JP6071216B2 - Manufacturing method of resin sealing material and resin sealing device - Google Patents

Manufacturing method of resin sealing material and resin sealing device Download PDF

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JP6071216B2
JP6071216B2 JP2012041625A JP2012041625A JP6071216B2 JP 6071216 B2 JP6071216 B2 JP 6071216B2 JP 2012041625 A JP2012041625 A JP 2012041625A JP 2012041625 A JP2012041625 A JP 2012041625A JP 6071216 B2 JP6071216 B2 JP 6071216B2
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resin
sealing
standard
resin sealing
molding
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JP2013176875A (en
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高瀬 慎二
慎二 高瀬
衛 砂田
衛 砂田
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Towa株式会社
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93Batch processes
    • H01L24/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12041LED
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Description

The present invention relates to a resin sealing material manufacturing method and a resin sealing device , which are used when resin-sealing chip-shaped electronic components using a compression mold. Is.

  In the step of resin-sealing chip-like electronic components (hereinafter referred to as “chips”) such as IC (Integrated Circuit) chips, LED (Light Emitting Diode) chips, and chip capacitors, a curable resin is obtained by curing a fluid resin. A sealing resin made of is formed. As a result, the chip mounted on the lead frame, printed circuit board or the like (hereinafter referred to as “substrate body”) is resin-sealed. In recent years, compression molding has been used in addition to transfer molding as a method for resin sealing (see, for example, Patent Document 1). Compared to transfer molding, compression molding has advantages such as that the pressure of the fluid resin applied to the bonding wire is small and that the sealing resin can be made thinner. In compression molding, a powdery or granular resin sealing material made of a thermosetting resin or a resin sealing material (liquid resin) that is liquid at room temperature is used as a raw material for the flowable resin.

  This invention makes object the case where the powdery or granular resin sealing material which consists of thermosetting resins is used. A resin sealing material is supplied to a cavity of a molding die included in the resin sealing device, and the resin sealing material is heated and melted by a heater provided in the molding die. Is referred to as a “resin”. Subsequently, the fluid resin is heated and cured to form a sealing resin made of a cured resin in the cavity.

  By the way, in recent years, the following demands are getting stronger. The first requirement is a so-called light, thin and small requirement for an electronic component (hereinafter referred to as “electronic device”) as a finished product. Therefore, there is an increasing demand for a smaller wire diameter and a thinner sealing resin. The second requirement is accompanied by the wide adoption of LEDs. In an optical device typified by an LED among electronic devices, a sealing resin having translucency is used. When bubbles (voids) remain in the sealing resin, the optical properties are impaired. Therefore, the optical device is required to have no bubbles in the sealing resin.

JP 2007-125783 A (pages 5-9, FIG. 1)

  As a powdery or granular resin sealing material that is a raw material of the sealing resin, a raw material of a resin tablet used as a resin sealing material for transfer molding is usually diverted. The resin tablet is formed by compressing a powdery or granular resin sealing material, which is a raw material, into a cylindrical shape. In transfer molding, a resin tablet supplied to a cylindrical space called a pot is heated and melted to produce a molten resin. The produced molten resin is pressed by the plunger and injected into the cavity. The molten resin injected into the cavity is cured by being heated. Through the steps so far, the sealing resin made of the cured resin is formed.

  In transfer molding, a molten resin is produced by heating a cylindrical resin tablet in a pot. Therefore, a small variation in particle size (particle size) is not so required for a powdery or granular resin sealing material that is a raw material of a resin tablet. From this, the particle size of the powdery or granular resin sealing material used as a raw material for resin tablets in compression molding often varies greatly. In the present application documents, the term “powder or granule” means a fine powder, granule, granule, short rod, lump, small plate, or a shape similar to a sphere but not defined (for example, twisted). Shapes, irregular shapes, irregular shapes) and the like. Hereinafter, the term “granular resin” is used as a general term for “powder or granular resin sealing material”.

  By the way, the following things have been found by the inventors of the present invention. First, it has been found that the particle diameter of the resin sealing material has a large variation from the order of μm to about 2 to 3 mm.

  Secondly, when the resin sealing material having a large variation described above is used, the resin sealing material supplied to the cavity is mottled on the cavity bottom surface (inner bottom surface in the cavity). There is a tendency to be placed in. In particular, using a resin sealing material having a large variation, the target value t of the thickness of the sealing resin (the dimension from the upper surface of the substrate body to the upper surface of the sealing resin; the same applies hereinafter) is t = 0. Consider a case where a package of about 2 to 0.3 mm is to be manufactured. In this case, the resin sealing material to be supplied to the cavity has a strong tendency to be arranged in a mottled manner due to the small amount. In this case, the resin sealing material having a large variation in particle size is arranged in a distributed manner on the bottom surface of the cavity. Due to this, in the cavity, there is a case where the fluid resin present non-uniformly flows in the process until the chip is immersed in the fluid resin produced by melting the resin sealing material. is there. The flow of the flowable resin causes deformation of the wire, unfilling (in other words, bubbles) in the sealing resin, and the like.

  Thirdly, when there is a granular resin sealing material that protrudes and has a large particle size (for example, about 10 t), the resin sealing material is not sufficiently melted. There is a case where the wire may be touched in the stage. Such contact with the wire causes deformation of the wire.

  Fourthly, when a resin sealing material is supplied to the cavity by combining a shutter and a slit member (see, for example, Patent Document 1), the resin sealing has a large particle size. The presence of the material causes an increase in the weight of the flowable resin. This increases the variation in the thickness t of the sealing resin in the package.

  The fifth finding is that, depending on the properties of the resin sealing material, the resin sealing material having a small particle size should be essentially free of the resin sealing material when supplied to the cavity. There is a possibility of adhering to the place. Such adhesion may be caused by floating of the resin sealing material having a small particle diameter when the density of the resin sealing material is small. Further, such adhesion may be caused when the resin sealing material having a small particle diameter is charged with static electricity when the resin sealing material is easily charged. Adhesion of the resin sealing material to an unintended place causes the following problems. First, the resin sealing material varies and is arranged at the bottom of the cavity. Second, it is dirt on the mold. Thirdly, resin flash is generated due to insufficient clamping.

  The problem to be solved by the invention according to the present application is that due to the variation in the particle size of the powdery or granular resin sealing material that is the raw material of the sealing resin, the deformation of the wire, the bubble in the sealing resin The occurrence of problems such as occurrence and increase in variation of the thickness t of the sealing resin occurs.

  In order to solve the above-described problems, a resin sealing material according to the present invention is a resin sealing device in which an electronic component is sealed with a sealing resin using a compression molding mold provided in a resin sealing device and having a cavity. A resin sealing material that is used as a raw material of a sealing resin and includes a resin material and exhibits a powdery shape or a granular shape, and a thickness of the sealing resin is a target value t (mm) In the case of having a standard, the particle diameter D of the resin sealing material satisfies the second standard D ≦ a × t (mm), and the first standard is 0.03 (mm) ≦ t ≦ 1.2 (mm ) (A is a positive real number).

  The resin sealing material according to the present invention is characterized in that, in the above-described resin sealing material, the first standard is 0.05 (mm) ≦ t ≦ 1.0 (mm).

  Further, the resin sealing material according to the present invention is the above-described resin sealing material, the second standard calculates the projected area based on an image obtained by photographing the resin sealing material, The projected area is applied by treating the equivalent area diameter of the projected area as the particle diameter D, and the value of a is 3.0.

  Further, the resin sealing material according to the present invention is the above-described resin sealing material, wherein the resin sealing material satisfies the second standard using centrifugal force due to airflow or using a sieve. It is characterized by having been judged.

  The resin sealing material according to the present invention is characterized in that, in the above-described resin sealing material, the resin material has thermosetting properties.

  Moreover, the resin sealing material according to the present invention is characterized in that, in the above-described resin sealing material, the resin material includes an epoxy resin or a silicone resin.

  Moreover, the resin sealing material according to the present invention is characterized in that, in the above-described resin sealing material, the resin material has translucency.

  In addition, the resin sealing material according to the present invention includes at least a resin material, an additive, and a filler in the above-described resin sealing material, and the resin material is powdery or granular, and at least the resin material is added. The agent and the filler are kneaded and then pulverized and selected based on the second standard.

  In addition, the resin sealing material according to the present invention includes at least a resin material, an additive, and a filler in the above-described resin sealing material, and the resin material is powdery or granular, and at least the resin material is added. After the material and the filler are kneaded, they are pulverized and selected based on the second standard. As a result, the non-standard material that is determined not to satisfy D ≦ a × t (mm) among the second standard is pulverized. It is characterized by comprising the material in the second standard that has been determined to satisfy the second standard.

  Further, the resin sealing material according to the present invention is selected in the above-described resin sealing material from when the resin sealing material is supplied to the resin sealing device to when it is supplied to the cavity. As a result, it is characterized by being made of a material within the first standard determined to satisfy the second standard.

  Further, the resin sealing material according to the present invention is selected in the above-described resin sealing material from when the resin sealing material is supplied to the resin sealing device to when it is supplied to the cavity. As a result, the nonstandard material determined not to satisfy D ≦ a × t (mm) in the second standard is pulverized, so that the second standard is determined to satisfy the second standard. It is made of a material.

