KR102243618B1 - Resin molding apparatus and resin molded product manufacturing method - Google Patents

Abstract

The present invention is to suppress deterioration of the quality of the resin material, the resin molding modules 3A and 3B for performing resin molding, the transport mechanism 5 for transporting the resin material to the resin molding modules 3A and 3B, and the resin A resin supply module 8 that supplies a resin material to the conveyance mechanism 5 while accommodating the material, a suction mechanism (dust collection mechanism 10) that sucks dust in the resin supply module 8, and a dust collection mechanism ( A control unit 9 for controlling 10) is provided, and the control unit 9 makes suction by the dust collecting mechanism 10 intermittently.

Description

A resin molding apparatus, and a manufacturing method of a resin molded article TECHNICAL FIELD [RESIN MOLDING APPARATUS AND RESIN MOLDED PRODUCT MANUFACTURING METHOD]

The present invention relates to a resin molding apparatus and a method for producing a resin molded article.

Conventionally, as shown in Patent Literature 1, in a resin-encapsulated semiconductor manufacturing apparatus, an automatic air conditioning device is installed in a storage unit for storing a resin material made of a thermosetting resin, and the storage unit is configured to be maintained at a predetermined temperature and humidity. There is a thing. Specifically, only when the temperature and humidity of the storage unit rises or falls from a predetermined setting range, dehumidification and blowing are automatically performed.

However, in a resin molding apparatus such as a resin-encapsulated semiconductor manufacturing apparatus, it is difficult to seal the space in the apparatus. In addition, in a conventional resin molding apparatus, dust such as powder of a resin material scatters and contaminates the apparatus, so that the dust in the apparatus is sucked together with air.

Then, even if the automatic air conditioner is installed as described above, since outside air flows into the space of the storage unit, it is difficult to control the temperature and humidity of the storage unit. As a result, for example, the quality of the resin material deteriorates due to voids due to moisture absorption or dissolution due to temperature rise.

Japanese Unexamined Patent Application Publication No. Hei 5-267367

Accordingly, the present invention has been made in order to solve the above problem, and its main object is to suppress deterioration of the quality of a resin material.

In other words, the resin molding apparatus according to the present invention includes a resin molding module for performing resin molding, a transport mechanism for transporting a resin material to the resin molding module, and a resin material to the transport mechanism while accommodating the resin material. A resin supply module to supply, a suction mechanism for sucking dust in the resin supply module, and a control unit for controlling at least the suction mechanism, wherein the control unit is characterized in that the suction by the suction mechanism is intermittently performed. .

According to the present invention constituted in this way, deterioration of the quality of the resin material can be suppressed.

1 is a plan view schematically showing a configuration of a resin molding apparatus according to the present embodiment.
2 is a partial cross-sectional view showing a main part of a press portion of the same embodiment.
3 is a schematic diagram showing a piping configuration of the dust collecting mechanism of the embodiment.
4 is a schematic diagram showing a resin supply module according to the embodiment.
Fig. 5 is a plan view schematically showing a configuration of a conveying unit of a resin supply module according to the embodiment.
6 is a diagram showing a humidity measurement result of a resin delivery unit according to the embodiment and a humidity measurement result of a delivery unit having a conventional configuration.
7 is a schematic diagram showing a resin supply module according to a modified embodiment.

Next, the present invention will be described in more detail by way of example. However, the present invention is not limited by the following description.

As described above, the resin molding apparatus of the present invention includes a resin molding module for performing resin molding, a transport mechanism for transporting a resin material to the resin molding module, and the resin material in the transport mechanism while accommodating the resin material. A resin supply module for supplying a material, a suction mechanism for sucking dust in the resin supply module, and a control unit for controlling at least the suction mechanism, wherein the control unit makes suction by the suction mechanism intermittently performed. It is done.

