JP2010247429A - Resin sealing apparatus and resin sealing method using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To finish a resin sealed section of a resin sealed article consistently in a state free from unevenness by performing resin sealing by uniformly applying a molding resin to a cavity space. <P>SOLUTION: A resin sealing apparatus is equipped with stockers 130A, B which stock granular molding resins 120A, B according to each particle size range, a molding resin supply amount calculation means PC, a molding resin pulling out means to take out the granular molding resins 120A, B based on the supply amount calculated, a loading means 160 for loading the granular molding resins 120A, B, and an injection means for injecting the granular molding resins 120A, B to a lower mold 230 by reciprocating the loading means 160 between a loading position and a mold position, wherein the supply amount calculation means PC conducts a calculation based on the reserved amount of the granular molding resins 120A, B in the stocker 130A, B and the amount of the granular molding resins 120A, B used in the resin sealing of an electronic component 240 so that respective ratios of supply amount of the granular molding resins 120A, B out of stockers 130A, B may become a given ratio. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a resin sealing device that compresses and molds an electronic component using a granular molding resin, and a resin sealing method using the same.

The resin sealing molding method for electronic parts is a transfer molding method in which the molding resin in the pot is pumped into the cavity by the plunger to resin-mold the electronic component, and the molding resin is supplied to the cavity space for molding. A compression molding method is widely known in which an electronic component is resin-sealed and molded by clamping an upper die and a lower die each holding an electronic component in one of them after the resin is melted. Among such molding methods, the compression molding method is preferable in that the resin for molding is not pumped and the collapse of the wire of the electronic component due to the molten resin can be suppressed. As a resin sealing molding method and apparatus suitable for use in performing such a compression molding method, for example, there is one described in Patent Document 1.
In the resin sealing molding method and apparatus disclosed in Patent Document 1, the resin material before or after being put into the cavity space (cavity forming portion) is pressurized by the pressurizing means, and supplied to the cavity space. A resin sealing method and a resin sealing device are disclosed in which the resin material is made uniform, and the occurrence of defects such as voids and unfilling in the resin sealing portion of the resin-sealed product can be suppressed.

JP 2004-216558 A

  In recent years, since the depth dimension in the cavity space has become smaller and the planar area of the cavity space has expanded, the molding resin can be supplied in a uniform amount over the entire planar area of the cavity space. It has become difficult. When resin sealing is performed in such a state, a problem that voids are likely to occur in the resin sealing part and a problem that large variations in the quality of the resin sealing part are likely to occur are newly found. It was done. Such a problem is often observed particularly when a granular molding resin is used.

  Therefore, in the compression molding of electronic parts using a granular molding resin, the present invention always supplies the molding resin uniformly to the cavity space even in a shallow cavity space with a large planar dimension. An object of the present invention is to provide a resin sealing device capable of forming a resin sealing portion in a non-uniform state and also suitably suppressing generation of voids and a resin sealing method using the same.

In order to achieve the above object, the inventor of the present application can solve the above-mentioned problems by preliminarily separating the molding resin for each required particle size and supplying the sorted molding resin evenly to the cavity space. As a result, the present invention was completed.
That is, the present invention comprises a supply unit that supplies a granular molding resin to a lower mold, and an upper mold and a heating unit that heats the lower mold to a resin sealing temperature, and the upper mold and the An electronic component resin sealing device for resin-sealing the electronic component by clamping the electronic component together with the granular molding resin with a lower mold, wherein the supply unit is the granular molding resin A plurality of stockers that are separated and stored for each required particle size range, a storage amount of the granular molding resin in each stocker, and a usage amount of the granular molding resin when resin-sealing the electronic component Based on the above, the molding resin for calculating the supply amount of the granular molding resin from each stocker so that the ratio between the supply amounts of the granular molding resin supplied from the respective stockers becomes a predetermined ratio Supply amount calculating means; Based on the supply amount calculated by the molding resin supply amount calculation means, the molding resin take-out means for taking out the granular molding resin in each stocker, and the stock resin take-out means supplied from each stocker. Loading means for loading granular molding resin, and reciprocating the loading means between the loading position of the granular molding resin and the mold position, and the loaded granular molding resin to the lower mold A resin sealing device for an electronic component, comprising:

  In addition, the supply unit further includes temporary stacking means for temporarily stacking the granular molding resin supplied from each stocker. As a result, the granular molding resin to be used for the next resin sealing can be prepared while the loading means loaded with the granular molding resin is being transported to the lower mold. Parts can be sealed with resin.

  An intermediate position between the granular molding resin loading position and the mold position is an intermediate position in an environment isolated from the environment at the granular molding resin loading position and the environment at the mold position. A processing unit is provided, and the intermediate processing unit is provided with at least one of a decompression unit, a cooling unit, and a moisture absorption unit. This prevents the powdered molding resin from scattering from the molding resin loading position to the outside by reducing the molding resin loading position before the granular molding resin is charged into the lower mold. it can. In addition, by cooling the granular molding resin loaded in the loading means and in the loading means, it is possible to prevent melting of the granular molding resin before the lower mold is charged, and the deterioration of the molding resin and the resin sealing. It is possible to suppress the quality deterioration of the stopper. In addition, after the lower mold is put into the granular molding resin, the fine resin that has not been put into the lower mold is removed to prevent contamination of the resin sealing device by the fine resin remaining in the loading means. be able to.

  Further, the apparatus further comprises leveling means for leveling the loading state of the granular molding resin in the stacking means. Thereby, since the loading state of the granular molding resin loaded on the loading means becomes uniform, the granular molding resin can be charged in a more uniform state to the lower mold. It becomes possible to more reliably suppress quality variations.

Each stocker is provided with a vibration generating means that operates in response to the operation of the molding resin take-out means. Further, the loading means is provided with a vibration generating means that operates in response to an operation when the granular molding resin loaded on the loading means is put into the lower mold.
As a result, even if the stocker stores fine granular resin, the required amount of granular resin can be reliably supplied to the stacking means, temporary stacking means, or lower mold. It is possible to suitably prevent the fine granular resin for molding from remaining inside or on the loading means.

  Further, the present invention is further characterized by further comprising charge imparting means for imparting electric charge to the floating component of the granular molding resin, and charged substance adsorbing means for adsorbing the charged floating component. This makes it possible to reliably collect so-called particles such as fine powder and dust that are floating in the granular molding resin, so that contamination of the resin sealing device by the particles can be suitably prevented.

  The granular molding resin is loaded on the loading means in the molding resin loading section, the electronic component is resin-sealed by the upper mold and the lower mold in the press section, and the electronic component is covered A molded product supplied from the molded product supply section to the press section and sealed with resin in the press section is accommodated in a molded product storage section, and the press section includes the molding resin loading section and the molded product. It is arrange | positioned by the arrangement | positioning pinched | interposed by the supply section and the said molded article accommodation section, It is characterized by the above-mentioned. As a result, a system capable of easily taking measures against dust can be realized with a simple and inexpensive system.

  As another invention, using any one of the above resin sealing devices, the amount of granular molding resin stored in each stocker and the use of the granular molding resin when resin-sealing electronic components And calculating the supply amount of the granular molding resin from each stocker so that the ratio of the supply amounts of the granular molding resin supplied from within each stocker becomes a predetermined ratio based on the amount And a step of supplying granular molding resin from each stocker to the stacking means based on the calculated supply amount of molding resin. It can also be a method.

  And a step of depressurizing the internal space of the intermediate processing unit, a step of cooling the molding resin loaded on the stacking means, and a step of absorbing moisture in the intermediate processing unit. It is characterized by. As a result, the pressure between the granular molding resins loaded on the loading means can be reduced to facilitate the discharge of moisture, and the melting before the lower mold is put into the granular molding resin can be prevented. Generation | occurrence | production of the void at the time of a stop and deterioration of the quality of the resin sealing part can be suppressed.

