CN110524798A - The manufacturing method of resin molding apparatus and resin forming product - Google Patents
The manufacturing method of resin molding apparatus and resin forming product Download PDFInfo
- Publication number
- CN110524798A CN110524798A CN201910410236.5A CN201910410236A CN110524798A CN 110524798 A CN110524798 A CN 110524798A CN 201910410236 A CN201910410236 A CN 201910410236A CN 110524798 A CN110524798 A CN 110524798A
- Authority
- CN
- China
- Prior art keywords
- resin
- dust
- feeding assembly
- molding apparatus
- ester moulding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/1753—Cleaning or purging, e.g. of the injection unit
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/18—Feeding the material into the injection moulding apparatus, i.e. feeding the non-plastified material into the injection unit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
Abstract
The present invention is the resin molding apparatus for the quality deterioration for inhibiting resin material and the manufacturing method of resin forming product, and resin molding apparatus includes: ester moulding component (3A), ester moulding component (3B), carries out ester moulding；Transport mechanism (5) transports resin material into ester moulding component (3A), ester moulding component (3B)；Resin feeding assembly (8) accommodates resin material, and resin material is supplied into transport mechanism (5)；Aspirating mechanism (dust-collecting mechanism (10)), the dust in pump resin feeding assembly (8)；And control unit (9), it controls dust-collecting mechanism (10)；And control unit (9) makes intermittently to carry out using the suction of dust-collecting mechanism (10).
Description
Technical field
The present invention relates to the manufacturing methods of a kind of resin molding apparatus and resin forming product.
Background technique
In the past, as shown in Patent Document 1, in resin-encapsulated semiconductor manufacturing device, have to include thermmohardening in keeping
Property resin resin material Storage Department in automatic air regulating device is set, and by Storage Department be kept into as defined in temperature and humidity
Mode constitutor.Specifically, only in the case where the temperature and humidity of Storage Department fluctuates above and below defined setting range, automatically
It dehumidified, blown in ground.
But the resin molding apparatus such as resin-encapsulated semiconductor manufacturing device are difficult to the airtight space in device.In addition,
Existing resin molding apparatus is set as to fill since the dust such as the powder of resin material disperse to polluting in device
The structure that dust in setting aspirates together with air.
Then, even if being provided with automatic air regulating device as described, since outside air flows into the sky of Storage Department
In, therefore, it is difficult to control the temperature and humidity of Storage Department.As a result, gap caused by such as reason moisture absorption or rising institute by temperature
Caused dissolution etc., and lead to the quality deterioration of resin material.
[existing technical literature]
[patent document]
[patent document 1] Japanese Patent Laid-Open 5-267367 bulletin
Summary of the invention
[problem to be solved by the invention]
Therefore, the present invention is to put and winner in order to solve described problem, and the deterioration of the quality of resin material will be inhibited to make
For its main problem.
[technical means to solve problem]
That is, resin molding apparatus resin of the invention includes: ester moulding component, ester moulding is carried out；Transport mechanism, will
Resin material is transported into the ester moulding component；Resin feeding assembly, accommodates the resin material, and by the resin
Material is supplied into the transport mechanism；Aspirating mechanism aspirates the dust in the resin feeding assembly；And control unit, until
The aspirating mechanism is controlled less；And the control unit makes intermittently to carry out using the suction of the aspirating mechanism.
[The effect of invention]
The present invention formed according to this can inhibit the deterioration of the quality of resin material.
Detailed description of the invention
Fig. 1 is the plan view for schematically showing the structure of resin molding apparatus of present embodiment.
Fig. 2 is the fragmentary cross-sectional view for indicating the major part of press section of present embodiment.
Fig. 3 is the schematic diagram for indicating the piping structure of dust-collecting mechanism of present embodiment.
Fig. 4 is the skeleton diagram for indicating the resin feeding assembly of present embodiment.
Fig. 5 is the plan view for schematically showing the structure of the conveying unit of resin feeding assembly of present embodiment.
Fig. 6 is the wet of the hygrometry result for indicating the resin unloading part of present embodiment and the unloading part of existing structure
Spend the figure of measurement result.
Fig. 7 is the skeleton diagram for indicating the resin feeding assembly of variant embodiment.
The explanation of symbol
1: resin molding apparatus
2: feeding assembly
3A, 3B: ester moulding component
4: moving out component
5: transport mechanism (loading machine)
6: transport mechanism (unloader)
7: substrate feeding assembly
8: resin feeding assembly
9: control unit
10: dust-collecting mechanism (aspirating mechanism)
11: lid
12: gas supply mechanism (dehumidifying gas supply mechanism, cooling gas feed mechanism)
13: clean air feed mechanism
31: press section
41: substrate receiving portion
71: substrate unloading part
72: substrate supply unit
81: resin unloading part
82: resin supply unit
83: accumulator
101: dust arrester
102: connecting tube
102a: the first connecting tube
102b: the second connecting tube
102c: third connecting tube
102d: the four connecting tube
121: cooler
122: supply pipe
311: lower die
311a: mounting portion
311b: tank
312: upper mold
312a: resin channels
312b: die cavity
313: clamping
314: movable plate
315: top fixed disk
316: plunger
317: heater
811: accepting container
812: hopper
821: receiving unit
822: vibration section
823: aligning section
824: resin queuing portion
S1: the first detection sensor
S2: the second detection sensor
T: resin sheet
V1~V3: switch valve
W: substrate before sealing
Specific embodiment
Then, the present invention will be described in more detail for citing.But the present invention is not limited by the following description.
