CN111403303A - Resin sealing device and resin sealing method - Google Patents

Resin sealing device and resin sealing method Download PDF

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Publication number
CN111403303A
CN111403303A CN202010234428.8A CN202010234428A CN111403303A CN 111403303 A CN111403303 A CN 111403303A CN 202010234428 A CN202010234428 A CN 202010234428A CN 111403303 A CN111403303 A CN 111403303A
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CN
China
Prior art keywords
resin
substrate
molding
cavity
mold
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Granted
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CN202010234428.8A
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Chinese (zh)
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CN111403303B (en
Inventor
高濑慎二
田村孝司
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Towa Corp
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Towa Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/3607—Moulds for making articles of definite length, i.e. discrete articles with sealing means or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

Provided are a resin packaging device and a resin packaging method which can simultaneously suppress substrate warpage and perform both-side molding of a substrate. The resin sealing device of the present invention is a resin sealing device for resin sealing both surfaces of a substrate, and is characterized by comprising: contain the 1 st shaping module and the 2 nd shaping module, the 1 st shaping module is the shaping module that compression moulding used, through the 1 st shaping module, will the one side of base plate carries out the resin package back with compression moulding, through the 2 nd shaping module, can be right the resin package is carried out to the another side of base plate.

Description

Resin sealing device and resin sealing method
The present application is a divisional application of chinese patent application entitled "resin encapsulation apparatus and resin encapsulation method" filed on 2016, 28.6. 201680053681.5.
Technical Field
The present invention relates to a resin sealing apparatus and a resin sealing method.
Background
In a resin encapsulation step in a manufacturing process of an electronic component such as a bga (ball grid array) package, generally, only one surface of a substrate is encapsulated with a resin. However, in a resin encapsulation step in a manufacturing step of a boc (board On chip) package or a WBGA (WindowBGA, trade name) package corresponding to dram (dynamic Random Access memory), it is required to encapsulate a part of the position of one surface of a substrate, except for the other surface (for example, refer to reference 1).
Prior art documents:
patent document
Patent document 1: japanese laid-open patent publication No. 2001-53094
Disclosure of Invention
Problems to be solved by the invention
In order to resin-package both surfaces of the substrate, there is a resin packaging method: the substrate is provided with a hole (a hole for flowing a resin from one surface side of the substrate to the other surface side, hereinafter referred to as an "opening") and one surface of the substrate is resin-encapsulated by transfer molding, and the other surface is resin-encapsulated by transferring the resin from the opening to the other surface side.
On the other hand, recently, with the increase in density of portable devices and the like, packages in which chips are mounted on substantially the entire surface of one surface and the other surface (both surfaces) of a substrate have been demanded. In the process of manufacturing the package, it is necessary to resin-encapsulate substantially the entire surfaces of the two surfaces of the substrate.
However, in the manufacture of the package, when both surfaces of the substrate are resin-sealed by the resin sealing method, a cavity (upper cavity or lower cavity) on one side (upper mold or lower mold) may be filled with resin. For example, when a cavity (lower cavity) of the lower mold is filled with resin first, a problem occurs in that the substrate is warped in a convex shape (deformed). This is because, when both surfaces are resin-sealed by transfer molding, the resin is filled into one cavity due to gravity, flow resistance, and the like. In this case, the resin flows from one surface side of the substrate to the other surface side of the substrate through the opening of the substrate. In this case, there is a risk that the substrate may bulge toward the other surface side due to flow resistance when the resin flows from the opening of the substrate. In this case, the resin is filled into the other cavity in a state where the substrate is raised. The resin pressure is applied to the substrate by filling the resin into the cavities on the one side and the other side, but the resin pressure applied to the one side and the other side of the substrate is the same (the cavities on the one side and the other side are connected by the opening of the substrate, and therefore the resin pressure is the same), and a force for returning the substrate from a raised state to a flat state is not generated. Therefore, the resin is cured in a state where the other surface side of the substrate is raised, and the molding is completed in a state where the substrate is raised (deformed state). That is, if one surface and the other surface (both surfaces) of the substrate are resin-sealed simultaneously by the resin sealing method, the substrate may be deformed.
Accordingly, an object of the present invention is to provide a resin sealing apparatus and a resin sealing method capable of achieving both suppression of warpage of a substrate and both-side molding of the substrate.
Means for solving the problems
To achieve the above object, the resin sealing device of the present invention is
A resin encapsulation device for resin-encapsulating both surfaces of a substrate, characterized in that:
comprising a 1 st forming module, an
A 2 nd forming module for forming the composite material,
the 1 st forming module is a forming module for compression forming,
the first molding module 1 resin-encapsulates one surface of the substrate by compression molding, and the second molding module 2 resin-encapsulates the other surface of the substrate.
The resin encapsulation method of the invention is
A resin encapsulation method for resin-encapsulating both surfaces of a substrate, characterized by comprising:
a 1 st resin encapsulation step of resin-encapsulating one surface of the substrate by compression molding, and,
and a 2 nd resin encapsulation step of resin-encapsulating the other surface of the substrate after the 1 st resin encapsulation step.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, it is possible to provide a resin sealing apparatus and a resin sealing method that can achieve both suppression of substrate warpage and double-sided molding of a substrate.
Drawings
Fig. 1(a) is a cross-sectional view showing a resin sealing device of example 1 and a substrate resin-sealed therewith. Fig. 1(b) is a cross-sectional view showing a modification of the base plate ejector pin of fig. 1 (a).
Fig. 2 is a sectional view showing one step of an example of the resin sealing method according to example 1.
Fig. 3 is a sectional view illustrating another step in the same resin sealing method as fig. 2.
Fig. 4 is a sectional view illustrating still another step in the same resin encapsulation method as fig. 2.
Fig. 5 is a sectional view illustrating still another step in the same resin encapsulation method as fig. 2.
Fig. 6 is a sectional view illustrating still another step in the same resin sealing method as fig. 2.
Fig. 7 is a sectional view illustrating still another step in the same resin sealing method as fig. 2.
Fig. 8 is a sectional view illustrating still another step in the same resin sealing method as fig. 2.
Fig. 9(a) to (c) are step sectional views showing modifications of the resin sealing method of example 1.
Fig. 10 is a sectional view of a first molding module of the resin sealing apparatus of example 2 and a substrate resin-sealed therewith shown in fig. 10.
Fig. 11 is a sectional view of a 2 nd molding module of the resin sealing apparatus of example 2 and a substrate resin-sealed therewith shown in fig. 11.
FIG. 12 is a sectional view showing one step of an example of a resin sealing method according to example 2.
Fig. 13 is a sectional view illustrating another step in the same resin sealing method as fig. 12.
Fig. 14 is a sectional view illustrating still another step in the same resin sealing method as fig. 12.
Fig. 15 is a sectional view illustrating still another step in the same resin sealing method as fig. 12.
Fig. 16 is a sectional view illustrating still another step in the same resin sealing method as fig. 12.
Fig. 17 is a sectional view illustrating still another step in the same resin sealing method as fig. 12.
Fig. 18 is a sectional view illustrating still another step in the same resin sealing method as fig. 12.
Fig. 19 is a sectional view of a mold block for compression molding and a substrate reversing mechanism of a resin sealing apparatus according to example 3, and a substrate sealed with resin by the mold block and the substrate reversing mechanism.
FIG. 20 is a sectional view showing one step of an example of the resin sealing method of example 3, in FIGS. 20(a) to (c).
Fig. 21(a) to (b) are sectional views illustrating substrates resin-sealed by the resin sealing apparatus of the present invention.
Detailed Description
Next, the present invention will be described in further detail by way of examples. However, the present invention is not limited to the following description.
In the present invention, "resin package" means a state in which a resin is cured (solidified), but is not limited to this in the case of integral molding of both surfaces described later. That is, in the present invention, in the case of the both-side integral molding described later, the "resin package" means that at least the resin is in a state of being filled in the mold cavity at the time of mold clamping, and the resin may be in a flowing state without being cured (solidified).
