタ部でフィルムをフラットに保持することができる。また、フィルムの下型への配置時にはシャッタ部を巻き取って省スペース化を図ることができる。 According to this, the film can be held flat by the shutter portion so that the film is not bent by the weight of the resin in the concave portion mounted on the film. In addition, when the film is placed on the lower mold of the film, the shutter portion can be rolled up to save space.
　また、本発明の一実施形態における樹脂モールド装置において、前記ローダは、加熱部および冷却部を備えることが好ましい。 Moreover, in the resin mold apparatus in one Embodiment of this invention, it is preferable that the said loader is provided with a heating part and a cooling part.
　これによれば、フィルムやこれに搭載される樹脂の加熱を補助したり、冷却したりすることが容易となる。 According to this, it becomes easy to assist heating or cool the film and the resin mounted thereon.
　また、本発明の一実施形態における樹脂モールド装置において、前記下型キャビティ駒の上部が分離可能に設けられ、前記下型クランパの上部が分離可能に設けられ、前記下型キャビティ駒の上部と前記下型クランパの上部とが接続部材によって接続され、前記ローダは、前記下型キャビティ駒の上部の端面と前記下型クランパの上部の端面とが水平な状態で、前記下型キャビティ駒の上部の端面および前記下型クランパの上部の端面を覆うように配置された前記フィルムを搬送することが好ましい。 In the resin mold device according to one embodiment of the present invention, the upper part of the lower mold cavity piece is provided so as to be separable, and the upper part of the lower mold clamper is provided so as to be separable. The upper end of the lower mold cavity piece and the lower end of the lower mold cavity piece are connected such that the upper end of the lower mold cavity piece and the upper end face of the lower mold clamper are horizontal. It is preferable to convey the film arranged to cover the upper end face of the mold clamper.
　これによれば、フィルムおよびこれに搭載された樹脂を安定した状態でモールド金型に配置することができる。 According to this, it is possible to arrange the film and the resin mounted thereon in the mold in a stable state.
　また、本発明の一実施形態における樹脂モールド装置において、リング状の上部および下部プレートを備え、前記下部プレートは、周縁部端で前記上部プレート側の面から窪んで周方向に延びる段付き部が形成され、前記上部プレートと前記下部プレートの間に前記フィルムを挟んで、前記下部プレートの段付き部に前記上部プレートの内径部を対応させて前記上部プレートがはめ合わさってフィルムプレート部が構成され、前記下型クランパには周縁部端で端面から窪んで周方向に延びる段付き部が形成され、前記下型クランパの段付き部に前記下部プレートの内径部を対応させて前記フィルムプレート部がはめ合わさることが好ましい。 Further, in the resin mold device according to one embodiment of the present invention, the lower plate includes ring-shaped upper and lower plates, and the lower plate has a stepped portion which is recessed at a peripheral edge end from a surface on the upper plate side and extends in a circumferential direction Forming the film plate portion by interposing the film between the upper plate and the lower plate, the inner plate portion of the upper plate corresponding to the stepped portion of the lower plate, and the upper plate being fitted; The lower clamper is formed with a stepped portion which is recessed from the end face at the peripheral edge end and extends in the circumferential direction, and the inner diameter portion of the lower plate corresponds to the stepped portion of the lower clamper. It is preferable to fit.
　これによれば、簡単な構成でフィルムをフラットに保持することができ、そのままの状態で下型に配置することができる。 According to this, the film can be held flat with a simple configuration, and can be disposed in the lower mold as it is.
　また、本発明の一実施形態における樹脂モールド装置において、前記下型キャビティ駒の上部が分離可能に設けられ、型開きした状態で、前記下型キャビティ駒の上部の端面と前記下型クランパの端面とが水平となるように、前記下型キャビティ駒の上部がフローティング支持されていることが好ましい。 Further, in the resin mold device according to one embodiment of the present invention, the upper end face of the lower mold cavity piece and the end face of the lower mold clamper in the state where the upper part of the lower mold cavity piece is provided separably and opened. It is preferable that the upper part of the lower mold cavity piece is floatingly supported so as to be horizontal.
　これによれば、例えば、搬送部によって下型クランパを押し下げて下型キャビティ駒の端面と下型クランパの端面とを水平にする必要がなくなり、搬送部の動作・構成を簡素化することができる。また、下型にフィルムが配置された際には、下型キャビティ駒の上部がフローティングした状態であるため、フィルムの熱収縮を防止することができ、フィルムに搭載される樹脂の過熱を防止したり、加熱調整を行ったりすることが容易となる。 According to this, for example, it is not necessary to push down the lower mold clamper by the transport unit to make the end surface of the lower mold cavity piece and the end surface of the lower clamper horizontal, and the operation and configuration of the transport unit can be simplified. In addition, when the film is placed in the lower mold, the upper part of the lower mold cavity piece is in a floating state, so the heat shrinkage of the film can be prevented, and the resin mounted on the film is prevented from overheating. It becomes easy to perform heating adjustment.
　また、本発明の一実施形態における樹脂モールド装置において、前記下型クランパには、前記下型クランパの端面から突出可能にフローティング支持された複数のピンを備え、
　前記複数のピンは、前記下型クランパの端面から突出して前記ワークを支持し、前記ワークをクランプした状態では前記下型クランパの内部に収容されることが好ましい。 In the resin mold apparatus according to one embodiment of the present invention, the lower clamper includes a plurality of pins floatingly supported so as to project from an end face of the lower clamper.
The plurality of pins preferably protrude from an end face of the lower clamper to support the workpiece, and in a state in which the workpiece is clamped, the plurality of pins are preferably accommodated in the lower clamper.
　これによれば、クランプ前に上型で保持されているワークが落下するのを防止することができる。 According to this, it is possible to prevent the workpiece held by the upper die from being dropped before clamping.
　本願において開示される発明のうち、代表的なものによって得られる効果を簡単に説明すれば、成形品の品質性を向上することができる。 The effects obtained by typical ones of the inventions disclosed in the present application can be briefly described to improve the quality of molded articles.
本発明の一実施形態における樹脂モールド装置を平面レイアウトで示す全体構成図である。It is a whole block diagram which shows the resin mold apparatus in one Embodiment of this invention by a planar layout. 顆粒タイプの樹脂を供給する樹脂供給部の動作を説明するための図である。It is a figure for demonstrating the operation | movement of the resin supply part which supplies resin of a granule type. 本発明の第１実施形態における樹脂モールド工程中のプレス部の模式的断面図である。It is a typical sectional view of the press part in the resin mold process in a 1st embodiment of the present invention. 図３に続く樹脂モールド工程中のプレス部の模式的断面図である。It is a schematic cross section of the press part in the resin mold process following FIG. 図４に続く樹脂モールド工程中のプレス部の模式的断面図である。FIG. 5 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 4; 図５に続く樹脂モールド工程中のプレス部の模式的断面図である。FIG. 6 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 5; 図６に続く樹脂モールド工程中のプレス部の模式的断面図である。FIG. 7 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 6; 図７に続く樹脂モールド工程中のプレス部の模式的断面図である。FIG. 8 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 7; 図８に続く樹脂モールド工程中のプレス部の模式的断面図である。FIG. 9 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 8; 本発明の第２実施形態における樹脂モールド工程中のプレス部の模式的断面図である。It is a typical sectional view of a press part in a resin mold process in a 2nd embodiment of the present invention. 図１０に続く樹脂モールド工程中のプレス部の模式的断面図である。FIG. 11 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 10; 図１１に続く樹脂モールド工程中のプレス部の模式的断面図である。FIG. 12 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 11; 図１２に続く樹脂モールド工程中のプレス部の模式的断面図である。FIG. 13 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 12; 図１３に続く樹脂モールド工程中のプレス部の模式的断面図である。FIG. 14 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 13; 本発明の第３実施形態における樹脂モールド工程中のプレス部の模式的断面図である。It is a schematic cross section of the press part in the resin mold process in 3rd Embodiment of this invention. 図１５に続く樹脂モールド工程中のプレス部の模式的断面図である。FIG. 16 is a schematic cross-sectional view of a press portion in the resin molding process continued from FIG. 15; 図１６に続く樹脂モールド工程中のプレス部の模式的断面図である。FIG. 17 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 16; 図１７に続く樹脂モールド工程中のプレス部の模式的断面図である。FIG. 18 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 17; 図１８に続く樹脂モールド工程中のプレス部の模式的断面図である。FIG. 19 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 18; 本発明の第４実施形態における樹脂モールド工程中のプレス部の模式的断面図である。It is a schematic cross section of the press part in the resin mold process in 4th Embodiment of this invention. 図２０に示すフィルムプレート部の分解断面図である。FIG. 21 is an exploded cross-sectional view of a film plate portion shown in FIG. 20. 図２０に続く樹脂モールド工程中のプレス部の模式的断面図である。FIG. 21 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 20; 図２２に続く樹脂モールド工程中のプレス部の模式的断面図である。FIG. 23 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 22; 図２３に続く樹脂モールド工程中のプレス部の模式的断面図である。FIG. 24 is a schematic cross-sectional view of the press portion in the resin molding process continued from FIG. 23; 本発明の第５実施形態における樹脂モールド工程中のプレス部の模式的断面図である。It is a schematic cross section of the press part in the resin mold process in 5th Embodiment of this invention. 図２５に続く樹脂モールド工程中のプレス部の模式的断面図である。FIG. 26 is a schematic cross-sectional view of the press portion in the resin molding process continued from FIG. 25; 本発明の第６実施形態における樹脂モールド工程中のプレス部の模式的断面図である。It is typical sectional drawing of the press part in the resin mold process in 6th Embodiment of this invention. 本発明のその他の構成例における樹脂モールド工程中のプレス部の模式的断面図である。It is a schematic cross section of the press part in the resin mold process in the other structural example of this invention. 図２８に続く樹脂モールド工程中のプレス部の模式的断面図である。FIG. 29 is a schematic cross-sectional view of the press portion in the resin molding process continued from FIG. 28; 本発明のその他の構成例における樹脂モールド工程中のプレス部の模式的断面図である。It is a schematic cross section of the press part in the resin mold process in the other structural example of this invention. 図３０に続く樹脂モールド工程中のプレス部の模式的断面図である。FIG. 31 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 30; 図３１に続く樹脂モールド工程中のプレス部の模式的断面図である。FIG. 32 is a schematic cross-sectional view of the press portion in the resin molding process continued from FIG. 31; 本発明の第７実施形態における樹脂モールド工程中のプレス部の模式的断面図である。It is a typical sectional view of the press part in the resin mold process in a 7th embodiment of the present invention. 図３３に続く樹脂モールド工程中のプレス部の模式的断面図である。It is a schematic cross section of the press part in the resin mold process following FIG. 図３４に続く樹脂モールド工程中のプレス部の模式的断面図である。It is a schematic cross section of the press part in the resin mold process following FIG. 図３５に続く樹脂モールド工程中のプレス部の模式的断面図である。FIG. 36 is a schematic cross-sectional view of the press portion in the resin molding process continued from FIG. 35; 本発明の第８実施形態における樹脂モールド装置の型開き状態の正面説明図である。It is front explanatory drawing of the type | mold open state of the resin mold apparatus in 8th Embodiment of this invention. 図３７の可動プラテンの平面図である。FIG. 38 is a plan view of the movable platen of FIG. 37. 図３９Ａ及び図３９Ｂは、図３７に続く型閉じ動作途中のモールド金型の断面説明図である。39A and 39B are cross-sectional explanatory views of the molding die during the mold closing operation continued from FIG. 図４０Ａ～図４０Ｃは、モールド金型の一例と型閉じ動作を示す断面説明図である。40A to 40C are cross-sectional explanatory views showing an example of a mold and a mold closing operation. 図４１Ａ～図４１Ｃは、モールド金型の他例と型閉じ動作を示す断面説明図である。41A to 41C are cross-sectional explanatory views showing another example of the mold and the mold closing operation.
　以下の本発明における実施形態では、必要な場合に複数のセクションなどに分けて説明するが、原則、それらはお互いに無関係ではなく、一方は他方の一部または全部の変形例、詳細などの関係にある。このため、全図において、同一の機能を有する部材には同一の符号を付し、その繰り返しの説明は省略する場合がある。また、同様の構成から得られる同様の効果についてはその繰り返しの説明は省略する場合がある。 The following embodiments of the present invention will be described by dividing them into a plurality of sections if necessary, but in principle, they are not unrelated to each other, and one is a relation such as some or all of modifications or details of the other. It is in. Therefore, in all the drawings, members having the same function are denoted by the same reference numerals, and repeated descriptions thereof may be omitted. Moreover, the description of the repetition may be abbreviate | omitted about the same effect obtained from the same structure.
　また、構成要素の数（個数、数値、量、範囲などを含む）については、特に明示した場合や原理的に明らかに特定の数に限定される場合などを除き、その特定の数に限定されるものではなく、特定の数以上でも以下でも良い。また、構成要素などの形状に言及するときは、特に明示した場合および原理的に明らかにそうではないと考えられる場合などを除き、実質的にその形状などに近似または類似するものなどを含むものとする。 In addition, the number of components (including the number, numerical value, amount, range, etc.) is limited to the specific number unless explicitly stated or the principle is clearly limited to a specific number. It may be more or less than a specific number. In addition, when referring to shapes such as components, it is to be understood that substantially similar or similar to the shapes etc. is included unless specifically stated otherwise and when it is considered that it is not clearly apparent in principle. .
　（第１実施形態）
　まず、本実施形態における樹脂モールド装置１００について図１を参照して説明する。図１は、樹脂モールド装置１００を平面レイアウトで示す全体構成図である。この樹脂モールド装置１００は、樹脂モールドを行う構成であることはもちろん、樹脂モールド後のワーク（成形品）を検査してから、良品を加熱硬化（ポストキュア）させて収納する構成も含むものとなっている。 First Embodiment
First, the resin mold apparatus 100 according to the present embodiment will be described with reference to FIG. FIG. 1 is an overall configuration diagram showing the resin molding apparatus 100 in a planar layout. The resin molding apparatus 100 includes not only a configuration for resin molding but also a configuration for heat curing (post curing) and storing a non-defective item after inspecting a work (molded product) after resin molding. It has become.
　樹脂モールド装置１００は、種々の処理工程を行う処理部として、ワーク供給部１１０、樹脂供給部１２０、プレス部１３０、ワーク検査部・冷却部１４０、キュア部１５０（キュア炉）、ワーク収納部１６０を備えている。また、樹脂モールド装置１００は、各処理工程を制御する制御部１７０を備えている。各処理部としては、少なくとも単数で構成されていればよく、本実施形態では、樹脂供給部１２０、プレス部１３０がそれぞれ２機（複数）で構成されている場合を示す。このように、他の処理部より処理時間の掛かるものを複数で構成することで、樹脂モールド装置１００全体の稼働率を向上することができる。 The resin mold apparatus 100 includes a work supply unit 110, a resin supply unit 120, a press unit 130, a work inspection unit / cooling unit 140, a cure unit 150 (cure furnace), and a work storage unit 160 as processing units that perform various processing steps. Is equipped. Moreover, the resin mold apparatus 100 is provided with the control part 170 which controls each processing process. As each processing part, at least one should just be comprised, and the case where the resin supply part 120 and the press part 130 are each comprised by two machines (plurality) is shown by this embodiment. As described above, the operation rate of the entire resin mold apparatus 100 can be improved by configuring a plurality of processing units that require longer processing time than other processing units.
　また、樹脂モールド装置１００は、処理部間にワークや樹脂を搬送する搬送ロボットを備えたロボット機構部１８０を備えている。搬送ロボットは、例えば、各処理部間を回転および直線移動可能で、多関節の先にハンドを有するロボットである。樹脂モールド装置１００では、ロボット機構部１８０（搬送ロボット）を囲んで各処理部を配置している。このため、各処理部間でのワークや樹脂の移動距離（図１では破線でワークや樹脂の移動を示す。）が短縮され、効率のよいワーク搬送をすることができる。なお、ロボット機構部１８０に替えて、エアシリンダやリニアモータのような直動機構によって構成された搬送ロボット以外の搬送機構によって処理部間にワークや樹脂を搬送してもよい。 In addition, the resin mold apparatus 100 includes a robot mechanism unit 180 provided with a transfer robot for transferring a work or resin between the processing units. The transfer robot is, for example, a robot that can rotate and linearly move between the processing units, and has a hand at an end of an articulated joint. In the resin mold apparatus 100, each processing unit is disposed so as to surround the robot mechanism unit 180 (transport robot). For this reason, the movement distance of the work or resin between the processing units (the movement of the work or resin is indicated by a broken line in FIG. 1) is shortened, and the work can be efficiently transported. Note that instead of the robot mechanical unit 180, a workpiece or resin may be transported between the processing units by a transport mechanism other than a transport robot configured by a linear motion mechanism such as an air cylinder or a linear motor.
　ワーク供給部１１０（図１参照）は、樹脂モールドが行われるプレス部１３０へワークを供給するための処理部である。ワーク供給部１１０は、成形前のワーク（被成形品）を複数収納することができるマガジン（図示せず）を備えている。このマガジンから供給されたワークは、ロボット機構部１８０の搬送ロボットによってロボット機構部１８０が備えるワーク載置部（図示せず）に一時的に載置され、プレス部１３０が備えるローダ１９０（搬送部）によってプレス部１３０へ搬送される。 The workpiece supply unit 110 (see FIG. 1) is a processing unit for supplying a workpiece to the press unit 130 where resin molding is performed. The work supply unit 110 includes a magazine (not shown) capable of storing a plurality of works (formed products) before forming. The work supplied from this magazine is temporarily placed on a work placement unit (not shown) provided to the robot mechanism unit 180 by the transfer robot of the robot mechanism unit 180, and the loader 190 (transfer unit provided to the press unit 130 ) To the press unit 130.
　樹脂供給部１２０（図１参照）は、樹脂モールドが行われるプレス部１３０へ樹脂を供給するための処理部である。ここで、樹脂供給部１２０について図２を参照して説明する。図２は、顆粒タイプの樹脂Ｒ（以下、顆粒樹脂という。）を供給する樹脂供給部１２０の動作を説明するための図である。 The resin supply unit 120 (see FIG. 1) is a processing unit for supplying the resin to the press unit 130 where resin molding is performed. Here, the resin supply unit 120 will be described with reference to FIG. FIG. 2 is a diagram for explaining the operation of the resin supply unit 120 for supplying the granular type resin R (hereinafter referred to as granular resin).
　図２に示すように、樹脂供給部１２０は、顆粒樹脂Ｒを貯留することができる樹脂貯留部１２１、複数の小型の樹脂貯留部１２２と、樹脂供給領域（供給対象）へ顆粒樹脂Ｒを供給する複数のトラフ１２３とを備えている。対をなす樹脂貯留部１２２とトラフ１２３とは連通されており、ＸＹ駆動機構（図示しない）によって移動可能に設けられている。樹脂貯留部１２１は、固定して設けられて顆粒樹脂Ｒを大量に貯留することができ、これよりも小型の樹脂貯留部１２２へ小分けして顆粒樹脂Ｒを供給する。そして、電磁フィーダ（図示しない）によって樹脂貯留部１２２からトラフ１２３へ顆粒樹脂Ｒが送り出されて、樹脂供給領域に所定の形状（例えば、平坦状）に投下される。 As shown in FIG. 2, the resin supply unit 120 supplies the granular resin R to the resin storage portion 121 capable of storing granular resin R, a plurality of small resin storage portions 122, and the resin supply region (supply target). And a plurality of troughs 123. The resin storage part 122 and the trough 123 which make a pair are in communication, and are provided movably by an XY drive mechanism (not shown). The resin storage portion 121 can be fixedly provided to store a large amount of granular resin R, and can supply the granular resin R by dividing into smaller resin storage portions 122 than this. Then, the granular resin R is sent out from the resin storage portion 122 to the trough 123 by an electromagnetic feeder (not shown), and dropped into a resin supply region in a predetermined shape (for example, a flat shape).
　樹脂貯留部１２２およびトラフ１２３の対は、少なくとも一対設けられていればよいが、複数対（図２では、三対）設けることで樹脂供給領域への顆粒樹脂Ｒの投下時間を短縮することができる。三対の樹脂貯留部１２２およびトラフ１２３は、連結部材１２４によって連結されている。この連結により、各対に電磁フィーダを設けなくとも一つの電磁フィーダで同時に同程度の量の樹脂を所望の形状となるように樹脂供給領域に供給することができる。このように、複数の樹脂供給用構造を設けることで、正確な分量の樹脂を素早く供給することができる。同様に、液状樹脂を供給するディスペンサを複数備えてもよい。この場合にも、正確な分量の液状樹脂を素早く供給することができる。 At least a pair of resin reservoir 122 and trough 123 may be provided, but by providing a plurality of pairs (three pairs in FIG. 2), it is possible to shorten the dropping time of granular resin R to the resin supply region. it can. The three pairs of resin reservoirs 122 and troughs 123 are connected by a connecting member 124. By this connection, even if an electromagnetic feeder is not provided in each pair, it is possible to simultaneously supply the same amount of resin to the resin supply region so as to have a desired shape by one electromagnetic feeder. Thus, by providing a plurality of resin supply structures, it is possible to quickly supply an accurate amount of resin. Similarly, a plurality of dispensers for supplying liquid resin may be provided. Also in this case, the correct quantity of liquid resin can be quickly supplied.
　樹脂供給部１２０での供給対象は、リリースフィルムＦである。リリースフィルムＦには、例えば、ＦＥＰフィルム、ＰＥＴフィルム、フッ素含浸ガラスクロス、ポリ塩化ビニリデン、ＰＴＦＥ、ＥＴＦＥなどの一定の柔軟性、伸縮性、耐熱性のフィルムが用いられる。そして、樹脂供給対象となるリリースフィルムＦは、ロール状の状態から支持台１２５上において一方の把持部材１２６により引き出され、所定幅となる位置において把持部材１２６、１２６で把持された状態で、一回の成形分のフィルム幅に切断部材１２７（例えば、カッタ）で切断されて、所定の形状（例えば、短冊状）の状態となる。 The supply target of the resin supply unit 120 is the release film F. For the release film F, for example, a film having a certain degree of flexibility, elasticity, heat resistance, such as FEP film, PET film, fluorine-impregnated glass cloth, polyvinylidene chloride, PTFE, ETFE, etc. is used. Then, the release film F to be supplied with the resin is pulled out by the one gripping member 126 on the support base 125 from the rolled state, and is gripped by the gripping members 126 and 126 at the predetermined width. It is cut by a cutting member 127 (e.g., a cutter) into a film width corresponding to the number of times of molding, to be in a predetermined shape (e.g., a strip shape).
　リリースフィルムＦ（樹脂供給領域）への樹脂供給は、まず、各トラフ１２３が一列目の供給領域の延在方向（Ｘ方向）に移動しながら顆粒樹脂Ｒを供給していき、一列分の矩形状供給領域に樹脂供給が終了した後、二列目方向（Ｙ方向）に向けて移動する。次いで、各トラフ１２３が二列目の供給領域の延在方向（Ｘ方向）に移動しながら顆粒樹脂Ｒを供給していき、一列分の樹脂供給が終了した後、三列目方向（Ｙ方向）に移動する。次いで、各トラフ１２３が三列目の供給領域の延在方向（Ｘ方向）に移動しながら顆粒樹脂Ｒを供給していき、一列分の樹脂供給が終了して、樹脂供給領域全体への樹脂供給が終了する。 The resin supply to the release film F (resin supply area) is performed by supplying granular resin R while moving each trough 123 in the extending direction (X direction) of the supply area in the first row, After the resin supply to the shape supply region is completed, it moves in the second row direction (Y direction). Next, granular resin R is supplied while each trough 123 moves in the extending direction (X direction) of the supply region in the second row, and after resin supply for one row is completed, the third row direction (Y direction) Move to). Next, granular resin R is supplied while each trough 123 moves in the extending direction (X direction) of the supply region in the third row, and resin supply for one row is completed, and resin to the entire resin supply region Supply ends.
　このような樹脂供給部１２０によれば、リリースフィルムＦ上に、所定の領域（面積）、所定の厚み（高さ）で顆粒樹脂Ｒを所定の時間で供給（搭載）することができる。そして、リリースフィルムＦ上に供給された顆粒樹脂Ｒは、リリースフィルムＦとともに、ロボット機構部１８０によってローダ１９０へ搬送された後、ローダ１９０によりプレス部１３０の内部へ搬入される。このため、リリースフィルムＦは、樹脂Ｒを搬送するキャリアフィルムでもある。 According to such a resin supply unit 120, the granular resin R can be supplied (mounted) on the release film F with a predetermined area (area) and a predetermined thickness (height) for a predetermined time. Then, the granular resin R supplied onto the release film F is transported to the loader 190 by the robot mechanical unit 180 together with the release film F, and is then carried into the inside of the press unit 130 by the loader 190. For this reason, the release film F is also a carrier film for transporting the resin R.
　プレス部１３０（図１参照）は、ワークへ樹脂モールドを行い、モールド樹脂部（成形部）を成形するための処理部である。この処理工程については、後に詳細に説明する。成形後のワークは、ローダ１９０によってロボット機構部１８０が備えるワーク載置部（図示せず）に一時的に載置され、ロボット機構部１８０の搬送ロボットに渡される。 The press unit 130 (see FIG. 1) is a processing unit for performing resin molding on a work to form a mold resin unit (molding unit). This processing step will be described in detail later. The workpiece after molding is temporarily placed on a workpiece placement unit (not shown) provided in the robot mechanical unit 180 by the loader 190, and passed to the transfer robot of the robot mechanical unit 180.
　ワーク検査部・冷却部１４０（図１参照）は、成形後のワーク（成形品）の状態を検査するための処理部であり、また、加熱されているワークを冷却するための処理部である。冷却部は、ワーク検査部とは別個に設けることもできるが、ワーク検査部の空き領域に配置することで、構成をコンパクトにすることができる。 The workpiece inspection unit / cooling unit 140 (see FIG. 1) is a processing unit for inspecting the state of the workpiece (molded product) after molding, and is a processing unit for cooling the workpiece being heated. . The cooling unit can be provided separately from the workpiece inspection unit, but the arrangement can be made compact by arranging the cooling unit in a vacant area of the workpiece inspection unit.