  In addition, the method for producing a resin sealing material according to the present invention uses a compression molding die provided in a resin sealing device and has a cavity when sealing an electronic component with a sealing resin. A method for producing a resin sealing material that is used as a raw material for a stop resin and that exhibits a powdery or granular form, comprising a raw material group that includes at least a resinous material that exhibits a powdery or granular form, an additive, and a filler A step of kneading the raw material group, a step of kneading the raw material group to produce a first intermediate material, a step of grinding the intermediate material to produce a second intermediate material, and a sealing resin When the thickness has the first standard with the target value t (mm), the particle size D of the resin sealing material is based on the second standard D ≦ a × t (mm) (a is positive) Of the second intermediate material, and the second of the raw material group And determining the first in-standard material determined to satisfy the standard as a resin sealing material, wherein the first standard is 0.03 (mm) ≦ t ≦ 1.2 (mm) It is characterized by.

  In the method for manufacturing a resin sealing material according to the present invention, the first standard is 0.05 (mm) ≦ t ≦ 1.0 (mm) in the above-described method for manufacturing a resin sealing material. It is characterized by that.

  Further, in the method for producing a resin sealing material according to the present invention, in the above-described method for producing a resin sealing material, in the step of selecting a raw material group, an image obtained by photographing the resin sealing material The projected area is calculated based on the above, the area equivalent circle diameter of the projected area is treated as the particle size D, the second standard is applied, and the value of a is 3.0.

  In the method for producing a resin sealing material according to the present invention, in the above-described method for producing a resin sealing material, in the step of selecting a raw material group, centrifugal force due to air current or a sieve is used. And determining whether or not the resin sealing material satisfies the second standard.

  Moreover, the manufacturing method of the resin sealing material according to the present invention is the above-described method of manufacturing the resin sealing material, and the second standard is obtained as a result of selection based on the second standard in the step of selecting the raw material group. Of these, the step of pulverizing the non-standard material determined not to satisfy D ≦ a × t (mm), the step of selecting the pulverized non-standard material based on the second standard, and the pulverized non-standard material And a step of determining a second in-standard material determined to satisfy the second standard as a resin sealing material.

  According to the present invention, the resin sealing material used as the raw material of the sealing resin when the electronic component is resin-sealed with the sealing resin satisfies the following standards. In the standard, when the thickness of the sealing resin has the first standard in which the target value is t (mm), the particle size D of the resin sealing material is D ≦ 3.0 × t ( mm). This standard is applied by calculating the projected area based on an image obtained by photographing the resin sealing material and treating the equivalent area diameter of the projected area as the particle diameter D. When the resin sealing material satisfies this standard, the occurrence of defects due to the presence of the granular resin having a large particle diameter D with respect to the target thickness t is suppressed. By setting the first standard to 0.03 (mm) ≦ t ≦ 1.2 (mm), the effect of suppressing the occurrence of the above-described problems increases.

  In addition, according to the present invention, the resin sealing material supplied to the resin sealing device is a second standard relating to the particle size D of the resin sealing material, D ≦ 3.0 × t (mm). Is selected based on the standard. As a result of the sorting, the first in-standard material determined to satisfy the second standard is conveyed to the mold. Thus, when the conventional resin sealing material is supplied, the resin sealing material made of the first in-standard material determined to satisfy the second standard is conveyed to the mold. Therefore, the occurrence of problems due to the presence of the granular resin having a large particle diameter D with respect to the target thickness t is suppressed.

  In addition, according to the present invention, the non-standard material determined not to satisfy the second standard as a result of sorting is pulverized, and the pulverized non-standard material is sorted. As a result of the sorting, the first in-standard material determined to satisfy the second standard is conveyed to the mold. Therefore, the occurrence of problems due to the presence of the granular resin having a large particle diameter D with respect to the target thickness t is suppressed. Further, a resin sealing material is effectively used.

1 (1) to 1 (3) show a step of supplying a resin sealing material in the method for manufacturing a resin sealing body using the resin sealing material according to the present invention, and heating the resin sealing material. It is the schematic which shows each of the process and the process of clamping a shaping | molding die. 2 (1) to 2 (4) show a step of curing a fluid resin in a state in which the molding die is clamped, a step of opening the molding die after forming the sealing resin, and a molded body made of a resin sealing body. FIG. 3 is a schematic view showing a step of dividing the electronic device into individual pieces and an electronic device that has been cut into pieces and completed. FIG. 3 shows the particle diameter of the resin sealing material according to the present invention when the target value t of the sealing resin thickness is 0.19 mm and the supply amount w of the resin sealing material is 4.91 g. It is explanatory drawing which shows the result of the experiment which investigates the relationship between the standard (4 levels) of this, and the condition where the resin sealing material varies and is arranged on the bottom of the cavity. FIG. 4 shows the particle size of the resin sealing material according to the present invention when the target value t of the sealing resin thickness is 0.32 mm and the supply amount w of the resin sealing material is 7.91 g. It is explanatory drawing which shows the result of the experiment which investigates the relationship between the standard (4 levels) of this, and the condition where the resin sealing material varies and is arranged on the bottom of the cavity. FIG. 5 is a plan view showing one example of a resin sealing device in which the resin sealing material according to the present invention is used. FIG. 6 is a plan view showing another example of a resin sealing device in which the resin sealing material according to the present invention is used.

According to the present invention, when the thickness of the sealing resin has the first standard of 0.03 (mm) ≦ t ≦ 1.2 (mm) with the target value being t (mm), For resin sealing to be supplied to a molding die of a resin sealing device based on D ≦ 3.0 × t (mm) which is the second standard regarding the particle size (particle diameter) D of the resin sealing material Material is sorted. As a result of the sorting, the first in-standard material determined to satisfy the second standard is conveyed to the mold. On the other hand, the nonstandard material determined as not satisfying the second standard as a result of the selection is pulverized, and the pulverized nonstandard material is selected. As a result of the sorting, the second in- standard material determined to satisfy the second standard is conveyed to the mold.

[Example 1]
A resin sealing method and a resin sealing apparatus using the resin sealing material according to the present invention will be described with reference to FIGS. In addition, in order to make it easy to understand, all drawings in the present application document are schematically omitted and exaggerated as appropriate. The same components are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

  As shown in FIG. 1 (1), the resin sealing device using the resin sealing material according to the present invention has a lower mold 1 and an upper mold 2. The lower mold 1 and the upper mold 2 together constitute a mold. Between the lower mold | type 1 and the upper mold | type 2, the 1st supply means 3 which supplies the resin sealing material (after-mentioned) is provided so that advance / retreat is possible. The lower mold 1 is provided with a cavity 4 formed of a recess. The first supply means 3 supplies the cavity 4 with a resin sealing material 5 that is in the form of powder or particles. That is, the cavity 4 is a space to which the resin sealing material 5 is to be supplied. A release film 6 is supplied between the lower mold 1 and the upper mold 2 in a stretched state.

  The lower mold 1 and the upper mold 2 can be moved up and down relatively. As a result, the lower mold 1 and the upper mold 2 are relatively close to each other and clamped, and are relatively separated from each other and the mold is opened. FIG. 1 shows an example in which the lower mold 1 is composed of an outer frame member 7 and a cavity member 8, and the outer frame member 7 is elastically supported by an elastic member (such as a spiral spring; not shown). The outer frame member 7 constitutes the side surface of the cavity 4, and the cavity member 8 constitutes the bottom surface of the cavity 4. However, the present invention is not limited thereto, and the cavity 4 may be engraved in the integrally provided lower mold 1. Instead of or in addition to the outer frame member 7 being elastically supported, the cavity member 8 may be elastically supported by the elastic member.

  The lower mold 1 is provided with a suction path 9 for sucking the release film 6 to adhere to the mold surface of the lower mold 1, in other words, for adsorbing the release film 6 to the mold surface of the lower mold 1. It has been. In FIG. 1, two downward arrows drawn on the two suction paths 9 indicate how an external suction mechanism (not shown) sucks the release film 6. The lower mold 1 is provided with a heater 10 for heating the resin sealing material 5. Note that the heater provided in the cavity member 8 is not shown.

  The upper mold 2 is provided with a seal member 11 on the surface facing the lower mold 1 (hereinafter referred to as “the mold surface of the upper mold 2”) so as to surround the cavity 4 in plan view. A suction path 12 for sucking gas in a space including the cavity 4 is provided inside the seal member 11 in plan view on the mold surface of the upper mold 2.

  A pre-sealing substrate 15 having a plurality of chips 14 mounted on the substrate body 13 is fixed to the upper mold 2 by a known method such as suction. The pre-sealing substrate 15 is fixed so as to completely include the cavity 4 in a plan view and to be positioned inside the seal member 11 and the suction path 12. The electrode of the substrate body 13 and the electrode of the chip 14 (both not shown) are electrically connected by a wire 16 such as a gold wire. The substrate body 13 is divided into a plurality of regions 18 by a lattice-like boundary line 17 provided virtually. In each region 18, one or a plurality of chips 14 are mounted.

  The first supply means 3 includes an outer frame 19 and a supply shutter 20 provided at the lower portion of the outer frame 19 so as to be freely opened and closed. In the state where the supply shutter 20 is closed, a storage portion 21 in which the resin sealing material 5 is stored is formed inside the outer frame 19.

