TWI802094B - Part for collecting resin powder, piston unit, resin molding device, and manufacturing method of resin molded product - Google Patents
Part for collecting resin powder, piston unit, resin molding device, and manufacturing method of resin molded product Download PDFInfo
- Publication number
- TWI802094B TWI802094B TW110143338A TW110143338A TWI802094B TW I802094 B TWI802094 B TW I802094B TW 110143338 A TW110143338 A TW 110143338A TW 110143338 A TW110143338 A TW 110143338A TW I802094 B TWI802094 B TW I802094B
- Authority
- TW
- Taiwan
- Prior art keywords
- resin powder
- resin
- piston
- hole
- collecting
- Prior art date
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 314
- 239000011347 resin Substances 0.000 title claims abstract description 314
- 239000000843 powder Substances 0.000 title claims abstract description 200
- 238000000465 moulding Methods 0.000 title claims abstract description 75
- 238000004519 manufacturing process Methods 0.000 title claims description 22
- -1 piston unit Substances 0.000 title 1
- 238000001721 transfer moulding Methods 0.000 claims abstract description 16
- 230000007246 mechanism Effects 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 18
- 238000003780 insertion Methods 0.000 claims description 13
- 230000037431 insertion Effects 0.000 claims description 13
- 239000003566 sealing material Substances 0.000 claims description 3
- 238000011109 contamination Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 14
- 239000002184 metal Substances 0.000 description 9
- 239000007788 liquid Substances 0.000 description 7
- 235000012431 wafers Nutrition 0.000 description 6
- 238000009434 installation Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000002893 slag Substances 0.000 description 4
- 230000007257 malfunction Effects 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 239000013590 bulk material Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/1753—Cleaning or purging, e.g. of the injection unit
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Pistons, Piston Rings, And Cylinders (AREA)
Abstract
提供一種可高效減少從傳遞成型用成型模的料罐和活塞之間的間隙掉落的樹脂粉末對裝置的污染的樹脂粉末收集用部件。樹脂粉末收集用部件,其特徵在於,樹脂粉末收集用部件包括頂棚部和側壁部,可以配置在安裝所述活塞的活塞單元的上部,在頂棚部和側壁部圍成的空間內可以收集樹脂粉末,在頂棚部形成有用於插入活塞單元的活塞安裝部的活塞安裝部插入用貫通孔,用於樹脂粉末掉落至空間內的樹脂粉末落下用貫通孔,頂棚部上表面從活塞安裝部插入用貫通孔和活塞安裝部插入用貫通孔的相反側向樹脂粉末落下用貫通孔傾斜成凹狀。To provide a resin powder collection member capable of efficiently reducing contamination of the device by resin powder falling from the gap between a tank and a piston of a molding die for transfer molding. The component for collecting resin powder is characterized in that the component for collecting resin powder includes a ceiling part and a side wall part, and can be arranged on the upper part of the piston unit where the piston is installed, and the resin powder can be collected in the space surrounded by the ceiling part and the side wall part , A through hole for inserting the piston mounting part for inserting the piston mounting part of the piston unit is formed in the ceiling part, a through hole for dropping the resin powder is used for dropping the resin powder into the space, and the upper surface of the ceiling part is used for inserting from the piston mounting part The side opposite to the through-hole and the through-hole for inserting the piston mounting portion is inclined to be concavely inclined toward the through-hole for dropping the resin powder.
Description
本發明關於一種樹脂粉末收集用部件、活塞單元、樹脂成型裝置以及樹脂成型品的製造方法。The present invention relates to a component for collecting resin powder, a piston unit, a resin molding device, and a method for manufacturing a resin molded product.
在樹脂成型品的製造中,傳遞成型法(也稱為傳遞模塑法等)是被廣泛應用的方法。In the manufacture of resin molded products, transfer molding (also called transfer molding, etc.) is a widely used method.
在傳遞成型法中,為了降低樹脂渣對裝置的污染,會使用收集樹脂渣的構造。例如,在專利文獻1中,如圖1-4所示,在活塞(5)的前端和底端的中間部,經由彈簧(26)設置收納樹脂渣的收納器(20),收納器(20)的樹脂渣用去除單元(33)抽吸去除。去除單元(33)由空氣壓送機構(34)和抽吸排出機構(35)構成。此處,樹脂渣是指在藉由活塞將料罐(pot)內的樹脂材料擠壓至型腔內時,未被移送至料罐外而侵入料罐的內表面和活塞之間的滑動部而產生的殘留渣(殘渣)。樹脂渣為從傳遞成型用成型模的料罐與活塞之間的間隙落下的樹脂粉末。In the transfer molding method, in order to reduce contamination of the equipment by resin residue, a structure for collecting resin residue is used. For example, in Patent Document 1, as shown in Figures 1-4, a container (20) for storing resin slag is provided via a spring (26) in the middle part between the front end and the bottom end of the piston (5), and the container (20) The resin residue is removed by suction with the removal unit (33). The removal unit (33) is composed of an air pressure feeding mechanism (34) and a suction discharge mechanism (35). Here, the resin slag refers to the sliding part between the inner surface of the pot and the piston without being transported out of the pot when the resin material in the pot is squeezed into the cavity by the piston resulting residue (residue). The resin slag is resin powder falling from the gap between the pot and the piston of the transfer molding die.
[先前技術文獻] [專利文獻] 專利文獻1:專利第4836901號公報。 [Prior Art Literature] [Patent Document] Patent Document 1: Patent No. 4836901.
[發明要解決的問題][Problem to be solved by the invention]
但是,為了更高效地降低例如樹脂渣這樣的樹脂粉末對裝置的污染,有必要探討藉由別的結構收集樹脂粉末。However, in order to more efficiently reduce the pollution of the device by the resin powder such as resin slag, it is necessary to investigate the collection of the resin powder by other structures.