　ワーク検査部の検査項目としては、例えば、ワークの厚み計測、ワークの外観検査などがある。これらの検査結果は、制御部１７０へ送信されて処理される。例えば、成形品を一括あるいは分割して撮像して外観観察によって未充填などの成形不良がないか否かが検査される。成形の良否と不良がある場合には不良の種類や撮像画像を稼働情報として制御部１７０の記憶部に記憶する。異常（想定を上回る未充填など）が検出されたときには装置全体の動作を止めてメンテナンスすることで、不良品が連続生産されるのを防止することができる。検査が終了すると、ワーク検査部・冷却部１４０のワーク受け渡し位置から搬送ロボットによってワークがキュア部１５０へ搬送される。 The inspection items of the workpiece inspection unit include, for example, thickness measurement of the workpiece and appearance inspection of the workpiece. These inspection results are transmitted to the control unit 170 and processed. For example, molded articles are collectively or divided and imaged, and it is inspected by appearance observation whether there is any molding defect such as unfilled. If there is a molding failure or failure, the type of failure or the captured image is stored in the storage unit of the control unit 170 as operation information. By stopping the operation of the entire apparatus and performing maintenance when an abnormality (such as an unfilled state more than expected) is detected, it is possible to prevent continuous production of defective products. When the inspection is completed, the workpiece is transported to the curing unit 150 by the transport robot from the workpiece delivery position of the workpiece inspection unit / cooling unit 140.
　キュア部１５０（図１参照）は、ワークのモールド樹脂部を加熱硬化（ポストキュア）するための処理部である。キュア部１５０は、外部に対して開閉扉（図示せず）によって閉塞され、内部が所定温度に加熱されている。搬送ロボットに保持されているワークがキュア炉１５０に近づくと開閉扉が開放され、ワークが内部に配置されて搬送ロボットが退避すると開閉扉が閉塞し、所定時間加熱硬化される。その後、キュア部１５０から搬送ロボットによって搬出されたワークは、ワーク検査部・冷却部１４０で冷却された後、ワーク収納部１６０へ搬送される。 The curing unit 150 (see FIG. 1) is a processing unit for heat curing (post curing) the mold resin portion of the workpiece. The curing unit 150 is closed to the outside by an open / close door (not shown), and the inside is heated to a predetermined temperature. When the workpiece held by the transfer robot approaches the curing furnace 150, the open / close door is opened, and when the work is disposed inside and the transfer robot retracts, the open / close door is closed and heat curing is performed for a predetermined time. Thereafter, the work carried out of the curing unit 150 by the transfer robot is cooled by the work inspection unit / cooling unit 140 and then conveyed to the work storage unit 160.
　ワーク収納部１６０（図１参照）は、樹脂モールド装置１００の最終工程としてワークを収納するための処理部である。ワーク収納部１６０は、ワーク供給部１１０と同様のマガジンを備えており、このマガジンにロボット機構部１８０の搬送ロボットによってワーク（成形品）が収納されていく。 The workpiece storage unit 160 (see FIG. 1) is a processing unit for storing a workpiece as a final process of the resin molding apparatus 100. The workpiece storage unit 160 includes a magazine similar to the workpiece supply unit 110, and a workpiece (molded product) is stored in the magazine by the transport robot of the robot mechanism unit 180.
　次に、本実施形態における樹脂モールド装置１００のプレス部１３０について図３を参照して説明する。図３は、本実施形態におけるプレス部１３０の模式的断面図である。この図３では、被成形品の状態のワークＷも示している。ワークＷは、基板１０（例えば、配線基板）上にチップ部品１１（例えば、半導体チップ）がダイボンドにより実装され、ボンディングワイヤ（図示せず）によって基板１０とチップ部品１１とが電気的に接続されている。 Next, the press part 130 of the resin mold apparatus 100 in the present embodiment will be described with reference to FIG. FIG. 3 is a schematic cross-sectional view of the press unit 130 in the present embodiment. FIG. 3 also shows the workpiece W in the state of the article to be molded. In the work W, a chip component 11 (for example, a semiconductor chip) is mounted on a substrate 10 (for example, a wiring substrate) by die bonding, and the substrate 10 and the chip component 11 are electrically connected by bonding wires (not shown). ing.
　プレス部１３０は、モールド金型３０（対をなす上型３１および下型３２）を備えている。本実施形態では、下型３２を可動型とし上型３１を固定型として説明するが、上型３１を可動型、下型３２を固定型としたり、上型３１および下型３２を可動型としたりする場合でもよい。 The press unit 130 includes a mold 30 (a pair of upper mold 31 and lower mold 32). In this embodiment, the lower mold 32 is a movable mold and the upper mold 31 is a fixed mold, but the upper mold 31 is a movable mold, the lower mold 32 is a fixed mold, or the upper mold 31 and the lower mold 32 are movable. If you want to
　モールド金型３０では、上型３１にワークＷが保持され、下型３２にキャビティ凹部３３（ワーククランプ時にキャビティＣを構成する。）が設けられている。モールド金型３０は、キャビティ凹部３３の底部を構成する下型キャビティ駒３４とこれを囲ってキャビティ凹部３３の側部（壁部）を構成する下型クランパ３５とを備えている。モールド金型３０では、下型クランパ３５に対して下型キャビティ駒３４が相対的に移動することでキャビティ凹部３３の深さ（高さ）が変化してキャビティＣの容積が変化する。 In the mold 30, the work W is held by the upper mold 31, and the lower mold 32 is provided with a cavity recess 33 (which constitutes the cavity C at the time of work clamping). The mold 30 includes a lower mold cavity piece 34 constituting the bottom of the cavity recess 33 and a lower mold clamper 35 surrounding the lower mold cavity piece 34 and constituting the side (wall) of the cavity recess 33. In the mold 30, when the lower mold cavity piece 34 moves relative to the lower mold clamper 35, the depth (height) of the cavity recess 33 changes and the volume of the cavity C changes.
　上型３１の構成について具体的に説明する。上型３１は、上型ベース３６と、上型インサート３７と、上型クランパ４０とを備えている。上型ベース３６の下面に、図示しないヒータを備えてワークＷを加熱可能に構成された上型インサート３７が固定して組み付けられ、また、上型クランパ４０が上下方向に移動可能に組み付けられている。上型クランパ４０は、一枚の板状金型から構成され、これに貫通孔４１が形成されている。この上型クランパ４０の貫通孔４１に、上型インサート３７が挿入して配置されている。すなわち、上型インサート３７は、上型クランパ４０に囲まれている。 The structure of the upper mold 31 will be specifically described. The upper mold 31 includes an upper mold base 36, an upper mold insert 37, and an upper clamper 40. An upper mold insert 37 having a heater (not shown) and configured to be able to heat the work W is fixed and assembled on the lower surface of the upper mold base 36, and the upper mold clamper 40 is assembled movably in the vertical direction There is. The upper clamper 40 is formed of a single plate-shaped die, and a through hole 41 is formed in the upper die. The upper mold insert 37 is inserted into the through hole 41 of the upper clamper 40 and disposed. That is, the upper mold insert 37 is surrounded by the upper clamper 40.
　上型クランパ４０は、上型ベース３６に可動部を構成する弾性部材４２（例えば、スプリング）を介して上下方向に移動可能に組み付けられ、吊下げ支持（フローティング支持）されている。このため、上型ベース３６に対して、固定の上型インサート３７と、可動する上型クランパ４０との関係は、上型インサート３７が弾性部材４２の伸縮によって上型クランパ４０に対して相対的に移動することとなる。 The upper mold clamper 40 is vertically movably assembled to the upper mold base 36 via an elastic member 42 (for example, a spring) constituting a movable portion, and is suspended and supported (floating support). Therefore, with respect to the upper mold base 36, the relationship between the fixed upper mold insert 37 and the movable upper mold clamper 40 is such that the upper mold insert 37 is relative to the upper mold clamper 40 by the expansion and contraction of the elastic member 42. Will move to
　型開きしている場合のような弾性部材４２が付勢されていない状態（外部からの影響を受けていない状態）では、上型インサート３７の下面（下側の端面）は、上型クランパ４０の下面（下側の端面）よりも高い位置（上方の位置）にある。換言すると、上型クランパ４０の下面は、上型インサート３７の下面（下側の端面）よりも低い位置（下方の位置）にある。後述するが、このような高低差をつけて、型閉じするときに上型クランパ４０と下型クランパ３５とで密閉空間（チャンバー）を構成することで、減圧しながら樹脂モールドすることができる。また、上型クランパ４０に対して上型インサート３７を相対的に移動可能に設けることで、ワークＷの板厚に拘わらず均一な高さ位置でワークＷをクランプすることができる。 In a state where the elastic member 42 is not biased as in the case of mold opening (in a state where it is not influenced from the outside), the lower surface (lower end surface) of the upper mold insert 37 is the upper mold clamper 40. Is located higher (upper position) than the lower surface (lower end surface) of In other words, the lower surface of the upper clamper 40 is at a lower position (lower position) than the lower surface (lower end surface) of the upper mold insert 37. As will be described later, by forming a sealed space (chamber) with the upper clamper 40 and the lower clamper 35 when mold closing is performed with such height difference, resin molding can be performed while reducing pressure. Further, by providing the upper mold insert 37 so as to be movable relative to the upper mold clamper 40, the work W can be clamped at a uniform height position regardless of the thickness of the work W.
　また、上型３１は、上型インサート３７の外周面と上型クランパ４０の貫通孔４１の内周面との間に設けられたシール部材４３（例えば、Ｏリング）を備えている。このシール部材４３は、ワーククランプ時に形成されるキャビティＣ内を減圧にするために、上型インサート３７の外周面と上型クランパ４０の貫通孔４１の内周面との間の隙間がエア路４１Ａとなるようにシールしている（図７参照）。 Further, the upper die 31 includes a seal member 43 (for example, an O-ring) provided between the outer peripheral surface of the upper die insert 37 and the inner peripheral surface of the through hole 41 of the upper die clamper 40. In this sealing member 43, a gap between the outer peripheral surface of the upper mold insert 37 and the inner peripheral surface of the through hole 41 of the upper mold clamper 40 is an air path in order to reduce the pressure in the cavity C formed during workpiece clamping. It is sealed to be 41A (see FIG. 7).
　エア路４１Ａと連通するように、上型クランパ４０には、貫通孔４１の内周面から金型外部へ通じるエア路４４が形成されている。このエア路４４は、金型外部の減圧部４５（例えば、ポンプ）と連通されている。後述するが、隙間のエア路４１Ａおよびエア路４４を介して減圧部４５によって、キャビティＣが減圧される。 The upper mold clamper 40 is formed with an air passage 44 communicating from the inner peripheral surface of the through hole 41 to the outside of the mold so as to communicate with the air passage 41A. The air passage 44 is in communication with a pressure reducing portion 45 (for example, a pump) outside the mold. As will be described later, the cavity C is depressurized by the depressurizing unit 45 via the air passage 41A and the air passage 44 in the gap.
　なお、上型３１には、ワークＷを保持するワーク保持部が設けられている（図２７参照）。このワーク保持部は、上型インサート３７の端面に連通するエア路９０を設け、このエア路９０に通じる減圧部９１によって、上型インサート３７の下面にワークＷの基板１０の裏面を合わさるように吸着させ、ワークＷを保持する。あるいは、ワーク保持部は、上型インサート３７の端面に設けられた爪部や、静電チャックによってワークＷを保持する場合であってもよい。 In addition, the upper mold 31 is provided with a workpiece holding unit that holds the workpiece W (see FIG. 27). The work holding portion is provided with an air passage 90 communicating with the end face of the upper mold insert 37, and a pressure reducing portion 91 communicating with the air path 90 brings the back surface of the substrate 10 of the work W into alignment with the lower surface of the upper mold insert 37. The work W is held by suction. Alternatively, the workpiece holding portion may hold the workpiece W by a claw portion provided on the end face of the upper mold insert 37 or an electrostatic chuck.
　下型３２の構成について具体的に説明する。可動型である下型３２は、駆動源（電動モータ）により駆動する駆動伝達機構（トグルリンク等のリンク機構若しくはねじ軸等）を介して下型可動プラテンを昇降させる公知の型クランプ機構によって型開閉が行われるようになっている。この場合、下型３２の昇降動作は移動速度や加圧力等を任意に設定することができる。 The configuration of the lower mold 32 will be specifically described. The lower mold 32, which is a movable mold, is manufactured by a known mold clamping mechanism that raises and lowers the lower mold movable platen via a drive transmission mechanism (a link mechanism such as a toggle link or a screw shaft) driven by a drive source (electric motor). Opening and closing is to be performed. In this case, the moving speed, the pressing force, and the like of the lower die 32 can be set arbitrarily.
　下型３２は、下型ベース４６と、下型キャビティ駒３４と、下型クランパ３５とを備えている。下型ベース４６の上面に、下型キャビティ駒３４が固定して組み付けられ、また、下型クランパ３５が上下方向に移動可能に組み付けられている。下型クランパ３５は、一枚の板状金型から構成され、これに貫通孔４７が形成されている。この下型クランパ３５の貫通孔４７に、下型キャビティ駒３４が挿入して配置されている。すなわち、下型キャビティ駒３４は、下型クランパ３５に囲まれている。また、下型キャビティ駒３４は、図示しないヒータを備えることで後述するように樹脂Ｒを加熱可能に構成されている。 The lower mold 32 includes a lower mold base 46, a lower mold cavity piece 34, and a lower clamper 35. A lower mold cavity piece 34 is fixedly mounted on the upper surface of the lower mold base 46, and a lower mold clamper 35 is mounted movably in the vertical direction. The lower clamper 35 is composed of a single plate-like mold, and a through hole 47 is formed in this. The lower mold cavity piece 34 is inserted into the through hole 47 of the lower clamper 35 and disposed. That is, the lower mold cavity piece 34 is surrounded by the lower mold clamper 35. The lower mold cavity piece 34 is configured to be able to heat the resin R as described later by providing a heater (not shown).
　下型クランパ３５は、下型ベース４６に可動部を構成する弾性部材５０（例えば、スプリング）を介して上下方向に移動可能に組み付けられ、フローティング支持されている。このため、下型ベース４６に対して固定の下型キャビティ駒３４と、可動する下型クランパ３５との関係は、下型キャビティ駒３４が弾性部材５０の伸縮によって下型クランパ３５に対して相対的に移動することとなる。 The lower clamper 35 is vertically movably assembled to the lower mold base 46 via an elastic member 50 (e.g., a spring) constituting a movable portion, and is floatingly supported. Therefore, the relationship between the lower mold cavity piece 34 fixed relative to the lower mold base 46 and the movable lower mold clamper 35 is such that the lower mold cavity piece 34 is relative to the lower mold clamper 35 by the expansion and contraction of the elastic member 50. Will move in a
　型開きしている場合のような弾性部材５０が付勢されていない状態（外部からの影響を受けていない状態）では、下型キャビティ駒３４の上面（上側の端面）は、下型クランパ３５の上面（上側の端面）よりも低い位置（下方の位置）にある。後述するが、このような高低差をつけて、下型クランパ３５に対して下型キャビティ駒３４を相対的に移動可能に設けることで、キャビティ凹部３３の深さ（キャビティＣの容積）を変化させることができる。 In a state where the elastic member 50 is not biased as in the case of mold opening (in a state where it is not influenced from the outside), the upper surface (upper end surface) of the lower mold cavity piece 34 is the lower mold clamper 35. Lower position (lower position) than the upper surface (upper end surface) of As will be described later, the depth (volume of the cavity C) of the cavity recess 33 is changed by providing the lower mold cavity piece 34 movably relative to the lower mold clamper 35 with such a height difference. It can be done.
　また、下型３２は、下型キャビティ駒３４の外周面と下型クランパ３５の貫通孔４７の内周面との間に設けられたシール部材５１（例えば、Ｏリング）を備えている。このシール部材５１は、下型３２のパーティング面に配置されるリリースフィルムＦを吸引するために、下型キャビティ駒３４の外周面と下型クランパ３５の貫通孔４７の内周面との間の隙間がエア路４７Ａとなるようにシールしている（図５参照）。下型キャビティ駒３４の上面と、下型クランパ３５の貫通孔４７の内周面とがキャビティ凹部３３を構成するので、エア路４７Ａは、キャビティ凹部３３の底部と側部との角部に連通することとなる。 Further, the lower mold 32 is provided with a seal member 51 (for example, an O-ring) provided between the outer peripheral surface of the lower mold cavity piece 34 and the inner peripheral surface of the through hole 47 of the lower mold clamper 35. The seal member 51 is disposed between the outer peripheral surface of the lower mold cavity piece 34 and the inner peripheral surface of the through hole 47 of the lower clamper 35 in order to suck the release film F disposed on the parting surface of the lower mold 32. Is sealed so as to form an air passage 47A (see FIG. 5). The upper surface of the lower mold cavity piece 34 and the inner peripheral surface of the through hole 47 of the lower clamper 35 constitute the cavity recess 33, so the air passage 47 A communicates with the bottom of the cavity recess 33 and the corner between the side It will be done.
　このエア路４７Ａと連通するように、下型クランパ３５には、貫通孔４７の内周面から金型外部へ通じるエア路５２が形成されている。このエア路５２は、金型外部の吸着部５３（例えば、ポンプ）と連通されている。後述するが、隙間のエア路４７Ａおよびエア路５２を介して吸着部５３によって、リリースフィルムＦの中央部がキャビティ凹部３３の形状に追従して吸着保持される。 The lower mold clamper 35 is formed with an air passage 52 communicating from the inner peripheral surface of the through hole 47 to the outside of the mold so as to communicate with the air passage 47A. The air passage 52 is in communication with a suction unit 53 (for example, a pump) outside the mold. As will be described later, the central portion of the release film F follows the shape of the cavity recess 33 and is held by suction by the suction unit 53 via the air passage 47A and the air passage 52 in the gap.
　また、下型クランパ３５には、下型クランパ３５の上面から金型外部へ通じるエア路５４が形成されている。このエア路５４は、金型外部の吸着部５５（例えば、ポンプ）と連通されている。後述するが、エア路５４を介して吸着部５５によって、リリースフィルムＦの外周部が下型クランパ３５のクランプ面に吸着保持される。 In the lower clamper 35, an air passage 54 is formed which leads from the upper surface of the lower clamper 35 to the outside of the mold. The air passage 54 is in communication with a suction unit 55 (for example, a pump) outside the mold. As described later, the outer peripheral portion of the release film F is held by suction on the clamp surface of the lower clamper 35 by the suction unit 55 through the air passage 54.
　また、各プレス部１３０に隣接して、ワークＷを上型３１へ搬送可能なワークローダ５６と、樹脂ＲおよびリリースフィルムＦを下型３２へ搬送可能なフィルムローダ５７とを有するローダ１９０（図１参照）を備えられている。ローダ１９０では、ワークローダ５６およびフィルムローダ５７は、ロボット機構部１８０からプレス部１３０内部へワークＷやリリースフィルムＦを受渡し可能に構成され、図示しない駆動機構によってそれぞれ別系統で駆動されてプレス部１３０へワークＷやリリースフィルムＦの搬出入が可能となっている。なお、フィルムローダ５７は、樹脂ＲおよびリリースフィルムＦをローダ１９０内でロボット機構部１８０から受け取る構成としてもよいし、ロボット機構部１８０により樹脂供給部１２０に搬送されて樹脂ＲおよびリリースフィルムＦを供給されてもよい。 Further, a loader 190 having a work loader 56 capable of transporting the work W to the upper die 31 and a film loader 57 capable of transporting the resin R and the release film F to the lower die 32 adjacent to each press portion 130 (see FIG. 1) provided. In the loader 190, the work loader 56 and the film loader 57 are configured to be able to deliver the work W and the release film F from the robot mechanical unit 180 to the inside of the press unit 130, and are driven by different systems by a drive mechanism not shown. It is possible to carry out the work W and the release film F to 130. The film loader 57 may be configured to receive the resin R and the release film F from the robot mechanical unit 180 in the loader 190, or the robot mechanical unit 180 may convey the resin R and the release film F to the resin supply unit 120. It may be supplied.
　ワークローダ５６は、支持板６０と、支持部６１と、位置決め部６２とを備えている。支持板６０は、その平面領域の大きさが、例えば上型クランパ４０の貫通孔４１の平面領域よりも大きく構成されている。この支持板６０の上面に、所定の高さで平面視リング状の支持部６１が設けられている。また、支持板６０の上面であって支持部６１よりも外側に、所定の高さで複数の位置決め部６２（例えば、ピン）が設けられている。 The work loader 56 includes a support plate 60, a support portion 61, and a positioning portion 62. The size of the flat area of the support plate 60 is larger than, for example, the flat area of the through hole 41 of the upper clamper 40. On the upper surface of the support plate 60, a support portion 61 in a ring shape in plan view is provided at a predetermined height. In addition, a plurality of positioning portions 62 (for example, pins) are provided at a predetermined height on the upper surface of the support plate 60 and outside the support portion 61.
　支持部６１は、その平面領域がワークＷの基板１０の外縁内側に沿って設けられて、基板１０の平面領域とできるだけ同程度となるように設けられている。また、支持部６１は、その高さがワークＷの基板１０に搭載された部材の高さ（例えばチップ部品１１の厚みやボンディングワイヤの高さ）よりも高くなるように設けられている。これにより、ワークＷは、チップ部品１１およびボンディングワイヤ（図示せず）に対して支持板６０が接触（干渉）しないように、基板１０の表面外周部で支持部６１によって支持される。 The support portion 61 is provided along the inner side of the outer edge of the substrate 10 of the workpiece W so that the planar region is as similar as possible to the planar region of the substrate 10. Further, the support portion 61 is provided such that the height thereof is higher than the height of a member mounted on the substrate 10 of the workpiece W (for example, the thickness of the chip part 11 and the height of the bonding wire). Thus, the workpiece W is supported by the support portion 61 on the outer surface of the substrate 10 so that the support plate 60 does not contact (interfere with) the chip component 11 and the bonding wire (not shown).
　位置決め部６２は、上型クランパ４０の貫通孔４１の内周面に接触することで、ワークローダ５６を上型インサート３７に対して位置決め可能に構成され、一例としてその平面配置が上型クランパ４０の平面視矩形状の貫通孔４１の角部それぞれに設けられている。また、位置決め部６２は、その高さがワークＷを上型インサート３７に渡される前に貫通孔４１の内周面と接するように設けられている。これにより、ワークＷは、上型インサート３７の下面の所定領域に配置されるように、位置決め部６２によって位置決めされる。 The positioning portion 62 is configured to be able to position the work loader 56 with respect to the upper mold insert 37 by coming into contact with the inner peripheral surface of the through hole 41 of the upper mold clamper 40. It is provided in each corner of the through hole 41 having a rectangular shape in plan view. Further, the positioning portion 62 is provided such that its height is in contact with the inner peripheral surface of the through hole 41 before the workpiece W is transferred to the upper mold insert 37. Thereby, the workpiece W is positioned by the positioning portion 62 so as to be disposed in a predetermined area of the lower surface of the upper mold insert 37.
　このような構成のワークローダ５６によって、ワークＷの基板１０の裏面を上型インサート３７の下面に接触させて、ワークＷが上型３１へ引き渡される。このとき、支持部６１によって基板１０が上型インサート３７の下面に押し付けられ、この基板１０（ワークＷ）が上型３１の保持部によって保持されることとなる。 The work loader 56 transfers the work W to the upper mold 31 by bringing the back surface of the substrate 10 of the work W into contact with the lower surface of the upper mold insert 37. At this time, the substrate 10 is pressed against the lower surface of the upper mold insert 37 by the support portion 61, and the substrate 10 (work W) is held by the holding portion of the upper mold 31.
　フィルムローダ５７は、樹脂Ｒが搭載されたリリースフィルムＦを吸着して保持するハンド部６３を備えている。ハンド部６３は、リリースフィルムＦを保持する保持面６４（吸着面）と、保持面６４に通じるエア路６５と、保持面６４から凹んだ凹部６６とを有する。 The film loader 57 is provided with a hand portion 63 for adsorbing and holding the release film F on which the resin R is mounted. The hand portion 63 has a holding surface 64 (suction surface) for holding the release film F, an air passage 65 communicating with the holding surface 64, and a recess 66 recessed from the holding surface 64.
　保持面６４は、その大きさ（ハンド部６３の平面領域の大きさ）が、例えば短冊状のリリースフィルムＦの平面領域の外周に沿って吸着可能な大きさとなっている。凹部６６は、保持面６４の領域内で、例えばｎ行ｍ列（ｎ、ｍの少なくともいずれかが２以上）のマトリクス配置されるようにハンド部６３に複数形成されている。エア路６５は、凹部６６と干渉せずに保持面６４（例えば、保持面６４の外周部や、凹部６６間の保持面６４）からハンド部６３の外部へ通じるようにハンド部６３に形成されている。保持面６４へ通じるエア路６５は、凹部６６の周囲（各凹部６６間）に設けられている。また、エア路６５は、ハンド部６３の外部の吸着部６７（例えば、ポンプ）と連通されている。これによって、樹脂Ｒが搭載されたリリースフィルムＦを、樹脂Ｒを囲んで吸着することで必要に応じて外周において引っ張りを加えながら保持することができ、樹脂Ｒの重みによってリリースフィルムＦが撓まないようにフラットに吸着保持することができる。なお、ここでいう、リリースフィルムＦがフラットな状態とは、リリースフィルムＦが折り曲げられたり歪められたりしておらず樹脂Ｒの搬送やモールド金型３０へのセットに問題のない程度に平らな状態をいい、必ずしも完全な平面となっている必要はない。 The holding surface 64 has a size (size of the flat area of the hand portion 63) which can be adsorbed along the outer periphery of the flat area of the strip-like release film F, for example. A plurality of concave portions 66 are formed in the hand portion 63 so as to be arranged in a matrix of, for example, n rows and m columns (at least one of n and m is 2 or more) in the area of the holding surface 64. The air passage 65 is formed in the hand portion 63 so as to communicate with the outside of the hand portion 63 from the holding surface 64 (for example, the outer peripheral portion of the holding surface 64 and the holding surface 64 between the concave portions 66) without interference with the concave portions 66. ing. An air passage 65 leading to the holding surface 64 is provided around the recesses 66 (between the recesses 66). In addition, the air passage 65 is in communication with a suction portion 67 (for example, a pump) outside the hand portion 63. As a result, the release film F loaded with the resin R can be held while being tensioned at the outer periphery as necessary by attracting and absorbing the resin R, and the weight of the resin R causes the release film F to bend. It can be adsorbed and held flat so that it does not occur. Here, the flat state of the release film F means that the release film F is not bent or distorted, and is flat to the extent that there is no problem in transporting the resin R or setting it in the molding die 30. It does not have to be a perfect plane.
