CN103295975B - Resin seal material and manufacture method thereof - Google Patents

Resin seal material and manufacture method thereof Download PDF

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Publication number
CN103295975B
CN103295975B CN201310056524.8A CN201310056524A CN103295975B CN 103295975 B CN103295975 B CN 103295975B CN 201310056524 A CN201310056524 A CN 201310056524A CN 103295975 B CN103295975 B CN 103295975B
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resin
resin seal
seal material
sealing
unit
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CN103295975A (en
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高濑慎二
砂田卫
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Towa Corp
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Towa Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B7/00—Mixing; Kneading
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B9/00—Making granules
    • B29B9/12—Making granules characterised by structure or composition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

A kind of resin seal material and manufacture method thereof, this resin seal material is normally used as the raw material of sealing resin when the shaping mould using the compression forming being arranged at resin sealing apparatus and have die cavity carries out resin seal to chip, in powdery or granular, desired value t(mm at the thickness to sealing resin) set the first specification in the case of particle diameter D meet D≤3 × t(mm) this second specification.Resin seal material includes from being supplied to material in resin sealing apparatus is judged as the first specification of satisfied second specification to the result being supplied to die cavity sort.First specification is 0.03(mm)≤t≤1.0(mm).

Description

Resin seal material and manufacture method thereof
Technical field
The present invention relates to use the shaping mould of compression forming the electronic unit of shaped like chips is carried out use during resin seal, in powdery or granular resin seal material and manufacture method thereof.
Background technology
To IC(IntegratedCircuit) chip, LED(LightEmittingDiode) chip shape electronic component such as chip, chip capacitor is (hereinafter referred to as " chip ".) carry out in the operation of resin seal, form, by making liquid resin solidify, the sealing resin that solidification resin is constituted.Accordingly, lead frame, printed base plate etc. it are installed on (hereinafter referred to as " base main body ".) chip sealed by resin.In recent years as the method for resin seal, on the basis of transfer molding, use compression forming (for example, referring to patent documentation 1).Compared with transfer molding, compression forming have the pressure that the lead-in wire that liquid resin docking share applies little, can the advantage of slimming etc. of corresponding sealing resin.In compression forming, as the raw material of liquid resin, use powdery or granular resin seal material that thermosetting resin constitutes or be aqueous resin seal material (fluid resin) at normal temperatures.
The present invention with use the powdery that constituted of thermosetting resin or granular resin seal material situation as object.The die cavity supply resin seal material of the shaping mould with resin sealing apparatus, by the heater heated resin sealing material being arranged in shaping mould and make it melt, generates and has the molten resin (hereinafter referred to as " liquid resin ") of mobility.By continuing heating liquid resin and making it solidify, thus in die cavity, form the sealing resin that solidification resin is constituted.
But, in this technical field, following demand is more and more stronger.First demand is for the electronic unit as finished goods (hereinafter referred to as " electronic device ".) the demand of so-called compactization.Therewith, the demand of the slimming of the path of lead-in wire and sealing resin is stronger.Second demand is accompanied by widely used LED and the demand that produces, the most as follows.That is, among electronic device in luminescent device with LED as representative, use the sealing resin with light transmission, but this sealing resin can damage optical characteristics during entrapped air pockets (space).Second demand is to require to there is not bubble in luminescent device in sealing resin.
Patent documentation 1: JP 2007-125783 publication (page 5～9, the 1st figure)
The raw material of the resin sheet of the resin seal material of transfer molding it is normally used as raw-material powdery or the granular resin seal material of sealing resin, generally conversion.Resin sheet is by being cylindric as raw-material powdery or granular resin seal material by briquetting thus is formed.In transfer molding, it is heated by the resin sheet being supplied to be referred to as in the columnar space of pot and melts thus generate molten resin.The molten resin generated is pressed by plunger and injects in die cavity.The molten resin injected in die cavity solidifies by being heated.By operation so far, form the sealing resin that solidification resin is constituted.
In transfer molding, it is heated in pot by columned resin sheet thus generates molten resin.Therefore, for as the raw-material powdery of resin sheet or granular resin seal material, not it require that the deviation of particle diameter (particle footpath) is little.Thus, the powdery used in compression forming as the raw material of resin sheet or the particle diameter of granular resin seal material have relatively large deviation as a rule.In addition, in present specification, " powdery or granular " this term includes the uncertain shape (such as, twisted shape, irregular shape, have irregular shape) etc. of the shape of micropowder shape, graininess, granular, corynebacterium, bulk, platelet-like, similar ball.After, the general name as " powdery or granular resin seal material " suitably uses this term of granular resin.
But, the inventor of the invention involved by the application etc. finds situations below.First particle diameter being the discovery that resin seal material has from the biggest deviation of μm level to 2～3mm degree.
Second is the discovery that and uses when having the resin seal material of above-mentioned big deviation, and the resin seal material being supplied in die cavity has the tendency being configured to speckle shape (unequally chaotic) on die cavity bottom surface (inner bottom surface in die cavity).Notable especially with this tendency during the encapsulation that desired value t is t=0.2～0.3mm degree of the thickness (referring to the size of upper surface from the upper surface of base main body to sealing resin) of the resin seal material sealing resin to be manufactured with big deviation, in this case, the resin seal material should being supplied in die cavity is a small amount of and causes that to be configured to plaquelike tendency strong.In this case, about particle diameter, there is the resin seal material of big deviation to configure unevenly on die cavity bottom surface.Thus causing in die cavity, in the liquid resin that resin seal material molten generates, during dipping chip, the liquid resin of uneven existence can flow.The flowing of liquid resin becomes the reason being not filled by generations such as (in other words bubbles) in the deformation of lead-in wire, sealing resin.
3rd is the discovery that when there is the granular resin seal material with prominent big particle diameter (such as, 10t degree: t is the desired value of the thickness of sealing resin as above), meeting and wire contacts in the stage that this resin seal is the most melted with material.This cause the deformation of lead-in wire with contacting of lead-in wire.
4th is the discovery that when resin seal material is supplied in die cavity by combination baffle and slit parts (for example, referring to patent documentation 1), the existence of the resin seal material with prominent big particle diameter causes the increase of the weight of liquid resin.Accordingly, the deviation of the thickness t of the sealing resin in encapsulation becomes big.
5th is the discovery that according to resin seal properties of materials, has the resin seal material of small particle when being fed in die cavity, it is possible to be attached to the place that original resin seal material should not exist.This density hour being attached to resin seal material, causes by having the resin seal material of small particle and swimming.It addition, this resin seal material that is attached to is when being prone to charged, cause by having the resin seal material static electrification of small particle.The attachment to unexpected place of the resin seal material causes following drawback.First drawback is that resin sealing material configures unevenly on die cavity bottom surface.Second drawback is the pollution of shaping mould.3rd drawback is the generation of the resin burr that poor register causes.
Summary of the invention
The problem that invention involved by the application to be solved is the drawback of the increase etc. of the deviation of the thickness t eliminating the generation of bubble in the deformation of lead-in wire that the deviation as the raw-material powdery of sealing resin or the particle diameter of granular resin seal material causes, sealing resin, sealing resin.
In order to solve above-mentioned problem, resin seal material involved in the present invention, the raw material of sealing resin it is normally used as when using the shaping mould being arranged at the compression forming that resin sealing apparatus has die cavity, by sealing resin, electronic unit is carried out resin seal, comprising resin material is powdery or granular resin seal material, described resin seal material is characterised by, desired value t(mm at the thickness to sealing resin) set the particle diameter D of resin seal material in the case of the first specification and meet D≤a × t(mm) this second specification, first specification is 0.03(mm)≤t≤1.2(mm) (a is arithmetic number).
Additionally, the manufacture method of resin seal material involved in the present invention, it it is the raw material being normally used as sealing resin when using the shaping mould being arranged at the compression forming that resin sealing apparatus has die cavity, by sealing resin, electronic unit is carried out resin seal, in powdery or the manufacture method of granular resin seal material, the manufacture method of described resin seal material is characterised by, including: prepare at least to include in powdery or the operation of the raw material group of granular resin material, additive and filler；The operation of mixing raw material group；Mixing raw material group also generates the operation of the first intermediate materials；Pulverize intermediate materials and generate the operation of the second intermediate materials；Desired value t(mm at the thickness to sealing resin) set in the case of the first specification particle diameter D according to resin seal material as D≤a × t(mm) this second specification (a is as arithmetic number), sort the operation of the second intermediate materials；And material is defined as the operation of resin seal material in being judged as meeting the first specification of the second specification among raw material group, the first specification is 0.03(mm)≤t≤1.2(mm).