  Further, in any of the foregoing resin sealing methods, when the stacking means is transported to the mold position, the molding resin is put into the lower mold, and then returned to the molding resin stacking position, And a step of cleaning the stacking means with the cold jet air from the cooling means in the intermediate processing section. Thereby, the fine resin remaining in the stacking means after the granular molding resin is put into the lower mold can be removed, and the stacking means can be cleaned. Further, it is convenient because the loading means can be cooled before loading the next molding resin.

  Furthermore, in any of the above-described resin sealing methods, the method may further include a step of leveling the stacked state of the granular molding resin supplied into the stacking unit by the leveling unit. Thereby, the loading state of the granular molding resin loaded on the loading means becomes uniform, and the molding resin can be poured into the lower mold in a more precise state even with an extremely thin thickness, thereby suppressing the flow of the resin. be able to.

  Further, in any of the above-described resin sealing methods, the step of charging the floating component of the molding resin by the electrification applying unit, and the step of adsorbing the charged floating component by the charged object adsorption unit are further performed. It is characterized by having. Thereby, since the suspended fine particle resin can be reliably collected, contamination of the resin sealing device by the floating component of the granular molding resin can be suitably prevented.

  According to the resin sealing device and the resin sealing method using the same according to the present invention, in the compression molding of an electronic component using a granular molding resin, even when the cavity space is shallow and the planar dimension is large. The granular molding resin can be supplied in a uniform state. Thereby, the resin-sealed part of the resin-sealed product can always be finished in a non-uniform state, and the generation of voids can be suitably suppressed. In addition to this, since the particle size distribution of the granular molding resin supplied to the upper surface of the lower mold, which is a part of the cavity space, is always kept constant, the quality of the resin sealing part is constant and high quality It is possible to provide a resin-sealed product of an electronic component.

It is a top view which shows schematic structure of the resin sealing apparatus in 1st Embodiment. It is sectional drawing which shows the structure of a resin loading section, an intermediate | middle section, and a press section among the resin sealing apparatuses shown in FIG. It is explanatory sectional drawing of a resin loading section. It is a front view which shows schematic structure of the resin mounting section for shaping | molding of the resin sealing apparatus in 2nd Embodiment. It is sectional drawing which shows schematic structure of the resin mounting section for shaping | molding of the resin sealing apparatus in 3rd Embodiment. It is sectional drawing which shows the structure of a resin loading section, an intermediate | middle section, and a press section among the resin sealing apparatuses in 4th Embodiment.

(First embodiment)
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a plan view showing a schematic configuration of a resin sealing device in the first embodiment. FIG. 2 is a cross-sectional view showing a configuration of a resin loading section, an intermediate section, and a press section in the resin sealing device shown in FIG. FIG. 3 is an explanatory sectional view of the resin loading section. The diagram shown on the left side of FIG. 3 is the same as the diagram shown in FIG.
The compression molding apparatus 800 according to the present embodiment includes a molding resin loading section 100 that is a granular molding resin loading position, a press section 200 that is a mold position, and a cooling process for the loaded granular molding resin. The intermediate section 300 that performs intermediate processing on the stacking means 160, the substrate supply section 400 that is a molded product storage section, and the molded product storage that stores the resin-sealed product that is resin-sealed in the press section 200 Section 500. In this embodiment, the resin loading section 100, the intermediate section 300, the press section 200, the substrate supply section 400, and the molded product storage section 500 are arranged in this order. The molding resin stacking section 100 (and the intermediate section 300) and the substrate supply section 400 (and the molded product storage section 500) are arranged so as to sandwich the press section 200 therebetween. In addition, a moving rail 600 is provided along the direction in which the sections are arranged adjacent to each section. The moving rail 600 is provided with conveying means 700 that reciprocates on the moving rail 600 in the extending direction of the moving rail 600 and can reciprocate between the position of the moving rail 600 and the internal space of each section. . The transport unit 700 is provided with a cleaning unit 750 at the tip when the moving rail 600 approaches each section. This cleaning unit 750 is for removing the cured resin debris and the like adhering to the upper and lower mold surfaces, and comprises a removing means such as a rotating brush and a collecting means for collecting the resin debris removed by the removing means. be able to.

The molding resin loading section 100 will be described.
The molding resin loading section 100 is formed in a closed space by the outer wall 110 so that the internal environment is placed in an environment isolated from the outside. An entrance / exit 112 is provided in the outer wall 110 of the molding resin loading section 100. The loading means 160 advances and retreats from the entrance 112. The loading means 160 is reciprocated along the moving rail 600 (in the direction of arrow A in FIG. 3) and the direction perpendicular to the extending direction of the moving rail 600 (in the direction of arrow B in FIG. ) Is movably provided. In the molding resin loading section 100, as shown in FIG. 3, the stockers 130A, 130B (hereinafter, referred to as “molding resins”) are separated in a predetermined particle size range. When these are not particularly distinguished, they are simply stored by “stocker 130”). The stockers 130A and 130B in the present embodiment are formed in a funnel shape having upper openings, and the lower opening portions adjust the extraction amounts of the granular molding resins 120A and 120B from the stockers 130A and 130B. , 130B is provided with molding resin take-out means for preventing the granular molding resins 120A, 120B stored in the storage chamber 130B from dropping more than necessary. These molding resins 120A and 120B (hereinafter simply referred to as “molding resin 120” when they are not particularly distinguished) are resins in which only the particle diameters of granular materials such as granules or powders are different. For example, it is manufactured by pulverizing a solid resin formed by kneading and curing, and sieving it for each particle diameter with a sieve having a predetermined size. In the present embodiment, description will be made assuming that the molding resin 120A has a larger particle diameter than the molding resin 120B. In addition, the molding resins 120A and 120B have a particle size specified as a maximum value and / or a minimum value depending on the size of the mesh.

In the present embodiment, for example, a lid 142 that opens and closes the lower openings of the stockers 130A and 130B, a lid opening / closing driving device that drives the lid 142 to open / close, and a control unit (not shown) of the lid opening / closing driving device. Resin take-out means is configured. The molding resin take-out means is not limited to this configuration. The control unit of the lid opening / closing drive device in this embodiment is also used as a central control unit (PC) that controls the operation of the compression molding device 800. That is, the operation control of each unit is executed based on the CPU provided in the central control unit (PC) and the control program stored in the storage means. Further, it goes without saying that the control may be controlled in synchronism with each control unit provided in the lid opening / closing drive device of the compression molding device 800.
In FIG. 3, only two stockers 130A and 130B are shown, but three or more stockers may be provided.

The molding resin loading section 100 is provided with molding resin supply amount calculation means. The molding resin supply amount calculation means in this embodiment is substituted by the above-described central control unit (PC). The molding resin supply amount calculation means calculates the molding resin from each stocker 130A, 130B so that the ratio between the supply amounts of molding resin 120A, 120B supplied from each stocker 130A, 130B is a predetermined ratio. The supply amounts of 120A and 120B are calculated. In this case, the molding resin supply amount calculating means simply stores the amount of molding resin 120A, 120B in each stocker 130A, 130B and the wiring board 242 on which the semiconductor chip 240, which is an electronic component, is mounted. The supply amount of the molding resin 120 can be calculated on the basis of the usage amount of the molding resins 120A and 120B when the resin sealing process is performed on the molded product.
In the present embodiment, the central control unit (PC) manages the supply amount of the molding resins 120A and 120B based on the weight of the molding resins 120A and 120B stored in the stockers 130A and 130B. The weights of the molding resins 120A and 120B stored in the respective stockers 130A and 130B are measured in advance when the molding resins 120A and 120B are put into the stockers 130A and 130B, and the measured values are previously determined by the user. Therefore, it may be inputted to the molding resin supply amount calculation means (central control unit (PC)). Moreover, it is good also as a structure provided with a weight measurement means in each stocker 130A, 130B.