With this resin molding device, since the suction mechanism that sucks dust in the resin supply module intermittently performs suction, it is possible to suppress the inflow of outside air into the resin supply module, and Deterioration of the quality of the resin material can be suppressed. Further, since the dust in the resin supply module is sucked by the suction mechanism, it is possible to reduce contamination in the device caused by scattering of dust such as resin material powder.

In order to efficiently manage the humidity in the resin supply module, it is preferable to further include a dehumidification gas supply mechanism for supplying the dehumidified gas into the resin supply module.

In order to efficiently manage the temperature in the resin supply module, it is preferable that the dehumidification gas supply mechanism has a cooler that cools the gas.

Further, in order to efficiently manage the temperature in the resin supply module, it is preferable to further include a cooling gas supply mechanism for supplying the cooled gas into the resin supply module.

It is considered that the resin supply module includes a resin delivery unit for receiving the resin material therein and delivering the resin material, and a resin supply unit for supplying the resin material delivered from the resin delivery unit to the conveying mechanism. do.

In this configuration, since the resin delivery portion contains the resin material, dust such as powder of the resin material is easily generated from the resin delivery portion, and the influence of external air flowing into the resin delivery portion is greater than that of other portions.

For this reason, it is preferable that the suction mechanism sucks at least the dust in the resin delivery part.

In addition, it is preferable that the resin delivery unit and at least a part of the resin supply unit are covered by a cover body, and the dehumidification gas supply mechanism supplies dehumidified gas to at least the inside of the cover body. Alternatively, it is preferable that the resin delivery unit and at least a part of the resin supply unit are covered by a cover body, and the cooling gas supply mechanism supplies at least the cooled gas into the cover body.

With this configuration, the dehumidified gas or/and the cooled gas can be efficiently retained inside the cover body.

In order to simplify the control of the suction mechanism, it is considered that the control unit periodically performs suction by the suction mechanism. Even if the suction by the suction mechanism is periodically performed, dust may not be efficiently suctioned in some cases. Particularly, when the resin material is discharged from the resin delivery unit to the resin supply unit, dust such as powder of the resin material is likely to be generated. For this reason, it is preferable that, in addition to the periodic suction, the control unit performs suction by the suction mechanism at least during the operation of discharging the resin material from the resin delivery unit to the resin supply unit.

In order to efficiently suction dust such as powder of resin material, it is preferable that the resin delivery unit and at least a part of the resin supply unit are covered by a cover body, and the suction mechanism sucks dust inside the cover body. Do.

In addition, the manufacturing method of a resin molded article of the present invention is a method of manufacturing a resin molded article in which a resin material is conveyed from a resin supply module to a resin molded module by a conveying mechanism, and resin molded by the resin molding module is performed to produce a resin molded article. And in at least a part of a period from supply of the resin material to resin molding, dust in the resin supply module is intermittently sucked.

In this method of manufacturing a resin molded article, since dust in the resin supply module is intermittently sucked in at least a part of the period from the supply of the resin material to the resin molding, it is possible to suppress the inflow of outside air into the resin supply module. Deterioration of the quality of the resin material due to fluctuations in humidity or temperature caused by can be suppressed. In addition, since dust in the resin supply module is sucked, contamination in the device caused by scattering of dust such as powder of a resin material can be reduced.

<Embodiment of the present invention>

Hereinafter, an embodiment of a resin molding apparatus according to the present invention will be described with reference to the drawings.

The resin molding apparatus 1 of the present embodiment is a resin molding apparatus using a transfer molding method. This resin molding apparatus performs resin molding on a substrate on which a semiconductor chip is mounted, for example, and uses a cylindrical thermoplastic resin (hereinafter referred to as "resin tablet") as a resin material. In addition, as a "substrate", general substrates, such as a glass epoxy substrate, a ceramic substrate, a resin substrate, a metal substrate, and a lead frame, etc. are mentioned.

