CN103295975A - Resin seal material and manufacture method thereof - Google Patents
Resin seal material and manufacture method thereof Download PDFInfo
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- CN103295975A CN103295975A CN2013100565248A CN201310056524A CN103295975A CN 103295975 A CN103295975 A CN 103295975A CN 2013100565248 A CN2013100565248 A CN 2013100565248A CN 201310056524 A CN201310056524 A CN 201310056524A CN 103295975 A CN103295975 A CN 103295975A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B7/00—Mixing; Kneading
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B9/00—Making granules
- B29B9/12—Making granules characterised by structure or composition
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Abstract
A resin seal material and a manufacture method thereof are disclosed. The resin seal material is used as a raw material for a seal resin when a chip is subjected to resin seal operation by a compression molding die which is arranged in a resin seal device and provided with a cavity, and the resin seal material is powdery or granule in shape. In a condition that a first standard is set for the target value t(mm) of seal resin thickness, the grain diameter D satisfies a second standard which specifies D<=3*t(mm). The resin seal material comprises a material which is within the first standard and is judged to satisfy the second standard according to a sorting result obtained from the time when the material is supplied to the resin seal device to the time when the material is supplied to the cavity. The first standard specifies 0.03(mm)<=t<=1.0(mm).
Description
Technical field
The present invention relates to use that shaping mould that compression forming uses carries out using when resin-sealed to the electronic unit of shaped like chips, be powdery or granular resin-sealed with material and manufacture method thereof.
Background technology
To IC(Integrated Circuit) chip, LED(Light Emitting Diode) chip shape electronic component such as chip, chip capacitor is (hereinafter referred to as " chip ".) carry out in the resin-sealed operation, thereby by being solidified, liquid resin forms the sealing resin that cured resin constitutes.Accordingly, be installed on lead frame, printed base plate etc. (hereinafter referred to as " base main body ".) chip by resin-sealed.As resin-sealed method, use compression forming (for example, with reference to patent documentation 1) on the basis of transfer molding in recent years.Compare with transfer molding, compression forming has that the lead-in wire applied pressure that liquid resin butt joint share is little, the advantage of slimming that can corresponding sealing resin etc.In compression forming, as the raw material of liquid resin, use powdery that thermosetting resin constitutes or granular resin-sealed with material or be aqueous resin-sealed usefulness material (aqueous resin) at normal temperatures.
The present invention is object with the powdery that uses thermosetting resin and constitute or granular resin-sealed situation with material.The die cavity of the shaping mould that resin sealing apparatus is had is supplied with the resin-sealed material of use, and is resin-sealed with material and make its fusion by being arranged on heater heating in the shaping mould, generates the molten resin (hereinafter referred to as " liquid resin ") with flowability.Heat liquid resin and it is solidified by continuation, thereby in die cavity, form the sealing resin that cured resin constitutes.
Yet in this technical field, following demand is more and more stronger in recent years.First demand is to finish the electronic unit of product (hereinafter referred to as " electronic device " for conduct.) the demand of so-called compactization.Thereupon, the demand of the slimming of the pathization of lead-in wire and sealing resin is stronger.Second demand is to be accompanied by extensive employing LED and the demand that produces, and be particularly as follows.That is, among electronic device, be in the luminescent device of representative with LED, use the sealing resin with light transmission, but can damage optical characteristics during entrapped air pockets (space) in this sealing resin.Second demand is to require not exist in the sealing resin in luminescent device bubble.
Patent documentation 1: the spy opens 2007-125783 communique (the 5th～9 page, the 1st figure)
As the raw-material powdery of sealing resin or the granular resin-sealed material of using, migrating usually is used raw material as the resin-sealed resin sheet with material of transfer molding.Thereby resin sheet by as raw-material powdery or granular resin-sealed be cylindric formation with material by briquetting.In transfer molding, thereby be heated and fusion generation molten resin by the resin sheet that supplies in the columnar space that is called as pot.The molten resin that generates is pressed by plunger and is injected die cavity.Thereby inject the molten resin of die cavity by being heated curing.By operation so far, form the sealing resin that cured resin constitutes.
In transfer molding, thereby in pot, be heated the generation molten resin by columned resin sheet.Therefore, for as the raw-material powdery of resin sheet or the granular resin-sealed material of using, do not require the deviation of particle diameter (particle footpath) little so.Thus, the powdery that uses in compression forming as the raw material of resin sheet or granular resin-sealed particle diameter with material have as a rule than large deviation.In addition, in present specification, " powdery or granular " this term comprises uncertain shape (for example, the shape of distortion, irregular shape, have concavo-convex shape) of the shape of micro mist shape, graininess, granular, corynebacterium, bulk, platelet-like, similar ball etc.After, as suitable this term of granular resin feeding that uses of general name of " powdery or the granular resin-sealed material of using ".
Yet the inventor of the invention that the application is related waits the following situation of finding.First discovery is that resin-sealed particle diameter with material has from the deviation that μ m level to 2～the 3mm degree is big like this.
When second discovery is to use have an above-mentioned big deviation resin-sealed to use material, supplies to resin-sealed in the die cavity and have the tendency that in the die cavity bottom surface (inner bottom surface in the die cavity) is configured to patch shape (unequal ground is chaotic) with material.This tendency is remarkable when particularly using have a big deviation resin-sealed make sealing resin with the material desire the desired value t of thickness (referring to the size from the upper surface of base main body to the upper surface of sealing resin) as the encapsulation of t=0.2～0.3mm degree, in this case, should supply to resin-sealed a small amount of and cause that to be configured to plaquelike tendency strong with material in the die cavity.In this case, having the resin-sealed of big deviation about particle diameter can configuration unevenly on the die cavity bottom surface with material.Cause thus that in die cavity the liquid resin of inhomogeneous existence can flow in the process of dipping chip in the resin-sealed liquid resin that generates with the material fusion.Liquid resin mobile becomes the reason that the distortion, the not filling in the sealing resin (in other words bubble) of lead-in wire etc. takes place.
The 3rd discovery is to exist (for example to have outstanding big particle diameter, 10t degree: t is the desired value of the thickness of aforesaid sealing resin) granular resin-sealed when using material, resin-sealedly fully can not contact with lead-in wire in the stage of fusion with material at this.This and lead-in wire contact the distortion that causes lead-in wire.
The 4th discovery is combination baffle and slit parts with resin-sealed when supplying in the die cavity with material (for example, with reference to patent documentation 1), and the resin-sealed existence with material with outstanding big particle diameter causes the increase of the weight of liquid resin.Accordingly, the deviation of the thickness t of the sealing resin in the encapsulation becomes big.
The 5th discovery is according to the resin-sealed properties of materials of using, and what have a small particle diameter is resin-sealed when being fed in the die cavity with material, might be attached to the original resin-sealed place that should not exist with material.This resin-sealed density with material hour of being attached to, thus cause by resin-sealed the swimming with material with small particle diameter.In addition, this being attached to resin-sealedly is easy to when charged with material, thereby causes with the material static electrification by having the resin-sealed of small particle diameter.Resin-sealed with material to adhering to of unexpected place causing following drawback.First drawback is that the resin sealing material disposes unevenly on the die cavity bottom surface.Second drawback is the pollution of shaping mould.The 3rd drawback is the generation of the resin burr that causes of poor register.
Summary of the invention
The problem that the related invention desire of the application solves is to eliminate the drawback of increase etc. of deviation of the thickness t of the generation of the distortion of the lead-in wire that the deviation as the raw-material powdery of sealing resin or granular resin-sealed particle diameter with material causes, the bubble in the sealing resin, sealing resin.
In order to solve above-mentioned problem, the resin-sealed material of using involved in the present invention, being arranged at resin sealing apparatus in use has shaping mould that the compression forming of die cavity uses and by sealing resin electronic unit is carried out being used when resin-sealed raw material as sealing resin, comprise resin material and be powdery or the granular resin-sealed material of using, described resin-sealedly be characterised in that with material, at the desired value t(mm to the thickness of sealing resin) set under the situation of first specification resin-sealed particle diameter D with material and satisfy this second specification of D≤a * t(mm), first specification is 0.03(mm)≤t≤1.2(mm) (a is arithmetic number).
In addition, resin-sealed manufacture method with material involved in the present invention, be to be arranged at resin sealing apparatus in use to have shaping mould that the compression forming of die cavity uses and by sealing resin electronic unit is carried out being used when resin-sealed raw material as sealing resin, be powdery or granular resin-sealed manufacture method with material, described resin-sealed manufacture method with material is characterised in that, comprising: the operation of preparing to comprise at least the raw material group that is powdery or granular resin material, additive and filler; The operation of mixing raw material group; Mixing raw material group also generates the operation of first intermediate materials; Pulverize intermediate materials and generate the operation of second intermediate materials; At the desired value t(mm to the thickness of sealing resin) set under the situation of first specification according to resin-sealed particle diameter D with material to be this second specification (a is arithmetic number) of D≤a * t(mm), to sort the operation of second intermediate materials; And with being judged as among the raw material group material is defined as resin-sealed operation with material in first specification that satisfies second specification, first specification is 0.03(mm)≤t≤1.2(mm).
