TWI720488B - Resin molding device and method of producing resin molded product - Google Patents

Abstract

The present invention is a resin molding device to suppress deterioration of the quality of a resin material, and includes: a resin molding module (3A) and a resin molding module (3B) for molding resin; a conveyance mechanism (5) for delivering a resin material to the resin molding modules (3A) and (3B); a resin supply module (8) for housing and supplying the resin material to the conveyance mechanism (5); a suction mechanism (10) (dust-collecting mechanism) for sucking dust in the resin supply module (8); and a control unit (9) for controlling the dust-collecting mechanism (10), wherein the control unit (9) intermittently performs suction with use of the dust-collecting mechanism (10).

Description

Resin molding device and manufacturing method of resin molded product

The present invention relates to a resin molding device and a method of manufacturing a resin molded product.

In the past, as shown in Patent Document 1, in resin-sealed semiconductor manufacturing equipment, an automatic air-conditioning device is installed in a storage section that stores a resin material containing a thermosetting resin, and the storage section is maintained at a predetermined temperature and humidity. Former. Specifically, only when the temperature and humidity of the storage unit have fluctuated up and down from a predetermined setting range, dehumidification and air blowing are automatically performed.

However, it is difficult for a resin molding apparatus such as a resin-sealed semiconductor manufacturing apparatus to seal the space in the apparatus. In addition, the conventional resin molding apparatus contaminates the inside of the apparatus because dust such as powder of the resin material is scattered, and therefore has a structure that sucks the dust in the apparatus together with air.

Therefore, even if an automatic air-conditioning device is installed as described above, it is difficult to control the temperature and humidity of the storage unit because outside air flows into the space of the storage unit. As a result, the quality of the resin material deteriorates due to voids caused by moisture absorption or dissolution caused by temperature rise, for example. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 5-267367

[The problem to be solved by the invention] Therefore, the present invention was made to solve the above-mentioned problems, and its main problem is to suppress the deterioration of the quality of the resin material. [Technical means to solve the problem]

That is, the resin molding apparatus of the present invention is characterized in that it includes: a resin molding assembly to perform resin molding; a transport mechanism to transport the resin material to the resin molding assembly; a resin supply assembly to accommodate the resin material and transfer the resin material. The resin material is supplied to the conveying mechanism; a suction mechanism that sucks dust in the resin supply assembly; and a control section that controls at least the suction mechanism; and the control section makes use of the suction mechanism The suction is performed intermittently. [Effects of the invention]

According to the present invention thus constituted, it is possible to suppress the deterioration of the quality of the resin material.

Next, the present invention will be explained in more detail with examples. However, the present invention is not limited by the following description.

As described above, the resin molding apparatus of the present invention is characterized by including: a resin molding assembly to perform resin molding; a conveying mechanism to transport the resin material to the resin molding assembly; a resin supply assembly to accommodate the resin material and The resin material is supplied to the conveying mechanism; a suction mechanism that sucks dust in the resin supply assembly; and a control section that controls at least the suction mechanism; and the control section makes use of the suction The suction of the mechanism is performed intermittently. In the case of the resin molding apparatus, the suction by the suction mechanism that sucks the dust in the resin supply assembly is performed intermittently. Therefore, the inflow of external air into the resin supply assembly can be suppressed, and the external cause can be suppressed. The deterioration of the quality of the resin material caused by the humidity or temperature fluctuation caused by the air. In addition, since the dust in the resin supply assembly is sucked by the suction mechanism, it is possible to reduce contamination in the device caused by scattering of dust such as powder of the resin material.

In order to efficiently perform humidity management in the resin supply module, it is desirable to further include a dehumidified gas supply mechanism that supplies dehumidified gas into the resin supply module.

In order to efficiently perform temperature management in the resin supply module, it is desirable that the dehumidified gas supply mechanism has a cooler that cools the gas.

In addition, in order to efficiently perform temperature management in the resin supply module, it is desirable to further include a cooling gas supply mechanism that supplies the cooled gas into the resin supply module.

The resin supply unit may include a resin delivery unit that accommodates the resin material inside and delivers the resin material, and a resin supply unit that supplies the resin material that has been delivered from the resin delivery unit to the transport mechanism. Ministry. In the above structure, the resin sending part accommodates the resin material, so dusts such as powder of the resin material are likely to be generated from the resin sending part, and the influence of external air flowing into the resin sending part becomes greater than other parts. Therefore, it is desirable that the suction mechanism is a mechanism that sucks at least the dust in the resin sending portion.