Specifically, the resin molding apparatus 1, as shown in Fig. 1, a supply module for supplying the substrate W before resin encapsulation (hereinafter referred to as ``pre-encapsulation substrate W'') and the resin tablet T ( 2), two resin molding modules 3A and 3B for resin molding, and a carry-out module 4 for carrying out a resin molded product, respectively, as constituent elements. In addition, the supply module 2, the resin molding modules 3A and 3B, and the take-out module 4, which are constituent elements, can be attached to and detached from each other for different components, and can also be exchanged.

In addition, the resin molding apparatus 1 is a transport mechanism 5 (hereinafter, referred to as hereinafter) that transports the pre-sealing substrate W and the resin tablet T supplied by the supply module 2 to the resin molding modules 3A, 3B. , Referred to as "loader 5") and a conveying mechanism 6 (hereinafter referred to as "unloader 6) for conveying resin-molded resin-molded products by resin-molding modules 3A and 3B to the carrying-out module 4 」).

The supply module 2 of the present embodiment is an integrated substrate supply module 7 and a resin supply module 8.

The substrate supply module 7 has a substrate delivery unit 71 and a substrate supply unit 72. The substrate delivery unit 71 delivers the substrate W in the magazine before sealing to the substrate alignment unit. The substrate supply unit 72 receives the pre-sealing substrate W from the substrate delivery unit 71, aligns the received pre-sealing substrate W in a predetermined direction, and delivers it to the loader 5.

The resin supply module 8 has a resin delivery unit 81 and a resin supply unit 82. The resin delivery unit 81 receives the resin tablet T from the stocker 83 to be described later, and delivers the resin tablet T to the resin supply unit 82. The resin supply unit 82 receives the resin tablet T from the resin delivery unit 81, aligns the received resin tablet T in a predetermined direction, and passes it to the loader 5.

Each of the resin molding modules 3A and 3B has a press portion 31. As shown in FIG. 2, each press part 31 has a lower mold 311 which can be raised and lowered, and an upper mold fixed above the lower mold 311 so as to face each other (Fig. 2). And a mold clamping mechanism 313 for clamping the lower mold 311 and the upper mold 312. The lower mold 311 is fixed to the upper surface of the movable plate 314, and the upper mold 312 is fixed to the lower surface of the upper fixed plate 315. The mold clamping mechanism 313 is to clamp the upper mold 312 and the lower mold 311 or open the mold by moving the movable plate 314 up and down.

The lower mold 311 is provided with a mounting portion 311a on which the pre-sealing substrate W conveyed by the loader 5 is mounted. In the lower mold 311, a plurality of ports 311b to which the resin tablet T conveyed by the loader 5 is mounted are formed. In addition, in the lower mold 311, a plunger 316 for injecting the resin tablet T into the pot 311b, for example, the resin passage 312a formed in the upper mold 312 and the cavity 312b is installed, have.

In addition, in the upper mold 312 and the lower mold 311, heating units such as a heater (refer to the heater 317 in Fig. 2) are buried, respectively. By this heating part, the upper mold 312 and the lower mold 311 are usually heated to about 180°C.

<Resin molding operation of the resin molding apparatus 1>

Hereinafter, the basic operation|movement of resin molding of the resin molding apparatus 1 of this embodiment is demonstrated.

The substrate delivery unit 71 delivers the pre-sealing substrate W in the magazine to the substrate supply unit 72. The substrate supply unit 72 aligns the received substrate W before sealing in a predetermined direction, and delivers it to the loader 5. In parallel with this, the resin delivery unit 81 delivers the resin tablet T received from the stocker 83 to the resin supply unit 82. The resin supply unit 82 delivers the required number (four in Fig. 1) of the received resin tablets T to the loader 5.

Next, the loader 5 simultaneously conveys the received two pre-sealing substrates W and four resin tablets T to the press unit 31. The loader 5 supplies the substrate W before sealing to the mounting portion 311a of the lower mold 311 and the resin tablet T into the interior of the port 311b formed in the lower mold 311, respectively.