According to the present invention, in first, second specification of by sealing resin electronic unit being carried out being used when resin-sealed below satisfying with material as sealing resin raw-material resin-sealed.That is, in the present invention, at the desired value t(mm to the thickness of sealing resin) set under the situation of first specification, resin-sealed particle diameter D with material satisfies this second specification of D≤3.0 * t(mm).These specifications are handled the area equivalent circular diameter of this projected area as particle diameter D, thereby are suitable for by going out projected area according to taking the resin-sealed image calculation that obtains with material.Satisfy these specifications by resin-sealed with material, thereby suppress the generation of the drawback that existence that desired value t with respect to thickness has the granular resin of big particle diameter D causes.By first specification is made as 0.03(mm)≤t≤1.2(mm), thus the effect that suppresses the generation of above-mentioned drawback increases.
And then, according to the present invention, supply to resin-sealed in the resin sealing apparatus and sorted according to second relevant this specification of specification D≤3.0 * t(mm) of resin-sealed particle diameter D with material with material.The result of letter sorting be judged as in first specification that satisfies second specification material by conveyance in shaping mould.Accordingly, supply with existing resin-sealed with under the situation of material, be judged as that material constitutes in first specification that satisfies second specification resin-sealed with material by conveyance in shaping mould.Therefore, suppress the generation of the drawback that existence that desired value t with respect to thickness has the granular resin of big particle diameter D causes.
And then according to the present invention, the result of letter sorting is judged as the outer material of the specification that does not satisfy second specification and is pulverized, and the outer material of the specification of pulverizing is further sorted.The result of letter sorting be judged as in second specification that satisfies second specification material by conveyance in shaping mould.Therefore, suppress the generation of the drawback that existence that desired value t with respect to thickness has the granular resin of big particle diameter D causes.Further, effectively utilize the resin-sealed material of using.
Description of drawings
(1) of Fig. 1～(3) are to represent respectively to use in the manufacture method of resin-sealed resin sealing body with material involved in the present invention, supplies with resin-sealed operation with material, heating resin-sealed with material operation and the synoptic diagram of the operation of matched moulds shaping mould.
(1) of Fig. 2～(4) are to be illustrated respectively in operation that liquid resin is solidified, to form the operation of die sinking shaping mould after the sealing resin, the operation that makes the formed body singualtion that resin sealing body constitutes and the synoptic diagram of the electronic device that singualtion is finished.
Fig. 3 is that expression is for the resin-sealed material of using involved in the present invention, desired value t at the thickness of sealing resin is 0.19mm, resin-sealed quantity delivered w with material is under the situation of 4.91g, the key diagram of the result of experiment of the relation of the situation that the resin sealing material disposes unevenly on four levels that investigation is set particle diameter and the die cavity bottom surface.
Fig. 4 is that expression is for the resin-sealed material of using involved in the present invention, desired value t at the thickness of sealing resin is 0.32mm, resin-sealed quantity delivered w with material is under the situation of 7.91g, the key diagram of the result of experiment of the relation of the situation that the resin sealing material disposes unevenly on four levels that investigation is set particle diameter and the die cavity bottom surface.
Fig. 5 is the vertical view that an example of resin-sealed resin sealing apparatus with material involved in the present invention is used in expression.
Fig. 6 is the vertical view that another example of resin-sealed resin sealing apparatus with material involved in the present invention is used in expression.
Symbol description
1 counterdie
2 patrixes
3 first feed units
4 die cavities
The 5 resin-sealed materials of using
6 mold release film
7 housing parts
8 cavity part
9 attract passage (attraction unit)
10 heaters (heating unit)
11 seal members (the exhausted unit of outer air bound)
12 attract passage (decompressing unit)
13 base main body
14 chips (electronic unit)
15 sealing prebasal plates
16 lead-in wires
17 boundary lines
18 zones
19 housings
20 supply baffle plates
21 resettlement sections
22 molten resins
The exhausted space of 23 outer air bounds
24 gases that are discharged from etc.
25 sealing resins
26 formed bodys (resin sealing body)
27 rotating blades
28 electronic equipments
29 unit substrate
30 unit sealing resins
31 material receiving elements
32,59 resin material processing units
33 forming units
34 formed body allocation units
35,57 substrate receiving elements
36,58 resin material receiving elements
37 conveyance tracks
38 main conveyance unit (the first conveyance unit)
39 substrate acceptance divisions
40 substrate transferring portions
41 resin acceptance divisions
42 metering portions
43 containers
44 first resin conveying units
45,49 baffle plates (separating element)
46 letter sorting unit
47 pulverize the unit
48 second resin conveying units (the second conveyance unit)
50 collecting unit of dust
51 chase retainer
52 second feed units
53 drawdown pumps (decompressing unit)
54 formed body conveying units
55 formed body containers
56 formed body resettlement sections
60 resin material unit
A1, A2 resin sealing apparatus
The D particle diameter
The desired value of the thickness of t sealing resin
Embodiment
According to the present invention, the desired value that has its thickness at the thickness of sealing resin is made as t(mm) 0.03(mm)≤situation of this first specification of t≤1.2(mm) under, according to resin-sealed particle diameter (particle footpath) second specification D≤3.0 * t(mm) that D is relevant with material, should supply to resin-sealed in the shaping mould of resin sealing apparatus and be sorted with material.The result of letter sorting be judged as in first specification that satisfies second specification material by conveyance in shaping mould.On the other hand, the result of letter sorting is judged as the outer material of the specification that does not satisfy second specification and is pulverized, and the outer material of the specification of pulverizing is sorted.The result of letter sorting be judged as in second specification that satisfies second specification material by conveyance in shaping mould.
[embodiment 1]
With reference to Fig. 1～Fig. 4, describe using resin-sealed method of resin-sealing and resin sealing apparatus with material involved in the present invention.In addition, for easy to understand, all suit to omit or schematic representation turgidly for any accompanying drawing in the present specification.For the identical identical symbol of structural element mark, suitable omission explanation.
Shown in Fig. 1 (1), use resin-sealed resin sealing apparatus with material involved in the present invention to have counterdie 1 and patrix 2.Counterdie 1 and patrix 2 common formation shaping moulds.Between counterdie 1 and patrix 2, be provided with free to advance or retreatly and supply with resin-sealed first feed unit 3 with material (aftermentioned).In counterdie 1, be provided with the die cavity 4 that recess constitutes.First feed unit 3 will be powdery or granular resin-sealedly supply in the die cavity 4 with material 5.That is, die cavity 4 is the resin-sealed space that should be supplied to material 5.Mold release film 6 is supplying under the state that is stretched between counterdie 1 and the patrix 2.
In counterdie 1, be provided with for attract mold release film 6 make that it is close to the profile of counterdie 1, in other words for the attraction passage 9 that mold release film 6 is adsorbed in the profile of counterdie 1.In Fig. 1, two two downward arrows that attract passage 9 to describe are respectively illustrated the outside appearance that attracts mechanism (not shown) to attract mold release film 6.In counterdie 1, be provided with the resin-sealed heater 10 with material 5 of heating.In addition, the heater that is arranged in the cavity part 8 is also not shown.
In patrix 2 with 1 opposed of counterdie (hereinafter referred to as " profile of patrix 2 ") in be provided with seal member 11 to overlook the mode of surrounding die cavity 4.In the profile of patrix 2, overlook the attraction passage 12 that is provided with the gas in the space that attracts to comprise die cavity 4 in the inboard of seal member 11.
The sealing prebasal plate 15 that a plurality of chips 14 are installed in base main body 13 is fixed in patrix 2 by known methods such as absorption.Sealing prebasal plate 15 is to comprise die cavity 4 fully and to be positioned at seal member 11 and to attract the mode of the inboard of passage 12 to be fixed in overlooking.The electrode of base main body 13 is electrically connected by lead-in wires such as gold thread 16 with the electrode (all not shown) of chip 14.Base main body 13 is divided into a plurality of regional 18 by the cancellate boundary line 17 of virtual setting.One or more chips 14 are installed in each zone 18.