As described above, the resin sealing apparatus of the present invention is characterized in that: contain the 1 st shaping module and the 2 nd shaping module, the 1 st shaping module is the shaping module that compression moulding used, through the 1 st shaping module, will the one side of base plate carries out the resin package back with compression moulding, through the 2 nd shaping module, can with the resin package is carried out to the another side of base plate. In the resin sealing apparatus of the present invention, the one surface of the substrate is first sealed with resin by compression molding (resin is first filled into one cavity by compression molding) by the compression molding module. The substrate used in the present invention does not need to be provided with an opening for allowing the resin to flow from one surface side of the substrate to the other surface side. Further, since no opening is provided, the resin does not flow from one surface side of the substrate to the other surface side of the substrate through the opening. Therefore, deformation (warpage) of the substrate caused by flow resistance when the resin passes through the opening of the substrate does not occur. When the other surface is resin-sealed, the one surface is supported by the resin for compression molding, and thus warpage of the substrate can be suppressed even when resin pressure is applied to the substrate from the other surface side. Therefore, the invention can simultaneously restrain the warping of the substrate and form the two surfaces of the substrate.
The conventional method of resin-sealing both surfaces of the substrate by forming an opening in the substrate and performing transfer molding has a problem of cost caused by forming an opening in the substrate. Further, when the resin is transferred from the opening to the other surface side and resin-sealed, the flow distance for completing the resin-sealed entire surface of the other surface is long, and there is a problem that a cavity (air bubble) is generated and a wiring as a component is deformed.
In contrast, according to the present invention, since resin sealing can be performed on both surfaces of the substrate without opening the substrate, cost due to opening the substrate is not incurred, the flow distance for completing resin sealing on both surfaces is also short, and generation of voids (air bubbles) and deformation of the wiring can be suppressed.
In the resin sealing apparatus of the present invention, the upper and lower mold molding modules (1 molding module) may have both the 1 st molding module and the 2 nd molding module. And an upper die and a lower die are arranged in the upper die and the lower die forming module. In this case, the resin sealing apparatus may seal one surface of the substrate with resin by compression molding using one of the upper mold and the lower mold, and then seal the other surface of the substrate with resin using the other mold. Hereinafter, such a resin sealing apparatus is sometimes referred to as "1 st resin sealing apparatus". Accordingly, since both surfaces of the substrate can be integrally molded by using one molding module, the production efficiency is improved, the structure is simplified, and the cost can be reduced.
In the resin sealing apparatus of the present invention, when the upper and lower mold molding modules are included (when both surfaces of the substrate are integrally molded by using one molding module), it is preferable that the upper mold of the upper and lower mold molding modules is a molding die for compression molding and the lower mold of the upper and lower mold molding modules is a molding die for transfer molding. First, the production efficiency is improved, and the structure is simplified, thereby reducing the cost. Next, when the other surface of the substrate is resin-sealed by transfer molding, the terminal provided on the substrate (the other surface) can be easily molded in a state where the terminal is exposed from the sealing resin. The purpose of exposing the terminals is to make electrical connection to the substrate.
In the resin sealing apparatus according to the present invention, the 1 st molding block may be a molding block having a lower mold for compression molding, and the 2 nd molding block may be a molding block having an upper mold for transfer molding. In this case, after the lower surface of the substrate is resin-encapsulated by compression molding by the lower mold of the 1 st molding module, the upper surface of the substrate is resin-encapsulated by transfer molding by the upper mold of the 2 nd molding module. Hereinafter, such a resin sealing apparatus is sometimes referred to as a "2 nd resin sealing apparatus". The 2 nd molding module is a molding module having an upper mold for transfer molding, and when the other surface of the substrate is resin-sealed by transfer molding, it is easy to mold the substrate (the other surface) in a state where the terminals are exposed from the sealing resin. The purpose of exposing the terminals is as described above.
In the resin sealing apparatus of the present invention, the compression molding die block (one molding die block) may have both the 1 st molding die block and the 2 nd molding die block. The compression molding die block is provided with a compression molding die. The resin sealing apparatus may further include a substrate reversing mechanism that reverses the substrate up and down. In this case, one surface of the substrate is resin-sealed by compression molding using the compression molding die of the 1 st molding module, and after the substrate having one surface resin-sealed is vertically inverted by the substrate inverting mechanism, the other surface of the substrate is resin-sealed by the compression molding die. Hereinafter, such a resin sealing apparatus is sometimes referred to as a "3 rd resin sealing apparatus".
In the resin sealing apparatus of the present invention, it is preferable that the 1 st molding module has an upper mold. In this case, the resin sealing apparatus may seal one surface of the substrate with resin by compression molding using the upper mold of the 1 st molding module.
In the resin sealing apparatus according to the present invention, it is preferable that the 2 nd molding module is a molding module for transfer molding. In this case, the resin sealing apparatus may perform resin sealing by transfer molding the other surface of the substrate by the molding module for transfer molding. If the 2 nd molding module is a molding module for transfer molding and the other surface of the substrate is resin-sealed by transfer molding, the molding is facilitated in a state where the terminals provided on the substrate (the other surface) are exposed from the sealing resin. The purpose of exposing the terminals is as described above.
The present invention may further comprise an ejector pin. The ejector pin is provided so as to be able to advance and retreat from a cavity surface of a molding die provided in at least one of the 1 st molding module and the 2 nd molding module, and the ejector pin can be raised or lowered so that its tip protrudes from the cavity surface when the mold is opened and can be raised or lowered so that its tip does not protrude from the cavity surface when the mold is closed. This is preferable because the resin-encapsulated substrate can be easily released from the molding die. The mold provided with the ejector pins may be an upper mold, a lower mold, or both an upper mold and a lower mold, for example.
The resin sealing apparatus of the present invention may further comprise a waste resin separating member for separating a waste resin portion from the substrate having the resin sealing completed, after the resin sealing is performed on one surface and the other surface of the substrate. The unnecessary resin separating member is not particularly limited, and examples thereof include a separating tool used in a known manner such as gate cutting or gating.
The resin sealing apparatus of the present invention may further include a substrate pin which is provided so as to protrude upward outside a cavity (lower cavity) of a lower mold provided in at least one of the 1 st molding block and the 2 nd molding block, and on which the substrate is placed in a state of being released from an upper surface of the lower mold. The term "placing" as used herein also includes "fixing". In this way, when the interior of the mold is depressurized during intermediate mold clamping, the interior of the cavity (lower cavity) of the lower mold can be depressurized because the cavity (lower cavity) of the lower mold does not have the substrate as a cover. This can effectively prevent (reduce) the residual of excess air and the like in the cavity (lower cavity) of the lower mold, and can further suppress warpage of the substrate. When excess air remains in the cavity (lower cavity) of the lower mold, the cavity (lower cavity) of the lower mold contains air and the like in addition to the resin. As a result, the cavity of the lower mold is filled with resin or the like earlier than the upper cavity, and pressure (resin pressure) is applied to the cavity of the lower mold (lower cavity) earlier. Therefore, if excess air or the like remains in the cavity (lower cavity) of the lower mold, warpage of the substrate may occur. By means of the substrate pin, this problem can be prevented.
Further, the substrate pin may be integrated with the lower mold or may be separated from the lower mold.
The substrate pin may include a protruding substrate positioning portion at a tip thereof, for example, by being formed as a stepped pin. The substrate pin can mount the substrate by inserting the substrate positioning portion into a through hole provided in the substrate. Thus, the substrate can be stably fixed at a predetermined position by placing the substrate on the substrate pins. And is therefore preferred.
In the resin sealing apparatus of the present invention, the clearance for the substrate positioning portion may be provided in an upper cavity frame member of the upper mold, which will be described later.
The resin sealing apparatus of the present invention may further include a substrate conveying mechanism and a resin conveying mechanism. The substrate carrying mechanism carries the substrate subjected to resin encapsulation to a designated position of each molding module, and the resin carrying mechanism carries the resin for supplying the substrate onto the substrate. Further, the resin conveying mechanism conveys, for example, a flat plate-like resin to a position of the barrel. The resin sealing apparatus may also be configured such that the substrate transfer mechanism doubles as the resin transfer mechanism.