  The molding resin supply amount calculation means in the present embodiment resin seals the weights of the molding resins 120A and 120B stored in the stockers 130A and 130B, the sum of these weights, and one molded product. Based on the weights of the molding resins 120A and 120B used at the time, the supply amounts of the molding resins 120A and 120B from the stockers 130A and 130B are calculated. When the weight of the molding resin 120A, 120B to be supplied from each stocker 130A, 130B is calculated when the molding target is calculated by the molding resin supply amount calculation means, the central control unit (PC) The lids 142 of the respective stockers 130A and 130B are opened by the lid opening / closing drive device, and the molding resins 120A and 120B are supplied to the stacking means 160. At this time, the central control unit (PC) controls the opening / closing operation of the lid 142 so as to close the lid 142 when the weight measured by the weight measuring means provided in the stacking means 160 reaches a predetermined weight.

  In the present embodiment, the molding resin 120 </ b> A having a large particle size is supplied to the stacking unit 160 first, and the molding resin 120 </ b> B having the next small particle size is supplied to the stacking unit 160. Since the molding resin 120A having a large particle size and the molding resin 120B having a small particle size are supplied to the stacking means 160 in this order, the molding resin 120B can be dispersed in the gaps between the molding resins 120A. The molding resins 120A and 120B loaded on the loading means 160 can be distributed uniformly, which is convenient. Further, it is possible to efficiently prevent the fine molding resin 120A from adhering to the closing plates 164A and 164B described later.

  The molding resin stacking section 100 includes a dust suction part 114. The dust suction part 114 sucks air inside the molding resin stacking section 100 through a suction hole provided in the outer wall 110 and generates a negative pressure inside the resin by reducing the pressure (forms a reduced pressure space). Leakage of particles to the outside when 112 is opened is prevented.

The loading means 160 is formed in a container shape that can be opened and closed at the lower surface with the upper surface opened. The loading means 160 is provided along the moving rail 600 so as to be movable between the loading position of the molding resins 120A and 120B and the mold position of the press section 200.
The planar shape of the stacking means 160 is formed in a shape substantially equal to the planar shape of the cavity recess 238 provided in the lower mold 230 described later. More specifically, the shape of the opening portion on the bottom surface of the stacking means 160 is formed to be slightly smaller than the shape of the cavity recess 238 in plan view (see FIG. 1).
The stacking means 160 includes a rectangular frame in plan view that forms the side wall portion thereof and a shutter mechanism 162 that can open and close the bottom surface thereof, and while being transported from the molding resin stacking section 100 to the press section 200, The closed state is maintained, and the shutter mechanism 162 is operated on the cavity recess 238 (on the lower mold 230) of the press section 200 to open the bottom surface. The opening / closing operation of the shutter mechanism 162 is controlled by a central control unit (PC). In the present embodiment, the shutter mechanism 162 is a sliding type in which the two closing plates 164A and 164B are moved toward and away from the center position of the bottom surface of the stacking means 160 and the position outside the bottom surface of the stacking means 160 by a driving device (not shown). The shutter mechanism 162 is configured. Other examples of the shutter mechanism 162 include a structure in which a single closing plate 164 slides horizontally along the bottom surface of the stacking means 160, or a closing plate 164 whose one end edge is rotatably held on the bottom surface of the stacking means 160. Of course, it is also possible to employ a structure that rotates downward with the end edge holding the rotation axis as a rotation axis.
In the present embodiment, the shutter structure 162, the central control unit (PC), and the conveying means constitute an input means.

The intermediate section 300 will be described.
This intermediate section 300 is also formed in a closed space by an outer wall 310 provided with an inlet / outlet 312 in the same direction as the inlet / outlet of the other sections. The inner space of the intermediate section 300 includes the molding resin loading section 100 and the press section. 200 and the outside environment are isolated. In the present embodiment, the outer wall 310 is made of a heat insulating material so that the inner space of the intermediate section 300 can be thermally isolated from other spaces.

  In the intermediate section 300 in the present embodiment, a decompression means 320 that decompresses the internal space of the intermediate section 300, a cooling means 330 that cools the internal space of the intermediate section 300, the stacking means 160, and a water absorption means 332 are disposed. . The water absorbing means 332 is preferably disposed together with the cooling means 330. A vacuum pump is preferably used as the decompression unit 320. As the cooling means 330 that cools the internal space of the intermediate section 300, a Peltier element that does not generate wind is preferably used, and the stacking means 160 that has been heated in the press section 200 is cooled and the stacking means 160 is cooled. A cold air supply device 331 that is a cold air injection device that removes dirt (particles) attached to the outside of the means 160 is preferably used. Moreover, as the water absorption means 332, a water absorption gel is used suitably. The operations of the cooling means 330 and the cold air supply device 331 are each controlled by a central control unit (PC). In this embodiment, a cooling means that can maintain a no-air state, such as a Peltier element, may be operated at all times. However, the cold-air supply device 331 that injects cold air is loaded with the molding resin 120. When the stacked loading means 160 is cooled, it stops. Moreover, it is preferable that the temperature in the intermediate section 300 is temperature-controlled by the central control unit (PC) so as to be equal to or lower than the dew point when the water absorbing means 332 is operated.

  The loading means 160 loaded with the molding resin 120 in the molding resin loading section 100 is carried into the intermediate section 300 from the entrance / exit 312. When the loading means 160 is loaded into the intermediate section 300, the central control unit (PC) operates the cooling means 330 and 331 in response to whether the loading means 160 is loading the resin or after charging, so that the intermediate section is operated. The cooling of the internal space 300, the cleaning of the stacking means 160, and the cooling process are executed. As a result, during the resin transport, the molding resin 120 loaded on the stacking means 160 is cooled. In the case of a process after the resin is charged, the cooling means 331 ejects cold air from the nozzle and cleans it, and cools the stacking means 160 that has absorbed the heat during the operation in the press section 200 and has risen in temperature.

  Further, when the water absorption means 332 is disposed in the intermediate section 300, even if the temperature in the intermediate section 300 becomes the dew point, the water absorption means 332 can absorb the water. It is possible to reduce the moisture of the molding resin 120 that has been reduced as much as possible. In the intermediate section 300, the cooling means 330 can prolong the time until the stacking means 160 and the molding resin 120 start to melt. This prevents the molding resin 120 from melting and adhering into the stacking means 160 before being charged, and shortens the time from the time of melting until the molded product is immersed in the molten resin in the cavity recess 238 as much as possible. The large surface area can absorb heat, and the extremely fast curing of the granular resin can prevent the viscosity from rising before the mold clamp, thus preventing significant wire flow especially in compression molding of thin packages Convenient in that it can be.

The press section 200 will be described.
The press section 200 accommodates an upper mold 220 that is a movable mold and a lower mold 230 that is a fixed mold. The press section 200 is formed in a closed space by the outer wall 210 so that the inner environment is isolated from the outside. The outer wall 210 of the press section 200 is provided with an entrance / exit 212. The loading means 160 can advance and retreat into and from the press section 200 through the entrance / exit 212. In addition, the conveying means 700 for storing the wiring board 242 taken out from the board supply section 400 through the entrance / exit 212 and the wiring board (molded product) sealed with the press section 200 in the molded product storage section 500 is advanced. Exit. When the conveying means 700 advances and retreats in and out of the press section 200, the upper and lower mold clamping surfaces are cleaned by the cleaning unit 750 disposed at the tip of the conveying means 700. In this embodiment, the cleaning unit 750 is integrally attached to the transport unit 700, but the cleaning unit 750 may be provided separately from the transport unit 700. Further, since the cleaning unit 750 is not an essential configuration, the arrangement can be omitted.
In the present embodiment, the wiring substrate 242 on which the semiconductor chip 240 that is a resin-sealed product is mounted is carried into the press section 200 from the substrate supply section 400 by the transport unit 700.

