WO2022113853A1 - Resin powder collecting member, plunger unit, resin molding device, and method for manufacturing resin molded article - Google Patents

Resin powder collecting member, plunger unit, resin molding device, and method for manufacturing resin molded article Download PDF

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Publication number
WO2022113853A1
WO2022113853A1 PCT/JP2021/042284 JP2021042284W WO2022113853A1 WO 2022113853 A1 WO2022113853 A1 WO 2022113853A1 JP 2021042284 W JP2021042284 W JP 2021042284W WO 2022113853 A1 WO2022113853 A1 WO 2022113853A1
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WO
WIPO (PCT)
Prior art keywords
resin powder
resin
plunger
hole
collecting member
Prior art date
Application number
PCT/JP2021/042284
Other languages
French (fr)
Japanese (ja)
Inventor
秀男 市橋
和己 中山
Original Assignee
Ｔｏｗａ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｔｏｗａ株式会社 filed Critical Ｔｏｗａ株式会社
Priority to KR1020237014072A priority Critical patent/KR20230074253A/en
Priority to CN202180062257.8A priority patent/CN116113529A/en
Publication of WO2022113853A1 publication Critical patent/WO2022113853A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1753—Cleaning or purging, e.g. of the injection unit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings

Definitions

  • the present invention relates to a member for collecting resin powder, a plunger unit, a resin molding apparatus, and a method for manufacturing a resin molded product.
  • Transfer molding (also called transfer molding method) is a widely used method in the manufacture of resin molded products.
  • a mechanism for collecting (collecting) resin residue may be used for the purpose of reducing contamination of the device by resin residue.
  • a container (20) for accommodating resin residue is provided via a spring (26) in an intermediate portion between the tip and the base of the plunger (5).
  • the resin residue of the container (20) is suction-removed by the removing means (33).
  • the removing means (33) includes an air pressure feeding mechanism (34) and a suction / discharging mechanism (35).
  • the resin residue is the residual residue (residue) generated by invading the sliding portion between the inner surface of the pot and the plunger without being transferred to the outside of the pot when the resin material in the pot is extruded into the cavity by the plunger. ).
  • the resin residue becomes resin powder that falls from the gap between the transfer molding mold pot and the plunger.
  • the present invention relates to a resin powder collecting member, a plunger unit, a resin molding device, and a resin molded product that can efficiently reduce contamination of the device by resin powder falling from a gap between a transfer molding mold pot and a plunger. It is an object of the present invention to provide the manufacturing method of.
  • the resin powder collecting member of the present invention is used.
  • the resin powder collecting member includes a roof portion and a side wall portion, and can be arranged on the upper part of the plunger unit to which the plunger is attached.
  • the resin powder can be collected in the space surrounded by the roof portion and the side wall portion.
  • the roof portion is formed with a through hole for inserting the plunger mounting portion for inserting the plunger mounting portion of the plunger unit and a through hole for dropping the resin powder for the resin powder to fall into the space.
  • the upper surface of the roof portion is characterized in that it is concavely inclined from the side opposite to the through hole for inserting the plunger mounting portion and the through hole for inserting the plunger mounting portion toward the through hole for dropping the resin powder.
  • the plunger unit of the present invention is a plunger unit for transfer molding, which comprises the resin powder collecting member of the present invention.
  • the resin molding apparatus of the present invention is characterized by including the plunger unit of the present invention and a molding mold for resin molding.
  • the method for producing a resin molded product of the present invention is characterized by including a resin molding step of molding a resin material using the resin molding apparatus of the present invention.
  • a resin powder collecting member, a plunger unit, a resin molding device, and a resin molded product capable of efficiently reducing contamination of the device by resin powder falling from a gap between a transfer molding mold pot and a plunger. Manufacturing method can be provided.
  • FIG. 1 is a diagram showing an example of the resin powder collecting member of the present invention.
  • FIG. 1A is a plan view.
  • FIG. 1B is a bottom view.
  • FIG. 1 (c) is a side view.
  • 1 (d) is a cross-sectional view taken along the line I-I'of FIG. 1 (a).
  • FIG. 1 (e) is a perspective view seen from diagonally upward.
  • FIG. 1 (f) is a perspective view seen from diagonally downward.
  • FIG. 2 is a diagram showing an example of the plunger unit of the present invention.
  • FIG. 2A is a perspective view.
  • FIG. 2B is a perspective view seen from a direction different from that of FIG. 2A.
  • FIG. 2 (c) is a left side view.
  • FIG. 2D is a front view.
  • FIG. 1A is a plan view.
  • FIG. 1B is a bottom view.
  • FIG. 1 (c) is a side view.
  • FIG. 2 (e) is a right side view.
  • FIG. 2 (f) is a cross-sectional view of FIG. 2 (d) as viewed in the direction of III-III'.
  • FIG. 2 (g) is a cross-sectional view taken in the direction of II-II'of FIG. 2 (c).
  • 3A and 3B are cross-sectional views schematically showing a mechanism of resin powder collection using the resin powder collecting member of FIG. 1 and the plunger unit of FIG.
  • FIG. 4 is a cross-sectional view showing an example of the structure of the resin powder collecting member of the present invention.
  • FIG. 5 is a cross-sectional view showing a partial configuration in an example of the resin molding apparatus of the present invention.
  • FIG. 6 is a cross-sectional view schematically showing another example of the structure of the resin powder collecting member of the present invention and the mechanism of resin powder collecting by the plunger unit using the same.
  • FIG. 7 is a diagram showing an example of a plunger unit having no resin powder collecting member.
  • FIG. 7A is a perspective view.
  • FIG. 7 (b) is a perspective view seen from a direction different from that of FIG. 7 (a).
  • FIG. 7 (c) is a left side view.
  • FIG. 7D is a front view.
  • 7 (e) is a cross-sectional view taken along the line V-V'of FIG. 7 (d).
  • FIG. 7 (g) is a cross-sectional view taken in the direction of IV-IV'of FIG. 7 (c).
  • the shape of the through hole for dropping the resin powder may be a slit shape.
  • the resin powder collecting member of the present invention is, for example, for dropping the resin powder from the end of the through hole for inserting the plunger mounting portion when the resin powder collecting member is projected onto the mounting surface to be mounted on the plunger unit.
  • the distance to the through hole may be larger than the distance from the side end portion of the side wall portion to the through hole for dropping the resin powder.
  • the resin powder collecting member of the present invention may be provided with, for example, a sealing material for preventing the resin powder from falling around the through hole for inserting the plunger mounting portion.
  • the plunger unit of the present invention further has, for example, a plunger mounting portion and a hole through which the plunger mounting portion can move up and down inside, and a sealing material for preventing resin powder from falling is provided around the hole. May be.
  • the resin molding apparatus of the present invention may further include, for example, a suction mechanism for sucking in the space surrounded by the roof portion and the side wall portion.
  • the method for producing a resin molded product of the present invention further includes, for example, a resin powder disposal step of disposing of the resin powder collected in the space surrounded by the roof portion and the side wall portion to the outside of the resin molding apparatus. You may.
  • the resin molding apparatus of the present invention is a resin molding apparatus including the suction mechanism, and the resin powder disposal step is performed by stopping suction by the suction mechanism. You may.
  • transfer molding is used as described above.
  • the "molding mold” is, for example, a mold, but is not limited to this, and may be, for example, a ceramic mold or the like.
  • the resin molded product is not particularly limited, and may be, for example, a resin molded product obtained by simply molding a resin, or a resin molded product in which a component such as a chip is sealed with a resin.
  • the resin molded product may be, for example, an electronic component or the like.
  • the electronic component is not particularly limited and is arbitrary, and may be any electronic component in which any component such as a chip or a wire is resin-sealed.
  • the chip is not particularly limited, and examples thereof include chips such as ICs, LED chips, semiconductor chips, and semiconductor elements for power control.
  • the resin material before molding and the resin after molding are not particularly limited, and may be, for example, a thermosetting resin such as an epoxy resin or a silicone resin, or a thermoplastic resin. .. Further, it may be a thermosetting resin or a composite material containing a thermoplastic resin as a part.
  • examples of the form of the resin material before molding include granular resin, liquid resin, sheet-like resin, tablet-like resin, powder-like resin and the like.
  • the liquid resin may be liquid at room temperature, or includes a molten resin that is melted by heating to become liquid.
  • the object to be molded by resin molding is not particularly limited, but may be, for example, a substrate.
  • a resin molded product may be manufactured by resin-sealing (resin molding) a component (for example, a chip, a flip chip, etc.) mounted on a substrate (molding object).
  • FIG. 1 shows an example of the resin powder collecting member of the present invention.
  • FIG. 1A is a plan view.
  • FIG. 1B is a bottom view.
  • FIG. 1 (c) is a side view.
  • 1 (d) is a cross-sectional view taken along the line I-I'of FIG. 1 (a).
  • FIG. 1 (e) is a perspective view seen from diagonally upward.
  • FIG. 1 (f) is a perspective view seen from diagonally downward.
  • the resin powder collecting member 100 includes a roof portion 110 and a side wall portion 120.
  • the roof portion 110 and the side wall portion 120 are integrally formed.
  • the resin powder collecting member 100 can be arranged on the upper part of the plunger unit.
  • resin powder falling from the gap between the transfer molding mold pot and the plunger can be collected in the space 121 surrounded by the roof portion 110 and the side wall portion 120.
  • the roof portion 110 is formed with a through hole 101 for inserting the plunger mounting portion for inserting the plunger mounting portion of the plunger unit, which will be described later, and a through hole 102 for dropping the resin powder for the resin powder to fall into the space 121. Has been done.
  • the resin powder collecting member 100 has a rectangular shape when viewed from above or below, and nine plunger mounting portion insertion through holes 101 are provided in the roof portion 110. Are arranged in series along the longitudinal center of the.
  • the number of through holes 101 for inserting the plunger mounting portion is nine in FIG. 1, but the number is not limited to this and is arbitrary.
  • the number of through holes 102 for dropping resin powder is two in FIG. 1, but the number is not limited to this and is arbitrary.
  • the shape of the through hole 102 for dropping the resin powder is a slit shape in FIG. 1, but the shape is not limited to this and is arbitrary.
  • the upper surface of the roof portion 110 is inclined in a convex shape (mountain shape) from the resin powder drop through hole 102 toward the plunger mounting portion insertion through hole 101, and the plunger mounting portion insertion through hole 101 and the plunger mounting portion are inserted. It is inclined in a concave shape (valley shape) from the opposite side of the through hole 101 toward the through hole 102 for dropping the resin powder.
  • a convex portion 111 is formed along the center in the longitudinal direction, and two concave portions 112 are formed so as to sandwich the convex portion 111.
  • the plunger mounting portion insertion through hole 101 is arranged along the convex portion 111, and the resin powder drop through hole 102 is arranged in the concave portion 112.
  • the resin powder collecting member mounting portion 103 has a through hole penetrating from the upper surface to the lower surface of the roof portion 110, and by passing a screw or the like through the through hole, the resin powder collecting member 100 is a plunger, as will be described later. It can be attached to the unit body.
  • the resin powder collecting member mounting portion 103 is optional in the resin powder collecting member of the present invention, may or may not be present, and its form, number, arrangement position, and the like are also arbitrary. However, from the viewpoint of facilitating fixing the resin powder collecting member of the present invention to the plunger unit main body, it is preferable to have a resin powder collecting member mounting portion.
  • FIG. 2 shows an example of the plunger unit of the present invention.
  • FIG. 2A is a perspective view.
  • FIG. 2B is a perspective view seen from a direction different from that of FIG. 2A.
  • FIG. 2 (c) is a left side view.
  • FIG. 2D is a front view.
  • FIG. 2 (e) is a right side view.
  • FIG. 2 (f) is a cross-sectional view of FIG. 2 (d) as viewed in the direction of III-III'.
  • FIG. 2 (g) is a cross-sectional view taken in the direction of II-II'of FIG. 2 (c).
  • FIGS. 2 (f) and 2 (g) are cross-sectional views, the hatch is omitted as appropriate for the sake of simplification. The same applies to each sectional view shown in FIG. 3 and below.
  • the plunger unit 200 has the plunger unit main body 210 as a main component.
  • a rubber cover member 220 is fixed to the upper surface of the plunger unit main body 210.
  • the periphery of the plunger mounting portion 201 in the plunger unit main body 210 is covered with a cover member 220, whereby the intrusion of resin powder into the driving portion (inside the hole 211 shown in the figure) of the plunger mounting portion 201 is suppressed.
  • the plunger unit 200 has the resin powder collecting member 100 of the present invention described with reference to FIG. The resin powder collecting member 100 is arranged on the upper portion of the plunger unit 200.
  • the resin powder collecting member 100 is fixed to the upper surface of the cover member 220 by screwing by the plunger unit mounting portion 103 described with reference to FIG. 1.
  • a suction member 130 is attached to one end of the resin powder collecting member 100.
