JP6506680B2 - Resin sealing apparatus and resin sealing method - Google Patents

Description

  The present invention relates to a resin sealing device and a resin sealing method.

  In the resin sealing process in the manufacturing process of electronic components such as a BGA (Ball grid array) package, it is general to resin seal only one side of a substrate. However, in the resin sealing process in the manufacturing process of a BOC (Board On Chip) package compatible with a Dynamic Random Access Memory (DRAM) and a WBGA (Window BGA, product name) package, one side of the substrate and one side of the other are added. It is required to resin-seal the location of a part (for example, patent document 1).

JP 2001-53094 A

  In order to resin-seal both surfaces of the substrate, holes are formed in the substrate (holes for pouring resin from one surface side of the substrate to the other surface side, hereinafter referred to as “openings”) by transfer molding. There is a resin sealing method of resin sealing one surface of the substrate and rotating the resin from the opening to the other surface side to resin seal the other surface.

  On the other hand, recently, with the increasing density of portable devices and the like, there is a demand for a package in which a chip is mounted on substantially the entire surface of one side and the other side (both sides) of a substrate. In the process of manufacturing the package, it is necessary to resin-seal substantially the entire surface of each surface of the substrate.

  However, in the manufacture of the package, when the resin sealing method is used to simultaneously resin-seal both sides of the substrate, the resin (upper cavity or lower cavity) in one (upper mold or lower mold) first. May be filled. For example, when the lower mold cavity (lower cavity) is filled with resin first, there arises a problem that the substrate warps (deforms) in a convex shape. This is because, if resin sealing is performed on both surfaces simultaneously by transfer molding, resin may be filled in one of the cavities first due to gravity, flow resistance or the like. In that case, the resin flows from the one side of the substrate to the other side of the substrate through the opening of the substrate. Then, the flow resistance when the resin flows from the opening of the substrate may cause the substrate to expand toward the other surface. Then, with the substrate expanded, the other cavity is filled with resin. Although resin pressure is applied to the substrate by filling resin in one and the other cavities, the resin pressure applied to one and the other surface of the substrate is the same pressure (one and the other cavity are connected by the opening of the substrate Therefore, the resin pressure is the same), and no force is generated to return the substrate from the inflated state to the flat state. Therefore, curing of the resin proceeds in a state where the other surface side of the substrate is expanded, and molding is completed in a state where the substrate is expanded (deformed state). That is, when one side and the other side (both sides) of the substrate are resin-sealed simultaneously using the resin sealing method, the substrate may be deformed.

  Therefore, an object of the present invention is to provide a resin sealing device and a resin sealing method capable of achieving both suppression of substrate warpage and both-side molding of a substrate.

In order to achieve the above object, the resin sealing device of the present invention is
A resin sealing apparatus for sealing both sides of a substrate with resin,
A first forming module,
A second forming module,
The first molding module is a molding module for compression molding,
After one side of the substrate is resin-sealed by compression molding by the first molding module, the other side of the substrate can be resin-sealed by the second molding module. .

The resin sealing method of the present invention is
A resin sealing method of resin sealing both sides of a substrate, wherein
A first resin sealing step of sealing the resin on one side of the substrate by compression molding;
And a second resin sealing step of resin sealing the other surface of the substrate after the first resin sealing step.

  According to the present invention, it is possible to provide a resin sealing device and a resin sealing method capable of achieving both suppression of substrate warpage and both-side molding of a substrate.

FIG. 1A shows a cross-sectional view of a resin sealing device of Example 1 and a substrate sealed with the resin by the resin sealing device. FIG.1 (b) shows sectional drawing of the modification of the board | substrate pin of Fig.1 (a). FIG. 2 is a cross-sectional view illustrating an example process of the resin sealing method according to the first embodiment. FIG. 3 is a cross-sectional view illustrating another step in the resin sealing method identical to FIG. FIG. 4 is a cross-sectional view illustrating yet another step in the resin sealing method identical to FIG. FIG. 5 is a cross-sectional view illustrating yet another step in the resin sealing method identical to FIG. FIG. 6 is a cross-sectional view illustrating yet another step in the resin sealing method identical to FIG. FIG. 7 is a cross-sectional view illustrating yet another step in the resin sealing method identical to FIG. FIG. 8 is a cross-sectional view illustrating yet another step in the resin sealing method identical to FIG. FIGS. 9A to 9C are process cross-sectional views showing a modification of the resin sealing method of the first embodiment. FIG. 10 is a cross-sectional view of a first molding module of the resin sealing device of Example 2 and a substrate sealed with the resin by the first molding module. FIG. 11 is a cross-sectional view of a second molding module of the resin sealing device of Example 2 and a substrate sealed with the resin by the second molding module. FIG. 12 is a cross-sectional view illustrating an example process of the resin sealing method according to the second embodiment. FIG. 13 is a cross-sectional view illustrating another step in the resin sealing method identical to FIG. FIG. 14 is a cross-sectional view illustrating still another process of the same resin sealing method as FIG. 12. FIG. 15 is a cross-sectional view illustrating still another process of the same resin sealing method as FIG. 12. FIG. 16 is a cross-sectional view illustrating still another step in the resin sealing method identical to FIG. FIG. 17 is a cross-sectional view illustrating still another step in the resin sealing method identical to FIG. FIG. 18 is a cross-sectional view illustrating still another step in the resin sealing method identical to FIG. FIG. 19 shows a cross-sectional view of a compression molding type module and a substrate reversing mechanism of a resin sealing device of Example 3, and a substrate sealed with the resin by the same. 20 (a) to 20 (c) are cross-sectional views illustrating an example process of the resin sealing method according to the third embodiment. 21 (a) to 21 (b) are cross-sectional views illustrating a substrate sealed with a resin by the resin sealing device of the present invention.

  The invention will now be described in more detail by way of example. However, the present invention is not limited by the following description.

  In the present invention, “resin sealing” means that the resin is in a cured (solidified) state, but is not limited to this when collectively molding on both sides described later. That is, in the present invention, when collectively molding on both sides described later, “resin sealing” may be at least a state in which the resin is filled in the mold cavity at the time of mold clamping, and the resin is cured ( It may not be solidified but may be in a fluidized state.

  As described above, the resin sealing device of the present invention includes a first molding module and a second molding module, and the first molding module is a molding module for compression molding, and the first molding module is a first molding module. After one side of the substrate is resin-sealed by compression molding by the forming module, the other side of the substrate can be resin-sealed by the second forming module. In the resin sealing device of the present invention, one surface of the substrate is first resin-sealed by compression molding using a molding module for compression molding (the resin is first filled in the cavity by compression molding). The substrate used in the present invention does not need to have an opening for flowing resin from one surface side of the substrate to the other surface side. And by not providing the opening, the resin does not flow from the one surface side of the substrate through the opening to the other surface side of the substrate. Therefore, deformation (warpage) of the substrate due to flow resistance does not occur when the resin passes through the opening of the substrate. In addition, when the other surface is resin-sealed, by supporting the one surface with the compression molding resin, the warping of the substrate can be suppressed even if a resin pressure is applied to the substrate from the other surface side. it can. Thus, in the present invention, both suppression of substrate warpage and both-side molding of the substrate can be compatible.

  In the conventional method described above, that is, the method of resin sealing both surfaces of the substrate by transfer molding with an opening in the substrate, there is a problem of cost due to the opening in the substrate. In addition, when resin is rotated from the opening to the other surface side for resin sealing, the flow distance until resin sealing the entire surface of the other surface becomes long, and voids (air bubbles) are generated, which is a component There is also a problem that deformation of a wire or the like occurs.