Resin-sealedly describe with material 5 involved in the present invention.Resin-sealed with material 5 manufacturings as follows.At first, preparation comprises the raw material group of the filler (filler) that the powdery of heat reactive resin formation or granular resin material, additive and silicon dioxide etc. constitute at least.Then, mixing raw material group and generate first intermediate materials.Then, pulverize the first mixing intermediate materials and generate second intermediate materials.Then, specification according to the rules sorts second intermediate materials.Material is defined as resin-sealed with material 5 in first specification that satisfies the specification of stipulating with being judged as among second intermediate materials.
Can comprise that as resin material epoxy is that resin or silicon are resin.When being the resin-sealed usefulness of purpose use material 5 to make optics, resin material has light transmission.And then, use resin-sealed when the material 5, resin-sealed with containing fluorophor in the material 5 as additive.
In the present invention, use the resin-sealed material 5 of using, form the sealing resin that cured resin constitutes the desired value t with thickness.As the specification (first specification) of the desired value t of thickness, for example consider in recent years to be made as 0.1(mm for the demand of compactization of electronic device)≤t≤1.2(mm).When considering the relevant stronger demand of compactization, first specification is preferably 0.05(mm)≤t≤1.2(mm), more preferably 0.05(mm)≤t≤1.0(mm).When considering that chip is thick and be 15 these predictions of μ m degree according to the purposes of electronic device, first specification is preferably 0.03(mm)≤t≤1.0(mm).And then when consideration comprised effectively utilizing of material, first specification was preferably 0.03(mm)≤t≤1.2(mm).From this viewpoint of demand of actuality, first specification is preferably 0.2(mm)≤t≤1.0(mm).
Resin-sealedly satisfy particle diameter (particle footpath) 0.03(mm that D is relevant with the desired value of the thickness of sealing resin with material 5)≤specification of this regulation (second specification) of D≤3t(mm).This second specification is preferably 0.05(mm)≤D≤2t(mm).About resin-sealed these second specifications of being correlated with material 5, will describe in detail in the back.In present specification, resin-sealed particle diameter D with material 5 refers to the area equivalent circular diameter by the projected area of these particles in the resin-sealed image that obtains with material 5 of optical unit photographs.Particularly, go out projected area according to taking the resin-sealed image calculation that obtains with material 5, the area equivalent circular diameter of these projected areas is handled as particle diameter D.In (1) of Fig. 1, particle diameter D is shown easily.
In addition, to by other unit beyond the optical unit, for example known unit such as the centrifugal force that produces of air-flow, the screen cloth situation of measuring resin-sealed particle diameter D with material 5 describes.In this case, the measured value A of the particle diameter D that measures by above-mentioned optical unit is possible different with the measured value B of the particle diameter D that measures by other unit.Therefore, preferably, researching determining value A and measured value B's is relevant in advance, relevantly determines the second new specification according to this.Preferably, replace existing second specification to adopt the second new specification, according to this second new specification resin-sealed particle diameter D with material 5 is judged.
Below, thereby related resin-sealed of the application of the invention carried out the manufacture method of the resin sealing body of resin-sealed manufacturing resin sealing body with 5 pairs of chips of material 14, seeing figures.1.and.2 describes.The formed body that continuation forms resin-sealed chip 14, the manufacture method of in other words making the electronic device of electronic device by resin sealing body describe.
Shown in Fig. 1 (1), between counterdie 1 and patrix 2, mold release film 6 is supplied with in the top stretching of die cavity 4.Then, by attracting passage 9 to attract mold release film 6 to the bottom surface of die cavity 4.Accordingly, make mold release film 6 be adsorbed in the profile of formation die cavity 4 (hereinafter referred to as " cavity surface ".) whole.At least to the stage of counterdie 1 after the resin-sealed chip 14 with patrix 2 die sinkings, continue absorption mold release film 6.In addition, in present specification, for simplicity, be also referred to as " die cavity " for the resin-sealed space that should be supplied to material 5 under the state of whole of cavity surface absorption mold release film 6.
Then, first feed unit 3 is entered between counterdie 1 and the patrix 2, above die cavity 4, stop first feed unit 3.Then, open supply with baffle plate 20 at the left and right directions of accompanying drawing, die cavity 4 is supplied with resin-sealed with material 5.
Then, shown in Fig. 1 (2), 10 heating of use heater supply to the resin-sealed material 5 of using in the die cavity 4.Accordingly, make first feed unit, 3 fusions and generate liquid resin (with reference to the molten resin 22 of Fig. 1 (3)).Resin-sealed parallel with material 5 with heating, patrix 2 is descended.In addition, counterdie 1 is risen.Mainly be counterdie 1 and patrix 2 approaching getting final product relatively.
Then, shown in Fig. 1 (3).Patrix 2 is descended makes the lower end of seal member 11 contact with the profile of counterdie 1.Accordingly, formation comprises the space of die cavity 4 and the outer air bound exhausted space 23 isolated with the outside of shaping mould.Use is arranged on decompressing unit (not shown) such as the drawdown pump (aspiration pump) of the outside of shaping mould, the jar that reduces pressure, and externally reduce pressure in the exhausted space 23 of air bound.Accordingly, be included in the small particle in the exhausted space 23 of outer air bound and be included in outer air bound extremely the gas in space 23 and the molten resin 22 etc. be discharged to the outside of shaping mould.In (3) of Fig. 1, represent to be discharged to by decompression the gas etc. 24 of the outside of shaping mould near two arrows that make progress that attract to illustrate the passage 12.Preferably under touching the state (middle matched moulds state) of counterdie 1 and patrix 2 complete matched moulds, the profile from the lower end of seal member 11 and counterdie 1 begins the external air bound operation that reduces pressure of space 23 extremely.In addition, preferably in during molten resin 22 is completely crued, carry out the operation that reduces pressure in the exhausted space 23 of external air bound.
Then, shown in Fig. 2 (1), continue to make patrix 2 to descend.Accordingly, dipping chip 14 and lead-in wire 16(soak in molten resin 22), complete matched moulds counterdie 1 and patrix 2.Under the state (matched moulds state fully) of counterdie 1 and patrix 2 complete matched moulds, continuation heating and melting resin 22 in the time of by counterdie 1 and patrix 2 pressurizing melting resins 22.Accordingly, molten resin 22 is solidified, shown in Fig. 2 (2), form the sealing resin 25 that cured resin constitutes.
Then, shown in Fig. 2 (2), make patrix 2 rising die sinking counterdies 1 and patrix 2.Then, will have the formed body 26 that the resin sealing body (sealing metacoxal plate) of base main body 13, chip 14, lead-in wire 16 and sealing resin 25 constitutes is fetched into outside the shaping mould.Pass through to operation so far, a plurality of chips 14 that are installed on base main body 13 are carried out resin-sealed operation finish, a plurality of chips 14 are finished by resin-sealed formed body 26.
Then, shown in Fig. 2 (3), use known methods such as bonding film or absorption, formed body 26 is fixed in workbench (not shown).Use rotating blade 27, cut off formed body 26(fully along each boundary line 17 and cut entirely).Particularly, each boundary line 17 of each boundary line 17 of the directions X in Fig. 2 (3) and Y-direction cuts off formed body 26 fully respectively.Accordingly, carry out the singualtion (singulation) of formed body 26.Pass through to operation so far, formed body 26 with each the zone 18 be unit by singualtion, the electronic device 28 shown in (4) of shop drawings 2.It is that unit substrate 29, chip 14, lead-in wire 16 and the sealing resin 25 of unit singualtion regional 18 is the unit sealing resin 30 of unit singualtion with each with each zone 18 that each electronic device 28 has base main body 13.
In addition, in the operation that makes formed body 26 singualtion, replace cutting entirely, can also after the groove of formation midway of the thickness direction of formed body 26, (after the hemisection) apply external force and singualtion to formed body 26.Replace rotating blade 27, can also use laser, water jet, rope saw etc.
Below, for involved in the present invention resin-sealed with material 5, the specification of the particle diameter D regulation relevant with the desired value t of the thickness of sealing resin 25 is described.At first, the lower limit of second specification that resin-sealed particle diameter D with material 5 is set describes.The lower limit of second specification of particle diameter D when the desired value t of the thickness of sealing resin 25 is big certainly much less, even also need not in principle to determine desired value t hour of the thickness of sealing resin 25.But, according to the resin-sealed properties of materials of using, swim or charged causing with material because of resin-sealed, can take place resin-sealedly to be attached to original resin-sealed this problem of place that should not exist with material 5 with material 5.In order to prevent this problem, the lower limit of second specification of resin-sealed particle diameter D with material 5 is preferably big to a certain degree value.Rule of thumb, the value of having distinguished particle diameter D is during less than 0.05mm, supplies with or conveyance is resin-sealed is easy to take place above-mentioned swim or charged etc. during with material 5.And then the value of having distinguished particle diameter D is during less than 0.03mm, is easier to take place above-mentioned swim or charged etc.According to these items, about the lower limit of second specification of particle diameter D, we can say to be preferably more than the 0.03mm, more preferably more than the 0.05mm.Therefore, the following of second specification that particle diameter D is set prescribed a time limit, and is defined as 0.03(mm as lower limit)≤D, preferably be defined as 0.05(mm)≤D.