The wiring board 242 conveyed into the press section 200 is held by the upper mold 220, and the wiring board 242 is clamped by the upper mold 22 and the lower mold 230 which is a fixed mold, and the semiconductor mounted thereon. The chip 240 is resin-sealed by a cavity recess 238 formed in the lower mold 230.
The upper mold 220 includes an upper mold clamper 224 in which a holding unit 244 is mounted on the upper mold base 222. The upper mold 220 is provided so as to be movable toward and away from the lower mold 230 by the driving means 246.
The lower mold 230 includes a base block 232 and a lower mold clamper 236 disposed above the base block 232. A biasing means 234 is disposed between the base block 232 and the lower mold clamper 236, and the lower mold clamper 236 is constantly biased toward the upper mold 220 side. The base block 232 is formed in a convex shape in cross section, and the lower mold clamper 236 is supported on a stepped portion on the outer peripheral side of the cross section convex portion (central portion in plan view) of the base block 232 via an urging means 234. Yes. The lower mold clamper 236 is formed in a rectangular frame shape or a circular ring shape. A cavity concave portion 238 is formed by a step portion between the base block 232 and the lower mold clamper 236. The upper mold 220 and the lower mold 230 configured as described above are accommodated in a closed space formed by being surrounded by the outer wall 210.
The upper mold 220 and the lower mold 230 in the present invention are not limited to the configuration described above.

The holding means 244 provided in the upper mold 220 in this embodiment holds the wiring board 242 between the holding means 244 and the mold surface of the upper mold 220. The holding means 244 is configured such that the protrusion height and inclination of the upper mold 220 from the mold surface can be adjusted by pushing and rotating the upper end side of the hook body formed like a key at the lower end portion with a piston. It has become. A mechanism that forms a matte ground on the holding surface of the wiring substrate 242 in the upper mold 220 and evacuates the matted ground may be used in combination. The expansion / contraction operation of the holding means 244 can be controlled by the central control unit (PC), but is not limited to this configuration. When holding the wiring board 242 (molded product) on the holding means 244, in addition to the method of supplying the molded product by the operator, the molded product is supplied to the holding means 244 by an automatic supply device as will be described later. Any method may be used.
Further, the upper mold base block 222 in the present embodiment is provided with a heating means 221, and the upper mold 224 is heated to the resin sealing temperature at the time of resin sealing.

A release film 250 is laid so as to cover the cavity recess 238 formed in the lower mold 230. The release film 250 is air adsorbed by an adsorption groove (not shown) provided in the lower mold clamper 236 and then air adsorbed by an adsorption hole (not shown) provided in the lower mold 230. In addition, the release film 250 in this embodiment is wound around a roller and is not a long body that is unwound and supplied on the cavity recess 238, but is larger than the shape dimension of the cavity recess 238, and the outer dimension of the lower mold clamper 236. A single wafer release film is used. The supply and discharge (removal) of the release film 250 is performed by a release film supply / discharge device (not shown) that operates in accordance with the operations of the upper mold 220 and the lower mold 230.
Further, the base block 232 in the present embodiment is provided with a heating unit 231, and the lower mold 230 is heated to the resin sealing temperature by the heating unit 231.

  The stacking means 160 on which the molding resins 120A and 120B are stacked in the molding resin stacking section 100 is transferred from the entrance 112 provided on the outer wall 110 of the molding resin stacking section 100 to the outside of the molding resin stacking section 100 by the transport means. It is carried out. Thereafter, the stacking means 160 is carried into the internal space of the press section 200 from the entrance / exit 212 provided on the outer wall 210 of the press section 200 and set at a position immediately above the cavity recess 238. As such a conveying means, a configuration including a ball screw and a servo motor that can easily perform positioning and speed control is preferably used. The operation of the conveying means is also controlled by a central control unit (PC).

A substrate supply section 400 that is a molded product supply section is a section that accommodates the wiring substrate 242 to be supplied to the press section 200. A wiring board 242 as a molded product is accommodated in a magazine (not shown).
The molded product storage section 500 is a section that stores a molded product formed by resin-sealing processing (resin molding processing) of the wiring board 242 supplied from the substrate supply section 400 to the press section 200. Similarly to the substrate supply section 400, the molded product storage section 500 also stores a molded product in a magazine (not shown).

Next, a resin sealing method using the resin sealing device 800 in the present embodiment will be described.
The molding resins 120A and 120B stored in the stockers 130A and 130B are sorted in advance so as to have a required particle size distribution range by sieving or the like, and classified for each particle size range (for example, each mesh size of the sieve). Is stored in each stocker 130A, 130B. The weights of the molding resins 120A and 120B stored in the stockers 130A and 130B may be measured before being loaded into the stockers 130A and 130B. This measured value is input to the molding resin supply amount calculation means by the user. In addition, the molding resin supply amount calculation means is previously input with the molding resin amount required for one resin sealing.
The molding resin supply amount calculation means includes the weight of the molding resins 120A and 120B stored in the stockers 130A and 130B, the sum of these weights, and the weight of the molding resins 120A and 120B used for one resin sealing. Based on the above, the supply amounts of the molding resins 120A and 120B from the stockers 130A and 130B are calculated. In this way, by setting the supply amounts of the molding resins 120A and 120B from the stockers 130A and 130B, the reduction amounts of the molding resins 120A and 120B stored in the stockers 130A and 130B can be made uniform. it can. Therefore, it is advantageous because the particle size distribution of the resin for each molding can be made uniform, and the quality of the resin-sealed portion of the resin-sealed product can be maintained uniformly.

  Specifically, the resin weight T.I. ab gram is the total weight T. of the large resin (in this embodiment, the molding resin 120A). a. Total weight T. g of fine resin (in this embodiment, molding resin 120B) Distribute in b-gram ratio. In this case, in order to correct the insertion error resulting from the distribution at an economical speed (relatively high speed), the total amounts Σta and Σtb in N (N is a natural number) shots are always calculated, and the error amount is calculated as the following (N + 1). ) By continuing the work that feeds back the shot, it is possible to clean up to the remaining amount of resin remaining in the final shot. a: T.M. It can be managed to the ratio of b. According to this method, when ta is 0.14 grams more than the predetermined amount at a certain molding time, tb is controlled to be 0.14 grams less than the predetermined amount. Since ab falls within a predetermined weight, the amount of dropped resin, in other words, the package thickness is managed with an error of 0, and in the next molding, ta is dropped by 0.14 gram as a target from the predetermined amount. However, since 0.16 gram is actually reduced or an error occurs, in this case, 0.16 grams of tb is added and T.I. Prioritize ab. As a result, Σta is 0.02 grams short and Σtb is 0.02 grams, so in the next measurement, 0.02 grams less than the predetermined amount is input at ta, and tb The remainder calculated with ab constant is dropped. By providing feedback in this way, the resin can be disposed of without waste and with a minimum of less than the amount of resin for one molding, and the entire amount, including the amount of powder that was previously discarded, is used economically and environmentally. It is possible to provide a device that is superior to the above.

