CN103295921B - The manufacture method of resin sealing apparatus and resin sealing body - Google Patents

The manufacture method of resin sealing apparatus and resin sealing body Download PDF

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Publication number
CN103295921B
CN103295921B CN201310056521.4A CN201310056521A CN103295921B CN 103295921 B CN103295921 B CN 103295921B CN 201310056521 A CN201310056521 A CN 201310056521A CN 103295921 B CN103295921 B CN 103295921B
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CN
China
Prior art keywords
resin
resin sealing
sealing
unit
receiving
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CN201310056521.4A
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Chinese (zh)
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CN103295921A (en
Inventor
高濑慎二
砂田卫
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东和株式会社
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Priority to JP2012041624A priority Critical patent/JP5627619B2/en
Priority to JP2012-041624 priority
Application filed by 东和株式会社 filed Critical 东和株式会社
Publication of CN103295921A publication Critical patent/CN103295921A/en
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Publication of CN103295921B publication Critical patent/CN103295921B/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565Moulds
    • H01L21/566Release layers for moulds, e.g. release layers, layers against residue during moulding
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93Batch processes
    • H01L24/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93Batch processes
    • H01L2224/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12041LED
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

The manufacture method of a kind of resin sealing apparatus and resin sealing body, be supplied to powdery in die cavity or granular resin sealing material by use, moulding is to thickness targets value t(mm) thus the sealing resin of setting the first specification carries out resin sealing to electronic unit, possesses: substrate receiving element; Resin material receiving element; Sorting unit, is being fed into resin sealing apparatus to being moved into shaping mould, the second specification D≤a × t(mm relevant according to the particle diameter D of resin sealing material from resin sealing material) sorting resin sealing material, wherein a is arithmetic number; The first conveyance unit, is judged as the result of sorting to meet in the specification of the second specification material conveyance in shaping mould; And heating unit, thereby the described resin sealing material being supplied in die cavity by heating and melting generates molten resin, and the first specification is 0.03(mm)≤t≤1.2(mm), thereby solidify sealing resin described in moulding by molten resin.

Description

The manufacture method of resin sealing apparatus and resin sealing body

Technical field

The present invention relates to use shaping mould that compression forming uses and powdery or granular resin sealing material to shaped like chipsElectronic unit carries out resin sealing and manufactures the manufacture method of resin sealing apparatus and the resin sealing body of resin sealing body.

Background technology

To IC(IntegratedCircuit) chip, LED(LightEmittingDiode) chip, chip capacityThe chip shape electronic components such as device are (hereinafter referred to as " chip ". ) carry out in the operation of resin sealing, by making mobility treeThereby fat solidifies and forms the sealing resin that cured resin forms. Accordingly, be installed on lead frame, printed base plate etc. (withUnder be called " base main body ". ) chip sealed by resin. The method sealing as resin in recent years, at transfer moldingBasis on use compression forming (for example,, with reference to patent documentation 1). Compared with transfer molding, compression forming has streamMoving property resin docks that the lead-in wire applied pressure share is little, the advantage of slimming that can corresponding sealing resin etc. PressingShorten in type, as the raw material of liquid resin, use the powdery of thermosetting resin formation or granular resin sealing to useMaterial or be aqueous resin sealing material (aqueous resin) at normal temperatures.

The situation of the powdery that the present invention forms taking use thermosetting resin or granular resin sealing material is as object. RightThe die cavity of the shaping mould that resin sealing apparatus has is supplied with resin sealing material, by being arranged on the heating in shaping mouldDevice heating resin sealing material also makes its melting, generates the molten resin with mobility (hereinafter referred to as " mobilityResin "). Heat liquid resin and it is solidified by continuation, thereby in die cavity, form close that cured resin formsEnvelope resin.

But in this technical field, following demand is more and more stronger in recent years. First demand is for conductComplete the electronic unit of product (hereinafter referred to as " electronic device ". ) the demand of so-called compactization. Thereupon, drawThe demand of the path of line and the slimming of sealing resin is stronger. Second demand is to be accompanied by extensive employing LEDAnd the demand producing is particularly as follows. That is, in the luminescent device taking LED as representative among electronic device,Use has the sealing resin of light transmission, but can damage optical characteristics when entrapped air pockets (space) in this sealing resin.Second demand is to require in sealing resin, not exist bubble in luminescent device.

Patent documentation 1: JP 2007-125783 communique (5th~9 pages, the 1st figure)

As the raw-material powdery of sealing resin or granular resin sealing material, conversion is used as biography conventionallyPass the raw material of the resin sheet of the resin sealing material of moulding. Resin sheet passes through as raw-material powdery or granularThereby resin sealing material is cylindric formation by briquetting. In transfer molding, by being supplied to the circle that is called as potThe resin sheet in the space of tubular is heated and thereby melting generates molten resin. The molten resin generating is pressed by plungerAnd inject die cavity. Thereby the molten resin that injects die cavity solidifies by heated. By operation so far,Form the sealing resin that cured resin forms.

In transfer molding, thereby by columned resin sheet heated molten resin that generates in pot. Therefore, rightIn the raw-material powdery as resin sheet or granular resin sealing material, do not require so particle diameter (particle footpath)Deviation little. Thus, the powdery using in compression forming as the raw material of resin sheet or the sealing of granular resin are usedThe particle diameter of material has relatively large deviation as a rule. In addition, in present specification, " powdery or granular " thisTerm comprises shape uncertain of micro mist shape, graininess, granular, corynebacterium, bulk, platelet-like, similar ballShape (for example, the shape of distortion, irregular shape, the irregular shape of tool) etc. After, as " powderyOr granular resin sealing material " this term of the suitable use of general name " granular resin ".

But the inventor of the related invention of the application waits the following situation of finding. First discovery is that resin sealing is usedThe particle diameter of material has from the large like this deviation of μ m level to 2~3mm degree.

Second discovery is to use while having the resin sealing material of above-mentioned large deviation, is supplied to the resin in die cavitySealing material has and on die cavity bottom surface (inner bottom surface in die cavity), is configured to patch shape (unequal ground chaotic)Tendency. Particularly use have large deviation resin sealing material wish manufacture sealing resin thickness (refer to fromThe upper surface of base main body is to the size of the upper surface of sealing resin) desired value t be t=0.2~0.3mm degreeWhen encapsulation, this tendency is remarkable, in this case, should be supplied to resin sealing material in die cavity a small amount of and cause byBe configured to plaquelike tendency strong. In this case, having the resin sealing material of large deviation about particle diameter can beConfiguration unevenly on die cavity bottom surface. Cause thus in die cavity the mobility generating in the melting of resin sealing materialThe liquid resin that floods inhomogeneous existence in the process of chip in resin can flow. Mobile the becoming of liquid resin drawnThe reason that not filling (in other words bubble) in distortion, the sealing resin of line etc. occur.

The 3rd discovery is to exist to have outstanding large particle diameter (for example, 10t degree: t is sealing resin as aboveThe desired value of thickness) granular resin sealing material time, on the not abundant rank of melting of this resin sealing materialDuan Zhonghui contacts with lead-in wire. This distortion that causes lead-in wire that contacts with going between.

The 4th discovery is combination baffle and slit parts (for example, ginseng when resin sealing material is supplied in die cavityAccording to patent documentation 1), the existence with the resin sealing material of outstanding large particle diameter causes the weight of liquid resinIncrease. Accordingly, the deviation of the thickness t of the sealing resin in encapsulation becomes large.

The 5th discovery is according to the characteristic of resin sealing material, and the resin sealing material with small particle diameter is supplied toTo in die cavity time, be likely attached to the place that original resin sealing material should not exist. This resin that is attached toThe density hour of sealing material, thus swim and cause by thering is the resin sealing material of small particle diameter. In addition, thisKind be attached to resin sealing material and be easy to when charged, thereby by thering is the resin sealing material static electrification of small particle diameterCause. Resin sealing material is to adhering to of unexpected place causing following drawback. First drawback is in die cavity bottom surfaceUpper resin sealing material configures unevenly. Second drawback is the pollution of shaping mould. The 3rd drawback be matched moulds notThe generation of the resin burr fully causing.

Summary of the invention

The problem that the related invention wish of the application solves is to eliminate by the raw-material powdery as sealing resin or granularDistortion, the sealing resin of the lead-in wire that causes of the deviation of particle diameter of resin sealing material in generation, the sealing of bubbleThe drawbacks such as the increase of the deviation of the thickness t of resin.

In order to solve above-mentioned problem, resin sealing apparatus involved in the present invention, possesses the compression forming use with die cavityShaping mould, use and be supplied to powdery in die cavity or granular resin sealing material, the order by moulding to thicknessScale value t(mm) thus the sealing resin of setting the first specification carries out resin sealing to electronic unit, described resin sealingDevice is characterised in that to possess: substrate receiving element, receives electronic unit is installed from the outside of resin sealing apparatusSealing prebasal plate; Resin material receiving element, receives resin sealing material from the outside of resin sealing apparatus; PointChoose unit, from resin sealing material is fed into resin sealing apparatus to being moved in the process of shaping mould, rootAccording to second relevant specification D≤a × t(mm of the particle diameter D of resin sealing material) sorting resin sealing material (aFor arithmetic number); The first conveyance unit, is judged as the result of sorting to meet in the specification of the second specification material conveyance to becomingIn pattern; And heating unit, thereby its generation of resin sealing material being supplied in die cavity by heating and melting is meltedMelt resin, the first specification is 0.03(mm)≤t≤1.2(mm), thereby solidify forming seal tree by molten resinFat.