　このような構成のフィルムローダ５７によって、凹部６６でリリースフィルムＦに搭載された樹脂Ｒに対しては逃がしを確保しながら、凹部６６の周囲のエア路６５からリリースフィルムＦを吸引している。これにより、保持面６４にリリースフィルムＦがフラットに保持された状態（変形のない状態）で、樹脂ＲおよびリリースフィルムＦが下型３２へ渡される。また、凹部６６によって樹脂Ｒに対する逃がしを確保することができるので、リリースフィルムＦに搭載された樹脂Ｒの状態（形状、量）を保持することができる。なお、本実施形態では、リリースフィルムＦの全面ではなく、複数のエリア（複数の凹部６６に対応している。）に分かれて樹脂Ｒが搭載される。なお、リリースフィルムＦの強度や樹脂Ｒの重量によってはリリースフィルムＦの外周のみで吸引して保持することもできる。 With the film loader 57 having such a configuration, the release film F is suctioned from the air passage 65 around the recess 66 while securing the release of the resin R mounted on the release film F in the recess 66. As a result, the resin R and the release film F are delivered to the lower mold 32 in a state where the release film F is held flat on the holding surface 64 (in a state without deformation). Further, since the relief to the resin R can be secured by the concave portion 66, the state (shape, amount) of the resin R mounted on the release film F can be maintained. In the present embodiment, the resin R is mounted not in the entire surface of the release film F but in a plurality of areas (corresponding to a plurality of recesses 66). In addition, depending on the strength of the release film F and the weight of the resin R, it is possible to suck and hold only the outer periphery of the release film F.
　次に、本実施形態における樹脂モールド装置１００を用いた樹脂モールド方法（樹脂モールド装置１００の動作方法）について図３～図９を参照して説明する。図３～図９は、本実施形態における樹脂モールド工程中のプレス部１３０の模式的断面図である。 Next, a resin molding method (operation method of the resin mold apparatus 100) using the resin mold apparatus 100 according to the present embodiment will be described with reference to FIGS. 3 to 9 are schematic cross-sectional views of the press unit 130 during the resin molding process in the present embodiment.
　本実施形態における樹脂モールド装置１００は、下型３２のパーティング面に配置されるリリースフィルムＦを備えている。リリースフィルムＦを用いることで、下型キャビティ駒３４と下型クランパ３５との隙間からの樹脂漏れを防止することができる。また、下型キャビティ駒３４と下型クランパ３５との間の樹脂詰まりを防止して下型クランパ３５に対する下型キャビティ駒３４の相対的移動を確保することができる。なお、リリースフィルムＦの強度や樹脂Ｒの重量によってはリリースフィルムＦの外周のみで吸引して保持することもできる。 The resin mold apparatus 100 in the present embodiment includes a release film F disposed on the parting surface of the lower mold 32. By using the release film F, resin leakage from the gap between the lower mold cavity piece 34 and the lower mold clamper 35 can be prevented. In addition, resin clogging between the lower mold cavity piece 34 and the lower mold clamper 35 can be prevented, and relative movement of the lower mold cavity piece 34 with respect to the lower mold clamper 35 can be secured. In addition, depending on the strength of the release film F and the weight of the resin R, it is possible to suck and hold only the outer periphery of the release film F.
　図３に示すように、モールド金型３０が型開きした状態において、金型外部から、ワークローダ５６によってワークＷを搬入する。 As shown in FIG. 3, in a state where the mold 30 is opened, the workpiece W is carried in by the work loader 56 from the outside of the mold.
　また、モールド金型３０が型開きした状態において、フィルムローダ５７によって樹脂ＲおよびリリースフィルムＦを搬入する。これに先立ち、ロール状のリリースフィルムＦ上に樹脂Ｒが搭載（供給）され、所定の形状（例えば、短冊状）にリリースフィルムＦが切断されている（図２参照）。このリリースフィルムＦは、吸着部６７によって吸引して保持面６４に吸着されてフラットな状態で搬入される。なお、吸着部６７などの吸引動作は、矢印で示されている（図３等参照）。 Further, in a state where the mold 30 is opened, the film loader 57 carries in the resin R and the release film F. Prior to this, the resin R is mounted (supplied) on the roll-shaped release film F, and the release film F is cut into a predetermined shape (for example, a strip shape) (see FIG. 2). The release film F is sucked by the suction unit 67 and sucked by the holding surface 64 and carried in a flat state. The suction operation of the suction unit 67 or the like is indicated by an arrow (see FIG. 3 and the like).
　続いて、図４に示すように、ワークローダ５６を上昇させ、上型３１にワークＷを引き渡す。具体的には、ワークローダ５６の上昇によって、位置決め部６２を上型クランパ４０の貫通孔４１の内周面に当接させた後、基板１０の裏面を上型インサート３７の下面に当接させる。次いで、ワーク保持部（図示せず）によって、上型インサート３７の下面に基板１０（ワークＷ）が保持される。このようにして、ワークローダ５６から上型３１へワークＷが引き渡される。 Subsequently, as shown in FIG. 4, the work loader 56 is raised, and the work W is delivered to the upper die 31. Specifically, after the positioning portion 62 is brought into contact with the inner peripheral surface of the through hole 41 of the upper clamper 40 by the lifting of the work loader 56, the back surface of the substrate 10 is brought into contact with the lower surface of the upper insert 37. . Next, the substrate 10 (work W) is held on the lower surface of the upper mold insert 37 by the work holding portion (not shown). Thus, the work W is delivered from the work loader 56 to the upper mold 31.
　また、図４に示すように、フィルムローダ５７を下降させ、下型３２に樹脂Ｒが搭載されたリリースフィルムＦを引き渡して樹脂Ｒの溶融を開始させる。具体的には、まず、フィルムローダ５７の下降によって、リリースフィルムＦを介して保持面６４を下型クランパ３５の上面に当接させた後、弾性部材５０を押し縮める（可動部を可動させる）。すなわち、フィルムローダ５７の下降によって、下型クランパ３５を押し下げる。次いで、下型キャビティ駒３４の上面（上側の端面）と下型クランパ３５の上面（上側の端面）とが水平の状態となるまで、フィルムローダ５７を下降させる。なお、ここで、フィルムローダ５７を下降させる動作に替えて、下型３２を上昇させる動作により下型３２にリリースフィルムＦを引き渡してもよい。 Further, as shown in FIG. 4, the film loader 57 is lowered to deliver the release film F having the resin R mounted on the lower mold 32 to start melting of the resin R. Specifically, first, the holding surface 64 is brought into contact with the upper surface of the lower clamper 35 via the release film F by lowering the film loader 57, and then the elastic member 50 is compressed (the movable portion is moved). . That is, the lower clamper 35 is pushed down by lowering the film loader 57. Next, the film loader 57 is lowered until the upper surface (upper end surface) of the lower mold cavity piece 34 and the upper surface (upper end surface) of the lower mold clamper 35 become horizontal. Here, instead of the operation of lowering the film loader 57, the release film F may be delivered to the lower mold 32 by the operation of raising the lower mold 32.
　このとき、リリースフィルムＦ上の樹脂Ｒは下型キャビティ駒３４内により加熱されることで溶融が開始する。また、フィルムローダ５７は、保持面６４でフラットなリリースフィルムＦを保持している。すなわち、下型キャビティ駒３４の上面（上側の端面）と下型クランパ３５の上面（上側の端面）とが水平に保持された下型３２に、フィルムローダ５７によって樹脂Ｒが下型キャビティ駒３４上に位置するようにフラットなリリースフィルムＦを配置する。なお、リリースフィルムＦは、下型３２に配置（供給）されたときにフラットであればよい。この場合、図４に示すように、フィルムローダ５７の保持面６４がリリースフィルムＦを介してキャビティ凹部３３に押し付けられるような形状または大きさとした場合には、フィルムローダ５７がキャビティ駒３４の端面に当接するまで押し下げる動作を行うだけで、水平状態の下型３２にリリースフィルムＦを供給することができ、シワなど発生させずに簡単に供給することができる。 At this time, the resin R on the release film F is heated by the inside of the lower mold cavity piece 34 to start melting. Further, the film loader 57 holds the flat release film F at the holding surface 64. That is, in the lower mold 32 in which the upper surface (upper end surface) of the lower mold cavity piece 34 and the upper surface (upper end surface) of the lower mold clamper 35 are horizontally held, the resin R is transferred by the film loader 57 to the lower mold cavity piece 34. Position the flat release film F so that it is positioned above. The release film F may be flat when it is disposed (supplied) to the lower mold 32. In this case, as shown in FIG. 4, when the holding surface 64 of the film loader 57 is shaped or sized to be pressed against the cavity recess 33 through the release film F, the film loader 57 is an end face of the cavity piece 34. It is possible to supply the release film F to the lower mold 32 in the horizontal state simply by performing the pressing operation until it abuts on the lower mold 32 and it is possible to easily supply it without causing the wrinkles and the like.
　次いで、下型キャビティ駒３４の上面と下型クランパ３５の上面とが水平な状態で、下型キャビティ駒３４の上面および下型クランパ３５の上面を覆うように配置されたフラットな状態のリリースフィルムＦを、吸着部５３、５５によって吸着、保持する。これによって、フィルムローダ５７から下型３２へ樹脂ＲおよびリリースフィルムＦが引き渡される。なお、吸着部５３、５５は、別系統であってもよいし、同一系統であってもよい。 Next, with the upper surface of the lower mold cavity piece 34 and the upper surface of the lower mold clamper 35 horizontal, the release film in a flat state is disposed to cover the upper surface of the lower mold cavity piece 34 and the upper surface of the lower mold clamper 35. F is adsorbed and held by the adsorption units 53 and 55. Thereby, the resin R and the release film F are delivered from the film loader 57 to the lower mold 32. Note that the suction units 53 and 55 may be separate systems or may be the same system.
　続いて、後述するようにワークＷを保持した後、図５に示すように、ワークローダ５６を下降させる。これにより、ワークローダ５６がワークＷから離隔する。そして、ワークＷは、上型３１のみで保持される。 Then, after holding the work W as described later, the work loader 56 is lowered as shown in FIG. Thereby, the work loader 56 is separated from the work W. Then, the work W is held only by the upper mold 31.
　また、図５に示すように、吸着部５３、５５によってフラットなリリースフィルムＦをエア路４７Ａ、５２、５４から吸引しながら、フィルムローダ５７を上昇させて、弾性部材５０を伸長させる（可動部を可動させる）。そして、この弾性部材５０によって下型クランパ３５に対して下型キャビティ駒３４を相対的に移動してキャビティ凹部３３を形成する。このとき、吸着部５５によってリリースフィルムＦの外周部が吸着され、吸着部５３によってリリースフィルムＦのキャビティ凹部３３の角部に対応する箇所が吸着されているので、キャビティ凹部３３の内面に追従させながらリリースフィルムＦが変形する。これにより、リリースフィルムＦがキャビティ凹部３３の内面に追従して吸着保持される。 Further, as shown in FIG. 5, while suctioning the flat release film F from the air paths 47A, 52, 54 by the suction portions 53, 55, the film loader 57 is lifted to extend the elastic member 50 (movable portion Move). Then, the lower mold cavity piece 34 is moved relative to the lower mold clamper 35 by the elastic member 50 to form the cavity recess 33. At this time, the outer peripheral portion of the release film F is adsorbed by the adsorption portion 55, and the portion corresponding to the corner portion of the cavity recess 33 of the release film F is adsorbed by the adsorption portion 53. While the release film F is deformed. As a result, the release film F follows the inner surface of the cavity recess 33 and is held by suction.
　また、キャビティ凹部３３の内面に追従させながらリリースフィルムＦを吸着保持すると共に、樹脂Ｒをそのままキャビティ凹部３３に供給する。フィルムローダ５７によって樹脂ＲがリリースフィルムＦを介して下型キャビティ駒３４上に配置されているので、下型クランパ３５に対して下型キャビティ駒３４が相対的に移動してキャビティ凹部３３が形成されても、樹脂Ｒはそのままの状態を保持してキャビティ凹部３３に供給される。したがって、樹脂Ｒの形状が崩れず、また位置が変わらずにキャビティ凹部３３の底部に樹脂Ｒを供給することができる。このようにキャビティ凹部３３に所望の状態で樹脂Ｒを供給することは、ボイドやワイヤスイープなどによる成形品の品質不良を低減することに作用する。 Further, the release film F is adsorbed and held while following the inner surface of the cavity recess 33, and the resin R is supplied to the cavity recess 33 as it is. Since the resin R is disposed on the lower mold cavity piece 34 via the release film F by the film loader 57, the lower mold cavity piece 34 moves relative to the lower mold clamper 35 to form the cavity recess 33. Even if this is done, the resin R is supplied to the cavity recess 33 while maintaining the state as it is. Therefore, the shape of the resin R does not collapse, and the resin R can be supplied to the bottom of the cavity recess 33 without changing the position. As described above, supplying the resin R to the cavity recess 33 in a desired state works to reduce the quality defects of the molded product due to the void and the wire sweep.
　続いて、図６に示すように、ワークローダ５６およびフィルムローダ５７をモールド金型３０内部から退避させる。 Subsequently, as shown in FIG. 6, the work loader 56 and the film loader 57 are retracted from the inside of the mold 30.
　続いて、図７に示すように、可動型である下型３２を上昇させて、モールド金型３０を型閉じ（型締め）する。具体的には、下型クランパ３５と上型クランパ４０とでリリースフィルムＦをクランプする位置まで下型３２を上昇させる。これにより、キャビティ凹部３３を含むモールド金型３０内部が気密される。このとき、減圧部４５を駆動しておくことで、エア路４１Ａおよびエア路４４を介してキャビティ凹部３３を含むモールド金型３０内部が減圧（脱気）される。モールド金型３０内部を減圧することにより、その後の樹脂モールドにおいて溶融した樹脂Ｒに混入するエアが除去され、成形品にボイドの発生を防ぐことができる。 Subsequently, as shown in FIG. 7, the movable lower die 32 is raised to close the mold 30 (clamping). Specifically, the lower mold 32 is raised to a position where the release film F is clamped by the lower clamper 35 and the upper clamper 40. Thereby, the inside of the mold 30 including the cavity recess 33 is airtight. At this time, by driving the decompression unit 45, the inside of the mold 30 including the cavity recess 33 is decompressed (deaerated) through the air passage 41A and the air passage 44. By depressurizing the inside of the mold 30, the air mixed in the molten resin R in the subsequent resin mold is removed, and the generation of voids in the molded product can be prevented.
　続いて、図８に示すように、可動型である下型３２を更に上昇させて、基板１０の外周部にリリースフィルムＦを介して下型クランパ３５の上面を当接させる。このとき、弾性部材４２が弾性部材５０より弱いので、下型３２（下型クランパ３５）の上昇によって、上型クランパ４０を介して弾性部材４２が押し縮められる。これにより、上型インサート３７（上型３１）と下型クランパ３５（下型３２）とでワークＷがクランプされ、基板１０の表面と上型クランパ４０の下面とは水平な状態となる。このように、上型クランパ４０に対して上型インサート３７を相対的に移動させることで、ワークＷの板厚に拘わらず均一な高さ位置でワークＷをクランプすることができる。 Subsequently, as shown in FIG. 8, the movable lower die 32 is further raised to bring the upper surface of the lower clamper 35 into contact with the outer peripheral portion of the substrate 10 via the release film F. At this time, since the elastic member 42 is weaker than the elastic member 50, the elastic member 42 is compressed via the upper clamper 40 by the elevation of the lower die 32 (lower clamper 35). As a result, the work W is clamped by the upper mold insert 37 (upper mold 31) and the lower mold clamper 35 (lower mold 32), and the surface of the substrate 10 and the lower surface of the upper mold clamper 40 become horizontal. As described above, by moving the upper mold insert 37 relative to the upper clamper 40, the work W can be clamped at a uniform height position regardless of the thickness of the work W.
　続いて、図９に示すように、可動型である下型３２を更に上昇させて、チップ部品１１を金型温度で溶融した樹脂Ｒに浸漬させた後、キャビティＣ（キャビティ凹部３３）に充填された溶融樹脂Ｒを加熱硬化して、ワークＷに樹脂モールドを行う。このとき、下型クランパ３５が基板１０を介して上型３１に当接して移動が妨げられているので、下型３２（下型ベース４６）の上昇によって、弾性部材５０が押し縮められる。下型３２の上昇停止位置（換言すれば、この弾性部材５０の縮み量）を調整することで所望の成形厚み（成形位置）において樹脂モールドが行われる。これにより、成形品が略完成する。 Subsequently, as shown in FIG. 9, the movable lower die 32 is further raised to immerse the chip part 11 in the resin R melted at the mold temperature, and then the cavity C (cavity recess 33) is filled. The molten resin R thus obtained is heat-cured to resin-mold the workpiece W. At this time, since the lower mold clamper 35 abuts on the upper mold 31 via the substrate 10 and movement is hindered, the elastic member 50 is compressed by the rise of the lower mold 32 (lower mold base 46). By adjusting the rising and stopping position of the lower mold 32 (in other words, the amount of contraction of the elastic member 50), resin molding is performed at a desired molding thickness (molding position). Thereby, a molded article is substantially completed.
　その後、ワーク保持部によってワークＷ（成形品）が上型３１で保持され、また、吸着部５３、５５によってリリースフィルムＦが下型３２で保持された状態で型開きする。このとき、リリースフィルムＦを用いていることで、ワークＷを容易に離型させることができる。そして、前述したように、検査部・冷却部１４０、キュア部１５０を経てワーク収納部１６０にワークＷを収納する。 Thereafter, the workpiece W (molded product) is held by the upper mold 31 by the workpiece holding unit, and the release film F is held open by the lower mold 32 by the suction units 53 and 55. At this time, by using the release film F, the work W can be easily released. Then, as described above, the workpiece W is stored in the workpiece storage unit 160 through the inspection unit / cooling unit 140 and the curing unit 150.
　本実施形態における樹脂モールド装置１００を用いることで、フラットな状態でリリースフィルムＦを配置してからキャビティ凹部３３の形状に追従してリリースフィルムＦを変形することができる。例えば、リリースフィルムＦがシワとなったり重なったりした状態でモールド金型３０に供給されることはない。したがって、リリースフィルムＦのシワ等による成形品の外観への転写を防止したり、重なった箇所からの樹脂漏れを防止したりして、成形品の品質性を向上することができる。また、下型３２にキャビティ凹部３３を構成することで、キャビティ凹部３３の全面に供給され溶融した樹脂Ｒに、例えば、チップ部品１１やボンディングワイヤ（図示せず）を浸漬させることで、樹脂Ｒの流動を最小限とすることでボイドやワイヤスイープなどの成形品の品質不良を低減することができる。 By using the resin mold apparatus 100 according to the present embodiment, the release film F can be deformed following the shape of the cavity recess 33 after the release film F is disposed in a flat state. For example, the release film F is not supplied to the mold 30 in a wrinkled or overlapped state. Therefore, the transfer of the release film F to the appearance of the molded product due to wrinkles or the like can be prevented, or the resin leakage from the overlapping portion can be prevented, and the quality of the molded product can be improved. Further, by forming the cavity recess 33 in the lower mold 32, the resin R supplied to the entire surface of the cavity recess 33 and melted is, for example, immersing the chip component 11 and the bonding wire (not shown), the resin R By minimizing the flow of the resin, it is possible to reduce the quality defects of the molded articles such as voids and wire sweeps.
　（第２実施形態）
　前記第１実施形態に対して、本実施形態では、ワークローダ５６がワークＷを治具（上型インサート３７の下部）とともに上型３１に配置（セット）し、フィルムローダ５７が加熱部、冷却部、シャッタ部を備える点が相違する。以下では、この相違点を中心に図１０～図１４を参照して説明する。図１０～図１４は、本実施形態におけるプレス部１３０の模式的断面図である。 Second Embodiment
In contrast to the first embodiment, in the present embodiment, the work loader 56 arranges (sets) the work W together with the jig (the lower portion of the upper mold insert 37) in the upper mold 31, and the film loader 57 serves as a heating unit and cooling The difference is that the unit and the shutter unit are provided. In the following, this difference will be mainly described with reference to FIGS. 10 to 14. 10 to 14 are schematic cross-sectional views of the press unit 130 in the present embodiment.
　ワークＷ（基板１０）が大判になるに従い、ワークＷには撓み（反り）が大きく発生するため、前記第１実施形態のように、単に、基板１０の表面外周部でワークローダ５６（支持部６１）によってワークＷを保持した場合には、基板１０が自重で撓んで型内での保持が困難となったり、搬送中に落下したりするなどの問題が生じてしまう。そこで、本実施形態では、大判の基板１０の裏面にプレート状の治具３７Ａ（部材）を当てて撓みの発生を防止し、治具３７ＡとともにワークＷをワークローダ５６によって搬送する。この治具３７Ａは、例えば、上型インサート３７と同じ材質（ステンレス鋼）である。このため、治具３７Ａは、上型インサート３７の下部が分離可能に設けられたものとみなすこともできる。 As the workpiece W (substrate 10) becomes larger, deflection (warpage) occurs to a large extent in the workpiece W. Therefore, as in the first embodiment, the work loader 56 (supporting portion only at the outer surface of the substrate 10) In the case where the workpiece W is held by 61), the substrate 10 is bent by its own weight, making it difficult to hold the substrate in the mold, or causing problems such as dropping during transport. Therefore, in the present embodiment, a plate-like jig 37A (member) is placed against the back surface of the large-sized substrate 10 to prevent the occurrence of bending, and the work W is transported by the work loader 56 together with the jig 37A. The jig 37A is made of, for example, the same material (stainless steel) as the upper mold insert 37. For this reason, the jig 37A can be regarded as one in which the lower portion of the upper mold insert 37 is provided in a detachable manner.
　また、前記第１実施形態のように、フィルムローダ５７に複数の凹部６６を設ける構成の場合、凹部６６の外周部（保持面６４に通じるエア路６５が設けられている。）の領域には、リリースフィルムＦ上に樹脂Ｒを搭載することができない。しかし、ハンド部６３に開口部の広い一つの凹部６６を形成して、リリースフィルムＦに広範囲で樹脂Ｒを搭載した場合には、樹脂Ｒの重みによってリリースフィルムＦが撓みすぎてフラットに保持することが困難となることが考えられる。そこで、本実施形態では、ハンド部６３の開口部下において、樹脂Ｒが搭載されたリリースフィルムＦを保持可能なシャッタ部７０を設けている。 Further, in the case where the film loader 57 is provided with a plurality of recesses 66 as in the first embodiment, the region of the outer periphery of the recesses 66 (the air passage 65 communicating with the holding surface 64 is provided). , The resin R can not be mounted on the release film F. However, when one concave portion 66 having a wide opening is formed in the hand portion 63 and the resin R is mounted in a wide range on the release film F, the release film F is too bent and held flat due to the weight of the resin R Can be difficult. So, in this embodiment, the shutter part 70 which can hold | maintain the release film F in which resin R was mounted under the opening part of the hand part 63 is provided.
　ここで、本実施形態におけるフィルムローダ５７について具体的に説明する。フィルムローダ５７は、保持面６４を開閉可能なロール状のシャッタ部７０を備えている。このシャッタ部７０は、図示しない駆動部によって、保持面６４を開く状態（開状態）には、巻き取られて保持面６４から退避され、保持面６４を閉じた状態（閉状態）には、保持面６４に送り出される。このため、フィルムローダ５７は、シャッタ部７０の閉状態でリリースフィルムＦをシャッタ部７０で支持して搬送し、シャッタ部７０の開状態で下型３２にリリースフィルムＦを配置することができる。 Here, the film loader 57 in the present embodiment will be specifically described. The film loader 57 includes a roll-shaped shutter unit 70 capable of opening and closing the holding surface 64. The shutter portion 70 is wound up and retracted from the holding surface 64 in a state (open state) in which the holding surface 64 is opened by a driving unit (not shown), and in a state (closed state) in which the holding surface 64 is closed. It is delivered to the holding surface 64. Therefore, the film loader 57 can support and convey the release film F by the shutter unit 70 in the closed state of the shutter unit 70, and can arrange the release film F on the lower mold 32 in the open state of the shutter unit 70.
　シャッタ部７０は、例えば、薄い板金や樹脂材のような巻き取りが可能な材質で構成される。また、シャッタ部７０の材質は、リリースフィルムＦに対する摩擦抵抗が低い材質や形状を有するものが好ましい。これにより、リリースフィルムＦを歪ませることなく巻き取ることができる。また、シャッタ部７０には、巻取り方向に直交する方向に延在する支持棒のような芯７１が入ったものがよりリリースフィルムＦを平坦に保持する上で好ましい。 The shutter unit 70 is made of, for example, a thin sheet metal or a resin material capable of being wound up. Further, the material of the shutter portion 70 is preferably one having a material or a shape with low frictional resistance to the release film F. Thereby, the release film F can be wound without distortion. The shutter 70 preferably has a core 71 such as a support bar extending in a direction perpendicular to the winding direction, in order to keep the release film F flat.
　このようなフィルムローダ５７によれば、リリースフィルムＦ上に搭載されている凹部６６内の樹脂Ｒの重みによってリリースフィルムＦが撓まないように、シャッタ部７０でリリースフィルムＦをフラットに保持（支持）することができる。また、リリースフィルムＦの下型３２への配置時にはシャッタ部７０を巻き取って省スペース化を図ることができる。ただし、シャッタ部７０は、必ずしも巻き取り可能な構成とする必要はなく、板状の部材を開閉可能とする構成としてもリリースフィルムＦ（即ち樹脂Ｒ）を保持することができる。 According to such a film loader 57, the release film F is held flat by the shutter unit 70 so that the weight of the resin R in the recess 66 mounted on the release film F does not bend ( Support). In addition, when the release film F is disposed on the lower mold 32, the shutter portion 70 can be rolled up to save space. However, the shutter unit 70 does not necessarily have to be configured to be able to be wound up, and can hold the release film F (that is, the resin R) even if it is configured to be able to open and close a plate-like member.
　また、フィルムローダ５７は、冷却部７２および加熱部７３を備えている。これによれば、リリースフィルムＦやこれに搭載される樹脂Ｒの加熱を補助したり、冷却したりすることが容易となる。また、シャッタ部７０に加熱部を含ませた構成とすることで、リリースフィルムＦを予熱して、リリースフィルムＦをキャビティ凹部３３の形状により確実に倣わせることもできる。この場合、例えば芯７１を熱線とすることでシャッタ部７０に設ける加熱部とすることができる。 Also, the film loader 57 includes a cooling unit 72 and a heating unit 73. According to this, it becomes easy to assist heating or cool the release film F and the resin R mounted thereon. In addition, by including the heating portion in the shutter portion 70, the release film F can be preheated so that the release film F can be made to conform more reliably to the shape of the cavity recess 33. In this case, for example, by using the core 71 as a heat wire, a heating unit provided in the shutter unit 70 can be obtained.
　次に、本実施形態における樹脂モールド装置１００を用いた樹脂モールド方法（樹脂モールド装置１００の動作方法）について説明する。 Next, a resin molding method (operation method of the resin mold apparatus 100) using the resin mold apparatus 100 in the present embodiment will be described.
　図１０に示すように、モールド金型３０が型開きした状態において、金型外部から、ワークローダ５６によって治具３７Ａと共にワークＷを搬入する。 As shown in FIG. 10, in a state where the mold 30 is opened, the workpiece W is carried in together with the jig 37A by the work loader 56 from the outside of the mold.