It is possible to correct the measurement error of the molding resin capacity by dropping a rough and large resin at the beginning and then adding a fine resin that can be finely adjusted. Yes.
Further, by using the integrated values of the respective weights for the management curve, even if the number of stockers 130 is large, it becomes easy to control the addition / decrease, so that the molding resin 120 in all stockers 130 can be used up at the same time. Even uniform quality can be expected.

When the supply amount of the molding resin 120 from each stocker 130 is calculated by the molding resin supply amount calculation means, the central control unit (PC) controls the operation of the lid opening / closing drive device, and the lid 142 of each stocker 130 is moved. The molding resin 120 is loaded on the loading means 160. First, the central control unit (PC) opens the lid 142 of the stocker 130A of a molding resin having a large particle size (120A in this embodiment), and stacks the molding resin 120A on the stacking means 160. At this time, the loading unit 160 may stand by at a certain place, but it is rotated in a horizontal plane around the plane position of the lid 142 by the conveying unit, or the plane of the lid 142 in the longitudinal direction of the opening of the loading unit 160. The molding resin 120A may be loaded while reciprocating back and forth and left and right with respect to the position. In this case, the stacking unit 160 may be operated so that the planar position of the lid 142 is relatively operated within the opening of the stacking unit 160. A conveying means (not shown) that holds the stacking means 160 moves the stacking means 160, so that the molding resin 120A loaded can be loaded into the stacking means 160 with an equal thickness.
Since the transport means is provided with a weight measuring means for measuring the weight of the stacking means 160, the molding resin 120A corresponding to the weight calculated by the molding resin supply amount calculating means is stacked on the stacking means 160. Then, the molding resin take-out means operates the lid opening / closing drive device to close the lid 142 of the stocker 130A.

  Next, the central control unit (PC) operates a lid opening / closing drive device that opens and closes the lid 142 of the other stocker 130B to control it similarly to the stocker 130A, and controls the stacking means 160 to load the molding resin 120A. Control like time. As a result, the other molding resin 120B (molding resin having a small particle diameter) is stacked on the molding resin 120A at a uniform thickness by the stacking means 160. In this way, by loading the molding resin 120 on the loading means 160 for each particle size, the loading state of the resin 120 loaded on the loading means 160 can be made uniform.

  After the molding resin 120 is loaded on the stacking means 160 in the molding resin stacking section 100, the central control unit (PC) after unloading the stacking means 160 from the molding resin stacking section 100 by a transport means (not shown). Then, it is carried into the intermediate section 300. When the loading means 160 is carried into the intermediate section 300, the central control unit (PC) strongly cools the internal space of the intermediate section 300 by increasing the output of the cooling means 330 for continuous operation. When the internal space of the intermediate section 300 is cooled, the humidity increases. However, since the water absorption means 332 always functions, it is possible to prevent dew condensation, and thus it is possible to prevent water absorption of the granular resin having a very large surface area.

  After performing the cooling process in the intermediate section 300, the central control unit (PC) causes the stacking means 160 to be unloaded from the intermediate section 300 by the conveying means and loaded into the press section 200. The stacking means 160 carried into the press section 200 is set at a position immediately above the cavity recess 238. A release film 250 is set in the cavity recess 238 in a state where air is adsorbed in advance.

  After the stacking means 160 is set at a position immediately above the cavity recess 238, the central control unit (PC) immediately drives the driving means for the closing plate 164 to stack the two closing plates 164A and 164B constituting the shutter mechanism 162. Slide from the center position of the bottom surface of the means 160 to the position outside the bottom surface of the stacking means 160 (in FIG. As a result, the molding resin 120 loaded on the loading means 160 is put into the cavity recess 238 in which the release film 250 is set. Since the separation distance between the bottom surfaces of the blocking plates 164A and 164B and the cavity recess 238 is set to be as short as possible, even if the molding resin 120 is poured into the cavity recess 238 from the stacking means 160 by free fall. The molding resin 120 is not scattered, and the molding resin 120 can be poured into the cavity recess 238 while maintaining the stacked state in the stacking means 160. The base block 232 of the lower mold 230 is provided with a heating means 231. Since the lower mold 230 is heated (heated) to the resin sealing temperature, the molding resin charged into the cavity recess 238 is provided. 120 melts immediately.

At the time of resin sealing molding, as shown in FIG. 2, the wiring substrate 242 is held by the holding means 244 attached to the upper mold 220 of the press section 200. In the present embodiment, the central control unit (PC) takes out the wiring board 242 from the magazine (not shown) in the board supply section 400 to the transfer means 700 that reciprocates along the moving rail 600, and press section 200. The holding means 244 is supplied in advance.
When the molding resin 120 of the stacking means 160 is put into the cavity recess 238, the central control unit (PC) issues a control signal to move the stacking means 160 from the position above the cavity recess 238 and to move the drive means 246. The upper mold 220 and the lower mold 230 are clamped by driving. At this time, first, the semiconductor chip 240 begins to be immersed in the molten molding resin. When the lower mold clamper 236 comes into contact with the wiring substrate 242 with a slight delay, the urging means 234 is compressed and the semiconductor chip 240 is melted. It is completely immersed in the resin. Then, the upper mold 220 and the lower mold 230 are clamped and heated while being pressurized with a molding resin pressure, the molten molding resin is cured, and the semiconductor chip 240 is resin-sealed.

After resin sealing, the central control unit (PC) drives a driving means (not shown) in a direction in which the upper mold 220 is separated from the lower mold 230. At this time, since the wiring substrate 242 is held by the holding means 244 of the upper mold 220, the resin-sealed product is peeled off from the release film 250 laid on the lower mold 230.
Thereafter, the central control unit (PC) causes the holding hook of the holding means 244 to protrude (separate) from the surface of the upper mold clamper 224, and the resin-sealed product held by the holding means 244 is delivered to the conveying means 700, and the outer wall From the entrance / exit 212 of 210, it is carried in the storage magazine in the molded product storage part 500 outside the press section 200. Next, the wiring board 242 to be sealed with resin is taken out from the magazine in the board supply section 400, carried into the press section 200, and set in the holding means 244.
In the present embodiment, the transport unit 700 uses a resin waste removing unit such as a rotating brush disposed in the cleaning head 750 and a recovery unit when the transport unit 700 retracts from the internal space of the press section 200 after receiving the resin-sealed product. A cleaning process such as removing resin residue adhering to the mold surface is performed.

  After the compression resin sealing process in the press section 200 is finished, the central control unit (PC) again carries the empty stacking means 160 into the intermediate section 300 by the conveying means, and the cooling means 330 operating continuously. And the cold air supply device 331 is operated to cool the stacking means 160 that has reached a high temperature in the press section 200 by blowing cold air from the cold air supply device 331. Further, the fine particles of the molding resin 120 remaining inside the stacking means 160 can be blown off, and unnecessary fine flow resin can be removed from the stacking means 160.

At the same time, the central control unit (PC) operates the decompression unit 320 to discharge the molding resin for the fine particles blown off from the stacking unit 160 from the intermediate section 300, and then cools and cleans the stacking unit 160. It is again carried into the molding resin loading section 100. Then, the molding resin loading section 100 performs a loading process of the molding resin 120 necessary for the next resin sealing process.
By repeating the above procedure, the semiconductor chip 240 mounted on the wiring board 242 can be continuously resin-sealed.