In addition, it is desirable that the resin delivery part and at least a part of the resin supply part are covered by a cover body, and the dehumidified gas supply mechanism is a mechanism that supplies dehumidified gas at least into the cover body. Alternatively, it is desirable that the resin sending portion and at least a part of the resin supplying portion are covered by a lid, and the cooling gas supply mechanism is a mechanism that supplies cooled gas to at least the inside of the lid. With this structure, the dehumidified gas or/and the cooled gas can be efficiently left inside the cover.

In order to simplify the control of the suction mechanism, it is conceivable that the control unit periodically performs suction by the suction mechanism. There are cases in which dust cannot be sucked efficiently by simply performing suction by the suction mechanism periodically. In particular, when the resin material is sent from the resin sending part to the resin supply part, dust such as powder of the resin material is likely to be generated. Therefore, it is desirable that, in addition to the periodic suction, the control unit causes the suction by the suction mechanism at least during the operation of sending the resin material from the resin delivery unit to the resin supply unit. get on.

In order to efficiently suck dust such as powders of resin materials, it is desirable that the resin delivery part and at least a part of the resin supply part are covered by a cover, and the suction mechanism sucks the inside of the cover The institution of dust.

In addition, the method of manufacturing a resin molded product of the present invention uses a conveying mechanism to transport a resin material from a resin supply assembly to a resin molded assembly, and uses the resin molded assembly to perform resin molding to produce a resin molded product. The method is characterized in that the dust in the resin supply assembly is intermittently sucked in at least a part of the period from the supply of the resin material to the resin molding. According to the method of manufacturing the resin molded product, the dust in the resin supply assembly is intermittently sucked in at least a part of the period from the supply of the resin material to the resin molding, so that it is possible to prevent external air from reaching the resin supply assembly. It is possible to suppress the deterioration of the quality of the resin material due to the humidity or temperature fluctuation caused by the outside air. In addition, since the dust in the resin supply assembly is sucked, it is possible to reduce the contamination in the device caused by the scattering of dust such as powder of the resin material.

<Embodiments of the present invention> Hereinafter, an embodiment of the resin molding apparatus of the present invention will be described with reference to the drawings.

The resin molding apparatus 1 of this embodiment is a resin molding apparatus using a transfer molding method. The resin molding apparatus is, for example, a person who performs resin molding of a substrate on which a semiconductor chip is mounted, and a person who uses a cylindrical sheet-like thermoplastic resin (hereinafter referred to as a "resin tablet") as a resin material . In addition, as the "substrate", general substrates such as glass epoxy substrates, ceramic substrates, resin substrates, and metal substrates, lead frames, and the like can be cited.

Specifically, as shown in FIG. 1, the resin molding apparatus 1 includes a supply unit 2 for supplying a substrate W before resin sealing (hereinafter, referred to as a "pre-sealing substrate W") and a resin sheet T, respectively, which perform resin molding, for example, two The resin molding unit 3A, the resin molding unit 3B, and the unloading unit 4 for unloading the resin molding are used as constituent elements. In addition, the supply unit 2 as the constituent elements, the resin molding unit 3A, the resin molding unit 3B, and the unloading unit 4 are respectively removable and replaceable with respect to other constituent elements.

In addition, the resin molding apparatus 1 includes: a transport mechanism 5 (hereinafter, referred to as a "loader) for transporting the pre-seal substrate W and the resin sheet T supplied from the supply assembly 2 to the resin molding assembly 3A and the resin molding assembly 3B. 5"), and the resin molded product molded by the resin molding assembly 3A and the resin molding assembly 3B is transported to the transport mechanism 6 in the unloading assembly 4 (hereinafter referred to as "unloader 6").

The supply module 2 of the present embodiment is formed by integrating the substrate supply module 7 and the resin supply module 8.

The substrate supply assembly 7 has a substrate delivery portion 71 and a substrate supply portion 72. The substrate delivery unit 71 is a unit that delivers the pre-sealing substrate W in a magazine (magazine) to the substrate queuing unit. The substrate supply unit 72 receives the pre-seal substrate W from the substrate delivery unit 71, arranges the received pre-seal substrate W in a predetermined direction, and then transfers it to the loader 5.