As described above, resin molding apparatus of the invention includes: ester moulding component, ester moulding is carried out；Transport mechanism,
Resin material is transported into the ester moulding component；Resin feeding assembly, accommodates the resin material, and by the tree
Rouge material is supplied into the transport mechanism；Aspirating mechanism aspirates the dust in the resin feeding assembly；And control unit,
At least control the aspirating mechanism；And the control unit makes intermittently to carry out using the suction of the aspirating mechanism.
If the resin molding apparatus, then make the suction of the aspirating mechanism using the dust in pump resin feeding assembly
It intermittently carries out, therefore can inhibit outside air towards the inflow in resin feeding assembly, and can inhibit by because outside air is drawn
The deterioration of the quality of resin material caused by the variation of the humidity or temperature that rise.In addition, due to utilizing aspirating mechanism suction tree
Dust in rouge feeding assembly, thus the dust such as powder that can reduce resin material disperse caused by pollution in device.
In order to efficiently carry out the moisture management in resin feeding assembly, it is generally desirable to and then including will the gas through dehumidifying
It supplies to the dehumidifying gas supply mechanism in the resin feeding assembly.
In order to efficiently carry out the temperature management in resin feeding assembly, it is generally desirable to the dehumidifying gas supply mechanism tool
Have and carries out cooling cooler to the gas.
In addition, in order to efficiently carry out the temperature management in resin feeding assembly, it is generally desirable to and then including will be through cooling
Gas supply to the cooling gas feed mechanism in the resin feeding assembly.
The resin feeding assembly is contemplated that being included in internal collecting post states resin material and send out the resin material
Resin unloading part and the resin material sent out from the resin unloading part is supplied to the resin into the transport mechanism
Supply unit person.
In the structure, resin unloading part accommodates resin material, therefore is easy to generate resin material from resin unloading part
The dust such as powder, in addition, the influence that outside air flows into resin unloading part becomes bigger than other parts.
Therefore, it is desirable that the aspirating mechanism is the mechanism at least aspirating the dust in the resin unloading part.
It is also desirable to a part of the resin unloading part and at least described resin supply unit is covered by lid, and
The dehumidifying gas supply mechanism is at least to supply the gas through dehumidifying to the mechanism of the lid portion inside.Alternatively, ideal
It is that a part of the resin unloading part and at least described resin supply unit is covered by lid, and the cooling gas feed mechanism
It is that will at least supply through cooling gas to the mechanism of the lid portion inside.
If the structure, then lid portion inside efficiently can be stayed in by the gas through dehumidifying or/and through cooling gas.
In order to make the control of aspirating mechanism become simple, it is contemplated that the control unit makes the suction using the aspirating mechanism
Periodically carry out.In the presence of only by carrying out with making suction period using the aspirating mechanism, can not efficiently aspirating dirt
Angstrom the case where.In particular, being easy to produce when sending out the resin material in from the resin unloading part towards the resin supply unit
The dust such as the powder of resin material.Therefore, it is desirable that in addition to the periodic suction, control unit is at least from the tree
Rouge unloading part towards the suction made in the movement for sending out the resin material in the resin supply unit using the aspirating mechanism into
Row.
For efficiently dust such as powder of pump resin material, it is generally desirable to the resin unloading part and at least described tree
A part of rouge supply unit is covered by lid, and the aspirating mechanism is the mechanism for aspirating the dust of inside of the lid.
In addition, the manufacturing method of resin forming product of the invention is by resin material using transport mechanism from resin supply group
Part carries out ester moulding using the ester moulding component to manufacture the tree of resin forming product towards transporting in ester moulding component
The manufacturing method of resin-formed product, at least part during until the supply to ester moulding of the resin material,
Intermittently aspirate the dust in the resin feeding assembly.
If the manufacturing method of the resin forming product, then until the supply to ester moulding from resin material during
At least part in, the intermittently dust in pump resin feeding assembly, therefore can inhibit outside air towards resin supply group
Inflow in part, and can inhibit the quality of the resin material caused by the variation by the humidity because of caused by outside air or temperature
Deterioration.In addition, due to the dust in pump resin feeding assembly, the dust such as the powder of resin material can be reduced and dispersed institute
Pollution in the device of generation.
< embodiments of the present invention >
Hereinafter, being illustrated referring to an embodiment of the attached drawing to resin molding apparatus of the invention.
The resin molding apparatus 1 of present embodiment is the ester moulding using transfer modling (transfer molding) method
Device.The resin molding apparatus for example, carries out ester moulding person to the substrate for being equipped with semiconductor chip, and for that will be formed
The thermoplastic resin (hereinafter referred to as " resin sheet (resin tablet) ") of columned sheet is used as resin material person.In addition,
It as " substrate ", can enumerate: the general substrate such as glass epoxy substrate, ceramic substrate, resin substrate, metal substrate and lead frame
Frame etc..
Specifically, as shown in Figure 1, resin molding apparatus 1 respectively include supply resin seal before substrate W (hereinafter, claim
For the feeding assembly 2 of " substrate W before sealing ") and resin sheet T, such as two ester moulding component 3A, the tree of ester moulding are carried out
Rouge forming assembly 3B, and for move out resin forming product move out component 4 as constitute element.In addition, as element is constituted
Feeding assembly 2, ester moulding component 3A, ester moulding component 3B, and move out component 4 be respectively relative to other constitute elements can
It mutually loads and unloads and replaceable.