　また、モールド金型３０が型開きした状態において、フィルムローダ５７によって樹脂ＲおよびリリースフィルムＦを搬入する。このとき、金型からの輻射熱で樹脂Ｒが加熱されるのを防止したいときには、冷却部７２をオン状態（あるいはオフ状態）とし、加熱部７３をオフ状態としておくことで、リリースフィルムＦや樹脂Ｒが加熱されるのを防止することもできる。 Further, in a state where the mold 30 is opened, the film loader 57 carries in the resin R and the release film F. At this time, when it is desired to prevent the resin R from being heated by the radiant heat from the mold, the cooling section 72 is turned on (or off) and the heating section 73 is turned off to release the release film F or resin. It is also possible to prevent R from being heated.
　また、閉じた状態のシャッタ部７０により、リリースフィルムＦ上に搭載された樹脂Ｒを保持させた状態でモールド金型３０に搬入する。このリリースフィルムＦは、吸着部６７によって吸引して保持面６４に吸着されてフラットな状態で搬入される。 Further, the resin R loaded on the release film F is held in the mold 30 by the shutter unit 70 in the closed state. The release film F is sucked by the suction unit 67 and sucked by the holding surface 64 and carried in a flat state.
　続いて、図１１に示すように、ワークローダ５６を上昇させ、治具３７Ａと共にワークＷを上型３１へ引き渡す。具体的には、ワークローダ５６の上昇によって、位置決め部６２を上型クランパ４０の貫通孔４１の内周面に当接させた後、ワークＷを保持している治具３７Ａを上型インサート３７の下面に当接させる。次いで、ワーク保持部（図示せず）によって、上型インサート３７の下面にワークＷおよび治具３７Ａを保持する。このようにして、ワークローダ５６から上型３１へワークＷが引き渡される。 Subsequently, as shown in FIG. 11, the work loader 56 is raised, and the work W is delivered to the upper die 31 together with the jig 37A. Specifically, after the positioning portion 62 is made to abut on the inner peripheral surface of the through hole 41 of the upper clamper 40 by raising the work loader 56, the jig 37A holding the workpiece W is inserted into the upper mold insert 37. Abut the lower surface of the Next, the workpiece W and the jig 37A are held on the lower surface of the upper mold insert 37 by the workpiece holding portion (not shown). Thus, the work W is delivered from the work loader 56 to the upper mold 31.
　また、図１１に示すように、フィルムローダ５７を下降する。具体的には、まず、フィルムローダ５７の下降によって、リリースフィルムＦおよびシャッタ部７０を介して保持面６４を下型クランパ３５の上面に当接させた後、弾性部材５０を押し縮める（可動部を可動させる）。すなわち、フィルムローダ５７の下降によって、下型クランパ３５を押し下げる。次いで、下型キャビティ駒３４の上面と下型クランパ３５の上面とが水平の状態となるまで、フィルムローダ５７を下降させる。なお、冷却部７２をオン状態としている場合、モールド金型３０の金型温度を低下させないように、図１１に示す工程では、冷却部７２はオフ状態とするのが好ましい。 Further, as shown in FIG. 11, the film loader 57 is lowered. Specifically, first, the holding surface 64 is abutted against the upper surface of the lower clamper 35 via the release film F and the shutter portion 70 by lowering the film loader 57, and then the elastic member 50 is compressed (movable portion Move). That is, the lower clamper 35 is pushed down by lowering the film loader 57. Next, the film loader 57 is lowered until the upper surface of the lower mold cavity piece 34 and the upper surface of the lower clamper 35 become horizontal. When the cooling unit 72 is in the on state, it is preferable that the cooling unit 72 be in the off state in the process illustrated in FIG. 11 so as not to lower the temperature of the mold 30.
　続いて、図１２に示すように、ワークローダ５６を下降させる。これにより、ワークローダ５６がワークＷから離隔する。そして、ワークＷは、上型３１で保持される。 Subsequently, as shown in FIG. 12, the work loader 56 is lowered. Thereby, the work loader 56 is separated from the work W. Then, the workpiece W is held by the upper die 31.
　また、図１２に示すように、下型３２に樹脂Ｒが搭載されたリリースフィルムＦを渡す。具体的には、まず、シャッタ部７０を巻き取って、下型キャビティ駒３４の上面と下型クランパ３５の上面とが水平に保持された下型３２に、フィルムローダ５７によって樹脂Ｒが下型キャビティ駒３４上に位置するようにフラットなリリースフィルムＦを配置する。次いで、吸着部５３、５５によって、下型キャビティ駒３４の上面および下型クランパ３５の上面が水平となった下型３２のパーティング面に、フラットな状態のリリースフィルムＦを吸着、保持する。これによって、フィルムローダ５７から下型３２へ樹脂ＲおよびリリースフィルムＦが引き渡される。また、加熱部７３をオン状態とすることで、下型３２側（下方）からの加熱に加え、上方からも樹脂Ｒに対して加熱することができ、溶融させるための時間を短縮させることができる。これにより、生産性を向上することができる。 Further, as shown in FIG. 12, a release film F in which the resin R is mounted on the lower mold 32 is delivered. Specifically, first, the lower portion of the resin R is formed by the film loader 57 in the lower mold 32 in which the shutter portion 70 is wound up and the upper surface of the lower mold cavity piece 34 and the upper surface of the lower clamper 35 are held horizontally. A flat release film F is disposed to be positioned on the cavity piece 34. Next, the release film F in a flat state is adsorbed and held on the parting surface of the lower mold 32 in which the upper surface of the lower mold cavity piece 34 and the upper surface of the lower clamper 35 are horizontal by the suction portions 53 and 55. Thereby, the resin R and the release film F are delivered from the film loader 57 to the lower mold 32. In addition to heating from the lower mold 32 side (downward) by turning the heating unit 73 ON, the resin R can also be heated from above, and the time for melting can be shortened. it can. This can improve the productivity.
　続いて、図１３に示すように、吸着部５３、５５によってフラットなリリースフィルムＦをエア路４７Ａ、５２、５４から吸引しながら、フィルムローダ５７を上昇させて、弾性部材５０を伸長させる（可動部を可動させる）。そして、この弾性部材５０によって下型クランパ３５に対して下型キャビティ駒３４を相対的に移動してキャビティ凹部３３を形成する。このとき、吸着部５５によってリリースフィルムＦの外周部が吸着され、吸着部５３によってリリースフィルムＦのキャビティ凹部３３の角部に対応する箇所が吸着されているので、キャビティ凹部３３の内面に追従させながらリリースフィルムＦが変形する。これにより、リリースフィルムＦがキャビティ凹部３３の内面に追従して吸着保持される。 Subsequently, as shown in FIG. 13, while suctioning the flat release film F from the air paths 47A, 52, 54 by the suction portions 53, 55, the film loader 57 is lifted to extend the elastic member 50 (movable Move the part). Then, the lower mold cavity piece 34 is moved relative to the lower mold clamper 35 by the elastic member 50 to form the cavity recess 33. At this time, the outer peripheral portion of the release film F is adsorbed by the adsorption portion 55, and the portion corresponding to the corner portion of the cavity recess 33 of the release film F is adsorbed by the adsorption portion 53. While the release film F is deformed. As a result, the release film F follows the inner surface of the cavity recess 33 and is held by suction.
　この際に、キャビティ凹部３３の内面に追従させながらリリースフィルムＦを吸着保持することで、樹脂Ｒがそのままの形状でキャビティ凹部３３に供給される。換言すれば、フィルムローダ５７によって樹脂ＲがリリースフィルムＦを介して下型キャビティ駒３４上に配置されているので、下型クランパ３５に対して下型キャビティ駒３４が相対的に移動してキャビティ凹部３３が形成されても、樹脂Ｒはそのままの状態を保持してキャビティ凹部３３に供給される。したがって、樹脂Ｒの形状が崩れず、また位置が変わらずにキャビティ凹部３３の底部に樹脂Ｒを供給することができる。 At this time, the resin R is supplied to the cavity recess 33 as it is by suction-holding the release film F while making the inner surface of the cavity recess 33 follow. In other words, since the resin R is disposed on the lower mold cavity piece 34 via the release film F by the film loader 57, the lower mold cavity piece 34 moves relative to the lower mold clamper 35 and the cavity Even if the recess 33 is formed, the resin R is supplied to the cavity recess 33 while maintaining the state as it is. Therefore, the shape of the resin R does not collapse, and the resin R can be supplied to the bottom of the cavity recess 33 without changing the position.
　続いて、図１４に示すように、ワークローダ５６およびフィルムローダ５７をモールド金型３０内部から退避させる。その後、前記第１実施形態で図７～図９を参照して説明した工程を経て、成形品が略完成する。 Subsequently, as shown in FIG. 14, the work loader 56 and the film loader 57 are retracted from the inside of the mold 30. Thereafter, through the steps described with reference to FIGS. 7 to 9 in the first embodiment, the molded article is substantially completed.
　（第３実施形態）
　前記第２実施形態では、フィルムローダ５７として、樹脂Ｒが搭載された搭載面側でリリースフィルムＦを吸着保持するハンド部６３およびその搭載面とは反対面側でリリースフィルムＦを支持するシャッタ部７０を用いた場合について説明した。これに対して、本実施形態では、フィルムローダ５７として、樹脂ＲおよびリリースフィルムＦを支持し、そのまま下型３２に配置（セット）される治具（部材）を用いる点が相違する。以下では、この相違点を中心に図１５～図１９を参照して説明する。図１５～図１９は、本実施形態におけるプレス部１３０の模式的断面図である。 Third Embodiment
In the second embodiment, as the film loader 57, the hand unit 63 for holding the release film F by suction on the mounting surface side on which the resin R is mounted and the shutter unit for supporting the release film F on the opposite surface side to the mounting surface. The case of using 70 has been described. On the other hand, the present embodiment is different in that, as the film loader 57, a jig (member) which supports the resin R and the release film F and which is disposed (set) as it is on the lower mold 32 is used. In the following, this difference will be mainly described with reference to FIGS. 15 to 19 are schematic cross-sectional views of the press unit 130 in the present embodiment.
　前記第２実施形態のように、リリースフィルムＦを支持するシャッタ部７０では、リリースフィルムＦを下型３２に配置する際に、シャッタ部７０を巻き取る（取り外す）必要がある。このとき、リリースフィルムＦ上の樹脂Ｒがくずれるなどによりその分布に偏りが発生するおそれがある。そこで、本実施形態では、リリースフィルムＦ下にプレート状の治具３４Ａを当ててフラットのリリースフィルムＦを保持し、治具３４ＡとともにリリースフィルムＦをフィルムローダ５７によって搬送し、リリースフィルムＦが配置されたままの状態の治具３４Ａを下型３２として使用する。すなわち、この治具３４Ａは、例えば、下型キャビティ駒３４と同じ材質（ステンレス鋼）であるため、下型キャビティ駒３４の上部が分離可能に設けられたものとみなすことができる。 In the shutter unit 70 supporting the release film F as in the second embodiment, when arranging the release film F on the lower mold 32, it is necessary to wind up (remove) the shutter unit 70. At this time, the distribution of the resin R on the release film F may be biased due to breakage or the like. Therefore, in the present embodiment, a flat jig 34A is placed under the release film F to hold the flat release film F, and the release film F is transported by the film loader 57 together with the jig 34A, and the release film F is arranged. The jig 34A as it is is used as the lower mold 32. That is, since the jig 34A is made of, for example, the same material (stainless steel) as the lower mold cavity piece 34, the upper portion of the lower mold cavity piece 34 can be regarded as being separable.
　ここで、本実施形態におけるフィルムローダ５７とプレス部１３０について具体的に説明する。フィルムローダ５７は、下型キャビティ駒３４の上部が分離可能に設けられた治具３４Ａと、下型クランパ３５の上部が分離可能に設けられた治具３５Ａとを備えている。また、治具３５Ａの貫通孔に治具３４Ａが配置され、治具３４Ａを持ち上げ支持するように、治具３４Ａの外周面と治具３５Ａの内周面とが複数の接続部材７４によって接続されている。この接続部材７４は、例えば、板バネのように、治具３４Ａに対して治具３５Ａを上下方向に可動できる可動部としても用いられる。 Here, the film loader 57 and the press unit 130 in the present embodiment will be specifically described. The film loader 57 includes a jig 34A in which the upper part of the lower mold cavity piece 34 is provided so as to be separated, and a jig 35A in which the upper part of the lower mold clamper 35 is provided so as to be separated. Further, the jig 34A is disposed in the through hole of the jig 35A, and the outer peripheral surface of the jig 34A and the inner peripheral surface of the jig 35A are connected by a plurality of connection members 74 so as to lift and support the jig 34A. ing. For example, the connection member 74 is also used as a movable portion which can move the jig 35A in the vertical direction with respect to the jig 34A like a leaf spring.
　これら治具３４Ａと治具３５の厚みが異なり、治具３４Ａが治具３５Ａよりも厚みが薄い。そして、外部からの影響を受けていない状態では、接続部材７４によって、治具３４Ａの端面と治具３５Ａの端面とが水平に保持されている。また、プレス部１３０では、型開きしている場合のような弾性部材５０が付勢されていない状態（外部からの影響を受けていない状態）において、下型キャビティ駒３４の下部上面と、下型クランパ３５の下部上面とは、同じ高さ位置とすることができる。本実施形態では、このような治具３４Ａ、３５Ａの厚み差（高低差）をつけて、治具３５Ａ（下型クランパ３５の上部）に対して治具３４Ａ（下型キャビティ駒３４の上部）を相対的に移動可能に設けることで、キャビティ凹部３３の深さ（キャビティＣの容積）を変化させることができる。 The thickness of the jig 34A is different from that of the jig 35, and the jig 34A is thinner than the jig 35A. And in the state where it has not received the influence from the outside, the end face of jig 34A and the end face of jig 35A are held horizontally by connecting member 74. Further, in the press unit 130, the lower upper surface of the lower mold cavity piece 34 and the lower surface thereof are not pressed in a state where the elastic member 50 is not biased as in the case of mold opening (state not affected by the outside). The lower upper surface of the mold clamper 35 can be at the same height position. In this embodiment, the jig 34A (upper part of the lower mold cavity piece 34) is attached to the jig 35A (upper part of the lower mold clamper 35) by providing such thickness difference (height difference) of the jigs 34A, 35A. Can be moved relatively to change the depth of the cavity recess 33 (volume of the cavity C).
　また、本実施形態におけるプレス部１３０（フィルムローダ５７）は、上面（樹脂Ｒが搭載された面）からリリースフィルムＦを押さえる押さえ部７５、７６を備えている。押さえ部７５は、樹脂Ｒの周囲でリリースフィルムＦを押さえることができるように、外形の異なる２つの角環状部材を組み合わせたようなフランジ形状に形成され、治具３４Ａの外周部の端面に対向して設けられる。また、押さえ部７６は、リリースフィルムＦにおける下型クランパ３５の端面に対向して外周部を押さえることができるように、治具３５Ａの端面に対向して設けられる。 Further, the press unit 130 (film loader 57) in the present embodiment is provided with pressing units 75 and 76 that press the release film F from the upper surface (the surface on which the resin R is mounted). The pressing portion 75 is formed in a flange shape in which two square annular members having different outer shapes are combined so that the release film F can be pressed around the resin R, and faces the end face of the outer peripheral portion of the jig 34A. Provided. Further, the pressing portion 76 is provided so as to face the end face of the jig 35A so as to face the end face of the lower mold clamper 35 in the release film F to press the outer peripheral portion.
　フィルムローダ５７によって、治具３４Ａの端面と治具３５Ａの端面とを水平に保持しながら、これら端面にリリースフィルムＦをフラットに保持してリリースフィルムＦが搬送される。これによれば、リリースフィルムＦおよびこれに搭載された樹脂Ｒを安定した状態でモールド金型３０に配置することができる。 While the film loader 57 horizontally holds the end face of the jig 34A and the end face of the jig 35A, the release film F is conveyed flat by holding the release film F on these end faces. According to this, it is possible to arrange the release film F and the resin R mounted thereon in the mold 30 in a stable state.
　次に、本実施形態における樹脂モールド装置１００を用いた樹脂モールド方法（樹脂モールド装置１００の動作方法）について説明する。 Next, a resin molding method (operation method of the resin mold apparatus 100) using the resin mold apparatus 100 in the present embodiment will be described.
　図１５に示すように、モールド金型３０が型開きした状態において、金型外部から、ワークローダ５６によってワークＷを搬入する。また、モールド金型３０が型開きした状態において、フィルムローダ５７によって樹脂ＲおよびリリースフィルムＦを搬入する。 As shown in FIG. 15, in a state where the mold 30 is opened, the workpiece W is carried in by the work loader 56 from the outside of the mold. Further, in a state where the mold 30 is opened, the film loader 57 carries in the resin R and the release film F.
　なお、これに先立ち、例えば、樹脂供給部１２０において、治具３４Ａの端面と治具３５Ａの端面とが水平に保持された状態で、ロール状のリリースフィルムＦを送り出し、このリリースフィルムＦ上に樹脂Ｒが搭載（供給）される。次いで、所定の形状（例えば、短冊状）にリリースフィルムＦが切断されることで（図２参照）、このリリースフィルムＦは、治具３４Ａおよび治具３５Ａの端面が水平であるため、それに配置されるときの状態もフラットとなる。これがロボット機構部１８０とローダ１９０を介して、プレス部１３０に供給される。 Prior to this, for example, in a state where the end face of the jig 34A and the end face of the jig 35A are held horizontally in the resin supply unit 120, the roll-shaped release film F is sent out. Resin R is mounted (supplied). Then, the release film F is cut into a predetermined shape (for example, a strip shape) (see FIG. 2), and the release film F is disposed on the jig 34A and the jig 35A because the end faces are horizontal. The situation when being done is also flat. This is supplied to the press unit 130 via the robot mechanism unit 180 and the loader 190.
　続いて、図１６に示すように、ワークローダ５６を上昇させ、ワークＷを上型３１へ引き渡す。 Subsequently, as shown in FIG. 16, the work loader 56 is raised, and the work W is delivered to the upper die 31.
　また、図１６に示すように、フィルムローダ５７を下降させる。具体的には、フィルムローダ５７の下降によって、治具３５Ａを下型クランパ３５の上面に当接させる。このとき、リリースフィルムＦは、治具３４Ａ（下型キャビティ駒３４の上部）の端面と治具３５Ａ（下型クランパ３５の上部）の端面とが水平に保持された下型３２にフィルムローダ５７によってフラットに配置される。なお、このとき、治具３４Ａは下型キャビティ駒３４の上面に当接していない。 Further, as shown in FIG. 16, the film loader 57 is lowered. Specifically, the jig 35A is brought into contact with the upper surface of the lower clamper 35 by lowering the film loader 57. At this time, the release film F is a film loader 57 in which the end face of the jig 34A (upper part of the lower mold cavity piece 34) and the end face of the jig 35A (upper part of the lower mold clamper 35) are held horizontally. Arranged flat by. At this time, the jig 34A is not in contact with the upper surface of the lower mold cavity piece 34.
　続いて、図１７に示すように、ワークローダ５６を下降させる。これにより、ワークローダ５６がワークＷから離隔する。 Subsequently, as shown in FIG. 17, the work loader 56 is lowered. Thereby, the work loader 56 is separated from the work W.
　また、図１７に示すように、吸着部５３、５５によって、リリースフィルムＦを吸引する。具体的には、吸着部５５によってリリースフィルムＦの外周部が吸着され、吸着部５３によってリリースフィルムＦの中央部が吸着されて、治具３５Ａに対して上下方向に可動に設けられている治具３４Ａが接続部材７４によって下降する（可動部を可動させる）。 Further, as shown in FIG. 17, the release film F is suctioned by the suction units 53 and 55. Specifically, the outer peripheral portion of the release film F is adsorbed by the adsorption portion 55, and the central portion of the release film F is adsorbed by the adsorption portion 53, and the jig 35A is vertically movable. The tool 34A is lowered by the connection member 74 (moves the movable portion).
　この接続部材７４によって下型クランパ３５に対して下型キャビティ駒３４を相対的に移動してキャビティ凹部３３が形成されることとなる。このとき、吸着部５５によってリリースフィルムＦの外周部が吸着され、吸着部５３によってリリースフィルムＦのキャビティ凹部３３の角部に対応する箇所が吸着されているので、キャビティ凹部３３の内面に追従させながらリリースフィルムＦが変形する。これにより、リリースフィルムＦがキャビティ凹部３３の内面に追従して吸着保持される。 The lower mold cavity piece 34 is moved relative to the lower mold clamper 35 by the connection member 74 to form the cavity recess 33. At this time, the outer peripheral portion of the release film F is adsorbed by the adsorption portion 55, and the portion corresponding to the corner portion of the cavity recess 33 of the release film F is adsorbed by the adsorption portion 53. While the release film F is deformed. As a result, the release film F follows the inner surface of the cavity recess 33 and is held by suction.
　また、キャビティ凹部３３の内面に追従させながらリリースフィルムＦを吸着保持すると共に、樹脂Ｒをそのままキャビティ凹部３３に供給する。フィルムローダ５７によって樹脂ＲがリリースフィルムＦを介して治具３４Ａ上に配置されているので、キャビティ凹部３３が形成されても、樹脂Ｒはそのままの状態を保持してキャビティ凹部３３に供給される。したがって、樹脂Ｒの形状が崩れず、また位置が変わらずにキャビティ凹部３３の底部に樹脂Ｒを供給することができる。 Further, the release film F is adsorbed and held while following the inner surface of the cavity recess 33, and the resin R is supplied to the cavity recess 33 as it is. Since the resin R is disposed on the jig 34A via the release film F by the film loader 57, even if the cavity recess 33 is formed, the resin R is supplied to the cavity recess 33 while maintaining the state as it is. . Therefore, the shape of the resin R does not collapse, and the resin R can be supplied to the bottom of the cavity recess 33 without changing the position.
　続いて、図１８に示すように、吸着部５３、５５によってリリースフィルムＦをエア路５２、５４から吸引しながら、フィルムローダ５７を上昇させて、下型３２に樹脂ＲおよびリリースフィルムＦを引き渡す。 Subsequently, as shown in FIG. 18, while suctioning the release film F from the air passages 52, 54 by the suction sections 53, 55, the film loader 57 is raised to deliver the resin R and the release film F to the lower mold 32. .
　続いて、図１９に示すように、ワークローダ５６およびフィルムローダ５７をモールド金型３０内部から退避させる。その後、前記第１実施形態で図７～図９を参照して説明した工程を経て、成形品が略完成する。 Subsequently, as shown in FIG. 19, the work loader 56 and the film loader 57 are retracted from the inside of the mold 30. Thereafter, through the steps described with reference to FIGS. 7 to 9 in the first embodiment, the molded article is substantially completed.
　（第４実施形態）
　前記第１実施形態では、フィルムローダ５７としてリリースフィルムＦをフラットに吸着保持するハンド部６３を用いた場合について説明した。これに対して本実施形態では、フィルムローダ５７として、リリースフィルムＦをプレートとして支持し、そのまま下型３２に配置（セット）させる治具（部材）を用いる点が相違する。以下では、この相違点を中心に図２０～図２４を参照して説明する。図２０、図２２～図２４は、本実施形態におけるプレス部１３０の模式的断面図である。図２１は、図２０に示すフィルムローダ５７（フィルムプレート部）の分解断面図である。 Fourth Embodiment
In the first embodiment, the case where the hand unit 63 for holding the release film F in a flat state by suction as the film loader 57 has been described. On the other hand, the present embodiment is different in that, as the film loader 57, a jig (member) which supports the release film F as a plate and causes the lower mold 32 to be disposed (set) as it is. Hereinafter, this difference will be mainly described with reference to FIGS. 20 to 24. 20 and 22 to 24 are schematic cross-sectional views of the press unit 130 in the present embodiment. FIG. 21 is an exploded cross-sectional view of the film loader 57 (film plate portion) shown in FIG.
　本実施形態におけるプレス部１３０について具体的に説明する。フィルムローダ５７は、リング状の上部プレート８０および下部プレート８１を備えて、上下から挟み込むことでリリースフィルムＦを全周から引っ張った状態で保持可能に構成されている（特に、図２１参照）。図２１に示す例では、下部プレート８１は、フランジ状となるように、周縁部端で上部プレート８０側の面から窪んで周方向に延びる段付き部８２が形成されている。上部プレート８０と下部プレート８１の間にリリースフィルムＦを挟んで、下部プレート８１の段付き部８２（細径部）に上部プレート８０の内径部８０ａを対応させて上部プレート８０がはめ合わさってフィルムプレート部（フィルムローダ５７）が構成される（特に、図２０参照）。そして、リリースフィルムＦは、上部プレート８０および下部プレート８１の内周においてフラットとなるように、張設される。 The press unit 130 in the present embodiment will be specifically described. The film loader 57 is provided with a ring-shaped upper plate 80 and a lower plate 81, and is configured to be able to hold the release film F in a pulled state from the entire circumference by being sandwiched from above and below (in particular, refer to FIG. 21). In the example shown in FIG. 21, the lower plate 81 is formed with a stepped portion 82 extending in the circumferential direction, recessed from the surface on the upper plate 80 side at the peripheral edge end so as to be flange-like. With the release film F interposed between the upper plate 80 and the lower plate 81, the upper plate 80 is fitted such that the inner diameter portion 80a of the upper plate 80 corresponds to the stepped portion 82 (small diameter portion) of the lower plate 81. The plate portion (film loader 57) is configured (in particular, refer to FIG. 20). Then, the release film F is stretched so as to be flat on the inner peripheries of the upper plate 80 and the lower plate 81.
　なお、例えば、同一のリング状の上部プレート８０および下部プレート８１を用いて、それらの周縁部で貫通する孔をボルトなどで固定して（リリースフィルムＦ位置を避けて）、フィルムプレート部を構成してもよい。 In addition, for example, using the same ring-shaped upper plate 80 and lower plate 81, the holes penetrating at the peripheral portion thereof are fixed with bolts or the like (avoid release film F position) to configure the film plate portion You may
　また、下型クランパ３５には周縁部端で端面から窪んで周方向に延びる段付き部８３が形成されている。そして、下型クランパ３５の段付き部８３に下部プレート８１の内径部８１ａを対応させてフィルムプレート部（フィルムローダ５７）がはめ合わさって固定される。本実施形態では、簡単な構成でリリースフィルムＦをフラットに保持することができ、フラットな状態でリリースフィルムＦを下型３２に配置することができる。 Further, the lower clamper 35 is formed with a stepped portion 83 which is recessed in the end face at the peripheral edge end and extends in the circumferential direction. Then, the inner diameter portion 81a of the lower plate 81 is made to correspond to the stepped portion 83 of the lower clamper 35, and the film plate portion (film loader 57) is fitted and fixed. In this embodiment, the release film F can be held flat with a simple configuration, and the release film F can be disposed on the lower mold 32 in a flat state.