  On the other hand, in the present invention, since resin sealing of both sides of the substrate is possible without opening the opening in the substrate first, the cost due to opening the opening in the substrate does not occur, and The flow distance until resin sealing is short, and generation of voids (air bubbles) and deformation of the wire can be suppressed.

  In the resin sealing device of the present invention, the upper and lower mold modules (one molding module) may serve as the first molding module and the second molding module. The upper and lower mold modules are provided with an upper mold and a lower mold. In this case, the resin sealing device seals the resin on one side of the substrate by compression molding with one of the upper mold and the lower mold, and then uses the other mold to resin the other side of the substrate. It can be sealed. Hereinafter, such a resin sealing device may be referred to as a "first resin sealing device". As a result, since both sides of the substrate can be molded at one time using one molding module, the production efficiency is improved, and the configuration is simplified, so that cost reduction is possible, which is preferable.

  In the resin sealing device according to the present invention, when the upper and lower mold forming modules are included (when both sides of the substrate are collectively molded using one molding module), the upper mold of the upper and lower mold forming modules is for compression molding Preferably, the lower mold of the upper and lower mold modules is a mold for transfer molding. As a result, first, the production efficiency is improved and the configuration is simplified, so that the cost is reduced. Further, if the other surface of the substrate is resin-sealed by transfer molding, it is easy to mold the terminal provided on the substrate (the other surface) in a state of being exposed from the sealing resin. The purpose of exposing the terminals is for electrical connection to the substrate.

  In the resin sealing device according to the present invention, the first molding module is a molding module having a lower mold for compression molding, and the second molding module is a molding module having an upper mold for transfer molding. May be In this case, after the lower surface of the substrate is resin-molded by compression molding using the lower mold of the first molding module, the upper surface of the substrate is transfer molded using the upper mold of the second molding module. It can be sealed. Hereinafter, such a resin sealing device may be referred to as a “second resin sealing device”. The second molding module is a molding module having an upper mold for transfer molding, and if the other surface of the substrate is resin-sealed by transfer molding, the terminal provided on the substrate (the other surface) is sealed. It is easy to mold in a state of being exposed from the resin. The purpose of exposing the terminal is as described above.

  In the resin sealing device of the present invention, the compression molding type module (one molding module) may serve as the first molding module and the second molding module. The compression molding die module is provided with a compression molding die. Furthermore, the resin sealing device may include a substrate reversing mechanism that turns the substrate upside down. In this case, one surface of the substrate is resin-sealed by compression molding using the compression molding die of the first molding module, and the substrate with the resin-sealed one surface is subjected to the substrate reversing mechanism. After turning upside down, the other surface of the substrate may be resin-sealable by the compression molding die. Hereinafter, such a resin sealing device may be referred to as a "third resin sealing device".

  In the resin sealing device of the present invention, preferably, the first molding module has an upper mold. In this case, the resin sealing device may be capable of resin sealing by compression molding of one surface of the substrate by the upper mold of the first molding module.

  In the resin sealing device of the present invention, the second molding module is preferably a molding module for transfer molding. In this case, the resin sealing device may be capable of resin sealing by transfer molding of the other surface of the substrate by the molding module for transfer molding. The second molding module is a molding module for transfer molding, and when the other surface of the substrate is resin-sealed by transfer molding, the terminal provided on the substrate (the other surface) is exposed from the sealing resin It is easy to mold in the state. The purpose of exposing the terminal is as described above.

  The resin sealing device of the present invention may further include an ejector pin. The ejector pin is provided so as to be insertable into and removable from a cavity surface of a mold provided in at least one of the first molding module and the second molding module, and the ejector pin has its tip at the time of mold opening. May be raised or lowered to protrude from the cavity surface, and at the time of clamping, the tip may be raised or lowered so as not to protrude from the cavity surface. This is preferable because the substrate after resin sealing can be easily released from the mold. The mold provided with the ejector pin may be, for example, an upper mold, a lower mold, or both of an upper mold and a lower mold.

  The resin sealing device of the present invention may further include unnecessary resin separation means. The unnecessary resin separation means may be capable of separating the unnecessary resin portion from the resin-sealed substrate after resin-sealing one surface and the other surface of the substrate. The unnecessary resin separation unit is not particularly limited, and examples thereof include separation jigs used in known methods such as gate cut and gate.

  The resin sealing device of the present invention may further include a substrate pin. The substrate pin is, for example, provided so as to protrude upward outside the lower mold cavity (lower cavity) provided in at least one of the first molding module and the second molding module. The substrate may be mountable in a state of being released from the upper surface of the lower mold. The term "placement" as used herein also includes "fixing". Thus, the resin sealing device does not cover the lower mold cavity (lower cavity) when the pressure in the mold is reduced during intermediate mold clamping, so the lower mold cavity ( The pressure in the lower cavity can be reduced. As a result, it is possible to efficiently prevent (reduce) excess air or the like from remaining in the lower mold cavity (lower cavity), and it is possible to further suppress the warpage of the substrate. When excess air or the like remains in the lower mold cavity (lower cavity), air and the like are also included in the lower mold cavity (lower cavity) in addition to the resin. By doing so, the cavity of the lower mold is filled first with resin or the like compared to the upper cavity, and pressure (resin pressure) is applied to the cavity (lower cavity) of the lower mold first. Therefore, if excess air or the like remains in the lower mold cavity (lower cavity), warpage of the substrate may occur. According to the substrate pin, such a problem can be prevented.

  The substrate pin may be integrated with the lower die, or may be separated from the lower die.

  The substrate pin may include a protruding substrate positioning portion at its tip end, for example, by forming a stepped pin. The substrate pin may be capable of mounting the substrate by inserting the substrate positioning unit into a through hole provided in the substrate. Thus, by mounting the substrate on the substrate pin, the substrate can be stably fixed at a predetermined position, which is preferable.

  In the resin sealing device of the present invention, the relief hole for the substrate positioning portion may be provided in an upper cavity frame member or the like described later of the upper mold.

  The resin sealing device of the present invention may further include a substrate transfer mechanism and a resin transfer mechanism. The substrate transfer mechanism transfers the resin-sealed substrate to a predetermined position of each forming module, and the resin transfer mechanism transfers the resin to be supplied to the substrate onto the substrate. The resin transport mechanism transports, for example, a tablet-like resin to the position of the pot. In the resin sealing device, the substrate transfer mechanism may double as the resin transfer mechanism.

  The resin sealing device of the present invention is not limited to the third resin sealing device, and may include a substrate reversing mechanism. The substrate reversing mechanism reverses the top and bottom of the resin-sealed substrate as described above.

  The resin sealing device according to the present invention is a block (a member that constitutes a cavity of a molding module for compression molding in order to absorb variations in the amount of resin when compression molding is performed using a molding module for compression molding, for example) ) May be provided with a spring to apply pressure to the resin. In addition, a ball screw or a hydraulic cylinder may be attached to a block (member) constituting the cavity, and pressure may be applied by linear motion.

  In the resin-sealed device of the present invention, when each molding module has both the upper mold and the lower mold, a release for facilitating the release of the molded resin-sealed article from the mold in the both. A film may be provided, or may be provided on either one or not.

  The resin sealing device according to the present invention includes, for example, voids (air bubbles) in the sealing resin by containing, for example, air contained in the cavity, gas contained in the resin as a result of being heated, and the like. May occur. If voids (air bubbles) are generated, the durability or reliability of the resin-sealed product may be reduced. Then, in order to reduce a void (air bubble) as needed, you may include the vacuum pump etc. for performing resin sealing molding in a vacuum (pressure reduction) state.