The manufacture method of resin sealing body involved in the present invention, the one-tenth that the compression forming that resin sealing apparatus is possessed is usedThe die cavity that pattern has is supplied with and is powdery or granular resin sealing material, makes this resin sealing material melting rawBecome molten resin, this molten resin solidified, the desired value t(mm by moulding to thickness) setting the first specificationThereby sealing resin carries out resin sealing and manufactures resin sealing body electronic unit, the manufacturer of described resin sealing bodyMethod is characterised in that to possess: resin sealing apparatus receives the operation of resin sealing material; According to resin sealing materialThe second relevant specification D≤a × t(mm of particle diameter D of material) operation (a is arithmetic number) of sorting resin sealing material;And the result of sorting resin sealing material is judged as in the first specification that meets the second specification to material conveyance to mouldingOperation in mould, the first specification is 0.03(mm)≤t≤1.2(mm).

According to the present invention, at the desired value t(mm of the thickness to sealing resin) setting the first specification (0.03(mm)≤ t≤1.2(mm)) situation under, use the particle diameter D of resin sealing material to meet D≤a × t(mm) thisThe resin sealing material of the second specification. Accordingly, can suppress to there is large particle diameter D with respect to the desired value t of thicknessThe generation of the drawback that causes of the existence of granular resin. And then the first specification can also be 0.05(mm)≤t≤1.0(mm). In this case, the effect that suppresses the generation of above-mentioned drawback increases.

According to the present invention, at the desired value t(mm of the thickness to sealing resin) setting the first specification (0.03(mm)≤ t≤1.2(mm)) situation under, the second specification D≤3.0 × t relevant according to the particle diameter D of resin sealing material(mm) sorting is supplied to the resin sealing material in resin sealing apparatus. This sorting is for example according to passing through optical listThe area equivalent circular diameter of the projected area of these particles in the image that unit's shooting resin sealing material obtains carries out.The result of sorting is judged as and meets in the first specification of the second specification material conveyance in shaping mould. Accordingly, supplying withIn the situation of existing resin sealing material, can material conveyance in the first specification that meet the second specification will be judged asIn shaping mould. Therefore, can suppress to have with respect to the desired value t of thickness the depositing of granular resin of large particle diameter DIn the generation of the drawback causing.

According to the present invention, by the desired value t(mm of the thickness of sealing resin) be set as (the first specification (0.03(mm)≤ t≤1.2(mm)) situation under, the second specification D≤3.0 × t relevant according to the particle diameter D of resin sealing material(mm) sorting is supplied to the resin sealing material in resin sealing apparatus. This sorting is according to clapping by optical unitThe area equivalent circular diameter of taking the photograph the projected area of these particles in the image that resin sealing material obtains carries out. To divideThe result of choosing is judged as the outer material disintegrating of specification that does not meet the second specification, the outer material of specification that sorting is pulverized. To sortResult be judged as and meet in the second specification of the second specification material conveyance in shaping mould. Therefore, can suppress relativeThere is the generation of the drawback that the existence of the granular resin of large particle diameter D causes in the desired value t of thickness. And then, canEffectively utilize resin sealing material.

Brief description of the drawings

(1)~(3) of Fig. 1 are to represent respectively in the manufacture method of resin sealing body involved in the present invention,Supply with the operation of resin sealing material, the operation of heating resin sealing material and the work of matched moulds shaping mouldThe synoptic diagram of order.

(1)~(4) of Fig. 2 are to be illustrated respectively under the state of matched moulds shaping mould liquid resin is solidifiedThe operation of die sinking shaping mould, the formed body singualtion that resin sealing body is formed after operation, formation sealing resinOperation and the synoptic diagram of the electronic device that completes of singualtion.

Fig. 3 is in the manufacture method representing for resin sealing apparatus involved in the present invention and resin sealing bodyThe resin sealing material using, is 0.19mm at the desired value t of the thickness of sealing resin, resin sealing materialIn the quantity delivered w of the material situation that is 4.91g, resin on four levels that investigation is set particle diameter and die cavity bottom surfaceThe key diagram of the result of the experiment of the relation of the situation that sealing material configures unevenly.

Fig. 4 is in the manufacture method representing for resin sealing apparatus involved in the present invention and resin sealing bodyThe resin sealing material using, is 0.32mm at the desired value t of the thickness of sealing resin, resin sealing materialIn the quantity delivered w of the material situation that is 7.91g, resin on four levels that investigation is set particle diameter and die cavity bottom surfaceThe key diagram of the result of the experiment of the relation of the situation that sealing material configures unevenly.

Fig. 5 is the top view that represents an example of resin sealing apparatus involved in the present invention.

Fig. 6 is the top view that represents another example of resin sealing apparatus involved in the present invention.

Symbol description

1 counterdie

2 patrixes

3 first feed units

4 die cavities

5 resin sealing materials

6 mold release film

7 housing parts

8 cavity part

9 attraction channels (attraction unit)

10 heaters (heating unit)

11 seal members (the exhausted unit of outer air bound)

12 attraction channels (decompressing unit)

13 base main body

14 chips (electronic unit)

15 sealing prebasal plates

16 lead-in wires

17 boundary lines

18 regions

19 housings

20 supply baffle plates

21 resettlement sections

22 molten resins

The 23 exhausted spaces of outer air bound

24 gases that are discharged from etc.

25 sealing resins

26 formed bodys (resin sealing body)

27 rotating blades

28 electronic equipments

29 unit substrate

30 unit sealing resins

31 material receiving elements

32,59 resin material processing units

33 forming units

34 formed body allocation units

35,57 substrate receiving elements

36,58 resin material receiving elements

37 conveyance tracks

38 main conveyance unit (the first conveyance unit)

39 substrate acceptance divisions

40 substrate transferring portions

41 resin acceptance divisions

42 metering portions

43 containers

44 first resin conveying units

45,49 baffle plates (separating element)

46 sorting units

47 pulverizing units

48 second resin conveying units (the second conveyance unit)

50 collecting unit of dust

51 chase retainer

52 second feed units

53 drawdown pumps (decompressing unit)

54 formed body conveying units

55 formed body containers

56 formed body resettlement sections

60 resin material unit

A1, A2 resin sealing apparatus

D particle diameter

The desired value of the thickness of t sealing resin

Detailed description of the invention

According to the present invention, the desired value at the thickness of sealing resin with its thickness is made as t(mm) 0.03(mm)≤ t≤1.2(mm) in the situation of this first specification, according to the particle diameter of resin sealing material (particle footpath) DSecond relevant specification D≤3.0 × t(mm), sorting is supplied to the resin sealing material in resin sealing apparatusMaterial. These particles in this sorting basis image obtaining by optical unit photographs resin sealing materialThe area equivalent circular diameter of projected area carries out. The result of sorting is judged as in the first specification that meets the second specificationMaterial by conveyance in shaping mould. On the other hand, the result of sorting is judged as outside the specification that does not meet the second specificationMaterial is pulverized, and the outer material of specification of pulverizing is sorted. The result of sorting is judged as and meets second of the second specificationIn specification material by conveyance in shaping mould.

[embodiment 1]

With reference to Fig. 1~Fig. 4, the manufacture method to resin sealing body involved in the present invention and resin sealing apparatusDescribe. In addition, for ease of understanding, for all suitable omissions or overstate of any accompanying drawing in present specificationOpen ground schematic representation. Mark identical symbol for identical structural element, suitable description thereof is omitted.

As shown in Fig. 1 (1), resin sealing apparatus involved in the present invention has counterdie 1 and patrix 2. UnderThe common formation shaping mould of mould 1 and patrix 2. Between counterdie 1 and patrix 2, be provided with free to advance or retreatly and supply with treeThe first feed unit 3 of fat sealing material (aftermentioned). In counterdie 1, be provided with the die cavity 4 that recess forms.The first feed unit 3 will be powdery or granular resin sealing material 5 is supplied in die cavity 4. , die cavity 4The space that should be supplied to for resin sealing material 5. Mold release film 6 is supplied to counterdie 1 under the state being stretchedAnd between patrix 2.

Counterdie 1 can relatively carry out lifting with patrix 2. Accordingly, counterdie 1 relatively approaches also with patrix 2Matched moulds, and relatively away from also die sinking. Counterdie 1 shown in Figure 1 is by housing parts 7 and cavity part 8 structuresBecome, housing parts 7 are by elastomeric element (volute spring etc.; Not shown) by the example of resiliency supported. HousingParts 7 form the side of die cavity 4, and cavity part 8 forms the bottom surface of die cavity 4. Be not limited to this, die cavity 4 alsoCan be carved in the counterdie 1 being wholely set. Replace housing parts 7 by resiliency supported, or on this basis,Cavity part 8 can also be by elastomeric element by resiliency supported.

In counterdie 1, be provided with for attract mold release film 6 make that the profile of itself and counterdie 1 is close to, in other words useIn the attraction channel 9 of profile that mold release film 6 is adsorbed in to counterdie 1. In Fig. 1, two attraction channels 9 are distinguishedTwo downward arrows of describing illustrate the outside appearance that attracts mechanism (not shown) to attract mold release film 6. UnderIn mould 1, be provided with the heater 10 of heating resin sealing material 5. In addition be arranged in cavity part 8,Heater is also not shown.

In patrix 2 with opposed of counterdie 1 (hereinafter referred to as " profile of patrix 2 ") in to overlook bagThe mode of enclosing die cavity 4 is provided with seal member 11. In the profile of patrix 2, overlook the inner side at seal member 11Be provided with the attraction channel 12 of the gas in the space that attracts to comprise die cavity 4.