(Second Embodiment)
FIG. 4 is a cross-sectional view showing a schematic configuration of a molding resin loading section of the resin sealing device in the second embodiment.
In the present embodiment, the vibration generating means 132 is disposed in the stocker 130, and a tray 166 that is a temporary loading means for temporarily loading the granular molding resin 120 supplied from the stocker 130 is disposed. Is characteristic. In this embodiment, a weight measuring unit for measuring the weight of the granular molding resin 120 supplied from the stocker 130 is provided in the tray 166 instead of the conveying unit.
The tray 166 is connected to a ball screw and a servo motor mechanism that can move to the lower part of each resin drop opening of the stocker 130, and dropped while moving left and right so that the dropped molding resin 120 is accumulated flatly. The molded molding resin 120 is received. Specifically, after moving to the lower bottom of the stocker 130A, the tray 166 moves in the left-right direction and receives (deposits) a predetermined amount of molding resin 120A, and then lowers the stocker 130B. The tray 166 moves in the left-right direction and receives a predetermined amount of the molding resin 120B evenly. Thereafter, the tray 166 moves to a predetermined position above the stacking means 160 and waits until a drop command is issued by the central control unit (PC).

  The vibration generating means 132 is disposed on the bottom side portion of the stocker 130. As the vibration generating means 132, a piezoelectric element or the like that can generate extremely fine vibration is preferably used. The vibration generating means 132 is controlled by the central control unit (PC) so that the input power supply is turned on and off in synchronization (synchronized) with the opening / closing operation of the lid 142 attached to the stocker 130. For example, the vibration generating means 132 generates vibration when the lid of the stocker 130 is opened 142, and stops generating vibration when the lid 142 is closed. The molding resin 120 stored in the stocker 130 by the vibration generating means 132 operating in this way is preferable because the fine particle components in each do not accumulate at the bottom of the stocker 130. Thereby, the molding resin 120 stored in each stocker 130 can be taken out evenly. Such a configuration is particularly advantageous in a stocker (130B in the present embodiment) in which a granular molding resin having a small particle size is stored.

Similar to the configuration of the stacking means 160, the tray 166 in the present embodiment is formed in a box shape having an upper surface opening formed on a closing plate 168 whose bottom surface can be opened and closed. The opening / closing operation of the closing plate 168 of the tray 166 is controlled by a central control unit (PC). In the central control unit (PC), the weight measured by the weight measuring means (not shown) arranged on the tray 166 is calculated by the molding resin supply amount calculating means by the same method as in the previous embodiment. When the weight is reached, a process for controlling the operation of the lid opening / closing drive device and closing the lid 142 of the stocker 130 is executed.
By arranging such a tray 166, the stacking means 160 on which the molding resin 120 is stacked via the tray 166 is conveyed from the molding resin stacking section 100 to the press section 200 along the moving rail 600. In the meantime, it is possible to prepare for loading the molding resin 120 used for the next resin formation, and efficient production becomes possible. Further, when the molding resin 120 charged into the tray 166 is dropped onto the stacking means 160, the molding resin 120 in each particle size distribution enters each other, not the original loaded state supplied to the tray 166. This is also advantageous in that the particle size distribution becomes uniform.

  Although not shown, the vibration generating means 132 may be disposed not only on the stocker 130 but also on the closing plates 164A and 164B of the stacking means 160. According to such a configuration of the stacking means 160, when the molding resin 120 is charged from the stacking means 160 into the cavity recess 238, the adhesion of fine molding resin to the blocking plate 164 is prevented, and the blocking plate It is possible to prevent contamination of the loading means 160 due to melting of the molding resin for the fine particles adhering to the 164, and to control the amount of the molding resin 120 charged into the cavity recess 238 with extremely high accuracy. It is preferable in that it can also be performed. Moreover, since the same structure as the structure of the press section 200 in 1st Embodiment can be employ | adopted about the structure of the press section 200 of the resin sealing apparatus 800 concerning this embodiment, the detail of the press section 200 here The detailed explanation is omitted.

With respect to the resin sealing method of the wiring board 242 using the resin sealing device in the present embodiment, the process until the supply amount of the molding resin 120 from each stocker 130 is calculated by the molding resin supply amount calculation means is the first step. It is the same as the process in one embodiment.
Thereafter, the central control unit (PC) issues a command to the lid opening / closing drive device, opens the lid 142 of each stocker 130, and loads the molding resin 120 on the tray 166. The order of supplying the molding resins 120A and 120B to the tray 166 is also preferably performed in the same manner as in the first embodiment. In the present embodiment, it is not necessary to perform an operation such as moving the tray 166 within a required range during the supply of the molding resin 120, but such an operation is not prohibited.

When the weight measuring unit provided in the tray 166 loads the molding resin 120 corresponding to the weight calculated by the molding resin supply amount calculating unit on the tray 166, the central control unit (PC) opens the lid opening / closing drive device. Is operated to close the lid 142 of the stocker 130.
After the molding resin 120 having a required weight is supplied to the receiving tray 166, the central control unit (PC) operates a driving means (not shown) that slides the closing plate 168 that is the bottom surface of the receiving tray 166 to open the closing plate 168. As a result, the molding resin 120 temporarily loaded on the tray 166 is loaded on the loading means 160. The process after the molding resin 120 is loaded on the stacking means 160 can be performed in the same manner as in the first embodiment.

(Third embodiment)
FIG. 5 is a cross-sectional view showing a schematic configuration of a molding resin loading section of the resin sealing device in the third embodiment. The present embodiment is characterized in that it comprises leveling means 170 for leveling the loading state of the molding resins 120A and 120B loaded on the loading means 160. About the same structure as the above-mentioned embodiment, detailed description is abbreviate | omitted by using the same code | symbol.

  The leveling means 170 is substantially the same width dimension (slightly narrower than the width W) in any one of the upper surface openings of the stacking means 160 (the horizontal direction in FIG. 2 in the first embodiment). The leveling plate 172 formed to have a size) and the leveling plate 172 are moved forward and backward from the standby position to the internal space of the stacking means 160 via the upper opening of the stacking means 160. There is a leveling plate driving mechanism 174 for sliding in the depth direction of the paper surface in FIG. 5 (longitudinal direction of the upper surface opening) in the internal space of the means 160. The material of the leveling plate 172 is not particularly limited as long as no static electricity is generated between the leveling plate 172 and the leveling plate 172. A material that bends by resistance is preferred. The leveling plate driving mechanism 174 can be constituted by a leveling plate support 174a, a guide rail 174b, a driving motor 174c, a ball screw 174d, a ball screw driving means (not shown), and the like. The operation of the leveling plate driving mechanism 174 is also controlled by the central control unit (PC). Such leveling means 170 can of course be provided both in the case where the tray 166 described in the second embodiment is disposed and in the case where the tray 166 is not disposed. It is.

  In many cases, the molding resin 120 supplied by simply dropping from the stocker 130 or the receiving tray 166 is stacked in a mountain shape that forms an angle of repose of the molding resin 120 at the bottom of the stacking means 160. In such a case, since the leveling plate 172 is slid in the internal space of the stacking means 160 by the leveling plate driving mechanism 174 of the leveling unit 170, it is leveled by the lower end of the leveling plate 172 that reciprocates in the horizontal direction. The upper surface of the molding resin 120 in the stacking means 160 coincides with the height of the lower end of the leveling plate 172 and can be leveled in a state substantially parallel to the bottom surface of the stacking means 160. This is advantageous because the molding resin 120 can be loaded in a more uniform state as compared with the loading state of the molding resin 120 in the loading means 160 in the embodiment described above. Of course, the sliding direction of the leveling plate 172 may be the short side direction (width W direction) of the upper surface opening of the stacking means 160.