　次に、本実施形態における樹脂モールド装置１００を用いた樹脂モールド方法（樹脂モールド装置１００の動作方法）について説明する。 Next, a resin molding method (operation method of the resin mold apparatus 100) using the resin mold apparatus 100 in the present embodiment will be described.
　図２０に示すように、モールド金型３０が型開きした状態において、金型外部から、ワークローダ５６によってワークＷを搬入する。また、モールド金型３０が型開きした状態において、フィルムローダ５７によって樹脂ＲおよびリリースフィルムＦを搬入する。 As shown in FIG. 20, in a state where the mold 30 is opened, the workpiece W is carried in by the work loader 56 from the outside of the mold. Further, in a state where the mold 30 is opened, the film loader 57 carries in the resin R and the release film F.
　なお、これに先立ち、図２１に示すように、上部プレート８０と下部プレート８１の間にリリースフィルムＦを挟んでフィルムプレート部を構成し、このフィルムプレート部のリリースフィルムＦ上に樹脂Ｒが搭載（供給）されている。 Prior to this, as shown in FIG. 21, a film plate portion is formed by sandwiching the release film F between the upper plate 80 and the lower plate 81, and the resin R is mounted on the release film F of the film plate portion. (Supplied).
　続いて、図２２に示すように、ワークローダ５６を上昇させ、ワークＷを上型３１へ引き渡す。 Subsequently, as shown in FIG. 22, the work loader 56 is raised and the work W is delivered to the upper die 31.
　また、図２２に示すように、フィルムローダ５７を下降させ、下型３２に樹脂Ｒが搭載されたリリースフィルムＦを引き渡す。具体的には、まず、フィルムローダ５７の下降によって、下部プレート８１下面を下型クランパ３５の段付き部８３上面に当接させて固定した後、弾性部材５０を押し縮める（可動部を可動させる）。すなわち、フィルムローダ５７の下降によって、下型クランパ３５を押し下げる。次いで、下型キャビティ駒３４の上面（上側の端面）と下型クランパ３５の上面（上側の端面）とが水平の状態となるまで、フィルムローダ５７を下降させる。 Further, as shown in FIG. 22, the film loader 57 is lowered, and the release film F having the resin R mounted on the lower mold 32 is delivered. Specifically, first, the lower surface of the lower plate 81 is brought into contact with and fixed to the upper surface of the stepped portion 83 of the lower clamper 35 by lowering the film loader 57, and then the elastic member 50 is compressed (moving the movable portion ). That is, the lower clamper 35 is pushed down by lowering the film loader 57. Next, the film loader 57 is lowered until the upper surface (upper end surface) of the lower mold cavity piece 34 and the upper surface (upper end surface) of the lower mold clamper 35 become horizontal.
　このとき、フィルムローダ５７は、フラットなリリースフィルムＦを張設保持している。すなわち、下型キャビティ駒３４の上面と下型クランパ３５の上面とが水平に保持された下型３２に、フィルムローダ５７によって樹脂Ｒが下型キャビティ駒３４上に位置するようにフラットなリリースフィルムＦを配置する。 At this time, the film loader 57 stretches and holds the flat release film F. That is, in the lower mold 32 in which the upper surface of the lower mold cavity piece 34 and the upper surface of the lower clamper 35 are held horizontally, a flat release film so that the resin R is positioned on the lower mold cavity piece 34 by the film loader 57. Place F.
　次いで、下型キャビティ駒３４の上面と下型クランパ３５の上面とが水平な状態で、下型キャビティ駒３４の上面および下型クランパ３５の上面を覆うように配置されたフラットな状態のリリースフィルムＦを、吸着部５３によって吸着、保持する。 Next, with the upper surface of the lower mold cavity piece 34 and the upper surface of the lower mold clamper 35 horizontal, the release film in a flat state is disposed to cover the upper surface of the lower mold cavity piece 34 and the upper surface of the lower mold clamper 35. F is adsorbed and held by the adsorption unit 53.
　続いて、図２３に示すように、ワークローダ５６を下降させる。これにより、ワークローダ５６がワークＷから離隔する。そして、ワークＷは、上型３１のみで保持される。次いで、ワークローダ５６をモールド金型３０内部から退避させる。 Subsequently, as shown in FIG. 23, the work loader 56 is lowered. Thereby, the work loader 56 is separated from the work W. Then, the work W is held only by the upper mold 31. Next, the work loader 56 is retracted from the inside of the mold 30.
　また、図２３に示すように、吸着部５３によってフラットなリリースフィルムＦをエア路４７Ａ、５２から吸引しながら、フィルムローダ５７を上昇させて、弾性部材５０を伸長させる（可動部を可動させる）。そして、この弾性部材５０によって下型クランパ３５に対して下型キャビティ駒３４を相対的に移動してキャビティ凹部３３を形成する。このとき、下部プレート８１の内径部８１ａと下型クランパ３５の段付き部８３とが嵌め合わさりによってリリースフィルムＦの外周部が固定され、吸着部５３によってリリースフィルムＦのキャビティ凹部３３の角部に対応する箇所が吸着されているので、キャビティ凹部３３の内面に追従させながらリリースフィルムＦが変形する。これにより、リリースフィルムＦがキャビティ凹部３３の内面に追従して吸着保持される。 Further, as shown in FIG. 23, while suctioning the flat release film F from the air paths 47A and 52 by the suction portion 53, the film loader 57 is lifted to extend the elastic member 50 (move the movable portion). . Then, the lower mold cavity piece 34 is moved relative to the lower mold clamper 35 by the elastic member 50 to form the cavity recess 33. At this time, the outer peripheral portion of the release film F is fixed by the inner diameter portion 81a of the lower plate 81 and the stepped portion 83 of the lower clamper 35 being fitted, and the suction portion 53 fixes the corner of the cavity recess 33 of the release film F. Since the corresponding portion is adsorbed, the release film F deforms while making the inner surface of the cavity recess 33 follow. As a result, the release film F follows the inner surface of the cavity recess 33 and is held by suction.
　この際に、キャビティ凹部３３の内面に追従させながらリリースフィルムＦを吸着保持することで、樹脂Ｒがそのままの形状でキャビティ凹部３３に供給される。換言すれば、フィルムローダ５７によって樹脂ＲがリリースフィルムＦを介して下型キャビティ駒３４上に配置されているので、下型クランパ３５に対して下型キャビティ駒３４が相対的に移動してキャビティ凹部３３が形成されても、樹脂Ｒはそのままの状態を保持してキャビティ凹部３３に供給される。したがって、樹脂Ｒの形状が崩れず、また位置が変わらずにキャビティ凹部３３の底部に樹脂Ｒを供給することができる。このようにキャビティ凹部３３に所望の状態で樹脂Ｒを供給することは、ボイドやワイヤスイープなどによる成形品の品質不良を低減することに作用する。 At this time, the resin R is supplied to the cavity recess 33 as it is by suction-holding the release film F while making the inner surface of the cavity recess 33 follow. In other words, since the resin R is disposed on the lower mold cavity piece 34 via the release film F by the film loader 57, the lower mold cavity piece 34 moves relative to the lower mold clamper 35 and the cavity Even if the recess 33 is formed, the resin R is supplied to the cavity recess 33 while maintaining the state as it is. Therefore, the shape of the resin R does not collapse, and the resin R can be supplied to the bottom of the cavity recess 33 without changing the position. As described above, supplying the resin R to the cavity recess 33 in a desired state works to reduce the quality defects of the molded product due to the void and the wire sweep.
　続いて、図２４に示すように、可動型である下型３２を上昇させて、モールド金型３０を型閉じ（型締め）する。これにより、リリースフィルムＦがクランプされ、すなわち、上型３１と下型３２とでフィルムプレート部（フィルムローダ５７）が挟み込まれる。その後、前記第１実施形態で図８～図９を参照して説明した工程を経て、成形品が略完成する。 Subsequently, as shown in FIG. 24, the movable lower die 32 is raised to close the mold 30 (clamping). Thereby, the release film F is clamped, that is, the film plate portion (film loader 57) is sandwiched between the upper mold 31 and the lower mold 32. Thereafter, through the steps described with reference to FIGS. 8 to 9 in the first embodiment, the molded article is substantially completed.
　（第５実施形態）
　前記第１実施形態では、フィルムローダ５７（ハンド部６３）によって下型クランパ３５を押し下げることで、下型キャビティ駒３４の上面と下型クランパ３５の上面とを水平とする場合について説明した。これに対して、本実施形態では、下型３２内にフローティング支持したプレート状の治具３４Ａ（下型キャビティ駒３４の上部）を設け、その治具３４Ａの上面と下型クランパ３５の上面とを水平とする点が相違する。以下では、この相違点を中心に図２５～図２６を参照して説明する。図２５～図２６は、本実施形態におけるプレス部１３０の模式的断面図である。 Fifth Embodiment
In the first embodiment, the case where the upper surface of the lower mold cavity piece 34 and the upper surface of the lower clamper 35 are made horizontal by depressing the lower clamper 35 by the film loader 57 (hand portion 63) has been described. On the other hand, in the present embodiment, a plate-like jig 34A (upper part of the lower mold cavity piece 34) supported floatingly is provided in the lower mold 32, and the upper surface of the jig 34A and the upper surface of the lower clamper 35 Is different in that it is horizontal. Hereinafter, this difference will be mainly described with reference to FIGS. 25 to 26. 25 to 26 are schematic cross-sectional views of the press unit 130 in the present embodiment.
　本実施形態におけるプレス部１３０について具体的に説明する。プレス部１３０は、下型キャビティ駒３４の上部が分離可能に設けられたプレート状の治具３４Ａを備えている。また、プレス部１３０は、プレート状の治具３４Ａの例えば四隅を支持する複数の支持ピン８４を備えている。また、プレス部１３０は、下型ベース４６に対して支持ピン８４を上下方向に移動可能に組み付けられ、支持ピン８４と同数の弾性部材８５（例えば、スプリング）を備えている。このため、型開きした状態で、治具３４Ａ（下型キャビティ駒３４の上部）の上面と下型クランパ３５の上面とが水平となるように、支持ピン８４および可動部を構成する弾性部材８５によって治具３４Ａがフローティング支持されている。なお、プレート状の治具３４Ａは、弾性部材８５を用いずにエアシリンダやサーボモータといった駆動機構を用いて昇降可能な構成とすることもできる。 The press unit 130 in the present embodiment will be specifically described. The press unit 130 includes a plate-like jig 34A in which the upper portion of the lower mold cavity piece 34 is provided so as to be separated. The press unit 130 also includes a plurality of support pins 84 that support, for example, the four corners of the plate-like jig 34A. Further, the press unit 130 is assembled such that the support pin 84 is movable in the vertical direction with respect to the lower mold base 46, and includes the same number of elastic members 85 (for example, springs) as the support pin 84. Therefore, the support pin 84 and the elastic member 85 constituting the movable portion are arranged such that the upper surface of the jig 34A (the upper portion of the lower mold cavity piece 34) and the upper surface of the lower clamper 35 become horizontal in the mold open state. The jig 34A is floatingly supported by this. The plate-like jig 34A may be configured to be movable up and down using a drive mechanism such as an air cylinder or a servomotor without using the elastic member 85.
　次に、本実施形態における樹脂モールド装置１００を用いた樹脂モールド方法（樹脂モールド装置１００の動作方法）について説明する。 Next, a resin molding method (operation method of the resin mold apparatus 100) using the resin mold apparatus 100 in the present embodiment will be described.
　図２５に示すように、モールド金型３０が型開きした状態において、樹脂ＲおよびリリースフィルムＦを搬入し、下型３２へ引き渡す。このとき、リリースフィルムＦは、治具３４Ａ（下型キャビティ駒３４の上部）の上面と下型クランパ３５の上面とが水平に保持された下型３２にフィルムローダ５７によってフラットに配置される。そして、吸着部５３、５５によって、リリースフィルムＦを吸引し始める。 As shown in FIG. 25, the resin R and the release film F are carried in and delivered to the lower mold 32 in a state where the mold 30 is opened. At this time, the release film F is disposed flat by the film loader 57 on the lower mold 32 in which the upper surface of the jig 34A (the upper portion of the lower mold cavity piece 34) and the upper surface of the lower clamper 35 are held horizontally. Then, the suction unit 53, 55 starts to suck the release film F.
　続いて、図２６に示すように、吸着部５３、５５によって、リリースフィルムＦを吸引する。具体的には、吸着部５５によってリリースフィルムＦの外周部が吸着され、吸着部５３によってリリースフィルムＦ以下の空間の空気が吸引されて、下型クランパ３５に対して上下方向に可動に設けられている治具３４Ａが弾性部材８５を押し縮めながら下降する（可動部を可動させる）。 Subsequently, as shown in FIG. 26, the release film F is sucked by the suction units 53 and 55. Specifically, the outer peripheral portion of the release film F is adsorbed by the adsorption portion 55, and the air in the space below the release film F is adsorbed by the adsorption portion 53, and is provided movably in the vertical direction with respect to the lower clamper 35. The jig 34A is lowered while pressing the elastic member 85 (moving the movable portion).
　この弾性部材８５によって下型クランパ３５に対して治具３４Ａ（下型キャビティ駒３４の上部）を相対的に移動してキャビティ凹部３３が形成されることとなる。このとき、吸着部５５によってリリースフィルムＦの外周部が吸着され、吸着部５３によってリリースフィルムＦのキャビティ凹部３３の角部に対応する箇所が吸着されているので、キャビティ凹部３３の内面に追従させながらリリースフィルムＦが変形する。これにより、リリースフィルムＦがキャビティ凹部３３の内面に追従して吸着保持される。 The elastic member 85 moves the jig 34A (the upper portion of the lower mold cavity piece 34) relative to the lower mold clamper 35 to form the cavity recess 33. At this time, the outer peripheral portion of the release film F is adsorbed by the adsorption portion 55, and the portion corresponding to the corner portion of the cavity recess 33 of the release film F is adsorbed by the adsorption portion 53. While the release film F is deformed. As a result, the release film F follows the inner surface of the cavity recess 33 and is held by suction.
　また、キャビティ凹部３３の内面に追従させながらリリースフィルムＦを吸着保持すると共に、樹脂Ｒをそのままキャビティ凹部３３に供給する。フィルムローダ５７によって樹脂ＲがリリースフィルムＦを介して治具３４Ａ上に配置されているので、キャビティ凹部３３が形成されても、樹脂Ｒはそのままの状態を保持してキャビティ凹部３３に供給される。したがって、樹脂Ｒの形状が崩れず、また位置が変わらずにキャビティ凹部３３の底部に樹脂Ｒを供給することができる。その後、前記第１実施形態で図７～図９を参照して説明した工程を経て、成形品が略完成する。 Further, the release film F is adsorbed and held while following the inner surface of the cavity recess 33, and the resin R is supplied to the cavity recess 33 as it is. Since the resin R is disposed on the jig 34A via the release film F by the film loader 57, even if the cavity recess 33 is formed, the resin R is supplied to the cavity recess 33 while maintaining the state as it is. . Therefore, the shape of the resin R does not collapse, and the resin R can be supplied to the bottom of the cavity recess 33 without changing the position. Thereafter, through the steps described with reference to FIGS. 7 to 9 in the first embodiment, the molded article is substantially completed.
　これによれば、例えば、フィルムローダ５７によって下型クランパ３５を押し下げて下型キャビティ駒３４の端面と下型クランパ３５の端面とを水平にする必要がなくなり、フィルムローダ５７の動作・構成（例えば、駆動モータの出力、ストロークの低減）を簡素化することができる。また、下型３２にリリースフィルムＦが配置された際には、治具３４Ａ（下型キャビティ駒３４の上部）がフローティングした状態であるため、リリースフィルムＦの熱収縮を防止することができ、リリースフィルムＦに搭載される樹脂Ｒの過熱を防止したり、加熱調整を行ったりすることが容易となる。 According to this, for example, it is not necessary to push down the lower mold clamper 35 by the film loader 57 to make the end face of the lower mold cavity piece 34 and the end face of the lower mold clamper 35 horizontal, and the operation and configuration of the film loader 57 (for example, , The output of the drive motor, and the reduction of the stroke) can be simplified. Further, when the release film F is disposed in the lower mold 32, the jig 34A (upper part of the lower mold cavity piece 34) is in a floating state, so that the thermal contraction of the release film F can be prevented. It becomes easy to prevent overheating of the resin R mounted on the release film F and to perform heating adjustment.
　（第６実施形態）
　前記第１実施形態では、図７を参照して説明したように、型閉じしてキャビティ凹部３３を含むモールド金型３０内部が気密された状態で、モールド金型３０内部を減圧（脱気）する場合について説明した。このとき、上型３１のワーク保持部（エア路９０および吸着部９１）によって、基板１０（ワークＷ）を吸着により上型３１へ保持する場合、減圧のための吸引力により基板吸着のための吸引力が低下して、基板１０が落下するおそれがある。このような前記第１実施形態に対して、本実施形態では、下型クランパ３５に複数個のピンをフローティング支持させて減圧空間の形成状態において、基板１０を上型３１に押し付けるように支持する構成としている点が相違する。以下では、この相違点を中心に図２７を参照して説明する。図２７は、本実施形態におけるプレス部１３０の模式的断面図である。 Sixth Embodiment
In the first embodiment, as described with reference to FIG. 7, the inside of the mold 30 is depressurized (degassed) in a state in which the inside of the mold 30 including the cavity recess 33 is closed by closing the mold. The case was described. At this time, when holding the substrate 10 (work W) to the upper mold 31 by suction by the work holding portion (air passage 90 and suction portion 91) of the upper mold 31, the suction force for pressure reduction causes the substrate to be suctioned. The suction force is reduced, and the substrate 10 may fall. In contrast to the first embodiment, in the present embodiment, the lower clamper 35 is made to support a plurality of pins in a floating manner, and the substrate 10 is supported so as to be pressed against the upper die 31 in the formation state of the decompression space. The difference is in the configuration. In the following, this difference will be mainly described with reference to FIG. FIG. 27 is a schematic cross-sectional view of the press unit 130 in the present embodiment.
　プレス部１３０は、下型クランパ３５の貫通孔４７の周囲に沿って下型クランパ３５の内部に設けられた複数のピン８６を備えている。また、プレス部１３０は、下型クランパ３５に対してピン８６を上下方向に移動可能に下型クランパ３５の内部に組み付けられ、ピン８６と同数の弾性部材８７（例えば、スプリング）を備えている。 The press unit 130 includes a plurality of pins 86 provided inside the lower clamper 35 along the periphery of the through hole 47 of the lower clamper 35. The press portion 130 is assembled to the inside of the lower mold clamper 35 so that the pin 86 can be moved in the vertical direction with respect to the lower mold clamper 35, and includes the same number of elastic members 87 (for example, springs) as the pins 86. .
　このため、減圧空間を形成する状態で、下型クランパ３５の端面から突出して、リリースフィルムＦを介して基板１０の表面と当接してワークＷを支持するように、可動部を構成する弾性部材８７によってピン８６がフローティング支持されている。そして、ワークＷをクランプした状態では（図８参照）、ピン８６は下型クランパ３５の内部に収容される。したがって、クランプ前に上型３１で保持されているワークＷが落下するのを防止することができる。 For this reason, an elastic member which constitutes the movable portion so as to support the work W by coming into contact with the surface of the substrate 10 via the release film F so as to project from the end face of the lower clamper 35 in a state of forming a decompression space. A pin 86 is supported floating by 87. Then, in a state where the work W is clamped (see FIG. 8), the pin 86 is accommodated inside the lower clamper 35. Therefore, it is possible to prevent the workpiece W held by the upper die 31 from falling before clamping.
　なお、図２７では、エア路４４を通じて減圧部４５による減圧空間形成する際に、その吸引経路が塞がれたようにみえるが、ピン８６は部分的に配置されているため、減圧が阻害されることはない。 In FIG. 27, when forming a depressurization space by the depressurization unit 45 through the air passage 44, the suction path appears to be blocked, but since the pin 86 is partially disposed, the depressurization is inhibited. There is nothing to do.
　（第７実施形態）
　ワークＷ（基板１０）の片面のみを樹脂モールドする前記第１実施形態に対して、本実施形態では、ワークＷの両面を樹脂モールドする点が相違する。以下では、この相違点を中心に図３３～図３６を参照して説明する。図３３～図３６は、本実施形態における樹脂モールド工程中のプレス部１３０の模式的断面図である。 Seventh Embodiment
Compared to the first embodiment in which only one side of the work W (substrate 10) is resin-molded, the present embodiment is different in that both sides of the work W are resin-molded. Hereinafter, this difference will be mainly described with reference to FIGS. 33 to 36. 33 to 36 are schematic cross-sectional views of the press unit 130 during the resin molding process in the present embodiment.
　本実施形態におけるワークＷは、一方の面１０ａとその反対の他方の面１０ｂとを有する基板１０と、両面１０ａ、１０ｂのそれぞれに設けられる複数のボール状のバンプ１１Ａ、１１Ａ（第１部品、第２部品）とを備え、例えばウエハ状（板状）に構成されている。両面１０ａ、１０ｂのそれぞれのバンプ１１Ａ、１１Ａが樹脂モールドされて、両面１０ａ、１０ｂのそれぞれに樹脂モールド部１４、１５が形成され（図３６参照）、ワークＷは樹脂モールド製品（成形品）として略完成したものとなる。 The workpiece W in the present embodiment includes a substrate 10 having one surface 10 a and the other surface 10 b opposite thereto, and a plurality of ball-shaped bumps 11 A and 11 A provided on both surfaces 10 a and 10 b (first components, A second part) and is configured, for example, in a wafer shape (plate shape). The respective bumps 11A and 11A of both surfaces 10a and 10b are resin-molded, and resin molded portions 14 and 15 are formed on both surfaces 10a and 10b (see FIG. 36), and the work W is a resin molded product (molded product) It will be almost complete.
　このようなウエハ状のワークＷの樹脂モールドは、ＷＬＰ（Wafer Level 
Package）と呼ばれている。なお、ワークＷに設けられる部品としては、配線部品であるバンプ１１Ａに限らず、チップ部品（例えば、半導体チップ、ＭＥＭＳチップ、チップコンデンサなど）でもよく、また、配線部品およびチップ部品の両方でもよい。基板１０としては、一般的な基板だけでなく板状の部材を含み、部品が一時的に搭載されるキャリアや半導体ウエハであってもよい。 The resin mold of such a wafer-like workpiece W is WLP (Wafer Level).
It is called Package). The parts provided on the work W are not limited to the bumps 11A, which are wiring parts, and may be chip parts (for example, semiconductor chips, MEMS chips, chip capacitors, etc.), or both of wiring parts and chip parts. . As the substrate 10, not only a general substrate but also a plate-like member may be used, such as a carrier or a semiconductor wafer on which components are temporarily mounted.
　また、本実施形態において、ワークＷは、樹脂モールドされておらず、両面の部品（バンプ１１Ａ）が露出したもの（図３３参照）と、一面のみが樹脂モールドされて他面の部品（バンプ１１Ａ）のみが露出したもの（図３５参照）とがロボット機構部１８０（図１参照）によって別個に供給される。このため、本実施形態におけるプレス部１３０は、板状の第１治具１２（図３３参照）および第２治具１３（図３５参照）を備えることとなる。 Further, in the present embodiment, the workpiece W is not resin-molded, and the parts (bumps 11A) on both sides are exposed (see FIG. 33), and only one side is resin-molded and the parts on the other side (bumps 11A) ) (See FIG. 35) are separately supplied by the robot mechanism unit 180 (see FIG. 1). For this reason, the press part 130 in this embodiment will be equipped with the plate-shaped 1st jig 12 (refer FIG. 33) and the 2nd jig 13 (refer FIG. 35).
　治具１２、１３は、上型３１と下型３２とでワークＷをクランプする際に、上型インサート３７の下面にそれぞれが取り替えられて設けられる。治具１２は、面１０ａにおいて製品として製造される半導体チップに対して搭載されるバンプ１１Ａの搭載領域よりも大きい第１開孔１２ａ（図３３では複数を示す。）を有している。換言すれば、第１開孔１２ａは、バンプ１１Ａとして設けられた部品を避けながらワークＷと治具１２とを重ね合わせられるように形成されている。また、治具１３は、開孔１２ａよりも大きい第２開孔１３ａ（図３５では一つを示す。）を有している。 The jigs 12 and 13 are provided so as to be replaced on the lower surface of the upper mold insert 37 when the workpiece W is clamped by the upper mold 31 and the lower mold 32. The jig 12 has a first opening 12a (a plurality of which is shown in FIG. 33) larger than the mounting area of the bumps 11A mounted on the semiconductor chip manufactured as a product on the surface 10a. In other words, the first opening 12a is formed so that the workpiece W and the jig 12 can be overlapped while avoiding the parts provided as the bumps 11A. Further, the jig 13 has a second opening 13a (one shown in FIG. 35) larger than the opening 12a.
　治具１２を用いる際には、バンプ１１Ａが開孔１２ａに収まるようにして（すなわち、開孔１２ａによってバンプ１１Ａに対しては逃がしが確保されている。）、ワークＷの面１０ａに搭載される（図３３参照）。また、治具１３を用いる際には、樹脂モールド部１５が開孔１３ａに収まるようにして（すなわち、開孔１３ａによって樹脂モールド部１５に対しては逃がしが確保されている。）、ワークＷの面１０ｂに搭載される（図３５参照）。本実施形態では、治具１２、１３を用いることで、バンプ１１Ａや樹脂モールド部１５を逃がして（避けて）ワークＷをクランプすることができる（図３４、図３６参照）。 When the jig 12 is used, the bump 11A is mounted on the surface 10a of the work W such that the bump 11A is accommodated in the opening 12a (that is, escape is secured to the bump 11A by the opening 12a). (See FIG. 33). Further, when using the jig 13, the work W is made such that the resin mold portion 15 is accommodated in the opening 13 a (that is, the escape is secured to the resin mold portion 15 by the opening 13 a). Is mounted on the face 10b of (see FIG. 35). In the present embodiment, by using the jigs 12 and 13, the work W can be clamped by avoiding (avoiding) the bumps 11A and the resin mold portion 15 (see FIGS. 34 and 36).
　なお、治具１２、１３が取り替え可能であるため、別の製品を成形する際にはモールド金型３０を共用し、別の治具を用いることができる。また、治具１２、１３は、上型３１に固定しても用いてもよい。 In addition, since the jigs 12 and 13 can be replaced, when molding another product, the mold 30 can be shared and another jig can be used. The jigs 12 and 13 may be fixed to the upper mold 31 or may be used.