The sealing prebasal plate 15 of multiple chips 14 is installed in base main body 13 by known methods such as absorptionBe fixed in patrix 2. Sealing prebasal plate 15 to comprise die cavity 4 completely and to be positioned at seal member 11 in overlookingBe fixed with the mode of the inner side of attraction channel 12. The electrode of the electrode of base main body 13 and chip 14 is not (allDiagram) by 16 electrical connections of the lead-in wires such as gold thread. Base main body 13 is by the cancellate boundary line of virtual setting17 are divided into multiple regions 18. One or more chips 14 are installed in each region 18.

The first feed unit 3 has housing 19 and opens and closes the gear for supply of the bottom that is arranged on freely housing 19Plate 20. Supplying with under the state of closing with baffle plate 20, containing resettlement section 21 shapes of resin sealing material 5Become the inner side at housing 19.

Close to the resin using in the manufacture method of resin sealing apparatus involved in the present invention and resin sealing bodyEnvelope describes with material 5. Resin sealing material 5 manufacture as follows. First, prepare at least to comprise heatThe filler of the formation such as powdery or granular resin material, additive and silica that cured resin forms (is filled outFill agent) raw material group. Then, mixing raw material group generate the first intermediate materials. Then, pulverize mixingThe first intermediate materials and generate the second intermediate materials. Then, specification according to the rules sorts the second intermediate materials.Be that resin sealing is used by being judged as material decision in the first specification that meets the specification specifying among the second intermediate materialsMaterial 5.

Can comprise that as resin material epoxy is that resin or silicon are resin. To manufacture optics as object useWhen resin sealing material 5, resin material has light transmission. And then, while using resin sealing material 5,In resin sealing material 5, can also contain fluorophor as additive.

In the present invention, use resin sealing material 5, form cured resin and form the desired value t with thicknessSealing resin. As the specification (the first specification) of the desired value t of thickness, for example, consider in recent years for electronics deviceThe demand of compactization of part is made as 0.1(mm)≤t≤1.2(mm). Consider what compactization was correlated withWhen stronger demand, the first specification is preferably 0.05(mm)≤t≤1.2(mm), more preferably 0.05(mm)≤t≤1.0(mm). According to the purposes of electronic device consider chip thick be 15 these predictions of μ m degreeTime, the first specification is preferably 0.03(mm)≤t≤1.0(mm). And then consideration comprises effective profit of materialUsed time, the first specification is preferably 0.03(mm)≤t≤1.2(mm). Come from this viewpoint of demand of actualitySee, the first specification is preferably 0.2(mm)≤t≤1.0(mm).

It is relevant to the desired value of the thickness of sealing resin that resin sealing material 5 meets particle diameter (particle footpath) D0.03(mm)≤D≤3t(mm) specification (the second specification) of this regulation. This second specification is preferably 0.05(mm)≤D≤2t(mm). About these relevant second specifications of resin sealing material 5, will be in the backDescribe in detail. In present specification, the particle diameter D of resin sealing material 5 refers to by optical unit and clapsTake the photograph the area equivalent circular diameter of the projected area of these particles in the image that resin sealing material 5 obtains. ToolBody, the image calculation obtaining according to shooting resin sealing material 5 goes out projected area, by these perspective planesLong-pending area equivalent circular diameter is processed as particle diameter D. In Fig. 1 (1), particle diameter D is shown easily.

In addition, such as, to passing through other unit beyond optical unit, air-flow produces centrifugal force, screen cloth etc.The situation that the particle diameter D of resin sealing material 5 is measured in known unit describes. In this case, pass throughThe measured value A of the particle diameter D that above-mentioned optical unit is measured and the mensuration of the particle diameter D measuring by other unitValue B is likely different. Therefore, preferably, researching determining value A and measured value B's is relevant in advance, according to thisRelevant definite the second new specification. Preferably, replace existing the second specification to adopt the second new specification, according toThis second new specification judges the particle diameter D of resin sealing material 5.

Below, to the related resin sealing apparatus 5 of the application of the invention to chip 14 carry out resin sealing fromAnd the manufacture method of the resin sealing body of manufacture resin sealing body sees figures.1.and.2 and describes. It is right to continueFormed body that resin sealing chip 14 forms, in other words manufactured the electronic device of electronic device by resin sealing bodyManufacture method describes.

As shown in Fig. 1 (1), between counterdie 1 and patrix 2, the top of die cavity 4 is stretched and supplies with the demouldingFilm 6. Then, attract mold release film 6 by attraction channel 9 to the bottom surface of die cavity 4. Accordingly, mold release film 6 is inhaledInvest the profile that forms die cavity 4 (hereinafter referred to as " cavity surface ". ) whole. At least to resin sealing chipIn the stage of counterdie 1 and patrix 2 die sinkings after 14, continue absorption mold release film 6. In addition, in present specification,For simplicity, should be by for resin sealing material 5 under the state whole of cavity surface absorption mold release film 6The space of supplying with is also referred to as " die cavity ".

Then, the first feed unit 3 is entered between counterdie 1 and patrix 2, above die cavity 4, stopOne feed unit 3. Then, on the left and right directions of accompanying drawing, open and supply with baffle plate 20, die cavity 4 is supplied with to treeFat sealing material 5.

Then,, as shown in Fig. 1 (2), use heater 10 heating to be supplied to the resin sealing in die cavity 4With material 5. Accordingly, make the first feed unit 3 meltings and generate liquid resin (with reference to Fig. 1 (3)Molten resin 22). Parallel with heating resin sealing material 5, patrix 2 is declined. In addition also can make,Counterdie 1 rises. Mainly that counterdie 1 relatively approaches with patrix 2.

Then, as shown in Fig. 1 (3). The lower end that further makes patrix 2 decline to make seal member 11 with underThe profile contact of mould 1. Accordingly, form and comprise the space of die cavity 4 and the outer air bound isolated with the outside of shaping mouldSpace 23 absolutely. Outside drawdown pump (aspiration pump), decompressing unit such as decompression tank etc. that use is arranged on shaping mould are (notDiagram), externally reduce pressure in the exhausted space 23 of air bound. Accordingly, micro-in the exhausted space 23 of outer air bound will be included inLittle particle and be included in gas in the exhausted space 23 of outer air bound and molten resin 22 etc. be discharged to shaping mould outsidePortion. At the 1(3 of figure) near illustrate attraction channel 12 two arrows upwards represent to be arranged by decompressionGo out to outside gas of shaping mould etc. 24. Preferably contact with the profile of counterdie 1 in the lower end from seal member 11Enter to starting the exhausted space 23 of external air bound under the state (middle matched moulds state) of counterdie 1 and patrix 2 complete matched mouldsThe operation of row decompression. In addition, preferably until molten resin 22 completely crued during in carry out external air bound exhaustedThe operation reducing pressure in space 23.

Then,, as shown in Fig. 2 (1), continue to make patrix 2 to decline. Accordingly, in molten resin 22, soakStain chip 14 and lead-in wire 16(soak), matched moulds counterdie 1 and patrix 2 completely. Complete at counterdie 1 and patrix 2Under the state of matched moulds (matched moulds state completely), by counterdie 1 and patrix 2 pressurizing melting resin 22 time, continueContinuous heating and melting resin 22. Accordingly, molten resin 22 is solidified, as shown in Fig. 2 (2), form and solidify treeThe sealing resin 25 that fat forms.

Then,, as shown in Fig. 2 (2), make patrix 2 rising die sinking counterdies 1 and patrix 2. Then, by toolThere is resin sealing body (sealing metacoxal plate) structure of base main body 13, chip 14, lead-in wire 16 and sealing resin 25The formed body 26 becoming is fetched into outside shaping mould. By operation up to the present, to being installed on base main body 13Multiple chips 14 operation of carrying out resin sealing complete, the formed body 26 that multiple chips 14 are sealed by resin is completeBecome.

Then,, as shown in Fig. 2 (3), use the known methods such as adhesive film or absorption, by formed body 26Be fixed on workbench (not shown). Use rotating blade 27, cut off formed body completely along each boundary line 1726(cuts entirely). Particularly, respectively along each boundary line 17 and Y side of the directions X in Fig. 2 (3)To each boundary line 17, cut off formed body 26 completely. Accordingly, carry out the singualtion (singulation) of formed body 26.By operation up to the present, formed body 26 with each region 18Wei unit by singualtion, (4) of shop drawings 2Shown electronic device 28. Each electronic device 28 has base main body 13 with each region 18Wei unit singualtionUnit substrate 29, chip 14, lead-in wire 16 and sealing resin 25 are with the unit of each region 18Wei unit singualtionSealing resin 30.

In addition, making in the operation of formed body 26 singualtion, replace and entirely cutting, can also be at formed body 26 thickDegree direction the groove of formation midway after (after hemisection) formed body 26 is applied to external force and singualtion. Replace rotationBlade 27, can also use laser, water jet, rope saw etc.