In addition, resin molding apparatus 1 includes: substrate W and resin sheet T conveying before the sealing that will be supplied by feeding assembly 2
Transport mechanism 5 (hereinafter referred to as " loading machine (loader) 5 ") into ester moulding component 3A, ester moulding component 3B, and
The resin forming product for having carried out ester moulding by ester moulding component 3A, ester moulding component 3B is transported to moving out in component 4
Transport mechanism 6 (hereinafter referred to as " unloader (unloader) 6 ").
The feeding assembly 2 of present embodiment is winner by substrate feeding assembly 7 and 8 integration of resin feeding assembly.
Substrate feeding assembly 7 has substrate unloading part 71 and substrate supply unit 72.Substrate unloading part 71 is by magazine
(magazine) substrate W is sent to person in substrate queuing portion before the sealing in.Substrate supply unit 72 is connect from substrate unloading part 71
Substrate W before sealing is received, substrate W before received sealing is lined up towards defined direction, is then handover to person in loading machine 5.
Resin feeding assembly 8 has resin unloading part 81 and resin supply unit 82.Resin unloading part 81 is from aftermentioned storage
Glassware (stocker) 83 receives resin sheet T, and resin sheet T is sent to person in resin supply unit 82.Resin supply unit 82 be from
Resin unloading part 81 receives resin sheet T, is lined up received resin sheet T towards defined direction, is then handover in loading machine 5
Person.
Ester moulding component 3A, ester moulding component 3B are respectively provided with press section 31.As shown in Fig. 2, each press section 31 has
Have liftable lower die 311, the upper mold for the top for being fixed on lower die 311 opposite to each other (referring to Fig. 2 upper mold 312) and for pair
The clamping 313 that lower die 311 and upper mold 312 are molded.Lower die 311 is fixed on the upper surface of movable plate 314, upper mold
312 are fixed on the lower surface of top fixed disk 315.Clamping 313 is to move up and down movable plate 314, thus to upper mold
312 and lower die 311 carry out molding or die sinking person.
In lower die 311, it is formed with the mounting portion 311a of substrate W before the sealing that installation is transported by loading machine 5.In lower die
In 311, it is formed with the multiple tank 311b for the resin sheet T that installation has been transported by loading machine 5.In addition, in lower die 311, in tank
It is provided in 311b in the resin channels 312a and die cavity 312b for resin sheet T injection to be for example formed in upper mold 312
Plunger 316.
In addition, being embedded to the heating parts such as having heaters respectively in upper mold 312 and lower die 311 (referring to the heater of Fig. 2
317).In general, upper mold 312 and lower die 311 are heated to 180 DEG C or so using the heating part.
The ester moulding of < resin molding apparatus 1 acts >
Hereinafter, being illustrated to the elemental motion of the ester moulding of the resin molding apparatus 1 of present embodiment.
Substrate W before sealing in magazine is sent in substrate supply unit 72 by substrate unloading part 71.Substrate supply unit 72 makes
Substrate W is lined up towards defined direction before received sealing, is then handover in loading machine 5.At the same time, resin unloading part 81
It will be sent in resin supply unit 82 from the received resin sheet T of accumulator 83.Resin supply unit 82 is by received resin sheet T
In the numbers (in Fig. 1 be four) of needs be handover in loading machine 5.
Then, substrate W and four resin sheet T are simultaneously towards removing in press section 31 before loading machine 5 seals received two pieces
It send.Substrate W is supplied into the mounting portion 311a of lower die 311 before loading machine 5 will seal, and resin sheet T is supplied to being formed in lower die
The inside of tank 311b in 311.
Thereafter, upper mold 312 and lower die 311 are molded using clamping 313.Moreover, to the tree in each tank 311b
Rouge piece T is heated melting it and is generated liquid resin, and presses liquid resin by plunger 316.It flows as a result,
Dynamic property resin is formed in the inside of the die cavity 312b in upper mold 312 across resin channels 312a by injection.Then, only with hardening
Required required time heats liquid resin, and liquid resin is thus made to harden and form hardening resin.As a result,
Semiconductor chip in die cavity 312b and the substrate on its periphery are sealed in the shape corresponding to die cavity 312b and the hardening that shapes
In resin (sealing resin).
Then, after required time required for overcure, upper mold 312 and lower die 311 are opened, and made close
The demoulding (not shown) of the substrate of envelope.Thereafter, using unloader 6, the base of resin seal sealed will have been carried out by press section 31
Plate (resin forming product) is housed in the substrate receiving portion 41 for moving out component 4.
The whole movement of resin molding apparatus 1 comprising a series of movement is controlled by control unit 9.In Fig. 1,
The setting of control unit 9 can be set in other assemblies in feeding assembly 2, but also.In addition, control unit 9 is for example comprising tool
There are central processing unit (Central Processing Unit, CPU), internal storage, analog/digital (Analog/
Digital, A/D) converter, input/output interface etc. dedicated or general computer.
The structure > of < dust-collecting mechanism (aspirating mechanism) and resin feeding assembly 8
Moreover, the resin molding apparatus 1 of present embodiment includes in turn by ester moulding component 3A, ester moulding component 3B
And the dust generated in resin feeding assembly 8 is aspirated together with air to carry out the dust-collecting mechanism 10 of dust.