  • the suction member 130 has a hollow inside, and the cavity communicates with the space 121 surrounded by the roof portion 110 and the side wall portion 120 of the resin powder collecting member 100.
  • the suction member 130 has a suction hole 131, and can be sucked into the space 121 of the resin powder collecting member 100 through the suction hole 131 by a suction mechanism described later.
  • the plunger unit main body 210 has nine substantially cylindrical plunger mounting portions 201.
  • the plunger unit main body 210 has a hole 211 in the upper portion thereof, and the hole 211 penetrates to the upper surface of the cover member 220.
  • the plunger mounting portion 201 can move up and down inside the hole 211, and the upper portion of the plunger mounting portion 201 projects from the upper surface of the cover member 220.
  • a spring (elastic member) 212 is arranged inside the hole 211.
  • the plunger mounting portion 201 is placed on the spring 212, and the spring 212 can be expanded and contracted with the vertical movement of the plunger mounting portion 201.
  • a rod-shaped lever 202 is attached to the left end of the plunger unit main body 210, and a spherical knob 203 is attached to the tip of the lever 202.
  • FIG. 3A schematically shows the mechanism of resin powder collection in the resin molding apparatus of the present invention including the plunger unit 200 of FIG.
  • the cross-sectional view of FIG. 3A is an enlarged view of the upper part in the same cross-sectional view as that of FIG. 2F. That is, this figure is a cross-sectional view showing a state of cutting in a direction perpendicular to the direction in which the plunger mounting portions 201 are arranged and at a position of the diameter of the through hole 101 for inserting the plunger mounting portion.
  • the space 121 in the resin powder collecting member 100 is connected to the suction mechanism 800 via the suction path 801 and can be sucked into the space 121 to reduce the pressure by the suction mechanism 800.
  • the suction path 801 communicates with the inside of the space 121 via the suction member 130 and the suction hole 131 (not shown in FIG. 3A) described with reference to FIG.
  • the suction mechanism 800 is not particularly limited, and may be, for example, a suction pump, a vacuum pump, or the like.
  • the resin molding apparatus further includes a plunger, a pot, and a molding die (not shown in FIG. 3A).
  • the plunger is attached to the upper end of the plunger mounting portion 201. By moving the plunger mounting portion 201 up and down, the plunger can move up and down inside the pot. A resin material can be stored in the pot. By raising the plunger, the resin material inside the pot can be supplied into the molding die for resin molding.
  • the configurations of the plunger, the pot and the molding die are not particularly limited, and may be the same as those of a general resin molding apparatus for transfer molding, for example.
  • FIG. 3A will be described with reference to a method for manufacturing the resin molded product of the present invention using the resin molding apparatus of the present invention and an example of collecting resin powder.
  • a resin molding step of molding a resin material using a resin molding apparatus is performed.
  • This resin molding step is not particularly limited, and can be performed by, for example, the same method as general transfer molding.
  • the resin material inside the pot can be supplied into the molding die, whereby the resin molding step can be performed and the resin molded product can be manufactured.
  • the resin powder 10a falls from the gap between the plunger and the pot onto the roof portion 110 of the resin powder collecting member 100 as shown in the figure.
  • the upper surface of the roof portion 110 is inclined in a convex shape (mountain shape) toward the plunger mounting portion insertion through hole 101 and in a concave shape (valley shape) toward the resin powder drop through hole 102. is doing. That is, the upper surface of the roof portion 110 has the lowest portion of the through hole 102 for dropping the resin powder. Therefore, as shown in the figure, the resin powder 10a falls toward the resin powder falling through hole 102. Further, the resin powder 10a falls from the resin powder falling through hole 102 into the space 121 of the resin powder collecting member 100.
  • the suction mechanism 800 is optional and may or may not be present. Further, suction by the suction mechanism 800 is also optional and may or may not be performed. However, as described above, it is preferable to perform suction by the suction mechanism 800 because the resin powder 10a can be more easily collected. Further, the timing of suction by the suction mechanism 800 is not particularly limited. For example, prior to performing the resin molding step, it is preferable to suck the space 121 in advance by the suction mechanism 800 to reduce the pressure.
  • the depressurization in the space 121 due to this suction is continued until the resin molding step is completed.
  • the resin powder 10a in the space 121 is collected by suction by the suction mechanism 800.
  • a resin powder disposal step of discarding the resin powder 10a collected by the suction mechanism 800 from the space 121 of the resin powder collecting member 100 to the outside of the resin molding apparatus. May be done.
  • This resin powder disposal step may be performed by stopping the suction by the suction mechanism 800.
  • This resin powder disposal step may be performed automatically, for example, and the method is not particularly limited.
  • the resin powder 10a collected from the space 121 by the suction mechanism 800 is separated from the suction mechanism 800.
  • the suction by the suction mechanism 800 is performed by stopping the suction by another suction mechanism for removing the resin powder 10a.
  • FIG. 3 (b) shows a modified example of FIG. 3 (a).
  • the plunger unit 200 of FIG. 3B is the same as the plunger unit 200 of FIG. 3A except that it has the sealing materials (O-rings) 701 and 702 for preventing the resin powder from falling.
  • the O-ring 701 is provided around a hole 211 (a hole in which the plunger mounting portion 201 can move up and down inside) of the plunger unit main body 210 and the cover member 220.
  • the O-ring 701 can further reduce the resin powder 10a from falling into the holes 211.
  • the O-ring 702 constitutes a part of the resin powder collecting member 100.
  • the resin powder collecting member 100 of FIGS. 1, 2 and 3 (a) is the same as the resin powder collecting member 100 of FIGS. 1, 2 and 3 (a) except that it has an O-ring 702.
  • the O-ring 702 is provided around the through hole 101 for inserting the plunger mounting portion.
  • the O-ring 702 can further reduce the resin powder 10a from falling into the plunger mounting portion insertion through hole 101.
  • the method for manufacturing the resin molded product using the resin molding apparatus including the plunger unit of FIG. 3 (b) and the method for collecting the resin powder are not particularly limited, and for example, the same method as in FIG. 3 (a) is used. be able to.
  • the configuration of the resin molding apparatus of the present invention is not particularly limited and is arbitrary except that the plunger unit of the present invention and the molding mold for resin molding are included.
  • the configuration of the resin molding apparatus of the present invention may be the same as that of a general resin molding apparatus for transfer molding, except that the plunger unit is the plunger unit of the present invention.
  • the resin molding apparatus of the present invention including the plunger unit 200 of FIG. 2 may further have a plunger, a pot and a molding die as described above.
  • the cross-sectional view of FIG. 5 shows an example of the configuration of such a resin molding apparatus. In the figure, only the main part of the resin molding apparatus is shown.
  • the resin molding apparatus 1000 mainly includes a plunger unit 200, a base member 300, a plunger 400, a molding die composed of a lower die 500 and an upper die 600, and a lower die chase folder 510. And.
  • a space for arranging the plunger unit 200 is formed in the central portion of the base member 300, and the plunger unit 200 is arranged in the space.
  • the plunger 400 is attached to the upper end of the plunger mounting portion 201 in the plunger unit 200.
  • a lower chase folder 510 is placed on the base member 300.
  • the lower mold 500 is placed on the lower mold chase folder 510.
  • the upper die 600 is arranged above the lower die 500.
  • a mold cavity 601 is formed on the mold surface of the upper mold 600 (the surface facing the lower mold 500), and resin molding is possible in the mold cavity 601.
  • a through hole 501 is formed in the lower mold 500, and the through hole 501 is a pot for accommodating a resin material.
  • the plunger 400 can move up and down inside the through hole 501.
  • the lower mold 500 and the upper mold 600 can be molded and opened.
  • resin molding can be performed by compacting the mold and bringing the upper surface of the lower mold 500 into contact with the mold surface of the upper mold 600.
  • the resin material 10 in the through hole 501 (pot) can be injected into the mold cavity 601 and resin molded.
  • the resin material 10 in the figure is a liquid resin, for example, it may be a resin that is liquid at room temperature, or it may be a resin that has been heated and melted to make it liquid.
  • the method for producing the resin molded product and the method for collecting the resin powder using this resin molding apparatus are not particularly limited, and can be performed, for example, as described with reference to FIG. 3A described above.
  • FIG. 7 shows an example of the configuration of the plunger unit having no resin powder collecting member.
  • FIG. 7A is a perspective view.
  • FIG. 7 (b) is a perspective view seen from a direction different from that of FIG. 7 (a).
  • FIG. 7 (c) is a left side view.
  • FIG. 7D is a front view.
  • 7 (e) is a cross-sectional view taken along the line V-V'of FIG. 7 (d).
  • FIG. 7 (g) is a cross-sectional view taken in the direction of IV-IV'of FIG. 7 (c).
  • the plunger unit 200a shown in FIG. 7 is the same as the plunger unit 200 of FIG.
  • the cover member 220a is the same as the cover member 220 of FIG. 2 except that it does not have a screw hole for attaching the resin powder collecting member 100.
  • the collecting member 100 of the present invention it is possible to reduce the resin powder 10a from falling from the upper surface of the cover member 200, so that the resin powder 10a is an isobaric device in the plunger body. It is possible to reduce entry into the portion or the drive portion of the plunger mounting portion 201, and it is also possible to reduce malfunction of the plunger.
  • the resin powder collecting member of the present invention it is not necessary to frequently clean the resin powder as compared with the case where the resin powder collecting member is not provided as shown in FIG. Therefore, according to the present invention, the resin powder can be efficiently collected, and as a result, the resin molded product can be efficiently manufactured. Further, according to the present invention, for example, as described above, the accumulated resin powder can be automatically removed by suction or the like. According to this, the resin powder can be collected more efficiently.
  • the resin powder collecting member of the present invention has a roof portion as described above.
  • the portion other than the through hole for inserting the plunger mounting portion and the through hole for dropping the resin powder can always be closed.
  • suction or air pressure feeding it is possible to reduce the amount of the resin powder contained in the resin powder collecting member soaring out of the collecting member from above.
  • the resin powder collecting member of the present invention is, for example, as described above, when the resin powder collecting member is projected onto the mounting surface to be mounted on the plunger unit, the resin powder is projected from the end of the through hole for inserting the plunger mounting portion.
  • the distance to the drop through hole may be larger than the distance from the side end of the side wall portion to the resin powder drop through hole.
  • FIG. 4 is a cross-sectional view showing only a portion of the resin powder collecting member 100 and the plunger mounting portion 201 in FIG. 2 (f) or FIG. 3 (a).
  • the resin powder collecting member 100 when the resin powder collecting member 100 is projected onto the mounting surface 140 mounted on the plunger unit main body 210, the resin powder collecting member 100 drops the resin powder from the end portion on the side of the through hole 101 for inserting the plunger mounting portion.
  • the distance l2 to the through hole 102 is larger than the distance l1 from the side end of the side wall portion 120 to the through hole 102 for dropping the resin powder.
  • the inclination angle ⁇ of the inclined surface from the end portion on the side of the through hole 101 for inserting the plunger mounting portion to the through hole 102 for dropping the resin powder is gentle.
  • the resin powder that falls in the vertical direction from the sliding gap in which the plunger slides enters the space of the resin powder collecting member 100 from the gap between the plunger mounting portion 201 and the plunger mounting portion insertion through hole 101. It is possible to reduce falling into 121. As a result, the amount of resin powder accumulated in the region X inside the space 121 around the plunger mounting portion 201 in the space 121 can be reduced. Therefore, it is possible to reduce the resin powder from entering the holes 211 of the plunger unit main body 210 and the cover member 220 (the holes in which the plunger mounting portion 201 can move up and down, see FIG. 2).
  • the resin powder can be further prevented from entering the holes 211 of the plunger unit main body 210 and the cover member 220. It can be effectively reduced.
  • the resin powder collecting member 100 of FIG. 4 as shown in the drawing, the inclination angle ⁇ of the inclined surface (outer inclined surface) from the side end portion of the side wall portion 120 to the resin powder falling through hole 102 and the plunger mounting portion are inserted.
  • the relationship with the inclination angle ⁇ of the inclined surface (inner inclined surface) from the end portion on the side of the through hole 101 to the through hole 102 for dropping the resin powder is ⁇ > ⁇ .
  • the relationship between the height t1 from the bottom surface of the roof to the apex of the outer inclined surface and the height t2 from the bottom of the roof to the apex of the inner inclined surface is t1> t2.
  • the left half of the resin powder collecting member 100 is shown, but since it is symmetrical, the right half is also the same size as the left half.
  • the structure, shape, manufacturing method, etc. of the resin powder collecting member of the present invention are not limited to the examples shown in FIGS. 1 to 4.
  • the resin powder collecting member 100 shown in FIGS. 1 to 4 can be manufactured by cutting a metal block-shaped material or the like.
  • the resin powder collecting member of the present invention is not limited to this, and may be manufactured by plastic working such as sheet metal processing for bending a metal flat plate material, for example.
  • the cross-sectional view of FIG. 6 shows an example of the structure of such a resin powder collecting member of the present invention, and schematically shows a mechanism of resin powder collecting by a plunger unit using the same.