  In the resin sealing method using the resin sealing device according to the present embodiment, the steps from loading the molding resin 120 to the loading means 160 from the stocker 130 or the receiving tray 166 are the steps in any of the previously described embodiments. It can be performed in the same way. In the case of adopting the present embodiment, the process of slightly moving the stacking means 160 and the receiving tray 166 while the molding resin 120 is being stacked may be omitted. Is wide, it is necessary to move the stacking means 160 and the tray 166 in the horizontal direction and the depth direction shown in the drawing, and in particular in the case of a thin package. When the molding resin 120 is loaded on the molding resin stacking means 160, the central control unit (PC) drives the leveling plate driving mechanism 174 of the leveling means 170 to form an angle of repose within the stacking means 160. The molding resin 120 loaded is leveled by the leveling plate 172. By sliding the leveling plate 172 on the surface of the molding resin 120, the surface of the molding resin 120 in the stacking means 160 can be adjusted to a state (horizontal plane) parallel to the bottom surface of the stacking means 160. After the molding resin 120 is in a flat state as described above, the central control unit (PC) carries the stacking means 160 into the intermediate section 300 by the conveying means, and outputs the output of the cooling means 330 that is always operated. The cooling unit 330 is operated and the cooling unit 330 is operated to appropriately perform the cooling process and the dehumidifying process. After performing the intermediate process in the intermediate section 300, or directly from the molding resin loading section 100, the intermediate section 300 is carried into the press section 200. As the process after the loading means 160 is carried into the press section 200, the same process as that of any of the above-described embodiments can be applied.

(Fourth embodiment)
FIG. 6 is a cross-sectional view showing a schematic configuration of a resin sealing device in the fourth embodiment. The present embodiment is characterized in that a charge imparting means and a charged substance adsorbing means are provided in order to collect the molding resin floating in each section. In the present embodiment, the charge imparting means 180 and the charged object adsorbing means 182 are disposed in all of the molding resin stacking section 100, the press section 200, and the intermediate section 300. It is also possible to adopt a form in which only the section is arranged. Further, in the present embodiment, the cooling means 330 and the water absorption means 332 are disposed in the molding resin stacking section 100 and the intermediate section 300 to improve the charging efficiency in the molding resin stacking section 100 and the intermediate section 300 and float. The charging efficiency of the molding resin that is used is increased.

The charge applying means 180 discharges from the discharge electrode to the internal space of each section, and floats in the internal space in each section (so-called particles including not only fine particle components of the molding resin 120 but also dust). Charge. The charged substance adsorbing means 182 is formed on an adsorbing electrode to which a potential opposite to the electric potential discharged from the discharge electrode is supplied, and adsorbs floating substances in each section. If the adsorption electrode is disposed in the collection container 184, the adsorbed material adsorbed on the adsorption electrode can be collected in the collection container 184 when the potential supply to the adsorption electrode is stopped. The collection container 184 may be taken out and cleaned as appropriate during apparatus maintenance or the like.
By disposing such charge applying means 180 and charged substance adsorbing means 182, the floating component in each section and the molding resin out of the floating component melt and adhere to the components in each section. It is possible to suitably prevent the occurrence of dirt due to the resin.

  The resin sealing method using the resin sealing device 800 according to the present embodiment employs any of the steps in the other embodiments described above, and forms the resin mounting section 100 for molding, the intermediate section 300, and the press section 200. The charge applying means 180 and the charged object adsorbing means 182 may be operated in at least one of the sections. Of course, the operation timing of the charged substance applying unit 180 and the charged object adsorbing unit 182 is not particularly limited.

Although the present invention has been described in detail based on the above embodiments, the present invention is not limited to the above-described embodiments, and the present invention is not limited to the above-described embodiments, even if appropriate changes are made without departing from the scope of the invention. Needless to say, it belongs to the technical scope.
For example, in the above embodiment, the resin sealing device 800 includes the molding resin stacking section 100, the intermediate section 300, the press section 200, the substrate supply section 400, and the molded product storage section 500. It is also possible to adopt a section configuration in which the intermediate section 300 is excluded. Even in the resin sealing device 800 having a section configuration in which the intermediate section 300 is omitted, it is a matter of course that the press section 200 is sandwiched between the molding resin stacking section 100 and the substrate supply section 400. .

In the above embodiment, the cavity recess 238 is disposed in the lower mold 230, and the wiring substrate 242, which is a molded product to be resin-sealed, is held by the holding means 244 provided in the upper mold 220 and molded. Although the embodiment has been described in which the semiconductor chip 240 is resin-sealed by clamping the upper mold 220 and the lower mold 230 so that the semiconductor chip 240 is immersed in the cavity recess 238 to which the resin 120 is supplied. However, the present invention is not limited to this embodiment.
For example, the wiring board 242 is positioned and set on the clamping surface of the lower mold 230, and after the granular molding resin 120 is supplied onto the wiring board 242 and the semiconductor chip 240, the upper mold 220 and the lower mold 230 are mounted. It is also possible to employ an embodiment in which the semiconductor chip 240 is molded by resin sealing with a cavity recess formed in the upper mold 220 by clamping. At this time, the holding means 244 having the same configuration as that described in the first embodiment may be disposed in the lower mold 230.

Further, in the above embodiment, the molding resin supply amount calculation means is used for the weight of the molding resins 120A and 120B stored in the stockers 130A and 130B, the sum of these weights, and one-time resin sealing. Although the method of calculating the supply amount of the molding resins 120A and 120B from the stockers 130A and 130B based on the weight of the molding resins 120A and 120B has been described, the present invention is not limited to this calculation method. .
For example, the molding resin supply amount calculation means includes a storage amount (storage weight) of the molding resins 120A and 120B in the stockers 130A and 130B and a molding resin supplied from the stockers 130A and 130B for one-time resin sealing. A method of calculating the supply amount of the molding resins 120A and 120B so that the ratio of the weights of the resins 120A and 120B is the same in all the stockers 130A and 130B may be employed.

  Further, as described above, in the method of controlling the dropped amount of the molding resin 120 with feedback, the total weight can be made the same by molding the molding resin 120 having different particle sizes of large and small. However, the ratio between the resin and the filler and the composition ratio between other composition materials may change. In this case, if the change in the strength of the package or the characteristic value of the linear expansion coefficient caused by the difference in the composition ratio becomes a problem, the composition of the resin sealing part constituting the package is investigated for each shot, and the investigation result By managing the particle size classification and mixing ratio based on the above and managing the allowable range of the above characteristic values, it is possible to perform higher quality resin sealing.

  Further, the leveling means 170 according to the third embodiment is configured to advance and retract the leveling plate 172 from the vertical direction of the stacking means 160 between the internal space of the stacking means 160 and the outside by the leveling plate driving mechanism 174. However, the sliding movement length of the leveling plate 172 is made larger than the length dimension in the longitudinal direction of the stocker 130, and the leveling plate 172 is lowered to the leveling depth inside the side wall surface of the stacking means 160. It is preferable that the resin inlet can be installed close to the upper edge of the loading container 160 by leveling and sliding from that position, so that generation of dust can be suppressed. Further, it is advantageous in that the configuration of the ball screw 174d and the ball screw driving means of the leveling plate driving mechanism 174 can be omitted, and a simple mechanism can be obtained.

  Further, a configuration using a pressing plate that presses the molding resin 120 supplied to the stacking means 160 may be employed. In this case, as the pressing plate, a flat plate slightly smaller than the planar shape of the frame inner region of the stacking means 160 can be used. Since this pressing plate is cooled by the intermediate section 300 and placed on the molding resins 120A and 120B loaded on the loading means 160, the molding resin 120 can be dropped while being pressed from above, so that the loading means It can be dropped into the cavity recess 238 without shifting from the position loaded on 160. Further, by bringing the cooled pressing plate into contact from the upper side, the molding resin 120 can be rapidly cooled, and the temperature rise of the molding resin 120 before dropping the lower mold 230 can be effectively prevented. In addition, after dropping the molding resin 120 into the cavity recess 238, the molding resin 120 is taken out before the molding resin 120 is supplied in the intermediate section 300 or the like and cooled together with the stacking means 160.