After that, the upper mold 312 and the lower mold 311 are clamped using the mold clamping mechanism 313. Then, the resin tablet T in each pot 311b is heated and melted to generate a fluid resin, and the fluid resin is pressed by the plunger 316. Thereby, the fluid resin is injected into the cavity 312b formed in the upper mold 312 through the resin passage 312a. Subsequently, the fluid resin is cured by heating the fluid resin for the required time required for curing to form a cured resin. Thereby, the semiconductor chip in the cavity 312b and the substrate around it are sealed in a cured resin (encapsulation resin) molded corresponding to the shape of the cavity 312b.

Next, after the time required for curing has elapsed, the upper mold 312 and the lower mold 311 are mold-opened, and the encapsulated substrate (not shown) is molded. Thereafter, the sealed substrate (resin molded product) resin-sealed by the press unit 31 is accommodated in the substrate receiving unit 41 of the carrying out module 4 using the unloader 6.

The operation of the entire resin molding apparatus 1 including the series of operations described above is controlled by the control unit 9. Although this control part 9 is provided in the supply module 2 in FIG. 1, it may be provided in another module. Further, the control unit 9 is constituted by a dedicated or general purpose computer having, for example, a CPU, an internal memory, an AD converter, an input/output interface, and the like.

<Configuration of dust collecting mechanism (suction mechanism) and resin supply module 8>

In addition, the resin molding apparatus 1 of the present embodiment further includes a dust collecting mechanism 10 that sucks and collects dust generated by the resin molding modules 3A and 3B and the resin supply module 8 together with air. .

Specifically, as shown in FIG. 3, the dust collecting mechanism 10 is a dust collector 101, a connection pipe that connects the dust collector 101 and the modules 3A, 3B, and 8 to suck dust together with air ( 102) and on-off valves V1 to V3. Although the dust collector 101 of this embodiment is provided in the carrying out module 4, it is not limited to this.

The connection pipe 102 is connected to each of the resin molding modules 3A and 3B and the resin supply module 8. The opening of the connection pipe 102 in the resin molding modules 3A, 3B is the upper mold 312 or the lower mold ( It is installed in the vicinity of 311). In addition, the configuration of the connection pipe 102 in the resin supply module 8 will be described later.

Further, in the required location of the connection pipe 102, on-off valves V1 to V3 for switching modules for sucking dust are provided. Here, the on-off valve V1 or V2 is an on-off valve for switching between collecting dust from the resin molding modules 3A and 3B and stopping the same. In addition, the on-off valve V3 is an on-off valve for switching the dust collection from the resin supply module 8 and its stop. These on-off valves V1 to V3 are electric valves, and their opening and closing is controlled by the control unit 9.

Specifically, the control unit 9, when cleaning the upper mold 312 or the lower mold 311 after resin molding, in order to collect dust from the upper mold 312 or the lower mold 311, the resin molding module 3A, 3B) and the dust collector 101 are connected via a connection pipe 102. Specifically, the control unit 9 opens the on-off valve V1 or V2. At this time, in order to prioritize dust collection from the resin molding modules 3A and 3B, the on-off valve V3 on the side of the resin supply module 8 is in a closed state.

On the other hand, the control unit 9 is the resin supply module 8 before cleaning of the upper mold 312 or the lower mold 311 after resin molding, that is, during the supply of the resin tablet T to the resin molding. And the dust collector 101 are connected via a connection pipe 102. Specifically, the control unit 9 opens the on-off valve V3. At this time, since cleaning of the upper mold 312 or the lower mold 311 is not performed, the on-off valves V1 and V2 on the side of the resin molding modules 3A and 3B are in a closed state. With these controls, the dust collector 101 is in a state of constant operation.

Next, the configuration of the dust collecting mechanism 10 in the resin supply module 8 will be described.

The resin supply module 8 of the present embodiment, as shown in Figs. 4 and 5, accommodates a large number of resin tablets T, and at the same time, a resin delivery unit 81 for discharging the resin tablets T, It has a resin supply part 82 for supplying the resin tablet T discharged out by the said resin delivery part 81 to a conveyance mechanism.