  • FIG. 6 is a diagram showing a state in which the resin powder collecting member 100a of the present invention is attached to the plunger unit 200 of FIG.
  • FIG. 6 is the same as FIG. 3A except that the resin powder collecting member 100 is changed to the resin powder collecting member 100a.
  • the method for manufacturing the resin molded product using the resin molding apparatus including the plunger unit of FIG. 6 and the method for collecting the resin powder are not particularly limited, and for example, the same method as in FIG. 3A is used. Can be done.
  • the resin powder collecting member 100a is the same as the resin powder collecting member 100 of FIGS. 1 to 4 except that it has a roof portion 110a instead of the roof portion 110 and a side wall portion 120a instead of the side wall portion 120. be.
  • the roof portion 110a is the same as the roof portion 110 except that the shape is a flat plate.
  • the shape of the upper surface of the roof portion 110a is the same as that of the roof portion 110 of the resin powder collecting member 100. That is, the upper surface of the roof portion 110a is inclined in a convex shape (mountain shape) toward the plunger mounting portion insertion through hole 101 and concave toward the resin powder drop through hole 102 (as in the roof portion 110). It is inclined in a valley shape). This makes it easier for the resin powder 10a to fall toward the resin powder falling through hole 102. Further, in the roof portion 110a of FIG.
  • the end portion of the roof portion 110a on the outer side is on the inner side (plunger mounting portion insertion through hole 101 side).
  • the resin powder 10a that has entered the space 121 is less likely to come out of the resin powder falling through hole 102.
  • the resin powder collecting member 100a can be manufactured, for example, by plastic working such as sheet metal processing for bending a metal flat plate-like material, as described above.
  • a hole is formed in one metal flat plate to form a through hole 101 for inserting a plunger mounting portion, a through hole 102 for dropping resin powder, and the like, and the one metal flat plate is formed.
  • the shaped material can be bent to form the roof portion 110a and the side wall portion 120a.
  • the method for manufacturing the resin powder collecting member of the present invention is not limited to plastic processing such as cutting of a metal block-shaped material and sheet metal processing for bending a metal flat plate-shaped material, and any other manufacturing method. May be manufactured by
  • the present invention has been described above with reference to the examples, the present invention is not limited to the above-mentioned examples.
  • the number of through holes for dropping the resin powder is not particularly limited and is arbitrary as described above.
  • slit (long hole) -shaped resin powder is provided on both sides of the through hole 101 for inserting the plunger mounting portion so that the resin powder 10a can easily fall from the through hole 102 for dropping the resin powder.
  • One drop through hole 102 is provided.
  • the present invention is not limited to this, and for example, a plurality of through holes for dropping resin powder may be provided on both sides of the through holes for inserting the plunger mounting portion.
  • the resin powder collecting member of the present invention includes the roof portion and the side wall portion as described above, but the bottom surface portion may be omitted.
  • the upper surface of the cover member 220 can be used as the bottom surface of the resin powder collecting member 100 or 100a. This is to fulfill the function of.
  • the present invention is not limited to this, and for example, the resin powder collecting member may have a bottom surface portion.
  • the present invention is not limited to the above-described embodiment, and can be arbitrarily and appropriately combined, modified, or selected and adopted as necessary without departing from the spirit of the present invention. It is a thing.

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Abstract

Provided is a resin powder collecting member which can efficiently reduce the contamination of a device due to resin powder falling from a gap between a plunger and a pot of a molding mold for transfer molding.　A resin powder collecting member 100 is used to collect resin powder falling from a gap between a plunger and a pot for transfer molding. The resin powder collecting member 100 is characterized in that: the member includes a roof section 110 and a side wall section 120; it is possible to dispose said member on top of a plunger unit to which the plunger is attached; said member can collect resin powder inside a space 121 surrounded by the roof section 110 and the side wall section 120; the roof section 110 has formed therein plunger attachment part insertion through-holes 101 into which the plunger attachment part of the plunger unit is inserted and resin powder falling through-holes 102 through which the resin powder falls into the space 121; and the roof section upper surface 110 is inclined in a U-shape towards the resin powder falling through-holes 102 from the plunger attachment part insertion through-holes 101 and from the side opposite to the plunger attachment part insertion through-holes 101.

Description

樹脂粉収集用部材、プランジャユニット、樹脂成形装置及び樹脂成形品の製造方法Manufacturing method of resin powder collecting member, plunger unit, resin molding device and resin molded product
　本発明は、樹脂粉収集用部材、プランジャユニット、樹脂成形装置及び樹脂成形品の製造方法に関する。 The present invention relates to a member for collecting resin powder, a plunger unit, a resin molding apparatus, and a method for manufacturing a resin molded product.
　樹脂成形品の製造において、トランスファ成形（トランスファーモールド法などともいう）は、広く用いられている方法である。 Transfer molding (also called transfer molding method) is a widely used method in the manufacture of resin molded products.
　トランスファ成形では、樹脂カスによる装置の汚染を低減する目的で、樹脂カスを集める（収集する）ための仕組みが用いられることがある。例えば、特許文献１では、その図１～４に記載のとおり、プランジャ（５）の先端と基端との中間部に、樹脂カスを収容する収容器（２０）を、スプリング（２６）を介して設け、収容器（２０）の樹脂カスは除去手段（３３）で吸引除去する。除去手段（３３）は、空気圧送機構（３４）と吸引排出機構（３５）とから構成されている。ここで、樹脂カスとは、ポット内の樹脂材料をプランジャによってキャビティに押し出した際に、ポット外に移送されずに、ポットの内面とプランジャとの摺動部に侵入して生じる残りカス（残滓）のことである。樹脂カスは、トランスファ成形用成形型のポットとプランジャとの隙間から落下する樹脂粉となる。 In transfer molding, a mechanism for collecting (collecting) resin residue may be used for the purpose of reducing contamination of the device by resin residue. For example, in Patent Document 1, as shown in FIGS. 1 to 4, a container (20) for accommodating resin residue is provided via a spring (26) in an intermediate portion between the tip and the base of the plunger (5). The resin residue of the container (20) is suction-removed by the removing means (33). The removing means (33) includes an air pressure feeding mechanism (34) and a suction / discharging mechanism (35). Here, the resin residue is the residual residue (residue) generated by invading the sliding portion between the inner surface of the pot and the plunger without being transferred to the outside of the pot when the resin material in the pot is extruded into the cavity by the plunger. ). The resin residue becomes resin powder that falls from the gap between the transfer molding mold pot and the plunger.
特許第４８３６９０１号公報Japanese Patent No. 4836901
　しかしながら、樹脂カスのような樹脂粉による装置の汚染を、さらに効率的に低減するために、別の構成による樹脂粉の収集も検討する必要がある。 However, in order to more efficiently reduce equipment contamination by resin powder such as resin residue, it is necessary to consider collecting resin powder with a different configuration.
　そこで、本発明は、トランスファ成形用成形型のポットとプランジャとの隙間から落下する樹脂粉による装置の汚染を効率的に低減可能な樹脂粉収集用部材、プランジャユニット、樹脂成形装置及び樹脂成形品の製造方法を提供することを目的とする。 Therefore, the present invention relates to a resin powder collecting member, a plunger unit, a resin molding device, and a resin molded product that can efficiently reduce contamination of the device by resin powder falling from a gap between a transfer molding mold pot and a plunger. It is an object of the present invention to provide the manufacturing method of.
　この目的を達成するために、本発明の樹脂粉収集用部材は、
　トランスファ成形用成形型のポットとプランジャとの隙間から落下する樹脂粉を収集するのに用いる樹脂粉収集用部材であって、
　前記樹脂粉収集用部材は、屋根部と側壁部とを含み、前記プランジャが取り付けられるプランジャユニットの上部に配置することが可能であり、
　前記屋根部と前記側壁部とで囲まれた空間内に前記樹脂粉を収集可能であり、
　前記屋根部には、前記プランジャユニットのプランジャ取付部が挿入されるためのプランジャ取付部挿入用貫通孔と、前記樹脂粉が前記空間内に落ちるための樹脂粉落下用貫通孔とが形成され、
　前記屋根部上面は、前記プランジャ取付部挿入用貫通孔及び前記プランジャ取付部挿入用貫通孔とは反対側から前記樹脂粉落下用貫通孔に向かって凹状に傾斜していることを特徴とする。 In order to achieve this object, the resin powder collecting member of the present invention is used.
A resin powder collecting member used to collect resin powder falling from the gap between the transfer molding mold pot and the plunger.
The resin powder collecting member includes a roof portion and a side wall portion, and can be arranged on the upper part of the plunger unit to which the plunger is attached.
The resin powder can be collected in the space surrounded by the roof portion and the side wall portion.
The roof portion is formed with a through hole for inserting the plunger mounting portion for inserting the plunger mounting portion of the plunger unit and a through hole for dropping the resin powder for the resin powder to fall into the space.
The upper surface of the roof portion is characterized in that it is concavely inclined from the side opposite to the through hole for inserting the plunger mounting portion and the through hole for inserting the plunger mounting portion toward the through hole for dropping the resin powder.
　本発明のプランジャユニットは、前記本発明の樹脂粉収集用部材を有することを特徴とするトランスファ成形用のプランジャユニットである。 The plunger unit of the present invention is a plunger unit for transfer molding, which comprises the resin powder collecting member of the present invention.
　本発明の樹脂成形装置は、前記本発明のプランジャユニットと、樹脂成形用の成形型とを含むことを特徴とする。 The resin molding apparatus of the present invention is characterized by including the plunger unit of the present invention and a molding mold for resin molding.
　本発明の樹脂成形品の製造方法は、前記本発明の樹脂成形装置を用いて樹脂材料を成形する樹脂成形工程を含むことを特徴とする。 The method for producing a resin molded product of the present invention is characterized by including a resin molding step of molding a resin material using the resin molding apparatus of the present invention.
　本発明によれば、トランスファ成形用成形型のポットとプランジャとの隙間から落下する樹脂粉による装置の汚染を効率的に低減可能な樹脂粉収集用部材、プランジャユニット、樹脂成形装置及び樹脂成形品の製造方法を提供することができる。 According to the present invention, a resin powder collecting member, a plunger unit, a resin molding device, and a resin molded product capable of efficiently reducing contamination of the device by resin powder falling from a gap between a transfer molding mold pot and a plunger. Manufacturing method can be provided.
図１は、本発明の樹脂粉収集用部材の一例を示す図である。図１（ａ）は、平面図である。図１（ｂ）は、下面図である。図１（ｃ）は、側面図である。図１（ｄ）は、図１（ａ）のＩ－Ｉ’方向に見た断面図である。図１（ｅ）は、斜め上方向から見た斜視図である。図１（ｆ）は、斜め下方向から見た斜視図である。FIG. 1 is a diagram showing an example of the resin powder collecting member of the present invention. FIG. 1A is a plan view. FIG. 1B is a bottom view. FIG. 1 (c) is a side view. 1 (d) is a cross-sectional view taken along the line I-I'of FIG. 1 (a). FIG. 1 (e) is a perspective view seen from diagonally upward. FIG. 1 (f) is a perspective view seen from diagonally downward. 図２は、本発明のプランジャユニットの一例を示す図である。図２（ａ）は、斜視図である。図２（ｂ）は、図２（ａ）とは異なる方向から見た斜視図である。図２（ｃ）は、左側面図である。図２（ｄ）は、正面図である。図２（ｅ）は、右側面図である。図２（ｆ）は、図２（ｄ）のIII－III’方向に見た断面図である。図２（ｇ）は、図２（ｃ）のII－II’方向に見た断面図である。FIG. 2 is a diagram showing an example of the plunger unit of the present invention. FIG. 2A is a perspective view. FIG. 2B is a perspective view seen from a direction different from that of FIG. 2A. FIG. 2 (c) is a left side view. FIG. 2D is a front view. FIG. 2 (e) is a right side view. FIG. 2 (f) is a cross-sectional view of FIG. 2 (d) as viewed in the direction of III-III'. FIG. 2 (g) is a cross-sectional view taken in the direction of II-II'of FIG. 2 (c). 図３（ａ）及び（ｂ）は、図１の樹脂粉収集用部材及び図２のプランジャユニットを用いた樹脂粉収集の仕組みを模式的に示す断面図である。3A and 3B are cross-sectional views schematically showing a mechanism of resin powder collection using the resin powder collecting member of FIG. 1 and the plunger unit of FIG. 図４は、本発明の樹脂粉収集用部材の構造の一例を示す断面図である。FIG. 4 is a cross-sectional view showing an example of the structure of the resin powder collecting member of the present invention. 図５は、本発明の樹脂成形装置の一例における一部の構成を示す断面図である。FIG. 5 is a cross-sectional view showing a partial configuration in an example of the resin molding apparatus of the present invention. 図６は、本発明の樹脂粉収集用部材の構造の別の一例と、それを用いたプランジャユニットによる樹脂粉収集の仕組みとを模式的に示す断面図である。FIG. 6 is a cross-sectional view schematically showing another example of the structure of the resin powder collecting member of the present invention and the mechanism of resin powder collecting by the plunger unit using the same. 図７は、樹脂粉収集用部材を有しないプランジャユニットの一例を示す図である。図７（ａ）は、斜視図である。図７（ｂ）は、図７（ａ）とは異なる方向から見た斜視図である。図７（ｃ）は、左側面図である。図７（ｄ）は、正面図である。図７（ｅ）は、図７（ｄ）のＶ－Ｖ’方向に見た断面図である。図７（ｇ）は、図７（ｃ）のIV－IV’方向に見た断面図である。FIG. 7 is a diagram showing an example of a plunger unit having no resin powder collecting member. FIG. 7A is a perspective view. FIG. 7 (b) is a perspective view seen from a direction different from that of FIG. 7 (a). FIG. 7 (c) is a left side view. FIG. 7D is a front view. 7 (e) is a cross-sectional view taken along the line V-V'of FIG. 7 (d). FIG. 7 (g) is a cross-sectional view taken in the direction of IV-IV'of FIG. 7 (c).