Specifically, as shown in figure 3, dust-collecting mechanism 10 includes: dust arrester 101, by the dust arrester 101 and each component
3A, component 3B, component 8 connect the connecting tube 102 for aspirating dust together with air and switch valve V1~switch valve V3.
The dust arrester 101 of present embodiment is arranged in moving out component 4, and but not limited to this.
Connecting tube 102 is connect with each ester moulding component 3A, ester moulding component 3B and resin feeding assembly 8.In order to hold
Generated dust carries out dust, ester moulding component 3A, ester moulding component when easily to the cleaning of upper mold 312 or lower die 311
The opening of connecting tube 102 in 3B is arranged near upper mold 312 or lower die 311.In addition, the connection in resin feeding assembly 8
The structure of pipe 102 will be aftermentioned.
In addition, be provided on the required position of connecting tube 102 for switch suction dust component switch valve V1~
Switch valve V3.Herein, switch valve V1 or switch valve V2 is for switching from ester moulding component 3A, ester moulding component 3B
Dust and its switch valve of stopping.In addition, switch valve V3 is for switching dust and its stopping from resin feeding assembly 8
Switch valve.These switch valves V1~switch valve V3 is motor-driven valve, its switch is controlled by control unit 9.
Specifically, when the cleaning of upper mold 312 or lower die 311 of the control unit 9 after ester moulding, in order to from upper mold
312 or lower die 311 in the dust that is discharged carry out dust, ester moulding component 3A, ester moulding component 3B and dust arrester 101 are passed through
It is connected by connecting tube 102.Specifically, control unit 9 opens switch valve V1 or switch valve V2.At this point, in order to make from tree
Dust in rouge forming assembly 3A, ester moulding component 3B is preferential, and the switch valve V3 of 8 side of resin feeding assembly is set as closing
State.
On the other hand, before the cleaning of upper mold 312 or lower die 311 of the control unit 9 after ester moulding, i.e., from resin sheet T's
In a period of supply is until ester moulding, resin feeding assembly 8 is connect with dust arrester 101 via connecting tube 102.Specifically
For, control unit 9 opens switch valve V3.At this point, due to the cleaning without upper mold 312 or lower die 311, by resin at
Shape component 3A, the side ester moulding component 3B switch valve V1, switch valve V2 be set as close state.It is controlled by these, dust
Device 101 becomes the state operated always.
Secondly, being illustrated to the structure of the dust-collecting mechanism 10 in resin feeding assembly 8.
As shown in Figures 4 and 5, the resin feeding assembly 8 of present embodiment, which has, accommodates many resin sheet T and sends out institute
It states the resin unloading part 81 of resin sheet T and will be supplied by the resin sheet T that the resin unloading part 81 is sent out into transport mechanism
Resin supply unit 82.
Resin unloading part 81 includes accepting container 811 and hopper 812.Hopper 812 for example becomes can be on the transverse direction of Fig. 4
The structure of vibration, accepting container 811 become to include the structure towards the inclined inclined surface in receiving unit side.It has been put into from accumulator 83
The inclined surface of resin sheet T towards accepting container 811 is fallen, and is sent in receiving unit 821 by the vibration of hopper 812.
Accepting container 811 is such as box shape person to form the sidewall opening of upper wall and side, with the side wall of the side
The mode for becoming lower section is obliquely arranged.In addition, being provided with receiving on the top of accepting container 811, there are many storages of resin sheet T
Glassware 83, resin sheet T are put into accepting container 811 from the accumulator 83 via the opening of upper wall.
Resin supply unit 82 is using so-called feed appliance (parts feeder) person, comprising: receiving unit 821 is caught
The resin sheet T sent out from the opening of the side wall of the side of accepting container 811；Vibration section 822 carrys out the vibration of receiving unit 821
Keep resin sheet T mobile；Aligning section 823, makes to carry out mobile resin sheet T by vibration to be arranged in a column-shaped；And resin row
Office 824 is handover to loading for being lined up multiple resin materials arranged by the aligning section 823 one by one
In machine 5.In the present embodiment, aligning section 823 is to make resin sheet T to carry out arrayer with the state that couches, and resin queuing portion 824 is
The resin sheet T for the state of couching is set to be rotated into erected state to carry out queuer.
Herein, it has tailed off as shown in figure 5, being provided with the resin sheet T detected in the receiving unit 821 in receiving unit 821
Such as contact the first detection sensor S1.Control unit 9, must in the detection signal according to the first detection sensor S1
The hopper 812 of resin unloading part 81 must be made to vibrate towards in the case where supplementing resin sheet T in receiving unit 821, and from accepting container
811 towards supplying resin sheet T in receiving unit 821.
In addition, as shown in figure 5, being provided with whether detection is arranged with regulation in the aligning section 823 in aligning section 823
Second detection sensor S2 of such as light-transmission type of several resin sheet T.Control unit 9 is according to the second detection sensor S2's
Signal is detected, in the case where not being arranged with the resin sheet T of stated number in aligning section 823, provide the starting of vibration section 822 will
Several resin sheet T are arranged in aligning section 823.
In the structure, as shown in Figures 3 and 4, the connecting tube for the dust-collecting mechanism 10 being connect with resin feeding assembly 8
102 have the first connecting tube 102a connecting with accepting container 811, the second connecting tube 102b connecting with receiving unit 821 and row
The third connecting tube 102c that column portion 823 connects and the 4th connecting tube 102d being connect with resin queuing portion 824.