Then, the upper limit of second specification that particle diameter D is set describes.About the upper limit of second specification, determine by following order.As first order, will be set on the basis of particle diameter D as the specific scope of a plurality of (present embodiment is example with four) of the level of particle diameter D, sort resin-sealed with material 5 so that particle diameter D fall in the specific scope of setting.In addition, these specific scopes are different with the second above-mentioned specification.As second order, set by the desired value t(mm as the thickness of sealing resin 25) two level values constituting of suitable value.In addition, these level values are different with the first above-mentioned specification.As the 3rd order, calculate the resin-sealed weight w(g with material 5 corresponding with the desired value t of the thickness of each sealing resin 25), the resin-sealed of this weight is dispersed in actual evaluation usefulness die cavity (planar dimension: in 233 * 67mm) with material 5.Measure the resin-sealed of distribution optically and cover the ratio of this die cavity bottom surface (hereinafter referred to as " resin occupation rate " with material 5.）。As the 4th order, when should be resin-sealed resin-sealed with material 5 to using, the resin occupation rate of which kind of degree then can allow the deviation etc. of thickness of the sealing resin 25 of reality to estimate.According to above four orders, about resin-sealed particle diameter D with material 5, determine to be considered to can actual second specification of using the upper limit.
Below, the order of the upper limit of second specification of setting for the particle diameter D that determines resin sealing apparatus 5 describes with reference to Fig. 3 and Fig. 4.As first order, sort the resin-sealed material 5 of using, preparation particle diameter D falls into resin-sealed material Ma, Mb, Mc, the Md of using as the specific scope 1～4 of four levels respectively.Wherein, specific scope 1 be D=1.0～2.0(mm), and specific scope 2 be D=0.2～2.0(mm), and specifically scope 3 is D=0.2～1.0(mm), and specifically scope 4 is D=0.2～0.4(mm).
Resin-sealed usefulness material Ma:D=1.0～2.0(mm)
Resin-sealed usefulness material Mb:D=0.2～2.0(mm)
Resin-sealed usefulness material Mc:D=0.2～1.0(mm)
Resin-sealed usefulness material Md:D=0.2～0.4(mm)
As second order, set t=0.19(mm) and two level values t=0.32(mm) as the desired value of the thickness of sealing resin 25.T=0.19(mm) this level value is for considering in recent years the level value to the requirements set of compactization of electronic device 28.
As the 3rd order, in above-mentioned two level values (desired value of the thickness of sealing resin 25 is t=0.19(mm) and 0.32(mm) under) the situation, calculate the weight of corresponding resin-sealed usefulness material 5 respectively with this desired value t.The weight that calculates is at level value 1(desired value t=0.19(mm)) time be 4.91(g), at level value 2(desired value t=0.32(mm)) time be 7.91(g).In addition, the value of above-mentioned weight is the calculated value (theoretical value) when chip 14 is installed.
In addition, in experiment, be not installed on the state of base main body 13, in other words be object with the virtual substrate at chip 14, supply with resin-sealed with material 5.Quantity delivered w as reality, replace being equivalent to level value 1(desired value t=0.19(mm)) time w=4.91(g), with w=6.03(g) resin-sealed with material 5, in addition, replace being equivalent to level value 2(desired value t=0.32(mm)) time w=7.91(g), with w=10.16(g) resin-sealed being dispersed in respectively with material 5 estimate in the usefulness die cavity.
Continuation prepares to be equivalent to quantity delivered w=4.91(g as the 3rd order) resin-sealed resin-sealed with material Ma, Mb, Mc, Md with material 5, these are dispersed in successively estimate with in the die cavity.Similarly, prepare to be equivalent to quantity delivered w=7.91(g) resin-sealed resin-sealed with material Ma, Mb, Mc, Md with material 5, these are dispersed in successively estimate with in the die cavity.Take the resin-sealed state with material 5 that scatters from estimating with the top of die cavity.The image that obtains by shooting is carried out binary conversion treatment, calculate resin-sealed resin occupation rate with material 5.Particularly, in the image with 256 gray scales (with rank 0 as black, with rank 255 as in vain), rank 25 is carried out binary conversion treatment as threshold value to image.In binary image, rank is judged as " having the resin-sealed material of using " below 25, calculates the area ratio that has the part of resin-sealed usefulness material with the bottom surface of die cavity estimating.
Shown in (1) of Fig. 3～(4) at quantity delivered w=4.91(g) situation under, carry out image that binary conversion treatment obtains and the pie chart of resin occupation rate to being scattered with resin-sealed state with material Ma～Md respectively.Shown in (1) of Fig. 4～(4) at quantity delivered w=7.91(g) situation under, carry out image that binary conversion treatment obtains and the pie chart of resin occupation rate to being scattered with resin-sealed state with material Ma～Md respectively.
As the 4th order, use four kinds shown in (1)～(4) of Fig. 3 resin-sealed with material Ma～Md, moulding desired value t=0.19(mm) sealing resin 25(with reference to the 2(2 of figure)).According to this result, the situation of (1) of Fig. 3～(3) is judged as and does not allow as sealing resin 25, and the situation of Fig. 3 (4) is judged as has the surplus permission as sealing resin 25.
According to the result shown in Fig. 3, the first, as to resin-sealed particle diameter D(mm with material 5) lower limit of second specification set judges D=0.2(mm) appropriate.Lower limit D=1.0(mm as second specification) time, because resin sealing material 5 is configured to plaquelike tendency strong (with reference to (1) of Fig. 3) on estimating with the bottom surface of die cavity, so clear and definite the permission as sealing resin 25.
The upper limit anticipation of second specification according to the result shown in Fig. 3, the second, resin-sealed particle diameter D(mm with material 5) is present in D=0.4(mm) above 1.0(mm) below scope in.The scope that second specification of such particle diameter D is set is at resin-sealed particle diameter D(mm with material 5) second specification following to be limited among the situation of 0.2mm be that the resin occupation rate is equivalent to the scope below 84% more than 41% between the situation shown in (4) of the situation shown in Fig. 3 (3) and Fig. 3.
Continuation is as the 4th order, uses four kinds shown in (1)～(4) of Fig. 4 resin-sealed with material Ma～Md, the desired value t=0.32(mm of molding thickness) sealing resin 25(with reference to (2) of Fig. 2).Based on this result, be judged as during for (1) of Fig. 4, state shown in (2) and do not allow as sealing resin 25, be judged as permission as sealing resin 25 during for (3) of Fig. 4, state shown in (4).And then, be judged as the boundary of permission during for the state shown in Fig. 4 (3).Therefore, according to the result shown in Fig. 4 (particularly (3) of Fig. 4), at resin-sealed particle diameter D(mm with material 5) second specification following be limited under the situation of 0.2mm, infer D=1.0(mm as the upper limit of second specification) be suitable.D=1.0(mm as the upper limit of second specification) this value is equivalent to the desired value t=0.32(mm for the thickness of sealing resin 25), this relation of D/t=3.125.In addition, (under the D=0.2～1.0mm), the resin occupation rate is 72% in the situation that is the state shown in (3) of Fig. 4.
Continuation is as the 4th order, according to the particle diameter D(mm that is equivalent to infer according to Fig. 4) the upper limit (D=1.0(mm) of second specification) resin occupation rate (72%), to the particle diameter D(mm under the situation shown in Fig. 3) the upper limit of second specification study.Particle diameter D(mm in (3) of Fig. 3) be D=0.2～1.0mm, the resin occupation rate is 41%, particle diameter D(mm in (4) of Fig. 3) be D=0.2～0.4mm, the resin occupation rate is 84%.When between these, calculating the resin occupation rate in proportion and be 72% situation, as particle diameter D(mm) the upper limit of second specification, obtain D=0.567mm.It is 72% situation that this value of D=0.567mm is equivalent to the resin occupation rate, and is equivalent to the desired value t=0.19(mm for the thickness of sealing resin 25), this relation of D/t=2.99.
In sum, about to particle diameter D(mm) second specification set, the desired value t(mm of the upper limit of second specification under the situation of the following 0.2mm of being limited to of second specification and the thickness of sealing resin 25) relation (D/t) is D/t=3.125 in the situation of Fig. 3, and the situation of Fig. 4 is D/t=2.99.According to these items, about particle diameter D(mm) the upper limit of second specification and the desired value t(mm of the thickness of sealing resin 25) relation, judge that D/t=3.0 roughly is appropriate.