　つぎに、本発明について、例を挙げてさらに詳細に説明する。ただし、本発明は、以下の説明により限定されない。 Next, the present invention will be described in more detail with an example. However, the present invention is not limited by the following description.
　本発明の樹脂粉収集用部材は、例えば、前記樹脂粉落下用貫通孔の形状が、スリット状であってもよい。 In the resin powder collecting member of the present invention, for example, the shape of the through hole for dropping the resin powder may be a slit shape.
　本発明の樹脂粉収集用部材は、例えば、前記樹脂粉収集用部材が前記プランジャユニットに取り付けられる取付面に投影した場合において、前記プランジャ取付部挿入用貫通孔側端部から前記樹脂粉落下用貫通孔までの距離が、前記側壁部側端部から前記樹脂粉落下用貫通孔までの距離よりも大きくてもよい。 The resin powder collecting member of the present invention is, for example, for dropping the resin powder from the end of the through hole for inserting the plunger mounting portion when the resin powder collecting member is projected onto the mounting surface to be mounted on the plunger unit. The distance to the through hole may be larger than the distance from the side end portion of the side wall portion to the through hole for dropping the resin powder.
　本発明の樹脂粉収集用部材は、例えば、前記プランジャ取付部挿入用貫通孔の周囲に、樹脂粉落下防止用のシール材が設けられていてもよい。 The resin powder collecting member of the present invention may be provided with, for example, a sealing material for preventing the resin powder from falling around the through hole for inserting the plunger mounting portion.
　本発明のプランジャユニットは、例えば、さらに、プランジャ取付部と、前記プランジャ取付部が内部を上下動可能な孔とを有し、前記孔の周囲に、樹脂粉落下防止用のシール材が設けられていてもよい。 The plunger unit of the present invention further has, for example, a plunger mounting portion and a hole through which the plunger mounting portion can move up and down inside, and a sealing material for preventing resin powder from falling is provided around the hole. May be.
　本発明の樹脂成形装置は、例えば、さらに、前記屋根部と前記側壁部とで囲まれた空間内を吸引するための吸引機構を含んでいてもよい。 The resin molding apparatus of the present invention may further include, for example, a suction mechanism for sucking in the space surrounded by the roof portion and the side wall portion.
　本発明の樹脂成形品の製造方法は、例えば、さらに、前記屋根部と前記側壁部とで囲まれた空間内に収集した樹脂粉を前記樹脂成形装置外部に廃棄する樹脂粉廃棄工程を含んでいてもよい。 The method for producing a resin molded product of the present invention further includes, for example, a resin powder disposal step of disposing of the resin powder collected in the space surrounded by the roof portion and the side wall portion to the outside of the resin molding apparatus. You may.
　本発明の樹脂成形品の製造方法は、例えば、前記本発明の樹脂成形装置が、前記吸引機構を含む樹脂成形装置であり、前記樹脂粉廃棄工程は、前記吸引機構による吸引を停止して行ってもよい。 In the method for producing a resin molded product of the present invention, for example, the resin molding apparatus of the present invention is a resin molding apparatus including the suction mechanism, and the resin powder disposal step is performed by stopping suction by the suction mechanism. You may.
　本発明において、樹脂成形方法は、前述のとおり、トランスファ成形を用いる。 In the present invention, as the resin molding method, transfer molding is used as described above.
　本発明において、「成形型」は、例えば金型であるが、これに限定されず、例えば、セラミック型等であってもよい。 In the present invention, the "molding mold" is, for example, a mold, but is not limited to this, and may be, for example, a ceramic mold or the like.
　本発明において、樹脂成形品は、特に限定されず、例えば、単に樹脂を成形した樹脂成形品でもよいし、チップ等の部品を樹脂封止した樹脂成形品でもよい。本発明において、樹脂成形品は、例えば、電子部品等であってもよい。電子部品としては、特に限定されず任意であり、例えば、チップ、ワイヤ等の任意の部品を樹脂封止した任意の電子部品でもよい。チップとしては、特に限定されず、例えば、ＩＣ、ＬＥＤチップ、半導体チップ、電力制御用の半導体素子等のチップが挙げられる。 In the present invention, the resin molded product is not particularly limited, and may be, for example, a resin molded product obtained by simply molding a resin, or a resin molded product in which a component such as a chip is sealed with a resin. In the present invention, the resin molded product may be, for example, an electronic component or the like. The electronic component is not particularly limited and is arbitrary, and may be any electronic component in which any component such as a chip or a wire is resin-sealed. The chip is not particularly limited, and examples thereof include chips such as ICs, LED chips, semiconductor chips, and semiconductor elements for power control.
　本発明において、成形前の樹脂材料及び成形後の樹脂としては、特に制限されず、例えば、エポキシ樹脂やシリコーン樹脂などの熱硬化性樹脂であってもよいし、熱可塑性樹脂であってもよい。また、熱硬化性樹脂あるいは熱可塑性樹脂を一部に含んだ複合材料であってもよい。本発明において、成形前の樹脂材料の形態としては、例えば、顆粒状樹脂、液状樹脂、シート状の樹脂、タブレット状の樹脂、粉状の樹脂等が挙げられる。なお、本発明において、液状樹脂とは、常温で液状であってもよいし、加熱により溶融されて液状となる溶融樹脂も含む。 In the present invention, the resin material before molding and the resin after molding are not particularly limited, and may be, for example, a thermosetting resin such as an epoxy resin or a silicone resin, or a thermoplastic resin. .. Further, it may be a thermosetting resin or a composite material containing a thermoplastic resin as a part. In the present invention, examples of the form of the resin material before molding include granular resin, liquid resin, sheet-like resin, tablet-like resin, powder-like resin and the like. In the present invention, the liquid resin may be liquid at room temperature, or includes a molten resin that is melted by heating to become liquid.
　本発明において、樹脂成形の成形対象物は、特に限定されないが、例えば、基板であってもよい。また、本発明において、例えば、基板（成形対象物）に実装された部品（例えばチップ、フリップチップ等）を樹脂封止（樹脂成形）して樹脂成形品を製造してもよい。 In the present invention, the object to be molded by resin molding is not particularly limited, but may be, for example, a substrate. Further, in the present invention, for example, a resin molded product may be manufactured by resin-sealing (resin molding) a component (for example, a chip, a flip chip, etc.) mounted on a substrate (molding object).
　以下、本発明の具体的な実施例を図面に基づいて説明する。各図は、説明の便宜のため、適宜省略、誇張等をして模式的に描いている。 Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. For convenience of explanation, each figure is schematically drawn by omitting or exaggerating as appropriate.
　本実施例では、本発明の樹脂粉収集用部材、プランジャユニット、樹脂成形装置及び樹脂成形品の製造方法の一例について説明する。 In this embodiment, an example of the resin powder collecting member, the plunger unit, the resin molding apparatus, and the method for manufacturing the resin molded product of the present invention will be described.
　図１に、本発明の樹脂粉収集用部材の一例を示す。図１（ａ）は、平面図である。図１（ｂ）は、下面図である。図１（ｃ）は、側面図である。図１（ｄ）は、図１（ａ）のＩ－Ｉ’方向に見た断面図である。図１（ｅ）は、斜め上方向から見た斜視図である。図１（ｆ）は、斜め下方向から見た斜視図である。 FIG. 1 shows an example of the resin powder collecting member of the present invention. FIG. 1A is a plan view. FIG. 1B is a bottom view. FIG. 1 (c) is a side view. 1 (d) is a cross-sectional view taken along the line I-I'of FIG. 1 (a). FIG. 1 (e) is a perspective view seen from diagonally upward. FIG. 1 (f) is a perspective view seen from diagonally downward.
　図１に示すとおり、この樹脂粉収集用部材１００は、屋根部１１０と側壁部１２０とを含む。この樹脂粉収集用部材１００では、屋根部１１０と側壁部１２０とは一体に形成されている。後述するように、樹脂粉収集用部材１００は、プランジャユニットの上部に配置することが可能である。屋根部１１０と側壁部１２０とで囲まれた空間１２１内には、後述するように、トランスファ成形用成形型のポットとプランジャとの隙間から落下する樹脂粉を収集可能である。屋根部１１０には、後述するプランジャユニットのプランジャ取付部が挿入されるためのプランジャ取付部挿入用貫通孔１０１と、樹脂粉が空間１２１内に落ちるための樹脂粉落下用貫通孔１０２とが形成されている。この樹脂粉収集用部材１００は、図１（ａ）及び（ｂ）に示すように、上又は下から見て矩形をしており、９つのプランジャ取付部挿入用貫通孔１０１が、屋根部１１０の長手方向の中心に沿って直列に配置されている。なお、プランジャ取付部挿入用貫通孔１０１の数は、図１では９つであるが、これに限定されず任意である。樹脂粉落下用貫通孔１０２は２つあり、２つのスリット状の樹脂粉落下用貫通孔１０２が、直列に配置された９つのプランジャ取付部挿入用貫通孔１０１を挟むように、屋根部１１０の長手方向に沿って配置されている。なお、樹脂粉落下用貫通孔１０２の数は、図１では２つであるが、これに限定されず任意である。また、樹脂粉落下用貫通孔１０２の形状は、図１ではスリット状であるが、これに限定されず任意である。屋根部１１０の上面は、樹脂粉落下用貫通孔１０２からプランジャ取付部挿入用貫通孔１０１に向かって凸状（山状）に傾斜するとともに、プランジャ取付部挿入用貫通孔１０１及びプランジャ取付部挿入用貫通孔１０１の反対側から樹脂粉落下用貫通孔１０２に向かって凹状（谷状）に傾斜している。これにより、トランスファ成形用成形型のポットとプランジャとの隙間から落下する樹脂粉が、プランジャ取付部挿入用貫通孔１０１とプランジャ取付部との隙間から落ちにくいとともに、樹脂粉落下用貫通孔１０２から空間１２１内に落ちやすくなっている。より具体的には、屋根部１１０は、長手方向の中心に沿って凸部１１１が形成され、凸部１１１を挟むように２本の凹部１１２が形成されている。そして、プランジャ取付部挿入用貫通孔１０１は凸部１１１に沿って配置され、樹脂粉落下用貫通孔１０２は凹部１１２に配置されている。また、屋根部１１０には、その長手方向の中心の両端部に、直列に配置された９つのプランジャ取付部挿入用貫通孔１０１を挟むように、２つの樹脂粉収集用部材取付部１０３が形成されている。樹脂粉収集用部材取付部１０３は、屋根部１１０の上面から下面まで貫通する貫通孔を有し、その貫通孔にねじ等を通すことで、後述するように、樹脂粉収集用部材１００をプランジャユニット本体に取り付けることが可能である。なお、樹脂粉収集用部材取付部１０３は、本発明の樹脂粉収集用部材においては任意であり、あっても無くてもよく、その形態、数、配置位置等も任意である。ただし、本発明の樹脂粉収集用部材をプランジャユニット本体に固定しやすくする等の観点から、樹脂粉収集用部材取付部があることが好ましい。 As shown in FIG. 1, the resin powder collecting member 100 includes a roof portion 110 and a side wall portion 120. In the resin powder collecting member 100, the roof portion 110 and the side wall portion 120 are integrally formed. As will be described later, the resin powder collecting member 100 can be arranged on the upper part of the plunger unit. As will be described later, resin powder falling from the gap between the transfer molding mold pot and the plunger can be collected in the space 121 surrounded by the roof portion 110 and the side wall portion 120. The roof portion 110 is formed with a through hole 101 for inserting the plunger mounting portion for inserting the plunger mounting portion of the plunger unit, which will be described later, and a through hole 102 for dropping the resin powder for the resin powder to fall into the space 121. Has been done. As shown in FIGS. 1 (a) and 1 (b), the resin powder collecting member 100 has a rectangular shape when viewed from above or below, and nine plunger mounting portion insertion through holes 101 are provided in the roof portion 110. Are arranged in series along the longitudinal center of the. The number of through holes 101 for inserting the plunger mounting portion is nine in FIG. 1, but the number is not limited to this and is arbitrary. There are two through holes 102 for dropping resin powder, and the roof portion 110 has two slit-shaped through holes for dropping resin powder 102 so as to sandwich the nine through holes 101 for inserting the plunger mounting portion arranged in series. It is arranged along the longitudinal direction. The number of through holes 102 for dropping resin powder is two in FIG. 1, but the number is not limited to this and is arbitrary. Further, the shape of the through hole 102 for dropping the resin powder is a slit shape in FIG. 1, but the shape is not limited to this and is arbitrary. The upper surface of the roof portion 110 is inclined in a convex shape (mountain shape) from the resin powder drop through hole 102 toward the plunger mounting portion insertion through hole 101, and the plunger mounting portion insertion through hole 101 and the plunger mounting portion are inserted. It is inclined in a concave shape (valley shape) from the opposite side of the through hole 101 toward the through hole 102 for dropping the resin powder. As a result, the resin powder that falls from the gap between the transfer molding mold pot and the plunger is difficult to fall from the gap between the plunger mounting portion insertion through hole 101 and the plunger mounting portion, and from the resin powder falling through hole 102. It is easy to fall into the space 121. More specifically, in the roof portion 110, a convex portion 111 is formed along the center in the longitudinal direction, and two concave portions 112 are formed so as to sandwich the convex portion 111. The plunger mounting portion insertion through hole 101 is arranged along the convex portion 111, and the resin powder drop through hole 102 is arranged in the concave portion 112. Further, in the roof portion 110, two resin powder collecting member mounting portions 103 are formed so as to sandwich nine plunger mounting portion insertion through holes 101 arranged in series at both ends of the center in the longitudinal direction thereof. Has been done. The resin powder collecting member mounting portion 103 has a through hole penetrating from the upper surface to the lower surface of the roof portion 110, and by passing a screw or the like through the through hole, the resin powder collecting member 100 is a plunger, as will be described later. It can be attached to the unit body. The resin powder collecting member mounting portion 103 is optional in the resin powder collecting member of the present invention, may or may not be present, and its form, number, arrangement position, and the like are also arbitrary. However, from the viewpoint of facilitating fixing the resin powder collecting member of the present invention to the plunger unit main body, it is preferable to have a resin powder collecting member mounting portion.