Below, for the resin sealing material 5 using in resin sealing apparatus involved in the present invention, to particle diameterThe specification of the regulation that D is relevant to the desired value t of the thickness of sealing resin 25 describes. First, close to resinThe lower limit of the second specification that envelope is set with the particle diameter D of material 5 describes. The lower limit of the second specification of particle diameter DIn the time that the desired value t of the thickness of sealing resin 25 is large certainly much less, even at the order of the thickness of sealing resin 25Scale value t hour in principle also without determining. But, according to the characteristic of resin sealing material, because resin sealing is usedMaterial swims or charged causing, resin sealing material 5 can occur and be attached to original resin sealing material 5 notThis problem of the place that should exist. In order to prevent this problem, second of the particle diameter D of resin sealing material 5The lower limit of specification is preferably large to a certain degree value. The value of rule of thumb, having distinguished particle diameter D is less than 0.05mmTime, supply with or be easy to when conveyance resin sealing material 5 to occur above-mentioned swim or charged etc. And then, distinguishThe value of particle diameter D while being less than 0.03mm, be easier to occur above-mentioned swim or charged etc. According to these items,About the lower limit of the second specification of particle diameter D, more than being preferably 0.03mm, more preferably 0.05mm withOn. Therefore, the second specification of particle diameter D is arranged down in limited time, is defined as 0.03(mm as lower limit)≤D,Preferably be defined as 0.05(mm)≤D.

The upper limit of the second specification of then, particle diameter D being set describes. About the upper limit of the second specification, logicalCrossing following order determines. As the first order, using as the level of particle diameter D multiple, (the present embodiment is with fourFor example) specific scope be set as on the basis of particle diameter D, sorting resin sealing material 5 is so that particle diameter DFall in the specific scope of setting. In addition, these specific scopes are different from the second above-mentioned specification. AsThe second order, sets by the desired value t(mm of the thickness as sealing resin 25) two of forming of suitable valueLevel value. In addition, these level values are different from the first above-mentioned specification. As the 3rd order, calculate with respectivelyThe weight w(g of the resin sealing material 5 that the desired value t of the thickness of individual sealing resin 25 is corresponding), this is heavyThe resin sealing material 5 of amount is dispersed in die cavity for actual evaluation (planar dimension: 233 × 67mm). LightThe ratio of resin sealing material 5 these die cavity bottom surfaces of covering of scattering is measured (hereinafter referred to as " resin accounts in the property learned groundThere is rate ". ). As the 4th order, when using the 5 resins sealing of this resin sealing material, which kind of degreeThe resin occupation rate deviation that can allow the thickness of actual sealing resin 25 etc. evaluate. According to more thanFour orders, about the particle diameter D of resin sealing material 5, definite being considered to can actual the second specification usingThe upper limit.

Below, the order of the upper limit of the second specification of setting for the particle diameter D that determines resin sealing apparatus 5, ginsengDescribe according to Fig. 3 and Fig. 4. As the first order, sorting resin sealing material 5, prepares particle diameter D and dividesDo not fall into resin sealing material Ma, Mb, Mc, Md as the specific scope 1~4 of four levels.Wherein, specific scope 1 is D=1.0~2.0(mm), specific scope 2 is D=0.2~2.0(mm),Specific scope 3 is D=0.2~1.0(mm), specific scope 4 is D=0.2~0.4(mm).

Resin sealing material Ma:D=1.0~2.0(mm)

Resin sealing material Mb:D=0.2~2.0(mm)

Resin sealing material Mc:D=0.2~1.0(mm)

Resin sealing material Md:D=0.2~0.4(mm)

As the second order, set t=0.19(mm) and two level values t=0.32(mm) as sealingThe desired value t of the thickness of resin 25. T=0.19(mm) this level value is for considering in recent years to electronic device 28The level value of requirements set of compactization.

As the 3rd order, in above-mentioned two level values, (desired value of the thickness of sealing resin 25 is t=0.19(mm), in situation and 0.32(mm)), calculate the corresponding resin sealing material respectively with this desired value tThe weight of material 5. The weight calculating is at level value 1(desired value t=0.19(mm)) time be 4.91(g),At level value 2(desired value t=0.32(mm)) time be 7.91(g). In addition, the value of above-mentioned weight is peaceCalculated value (theoretical value) when chip 14 is housed.

In addition,, in experiment, be not installed on the state of base main body 13 at chip 14, in other words with virtual basePlate is object, supplies with resin sealing material 5. As actual quantity delivered w, replace and be equivalent to level value 1(orderScale value t=0.19(mm)) time w=4.91(g), by w=6.03(g) resin sealing material 5,In addition, replace and be equivalent to level value 2(desired value t=0.32(mm)) time w=7.91(g), by w=Resin sealing material 5 10.16(g) is dispersed in respectively to be evaluated with in die cavity.

Continue, as the 3rd order, to prepare to be equivalent to quantity delivered w=4.91(g) resin sealing material 5Resin sealing material Ma, Mb, Mc, Md, be dispersed in these successively and evaluate with in die cavity. Similarly,Preparation is equivalent to quantity delivered w=7.91(g) resin sealing material 5 resin sealing material Ma, Mb,Mc, Md, be dispersed in these successively and evaluate with in die cavity. From evaluating with taking the resin scattering in the top of die cavityThe state of sealing material 5. The image obtaining by shooting is carried out to binary conversion treatment, calculate resin sealingBy the resin occupation rate of material 5. Particularly, there are 256 gray scales (using rank 0 as black, by rank255 as white) image in using rank 25 as threshold value, image is carried out to binary conversion treatment. At binary imageMiddlely rank is judged as to " having resin sealing material " below 25, calculates and evaluating with on the bottom surface of die cavityThere is the Area Ratio of the part of resin sealing material.

Shown in (1)~(4) of Fig. 3 at quantity delivered w=4.91(g) in the situation that, to being scattered with respectivelyThe state of resin sealing material Ma~Md carries out image that binary conversion treatment obtains and the cheese of resin occupation rateFigure. Shown in (1)~(4) of Fig. 4 at quantity delivered w=7.91(g) in the situation that, to being scattered with respectivelyThe state of resin sealing material Ma~Md carries out image that binary conversion treatment obtains and the cheese of resin occupation rateFigure.

As the 4th order, four kinds of resin sealing material Ma shown in (1)~(4) of use Fig. 3~Md, moulding desired value t=0.19(mm) sealing resin 25(with reference to (2) of Fig. 2). According to this knotReally, the situation of Fig. 3 (1)~(3) is judged as and does not allow as sealing resin 25, (4) of Fig. 3Situation is judged as to be had surplus and allows as sealing resin 25.

According to the result shown in Fig. 3, the first, as the particle diameter D(mm to resin sealing material 5) establishThe lower limit of the second fixed specification judges D=0.2(mm) appropriate. As the lower limit D=1.0(mm of the second specification)Time, owing to being configured to the strong (ginseng of plaquelike tendency in evaluation with resin sealing material 5 on the bottom surface of die cavityAccording to Fig. 3 (1)), therefore clear and definite permission as sealing resin 25.

According to the result shown in Fig. 3, the second, the particle diameter D(mm of resin sealing material 5) the second ruleThe upper limit anticipation of lattice is present in D=0.4(mm) above 1.0(mm) in following scope. To such particle diameterThe scope that the upper limit of the second specification of D is set is at the particle diameter D(mm of resin sealing material 5) the second specificationUnder be limited among the situation of 0.2mm as shown in the situation shown in Fig. 3 (3) and Fig. 3 (4)Between situation, resin occupation rate is equivalent to more than 41% scope below 84%.

Continue as the 4th order four kinds of resin sealing materials shown in (1)~(4) of use Fig. 4Ma~Md, the desired value t=0.32(mm of molding thickness) sealing resin 25(with reference to (2) of Fig. 2).Based on this result, during for state shown in (1), (2) of Fig. 4, be judged as and do not allow as sealing resin25, during for state shown in (3), (4) of Fig. 4, be judged as and allow as sealing resin 25. And then,During for state shown in Fig. 4 (3), be judged as the boundary of permission. Therefore, according to Fig. 4 (particularly Fig. 4(3)) shown in result, at the particle diameter D(mm of resin sealing material 5) the second specification underBe limited in the situation of 0.2mm, infer D=1.0(mm as the upper limit of the second specification) be suitable. AsThe D=1.0(mm of the upper limit of the second specification) this value is equivalent to the desired value for the thickness of sealing resin 25T=0.32(mm), this relation of D/t=3.125. In addition, in the feelings that are the state shown in (3) of Fig. 4Under condition (D=0.2~1.0mm), resin occupation rate is 72%.

Continue as the 4th order, according to the particle diameter D(mm that is equivalent to infer according to Fig. 4) the second specificationThe upper limit (D=1.0(mm)) resin occupation rate (72%), to the particle diameter D in the situation shown in Fig. 3(mm) upper limit of the second specification is studied. Particle diameter D(mm in Fig. 3 (3)) be D=0.2~1.0mm, resin occupation rate is 41%, particle diameter D(mm in Fig. 3 (4)) be D=0.2~0.4mm,Resin occupation rate is 84%. While calculating in proportion resin occupation rate and be 72% situation between these, as grainFootpath D(mm) the upper limit of the second specification, obtain D=0.567mm. This value of D=0.567mm is equivalent toResin occupation rate is 72% situation, and is equivalent to the desired value t=0.19 for the thickness of sealing resin 25(mm), this relation of D/t=2.99.

In sum, about to particle diameter D(mm) the second specification of setting, under the second specification, be limited to 0.2mmSituation under the upper limit of the second specification and the desired value t(mm of the thickness of sealing resin 25) relation (D/t)Be D/t=3.125 in the situation of Fig. 3, the situation of Fig. 4 is D/t=2.99. According to these items, about particle diameterThe desired value t(mm of the upper limit of the second specification D(mm) and the thickness of sealing resin 25) relation, judgementD/t=3.0 is roughly appropriate.