  As a board | substrate resin-sealed by the resin sealing apparatus of this invention, it is the mounting board by which the chip | tip was mounted in the both surfaces, for example. As the mounting substrate, for example, as shown in FIG. 21A, a chip 1 and a wire 3 for electrically connecting the chip 1 and the substrate 2 are provided on one of the both surfaces, and the both surfaces are provided. The other is the mounting substrate 11 provided with the flip chip 4 and the ball terminal 5 as the external terminal.

  Here, in the case where both surfaces of the substrate 2 having the above configuration are formed, it is necessary to expose the ball terminals 5 from at least one surface. When exposing the ball terminal 5 on the compression molding side, it is preferable to press the ball terminal 5 against the release film to expose it. Further, if necessary, after the resin sealing, in order to expose the ball terminals 5, the sealing resin may be subjected to a grinding process or the like. On the other hand, when the terminals are exposed on the transfer molding side, for example, as shown in the mounting substrate of FIG. 21 (b), the ball terminals 5 are replaced with terminals 6 having a flat exposed surface, and molding for transfer molding It is preferable that the flat terminal 6 be pressed and exposed by performing mold clamping in advance with a convex portion provided on the mold of the module. The mounting substrate 11 of FIG. 21 (b) is not provided with the ball terminals 5 of the mounting substrate 11 of FIG. 21 (a) on the one surface but on the other surface to form a flat terminal 6. Is the same as the mounting substrate 11 of FIG. 21 (a). This is preferable because reliable exposure is possible.

  In the present invention, the substrate to be resin-sealed is not limited to each mounting substrate 11 of FIGS. 21 (a) and 21 (b), but is arbitrary. As the resin-sealed substrate, for example, at least one of the chip 1, the flip chip 4 and the ball terminal 5 (or the flat terminal 6) is formed of the substrate 2 as shown in FIGS. 21 (a) and 21 (b). It may be mounted on one side or may be mounted on both sides of the substrate 2. Further, for example, the terminals may be omitted if electrical connection to the substrate (for example, connection of a power supply circuit, a signal circuit, or the like to the substrate) can be performed. The shape and size of each of the substrate 2, the chip 1, the flip chip 4, and the ball terminal 5 (or the flat terminal 6) are not particularly limited.

  As a board | substrate resin-sealed by the resin sealing apparatus of this invention, the high frequency module board | substrate for portable communication terminals etc. are mentioned, for example. In the substrate for the mobile communication terminal, in order to resin-seal both surfaces of the substrate, it is possible to open an opening in the cradle portion, but a resin sealing molding method which does not need to open the opening is desired. There is. Further, the substrate for the mobile communication terminal is small in size, and it may be difficult to open the opening and carry out resin sealing molding when the components are embedded at high density. On the other hand, in the resin-sealed device of the present invention, as described above, both sides of the substrate can be resin-sealed without opening the opening, and such a small size and high density of components are embedded. It is applicable also to the substrate which is The substrate sealed with the resin sealing device of the present invention is not particularly limited, and examples thereof include a module substrate for power control, a substrate for device control, and the like.

  A frame member having a through hole may be used to supply the substrate to the mold. In this case, for example, the substrate is adsorbed and fixed to the lower surface of the frame member. Then, the resin is supplied into the through hole of the frame member. The substrate fixed by the frame member is, for example, inserted between the upper mold and the lower mold in the mold-opened state, and the substrate is mounted on a substrate pin or the like by lowering the frame member or raising the lower mold. Place. The frame member may be withdrawn as needed. By using the frame member, the resin can be disposed on the substrate in a stable state, which is preferable.

  The resin is not particularly limited, and may be, for example, a thermosetting resin such as an epoxy resin or a silicone resin, or a thermoplastic resin. In addition, a composite material partially containing a thermosetting resin or a thermoplastic resin may be used. Examples of the form of the resin to be supplied include granular resin, flowable resin, sheet-like resin, tablet-like resin, powdery resin and the like. In the present invention, the fluid resin is not particularly limited as long as it is a resin having fluidity, and examples thereof include liquid resin and molten resin. In the present invention, the liquid resin means, for example, a resin which is liquid or has fluidity at room temperature. In the present invention, the molten resin means, for example, a resin which has become liquid or has fluidity by melting. The form of the resin may be any other form as long as it can be supplied to the cavity, pot or the like of the mold.

  Generally, "electronic component" may refer to a chip before resin sealing and to a state in which the chip is resin sealed, but in the present invention, when simply referred to as "electronic component", Unless otherwise specified, it refers to an electronic component (electronic component as a finished product) in which the chip is resin-sealed. In the present invention, “chip” refers to a chip before resin sealing, and specific examples include a chip such as an IC, a semiconductor chip, or a semiconductor element for power control. In the present invention, the chip before resin sealing is referred to as “chip” for convenience in order to distinguish it from the electronic component after resin sealing. However, the “chip” in the present invention is not particularly limited as long as it is a chip before resin sealing, and may not be in the form of a chip.

  In the present invention, the term "flip chip" refers to an IC chip having a bump-like projecting electrode called a bump on an electrode (bonding pad) on the surface of the IC chip, or to such a chip form. The chip is mounted downward (face down) on a wiring portion such as a printed circuit board. The flip chip is used, for example, as one of chips or mounting methods for wireless bonding.

  The resin sealing method of the present invention is a resin sealing method in which both sides of a substrate are sealed with resin, and a first resin sealing step in which one side of the substrate is sealed with a resin by compression molding; And a second resin sealing step of resin sealing the other surface of the substrate after the first resin sealing step. In the resin sealing method of the present invention, in order to resin-seal one surface of the substrate first by compression molding, when the other surface is resin-sealed, the one surface is supported by the resin for compression molding. Thus, warpage of the substrate can be suppressed even if resin pressure is applied to the substrate from the other surface side. For this reason, in the present invention, it is possible to achieve both suppression of substrate warpage and both-side molding of the substrate.

  In the resin sealing method of the present invention, the first resin sealing step is performed by the first molding module using the resin sealing device of the present invention, and the second molding module performs the first resin sealing step. The second resin sealing step may be performed.

  In the resin sealing method, the first resin sealing step and the second resin sealing step are carried out using the first resin sealing device of the present invention, the upper and lower mold modules (one molding Module).

  The said resin sealing method performs the said 1st resin sealing process by the said lower mold | type of the said 1st shaping | molding module using the said 2nd resin sealing apparatus of this invention, The said 2nd resin The sealing step may be performed by the upper mold of the second molding module.

  The said resin sealing method is using the said 3rd resin sealing apparatus of this invention, between the said 1st resin sealing process and the said 2nd resin sealing process, the said one surface is The first resin sealing step and the second resin sealing step are performed using the compression molding die, including a substrate inverting step of inverting the resin-sealed substrate upside down by the substrate inverting mechanism. It is also good.

  In the resin sealing method, when the resin sealing device is used, the first resin sealing step may be performed by the upper mold of the first molding module of the resin sealing device.

  In the resin sealing method, when the resin sealing device of the present invention is used, the second resin sealing step may be performed by the molding module for transfer molding of the resin sealing device.

  In the resin sealing method, when the resin sealing device of the present invention is used, the tip of the ejector pin protrudes from the bottom surface of the mold cavity when the mold is opened by the resin sealing device. And the step of raising or lowering the tip of the ejector pin so as not to protrude from the bottom surface of the cavity of the mold at the time of mold clamping.

  In the resin sealing method, when using the resin sealing device of the present invention, after resin sealing one surface and the other surface of the substrate by the resin sealing device, an unnecessary resin portion is obtained, The unnecessary resin separation step may be included to separate from the resin-sealed substrate by the unnecessary resin separation means.