　図２に、本発明のプランジャユニットの一例を示す。図２（ａ）は、斜視図である。図２（ｂ）は、図２（ａ）とは異なる方向から見た斜視図である。図２（ｃ）は、左側面図である。図２（ｄ）は、正面図である。図２（ｅ）は、右側面図である。図２（ｆ）は、図２（ｄ）のIII－III’方向に見た断面図である。図２（ｇ）は、図２（ｃ）のII－II’方向に見た断面図である。なお、図２（ｆ）及び（ｇ）は断面図であるが、図示の簡略化のために、ハッチは適宜省略して描いている。図３以下の各断面図においても同様である。 FIG. 2 shows an example of the plunger unit of the present invention. FIG. 2A is a perspective view. FIG. 2B is a perspective view seen from a direction different from that of FIG. 2A. FIG. 2 (c) is a left side view. FIG. 2D is a front view. FIG. 2 (e) is a right side view. FIG. 2 (f) is a cross-sectional view of FIG. 2 (d) as viewed in the direction of III-III'. FIG. 2 (g) is a cross-sectional view taken in the direction of II-II'of FIG. 2 (c). Although FIGS. 2 (f) and 2 (g) are cross-sectional views, the hatch is omitted as appropriate for the sake of simplification. The same applies to each sectional view shown in FIG. 3 and below.
　図示のとおり、このプランジャユニット２００は、プランジャユニット本体２１０を主要な構成要素とする。プランジャユニット本体２１０の上面には、ラバー（ゴム）製のカバー部材２２０が固定されている。プランジャユニット本体２１０におけるプランジャ取付部２０１の周囲は、カバー部材２２０でカバーされており、これにより、プランジャ取付部２０１の駆動部分（図示している孔２１１内）への樹脂粉の侵入が抑制されている。さらに、プランジャユニット２００は、図１で説明した本発明の樹脂粉収集用部材１００を有する。樹脂粉収集用部材１００は、プランジャユニット２００の上部に配置されている。より具体的には、樹脂粉収集用部材１００は、図１で説明したプランジャユニット取付部１０３によって、カバー部材２２０の上面に、ねじ止めにより固定されている。また、樹脂粉収集用部材１００の一端には、吸引用部材１３０が取り付けられている。吸引用部材１３０は、内部が空洞であり、その空洞は、樹脂粉収集用部材１００の屋根部１１０と側壁部１２０とで囲まれた空間１２１と連通している。吸引用部材１３０は、吸引穴１３１を有し、吸引穴１３１を介して、後述する吸引機構により、樹脂粉収集用部材１００の空間１２１内を吸引可能である。プランジャユニット本体２１０は、９本の略円筒形のプランジャ取付部２０１を有する。また、プランジャユニット本体２１０は、その上部に孔２１１を有し、孔２１１は、カバー部材２２０の上面まで貫通している。プランジャ取付部２０１は、孔２１１の内部を上下動可能であり、プランジャ取付部２０１の上部は、カバー部材２２０の上面から突出している。図２（ｆ）及び（ｇ）に示すとおり、孔２１１の内部には、バネ（弾性部材）２１２が配置されている。プランジャ取付部２０１は、バネ２１２の上に載置され、バネ２１２は、プランジャ取付部２０１の上下動とともに伸縮可能である。また、プランジャユニット本体２１０の左端には、棒状のレバー２０２が取り付けられ、さらに、レバー２０２の先端には、球状のノブ２０３が取り付けられている。 As shown in the figure, the plunger unit 200 has the plunger unit main body 210 as a main component. A rubber cover member 220 is fixed to the upper surface of the plunger unit main body 210. The periphery of the plunger mounting portion 201 in the plunger unit main body 210 is covered with a cover member 220, whereby the intrusion of resin powder into the driving portion (inside the hole 211 shown in the figure) of the plunger mounting portion 201 is suppressed. ing. Further, the plunger unit 200 has the resin powder collecting member 100 of the present invention described with reference to FIG. The resin powder collecting member 100 is arranged on the upper portion of the plunger unit 200. More specifically, the resin powder collecting member 100 is fixed to the upper surface of the cover member 220 by screwing by the plunger unit mounting portion 103 described with reference to FIG. 1. Further, a suction member 130 is attached to one end of the resin powder collecting member 100. The suction member 130 has a hollow inside, and the cavity communicates with the space 121 surrounded by the roof portion 110 and the side wall portion 120 of the resin powder collecting member 100. The suction member 130 has a suction hole 131, and can be sucked into the space 121 of the resin powder collecting member 100 through the suction hole 131 by a suction mechanism described later. The plunger unit main body 210 has nine substantially cylindrical plunger mounting portions 201. Further, the plunger unit main body 210 has a hole 211 in the upper portion thereof, and the hole 211 penetrates to the upper surface of the cover member 220. The plunger mounting portion 201 can move up and down inside the hole 211, and the upper portion of the plunger mounting portion 201 projects from the upper surface of the cover member 220. As shown in FIGS. 2 (f) and 2 (g), a spring (elastic member) 212 is arranged inside the hole 211. The plunger mounting portion 201 is placed on the spring 212, and the spring 212 can be expanded and contracted with the vertical movement of the plunger mounting portion 201. Further, a rod-shaped lever 202 is attached to the left end of the plunger unit main body 210, and a spherical knob 203 is attached to the tip of the lever 202.
　図３（ａ）の断面図に、図２のプランジャユニット２００を含む本発明の樹脂成形装置における樹脂粉収集の仕組みを模式的に示す。図３（ａ）の断面図は、図２（ｆ）と同様の断面図における上部を拡大した図である。すなわち、この図は、プランジャ取付部２０１が並ぶ方向に対して垂直な方向で、かつ、プランジャ取付部挿入用貫通孔１０１の直径の位置において切断した様子を示す断面図である。樹脂粉収集用部材１００内の空間１２１は、吸引路８０１を介して吸引機構８００に接続され、吸引機構８００により空間１２１内を吸引して減圧することができる。吸引路８０１は、図２で説明した吸引用部材１３０及び吸引穴１３１（図３（ａ）では図示せず）を介して空間１２１内と連通している。また、吸引機構８００は特に限定されず、例えば、吸引ポンプ、真空ポンプ等であってもよい。また、樹脂成形装置は、さらに、図３（ａ）で図示していないプランジャ、ポット及び成形型を有する。プランジャは、プランジャ取付部２０１の上端に取り付けられている。プランジャ取付部２０１の上下動によって、プランジャがポット内部を上下動可能である。ポット内には樹脂材料を収容可能である。プランジャの上昇により、ポット内部の樹脂材料を成形型内に供給して樹脂成形可能である。プランジャ、ポット及び成形型の構成は、特に限定されず、例えば、一般的なトランスファ成形用の樹脂成形装置と同様であってもよい。 The cross-sectional view of FIG. 3A schematically shows the mechanism of resin powder collection in the resin molding apparatus of the present invention including the plunger unit 200 of FIG. The cross-sectional view of FIG. 3A is an enlarged view of the upper part in the same cross-sectional view as that of FIG. 2F. That is, this figure is a cross-sectional view showing a state of cutting in a direction perpendicular to the direction in which the plunger mounting portions 201 are arranged and at a position of the diameter of the through hole 101 for inserting the plunger mounting portion. The space 121 in the resin powder collecting member 100 is connected to the suction mechanism 800 via the suction path 801 and can be sucked into the space 121 to reduce the pressure by the suction mechanism 800. The suction path 801 communicates with the inside of the space 121 via the suction member 130 and the suction hole 131 (not shown in FIG. 3A) described with reference to FIG. Further, the suction mechanism 800 is not particularly limited, and may be, for example, a suction pump, a vacuum pump, or the like. In addition, the resin molding apparatus further includes a plunger, a pot, and a molding die (not shown in FIG. 3A). The plunger is attached to the upper end of the plunger mounting portion 201. By moving the plunger mounting portion 201 up and down, the plunger can move up and down inside the pot. A resin material can be stored in the pot. By raising the plunger, the resin material inside the pot can be supplied into the molding die for resin molding. The configurations of the plunger, the pot and the molding die are not particularly limited, and may be the same as those of a general resin molding apparatus for transfer molding, for example.