In addition, the situation of Fig. 3 (4) is judged as and has the surplus permission as sealing resin 25.According to this item, judge the situation shown in (4) of preferred Fig. 3, namely to particle diameter D(mm) the desired value t(mm of the upper limit of second specification set and the thickness of sealing resin 25) the pass be
Situation.Therefore, about particle diameter D(mm) the upper limit of second specification and the desired value t(mm of the thickness of sealing resin 25) preferred relation, judge that D/t=2.0 roughly is appropriate.
According to explanation up to the present, about particle diameter D(mm) we can say that following specification is appropriate.The first, the following of second specification that particle diameter D is set is 0.03(mm in limited time)≤D, be preferably 0.05(mm)≤D.The second, as the upper limit of second specification of particle diameter D, with the desired value t(mm of the thickness of sealing resin 25) the pass be D≤3.0 * t, be preferably D≤2.0 * t.
Therefore, to particle diameter D(mm) second specification set is as follows.That is, second specification becomes the desired value t(mm of particle diameter D and the thickness of sealing resin 25) relevant this specification of D≤3.0 * t(mm).This second specification is preferred from improving this viewpoint of resin-sealed earning rate with material 5 (effective rate of utilization).On the other hand, from thinner electronic device 28 corresponding these viewpoints, preferred D≤2.0 * t(mm) these second specifications.These second specifications are arranged down in limited time additional 0.03(mm according to suppressing resin-sealed with charged this viewpoint with swimming of material 5)≤this specification of D or 0.05(mm)≤this specification of D.
The resin-sealed material 5 of using that present embodiment is related, satisfy 0.03(mm with the specification (first specification) as the desired value t of the thickness of sealing resin 25)≤this specification of this specification (being preferably the 0.05(mm)≤t of t≤1.2(mm)≤1.0(mm)) be prerequisite, satisfy the second following specification.This is particle diameter D and relevant, this second specification of D≤3.0 * t(mm) of desired value t of the thickness of sealing resin 25.From with thinner electronic device 28 corresponding these viewpoints, preferred D≤2.0 * t(mm) these second specifications.These second specifications are arranged down in limited time additional 0.03(mm)≤this specification of D or 0.05(mm)≤this specification of D.
Satisfy these specifications by resin-sealed with material 5, thereby obtain following effect.The first, even desired value t hour of the thickness of sealing resin 25, even resin-sealed with under material 5 a spot of situations in supplying to die cavity 4 in other words also can suppress resin-sealed with material 5 configuration unevenly on the die cavity bottom surface.Accordingly, in the die cavity 4 shown in Fig. 1,2, suppress the resin-sealed liquid resin 22 that generates with material 5 fusions and flow.Therefore, suppress the generation of the distortion of lead-in wire 16, the not filling in the sealing resin 25 etc.
The second, the upper limit of particle diameter D is controlled as suitable value.Therefore, suppress the generation of the drawback that existence that desired value t with respect to thickness has the granular resin of big particle diameter causes.Particularly, the deviation that suppresses the thickness of the sealing resin in the encapsulation.
The 3rd, suppress by have a small particle diameter resin-sealed with material 5 swim or cause by static electrification, resin-sealedly adhere to unexpected place with material 5.Therefore, suppress this resin-sealed generation with the drawback that causes adhering to of material 5.
In addition, in present specification, the lower limit of second specification that particle diameter D is set and not meaning that is got rid of and is comprised that the particle diameter D's littler than this lower limit is resin-sealed with material 5.In fact, in conveyance or measure resin-sealedly with in the process of material 5, break or breach might generate small powder or plastochondria (the resin-sealed particulate that causes with material 5 is hereinafter referred to as " resin system particulate " with material 5 because of resin-sealed.）。This resin system particulate might have the particle diameter D littler than the lower limit of second specification of particle diameter D.Therefore, be that reason is judged as that not belong to resin-sealed be ill-considered with material 5 there to be the resin system particulate with particle diameter D littler than the lower limit of second specification of particle diameter D.
[embodiment 2]
With reference to Fig. 5 an embodiment who uses resin-sealed resin sealing apparatus with material 5 involved in the present invention is described.As shown in Figure 5, resin sealing apparatus A1 possesses material receiving element 31, resin material processing unit 32, a plurality of (among Fig. 5 two) forming unit 33 and formed body allocation units 34.Material receiving element 31 possesses the substrate receiving element 35 that receives sealing prebasal plate 15 and the resin material receiving element 36 that receives resin sealing material 5.From material receiving element 31 successively via resin material processing unit 32 and a plurality of forming unit 33 to formed body allocation units 34, be provided with conveyance track 37.In conveyance track 37, be provided with main conveyance unit 38.Main conveyance unit 38 can be along conveyance track 37 transversely moving at accompanying drawing.In addition, forming unit 33 also can be for single.
In using the related resin-sealed resin sealing apparatus A1 of material 5 of using of present embodiment, the first following structure that adopts resin material processing unit 32 to be correlated with.That is, resin material processing unit 32 and the 31 adjacent and loading and unloading settings freely of material receiving element in resin sealing apparatus A1.By adopting this first structure, resin material processing unit 32 is installed on resin sealing apparatus A1 as required, perhaps dismantles from resin sealing apparatus A1 as required.
Resin material processing unit 32 has according to resin-sealed letter sorting unit 46 and the result that pulverizes letter sorting with material 5 of second specification of particle diameter D letter sorting and is judged as particle diameter greater than the specification of second specification pulverizing unit 47 of material outward.And then resin material processing unit 32 has in resin acceptance division 41 and letter sorting unit 46 and pulverizes the resin-sealed second resin conveying unit 48 of using material outside material 5 and the specification of conveyance between the unit 47.
As letter sorting unit 46, for example select or known unit such as centrifugal force that suitable combination optical unit, air-flow produce, screen cloth and using.As pulverizing unit 47, for example use known unit such as stirring, roller mill.Letter sorting unit 46 is included in the resin material processing unit 32 with pulverizing unit 47.
In order to prevent resin system particulate intrusion substrate receiving element 35, following structural element is set in resin material processing unit 32 preferably.These structural elements comprise cooperating with baffle plate 45 and will comprise baffle plate 49 that resin material receiving element 36 and letter sorting unit 46 and the space of pulverizing unit 47 and other spaces are isolated and attract the also collecting unit of dust 50 of control of dust to being present in by the particulate in the isolated space of baffle plate 45 and baffle plate 49.
As second specification of the particle diameter D that is suitable in the letter sorting unit 46, first specification that can set with the desired value t to the thickness of sealing resin 25 is associated and adopts following specification.First specification as the desired value t of thickness for example adopts 0.03(mm)≤this specification of this specification (being preferably the 0.05(mm)≤t of t≤1.2(mm)≤1.0(mm)).Second specification as the specific scope of particle diameter D is set for example adopts 0.03(mm)≤these specifications of D≤3.0 * t(mm) (being preferably 0.05(mm)≤this specification of D≤2.0 * t(mm)).
A plurality of forming units 33 have following structural element respectively.That is, as structural element enumerate be chase retainer 51, be installed on the counterdie 1 chasing retainer 51 and have die cavity 4, and counterdie 1 opposite disposed fixedly have among patrix 2(Fig. 5 of sealing prebasal plate 15 not shown), to supplying with between counterdie 1 and the patrix 2 and second feed unit 52 of coiling mold release film 6 and to being formed on the drawdown pump 53 that reduces pressure in the exhausted space of outer air bound between counterdie 1 and the patrix 2 (with reference to the space 23 extremely of the outer air bound shown in Fig. 1 (3)).
The formed body resettlement section 56 that in formed body allocation units 34, is provided with the formed body conveying unit 54 of conveyance formed body 26 and disposes the formed body usefulness container 55 of the formations such as pallet of accommodating formed body 26.
In using the related resin-sealed resin sealing apparatus A1 of material 5 of using of present embodiment, on the basis of relevant aforesaid first structure of resin material processing unit 32, the second following structure that adopts single or multiple (among Fig. 5 two) forming unit 33 to be correlated with.Namely, the forming unit 33 in the left side shown in Fig. 5 is adjacent with resin material processing unit 32, and with the forming unit 33 adjacent (in other words being clipped by the forming unit 33 of resin material processing unit 32 with the right side) on right side, loading and unloading arrange freely in resin sealing apparatus A1.In addition, the forming unit on right side 33 is adjacent with the forming unit 33 in left side, and with formed body allocation units 34 adjacent (in other words being clipped with formed body allocation units 34 by the forming unit 33 in left side), loading and unloading arrange freely in resin sealing apparatus A1.