The resin delivery unit 81 includes a storage container 811 and a hopper 812. The hopper 812 has a configuration capable of vibrating in the transverse direction of FIG. 4, for example, and the accommodation container 811 has a configuration having an inclined surface inclined at the receiving portion side. The resin tablet T injected from the stocker 83 falls on the inclined surface of the storage container 811 and is discharged to the receiving portion 821 by the vibration of the hopper 812.

The storage container 811 is formed, for example, in a box shape in which an upper wall and one side wall are opened, and is provided inclined so that the one side wall is downward. In addition, a stocker 83 in which a plurality of resin tablets T are accommodated is provided on the upper part of the storage container 811, and the resin tablet T passes from the stocker 83 through an opening in the upper wall, and the storage container 811 ).

The resin supply unit 82 uses a so-called parts feeder, a receiving unit 821 receiving the resin tablet T discharged from an opening of one side wall of the receiving container 811, and the receiving unit ( A vibration unit 822 for moving the resin tablet T by vibrating 821, an array portion 823 for arranging the resin tablet T moved by vibration in a row, and the arrangement unit It has a resin alignment part 824 for aligning a plurality of resin materials arranged by 823 and passing them to the loader 5. In this embodiment, the arrangement part 823 arranges the resin tablet T in a horizontally arranged state, and the resin alignment part 824 is the resin tablet T in a horizontally arranged state in a standing state. It is rotated and aligned.

Here, in the receiving part 821, as shown in FIG. 5, a contact type 1st detection sensor S1 for detecting that the resin tablet T in the said receiving part 821 is low is provided, for example, have. When it is necessary to replenish the resin tablet T to the receiving portion 821 by the detection signal of the first detection sensor S1, the control unit 9 controls the hopper 812 of the resin delivery unit 81 ) Is vibrated, and the resin tablet T is supplied to the receiving part 821 from the storage container 811.

In addition, as shown in FIG. 5, in the array portion 823, for example, a light transmission type second detection sensor S2 that detects whether a predetermined number of resin tablets T are arranged in the array portion 823. ) Is installed. The control unit 9 activates the vibration unit 822 when a predetermined number of resin tablets T are not arranged in the array unit 823 by the detection signal of the second detection sensor S2. , A predetermined number of resin tablets T are arranged in the arrangement portion 823.

In this configuration, the connection pipe 102 of the dust collecting mechanism 10 connected to the resin supply module 8 is a first connection pipe connected to the storage container 811 ( 102a), a second connection pipe 102b connected to the receiving portion 821, a third connection pipe 102c connected to the array portion 823, and a fourth connection connected to the resin alignment portion 824 It has a tube 102d.

In the present embodiment, the first connection pipe 102a is opened at the bottom of the storage container 811. The 2nd connecting pipe 102b is opened in the bottom part of the receiving part 821. The 3rd connecting pipe 102c is open in the bottom part of the arrangement part 823. The 4th connection pipe 102d is opened in the vicinity of the resin alignment part 824. In addition, the opening positions of each of the connecting pipes 102a to 102d are not limited to the above, and may be a position capable of collecting dust in each portion.

The first to fourth connecting pipes 102a to 102d of the present embodiment are configured by branching in the middle, and the opening and closing of the first to fourth connecting pipes 102a to 102d are collectively switched at the branch point. The on-off valve V3 on the side of the resin supply module 8 is provided (see Fig. 3).

When this on-off valve V3 is opened, dust collection is performed by the first to fourth connection pipes 102a to 102d, and the first to fourth connection pipes 102a are closed by closing the on-off valve V3. Dust collection by -102d) stops.

And the control unit 9 that controls the on-off valve V3 intermittently opens and closes the on-off valve V3 during the completion of resin molding (during operation from the supply of the resin tablet T to the resin molding). By controlling to be performed, dust collection by the dust collecting mechanism 10 is intermittently performed.