The resin sealing apparatus may be not limited to the 3 rd resin sealing apparatus, and may further include a substrate reversing mechanism. The substrate reversing mechanism reverses the substrate, which is resin-sealed, vertically as described above.
The resin sealing apparatus of the present invention can be applied, for example, to a compression molding mold, and in order to absorb unevenness in the amount of resin during compression molding, a spring is provided in a block (member) constituting a cavity of the compression molding mold to apply pressure to the resin. Further, a ball screw, a hydraulic cylinder, or the like may be attached to the block (member) constituting the cavity, and pressurization may be performed by linear motion.
In the resin package apparatus of the present invention, when each molding module includes both the upper mold and the lower mold, a release film for facilitating release from a molding die of a molded resin package product may be provided in either one of the molding modules, or may not be provided.
In the resin sealing apparatus of the present invention, voids (bubbles) may be generated in the sealing resin due to, for example, air contained in the cavity, or gas in which moisture contained in the resin is changed into gas by heating. If the voids (air bubbles) are generated, there is a risk that the durability or reliability of the resin-encapsulated product will be reduced. Therefore, in order to reduce the voids (air bubbles) as necessary, a vacuum pump or the like for performing resin sealing molding in a vacuum (reduced pressure) state may be included.
According to the resin sealing apparatus of the present invention, the substrate on which the resin sealing is performed is, for example, a mounting substrate on both surfaces of which chips are mounted. As an example of the mounting substrate, as shown in fig. 21(a), a mounting substrate 11 is provided with a chip 1 and a lead 3 electrically connecting the chip 1 and a substrate 2 on one of its two surfaces, and a flip chip 4 and a ball terminal 5 as an external terminal on the other of its two surfaces.
Here, when molding both surfaces of the substrate 2 having the above-described configuration, the ball terminal 5 needs to be exposed from at least one surface. When the ball terminal 5 is exposed on the compression molding side, the ball terminal 5 is preferably exposed by pressing it against a mold release film. If necessary, the resin package may be subjected to grinding treatment or the like to expose the ball terminals 5 after resin packaging. On the other hand, when the terminals are exposed on the transfer molding side, it is preferable that, for example, as shown in a mounting substrate of fig. 21(b), terminals 6 having a flat exposed surface are provided instead of the spherical terminals 5, and the terminals 6 are exposed by pressing the flat terminals 6 by clamping in advance at a convex portion of a mold provided in a molding module for transfer molding. The mounting board 11 of fig. 21(b) is the same as the mounting board 11 of fig. 21(a) except that the spherical terminals 5 of the mounting board 11 of fig. 21(a) are not provided on the one surface, but the flat terminals 6 are provided on the other surface. This is preferable because the exposure can be ensured.
In the present invention, the substrate to be resin-sealed is not limited to the mounting substrates 11 shown in fig. 21(a) and 21(b), but may be any substrate. As the substrate to be resin-sealed, for example, at least one of the chip 1, the flip chip 4, and the ball terminal 5 (or the flat terminal 6) may be mounted on one surface of the substrate 2 as shown in fig. 21(a) and 21(b), or may be mounted on both surfaces of the substrate 2. For example, the terminal may be omitted if the substrate can be electrically connected (for example, a power supply circuit, a signal circuit, or the like is connected to the substrate). The shapes and sizes of the substrate 2, the chip 1, the flip chip 4, and the ball terminals (or the flat terminals 6) are not particularly limited.
Examples of the substrate to be resin-sealed by the resin sealing device of the present invention include a high-frequency module substrate for a mobile communication terminal. In the substrate for a mobile communication terminal, an opening may be formed in the holder portion in order to seal both surfaces of the substrate with resin, but a resin sealing molding method which does not require the opening to be formed is desired. In addition, when the substrate for the mobile communication terminal is small and components are incorporated in a high density, it may be difficult to perform resin encapsulation molding while leaving the opening. In contrast, the resin sealing apparatus of the present invention can seal both surfaces of the substrate with resin without leaving the opening as described above, and is also applicable to such a small-sized substrate in which components are embedded at high density. The substrate to be resin-sealed by the resin sealing device of the present invention is not particularly limited, and examples thereof include a power control module substrate, a device control substrate, and the like.
In order to supply the substrate to the molding die, a frame member having a through hole may be used. In this case, for example, the substrate is fixed by being attracted to the lower surface of the frame member. Then, the resin is supplied into the through hole of the frame member. The substrate fixed by the frame member may be placed on a substrate pin or the like by, for example, moving the substrate between an upper mold and a lower mold in an open state, and lowering the frame member or raising the lower mold. The frame member may also be withdrawn as desired. The use of the frame member is preferable because resin can be stably arranged in the substrate.
The resin is not particularly limited, and may be a thermosetting resin such as an epoxy resin or a silicone resin, or may be a thermoplastic resin. In addition, the resin composition may be a composite material partially containing a thermosetting resin or a thermoplastic resin. Examples of the form of the supplied resin include a granular resin, a flowable resin, a flaky resin, a tabular resin, and a powdery resin. In the present invention, the flowable resin is not particularly limited as long as it has fluidity, and examples thereof include a liquid resin and a molten resin. In the present invention, the liquid resin is, for example, a resin that is liquid at room temperature or has fluidity. In the present invention, the molten resin is, for example, a resin that is changed to a liquid state or a state having fluidity by melting. The resin may be in another form if it can be supplied to a cavity of a mold, a cylinder, or the like.
In addition, although the term "electronic component" usually refers to a chip before resin encapsulation and a chip after resin encapsulation, in the present invention, when the term "electronic component" is simply used, it refers to an electronic component (electronic component as a finished product) after resin encapsulation of the chip unless otherwise specified. In the present invention, the "chip" refers to a chip before resin encapsulation, and specifically includes chips such as an IC, a semiconductor chip, and a semiconductor element for power control. In the present invention, in order to distinguish a chip before resin encapsulation from a chip after resin encapsulation, it is referred to as a "chip" for convenience. However, the "chip" in the present invention is not particularly limited as long as it is a chip before resin encapsulation, and it is not necessarily in a chip shape.
In the present invention, the term "flip chip" refers to an IC chip having bump-like protruding electrodes called bumps on electrodes (pads) on a surface portion of the IC chip, or a chip form of such a chip. The chip is mounted on a wiring portion of a printed board or the like with the chip facing downward (face down). The flip chip is used, for example, as one of a chip for wire-less bonding and a mounting method.
The resin sealing method of the present invention is a resin sealing method for resin sealing both surfaces of a substrate, and includes: a 1 st resin encapsulation step of resin-encapsulating one surface of the substrate by compression molding, and a 2 nd resin encapsulation step of resin-encapsulating the other surface of the substrate after the 1 st resin encapsulation step. In the resin sealing method of the present invention, one surface of the substrate is first resin-sealed by compression molding, and when the other surface is resin-sealed, the one surface is supported by the resin for compression molding, and resin pressure is applied to the substrate from the other surface side, whereby warpage of the substrate can be suppressed. Therefore, the present invention can achieve both suppression of warpage of the substrate and both-side molding of the substrate.
The resin sealing method of the present invention may use the resin sealing apparatus of the present invention, and the 1 st resin sealing step is performed by the 1 st molding module, and the 2 nd resin sealing step is performed by the 2 nd molding module.
The resin sealing method may use the 1 st resin sealing apparatus of the present invention to perform the 1 st and 2 nd resin sealing steps by the upper and lower mold molding modules (one molding module).
The resin sealing method may use the 2 nd resin sealing apparatus of the present invention, the 1 st resin sealing step is performed by the lower mold of the 1 st molding block, and the 2 nd resin sealing step is performed by the upper mold of the 2 nd molding block.
The resin sealing method may use the 3 rd resin sealing apparatus of the present invention, and includes a substrate inverting step of inverting the substrate having one surface resin-sealed by the substrate inverting mechanism up and down between the 1 st resin sealing step and the 2 nd resin sealing step, and the 1 st resin sealing step and the 2 nd resin sealing step are performed by the compression molding die.