In addition, when being provided with single forming unit 33 in resin sealing apparatus A1, this forming unit 33 is clipped installation by resin material processing unit 32 and formed body allocation units 34 in resin sealing apparatus A1.Suppose from resin sealing apparatus A1 dismounting formed body allocation units 34, then can be in resin sealing apparatus A1 and other forming units 33 of the adjacent loading and unloading in right side of this single forming unit 33.
Use the related resin-sealed resin sealing apparatus A1 with material 5 of present embodiment to have following effect.The first, be judged as the outer material of the specification that does not satisfy second specification by pulverizing the result who pulverizes by 46 letter sortings of letter sorting unit unit 47.The outer material of specification by the 46 letter sorting pulverizing of letter sorting unit.The result of letter sorting is judged as in second specification that satisfies second specification material conveyance in shaping mould.Therefore, can effectively utilize the resin-sealed material 5 of using that supplies among the resin sealing apparatus A1.
The second, by adopting first structure, can resin material processing unit 32 be installed on resin sealing apparatus A1 as required about resin material processing unit 32 afterwards, perhaps resin material processing unit 32 is dismantled from resin sealing apparatus A1 afterwards.Accordingly, can be according to the desired value t(of the thickness of the sealing resin 25 of resin-sealed specification, electronic device 28 with material 5 with reference to Fig. 2) etc., resin sealing apparatus A1 is installed resin material processing unit 32 afterwards, and afterwards from resin sealing apparatus A1 dismounting resin material processing unit 32.And then, the resin material processing unit 32 from resin sealing apparatus A1 dismounting in first factory can be transplanted on second factory that needs this resin material processing unit 32, be installed on the resin sealing apparatus A1 that second factory possesses.Therefore, use the electronic device 28(of resin sealing apparatus A1 with reference to Fig. 2 (4)) manufacturer can be according to the variation of the trend in market, resin-sealed specification with material 5 and electronic device 28 etc., in resin sealing apparatus A1, easily load and unload resin material processing unit 32.
The 3rd, by adopting aforesaid second structure, each forming unit 33 is installed on resin sealing apparatus A1 as required, perhaps dismantles from resin sealing apparatus A1 as required about each forming unit 33.Accordingly, can be according to the trend in market, the increase and decrease of demand etc., resin sealing apparatus A1 is installed and sets up forming unit 33, and from resin sealing apparatus A1 dismounting forming unit 33 and reduce the quantity of forming unit 33.And then, the forming unit 33 from resin sealing apparatus A1 dismounting in first factory can be transplanted on second factory that for example is positioned at other places in great demand, be installed on the resin sealing apparatus A1 that second factory possesses.Therefore, use the electronic device 28(of resin sealing apparatus A2 with reference to Fig. 2 (4)) manufacturer can easily adjust the production capacity of electronic device 28 according to the trend in market, the increase and decrease of demand etc.
The 4th, collecting unit of dust 50 is set, will comprise that by baffle plate 45 and baffle plate 49 resin material receiving element 36 and letter sorting unit 46 are isolated with the space of pulverizing unit 47 and other spaces, the resin system particulate that is present in isolated space etc. is attracted also control of dust.Accordingly, can comprise the atomic particulate of resin system by control of dust.Therefore, can suppress to be attached to the drawback that sealing prebasal plate 15 grades take place because comprising the atomic foreign matter of resin system.
The 5th, by use mold release film 6, thereby can make formed body 26 easily from counterdie 1 demoulding (with reference to (2) of Fig. 2).And then, via mold release film 6, can be with the fine concavo-convex sealing resin 25 that positively is needed on that is arranged on the cavity surface.By these items, making (4) of electronic device 28(with reference to Fig. 2) time can improve quality.Particularly when manufacturing has the optics that comprises fine concavo-convex lens (for example, Fresnel Lenses etc.), can significantly improve quality.
The 6th, under middle matched moulds state, form the exhausted space 23 of outer air bound at least, to this outer air bound space 23 reduce pressure (with reference to (3) of Fig. 1) extremely.Accordingly, suppress the generation of the bubble in the sealing resin 25.Therefore, making (4) of electronic device 28(with reference to Fig. 2) time can improve quality.When particularly making the optics of the sealing resin 25 with light transmission, can significantly improve quality.
[embodiment 3]
With reference to Fig. 6 another embodiment that uses resin-sealed resin sealing apparatus with material 5 involved in the present invention is described.As shown in Figure 6, in resin sealing apparatus A2, adopt first～the 3rd following structure.
First structure is as follows.That is, the forming unit 33 in the left side shown in Fig. 6 is adjacent with substrate receiving element 57, and with the forming unit 33 adjacent (in other words being clipped by the forming unit 33 of substrate receiving element 57 with the right side) on right side, loading and unloading arrange freely in resin sealing apparatus A2.In addition, the forming unit on right side 33 is adjacent with the forming unit 33 in left side, and with formed body allocation units 34 adjacent (in other words being clipped with formed body allocation units 34 by the forming unit 33 in left side), loading and unloading arrange freely in resin sealing apparatus A2.
Second structure is as follows.Namely, resin material receiving element 36 is included in the resin receiving element 31 among the resin sealing apparatus A1 shown in Figure 5, and is relative therewith, in resin sealing apparatus A2, resin material receiving element 58 is independent from substrate receiving element 57, with the 59 adjacent settings of resin material processing unit.In Fig. 6, resin material receiving element 58 is adjacent on the above-below direction of accompanying drawing with resin material processing unit 59.Resin material receiving element 58 and resin material processing unit 59 common formation resin materials unit 60.And then resin material receiving element 58 is independently module of difference with resin material processing unit 59, can be at resin material with loading and unloading respectively in the unit 60.That is, can be afterwards at the installation resin material processing unit 59 in the unit 60 of the resin material with resin material receiving element 58.
In addition, when being provided with single forming unit 33 in resin sealing apparatus A2, this forming unit 33 is clipped installation by substrate receiving element 57 and formed body allocation units 34 in resin sealing apparatus A2.Suppose from resin sealing apparatus A2 dismounting resin material with unit 60 and formed body allocation units 34, then can be in resin sealing apparatus A2 and other forming units 33 of the adjacent loading and unloading in right side of this single forming unit 33.
The 3rd structure is as follows.That is, resin material clips among single or multiple forming unit 33(Fig. 6 two with unit 60 in overlooking), be arranged on the opposition side with substrate receiving element 57.Therefore, in resin sealing apparatus A2, the substrate receiving element 57 that receives sealing prebasal plate 15 with receive letter sorting and be powdery or the granular resin-sealed resin material of pulverizing material outside the specification with material 5 as required and be positioned at farthest position with unit 60.
According to first structure, each forming unit 33 is installed on resin sealing apparatus A2 as required, perhaps dismantles from resin sealing apparatus A2 as required.Therefore, use the electronic device 28(of resin sealing apparatus A2 with reference to Fig. 2 (4)) manufacturer can easily adjust the production capacity of electronic device 28 according to the trend in market, the increase and decrease of demand etc.
According to second structure, can use at the resin material with resin material receiving element 58 afterwards resin material processing unit 59 is installed in the unit 60.Therefore, be accompanied by the sealing resin 30(of unit that electronic device 28 has with reference to Fig. 2 (4)) the variation of technology trend of propelling etc. of slimming, according to the expectation of the manufacturer of electronic device 28, can append resin material processing unit 59 afterwards.
According to the 3rd structure, can prevent intrusion substrate receiving elements 57 such as resin system particulate.Therefore, can prevent from being attached to the drawback that sealing prebasal plate 15 grades take place because comprising the atomic foreign matter of resin system.
And then, therefore same with the situation of the resin sealing apparatus A1 shown in Fig. 5 owing in resin sealing apparatus A2, being provided with letter sorting unit 46 and pulverizing unit 47, can effectively utilize the resin-sealed material 5 of using that supplies among the resin sealing apparatus A2.
In addition, owing to be provided with collecting unit of dust 50, to comprise that by baffle plate 45 resin material receiving element 58 and letter sorting unit 46 are isolated with the space of pulverizing unit 47 and other spaces, the particulate that is present in isolated space is attracted and control of dust, therefore same with the situation of the resin sealing apparatus A1 shown in Fig. 5, can suppress to be attached to the drawback that sealing prebasal plate 15 grades take place because comprising the atomic foreign matter of resin system.
In addition, therefore same with the situation of the resin sealing apparatus A1 shown in Fig. 5 owing to use mold release film 6 in resin sealing apparatus A2, making (4) of electronic device 28(with reference to Fig. 2) time can improve quality.