  In addition, when the resin sealing device of the present invention is used, the resin sealing method may include a substrate placing step of placing the substrate on a substrate pin in a state where the substrate is released from the upper surface of the lower mold. Furthermore, in the substrate mounting step, the substrate positioning portion may be inserted into a through hole provided in the substrate so that the substrate pin may mount the substrate.

  Hereinafter, specific embodiments of the present invention will be described based on the drawings. Each drawing is schematically drawn with omission, exaggeration, etc. as appropriate for the convenience of description.

  In the present embodiment, first, an example of the resin sealing device of the present invention will be described, and next, an example of the resin sealing method of the present invention will be described. The substrate used in the present embodiment is the same as the substrate 2 of FIG.

  In the resin sealing device of the present embodiment, the upper and lower mold modules (one molding module) serve as the first molding module and the second molding module. An upper mold and a lower mold are provided in the upper and lower mold forming modules, the upper mold is a mold for compression molding, and the lower mold is a mold for transfer molding. However, the present invention is not limited to this. That is, in the present invention, for example, the upper mold may be a mold for transfer molding and the lower mold may be a mold for compression molding, contrary to the present embodiment described below.

  FIG. 1A shows a cross-sectional view of the resin sealing device of the present embodiment and a substrate sealed with the resin by the resin sealing device. As shown in FIG. 1A, the upper and lower mold forming module 10 includes an upper mold 200 and a lower mold 300 disposed to face the upper mold. As illustrated, for example, a release film 40 for facilitating release of the molded resin sealing product from the mold is adsorbed (mounted) on the mold surface (lower surface) of the upper mold 200. It can be fixed.

  In the resin sealing device of the present embodiment, the upper mold 200 is a molding mold (molding module) for compression molding, and for example, the upper cavity frame member 210, the upper cavity upper surface member 230, the plurality of elastic members 201, the upper mold It is formed of a base plate 202 and an upper mold outside air blocking member 203 having O rings 204A and 204B. In the upper mold 200, for example, an upper cavity 220 is formed by the upper cavity frame member 210 and the upper cavity upper surface member 230. The upper mold 200 is fixed to, for example, a fixing plate (not shown) of the upper and lower mold forming module 10. Further, the upper mold 200 or the upper and lower mold forming module 10 is provided with, for example, a heating unit (not shown) for heating the upper mold 200. By heating the upper mold 200 by the heating means, the resin in the upper cavity 220 is heated and cured (melted and cured). The heating unit may be provided, for example, on either or both of the upper mold 200 and the lower mold 300, and the position is not limited as long as at least one of the upper mold 200 and the lower mold 300 can be heated. .

  The upper cavity frame member 210 and the upper cavity upper surface member 230 are mounted, for example, in a state of hanging down on the upper mold base plate 202 via a plurality of elastic members 201. An upper mold outside air blocking member 203 is provided at an outer peripheral position of the upper mold base plate 202. The upper mold outside air blocking member 203 can be brought into the outside air blocking state by joining with the lower mold outside air blocking member 302 via the O-ring 204B as described later. An O-ring 204A for blocking the outside air is provided on the upper end surface of the upper mold outside air blocking member 203 (a portion sandwiched by the upper mold base plate 202 and the upper mold outside air blocking member 203). In addition, an O-ring 204B for blocking the outside air is also provided on the lower end surface of the upper mold outside-air blocking member 203. Further, the upper mold base plate 202 is provided with, for example, a hole (through hole) 205 of the upper mold 200 for forcibly sucking and depressurizing air in a space in the mold.

  In the resin sealing device shown in FIG. 1A, the upper cavity frame member 210 and the upper cavity upper surface member 230 are separated. However, the resin sealing device of the present embodiment is not limited to this, and The two may be integrated.

  The lower die 300 is a transfer die (moulding module), and is formed of, for example, a lower cavity block 320, a lower die base plate 301, and a lower air blocking member 302 having an O-ring 303. The lower cavity block 320 has a lower cavity 310. Further, the lower mold 300 or the upper and lower mold forming module 10 is provided with, for example, a heating unit (not shown) for heating the lower mold 300. By heating the lower mold 300 by the heating means, the resin in the lower cavity 310 is heated and cured (melted and cured). The lower mold 300 can be moved up and down by a drive mechanism (not shown) provided in the upper and lower mold forming module 10. That is, the lower mold 300 can move in a direction approaching the (fixed) upper mold 200 to clamp the mold. Then, the lower mold 300 can move in a direction away from the upper mold 200 to open the mold.

  The lower cavity block 320 is mounted, for example, in a state of being mounted on the lower mold base plate 301. A lower mold outside air blocking member 302 is provided at an outer peripheral position of the lower mold base plate 301. The lower mold outside air blocking member 302 is disposed immediately below the upper mold outside air blocking member 203 and the O-rings 204A and 204B for blocking the outside air. An O-ring 303 for blocking the outside air is provided on the lower end surface of the lower mold outside air blocking member 302 (a portion sandwiched by the lower mold base plate 301 and the lower mold outside air blocking member 302). By having the above configuration, upper mold outside air blocking member 203 including O rings 204A and 204B and lower mold outside air blocking member 302 including O ring 303 through O ring 204B at the time of upper and lower mold clamping. The inside of the cavity can be shut off by bonding.

  In the lower mold 300, for example, a resin passage 304 for supplying a resin material is provided. The lower cavity 310 and the pot 305 are connected by the resin passage 304. The plunger 306 disposed inside the pot 305 can move up and down by a plunger drive mechanism (not shown) provided in the upper and lower mold forming module 10. The resin may be supplied (set) into the pot 305 (on the plunger 306), and the plunger 306 may inject the resin into the lower cavity 310 through the resin passage 304 by moving the plunger 306 in the direction toward the upper mold 200. it can.

  In the lower mold 300, as shown in FIG. 1A, a substrate pin 330 is further mounted on an elastic member 340 provided inside the lower cavity block 320 outside the lower cavity 310 of the lower mold 300. In this state, it may be provided to project upward.

  As shown in FIG. 1A, each substrate pin 330 is provided on the outside of the cavity 310 of the lower mold 300 so as to protrude upward, and the substrate 2 is released from the upper surface of the lower mold 300. May be mountable. In addition, as shown in FIG. 1B, each substrate pin 330 may be, for example, a stepped pin, and may include a protruding substrate positioning portion 331 at its tip. The substrate pin 330 in FIG. 1B is the same as the substrate pin 330 in FIG. 1A except that the substrate positioning portion 331 is included. For example, as shown in FIG. 1B, each substrate pin 330 is inserted from the lower cavity block 320 by inserting the substrate positioning portion 331 into the through hole (not shown) provided in the substrate 2 as shown in FIG. It may be fixed in a free state.

  The lower portion of the lower cavity 310 of the lower mold 300 may further be provided with an ejector pin 550 as shown in FIG. 8 described later. Although the number of ejector pins may be one, a plurality of ejector pins may be used. Each of the ejector pins ascends so that its tip protrudes from the bottom surface of the lower cavity 310 of the lower mold 300 when the mold is opened, and its tip projects from the bottom surface of the lower cavity 310 of the lower mold 300 when clamping. You may not drop it.

  The resin sealing device of this embodiment may further include unnecessary resin separation means (not shown). The unnecessary resin separation means may be capable of separating the unnecessary resin portion from the resin-sealed substrate after resin-sealing one surface and the other surface of the substrate.