The resin supply unit 8 has a resin delivery unit 81 and a resin supply unit 82. The resin delivery unit 81 receives the resin sheet T from a stocker 83 to be described later, and delivers the resin sheet T to the resin supply unit 82. The resin supply unit 82 receives the resin sheet T from the resin delivery unit 81, arranges the received resin sheet T in a predetermined direction, and then transfers it to the loader 5.

The resin molding module 3A and the resin molding module 3B each have a pressing portion 31. As shown in FIG. 2, each pressing portion 31 has a lower mold 311 that can be raised and lowered, an upper mold (refer to the upper mold 312 of FIG. 2) fixed on the upper mold of the lower mold 311 opposite to each other, and the lower mold 311 and the upper mold 312 A mold clamping mechanism 313 that performs mold clamping. The lower mold 311 is fixed on the upper surface of the movable plate 314, and the upper mold 312 is fixed on the lower surface of the upper fixed plate 315. The mold clamping mechanism 313 moves the movable platen 314 up and down, thereby clamping or opening the upper mold 312 and the lower mold 311.

In the lower mold 311, a mounting portion 311a to which the pre-seal substrate W transported by the loader 5 is mounted is formed. In the lower mold 311, a plurality of tanks 311b to which the resin sheet T transported by the loader 5 is mounted is formed. In addition, in the lower mold 311, a plunger 316 for injecting the resin sheet T into the resin channel 312a and the cavity 312b formed in the upper mold 312, for example, is provided in the tank 311b.

In addition, heating parts such as heaters are embedded in the upper mold 312 and the lower mold 311 (refer to the heater 317 in FIG. 2 ). Generally, the upper mold 312 and the lower mold 311 are heated to about 180° C. by the heating part.

<Resin molding operation of resin molding apparatus 1> Hereinafter, the basic operation of the resin molding of the resin molding apparatus 1 of the present embodiment will be described.

The substrate delivery portion 71 delivers the pre-sealed substrate W in the cartridge to the substrate supply portion 72. The substrate supply unit 72 queues the received pre-sealing substrates W in a predetermined direction, and then transfers them to the loader 5. At the same time, the resin delivery unit 81 delivers the resin sheet T received from the stocker 83 to the resin supply unit 82. The resin supply unit 82 transfers the required number (four in FIG. 1) of the received resin sheets T to the loader 5.

Then, the loader 5 simultaneously conveys the received two pre-sealing substrates W and the four resin sheets T into the pressing portion 31. The loader 5 supplies the pre-sealing substrate W into the mounting portion 311 a of the lower mold 311, and supplies the resin sheet T to the inside of the tank 311 b formed in the lower mold 311.

After that, the upper mold 312 and the lower mold 311 are mold-clamped using the mold clamping mechanism 313. Then, the resin sheet T in each tank 311b is heated to be melted to generate a fluid resin, and the fluid resin is pressed by the plunger 316. Thus, the fluid resin passes through the resin channel 312a and is injected into the inside of the cavity 312b formed in the upper mold 312. Then, the fluid resin is heated only for the required time required for curing to harden the fluid resin to form a cured resin. As a result, the semiconductor chip in the cavity 312b and the surrounding substrates are sealed in the cured resin (sealing resin) molded corresponding to the shape of the cavity 312b.

Then, after the required time required for curing has elapsed, the upper mold 312 and the lower mold 311 are opened, and the sealed substrate (not shown) is released from the mold. After that, the unloader 6 is used to house the sealed substrate (resin molded product) resin-sealed by the pressing part 31 in the substrate accommodating part 41 of the unloading unit 4.

The entire operation of the resin molding apparatus 1 including the series of operations is controlled by the control unit 9. In FIG. 1, the control unit 9 is provided in the supply assembly 2, but it can also be provided in other assemblies. In addition, the control unit 9 includes, for example, a dedicated or general-purpose computer having a central processing unit (CPU), an internal memory, an analog/digital (Analog/Digital, A/D) converter, an input/output interface, and the like.

<Structure of dust collecting mechanism (suction mechanism) and resin supply unit 8> Furthermore, the resin molding apparatus 1 of the present embodiment further includes a dust collection mechanism 10 that sucks dust generated in the resin molding assembly 3A, the resin molding assembly 3B, and the resin supply assembly 8 together with air to collect the dust.