The resin sealing material 5 according to the present invention will be described. The resin sealing material 5 is manufactured as follows. First, preparation and powdered or granular resin material made of a thermosetting resin, and additives, including at least raw material group and the filler (filler) composed of silica. Next, the raw material group is kneaded to produce a first intermediate material. Next, the kneaded first intermediate material is pulverized to produce a second intermediate material. Next, the second intermediate material is selected based on a predetermined standard. The first in-standard material determined to satisfy the predetermined standard among the second intermediate materials is determined as the resin sealing material 5.

  An epoxy resin or a silicone resin can be included as the resin material. When the resin sealing material 5 is used for the purpose of manufacturing an optical device, the resin material has translucency. In addition, in this case, the resin sealing material 5 may contain a phosphor as an additive.

  In the present invention, the resin sealing material 5 is used to form a sealing resin made of a cured resin and having a target thickness t. The standard of thickness target value t (first standard) is, for example, 0.1 (mm) ≦ t ≦ 1.2 (mm) in consideration of the recent demand for lighter, thinner and smaller electronic devices. I will do it. In consideration of a stronger demand for miniaturization, the first standard is preferably 0.05 (mm) ≦ t ≦ 1.2 (mm), and more preferably 0.05 (mm) ≦ t. It is preferable that ≦ 1.0 (mm). In consideration of the prediction that the chip thickness will be about 15 μm depending on the use of the electronic device, the first standard is preferably 0.03 (mm) ≦ t ≦ 1.0 (mm). In addition, when considering the effective use of the material, the first standard is preferably 0.03 (mm) ≦ t ≦ 1.2 (mm). From the standpoint of practical requirements, the first standard is preferably 0.2 (mm) ≦ t ≦ 1.0 (mm).

  The resin sealing material 5 has a predetermined standard (second standard) of 0.03 (mm) ≦ D ≦ 3 t (mm) regarding the particle size (particle diameter) D and the target value t of the thickness of the sealing resin. Is satisfied. This second standard is preferably 0.05 (mm) ≦ D ≦ 2 t (mm). These standards relating to the resin sealing material 5 will be described in detail later. In the present application documents, the particle diameter D of the resin sealing material 5 is the equivalent circle diameter of the projected area of the particles in the image obtained by photographing the resin sealing material 5 by optical means. ,means. Specifically, a projected area is calculated based on an image obtained by photographing the resin sealing material 5, and an area equivalent circle diameter of the projected area is handled as the particle diameter D. In FIG. 1 (1), the particle diameter D is shown for convenience.

  In addition, the case where the particle diameter D of the resin sealing material 5 is measured by means other than optical means, for example, well-known means such as centrifugal force or sieving due to airflow will be described. In this case, there is a possibility that the measured value A of the particle diameter D by the optical means described above and the measured value B of the particle diameter D by other means are different. Therefore, it is preferable to examine the correlation between the measurement value A and the measurement value B in advance and to determine a new second standard based on the correlation. It is preferable to adopt a new second standard instead of the conventional second standard and determine the particle size D of the resin sealing material 5 based on the new second standard.

  Hereinafter, with reference to FIG. 1 and FIG. 2, about the manufacturing method of the resin sealing body which manufactures the resin sealing body by resin-sealing the chip | tip 14 using the resin sealing material 5 which concerns on this invention. I will explain. Then, the manufacturing method of the electronic device which manufactures an electronic device from the molded object formed by resin-sealing the chip | tip 14 in other words, a resin sealing body is demonstrated.

  As shown in FIG. 1 (1), a release film 6 is stretched and supplied above the cavity 4 between the lower mold 1 and the upper mold 2. Thereafter, the release film 6 is sucked toward the bottom surface of the cavity 4 by the suction path 9. As a result, the release film 6 is adsorbed on the entire mold surface (hereinafter referred to as “cavity surface”) constituting the cavity 4. The mold release film 6 is continuously adsorbed until the lower mold 1 and the upper mold 2 are opened after at least the chip 14 is sealed with the resin. In the present application document, a space in which the resin sealing material 5 is to be supplied in a state where the release film 6 is adsorbed on the entire cavity surface is also referred to as a “cavity” for convenience.

  Next, the first supply means 3 enters between the lower mold 1 and the upper mold 2, and the first supply means 3 is stopped above the cavity 4. Thereafter, the supply shutter 20 is opened in the left-right direction in the figure, and the resin sealing material 5 is supplied to the cavity 4.

Next, as shown in FIG. 1B, the resin sealing material 5 supplied to the cavity 4 is heated using a heater 10. Thus, the resin sealing material 5 supplied to the cavity 4 by the first supply means 3 is melted to generate a fluid resin (see the molten resin 22 in FIG. 1 (3)). In parallel with heating the resin sealing material 5, the upper mold 2 is lowered. In addition, the lower mold | type 1 can also be raised. In short, the lower mold 1 and the upper mold 2 should be relatively close to each other.

  Next, as shown in FIG. 1 (3), the upper die 2 is further lowered to bring the lower end of the seal member 11 into contact with the die surface of the lower die 1. Thus, an outside air blocking space 23 that is a space including the cavity 4 and is blocked from the outside of the mold is formed. The outside air blocking space 23 is decompressed using decompression means (not shown) such as a decompression pump (suction pump) and a decompression tank provided outside the mold. Thereby, the minute particles contained in the outside air blocking space 23 and the gas contained in the outside air blocking space 23 and the molten resin 22 are discharged to the outside of the mold. Two upward arrows shown in the vicinity of the suction path 12 in FIG. 1 (3) indicate the gas 24 and the like 24 discharged to the outside of the mold due to the reduced pressure. The outside air blocking space 23 is decompressed in a state (intermediate mold clamping state) from when the lower end of the seal member 11 and the mold surface of the lower mold 1 come into contact until the lower mold 1 and the upper mold 2 are completely clamped. It is preferred that the process is started. It is preferable that the step of decompressing the outside air blocking space 23 is performed during a period until the molten resin 22 is completely cured.

  Next, as shown in FIG. 2 (1), the upper mold 2 is subsequently lowered. Thereby, the chip 14 and the wire 16 are immersed in the molten resin 22 (soaked), and the lower mold 1 and the upper mold 2 are completely clamped. In a state where the lower mold 1 and the upper mold 2 are completely clamped (completely clamped state), the molten resin 22 is subsequently heated while the molten resin 22 is pressurized by the lower mold 1 and the upper mold 2. As a result, the molten resin 22 is cured to form a sealing resin 25 made of a cured resin as shown in FIG.

  Next, as shown in FIG. 2 (2), the upper mold 2 is raised and the lower mold 1 and the upper mold 2 are opened. Thereafter, a molded body 26 made of a resin sealing body (sealed substrate) having the substrate body 13, the chip 14, the wire 16, and the sealing resin 25 is taken out of the mold. Through the steps so far, the step of resin-sealing the plurality of chips 14 mounted on the substrate body 13 is completed, and the molded body 26 in which the plurality of chips 14 are resin-sealed is completed.

  Next, as shown in FIG. 2 (3), the molded body 26 is fixed to a stage (not shown) using a known method such as an adhesive film or adsorption. Using the rotary blade 27, the molded body 26 is completely cut (full cut) along each boundary line 17. Specifically, the molded body 26 is completely cut along each boundary line 17 in the X direction and each boundary line 17 in the Y direction in FIG. Thereby, singulation of the molded body 26 is performed. Through the steps so far, the molded body 26 is separated into units of each region 18 and the electronic device 28 shown in FIG. 2 (4) is manufactured. Each electronic device 28 includes a unit substrate 29 in which the substrate body 13 is divided into units in each region 18, a chip 14, a wire 16, and a sealing resin 25 in units of each region 18. And a stop resin 30.

  In the step of dividing the molded body 26 into pieces, instead of full cutting, an external force is applied to the molded body 26 after forming a groove halfway in the thickness direction of the molded body 26 (after half-cutting). You may divide into pieces. Instead of the rotary blade 27, a laser beam, a water jet, a wire saw or the like can be used.

  Hereinafter, the predetermined standard regarding the particle diameter D and the target value t of the thickness of the sealing resin 25 will be described for the resin sealing material 5 according to the present invention. First, the lower limit of the standard of the particle diameter D of the resin sealing material 5 will be described. The lower limit of the standard of the particle size D need not be determined in principle even when the target value t of the thickness of the sealing resin 25 is large, as well as when it is small. However, depending on the characteristics of the resin sealing material, there is a problem that the resin sealing material 5 adheres to a place where the resin sealing material 5 should not originally exist due to floating or charging of the resin sealing material. There are things to do. In order to prevent this problem, it is preferable that the lower limit of the standard of the particle diameter D of the resin sealing material 5 is a certain large value. From experience, it has been found that when the value of the particle diameter D is less than 0.05 mm, floating or electrification or the like is likely to occur when the resin sealing material 5 is supplied or conveyed. In addition, when the value of the particle diameter D is less than 0.03 mm, it has been found that the above-described floating and charging are more likely to occur. Based on these matters, the lower limit of the standard of the particle diameter D is preferably 0.03 mm or more, and more preferably 0.05 mm or more. Therefore, when the lower limit of the standard of the particle diameter D is provided, the lower limit is determined to be 0.03 (mm) ≦ D, preferably 0.05 (mm) ≦ D.