因此,本發明的目的是提供一種可以高效地降低從傳遞成型用成型模的料罐和活塞之間的間隙落下的樹脂粉末對裝置的污染的樹脂粉末收集用部件、活塞單元、樹脂成型裝置和樹脂成型品的製造方法。 [用以解決課題之手段] Therefore, an object of the present invention is to provide a resin powder collecting member, a piston unit, a resin molding device and A method of manufacturing a resin molded product. [Means to solve the problem]
為了達到該目的,本發明的樹脂粉末收集用部件是用於收集從傳遞成型用成型模的料罐和活塞之間的間隙落下的樹脂粉末的樹脂粉末收集用部件, 其特徵在於 所述樹脂粉末收集用部件包括頂棚部和側壁部,可以配置在安裝有所述活塞的活塞單元的上部, 在所述頂棚部和所述側壁部圍成的空間內可以收集所述樹脂粉末, 在所述頂棚部形成有用於插入所述活塞單元的活塞安裝部的活塞安裝部插入用貫通孔,和用於所述樹脂粉末掉落至所述空間內的樹脂粉末落下用貫通孔, 所述頂棚部上表面從所述活塞安裝部插入用貫通孔和所述活塞安裝部插入用貫通孔的相反側向所述樹脂粉末落下用貫通孔傾斜成凹狀。 In order to achieve this object, the resin powder collecting member of the present invention is a resin powder collecting member for collecting resin powder dropped from a gap between a tank and a piston of a molding die for transfer molding, It is characterized by The resin powder collecting part includes a ceiling part and a side wall part, and can be arranged on the upper part of the piston unit on which the piston is installed, the resin powder can be collected in the space enclosed by the ceiling portion and the side wall portion, A through-hole for inserting the piston attachment portion for inserting the piston attachment portion of the piston unit and a through-hole for dropping the resin powder into the space are formed in the ceiling portion, The upper surface of the ceiling part is sloped in a concave shape from the side opposite to the through-hole for inserting the piston attachment part and the through-hole for inserting the piston attachment part toward the through-hole for dropping the resin powder.
本發明的活塞單元是特徵在於具有所述本發明的樹脂粉末收集用部件的傳遞成型用活塞單元。The piston unit of the present invention is a piston unit for transfer molding comprising the resin powder collecting member of the present invention.
本發明的樹脂成型裝置的特徵在於包括所述本發明的活塞單元和樹脂成型用成型模。The resin molding apparatus of the present invention is characterized by including the piston unit of the present invention and a molding die for resin molding.
本發明的樹脂成型品的製造方法的特徵在於包括使用所述本發明的樹脂成型裝置,使樹脂材料成型的樹脂成型步驟。 [發明功效] The method of manufacturing a resin molded article of the present invention is characterized by including a resin molding step of molding a resin material using the resin molding apparatus of the present invention. [Efficacy of the invention]
藉由本發明,能夠提供一種可以高效地降低從傳遞成型用成型模的料罐和活塞之間的間隙落下的樹脂粉末對裝置的污染的樹脂粉末收集用部件、活塞單元、樹脂成型裝置和樹脂成型品的製造方法。According to the present invention, it is possible to provide a resin powder collecting member, a piston unit, a resin molding device, and a resin molding device capable of efficiently reducing contamination of the device by resin powder falling from the gap between the tank and the piston of a molding die for transfer molding. The method of manufacture of the product.
接著,舉例進一步詳細說明本發明。但是,本發明不限於以下說明。Next, examples are given to further describe the present invention in detail. However, the present invention is not limited to the following description.
在本發明的樹脂粉末收集用部件中,例如所述樹脂粉末落下用貫通孔的形狀可以是狹縫狀。In the resin powder collecting member of the present invention, for example, the shape of the resin powder dropping through hole may be a slit shape.
本發明的樹脂粉末收集用部件例如在投影至所述樹脂粉末收集用部件安裝在所述活塞單元的安裝面時,從所述活塞安裝部插入用貫通孔側端部到所述樹脂粉末落下用貫通孔的距離,可以比從所述側壁部側端部到所述樹脂粉末落下用貫通孔的距離大。The resin powder collecting member of the present invention, for example, when the resin powder collecting member is mounted on the mounting surface of the piston unit, is projected from the end of the piston mounting part insertion through hole side to the resin powder dropping part. The distance of the through hole may be greater than the distance from the side end of the side wall portion to the through hole for dropping resin powder.
在本發明的樹脂粉末收集用部件中,例如在所述活塞安裝部插入用貫通孔的周圍可以設置防止樹脂粉末落下的密封材料。In the resin powder collection member of the present invention, for example, a sealing material for preventing resin powder from falling may be provided around the through-hole for inserting the piston mounting portion.
本發明的活塞單元例如進一步具有活塞安裝部和所述活塞安裝部可在其內部上下移動的孔,在所述孔的周圍,可以設置防止樹脂粉末落下的密封材料。The piston unit of the present invention further includes, for example, a piston mounting portion and a hole in which the piston mounting portion can move up and down, and a sealing material for preventing resin powder from falling may be provided around the hole.
本發明的樹脂成型裝置例如可以進一步包括用於對所述頂棚部和所述側壁部圍成的空間內進行抽吸的抽吸機構。The resin molding apparatus of the present invention may further include, for example, a suction mechanism for sucking the space enclosed by the ceiling portion and the side wall portion.
本發明的樹脂成型品的製造方法例如可以進一步包括將在所述頂棚部和所述側壁部圍成的空間內收集的樹脂粉末捨棄至所述樹脂成型裝置外部的樹脂粉末捨棄步驟。The method for manufacturing a resin molded article of the present invention may further include, for example, a resin powder disposal step of discarding the resin powder collected in the space surrounded by the ceiling portion and the side wall portion to the outside of the resin molding device.
在本發明的樹脂成型品的製造方法中,例如所述本發明的樹脂成型裝置是包括所述抽吸機構的樹脂成型裝置,所述樹脂粉末捨棄步驟可以在停止所述抽吸機構的抽吸後進行。In the method for manufacturing a resin molded product of the present invention, for example, the resin molding device of the present invention is a resin molding device including the suction mechanism, and the resin powder discarding step may be performed after stopping the suction of the suction mechanism. later.
在本發明中,樹脂成型方法如上所述,使用傳遞成型。In the present invention, the resin molding method uses transfer molding as described above.
在本發明中,“成型模”例如是金屬模具,但不限於此,例如也可以是陶製模具等。In the present invention, the "molding die" is, for example, a metal die, but is not limited thereto, and may be, for example, a pottery die or the like.
在本發明中,樹脂成型品沒有特殊限制,例如可以是僅將樹脂成型的樹脂成型品,也可以是對晶片等部件進行樹脂密封的樹脂成型品。在本發明中,樹脂成型品例如可以是電子部件等。電子部件沒有特殊限制,是任意的,例如可以是樹脂密封晶片、電線等任意部件而得的任意電子部件。晶片沒有特殊限制,例如可舉例IC、LED晶片、半導體晶片、控制電力的半導體元件等晶片。In the present invention, the resin molded product is not particularly limited, and may be, for example, a resin molded product in which only resin is molded, or a resin molded product in which components such as a wafer are resin-sealed. In the present invention, the resin molded product may be, for example, an electronic component or the like. The electronic component is not particularly limited, and is arbitrary, for example, any electronic component obtained by sealing arbitrary components such as a chip and an electric wire with a resin. The wafer is not particularly limited, and examples thereof include wafers such as ICs, LED wafers, semiconductor wafers, and semiconductor elements for controlling electric power.