  Next, the resin sealing method of the present embodiment will be described with reference to FIGS. Below, the resin sealing method using the resin sealing device of a present Example is demonstrated. More specifically, the resin sealing device of FIGS. 2-8 is the same as the resin sealing device of FIG. 1 (a). The ejector pin 550 of FIG. 8 may or may not be present. In the resin sealing method, the first resin sealing step and the second resin sealing step are performed by the upper and lower mold forming module 10.

  In the resin sealing method of the present embodiment, prior to the first resin sealing step, a mold temperature raising step, a release film supply step, a substrate placement step, and a resin supply step described below are performed. Each process is an optional component in the resin sealing method.

  First, the heating means (not shown) can heat the mold (upper mold 200 and lower mold 300) and the mold (upper mold 200 and lower mold 300) can cure (melt and cure) the resin. The temperature is raised to a temperature (molding die heating step). Next, as shown in FIG. 2, the release film 40 is supplied to the upper mold 200 (release film supply step). Furthermore, the substrate 2 is placed on the substrate pin 330 in a state of being released from the upper surface of the lower mold 300 (substrate placing step). Here, the substrate 2 may be placed on the substrate pin 330 by inserting the substrate positioning portion 331 into a through hole (not shown) provided in the substrate 2.

  Next, as shown in FIG. 3, the granular resin 20a is supplied to the upper surface of the substrate 2, and the tablet resin (not shown) is supplied (set) to the pot (on the plunger 306) of the lower mold 300 (resin supply step) Furthermore, the tablet resin is heated and melted by the heated pot (and the lower mold 300) to form a molten resin (fluid resin) 30a. In the resin sealing method of the present embodiment, after the substrate 2 is supplied to the lower mold 300, it is not limited to supplying the granular resin 20a to the upper surface of the substrate 2. For example, After being supplied (set) on the upper surface, the substrate 2 supplied with the granular resin 20 a may be supplied to the lower mold 300.

  Next, as shown to FIGS. 4-5, the said 1st resin sealing process is performed. In this embodiment, although one side of the substrate 2 is sealed by compression molding in the first resin sealing step, specifically, as one example of a method of sealing the resin by the compression molding, The intermediate mold clamping process and the upper cavity resin filling process described in the above are performed.

  First, as shown in FIG. 4, the lower mold 300 is raised by a drive mechanism (not shown) to perform intermediate mold clamping (intermediate mold clamping process). In this state, the upper mold outside air blocking member 203 and the lower mold outside air blocking member 302 are joined via the O-ring 204B, and the inside of the mold is in a state of being blocked from the outside air. Then, suction in the arrow direction X shown in FIG. 4 is started from the holes 205 of the upper mold 200 to depressurize the inside of the mold.

  Next, as shown in FIG. 5, the lower die 300 is raised by the drive mechanism (not shown) to a position where the upper cavity 220 is filled with the resin 20a, and the lower die 300 is temporarily stopped at that position (upper Cavity resin filling process). Then, the granular resin 20 a is heated and melted by the upper mold 200 that has been heated (heated), and becomes a molten resin (fluid resin) 20 b. Incidentally, even if the molten resin (fluid resin) 20b has a low viscosity and resin pressure is applied to the substrate 2 from the upper mold side to temporarily generate warpage of the substrate, it is subsequently melted in the lower cavity 310. The resin (fluid resin) 30a is filled, and by applying a resin pressure to the substrate from the lower mold side, the warpage of the substrate is reduced, and if the warpage of the substrate is at a level that causes no problem, the upper cavity at this point The lower mold 300 may be raised to a position where the resin pressure is applied to 220.

  Next, as shown in FIGS. 6 to 7, the second resin sealing step is performed. In the present embodiment, the other surface of the substrate 2 is resin-sealed by transfer molding in the second resin-sealing step, but specifically, as an example of the method of resin-sealing by the transfer molding, specifically, The lower cavity resin filling process, the resin pressure process, and the mold opening process described in FIG.

  First, as shown in FIG. 6, for example, the plunger 306 is raised by the plunger drive mechanism (not shown) to a position where the lower resin cavity 310 is filled with the fluid resin 30a, and the plunger 306 is temporarily stopped at that position. (Lower cavity resin filling process).

  Next, as shown in FIG. 7, for example, the lower mold 300 and the plunger 306 are further raised substantially simultaneously, and resin pressure is applied to the upper surface side and the lower surface side of the substrate substantially simultaneously by the flowable resin 20b for compression molding. (Resin pressure process). By doing this, the warp of the substrate can be suppressed. When resin pressure is applied to the upper cavity 220 at the time shown in FIG. 7, only the plunger 306 is raised.

  Next, as shown in FIG. 8, for example, after the molten resin (flowable resin) 20 b and the flowable resin 30 a are cured and the sealing resins 20 and 30 are formed, the lower die 300 is driven by a drive mechanism (shown in FIG. Omitted) to lower the mold and open the mold (mold opening process).

  As described above, according to the resin sealing method of this embodiment, since one surface of the substrate 2 is sealed first by compression molding using the molding module for compression molding, the other surface is sealed by transfer molding. By supporting one surface with a resin for compression molding, the warpage of the substrate 2 can be suppressed even if resin pressure is applied to the substrate 2 from the other surface side. For this reason, in the present embodiment, it is possible to simultaneously suppress the warpage of the substrate 2 and to form both surfaces of the substrate 2. In addition, since both sides of the substrate 2 can be simultaneously formed using one forming module, the production efficiency is improved, and the configuration is simplified, so that the cost can be reduced. Note that, by resin-sealing the other surface by transfer molding, for example, it is possible to mold the terminal provided on the substrate (the other surface) in a state of being exposed from the sealing resin. This will be described in Example 2 (FIGS. 10 to 18) described later.

  Further, as shown in FIG. 8, in the resin sealing method of the present embodiment, at the time of mold opening, the tip end of the ejector pin 550 ascends so as to protrude from the bottom surface of the lower mold cavity; Occasionally, the tip end of the ejector pin 550 may be lowered so as not to protrude from the bottom surface of the lower mold cavity.

  Further, in the resin sealing method of the present embodiment, after the resin-sealed substrate (the molded substrate) 2 and the unnecessary resin portion 33 shown in FIG. 8 are collected together from the molding die, the unnecessary resin separating means (shown in FIG. The resin-sealed substrate (the molded substrate) 2 and the unnecessary resin portion 33 may be separated by the abbreviation). Incidentally, after the resin-sealed substrate (the molded substrate) 2 and the unnecessary resin portion 33 are separated, the resin-sealed substrate (the molded substrate) 2 and the resin molded substrate 10 together or separately from the upper and lower mold modules 10 or separately. The unnecessary resin portion 33 may be recovered from the upper and lower mold forming module 10 together.

  In the resin sealing method of the present embodiment, as shown in FIGS. 9A to 9C, the resin sealing method may be performed using the frame member 32. First, after the molding die temperature raising step and the release film supplying step shown in FIG. 2, as shown in FIG. 9A, the substrate mounting step and the resin supplying step have the internal through holes 31. The substrate 2 is adsorbed and fixed to the lower surface of the frame member 32, and the granular resin 20 a is supplied to the internal through holes 31 of the frame member 32, and the frame member 32, the substrate 2, And allow the granular resin 20a to enter between the upper and lower molds. Next, as shown in FIG. 9 (b), the substrate 2 on which the frame member 32 and the granular resin 20 a are placed is placed on the substrate pin 330 by lowering the frame member 32 or raising the lower mold 300. Do. Then, as shown in FIG. 9C, the frame member 32 is withdrawn. Except for these, the process is the same as the substrate mounting process and the resin supply process shown in FIGS. And after that, you may perform each process shown in FIGS. 4-8. Thus, as shown in FIGS. 9A to 9C, by using the frame member 32, a resin such as the granular resin 20a can be stably supplied onto the substrate 2.