In addition, the situation of Fig. 3 (4) is judged as and has surplus and allow as sealing resin 25. According to this thing, judge the situation shown in (4) of preferred Fig. 3, to particle diameter D(mm) the second specification of settingThe desired value t(mm of the thickness of the upper limit and sealing resin 25) pass beSituation. Therefore,About particle diameter D(mm) the upper limit of the second specification and the desired value t(mm of the thickness of sealing resin 25)Preferred relation, judges that D/t=2.0 is roughly appropriate.

According to explanation up to the present, about particle diameter D(mm) following specification is appropriate. TheOne, the lower of the second specification that particle diameter D is set is 0.03(mm in limited time)≤D, be preferably 0.05(mm)≤D.The second, as the upper limit of the second specification of particle diameter D, with the desired value t(mm of the thickness of sealing resin 25)Pass is D≤3.0 × t, is preferably D≤2.0 × t.

Therefore, to particle diameter D(mm) set the second specification as follows. , the second specification be particle diameter D withThe desired value t(mm of the thickness of sealing resin 25) relevant D≤3.0 × t(mm) this specification. This is second years oldSpecification is preferred from this viewpoint of earning rate (effective rate of utilization) of raising resin sealing material 5. AnotherAspect, from thinner corresponding this viewpoint of electronic device 28, preferably D≤2.0 × t(mm) thisTwo specifications. According to swimming with charged this viewpoint to these the second specification settings of inhibition resin sealing material 5In limited time lower, additional 0.03(mm) this specification of≤D or 0.05(mm) this specification of≤D.

The resin sealing material 5 using in the present embodiment, using the desired value t of the thickness as sealing resin 25Specification (the first specification) meet 0.03(mm)≤t≤1.2(mm) this specification (being preferably 0.05(mm)≤ t≤1.0(mm) this specification) be prerequisite, meet the second following specification. This is particle diameter D and sealing treeThat the desired value t of the thickness of fat 25 is correlated with, D≤3.0 × t(mm) this second specification. From with thinner electricityCorresponding this viewpoint of sub-device 28, preferably D≤2.0 × t(mm) this second specification. To these secondSpecification arranges down in limited time, additional 0.03(mm) this specification of≤D or 0.05(mm) this specification of≤D.

Meet these specifications by resin sealing material 5, thereby obtain following effect. The first, evenIn other words the desired value t hour of the thickness of sealing resin 25, even if use in the resin sealing being supplied in die cavity 4In a small amount of situation of material 5, also can suppress resin sealing material 5 configuration unevenly on die cavity bottom surface.Accordingly, in the die cavity 4 shown in Fig. 1,2, suppress the mobility tree that 5 meltings of resin sealing material generateFat 22 flows. Therefore, suppress the generation of not filling etc. in lead-in wire 16 distortion, sealing resin 25.

The second, the upper limit of particle diameter D is controlled as suitable value. Therefore, suppress the desired value t with respect to thicknessThere is the generation of the drawback that the existence of the granular resin of large particle diameter causes. Particularly, suppress encapsulation in closeThe deviation of the thickness of envelope resin.

The 3rd, suppress by have the resin sealing material 5 of small particle diameter swim or cause by static electrification,Resin sealing material 5 adheres to unexpected place. Therefore, suppress adhering to of this resin sealing material 5The generation of the drawback causing.

In addition,, in present specification, the lower limit of the second specification that particle diameter D is set does not also mean that eliminating bagDraw together the resin sealing material 5 of the particle diameter D less than this lower limit. In fact, use in conveyance or the sealing of metering resinIn the process of material 5, because resin sealing material 5 breaks or breach likely generates small powder or plastochondria(particulate that resin sealing material 5 causes, hereinafter referred to as " resin system particulate ". ). This resinBe that particulate likely has the particle diameter D less than the lower limit of the second specification of particle diameter D. Therefore, have to existThe resin system particulate of the particle diameter D less than the lower limit of the second specification of particle diameter D is that reason is judged as and does not belong to resinSealing material 5 is ill-considered.

[embodiment 2]

With reference to Fig. 5, resin sealing apparatus involved in the present invention embodiment is described. As Fig. 5 instituteShow, resin sealing apparatus A1 possesses material receiving element 31, resin material processing unit 32, multiple (Fig. 5In two) forming unit 33 and formed body allocation units 34. Material receiving element 31 possesses the sealing of receptionThe resin material receiving element of the substrate receiving element 35 of prebasal plate 15 and reception resin sealing material 536. From material receiving element 31 successively via resin material processing unit 32 and multiple forming unit 33 to mouldingBody allocation units 34, are provided with conveyance track 37. In conveyance track 37, be provided with main conveyance unit 38. MainConveyance unit 38 can be along conveyance track 37 transversely moving at accompanying drawing. In addition, forming unit 33 also canThink single.

Material receiving element 31 has the substrate that receives sealing prebasal plate 15 from the outside of resin sealing apparatus A1 and connectsReceipts portion 39 and by sealing prebasal plate 15 conveyances that receive to the substrate transferring portion 40 in main conveyance unit 38.Resin material receiving element 36 has the tree that receives resin sealing material 5 from the outside of resin sealing apparatus A1The metering portion 42 of the weight and volume of the resin sealing material 5 that fat acceptance division 41 and metering receive etc. ShouldResin sealing material 5 after the resin sealing material 5 of metering or metering is for example housed in the formations such as palletIn container 43. The resin sealing material 5 being housed in container 43 passes through the first resin conveying unit 44 with eachContainer 43 by conveyance in main conveyance unit 38.

Substrate receiving element 35 and preferably root in the time that the first resin conveying unit 44 is advanced and retreat of resin material receiving element 36Separate by the baffle plate 45 opening and closing according to needs. Accordingly, suppress to comprise the atomic particulate of resin system and invade substrateReceiving element 35.

In the related resin sealing apparatus A1 of the present embodiment, adopt resin material processing unit 32 to be correlated withThe first following structure. , in resin sealing apparatus A1, resin material processing unit 32 receives single with materialFirst 31 adjacent and handling settings freely. By adopting this first structure, 32 of resin material processing unitsBe installed on resin sealing apparatus A1 according to needs, or dismantle from resin sealing apparatus A1 as required.

Resin material processing unit 32 has according to the sorting of the second specification sorting resin sealing material 5 of particle diameterThe result of unit 46 and pulverizing sorting is judged as the pulverizing unit that particle diameter is greater than the outer material of specification of the second specification47. And then resin material processing unit 32 has at resin acceptance division 41 and sorting unit 46 and pulverizing unitThe second resin conveying unit 48 of the outer material of conveyance resin sealing material 5 and specification between 47.

As sorting unit 46, centrifugal force, sieve that for example selection or the optical unit of proper combination, air-flow produceKnown unit such as net and using. As pulverizing unit 47, for example, use the known unit such as stirring, roller mill.Sorting unit 46 is included in resin material processing unit 32 with pulverizing unit 47.

In order to prevent resin system particulate intrusion substrate receiving element 35, preferably in resin material processing unit 32Following structural element is set. These structural elements comprise with baffle plate 45 and cooperate and will comprise resin material receiving element36 with the isolated baffle plate 49 in the space of sorting unit 46 and pulverizing unit 47 and other spaces and to being present inAttract the also collecting unit of dust 50 of control of dust by the particulate in the isolated space of baffle plate 45 and baffle plate 49.

As the second specification of particle diameter D applicable in sorting unit 46, can with the thickness to sealing resin 25The first specification of setting of desired value t be associated and adopt following specification. As the first rule of the desired value t of thicknessLattice, for example, adopt 0.03(mm)≤t≤1.2(mm) this specification (being preferably 0.05(mm)≤t≤1.0(mm) this specification). As the second specification that the specific scope of particle diameter D is set, for example, adopt 0.03(mm)≤D≤3.0 × t(mm) this specification (being preferably 0.05(mm)≤D≤2.0 × t(mm) thisOne specification).

Multiple forming units 33 have respectively following structural element. What, enumerate as structural element is to chaseRetainer 51, be installed on the counterdie 1 chasing retainer 51 and there is die cavity 4, be fixed with counterdie 1 opposite disposedSealing prebasal plate 15 patrix 2(Fig. 5 in not shown), between counterdie 1 and patrix 2, supply with and reel take offThe second feed unit 52 of mould film 6 and to being formed on the exhausted space of outer air bound between counterdie 1 and patrix 2 (ginsengAccording to the exhausted space 23 of outer air bound shown in Fig. 1 (3)) drawdown pump 53 that reduces pressure.

In formed body allocation units 34, be provided with formed body conveying unit 54 and the configuration of conveyance formed body 26There is the formed body resettlement section 56 of the formed body container 55 that the pallet etc. of accommodating formed body 26 forms.

In the related resin sealing apparatus A1 of the present embodiment, before being correlated with at resin material processing unit 32On the basis of the first structure of stating, adopt single or multiple (in Fig. 5 two) forming unit 33 relevant belowThe second structure. That is, the forming unit 33 in the left side shown in Fig. 5 is adjacent with resin material processing unit 32,And (in other words by resin material processing unit 32 forming unit with right side adjacent with the forming unit 33 on right side33 clip), in resin sealing apparatus A1, handling arrange freely. In addition, the forming unit 33 on right side withThe forming unit 33 in left side is adjacent, and adjacent with formed body allocation units 34 (in other words by the moulding list in left sideUnit 33 clips with formed body allocation units 34), in resin sealing apparatus A1, handling arrange freely.

In addition, be provided with single forming unit 33 in resin sealing apparatus A1 time, at resin sealing apparatus A1In this forming unit 33 clipped installation by resin material processing unit 32 and formed body allocation units 34. Suppose fromResin sealing apparatus A1 dismounting formed body allocation units 34, can be single with this in resin sealing apparatus A1Other forming units 33 of the adjacent handling in right side of forming unit 33.