在本發明中,成型前的樹脂材料以及成型後的樹脂沒有特殊限制,例如可以是環氧樹脂或矽酮樹脂等熱固性樹脂,也可以是熱塑性樹脂。另外,也可以是包含一部分熱固性樹脂或熱塑性樹脂的複合材料。在本發明中,成型前的樹脂材料的形態例如可舉例顆粒狀樹脂、液態樹脂、片狀樹脂、板狀樹脂、粉末狀樹脂等。另外,在本發明中,液態樹脂可以是在常溫下為液態,也包括加熱熔融後為液態的熔融樹脂。In the present invention, the resin material before molding and the resin after molding are not particularly limited, for example, they may be thermosetting resins such as epoxy resin or silicone resin, or thermoplastic resins. In addition, a composite material containing a part of thermosetting resin or thermoplastic resin may also be used. In the present invention, the form of the resin material before molding includes, for example, granular resin, liquid resin, sheet-like resin, plate-like resin, powdery resin, and the like. In addition, in the present invention, the liquid resin may be liquid at normal temperature, and includes molten resin that is liquid after heating and melting.
在本發明中,樹脂成型的成型對象物沒有特殊限制,例如可以是基板。另外,在本發明中,例如可以對安裝在基板(成型對象物)上的部件(例如晶片、倒裝晶片等)進行樹脂密封(樹脂成型),製造樹脂成型品。In the present invention, the object to be molded by resin molding is not particularly limited, and may be, for example, a substrate. In addition, in the present invention, for example, components (for example, wafers, flip chips, etc.) mounted on a substrate (object to be molded) can be resin-sealed (resin molded) to manufacture a resin molded product.
下文基於圖示,說明本發明的具體實施例。為了便於說明,各圖進行適當省略、誇張等,進行示意性描述。Hereinafter, specific embodiments of the present invention will be described based on drawings. For convenience of description, each figure is appropriately omitted, exaggerated, etc., and is schematically described.
[實施例][Example]
在本實施例中,說明本發明的樹脂粉末收集用部件、活塞單元、樹脂成型裝置以及樹脂成型品的製造方法的一例。In this example, an example of the resin powder collecting member, the piston unit, the resin molding device, and the manufacturing method of the resin molded article of the present invention will be described.
圖1示出本發明的樹脂粉末收集用部件的一例。圖1之(a)是平面圖。圖1之(b)是底視圖。圖1之(c)是側視圖。圖1之(d)是從圖1之(a)的Ⅰ-Ⅰ’方向所視的剖視圖。圖1之(e)是從斜上方所視的斜視圖。圖1之(f)是從斜下方所視的斜視圖。FIG. 1 shows an example of the member for resin powder collection of this invention. (a) of Figure 1 is a plan view. (b) of Fig. 1 is a bottom view. (c) of Fig. 1 is a side view. (d) of Fig. 1 is a sectional view viewed from the I-I' direction of (a) of Fig. 1 . (e) of Fig. 1 is a perspective view seen from obliquely above. (f) of Fig. 1 is a perspective view viewed obliquely from below.
如圖1所示,該樹脂粉末收集用部件100包括頂棚部110和側壁部120。在該樹脂粉末收集用部件100中,頂棚部110和側壁部120形成為一體。如後所述,樹脂粉末收集用部件100可以配置在活塞單元的上部。在頂棚部110和側壁部120圍成的空間121內,如後所述,可以收集從傳遞成型用成型模的料罐和活塞之間的間隙落下的樹脂粉末。頂棚部110形成有後述用於插入活塞單元的活塞安裝部的活塞安裝部插入用貫通孔101,和用於樹脂粉末掉落至空間121內的樹脂粉末落下用貫通孔102。該樹脂粉末收集用部件100如圖1之(a)和(b)所示,從上方或下方看呈矩形,9個活塞安裝部插入用貫通孔101沿著頂棚部110的長邊方向的中心直排配置。另外,在圖1中,活塞安裝部插入用貫通孔101的個數為9個,但不限於此,是任意的。樹脂粉末落下用貫通孔102為2個,2個狹縫狀樹脂粉末落下用貫通孔102以隔著直排配置的9個活塞安裝部插入用貫通孔101的方式,沿著頂棚部110的長邊方向配置。另外,在圖1中,樹脂粉末落下用貫通孔102的個數為2個,但不限於此,是任意的。另外,在圖1中,樹脂粉末落下用貫通孔102的形狀為狹縫狀,但不限於此,是任意的。頂棚部110的上表面從樹脂粉末落下用貫通孔102朝向活塞安裝部插入用貫通孔101傾斜成凸狀(山狀),同時從活塞安裝部插入用貫通孔101和活塞安裝部插入用貫通孔101的相反側朝向樹脂粉末落下用貫通孔102傾斜成凹狀(穀狀)。由此,從傳遞成型用成型模的料罐和活塞之間的間隙落下的樹脂粉末難以掉落至活塞安裝部插入用貫通孔101和活塞安裝部之間的間隙,同時容易從樹脂粉末落下用貫通孔102掉落至空間121內。更具體而言,頂棚部110沿著長邊方向的中心形成凸部111,隔著凸部111形成兩道凹部112。並且,活塞安裝部插入用貫通孔101沿著凸部111配置,樹脂粉末落下用貫通孔102配置在凹部112。另外,在頂棚部110長邊方向中心的兩個端部,以隔著直排配置的9個活塞安裝部插入用貫通孔101的方式,形成2個樹脂粉末收集用部件安裝部103。樹脂粉末收集用部件安裝部103具有從頂棚部110的上表面貫通至下表面的貫通孔,藉由將螺絲等穿過該貫通孔,如後所述,可以將樹脂粉末收集用部件100安裝在活塞單元主體。另外,樹脂粉末收集用部件安裝部103在本發明的樹脂粉末收集用部件中是任意的,可有可無,其形態、個數、配置位置等也是任意的。但是,從易於將本發明的樹脂粉末收集用部件固定在活塞單元主體等的角度,較佳為具有樹脂粉末收集用部件安裝部。As shown in FIG. 1 , this resin
圖2示出本發明的活塞單元的一例。圖2之(a)是斜視圖。圖2之(b)是從與圖2之(a)不同方向所視的斜視圖。圖2之(c)是左側視圖。圖2之(d)是正視圖。圖2之(e)是右側視圖。圖2之(f)是從圖2之(d)的Ⅲ-Ⅲ’方向所視的剖視圖。圖2之(g)是從圖2之(c)的Ⅱ-Ⅱ’方向所視的剖視圖。另外,圖2之(f)和(g)是剖視圖,但為了簡略圖示,適當省略了剖面線。圖3以後的各剖視圖也如此。Fig. 2 shows an example of the piston unit of the present invention. (a) of Fig. 2 is a perspective view. (b) of Fig. 2 is a perspective view viewed from a direction different from that of (a) of Fig. 2 . (c) of Fig. 2 is a left side view. (d) of Fig. 2 is a front view. (e) of Fig. 2 is a right side view. (f) of Fig. 2 is a sectional view viewed from the III-III' direction of (d) of Fig. 2 . (g) of Fig. 2 is a cross-sectional view viewed from the direction II-II' of (c) of Fig. 2 . In addition, (f) and (g) of FIG. 2 are cross-sectional views, but hatching is appropriately omitted for the sake of simplicity of illustration. The same is true for each cross-sectional view after FIG. 3 .