　本実施形態において、ローダ１９０は、ロボット機構部１８０から引き渡されたワークＷの上に治具１２または治具１３を重ね合わせてからプレス部１３０にこれらを搬入する。また、ローダ１９０は、プレス部１３０から引き渡された樹脂モールド済みのワークＷの上から治具１２または治具１３を取り外してロボット機構部１８０に搬出する。このように、ローダ１９０に治具１２または治具１３が準備されることで、治具１２または治具１３と共にワークＷをプレス部１３０内部へ受渡しされる。 In the present embodiment, the loader 190 superimposes the jig 12 or the jig 13 on the workpiece W delivered from the robot mechanism unit 180 and then loads the same into the press unit 130. Further, the loader 190 removes the jig 12 or the jig 13 from the top of the resin-molded workpiece W delivered from the press unit 130 and carries it out to the robot mechanism unit 180. As described above, by preparing the jig 12 or the jig 13 in the loader 190, the workpiece W is delivered to the inside of the press unit 130 together with the jig 12 or the jig 13.
　次に、本実施形態における樹脂モールド装置１００（圧縮成形装置）を用いた成形品（樹脂モールド製品）の製造方法（樹脂モールド方法）について説明する。具体的には、成形品としてワークＷの両面（面１０ａ、１０ｂ）のそれぞれに樹脂モールド部１４、１５を形成するにあたり、片面ずつ成形する方法（一次成形、二次成形の二段階モールド方法）について説明する。 Next, a method (resin mold method) for producing a molded article (resin mold product) using the resin mold apparatus 100 (compression molding apparatus) according to the present embodiment will be described. Specifically, in forming the resin mold portions 14 and 15 on both surfaces ( surfaces 10a and 10b) of the work W as molded articles, a method of molding on one surface at a time (two-step molding method of primary molding and secondary molding) Will be explained.
　まず、ロボット機構部１８０によって搬送されたワークＷをローダ１９０においてバンプ１１Ａが開孔１２ａに収まるようにしてワークＷの一方の面１０ａに治具１２を搭載する。この場合、ローダ１９０において治具１２を搭載するため、ロボット機構部１８０はワークＷのみを搬送すればよく、可搬重量の小さいロボット機構部１８０を用いることができ、装置の製造コストを削減することができる。 First, the jig 12 is mounted on one surface 10 a of the workpiece W so that the bumps 11 A are accommodated in the openings 12 a in the loader 190, with the workpiece W transported by the robot mechanism unit 180. In this case, in order to mount the jig 12 in the loader 190, the robot mechanism unit 180 may transport only the work W, and the robot mechanism unit 180 having a small payload can be used, thereby reducing the manufacturing cost of the apparatus. be able to.
　次いで、モールド金型３０が型開きした状態において、金型外部から、ワークローダ５６（図３参照）によってワークＷおよび治具１２を搬入し、上型３１に治具１２ごとワークＷを引き渡す（図３３参照）。これにより、ワークＷは、上型３１の金型面で保持される。 Next, in a state where the mold 30 is opened, the work W and the jig 12 are carried in from the outside of the mold by the work loader 56 (see FIG. 3), and the work 12 is delivered to the upper mold 31 together with the jig 12 ( See Figure 33). Thereby, the work W is held by the mold surface of the upper mold 31.
　具体的には、ワークＷの面１０ｂを下型３２に向けた状態で、治具１２を上型インサート３７の下面に当接させ、ワーク保持部（図示せず）によって、上型３１（上型インサート３７）の金型面で治具１２を介してワークＷ（基板１０）を吸着保持する。治具１２にはワークＷ（基板１０）の面１０ａ上に搭載されているバンプ１１Ａを逃がす開孔１２ａが設けられているので、例えば、バンプ１１Ａを保護することができる。なお、治具１２を用いずに、上型インサート３７の下面に凹部を彫り込んで、バンプ１１Ａを逃がすようにしてもよい。 Specifically, the jig 12 is brought into contact with the lower surface of the upper mold insert 37 in a state in which the surface 10b of the workpiece W faces the lower mold 32, and the upper mold 31 (upper The workpiece W (substrate 10) is held by suction via the jig 12 on the mold surface of the mold insert 37). The jig 12 is provided with the opening 12a for releasing the bump 11A mounted on the surface 10a of the workpiece W (substrate 10), so that the bump 11A can be protected, for example. A recess may be engraved on the lower surface of the upper mold insert 37 without using the jig 12 to release the bump 11A.
　また、モールド金型３０が型開きした状態において、フィルムローダ５７（図３参照）によって樹脂ＲおよびリリースフィルムＦを搬入し、フィルムローダ５７から下型３２へ樹脂ＲおよびリリースフィルムＦを引き渡す（図３３参照）。この際、リリースフィルムＦの形状をフラットから下型キャビティ凹部３３の変形に追従させて、下型キャビティ凹部３３を含む下型３２の金型面にリリースフィルムＦを吸着保持すると共に、樹脂Ｒをそのまま下型キャビティ凹部３３に供給する。 Also, with the mold 30 opened, the film loader 57 (see FIG. 3) carries in the resin R and the release film F, and delivers the resin R and the release film F from the film loader 57 to the lower mold 32 (see FIG. See 33). At this time, the shape of the release film F is made to follow the deformation of the lower mold cavity recessed portion 33 from the flat, and the release film F is adsorbed and held on the mold surface of the lower mold 32 including the lower mold cavity recessed portion 33 It supplies to lower mold cavity crevice 33 as it is.
　なお、リリースフィルムＦを用いることで、下型インサート３４と下型クランパ３５との隙間からの樹脂漏れを防止することができる。但し、このような樹脂漏れの影響がなく樹脂Ｒをそのまま搬送できる場合には、リリースフィルムＦを用いなくともよい。 By using the release film F, resin leakage from the gap between the lower mold insert 34 and the lower mold clamper 35 can be prevented. However, when the resin R can be transported as it is without the influence of such a resin leak, the release film F may not be used.
　続いて、図３４に示すように、可動型である下型３２を上昇させて、金型温度で溶融した樹脂Ｒに面１０ｂに設けられたバンプ１１Ａをすべて浸漬させた後、上型３１と下型３２とでワークＷをクランプしながら、下型インサート３４を成形位置にまで移動させる。そして、下型キャビティＣに充填された樹脂Ｒを加熱硬化して、ワークＷに樹脂モールドを行う。これにより、ワークＷの面１０ｂに樹脂モールド部１５が形成される。 Subsequently, as shown in FIG. 34, the movable lower die 32 is raised to immerse all the bumps 11A provided on the surface 10b in the resin R melted at the die temperature, and then the upper die 31 and The lower mold insert 34 is moved to the forming position while clamping the work W with the lower mold 32. Then, the resin R filled in the lower mold cavity C is heated and cured, and the workpiece W is resin-molded. Thus, the resin mold portion 15 is formed on the surface 10 b of the workpiece W.
　その後、ワーク保持部によってワークＷ（成形品）が上型３１で保持され、また、吸着部５３、５５によってリリースフィルムＦが下型３２で保持された状態で型開きする。このとき、リリースフィルムＦを用いていることで、ワークＷを容易に離型させることができる。そして、前述したように、検査部・冷却部１４０、キュア部１５０を経てワーク収納部１６０にワークＷを収納する（図１参照）。 Thereafter, the workpiece W (molded product) is held by the upper mold 31 by the workpiece holding unit, and the release film F is held open by the lower mold 32 by the suction units 53 and 55. At this time, by using the release film F, the work W can be easily released. Then, as described above, the workpiece W is stored in the workpiece storage unit 160 through the inspection unit / cooling unit 140 and the curing unit 150 (see FIG. 1).
　次いで、ワーク収納部１６０では、面１０ｂに形成された樹脂モールド部１５を備えたワークＷがマガジンに収納されているので、このマガジンをワーク供給部１１０へと移動させる。このとき、ワークＷの面１０ａに樹脂モールド部１４を形成することができるように、ワークＷを反転させておくことで、二次成形の準備が整うことになる。なお、樹脂モールド部１４を形成するには、治具１２と治具１３を取り替えて樹脂モールド部１５を形成した工程と同様の工程が行われる。 Next, in the work storage unit 160, since the work W provided with the resin mold portion 15 formed on the surface 10b is stored in the magazine, the magazine is moved to the work supply unit 110. At this time, by reversing the workpiece W so that the resin mold portion 14 can be formed on the surface 10 a of the workpiece W, preparation for secondary molding is completed. In addition, in order to form the resin mold part 14, the process similar to the process which replaced the jig | tool 12 and the jig | tool 13 and formed the resin mold part 15 is performed.
　次いで、ロボット機構部１８０によりローダ１９０に搬入されたワークＷの樹脂モールド部１５が開孔１３ａに収まるようにしてワークＷの一方の面１０ｂに治具１３を搭載する。ここで、治具１３の開孔１３ａは、樹脂モールド部１５の平面領域よりも大きく、言い換えると、樹脂モールド部１５を形成する下型キャビティＣを構成する下型インサート３４の上面よりも大きい。 Next, the jig 13 is mounted on one surface 10 b of the work W such that the resin mold portion 15 of the work W carried into the loader 190 by the robot mechanism unit 180 fits in the opening 13 a. Here, the opening 13 a of the jig 13 is larger than the flat area of the resin mold portion 15, in other words, larger than the upper surface of the lower mold insert 34 constituting the lower mold cavity C forming the resin mold portion 15.
　続いて、モールド金型３０が型開きした状態において、金型外部から、ワークローダ５６（図３参照）によってワークＷおよび治具１３を搬入し、上型３１に治具１３ごとワークＷを引き渡す（図３５参照）。治具１３にはワークＷ（基板１０）の面１０ｂ上に搭載されている樹脂モールド部１５を逃がす開孔１３ａが設けられているので、例えば、樹脂モールド部１５を保護することができる。なお、治具１３を用いずに、上型インサート３７の下面に凹部を彫り込んで、樹脂モールド部１５を逃がすようにしてもよい。 Subsequently, in a state where the mold 30 is opened, the work W and the jig 13 are carried in from the outside of the mold by the work loader 56 (see FIG. 3), and the work 13 is delivered to the upper mold 31 together with the jig 13 (See Figure 35). The jig 13 is provided with the opening 13a for releasing the resin mold portion 15 mounted on the surface 10b of the workpiece W (substrate 10), so that the resin mold portion 15 can be protected, for example. The resin mold portion 15 may be released by engraving a recess on the lower surface of the upper mold insert 37 without using the jig 13.
　また、モールド金型３０が型開きした状態において、フィルムローダ５７（図３参照）によって樹脂ＲおよびリリースフィルムＦを搬入し、フィルムローダ５７から下型３２へ樹脂ＲおよびリリースフィルムＦを引き渡す（図３５参照）。この際、リリースフィルムＦの形状をフラットから下型キャビティ凹部３３の変形に追従させて、下型キャビティ凹部３３を含む下型３２の金型面にリリースフィルムＦを吸着保持すると共に、樹脂Ｒをそのまま下型キャビティ凹部３３に供給する。 Also, with the mold 30 opened, the film loader 57 (see FIG. 3) carries in the resin R and the release film F, and delivers the resin R and the release film F from the film loader 57 to the lower mold 32 (see FIG. See 35). At this time, the shape of the release film F is made to follow the deformation of the lower mold cavity recessed portion 33 from the flat, and the release film F is adsorbed and held on the mold surface of the lower mold 32 including the lower mold cavity recessed portion 33 It supplies to lower mold cavity crevice 33 as it is.
　この樹脂Ｒは、樹脂モールド部１４を形成するものであり、先に形成した樹脂モールド部１５と同量、同質のものとすることで、バンプ１１Ａを同一な形状に封止することができる。但し、本実施形態ではバンプ１１Ａとして示される基板１０に搭載された部品の高さが異なる場合には、それぞれに適した分量の樹脂Ｒを用いることもできる。この場合、樹脂モールドする厚みの差による反り防止の目的や、搭載された部品の機能に応じて性質の異なる樹脂Ｒを用いることもできる。 The resin R forms the resin mold portion 14, and by making the same amount and the same quality as the resin mold portion 15 formed previously, the bumps 11 A can be sealed in the same shape. However, in the present embodiment, when the heights of the components mounted on the substrate 10 shown as the bumps 11A are different, it is also possible to use an amount of resin R suitable for each. In this case, it is also possible to use a resin R having different properties depending on the purpose of preventing warpage due to the difference in thickness of resin molding and the function of the mounted component.
　続いて、図３６に示すように、可動型である下型３２を上昇させて、金型温度で溶融した樹脂Ｒに面１０ａに設けられたバンプ１１Ａをすべて浸漬させた後、上型３１と下型３２とでワークＷをクランプしながら、下型インサート３４を成形位置にまで移動させる。そして、下型キャビティＣに充填された樹脂Ｒを加熱硬化して、ワークＷに樹脂モールドを行う。これにより、ワークＷの面１０ａに樹脂モールド部１４が形成される。 Subsequently, as shown in FIG. 36, the lower die 32, which is a movable die, is raised to immerse all the bumps 11A provided on the surface 10a in the resin R melted at the die temperature. The lower mold insert 34 is moved to the forming position while clamping the work W with the lower mold 32. Then, the resin R filled in the lower mold cavity C is heated and cured, and the workpiece W is resin-molded. Thereby, the resin mold portion 14 is formed on the surface 10 a of the work W.
　その後、ワーク保持部によってワークＷ（成形品）が上型３１で保持され、また、吸着部５３、５５によってリリースフィルムＦが下型３２で保持された状態で型開きする。このとき、リリースフィルムＦを用いていることで、ワークＷを容易に離型させることができる。そして、前述したように、検査部・冷却部１４０、キュア部１５０を経てワーク収納部１６０にワークＷを収納する（図１参照）。 Thereafter, the workpiece W (molded product) is held by the upper mold 31 by the workpiece holding unit, and the release film F is held open by the lower mold 32 by the suction units 53 and 55. At this time, by using the release film F, the work W can be easily released. Then, as described above, the workpiece W is stored in the workpiece storage unit 160 through the inspection unit / cooling unit 140 and the curing unit 150 (see FIG. 1).
　その後のワークＷについて、樹脂モールド部１４、１５の端面を研削することでバンプ１１Ａを露出させると共に、１つのチップ相当のエリア毎に個片化することで、両面に接続端子面が形成された１つのパッケージ（樹脂モールド製品）が形成される。なお、バンプ１１Ａが片面に配置された基板１０の一面同士を貼り付けることでワークＷとして用いる場合には、基板１０同士を剥離させてから１つのチップ相当のエリアに個片化することで、片面に接続端子面が形成されたパッケージを効率よく成形することができる。 While grinding the end faces of the resin mold portions 14 and 15 to expose the bumps 11A for the workpiece W after that, the connection terminal surfaces are formed on both surfaces by singulating each area equivalent to one chip. One package (resin mold product) is formed. When the workpiece 10 is used as the work W by bonding one surface of the substrate 10 on one side of which the bumps 11A are disposed on one surface, the substrate 10 is separated and then singulated into an area corresponding to one chip. A package having a connection terminal surface formed on one side can be formed efficiently.
　本実施形態によれば、板状のワークＷの両面１０ａ、１０ｂをそれぞれ圧縮成形方法によって樹脂モールドすることができる。また、下型キャビティ凹部３３（下型キャビティＣ）へ樹脂Ｒを供給して樹脂モールドすることができるので、大型のワークＷであっても効率よく成形することができる。 According to the present embodiment, both surfaces 10a and 10b of the plate-like work W can be resin-molded by the compression molding method. Further, since the resin R can be supplied to the lower mold cavity recess 33 (lower mold cavity C) for resin molding, even a large-sized work W can be efficiently molded.
　また、ワークＷの片面に樹脂モールド部１５を形成した後に、ワーク収納部１６０にワークＷを収納せずにプレス部１３０に搬入して樹脂モールド部１４を形成することで、樹脂モールド部１４、１５を連続的に成形することもできる。 Further, after the resin mold portion 15 is formed on one side of the work W, the resin mold portion 14 is formed by carrying the work W into the press portion 130 without storing the work W in the work storage portion 160, It is also possible to mold 15 continuously.
　また、上述の実施形態において、樹脂Ｒ及びリリースフィルムＦをフラットに保持するために設けたシャッタ部７０に替えて、樹脂Ｒをフラットに保持するために樹脂保持用の板状部材を樹脂ＲとリリースフィルムＦとの間に挟みこんだ状態でリリースフィルムＦを搬送してもよい。樹脂保持用の板状部材は、例えば、金属板、ガラス板またはシリコンウェハなどの各種の板材としてもよいし、リードフレームや基板のような構造体としてもよい。この場合、樹脂保持用の板状部材は、成形後に剥離してもよいしそのままパッケージに残存させることで、放熱層、電磁シールド層、フィルタ層、レンズ層、波長変換層、ガス透過防止層、または、配線層といった機能層として利用することもできる。このような樹脂保持用の板状部材を用いることで、ワークＷに貼り付けることで高機能化が可能な板状の部材で樹脂Ｒ及びリリースフィルムＦのフラットな搬送を行うことができ、高機能な製品を簡易に製造することができる。なお、樹脂保持用の板状部材とシャッタ部７０と併用してもよい。 Further, in the above-described embodiment, instead of the shutter portion 70 provided to hold the resin R and the release film F flat, the plate member for resin holding is used to hold the resin R flat. The release film F may be conveyed while being sandwiched between the release film F and the release film F. The plate-like member for resin retention may be, for example, various plate materials such as a metal plate, a glass plate, or a silicon wafer, or may be a structure such as a lead frame or a substrate. In this case, the plate-like member for holding the resin may be peeled off after molding or left as it is in the package, whereby the heat dissipation layer, the electromagnetic shield layer, the filter layer, the lens layer, the wavelength conversion layer, the gas permeation preventing layer, Alternatively, it can be used as a functional layer such as a wiring layer. By using such a plate-shaped member for holding resin, it is possible to perform flat conveyance of the resin R and the release film F with a plate-like member capable of achieving high functionality by being attached to the work W, and high Functional products can be easily manufactured. The resin holding plate member and the shutter unit 70 may be used in combination.
　（第８実施形態）
　前記第１実施形態における樹脂モールド装置のプレス部では、公知のクランプ機構によってモールド金型の型開閉を行う場合について説明した。本実施形態では、特に、ワークＷの大型化（ＷＬＰ）に対応したクランプ機構をプレス部に備えた樹脂モールド装置について説明する。本実施形態の樹脂モールド装置によれば、型閉じ動作における可動プラテンの平行度を維持しつつ型閉じを高精度に行いかつ最終樹脂圧を高圧にすることで成形品質を高めることができる。 Eighth Embodiment
In the press portion of the resin mold apparatus in the first embodiment, the case where mold opening and closing of the mold is performed by a known clamp mechanism has been described. In the present embodiment, in particular, a resin mold apparatus provided with a clamp mechanism corresponding to the increase in size (WLP) of the workpiece W in the press portion will be described. According to the resin mold apparatus of the present embodiment, the molding quality can be enhanced by performing mold closing with high accuracy while maintaining the parallelism of the movable platen in the mold closing operation and by making the final resin pressure high.
　以下、本発明に係るモールド金型を開閉するクランプ機構を備えた樹脂モールド装置の好適な実施の形態について添付図面と共に詳述する。樹脂モールド装置２０１は、上型２０２及び下型２０３を有するモールド金型２０４と該モールド金型２０４を開閉するクランプ機構２０５を備えている。 BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of a resin mold apparatus having a clamp mechanism for opening and closing a mold according to the present invention will be described in detail below with reference to the attached drawings. The resin mold apparatus 201 includes a mold 204 having an upper mold 202 and a lower mold 203 and a clamp mechanism 205 for opening and closing the mold 204.
　図３７において、クランプ機構２０５は、矩形状のベース部２０６に設けられている。ベース部２０６と固定プラテン２０７との間は各コーナー部（４か所；図３８参照）に配置されたタイバー２０８により連結されている。上型２０２は固定プラテン２０７に支持され、下型２０３は可動プラテン２０９の正面（上面）側に支持されている。可動プラテン２０９は貫通して連係するタイバー２０８にガイドされて上下動する。 In FIG. 37, the clamp mechanism 205 is provided on a rectangular base portion 206. The base portion 206 and the fixed platen 207 are connected by tie bars 208 disposed at each corner portion (four places; see FIG. 38). The upper mold 202 is supported by the fixed platen 207, and the lower mold 203 is supported on the front (upper surface) side of the movable platen 209. The movable platen 209 is guided by an associated tie bar 208 to move up and down.
　可動プラテン２０９の背面側には、当該可動プラテン２０９に連係し固定プラテン２０７との間でモールド金型２０４を第１型締め力まで型閉じするボールねじ機構２１０（第１型開閉機構）が設けられている。 On the back side of the movable platen 209, a ball screw mechanism 210 (first type opening / closing mechanism) is provided which cooperates with the movable platen 209 to mold-close the mold 204 to the first mold clamping force with the fixed platen 207. It is done.
　具体的には、ベース部２０６にはタイバー２０８より内側に４か所でねじ軸２１１が設けられ、各ねじ軸２１１を回転駆動する第１駆動モータ２１２（サーボモータ）が４カ所に設けられている。第１駆動モータ２１２は、複数のモータ間で同期をとって駆動しており、サーボ制御によって高精度に速度制御することができる。また、可動プラテン２０９の背面側には、ねじ軸２１１とねじ嵌合する固定ナット２１３が４カ所に設けられている。図３８において、タイバー２０８及びねじ軸２１１はベース部２０６（可動プラテン２０９）の対角位置で互いに等間隔に配置されている。なお、ボールねじ機構２１０は３個以上設けられていれば何個設けられていてもよい。 Specifically, screw shafts 211 are provided on the base portion 206 at four positions on the inner side of the tie bar 208, and first drive motors 212 (servo motors) for rotationally driving the screw shafts 211 are provided at four positions. There is. The first drive motor 212 is driven in synchronization among the plurality of motors, and can perform speed control with high accuracy by servo control. Further, on the back surface side of the movable platen 209, fixed nuts 213 screw-fitted to the screw shaft 211 are provided at four places. In FIG. 38, the tie bars 208 and the screw shafts 211 are equally spaced from each other at diagonal positions of the base portion 206 (movable platen 209). In addition, as long as three or more ball screw mechanisms 210 are provided, any number may be provided.
　可動プラテン２０９の背面側中央部には、トグルリンク機構２１４（第２型開閉機構）が設けられている。トグルリンク機構２１４は、可動プラテン２０９に連係し第１の型締め力よりさらにクランプ力を強めた第２型締め力まで型閉じして最終樹脂圧を維持する。具体的には、ベース部２０６の中央部にはねじ軸２１５及びそのねじ軸２１５を回転駆動する第２駆動モータ２１６（サーボモータ）が設けられている。ねじ軸２１５には可動ナット２１７がねじ嵌合している。可動ナット２１７にはリンク連結部２１８が一体に設けられている。なお、各駆動モータ２１６、２１２は、ベルト機構を利用することでベース部２０６の側方に配置してもよい。 A toggle link mechanism 214 (second type opening and closing mechanism) is provided at the center on the back side of the movable platen 209. The toggle link mechanism 214 cooperates with the movable platen 209 to close the mold to a second mold clamping force that further intensifies the clamping force than the first clamping force to maintain the final resin pressure. Specifically, a screw shaft 215 and a second drive motor 216 (servo motor) for rotationally driving the screw shaft 215 are provided at the central portion of the base portion 206. A movable nut 217 is screwed on the screw shaft 215. The link connection portion 218 is integrally provided on the movable nut 217. The drive motors 216 and 212 may be arranged on the side of the base portion 206 by using a belt mechanism.
　トグルリンク機構２１４は、いわゆる倍力機構であって、以下の各リンク部材によって構成されるトグルリンク構造によって第２駆動モータ２１６からの出力を増大（増幅）させて可動プラテン２０９に出力可能に構成される。具体的には、リンク連結部２１８には連結リンク２１９の一端が回動可能に連結されている。連結リンク２１９の他端は三角リンク２２０の頂角部分に回動可能に連結している。三角リンク２２０の一方の底角部分はベース部２０６に対して回動可能に連結しており、他方の底角部分はスライドリンク２２１の一端に回動可能に連結している。スライドリンク２２１の他端は可動プラテン２０９の背面に設けられた連結部２０９ａに回動可能に連結している。このような構成により、トグルリンク機構２１４では、可動ナット２１７がねじ嵌合された第２駆動モータ２１６により、可動プラテン２０９の背面に設けられた連結部２０９ａを駆動される。 The toggle link mechanism 214 is a so-called power boosting mechanism, and is configured to increase (amplify) the output from the second drive motor 216 by the toggle link structure constituted by the following link members, and to be able to output to the movable platen 209 Be done. Specifically, one end of the connection link 219 is rotatably connected to the link connection portion 218. The other end of the connection link 219 is rotatably connected to the apex portion of the triangular link 220. One base corner portion of the triangular link 220 is pivotally connected to the base portion 206, and the other base corner portion is pivotally connected to one end of the slide link 221. The other end of the slide link 221 is rotatably connected to a connecting portion 209 a provided on the back surface of the movable platen 209. With such a configuration, in the toggle link mechanism 214, the connecting portion 209a provided on the back surface of the movable platen 209 is driven by the second drive motor 216 in which the movable nut 217 is screwed.
　また、第１駆動モータ２１２と第２駆動モータ２１６は、制御部２２２により駆動制御される。また、各タイバー２０８には、圧力センサ２２３が各々設けられている。制御部２２２は、圧力センサ２２３からモールド金型２０４のクランプ圧を検出して第１駆動モータ２１２と第２駆動モータ２１６を駆動制御することで、ボールねじ機構２１０及びトグルリンク機構２１４による金型クランプ動作を制御する。 The first drive motor 212 and the second drive motor 216 are driven and controlled by the controller 222. Each tie bar 208 is also provided with a pressure sensor 223. The control unit 222 detects the clamp pressure of the mold die 204 from the pressure sensor 223 and controls the driving of the first drive motor 212 and the second drive motor 216 to thereby obtain a mold by the ball screw mechanism 210 and the toggle link mechanism 214. Control the clamping operation.
　具体的には、制御部２２２は、型閉じ動作を開始すると、第１駆動モータ２１２と第２駆動モータ２１６を同期して駆動させ、ボールねじ機構２１０より可動プラテン２０９を通じてモールド金型２０４に供給されたワークを第１型締め力でクランプしてから当該ボールねじ機構２１０の加圧状態をトグルリンク機構２１４による加圧状態へ受け渡して当該トグルリンク機構２１４により可動プラテン２０９を第１型締め力より大きい第２型締め力までクランプする。 Specifically, when the mold closing operation is started, the control unit 222 synchronously drives the first drive motor 212 and the second drive motor 216 to supply the mold screw 204 from the ball screw mechanism 210 through the movable platen 209. The clamped work is clamped with the first mold clamping force, and then the pressurized state of the ball screw mechanism 210 is transferred to the pressurized state by the toggle link mechanism 214, and the movable platen 209 is clamped with the first mold clamping force by the toggle link mechanism 214. Clamp to a larger second mold clamping force.