　図３（ａ）を用いて、本発明の樹脂成形装置を用いた本発明の樹脂成形品の製造方法及び樹脂粉収集の一例について説明する。まず、樹脂成形装置を用いて樹脂材料を成形する、樹脂成形工程を行う。この樹脂成形工程は、特に限定されず、例えば、一般的なトランスファ成形と同様の方法で行うことができる。前述のとおり、プランジャの上昇により、ポット内部の樹脂材料を成形型内に供給可能であり、これにより樹脂成形工程を行い、樹脂成形品を製造できる。この樹脂成形工程において、プランジャとポットとの隙間から、樹脂粉収集用部材１００の屋根部１１０の上に、図示のとおり樹脂粉１０ａが落ちてくる。前述のとおり、屋根部１１０の上面は、プランジャ取付部挿入用貫通孔１０１に向かって凸状（山状）に傾斜するとともに、樹脂粉落下用貫通孔１０２に向かって凹状（谷状）に傾斜している。すなわち、屋根部１１０の上面は、樹脂粉落下用貫通孔１０２の部分が最も低くなっている。このため、樹脂粉１０ａは、図示のとおり、樹脂粉落下用貫通孔１０２に向かって落ちる。さらに、樹脂粉１０ａは、樹脂粉落下用貫通孔１０２から樹脂粉収集用部材１００の空間１２１内に落ちる。このとき、空間１２１内を吸引機構により吸引して減圧にすることで、さらに樹脂粉１０ａが空間１２１内に落ちやすくなり、樹脂粉１０ａの収集がしやすくなる。なお、本発明において、吸引機構８００は任意であり、あってもなくてもよい。また、吸引機構８００による吸引も任意であり、行っても行わなくてもよい。しかし、前述のとおり、吸引機構８００による吸引を行うと、さらに樹脂粉１０ａの収集がしやすくなるため好ましい。また、吸引機構８００による吸引を行うタイミングも特に限定されない。例えば、樹脂成形工程を行うに先立ち、あらかじめ吸引機構８００によって空間１２１内を吸引し、減圧にすることが好ましい。また、この吸引による空間１２１内の減圧は、樹脂成形工程が終了するまで持続させることが好ましい。なお、吸引機構８００による吸引により、空間１２１内の樹脂粉１０ａを集塵することになる。さらに、樹脂成形品の製造方法において、樹脂成形工程後に、さらに、樹脂粉収集用部材１００の空間１２１内から吸引機構８００により集塵した樹脂粉１０ａを樹脂成形装置外部に廃棄する樹脂粉廃棄工程を行ってもよい。この樹脂粉廃棄工程は、吸引機構８００による吸引を停止して行ってもよい。この樹脂粉廃棄工程は、例えば、自動で行うようにしてもよく、その方法は特に限定されないが、例えば、空間１２１内から吸引機構８００により集塵した樹脂粉１０ａを、吸引機構８００とは別の吸引機構（図示せず）により吸引して除去してもよい。この場合、集塵力を高く保つためには、吸引機構８００による吸引は、樹脂粉１０ａ除去用の別の吸引機構による吸引を停止して行うことが好ましい。 FIG. 3A will be described with reference to a method for manufacturing the resin molded product of the present invention using the resin molding apparatus of the present invention and an example of collecting resin powder. First, a resin molding step of molding a resin material using a resin molding apparatus is performed. This resin molding step is not particularly limited, and can be performed by, for example, the same method as general transfer molding. As described above, by raising the plunger, the resin material inside the pot can be supplied into the molding die, whereby the resin molding step can be performed and the resin molded product can be manufactured. In this resin molding step, the resin powder 10a falls from the gap between the plunger and the pot onto the roof portion 110 of the resin powder collecting member 100 as shown in the figure. As described above, the upper surface of the roof portion 110 is inclined in a convex shape (mountain shape) toward the plunger mounting portion insertion through hole 101 and in a concave shape (valley shape) toward the resin powder drop through hole 102. is doing. That is, the upper surface of the roof portion 110 has the lowest portion of the through hole 102 for dropping the resin powder. Therefore, as shown in the figure, the resin powder 10a falls toward the resin powder falling through hole 102. Further, the resin powder 10a falls from the resin powder falling through hole 102 into the space 121 of the resin powder collecting member 100. At this time, by sucking the inside of the space 121 by the suction mechanism to reduce the pressure, the resin powder 10a is more likely to fall into the space 121, and the resin powder 10a is more easily collected. In the present invention, the suction mechanism 800 is optional and may or may not be present. Further, suction by the suction mechanism 800 is also optional and may or may not be performed. However, as described above, it is preferable to perform suction by the suction mechanism 800 because the resin powder 10a can be more easily collected. Further, the timing of suction by the suction mechanism 800 is not particularly limited. For example, prior to performing the resin molding step, it is preferable to suck the space 121 in advance by the suction mechanism 800 to reduce the pressure. Further, it is preferable that the depressurization in the space 121 due to this suction is continued until the resin molding step is completed. The resin powder 10a in the space 121 is collected by suction by the suction mechanism 800. Further, in the method for manufacturing a resin molded product, after the resin molding step, a resin powder disposal step of discarding the resin powder 10a collected by the suction mechanism 800 from the space 121 of the resin powder collecting member 100 to the outside of the resin molding apparatus. May be done. This resin powder disposal step may be performed by stopping the suction by the suction mechanism 800. This resin powder disposal step may be performed automatically, for example, and the method is not particularly limited. For example, the resin powder 10a collected from the space 121 by the suction mechanism 800 is separated from the suction mechanism 800. It may be removed by suction by the suction mechanism (not shown). In this case, in order to keep the dust collecting power high, it is preferable that the suction by the suction mechanism 800 is performed by stopping the suction by another suction mechanism for removing the resin powder 10a.
　図３（ｂ）の断面図に、図３（ａ）の変形例を示す。図３（ｂ）のプランジャユニット２００は、図示のとおり、樹脂粉落下防止用のシール材（Ｏリング）７０１及び７０２を有すること以外は、図３（ａ）のプランジャユニット２００と同じである。Ｏリング７０１は、図示のとおり、プランジャユニット本体２１０及びカバー部材２２０の孔２１１（プランジャ取付部２０１が内部を上下動可能な孔）の周囲に設けられている。Ｏリング７０１により、樹脂粉１０ａが孔２１１内に落ちることをさらに低減できる。また、Ｏリング７０２は、樹脂粉収集用部材１００の一部を構成している。図３（ｂ）の樹脂粉収集用部材１００は、Ｏリング７０２を有すること以外は、図１、２及び３（ａ）の樹脂粉収集用部材１００と同じである。図示のとおり、Ｏリング７０２は、プランジャ取付部挿入用貫通孔１０１の周囲に設けられている。Ｏリング７０２により、樹脂粉１０ａがプランジャ取付部挿入用貫通孔１０１内に落ちることをさらに低減できる。図３（ｂ）のプランジャユニットを含む樹脂成形装置を用いた樹脂成形品の製造方法及び樹脂粉の収集を行う方法は、特に限定されず、例えば、図３（ａ）と同様の方法で行うことができる。 The cross-sectional view of FIG. 3 (b) shows a modified example of FIG. 3 (a). As shown in the figure, the plunger unit 200 of FIG. 3B is the same as the plunger unit 200 of FIG. 3A except that it has the sealing materials (O-rings) 701 and 702 for preventing the resin powder from falling. As shown in the figure, the O-ring 701 is provided around a hole 211 (a hole in which the plunger mounting portion 201 can move up and down inside) of the plunger unit main body 210 and the cover member 220. The O-ring 701 can further reduce the resin powder 10a from falling into the holes 211. Further, the O-ring 702 constitutes a part of the resin powder collecting member 100. The resin powder collecting member 100 of FIG. 3 (b) is the same as the resin powder collecting member 100 of FIGS. 1, 2 and 3 (a) except that it has an O-ring 702. As shown in the figure, the O-ring 702 is provided around the through hole 101 for inserting the plunger mounting portion. The O-ring 702 can further reduce the resin powder 10a from falling into the plunger mounting portion insertion through hole 101. The method for manufacturing the resin molded product using the resin molding apparatus including the plunger unit of FIG. 3 (b) and the method for collecting the resin powder are not particularly limited, and for example, the same method as in FIG. 3 (a) is used. be able to.
　なお、本発明の樹脂成形装置の構成は、本発明のプランジャユニットと、樹脂成形用の成形型とを含むこと以外は、特に限定されず、任意である。例えば、本発明の樹脂成形装置の構成は、プランジャユニットが本発明のプランジャユニットであること以外は、一般的なトランスファ成形用の樹脂成形装置と同様であってもよい。例えば、図２のプランジャユニット２００を含む本発明の樹脂成形装置は、前述のとおり、さらに、プランジャ、ポット及び成形型を有していてもよい。図５の断面図に、そのような樹脂成形装置の構成の一例を示す。同図では、樹脂成形装置の要部のみ示している。図示のとおり、この樹脂成形装置１０００は、プランジャユニット２００と、ベース部材３００と、プランジャ４００と、下型５００及び上型６００により構成された成形型と、下型チェイスフォルダ５１０とを主要構成要素とする。ベース部材３００の中心部には、プランジャユニット２００を配置するための空間が形成され、プランジャユニット２００はその空間内に配置されている。プランジャ４００は、プランジャユニット２００におけるプランジャ取付部２０１の上端に取り付けられている。ベース部材３００上には下型チェイスフォルダ５１０が載置されている。下型チェイスフォルダ５１０上には下型５００が載置されている。さらに、下型５００の上方には上型６００が配置されている。上型６００の型面（下型５００と対向する側の面）には、型キャビティ６０１が形成され、型キャビティ６０１内で樹脂成形が可能である。下型５００には貫通孔５０１が形成され、貫通孔５０１が、樹脂材料収容用のポットになっている。プランジャ４００は、貫通孔５０１内部を上下動可能である。下型５００を、ベース部材３００及び下型チェイスフォルダ５１０とともに上下動させることで、下型５００と上型６００とを型締め及び型開きすることができる。図示のとおり、型締めして下型５００の上面と上型６００の型面とを接触させることで、樹脂成形を行うことができる。より具体的には、この状態でプランジャ４００を上昇させることで、貫通孔５０１（ポット）内の樹脂材料１０を型キャビティ６０１内に注入し、樹脂成形することができる。なお、図の樹脂材料１０は液状樹脂であるが、例えば、室温で液状である樹脂でもよいし、加熱して溶融させ液状にした樹脂であってもよい。この樹脂成形装置を用いた樹脂成形品の製造方法及び樹脂粉の収集を行う方法は、特に限定されず、例えば、前述の図３（ａ）を用いて説明したとおりに行うことができる。 The configuration of the resin molding apparatus of the present invention is not particularly limited and is arbitrary except that the plunger unit of the present invention and the molding mold for resin molding are included. For example, the configuration of the resin molding apparatus of the present invention may be the same as that of a general resin molding apparatus for transfer molding, except that the plunger unit is the plunger unit of the present invention. For example, the resin molding apparatus of the present invention including the plunger unit 200 of FIG. 2 may further have a plunger, a pot and a molding die as described above. The cross-sectional view of FIG. 5 shows an example of the configuration of such a resin molding apparatus. In the figure, only the main part of the resin molding apparatus is shown. As shown in the figure, the resin molding apparatus 1000 mainly includes a plunger unit 200, a base member 300, a plunger 400, a molding die composed of a lower die 500 and an upper die 600, and a lower die chase folder 510. And. A space for arranging the plunger unit 200 is formed in the central portion of the base member 300, and the plunger unit 200 is arranged in the space. The plunger 400 is attached to the upper end of the plunger mounting portion 201 in the plunger unit 200. A lower chase folder 510 is placed on the base member 300. The lower mold 500 is placed on the lower mold chase folder 510. Further, the upper die 600 is arranged above the lower die 500. A mold cavity 601 is formed on the mold surface of the upper mold 600 (the surface facing the lower mold 500), and resin molding is possible in the mold cavity 601. A through hole 501 is formed in the lower mold 500, and the through hole 501 is a pot for accommodating a resin material. The plunger 400 can move up and down inside the through hole 501. By moving the lower mold 500 up and down together with the base member 300 and the lower mold chase folder 510, the lower mold 500 and the upper mold 600 can be molded and opened. As shown in the figure, resin molding can be performed by compacting the mold and bringing the upper surface of the lower mold 500 into contact with the mold surface of the upper mold 600. More specifically, by raising the plunger 400 in this state, the resin material 10 in the through hole 501 (pot) can be injected into the mold cavity 601 and resin molded. Although the resin material 10 in the figure is a liquid resin, for example, it may be a resin that is liquid at room temperature, or it may be a resin that has been heated and melted to make it liquid. The method for producing the resin molded product and the method for collecting the resin powder using this resin molding apparatus are not particularly limited, and can be performed, for example, as described with reference to FIG. 3A described above.
　また、図７に、樹脂粉収集用部材を有しないプランジャユニットの構成の一例を示す。図７（ａ）は、斜視図である。図７（ｂ）は、図７（ａ）とは異なる方向から見た斜視図である。図７（ｃ）は、左側面図である。図７（ｄ）は、正面図である。図７（ｅ）は、図７（ｄ）のＶ－Ｖ’方向に見た断面図である。図７（ｇ）は、図７（ｃ）のIV－IV’方向に見た断面図である。図７に示すプランジャユニット２００ａは、樹脂粉収集用部材１００及び吸引用部材１３０を有しないことと、カバー部材２２０に代えてカバー部材２２０ａを有すること以外は、図２のプランジャユニット２００と同じである。カバー部材２２０ａは、樹脂粉収集用部材１００取付用のねじ穴を有しないこと以外は、図２のカバー部材２２０と同じである。 Further, FIG. 7 shows an example of the configuration of the plunger unit having no resin powder collecting member. FIG. 7A is a perspective view. FIG. 7 (b) is a perspective view seen from a direction different from that of FIG. 7 (a). FIG. 7 (c) is a left side view. FIG. 7D is a front view. 7 (e) is a cross-sectional view taken along the line V-V'of FIG. 7 (d). FIG. 7 (g) is a cross-sectional view taken in the direction of IV-IV'of FIG. 7 (c). The plunger unit 200a shown in FIG. 7 is the same as the plunger unit 200 of FIG. 2 except that it does not have the resin powder collecting member 100 and the suction member 130 and has the cover member 220a instead of the cover member 220. be. The cover member 220a is the same as the cover member 220 of FIG. 2 except that it does not have a screw hole for attaching the resin powder collecting member 100.