The related resin sealing apparatus A1 of the present embodiment has following effect. The first, pass through pulverizing unit47 pulverize the result sorting by sorting unit 46 is judged as the outer material of specification that does not meet the second specification. By dividingChoose the outer material of specification that unit 46 sortings are pulverized. The result of sorting is judged as to the second specification that meets the second specificationInterior material conveyance is in shaping mould. Therefore, can effectively utilize the resin being supplied in resin sealing apparatus A1Sealing material 5.

The second,, can as required, will by adopting the first structure about resin material processing unit 32 afterwardsResin material processing unit 32 is installed on resin sealing apparatus A1, or afterwards by resin material processing unit 32Dismantle from resin sealing apparatus A1. Accordingly, can be according to the specification of resin sealing material 5, electronic deviceThe desired value t(of the thickness of 28 sealing resin 25 is with reference to Fig. 2) etc., resin sealing apparatus A1 is installed afterwardsResin material processing unit 32, and afterwards from resin sealing apparatus A1 dismounting resin material processing unit 32.And then, can will in the first factory, transfer from the resin material processing unit 32 of resin sealing apparatus A1 dismountingTo the second factory that need to this resin material processing unit 32, be installed on the resin sealing apparatus that the second factory possessesA1. Therefore, use the electronic device 28(of resin sealing apparatus A1 with reference to Fig. 2 (4)) manufacturer's energyEnough according to the variation of the specification of the trend in market, resin sealing material 5 and electronic device 28 etc., close at resinIn seal apparatus A1, easily load and unload resin material processing unit 32.

The 3rd, about each forming unit 33, by adopting aforesaid the second structure, each forming unit 33 is according to needBe installed on resin sealing apparatus A1, or dismantle from resin sealing apparatus A1 as required. Accordingly, canAccording to increase and decrease of the trend in market, demand etc., resin sealing apparatus A1 is installed and sets up forming unit 33,And from resin sealing apparatus A1 dismounting forming unit 33 and reduce the quantity of forming unit 33. And then, canBy the forming unit 33 from resin sealing apparatus A1 dismounting in the first factory be transplanted on be for example positioned in great demandSecond factory in other places, be installed on the resin sealing apparatus A1 that the second factory possesses. Therefore, use treeThe electronic device 28(of fat sealing device A1 is with reference to Fig. 2 (4)) manufacturer can according to the trend in market,The production capacity of electronic device 28 is easily adjusted in the increase and decrease of demand etc.

The 4th, collecting unit of dust 50 is set, will comprise resin material receiving element 36 by baffle plate 45 and baffle plate 49Isolated with space and other spaces of pulverizing unit 47 with sorting unit 46, to being present in the tree in isolated spaceFat is that particulate etc. attracts and control of dust. Accordingly, can comprise the atomic particulate of resin system by control of dust. CauseThis, can suppress to be attached to because comprising the atomic foreign matter of resin system the drawback that sealing prebasal plate 15 grades occur.

The 5th, by using mold release film 6, thereby can make formed body 26 easily from counterdie 1 demoulding (reference(2) of Fig. 2). And then, via mold release film 6, can by be arranged in cavity surface fine concavo-convex reallyBe needed on sealing resin 25. By these items, the 2(4 at manufacture electronic device 28(with reference to figure)) timeCan improve quality. Particularly have and comprise fine concavo-convex lens (for example, Fresnel Lenses etc.) in manufactureOptics time, can significantly improve quality.

The 6th, the exhausted space 23 of air bound outside at least forming under middle matched moulds state, enters the exhausted space 23 of this outer air boundRow decompression (with reference to Fig. 1 (3)). Accordingly, suppress the generation of the bubble in sealing resin 25. Therefore,Manufacturing electronic device 28((4) with reference to Fig. 2) time can improve quality. Particularly manufacture and there is light transmissionThe optics of sealing resin 25 time, can significantly improve quality.

[embodiment 3]

With reference to Fig. 6, other embodiment of resin sealing apparatus involved in the present invention are described. As Fig. 6 instituteShow, in resin sealing apparatus A2, adopt the first~three following structure.

The first structure is as follows. , the forming unit 33 and substrate receiving element 57 in the left side shown in Fig. 6Adjacent, and (in other words by substrate receiving element 57 moulding list with right side adjacent with the forming unit 33 on right sideUnit 33 clips), in resin sealing apparatus A2, handling arrange freely. In addition, the forming unit 33 on right sideAdjacent with the forming unit 33 in left side, and adjacent with formed body allocation units 34 (in other words by the moulding in left sideUnit 33 clips with formed body allocation units 34), in resin sealing apparatus A2, handling arrange freely.

The second structure is as follows. , in resin sealing apparatus A1 shown in Figure 5, resin material receives singleUnit 36 is included in resin receiving element 31, and on the other hand, in resin sealing apparatus A2, resin material connectsReceive unit 58 independent from substrate receiving element 57, setting adjacent with resin material processing unit 59. In Fig. 6,Resin material receiving element 58 is adjacent on the above-below direction of accompanying drawing with resin material processing unit 59. Resinous woodMaterial receiving element 58 forms unit 60 for resin material jointly with resin material processing unit 59. And then, resinMaterial receiving element 58, can be used at resin material for independently module of difference with resin material processing unit 59Handling respectively in unit 60. , can there is the list for resin material of resin material receiving element 58 afterwardsIn unit 60, resin material processing unit 59 is installed.

In addition, be provided with single forming unit 33 in resin sealing apparatus A2 time, at resin sealing apparatus A2In this forming unit 33 clipped installation by substrate receiving element 57 and formed body allocation units 34. Suppose from resinSealing device A2 dismounting is unit 60 and formed body allocation units 34 for resin material, can be at resin sealing dressPut in A2 other forming units 33 of the adjacent handling in right side with this single forming unit 33.

The 3rd structure is as follows. , resin material clips single or multiple moulding lists with unit 60 in overlookingIn the 33(Fig. 6 of unit two), be arranged on the opposition side with substrate receiving element 57. Therefore, at resin sealing dressPut in A2, the substrate receiving element 57 of reception sealing prebasal plate 15 and reception sorting are powdery or granular resinSealing material 5 is pulverized the specification position that the resin material unit 60 of material is positioned at farthest as required outward.

According to the first structure, each forming unit 33 is installed on resin sealing apparatus A2 as required, or according toNeed to dismantle from resin sealing apparatus A2. Therefore, use the electronic device 28(reference of resin sealing apparatus A2(4) of Fig. 2) manufacturer can easily adjust electronic device according to the increase and decrease of the trend in market, demand etc.28 production capacity.

According to the second structure, can be afterwards in the unit 60 for resin material with resin material receiving element 58Middle installation resin material processing unit 59. Therefore, be accompanied by the unit sealing resin 30 that electronic device 28 hasThe variation of the technology trend of the propelling of the slimming of (with reference to Fig. 2 (4)) etc., according to electronic device 28The expectation of manufacturer can be appended resin material processing unit 59 afterwards.

According to the 3rd structure, can prevent the intrusion substrate receiving elements 57 such as resin system particulate. Therefore, canPrevent from being attached to because comprising the atomic foreign matter of resin system the drawback that sealing prebasal plate 15 grades occur.

And then, owing to being provided with sorting unit 46 and pulverizing unit 47 in resin sealing apparatus A2, therefore withThe situation of resin sealing apparatus A1 shown in Fig. 5 is same, can effectively utilize and be supplied to resin sealing apparatusResin sealing material 5 in A2.

In addition, owing to being provided with collecting unit of dust 50, by baffle plate 45 will comprise resin material receiving element 58 withSorting unit 46 is isolated with space and other spaces of pulverizing unit 47, to being present in the particulate in isolated spaceSon attracts and control of dust, therefore same with the situation of the resin sealing apparatus A1 shown in Fig. 5, can suppressBe attached to because comprising the atomic foreign matter of resin system the drawback that sealing prebasal plate 15 grades occur.

In addition, in resin sealing apparatus A2, owing to using mold release film 6, therefore with the resin shown in Fig. 5The situation of sealing device A1 is same, manufacturing electronic device 28((4) with reference to Fig. 2) time can improve productMatter.

In addition, in resin sealing apparatus A2, due to the exhausted space of air bound outside at least forming under middle matched moulds state23 and reduced pressure (with reference to Fig. 1 (3)) in the exhausted space 23 of this outer air bound, therefore with shown in Fig. 5The situation of resin sealing apparatus A1 is same, manufacturing electronic device 28((4) with reference to Fig. 2) time can carryHigh-quality.

In addition,, in resin sealing apparatus A2 shown in Figure 6, can also exchange formed body allocation units 34With the plan-position of resin material with unit 60. While so exchange, resin material is with showing in unit 60 and Fig. 6The forming unit 33 on the right side going out is adjacent, and adjacent with formed body allocation units 34 (in other words, by right sideForming unit 33 clips with formed body allocation units 34), in resin sealing apparatus A2, handling arrange freely.

The particle diameter D illustrating in present specification refers to by optical unit photographs resin sealing material 5 and obtainsTo image in the area equivalent circular diameter of projected area of these particles. Therefore, with same resin sealingWith material 5 be object, the mensuration (calculating) of usable floor area equivalent diameter other determination methods in addition, for exampleWhen mensuration, shading method or the screening method of Feret's diameter etc. are measured particle diameter D, likely obtain and present specificationIn the different measured value of particle diameter D. While using other determination methods to measure particle diameter D, and by present specificationThe measured value displacement of determination method while measuring, judge whether to be included in the of the particle diameter D that illustrates in present specificationIn two specifications. In other words, by the particle diameter D illustrating in the measured value that uses other determination methods to obtain and present specificationThe second specification directly contrast imappropriate.