如圖所示,該活塞單元200的主要構成要件是活塞單元主體210。活塞單元主體210的上表面固定有橡膠製的蓋部件220。活塞單元主體210的活塞安裝部201周圍被蓋部件220罩住,由此,抑制樹脂粉末侵入活塞安裝部201的驅動部分(圖示中的孔211內)。進一步,活塞單元200具有圖1中說明的本發明的樹脂粉末收集用部件100。樹脂粉末收集用部件100配置在活塞單元200的上部。更具體而言,樹脂粉末收集用部件100藉由圖1中說明的樹脂粉末收集用部件安裝部103,用固定螺絲固定在蓋部件220的上表面。另外,在樹脂粉末收集用部件100的一端安裝有抽吸用部件130。抽吸用部件130的內部為空腔,該空腔與樹脂粉末收集用部件100的頂棚部110和側壁部120圍成的空間121連通。抽吸用部件130具有抽吸孔131,經抽吸孔131,藉由後述的抽吸機構,可以對樹脂粉末收集用部件100的空間121內進行抽吸。活塞單元主體210具有9個近圓筒形的活塞安裝部201。另外,活塞單元主體210在其上部具有孔211,孔211貫通至蓋部件220的上表面。活塞安裝部201可以在孔211內部上下移動,活塞安裝部201的上部從蓋部件220的上表面突出。如圖2之(f)和(g)所示,孔211內部配置有彈簧(彈性部件)212。活塞安裝部201載置在彈簧212上,彈簧212可以在活塞安裝部201上下移動的同時進行伸縮。另外,在活塞單元主體210的左端安裝有棒狀的桿202,進一步,在桿202的前端安裝有球形旋鈕203。As shown in the figure, the main component of this
圖3之(a)的剖視圖示意性示出包括圖2的活塞單元200的本發明的樹脂成型裝置中的樹脂粉末收集結構。圖3之(a)的剖視圖是與圖2之(f)相同的剖視圖中的上部的放大圖。亦即,該圖是示出在與活塞安裝部201並排方向垂直的方向,且在活塞安裝部插入用貫通孔101的直徑位置處切斷的形態的剖視圖。樹脂粉末收集用部件100內的空間121經抽吸路徑801與抽吸機構800連接,可以藉由抽吸機構800對空間121內進行抽吸而減壓。抽吸路徑801經圖2中說明的抽吸用部件130和抽吸孔131(圖3之(a)中未圖示)與空間121內連通。另外,抽吸機構800沒有特殊限制,例如可以是抽吸泵、真空泵等。另外,樹脂成型裝置進一步具有圖3之(a)中未圖示的活塞、料罐、成型模。活塞安裝在活塞安裝部201的上端。藉由活塞安裝部201的上下移動,活塞可以在料罐內部上下移動。料罐內可以收納樹脂材料。藉由活塞的上升,料罐內部的樹脂材料可以供給至成型模內,進行樹脂成型。活塞、料罐和成型模的構成沒有特殊限制,例如可以與常規的傳遞成型用的樹脂成型裝置相同。The sectional view of (a) of FIG. 3 schematically shows a resin powder collection structure in the resin molding device of the present invention including the
使用圖3之(a),說明使用了本發明的樹脂成型裝置的本發明的樹脂成型品的製造方法和樹脂粉末收集的一例。首先,進行使用樹脂成型裝置對樹脂材料進行成型的樹脂成型步驟。該樹脂成型步驟沒有特殊限制,例如可以用與常規的傳遞成型相同的方法進行。如上所述,藉由活塞上升,可以向成型模內供給料罐內部的樹脂材料,由此可以進行樹脂成型步驟,製造樹脂成型品。在該樹脂成型步驟中,如圖所示,樹脂粉末10a從活塞和料罐之間的間隙掉落至樹脂粉末收集用部件100的頂棚部110上。如上所述,頂棚部110的上表面朝向活塞安裝部插入用貫通孔101傾斜成凸狀(山狀)的同時,朝向樹脂粉末落下用貫通孔102傾斜成凹狀(穀狀)。亦即,在頂棚部110的上表面,樹脂粉末落下用貫通孔102的部分最低。因此,如圖所示,樹脂粉末10a 向樹脂粉末落下用貫通孔102掉落。進一步,樹脂粉末10a從樹脂粉末落下用貫通孔102掉落至樹脂粉末收集用部件100的空間121內。此時,藉由抽吸機構對空間121內進行抽吸而減壓,由此進一步使樹脂粉末10a易於掉落至空間121內,易於收集樹脂粉末10a。另外,在本發明中,抽吸機構800是任意的,可有可無。另外,藉由抽吸機構800進行抽吸也是任意的,是否進行均可。但是,如上所述,若藉由抽吸機構800進行抽吸,則更易於收集樹脂粉末10a,因此較佳。另外,抽吸機構800進行抽吸的時機沒有特殊限制。例如,較佳為在進行樹脂成型步驟前,預先藉由抽吸機構800對空間121內進行抽吸而減壓。另外,藉由該抽吸對空間121內進行減壓較佳為持續至樹脂成型步驟結束。另外,藉由抽吸機構800的抽吸,可以收集空間121內的樹脂粉末10a。進一步,在樹脂成型品的製造方法中,在樹脂成型步驟後,可以進一步進行將藉由抽吸機構800從樹脂粉末收集用部件100的空間121內收集的樹脂粉末10a捨棄至樹脂成型裝置外部的樹脂粉末捨棄步驟。該樹脂粉末捨棄步驟例如可以停止抽吸機構800的抽吸後進行。該樹脂粉末捨棄步驟例如可以自動進行,其方法沒有特殊限制,例如可以將藉由抽吸機構800從空間121內收集的樹脂粉末10a藉由除抽吸機構800外的其他抽吸機構(未圖示)進行抽吸而去除。此時,為了保持較高的集塵力,抽吸機構800的抽吸較佳為在停止用於除去樹脂粉末10a的其他抽吸機構的抽吸後進行。Using FIG. 3( a ), an example of a method for producing a resin molded article of the present invention and collection of resin powder using the resin molding apparatus of the present invention will be described. First, a resin molding step of molding a resin material using a resin molding device is performed. This resin molding step is not particularly limited, and can be performed, for example, by the same method as conventional transfer molding. As described above, the resin material inside the tank can be supplied into the molding die by the piston rising, thereby enabling the resin molding step to produce a resin molded product. In this resin molding step, the