  Further, in this embodiment, one of the cavities of the mold is filled first by compression molding. Thereby, coexistence of suppression of the curvature (deformation) of a board | substrate, and double-sided shaping | molding of a board | substrate is possible as mentioned above. The reason is that in compression molding, it is possible to adjust the amount of resin (resin for compression molding) supplied to the cavity. For example, when adjusting the volume of the resin, if the specific gravity of the resin is known, the adjustment can be performed by measuring the weight of the supplied resin. Specifically, for example, the resin for compression molding is supplied to the one cavity by setting the amount of resin for compression molding to substantially the same volume as the cavity on the one side (the side to be compression molded) in the flat state of the substrate. To fill. Then, it is possible to suppress at least the occurrence of swelling or denting of the substrate due to excess or deficiency of the resin amount. Thereafter, even if the other cavity is filled with resin and resin pressure is applied from the other side of the substrate, the compression molding resin having substantially the same volume as the one cavity supports from the one side of the substrate. The molding can be completed with the substrate flat.

  On the other hand, when one cavity is filled first by transfer molding, for example, the amount of resin supplied to the one cavity changes depending on the upper and lower positions of the plunger. Accordingly, there is a risk that the substrate may swell or dent due to excess or deficiency of the resin amount. Therefore, it is preferable to fill one of the cavities first by compression molding.

  When one cavity is filled first by compression molding, if the resin for compression molding in the molten state has a high viscosity, the resin strongly resists the substrate when the resin is filled in one cavity. Force may work. In that case, the substrate may swell due to the volume of the unfilled portion without filling the resin in the entire one cavity. Even in such a case, the other cavity is filled with the resin, and the resin pressure is applied to the substrate from the other surface side of the substrate to flatten the expanded substrate and fill the entire cavity with the resin. It can be done.

  Next, in this embodiment, another embodiment of the present invention, that is, another example of the resin sealing device of the present invention and the resin sealing method of the present invention will be described. The substrate used in this embodiment is different from the substrate 2 shown in FIG. 21 (b) except that the number of flat terminals 6 is different and that the flat terminals 6 are provided on the same side as the flip chip 4. It is almost the same. Although the number of flat terminals 6 is 2 in the present embodiment and the third embodiment (FIGS. 10 to 20) and 3 in FIG. 21B, these numbers are merely examples, and the present invention is not limited thereto. I do not limit at all. The same applies to the chip 1, the wire 3, the flip chip 4 and the ball terminal 5 (Example 1 and FIG. 21 (a)).

  The resin sealing device of this embodiment includes two molding modules of a first molding module having a lower mold for compression molding and a second molding module having an upper mold for transfer molding, wherein the first molding is performed The lower surface of the substrate can be resin-sealed by compression molding by the lower mold of the module, and the upper surface of the substrate can be resin-sealed by transfer molding by the upper mold of the second molded module. Furthermore, the resin sealing device of the present embodiment may include, for example, a substrate transfer mechanism.

  FIG. 10 shows a cross-sectional view of the first molding module 500 of the resin sealing device of this embodiment and the substrate 2 sealed with the resin. As shown in FIG. 10, the first forming module 500 includes a substrate holding member (upper mold) 600 and a lower mold 700 disposed to face the substrate holding member (upper mold) 600.

  The substrate holding member (upper mold) 600 exposes, for example, a communication member 610 communicating with a high pressure gas source 650 such as a compressor or a compressed air tank, the cavity top surface and the frame member 620, and the flat terminal 6 mounted on the substrate 2. And a plurality of elastic members 602 and a plate member 640. The cavity top surface and the frame member 620 have a cavity 601. The communicating member 610 and the cavity upper surface and the frame member 620 are provided in a state of hanging down on the plate member 640 via the plurality of elastic members 602. The communication member 610 is provided with an air passage (air passage) 603 for pressure-feeding the air compressed by the high pressure gas source 650 to the cavity 601. The cavity upper surface and the frame member 620 have a configuration in which an upper cavity upper surface member having a cavity 601 and a frame member surrounding the upper cavity upper surface member are integrated. A plurality of air holes 604 for communicating the air passage 603 of the communication member 610 and the cavity 601 are provided on the upper surface of the cavity 601.

  In the present embodiment, the convex member 630 may hold the substrate 2 such as the upper surface of the flat terminal 6 or the like so that the substrate 2 is not warped by the resin molding by the first molding module 500. Preferably, it is provided in a part.

  The lower mold 700 is a mold for compression molding, and is formed of, for example, a lower cavity lower surface member 710, a lower cavity frame member 720, an elastic member 702, and a lower mold base plate 730. In the lower mold 700, a lower cavity 701 is constituted by the lower cavity lower surface member 710 and the lower cavity frame member 720. The lower cavity lower surface member 710 is mounted, for example, in a state of being mounted on the lower mold base plate 730. The lower cavity lower surface member 710 may be mounted on the lower die base plate 730 via the elastic member 702, for example. The lower cavity frame member 720 is disposed, for example, so as to surround the lower cavity lower surface member 710 in a state of being mounted on the lower mold base plate 730 via a plurality of elastic members 702. Further, a sliding hole 711 is formed by the gap between the lower cavity lower surface member 710 and the lower cavity frame member 720. As described later, for example, a release film or the like can be adsorbed by suction through the slide holes 711. The lower mold 700 is provided with, for example, heating means (not shown) for heating the lower mold 700. By heating the lower mold 700 with the heating means, the resin in the lower cavity 701 is heated and cured (melted and cured). The lower mold 700 can move up and down, for example, by a drive mechanism (not shown) provided in the first molding module 500. Further, the lower mold outside air blocking member of the lower mold 700 is omitted from the illustration and the detailed description for the sake of simplification.

  FIG. 11 shows a cross-sectional view of the second molding module 800 of the resin sealing device of this embodiment and the substrate 2 sealed with the resin by the second molding module. As shown in FIG. 11, the second molding module 800 includes an upper mold 900 and a substrate holding member (lower mold) 1000 disposed to face the upper mold.

  The upper mold 900 is a mold for transfer molding, and for example, an upper cavity upper surface member 910, an upper cavity frame member 920 which is a frame member surrounding the upper cavity upper surface member 910, and a flat terminal mounted on the substrate 2. A convex member 930 for exposing 6, a plurality of elastic members 902, and an upper mold base plate 940 are formed. In the upper mold 900, an upper cavity 901 is constituted by the upper cavity upper surface member 910. The upper mold 900 is mounted with the upper cavity upper surface member 910 hanging down on the upper mold base plate 940 via a plurality of elastic members 902, and the upper cavity frame member 920 hangs down on the upper mold base plate 940. It is equipped with The upper mold outside air blocking member of the upper mold 900 is not shown and the detailed description for simplification.

  In the upper mold 900, for example, a resin passage 950 for supplying a resin material is provided. Upper cavity 901 and pot 960 are connected by resin passage 950. The plunger 970 disposed inside the pot 960 can move up and down, for example, by a plunger drive mechanism (not shown) provided in the second forming module 800.

  The substrate holding member (lower mold) 1000 is a plate for mounting the substrate 2 whose one surface is sealed by the first molding module 500 with resin, and, for example, a plurality of cavity lower surface members 1010, cavity frame members 1020, The elastic member 1030 and the base member 1040 are formed. In the substrate holding member (lower mold) 1000, for example, a cavity 1001 is formed by the cavity lower surface member 1010 and the cavity frame member 1020. The cavity lower surface member 1010 and the cavity frame member 1020 are mounted on the base member 1040 with a plurality of elastic members 1030 interposed therebetween. The substrate 2 is placed on the substrate holding member (lower mold) 1000 such that the resin-sealed region is accommodated in the cavity 1001. The second forming module 800 is provided with, for example, heating means (not shown) for heating the pot 960. By heating the pot 960 by the heating means (not shown), the resin supplied (set) to the pot 960 is heated and cured (melted and cured). The substrate holding member (lower mold) 1000 can move in the vertical direction, for example, by a substrate holding member driving mechanism (not shown) provided in the second molding module 800.