　図７のように樹脂粉収集用部材を有しないプランジャユニットを用いて樹脂成形品の製造を行なった場合、ポットとプランジャの隙間から落ちた樹脂粉が、カバー部材２００の上面に溜まることになる。このカバー部材２００上面に溜まった樹脂粉を、定期的に手動でクリーニングして除去する必要がある。クリーニング不足で溜まった樹脂粉が、カバー部材２００上面から落ちてプランジャ本体内の等圧装置部分又はプランジャ取付部２０１の駆動部分（図示している孔２１１内）に侵入すると、プランジャの動作不良に繋がるおそれがある。そこで、図１～３で説明したように、本発明の収集用部材１００を用いれば、樹脂粉１０ａがカバー部材２００上面から落ちることを低減できるため、樹脂粉１０ａがプランジャ本体内の等圧装置部分又はプランジャ取付部２０１の駆動部分等に進入することを低減可能であり、プランジャの動作不良をも低減できる。本発明の樹脂粉収集用部材を用いれば、図７のように樹脂粉収集用部材を有しない場合と比較して、樹脂粉のクリーニングを頻繁に行う必要がない。このため、本発明によれば、樹脂粉の収集を効率的に行うことができ、その結果、樹脂成形品の製造も効率的に行うことができる。また、本発明によれば、例えば、前述のとおり、溜まった樹脂粉を、吸引等によって自動的に除去することも可能である。これによれば、樹脂粉の収集をさらに効率的に行うことができる。 When a resin molded product is manufactured using a plunger unit that does not have a resin powder collecting member as shown in FIG. 7, the resin powder that has fallen from the gap between the pot and the plunger will collect on the upper surface of the cover member 200. .. It is necessary to periodically manually clean and remove the resin powder accumulated on the upper surface of the cover member 200. If the resin powder accumulated due to insufficient cleaning falls from the upper surface of the cover member 200 and enters the isobaric device portion in the plunger body or the drive portion of the plunger mounting portion 201 (inside the hole 211 shown in the figure), the plunger malfunctions. There is a risk of connection. Therefore, as described with reference to FIGS. 1 to 3, if the collecting member 100 of the present invention is used, it is possible to reduce the resin powder 10a from falling from the upper surface of the cover member 200, so that the resin powder 10a is an isobaric device in the plunger body. It is possible to reduce entry into the portion or the drive portion of the plunger mounting portion 201, and it is also possible to reduce malfunction of the plunger. When the resin powder collecting member of the present invention is used, it is not necessary to frequently clean the resin powder as compared with the case where the resin powder collecting member is not provided as shown in FIG. Therefore, according to the present invention, the resin powder can be efficiently collected, and as a result, the resin molded product can be efficiently manufactured. Further, according to the present invention, for example, as described above, the accumulated resin powder can be automatically removed by suction or the like. According to this, the resin powder can be collected more efficiently.
　また、本発明の樹脂粉収集用部材は、前述のとおり、屋根部を有する。これにより、本発明の樹脂粉収集用部材の上端において、プランジャ取付部挿入用貫通孔及び樹脂粉落下用貫通孔以外の部分は、常に閉じておくことができる。これにより、例えば、吸引又は空気の圧送等を行った際に、樹脂粉収集用部材内に収容された樹脂粉が上方から収集部材の外に舞い上がることを低減できる。これにより、例えば、特許文献１よりもさらに効率のよい樹脂粉の収集を行うことも可能である。 Further, the resin powder collecting member of the present invention has a roof portion as described above. As a result, at the upper end of the resin powder collecting member of the present invention, the portion other than the through hole for inserting the plunger mounting portion and the through hole for dropping the resin powder can always be closed. Thereby, for example, when suction or air pressure feeding is performed, it is possible to reduce the amount of the resin powder contained in the resin powder collecting member soaring out of the collecting member from above. Thereby, for example, it is possible to collect the resin powder more efficiently than Patent Document 1.
　また、本発明の樹脂粉収集用部材は、例えば、前述のとおり、樹脂粉収集用部材がプランジャユニットに取り付けられる取付面に投影した場合において、プランジャ取付部挿入用貫通孔側端部から樹脂粉落下用貫通孔までの距離が、側壁部側端部から樹脂粉落下用貫通孔までの距離よりも大きくてもよい。図４の断面図に、その一例を示す。図４は、図２（ｆ）又は図３（ａ）において、樹脂粉収集用部材１００及びプランジャ取付部２０１の部分のみを示した断面図である。図示のとおり、樹脂粉収集用部材１００は、樹脂粉収集用部材１００がプランジャユニット本体２１０に取り付けられる取付面１４０に投影した場合において、プランジャ取付部挿入用貫通孔１０１側端部から樹脂粉落下用貫通孔１０２までの距離ｌ２が、側壁部１２０側端部から樹脂粉落下用貫通孔１０２までの距離ｌ１よりも大きい。これにより、図示のとおり、プランジャ取付部挿入用貫通孔１０１側端部から樹脂粉落下用貫通孔１０２までの傾斜面の傾斜角φがなだらかになっている。したがって、プランジャが摺動（上下動）する摺動隙間から鉛直方向に落下する樹脂粉が、プランジャ取付部２０１とプランジャ取付部挿入用貫通孔１０１との隙間から、樹脂粉収集用部材１００の空間１２１内に落下することを低減できる。これにより、空間１２１内におけるプランジャ取付部２０１周囲の空間１２１内部にある領域Ｘに溜まる樹脂粉を低減できる。したがって、樹脂粉がプランジャユニット本体２１０及びカバー部材２２０の孔２１１（プランジャ取付部２０１が内部を上下動可能な孔、図２参照）に入り込むことを低減できる。よって、樹脂粉がプランジャ本体内の等圧装置部分又はプランジャ取付部２０１の駆動部分等に進入することを、さらに低減可能であり、プランジャの動作不良をさらに低減できる。また、図３（ｂ）のＯリング７０１及び７０２のいずれか一方を使用するか、又は両方を併用することで、樹脂粉がプランジャユニット本体２１０及びカバー部材２２０の孔２１１に入り込むことを、さらに効果的に低減できる。なお、図４の樹脂粉収集用部材１００では、図示のとおり、側壁部１２０側端部から樹脂粉落下用貫通孔１０２までの傾斜面（外側傾斜面）の傾斜角θと、プランジャ取付部挿入用貫通孔１０１側端部から樹脂粉落下用貫通孔１０２までの傾斜面（内側傾斜面）の傾斜角φとの関係は、θ＞φとなっている。また、屋根部底面から外側傾斜面頂点までの高さｔ１と、屋根部底部から内側傾斜面頂点までの高さｔ２との関係は、ｔ１＞ｔ２となっている。さらに、同図では、樹脂粉収集用部材１００の左半分の寸法のみ示しているが、左右対称であるため、右半分も左半分と同寸である。 Further, the resin powder collecting member of the present invention is, for example, as described above, when the resin powder collecting member is projected onto the mounting surface to be mounted on the plunger unit, the resin powder is projected from the end of the through hole for inserting the plunger mounting portion. The distance to the drop through hole may be larger than the distance from the side end of the side wall portion to the resin powder drop through hole. An example thereof is shown in the cross-sectional view of FIG. FIG. 4 is a cross-sectional view showing only a portion of the resin powder collecting member 100 and the plunger mounting portion 201 in FIG. 2 (f) or FIG. 3 (a). As shown in the figure, when the resin powder collecting member 100 is projected onto the mounting surface 140 mounted on the plunger unit main body 210, the resin powder collecting member 100 drops the resin powder from the end portion on the side of the through hole 101 for inserting the plunger mounting portion. The distance l2 to the through hole 102 is larger than the distance l1 from the side end of the side wall portion 120 to the through hole 102 for dropping the resin powder. As a result, as shown in the figure, the inclination angle φ of the inclined surface from the end portion on the side of the through hole 101 for inserting the plunger mounting portion to the through hole 102 for dropping the resin powder is gentle. Therefore, the resin powder that falls in the vertical direction from the sliding gap in which the plunger slides (moves up and down) enters the space of the resin powder collecting member 100 from the gap between the plunger mounting portion 201 and the plunger mounting portion insertion through hole 101. It is possible to reduce falling into 121. As a result, the amount of resin powder accumulated in the region X inside the space 121 around the plunger mounting portion 201 in the space 121 can be reduced. Therefore, it is possible to reduce the resin powder from entering the holes 211 of the plunger unit main body 210 and the cover member 220 (the holes in which the plunger mounting portion 201 can move up and down, see FIG. 2). Therefore, it is possible to further reduce the entry of the resin powder into the isobaric device portion in the plunger main body, the drive portion of the plunger mounting portion 201, or the like, and it is possible to further reduce the malfunction of the plunger. Further, by using either one of the O- rings 701 and 702 of FIG. 3B or using both of them in combination, the resin powder can be further prevented from entering the holes 211 of the plunger unit main body 210 and the cover member 220. It can be effectively reduced. In the resin powder collecting member 100 of FIG. 4, as shown in the drawing, the inclination angle θ of the inclined surface (outer inclined surface) from the side end portion of the side wall portion 120 to the resin powder falling through hole 102 and the plunger mounting portion are inserted. The relationship with the inclination angle φ of the inclined surface (inner inclined surface) from the end portion on the side of the through hole 101 to the through hole 102 for dropping the resin powder is θ> φ. Further, the relationship between the height t1 from the bottom surface of the roof to the apex of the outer inclined surface and the height t2 from the bottom of the roof to the apex of the inner inclined surface is t1> t2. Further, in the figure, only the left half of the resin powder collecting member 100 is shown, but since it is symmetrical, the right half is also the same size as the left half.
　また、本発明の樹脂粉収集用部材の構造、形状、製造方法等は、図１～４に示した例に限定されない。例えば、図１～４に示した樹脂粉収集用部材１００は、金属製ブロック状材料の切削加工等により製造できる。しかし、本発明の樹脂粉収集用部材は、これに限定されず、例えば、金属製平板状材料を折り曲げる板金加工等の塑性加工により製造してもよい。図６の断面図に、そのような本発明の樹脂粉収集用部材の構造の一例を示すとともに、それを用いたプランジャユニットによる樹脂粉収集の仕組みを模式的に示す。図６は、図２のプランジャユニット２００に本発明の樹脂粉収集用部材１００ａを取り付けた状態を示す図である。図６は、樹脂粉収集用部材１００を樹脂粉収集用部材１００ａに変更したこと以外は図３（ａ）と同じである。また、図６のプランジャユニットを含む樹脂成形装置を用いた樹脂成形品の製造方法及び樹脂粉の収集を行う方法は、特に限定されず、例えば、図３（ａ）と同様の方法で行うことができる。樹脂粉収集用部材１００ａは、屋根部１１０に代えて屋根部１１０ａを有し、側壁部１２０に代えて側壁部１２０ａを有すること以外は、図１～４の樹脂粉収集用部材１００と同様である。屋根部１１０ａは、形状が平板状であること以外は屋根部１１０と同様である。屋根部１１０ａの上面の形状は、樹脂粉収集用部材１００の屋根部１１０と同様である。すなわち、屋根部１１０ａの上面は、屋根部１１０と同様に、プランジャ取付部挿入用貫通孔１０１に向かって凸状（山状）に傾斜するとともに、樹脂粉落下用貫通孔１０２に向かって凹状（谷状）に傾斜している。これにより、樹脂粉１０ａが樹脂粉落下用貫通孔１０２に向かって落ちやすくなっている。また、図６の屋根部１１０ａでは、図示のとおり、樹脂粉落下用貫通孔１０２において、外側（側壁部１２０ａ側）の屋根部１１０ａの端部が、内側（プランジャ取付部挿入用貫通孔１０１側）の端部の下方に入り込んでいる。このような構成により、空間１２１内に入り込んだ樹脂粉１０ａが樹脂粉落下用貫通孔１０２から出にくくなる。また、この樹脂粉収集用部材１００ａは、例えば、前述のとおり、金属製平板状材料を折り曲げる板金加工等の塑性加工により製造することができる。より具体的には、例えば、１枚の金属製平板状材料に孔を開けてプランジャ取付部挿入用貫通孔１０１、樹脂粉落下用貫通孔１０２等を形成するとともに、その１枚の金属製平板状材料を折り曲げて屋根部１１０ａ及び側壁部１２０ａを形成することができる。また、本発明の樹脂粉収集用部材の製造方法は、金属製ブロック状材料の切削加工、及び金属製平板状材料を折り曲げる板金加工等の塑性加工に限定されず、これら以外の任意の製造方法により製造してもよい。 Further, the structure, shape, manufacturing method, etc. of the resin powder collecting member of the present invention are not limited to the examples shown in FIGS. 1 to 4. For example, the resin powder collecting member 100 shown in FIGS. 1 to 4 can be manufactured by cutting a metal block-shaped material or the like. However, the resin powder collecting member of the present invention is not limited to this, and may be manufactured by plastic working such as sheet metal processing for bending a metal flat plate material, for example. The cross-sectional view of FIG. 6 shows an example of the structure of such a resin powder collecting member of the present invention, and schematically shows a mechanism of resin powder collecting by a plunger unit using the same. FIG. 6 is a diagram showing a state in which the resin powder collecting member 100a of the present invention is attached to the plunger unit 200 of FIG. FIG. 6 is the same as FIG. 3A except that the resin powder collecting member 100 is changed to the resin powder collecting member 100a. Further, the method for manufacturing the resin molded product using the resin molding apparatus including the plunger unit of FIG. 6 and the method for collecting the resin powder are not particularly limited, and for example, the same method as in FIG. 3A is used. Can be done. The resin powder collecting member 100a is the same as the resin powder collecting member 100 of FIGS. 1 to 4 except that it has a roof portion 110a instead of the roof portion 110 and a side wall portion 120a instead of the side wall portion 120. be. The roof portion 110a is the same as the roof portion 110 except that the shape is a flat plate. The shape of the upper surface of the roof portion 110a is the same as that of the roof portion 110 of the resin powder collecting member 100. That is, the upper surface of the roof portion 110a is inclined in a convex shape (mountain shape) toward the plunger mounting portion insertion through hole 101 and concave toward the resin powder drop through hole 102 (as in the roof portion 110). It is inclined in a valley shape). This makes it easier for the resin powder 10a to fall toward the resin powder falling through hole 102. Further, in the roof portion 110a of FIG. 6, as shown in the drawing, in the resin powder falling through hole 102, the end portion of the roof portion 110a on the outer side (side wall portion 120a side) is on the inner side (plunger mounting portion insertion through hole 101 side). ) Has entered below the end. With such a configuration, the resin powder 10a that has entered the space 121 is less likely to come out of the resin powder falling through hole 102. Further, the resin powder collecting member 100a can be manufactured, for example, by plastic working such as sheet metal processing for bending a metal flat plate-like material, as described above. More specifically, for example, a hole is formed in one metal flat plate to form a through hole 101 for inserting a plunger mounting portion, a through hole 102 for dropping resin powder, and the like, and the one metal flat plate is formed. The shaped material can be bent to form the roof portion 110a and the side wall portion 120a. Further, the method for manufacturing the resin powder collecting member of the present invention is not limited to plastic processing such as cutting of a metal block-shaped material and sheet metal processing for bending a metal flat plate-shaped material, and any other manufacturing method. May be manufactured by
　以上、実施例を参照して本発明を説明したが、本発明は、上述の実施例に限定されない。例えば、本発明の樹脂粉収集用部材において、樹脂粉落下用貫通孔の数は、前述のとおり、特に限定されず任意である。例えば、図１～４及び６では、樹脂粉１０ａが樹脂粉落下用貫通孔１０２から落下しやすいように、プランジャ取付部挿入用貫通孔１０１の両側のそれぞれにスリット（長孔）状の樹脂粉落下用貫通孔１０２を１つずつ設けている。しかし、本発明は、これに限定されず、例えば、プランジャ取付部挿入用貫通孔の両側に樹脂粉落下用貫通孔をそれぞれ複数設けてもよい。また、本発明の樹脂粉収集用部材は、前述のとおり屋根部と側壁部とを含むが、底面部は無くてもよい。例えば、図２、３及び６で示したとおり、樹脂粉収集用部材１００又は１００ａをカバー部材２２０の上面に固定することで、カバー部材２２０の上面が樹脂粉収集用部材１００又は１００ａの底面としての機能を果たすためである。しかし、本発明はこれに限定されず、例えば、樹脂粉収集用部材が底面部を有していてもよい。 Although the present invention has been described above with reference to the examples, the present invention is not limited to the above-mentioned examples. For example, in the resin powder collecting member of the present invention, the number of through holes for dropping the resin powder is not particularly limited and is arbitrary as described above. For example, in FIGS. 1 to 4 and 6, slit (long hole) -shaped resin powder is provided on both sides of the through hole 101 for inserting the plunger mounting portion so that the resin powder 10a can easily fall from the through hole 102 for dropping the resin powder. One drop through hole 102 is provided. However, the present invention is not limited to this, and for example, a plurality of through holes for dropping resin powder may be provided on both sides of the through holes for inserting the plunger mounting portion. Further, the resin powder collecting member of the present invention includes the roof portion and the side wall portion as described above, but the bottom surface portion may be omitted. For example, as shown in FIGS. 2, 3 and 6, by fixing the resin powder collecting member 100 or 100a to the upper surface of the cover member 220, the upper surface of the cover member 220 can be used as the bottom surface of the resin powder collecting member 100 or 100a. This is to fulfill the function of. However, the present invention is not limited to this, and for example, the resin powder collecting member may have a bottom surface portion.