圖3之(b)的剖視圖示出圖3之(a)的變形例。圖3之(b)的活塞單元200如圖所示,除具有防止樹脂粉末落下用的密封材料(O形環)701和702外,與圖3之(a)的活塞單元200相同。如圖所示,O形環701設於活塞單元主體210和蓋部件220的孔211(活塞安裝部201可在其內部上下移動的孔)的周圍。藉由O形環701,可以進一步減少樹脂粉末10a掉落至孔211內。另外,O形環702構成樹脂粉末收集用部件100的一部分。圖3之(b)的樹脂粉末收集用部件100除具有O形環702外,與圖1、圖2和圖3之(a)的樹脂粉末收集用部件100相同。如圖所示,O形環702設於活塞安裝部插入用貫通孔101的周圍。藉由O形環702,可以進一步減少樹脂粉末10a掉落至活塞安裝部插入用貫通孔101內。使用包括圖3之(b)的活塞單元的樹脂成型裝置的樹脂成型品的製造方法和進行樹脂粉末的收集的方法沒有特殊限制,例如可以用與圖3之(a)相同的方法進行。The cross-sectional view of (b) of FIG. 3 shows a modified example of (a) of FIG. 3 . As shown in the figure, the
另外,本發明的樹脂成型裝置的構成除包括本發明的活塞單元和樹脂成型用的成型模外,沒有特殊限制,是任意的。例如,本發明的樹脂成型裝置的構成除活塞單元是本發明的活塞單元外,可以與常規的傳遞成型用的樹脂成型裝置相同。例如,包括圖2的活塞單元200的本發明的樹脂成型裝置如上所述,可以進一步具有活塞、料罐和成型模。圖5的剖視圖示出上述樹脂成型裝置的構成的一例。該圖只示出樹脂成型裝置的主要部分。如圖所示,該樹脂成型裝置1000的主要構成要件為活塞單元200、底座部件300、活塞400、由下模500和上模600構成的成型模,以及下模模架(chase holder)510。底座部件300的中心部形成有用於配置活塞單元200的空間,活塞單元200配置於該空間內。活塞400安裝在活塞單元200中的活塞安裝部201的上端。底座部件300上載置下模模架510。下模模架510上載置下模500。進一步,下模500的上方配置有上模600。上模600的模面(與下模500相對側的面)形成有模腔601,可以在模腔601內進行樹脂成型。下模500形成有貫通孔501,貫通孔501成為收納樹脂材料用的料罐。活塞400可以在貫通孔501內部上下移動。藉由使下模500與底座部件300和下模模架510一起上下移動,可以將下模500和上模600開模及合模。如圖所示,藉由合模,使下模500的上表面和上模600的模面接觸,可以進行樹脂成型。更具體而言,藉由在該狀態下,使活塞400上升,可以將貫通孔501(料罐)內的樹脂材料10注入模腔601內,進行樹脂成型。另外,圖中的樹脂材料10是液態樹脂,但是例如既可以是在室溫下為液態的樹脂,也可以是加熱熔融後為液態的樹脂。使用該樹脂成型裝置的樹脂成型品的製造方法和進行樹脂粉末的收集的方法沒有特殊限制,例如可以使用上述圖3之(a)按照說明進行。In addition, the configuration of the resin molding apparatus of the present invention is not particularly limited except that it includes the piston unit of the present invention and a molding die for resin molding, and is arbitrary. For example, the configuration of the resin molding apparatus of the present invention may be the same as that of a conventional resin molding apparatus for transfer molding except that the piston unit is the piston unit of the present invention. For example, the resin molding apparatus of the present invention including the
另外,圖7示出了不具有樹脂粉末收集用部件的活塞單元的構成的一例。圖7之(a)是斜視圖。圖7之(b)是從與圖7之(a)不同方向所視的斜視圖。圖7之(c)是左側視圖。圖7之(d)是正視圖。圖7之(e)是從圖7之(d)的Ⅴ-Ⅴ’方向所視的剖視圖。圖7之(f)是從圖7之(c)的Ⅳ-Ⅳ’方向所視的剖視圖。圖7所示的活塞單元200a除不具有樹脂粉末收集用部件100和抽吸用部件130,以及代替蓋部件220具有蓋部件220a以外,與圖2的活塞單元200相同。蓋部件220a除沒有用於安裝樹脂粉末收集用部件100的螺絲孔外,與圖2的蓋部件220相同。In addition, FIG. 7 has shown an example of the structure of the piston unit which does not have the member for resin powder collection. (a) of Fig. 7 is a perspective view. (b) of Fig. 7 is a perspective view viewed from a direction different from that of (a) of Fig. 7 . (c) of Fig. 7 is a left side view. (d) of Fig. 7 is a front view. (e) of Fig. 7 is a sectional view viewed from the V-V' direction of (d) of Fig. 7 . (f) of Fig. 7 is a cross-sectional view viewed from the direction IV-IV' of (c) of Fig. 7 .