Specifically, as shown in FIG. 3, the dust collection mechanism 10 includes a dust collector 101, and a connecting pipe 102 that connects the dust collector 101 to each of the components 3A, 3B, and 8 to suck dust and air together. , And on-off valve V1 ~ on-off valve V3. The dust collector 101 of this embodiment is provided in the carry-out unit 4, but it is not limited to this.

The connecting pipe 102 is connected to each of the resin molding unit 3A, the resin molding unit 3B, and the resin supply unit 8. In order to easily collect dust generated during cleaning of the upper mold 312 or the lower mold 311, the opening of the connecting pipe 102 in the resin molding assembly 3A and the resin molding assembly 3B is provided in the vicinity of the upper mold 312 or the lower mold 311. In addition, the structure of the connection pipe 102 in the resin supply module 8 is mentioned later.

In addition, the on-off valve V1 to the on-off valve V3 for switching the dust suction unit are provided at the required part of the connecting pipe 102. Here, the on-off valve V1 or the on-off valve V2 is an on-off valve for switching the dust collection from the resin molding assembly 3A and the resin molding assembly 3B and stopping it. In addition, the on-off valve V3 is an on-off valve for switching the dust collection from the resin supply unit 8 and stopping it. These on-off valves V1 to V3 are electric valves, and their opening and closing are controlled by the control unit 9.

Specifically, when cleaning the upper mold 312 or the lower mold 311 after resin molding, the control unit 9 collects the dust discharged from the upper mold 312 or the lower mold 311 by removing the resin molding assembly 3A and the resin molding assembly 3A. 3B and the dust collector 101 are connected via a connecting pipe 102. Specifically, the control unit 9 opens the on-off valve V1 or the on-off valve V2. At this time, in order to give priority to dust collection from the resin molding assembly 3A and the resin molding assembly 3B, the on-off valve V3 on the resin supply assembly 8 side is set to a closed state.

On the other hand, the control unit 9 connects the resin supply assembly 8 and the dust collector 101 via the resin mold before cleaning the upper mold 312 or the lower mold 311 after resin molding, that is, during the period from the supply of the resin sheet T to the resin molding. The tube 102 is connected. Specifically, the control unit 9 opens the on-off valve V3. At this time, since cleaning of the upper mold 312 or the lower mold 311 is not performed, the on-off valve V1 and the on-off valve V2 on the side of the resin molding unit 3A and the resin molding unit 3B are closed. With these controls, the dust collector 101 is always in operation.

Next, the structure of the dust collection mechanism 10 in the resin supply assembly 8 is demonstrated.

As shown in FIGS. 4 and 5, the resin supply assembly 8 of this embodiment has a resin delivery unit 81 that houses a large number of resin sheets T and delivers the resin sheets T, and a resin sheet that has been delivered by the resin delivery unit 81 T is supplied to the resin supply part 82 in the conveyance mechanism.

The resin delivery unit 81 includes a storage container 811 and a hopper 812. The hopper 812 becomes a structure which can vibrate in the horizontal direction of FIG. 4, for example, and the storage container 811 becomes a structure including the inclined surface inclined toward the receiving part side. The resin sheet T put in from the stocker 83 falls toward the inclined surface of the storage container 811 and is sent out to the receiving part 821 by the vibration of the hopper 812.

The storage container 811 is, for example, a box-shaped one in which an upper wall and an opening on one side wall are formed, and is installed obliquely so that the side wall on the one side becomes downward. In addition, a stocker 83 accommodating many resin sheets T is provided on the upper part of the storage container 811, and the resin sheets T are put into the storage container 811 from the stocker 83 through the opening of the upper wall.

The resin supply unit 82 uses a so-called parts feeder, and includes: a receiving unit 821 for receiving the resin sheet T that has been sent out through the opening of the side wall of the storage container 811; and a vibrating unit 822 for making the receiving The part 821 vibrates to move the resin sheet T; the arrangement part 823 arranges the resin sheets T moved by vibration in a row; and the resin line part 824 is used to arrange a plurality of pieces by the arrangement part 823 The resin materials are queued one by one to be transferred to the loader 5. In this embodiment, the arrangement part 823 arranges the resin sheets T in the horizontally lying state, and the resin line part 824 rotates the resin sheets T in the horizontally lying state to form a line.