While measuring the particle diameter D of resin sealing material 5, the resin being dispersed in pallet is taken in use from top closeThe method of envelope use material 5, the method from side shooting from the resin sealing material 5 of batcher free-falling etc.But, be not limited to these. The total of all resin sealing materials 5 that can supply with taking wish is that object is surveyedDetermine particle diameter D. Replace therewith, the resin sealing material 5 that can also supply with from wish, extract a part of sample out,Measure particle diameter D taking this sample as object.

In explanation up to the present, inside at resin sealing apparatus A1, A2 is arranged according to particle diameter DThe sorting unit 46 of the second specification sorting resin sealing material 5 of setting and the result judgement of pulverizing sortingFor particle diameter D than the example of the pulverizing unit 47 of the outer material of the large specification of the second specification be illustrated (with reference to Fig. 5,6). Be not limited to this, as variation, can also be in outer setting sorting unit and the pulverizing of resin sealing apparatusUnit the two. In this case, the outside at resin sealing apparatus can be sorted in advance and powder as requiredBroken resin sealing material 5 is supplied in resin sealing apparatus.

As other variation, can also sorting unit be set in the inside of resin sealing apparatus, seal at resinThe outer setting of device is pulverized the pulverizing unit of the outer material of specification that is judged as the second specification that does not meet particle diameter D.The operation that outer specification material is transplanted in pulverizing unit can manually be carried out by operator, also can use alongThe conveyance unit of rail moving or the conveyance unit reciprocally with the arm of rotation carry out.

In the structure of up to the present explanation, replace and supplying with baffle plate 20, can also be at the first feed unit 3The middle whereabouts mouth that resin sealing material 5 is set. In this structure, by making resin sealing material 5 on one sideDrop in die cavity 4 and the first feed unit 3 is moved on one side, thereby die cavity 4 is supplied with to resin sealing material 5.As the whereabouts mouth of resin sealing material 5, the whereabouts mouth of the shape with groove shape is preferably almost flatly set.And then, preferably with the profile with respect to die cavity 4 in overlooking, the not phase of track of whereabouts resin sealing material 5Mutual respect is folded and disjoint mode moves the first feed unit 3. Further, preferably add by use the unit that shakesThereby the mouth that falls is applied to vibration vibrates resin sealing material 5 while for the profile whereabouts of die cavity 4Resin sealing material 5.

In the structure of up to the present explanation, can also adopt first, second following change structure. FirstTo change structure be to arrange to have the first feed unit of housing, with the inner side overlooking middle covering housing and housingMode is adsorbed rectangular-shaped mold release film 6 at the lower surface of the first feed unit, to what surrounded by housing and mold release film 6The structure of resin sealing material 5 is supplied with in the resettlement section that space forms. According to this structure, in resettlement section, accommodateHave under the state of resin sealing material 5, make the first feed unit move to the top of die cavity 4. Remove forWhen the absorption of mold release film 6, in the inner surface absorption mold release film 6 of die cavity 4. Accordingly, supply with de-to die cavity 4Mould film 6 and resin sealing material 5.

The second change structure is that first feed unit with recess is set, and recess is supplied with to resin sealing material5, adsorb rectangular-shaped mold release film 6 at the upper surface of the first feed unit, make the structure of the first feed unit reversion.According to this structure, make the first feed unit of reversion move to the top of die cavity 4. Remove for mold release film 6When absorption, in the inner surface absorption mold release film 6 of die cavity 4. Accordingly, die cavity 4 is supplied with to mold release film 6 and treeFat sealing material 5.

While the first feed unit being supplied with to resin sealing material 5 in two above-mentioned change structures, can bothUse adds the unit that shakes. In addition, by the whereabouts mouth of the first feed unit whereabouts resin sealing material 5 is appliedVibration, thus can make resin sealing material 5 vibrate. Now, preferably above the first feed unit oneLimit vibrates resin sealing material 5, on one side to the first feed unit whereabouts resin sealing material 5.

In explanation up to the present, to the conveyer that conveyance is sealed to prebasal plate 15 and formed body 26 withThe conveyer of conveyance resin sealing material 5 is illustrated (ginseng as the example of main conveyance unit 38 jointlyAccording to Fig. 5,6). Replace this structure, conveyance can also be sealed to the conveyance system of prebasal plate 15 and formed body 26The conveyer of system and conveyance resin sealing material 5 is as another set of system.

In explanation up to the present, the structure that is provided with a composition pattern in a forming unit 33 is enteredGo explanation (with reference to Fig. 5,6). Replace this structure, can also prepare two groups for a forming unit 33Comprise a composition pattern of counterdie 1 and patrix 2, configure respectively a composition pattern epimere and hypomere two sections.In this structure, by making the action of common mould switching mechanism, thereby in matched moulds and die sinking in fact simultaneouslyOne composition pattern of one composition pattern of section and hypomere. As common mould switching mechanism, for example, use servo electricityThe gear unit of the drive source such as motivation, hydraulic cylinder and rack and pinion etc. According to this structure, have in useWhen the forming unit 33 of identical proprietary area, can realize the production efficiency of twice.

In explanation up to the present, the embodiment that uses mold release film 6 is illustrated (with reference to Fig. 2's(2), 5,6). But, the physical property of material using according to shaping mould and the group of the physical property of sealing resin 25Close, also can not use mold release film 6.

In explanation up to the present, to the exhausted space 23 of air bound outside at least forming under middle matched moulds state, rightThe embodiment reducing pressure in the exhausted space 23 of this outer air bound is illustrated (with reference to Fig. 1 (3)). But,According to relevant quality levels such as the bubbles that sealing resin 25 is required, also can not implement to form outer air bound empty absolutelyBetween 23 pairs of exhausted spaces 23 of this outer air bound reduce pressure.

In explanation up to the present, as shown in Fig. 2 (3), (4), make formed body 26 with each region18 is unit singualtion. For example, on the directions X in Fig. 2 (3), exist in four and Y-direction and existWhen four regions 18, formed body 26 monolithics turn to 16 electronic devices 28 that are made up of a region 18 respectivelyForm monolithic. But be not limited to this, can also with four common regions in and Y-direction on directions X (withUnder be expressed as " 1 × 4 ". ) formed body 26 monolithics are turned to, or make formed body with 4 × 1 common regions26 monolithics turn to. Like this, can manufacture four electronic devices 28 that formed by four regions 18 respectively. And then,Can make formed body 26 singualtion with 2 × 2 region, manufacture four electronics that formed by four regions 18 respectivelyDevice 28. Further, can from formed body 26, remove the unwanted part in end, with 4 × 4 districtTerritory makes formed body 26 singualtion, manufactures the electronic device 28 being made up of 16 regions 18. Therefore, coreWhen sheet 14 is LED chip, can easily manufacture row shape or planar optics (illuminator).

The present invention is not limited to the above embodiments, not departing from the scope of aim of the present invention, and Ke YigenAccording to needs, any and proper combination, change or selection adopt.

Claims (30)