在如圖7那樣使用不具有樹脂粉末收集用部件的活塞單元製造樹脂成型品時,從料罐和活塞之間的間隙掉落的樹脂粉末積存在蓋部件220a的上表面。積存在該蓋部件220a上表面的樹脂粉末需要定期人工清理去除。若清理不充分而積存的樹脂粉末從蓋部件220a上表面掉落,侵入活塞主體內的等壓裝置部分或活塞安裝部201的驅動部分(圖示的孔211內),可能導致活塞的運行不良。因此,如圖1-3的說明,若使用本發明的樹脂粉末收集用部件100,因為能夠減少樹脂粉末10a從蓋部件220a上表面掉落,所以可以減少樹脂粉末10a進入活塞主體內的等壓裝置部分或活塞安裝部201的驅動部分等,也可以減少活塞的運行不良。若使用本發明的樹脂粉末收集用部件,與圖7所示的沒有樹脂粉末收集用部件的情形相比,不需要頻繁清理樹脂粉末。因此,藉由本發明,可以高效收集樹脂粉末,其結果,也可以高效地製造樹脂成型品。另外,藉由本發明,例如如上所述,可以藉由抽吸等自動去除積存的樹脂粉末。由此,可以進一步高效地收集樹脂粉末。When a resin molded product is manufactured using a piston unit without a resin powder collection member as shown in FIG. 7 , resin powder dropped from the gap between the tank and the piston accumulates on the upper surface of the
另外,本發明的樹脂粉末收集用部件如上所述,具有頂棚部。由此,在本發明的樹脂粉末收集用部件的上端,除活塞安裝部插入用貫通孔和樹脂粉末落下用貫通孔以外的部分可以始終關閉。由此,例如在進行抽吸或空氣壓送時,可以減少收納在樹脂粉末收集用部件內的樹脂粉末從上方飛揚到收集部件外。由此,例如可以比專利文獻1更高效地收集樹脂粉末。In addition, the member for resin powder collection of this invention has a ceiling part as mentioned above. Accordingly, the upper end of the resin powder collecting member of the present invention can always be closed except for the through-hole for inserting the piston mounting portion and the through-hole for dropping the resin powder. Thereby, for example, when suction or air pressure feeding is performed, it is possible to reduce the flying of the resin powder contained in the resin powder collecting member from above to the outside of the collecting member. Thereby, resin powder can be collected more efficiently than patent document 1, for example.
另外,本發明的樹脂粉末收集用部件例如如上所述,在投影到樹脂粉末收集用部件安裝在活塞單元的安裝面時,從活塞安裝部插入用貫通孔側端部到樹脂粉末落下用貫通孔的距離可以比從側壁部側端部到樹脂粉末落下用貫通孔的距離大。圖4的剖視圖示出其中一例。圖4是在圖2之(f)或圖3之(a)中,僅示出樹脂粉末收集用部件100和活塞安裝部201的部分的剖視圖。如圖所示,樹脂粉末收集用部件100在投影至樹脂粉末收集用部件100安裝在活塞單元主體210的安裝面140時,從活塞安裝部插入用貫通孔101側端部到樹脂粉末落下用貫通孔102的距離l2比從側壁部120側端部到樹脂粉末落下用貫通孔102的距離l1大。由此,如圖所示,從活塞安裝部插入用貫通孔101側端部到樹脂粉末落下用貫通孔102的傾斜面的傾斜角φ變得平緩。因此,可以使從活塞滑動(上下移動)的滑動間隙沿垂直方向落下的樹脂粉末減少從活塞安裝部201和活塞安裝部插入用貫通孔101之間的間隙落下至樹脂粉末收集用部件100的空間121內。由此,能夠減少在空間121內的位於活塞安裝部201周圍的空間121內部的區域X中積存的樹脂粉末。因此,能夠減少樹脂粉末進入活塞單元主體210和蓋部件220的孔211(活塞安裝部201可在其內部上下移動的孔,參照圖2)。由此,能夠進一步減少樹脂粉末進入活塞主體內的等壓裝置部分或活塞安裝部201的驅動部分等,能夠進一步減少活塞的運行不良。另外,藉由使用圖3之(b)的O形環701和702中的任一個,或兩個一起使用,能夠進一步有效地減少樹脂粉末進入活塞單元主體210和蓋部件220的孔211。另外,在圖4的樹脂粉末收集用部件100中,如圖所示,從側壁部120側端部到樹脂粉末落下用貫通孔102的傾斜面(外側傾斜面)的傾斜角θ與從活塞安裝部插入用貫通孔101側端部到樹脂粉末落下用貫通孔102的傾斜面(內側傾斜面)的傾斜角φ的關係是θ>φ。另外,從頂棚部底面到外側傾斜面頂點的高度t1與從頂棚部底部到內側傾斜面頂點的高度t2的關係是t1>t2。另外,在該圖中,僅展示出了樹脂粉末收集用部件100的左半邊尺寸,但因為左右對稱,右半邊與左半邊尺寸相同。In addition, the member for collecting resin powder of the present invention, for example, as described above, when projected that the member for collecting resin powder is mounted on the mounting surface of the piston unit, from the end on the side of the through hole for inserting the piston mounting part to the through hole for dropping the resin powder The distance may be greater than the distance from the side end of the side wall portion to the through hole for dropping the resin powder. An example thereof is shown in a sectional view of FIG. 4 . FIG. 4 is a cross-sectional view showing only parts of the resin
另外,本發明的樹脂粉末收集用部件的構造、形狀、製造方法等不限於圖1-4所示的示例。例如,圖1-4示出的樹脂粉末收集用部件100可以藉由金屬製塊狀材料的切割加工等製造。但是,本發明的樹脂粉末收集用部件不限於此,例如可以藉由彎折金屬製平板狀材料的板金加工等塑性加工進行製造。圖6的剖視圖示出上述本發明的樹脂粉末收集用部件的構造的一例,同時示意性地示出藉由使用該構造的活塞單元收集樹脂粉末的結構。圖6是示出本發明的樹脂粉末收集用部件100a安裝在圖2的活塞單元200的狀態的圖。圖6除將樹脂粉末收集用部件100更換為樹脂粉末收集用部件100a外與圖3之(a)相同。另外,使用包括圖6的活塞單元的樹脂成型裝置的樹脂成型品的製造方法和收集樹脂粉末的方法沒有特殊限制,例如可以與圖3之(a)相同的方法進行。樹脂粉末收集用部件100a除具有頂棚部110a代替頂棚部110,具有側壁部120a代替側壁部120外,與圖1-4的樹脂粉末收集用部件100相同。頂棚部110a除形狀為平板狀以外,與頂棚部110相同。頂棚部110a的上表面的形狀與樹脂粉末收集用部件100的頂棚部110相同。亦即,頂棚部110a的上表面與頂棚部110同樣地,向活塞安裝部插入用貫通孔101傾斜成凸狀(山狀)的同時,向樹脂粉末落下用貫通孔102傾斜成凹狀(穀狀)。由此,樹脂粉末10a易於向樹脂粉末落下用貫通孔102掉落。另外,在圖6的頂棚部110a中,如圖所示,在樹脂粉末落下用貫通孔102,外側(側壁部120a側)的頂棚部110a的端部進入到內側(活塞安裝部插入用貫通孔101側)端部的下方。藉由上述構成,進入空間121內的樹脂粉末10a難以從樹脂粉末落下用貫通孔102掉出。另外,該樹脂粉末收集用部件100a例如如上所述,可以藉由彎折金屬製平板狀材料的板金加工等塑性加工進行製造。更具體而言,例如可以在一塊金屬製平板狀材料上開孔,形成活塞安裝部插入用貫通孔101、樹脂粉末落下用貫通孔102等,並彎折這一塊金屬製平板狀材料形成頂棚部110a和側壁部120a。另外,本發明的樹脂粉末收集用部件的製造方法不限於金屬製塊狀材料的切割加工,以及彎折金屬製平板狀材料的板金加工等塑性加工,也可以藉由此外的任意製造方法進行製造。In addition, the configuration, shape, manufacturing method, etc. of the resin powder collecting member of the present invention are not limited to the examples shown in FIGS. 1-4 . For example, the resin