When the resin encapsulating method uses the resin encapsulating apparatus, the 1 st resin encapsulating step may be performed by an upper mold of the 1 st molding module of the resin encapsulating apparatus.
In the resin sealing method, when the resin sealing apparatus of the present invention is used, the 2 nd resin sealing step may be performed by the molding module for transfer molding of the resin sealing apparatus.
In addition, when the resin encapsulation method uses the resin encapsulation device of the present invention, the method may include the steps of: a step of raising or lowering the front end of the ejector pin so as to protrude from the bottom surface of the cavity of the molding die during die opening by the resin sealing apparatus; and a step of raising or lowering the tip of the ejector pin so as not to protrude from the bottom surface of the cavity of the mold during mold clamping by the resin sealing apparatus.
In the resin sealing method, when the resin sealing apparatus of the present invention is used, the method may further include a step of separating the unnecessary resin portion from the resin-sealed substrate by the unnecessary resin separating member after resin-sealing the one surface and the other surface of the substrate by the resin sealing apparatus.
In the resin sealing method, when the resin sealing apparatus of the present invention is used, the method may further include a substrate mounting step of mounting the substrate on the substrate pin in a state where the substrate is separated from the upper surface of the lower mold. Further, in the substrate mounting step, the substrate pin may mount the substrate by inserting the substrate positioning portion into a through hole provided in the substrate.
Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. The drawings are appropriately omitted or exaggerated for convenience of explanation, and are schematically depicted.
[ example 1]
In the present embodiment, an example of the resin sealing apparatus of the present invention will be described first, and then an example of the resin sealing method of the present invention will be described. The substrate used in this embodiment is the same as the substrate 2 in fig. 21 (a).
In the resin encapsulating apparatus of the present embodiment, the upper and lower mold molding modules (one molding module) have both the 1 st molding module and the 2 nd molding module. The upper and lower die forming modules are provided with an upper die and a lower die, the upper die is a forming die for compression forming, and the lower die is a forming die for transfer forming. However, the present invention is not limited thereto. That is, in the present invention, for example, contrary to the embodiment described below, the upper mold is a transfer molding mold and the lower mold is a compression molding mold.
Fig. 1(a) shows a cross-sectional view of the resin sealing apparatus of the present embodiment and a substrate resin-sealed therewith. As shown in fig. 1(a), the upper and lower mold forming modules 10 include an upper mold 200 and a lower mold 300 disposed to face the upper mold. On the mold surface (lower surface) of the upper mold 200, as shown in the drawing, for example, a release film 40 for facilitating the release of the molded resin-encapsulated product from the molding die is fixed by suction.
In the resin sealing apparatus of the present embodiment, the upper mold 200 is a compression molding die (molding block), and is formed of, for example, an upper cavity frame member 210, an upper cavity upper surface member 230, a plurality of elastic members 201, an upper mold base 202, and an upper mold outside air blocking member 203 having O- rings 204A and 204B. The upper mold 200 includes an upper cavity 220 formed by, for example, an upper cavity frame member 210 and an upper cavity upper surface member 230. The upper mold 200 is fixed to, for example, a fixed plate (not shown) of the upper and lower mold molding blocks 10. The upper mold 200 or the upper and lower mold forming modules 10 are provided with, for example, a heating member (not shown) for heating the upper mold 200. By heating the upper mold 200 with the heating member, the resin in the upper cavity 220 is heated and solidified (melted and solidified). The heating member may be provided on one or both of the upper mold 200 and the lower mold 300, and the position thereof is not limited as long as it can heat at least one of the upper mold 200 and the lower mold 300.
The upper cavity frame member 210 and the upper cavity upper surface member 230 are attached to the upper mold base 202 via a plurality of elastic members 201, for example. An upper mold outside air blocking member 203 is provided at an outer peripheral position of the upper mold base 202. The upper mold outside air blocking member 203 is joined to the lower mold outside air blocking member 302 via the O-ring 204B as described later, whereby the inside of the cavity can be blocked from the outside air. On the upper end surface of the upper mold outside air blocking member 203 (the portion sandwiched between the upper mold base 202 and the upper mold outside air blocking member 203), an O-ring 204A for blocking outside air is provided. Further, an O-ring 204B for isolating the outside air is provided on the lower end surface of the upper mold outside air isolation member 203. Further, the upper die base 202 is provided with, for example, a hole (through hole) 205 of the upper die 200 for forcibly sucking air in a space portion in the die and reducing the pressure.
In the resin sealing apparatus of fig. 1(a), the upper cavity frame member 210 and the upper cavity upper surface member 230 are separated from each other, but the resin sealing apparatus of the present embodiment is not limited thereto, and the two members may be integrated with each other.
The lower mold 300 is a mold (molding module) for transfer molding, and is formed of, for example, a lower cavity block 320, a lower mold base 301, and a lower mold outside air isolation member 302 having an O-ring 303. The lower cavity block 320 has a lower cavity 310. The lower mold 300 or the upper and lower mold forming modules 10 are provided with, for example, a heating member (not shown) for heating the lower mold 300. By heating the lower mold 300 with the heating member, the resin in the lower cavity 310 is heated and solidified (melted and solidified). The lower mold 300 is movable up and down by a driving mechanism (not shown) provided in the upper and lower mold forming modules 10. That is, the lower mold 300 can be moved in a direction to approach the (fixed) upper mold 200 and clamped. The lower mold 300 is movable in a direction away from the upper mold 200 to open the mold.
The lower cavity block 320 is mounted on the lower mold base 301, for example. A lower mold outside air blocking member 302 is provided at an outer peripheral position of the lower mold base 301. The lower mold outside air blocking member 302 is disposed directly below the upper mold outside air blocking member 203 and the O- rings 204A and 204B for blocking outside air. An O-ring 303 for isolating the outside air is provided on the lower end surface of the lower mold outside air isolation member 302 (the portion sandwiched between the lower mold base 301 and the lower mold outside air isolation member 302). With the above configuration, when the upper and lower molds are closed, the upper mold outside air blocking member 203 including the O- rings 204A and 204B and the lower mold outside air blocking member including the O-ring 303 are joined to each other via the O-ring 204B, whereby the inside of the cavity can be kept in a state of blocking the outside air.
The lower mold 300 is provided with, for example, a resin passage 304 for supplying a resin material. The lower cavity 310 and the cartridge 305 are connected by the resin passage 304. The plunger 306 disposed inside the cartridge 305 is movable up and down by a plunger driving mechanism (not shown) provided in the upper and lower mold molding modules 10. By supplying (setting) the resin to the cartridge 305 (on the plunger 306) and moving the plunger 306 in a direction approaching the upper die 200, the plunger 306 can inject the resin into the lower cavity 310 via the resin passage 304.
As shown in fig. 1(a), the lower mold 300 may further include substrate pins 330 that protrude upward from the outer side of the lower cavity 310 of the lower mold 300 in a state of being placed on the elastic members 340 provided in the lower cavity block 320.
As shown in fig. 1(a), each substrate pin 330 is provided so as to protrude upward outside the cavity 310 of the lower mold 300, and can mount the substrate 2 in a state of being detached from the upper surface of the lower mold 300. As shown in fig. 1(b), each substrate pin 330 may be, for example, a stepped pin and may include a substrate positioning portion 331 having a protruding shape at its tip. The substrate pin of fig. 1(b) is the same as the substrate pin 330 of fig. 1(a) except that it includes a substrate positioning portion 331. As shown in fig. 1 b, for example, each substrate pin 330 can fix the substrate 2 in a state of being released from the lower cavity block 320 by inserting the substrate positioning portion 331 into a through hole (not shown) provided in the substrate 2.
As shown in fig. 8, a pin 550 may be further provided at the bottom of the lower cavity 310 of the lower mold 300. The number of the stripping rods can be 1 or more. The ejector pins may be raised so that their tips protrude from the bottom surface of the lower cavity 310 of the lower mold 300 during mold opening and lowered so that their tips do not protrude from the bottom surface of the lower cavity 310 of the lower mold 300 during mold closing.