According to the present invention, be normally used as when electronic unit being carried out resin seal by sealing resin the raw-material resin seal material of sealing resin meet below first, second specification.I.e., in the present invention, desired value t(mm at the thickness to sealing resin) set the first specification in the case of, the particle diameter D of resin seal material meets D≤3.0 × t(mm) this second specification.These specifications calculate projected area by the image obtained according to shooting resin seal material, process the area equivalent circular diameter of this projected area as particle diameter D, thus are suitable for.These specifications are met by resin seal material, thus the generation of drawback that the existence of the suppression granular resin that has big particle diameter D relative to desired value t of thickness causes.By the first specification is set to 0.03(mm)≤t≤1.2(mm), thus suppress the effect of the generation of above-mentioned drawback to increase.
And then, according to the present invention, the resin seal material being supplied in resin sealing apparatus is according to the second specification D≤3.0 × t(mm relevant for the particle diameter D of resin seal material) this specification and be sorted.In the result of sorting is judged as the first specification of satisfied second specification, material is transported in shaping mould.Accordingly, in the case of supplying existing resin seal material, it is judged that the resin seal material constituted for material in the first specification of satisfied second specification is transported in shaping mould.Therefore, the generation of the drawback that the existence of the granular resin that suppression has big particle diameter D relative to desired value t of thickness causes.
And then, according to the present invention, the result of sorting is judged as that the outer material of specification being unsatisfactory for the second specification is crushed, and the outer material of the specification of pulverizing is sorted further.In the result of sorting is judged as the second specification of satisfied second specification, material is transported in shaping mould.Therefore, the generation of the drawback that the existence of the granular resin that suppression has big particle diameter D relative to desired value t of thickness causes.Further, resin seal material is effectively utilized.
Accompanying drawing explanation
(1)～(3) of Fig. 1 is in the manufacture method representing the resin sealing body using resin seal material involved in the present invention respectively, the synoptic diagram of the operation of the supply operation of resin seal material, the operation of heated resin sealing material and matched moulds shaping mould.
(1)～(4) of Fig. 2 be make liquid resin solidify under the state being illustrated respectively in matched moulds shaping mould operation, form the operation of die sinking shaping mould after sealing resin, the synoptic diagram of electronic device that the operation of the molded body singualtion that makes resin sealing body constitute and singualtion complete.
Fig. 3 is to represent the resin seal material for involved in the present invention, desired value t at the thickness of sealing resin is 0.19mm, in the case of quantity delivered w of resin seal material is 4.91g, investigate the explanatory diagram of the result of the experiment of the relation of the situation that four levels setting particle diameter configure unevenly with resin sealing material on die cavity bottom surface.
Fig. 4 is to represent the resin seal material for involved in the present invention, desired value t at the thickness of sealing resin is 0.32mm, in the case of quantity delivered w of resin seal material is 7.91g, investigate the explanatory diagram of the result of the experiment of the relation of the situation that four levels setting particle diameter configure unevenly with resin sealing material on die cavity bottom surface.
Fig. 5 is the top view of the example representing the resin sealing apparatus using resin seal material involved in the present invention.
Fig. 6 is the top view of another example representing the resin sealing apparatus using resin seal material involved in the present invention.
Symbol description
1 lower mold
2 upper molds
3 first feed units
4 die cavities
5 resin seal materials
6 mold release film
7 housing parts
8 cavity part
9 attraction channels (attraction unit)
10 heaters (heating unit)
11 seal members (exogenous QI isolation unit)
12 attraction channels (decompressing unit)
13 base main body
14 chips (electronic unit)
15 seal prebasal plate
16 lead-in wires
17 boundary lines
18 regions
19 housings
20 supply baffle plates
21 resettlement sections
22 molten resins
23 exogenous QI isolation spaces
24 gases etc. being discharged
25 sealing resins
26 molded bodys (resin sealing body)
27 rotating blades
28 electronic equipments
29 unit substrate
30 unit sealing resins
31 materials receive unit
32,59 resin material processing unit
33 forming units
34 molded body allocation units
35,57 substrates receive unit
36,58 resin materials receive unit
37 rail
38 main transport unit (the first transport unit)
39 substrate acceptance divisions
40 substrate conveying units
41 resin acceptance divisions
42 measurement unit
43 containers
44 first resin conveying units
45,49 baffle plates (separating element)
46 sorting units
47 pulverizing units
48 second resin conveying units (the second transport unit)
50 collecting unit of dust
51 chase keeper
52 second feed units
53 drawdown pumps (decompressing unit)
54 molded body conveying units
55 molded body containers
56 molded body resettlement sections
60 resin material unit
A1, A2 resin sealing apparatus
D particle diameter
The desired value of the thickness of t sealing resin
Detailed description of the invention
According to the present invention, the desired value at the thickness of sealing resin with its thickness is set to t(mm) 0.03(mm)≤t≤1.2(mm) in the case of this first specification, the second specification D≤3.0 × t(mm that particle diameter (particle footpath) D according to resin seal material is relevant), the resin seal material should being supplied in the shaping mould of resin sealing apparatus is sorted.In the result of sorting is judged as the first specification of satisfied second specification, material is transported in shaping mould.On the other hand, the result of sorting is judged as that the outer material of specification being unsatisfactory for the second specification is crushed, and the outer material of the specification of pulverizing is sorted.In the result of sorting is judged as the second specification of satisfied second specification, material is transported in shaping mould.
[embodiment 1]
With reference to Fig. 1～Fig. 4, the method for resin-sealing and resin sealing apparatus using resin seal material involved in the present invention is illustrated.Additionally, for ease of understanding, the most suitably omit for any accompanying drawing in present specification or schematic representation turgidly.For the symbol that identical structural element mark is identical, suitably omit the description.
As shown in (1) of Fig. 1, the resin sealing apparatus of resin seal material involved in the present invention is used to have lower mold 1 and upper mold 2.Lower mold 1 and upper mold 2 collectively form shaping mould.The first feed unit 3 of supply resin seal material (aftermentioned) movably it is provided with between lower mold 1 and upper mold 2.The die cavity 4 that recess is constituted it is provided with in lower mold 1.First feed unit 3 is by powdery or granular resin seal material 5 is supplied in die cavity 4.That is, die cavity 4 is the space that resin seal material 5 should be supplied to.Mold release film 6 is supplied to when being stretched between lower mold 1 and upper mold 2.
Lower mold 1 can relatively lift with upper mold 2.Accordingly, lower mold 1 and upper mold 2 are relatively close to also matched moulds, and are relatively far from and die sinking.Figure 1 illustrates lower mold 1 to be made up of housing parts 7 and cavity part 8, housing parts 7 are by elastomeric element (volute spring etc.；Not shown) example that is elastically supported.Housing parts 7 constitute the side of die cavity 4, and cavity part 8 constitutes the bottom surface of die cavity 4.Being not limited to this, die cavity 4 can also be carved in the lower mold 1 being wholely set.Replace housing parts 7 to be elastically supported, or on this basis, cavity part 8 can also be elastically supported by elastomeric element.
Lower mold 1 is provided with that be close to for the profile attracting mold release film 6 to make it with lower mold 1, in other words for mold release film 6 being adsorbed in the attraction channel 9 of the profile of lower mold 1.Downward two arrow described two attraction channels 9 respectively in FIG illustrates that outside attracting mechanism (not shown) attracts the appearance of mold release film 6.The heater 10 of heated resin sealing material 5 it is provided with in lower mold 1.Additionally, the heater being arranged in cavity part 8 not shown.
In the face (hereinafter referred to as " profile of upper mold 2 ") opposed with lower mold 1, in the way of overlooking encirclement die cavity 4, it is provided with seal member 11 in upper mold 2.The profile of upper mold 2 is overlooked and is provided with the attraction channel 12 attracting to include the gas in the space of die cavity 4 in the inner side of seal member 11.
The prebasal plate 15 that seals being provided with multiple chip 14 in base main body 13 is fixed in upper mold 2 by known methods such as absorption.Seal prebasal plate 15 to include die cavity 4 in vertical view completely and to be positioned at seal member 11 and fixed in the way of the inner side of attraction channel 12.The electrode of base main body 13 is electrically connected by lead-in wires 16 such as gold threads with the electrode of chip 14 (the most not shown).Base main body 13 is divided into multiple region 18 by the cancellate boundary line 17 of virtual setting.One or more chip 14 is installed in each region 18.
First feed unit 3 has a housing 19 and opening and closing is arranged on the supply baffle plate 20 of bottom of housing 19 freely.When supply is closed with baffle plate 20, the resettlement section 21 containing resin seal material 5 is formed at the inner side of housing 19.