  Secondly, the upper limit of the standard of the particle diameter D of the resin sealing material 5 will be described. The upper limit of the standard for the particle size D was determined by the following procedure. As a first procedure, the resin sealing material 5 was selected so that the particle diameter D was within a specific range (4 levels). As a second procedure, two levels having appropriate values were set as the target value t (mm) of the thickness of the sealing resin 25. As a third procedure, the weight w (g) of the resin sealing material 5 corresponding to the target value t (two levels) of the thickness of each sealing resin 25 is calculated, and the resin sealing material of that weight is used. Material 5 was actually sprayed into the evaluation cavity (planar dimension: 233 × 67 mm). The ratio (hereinafter referred to as “resin occupancy rate”) of the sprayed resin sealing material 5 covering the bottom surface of the cavity was optically measured. As a fourth procedure, when the resin sealing material 5 is used for resin sealing, the degree of resin occupancy is acceptable in terms of variations in the thickness of the actual sealing resin 25 and the like. I evaluated it. By the above four procedures, the upper limit of the standard was determined for the particle size D of the resin sealing material 5 that could be actually used.

Hereinafter, the procedure for determining the upper limit of the standard of the particle diameter D of the resin sealing material 5 will be described with reference to FIGS. 3 and 4. As a first procedure, the resin sealing material 5 was selected, and resin sealing materials Ma, Mb, Mc, and Md having a particle diameter D falling within the following range (four levels) were prepared.
Resin sealing material Ma: D = 1.0 to 2.0 mm
Resin sealing material Mb: D = 0.2 to 2.0 mm
Resin sealing material Mc: D = 0.2 to 1.0 mm
Resin sealing material Md: D = 0.2 to 0.4 mm

  As a second procedure, two levels of t = 0.19 (mm) and t = 0.32 (mm) were set as target values t (mm) for the thickness of the sealing resin 25. The value of t = 0.19 (mm) is a value set in consideration of the recent demand for lighter, thinner and smaller electronic devices 28.

  As a third procedure, when the target value t of the thickness of the sealing resin 25 is t = 0.19 (mm) and 0.32 (mm), the target value t (2 of the thickness of the sealing resin 25 The weight of the resin sealing material 5 corresponding to each level was calculated. The calculated weight was 4.91 (g) when t = 0.19 (mm) and 7.91 (g) when t = 0.32 (mm). The above-described weight value is a calculated value (theoretical value) when the chip 14 is mounted.

  In the experiment, in a state where the chip 14 is not mounted on the substrate body 13, in other words, the resin sealing material 5 is supplied for the dummy substrate. As the actual supply amount w, 6.03 g of the resin sealing material 5 instead of 4.91 g corresponding to the case of t = 0.19 (mm) corresponds to the case of t = 0.32 (mm). In place of 7.91 g, 1016 g of the resin sealing material 5 was dispersed in the evaluation cavities.

  Subsequently, as a third procedure, resin sealing materials Ma, Mb, Mc, and Md corresponding to the resin sealing material 5 of w = 4.91 (g) are prepared, and these are used as evaluation cavities. We sprayed sequentially. Similarly, resin sealing materials Ma, Mb, Mc, and Md corresponding to the resin sealing material 5 of w = 7.91 (g) were prepared, and these were sequentially dispersed in the evaluation cavity. The state of the dispersed resin sealing material 5 was photographed from above the evaluation cavity. The image obtained by photographing was binarized, and the resin occupation ratio of the resin sealing material 5 was calculated. Specifically, in an image having 256 gradations (level 0 is black and level 255 is white), the image is binarized using level 25 as a threshold value. In the binarized image, level 25 or less was judged as “the resin sealing material is present”, and the area ratio of the portion where the resin sealing material was present on the bottom surface of the evaluation cavity was calculated.

  In the case of the supply amount w = 4.91 (g), an image obtained by binarizing the state where each of the resin sealing materials Ma to Md is dispersed and a pie chart of the resin occupancy rate are shown in FIG. Shown in 1) to (4). In the case of the supply amount w = 7.91 (g), an image obtained by binarizing the state where each of the resin sealing materials Ma to Md is dispersed and a pie chart of the resin occupation ratio are shown in FIG. Shown in 1) to (4).

  As a fourth procedure, the four types of resin sealing materials Ma to Md shown in FIGS. 3 (1) to (4) are used to seal the target thickness t = 0.19 (mm). The stop resin 25 was molded (see FIG. 2 (2)). Based on the result, it is determined that the sealing resin 25 is not allowed in the cases of FIGS. 3 (1) to 3 (3), and the sealing resin 25 is allowed with a margin in the case of FIG. 3 (4). It was determined.

  Based on the results shown in FIG. 3, first, it is determined that D = 0.2 (mm) is appropriate as the lower limit value of the standard of the particle diameter D (mm) of the resin sealing material 5. It was. When the lower limit of the standard of the particle size D (mm) is D = 1.0 (mm), the resin sealing material 5 tends to be arranged in a mottled shape on the bottom surface of the evaluation cavity (FIG. 3 ( It is obvious that the sealing resin 25 is not allowed as shown in 1).

  Based on the results shown in FIG. 3, second, the upper limit value of the standard of the particle diameter D (mm) of the resin sealing material 5 is 1.0 (1.0) when D = 0.4 (mm) or more. mm) is expected to exist in the following range. This range regarding the particle diameter D is the case shown in FIG. 3 (3) and FIG. 3 (4) when the lower limit of the standard of the particle diameter D (mm) of the resin sealing material 5 is 0.2 mm. The resin occupancy rate corresponds to a range of 41% or more and 84% or less.

  Subsequently, as a fourth procedure, a target thickness value t = 0.32 (mm) using the four types of resin sealing materials Ma to Md shown in FIGS. ) Sealing resin 25 was molded (see FIG. 2B). Based on the result, it is judged that the sealing resin 25 is not allowed in the case shown in FIGS. 4 (1) and (2), and the sealing is shown in FIGS. 4 (3) and (4). It was judged to be acceptable as the stop resin 25. In addition, it was determined that the case shown in FIG. 4 (3) is an acceptable limit. Therefore, based on the result shown in FIG. 4 (particularly FIG. 4 (3)), when the lower limit of the standard of the particle diameter D (mm) of the resin sealing material 5 is 0.2 mm, the particle diameter It is estimated that D = 1.0 (mm) is appropriate as the upper limit of the standard of D (mm). The value D = 1.0 (mm) as the upper limit of the standard of the particle diameter D (mm) is D / t = for the target value t = 0.32 (mm) of the thickness of the sealing resin 25. This corresponds to the relationship of 3.125. In the case shown in FIG. 4 (3) (D = 0.2 to 1.0 mm), the resin occupation ratio is 72%.

  Subsequently, as a fourth procedure, based on the resin occupation ratio (72%) corresponding to the upper limit (D = 1.0 (mm)) of the standard of the particle diameter D (mm) estimated based on FIG. The upper limit of the standard of the particle diameter D (mm) in the case shown in FIG. 3 (3), the particle size D (mm) is D = 0.2 to 1.0 mm and the resin occupancy is 41%. In FIG. 3 (4), the particle size D (mm) is D = 0.2. The resin occupancy is 84% at ˜0.4 mm. When proportionally calculating the case where the resin occupancy is 72% among these, D = 0.567 mm is obtained as the upper limit of the standard of the particle diameter D (mm). This value of D = 0.567 mm corresponds to the case where the resin occupancy is 72%, and D / t = for the target value t = 0.19 (mm) of the thickness of the sealing resin 25. This corresponds to the relationship of 2.99.

  Summarizing the above, regarding the standard of the particle diameter D (mm), the relationship between the upper limit of the standard and the target value t (mm) of the thickness of the sealing resin 25 when the lower limit of the standard is 0.2 mm is shown in FIG. In the case of 3, D / t = 3.125, and in the case of FIG. 4, D / t = 2.99. Based on these facts, D / t = 3.0 is generally appropriate for the relationship between the upper limit of the standard of the particle diameter D (mm) and the target value t (mm) of the thickness of the sealing resin 25. Judge.

  In the case of FIG. 3 (4), it was determined that the sealing resin 25 is allowed with a margin. Based on this, the relationship between the upper limit of the standard of the particle diameter D (mm) and the target value t (mm) of the thickness of the sealing resin 25 is shown in FIG. It is determined that the case of ≈ 2.11. Therefore, regarding the preferable relationship between the upper limit of the standard of the particle diameter D (mm) and the target value t (mm) of the thickness of the sealing resin 25, it is determined that D / t = 2.0 is generally appropriate.

  From the description so far, it can be said that the following standard is appropriate for the particle diameter D (mm). First, in the case where the lower limit of the standard of the particle diameter D is provided, 0.03 (mm) ≦ D, and preferably 0.05 (mm) ≦ D. Second, the upper limit of the standard of the particle diameter D is that the relationship between the thickness of the sealing resin 25 and the target value t (mm) is D ≦ 3.0 × t, and preferably D ≦ 2. 0.0 × t.