The resin sealing apparatus of the present embodiment may further include an unnecessary resin separating member (not shown). The unnecessary resin separating member may separate an unnecessary resin portion from the substrate having the resin package completed, after resin-packaging one surface and the other surface of the substrate.
Next, a resin sealing method according to the present embodiment will be described with reference to fig. 2 to 8. A resin sealing method using the resin sealing apparatus of the present embodiment will be described below. More specifically, the resin sealing apparatus of fig. 2 to 8 is the same as the resin sealing apparatus of fig. 1 (a). The ejector pins shown in fig. 8 may be used or not. The resin encapsulation method performs the 1 st resin encapsulation step and the 2 nd resin encapsulation step through the upper and lower mold molding modules 10.
In the resin sealing method of the present embodiment, the mold temperature raising step, the mold release film supplying step, the substrate mounting step, and the resin supplying step, which will be described below, are performed before the first resin sealing step 1. Each step is an arbitrary constituent element in the resin sealing method.
First, the mold (the upper mold 200 and the lower mold 300) is heated by a heating member (not shown) to raise the temperature of the mold (the upper mold 200 and the lower mold 300) to a temperature at which the resin can be solidified (melted and solidified) (mold temperature raising step). Next, as shown in fig. 2, the release film 40 is supplied to the upper die 200 (release film supply step). Further, the substrate 2 is placed on the substrate pins 330 in a state of being released from the upper surface of the lower mold 300 (substrate placing step). Here, the substrate 2 can be placed on the substrate pins 330 by inserting the substrate positioning portion 331 into a through hole (not shown) provided in the substrate 2.
Next, as shown in fig. 3, the granular resin 20a is supplied to the upper surface of the substrate 2, and a flat resin (not shown) is supplied (set) to the cylinder (plunger 306) of the lower mold 300 (resin supply step), and further, the flat resin is heated and melted by the cylinder (and the lower mold 300) heated to become a molten resin (flowable resin) 30 a. Further, the resin encapsulating method of the present embodiment is not limited to supplying the granular resin 20a to the upper surface of the substrate 2 after supplying the substrate 2 to the lower mold 300, but for example, the substrate 2 supplied with the granular resin 20a may be supplied to the lower mold 300 after supplying (setting) the granular resin 20a to the upper surface of the substrate 2 in advance.
Next, as shown in fig. 4 to 5, the 1 st resin sealing step is performed, and in the present embodiment, as an example of the method of resin sealing by compression molding by resin sealing one surface of the substrate 2 by compression molding in the 1 st resin sealing step, specifically, an intermediate mold clamping step and an upper cavity resin filling step described below are performed.
First, as shown in fig. 4, the lower mold 300 is raised by a driving mechanism (not shown) to perform intermediate mold clamping (intermediate mold clamping step). In this state, the upper mold outside air blocking member 203 and the lower mold outside air blocking member 302 are joined via the O-ring 204B, and the inside of the mold is blocked from the outside air. Then, the inside of the mold is depressurized by performing suction in the arrow direction X shown in fig. 4 from the hole 205 of the upper mold 200.
Next, as shown in fig. 5, the lower mold 300 is raised by a driving mechanism (not shown) to a position where the resin 20a is filled in the upper cavity 220, and the lower mold 300 is temporarily stopped at this position (upper cavity resin filling step). Then, the granular resin 20a is heated and melted by the heated (temperature-raised) upper mold 200, and becomes a molten resin (flowable resin) 20 b. In addition, even if the substrate 2 is temporarily warped by the resin pressure applied thereto from the upper mold side due to the low viscosity of the molten resin (flowable resin) 20b, and thereafter, if the substrate is warped to such an extent that the warpage of the substrate is reduced and the substrate warp is not problematic by the resin pressure applied thereto from the lower mold side due to the molten resin (flowable resin) 30a being filled into the lower cavity 310, the lower mold 300 can be raised to the position of the upper cavity 220 to which the resin pressure is applied at that point in time.
Next, as shown in fig. 6 to 7, the 2 nd resin sealing step is performed. In the present embodiment, the second surface of the substrate 2 is resin-sealed by transfer molding in the above-described second resin sealing step, and as an example of the method of resin-sealing by transfer molding, specifically, a lower cavity resin filling step, a resin pressing step, and a mold opening step described below are performed.
First, as shown in fig. 6, for example, the plunger 306 is raised by a plunger drive mechanism (not shown) to a position where the fluid resin 30a is filled in the lower cavity 310, and the plunger 306 is temporarily stopped at the position (lower cavity resin filling step).
Next, as shown in fig. 7, for example, the lower mold 300 and the plunger 306 are further raised at approximately the same time, and resin pressure is applied to the upper surface side and the lower surface side of the substrate at approximately the same time by the flowable resin 20b for compression molding (resin pressing step). By doing so, substrate warpage can be suppressed. When resin pressure is applied to upper cavity 220 at the time point shown in fig. 7, only plunger 306 is raised.
Next, as shown in fig. 8, for example, after the molten resin (flowable resin) 20b and the flowable resin 30a are solidified to form the encapsulating resins 20 and 30, the lower mold 300 is lowered by a driving mechanism (not shown) to open the mold (mold opening step).
As described above, in the resin sealing method of the present embodiment, since the one surface of the substrate 2 is resin-sealed by compression molding using the molding module for compression molding, when the other surface is resin-sealed by transfer molding, the one surface is supported by the resin for compression molding, and resin pressure is applied to the substrate 2 from the other surface side, whereby warpage of the substrate 2 can be suppressed. Therefore, the present invention can achieve both suppression of warpage of the substrate 2 and both-side molding of the substrate 2. In addition, since both surfaces of the substrate 2 can be integrally molded by using one molding module, the production efficiency is improved, and the structure is simplified, so that the cost can be reduced. Further, by resin-sealing the other surface by transfer molding, for example, the terminal provided on the substrate (the other surface) can be molded in a state where it is exposed from the sealing resin. This is explained in example 2 (fig. 10 to 18) described later.
In the resin encapsulation method of the present embodiment, as shown in fig. 8, the method may further include the following steps: a rising step in which the tip of the ejector pin 550 rises so as to protrude from the bottom surface of the cavity of the lower mold when opening the mold; and a lowering step in which the tip of the ejector pin 550 is lowered so as not to protrude from the bottom surface of the cavity of the lower mold during mold closing.
In the resin sealing method of the present embodiment, after the substrate (molded substrate) 2 having the resin package completed and the unnecessary resin portion 33 shown in fig. 8 are recovered from the molding die together, the substrate (molded substrate) 2 having the resin package completed and the unnecessary resin portion 33 may be separated by the unnecessary resin separating member (not shown). Further, after separating the substrate (molded substrate) 2 on which the resin package is completed and the unnecessary resin portion 33, the substrate (molded substrate) 2 on which the resin package is completed and the unnecessary resin portion 33 may be recovered together or separately from the upper and lower mold molding modules 10 together.
In the resin sealing method of the present embodiment, as shown in fig. 9(a) to (c), the resin sealing method can be performed using the frame member 32. First, after the mold temperature raising step and the mold release film supplying step shown in fig. 2, as shown in fig. 9(a), in the substrate placing step and the resin supplying step, the substrate 2 is sucked and fixed to the lower surface of the frame member 32 having the inner through-holes 31, the granular resin 20a is supplied to the inner through-holes 31 of the frame member 32, and when the upper mold 200 and the lower mold 300 are opened, the frame member 32, the substrate 2, and the granular resin 20a are inserted between the upper mold and the lower mold. Next, as shown in fig. 9(b), the frame member 32 is lowered or the lower die 300 is raised, so that the substrate 2 on which the frame member 32 and the granular resin 20a are placed is placed on the substrate pins 330. Then, as shown in fig. 9(c), the frame member 32 is retracted. Except for these steps, the steps are the same as the substrate mounting step and the resin supplying step shown in fig. 2 to 3. Thereafter, the steps shown in fig. 4 to 8 may be performed. As shown in fig. 9(a) to 9(c), by using the frame member 32, resin such as the granular resin 20a can be stably supplied onto the substrate 2.