Resin seal material 5 involved in the present invention is illustrated.Resin seal material 5 manufacture as follows.First, prepare at least to include the raw material group of the filler (filler) that powdery or granular resin material, additive and silicon dioxide etc. that heat reactive resin constitutes constitute.Then, mixing raw material group generate the first intermediate materials.Then, pulverize the first mixing intermediate materials and generate the second intermediate materials.Then, the second intermediate materials is sorted according to the specification of regulation.In being judged as the first specification of the specification of satisfied regulation among second intermediate materials, material is defined as resin seal material 5.
Epoxy system resin or silicon system resin can be included as resin material.When using resin seal with material 5 for the purpose of manufacture optics, resin material has light transmission.And then, when using resin seal with material 5, can also be containing fluorophor as additive in resin seal material 5.
In the present invention, use resin seal material 5, form solidification resin and constitute the sealing resin of desired value t with thickness.As the specification (the first specification) of desired value t of thickness, such as, consider that the demand of compactization for electronic device in recent years is set to 0.1(mm)≤t≤1.2(mm).When considering the relevant more intensive demand of compactization, the first specification is preferably 0.05(mm)≤t≤1.2(mm), more preferably 0.05(mm) and≤t≤1.0(mm).Purposes according to electronic device considers that when chip thickness is 15 this prediction of μm degree, the first specification is preferably 0.03(mm)≤t≤1.0(mm).And then, it is considered to include that when effectively utilizing of material, the first specification are preferably 0.03(mm)≤t≤1.2(mm).From the point of view of this viewpoint of the demand of actuality, the first specification is preferably 0.2(mm)≤t≤1.0(mm).
Resin seal material 5 meets the 0.03(mm that particle diameter (particle footpath) D is relevant to the desired value of the thickness of sealing resin)≤D≤3t(mm) specification (the second specification) of this regulation.This second specification is preferably 0.05(mm)≤D≤2t(mm).About resin seal these relevant second specifications of material 5, will be described in detail later.In present specification, the particle diameter D of resin seal material 5 refers to the area equivalent circular diameter of the projected area by these particles in the image that optical unit photographs resin seal material 5 obtains.Specifically, calculate projected area according to the image that shooting resin seal material 5 obtains, the area equivalent circular diameter of these projected areas is processed as particle diameter D.Particle diameter D it is conveniently shown in (1) of Fig. 1.
Additionally, the situation of the particle diameter D that the unit that the centrifugal force produced by other unit beyond optical unit, such as air-flow, screen cloth etc. are known measures resin seal material 5 is illustrated.In this case, measured value A of the particle diameter D measured by above-mentioned optical unit is the most different from measured value B of the particle diameter D measured by other unit.It is therefore preferred that researching determining value A is relevant to measured value B in advance, it is correlated with according to this and determines the second new specification.Preferably, replace existing second specification to use the second new specification, according to this second new specification, the particle diameter D of resin seal material 5 is judged.
Hereinafter, the resin seal material 5 involved by the application of the invention is carried out resin seal to chip 14 thus manufactures the manufacture method of the resin sealing body of resin sealing body, see figures.1.and.2 and illustrate.The manufacture method of the electronic device continue the molded body to resin seal chip 14 formation, in other words being manufactured electronic device by resin sealing body illustrates.
Supply mold release film 6 stretched over as shown in (1) of Fig. 1, between lower mold 1 and upper mold 2, to die cavity 4.Then, by attraction channel 9 to the bottom surface of die cavity 4 attraction mold release film 6.Accordingly, make mold release film 6 be adsorbed in and constitute the profile of die cavity 4 (hereinafter referred to as " cavity surface ".) whole.At least to the stage of lower mold 1 after resin seal chip 14 with upper mold 2 die sinking, continue absorption mold release film 6.Additionally, in present specification, for convenience, the space should being supplied to for the resin seal material 5 when whole of cavity surface absorption mold release film 6 is also referred to as " die cavity ".
Then, make the first feed unit 3 enter between lower mold 1 and upper mold 2, above die cavity 4, stop the first feed unit 3.Then, open up supply baffle plate 20 in the right and left of accompanying drawing, die cavity 4 is supplied resin seal material 5.
Then, as shown in (2) of Fig. 1, heater 10 is used to heat the resin seal material 5 being supplied in die cavity 4.Accordingly, the first feed unit 3 is made to melt and generate liquid resin (molten resins 22 of (3) of reference Fig. 1).Parallel with heated resin sealing material 5, make upper mold 2 decline.In addition it is also possible to make lower mold 1 rise.Mainly lower mold 1 and upper mold 2 relatively close to.
Then, as shown in (3) of Fig. 1.Making upper mold 2 decline further makes the lower end of seal member 11 contact with the profile of lower mold 1.Accordingly, formation includes the space of die cavity 4 and the exogenous QI isolation space 23 of the external environment with shaping mould.Using the decompressing unit (not shown) such as the drawdown pump (air pump) of the outside being arranged on shaping mould, decompression tank, reduces pressure in the exhausted space of external air bound 23.Accordingly, will be contained in the exogenous QI small particle completely cutting off in space 23 and the gas etc. being included in exogenous QI isolation space 23 and molten resin 22 and be discharged to the outside of shaping mould.Two arrows upwards illustrated near attraction channel 12 in (3) of Fig. 1 represent gas of the outside being discharged to shaping mould by decompression etc. 24.Preferably touch lower mold 1 in the profile from the lower end of seal member 11 Yu lower mold 1 and start, under the state of the complete matched moulds of upper mold 2 (middle matched moulds state), the operation that the exhausted space of external air bound 23 carries out reducing pressure.Additionally, it is preferred that until molten resin 22 completely crued period performs the operation that the exhausted space of external air bound 23 carries out reducing pressure.
Then, as shown in (1) of Fig. 2, continue to make upper mold 2 decline.Accordingly, molten resin 22 impregnates chip 14 and lead-in wire 16(soaks), complete matched moulds lower mold 1 and upper mold 2.Under the lower mold 1 state (complete matched moulds state) with the complete matched moulds of upper mold 2, continue to add hot-melt resin 22 while upper mold 2 pressurizing melting resin 22 by lower mold 1.Accordingly, make molten resin 22 solidify, as shown in (2) of Fig. 2, form the sealing resin 25 that solidification resin is constituted.
Then, as shown in (2) of Fig. 2, upper mold 2 is made to rise die sinking lower mold 1 and upper mold 2.Then, outside the molded body 26 that the resin sealing body (sealing metacoxal plate) with base main body 13, chip 14, lead-in wire 16 and sealing resin 25 is constituted being fetched into shaping mould.By operation up to the present, the operation that the multiple chips 14 being installed on base main body 13 are carried out resin seal completes, and multiple chips 14 molded body 26 sealed by resin completes.
Then, as shown in (3) of Fig. 2, use the method that adhesive film or absorption etc. are known, molded body 26 is fixed on workbench (not shown).Use rotating blade 27, completely cut through molded body 26(along each boundary line 17 and entirely cut).Specifically, respectively along each boundary line 17 and each boundary line 17 of Y-direction of the X-direction in (3) of Fig. 2, molded body 26 is completely cut through.Accordingly, the singualtion (singulation) of molded body 26 is performed.By operation up to the present, molded body 26 is singulated in units of each region 18, manufactures the electronic device 28 shown in (4) of Fig. 2.Each electronic device 28 has the unit sealing resin 30 that unit substrate 29, chip 14, lead-in wire 16 and the sealing resin 25 that base main body 13 is unit singualtion with each region 18 is unit singualtion with each region 18.
Additionally, in the operation making molded body 26 singualtion, replace entirely cutting, it is also possible to after the midway of the thickness direction of molded body 26 forms groove (after hemisection) molded body 26 is applied external force and singualtion.Replace rotating blade 27, it is also possible to use laser, water jet, rope saw etc..
Hereinafter, for resin seal material 5 involved in the present invention, the specification of the regulation relevant to desired value t of the thickness of sealing resin 25 to particle diameter D illustrates.First, the lower limit of the second specification that the particle diameter D of resin seal material 5 sets is illustrated.The lower limit of second specification of particle diameter D when desired value t of the thickness of sealing resin 25 is big certainly the most much less, even if in desired value t hour of thickness of sealing resin 25 in principle without determining.But, according to resin seal properties of materials, swim because of resin seal material or charged cause, it may occur that resin seal material 5 is attached to this problem of place that original resin seal material 5 should not exist.In order to prevent this problem, the lower limit of second specification of the particle diameter D of resin seal material 5 is preferably the biggest value.Rule of thumb, when having distinguished the value of particle diameter D less than 0.05mm, when supplying or transport resin seal material 5, it is prone to occur above-mentioned swimming or charged etc..And then, when having distinguished the value of particle diameter D less than 0.03mm, it is easier to above-mentioned swimming or charged etc. occurs.According to these items, about the lower limit of second specification of particle diameter D, it may be said that be preferably more than 0.03mm, more preferably more than 0.05mm.Therefore, when the lower limit of the second specification of particle diameter D is set, it is defined as 0.03(mm as lower limit)≤D, it is preferably determined as 0.05(mm)≤D.