In addition, in resin sealing apparatus A2, owing under middle matched moulds state, form the exhausted space 23 of outer air bound at least and to air bound outside this space 23 reduce pressure (with reference to (3) of Fig. 1) extremely, therefore same with the situation of the resin sealing apparatus A1 shown in Fig. 5, making (4) of electronic device 28(with reference to Fig. 2) time can improve quality.
In addition, among the resin sealing apparatus A2 shown in Figure 6, can also exchange formed body allocation units 34 and the plan position approach of resin material with unit 60.When so exchanging, resin material is adjacent with the forming unit 33 on the right side shown in Fig. 6 with unit 60, and with formed body allocation units 34 adjacent (in other words, being clipped by forming unit 33 and the formed body allocation units 34 on right side), loading and unloading arrange freely in resin sealing apparatus A2.
The particle diameter D that illustrates in present specification refers to the area equivalent circular diameter by the projected area of these particles in the resin-sealed image that obtains with material 5 of optical unit photographs.Therefore, with same resin-sealed be object with material 5, the mensuration of usable floor area equivalent diameter (calculating) other determination methods in addition when for example the mensuration of Feret, shading method or screening method etc. are measured particle diameter D, might obtain the measured value different with particle diameter D in the present specification.When using other determination methods to measure particle diameter D, the measured value displacement when measuring by the determination method in the present specification judges whether to be included in second specification of the particle diameter D that illustrates in the present specification.In other words, second specification of the particle diameter D that illustrates in the measured value that other determination methods of use are obtained and the present specification directly compares imappropriate.
When measuring resin-sealed particle diameter D with material 5, use the resin-sealed method with material 5 that is dispersed in the pallet of taking from the top, take from the resin-sealed method with material 5 of batcher free fall from the side etc.But, be not limited to these.The total of all resin-sealed usefulness materials 5 that can supply with desire is that object is measured particle diameter D.Replacing therewith, can also extract a part of sample the material 5 out from resin-sealed the using that desire is supplied with, is that object is measured particle diameter D with this sample.
In explanation up to the present, to arrange in the inside of resin sealing apparatus A1, A2 according to second specification letter sorting that particle diameter D is set resin-sealed with material 5 letter sorting unit 46 and pulverize the result who sorts be judged as particle diameter D than the big specification of second specification outside the example of pulverizing unit 47 of material be illustrated (with reference to Fig. 5,6).Be not limited thereto, as variation, can also the outer setting of resin sealing apparatus letter sorting unit with pulverize the unit the two.In this case, can be with resin-sealedly supplying in the resin sealing apparatus with material 5 of sorting in advance in the outside of resin sealing apparatus and pulverize as required.
As other variation, the letter sorting unit can also be set, the pulverizing unit of material outside the outer setting of resin sealing apparatus is pulverized the specification that is judged as second specification that does not satisfy particle diameter D in the inside of resin sealing apparatus.The outer material of specification is transplanted on the operation of pulverizing in the unit can manually be carried out by the operator, also can use along conveyance unit that track moves or has reciprocally that the conveyance unit of the arm of rotation carries out.
In the structure of explanation up to the present, replace supplying with baffle plate 20, resin-sealed whereabouts mouth with material 5 can also be set in first feed unit 3.In this structure, while by making resin-sealed dropping to material 5 that first feed unit 3 is moved, thereby die cavity 4 is supplied with resin-sealed with material 5.As resin-sealed whereabouts mouth with material 5, the preferred whereabouts mouth that shape with groove shape almost flatly is set.And then, preferably with in overlooking with respect to the profile of die cavity 4, the not overlapped and disjoint mode of resin-sealed track with material 5 that falls moves first feed unit 3.Further, thus preferably adding the unit that shakes by use on one side applies vibration to the mouth that falls and makes and resin-sealedly vibrate for the resin-sealed material 5 of using in the profile whereabouts of die cavity 4 with material 5.
In the structure of explanation up to the present, can also adopt first, second following change structure.The first change structure is for arranging first feed unit with housing, mode with the inboard of covering housing and housing in overlooking is adsorbed rectangular-shaped mold release film 6 at the lower surface of first feed unit, and resin-sealed structure with material 5 is supplied with in the resettlement section that the space that is surrounded by housing and mold release film 6 constitutes.According to this structure, in the resettlement section, contain resin-sealed using under the state of material 5, make first feed unit move to the top of die cavity 4.Releasing is for the absorption of mold release film 6 time, in the inner surface absorption mold release film 6 of die cavity 4.Accordingly, die cavity 4 is supplied with mold release film 6 and the resin-sealed material 5 of using.
The second change structure is supplied with the resin-sealed material 5 of using for first feed unit with recess is set to recess, in the rectangular-shaped mold release film 6 of upper surface absorption of first feed unit, makes the structure of first feed unit counter-rotating.According to this structure, make first feed unit of counter-rotating move to the top of die cavity 4.Releasing is for the absorption of mold release film 6 time, in the inner surface absorption mold release film 6 of die cavity 4.Accordingly, die cavity 4 is supplied with mold release film 6 and the resin-sealed material 5 of using.
In above-mentioned two change structures, first feed unit is supplied with resin-sealedly during with material 5, can both be used to add the unit that shakes.In addition, apply vibration by resin-sealed whereabouts mouth with material 5 that first feed unit is fallen, thereby can make resin-sealed with material 5 vibrations.At this moment, Yi Bian preferably above first feed unit, make resin-sealed with material 5 vibrations, Yi Bian resin-sealed with material 5 to first feed unit whereabouts.
In explanation up to the present, conveyer and the resin-sealed conveyer with material 5 of conveyance that conveyance is sealed prebasal plate 15 and formed body 26 is illustrated (with reference to Fig. 5,6) as the example of main conveyance unit 38 jointly.Replace this structure, conveyance can also be sealed the resin-sealed conveyer with material 5 of the conveyer of prebasal plate 15 and formed body 26 and conveyance as another set of system.
In explanation up to the present, be illustrated (with reference to Fig. 5,6) in a forming unit 33, being provided with a structure of forming pattern.Replace this structure, can also prepare two groups for a forming unit 33 and comprise that counterdie 1 and one of patrix 2 form patterns, dispose a composition pattern respectively epimere and hypomere two sections.In this structure, by making the action of common mould switching mechanism, thus one of a matched moulds and die sinking epimere composition pattern of forming pattern and hypomere in fact simultaneously.As common mould switching mechanism, for example use the gear unit of drive sources such as servomotor, hydraulic cylinder and rack and pinion etc.According to this structure, when having the forming unit 33 of identical proprietary area, use can realize the production efficiency of twice.
In explanation up to the present, the embodiment that uses mold release film 6 is illustrated (with reference to (2), 5,6 of Fig. 2).But the combination of the rerum natura of the material that uses according to shaping mould and the rerum natura of sealing resin 25 also can not used mold release film 6.
In explanation up to the present, to the exhausted space 23 of air bound outside forming under middle matched moulds state at least, the embodiment that is reduced pressure in the exhausted space 23 of this outer air bound is illustrated (with reference to (3) of Fig. 1).But according to the relevant quality levels such as bubble that sealing resin 25 is required, also can not implement to form 23 pairs in the exhausted space of outer air bound should reduce pressure in the exhausted space 23 of outer air bound.
In explanation up to the present, shown in Fig. 2 (3), (4), making formed body 26 is the unit singualtion with each zone 18.For example, when having four zones 18 on four of existence and the Y-direction on the directions X in Fig. 2 (3), formed body 26 monolithics turn to 16 electronic devices 28 that are made of a zone 18 respectively.But be not limited thereto, can also (following table be shown " 1 * 4 " with four common zones on and the Y-direction on the directions X.) make formed body 26 singualtion, perhaps make formed body 26 singualtion with 4 * 1 common zones.Like this, can make four electronic devices 28 that constituted by four zones 18 respectively.And then, can make formed body 26 form monolithic with 2 * 2 zone, make four electronic devices 28 that constituted by four zones 18 respectively.Further, can remove the unwanted part in the end from formed body 26, the zone with 4 * 4 makes formed body 26 singualtion, makes an electronic device 28 that is made of 16 zones 18.Therefore, when chip 14 is led chip, can easily make row shape or planar optics (luminous element).
The present invention is not limited to the above embodiments, in the scope that does not break away from aim of the present invention, can be as required, and any and suitable combination, change or selection employing.
Claims (16)
1. resin-sealed material of using, be arranged at resin sealing apparatus and have shaping mould that the compression forming of die cavity uses in use and by sealing resin electronic unit is carried out being used when resin-sealed raw material as described sealing resin, comprise resin material and be powdery or granular, described resin-sealedly be characterised in that with material
At the desired value t(mm to the thickness of described sealing resin) set under the situation of first specification described resin-sealed particle diameter D with material and satisfy this second specification of D≤a * t(mm),
Described first specification is 0.03(mm)≤t≤1.2(mm), wherein a is arithmetic number.