  In the present embodiment, in the first forming module 500, the cavity 601 may be filled with a gel-like solid, instead of supplying the compressed air to the cavity 601. By holding the substrate 2 with the gel-like solid, the warp of the substrate 2 can be suppressed.

  Next, the resin sealing method of the present embodiment will be described with reference to FIGS. 12 to 18. Below, although the resin sealing method using the resin sealing device of a present Example is demonstrated, the resin sealing method of a present Example is not limited to using the said resin sealing device.

  In the resin sealing method of the present embodiment, prior to the first resin sealing step, the substrate supply step and the resin supply step described below are performed. Each process is an optional component in the resin sealing method.

  First, as shown in FIG. 12, the substrate 2 is supplied to the substrate holding member (upper mold) 600 of the first forming module 500 by the substrate transfer mechanism 1100, and the substrate 2 is held by the substrate clamper and suction holes (not shown). Fix (substrate supply process). After the substrate supply process, the substrate transport mechanism 1100 is retracted.

  Next, a resin transfer mechanism (not shown) is made to enter between the substrate holding member (upper die) 600 and the lower die 700. As shown in FIG. 13, the release film 130, the resin frame member 140 placed on the release film 130, and the granular resin 150a supplied to the internal through holes 140A of the resin frame member 140 by the resin transport mechanism, Transport to the lower mold 700. Then, the release film 130 is attracted to the lower cavity 701 by suction from the sliding holes 711 in the gap between the lower cavity lower surface member 710 and the lower cavity frame member 720 by suction in the arrow direction Y shown in FIG. And the granular resin 150a (resin supply step). Thereafter, the resin transport mechanism and the resin frame member 140 are retracted.

  Next, as shown in FIGS. 14 to 15, the first resin sealing process of the present embodiment is performed. In this embodiment, in the first resin sealing step, one surface of the substrate is resin-molded by compression molding using the first molding module 500 having the lower mold.

  Specifically, first, as shown in FIG. 14, the granular resin 150a is heated and melted by the lower mold 700 heated by the heating means (not shown), and is melted into the molten resin (fluid resin) 150b. Become. Next, as shown in FIG. 14, the lower mold 700 is raised by a drive mechanism (not shown) and attached to the molten resin (fluid resin) 150b filled in the lower cavity 701 on the lower surface of the substrate 2. The chip 1 and the wire 3 are dipped. At the same time or slightly later, the high pressure gas source 650 supplies the substrate holding member (upper die) 600 with air at the same pressure as the molding pressure in the direction of the arrow in FIG. Thereby, it is possible to resin-seal one surface (lower surface) of the substrate 2 while suppressing the substrate warpage.

  Next, as shown in FIG. 15, after the molten resin (fluid resin) 150b is cured and the sealing resin 150 is formed, the lower mold 700 is lowered by a drive mechanism (not shown) to open the mold. Perform (mold opening process). When opening the mold, for example, as shown in FIG. 15, the suction through the slide hole 711 may be released. Then, after the mold is opened, the substrate 2 on which one surface (lower surface) is formed is conveyed to the second forming module 800 by the substrate conveyance mechanism 1100 (second module conveyance step).

  Next, as shown in FIG. 16, the substrate 2 is transported to the substrate holding member (lower die) 1000 of the second forming module 800 by the substrate transport mechanism 1100 shown in FIG. 15. Thereafter, the tablet resin is supplied to the pot 960 by a resin transfer mechanism (not shown), and further, the tablet resin is heated and melted by a pot (lower mold) heated by a heating means (not shown). (Flowable resin) 971a (resin supply process). The substrate transfer mechanism 1100 may supply the tablet resin. As shown in Example 3 described later, the substrate 2 may be turned upside down by a substrate reversing mechanism (not shown). In that case, the top and bottom of the cavity are reversed.

  Next, as shown in FIG. 17, the upper mold 900 and the substrate holding member (lower mold) 1000 are clamped. At this time, as shown in FIG. 17, the lower surface of the convex member 930 attached to the upper cavity surface of the upper mold 900 is brought into contact with the upper surface of the flat terminal 6 attached to the upper surface of the substrate 2 and pressed.

  Furthermore, as shown to FIGS. 17-18, the said 2nd resin sealing process of a present Example is performed. In the present embodiment, the second molding module 800 resin-seals the other surface (upper surface) of the substrate 2 by transfer molding. Specifically, as shown in FIG. 17, the substrate holding member (lower mold) 1000 is lifted by the substrate holding member driving mechanism (not shown) to clamp the substrate 2. Then, as shown in FIG. 18, the plunger 970 is raised by a plunger drive mechanism (not shown) to fill the upper cavity 901 with the molten resin (fluid resin) 971a, and further, the fluid resin 971a is cured. As shown in FIG. 18, the sealing resin 971 is used. Thus, the upper surface of the substrate 2 is sealed with a sealing resin 971 and molded. At this time, as described above, since the upper surface of the flat terminal 6 is pressed against the lower surface of the convex member 930, it is not immersed in the molten resin 971a. Therefore, resin sealing can be performed in a state where the upper surface of the flat terminal 6 is exposed from the sealing resin 971.

  As described above, according to the resin sealing method of this embodiment, since one surface of the substrate is first resin-molded by compression molding using a molding module for compression molding, the other surface is resin-molded by transfer molding. In this case, by supporting one surface with a resin for compression molding, warpage of the substrate can be suppressed even if resin pressure is applied to the substrate from the other surface side. For this reason, in the present embodiment, it is possible to simultaneously suppress the warpage of the substrate and to form both sides of the substrate. Further, in this embodiment, since the other surface is resin-sealed by transfer molding, it is easy to mold the terminal provided on the substrate (the other surface) in a state of being exposed from the sealing resin.

  Next, in the present embodiment, another example of the resin sealing device of the present invention and the resin sealing method of the present invention will be described. The substrate used in the present embodiment is the same as the substrate 2 shown in FIG.

  In the resin sealing device of the present embodiment, a compression molding type module (one molding module) serves as the first molding module and the second molding module. The compression molding die module is provided with a compression molding die. The resin sealing device further includes a substrate reversing mechanism for reversing the upper limit of the substrate.

  FIG. 19 shows a cross-sectional view of the resin sealing device of the present example and a substrate sealed with the resin. As shown in FIG. 19, the compression molding type module 500A includes a substrate holding member (upper mold) 600B and a lower mold 700 disposed opposite to the substrate holding member (upper mold) 600B. The substrate holding member (upper die) 600B is the same as the substrate holding member (upper die) 600 shown in FIG. 15 except that it does not include the convex member 630, and the lower die 700 and the lower die 700 shown in FIG. It is the same. However, in the present embodiment, the height of the cavity 601 is assumed, for example, in consideration of the actual processing (molding type and resin sealing), the height of each sealing resin after resin sealing, and the like. The height of the sealing resin of the molded substrate is the same as or slightly higher than that. By so doing, the sealing resin can be reliably accommodated in the cavity 601.

  Next, the resin sealing method according to the present embodiment will be described with reference to FIGS. Although a resin sealing method using the resin sealing device shown in FIG. 19 will be described below, the resin sealing method of this embodiment is not limited to the method using the resin sealing device.