Here, as shown in FIG. 5, the receiving unit 821 is provided with, for example, a contact-type first detection sensor S1 that detects that the resin sheet T in the receiving unit 821 has decreased. The control unit 9 vibrates the hopper 812 of the resin sending unit 81 and moves from the storage container 811 to the receiving unit 821 when it is necessary to replenish the resin sheet T into the receiving unit 821 based on the detection signal of the first detection sensor S1. The resin sheet T is supplied.

In addition, as shown in FIG. 5, the arrangement portion 823 is provided with, for example, a light-transmitting second detection sensor S2 that detects whether a predetermined number of resin sheets T are arranged in the arrangement portion 823. The control unit 9 activates the vibration unit 822 to arrange the predetermined number of resin sheets T in the arrangement when the predetermined number of resin sheets T are not arranged in the arrangement part 823 based on the detection signal of the second detection sensor S2. Section 823.

In the above structure, as shown in FIGS. 3 and 4, the connecting pipe 102 of the dust collecting mechanism 10 connected to the resin supply assembly 8 has a first connecting pipe 102a connected to the storage container 811, and a second connecting pipe 102a connected to the receiving portion 821. The connection pipe 102b, the third connection pipe 102c connected to the arrangement part 823, and the fourth connection pipe 102d connected to the resin line part 824.

In this embodiment, the first connecting pipe 102a opens at the bottom of the storage container 811. The second connecting pipe 102b opens at the bottom of the receiving portion 821. The third connecting pipe 102c opens at the bottom of the arrangement portion 823. The fourth connection pipe 102 d opens in the vicinity of the resin line part 824. In addition, the opening position of each connecting pipe 102a to 102d is not limited to the above-mentioned position, as long as it is a position where dust in each part can be collected.

The first connecting pipe 102a to the fourth connecting pipe 102d of this embodiment are configured to branch in the middle, and a resin supply for collectively switching the switches of the first connecting pipe 102a to the fourth connecting pipe 102d is provided at the branch point. On-off valve V3 on the assembly 8 side (refer to Figure 3).

By opening the on-off valve V3, dust collection by the first connecting pipe 102a to the fourth connecting pipe 102d is performed, and by closing the on-off valve V3, the use of the first connecting pipe 102a to the fourth connecting pipe 102d is stopped. The dust collection.

Furthermore, the control unit 9 that controls the on-off valve V3 intermittently controls the on-off valve V3 during the period before the completion of resin molding (from the supply of the resin sheet T to the operation until the resin molding), thereby enabling the use of The dust collection of the dust collection mechanism 10 is performed intermittently.

Specifically, the control unit 9 periodically performs dust collection by the dust collection mechanism 10. For example, the on-off valve V3 is set to a closed state for 60 seconds (a state where dust is not collected), and then set to an open state for 15 seconds (a state where dust is collected). In addition, the period during which the on-off valve V3 is in the closed state and the period during which the on-off valve V3 is in the open state can be changed in accordance with the temperature, humidity, and air volume of the supplied gas. Here, while the on-off valve V3 is in the closed state, the other on-off valve V1 or the on-off valve V2 is in the open state. As a result, it is possible to prevent damage to the dust collector 101 which is always in operation.

In addition, in addition to the periodic switch control, the control unit 9 opens the on-off valve V3 on the resin supply assembly 8 side during the operation of sending the resin sheet T from the resin delivery unit 81 to the resin supply unit 82 to enable the use of the dust collector The dust collection of the first connecting pipe 102a to the fourth connecting pipe 102d of the structure 10 is performed. The reason is that during the operation of sending out the resin sheet T from the resin sending portion 81, the storage container 811 is vibrated by the hopper 812, and dust is likely to be generated.

Specifically, the control unit 9 opens the on-off valve V3 when vibrating the hopper 812 of the resin sending unit 81 based on the detection signal of the first detection sensor S1. Then, the control unit 9 closes the on-off valve V3 when the vibration of the hopper 812 of the resin sending unit 81 is stopped based on the detection signal of the first detection sensor S1.

In addition, the control unit 9 may stop the dust collection by the dust collection mechanism 10 during the period in which the receiving unit 821 is vibrated. The reason is that if suction is performed while the receiving portion 821 is vibrated, the resin sheet T is attracted to the suction port (dust collecting port) formed on the bottom surface of the receiving portion 821, and the resin sheet T becomes unable to move. .

Specifically, the control unit 9 opens the on-off valve V3 when the vibration unit 822 is stopped based on the detection signal of the second detection sensor S2. On the other hand, the control unit 9 closes the on-off valve V3 when the vibration unit 822 is activated based on the detection signal of the second detection sensor S2.