  Further, although the configuration in which the molding resin 120 is dropped from the stocker 130 so as to be uniformly stacked in one rectangular frame of the stacking means 160 has been described, the present invention is not limited to this. For example, the rectangular frame of the stacking means 160 is divided so that the number of the cavity recesses 238 formed in one mold is the same as the number of the cavity recesses 238, and is molded into a plurality of cavity recesses 238 in one transport. The resin 120 can be dropped.

  Moreover, although the structure using the stocker 130 whose opening part is horizontally long was demonstrated, you may use what differs in the shape of an opening part from this. For example, it can be formed in an opening shape such as a circular shape, an elliptical shape, or a square shape. The molding resin 120 can be dropped over the entire surface of the stacking means 160 by scanning the stacking means 160 while reciprocating back and forth and right and left and stacking the molding resin 120 on the stacking means 160. In this case, a horizontally long tray 166 may be used as in the above-described embodiment, but the molding resin 120 may be loaded on the loading unit 160 by scanning while reciprocating back and forth and left and right on the loading unit 160. .

  In addition, it goes without saying that embodiments according to all combinations of the above-described embodiments and modifications belong to the technical scope of the present invention.

100 Molding resin loading sections 120A and 120B Molding resins 130A and 130B Stocker 160 Loading means 170 Leveling means 180 Charge applying means 182 Charged material adsorption means 200 Press section 220 Upper mold 230 Lower mold 238 Cavity recess 240 Semiconductor chip 242 Wiring board 244 Holding means 300 Intermediate section 320 Decompression means 330, 331 Cooling means 332 Water absorption means 400 Substrate supply section 500 Molded product storage section 600 Moving rail 700 Conveying means 800 Compression molding apparatus PC Central control unit

Claims (13)

A supply unit for supplying granular molding resin to the lower mold, and a heating means for heating the upper mold and the lower mold to a resin sealing temperature. The upper mold and the lower mold A resin sealing device for an electronic component for resin-sealing the electronic component by clamping the electronic component together with a granular molding resin,
The supply unit
A plurality of stockers for separating and storing the granular molding resin for each required particle size range;
The granular molding resin supplied from the stocker based on the storage amount of the granular molding resin in each stocker and the usage amount of the granular molding resin when the electronic component is resin-sealed. Molding resin supply amount calculation means for calculating the supply amount of the granular molding resin from each stocker so that the ratio between the supply amounts of the above becomes a predetermined ratio;
Based on the supply amount calculated by the molding resin supply amount calculation means, a molding resin extraction means for extracting the granular molding resin in each stocker;
A loading means for loading the granular molding resin supplied from each stocker by the molding resin take-out means;
A loading means for reciprocally moving the loading means between the loading position of the granular molding resin and the mold position, and for charging the loaded granular molding resin into the lower mold; A resin sealing device for electronic parts, comprising:   2. The resin sealing device for an electronic component according to claim 1, wherein the supply unit further includes temporary stacking means for temporarily stacking the granular molding resin supplied from each stocker. An intermediate processing portion placed in an environment isolated from the environment at the loading position of the granular molding resin and the environment at the mold position at an intermediate position between the resin molding position for granular molding and the mold position. Is arranged,
3. The resin sealing device for an electronic component according to claim 1, wherein the intermediate processing unit is provided with at least one of a decompression unit, a cooling unit, and a moisture absorption unit.   The resin for electronic parts according to any one of claims 1 to 3, further comprising a leveling means for leveling the loading state of the resin for granular molding in the stacking means. Sealing device.   5. The electron according to claim 1, wherein each stocker is provided with a vibration generating unit that operates in response to the operation of the molding resin removing unit. Resin sealing device for parts.   2. The vibration generating means that operates corresponding to an operation when the granular molding resin loaded on the loading means is put into the lower mold is disposed in the loading means. The resin sealing device for an electronic component according to any one of claims 1 to 5.   2. The apparatus according to claim 1, further comprising a charge applying unit that applies a charge to a floating component of the granular molding resin, and a charged substance adsorbing unit that adsorbs the charged floating component. 6. The resin sealing device for an electronic component according to claim 6. The granular molding resin is loaded on the loading means in the molding resin loading section,
The electronic component is resin-sealed by the upper mold and the lower mold in a press section,
The electronic component is supplied to the press section from a molding supply section,
The molded product resin-sealed in the press section is accommodated in the molded product storage section,
The said press section is arrange | positioned by the arrangement | positioning pinched | interposed by the said resin mounting section for shaping | molding, the said to-be-molded product supply section, and the said molded article accommodation section, The Claim 1 thru | or 7 characterized by the above-mentioned. The resin molding apparatus as described in any one. A resin sealing method for an electronic component using the resin sealing device for an electronic component according to any one of claims 1 to 8,
Supply of granular molding resin supplied from each stocker based on the storage amount of granular molding resin in each stocker and the amount of granular molding resin used when resin-sealing electronic components Calculating the supply amount of the granular molding resin from each stocker so that the ratio between the quantities becomes a predetermined ratio;
And a step of supplying a granular molding resin from each stocker to the stacking means based on the calculated supply amount of the molding resin. . A resin sealing method for an electronic component using the resin sealing device for an electronic component according to claim 3,
Supply of granular molding resin supplied from each stocker based on the storage amount of granular molding resin in each stocker and the amount of granular molding resin used when resin-sealing electronic components Calculating the supply amount of the granular molding resin from each stocker so that the ratio between the quantities becomes a predetermined ratio;
A step of supplying a granular molding resin from each stocker to the stacking means based on the calculated molding resin supply amount;
At least one of a step of reducing the internal space of the intermediate processing unit, a step of cooling the molding resin loaded on the stacking means, and a step of absorbing moisture in the intermediate processing unit. A resin sealing method for an electronic component. A resin sealing method for an electronic component using the resin sealing device for an electronic component according to any one of claims 3 to 8,
Supply of granular molding resin supplied from each stocker based on the storage amount of granular molding resin in each stocker and the amount of granular molding resin used when resin-sealing electronic components Calculating the supply amount of the granular molding resin from each stocker so that the ratio between the quantities becomes a predetermined ratio;
A step of supplying a granular molding resin from each stocker to the stacking means based on the calculated molding resin supply amount;
When the stacking means is transported to the mold position, the molding resin is put into the lower mold, and then returned to the molding resin stacking position, the cold air from the cooling means is used to return the molding resin in the intermediate processing section. And a step of cleaning the loading means. A resin sealing method for an electronic component using the resin sealing device for an electronic component according to claim 4,
Supply of granular molding resin supplied from each stocker based on the storage amount of granular molding resin in each stocker and the amount of granular molding resin used when resin-sealing electronic components Calculating the supply amount of the granular molding resin from each stocker so that the ratio between the quantities becomes a predetermined ratio;
A step of supplying a granular molding resin from each stocker to the stacking means based on the calculated molding resin supply amount;
And a step of leveling the loading state of the molding resin supplied into the loading means by the leveling means. A resin sealing method for an electronic component using the resin sealing device for an electronic component according to claim 7,
Supply of granular molding resin supplied from each stocker based on the storage amount of granular molding resin in each stocker and the amount of granular molding resin used when resin-sealing electronic components Calculating the supply amount of the granular molding resin from each stocker so that the ratio between the quantities becomes a predetermined ratio;
A step of supplying a granular molding resin from each stocker to the stacking means based on the calculated molding resin supply amount;
Transporting the loading means to the mold position, and charging the granular molding resin loaded on the loading means into the lower mold;
An electronic component resin comprising: a step of charging the floating component of the molding resin by the charge applying unit; and a step of adsorbing the charged floating component by the charged object adsorption unit. Sealing method.

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