In addition, in this embodiment, one of the two cavities of the forming die is filled first by compression molding. Thus, as described above, both suppression of warpage (deformation) of the substrate and double-sided molding of the substrate can be achieved. This is because the amount of resin supplied to the cavity (resin for compression molding) can be adjusted in compression molding. For example, when the specific gravity of the resin is known in adjusting the volume of the resin, the adjustment can be performed by measuring the weight of the supplied resin. Specifically, for example, the amount of resin for compression molding is set to be substantially the same volume as that of one side (compression molding side) cavity of the substrate in a flat state, and the resin for compression molding is supplied to and filled in the one side cavity. By doing so, it is possible to at least suppress the occurrence of swelling or dishing of the substrate due to an excess or deficiency in the amount of resin. Thereafter, even if the other cavity is filled with resin and resin pressure is applied from the other surface side of the substrate, the resin for compression molding having substantially the same volume as the one cavity is supported from the one surface side of the substrate, and thus the molding can be completed in a flat state of the substrate.
On the other hand, for example, when filling one cavity in advance by transfer molding, the amount of resin supplied to the one cavity changes depending on the vertical position of the plunger. Therefore, there is a risk that swelling or dishing of the substrate occurs due to an excess or an insufficient amount of the resin. Therefore, it is preferable to fill the cavity on one side first by compression molding.
In addition, when filling one cavity first by compression molding, if the resin for compression molding in a molten state has high viscosity, a strong resistance may be applied to the substrate when the resin is filled into the one cavity. In this case, the resin may not be filled into the entire cavity on the one side, and the substrate may be swelled due to the volume of the unfilled portion. Even in such a case, by filling the resin into the other cavity and applying resin pressure to the substrate from the other surface side of the substrate, the swelled substrate can be flattened and the resin can be filled into the entire one cavity.
[ example 2]
Next, in this embodiment, another embodiment of the present invention, that is, another embodiment of the resin sealing apparatus and the resin sealing method of the present invention will be described. The substrate used in this embodiment is almost the same as the substrate 2 shown in fig. 21(b) except that the number of the flat terminals 6 is different and the flat terminals 6 are disposed on the same side as the flip chip 4. The number of flat terminals 6 is 2 in the present example and example 3 (fig. 10 to 20) described later, and 3 in fig. 21(b), but these numbers are merely examples, and the present invention is not limited thereto. The same applies to the chip 1, the lead 3, the flip chip 4, and the ball terminal 5 (example 1 and fig. 21 (a)).
The resin packaging device of this embodiment includes the 1 st shaping module that has the lower mould that compression molding used and has 2 shaping modules of the 2 nd shaping module of last mould that transfer molding used, through the lower mould of the 1 st shaping module, can with the lower surface of base plate carries out resin package with compression molding, through the last mould of the 2 nd shaping module, can right the upper surface of base plate carries out resin package with transfer molding. In addition, the resin encapsulation device of the present embodiment may include a substrate conveyance mechanism, for example.
Fig. 10 is a sectional view showing the 1 st molding module 500 of the resin packaging apparatus of the present embodiment and the substrate 2 resin-packaged therewith. As shown in fig. 10, the 1 st molding module 500 includes a substrate holding member (upper mold) 600 and a lower mold 700 disposed opposite to the substrate holding member (upper mold) 600.
The substrate holding member (upper mold) 600 is formed of, for example, a communication member 610 that communicates with a high-pressure gas source 650 such as a compressor or a compressed gas tank, a cavity upper surface and frame member 620, a convex member 630 for exposing the flat terminals 6 mounted on the substrate 2, a plurality of elastic members 602, and a plate member 640. The cavity upper surface and the frame member 620 have a cavity 601. The communicating member 610, the cavity upper surface, and the frame member 620 are attached to the plate member 640 in a state of hanging down via the plurality of elastic members 602. The communicating member 610 is provided with an air passage (air passage) 603 for feeding compressed air to the cavity 601 by a high-pressure gas source 650. The cavity upper surface and frame member 620 is configured such that an upper cavity upper surface member having the cavity 601 is integrated with a frame member surrounding the upper cavity upper surface member. An air passage 603 of the communicating member 610 and a plurality of air holes 604 for communicating with the cavity 601 are provided on the upper surface of the cavity 601.
In the present embodiment, the convex member 630 is preferably provided with a portion that can press the substrate 2 so that the substrate 2 is not warped by resin encapsulation by the 1 st molding module 500, for example, so that the upper surface of the flat terminal 6 is pressed.
The lower mold 700 is a compression molding die, and is formed of, for example, a lower cavity lower surface member 710, a lower cavity frame member 720, an elastic member 702, and a lower mold base 730. The lower mold 700 has a lower cavity 701 formed by a lower cavity lower surface member 710 and a lower cavity frame member 720. The lower cavity lower surface member 710 is mounted on the lower mold base 730, for example. The lower cavity lower surface member 710 may be attached to the lower mold base 730 with the elastic member 702 placed thereon, for example. The lower cavity frame member 720 is disposed so as to surround the lower cavity lower surface member 710, for example, in a state of being placed on the lower mold base 730 via the plurality of elastic members 702. In addition, a sliding hole 711 is formed by a gap between the lower cavity lower surface member 710 and the lower cavity frame member 720. As described later, the slide hole 711 allows suction, for example, to suck a release film. The lower mold 700 is provided with, for example, a heating member (not shown) for heating the lower mold 700. By heating the lower mold 700 with the heating member, the resin in the lower cavity 701 is heated and solidified (melted and solidified). The lower mold 700 can be moved up and down by a driving mechanism (not shown) provided in the 1 st molding module 500, for example. The lower mold external air blocking member of the lower mold 700 is not shown or described in detail for simplification.
Fig. 11 is a sectional view showing a 2 nd molding module 800 of the resin encapsulating apparatus of the present embodiment and a substrate 2 resin-encapsulated therewith. As shown in fig. 11, the 2 nd molding module 800 includes an upper mold 900 and a substrate holding member (lower mold) 1000 disposed opposite to the upper mold.
The upper mold 900 is a transfer molding mold, and is formed of, for example, an upper cavity upper surface member 910, an upper cavity frame member 920 as a frame member surrounding the upper cavity upper surface member 910, a convex member 930 for exposing the flat terminals 6 mounted on the substrate 2, a plurality of elastic members 902, and an upper mold base 940. The upper die 900 has an upper cavity 901 formed by an upper cavity upper surface member 910. Upper cavity upper surface member 910 is attached to upper mold base 940 via elastic member 902, and upper cavity frame member 920 is attached to upper mold base 940 in a suspended state. The upper mold external air insulating member of the upper mold 900 is not illustrated or described in detail for simplification.
The upper die 900 is provided with a resin passage 950 for supplying a resin material, for example. The upper cavity 901 is connected to the barrel 960 through a resin passage 950. The plunger 970 disposed inside the cartridge 960 is movable up and down by a plunger driving mechanism (not shown) provided in the 2 nd molding module 800, for example.
The substrate holding member (lower mold) 1000 is a plate for placing the substrate 2 whose one surface is resin-encapsulated by the first molding module 500 1, and is formed of, for example, a cavity lower surface member 1010, a cavity frame member 1020, a plurality of elastic members 1030, and a base member 1040. The substrate holding member (lower mold) 1000 has a cavity 1001 formed by, for example, a cavity lower surface member 1010 and a cavity frame member 1020. The cavity lower surface member 1010 and the cavity frame member 1020 are mounted on a base member 1040 via a plurality of elastic members 1030. The substrate 2 is placed on the substrate holding member (lower mold) 1000 so that the resin sealing region is accommodated in the cavity 1001. The 2 nd molding module 800 is provided with, for example, a heating member (not shown) for heating the cartridge 960. By heating the barrel 960 with the heating member (not shown), the resin supplied (provided) to the barrel 960 is heated and solidified (melted and solidified). The substrate holding member (lower mold) 1000 is movable up and down by a substrate holding member driving mechanism (not shown) provided in the 2 nd molding module 800, for example.