  Therefore, the standard for the particle size D (mm) is as follows. The standard is a standard of D ≦ 3.0 × t (mm) regarding the particle diameter D and the target value t (mm) of the thickness of the sealing resin 25. This standard is preferable from the viewpoint of increasing the yield (effective utilization rate) of the resin sealing material 5. On the other hand, from the viewpoint of corresponding to a thinner electronic device 28, the standard D ≦ 2.0 × t (mm) is preferable. In the case where these standards are provided with a lower limit based on the viewpoint of suppressing floating and electrification of the resin sealing material 5, a standard of 0.03 (mm) ≦ D or 0.05 (mm) ≦ D The standard is added.

  The resin sealing material 5 according to the present embodiment is 0.03 (mm) ≦ t ≦ 1.2 (mm) as a standard (first standard) of the target value t of the thickness of the sealing resin 25. The following standard (second standard) is satisfied on the premise that the standard (preferably 0.05 (mm) ≦ t ≦ 1.0 (mm)) is satisfied. It is a standard of D ≦ 3.0 × t (mm) regarding the particle diameter D and the target value t of the thickness of the sealing resin 25. From the viewpoint of corresponding to a thinner electronic device 28, the standard is preferably D ≦ 2.0 × t (mm). When these standards are provided with a lower limit, a standard of 0.03 (mm) ≦ D or a standard of 0.05 (mm) ≦ D is added.

  When the resin sealing material 5 satisfies this standard, the following effects can be obtained. First, even when the target value t of the thickness of the sealing resin 25 is small, in other words, even when the amount of the resin sealing material 5 supplied to the cavity 4 is small, the resin sealing material 5 is the cavity. Dispersion at the bottom surface is suppressed. Thereby, in the cavity 4 shown in FIGS. 1 and 2, the fluid resin 22 generated by melting the resin sealing material 5 is suppressed from flowing. Accordingly, the deformation of the wire 16 and the occurrence of unfilling in the sealing resin 25 are suppressed.

  Second, the upper limit of the particle diameter D is suppressed to an appropriate value. Therefore, the occurrence of defects due to the presence of the granular resin having a large particle size with respect to the target thickness value t is suppressed. Specifically, variation in the thickness t of the sealing resin in the package is suppressed.

  Thirdly, adhesion of the resin sealing material 5 to an unintended place caused by floating of the resin sealing material 5 having a small particle diameter or charging with static electricity is suppressed. Therefore, the occurrence of problems due to the adhesion of the resin sealing material 5 is suppressed.

  In the present application documents, the lower limit value of the standard for the particle size D does not mean that the resin sealing material 5 including the particle size D smaller than the lower limit value is excluded. Actually, in the process of transporting or weighing the resin sealing material 5, the resin sealing material 5 is cracked or chipped, so that a fine powder or particle (on the resin sealing material 5). The resulting fine particles may be referred to as “resin-based fine particles”). Such resin-based fine particles may have a particle size D smaller than the lower limit of the standard of the particle size D. Therefore, it is not appropriate to determine that the resin-based fine particles 5 having a particle diameter D smaller than the lower limit value of the standard of the particle diameter D do not correspond to the resin sealing material 5 in the present application.

[Example 2]
One embodiment of a resin sealing device in which the resin sealing material 5 according to the present invention is used will be described with reference to FIG. As shown in FIG. 5, the resin sealing device A <b> 1 includes a material receiving means 31, a resin material processing means 32, a plurality of (two in FIG. 5) forming means 33, and a molded body discharging means 34. With. The material receiving unit 31 includes a substrate receiving unit 35 that receives the pre-sealing substrate 15 and a resin material receiving unit 36 that receives the resin sealing material 5. A conveying rail 37 is provided from the material receiving means 31 through the resin material processing means 32 and the plurality of molding means 33 to the molded body discharging means 34 in order. Main conveyance means 38 is provided on the conveyance rail 37. The main conveyance means 38 can move in the horizontal direction in the figure along the conveyance rail 37. Note that the number of forming means 33 may be one.

  The material receiving unit 31 includes a substrate receiving unit 39 that receives the pre-sealing substrate 15 from the outside of the resin sealing apparatus A1, and a substrate transfer unit 40 that transfers the received pre-sealing substrate 15 to the main transfer unit 38. The resin material receiving means 36 includes a resin receiving portion 41 that receives the resin sealing material 5 from the outside of the resin sealing device A1, and a measuring portion 42 that measures the weight, volume, and the like of the received resin sealing material 5. Have. The resin sealing material 5 to be weighed or the weighed resin sealing material 5 is accommodated in a container 43 made of, for example, a tray. The resin sealing material 5 accommodated in the container 43 is conveyed to the main conveying means 38 together with the container 43 by the first resin conveying unit 44.

  The substrate receiving means 35 and the resin material receiving means 36 are preferably partitioned by a shutter 45 that opens and closes as necessary when the first resin transport portion 44 advances and retreats. This suppresses the entry of fine particles including resin fine particles into the substrate receiving means 35.

  In the resin sealing device A1 in which the resin sealing material 5 according to the present embodiment is used, the first configuration relating to the resin material processing means 32 is employed. Adjacent to the material receiving means 31, a resin material processing means 32 is detachably provided in the resin sealing device A1. Therefore, the resin material processing means 32 is attached to the resin sealing device A1 as necessary or removed from the resin sealing device A1 as necessary.

  The resin material processing unit 32 includes a sorting unit 46 that sorts the resin sealing material 5 in accordance with a particle size standard, and a pulverizing unit 47 that crushes a non-standard material that is determined to have a particle size larger than the standard as a result of the sorting. And have. In addition, the resin material processing unit 32 includes a second resin transport unit 48 that transports the resin sealing material 5 and the nonstandard material between the resin receiving unit 41, the sorting unit 46, and the crushing unit 47.

  As the sorting means 46, for example, known means such as optical means, centrifugal force by airflow, and sieve are selected or used in appropriate combination. As the pulverizing means 47, for example, known means such as stirring and a roll mill are used. The sorting means 46 and the pulverizing means 47 are included in the resin material processing means 32.

  In order to prevent resin-based fine particles and the like from entering the substrate receiving means 35, the resin material processing means 32 is preferably provided with the following components. These components are blocked by the shutter 49 that blocks the space including the resin material receiving means 36, the sorting means 46, and the crushing means 47 from the other spaces in cooperation with the shutter 45, and the shutter 45 and the shutter 49. Dust collecting means 50 for sucking and collecting fine particles present in the space.

  As the standard of the particle diameter D applied in the sorting means 46, the following standard can be adopted in relation to the standard of the target value t of the thickness of the sealing resin 25. As a standard of thickness target value t (first standard), for example, a standard of 0.03 (mm) ≦ t ≦ 1.2 (mm) (preferably 0.05 (mm) ≦ t ≦ 1.0 The standard (mm) is adopted. As a standard (second standard) of the particle size D, for example, a standard of 0.03 (mm) ≦ D ≦ 3.0 × t (mm) (preferably 0.05 (mm) ≦ D ≦ 2.0 × t (mm)).

  Each of the plurality of forming means 33 has the following components. Examples of components include a chase holder 51, a lower mold 1 attached to the chase holder 51 and having a cavity 4, and an upper mold provided facing the lower mold 1 and to which the substrate 15 before sealing is fixed. 2 (not shown in FIG. 5). Next, the second supply means 52 supplies and releases the release film 6 between the lower mold 1 and the upper mold 2. Next, there is a decompression pump 53 that depressurizes an outside air blocking space (see the outside air blocking space 23 shown in FIG. 1 (3)) formed between the lower mold 1 and the upper mold 2.

  The molded body dispensing means 34 is provided with a molded body transporting section 54 that transports the molded body 26 and a molded body housing section 56 in which a molded body container 55 including a tray or the like in which the molded body 26 is housed is disposed. .

  In the resin sealing device A1 in which the resin sealing material 5 according to the present embodiment is used, in addition to the first configuration related to the resin material processing means 32, one or a plurality (two in FIG. 5) are provided. The 2nd structure regarding the shaping | molding means 33 is employ | adopted. The left molding means 33 shown in FIG. 5 is adjacent to the resin material processing means 32 and adjacent to the right molding means 33 (in other words, between the resin material processing means 32 and the right molding means 33). The resin sealing device A1 is detachably provided. The right molding means 33 is adjacent to the left molding means 33 and adjacent to the molded body discharging means 34 (in other words, sandwiched between the left molding means 33 and the molded body discharging means 34). The sealing device A1 is detachably provided.

  When a single molding unit 33 is provided in the resin sealing device A1, the molding unit 33 is sandwiched between the resin material processing unit 32 and the molded body discharging unit 34 in the resin sealing device A1. Attached. If the molded body discharging means 34 is removed from the resin sealing device A1, the other molding means 33 can be attached and detached adjacent to the right side of the single molding means 33 in the resin sealing device A1.

The resin sealing device A1 in which the resin sealing material 5 according to the present embodiment is used has the following effects. First, the non-standard material determined as not satisfying the second standard as a result of being sorted by the sorting means 46 is crushed by the pulverizing means 47. The ground non-standard material is sorted by the sorting means 46. As a result of the sorting, the second in- standard material determined to satisfy the second standard is conveyed to the mold. Therefore, the resin sealing material 5 supplied to the resin sealing device A1 can be used effectively.