  First, instead of the first molding module 500 of the second embodiment, a compression molding type module 500A is used, and instead of the substrate holding member (upper mold) 600 of the first molding module 500, a substrate holding member (upper mold) Except that the substrate 2 is supplied to 600 B, and the substrate 2 of Example 2 is replaced with the same substrate as that of FIG. 20A (that is, having the ball terminals 5 instead of the flat terminals 6) The substrate supply process is performed in the same manner as the substrate supply process of the second embodiment. Next, the resin supply process is performed in the same manner as the resin supply process of the second embodiment.

  Next, in the same manner as the first resin sealing step of the second embodiment, a first resin sealing step is performed (not shown).

  Next, the mold opening process is performed in the same manner as the mold opening process of the second embodiment.

  Next, as shown in FIG. 20A, the substrate 2 with one surface sealed with a resin is withdrawn from the compression molding type module 500A by the substrate reversing mechanism 1100A (exit process). The substrate reversing mechanism may double as a substrate transporting mechanism similar to the substrate transporting mechanism 1100 in the second embodiment.

  Next, as shown in FIG. 20B, the substrate reversing mechanism 1100A is rotated by 180 degrees together with the substrate 2 fixed to the substrate reversing mechanism 1100A (substrate reversing step). Next, the substrate reversing mechanism 1100A is made to enter the compression molding type module 500A (entry step). Next, as shown in FIG. 20 (c), the substrate 2 fixed to the substrate reversing mechanism 1100A is fixed to the substrate holding member (upper die) 600B by the substrate clamper and the suction hole (not shown) (substrate supply step ). In the present embodiment, the leaving step and the entering step are optional components. For example, even if the substrate 2 can be reversed without leaving it, it may not be allowed to leave if it is reversible. Further, in the substrate inverting step, in FIG. 20B, the substrate is inverted by rotating the substrate 180 degrees in the direction of the arrow in the drawing. However, the substrate inverting step is not limited to this, and for example, the substrate may be rotated in an arbitrary direction different from the arrow in FIG. 20 (b) as long as the substrate can be inverted.

  Next, in the same manner as the resin supply process of the second embodiment, the resin supply process is performed. Prior to the resin supply step, for example, the release film (used release film) used in the first resin sealing step may be collected, and a new release film may be used in the resin supply step.

  Next, a second resin sealing process is performed in the same manner as the first resin sealing process of Example 2 except that the other surface is resin-sealed instead of the one surface (a second resin-sealing process) Not shown). In the second resin sealing step, the resin-sealed surface may be pressed with compressed air, but may not be pressed.

  As described above, according to the resin sealing method of the present embodiment, when one side of the substrate is sealed first by compression molding using the compression molding mold module, the other side is sealed with resin. By supporting one surface with a resin for compression molding, it is possible to suppress the warp of the substrate even if resin pressure is applied to the substrate from the other surface side.

  The present invention is not limited to the above-described embodiment, and can be arbitrarily and appropriately combined, changed, or selected and adopted as needed without departing from the spirit of the present invention. is there.

1 chip 2 substrate 3 wire 4 flip chip 5 ball terminal 6 flat terminal (terminal)
10 upper and lower mold forming module 11 mounting substrate 20a, 150a granular resin 20b, 30a, 150b, 971a molten resin (fluid resin)
20, 30, 150, 971 Sealing resin 31, 140 A Internal through hole 32 Frame member
33 Unnecessary resin portion 40, 130 Release film 140 Resin frame member 200, 900 Upper mold 201, 340, 602, 702, 902, 1030 Elastic member 202, 940 Upper mold base plate 203 Upper mold outside air blocking member 204A, 204B, 303 O ring 205 Upper mold hole 210, 920 Upper cavity frame member 220, 901 Upper cavity 230, 910 Upper cavity upper surface member 300, 700 Lower mold 301, 730 Lower mold base plate 302 Lower mold outside air blocking member 304, 950 Resin passage 305, 960 Pot 306, 970 plunger 310, 701 lower cavity 320 lower cavity block 330 substrate pin 331 substrate positioning portion 500 first molding module 500A compression molding die module 550 ejector pin 600, 600B substrate Support member (upper die)
601, 1001 Cavity 603 Air passage 604 Air hole 610 Communication member 620 Cavity upper surface and frame member 630, 930 Convex member 640 Plate member 650 High pressure gas source 710 Lower cavity lower surface member 711 Sliding hole 720 Lower cavity frame member 800 Second molding Module 1000 Substrate holding member (lower type)
1010 cavity lower surface member 1020 cavity frame member 1040 base member 1100 substrate transport mechanism 1100A substrate reversing mechanism X, Y arrow

Claims (10)

A resin sealing apparatus for sealing both sides of a substrate with resin,
A first forming module,
A second forming module,
The first molding module is a molding module having a lower mold for compression molding,
The second molding module is a molding module having an upper mold for transfer molding,
By the lower die of the first molding module, after resin sealing the compression molding under surface of the substrate, by the upper die of the second molding module, resin molding over the surface of the substrate by transfer molding A resin sealing device characterized in that it can be stopped. The substrate is its mounting substrate chip is mounted on both sides, a resin sealing apparatus according to claim 1. In addition, including ejector pins,
The ejector pin is provided so as to be insertable into and removable from a cavity surface of a mold provided in at least one of the first molding module and the second molding module.
The ejector pin is
At the time of mold opening, its tip can be raised or lowered to protrude from the cavity surface,
The resin sealing device according to claim 1 or 2 , wherein at the time of mold clamping, the front end can be raised or lowered so as not to protrude from the cavity surface. Furthermore, it includes unnecessary resin separation means,
The unnecessary resin separating means, the one surface and the other surface of the substrate after resin sealing, the unnecessary resin portion can be separated from the resin-sealed substrate, any one of claims 1 to 3 The resin sealing device according to one item. In addition, including substrate pins,
The substrate pin is provided so as to protrude upward outside the lower mold cavity provided in at least one of the first molding module and the second molding module.
The resin sealing device according to any one of claims 1 to 4 , wherein the substrate pin can be placed with the substrate released from the upper surface of the lower mold. The substrate pin includes a protruding substrate positioning portion at its tip,
The resin sealing device according to claim 5 , wherein the substrate pin can mount the substrate by inserting the substrate positioning portion into a through hole provided in the substrate.   A resin sealing apparatus for resin sealing a double-sided mounting substrate,
  Equipped with molds for compression molding including upper and lower molds,
  The upper mold is a space supplied with gas from a high pressure gas source, and a space is formed in which the upper surface of the double-sided mounting substrate is exposed during compression molding.
  The lower mold includes a cavity lower surface member and a cavity frame member. A resin sealing method of resin sealing both sides of a substrate, wherein
A first resin sealing step of a resin sealing by compression molding under surface of the substrate,
After said first resin sealing step, a resin sealing method which comprises a second resin sealing step of a resin sealing by transfer molding on surface of the substrate. A resin sealing device according to any one of claims 1 to 6 ,
Performing the first resin sealing process with the first molding module;
The resin sealing method according to claim 8 , wherein the second resin sealing step is performed by the second molding module.   A resin sealing method for resin sealing a double-sided mounting substrate,
  The space formed in the upper mold is supplied with gas from a high pressure gas source so that the double-sided mounting substrate is clamped by the upper mold and the lower mold of the compression molding mold and the upper surface of the double-sided mounting board is exposed. A resin sealing method characterized in that compression resin molding is performed using resin supplied to a cavity constituted by a lower mold cavity lower surface member and a cavity frame member in a state.

Images