In this embodiment, the 1 st molding module 500 may be configured to fill the cavity 601 with a gel-like solid instead of supplying compressed air to the cavity 601. By pressing the substrate 2 with the gel-like solid, warpage of the substrate 2 can be suppressed.
Next, a resin sealing method according to the present embodiment will be described with reference to fig. 12 to 18. Hereinafter, a resin sealing method using the resin sealing apparatus of the present embodiment will be described, but the resin sealing method of the present embodiment is not limited to the use of the resin sealing apparatus.
In the resin sealing method of the present embodiment, the substrate supply step and the resin supply step described below are performed before the 1 st resin sealing step. Each step is an arbitrary constituent element in the resin sealing method.
First, as shown in fig. 12, the substrate 2 is supplied to the substrate holding member (upper mold) 600 of the 1 st molding module 500 by the substrate transfer mechanism 1100, and the substrate 2 is fixed by the substrate holder and the suction hole (not shown) (substrate supply step). After the substrate supply step, the substrate transport mechanism 1100 is retracted.
Next, a resin transfer mechanism (not shown) is inserted between the substrate holding member (upper mold) 600 and the lower mold 700. As shown in fig. 13, the release film 130, the resin frame member 140 placed on the release film 130, and the granular resin 150A supplied to the inner through-hole 140A of the resin frame member 140 are conveyed to the lower mold 700 by the resin conveying mechanism. Then, the release film 130 is sucked by suction in the arrow direction Y shown in fig. 13 from the slide hole 711 in the gap between the lower cavity lower surface member 710 and the lower cavity frame member 720, and the release film 130 and the particulate resin 150a are supplied to the lower cavity 701 (resin supply step). Thereafter, the resin conveying mechanism and the resin frame member 140 are retracted.
Next, as shown in fig. 14 to 15, the 1 st resin sealing step of the present example was performed. In this embodiment, in the 1 st resin encapsulation step, the 1 st molding module 500 having a lower mold is used to encapsulate one surface of the substrate with resin by compression molding.
Specifically, as shown in fig. 14, the pellet resin 150a is heated and melted by the lower mold 700 heated by a heating member (not shown) to become a molten resin (flowable resin) 150 b. Subsequently, as shown in fig. 14, the lower mold 700 is raised by a driving mechanism (not shown), and the chip 1 and the lead 3 mounted on the lower surface of the substrate 2 are immersed in the molten resin (flowable resin) 150b filled in the lower cavity 701. At the same time, or at a later timing, the high-pressure gas source 650 supplies air having the same pressure as the molding pressure to the substrate holding member (upper mold) 600 in the direction of the arrow in fig. 14. This allows resin sealing of one surface (lower surface) of the substrate 2 while suppressing warpage of the substrate.
Next, as shown in fig. 15, after the molten resin (flowable resin) 150b is solidified to form the encapsulating resin 150, the lower mold 700 is lowered by a driving mechanism (not shown) to open the mold (mold opening step). When the mold is opened, for example, as shown in fig. 15, the suction through the slide hole 711 can be released. After the mold is opened, the substrate 2 having one surface (lower surface) molded is transferred to the 2 nd molding module 800 by the substrate transfer mechanism 1100 (2 nd module transfer step).
Next, as shown in fig. 16, the substrate 2 is conveyed to the substrate holding member (lower mold) 1000 of the 2 nd molding module 800 by the substrate conveying mechanism 1100 shown in fig. 15. Thereafter, the flat resin is supplied to the cylinder 960 by a resin conveying mechanism (not shown), and further, the flat resin is heated and melted by a cylinder (lower mold) heated by a heating member (not shown) to become a molten resin (flowable resin) 971a (resin supplying step). The supply of the flat resin may be performed by the substrate transfer mechanism 1100. As shown in example 3 described later, the substrate 2 may be turned upside down by a substrate reversing mechanism (not shown). In this case, the cavity is upside down.
Subsequently, as shown in fig. 17, the upper mold 700 and the substrate holding member (lower mold) 1000 are clamped. At this time, as shown in fig. 17, the lower surface of the convex member 930 provided on the upper cavity surface of the upper mold 900 is brought into contact with and pressed against the upper surface of the flat terminal 6 provided on the upper surface of the substrate 2.
Further, as shown in fig. 17 to 18, the 2 nd resin encapsulation step of the present embodiment is performed. In this embodiment, the second molding module 2 performs resin encapsulation on the other surface (upper surface) of the substrate 2 by transfer molding. Specifically, as shown in fig. 17, the substrate holding member (lower mold) 1000 is raised by a substrate holding member driving mechanism (not shown) to clamp the substrate 2. Then, as shown in fig. 18, the plunger 970 is raised by a plunger drive mechanism (not shown) to fill the upper cavity 901 with a molten resin (flowable resin) 971a, and the flowable resin 971a is further cured to form an encapsulating resin 971 as shown in fig. 18. In this manner, the upper surface of the substrate 2 is resin-sealed with the sealing resin 971 and molded. At this time, as described above, the upper surface of the flat terminal 6 is pressed by being in contact with the lower surface of the convex member 930, and therefore is not immersed in the molten resin 971 a. Therefore, the resin sealing can be performed in a state where the upper surface of the flat terminal 6 is exposed from the sealing resin 971.
As described above, in the resin sealing method of the present embodiment, the resin sealing is performed by compression molding on one surface of the substrate by the molding module for compression molding, and when the resin sealing is performed by transfer molding on the other surface, the resin sealing is supported by the resin for compression molding on one surface, so that the warpage of the substrate can be suppressed even if the resin pressure is applied to the substrate from the other surface side. Therefore, the present embodiment can achieve both suppression of substrate warpage and double-sided molding of the substrate. In the present embodiment, the other surface is resin-encapsulated by transfer molding, and therefore, molding is facilitated in a state where the terminals provided on the substrate (the other surface) are exposed from the encapsulating resin.
[ example 3]
Next, in this embodiment, another example of the resin sealing apparatus and the resin sealing method of the present invention will be described. The substrate used in this embodiment is the same as the substrate 2 shown in fig. 21 (a).
In the resin sealing apparatus of the present embodiment, the compression molding die block (1 molding die block) has both the 1 st molding die block and the 2 nd molding die block. The compression molding die block is provided with a compression molding die. The resin sealing device further includes a substrate reversing mechanism for reversing the substrate vertically.
Fig. 19 shows a cross-sectional view of the resin packaging device of the present embodiment and a substrate resin-packaged therewith. As shown in fig. 19, the compression molding die block 500A includes a substrate holding member (upper die) 600B and a lower die 700 disposed opposite to the substrate holding member (upper die) 600B. The substrate holding member (upper mold) 600B is the same as the substrate holding member (upper mold) 600 shown in fig. 15 except that the convex member 630 is not included, and the lower mold 700 is the same as the lower mold 700 shown in fig. 15. However, in the present embodiment, the height of the cavity 601 is the same as or slightly higher than the height of the sealing resin of the substrate to be molded, which is supposed in consideration of, for example, actual processing (molding die and resin sealing) and the height of each sealing resin for completing the resin sealing. By doing so, the encapsulating resin can be reliably accommodated in the cavity 601.
Next, the resin sealing method of the present example will be described with reference to fig. 20(a) to (c). Further, a resin sealing method using the resin sealing apparatus shown in fig. 19 is explained below, but the resin sealing method of the present embodiment is not limited to the method using the resin sealing apparatus.
First, the substrate supply step is performed in the same manner as the substrate supply step of example 2, except that a mold module 500A for compression molding is used instead of the 1 st molding module 500 of example 2, the substrate 2 is supplied to a substrate holding member (upper mold) 600B instead of the substrate holding member (upper mold) 600 of the 1 st molding module 500, and the substrate 2 identical to fig. 20(a) (i.e., having the spherical terminals 5 instead of the flat terminals 6) is used instead of the substrate 2 of example 2. Next, the resin supplying step was performed in the same manner as the resin supplying step of example 2.