  Secondly, by adopting the first configuration with respect to the resin material processing means 32, the resin material processing means 32 is attached to the resin sealing device A1 afterwards as needed, or the resin material processing is performed afterwards. The means 32 can be removed from the resin sealing device A1. As a result, the resin material processing means 32 is applied to the resin sealing device A1 in accordance with the specifications of the resin sealing material 5 and the thickness t (see FIG. 2) of the sealing resin 25 of the electronic device 28. And the resin material processing means 32 can be removed from the resin sealing device A1 afterwards. In addition, the resin material processing means 32 removed from the resin sealing device A1 in the first factory is transferred to a second factory that requires the resin material processing means 32, and the second factory holds it. It can be attached to the resin sealing device A1. Therefore, the manufacturer of the electronic device 28 (see FIG. 2 (4)) that uses the resin sealing device A1 determines the resin sealing according to the market trend, changes in the specifications of the resin sealing material 5 and the electronic device 28, and the like. The resin material processing means 32 can be easily attached to and detached from the stopper A1.

  Thirdly, by adopting the second configuration with respect to each molding means 33, each molding means 33 is attached to the resin sealing device A1 as necessary, or from the resin sealing device A1 as necessary. Removed. As a result, the molding means 33 is attached to the resin sealing device A1 and added in accordance with the market trend and the increase / decrease in demand, and the molding means 33 is detached from the resin sealing device A1 and molded. The number of 33 can be reduced. In addition, the molding means 33 removed from the resin sealing device A1 in the first factory is transferred to, for example, a second factory located in another area where demand is strong, and the second factory holds it. It can be attached to the resin sealing device A1. Therefore, the manufacturer of the electronic device 28 (see FIG. 2 (4)) that uses the resin sealing device A1 can easily adjust the production capacity of the electronic device 28 according to market trends, increase / decrease in demand, and the like. .

  Fourth, the space including the resin material receiving means 36, the sorting means 46, and the crushing means 47 is blocked from other spaces by the shutter 45 and the shutter 49, and the resin-based fine particles and the like existing in the blocked space are sucked. A dust collecting means 50 for collecting the dust is provided. As a result, fine particles including resin-based fine particles can be collected. Therefore, it is possible to suppress problems caused by foreign matters including resin-based fine particles adhering to the pre-sealing substrate 15 or the like.

  Fifth, by using the release film 6, the molded body 26 can be easily released from the lower mold 1 (see FIG. 2 (2)). In addition, fine irregularities provided on the cavity surface can be reliably transferred to the sealing resin 25 via the release film 6. By these, quality can be improved when manufacturing the electronic device 28 (refer FIG. 2 (4)). In particular, when manufacturing an optical device having a lens (for example, a Fresnel lens or the like) including fine irregularities, the quality can be remarkably improved.

  Sixth, the outside air blocking space 23 is formed at least in the intermediate mold clamping state, and the outside air blocking space 23 is decompressed (see FIG. 1 (3)). Thereby, generation | occurrence | production of the bubble in the sealing resin 25 is suppressed. Therefore, the quality can be improved when the electronic device 28 (see FIG. 2 (4)) is manufactured. In particular, when manufacturing an optical device having the translucent sealing resin 25, the quality can be remarkably improved.

[Example 3]
Another embodiment of the resin sealing device in which the resin sealing material 5 according to the present invention is used will be described with reference to FIG. As shown in FIG. 6, the following configuration is adopted in the resin sealing device A2.

  As a first configuration, the left molding means 33 shown in FIG. 6 is adjacent to the substrate receiving means 57 and adjacent to the right molding means 33 (in other words, the substrate receiving means 57 and the right molding means). It is sandwiched between the means 33) and is detachably provided in the resin sealing device A2. The right molding means 33 is adjacent to the left molding means 33 and adjacent to the molded body discharging means 34 (in other words, sandwiched between the left molding means 33 and the molded body discharging means 34). The sealing device A2 is detachably provided.

  As a second configuration, in the resin sealing device A1 shown in FIG. 5, the resin material receiving means 36 is included in the material receiving means 31, whereas in the resin sealing device A2, the substrate receiving means is included. Resin material receiving means 58 independent of 57 is provided adjacent to the resin material processing means 59. In FIG. 6, the resin material receiving means 58 and the resin material processing means 59 are adjacent to each other in the vertical direction of the figure. The resin material receiving means 58 and the resin material processing means 59 together constitute a resin material means 60. In addition, the resin material receiving means 58 and the resin material processing means 59 are independent modules, and are configured to be detachable from the resin material means 60. That is, the resin material processing means 59 can be attached to the resin material means 60 having the resin material receiving means 58 later.

  In the case where a single molding means 33 is provided in the resin sealing device A2, the molding means 33 is sandwiched between the substrate receiving means 57 and the molded body discharging means 34 in the resin sealing device A2. It is attached. If the resin material means 60 and the molded body discharging means 34 are removed from the resin sealing device A2, in the resin sealing device A2, another molding means is adjacent to the right side of the single molding means 33. 33 can be attached and detached.

  As a third configuration, the resin material means 60 is provided on the side opposite to the substrate receiving means 57 with the single or plural molding means 33 (two in FIG. 6) sandwiched therebetween in plan view. . Therefore, in the resin sealing apparatus A2, the substrate receiving means 57 for receiving the substrate 15 before sealing, and the resin material for receiving and selecting the resin sealing material 5 exhibiting powdery or granular form and pulverizing the nonstandard material as necessary. The use means 60 is located farthest away.

  According to the 1st structure, each shaping | molding means 33 is attached to resin sealing apparatus A2 as needed, or is removed from resin sealing apparatus A2 as needed. Therefore, the manufacturer of the electronic device 28 (see FIG. 2 (4)) that uses the resin sealing device A2 can easily adjust the production capacity of the electronic device 28 according to market trends, increase / decrease in demand, and the like. .

  According to the second configuration, the resin material processing means 59 can be attached to the resin material means 60 having the resin material receiving means 58 later. Therefore, as the unit sealing resin 30 (see FIG. 2 (4)) of the electronic device 28 has become thinner, the resin material can be used later according to the demands of the manufacturer of the electronic device 28. Processing means 59 can be added.

  According to the third configuration, resin-based fine particles and the like can be prevented from entering the substrate receiving means 57. Therefore, it is possible to prevent problems caused by foreign matters including resin-based fine particles adhering to the pre-sealing substrate 15 or the like.

  In addition, sorting means 46 and crushing means 47 are provided in the resin sealing device A2. Accordingly, the resin sealing material 5 supplied to the resin sealing device A2 can be effectively used as in the case of the resin sealing device A1 shown in FIG.

  Further, a dust collecting means 50 that blocks the space including the resin material receiving means 58, the sorting means 46, and the pulverizing means 47 from other spaces by the shutter 45, and sucks and collects fine particles present in the blocked space. Provide. As a result, similarly to the case of the resin sealing device A1 shown in FIG. 5, it is possible to suppress problems caused by foreign matters including resin-based fine particles adhering to the pre-sealing substrate 15 and the like.

  Moreover, the release film 6 is used in the resin sealing device A2. As a result, as in the case of the resin sealing device A1 shown in FIG. 5, the quality can be improved when the electronic device 28 (see FIG. 2 (4)) is manufactured.

  Further, in the resin sealing device A2, the outside air blocking space 23 is formed at least in the intermediate mold clamping state, and the outside air blocking space 23 is decompressed (see FIG. 1 (3)). As a result, as in the case of the resin sealing device A1 shown in FIG. 5, the quality can be improved when the electronic device 28 (see FIG. 2 (4)) is manufactured.

  In the resin sealing device A2 shown in FIG. 6, the planar positions of the molded body dispensing means 34 and the resin material means 60 may be interchanged. In this case, the resin material means 60 is adjacent to the right molding means 33 shown in FIG. 6 and adjacent to the molded body discharging means 34 (in other words, the right molding means). The resin sealing device A2 is detachably provided between the means 33 and the molded body discharging means 34).

  The particle diameter D described in the present application document means an area equivalent circle diameter of the projected area of these particles in an image obtained by photographing the resin sealing material 5 by optical means. Therefore, for the same resin sealing material 5, the particle diameter D can be measured by using a measurement method other than the measurement (calculation) of the equivalent circle diameter, for example, the measurement of the ferret diameter, the shading method, the screening method, or the like. May be measured, which may be different from the particle diameter D in the present application document. If the particle size D is measured using another measurement method, is it replaced with the measurement value when measured by the measurement method in the present application document and included in the standard of the particle size D described in the present application document? Judge whether or not. In other words, it is not appropriate to directly compare the measurement values obtained using other measurement methods with the standard of the particle size D described in the present application document.

  When measuring the particle diameter D of the resin sealing material 5, a method of photographing the resin sealing material 5 sprayed on the tray from above, the resin sealing material 5 that freely falls from the feeder from the side. A method of photographing is used. However, it is not limited to these. The particle diameter D can be measured for all the resin sealing materials 5 to be supplied. Instead, a part of the sample can be extracted from the resin sealing material 5 to be supplied, and the particle diameter D can be measured for the sample.

  In the description so far, the sorting means 46 for sorting the resin sealing material 5 in accordance with the standard for the particle size D, and the pulverization for pulverizing the non-standard material whose particle size D is determined to be larger than the standard as a result of the sorting. The example which provided the means 47 inside resin sealing apparatus A1 and A2 was demonstrated (refer FIG. 5, 6). Not only this but as a modification, you may provide both a selection means and a grinding | pulverization means outside the resin sealing apparatus. In this case, the resin sealing material 5 that has been selected in advance outside the resin sealing device and pulverized as necessary can be supplied to the resin sealing device.