Then, the upper limit of the second specification that particle diameter D sets is illustrated.About the upper limit of the second specification, determined by following sequence.As first order, on the basis of the specific range set of multiple (the present embodiment is as a example by four) of the level as particle diameter D is particle diameter D, sorting resin seal material 5 so that particle diameter D fall into setting specific in the range of.Additionally, these specific scopes are different from the second above-mentioned specification.As the second order, set by desired value t(mm of the thickness as sealing resin 25) two level values constituting of suitable value.Additionally, these level values are different from the first above-mentioned specification.As the 3rd order, calculate weight w(g of the resin seal material 5 corresponding with desired value t of the thickness of each sealing resin 25), the resin seal material 5 of this weight is dispersed in actual evaluation die cavity (planar dimension: 233 × 67mm).The resin seal material 5 measuring distribution covers the ratio of this die cavity bottom surface (hereinafter referred to as " resin occupation rate " optically.).As the 4th order, to when using this resin seal by material 5 resin seal, the resin occupation rate of which kind of degree then can allow the deviation etc. of the thickness of the sealing resin 25 of reality to be evaluated.According to above four orders, about the resin seal particle diameter D of material 5, determine the upper limit being considered the second specification that can be actually used.
Hereinafter, for determining the order of the upper limit of the second specification of the particle diameter D setting of resin sealing apparatus 5, illustrate with reference to Fig. 3 and Fig. 4.As the first order, sort resin seal material 5, prepare particle diameter D and respectively fall in as resin seal material Ma, Mb, Mc, the Md in the specific scope 1～4 of four levels.Wherein, specific scope 1 is D=1.0～2.0(mm), specific scope 2 is D=0.2～2.0(mm), specific scope 3 is D=0.2～1.0(mm), specific scope 4 is D=0.2～0.4(mm).
Resin seal material Ma:D=1.0～2.0(mm)
Resin seal material Mb:D=0.2～2.0(mm)
Resin seal material Mc:D=0.2～1.0(mm)
Resin seal material Md:D=0.2～0.4(mm)
As the second order, set t=0.19(mm) and two level values t=0.32(mm) as the desired value of the thickness of sealing resin 25.T=0.19(mm) this level value is the level value considering requirements set to compactization of electronic device 28 in recent years.
As the 3rd order, in above-mentioned two level value (desired value of the thickness of sealing resin 25 is t=0.19(mm) and 0.32(mm)) in the case of, calculate the weight of the resin seal material 5 the most corresponding with this desired value t.The weight calculated is in level value 1(desired value t=0.19(mm)) time be 4.91(g), in level value 2(desired value t=0.32(mm)) time be 7.91(g).Additionally, the value of calculation (theoretical value) when the value of above-mentioned weight is to be provided with chip 14.
Additionally, in an experiment, it is not installed on the state of base main body 13 at chip 14, in other words with virtual substrate as object, supplies resin seal material 5.As actual quantity delivered w, replace be equivalent to level value 1(desired value t=0.19(mm)) time w=4.91(g), by w=6.03(g) resin seal material 5, additionally, replace be equivalent to level value 2(desired value t=0.32(mm)) time w=7.91(g), by w=10.16(g) resin seal material 5 be dispersed in respectively in evaluation die cavity.
Continue, as the 3rd order, to prepare to be equivalent to quantity delivered w=4.91(g) resin seal material Ma, Mb, Mc, Md of resin seal material 5, these are dispersed in evaluation die cavity successively.Similarly, prepare to be equivalent to quantity delivered w=7.91(g) resin seal material Ma, Mb, Mc, Md of resin seal material 5, these are dispersed in evaluation die cavity successively.The resin seal state of material 5 spread from the shooting of the top of evaluation die cavity.The image obtained by shooting is carried out binary conversion treatment, calculates the resin occupation rate of resin seal material 5.Specifically, in the image with 256 gray scales (using rank 0 as black, using rank 255 as white), rank 25 is carried out binary conversion treatment as threshold value to image.In binary image, rank less than 25 is judged as " there is resin seal material ", calculates the area ratio of the part that there is resin seal material on the bottom surface of evaluation die cavity.
In quantity delivered w=4.91(g shown in (1)～(4) of Fig. 3) in the case of, the state being scattered with resin seal material Ma～Md respectively is carried out image and the pie chart of resin occupation rate that binary conversion treatment obtains.In quantity delivered w=7.91(g shown in (1)～(4) of Fig. 4) in the case of, the state being scattered with resin seal material Ma～Md respectively is carried out image and the pie chart of resin occupation rate that binary conversion treatment obtains.
As the 4th order, use four kinds of resin seal material Ma～Md shown in (1)～(4) of Fig. 3, molded target value t=0.19(mm) sealing resin 25(with reference to the 2(2 of figure)).According to this result, the situation of (1)～(3) of Fig. 3 is judged as not allowing as sealing resin 25, and the situation of (4) of Fig. 3 is judged as having surplus and allows as sealing resin 25.
According to the result shown in Fig. 3, first, the particle diameter D(mm as to resin seal material 5) lower limit of the second specification that sets judges D=0.2(mm) appropriate.Lower limit D=1.0(mm as the second specification) time, owing to resin sealing material 5 is configured to plaquelike tendency strong (with reference to (1) of Fig. 3) on the bottom surface of evaluation die cavity, therefore specify that and do not allow as sealing resin 25.
According to the result shown in Fig. 3, second, the particle diameter D(mm of resin seal material 5) the upper limit anticipation of the second specification be present in D=0.4(mm) above 1.0(mm) in following scope.The scope setting second specification of such particle diameter D is at the particle diameter D(mm of resin seal material 5) (4) as the situation shown in (3) for Fig. 3 among the situation of 0.2mm and Fig. 3 of the lower limit of the second specification shown in situation between, resin occupation rate is equivalent to the scope of less than more than 41% 84%.
Continue, as the 4th order, to use four kinds of resin seal material Ma～Md shown in (1)～(4) of Fig. 4, desired value t=0.32(mm of molding thickness) sealing resin 25(with reference to (2) of Fig. 2).Based on this result, it is judged as not allowing as sealing resin 25 during state shown in (1), (2) for Fig. 4, is judged as allowing as sealing resin 25 during state shown in (3), (4) for Fig. 4.And then, it is judged as the boundary allowed during state shown in (3) for Fig. 4.Therefore, according to the result shown in Fig. 4 ((3) of particularly Fig. 4), the particle diameter D(mm at resin seal material 5) the lower limit of the second specification be 0.2mm in the case of, the upper limit as the second specification estimates D=1.0(mm) be suitable.The D=1.0(mm of the upper limit as the second specification) this value is equivalent to desired value t=0.32(mm of the thickness for sealing resin 25), this relation of D/t=3.125.Additionally, in the situation (D=0.2～1.0mm) of state shown in (3) for Fig. 4, resin occupation rate is 72%.
Continue as the 4th order, the particle diameter D(mm according to being equivalent to according to Fig. 4 presumption) the upper limit (D=1.0(mm) of the second specification) resin occupation rate (72%), the particle diameter D(mm in the case of shown in Fig. 3) the upper limit of the second specification study.Particle diameter D(mm in (3) of Fig. 3) it is D=0.2～1.0mm, resin occupation rate is 41%, particle diameter D(mm in (4) of Fig. 3) and it is D=0.2～0.4mm, resin occupation rate is 84%.When calculating the situation that resin occupation rate is 72% between these in proportion, as particle diameter D(mm) the upper limit of the second specification, obtain D=0.567mm.This value of D=0.567mm is equivalent to the situation that resin occupation rate is 72%, and is equivalent to desired value t=0.19(mm of thickness for sealing resin 25), this relation of D/t=2.99.
In sum, about to particle diameter D(mm) the second specification of setting, the lower limit of the second specification is desired value t(mm of the thickness of the upper limit and the sealing resin 25 of the second specification in the case of 0.2mm) relation (D/t) be D/t=2.99 in the situation that situation is D/t=3.125, Fig. 4 of Fig. 3.According to these items, about particle diameter D(mm) desired value t(mm of thickness of the upper limit and sealing resin 25 of the second specification) relation, it is judged that D/t=3.0 is about appropriate.
Additionally, the situation of (4) of Fig. 3 is judged as that having surplus allows as sealing resin 25.According to this item, it is judged that the situation shown in (4) of preferably Fig. 3, i.e. to particle diameter D(mm) desired value t(mm of the upper limit of the second specification that sets and the thickness of sealing resin 25) relation asSituation.Accordingly, with respect to particle diameter D(mm) desired value t(mm of thickness of the upper limit and sealing resin 25 of the second specification) preferred relation, it is judged that D/t=2.0 is about appropriate.