Specifically, the control unit 9 causes the dust collection mechanism 10 to periodically collect dust. For example, the on-off valve V3 is in a closed state for 60 seconds (a state in which dust is not collected), and is in an open state for 15 seconds (a state in which dust is collected). In addition, the period in which the on-off valve V3 is in a closed state and in an open state can be changed according to the temperature, humidity, air volume, and the like of the supply gas. Here, while the on-off valve V3 is in a closed state, the other on-off valves V1 or V2 are in an open state. Thereby, it is possible to prevent damage to the dust collector 101 that is always operated.

In addition, the control unit 9, in addition to the above-described periodic open/close control, during the operation of discharging the resin tablet T from the resin delivery unit 81 to the resin supply unit 82, the on/off valve on the resin supply module 8 side (V3) is opened to perform dust collection by the first to fourth connecting pipes 102a to 102d of the dust collecting mechanism 10. This is because during the operation of discharging the resin tablet T from the resin delivery unit 81, the storage container 811 vibrates by the hopper 812, and dust is likely to be generated.

Specifically, when the control unit 9 vibrates the hopper 812 of the resin delivery unit 81 based on the detection signal of the first detection sensor S1, the on-off valve V3 is opened. And the control part 9 closes the on/off valve V3 when stopping the vibration of the hopper 812 of the resin delivery part 81 based on the detection signal of the 1st detection sensor S1.

In addition, the control unit 9 can also stop dust collection by the dust collecting mechanism 10 while the receiving portion 821 is vibrating. When suction is performed while the receiving part 821 is vibrating, the resin tablet T is adsorbed to the suction port (dust collecting port) formed on the bottom surface of the receiving part 821, and the resin tablet T cannot be moved. Because.

Specifically, when the control unit 9 stops the vibration unit 822 based on a detection signal from the second detection sensor S2, the on-off valve V3 opens. On the other hand, the control unit 9 closes the on-off valve V3 when activating the vibration unit 822 based on a detection signal from the second detection sensor S2.

Further, in the above, the dust collection/stop by the first to fourth connection pipes 102a to 102d is switched by one on-off valve V3, but each of the first to fourth connection pipes 102a to 102d By providing an opening/closing valve to each of the connecting pipes 102a to 102d, it may be configured to switch dust collection/stop.

And in this embodiment, as shown in FIG. 4, the resin delivery part 81 and at least a part of the resin supply part 82 are surrounded by the cover 11 and covered. The cover 11 is provided separately from the case (not shown) of the resin supply module 8 and covers the resin delivery unit 81 and at least a part of the resin supply unit 82. Specifically, at least the receiving part 821 of the resin delivery part 81 and the resin supply part 82 is surrounded by the cover 11 and covered. Thereby, the volume of the space sucked by the first connection pipe 102a connected to the resin delivery part 81 and the second and third connection pipes 102b and 102c connected to the resin supply part 82 is reduced. , It can improve dust collection efficiency.

In addition, the resin molding apparatus 1 of this embodiment is provided with a gas supply mechanism 12 for supplying a dehumidified gas (for example, air) to the resin supply module 8 as shown in FIG. 4. .

Specifically, the gas supply mechanism 12 has a cooler 121 that cools the gas, and dehumidifies the gas by cooling the gas with the cooler 121. In this case, the gas supply mechanism 12 functions as a dehumidifying gas supply mechanism and a cooling gas supply mechanism. This dehumidified gas has a lower humidity than outside air. In addition, the gas supply mechanism 12 has a supply pipe 122 for supplying the gas cooled and dehumidified by the cooler 121 into the resin supply module 8. This supply pipe 122 is thought to elicit gas toward the resin delivery unit 81, for example, but is not particularly limited as long as gas is introduced into the resin supply module 8. In addition, the number of lead-out ports of the supply pipe 122 may be one, or may be plural. The dehumidification gas supply mechanism may supply compressed air dehumidified using a dehumidification filter. As the gas supply mechanism, both a dehumidification gas supply mechanism and a cooling gas supply mechanism may be provided.