In the present embodiment, bottom opening of the first connecting tube 102a in accepting container 811.Second connecting tube 102b exists
The bottom opening of receiving unit 821.Bottom opening of the third connecting tube 102c in aligning section 823.4th connecting tube 102d is in resin
It is open near queuing portion 824.In addition, the aperture position of each connecting tube 102a~connecting tube 102d is not limited to institute's rheme
It sets, as long as the position of dust can be carried out to the dust in each portion.
The first connecting tube 102d of connecting tube 102a~the 4th of present embodiment is to carry out branch in midway to constitute, in institute
State the resin supply group being provided on branch point for the unified switch for switching the first connecting tube 102d of connecting tube 102a~the 4th
The switch valve V3 of 8 side of part (referring to Fig. 3).
By opening the switch valve V3, and carry out the collection using the first connecting tube 102d of connecting tube 102a~the 4th
Dirt by closing switch valve V3, and stops utilizing the dust of the first connecting tube 102d of connecting tube 102a~the 4th.
Moreover, (from the confession of resin sheet T during controlling the control unit 9 of the switch valve V3 before ester moulding completion
To in the movement until ester moulding) in, intermittently the switch of control switch valve V3, thus makes the collection using dust-collecting mechanism 10
Dirt intermittently carries out.
Specifically, control unit 9 makes periodically to carry out using the dust of dust-collecting mechanism 10.For example, switch valve V3 is set
For 60 seconds closed states (state without dust), it is then set as 15 seconds opening state (state for carrying out dust).Separately
Outside, during switch valve V3 being set as closed state and it is set as can correspond to the temperature, wet of supply gas during opening state
Degree, air quantity etc. and change.Herein, in a period of switch valve V3 is set as closed state, by other switch valves V1 or switch valve
V2 is set as opening state.This prevents the damages of the dust arrester 101 operated always.
In addition, in addition to the periodic switch control, control unit 9 is from resin unloading part 81 towards resin supply unit 82
In the middle movement for sending out resin sheet T, the switch valve V3 of 8 side of resin feeding assembly is opened, makes first using dust-collecting mechanism 10
The dust of the connecting tube 102d of connecting tube 102a~the 4th carries out.Its reason is: sending out resin sheet T's from resin unloading part 81
In movement, accepting container 811 is vibrated by hopper 812 and is easy to produce dust.
Specifically, control unit 9 makes resin unloading part 81 in the detection signal according to the first detection sensor S1
Hopper 812 vibrate in the case where, switch valve V3 is opened.Moreover, control unit 9 is in the detection according to the first detection sensor S1
Signal and in the case where stopping the vibration of hopper 812 of resin unloading part 81, switch valve V3 is closed.
In addition, control unit 9 can also make to stop using the dust of dust-collecting mechanism 10 in a period of vibrating receiving unit 821
Only.Its reason is: if being aspirated in a period of vibrating receiving unit 821, resin sheet T is adsorbed on receiving unit 821
It is formed by bottom surface in pump orifice (dust collecting opening), resin sheet T becomes not moving.
Specifically, the feelings that control unit 9 stops vibration section 822 in the detection signal according to the second detection sensor S2
Under condition, switch valve V3 is opened.On the other hand, control unit 9 makes to vibrate in the detection signal according to the second detection sensor S2
In the case that portion 822 starts, switch valve V3 is closed.
In addition, being switched by a switch valve V3 and utilizing the first connecting tube of connecting tube 102a~the 4th in described
Dust/stopping of 102d, but can also constitute as follows: in the first connecting tube 102d of connecting tube 102a~the 4th respectively
Switch valve is set, switches dust/stopping thus directed towards each connecting tube 102a~connecting tube 102d.
Moreover, in the present embodiment, as shown in figure 4, a part of resin unloading part 81 and at least resin supply unit 82
It is surrounded and is covered by lid 11.Lid 11 is provided separately with the framework of resin feeding assembly 8 (not shown), and covering resin is sent out
A part of person of portion 81 and at least resin supply unit 82.Specifically, resin unloading part 81 and resin supply unit 82 at least connect
Receipts portion 821 is surrounded and is covered by lid 11.Can reduce as a result, the first connecting tube 102a by being connect with resin unloading part 81 and with
The volume in the space that the second connecting tube 102b, the third connecting tube 102c that resin supply unit 82 connects are aspirated, and promote dirt
Angstrom collection efficiency.
In addition, as shown in figure 4, the resin molding apparatus 1 of present embodiment includes by the gas (such as air) through dehumidifying
It supplies to the gas supply mechanism 12 in resin feeding assembly 8.
Specifically, gas supply mechanism 12, which has, carries out cooling cooler 121 to gas, pass through the cooler
121 cool down gas, thus dehumidify to gas.In the case, gas supply mechanism 12 is both as except moisture
Body feed mechanism plays a role, and also plays a role as cooling gas feed mechanism.The gas through dehumidifying is outside humidity ratio
The low gas of portion's air.In addition, gas supply mechanism 12 has will have been carried out gas supply that is cooling and dehumidifying by cooler 121
Supply pipe 122 in resin feeding assembly 8.Such as it is contemplated that the supply pipe 122 towards resin unloading part 81 export gas, but
As long as introducing gas into person in resin feeding assembly 8, then it is not particularly limited.In addition, the export mouth of supply pipe 122 can be
One, it is also possible to multiple.It is empty that dehumidifying gas supply mechanism can also supply the compression to be dehumidified using dehumidifying filter
Gas.As gas supply mechanism, dehumidifying both gas supply mechanism and cooling gas feed mechanism also can be set.