2. the resin-sealed material of using according to claim 1 is characterized in that, described first specification is 0.05(mm)≤t≤1.0(mm).
3. the resin-sealed material of using according to claim 1 and 2, it is characterized in that, described second specification is by going out projected area according to taking the described resin-sealed image calculation that obtains with material, is suitable for as described particle diameter D thereby the area equivalent circular diameter of this projected area handled
The value of described a is 3.0.
4. the resin-sealed material of using according to claim 1 and 2 is characterized in that, utilizes the centrifugal force that air-flow produces or utilizes sieve to judge and describedly resin-sealedly whether satisfy described second specification with material.
5. the resin-sealed material of using according to claim 1 and 2 is characterized in that described resin material has thermosetting.
6. the resin-sealed material of using according to claim 5 is characterized in that, described resin material comprises that epoxy is that resin or silicon are resin.
7. the resin-sealed material of using according to claim 1 and 2 is characterized in that described resin material has light transmission.
8. the resin-sealed material of using according to claim 1 and 2 is characterized in that, this is resin-sealed to comprise material in first specification that has described resin material, additive and filler at least with material,
Described resin material is powdery or granular,
Material be described at least resin material, described additive and described filler by mixing and pulverize the crushed material that forms and be judged as the material that satisfies described second specification according to the result that described second specification (D≤a * t(mm)) sorts in described first specification.
9. the resin-sealed material of using according to claim 1 and 2 is characterized in that, this is resin-sealed to comprise material in second specification that has described resin material, additive and filler at least with material,
Described resin material is powdery or granular,
In described second specification material be described at least resin material, described additive and described filler by mixing and pulverize first crushed material that forms according to the result of described second specification (D≤a * t(mm)) letter sorting be judged as do not satisfy described second specification specification outward material further pulverized, generate after second crushed material, this second crushed material is judged as the material that satisfies described second specification according to the result of described second specification letter sorting.
10. the resin-sealed material of using according to claim 1 and 2 is characterized in that, describedly resin-sealedly comprises material in first specification with material,
Described resin-sealed with material for being judged as the material that satisfies described second specification from supplying to described resin sealing apparatus to the result who supplies to the described die cavity according to described second specification (D≤a * t(mm)) letter sorting.
11. the resin-sealed material of using according to claim 1 and 2 is characterized in that, describedly resin-sealedly comprises material in second specification with material,
Material is describedly resin-sealedly to be judged as the specification that does not satisfy described second specification outside material and to be pulverized and generate after the crushed material to supplying to the described die cavity result according to described second specification (D≤a * t(mm)) letter sorting from supplying to described resin sealing apparatus with material in described second specification, and this crushed material is judged as the material that satisfies described second specification according to the result that described second specification sorts.
12. resin-sealed manufacture method with material, described resin-sealed be arranged at resin sealing apparatus and have shaping mould that the compression forming of die cavity uses in use with material by sealing resin electronic unit is carried out being used when resin-sealed raw material as sealing resin, be powdery or granular, described resin-sealed manufacture method with material is characterised in that, comprising:
Prepare to comprise at least the operation of the raw material group that is powdery or granular resin material, additive and filler;
The operation of mixing described raw material group;
Mixing described raw material group also generates the operation of first intermediate materials;
Pulverize described intermediate materials and generate the operation of second intermediate materials;
At the desired value t(mm to the thickness of described sealing resin) to set under the situation of first specification according to described resin-sealed particle diameter D with material be this second specification of D≤a * t(mm), wherein a is arithmetic number, sorts the operation of described second intermediate materials; And
Material is defined as described resin-sealed operation with material in first specification that satisfies described second specification with being judged as among the described raw material group,
Described first specification is 0.03(mm)≤t≤1.2(mm).
13. resin-sealed manufacture method with material according to claim 12 is characterized in that described first specification is 0.05(mm)≤t≤1.0(mm).
14. resin-sealed manufacture method with material according to claim 13, it is characterized in that, in the operation of the described raw material group of letter sorting, by going out projected area according to taking the described resin-sealed image calculation that obtains with material, thereby the area equivalent circular diameter of this projected area is handled suitable described second specification as described particle diameter D
The value of described a is 3.0.
15. resin-sealed manufacture method with material according to claim 13 is characterized in that, in the operation of the described raw material group of letter sorting, utilizes the centrifugal force that air-flow produces or utilizes sieve to judge and describedly resin-sealedly whether satisfy described second specification with material.
16. according to each described resin-sealed manufacture method with material in the claim 12～15, it is characterized in that, further comprise:
Pulverizing is judged as the operation of material outside the specification that does not satisfy described second specification (D≤a * t(mm)) according to the result of described second specification letter sorting in the operation of the described raw material group of letter sorting;
Operation according to material outside the described specification of described second specification letter sorting pulverizing; And
Material is defined as described resin-sealed operation with material in second specification that satisfies described second specification with being judged as among the outer material of the described specification of pulverizing.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012041625A JP6071216B2 (en) | 2012-02-28 | 2012-02-28 | Manufacturing method of resin sealing material and resin sealing device |
| JP2012-041625 | 2012-02-28 |
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| CN103295975A true CN103295975A (en) | 2013-09-11 |
| CN103295975B CN103295975B (en) | 2016-08-03 |
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| CN201310056524.8A Active CN103295975B (en) | 2012-02-28 | 2013-02-22 | Resin seal material and manufacture method thereof |
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| Country | Link |
|---|---|
| JP (1) | JP6071216B2 (en) |
| KR (2) | KR20130098898A (en) |
| CN (1) | CN103295975B (en) |
| TW (1) | TWI601573B (en) |
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| CN104708752A (en) * | 2013-11-28 | 2015-06-17 | 东和株式会社 | Method and apparatus for supplying resin material of compression molding apparatus |
| CN105034228A (en) * | 2014-04-30 | 2015-11-11 | 东和株式会社 | Sheet-type resin body, resin molding apparatus, resin molding method and molding product manufacturing method |
| CN105098030A (en) * | 2015-06-17 | 2015-11-25 | 苏州迈瑞微电子有限公司 | Integrated circuit (IC) package method and package structure |
| CN106935575A (en) * | 2015-10-13 | 2017-07-07 | 罗姆股份有限公司 | The manufacture method and optical semiconductor device of optical semiconductor device |
| CN110223992A (en) * | 2019-06-27 | 2019-09-10 | 武汉华星光电半导体显示技术有限公司 | The preparation method of display panel, the molding die of display panel and display panel |
| CN111403303A (en) * | 2015-11-09 | 2020-07-10 | 东和株式会社 | Resin sealing device and resin sealing method |
| CN113745136A (en) * | 2021-11-08 | 2021-12-03 | 张家港谱析传感科技有限公司 | Electronic component manufacturing equipment |
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| JP5627619B2 (en) * | 2012-02-28 | 2014-11-19 | Ｔｏｗａ株式会社 | Resin sealing device and method for manufacturing resin sealing body |
| JP6444707B2 (en) * | 2014-11-28 | 2018-12-26 | Ｔｏｗａ株式会社 | Electronic component, manufacturing method and manufacturing apparatus |
| JP6525580B2 (en) * | 2014-12-24 | 2019-06-05 | Ｔｏｗａ株式会社 | Resin molding apparatus and resin molding method |
| JP6491120B2 (en) * | 2016-02-13 | 2019-03-27 | Ｔｏｗａ株式会社 | Resin sealing device, resin sealing method, and resin molded product manufacturing method |
| JP7003184B2 (en) * | 2020-06-22 | 2022-01-20 | Ｔｏｗａ株式会社 | Resin molding equipment and manufacturing method of resin molded products |
| JP7453683B2 (en) * | 2020-09-11 | 2024-03-21 | アピックヤマダ株式会社 | Resin sealing device |
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| CN105034228A (en) * | 2014-04-30 | 2015-11-11 | 东和株式会社 | Sheet-type resin body, resin molding apparatus, resin molding method and molding product manufacturing method |
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| CN110223992A (en) * | 2019-06-27 | 2019-09-10 | 武汉华星光电半导体显示技术有限公司 | The preparation method of display panel, the molding die of display panel and display panel |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2013176875A (en) | 2013-09-09 |
| TWI601573B (en) | 2017-10-11 |
| CN103295975B (en) | 2016-08-03 |
| KR20130098898A (en) | 2013-09-05 |
| KR20150065641A (en) | 2015-06-15 |
| JP6071216B2 (en) | 2017-02-01 |
| TW201334873A (en) | 2013-09-01 |
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