In addition, in the above, one switch valve V3 is used to switch the dust collection/stop using the first connecting pipe 102a to the fourth connecting pipe 102d, but it can also be configured as follows: The connecting pipe 102d is provided with an on-off valve, thereby switching the dust collection/stop for each of the connecting pipe 102a to the connecting pipe 102d.

Furthermore, in this embodiment, as shown in FIG. 4, the resin sending part 81 and at least a part of the resin supply part 82 are enclosed and covered by the cover body 11. As shown in FIG. The cover 11 is provided separately from the frame (not shown) of the resin supply assembly 8 and covers the resin sending portion 81 and at least a part of the resin supply portion 82. Specifically, at least the receiving portion 821 of the resin sending portion 81 and the resin supplying portion 82 is surrounded and covered by the cover 11. As a result, the volume of the space sucked by the first connecting pipe 102a connected to the resin sending portion 81 and the second connecting pipe 102b and the third connecting pipe 102c connected to the resin supply portion 82 can be reduced, and the amount of dust can be improved. Dust collection efficiency.

In addition, as shown in FIG. 4, the resin molding apparatus 1 of the present embodiment includes a gas supply mechanism 12 that supplies dehumidified gas (for example, air) into the resin supply module 8.

Specifically, the gas supply mechanism 12 has a cooler 121 that cools the gas, and the cooler 121 cools the gas, thereby dehumidifying the gas. In this case, the gas supply mechanism 12 functions as both a dehumidified gas supply mechanism and a cooling gas supply mechanism. The dehumidified gas is a gas whose humidity is lower than that of outside air. In addition, the gas supply mechanism 12 has a supply pipe 122 that supplies the gas cooled and dehumidified by the cooler 121 into the resin supply module 8. For example, it is conceivable that the supply pipe 122 leads the gas toward the resin delivery unit 81, but it is not particularly limited as long as it introduces the gas into the resin supply assembly 8. In addition, there may be one or more outlets of the supply pipe 122. The dehumidification gas supply mechanism may supply compressed air dehumidified using a dehumidification filter. As the gas supply mechanism, both a dehumidification gas supply mechanism and a cooling gas supply mechanism may be provided.

In this embodiment, the resin sending portion 81 and the resin supplying portion 82 are covered by the cover 11, so the supply pipe 122 is laid inside the cover 11. Thereby, the dehumidified gas or/and the cooled gas can be efficiently left inside the lid 11, and the temperature and humidity of the environment in which the resin material is housed can be efficiently reduced.

<Experimental results> The result of the humidity control of the resin delivery unit 81 of the resin supply assembly 8 configured as described above is shown in FIG. 6. In addition, FIG. 6 also shows the result of humidity control when dust collection is continuously performed in the same device configuration as a comparative example. In addition, in FIG. 6, the horizontal axis is arbitrarily set.

As can be understood from FIG. 6, in the present embodiment, the increase and decrease of humidity are repeated in comparison with the timing of dust collection by the dust collection mechanism 10 and its stop. During the dust collection process using the dust collection mechanism 10, the humidity rises, and during the stop process, the humidity drops. In this embodiment, since dust is collected intermittently, it is hard to be affected by outside air, and the minimum value of humidity is 36.2%, and the maximum value is suppressed to 39.8%. On the other hand, in the comparative example, since the dust collection operation is continuously performed, the influence of outside air is large, and although the minimum value of humidity is 36.9%, the maximum value rises to 42.7%. In this embodiment, there are five peaks. The peaks other than the fourth from the left are the result of periodic suction. The fourth peak from the left is caused by the periodic suction. The resin feeder 81 is a result of the suction performed during the action of sending the resin material to the resin feeder 82.

<Effects of this embodiment> According to the resin molding apparatus 1 of the present embodiment, in the operation from the supply of the resin sheet T to the resin molding, the dust collection by the dust collection mechanism 10 is performed intermittently. Therefore, it is possible to prevent external air from entering the resin supply assembly 8 Inflow, it is possible to suppress the deterioration of the quality of the resin sheet T due to the humidity or temperature fluctuation caused by the outside air. In addition, since the dust in the resin supply assembly 8 is collected by the dust collecting mechanism 10, it is possible to reduce the contamination in the device caused by the scattering of dust such as powder of the resin sheet T.