　さらに、本発明は、上述の実施例に限定されるものではなく、本発明の趣旨を逸脱しない範囲内で、必要に応じて、任意にかつ適宜に組み合わせ、変更し、又は選択して採用できるものである。 Further, the present invention is not limited to the above-described embodiment, and can be arbitrarily and appropriately combined, modified, or selected and adopted as necessary without departing from the spirit of the present invention. It is a thing.
　この出願は、２０２０年１１月２４日に出願された日本出願特願２０２０－１９４７３７を基礎とする優先権を主張し、その開示の全てをここに取り込む。 This application claims priority on the basis of Japanese Application Japanese Patent Application No. 2020-194737 filed on November 24, 2020, and incorporates all of its disclosures herein.
１０　　樹脂材料
１０ａ　樹脂粉
１００、１００ａ　　樹脂粉収集用部材
１０１　　プランジャ取付部挿入用貫通孔
１０２　　樹脂粉落下用貫通孔
１０３　　プランジャユニット取付部
１１０、１１０ａ　　屋根部
１１１　　屋根部の凸部
１１２　　屋根部の凹部
１２０、１２０ａ　　側壁部
１２１　　屋根部と側壁部とで囲まれた空間
１３０　　吸引用部材
１３１　　吸引穴
１４０　　樹脂粉収集用部材１００がプランジャユニット本体２１０に取り付けられる取付面
２００、２００ａ　　プランジャユニット
２０１　　プランジャ取付部
２０２　　レバー
２０３　　ノブ
２１０　　プランジャユニット本体
２１１　　孔
２１２　　バネ（弾性部材）
２２０、２２０ａ　　カバー部材
３００　　ベース部材
４００　　プランジャ
５００　　下型
５０１　　貫通孔（ポット）
５１０　　下型チェイスフォルダ
６００　　上型
６０１　　型キャビティ
７０１、７０２　　Ｏリング
８００　　吸引機構
８０１　　吸引路
１０００　樹脂成形装置
Ｘ　　空間１２１内におけるプランジャ取付部２０１周囲の空間１２１内部にある領域 10 Resin material 10a Resin powder 100, 100a Resin powder collecting member 101 Plunger mounting part insertion through hole 102 Resin powder drop through hole 103 Plunger unit mounting part 110, 110a Roof part 111 Roof part convex part 112 Roof part concave part 120, 120a Side wall 121 Space surrounded by roof and side wall 130 Suction member 131 Suction hole 140 Mounting surface 200, 200a Plunger unit 201 Plunger mounting part to which the resin powder collecting member 100 is attached to the plunger unit main body 210 202 Lever 203 Knob 210 Plunger unit body 211 Hole 212 Spring (elastic member)
220, 220a Cover member 300 Base member 400 Plunger 500 Lower mold 501 Through hole (pot)
510 Lower chase folder 600 Upper type 601 Cavity 701, 702 O-ring 800 Suction mechanism 801 Suction path 1000 Resin molding device X Area inside the space 121 around the plunger mounting part 201 in the space 121

Claims (10)

  1. 　トランスファ成形用成形型のポットとプランジャとの隙間から落下する樹脂粉を収集するのに用いる樹脂粉収集用部材であって、
    　前記樹脂粉収集用部材は、屋根部と側壁部とを含み、前記プランジャが取り付けられるプランジャユニットの上部に配置することが可能であり、
    　前記屋根部と前記側壁部とで囲まれた空間内に前記樹脂粉を収集可能であり、
    　前記屋根部には、前記プランジャユニットのプランジャ取付部が挿入されるためのプランジャ取付部挿入用貫通孔と、前記樹脂粉が前記空間内に落ちるための樹脂粉落下用貫通孔とが形成され、
    　前記屋根部上面は、前記プランジャ取付部挿入用貫通孔及び前記プランジャ取付部挿入用貫通孔とは反対側から前記樹脂粉落下用貫通孔に向かって凹状に傾斜していることを特徴とする樹脂粉収集用部材。     A resin powder collecting member used to collect resin powder falling from the gap between the transfer molding mold pot and the plunger.
    The resin powder collecting member includes a roof portion and a side wall portion, and can be arranged on the upper part of the plunger unit to which the plunger is attached.
    The resin powder can be collected in the space surrounded by the roof portion and the side wall portion.
    The roof portion is formed with a through hole for inserting the plunger mounting portion for inserting the plunger mounting portion of the plunger unit and a through hole for dropping the resin powder for the resin powder to fall into the space.
    The upper surface of the roof portion is made of a resin that is concavely inclined from the side opposite to the through hole for inserting the plunger mounting portion and the through hole for inserting the plunger mounting portion toward the through hole for dropping the resin powder. Material for collecting powder.
  2. 　前記樹脂粉落下用貫通孔の形状が、スリット状である請求項１記載の樹脂粉収集用部材。 The resin powder collecting member according to claim 1, wherein the through hole for dropping the resin powder has a slit shape.
  3. 　前記樹脂粉収集用部材が前記プランジャユニットに取り付けられる取付面に投影した場合において、前記プランジャ取付部挿入用貫通孔側端部から前記樹脂粉落下用貫通孔までの距離が、前記側壁部側端部から前記樹脂粉落下用貫通孔までの距離よりも大きい請求項１又は２記載の樹脂粉収集用部材。 When the resin powder collecting member is projected onto the mounting surface to be mounted on the plunger unit, the distance from the end of the through hole for inserting the plunger mounting portion to the through hole for dropping the resin powder is the side end of the side wall portion. The resin powder collecting member according to claim 1 or 2, which is larger than the distance from the portion to the resin powder falling through hole.
  4. 　請求項１から３のいずれか一項に記載の樹脂粉収集用部材を有することを特徴とするトランスファ成形用のプランジャユニット。 A plunger unit for transfer molding, which comprises the resin powder collecting member according to any one of claims 1 to 3.
  5. 　さらに、プランジャ取付部と、前記プランジャ取付部が内部を上下動可能な孔とを有し、前記孔の周囲に、樹脂粉落下防止用のシール材が設けられている請求項４記載のプランジャユニット。 The plunger unit according to claim 4, further comprising a plunger mounting portion and a hole in which the plunger mounting portion can move up and down inside, and a sealing material for preventing resin powder from falling is provided around the hole. ..
  6. 　請求項４又は５記載のプランジャユニットと、樹脂成形用の成形型とを含むことを特徴とする樹脂成形装置。 A resin molding apparatus comprising the plunger unit according to claim 4 or 5 and a molding die for resin molding.
  7. 　さらに、前記屋根部と前記側壁部とで囲まれた空間内を吸引するための吸引機構を含む請求項６記載の樹脂成形装置。 The resin molding apparatus according to claim 6, further comprising a suction mechanism for sucking in the space surrounded by the roof portion and the side wall portion.
  8. 　請求項６又は７記載の樹脂成形装置を用いて樹脂材料を成形する樹脂成形工程を含むことを特徴とする樹脂成形品の製造方法。 A method for manufacturing a resin molded product, which comprises a resin molding step of molding a resin material using the resin molding apparatus according to claim 6 or 7.
  9. 　さらに、前記屋根部と前記側壁部とで囲まれた空間内に収集した樹脂粉を前記樹脂成形装置外部に廃棄する樹脂粉廃棄工程を含む、請求項８記載の樹脂成形品の製造方法。 The method for manufacturing a resin molded product according to claim 8, further comprising a resin powder disposal step of disposing of the resin powder collected in the space surrounded by the roof portion and the side wall portion to the outside of the resin molding apparatus.
  10. 　前記樹脂成形装置が、請求項７記載の樹脂成形装置であり、前記樹脂粉廃棄工程は、前記吸引機構による吸引を停止して行う、請求項９記載の樹脂成形品の製造方法。 The method for manufacturing a resin molded product according to claim 9, wherein the resin molding apparatus is the resin molding apparatus according to claim 7, and the resin powder disposal step is performed by stopping suction by the suction mechanism.
PCT/JP2021/042284 2020-11-24 2021-11-17 Resin powder collecting member, plunger unit, resin molding device, and method for manufacturing resin molded article WO2022113853A1 (en)

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JPH06328496A (en) * 1993-05-26 1994-11-29 Mitsubishi Materials Corp Transfer mold
JPH1034694A (en) * 1996-07-19 1998-02-10 Hitachi Ltd Molding die cleaning device
JP2009056769A (en) * 2007-09-03 2009-03-19 Towa Corp Resin-encapsulated molding method of electronic component and molding die
JP2020088079A (en) * 2018-11-21 2020-06-04 Ｔｏｗａ株式会社 Plunger replacement method, plunger unit, and resin molding device

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JPS4836901B1 (en) 1967-01-12 1973-11-07
JP6560498B2 (en) * 2015-01-27 2019-08-14 Ｔｏｗａ株式会社 Resin sealing method and resin molded product manufacturing method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06328496A (en) * 1993-05-26 1994-11-29 Mitsubishi Materials Corp Transfer mold
JPH1034694A (en) * 1996-07-19 1998-02-10 Hitachi Ltd Molding die cleaning device
JP2009056769A (en) * 2007-09-03 2009-03-19 Towa Corp Resin-encapsulated molding method of electronic component and molding die
JP2020088079A (en) * 2018-11-21 2020-06-04 Ｔｏｗａ株式会社 Plunger replacement method, plunger unit, and resin molding device

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