According to explanation up to the present, about particle diameter D(mm) it may be said that following specification is appropriate.First, be 0.03(mm during the lower limit of the second specification that particle diameter D is set)≤D, preferably 0.05(mm)≤D.Second, as the upper limit of second specification of particle diameter D, with desired value t(mm of the thickness of sealing resin 25) relation be D≤3.0 × t, preferably D≤2.0 × t.
Therefore, to particle diameter D(mm) the second specification of setting is as follows.That is, the second specification becomes particle diameter D and desired value t(mm of the thickness of sealing resin 25) relevant D≤3.0 × t(mm) this specification.This second specification is preferred from the point of view of earning rate (effective rate of utilization) this viewpoint improving resin seal material 5.On the other hand, from from the point of view of thinner electronic device 28 this viewpoint corresponding, preferably D≤2.0 × t(mm) this second specification.Swimming and time these second specifications are arranged this viewpoint charged lower limit according to suppression resin seal material 5, additional 0.03(mm) this specification of≤D or 0.05(mm) this specification of≤D.
Resin seal involved by the present embodiment material 5, to meet 0.03(mm as the specification of desired value t of the thickness of sealing resin 25 (the first specification))≤t≤1.2(mm) this specification (preferably 0.05(mm)≤t≤1.0(mm) this specification) premised on, meet the second following specification.This is that particle diameter D is relevant to desired value t of the thickness of sealing resin 25, D≤3.0 × t(mm) this second specification.From with from the point of view of thinner electronic device 28 this viewpoint corresponding, preferably D≤2.0 × t(mm) this second specification.When these second specifications are arranged lower limit, additional 0.03(mm) this specification of≤D or 0.05(mm) this specification of≤D.
Meet these specifications by resin seal material 5, thus obtain following effect.First, though desired value t hour of the thickness at sealing resin 25, even if in the case of the resin seal material in other words in being supplied to die cavity 45 is a small amount of, resin seal material 5 also can be suppressed to configure unevenly on die cavity bottom surface.Accordingly, in Fig. 1, the die cavity 4 shown in 2, the melted liquid resin 22 generated of suppression resin seal material 5 flows.Therefore, the deformation of suppression lead-in wire 16, the generation being not filled by etc. in sealing resin 25.
Second, the upper limit of particle diameter D is controlled as suitable value.Therefore, the generation of the drawback that the existence of the granular resin that suppression has big particle diameter relative to desired value t of thickness causes.Specifically, the deviation of the thickness of the sealing resin in suppression encapsulation.
3rd, suppress to be adhered to unexpected place by that there is the resin seal material 5 of small particle swim or caused by static electrification, resin seal material 5.Therefore, the generation of the drawback that the attachment of this resin seal material 5 causes is suppressed.
Additionally, in present specification, it is not meant to the lower limit of the second specification that particle diameter D sets get rid of the resin seal material 5 including the particle diameter D less than this lower limit.It practice, conveyance or metering resin seal with material 5 during, rupture because of resin seal material 5 or breach likely generate small powder body or plastochondria (micropartical that resin seal material 5 causes, hereinafter referred to as " resin system micropartical ".).This resin system micropartical likely has the particle diameter D that the lower limit of the second specification than particle diameter D is little.Therefore, it is judged as that it is ill-considered for being not belonging to resin seal material 5 with the resin system micropartical that there is the little particle diameter D of the lower limit with the second specification than particle diameter D for reason.
[embodiment 2]
An embodiment with reference to the Fig. 5 resin sealing apparatus to using resin seal material 5 involved in the present invention illustrates.As it is shown in figure 5, resin sealing apparatus A1 possesses material receives unit 31, resin material processing unit 32, multiple (in Fig. 5 two) forming unit 33 and molded body allocation unit 34.Material receives the resin material of substrate reception unit 35 and reception resin seal material 5 that unit 31 possesses reception sealing prebasal plate 15 and receives unit 36.From material receive unit 31 successively via resin material processing unit 32 and multiple forming unit 33 to molded body allocation unit 34, be provided with rail 37.Main transport unit 38 it is provided with in rail 37.Main transport unit 38 can be along rail 37 transversely moving at accompanying drawing.Additionally, forming unit 33 can also be single.
Material reception unit 31 has the substrate acceptance division 39 of the external reception sealing prebasal plate 15 from resin sealing apparatus A1 and the prebasal plate 15 that seals received is transported to the substrate conveying unit 40 main transport unit 38.Resin material reception unit 36 has the measurement unit 42 of the weight and volume etc. of the resin acceptance division 41 of the external reception resin seal material 5 from resin sealing apparatus A1 and the resin seal material 5 of metering reception.Resin seal material 5 after the resin seal material 5 that should measure or metering is such as housed in the container 43 of the compositions such as pallet.The resin seal material 5 being housed in container 43 is transported in main transport unit 38 with each container 43 by the first resin conveying unit 44.
Substrate receive unit 35 and resin material reception unit 36 preferably when the first resin conveying unit 44 is retreated baffle plate 45 as desired by opening and closing separate.Accordingly, suppression comprises resin system atomic micropartical intrusion substrate reception unit 35.
Use the resin seal involved by the present embodiment with in the resin sealing apparatus A1 of material 5, use relevant the first following structure of resin material processing unit 32.That is, in resin sealing apparatus A1, resin material processing unit 32 is adjacent with material reception unit 31 and detachably arranges.By using this first structure, resin material processing unit 32 is installed on resin sealing apparatus A1 as required, or dismantles from resin sealing apparatus A1 as required.
Resin material processing unit 32 has the sorting unit 46 of the second specification sorting resin seal material 5 according to particle diameter D and the result of pulverizing sorting is judged as that particle diameter is more than the pulverizing unit 47 of the outer material of specification of the second specification.And then, resin material processing unit 32 has conveyance resin seal material 5 and the second resin conveying unit 48 of the outer material of specification between resin acceptance division 41 and sorting unit 46 and pulverizing unit 47.
Use as the known unit such as sorting unit 46, such as selection or the optical unit of proper combination, the centrifugal force of air-flow generation, screen cloth.As pulverizing unit 47, such as, use the known unit such as stirring, roller mill.Sorting unit 46 and pulverizing unit 47 are included in resin material processing unit 32.
Receive unit 35 to prevent resin system micropartical from invading substrate, following structural element is preferably set in resin material processing unit 32.These structural elements include cooperating with baffle plate 45 and will include that resin material receives unit 36 and sorting unit 46 and the space of pulverizing unit 47 and the baffle plate 49 of other spaces isolation and the micropartical being present in the space completely cut off by baffle plate 45 and baffle plate 49 carries out attracting the collecting unit of dust 50 of also dust.
As second specification of the particle diameter D being suitable in sorting unit 46, can be associated with the first specification that desired value t of the thickness to sealing resin 25 sets and use following specification.As the first specification of desired value t of thickness, for example with 0.03(mm)≤t≤1.2(mm) this specification (preferably 0.05(mm)≤t≤1.0(mm) this specification).As the second specification of the specific range set to particle diameter D, for example with 0.03(mm)≤D≤3.0 × t(mm) this specification (preferably 0.05(mm)≤D≤2.0 × t(mm) this specification).
Multiple forming units 33 are respectively provided with following structural element.That is, as structural element enumerate be chase keeper 51, be installed on chase keeper 51 have the lower mold 1 of die cavity 4 and lower mold 1 opposite disposed be fixed with seal in upper mold 2(Fig. 5 of prebasal plate 15 not shown), to the second feed unit 52 supplying and winding mold release film 6 between lower mold 1 and upper mold 2 and the drawdown pump 53 reduced pressure in the exogenous QI isolation space (exogenous QI shown in (3) with reference to Fig. 1 completely cuts off space 23) being formed between lower mold 1 and upper mold 2.
The molded body resettlement section 56 of the molded body container 55 of the compositions such as the molded body conveying unit 54 being provided with conveyance molded body 26 in molded body allocation unit 34 and the pallet being configured with collecting molded body 26.
Using the resin seal involved by the present embodiment with in the resin sealing apparatus A1 of material 5, on the basis of relevant aforesaid first structure of resin material processing unit 32, use relevant the second following structure of single or multiple (in Fig. 5 two) forming unit 33.I.e., the forming unit 33 in the left side shown in Fig. 5 is adjacent with resin material processing unit 32, and adjacent with the forming unit 33 on right side (in other words being clipped by the forming unit 33 of resin material processing unit 32 with right side), detachably arrange in resin sealing apparatus A1.It addition, the forming unit 33 on right side adjacent and adjacent with molded body allocation unit 34 with the forming unit 33 in left side (in other words being clipped with molded body allocation unit 34 by the forming unit 33 in left side), detachably arrange in resin sealing apparatus A1.