In the present embodiment, resin unloading part 81 and resin supply unit 82 are covered by lid 11, therefore 122 quilt of supply pipe
Be laid in the inside of lid 11.It can efficiently be stayed in lid 11 by the gas through dehumidifying or/and through cooling gas as a result,
Portion, and can efficiently make the temperature for accommodating the environment of resin material and humidity decline.
< experimental result >
The humid control result of the resin unloading part 81 of the resin feeding assembly 8 constituted in the above manner is shown in Fig. 6
In.In addition, being also illustrated in humid control result conduct when continuously having carried out dust in identical apparatus structure in Fig. 6
Comparative example.In addition, horizontal axis is arbitrarily set in Fig. 6.
As according to Fig. 6 and, in the present embodiment, humidity increase and decrease control utilize dust-collecting mechanism 10 dust
And its stop opportunity and repetition.During using the dust of dust-collecting mechanism 10, humidity rises, wet in its stopped process
Degree decline.In the present embodiment, due to intermittently carrying out dust, therefore, it is difficult to be influenced by outside air, humidity is most
Small value is 36.2%, and maximum value is suppressed to 39.8%.On the other hand, in a comparative example, due to continuously carrying out dust movement,
Therefore the influence of outside air is big, although the minimum value of humidity is 36.9%, until maximum value rises to 42.7%.
There are five peak values in the present embodiment, and the peak value from left side other than the 4th is produced by periodically aspirating
It is raw as a result, the 4th peak value is by being supplied in addition to periodic suction from resin unloading part 81 towards resin from left side
Result caused by the suction carried out in the movement of resin material is sent out in portion 82.
The effect > of < present embodiment
Resin molding apparatus 1 according to the present embodiment, in the movement until the supply to ester moulding of resin sheet T
In, make intermittently to carry out using the dust of dust-collecting mechanism 10, therefore can inhibit outside air towards the stream in resin feeding assembly 8
Enter, and can inhibit the deterioration of the quality of resin sheet T caused by the variation by the humidity because of caused by outside air or temperature.Separately
Outside, due to carrying out dust to the dust in resin feeding assembly 8 using dust-collecting mechanism 10, the powder of resin sheet T can be reduced
The pollution that equal dust disperse in generated device.
It especially in the present embodiment, can due to utilizing the dust in 10 pump resin unloading part 81 of dust-collecting mechanism
Dust is intensively aspirated from the position of the dust such as the powder for being easy to produce resin sheet T, and can efficiently be reduced as produced by dust
Pollution.At this point, due to intermittently carrying out the dust for resin unloading part 81 dust can be carried out, and reduce and flow into tree
Outside air in rouge unloading part 81 inhibits the deterioration of the quality of resin sheet T.
< other embodiments >
For example, as shown in fig. 7, clean air feed mechanism 13 can also be arranged on the top of resin feeding assembly 8.It is described
Clean air feed mechanism 13 is towards the supply of resin feeding assembly 8 person that is clean air.It is supplied by the way that the clean air is arranged
To mechanism 13, dispersing for dust can be reduced.Alternatively, it is also possible to after dehumidifying to the clean air towards resin feeding assembly 8
Supply.
The resin material of the embodiment is to form sheet person, but in addition to this, be also possible to sheet, granular, particle
The resin material of the solid-likes such as shape or powdery.
In said embodiment, transport mechanism 5 is will to seal preceding substrate W and be transported simultaneously with resin sheet T to lower die 311 to be
Structure only separately transports the structure until lower die 311 but it is also possible to be substrate W before sealing and resin sheet T.
As long as the state that resin material is lined up by resin feeding assembly 8 is handover to person in transport mechanism 5, then
It is not limited to the structure of the embodiment.
The dust-collecting mechanism of the embodiment is the dust-collecting mechanism shared in ester moulding component and resin feeding assembly,
But an other dust-collecting mechanism can also be set in ester moulding component and resin feeding assembly respectively.
The resin molding apparatus 1 of the embodiment is with the dust-collecting mechanism 10 for combining aspirating mechanism with dust arrester
Structure is but it is also possible to be the structure with the aspirating mechanism using the dust in suction pump pump resin feeding assembly 8.
In said embodiment, resin feeding assembly 8 and substrate feeding assembly 7 are constituted as a component, but
Resin feeding assembly 8 can also be set as different components from substrate feeding assembly 7.
It is that there are two the structures of ester moulding component for tool, but ester moulding component is also possible to one in said embodiment
It is a, it is also possible to three or more.
In addition, the present invention is not limited to the embodiments, can carry out within the scope of its spirit certainly each
Kind deformation.
Claims (10)
1. a kind of resin molding apparatus characterized by comprising
Ester moulding component carries out ester moulding；
Transport mechanism transports resin material into the ester moulding component；
Resin feeding assembly accommodates the resin material, and the resin material is supplied into the transport mechanism；
Aspirating mechanism aspirates the dust in the resin feeding assembly；And
Control unit at least controls the aspirating mechanism；And
The control unit makes intermittently to carry out using the suction of the aspirating mechanism.