上文參照實施例說明了本發明,但是本發明不限於上述實施例。例如在本發明的樹脂粉末收集用部件中,樹脂粉末落下用貫通孔的個數如上所述,沒有特殊限制,是任意的。例如,在圖1-4和6中,為了使樹脂粉末10a易於從樹脂粉末落下用貫通孔102掉落,在活塞安裝部插入用貫通孔101的兩側分別各設置1個狹縫(長孔)狀的樹脂粉末落下用貫通孔102。但是,本發明不限於此,例如可以是在活塞安裝部插入用貫通孔的兩側分別設置複數個樹脂粉末落下用貫通孔。另外,本發明的樹脂粉末收集用部件如上所述,包括頂棚部和側壁部,但是可以沒有底面部。例如,如圖2、圖3、圖6所示,藉由將樹脂粉末收集用部件100或100a固定在蓋部件220的上表面,蓋部件220的上表面作為樹脂粉末收集用部件100或100a的底面發揮作用。但是,本發明不限於此,例如樹脂粉末收集用部件可以具有底面部。The present invention has been described above with reference to the embodiments, but the present invention is not limited to the above-described embodiments. For example, in the member for collecting resin powder of the present invention, the number of through-holes for dropping resin powder is arbitrary as described above and is not particularly limited. For example, in FIGS. 1-4 and 6, in order to make the
進一步,本發明不受上述實施例的限定,只要在不脫離本發明主旨的範圍內,能夠根據需要,任意且恰當地進行組合、變化或選擇使用。Furthermore, the present invention is not limited to the above-mentioned embodiments, and can be arbitrarily and appropriately combined, changed, or selectively used as needed within the scope not departing from the gist of the present invention.
本發明主張以2020年11月24日申請的日本申請特願2020-194737為基礎的優先權,其公開的全部內容納入本文中。The present application claims priority based on Japanese Patent Application No. 2020-194737 filed on November 24, 2020, and the entire disclosure thereof is incorporated herein.
10:樹脂材料
10a:樹脂粉末
100、100a:樹脂粉末收集用部件
101:活塞安裝部插入用貫通孔
102:樹脂粉末落下用貫通孔
103:樹脂粉末收集用部件安裝部
110、110a:頂棚部
111:頂棚部的凸部
112:頂棚部的凹部
120、120a:側壁部
121:頂棚部與側壁部圍成的空間
130:抽吸用部件
131:抽吸孔
140:樹脂粉末收集用部件100安裝在活塞單元主體210的安裝面
200、200a:活塞單元
201:活塞安裝部
202:桿
203:旋鈕
210:活塞單元主體
211:孔
212:彈簧
220、220a:蓋部件
300:底座部件
400:活塞
500:下模
501:貫通孔
510:下模模架
600:上模
601:模腔
701、702:O形環
800:抽吸機構
801:抽吸路徑
1000:樹脂成型裝置
X:在空間121內的位於活塞安裝部201周圍的空間121內部的區域
10:
圖1是示出本發明的樹脂粉末收集用部件的一例的圖。圖1之(a)是平面圖。圖1之(b)是底視圖。圖1之(c)是側視圖。圖1之(d)是從圖1之(a)的Ⅰ-Ⅰ’方向所視的剖視圖。圖1之(e)是從斜上方所視的斜視圖。圖1之(f)是從斜下方所視的斜視圖。FIG. 1 is a diagram showing an example of the member for collecting resin powder of the present invention. (a) of Figure 1 is a plan view. (b) of Fig. 1 is a bottom view. (c) of Fig. 1 is a side view. (d) of Fig. 1 is a sectional view viewed from the I-I' direction of (a) of Fig. 1 . (e) of Fig. 1 is a perspective view seen from obliquely above. (f) of Fig. 1 is a perspective view viewed obliquely from below.
圖2是示出本發明的活塞單元的一例的圖。圖2之(a)是斜視圖。圖2之(b)是從與圖2之(a)不同方向所視的斜視圖。圖2之(c)是左側視圖。圖2之(d)是正視圖。圖2之(e)是右側視圖。圖2之(f)是從圖2之(d)的Ⅲ-Ⅲ’方向所視的剖視圖。圖2之(g)是從圖2之(c)的Ⅱ-Ⅱ’方向所視的剖視圖。Fig. 2 is a diagram showing an example of a piston unit of the present invention. (a) of Fig. 2 is a perspective view. (b) of Fig. 2 is a perspective view viewed from a direction different from that of (a) of Fig. 2 . (c) of Fig. 2 is a left side view. (d) of Fig. 2 is a front view. (e) of Fig. 2 is a right side view. (f) of Fig. 2 is a sectional view viewed from the III-III' direction of (d) of Fig. 2 . (g) of Fig. 2 is a cross-sectional view viewed from the direction II-II' of (c) of Fig. 2 .
圖3之(a)和(b)是示意地示出使用了圖1的樹脂粉末收集用部件和圖2的活塞單元的樹脂粉末收集結構的剖視圖。(a) and (b) of FIG. 3 are cross-sectional views schematically showing a resin powder collecting structure using the resin powder collecting member of FIG. 1 and the piston unit of FIG. 2 .
圖4是示出本發明的樹脂粉末收集用部件的構造的一例的剖視圖。Fig. 4 is a cross-sectional view showing an example of the structure of the resin powder collecting member of the present invention.