During additionally, be provided with single forming unit 33 in resin sealing apparatus A1, in resin sealing apparatus A1, this forming unit 33 is clipped installation by resin material processing unit 32 and molded body allocation unit 34.Assume to dismantle molded body allocation unit 34 from resin sealing apparatus A1, then can in resin sealing apparatus A1 with other forming units 33 of the adjacent handling in right side of this single forming unit 33.
The resin sealing apparatus A1 using the resin seal material 5 involved by the present embodiment has following effect.First, pulverize, by pulverizing unit 47, the result sorted by sorting unit 46 and be judged as being unsatisfactory for the outer material of specification of the second specification.The outer material of specification pulverized by sorting unit 46 sorting.In the result of sorting is judged as the second specification of satisfied second specification, material is transported in shaping mould.Therefore, it is possible to effectively utilize the resin seal material 5 being supplied in resin sealing apparatus A1.
Second, about resin material processing unit 32 by using the first structure, it is possible to as required, resin material processing unit 32 is installed on resin sealing apparatus A1 afterwards, or resin material processing unit 32 is dismantled from resin sealing apparatus A1 afterwards.Accordingly, can be according to the specification of resin seal material 5, desired value t(reference Fig. 2 of the thickness of the sealing resin 25 of electronic device 28) etc., resin sealing apparatus A1 is installed resin material processing unit 32 afterwards, and dismantles resin material processing unit 32 from resin sealing apparatus A1 afterwards.And then, it is possible to the resin material processing unit 32 dismantled from resin sealing apparatus A1 in the first factory is transplanted on and needs the second factory of this resin material processing unit 32, be installed on the resin sealing apparatus A1 that the second factory possesses.Therefore, use the electronic device 28(of resin sealing apparatus A1 with reference to (4) of Fig. 2) manufacturer can easily load and unload resin material processing unit 32 in resin sealing apparatus A1 according to the trend in market, resin seal material 5 and the change etc. of the specification of electronic device 28.
3rd, about each forming unit 33 by using aforesaid second structure, each forming unit 33 is installed on resin sealing apparatus A1 as required, or dismantles from resin sealing apparatus A1 as required.Hereby it is possible to according to the trend in market, the increase and decrease etc. of demand, resin sealing apparatus A1 is installed and sets up forming unit 33, and from resin sealing apparatus A1 dismounting forming unit 33 quantity that reduces forming unit 33.And then, it is possible to the forming unit 33 dismantled from resin sealing apparatus A1 in the first factory is transplanted on and is such as positioned at the second factory elsewhere in great demand, be installed on the resin sealing apparatus A1 that the second factory possesses.Therefore, use the electronic device 28(of resin sealing apparatus A2 with reference to (4) of Fig. 2) manufacturer can be easily adjusted the production capacity of electronic device 28 according to the increase and decrease etc. of the trend in market, demand.
4th, collecting unit of dust 50 is set, by baffle plate 45 with baffle plate 49 by including that resin material receives unit 36 and completely cuts off with the space of pulverizing unit 47 and other spaces with sorting unit 46, carries out attracting and dust to the resin system micropartical etc. in the space being present in isolation.Hereby it is possible to dust comprises the atomic micropartical of resin system.Therefore, it is possible to suppression is attached to seal the drawback that prebasal plate 15 grade occurs because comprising the atomic foreign body of resin system.
5th, by using mold release film 6 such that it is able to make molded body 26 easily from lower mold 1 demoulding (with reference to (2) of Fig. 2).And then, via mold release film 6, it is possible to fine concavo-convex be positively needed on sealing resin 25 by be arranged in cavity surface.By these items, manufacturing the electronic device 28((4) with reference to Fig. 2) time can improve quality.Particularly when manufacture has the optics including fine concavo-convex lens (such as, Fresnel Lenses etc.), it is possible to significantly improve quality.
6th, under middle matched moulds state, at least form exogenous QI isolation space 23, (with reference to (3) of Fig. 1) are reduced pressure in this exogenous QI isolation space 23.Accordingly, the generation of the bubble in suppression sealing resin 25.Therefore, manufacturing electronic device 28(with reference to (4) of Fig. 2) time can improve quality.When particularly manufacturing the optics of sealing resin 25 with light transmission, it is possible to significantly improve quality.
[embodiment 3]
Another embodiment with reference to the Fig. 6 resin sealing apparatus to using resin seal material 5 involved in the present invention illustrates.As shown in Figure 6, in resin sealing apparatus A2, use following first～the 3rd structure.
First structure is as follows.That is, the forming unit 33 in the left side shown in Fig. 6 receives unit 57 adjacent and adjacent with the forming unit 33 on right side (in other words being clipped by the forming unit 33 of substrate reception unit 57 with right side) with substrate, detachably arranges in resin sealing apparatus A2.It addition, the forming unit 33 on right side adjacent and adjacent with molded body allocation unit 34 with the forming unit 33 in left side (in other words being clipped with molded body allocation unit 34 by the forming unit 33 in left side), detachably arrange in resin sealing apparatus A2.
Second structure is as follows.I.e., during in the resin sealing apparatus A1 that figure 5 illustrates, resin material reception unit 36 is included in resin reception unit 31, on the other hand, in resin sealing apparatus A2, resin material receives unit 58 and receives unit 57 independently from substrate, is disposed adjacent with resin material processing unit 59.In figure 6, to receive unit 58 and resin material processing unit 59 adjacent on the above-below direction of accompanying drawing for resin material.Resin material receives unit 58 and collectively forms resin material unit 60 with resin material processing unit 59.And then, it is module independently that resin material receives unit 58 with resin material processing unit 59, it is possible to load and unload respectively in resin material unit 60.I.e., it is possible in the resin material unit 60 with resin material reception unit 58, resin material processing unit 59 is installed afterwards.
During additionally, be provided with single forming unit 33 in resin sealing apparatus A2, in resin sealing apparatus A2, this forming unit 33 is received unit 57 by substrate and clips installation with molded body allocation unit 34.Assume from resin sealing apparatus A2 dismounting resin material unit 60 and molded body allocation unit 34, then can in resin sealing apparatus A2 with other forming units 33 of the adjacent handling in right side of this single forming unit 33.
3rd structure is as follows.That is, during resin material unit 60 clips single or multiple forming unit 33(Fig. 6 in vertical view two), be arranged on and substrate receive unit 57 opposition side.Therefore, in resin sealing apparatus A2, the substrate of reception sealing prebasal plate 15 receives unit 57 and reception is sorted in powdery or granular resin seal material 5 is pulverized the resin material unit 60 of material outside specification as required and is positioned at farthest position.
According to the first structure, each forming unit 33 is installed on resin sealing apparatus A2 as required, or dismantles from resin sealing apparatus A2 as required.Therefore, use the electronic device 28(of resin sealing apparatus A2 with reference to (4) of Fig. 2) manufacturer can be easily adjusted the production capacity of electronic device 28 according to the increase and decrease etc. of the trend in market, demand.
According to the second structure, it is possible to install resin material processing unit 59 in the resin material unit 60 with resin material reception unit 58 afterwards.Therefore, the unit sealing resin 30(having along with electronic device 28 is with reference to (4) of Fig. 2) the change of technology trend of propelling etc. of slimming, according to the expectation of the manufacturer of electronic device 28, it is possible to add resin material processing unit 59 afterwards.
According to the 3rd structure, it is possible to prevent resin system micropartical etc. from invading substrate and receive unit 57.Therefore, it is possible to prevent from being attached to seal the drawback of generation such as prebasal plate 15 grade because comprising the atomic foreign body of resin system.
And then, owing to being provided with sorting unit 46 and pulverizing unit 47 in resin sealing apparatus A2, therefore as the situation of the resin sealing apparatus A1 shown in Fig. 5, it is possible to effectively utilize the resin seal material 5 being supplied in resin sealing apparatus A2.
Additionally, owing to being provided with collecting unit of dust 50, to include that resin material receives unit 58 and completely cuts off with the space of pulverizing unit 47 and other spaces with sorting unit 46 by baffle plate 45, carry out attracting and dust to the micropartical in the space being present in isolation, therefore as the situation of the resin sealing apparatus A1 shown in Fig. 5, it is possible to suppress to be attached to seal the drawback of generation such as prebasal plate 15 grade because comprising the atomic foreign body of resin system.
It addition, in resin sealing apparatus A2, owing to using mold release film 6, therefore with the situation of the resin sealing apparatus A1 shown in Fig. 5 as, at manufacture electronic device 28(with reference to (4) of Fig. 2) time can improve quality.
Additionally, in resin sealing apparatus A2, owing at least forming exogenous QI isolation space 23 under middle matched moulds state and (with reference to (3) of Fig. 1) reduced pressure in this exogenous QI isolation space 23, therefore as the situation of the resin sealing apparatus A1 shown in Fig. 5, manufacturing electronic device 28(with reference to (4) of Fig. 2) time can improve quality.