  As another modified example, the selecting means may be provided inside the resin sealing device, and the pulverizing means for pulverizing the nonstandard material determined not to satisfy the standard of the particle diameter D may be provided outside the resin sealing device. . The step of transferring the nonstandard material to the crushing means may be performed manually by an operator, or may be performed using a conveying means that moves along a rail or a conveying means that has an arm that rotates so as to reciprocate.

  In the description so far, instead of the supply shutter 20, the first supply means 3 may be provided with an outlet for the resin sealing material 5. In this case, the resin sealing material 5 is supplied to the cavity 4 by moving the first supply means 3 while dropping the resin sealing material 5 into the cavity 4. As a dropper for the resin sealing material 5, a dropper having a bowl shape is preferably provided almost horizontally. In addition, it is preferable to move the first supply means 3 so that the locus of dropping the resin sealing material 5 with respect to the mold surface of the cavity 4 in plan view does not overlap and do not intersect with each other. Furthermore, it is preferable that the resin sealing material 5 is dropped with respect to the mold surface of the cavity 4 while vibrating the resin sealing material 5 by applying vibration to the drop port using a vibrating means.

  The following configuration may be adopted. In the first configuration, a first release means having an outer frame is provided, and a rectangular release film 6 is formed on the lower surface of the first supply means so as to cover the outer frame and the inner side of the outer frame in plan view. The resin sealing material 5 is supplied to the housing portion formed of a space surrounded by the outer frame and the release film 6. According to this configuration, the first supply means is moved above the cavity 4 in a state where the resin sealing material 5 is accommodated in the accommodating portion. While releasing the adsorption to the release film 6, the release film 6 is adsorbed to the inner surface of the cavity 4. Thus, the release film 6 and the resin sealing material 5 are supplied to the cavity 4.

  The second configuration includes a first supply unit having a recess, supplies the resin sealing material 5 to the recess, adsorbs the rectangular release film 6 on the upper surface of the first supply unit, In this configuration, one supply means is reversed. According to this configuration, the inverted first supply means is moved above the cavity 4. While releasing the adsorption to the release film 6, the release film 6 is adsorbed to the inner surface of the cavity 4. Thus, the release film 6 and the resin sealing material 5 are supplied to the cavity 4.

  In either of the two configurations described above, the vibration means can be used when the resin sealing material 5 is supplied to the first supply means. The resin sealing material 5 is vibrated by applying vibration to a drop port through which the resin sealing material 5 is dropped with respect to the first supply means. It is preferable to drop the resin sealing material 5 on the first supply means while vibrating the resin sealing material 5 above the first supply means.

  In the description so far, the example in which the transport system for transporting the pre-sealing substrate 15 and the molded body 26 and the transport system for transporting the resin sealing material 5 are shared as the main transport means 38 has been described ( (See FIGS. 5 and 6). Instead of this, the transport system for transporting the pre-sealing substrate 15 and the molded body 26 and the transport system for transporting the resin sealing material 5 may be separate systems.

  In the description so far, the configuration in which one set of forming dies is provided in one forming means 33 has been described (see FIGS. 5 and 6). Instead of this, two sets of molds including the lower mold 1 and the upper mold 2 are prepared for one molding means 33, and one set is formed in each of the upper and lower stages. A mold may be placed. In this case, by operating a common mold opening / closing mechanism, the upper set of molds and the lower set of molds can be clamped and opened substantially simultaneously. As a common mold opening / closing mechanism, for example, a drive source such as a servo motor or a hydraulic cylinder and a transmission means such as a rack and pinion are used. According to this configuration, double production efficiency can be realized when the molding means 33 having the same exclusive area is used.

  In the description so far, the embodiment using the release film 6 has been described (see FIGS. 2 (2), 5 and 6). Depending on the combination of the physical properties of the material used for the mold and the physical properties of the sealing resin 25, the release film 6 may not be used.

  In the description so far, the embodiment has been described in which the outside air blocking space 23 is formed at least in the intermediate mold clamping state and the outside air blocking space 23 is decompressed (see FIG. 1 (3)). Depending on the quality level required for the bubbles or the like required for the sealing resin 25, it is not necessary to form the outside air blocking space 23 and depressurize the outside air blocking space 23.

  In the description so far, as shown in FIGS. 2 (3) and 2 (4), the molded body 26 is divided into individual regions 18 units. For example, in the case where there are four regions 18 in the X direction and four regions 18 in the Y direction in FIG. 2 (3), the compact 26 has 16 electronic devices 28 each composed of one region 18. It is divided into pieces. Not limited to this, the molded body 26 is divided into pieces in a region (hereinafter referred to as “1 × 4”) that is one piece in the X direction and four pieces in the Y direction, or is formed into a region that is gathered in 4 × 1. The body 26 can be separated into four electronic devices 28 each consisting of four regions 18. In addition, the molded body 26 can be divided into 2 × 2 regions, and four electronic devices 28 each having four regions 18 can be manufactured. Further, an unnecessary portion at the end portion is removed from the molded body 26, and the molded body 26 is separated into 4 × 4 areas to manufacture one electronic device 28 composed of 16 areas 18. it can. Therefore, in the case where the chip 14 is an LED chip, it is possible to easily manufacture a row or planar optical device (light emitting body).

  The present invention is not limited to the above-described embodiments, and can be arbitrarily combined, modified, or selected and adopted as necessary without departing from the spirit of the present invention. is there.

DESCRIPTION OF SYMBOLS 1 Lower mold | type 2 Upper mold | type 3 1st supply means 4 Cavity 5 Resin sealing material 6 Release film 7 Outer frame member 8 Cavity member 9 Suction path (suction means)
10 Heater (heating means)
11 Seal member (outside air blocking means)
12 Suction passage (pressure reduction means)
13 Substrate body 14 Chip (electronic component)
DESCRIPTION OF SYMBOLS 15 Substrate before sealing 16 Wire 17 Boundary line 18 Area | region 19 Outer frame 20 Supply shutter 21 Housing | casing part 22 Molten resin 23 Outside air blocking space 24 Gas discharged | emitted 25 Sealing resin 26 Molded body (resin sealing body)
27 Rotating blade 28 Electronic device 29 Unit substrate 30 Unit sealing resin 31 Material receiving means 32, 59 Resin material processing means 33 Molding means 34 Molded body dispensing means 35, 57 Substrate receiving means 36, 58 Resin material receiving means 37 Conveying rail 38 Main transfer means (first transfer means)
39 Substrate receiving section 40 Substrate transport section 41 Resin receiving section 42 Weighing section 43 Container 44 First resin transport section 45, 49 Shutter (partitioning means)
46 Sorting means 47 Crushing means 48 Second resin transport section (second transport means)
50 Dust collecting means 51 Chase holder 52 Second supply means 53 Pressure reducing pump (pressure reducing means)
54 Molded body conveyance section 55 Molded body container 56 Molded body accommodation section 60 Resin material means A1, A2 Resin sealing device D Particle size t Target value of sealing resin thickness

Claims (18)