1. a resin sealing apparatus, possesses and has the shaping mould that the compression forming of die cavity is used, and uses the described type that is supplied toPowdery in chamber or granular resin sealing material carry out forming seal resin, by the order of the thickness to sealing resinScale value t (mm) thus set the first specification utilize described sealing resin to carry out to the electronic unit of installing in base main bodyResin sealing, described resin sealing apparatus is characterised in that to possess:
Substrate receiving element, receives described base main body from the outside of described resin sealing apparatus described electronics is installedThe sealing prebasal plate of parts;
Resin material receiving element, receives described resin sealing material from the outside of described resin sealing apparatus;
Sorting unit, is arranged on the inside of described resin sealing apparatus, is being fed into from described resin sealing materialDescribed resin sealing apparatus is to being moved between described shaping mould, relevant according to the particle diameter D of described resin sealing materialSecond specification D≤a × t (mm) sort described resin sealing material, wherein a is arithmetic number;
The first conveyance unit, is judged as the result of sorting in the specification that meets described the second specification described in material conveyance is arrivedIn shaping mould; And
Heating unit, thus its generation of described resin sealing material being supplied in described die cavity by heating and melting is meltedMelt resin,
Described thickness is the extremely size of the upper surface of described sealing resin of upper surface from described base main body,
Described the first specification is 0.03 (mm)≤t≤1.2 (mm),
Thereby by sealing resin described in the curing moulding of described molten resin.
2. resin sealing apparatus according to claim 1, is characterized in that, described the first specification is 0.05 (mm)≤t≤1.0(mm)。
3. resin sealing apparatus according to claim 1 and 2, is characterized in that, described sorting unit passes through rootThe image calculation obtaining according to the described resin sealing material of shooting goes out projected area, by the area equivalent circle of this projected areaThereby diameter is processed and is sorted described resin sealing material as described particle diameter D,
The value of described a is 3.0.
4. resin sealing apparatus according to claim 1 and 2, is characterized in that, described sorting unit utilizes gasDescribed resin sealing material is chosen in the centrifugal force that miscarriage is raw or utilization screening.
5. resin sealing apparatus according to claim 1 and 2, is characterized in that, further possesses respectively and hasOne or more forming units of described shaping mould,
Described substrate receiving element and described resin material receiving element in overlooking for one or more described moulding listsUnit configures side by side in the same side,
A described forming unit among one or more described forming units in overlooking with described substrate receiving elementAdjacent with at least one of described resin material receiving element, and in described resin sealing apparatus, handling arrange freely.
6. resin sealing apparatus according to claim 1 and 2, is characterized in that, further possesses respectively and hasOne or more forming units of described shaping mould,
Described substrate receiving element and described resin material receiving element clip one or more described moulding lists in overlookingThe opposite configuration of unit,
A described forming unit among one or more described forming units in overlooking with described substrate receiving elementAdjacent with at least one of described resin material receiving element, and in described resin sealing apparatus, handling arrange freely.
7. resin sealing apparatus according to claim 5, is characterized in that, is provided with multiple described forming units,Among these multiple described forming units one is adjacent with forming unit described in other in overlooking, and at described resinIn sealing device, handling arrange freely.
8. resin sealing apparatus according to claim 6, is characterized in that, is provided with multiple described forming units,Among these multiple described forming units one is adjacent with forming unit described in other in overlooking, and at described resinIn sealing device, handling arrange freely.
9. resin sealing apparatus according to claim 1 and 2, is characterized in that, further possesses:
Pulverizing unit, the result that pulverizing is sorted by described sorting unit is judged as and does not meet described second specification (D≤a× t (mm)) the outer material of specification; And
The second conveyance unit, by outer the described specification of pulverizing material conveyance in described sorting unit.
10. resin sealing apparatus according to claim 9, is characterized in that, further possesses:
Separating element, separates and at least comprises described resin material receiving element, described sorting unit and described pulverizing unitSpace; And
Collecting unit of dust, attracts the described space after separating.
11. resin sealing apparatus according to claim 9, is characterized in that, described sorting unit and described powderBroken unit is included in the resin material processing unit of processing the described resin sealing material receiving,
Described resin material processing unit is adjacent with described resin material receiving element, and in described resin sealing apparatusHandling arrange freely.
12. resin sealing apparatus according to claim 10, is characterized in that, described sorting unit and described powderBroken unit is included in the resin material processing unit of processing the described resin sealing material receiving,
Described resin material processing unit is adjacent with described resin material receiving element, and in described resin sealing apparatusHandling arrange freely.
13. resin sealing apparatus according to claim 1 and 2, is characterized in that, described resin sealing materialMaterial comprises resin material,
Described resin material has thermosetting,
Thereby described heating unit is by sealing resin described in the described molten resin moulding that is heating and curing.
14. resin sealing apparatus according to claim 1 and 2, is characterized in that further possessing: firstFeed unit, supplies with described resin sealing material to described die cavity;
Mobile unit, at least makes described the first feed unit move to the top of described die cavity; And
Add the unit that shakes, above described die cavity or described the first feed unit above, correspondence is fed into described typeDescribed resin sealing material in chamber applies vibration.
15. resin sealing apparatus according to claim 1 and 2, is characterized in that further possessing: outer gasIsolated unit, at least under the state of described shaping mould matched moulds by comprise the space of described die cavity and described shaping mould outsideThe isolated exhausted space of outer air bound that forms of portion; And
Decompressing unit, reduces pressure to the exhausted space of described outer air bound.
16. resin sealing apparatus according to claim 1 and 2, is characterized in that further possessing: secondFeed unit, under the state of described shaping mould die sinking to supply with mold release film with the overlapping mode of described die cavity; And
Attract unit, thereby attract described mold release film to make described mold release film be close to institute by the profile in described die cavityState profile.
The manufacture method of 17. 1 kinds of resin sealing bodies, the mould that the compression forming that resin sealing apparatus is possessed is usedSome die cavities are supplied with and are powdery or granular resin sealing material, make this resin sealing material melting and generate meltingResin, solidifies this molten resin and carrys out forming seal resin, by the desired value t (mm) of the thickness to sealing resinThereby setting the first specification utilizes described sealing resin to carry out resin sealing system to the electronic unit of installing in base main bodyMolding resins seal, the manufacture method of described resin sealing body is characterised in that, comprising:
Described resin sealing apparatus receives the operation of described resin sealing material;
At the inside of the described resin sealing apparatus second specification D relevant according to the particle diameter D of described resin sealing material≤ a × t (mm) sorts the operation of described resin sealing material, and wherein a is arithmetic number; And
The result of the described resin sealing material of sorting is judged as to material in the first specification that meets described the second specification removesDeliver to the operation in described shaping mould,
Described thickness is the extremely size of the upper surface of described sealing resin of upper surface from described base main body,
Described the first specification is 0.03 (mm)≤t≤1.2 (mm).
The manufacture method of 18. resin sealing bodies according to claim 17, is characterized in that, described the first specificationBe 0.05 (mm)≤t≤1.0 (mm).
The manufacture method of 19. resin sealing bodies according to claim 18, is characterized in that, in the described tree of sortingIn the operation of fat sealing material, go out perspective plane by the image calculation obtaining according to the described resin sealing material of shootingLong-pending, thus the area equivalent circular diameter of this projected area is processed and sorted described resin sealing material as described particle diameter DMaterial,
The value of described a is 3.0.
The manufacture method of 20. resin sealing bodies according to claim 18, is characterized in that, in the described tree of sortingIn the operation of fat sealing material, utilize centrifugal force or the utilization screening that air-flow produces to choose described resin sealing material.
21. according to the manufacture method of the resin sealing body described in claim 17~20, it is characterized in that, in sorting instituteState in the operation of resin sealing material, sort described resin sealing material in the inside of described resin sealing apparatus.
22. according to the manufacture method of the resin sealing body described in claim 17~20, it is characterized in that, in sorting instituteState in the operation of resin sealing material, sort described resin sealing material in the outside of described resin sealing apparatus.
23. according to the manufacture method of the resin sealing body described in claim 17~20, it is characterized in that, further bagDraw together:
The result of pulverizing sorting is judged as the outer material of specification the life that do not meet described the second specification (D≤a × t (mm))The operation of material after becoming to pulverize;
Sort the operation of material after described pulverizing according to described the second specification; And
The result of material after the described pulverizing of sorting is judged as to material conveyance in the second specification that meets described the second specification to be arrivedOperation in described shaping mould.
The manufacture method of 24. resin sealing bodies according to claim 23, is characterized in that, is generating described powderIn the operation of broken rear material, material outside described specification is pulverized in the inside of described resin sealing apparatus.
The manufacture method of 25. resin sealing bodies according to claim 23, is characterized in that, is generating described powderIn the operation of broken rear material, material outside described specification is pulverized in the outside of described resin sealing apparatus.
26. according to the manufacture method of the resin sealing body described in claim 17~20, it is characterized in that, further bagDraw together:
Prepare the operation of described resin sealing apparatus, described resin sealing apparatus has from described resin sealing apparatusPortion receive be provided with described electronic unit sealing prebasal plate substrate receiving element, from described resin sealing apparatusPortion receive the resin material receiving element of described resin sealing material and have respectively one of described shaping mould orMultiple forming units;
Described substrate receiving element is supplied with to the operation of described sealing prebasal plate; And
Described resin material receiving element is supplied with to the operation of described resin sealing material,
In the operation of the described sealing prebasal plate of supply and the operation of the described resin sealing material of supply, to adjacent instituteState substrate receiving element and described resin material receiving element and supply with respectively described sealing prebasal plate and described resin sealing useMaterial.
27. according to the manufacture method of the resin sealing body described in claim 17~20, it is characterized in that, further bagDraw together:
Prepare the operation of described resin sealing apparatus, described resin sealing apparatus has from described resin sealing apparatusPortion receive be provided with described electronic unit sealing prebasal plate substrate receiving element, from described resin sealing apparatusPortion receive the resin material receiving element of described resin sealing material and have respectively one of described shaping mould orMultiple forming units;
Described substrate receiving element is supplied with to the operation of described sealing prebasal plate; And
Described resin material receiving element is supplied with to the operation of described resin sealing material,
In the operation of the described sealing prebasal plate of supply and the operation of the described resin sealing material of supply, to clipping oneOr the described substrate receiving element of the opposite configuration of multiple described forming unit and described resin material receiving element supply respectivelyGive described sealing prebasal plate and described resin sealing material.
28. according to the manufacture method of the resin sealing body described in claim 17~20, it is characterized in that, further bagDraw together:
The first feed unit of making the described die cavity supply with described resin sealing material moves to the top of described die cavityOperation; And
Apply the operation of vibration to being fed into described resin sealing material in described die cavity,
Described resin sealing material is applied in the operation of vibration, above described die cavity or described first supply withThe top of unit applies vibration to described resin sealing material.
29. according to the manufacture method of the resin sealing body described in claim 17~20, it is characterized in that, further bagDraw together:
By be judged as material conveyance in described the first specification that meets described the second specification to the operation in described shaping mould itAfter, under the state of shaping mould midway or described in matched moulds of shaping mould described in matched moulds, by the space that comprises described die cavity withThe isolated operation that forms the exhausted space of outer air bound in outside of described shaping mould; And
The operation being reduced pressure in the exhausted space of described outer air bound.
30. according to the manufacture method of the resin sealing body described in claim 17~20, it is characterized in that, further bagDraw together:
Under the state of shaping mould described in die sinking to supply with the operation of mold release film with the overlapping mode of described die cavity; And
Thereby attract described mold release film to make described mold release film be close to the work of described profile by the profile in described die cavityOrder.
CN201310056521.4A 2012-02-28 2013-02-22 The manufacture method of resin sealing apparatus and resin sealing body CN103295921B (en)

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