Additionally, in the resin sealing apparatus A2 that figure 6 illustrates, it is also possible to exchange molded body allocation unit 34 and the resin material plan-position of unit 60.When so exchanging, resin material unit 60 is adjacent with the forming unit 33 on the right side shown in Fig. 6, and adjacent with molded body allocation unit 34 (in other words, clipped by forming unit 33 and the molded body allocation unit 34 on right side), detachably arrange in resin sealing apparatus A2.
In present specification, the particle diameter D of explanation refers to the area equivalent circular diameter of the projected area by these particles in the image that optical unit photographs resin seal material 5 obtains.Therefore, with same resin seal material 5 as object, other algoscopys beyond the mensuration (calculating) of usable floor area equivalent diameter, such as when the mensuration of Feret's diameter, shading method or screening method etc. measure particle diameter D, it is possible to obtain from different for the particle diameter D measured value in present specification.When using other algoscopys to measure particle diameter D, replace with measured value when being measured by the algoscopy in present specification, it may be judged whether in second specification of the particle diameter D being included in present specification explanation.In other words, directly carry out contrasting the most appropriate by the second specification using the particle diameter D illustrated in the measured value that obtains of other algoscopys and present specification.
When measuring the resin seal particle diameter D of material 5, use the method for the resin seal material 5 being dispersed in pallet from top shooting, from side shooting from the method etc. of the resin seal material 5 of batcher free-falling.But, it is not limited to these.Particle diameter D can be measured for object with the total of all resin seal materials 5 to be supplied.Replace and this, additionally it is possible to from the resin seal material 5 to be supplied, extract a part of sample out, measure particle diameter D with this sample for object.
In explanation up to the present, to arranging the sorting unit 46 according to the second specification sorting resin seal material 5 that particle diameter D is set in the inside of resin sealing apparatus A1, A2 and pulverizing the result of sorting and be judged as that the example of the pulverizing unit 47 of material is illustrated outside specification big than the second specification for particle diameter D (reference Fig. 5,6).Be not limited to this, as variation, it is also possible to sorting unit and both pulverizing units are set in the outside of resin sealing apparatus.In this case, it is possible to the resin seal material 5 being sorted in advance the outside at resin sealing apparatus and pulverizing as required is supplied in resin sealing apparatus.
As other variation, it is also possible to arrange sorting unit in the inside of resin sealing apparatus, the pulverizing unit of the outer material of specification pulverizing the second specification being judged as being unsatisfactory for particle diameter D is set in the outside of resin sealing apparatus.The operation that outer for specification material is transplanted in pulverizing unit manually can be carried out by operator, it is possible to use the transport unit moved along track or the transport unit with the arm reciprocally rotated are carried out.
In the structure up to the present illustrated, replace supply baffle plate 20, it is also possible to the whereabouts mouth of resin seal material 5 is set in the first feed unit 3.In the structure shown here, make the first feed unit 3 move by making resin seal material 5 drop in die cavity 4, thus die cavity 4 is supplied resin seal material 5.As the resin seal whereabouts mouth of material 5, the whereabouts mouth of the shape with channel-shaped is the most nearly horizontally set.And then, preferably with in vertical view relative to the profile of die cavity 4, the track of whereabouts resin seal material 5 does not overlaps and disjoint mode makes the first feed unit 3 move.Further, preferably added the unit that shakes by use and whereabouts mouth is applied vibration so that resin seal material 5 vibrates the profile whereabouts resin seal material 5 for die cavity 4.
In the structure up to the present illustrated, it is also possible to use first, second following change structure.First change structure is the first feed unit arranging and having housing, in the way of covering housing and the inner side of housing in vertical view, the lower surface at the first feed unit adsorbs rectangular-shaped mold release film 6, the structure of the resettlement section constituting the space surrounded by housing and mold release film 6 supply resin seal material 5.According to this structure, resettlement section contains resin seal material 5, the first feed unit is made to move to the top of die cavity 4.While releasing the absorption for mold release film 6, the inner surface at die cavity 4 adsorbs mold release film 6.Accordingly, die cavity 4 is supplied mold release film 6 and resin seal material 5.
Second change structure is the first feed unit arranging and having recess, and recess is supplied resin seal material 5, and the upper surface at the first feed unit adsorbs rectangular-shaped mold release film 6, makes the structure of the first feed unit reversion.According to this structure, the first feed unit of reversion is made to move to the top of die cavity 4.While releasing the absorption for mold release film 6, the inner surface at die cavity 4 adsorbs mold release film 6.Accordingly, die cavity 4 is supplied mold release film 6 and resin seal material 5.
Time in two above-mentioned change structures to the first feed unit supply resin seal material 5, can use and add the unit that shakes.It addition, by the first feed unit whereabouts resin seal whereabouts mouth of material 5 is applied vibration such that it is able to make resin seal material 5 vibrate.Now, resin seal material 5 is preferably made to vibrate above the first feed unit, while to the first feed unit whereabouts resin seal material 5.
In explanation up to the present, to the conveyer of the conveyer with conveyance resin seal material 5 that conveyance is sealed prebasal plate 15 and molded body 26 collectively as the example of main transport unit 38 be illustrated (with reference to Fig. 5,6).Replace this structure, it is also possible to conveyance is sealed the conveyer of prebasal plate 15 and molded body 26 and the conveyer of conveyance resin seal material 5 as another set of system.
In explanation up to the present, the structure being provided with a composition pattern in a forming unit 33 is illustrated (with reference to Fig. 5,6).Replace this structure, it is also possible to two groups of composition patterns including lower mold 1 and upper mold 2 are prepared for a forming unit 33, be respectively configured a composition pattern two sections of epimere and hypomere.In the structure shown here, by making common mould switching mechanism action such that it is able to a composition pattern of matched moulds and die sinking epimere forms pattern with the one of hypomere substantially simultaneously.As common mould switching mechanism, such as, use the gear unit of the driving source such as servomotor, hydraulic cylinder and rack and pinion etc..According to this structure, it is capable of the production efficiency of twice when using the forming unit 33 with identical proprietary area.
In explanation up to the present, to use mold release film 6 embodiment be illustrated (with reference to (2) of Fig. 2,5,6).But, the combination of the physical property of physical property and the sealing resin 25 of the material used according to shaping mould, it is also possible to do not use mold release film 6.
In explanation up to the present, at least forming exogenous QI isolation space 23 under middle matched moulds state, the embodiment reducing pressure this exogenous QI isolation space 23 is illustrated (with reference to (3) of Fig. 1).But, according to relevant quality levels such as the bubbles that sealing resin 25 requires, it is also possible to do not implement to form exogenous QI isolation space 23 and is reduced pressure in this exogenous QI isolation space 23.
In explanation up to the present, as shown in (3), (4) of Fig. 2, make molded body 26 with each region 18 for unit singualtion.Such as, when the X-direction in (3) of Fig. 2 exists four regions 18 in existence four and Y-direction, molded body 26 monolithic turns to 16 electronic devices 28 being made up of respectively a region 18.But it is not limited to this, it is also possible to four common regions in X-direction one and Y-direction (hereinafter referred to as " 1 × 4 ".) make molded body 26 singualtion, or make molded body 26 singualtion with 4 × 1 common regions.In such manner, it is possible to manufacture four electronic devices 28 being made up of respectively four regions 18.And then, it is possible to make molded body 26 form monolithic with the region of 2 × 2, manufacture four electronic devices 28 being made up of four regions 18 respectively.Further, it is possible to from molded body 26, remove the unwanted part in end, make molded body 26 singualtion with the region of 4 × 4, manufacture the electronic device 28 being made up of 16 regions 18.Therefore, when chip 14 is LED chip, it is possible to be easily manufactured the optics (luminous body) of column-shaped or planar.
The present invention is not limited to the above embodiments, without departing from the scope of spirit of the present invention, and can as required, arbitrarily and proper combination, change or select to use.

Claims (16)

1. a resin seal material, the raw material of described sealing resin it is normally used as when the shaping mould using the compression forming being arranged at resin sealing apparatus and have die cavity carries out resin seal by the sealing resin electronic unit to being installed in base main body, comprise resin material and in powdery or granular, described resin seal material is characterised by
When using the size to the upper surface of described sealing resin of the surface being provided with electronic unit from base main body as the thickness of described sealing resin, in the case of desired value t of the thickness to described sealing resin sets the first specification, the particle diameter D of described resin seal material meets this second specification of D≤a × t, the unit of wherein said t is mm
Described first specification is 0.03mm≤t≤1.2mm, and wherein a is 2.0 or 3.0.