  1. When the electronic component mounted on the substrate body is resin-sealed with a sealing resin composed of a cured resin after curing using a compression molding mold provided in the resin sealing device and having a cavity. A method for producing a resin sealing material, which is used as a raw material for a resin and produces a resin sealing material containing a resin material and exhibiting a powdery or granular shape ,
    The resin sealing material includes at least the resin material, an additive, and a filler,
    The resin material is powdery or granular,
    In the case where the thickness of the sealing resin has a first standard in which the target value is t (mm), the resin sealing material has D ≦ a × t related to the particle size D of the resin sealing material. Satisfies the second standard (mm) (coefficient a is a positive real number),
    The first standard is a standard related to the thickness of the sealing resin, and 0.03 (mm) ≦ t ≦ 1.2 (mm),
    The second standard is a standard related to the particle diameter D of the resin sealing material and the thickness of the sealing resin,
    The coefficient a satisfies 2.99 ≦ a ≦ 3.125,
    The thickness of the sealing resin in the first standard is a dimension from the upper surface of the substrate body to the upper surface of the sealing resin,
    Kneading at least the resin material, the additive and the filler;
    Crushing the kneaded resin material, the additive, and the filler;
    A method for producing a resin sealing material, comprising a step of selecting the pulverized resin material, the additive, and the filler based on the second standard.
  2. In the manufacturing method of the resin sealing material described in Claim 1 ,
    A step of pulverizing a non-standard material is determined not to satisfy the sorted result and the second standard based on the second standard,
    Obtaining the second in-standard material determined to satisfy the second standard by sorting the pulverized non-standard material based on the second standard;
    Manufacturing method of the resin sealing material, characterized by further comprising the step of determining the second standard within the material in the resin sealing material.
  3. In the method for producing a resin sealing material according to claim 1 or 2 ,
    The resin sealing material is selected from the first in-standard material determined to satisfy the second standard as a result of being selected after being supplied to the cavity after being supplied to the resin sealing device. The manufacturing method of the material for resin sealing characterized by becoming.
  4. In the method for producing a resin sealing material according to claim 1 or 2 ,
    The non-standard material determined to not satisfy the second standard is pulverized as a result of sorting the resin sealing material from the time it is supplied to the resin sealing device to the time it is supplied to the cavity. The method for producing a resin sealing material comprising: a second in-standard material that has been determined to satisfy the second standard.
  5. When the electronic component mounted on the substrate body is resin-sealed with a sealing resin composed of a cured resin after curing using a compression molding mold provided in the resin sealing device and having a cavity. A method for producing a resin sealing material that is used as a raw material of a resin and exhibits a powdery or granular shape,
    Preparing a raw material group including at least a resin material exhibiting powdery or granular form, an additive, and a filler;
    Kneading the raw material group;
    Kneading the raw material group to produce a first intermediate material;
    Crushing the first intermediate material to produce a second intermediate material;
    In a case wherein the first standard thickness of the sealing resin is a target value t (mm), D ≦ about the thickness of the sealing resin and the particle size D of the resin sealing material a × t Selecting the second intermediate material based on a second standard (mm) (coefficient a is a positive real number);
    Determining a first in-standard material determined to satisfy the second standard among the raw material group as the resin sealing material,
    The first standard is a standard related to the thickness of the sealing resin, and 0.03 (mm) ≦ t ≦ 1.2 (mm),
    The coefficient a satisfies 2.99 ≦ a ≦ 3.125,
    The method for producing a resin sealing material, wherein the thickness of the sealing resin in the first standard is a dimension from the upper surface of the substrate body to the upper surface of the sealing resin.
  6. In the manufacturing method of the resin sealing material described in Claim 1 or 5 ,
    Resin characterized in that the first standard is 0.05 (mm) ≦ t ≦ 1.0 (mm) instead of 0.03 (mm) ≦ t ≦ 1.2 (mm) Manufacturing method of sealing material.
  7. In the manufacturing method of the resin sealing material described in Claim 1 or 5 ,
    In the step of selecting the raw material group, a projected area is calculated based on an image obtained by photographing the resin sealing material, and an area equivalent circle diameter of the projected area is handled as the particle diameter D. A method for producing a resin sealing material, wherein the second standard is applied.
  8. In the manufacturing method of the resin sealing material described in Claim 1 or 5 ,
    In the step of selecting the raw material group, it is determined whether the resin sealing material satisfies the second standard by using centrifugal force due to airflow or by using a sieve. Manufacturing method of sealing material.
  9. In the manufacturing method of the resin sealing material described in Claim 5 ,
    A step of pulverizing the non-standard material determined not to satisfy the second standard as a result of the selection based on the second standard in the step of selecting the raw material group;
    Screening the pulverized non-standard material based on the second standard;
    A resin sealing material comprising a step of determining, as the resin sealing material, a second in-standard material determined to satisfy the second standard among the pulverized non-standard material Manufacturing method.
  10. A molding means using a molding die for compression molding having a cavity is formed, and a sealing resin composed of a cured resin after curing is molded using a powdery or granular resin sealing material supplied to the cavity. In accordance with a first standard in which the target value of the thickness of the sealing resin is t (mm), a resin sealing device for resin sealing an electronic component mounted on a substrate body with the sealing resin,
      A substrate receiving means for receiving a pre-sealing substrate in which the electronic component is mounted on the substrate body from the outside of the resin sealing device;
      A resin material receiving means for receiving the resin sealing material from the outside of the resin sealing device;
      First conveying means for conveying the resin sealing material to the molding means;
      Heating means for generating a molten resin by heating and melting the resin sealing material supplied to the cavity;
      Partition means for partitioning a space including at least the resin material receiving means;
      A dust collecting means for sucking the partitioned space,
      The resin material receiving means is within the first standard selected as the resin sealing material based on a second standard D ≦ a × t (mm) related to the particle size D of the resin sealing material. Accept material (coefficient a is a positive real number),
    The first standard is a standard related to the thickness of the sealing resin, and 0.03 (mm) ≦ t ≦ 1.2 (mm),
    The second standard is a standard related to the particle diameter D of the resin sealing material and the thickness of the sealing resin,
    The coefficient a satisfies 2.99 ≦ a ≦ 3.125,
    The thickness of the sealing resin in the first standard is a dimension from the upper surface of the substrate body to the upper surface of the sealing resin,
      The said 1st conveyance means conveys the said 1st specification material to the said shaping | molding means as said resin sealing material, The resin sealing apparatus characterized by the above-mentioned.
  11. In the resin sealing device according to claim 10,
      The first standard is 0.05 (mm) ≦ t ≦ 1.0 (mm).
  12. In the resin sealing device according to claim 10,
    Comprising one or a plurality of said forming means,
      The substrate receiving means and the resin material receiving means are arranged on the same side with respect to one or a plurality of the forming means in plan view,
      One of the molding means or one of the molding means is adjacent to at least one of the substrate receiving means and the resin material receiving means in a plan view, and the resin sealing device A resin sealing device, wherein the device is detachable.
  13. In the resin sealing device according to claim 10,
    Comprising one or a plurality of molding means each having the mold;
      The substrate receiving means and the resin material receiving means are arranged to face each other with one or a plurality of the molding means in plan view,
      One of the molding means or one of the molding means is adjacent to at least one of the substrate receiving means and the resin material receiving means in a plan view, and the resin sealing device A resin sealing device, wherein the device is detachable.
  14. In the resin sealing device according to claim 12 or 13,
      One of the plurality of molding means is provided adjacent to the other molding means in plan view and detachably provided in the resin sealing device. Resin sealing device.
  15. In the resin sealing device according to claim 10,
    The resin sealing material includes a resin material,
      The resin material has thermosetting properties,
      The resin sealing device, wherein the heating means forms the sealing resin by heating and curing the molten resin.
  16. In the resin sealing device according to claim 10,
    A first supply means for supplying the resin sealing material to the cavity;
      The resin sealing apparatus, wherein the first transport unit moves the first supply unit to the molding unit having the cavity.
  17. In the resin sealing device according to claim 10,
    An outside air blocking means for blocking the space including the cavity from the outside of the mold at least when the mold is clamped to form an outside air blocking space;
      A resin sealing device comprising: a decompression unit that decompresses the outside air blocking space.
  18. In the resin sealing device according to claim 10,
    Second supply means for supplying a release film so as to overlap the cavity in a state where the mold is opened;
      A resin sealing device comprising: suction means for adhering the release film to the mold surface by sucking the release film toward the mold surface in the cavity.
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KR1020130006910A KR20130098898A (en) 2012-02-28 2013-01-22 Material for resin sealing and manufacturing method for the same
CN201310056524.8A CN103295975B (en) 2012-02-28 2013-02-22 Resin seal material and manufacture method thereof
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JP5627619B2 (en) * 2012-02-28 2014-11-19 Towa株式会社 Resin sealing device and method for manufacturing resin sealing body
JP6057880B2 (en) * 2013-11-28 2017-01-11 Towa株式会社 Resin material supply method and supply device for compression molding apparatus
JP6430143B2 (en) * 2014-04-30 2018-11-28 Towa株式会社 Resin molding apparatus, resin molding method, and molded product manufacturing method
JP6444707B2 (en) * 2014-11-28 2018-12-26 Towa株式会社 Electronic component, manufacturing method and manufacturing apparatus
JP6525580B2 (en) * 2014-12-24 2019-06-05 Towa株式会社 Resin molding apparatus and resin molding method
CN105098030A (en) * 2015-06-17 2015-11-25 苏州迈瑞微电子有限公司 Integrated circuit (IC) package method and package structure
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Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11246671A (en) * 1998-02-26 1999-09-14 Shin Etsu Chem Co Ltd Production of granular epoxy resin composition
JP3594489B2 (en) * 1998-07-03 2004-12-02 京セラケミカル株式会社 Method for manufacturing resin-encapsulated electronic component
JP2007197571A (en) * 2006-01-26 2007-08-09 Matsushita Electric Works Ltd Epoxy resin composition for sealing and resin-sealed electronic component
JP5277569B2 (en) * 2007-06-11 2013-08-28 住友ベークライト株式会社 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
JP2009007524A (en) * 2007-06-29 2009-01-15 Asahi Glass Co Ltd Translucent sealing curable composition
JP2009275110A (en) * 2008-05-14 2009-11-26 Nitto Denko Corp Resin composition for encapsulating semiconductor and semiconductor device using the same
JP5086945B2 (en) * 2008-09-05 2012-11-28 株式会社東芝 Manufacturing method of semiconductor device
CN102246295B (en) * 2008-12-10 2013-09-04 住友电木株式会社 Granulated epoxy resin composition for semiconductor encapsulation, semiconductor device using same, and method for manufacturing semiconductor device
MY152389A (en) * 2008-12-10 2014-09-15 Sumitomo Bakelite Co Resin composition for encapsulating semiconductor, method for producing semiconductor device and semiconductor device
JP2010247429A (en) * 2009-04-15 2010-11-04 Apic Yamada Corp Resin sealing apparatus and resin sealing method using the same
JP2011171436A (en) * 2010-02-17 2011-09-01 Tdk Corp Electronic component built-in module and manufacturing method of the same
JP2012028651A (en) * 2010-07-26 2012-02-09 Toshiba Corp Resin supply device and method for manufacturing semiconductor device
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