Particularly in this embodiment, since the dust collecting mechanism 10 sucks the dust in the resin delivery part 81, it is possible to collect dust concentratedly from the places where dust such as powder of the resin sheet T is likely to be generated, and it is possible to efficiently reduce the dust caused by the dust. The pollution produced. At this time, since dust collection with respect to the resin sending part 81 is performed intermittently, dust collection can be performed, and the outside air flowing into the resin sending part 81 can be reduced, and the deterioration of the quality of the resin sheet T can be suppressed.

<Other embodiments> For example, as shown in FIG. 7, a clean air supply mechanism 13 may be provided on the upper part of the resin supply assembly 8. The clean air supply mechanism 13 supplies clean air to the resin supply unit 8. By providing the clean air supply mechanism 13, scattering of dust can be reduced. In addition, the clean air may be dehumidified and supplied to the resin supply unit 8.

The resin material of the above-mentioned embodiment is formed into a sheet shape, but in addition to this, it may be a solid resin material such as a sheet shape, a granular shape, a granular shape, or a powder shape.

In the above-mentioned embodiment, the conveying mechanism 5 is a structure that simultaneously conveys the pre-sealing substrate W and the resin sheet T to the lower mold 311, but it may also separately convey the pre-sealing substrate W and the resin sheet T to the lower mold 311. Structure.

The resin supply unit 8 is not limited to the structure of the above-mentioned embodiment as long as it transfers the resin material to the conveying mechanism 5 in a queued state.

The dust collection mechanism of the above-mentioned embodiment is a dust collection mechanism shared by the resin molding assembly and the resin supply assembly, but separate dust collection mechanisms may be provided in the resin molding assembly and the resin supply assembly, respectively.

The resin molding apparatus 1 of the above-mentioned embodiment has a structure having a dust collection mechanism 10 combining a suction mechanism and a dust collector, but it may also have a suction mechanism that sucks dust in the resin supply assembly 8 with a suction pump. structure.

In the above-mentioned embodiment, the resin supply assembly 8 and the substrate supply assembly 7 are configured as one assembly, but the resin supply assembly 8 and the substrate supply assembly 7 may be different assemblies.

In the above-mentioned embodiment, the structure has two resin molded components, but there may be one resin molded component or three or more resin molded components.

In addition, the present invention is not limited to the above-mentioned embodiments, and of course various modifications can be made without departing from the spirit thereof.

1‧‧‧Resin molding device 2‧‧‧Supply components 3A、3B‧‧‧Resin molding components 4‧‧‧Move out the components 5‧‧‧Transfer mechanism (loader) 6‧‧‧Transfer mechanism (unloader) 7‧‧‧Substrate supply assembly 8‧‧‧Resin supply assembly 9‧‧‧Control Department 10‧‧‧Dust collection mechanism (suction mechanism) 11‧‧‧Cover body 12‧‧‧Gas supply mechanism (dehumidification gas supply mechanism, cooling gas supply mechanism) 13‧‧‧Clean air supply mechanism 31‧‧‧Pressing part 41‧‧‧Substrate storage section 71‧‧‧Substrate delivery section 72‧‧‧Substrate Supply Department 81‧‧‧Resin Delivery Department 82‧‧‧Resin Supply Department 83‧‧‧Stocker 101‧‧‧Dust Collector 102‧‧‧Connecting pipe 102a‧‧‧First connecting pipe 102b‧‧‧Second connecting pipe 102c‧‧‧The third connecting pipe 102d‧‧‧Fourth connecting pipe 121‧‧‧Cooler 122‧‧‧Supply pipe 311‧‧‧Die 311a‧‧‧Installation Department 311b‧‧‧Can 312‧‧‧Upper die 312a‧‧‧Resin channel 312b‧‧‧Mold cavity 313‧‧‧Clamping mechanism 314‧‧‧movable plate 315‧‧‧Upper fixed plate 316‧‧‧Plunger 317‧‧‧Heater 811‧‧‧Container 812‧‧‧ Hopper 821‧‧‧Receiving Department 822‧‧‧Vibration Department 823‧‧‧Arrangement Department 824‧‧‧Resin Queuing Department S1‧‧‧First detection sensor S2‧‧‧Second detection sensor T‧‧‧Resin sheet V1～V3‧‧‧On-off valve W‧‧‧Sealed front substrate