Then, the 1 st resin sealing step (not shown) is performed in the same manner as the 1 st resin sealing step of example 2.
Next, the mold opening step was performed in the same manner as the mold opening step described in example 2.
Subsequently, as shown in fig. 20A, the substrate 2 having one surface encapsulated with resin is ejected from the compression molding die block 500A by the substrate reversing mechanism 1100A (ejection step). The substrate reversing mechanism may also be a substrate conveying mechanism similar to the substrate conveying mechanism 1100 in embodiment 2.
Next, as shown in fig. 20(b), the substrate reversing mechanism 1100A is rotated 180 degrees together with the substrate 2 fixed to the substrate reversing mechanism 1100A (substrate reversing step). Then, the substrate reversing mechanism 1100A is advanced into the compression molding die block 500A (advancing step). Subsequently, as shown in fig. 20 c, the substrate 2 fixed to the substrate reversing mechanism 1100A is fixed to the substrate holding member (upper mold) 600B through the substrate holder and the suction hole (not shown). In the present embodiment, the step of exiting and the step of entering are arbitrary components, and for example, even if the substrate 2 is not exited, the substrate may be inverted and not exited. In the substrate reversing step, the substrate is reversed by rotating the substrate 180 degrees in the direction of the arrow in fig. 20 (b). However, the substrate inverting step is not limited thereto, and may be performed by rotating the substrate in any direction different from the arrow in fig. 20(b), for example, as long as the substrate can be inverted.
Next, the resin supplying step was performed in the same manner as the resin supplying step of example 2. In the resin supply step, for example, the release film used in the 1 st resin sealing step (used release film) may be recovered first, and a new release film may be used in the resin supply step.
Then, a 2 nd resin sealing step (not shown) is performed in the same manner as the 1 st resin sealing step of example 2, except that the other surface is resin-sealed instead of the one surface. In the 2 nd resin sealing step, the surface on which the resin sealing is completed may be pressed with compressed air or may not be pressed.
In this way, in the resin sealing method of the present embodiment, since the one surface of the substrate is resin-sealed by compression molding first by the compression molding die block, when the other surface is resin-sealed, the one surface is supported by the resin for compression molding, and thus warpage of the substrate can be suppressed even if resin pressure is applied to the substrate from the other surface side.
The present invention is not limited to the above-described embodiments, and can be modified and selectively employed in arbitrary and appropriate combinations as necessary without departing from the spirit of the present invention.
Description of the reference numerals
1 chip
2 base plate
3 conducting wire
4 flip chip
5 ball terminal
6 Flat terminal
10 upper and lower die forming module
11 mounting substrate
20a, 150a particulate resin
20b, 30a, 150b, 971a molten resin (flowable resin)
20. 30, 150, 971 encapsulating resin
31. 140A inner through hole
32 frame component
33 resin unnecessary part
40. 130 mold release film
140 resin frame member
200. 900 upper die
201. 340, 602, 702, 902, 1030 elastic parts 202, 940 upper die base
203 upper die external air isolation component
204A, 204B, 303O-ring
205 holes in the upper mould
210. 920 Upper cavity frame part
220. 901 upper cavity
230. 910 Upper surface part of upper cavity
300. 700 lower die
301. 730 lower die base
302 lower die external air isolation component
304. 950 resin passage
305. 960 Cartridge
306. 970 plunger piston
310. 701 lower cavity
320 lower cavity block
330 substrate pin
331 substrate positioning part
500 st forming module
500A compression molding die block
550 ejector pin
600. 600B substrate holding member (Upper mold)
601. 1001 die cavity
603 air passage
604 air holes
610 communication part
620 mold cavity upper surface and frame member
630. 930 convex part
640 plate parts
650 high-pressure gas source
710 lower cavity lower surface part
711 sliding hole
720 lower cavity frame part
800 nd 2 forming module
1000 substrate holding Member (lower die)
1010 die cavity lower surface part
1020 die cavity frame part
1040 base part
1100 base plate conveying mechanism
1100A base plate reversal mechanism
X, Y arrow head

Claims (10)

1. A resin package device for resin-packaging both surfaces of a substrate, characterized in that:
comprising a 1 st forming module and
a 2 nd forming module for forming the composite material,
the 1 st molding block is a molding block having a lower mold for compression molding,
the 2 nd forming module is a forming module provided with an upper die for transfer forming,
through the 1 st forming module the lower mould will the lower surface of base plate carries out resin package with compression moulding after, through the 2 nd forming module the last mould, can be right the upper surface of base plate carries out resin package with transfer molding.
2. The resin package device according to claim 1, wherein the substrate is a mounting substrate having chips mounted on both surfaces thereof.
3. The resin-encapsulated device according to claim 1 or 2, further containing ejector pins,
the ejector pin is provided so as to be able to enter and exit from a cavity surface of a molding die provided in at least one of the 1 st molding module and the 2 nd molding module,
as far as the ejector pin is concerned,
when the mold is opened, the front end of the mold can be raised or lowered in a manner of protruding from the cavity surface,
when the mold is closed, the tip end of the mold can be raised or lowered so as not to protrude from the cavity surface.
4. The resin sealing apparatus according to claim 1 or 2, further comprising a useless resin separating part,
the unnecessary resin separating member may be configured to separate an unnecessary resin portion from the substrate having been resin-sealed, after resin-sealing the one surface and the other surface of the substrate.
5. The resin sealing device according to claim 1 or 2, further containing a substrate pin,
the substrate pin is provided so as to protrude upward outside a cavity of a lower mold provided in at least one of the 1 st molding module and the 2 nd molding module,
the substrate pin may mount the substrate in a state of being separated from the upper surface of the lower mold.
6. The resin package device according to claim 5, wherein
The substrate pin includes a protruding substrate positioning portion at a front end thereof,
the substrate positioning portion is inserted into a through hole provided in the substrate, and the substrate pin can mount the substrate thereon.
7. A resin package device for resin-packaging a double-sided mounting substrate, characterized in that:
comprises a compression molding die having an upper die and a lower die,
the upper mold forms a space in which the upper surface of the double-sided mounting substrate is exposed during compression molding as a space for supplying gas from a high-pressure gas source,
the lower die comprises a die cavity lower surface component and a die cavity frame component.
8. A resin sealing method for resin-sealing both surfaces of a substrate, comprising:
a 1 st resin encapsulation step of resin-encapsulating the lower surface of the substrate by compression molding, and,
and a 2 nd resin encapsulation step of performing resin encapsulation on the upper surface of the substrate by transfer molding after the 1 st resin encapsulation step.
9. The resin sealing method according to claim 8, wherein
Use of the resin package device according to any one of claims 1 to 6,
performing the 1 st resin encapsulation step by the 1 st molding block,
performing the 2 nd resin encapsulation step by the 2 nd molding module.
10. A resin sealing method for resin-sealing a double-sided mounting substrate, characterized in that:
the double-sided mounting board is sandwiched between an upper die and a lower die of a compression molding die, and the upper surface of the double-sided mounting board is exposed, and compression resin molding is performed using a resin supplied into a cavity formed by a cavity lower surface member of the lower die and a cavity frame member while supplying a gas from a high-pressure gas source into a space formed by the upper die.
CN202010234428.8A 2015-11-09 2016-06-28 Resin packaging device and resin packaging method Active CN111403303B (en)

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CN201680053681.5A CN108025466B (en) 2015-11-09 2016-06-28 Resin sealing device and resin sealing method
CN202010234428.8A CN111403303B (en) 2015-11-09 2016-06-28 Resin packaging device and resin packaging method
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TW201722681A (en) 2017-07-01
TWI617419B (en) 2018-03-11
CN108025466A (en) 2018-05-11
KR102228644B1 (en) 2021-03-15
KR20200098738A (en) 2020-08-20
JP2017087551A (en) 2017-05-25
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KR102192732B1 (en) 2020-12-17
CN111403303B (en) 2023-09-01

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