圖5是示出本發明的樹脂成型裝置的一例中的一部分構成的剖視圖。Fig. 5 is a cross-sectional view showing a part of an example of the resin molding apparatus of the present invention.
圖6是示意地示出本發明的樹脂粉末收集用部件的構造的另一例和藉由使用該構造的活塞單元收集樹脂粉末的結構的剖視圖。6 is a cross-sectional view schematically showing another example of the structure of the member for collecting resin powder of the present invention and a structure for collecting resin powder by using a piston unit having the structure.
圖7是示出不具有樹脂粉末收集用部件的活塞單元的一例的圖。圖7之(a)是斜視圖。圖7之(b)是從與圖7之(a)不同方向所視的斜視圖。圖7之(c)是左側視圖。圖7之(d)是正視圖。圖7之(e)是從圖7之(d)的Ⅴ-Ⅴ’方向所視的剖視圖。圖7之(f)是從圖7之(c)的Ⅳ-Ⅳ’方向所視的剖視圖。FIG. 7 is a diagram showing an example of a piston unit that does not have a member for collecting resin powder. (a) of Fig. 7 is a perspective view. (b) of Fig. 7 is a perspective view viewed from a direction different from that of (a) of Fig. 7 . (c) of Fig. 7 is a left side view. (d) of Fig. 7 is a front view. (e) of Fig. 7 is a sectional view viewed from the V-V' direction of (d) of Fig. 7 . (f) of Fig. 7 is a cross-sectional view viewed from the direction IV-IV' of (c) of Fig. 7 .
100:樹脂粉末收集用部件 100: Parts for collecting resin powder
101:活塞安裝部插入用貫通孔 101: Through hole for inserting piston mounting part
102:樹脂粉末落下用貫通孔 102: Through hole for dropping resin powder
103:樹脂粉末收集用部件安裝部 103: Resin powder collection part installation part
110:頂棚部 110: ceiling part
111:頂棚部的凸部 111: Convex part of ceiling part
112:頂棚部的凹部 112: Recessed part of ceiling part
120:側壁部 120: side wall part
121:頂棚部與側壁部圍成的空間 121: The space enclosed by the ceiling part and the side wall part
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP2020-194737 | 2020-11-24 | ||
JP2020194737A JP7341115B2 (en) | 2020-11-24 | 2020-11-24 | Resin powder collection member, plunger unit, resin molding device, and method for manufacturing resin molded products |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202233386A TW202233386A (en) | 2022-09-01 |
TWI802094B true TWI802094B (en) | 2023-05-11 |
Family
ID=81754587
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110143338A TWI802094B (en) | 2020-11-24 | 2021-11-22 | Part for collecting resin powder, piston unit, resin molding device, and manufacturing method of resin molded product |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7341115B2 (en) |
KR (1) | KR20230074253A (en) |
CN (1) | CN116113529A (en) |
TW (1) | TWI802094B (en) |
WO (1) | WO2022113853A1 (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06328496A (en) * | 1993-05-26 | 1994-11-29 | Mitsubishi Materials Corp | Transfer mold |
TW201634220A (en) * | 2015-01-27 | 2016-10-01 | Towa Corp | Resin sealing method and resin sealing device |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4836901B1 (en) | 1967-01-12 | 1973-11-07 | ||
JPH1034694A (en) * | 1996-07-19 | 1998-02-10 | Hitachi Ltd | Molding die cleaning device |
JP4836901B2 (en) * | 2007-09-03 | 2011-12-14 | Towa株式会社 | Resin sealing molding method for electronic parts and mold |
JP6701308B1 (en) * | 2018-11-21 | 2020-05-27 | Towa株式会社 | Plunger replacement method, plunger unit, and resin molding device |
-
2020
- 2020-11-24 JP JP2020194737A patent/JP7341115B2/en active Active
-
2021
- 2021-11-17 CN CN202180062257.8A patent/CN116113529A/en active Pending
- 2021-11-17 WO PCT/JP2021/042284 patent/WO2022113853A1/en active Application Filing
- 2021-11-17 KR KR1020237014072A patent/KR20230074253A/en unknown
- 2021-11-22 TW TW110143338A patent/TWI802094B/en active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06328496A (en) * | 1993-05-26 | 1994-11-29 | Mitsubishi Materials Corp | Transfer mold |
TW201634220A (en) * | 2015-01-27 | 2016-10-01 | Towa Corp | Resin sealing method and resin sealing device |
Also Published As
Publication number | Publication date |
---|---|
CN116113529A (en) | 2023-05-12 |
WO2022113853A1 (en) | 2022-06-02 |
JP7341115B2 (en) | 2023-09-08 |
JP2022083345A (en) | 2022-06-03 |
TW202233386A (en) | 2022-09-01 |
KR20230074253A (en) | 2023-05-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100897654B1 (en) | Molding apparatus for resin encapsulation of electronic part | |
KR101659690B1 (en) | Resin sealing apparatus and resin sealing method | |
KR101710235B1 (en) | Apparatus and method for manufacturing electronic component | |
TWI720488B (en) | Resin molding device and method of producing resin molded product | |
KR101705978B1 (en) | Resin molding apparatus and resin molding method | |
TWI802094B (en) | Part for collecting resin powder, piston unit, resin molding device, and manufacturing method of resin molded product | |
CN107756707B (en) | Resin molding apparatus and method for manufacturing resin molded product | |
TWI783806B (en) | Resin molding device and method for manufacturing resin molded product | |
JP2022155897A (en) | Resin-sealing device | |
JPH05138681A (en) | Vibrating part feeder and resin molding apparatus | |
JP6876637B2 (en) | Molding mold, resin molding equipment and manufacturing method of resin molded products | |
JP6416331B2 (en) | Electronic component manufacturing apparatus and manufacturing method | |
JP4162474B2 (en) | Supply method to resin molding die, extraction method from resin molding die, supply mechanism, and extraction mechanism | |
CN112750723A (en) | Cleaning module, cutting device, and method for manufacturing cut product | |
JP4347932B2 (en) | Resin sealing device | |
WO2023228462A1 (en) | Resin molding device, and method for manufacturing resin molded article | |
KR100377407B1 (en) | circuit tape arrange device | |
WO2009025402A1 (en) | Tray for epoxy molding compound powder and apparatus for providing epoxy molding compound powder having the tray | |
JP2024044401A (en) | Resin supplying device, resin molding device, and method for manufacturing resin molded product | |
KR20230015449A (en) | Manufacturing method of cleaning mechanism, resin molded device and resin molded product | |
JPH11284002A (en) | Resin sealing device for semiconductor element |