In this embodiment, since the resin delivery part 81 and the resin supply part 82 are covered with the cover 11, the supply pipe 122 is piped inside the cover 11. Thereby, the dehumidified gas or/and the cooled gas can be efficiently retained in the inside of the cover 11, and the temperature and humidity of the atmosphere containing the resin material can be efficiently reduced.

<Experiment result>

Fig. 6 shows the humidity control results of the resin delivery unit 81 of the resin supply module 8 configured as described above. Further, as a comparative example, Fig. 6 also shows the humidity control result when dust collection is continuously performed in the same device configuration. In addition, in FIG. 6, the horizontal axis is arbitrary.

As can be seen from FIG. 6, in the present embodiment, the increase or decrease of humidity is repeated in accordance with the timing of dust collection by the dust collecting mechanism 10 and the stop thereof. During dust collection by the dust collecting mechanism 10, the humidity rises, and during the stoppage, the humidity decreases. In this embodiment, by intermittently performing dust collection, it becomes difficult to be affected by outside air, and the minimum value of humidity is 36.2%, and the maximum value is suppressed to 39.8%. On the other hand, in the comparative example, since the dust collection operation is continuously performed, the influence of the outside air is large, and the minimum value of humidity is 36.9%, but the maximum value rises to 42.7%.

In this embodiment, there are five peaks, peaks other than the fourth from the left are the result of periodic suction, and the fourth peak from the left is in addition to periodic suction, and from the resin delivery unit 81 to the resin supply unit ( 82) is a result of the suction performed during the operation of discharging the resin material.

<Effect of this embodiment>

According to the resin molding apparatus 1 of the present embodiment, since the dust collection mechanism 10 intermittently collects dust during the operation from the supply of the resin tablet T to the resin molding, the resin supply module 8 Inflow of outside air into the furnace can be suppressed, and quality deterioration of the resin tablet T due to fluctuations in humidity or temperature caused by outside air can be suppressed. In addition, since the dust collecting mechanism 10 collects dust in the resin supply module 8, it is possible to reduce contamination in the apparatus generated by scattering of dust such as powder of the resin tablet T.

In particular, in this embodiment, since dust in the resin delivery unit 81 is sucked by the dust collecting mechanism 10, the dust can be intensively sucked from the dust-prone areas such as powder of the resin tablet T. , Pollution by dust can be efficiently reduced. At this time, since the dust collection to the resin delivery unit 81 is intermittently performed, the outside air flowing into the resin delivery unit 81 can be reduced while dust collection is performed, and deterioration of the quality of the resin tablet T can be suppressed.

<Other embodiments>

For example, as shown in FIG. 7, a clean air supply mechanism 13 may be provided above the resin supply module 8. The clean air supply mechanism 13 supplies clean air toward the resin supply module 8. By providing this clean air supply mechanism 13, scattering of dust can be reduced. Further, this clean air may be dehumidified and supplied to the resin supply module 8.

Although the resin material of the above embodiment has a tablet shape, in addition, even if it is a solid resin material called a sheet shape, granular shape, granular shape, or powder shape. good.

In the above embodiment, the transfer mechanism 5 was configured to simultaneously transfer the pre-sealing substrate W and the resin tablet T to the lower mold 311, but the pre-sealing substrate W and the resin tablet T are separately lowered. It may be a configuration that conveys up to (311).

The resin supply module 8 is not limited to the configuration of the above embodiment as long as it is passed to the conveying mechanism 5 in a state in which the resin materials are aligned.

Although the dust collecting mechanism of the above embodiment was common to the resin molding module and the resin supply module, a separate dust collecting mechanism may be provided for each of the resin molding module and the resin supply module.

The resin molding apparatus 1 of the above embodiment has a configuration having a dust collecting mechanism 10 that combines a suction mechanism and a dust collector, but may have a configuration having a suction mechanism that sucks dust in the resin supply module 8 by a suction pump. .

In the above embodiment, the resin supply module 8 and the substrate supply module 7 are configured as one module, but the resin supply module 8 and the substrate supply module 7 may be different modules.