　図４０Ａを参照して、モールド金型２０４の一例について説明する。上型２０２は、上型ベース２０２ａが固体プラテン７に支持されている。上型ベース２０２ａには上型インサート２０２ｂが組み付けられる。上型インサート２０２ｂのワークＷをクランプ面と面一に吸着保持するワーク保持部２０２ｃが形成されている。 An example of the mold 204 will be described with reference to FIG. 40A. The upper mold base 202 a of the upper mold 202 is supported by the solid platen 7. The upper mold insert 202b is assembled to the upper mold base 202a. A work holding portion 202c is formed, which suctions and holds the work W of the upper mold insert 202b flush with the clamp surface.
　下型２０３は、下型ベース２０３ａが可動プラテン２０９に支持されている。下型ベース２０３ａのクランプ面には凹部が形成されており、該凹部には下型キャビティ駒２０３ｂが支持されその周囲に下型クランパ２０３ｃがコイルばね２０３ｄにより付勢されて支持されている。下型クランパ２０３ｃは、下型キャビティ駒２０３ｂの上面より上方に突出しており、下型キャビティ凹部２０３ｅが形成されている。この下型キャビティ凹部２０３ｅを覆うようにリリースフィルムＦが吸着保持される。 The lower mold base 203 a of the lower mold 203 is supported by the movable platen 209. A recess is formed in the clamp surface of the lower mold base 203a, and the lower mold cavity piece 203b is supported in the recess, and the lower clamper 203c is supported by being biased by a coil spring 203d around it. The lower mold clamper 203c protrudes upward from the upper surface of the lower mold cavity piece 203b, and a lower mold cavity recess 203e is formed. The release film F is held by suction so as to cover the lower mold cavity recess 203e.
　リリースフィルムＦは、上型クランプ面に吸着保持される。リリースフィルムＦは、厚さ０．５ｍｍ程度で耐熱性を有するもので、金型面より容易に剥離するものであって、柔軟性、伸展性を有するもの、例えば、ＰＴＦＥ、ＥＴＦＥ、ＰＥＴ、ＦＥＰフィルム、フッ素含浸ガラスクロス、ポリプロピレンフィルム、ポリ塩化ビニリジン等を主成分とした単層又は複層膜が好適に用いられる。 The release film F is held by suction on the upper mold clamping surface. The release film F has a heat resistance of about 0.5 mm in thickness and can be easily peeled from the mold surface, and has flexibility and extensibility, for example, PTFE, ETFE, PET, FEP A film, a fluorine-impregnated glass cloth, a polypropylene film, a single layer or a multilayer film mainly composed of polyvinylidene chloride or the like is preferably used.
　次にクランプ機構２０５の開閉動作と樹脂モールド動作の一例について図３７、図３９Ａ及び図３９Ｂ、 図４０Ａ～図４０Ｃを参照して説明する。 Next, an example of the opening / closing operation of the clamp mechanism 205 and the resin molding operation will be described with reference to FIGS. 37, 39A and 39B, and FIGS. 40A to 40C.
　図３７において、モールド金型２０４が型開き状態において、図示しない供給装置によりワークＷがモールド金型２０４へ供給される。尚、下型２０３の下型キャビティ凹部２０３ｅは予めリリースフィルムＦに覆われて吸着保持されている。 In FIG. 37, when the mold die 204 is in the mold open state, the workpiece W is supplied to the mold die 204 by a supply device (not shown). The lower mold cavity recess 203e of the lower mold 203 is covered with the release film F in advance and held by suction.
　図４０Ａに示すように、ワークＷ（たとえば半導体チップが搭載された基板、半導体ウエハ等）が上型２０２のワーク保持部２０２ｃに吸着保持され、リリースフィルムＦに覆われた下型キャビティ凹部２０３ｅにモールド樹脂Ｒ（液状樹脂、顆粒状樹脂、粒体樹脂（パウダー樹脂）、シート樹脂、タブレット樹脂等）が供給される。なお、モールド樹脂ＲをリリースフィルムＦと共に下型キャビティ凹部２０３ｅに供給してもよい。 As shown in FIG. 40A, the workpiece W (for example, a substrate on which a semiconductor chip is mounted, a semiconductor wafer, etc.) is held by suction on the workpiece holding portion 202c of the upper mold 202 and Mold resin R (liquid resin, granular resin, granular resin (powder resin), sheet resin, tablet resin, etc.) is supplied. The mold resin R may be supplied to the lower mold cavity recess 203e together with the release film F.
　型閉じ動作を開始すると、制御部２２２は、第１駆動モータ２１２と第２駆動モータ２１６とを同期をとりながら駆動する。図３９Ａにおいて、第１駆動モータ２１２の駆動によってボールねじ機構２１０は、４か所に有するねじ軸２１１が回転し、ねじ軸２１１の回転に伴って固定ナット２１３とねじ嵌合する可動プラテン２０９が固定プラテン２０７に対する平行度を保ったまま上昇する。即ち、下型２０３（具体的にはそのパーティング面）が上型２０２（具体的にはそのパーティング面）対して平行度を保ったまま上昇する。 When the mold closing operation is started, the control unit 222 drives the first drive motor 212 and the second drive motor 216 in synchronization with each other. In FIG. 39A, the screw shaft 211 of the ball screw mechanism 210 is rotated at four points by the drive of the first drive motor 212, and the movable platen 209 screw-engages with the fixed nut 213 with the rotation of the screw shaft 211. It rises while maintaining the parallelism with respect to the fixed platen 207. That is, the lower die 203 (specifically, the parting surface thereof) rises while maintaining parallelism with the upper die 202 (specifically, the parting surface thereof).
　また、第２駆動モータ２１６の駆動により、トグルリンク機構２１４は、ねじ軸２１５にねじ嵌合している可動ナット２１７が上動するため、リンク連結部２１８の両側に連結する連結リンク２１９が水平方向に向かって両側に傾倒し、三角リンク２２０が起立するように回転し、スライドリンク２２１を押し上げる。このとき、トグルリンク機構２１４は、スライドリンク２２１と連結部２０９ａとの間に設けられた隙間により可動プラテン２０９を通じた荷重を受けていない。 Further, since the movable nut 217 screwed to the screw shaft 215 is moved upward by the drive of the second drive motor 216, the connection link 219 connected to both sides of the link connection portion 218 is horizontal. Tilting to both sides in the direction, the triangular link 220 rotates so as to stand up, and pushes up the slide link 221. At this time, the toggle link mechanism 214 does not receive the load through the movable platen 209 due to the gap provided between the slide link 221 and the connecting portion 209a.
　また、図４０Ｂに示すように、下型クランパ２０３ｃがリリースフィルムＦを介してワークＷ（基板）及び上型インサート２０２ｂに当接したままコイルばね２０３ｄが押し縮められる。これによりモールド金型２０４内に密閉空間（減圧空間、閉鎖空間）が形成され、樹脂Ｒがキャビティ凹部２０３ｅ（キャビティ）内に充填される。この場合、可動プラテン２０９が平行度を保ったまま上昇することで、固定プラテン２０７に対しても平行度を保ったまま接近することとなる。したがって、上型２０２及び下型２０３の型締めも平行度を保ったままで行うことができる。なお、図４０に示すように樹脂Ｒを下型キャビティ凹部２０３ｅ中央に供給する場合のように下型キャビティ凹部２０３ｅの外側に向けて樹脂Ｒを拡げることでキャビティ凹部２０３ｅ（キャビティ）内に充填されるときには、ボールねじ機構２１０によって型締め速度を適切に制御することもできる。 Further, as shown in FIG. 40B, the coil spring 203d is compressed while the lower clamper 203c is in contact with the work W (substrate) and the upper insert 202b via the release film F. As a result, a sealed space (reduced pressure space, closed space) is formed in the mold die 204, and the resin R is filled in the cavity recess 203e (cavity). In this case, as the movable platen 209 rises while maintaining the parallelism, the movable platen 209 approaches the stationary platen 207 while maintaining the parallelism. Therefore, the clamping of the upper mold 202 and the lower mold 203 can also be performed while maintaining the parallelism. As shown in FIG. 40, the resin R is spread toward the outside of the lower mold cavity recess 203e as in the case of supplying the resin R to the center of the lower mold cavity recess 203e, thereby filling the inside of the cavity recess 203e (cavity). At the same time, the ball screw mechanism 210 can properly control the clamping speed.
　そのまま型締めを続け、４か所ある圧力センサ２２３が各々第１型締め圧力（例えば、合計３６ｔｏｎ；モールド樹脂Ｒの樹脂圧）を検出すると、第１駆動モータ２１２の駆動を停止し第２駆動モータ２１６の駆動を継続する。これにより、ボールねじ機構２１０による可動プラテン２０９の加圧状態をトグルリンク機構２１４が引き継いで、各圧力センサ２２３が第１型締め圧力より高い第２型締め力（例えば、合計１２５ｔｏｎ；最終樹脂圧）を検出するまで加圧する。これにより、図３９Ｂにおいて、可動ナット２１７がねじ軸２１５に沿って更に上動し、可動プラテン２０９の連結部２０９ａを通じて連結するスライドリンク２２１が三角リンク２２０と共に直立した状態となる。なお、第１駆動モータ２１２の駆動を停止せずに、ボールねじ機構２１０とトグルリンク機構２１４との両方により可動プラテン２０９を加圧してもよい。また、ボールねじ機構２１０は駆動しながら加圧しない状態としてもよい。 The clamping is continued as it is, and when the four pressure sensors 223 detect the first clamping pressure (for example, a total of 36 tons; the resin pressure of the mold resin R), the driving of the first drive motor 212 is stopped and the second drive is performed. The driving of the motor 216 is continued. Thereby, the toggle link mechanism 214 takes over the pressurized state of the movable platen 209 by the ball screw mechanism 210, and each pressure sensor 223 has a second mold clamping force higher than the first mold clamping pressure (for example, 125 tons in total; final resin pressure). Pressurize until it detects. As a result, in FIG. 39B, the movable nut 217 further moves upward along the screw shaft 215, and the slide link 221 coupled through the coupling portion 209a of the movable platen 209 is in an upright state with the triangular link 220. The movable platen 209 may be pressurized by both the ball screw mechanism 210 and the toggle link mechanism 214 without stopping the driving of the first drive motor 212. Further, the ball screw mechanism 210 may not be pressurized while being driven.
　このとき、図４０Ｃに示すように、モールド金型２０４は、上型インサート２０２ｂと下型クランパ２０３ｃが当接したまま、可動プラテン２０９に対する加圧が強まるため、下型クランパ２０３ｃのコイルばね２０３ｄが押し縮められてモールド樹脂Ｒが、下型キャビティ凹部２０３ｅ内に充填され最終樹脂圧のまま維持され、モールド樹脂Ｒが加熱硬化される。 At this time, as shown in FIG. 40C, in the molding die 204, the pressure on the movable platen 209 is intensified while the upper mold insert 202b and the lower mold clamper 203c are in contact with each other, so the coil spring 203d of the lower mold clamper 203c is By being compressed, the mold resin R is filled in the lower mold cavity recess 203 e and maintained at the final resin pressure, and the mold resin R is heat-cured.
　上述したように、ボールねじ機構２１０により可動プラテン２０９を通じてモールド金型２０４に供給されたワークＷを第１型締め力でクランプすることで、モールド金型２０４内に密閉空間を形成することができる。このボールねじ機構２１０による加圧状態をトグルリンク機構２１４が引き継いで当該トグルリンク機構２１４により可動プラテン２０９が第１型締め力より大きい第２型締め力までクランプされることで、最終樹脂圧でモールド樹脂Ｒを加熱硬化させる。 As described above, the sealed space can be formed in the mold die 204 by clamping the work W supplied to the mold die 204 through the movable platen 209 by the ball screw mechanism 210 with the first mold clamping force. . The toggle link mechanism 214 takes over the pressurized state by the ball screw mechanism 210, and the movable platen 209 is clamped by the toggle link mechanism 214 to the second mold clamping force which is larger than the first mold clamping force, so that the final resin pressure is achieved. The mold resin R is heated and cured.
　よって、型閉じ動作における可動プラテン２０９の平行度を維持しつつ型閉じを高精度に行いかつ最終樹脂圧を高圧にすることで成形品質を高めることができる。即ち、平行度や型締め速度が特に重要なモールド樹脂Ｒの充填までは、ボールねじ機構２１０により高精度に駆動量を制御しながら型締めしていき、加圧力が特に重要なモールド樹脂Ｒの充填後は、第２駆動モータ２１６による出力を増大させるトグルリンク機構２１４によって型締めし加圧することで、モールド金型２０４の型閉じ前後においてそれぞれ要求される性能を実現することができる。 Therefore, the molding quality can be enhanced by performing mold closing with high accuracy while maintaining the parallelism of the movable platen 209 in the mold closing operation and increasing the final resin pressure. That is, until the filling of the mold resin R where parallelism and mold clamping speed are particularly important, the mold is clamped while controlling the driving amount with high precision by the ball screw mechanism 210, and the pressing force is particularly important for the mold resin R. After filling, by pressing and pressing the mold with the toggle link mechanism 214 that increases the output of the second drive motor 216, it is possible to realize the required performance before and after the mold closing of the mold 204, respectively.
　また、モールド金型２０４を開閉するクランプ機構２０５として、第２駆動モータ２１６による出力を増大させるトグルリンク機構２１４を用いることで、例えば出力を増大させる機構を用いることなく直動機構のみを用いて型開閉動作を行う場合に比べて機構を駆動するサーボモータ（第１駆動モータ２１２，第２駆動モータ２１６）をより出力の小さいものを用いることができ、ねじ軸２１１の直径も細くすることで、装置が小型化し、消費電力も低減することができ、製造コストを減らすことができる。したがって、より安価にワークＷの大判化に対応することができる。 Further, by using the toggle link mechanism 214 for increasing the output by the second drive motor 216 as the clamp mechanism 205 for opening and closing the mold die 204, for example, using only the linear movement mechanism without using the mechanism for increasing the output. The servomotors (the first drive motor 212 and the second drive motor 216) for driving the mechanism can be smaller in output than in the case of performing the mold opening / closing operation, and the diameter of the screw shaft 211 is also reduced. The size of the device can be reduced, the power consumption can be reduced, and the manufacturing cost can be reduced. Therefore, it is possible to cope with the increase in size of the work W more inexpensively.
　図４０Ａ～図４０Ｃでは、モールド金型２０４の上型２０２にワークＷを保持し、下型２０３に形成されるキャビティにモールド樹脂Ｒを供給されていたが、それとは反対の構成であってもよい。 In FIGS. 40A to 40C, the work W is held by the upper mold 202 of the molding die 204, and the mold resin R is supplied to the cavity formed in the lower mold 203, but the configuration may be reversed. Good.
　即ち、図４１Ａにおいて、上型２０２は、上型ベース２０２ａが固定プラテン２０７に支持されている。上型ベース２０２ａのクランプ面には凹部が形成されており、該凹部には上型キャビティ駒２０２ｄが支持されその周囲に上型クランパ２０２ｅがコイルばね２０２ｆにより付勢されて吊り下げ支持されている。上型クランパ２０２ｅは、上型キャビティ駒２０２ｄの下面より下方に突出しており、上型キャビティ凹部２０２ｇが形成されている。この上型キャビティ凹部２０２ｇを覆うようにリリースフィルムＦが吸着保持される。 That is, in FIG. 41A, the upper mold base 202 a of the upper mold 202 is supported by the fixed platen 207. A recess is formed on the clamp surface of the upper mold base 202a, and the upper mold cavity piece 202d is supported in the recess, and the upper mold clamper 202e is biased and supported by a coil spring 202f around it. . The upper mold clamper 202e protrudes downward from the lower surface of the upper mold cavity piece 202d, and an upper mold cavity recess 202g is formed. The release film F is held by suction so as to cover the upper mold cavity recess 202g.
　下型２０３は、下型ベース２０３ａが可動プラテン２０９に支持されている。下型ベース２０３ａには下型インサート２０３ｆが組み付けられている。下型インサート２０３ｆには、ワークＷをクランプ面と面一に吸着保持するワーク保持部２０３ｇが形成されている。 The lower mold base 203 a of the lower mold 203 is supported by the movable platen 209. A lower mold insert 203f is assembled to the lower mold base 203a. The lower mold insert 203f is formed with a work holding portion 203g for attracting and holding the work W flush with the clamp surface.
　図４１Ａに示すように、モールド金型２０４が型開き状態で、ワークＷ（たとえば半導体チップが搭載された基板、半導体ウエハ等）が下型２０３のワーク保持部２０３ｇに供給され、モールド樹脂Ｒ（液状樹脂、顆粒状樹脂、粒体樹脂（パウダー樹脂）、シート樹脂、タブレット樹脂等）が供給される。モールド樹脂Ｒは、予めワークＷ上に供給されてからワーク保持部２０３ｇに供給されてもよい。上型２０２の上型キャビティ凹部２０２ｇはリリースフィルムＦに覆われて吸着保持されている。 As shown in FIG. 41A, with the mold 204 open, a workpiece W (for example, a substrate on which a semiconductor chip is mounted, a semiconductor wafer, etc.) is supplied to the workpiece holding portion 203g of the lower mold 203 and mold resin R ( Liquid resin, granular resin, granular resin (powder resin), sheet resin, tablet resin, etc. are supplied. The mold resin R may be supplied to the workpiece W in advance and then supplied to the workpiece holding unit 203g. The upper mold cavity recess 202 g of the upper mold 202 is covered with the release film F and held by suction.
　ボールねじ機構２１０を駆動して型閉じ動作が開始されると、図４１Ｂに示すように、上型クランパ２０２ｅがリリースフィルムＦを介してワークＷ（基板）及び下型インサート２０３ｆに当接したままコイルばね２０２ｆが押し縮められる。これによりモールド金型２０４内に密閉空間（減圧空間、閉鎖空間）が形成されたままモールド樹脂Ｒが、上型キャビティ凹部２０２ｇ内に充填される。 When the ball screw mechanism 210 is driven to start the mold closing operation, as shown in FIG. 41B, the upper clamper 202e remains in contact with the work W (substrate) and the lower insert 203f via the release film F. The coil spring 202f is compressed. Thereby, the mold resin R is filled in the upper mold cavity recess 202g while the sealed space (reduced pressure space, closed space) is formed in the molding die 204.
　モールド金型２０４が第１型締め力に到達して、ボールねじ機構２１０による加圧からトグルリンク機構２１４の加圧に移行すると、図４１Ｃに示すように、モールド金型２０４は、下型インサート２０３ｆと上型クランパ２０２ｅが当接したまま、可動プラテン２０９に対する加圧が強まるため、上型クランパ２０２ｅのコイルばね２０２ｆが押し縮められた状態となってキャビティ凹部内の樹脂圧が上昇し最終クランプ圧となってモールド樹脂Ｒに所定の樹脂圧が加えられたまま維持され、モールド樹脂Ｒが加熱硬化される。 When the mold die 204 reaches the first mold clamping force and shifts from pressurization by the ball screw mechanism 210 to pressurization of the toggle link mechanism 214, as shown in FIG. 41C, the mold die 204 is inserted into the lower mold insert. The pressure applied to the movable platen 209 is intensified while the upper clamper 202e is in contact with the upper clamper 202e, so that the coil spring 202f of the upper clamper 202e is compressed and the resin pressure in the cavity recess rises and the final clamp As a pressure is applied, a predetermined resin pressure is kept applied to the mold resin R, and the mold resin R is heat-cured.
　上記構成によれば、制御部２２２は、型閉じ動作を開始すると、ボールねじ機構２１０及びトグルリンク機構２１４を同期して駆動させ、ボールねじ機構２１０により可動プラテン２０９を通じてモールド金型２０４に供給されたワークＷを第１型締め力でクランプすることで、モールド金型２０４を型閉じして当該モールド金型２０４内に密閉空間を形成することができる。このボールねじ機構２１０による加圧状態をトグルリンク機構２１４が引き継いで当該トグルリンク機構２１４により可動プラテン２０９が第１型締め力より大きい第２型締め力までクランプされることで、最終樹脂圧でモールド樹脂Ｒを加熱硬化させることができる。 According to the above configuration, when the mold closing operation is started, the control unit 222 synchronously drives the ball screw mechanism 210 and the toggle link mechanism 214 and supplies the mold screw 204 via the movable platen 209 by the ball screw mechanism 210. By clamping the workpiece W with the first mold clamping force, the mold die 204 can be closed and an enclosed space can be formed in the mold die 204. The toggle link mechanism 214 takes over the pressurized state by the ball screw mechanism 210, and the movable platen 209 is clamped by the toggle link mechanism 214 to the second mold clamping force which is larger than the first mold clamping force, so that the final resin pressure is achieved. The mold resin R can be heat-cured.
　よって、上述の型構成と同様に、ワークＷの大型化に対応してモールド金型２０４の平行度や型締め速度を精度よく維持したまま、小型でしかも低コストに型締め可能な樹脂モールド装置２０１を提供することができる。なお、トグルリンク機構２１４に替えて油圧プレス機構を設けてもよい。この場合にも型閉じ動作における可動プラテン２０９の平行度を維持しつつ型閉じを高精度に行いかつ最終樹脂圧を高圧にすることで成形品質を高めることができる。また、トグルリンク機構２１４に替えて他の倍力機構を設けてもよい。 Therefore, as in the case of the above-described mold configuration, a resin mold device that can be compacted at low cost and at low cost while maintaining the parallelism and mold clamping speed of the mold 204 accurately in response to the increase in size of the work W 201 can be provided. A hydraulic press mechanism may be provided instead of the toggle link mechanism 214. Also in this case, the molding quality can be enhanced by performing mold closing with high accuracy while maintaining the parallelism of the movable platen 209 in the mold closing operation and by increasing the final resin pressure. Also, instead of the toggle link mechanism 214, another boosting mechanism may be provided.
　また、上述のようなボールねじ機構２１０により可動プラテン２０９を駆動して型開閉動作を行い型クランプすると共に、上述のトグルリンク機構２１４で図４０に示す下型キャビティ駒２０３ｂのみを加圧及び駆動する構成としてもよい。この場合、下型ベース２０３ａ及び可動プラテン２０９に貫通孔を設けると共に、下型キャビティ駒２０３ｂを加圧する加圧部材をこの貫通孔を貫通させると共に連結部２０９ａに連結することで、下型キャビティ駒２０３ｂを別に駆動させることができる。これによれば、下型キャビティ駒２０３ｂによる樹脂Ｒの加圧力と型クランプ力とを個別に制御することができるため、樹脂圧を任意に上昇させながら型クランプ力を抑えることもでき、装置全体の出力を抑えても樹脂圧を下げることなく成形することもできる。また、必要な加圧力に応じて、ボールねじ機構２１０のみでの駆動と、ボールねじ機構２１０及びトグルリンク機構２１４による駆動とで駆動状態を切り替えることもできる。さらに、下型キャビティ駒２０３ｂを単独で上昇させて下型２０３から突出させることで型クリーニングを容易にすることもできる。 Further, the movable platen 209 is driven by the ball screw mechanism 210 as described above to perform mold opening and closing operation to perform mold clamping, and the toggle link mechanism 214 described above applies pressure and drives only the lower mold cavity piece 203b shown in FIG. It may be configured to In this case, while providing a through hole in lower mold base 203a and movable platen 209, a pressing member for pressing lower mold cavity piece 203b penetrates the through hole and is connected to connecting portion 209a, thereby forming the lower mold cavity piece. 203 b can be driven separately. According to this, since the pressing force of the resin R by the lower die cavity piece 203b and the die clamping force can be individually controlled, the die clamping force can be suppressed while arbitrarily increasing the resin pressure, and the whole apparatus can It is also possible to mold without lowering the resin pressure even if the output of. Also, depending on the required pressure, the drive state can be switched between the drive by the ball screw mechanism 210 alone and the drive by the ball screw mechanism 210 and the toggle link mechanism 214. Furthermore, the lower mold cavity piece 203b may be raised alone and projected from the lower mold 203 to facilitate mold cleaning.
　以上、本発明を実施形態に基づき具体的に説明したが、本発明は前記実施形態に限定されるものではなく、その要旨を逸脱しない範囲で種々変更可能であることはいうまでもない。 As mentioned above, although this invention was concretely demonstrated based on embodiment, this invention is not limited to the said embodiment, It can not be overemphasized that it can change variously in the range which does not deviate from the summary.
　前記第１実施形態では、樹脂Ｒとして顆粒樹脂を用いた場合について説明した。これに限らず、樹脂Ｒとして、フィルム状の樹脂を用いてもよく、また、大きさのことなるフィルム状の樹脂を山状となるように積層させたものを用いてもよい。 In the said 1st Embodiment, the case where granular resin was used as resin R was demonstrated. Not limited to this, as the resin R, a film-like resin may be used, or a film-like resin having different sizes may be laminated so as to form a mountain-like shape.
　具体的には、図２８、図２９に示すようなワークＷおよび樹脂Ｒを用いる成形を採用することができる。これらの図に示すように、ワークＷとしては、基板１０上にチップ部品１１がフリップチップ実装されたものを用いることができる。この場合、樹脂Ｒとしては、中高に形成されたフィルム状の樹脂を用いたり、中高に供給した顆粒樹脂を用いたりすることができる。この場合、上述した実施形態と同様にワークＷ及び樹脂Ｒを供給してからモールドする工程において、型閉じ後に更に型締めする過程で、図２９に示すように、チップ部品１１が溶融した樹脂Ｒに浸漬されるときに、中央側のチップ部品１１から順に樹脂Ｒに浸漬していく。この際に、溶融した樹脂Ｒは基板１０中央から外周側に流されることとなる。したがって、チップ部品１１がフリップチップ実装されたワークＷを封止するときには、チップ部品１１と基板１０との間のアンダーフィルが容易となる。 Specifically, molding using a workpiece W and a resin R as shown in FIGS. 28 and 29 can be employed. As shown in these figures, as the work W, one in which the chip component 11 is flip-chip mounted on the substrate 10 can be used. In this case, as the resin R, it is possible to use a film-like resin formed in a middle-high shape, or a granular resin supplied in a middle-high position. In this case, in the step of supplying the work W and the resin R and then molding as in the above-described embodiment, the resin R in which the chip part 11 is melted as shown in FIG. When it is immersed in, the resin R is dipped sequentially from the chip component 11 on the center side. At this time, the melted resin R flows from the center of the substrate 10 to the outer peripheral side. Therefore, when the chip part 11 seals the work W on which the flip chip mounting is performed, the underfill between the chip part 11 and the substrate 10 becomes easy.