2. resin molding apparatus according to claim 1, which is characterized in that further include:
Gas through dehumidifying is supplied to the dehumidifying gas supply mechanism in the resin feeding assembly.
3. resin molding apparatus according to claim 2, which is characterized in that
The dehumidifying gas supply mechanism, which has, carries out cooling cooler to the gas.
4. resin molding apparatus according to claim 2, which is characterized in that further include:
It will supply through cooling gas to the cooling gas feed mechanism in the resin feeding assembly.
5. resin molding apparatus according to claim 1, which is characterized in that
The resin feeding assembly includes sending out in the resin that internal collecting post states resin material and sends out the resin material
Portion and the resin material sent out from the resin unloading part is supplied into the resin supply unit into the transport mechanism, and
The aspirating mechanism is the mechanism at least aspirating the dust in the resin unloading part.
6. resin molding apparatus according to claim 5, which is characterized in that
It further include the dehumidifying gas supply mechanism supplied the gas through dehumidifying in the resin feeding assembly,
A part of the resin unloading part and at least described resin supply unit is covered by lid, and
The dehumidifying gas supply mechanism is at least to supply the gas through dehumidifying to the mechanism of the lid portion inside.
7. resin molding apparatus according to claim 5, which is characterized in that
It further include that will supply through cooling gas to the cooling gas feed mechanism in the resin feeding assembly,
A part of the resin unloading part and at least described resin supply unit is covered by lid, and
The cooling gas feed mechanism is will at least to supply through cooling gas to the mechanism of the lid portion inside.
8. resin molding apparatus according to claim 5, which is characterized in that
The control unit carries out with making the suction period using the aspirating mechanism, and at least from the resin unloading part
Towards the suction progress made in the movement for sending out the resin material in the resin supply unit using the aspirating mechanism.
9. resin molding apparatus according to claim 5, which is characterized in that
A part of the resin unloading part and at least described resin supply unit is covered by lid, and
The aspirating mechanism is the mechanism for aspirating the dust of inside of the lid.
It is by resin material using transport mechanism from resin feeding assembly towards tree 10. a kind of manufacturing method of resin forming product
It is transported in rouge forming assembly, and carries out ester moulding using the ester moulding component to manufacture the ester moulding of resin forming product
The manufacturing method of product, which is characterized in that
In at least part during until the supply to ester moulding of the resin material, the tree is intermittently aspirated
Dust in rouge feeding assembly.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-099707 | 2018-05-24 | ||
| JP2018099707A JP6894403B2 (en) | 2018-05-24 | 2018-05-24 | Resin molding equipment and manufacturing method of resin molded products |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110524798A true CN110524798A (en) | 2019-12-03 |
Family
ID=68659654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910410236.5A Pending CN110524798A (en) | 2018-05-24 | 2019-05-17 | The manufacturing method of resin molding apparatus and resin forming product |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6894403B2 (en) |
| KR (1) | KR102243618B1 (en) |
| CN (1) | CN110524798A (en) |
| TW (1) | TWI720488B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113635507A (en) * | 2020-05-11 | 2021-11-12 | 山田尖端科技株式会社 | Resin molding apparatus and cleaning method |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7360365B2 (en) * | 2020-07-14 | 2023-10-12 | Ｔｏｗａ株式会社 | Resin material supply device, resin molding device, and method for manufacturing resin molded products |
| JP7465843B2 (en) * | 2021-04-08 | 2024-04-11 | Ｔｏｗａ株式会社 | Resin molding device and method for manufacturing resin molded product |
| JP2024044401A (en) * | 2022-09-21 | 2024-04-02 | Ｔｏｗａ株式会社 | Resin supplying device, resin molding device, and method for manufacturing resin molded product |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2378179Y (en) * | 1999-07-05 | 2000-05-17 | 王邦枝 | Improved plastic granule moisture separator |
| CN1743159A (en) * | 2004-08-30 | 2006-03-08 | 日本瑞翁株式会社 | Regenerated resin formed body, method for forming same and method for obtaining mould for making regenerated resin cd |
| CN101631731A (en) * | 2007-03-20 | 2010-01-20 | 三菱化学株式会社 | Method of transporting and method of storing polymer pellet |
| JP2010247429A (en) * | 2009-04-15 | 2010-11-04 | Apic Yamada Corp | Resin sealing apparatus and resin sealing method using the same |
| CN203580062U (en) * | 2013-09-16 | 2014-05-07 | 吴焕雄 | Adjustable filter |
| CN106042247A (en) * | 2010-11-25 | 2016-10-26 | 山田尖端科技株式会社 | Resin molding machine |
| CN106239832A (en) * | 2016-07-25 | 2016-12-21 | 信易电热机械有限公司 | A kind of removal moisture drying pay-off |