FIG. 1 is a plan view schematically showing the structure of the resin molding apparatus of this embodiment. Fig. 2 is a partial cross-sectional view showing the main part of the pressing portion of the present embodiment. Fig. 3 is a schematic diagram showing the piping structure of the dust collecting mechanism of the present embodiment. Fig. 4 is a schematic view showing the resin supply assembly of the present embodiment. Fig. 5 is a plan view schematically showing the structure of the conveying section of the resin supply module of the present embodiment. Fig. 6 is a diagram showing the humidity measurement result of the resin delivery unit of the present embodiment and the humidity measurement result of the delivery unit of the conventional structure. Fig. 7 is a schematic diagram showing a resin supply assembly according to a modified embodiment.

5‧‧‧Transfer mechanism (loader)

8‧‧‧Resin supply assembly

11‧‧‧Cover body

12‧‧‧Gas supply mechanism (dehumidification gas supply mechanism, cooling gas supply mechanism)

81‧‧‧Resin Delivery Department

82‧‧‧Resin Supply Department

83‧‧‧Stocker

102a‧‧‧First connecting pipe

102b‧‧‧Second connecting pipe

102c‧‧‧The third connecting pipe

102d‧‧‧Fourth connecting pipe

121‧‧‧Cooler

122‧‧‧Supply pipe

811‧‧‧Container

812‧‧‧ Hopper

821‧‧‧Receiving Department

822‧‧‧Vibration Department

823‧‧‧Arrangement Department

824‧‧‧Resin Queuing Department

T‧‧‧Resin sheet

Claims (10)

A resin molding device includes: a resin molding assembly to perform resin molding; a conveying mechanism to transport a resin material to the resin molding assembly; a resin supply assembly to accommodate the resin material and supply the resin material to the In the conveying mechanism; a suction mechanism that sucks dust in the resin supply assembly; and a control section that controls at least the suction mechanism; and the control section enables the intermittent suction by the suction mechanism And the state of collecting dust and the state of not collecting dust are periodically performed at a set interval. The state of collecting dust and the state of not collecting dust are based on individual states. Repeat for the set time. The resin molding apparatus described in the first item of the scope of patent application further includes a dehumidified gas supply mechanism for supplying dehumidified gas into the resin supply assembly. The resin molding apparatus according to claim 2, wherein the dehumidifying gas supply mechanism has a cooler that cools the gas. The resin molding apparatus described in the second item of the scope of patent application further includes a cooling gas supply mechanism for supplying cooled gas into the resin supply assembly. The resin molding apparatus according to the first item of the patent application, wherein the resin supply assembly includes an internal storage of the resin material and delivery of the resin material. The resin delivery portion of the resin material, and the resin supply portion that supplies the resin material that has been delivered from the resin delivery portion to the resin supply portion of the transport mechanism, and the suction mechanism sucks at least the resin within the resin delivery portion The institution of dust. The resin molding apparatus according to claim 5, which further includes a dehumidified gas supply mechanism for supplying dehumidified gas into the resin supply assembly, the resin delivery part and at least the resin supply part A part is covered by a cover, and the dehumidified gas supply mechanism is a mechanism that supplies dehumidified gas to at least the inside of the cover. The resin molding apparatus described in claim 5, further comprising a cooling gas supply mechanism for supplying cooled gas into the resin supply assembly, the resin sending part and at least the resin supply part A part is covered by a lid, and the cooling gas supply mechanism is a mechanism that supplies cooled gas to at least the inside of the lid. The resin molding apparatus according to claim 5, wherein the control unit makes use of the suction mechanism at least in the operation of sending the resin material from the resin sending unit to the resin supply unit The suction is carried out. The resin molding apparatus according to claim 5, wherein the resin delivery part and at least a part of the resin supply part are covered by a cover, and the suction mechanism sucks the inside of the cover Of dusty bodies. A method of manufacturing a resin molded product, which is a method of manufacturing a resin molded product that uses a conveying mechanism to transport a resin material from a resin supply assembly to a resin molded component, and uses the resin molded component to perform resin molding to produce a resin molded product, Wherein, in at least a part of the period from the supply of the resin material to the resin molding, the dust in the resin supply assembly is intermittently sucked, and the dust is collected or not. The state of is repeated periodically at set intervals, and the state of performing dust collection and the state of not performing dust collection are repeated for a time set for the individual state.

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