In the above-described embodiment, the configuration has two resin molding modules, but the number of resin molding modules may be one or three or more.

In addition, it goes without saying that the present invention is not limited to the above embodiments, and various modifications are possible within a range not departing from the gist.

1: resin molding device
3A, 3B: resin molding module
5: conveyance mechanism (loader)
8: resin supply module
81: resin delivery unit
82: resin supply unit
9: control unit
10: dust collecting mechanism (suction mechanism)
11: cover body
12: gas supply mechanism (dehumidification gas supply mechanism, cooling gas supply mechanism)
121: cooler

Claims (10)

A resin molding module for performing resin molding, and
A conveying mechanism for conveying a tablet-shaped resin material to the resin molding module,
A resin supply module for accommodating the resin material and supplying the resin material to the conveying mechanism;
A suction mechanism that sucks dust in the resin supply module,
And at least a control unit for controlling the suction mechanism,
In the resin molding module, outside air flows in by the dust being sucked in by the suction mechanism,
The resin supply module has a storage container for accommodating the resin material therein, a resin delivery unit for delivering the resin material from the storage container, and for supplying the resin material delivered from the resin delivery unit to the transfer mechanism. It has a resin supply part,
The suction mechanism is configured to suck at least the dust in the resin delivery portion, and has a connection pipe that sucks the dust from the inside of the storage container,
The control unit periodically performs a state of collecting dust and a state of not collecting dust repeatedly at a set interval so as to intermittent suction by the suction mechanism in order to suppress the inflow of outside air into the resin supply module, and the A resin molding apparatus in which a state of collecting dust and a state of not collecting the dust are repeatedly performed at a time set for each state. The method of claim 1,
A resin molding apparatus further comprising a dehumidifying gas supply mechanism for supplying a dehumidified gas into the resin supply module. The method of claim 2,
The dehumidifying gas supply mechanism has a cooler that cools the gas. The method of claim 2,
A resin molding apparatus further comprising a cooling gas supply mechanism for supplying a cooled gas into the resin supply module. delete The method of claim 1,
Further comprising a dehumidification gas supply mechanism for supplying the dehumidified gas into the resin supply module,
The resin delivery part and at least a part of the resin supply part are covered with a cover body,
The dehumidifying gas supply mechanism supplies dehumidified gas to at least the inside of the cover body. The method of claim 1,
Further comprising a cooling gas supply mechanism for supplying the cooled gas into the resin supply module,
The resin delivery part and at least a part of the resin supply part are covered with a cover body,
The resin molding apparatus, wherein the cooling gas supply mechanism supplies cooled gas to at least the inside of the cover body. The method of claim 1,
The control unit causes suction by the suction mechanism to be performed at least during an operation of discharging the resin material from the resin delivery unit to the resin supply unit. The method of claim 1,
The resin delivery part and at least a part of the resin supply part are covered with a cover body,
The resin molding apparatus, wherein the suction mechanism sucks dust inside the cover body. A method for producing a resin molded article in which a tablet-shaped resin material is conveyed from a resin supply module to a resin molding module by a conveying mechanism, and resin molded by the resin molding module to produce a resin molded product, comprising:
In the resin molding module, outside air is introduced by suction of dust by a suction mechanism,
The resin supply module has a storage container for accommodating the resin material therein, a resin delivery unit for delivering the resin material from the storage container, and for supplying the resin material delivered from the resin delivery unit to the transfer mechanism. It has a resin supply part,
The suction mechanism is for suctioning at least the dust in the resin delivery part, and has a connection pipe connected to the storage container to suck the dust,
In at least a part of the period from the supply of the resin material to the resin molding, in order to intermittent suction of dust in the resin supply module in order to suppress the inflow of outside air to the resin supply module, the state of collecting dust and not collecting the dust A method of manufacturing a resin molded article, wherein the state is periodically performed so that the state is repeatedly performed at set intervals, and the state in which the dust is collected and the state in which the dust is not collected are repeatedly performed at a set time for each state.

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