| CN206383403U (en) * | 2017-01-11 | 2017-08-08 | 东莞市广为塑料机械有限公司 | A kind of removal moisture drying system conveys closed loop |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05267367A (en) | 1992-03-23 | 1993-10-15 | Fujitsu Miyagi Electron:Kk | Resin sealed semiconductor manufacturing device |
| JP3200211B2 (en) * | 1992-12-01 | 2001-08-20 | アピックヤマダ株式会社 | Semiconductor sealing device |
| JP3519521B2 (en) * | 1995-11-10 | 2004-04-19 | 株式会社サイネックス | Semiconductor encapsulation molding equipment |
| JPH09246298A (en) * | 1996-03-13 | 1997-09-19 | Toshiba Corp | Semiconductor molding equipment |
| JP3516195B2 (en) * | 1996-05-28 | 2004-04-05 | 東京エレクトロン株式会社 | Method and apparatus for forming coating film |
| JP2002313829A (en) * | 2001-04-19 | 2002-10-25 | Mitsubishi Electric Corp | Cleaning device for mold for semiconductor resin sealing apparatus |
| JP3879638B2 (en) * | 2002-09-13 | 2007-02-14 | 松下電器産業株式会社 | Semiconductor resin sealing device |
| KR20140120153A (en) * | 2013-04-02 | 2014-10-13 | 에스티엑스조선해양 주식회사 | natural gas hydrate dissociation device and method using hot water injection pipe line |
| CN205263685U (en) * | 2015-12-07 | 2016-05-25 | 贵州省华腾农业科技有限公司 | Cooling room humiture adjusting device |
| JP6212609B1 (en) * | 2016-08-19 | 2017-10-11 | Ｔｏｗａ株式会社 | Resin molding apparatus and resin molded product manufacturing method |
-
2018
- 2018-05-24 JP JP2018099707A patent/JP6894403B2/en active Active
-
2019
- 2019-05-10 KR KR1020190054793A patent/KR102243618B1/en active IP Right Grant
- 2019-05-17 CN CN201910410236.5A patent/CN110524798A/en active Pending
- 2019-05-21 TW TW108117399A patent/TWI720488B/en active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2378179Y (en) * | 1999-07-05 | 2000-05-17 | 王邦枝 | Improved plastic granule moisture separator |
| CN1743159A (en) * | 2004-08-30 | 2006-03-08 | 日本瑞翁株式会社 | Regenerated resin formed body, method for forming same and method for obtaining mould for making regenerated resin cd |
| CN101631731A (en) * | 2007-03-20 | 2010-01-20 | 三菱化学株式会社 | Method of transporting and method of storing polymer pellet |
| JP2010247429A (en) * | 2009-04-15 | 2010-11-04 | Apic Yamada Corp | Resin sealing apparatus and resin sealing method using the same |
| CN106042247A (en) * | 2010-11-25 | 2016-10-26 | 山田尖端科技株式会社 | Resin molding machine |
| CN203580062U (en) * | 2013-09-16 | 2014-05-07 | 吴焕雄 | Adjustable filter |
| CN106239832A (en) * | 2016-07-25 | 2016-12-21 | 信易电热机械有限公司 | A kind of removal moisture drying pay-off |
| CN206383403U (en) * | 2017-01-11 | 2017-08-08 | 东莞市广为塑料机械有限公司 | A kind of removal moisture drying system conveys closed loop |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113635507A (en) * | 2020-05-11 | 2021-11-12 | 山田尖端科技株式会社 | Resin molding apparatus and cleaning method |
| CN113635507B (en) * | 2020-05-11 | 2023-08-25 | 山田尖端科技株式会社 | Resin molding apparatus and cleaning method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6894403B2 (en) | 2021-06-30 |
| TWI720488B (en) | 2021-03-01 |
| KR102243618B1 (en) | 2021-04-23 |
| KR20190134473A (en) | 2019-12-04 |
| JP2019202495A (en) | 2019-11-28 |
| TW202003192A (en) | 2020-01-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110524798A (en) | The manufacturing method of resin molding apparatus and resin forming product | |
| CN104708734B (en) | The resin material supply method and feed mechanism and compress moulding method and compression molding apparatuss of compression molding apparatuss | |
| CN101405854B (en) | Resin sealing/molding apparatus | |
| CN103915352B (en) | Resin encapsulation equipment and resin encapsulation method | |
| CA2595928A1 (en) | Device for filling an extruder with pretreated thermoplastic material | |
| US8882401B2 (en) | Discharge apparatus for powdered or granular material and transport system for the material provided with the discharge apparatus | |
| CN108824094A (en) | Drying forming device in disposable fibrous tableware moulding equipment | |
| JP2010247429A (en) | Resin sealing apparatus and resin sealing method using the same | |
| CN212370097U (en) | Automatic feed proportioning system | |
| JP2000001224A (en) | Powder and grain throw-in device | |
| CN105522709A (en) | Lid maker with intelligent control type extrusion mechanism | |
| CN107756707B (en) | Resin molding apparatus and method for manufacturing resin molded product | |
| CN204869463U (en) | Automatic ration feed control system | |
| TW202116518A (en) | Resin supply mechanism, resin molding device, and method of manufacturing resin molded product wherein the resin supply mechanism can supply resin materials at a plurality of positions | |
| JP4061212B2 (en) | Resin sealing molding equipment | |
| CN112179067B (en) | Powder particle processing container and drying device | |
| JP2021072395A (en) | Cleaning module, cutting device, and manufacturing method of cut product | |
| CN218742290U (en) | Cement mill convenient to automatic discharging | |
| CN208529488U (en) | A kind of new and effective injection molding machine of plastic | |
| CN114955036B (en) | Multistage quantitative weighing and filling machine | |
| KR100455388B1 (en) | Molding apparatus carrying out automatically mold release treatment on mold for molding semiconductor devices | |
| JPH0234010Y2 (en) | ||
| JPS61127519A (en) | Pellet transfer device | |
| JPH061450A (en) | Conveying apparatus | |
| JPH0747373Y2 (en) | Collection device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20191203 |