　前記第１実施形態では、樹脂供給部１２０において、複数のトラフ１２３を用いて、同時に同程度の量の樹脂Ｒを樹脂供給領域であるリリースフィルムＦ上に供給（搭載）する場合について説明した。これに限らず、複数のトラフ１２３の代わりに、顆粒樹脂や液状樹脂のような流動性のある樹脂を供給可能な多連ノズルを有するディスペンサを用いてもよい。これによれば、樹脂供給量の増大（樹脂供給領域の大型化）に起因する供給時間の長時間化を防止することができる。また、例えば樹脂供給領域に対して、各ノズルを分布して配置して樹脂供給にムラのないようにすることで、均一に供給することもできる。 In the first embodiment, the case where the resin supply unit 120 simultaneously supplies (mounts) the resin R of the same amount on the release film F which is the resin supply region by using the plurality of troughs 123 has been described. Not limited to this, in place of the plurality of troughs 123, a dispenser having multiple nozzles capable of supplying a flowable resin such as granular resin or liquid resin may be used. According to this, it is possible to prevent an increase in the supply time caused by the increase in the resin supply amount (the enlargement of the resin supply region). In addition, for example, the nozzles can be distributed and arranged in the resin supply region so that the resin supply can be uniformly performed, whereby the resin can be uniformly supplied.
　前記第１実施形態では、型クランプ機構の型開閉に伴って、弾性部材５０を伸縮させて下型クランパ３５に対して下型キャビティ駒３４を相対的に移動させる場合について説明した。これに限らず、型クランプ機構とは別に駆動させる、下型クランパ３５の高さを可変する機構を用いてもよい。 In the first embodiment, the case where the lower mold cavity piece 34 is moved relative to the lower mold clamper 35 by expanding and contracting the elastic member 50 with the mold opening and closing of the mold clamping mechanism has been described. The invention is not limited to this, and a mechanism for varying the height of the lower clamper 35 which is driven separately from the mold clamping mechanism may be used.
　キャビティ高さの可変機構としては、例えば、下型キャビティ駒３４が駆動源と接続されてモールド金型３０の下型ベース４６に移動可能に組み付けられ、下型クランパ３５が下型ベース４６に固定して組み付けられる構成であってもよい。 As a variable mechanism of the cavity height, for example, the lower mold cavity piece 34 is connected to a drive source and movably assembled to the lower mold base 46 of the mold 30 and the lower mold clamper 35 is fixed to the lower mold base 46 It may be configured to be assembled.
　また、キャビティ高さの可変機構としては、下型キャビティ駒３４と下型ベース４６との間に、界面がテーパ面（傾斜面）に形成された板厚調整ブロック（テーパーブロック）を重ね合わせてくさび部を設け、板厚調整ブロックのうちの一方がエアシリンダ、モータなどの駆動源によりスライド可能とした構成であってもよい。 Further, as a variable mechanism of the cavity height, a plate thickness adjustment block (taper block) having an interface formed on a tapered surface (inclined surface) is superimposed between the lower mold cavity piece 34 and the lower mold base 46 A wedge portion may be provided, and one of the plate thickness adjustment blocks may be slidable by a drive source such as an air cylinder or a motor.
　前記第１実施形態では、フィルムローダ５７において保持面６４からのみ吸着部６７と接続してエア吸引する場合について説明した（図３参照）。これに限らず、フィルムローダ５７ａとして、凹部６６内においてエア吸引可能な構成としてもよく、また、凹部６６内にエアを充填して加圧可能な構成としてもよい。具体的には、図３０～図３２に示すようなフィルムローダ５７ａを用いることができる。なお、図３０～図３２において、上型３１（図３参照）は省略している。 In the first embodiment, the case where the film loader 57 is connected to the suction unit 67 only from the holding surface 64 to perform air suction has been described (see FIG. 3). Not limited to this, the film loader 57a may be configured to be capable of air suction in the recess 66, or may be configured to be capable of being filled with air and pressurizing it. Specifically, a film loader 57a as shown in FIGS. 30 to 32 can be used. In FIGS. 30 to 32, the upper mold 31 (see FIG. 3) is omitted.
　このフィルムローダ５７ａによれば、図３０に示すように、樹脂Ｒが搭載されたリリースフィルムＦを搬送する際には、図３に示したエア路６５と同様の機能を有するエア路６５ａとは別系統の吸引・加圧部６７ｂと凹部６６とを接続するエア路６５ｂから吸引または加圧を行う。具体的には、樹脂Ｒの重量によるリリースフィルムＦへの加圧と吸着部６７ａによる吸引力（負圧）とを均衡させることで、樹脂Ｒの重量によってリリースフィルムＦの撓みを防止することができる。 According to this film loader 57a, as shown in FIG. 30, when transporting the release film F on which the resin R is mounted, an air channel 65a having the same function as the air channel 65 shown in FIG. Suction or pressurization is performed from an air passage 65 b connecting the suction / pressurization unit 67 b of another system and the recess 66. Specifically, the deflection of the release film F is prevented by the weight of the resin R by equalizing the pressure on the release film F by the weight of the resin R and the suction force (negative pressure) by the adsorbing portion 67a. it can.
　また、このフィルムローダ５７ａによれば、図３１、図３２に示すように、リリースフィルムＦをキャビティ凹部３３に配置するときに、吸引・加圧部６７ｂからエアを供給し凹部６６内にエアを充填して加圧することでリリースフィルムＦのシワを伸ばすこともできる。これによれば、キャビティ凹部３３の角部に対応する箇所からの吸引によってリリースフィルムＦをキャビティ凹部３３の形状に倣わせながら、キャビティ駒３４の端面にリリースフィルムＦのシワを外側に押し出しながら押し潰すこともできるので、シワの発生をより確実に防止することができる。なお、このとき凹部６６内に充填するエアとして加熱エアを用いることができ、型温を下げずにシワの発生を防止することができる。また、リリースフィルムＦも加熱されるため、リリースフィルムＦをキャビティ凹部３３の形状により確実に倣わせることもできる。 Further, according to the film loader 57a, as shown in FIGS. 31 and 32, when the release film F is disposed in the cavity recess 33, air is supplied from the suction / pressurizing portion 67b and air is supplied into the recess 66. It is also possible to stretch the wrinkles of the release film F by filling and pressing. According to this, while making the release film F conform to the shape of the cavity recess 33 by suction from a position corresponding to the corner of the cavity recess 33, the wrinkles of the release film F are pushed while pushing outward on the end face of the cavity piece 34 Since it can also be crushed, the occurrence of wrinkles can be prevented more reliably. At this time, heated air can be used as air to be filled in the concave portion 66, and generation of wrinkles can be prevented without lowering the mold temperature. Further, since the release film F is also heated, the release film F can be made to conform more reliably to the shape of the cavity recess 33.
　なお、前記第１実施形態では、フィルムローダ５７は、樹脂Ｒが搭載されたリリースフィルムＦを下型３２に配置する例について説明したが本発明はこれに限定されず、上型３１に配置することもできる。この場合、樹脂モールド装置１００におけるモールド金型３０は、下型３２と上型３１とを上下反転したような構成とされて、下型（本発明における第一型に相当）とキャビティ凹部が形成される上型（本発明における第二型に相当）とを型閉じして、このキャビティ凹部に充填された樹脂でワークＷを樹脂モールド可能に構成される。この上型は、前記第１実施形態における下型３２と同様に、キャビティ凹部の底部を構成するキャビティ駒と、キャビティ凹部の側部を構成するクランパと、クランパに対してキャビティ駒を相対的に移動させる可動部と、キャビティ駒の端面とクランパの端面とを覆うように配置されたリリースフィルムＦを吸引して吸着する吸着部と、を備える構成を採用することができる。また、フィルムローダは、前記第１実施形態におけるフィルムローダ５７と同様に、リリースフィルムＦをフラットな状態で搬送すると共に、キャビティ駒の端面とクランパの端面とを同等な高さに位置させながらリリースフィルムＦを平坦な状態のままでこのキャビティ駒の端面とこのクランパの端面とに配置する。このような樹脂モールド装置１００によれば、樹脂Ｒと一緒にプレス部１３０に搬入しない場合であっても、シワの発生を防止しながら配置することができる。 In the first embodiment, the film loader 57 has described the example in which the release film F on which the resin R is mounted is disposed on the lower mold 32. However, the present invention is not limited thereto, and is disposed on the upper mold 31. It can also be done. In this case, the mold 30 in the resin molding apparatus 100 is configured such that the lower mold 32 and the upper mold 31 are vertically inverted, and the lower mold (corresponding to the first mold in the present invention) and the cavity recess are formed. The upper mold (corresponding to the second mold in the present invention) is closed and the work W can be resin-molded with the resin filled in the cavity recess. Similar to the lower mold 32 in the first embodiment, this upper mold has a cavity piece constituting the bottom of the cavity recess, a clamper constituting the side portion of the cavity recess, and a cavity piece relative to the clamper. A configuration may be employed that includes a movable portion to be moved, and a suction portion that sucks and sucks the release film F disposed so as to cover the end face of the cavity piece and the end face of the clamper. Further, the film loader conveys the release film F in a flat state as well as the film loader 57 in the first embodiment, and the release film is positioned while the end face of the cavity piece and the end face of the clamper are positioned at the same height. The F is placed flat on the end face of the cavity piece and the end face of the clamper. According to such a resin mold apparatus 100, even when the resin R and the resin R are not carried into the press unit 130, the resin mold apparatus 100 can be disposed while preventing the occurrence of wrinkles.
　また、前記第１実施形態では樹脂供給部１２０において顆粒状の樹脂ＲをリリースフィルムＦに供給する場合について説明した。これに限らず、樹脂供給部１２０は、液状の樹脂Ｒを供給することもできる。この場合、樹脂供給部１２０が液状の樹脂ＲをワークＷ上に供給した後に、ロボット機構部１８０がワークＷごとプレス部１３０に搬入してもよい。また、樹脂供給部１２０は、シート状の樹脂Ｒを供給することもできる。この場合、ロボット機構部１８０は、樹脂供給部１２０によって供給されたシート状の樹脂Ｒを、リリースフィルムＦまたはワークＷと重ね合わせて、もしくは、この樹脂Ｒのみでプレス部１３０に搬入してもよい。 In the first embodiment, the case where the granular resin R is supplied to the release film F in the resin supply unit 120 has been described. Not limited to this, the resin supply unit 120 can also supply a liquid resin R. In this case, after the resin supply unit 120 supplies the liquid resin R onto the workpiece W, the robot mechanism unit 180 may carry the workpiece W into the press unit 130. The resin supply unit 120 can also supply a sheet-like resin R. In this case, even if the robot mechanism unit 180 superposes the sheet-like resin R supplied by the resin supply unit 120 on the release film F or the work W, or carries it into the press unit 130 with only this resin R. Good.
　また、ワークＷとしては、保護する必要のある面があれば、チップ部品１１やバンプ１１Ａが搭載されていないウエハそのもののような板状の部材であってもよい。このような板状の部材の表面は、凹凸形状を有してもよいし平坦な面であってもよい。 The work W may be a plate-like member such as a wafer itself on which the chip parts 11 and the bumps 11A are not mounted as long as there is a surface to be protected. The surface of such a plate-like member may have a concavo-convex shape or may be a flat surface.

Claims (14)

  1. 　上型とキャビティ凹部が形成される下型とを型閉じして、前記キャビティ凹部に充填された樹脂でワークを樹脂モールドする樹脂モールド装置であって、
    　前記下型は、前記キャビティ凹部の底部を構成する下型キャビティ駒と、前記キャビティ凹部の側部を構成する下型クランパと、前記樹脂が搭載されたフィルムを保持して搬送可能なローダと、前記下型キャビティ駒の端面および前記下型クランパの端面を覆うように配置された前記フィルムを吸着する吸着部と、を備え、
    　前記下型キャビティ駒は、前記下型クランパに対して相対的に移動可能に構成され、
    　前記ローダは、前記下型キャビティ駒の端面と前記下型クランパの端面とが水平に保持された前記下型に、前記樹脂が前記下型キャビティ駒上に位置するように前記フィルムを配置し、
    　前記吸着部は、前記キャビティ凹部の内面に追従して前記フィルムを吸着保持し、前記キャビティ凹部に前記樹脂を供給することを特徴とする樹脂モールド装置。     A resin molding apparatus which mold-closes an upper mold and a lower mold in which a cavity recess is formed and resin-molds a work with the resin filled in the cavity recess,
    The lower mold includes a lower mold cavity piece that forms the bottom of the cavity recess, a lower mold clamper that forms the side of the cavity recess, and a loader that can hold and transport a film on which the resin is mounted. And an adsorbing portion for adsorbing the film, which is disposed so as to cover an end face of the lower mold cavity piece and an end face of the lower clamper,
    The lower mold cavity piece is configured to be movable relative to the lower mold clamper,
    The loader arranges the film on the lower mold in which the end face of the lower mold cavity piece and the end face of the lower mold clamper are horizontally held so that the resin is positioned on the lower mold cavity piece.
    The resin mold apparatus, wherein the suction unit adheres and holds the film following the inner surface of the cavity recess, and supplies the resin to the cavity recess.
  2. 　請求項１記載の樹脂モールド装置において、
    　前記ローダは、前記フィルムを保持する保持面と、前記フィルムに搭載された前記樹脂の逃がしとなる、前記保持面から凹んだ凹部と、前記凹部の周囲の前記保持面に通じ、前記フィルムを吸引するエア路とを有するハンド部を備えることを特徴とする樹脂モールド装置。     In the resin mold apparatus according to claim 1,
    The loader communicates with the holding surface for holding the film, the concave portion recessed from the holding surface as a relief of the resin mounted on the film, and the holding surface around the concave portion to suck the film. What is claimed is: 1. A resin mold apparatus comprising: a hand portion having an air passage for
  3. 　請求項２記載の樹脂モールド装置において、
    　前記ローダは、前記保持面を開閉可能なロール状のシャッタ部を備え、前記シャッタ部の閉状態で前記フィルムを前記シャッタ部で支持して搬送し、前記シャッタ部の開状態で前記下型に前記フィルムを配置することを特徴とする樹脂モールド装置。     In the resin mold apparatus according to claim 2,
    The loader includes a roll-shaped shutter portion capable of opening and closing the holding surface, and the film is supported and conveyed by the shutter portion in the closed state of the shutter portion, and the lower mold is opened in the open state of the shutter portion. The resin mold apparatus characterized by arrange | positioning the said film.
  4. 　請求項１～３のいずれか一項に記載の樹脂モールド装置において、
    　前記ローダは、加熱部および冷却部を備えることを特徴とする樹脂モールド装置。     The resin mold apparatus according to any one of claims 1 to 3.
    The resin mold apparatus, wherein the loader includes a heating unit and a cooling unit.
  5. 　請求項１記載の樹脂モールド装置において、
    　前記下型キャビティ駒の上部が分離可能に設けられ、
    　前記下型クランパの上部が分離可能に設けられ、
    　前記下型キャビティ駒の上部と前記下型クランパの上部とが接続部材によって接続され、
    　前記ローダは、前記下型キャビティ駒の上部の端面と前記下型クランパの上部の端面とが水平な状態で、前記下型キャビティ駒の上部の端面および前記下型クランパの上部の端面を覆うように配置された前記フィルムを搬送することを特徴とする樹脂モールド装置。     In the resin mold apparatus according to claim 1,
    The top of the lower mold cavity piece is separably provided,
    The upper portion of the lower clamper is separably provided.
    The upper portion of the lower mold cavity piece and the upper portion of the lower mold clamper are connected by a connecting member,
    The loader is arranged to cover the upper end face of the lower mold cavity piece and the upper end face of the lower mold clamper, with the upper end face of the lower mold cavity piece and the upper end face of the lower mold clamper horizontal. A resin mold apparatus for conveying the film.
  6. 　請求項１記載の樹脂モールド装置において、
    　リング状の上部および下部プレートを備え、
    　前記下部プレートは、周縁部端で前記上部プレート側の面から窪んで周方向に延びる段付き部が形成され、
    　前記上部プレートと前記下部プレートの間に前記フィルムを挟んで、前記下部プレートの段付き部に前記上部プレートの内径部を対応させて前記上部プレートがはめ合わさってフィルムプレート部が構成され、
    　前記下型クランパには周縁部端で端面から窪んで周方向に延びる段付き部が形成され、前記下型クランパの段付き部に前記下部プレートの内径部を対応させて前記フィルムプレート部がはめ合わさることを特徴とする樹脂モールド装置。     In the resin mold apparatus according to claim 1,
    It has ring-shaped upper and lower plates,
    The lower plate is formed with a circumferentially extending stepped portion recessed from a surface on the upper plate side at a peripheral edge end,
    With the film interposed between the upper plate and the lower plate, the inner plate of the upper plate is made to correspond to the stepped portion of the lower plate, and the upper plate is fitted to constitute a film plate portion.
    The lower clamper is provided with a stepped portion which is recessed from the end face at the peripheral edge end and extends in the circumferential direction, and the film plate portion is fitted with the stepped portion of the lower clamper corresponding to the inner diameter of the lower plate. The resin mold apparatus characterized by combining.
  7. 　請求項１記載の樹脂モールド装置において、
    　前記下型キャビティ駒の上部が分離可能に設けられ、
    　型開きした状態で、前記下型キャビティ駒の上部の端面と前記下型クランパの端面とが水平となるように、前記下型キャビティ駒の上部がフローティング支持されていることを特徴とする樹脂モールド装置。     In the resin mold apparatus according to claim 1,
    The top of the lower mold cavity piece is separably provided,
    The upper part of the lower mold cavity piece is supported in a floating manner so that the end face of the upper part of the lower mold cavity piece and the end face of the lower mold clamper are horizontal when the mold is opened.
  8. 　請求項１～７のいずれか一項に記載の樹脂モールド装置において、
    　前記下型クランパには、前記下型クランパの端面から突出可能にフローティング支持された複数のピンを備え、
    　前記複数のピンは、前記下型クランパの端面から突出して前記ワークを支持し、前記ワークをクランプした状態では前記下型クランパの内部に収容されることを特徴とする樹脂モールド装置。     The resin mold apparatus according to any one of claims 1 to 7,
    The lower clamper includes a plurality of pins floatingly supported so as to project from an end face of the lower clamper.
    A resin mold apparatus characterized in that the plurality of pins project from an end face of the lower mold clamper to support the work, and in a state where the work is clamped, the plurality of pins are accommodated inside the lower mold clamper.
  9. 　第一型とキャビティ凹部が形成される第二型とを型閉じして、前記キャビティ凹部に充填された樹脂でワークを樹脂モールドする樹脂モールド装置であって、
    　前記第二型は、前記キャビティ凹部の底部を構成するキャビティ駒と、前記キャビティ凹部の側部を構成するクランパと、当該クランパに対して当該キャビティ駒を相対的に移動させる可動部と、前記キャビティ駒の端面と前記クランパの端面とを覆うように配置されたフィルムを吸着する吸着部と、を備え、
    　前記フィルムをフラットな状態で搬送すると共に、前記キャビティ駒の端面と前記クランパの端面とを同等な高さに位置させながら前記フィルムをフラットな状態のままで前記キャビティ駒の端面と前記クランパの端面とに配置するローダを備えることを特徴とする樹脂モールド装置。     A resin mold apparatus which mold-closes a first mold and a second mold in which a cavity recess is formed, and resin-molds a work with the resin filled in the cavity recess,
    The second mold comprises a cavity piece that constitutes the bottom of the cavity recess, a clamper that constitutes the side of the cavity recess, a movable part that moves the cavity piece relative to the clamper, and the cavity And a suction unit for suctioning the film disposed so as to cover the end face of the piece and the end face of the clamper,
    The film is conveyed in a flat state, and the end face of the cavity piece and the end face of the clamper are positioned at the same height, while the film is kept flat, on the end face of the cavity piece and the end face of the clamper. A resin mold apparatus comprising a loader to be disposed.
  10. 　樹脂モールド装置を用いて、上型とキャビティ凹部が形成される下型とを型閉じして、前記キャビティ凹部に充填された樹脂でワークを樹脂モールドする樹脂モールド方法であって、
    　前記下型は、前記キャビティ凹部の底部を構成する下型キャビティ駒と、前記キャビティ凹部の側部を構成する下型クランパと、前記樹脂が搭載されたフィルムを保持して搬送可能なローダと、前記下型キャビティ駒の端面と前記下型クランパの端面とを覆うように配置された前記フィルムを吸着する吸着部と、を備え、
    （ａ）前記下型キャビティ駒の端面と前記下型クランパの端面とが水平に保持された前記下型に、前記ローダによって前記樹脂が前記下型キャビティ駒上に位置するように前記フィルムを配置する工程と、
    （ｂ）前記吸着部によって前記フィルムを吸引しながら、前記下型クランパに対して前記下型キャビティ駒を相対的に移動して前記キャビティ凹部を形成することで、前記キャビティ凹部の内面に追従させながら前記フィルムを吸着保持すると共に、前記樹脂をそのまま前記キャビティ凹部に供給する工程と、
    を含むことを特徴とする樹脂モールド方法。     A resin molding method using a resin molding apparatus to mold-close an upper mold and a lower mold in which a cavity recess is formed, and resin-molding a work with the resin filled in the cavity recess,
    The lower mold includes a lower mold cavity piece that forms the bottom of the cavity recess, a lower mold clamper that forms the side of the cavity recess, and a loader that can hold and transport a film on which the resin is mounted. And a suction unit for suctioning the film disposed so as to cover the end face of the lower mold cavity piece and the end face of the lower mold clamper,
    (A) The film is disposed on the lower mold in which the end face of the lower mold cavity piece and the end face of the lower mold clamper are horizontally held by the loader so that the resin is positioned on the lower mold cavity piece Process,
    (B) The lower mold cavity piece is moved relative to the lower mold clamper to form the cavity recess while suctioning the film by the suction section, thereby causing the inner surface of the cavity recess to follow. And holding the film by suction while supplying the resin as it is to the cavity recess.
    A resin molding method comprising:
  11. 　モールド金型を開閉するクランプ機構を備えた樹脂モールド装置であって、
    　前記クランプ機構は、
    　前記モールド金型のうち少なくとも一方の金型を支持する可動プラテンと、
    　他方の金型を支持する固定プラテンと、
    　前記可動プラテンに連係し前記固定プラテンとの間で前記モールド金型を第１型締め力まで型閉じする第１型開閉機構と、
    　前記可動プラテンに連係し前記第１の型締め力よりさらにクランプ力を強めた第２型締め力まで型閉じして最終樹脂圧を維持する第２型開閉機構と、
    　前記第１，第２型開閉機構の開閉動作を制御する制御部と、を具備し、
    　前記制御部は、型閉じ動作を開始すると、前記第１，第２型開閉機構を同期して駆動させ、前記第１型開閉機構により前記可動プラテンを通じて前記モールド金型に供給されたワークが第１型締め力でクランプされてから当該第１型開閉機構の加圧状態を前記第２型開閉機構が引き継いで前記可動プラテンを通じて前記ワークが前記第１型締め力より大きい第２型締め力まで前記モールド金型によりクランプされることを特徴とする樹脂モールド装置。     A resin mold apparatus comprising a clamp mechanism for opening and closing a mold, comprising:
    The clamp mechanism
    A movable platen for supporting at least one of the molds;
    A stationary platen supporting the other mold,
    A first mold opening / closing mechanism that cooperates with the movable platen to mold-close the mold to a first clamping force with the fixed platen;
    A second mold opening / closing mechanism which maintains the final resin pressure by closing the mold to a second mold clamping force which is linked to the movable platen and which further strengthens the clamping force from the first mold clamping force;
    A control unit that controls the opening and closing operation of the first and second opening and closing mechanisms;
    When the mold closing operation is started, the control unit synchronously drives the first and second mold opening and closing mechanisms, and the work supplied to the mold die through the movable platen by the first mold opening and closing mechanism is After being clamped by the first mold clamping force, the second mold opening / closing mechanism takes over the pressurized state of the first mold opening / closing mechanism, and the work is to the second mold clamping force greater than the first mold clamping force through the movable platen. A resin mold apparatus characterized in that the resin mold is clamped by the mold.
  12. 　前記第１型開閉機構は、前記可動プラテンの外周縁部に沿って等間隔に配置され、前記第２型開閉機構は前記可動プラテンの中央部に配置されている請求項１１記載の樹脂モールド装置。 12. The resin mold apparatus according to claim 11, wherein the first mold opening and closing mechanism is disposed at equal intervals along the outer peripheral edge of the movable platen, and the second mold opening and closing mechanism is disposed at a central part of the movable platen. .
  13. 　モールド金型の一方の金型を支持する固定プラテンに対し、前記モールド金型の他方の金型を支持する可動プラテンを昇降することで当該モールド金型を開閉可能に構成されたクランプ機構を備えた樹脂モールド装置であって、
    　前記クランプ機構は、
    　前記可動プラテンの中央に連結されるトグルリンク機構と、
    　前記可動プラテンの外周縁部に沿って等間隔に配置されて、当該配置位置において当該可動プラテンに各々連結される３個以上のボールねじ機構と、
    を備えることを特徴とする樹脂モールド装置。     It has a clamp mechanism configured to be able to open and close the mold by moving up and down a movable platen supporting the other mold of the mold with respect to a fixed platen supporting one mold of the mold. A resin mold apparatus,
    The clamp mechanism
    A toggle link mechanism connected to the center of the movable platen;
    Three or more ball screw mechanisms arranged at equal intervals along the outer peripheral edge of the movable platen, and connected to the movable platen at the arrangement position;
    A resin mold apparatus comprising:
  14. 　一方の金型を支持する可動プラテンと他方の金型を支持する固定プラテンを備えたクランプ機構を用いてモールド金型を開閉することにより樹脂モールドする樹脂モールド方法であって、
    　型開きした前記モールド金型にワーク及び樹脂を供給する工程と、
    　前記可動プラテンに連係する第１型開閉機構及び第２型開閉機構の同期をとって作動させ、前記第１型開閉機構により前記ワークが前記モールド金型により第１型締め力でクランプされるまで型閉じする工程と、
    　前記第１型開閉機構の加圧状態を前記第２型開閉機構が引き継いで前記可動プラテンを作動させて前記モールド金型を前記第１型締め力より大きい第２型締め力までクランプする工程と、
    　前記モールド金型を前記第２型締め力でクランプした最終樹脂圧を維持しつつ前記樹脂を加熱硬化させる工程と、
    を含むことを特徴とする樹脂モールド方法。     A resin molding method for resin molding by opening and closing a mold using a clamp mechanism including a movable platen for supporting one mold and a fixed platen for supporting the other mold,
    Supplying a work and a resin to the mold that has been opened;
    The first mold opening and closing mechanism linked to the movable platen and the second mold opening and closing mechanism are operated in synchronization, and the work is clamped by the mold with the first mold clamping force by the first mold opening and closing mechanism. Mold closing step;
    The second mold opening and closing mechanism takes over the pressurized state of the first mold opening and closing mechanism, and operates the movable platen to clamp the mold to a second mold clamping force that is larger than the first mold clamping force; ,
    Heat curing the resin while maintaining a final resin pressure in which the mold is clamped with the second mold clamping force;
    A resin molding method comprising:
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