Resin seal material the most according to claim 1, it is characterised in that described first specification is 0.05mm≤t≤1.0mm.
Resin seal material the most according to claim 1 and 2, it is characterized in that, described second specification calculates projected area by the image obtained according to the described resin seal material of shooting, processes the area equivalent circular diameter of this projected area as described particle diameter D thus is suitable for
The value of described a is 3.0.
Resin seal material the most according to claim 1 and 2, it is characterised in that utilize centrifugal force that air-flow produces or utilize sieve to judge whether described resin seal material meets described second specification.
Resin seal material the most according to claim 1 and 2, it is characterised in that described resin material has thermosetting.
Resin seal material the most according to claim 5, it is characterised in that described resin material includes epoxy system resin or silicon system resin.
Resin seal material the most according to claim 1 and 2, it is characterised in that described resin material has light transmission.
Resin seal material the most according to claim 1 and 2, it is characterised in that this resin seal material includes at least having material in the first specification of described resin material, additive and filler,
Described resin material is powdery or granular,
In described first specification, material is that the most described resin material, described additive and described filler are judged as meeting the material of described second specification by ground product that is mixing and that pulverize according to the result of described second specification D≤a × t sorting.
Resin seal material the most according to claim 1 and 2, it is characterised in that this resin seal material includes at least having material in the second specification of described resin material, additive and filler,
Described resin material is powdery or granular,
In described second specification, material is that the outer material of specification that the most described resin material, described additive and described filler are judged as being unsatisfactory for described second specification by the first ground product that is mixing and that pulverize according to the result of described second specification D≤a × t sorting is pulverized further, after generating the second ground product, this second ground product is judged as meeting the material of described second specification according to the result of described second specification sorting.
Resin seal material the most according to claim 1 and 2, it is characterised in that described resin seal material includes material in the first specification,
Described resin seal material is from being supplied to described resin sealing apparatus to the material being supplied to described die cavity be judged as meeting described second specification according to the result that described second specification D≤a × t sorts.
11. resin seal materials according to claim 1 and 2, it is characterised in that described resin seal material includes material in the second specification,
In described second specification, material is described resin seal material be judged as being unsatisfactory for the material specification of described second specification to the result being supplied to described die cavity according to described second specification D≤a × t sorting crushed and after generating ground product from being supplied to described resin sealing apparatus, and the result that this ground product sorts according to described second specification is judged as meeting the material of described second specification.
The manufacture method of 12. 1 kinds of resin seal materials, described resin seal material is normally used as the raw material of sealing resin when the shaping mould using the compression forming being arranged at resin sealing apparatus and have die cavity carries out resin seal by the sealing resin electronic unit to being installed in base main body, in powdery or granular, the manufacture method of described resin seal material is characterised by, including:
Prepare at least to include in powdery or the operation of the raw material group of granular resin material, additive and filler；
The operation of mixing described raw material group；
Mixing described raw material group also generates the operation of the first intermediate materials；
Pulverize described intermediate materials and generate the operation of the second intermediate materials；
When using the size to the upper surface of described sealing resin of the surface being provided with electronic unit from base main body as the thickness of described sealing resin, in the case of desired value t of the thickness to described sealing resin sets the first specification, particle diameter D according to described resin seal material is as this second specification of D≤a × t, sorts the operation of described second intermediate materials；And
To be judged as meeting material in the first specification of described second specification among described raw material group and be defined as the operation of described resin seal material,
Wherein the unit of t is mm,
A is 2.0 or 3.0,
Described first specification is 0.03mm≤t≤1.2mm.
The manufacture method of 13. resin seal materials according to claim 12, it is characterised in that described first specification is 0.05mm≤t≤1.0mm.
The manufacture method of 14. resin seal materials according to claim 13, it is characterized in that, in the operation sorting described raw material group, projected area is calculated by the image obtained according to the described resin seal material of shooting, the area equivalent circular diameter of this projected area is processed as described particle diameter D thus is suitable for described second specification
The value of described a is 3.0.
The manufacture method of 15. resin seal materials according to claim 13, it is characterised in that in the operation sorting described raw material group, utilizes centrifugal force that air-flow produces or utilizes to sieve and judge whether described resin seal material meets described second specification.
16. according to the manufacture method of the resin seal material according to any one of claim 12～15, it is characterised in that farther include:
Pulverize the operation that the result sorted in the operation sorting described raw material group is judged as being unsatisfactory for the outer material of specification of described second specification D≤a × t according to described second specification；
Operation according to the outer material of described specification that described second specification sorting is pulverized；And
It is judged as meeting material in the second specification of described second specification among the outer material of described specification that will pulverize and is defined as the operation of described resin seal material.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI814009B (en) * 2020-09-11 2023-09-01 日商山田尖端科技股份有限公司 Resin sealing device

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5627619B2 (en) * 2012-02-28 2014-11-19 Ｔｏｗａ株式会社 Resin sealing device and method for manufacturing resin sealing body
JP6057880B2 (en) * 2013-11-28 2017-01-11 Ｔｏｗａ株式会社 Resin material supply method and supply device for compression molding apparatus
JP6430143B2 (en) * 2014-04-30 2018-11-28 Ｔｏｗａ株式会社 Resin molding apparatus, resin molding method, and molded product manufacturing method
JP6444707B2 (en) * 2014-11-28 2018-12-26 Ｔｏｗａ株式会社 Electronic component, manufacturing method and manufacturing apparatus
JP6525580B2 (en) * 2014-12-24 2019-06-05 Ｔｏｗａ株式会社 Resin molding apparatus and resin molding method
CN105098030A (en) * 2015-06-17 2015-11-25 苏州迈瑞微电子有限公司 Integrated circuit (IC) package method and package structure
JP6842234B2 (en) * 2015-10-13 2021-03-17 ローム株式会社 Manufacturing method of optical semiconductor device and optical semiconductor device
JP6506680B2 (en) * 2015-11-09 2019-04-24 Ｔｏｗａ株式会社 Resin sealing apparatus and resin sealing method
JP6491120B2 (en) * 2016-02-13 2019-03-27 Ｔｏｗａ株式会社 Resin sealing device, resin sealing method, and resin molded product manufacturing method
CN110223992B (en) * 2019-06-27 2021-09-03 武汉华星光电半导体显示技术有限公司 Display panel, forming die of display panel and preparation method of display panel
JP7003184B2 (en) * 2020-06-22 2022-01-20 Ｔｏｗａ株式会社 Resin molding equipment and manufacturing method of resin molded products
CN113745136B (en) * 2021-11-08 2022-01-04 张家港谱析传感科技有限公司 Electronic component manufacturing equipment

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102246295A (en) * 2008-12-10 2011-11-16 住友电木株式会社 Granulated epoxy resin composition for semiconductor encapsulation, semiconductor device using same, and method for manufacturing semiconductor device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11246671A (en) * 1998-02-26 1999-09-14 Shin Etsu Chem Co Ltd Production of granular epoxy resin composition
JP3594489B2 (en) * 1998-07-03 2004-12-02 京セラケミカル株式会社 Method for manufacturing resin-encapsulated electronic component
JP2007197571A (en) * 2006-01-26 2007-08-09 Matsushita Electric Works Ltd Epoxy resin composition for sealing and resin-sealed electronic component
JP5277569B2 (en) * 2007-06-11 2013-08-28 住友ベークライト株式会社 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
JP2009007524A (en) * 2007-06-29 2009-01-15 Asahi Glass Co Ltd Translucent sealing curable composition
JP2009275110A (en) * 2008-05-14 2009-11-26 Nitto Denko Corp Resin composition for encapsulating semiconductor and semiconductor device using the same
JP5086945B2 (en) * 2008-09-05 2012-11-28 株式会社東芝 Manufacturing method of semiconductor device
CN102246296B (en) * 2008-12-10 2014-02-05 住友电木株式会社 Semiconductor-sealing resin composition, method for producing semiconductor device, and semiconductor device
JP2010247429A (en) * 2009-04-15 2010-11-04 Apic Yamada Corp Resin sealing apparatus and resin sealing method using the same
JP2011171436A (en) * 2010-02-17 2011-09-01 Tdk Corp Electronic component built-in module and manufacturing method of the same
JP2012028651A (en) * 2010-07-26 2012-02-09 Toshiba Corp Resin supply device and method for manufacturing semiconductor device
JP5627619B2 (en) * 2012-02-28 2014-11-19 Ｔｏｗａ株式会社 Resin sealing device and method for manufacturing resin sealing body

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102246295A (en) * 2008-12-10 2011-11-16 住友电木株式会社 Granulated epoxy resin composition for semiconductor encapsulation, semiconductor device using same, and method for manufacturing semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI814009B (en) * 2020-09-11 2023-09-01 日商山田尖端科技股份有限公司 Resin sealing device

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