CN117177853A - Forming die, resin forming device and method for manufacturing resin formed product - Google Patents

Forming die, resin forming device and method for manufacturing resin formed product Download PDF

Info

Publication number
CN117177853A
CN117177853A CN202180097206.9A CN202180097206A CN117177853A CN 117177853 A CN117177853 A CN 117177853A CN 202180097206 A CN202180097206 A CN 202180097206A CN 117177853 A CN117177853 A CN 117177853A
Authority
CN
China
Prior art keywords
molding
resin
substrate
mold
block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180097206.9A
Other languages
Chinese (zh)
Inventor
宫景孝之
吉田周平
市桥秀男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of CN117177853A publication Critical patent/CN117177853A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B29C33/14—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/64—Mould opening, closing or clamping devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14122—Positioning or centering articles in the mould using fixed mould wall projections for centering the insert

Abstract

The molding die includes a molding die body that holds a molding object (Sa) and has a cavity (MCa) to which a resin material (T) is supplied, and includes: a cavity block (71) having a cavity (71 a) to which a resin material (T) is supplied; and a depression block (UM), wherein a resin flow path (71 b, 71d, 81, 82) for flowing the resin material (T) from the depression (71A) to the cavity (MCa) is formed between the depression block and the depression block (71), wherein the depression block (71) has a protruding portion (71A) protruding in a state capable of pressing the molded object (Sa), and wherein an insertion member (71 Aa) for being inserted into a hole (H) formed in the molded object (Sa) is formed in the protruding portion (71A).

Description

Forming die, resin forming device and method for manufacturing resin formed product
Technical Field
The present disclosure relates to a molding die, a resin molding apparatus, and a method for manufacturing a resin molded product.
Background
A substrate to which an electronic component such as a semiconductor chip (hereinafter, also simply referred to as a "chip") is connected is generally used as an electronic component by resin encapsulation. Conventionally, as a resin molding apparatus for transfer molding, there is known an apparatus including: a molding die having an upper die and a lower die to which a substrate is supplied; a release film supply mechanism for supplying a release film to the parting surface of the upper die; and a clamping mechanism for clamping the molding die (for example, refer to patent document 1).
In the resin molding apparatus described in patent document 1 (resin molding apparatus in the document), a bridge portion is formed in a pocket provided in a lower die, and when the die is clamped by a clamping mechanism, an outer peripheral end of a substrate is held by being sandwiched between the lower die and the bridge portion. In addition, a positioning pin is formed to protrude upward in the lower die, and when the substrate is supplied to the lower die, the positioning pin is positioned by associating a V-shaped recess provided in the substrate with the positioning pin.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open No. 2020-29045
Disclosure of Invention
Problems to be solved by the invention
However, when the lower die is provided with the positioning pins as in the resin molding apparatus described in patent document 1, the positioning pins may become an obstacle and cannot be handled when it is desired to supply the release film to the die parting surface of the lower die for the reason of preventing contamination of the lower die or the like.
Accordingly, a molding die, a resin molding apparatus, and a method for manufacturing a resin molded product are desired, which have a high degree of freedom in positioning a substrate.
Solution for solving the problem
The molding die of the present disclosure is characterized by comprising a molding die body that holds a molding object and has a cavity to which a resin material is supplied, the molding die body comprising: a pocket block (pocket block) having a pocket to which the resin material is supplied; and a depression block (depression block) in which a resin flow path for flowing the resin material from the depression hole to the cavity is formed between the depression block and the depression block, wherein the depression block has a protruding portion protruding in a state where the molding object can be pressed, and an insertion member for insertion into a hole formed in the molding object is formed in the protruding portion.
The resin molding device of the present disclosure is characterized by comprising: the forming die; a release film supply mechanism that supplies a release film to a mold parting surface of the molding die main body to which the molding object is to be supplied; and a clamping mechanism for clamping the molding die.
The method for producing a resin molded article of the present disclosure is characterized by comprising: a release film supply step of supplying the release film to the molding die main body; a molding object supply step of supplying the molding object onto the release film; a positioning step of relatively moving the pocket block and the molding die main body to insert the insertion member into the hole, thereby positioning the molding object; and a molding step of supplying the resin material to the cavity in a state in which the mold is clamped by the clamping mechanism, thereby molding the resin of the molding object.
Drawings
Fig. 1 is a schematic plan view showing a resin molding apparatus.
Fig. 2 is a schematic front view showing a molding die.
Fig. 3 is a perspective view showing a groove pocket block and a depression block.
Fig. 4 is a perspective view of the pocket block and lower die.
Fig. 5 is an enlarged perspective view showing a lower die on which the groove block and the substrate are placed.
Fig. 6A is a diagram showing a first stage of the positioning process.
Fig. 6B is a diagram showing a second stage of the positioning process.
Fig. 6C is a diagram showing a third stage of the positioning process.
Fig. 6D is a diagram showing a fourth stage of the positioning process.
Fig. 6E is a diagram showing a fifth stage of the positioning process.
Fig. 7 is an enlarged perspective view showing a positioning needle according to another embodiment.
Detailed Description
Hereinafter, embodiments of a molding die, a resin molding apparatus, and a method for manufacturing a resin molded product according to the present disclosure will be described with reference to the drawings. However, the present invention is not limited to the following embodiments, and various modifications may be made without departing from the spirit and scope thereof.
A substrate (molded object) to which a semiconductor chip or the like is connected is used as an electronic component by resin encapsulation. As a technique for resin-sealing the molding object, a transfer method and the like can be cited. One of the transmission methods is as follows: a molding object is placed on a release film that is adhered to a lower die of a molding die, a resin sheet (resin material) obtained by solidifying a granular resin is supplied to a cavity of the molding die, the resin sheet is heated and melted, and a molten resin is supplied to a cavity to resin-mold the molding object.
The powder resin includes not only powder resin but also resin sheets made of solid resin obtained by compacting powder resin, and both of them are melted by heating to become liquid melted resin. The particulate resin may be a thermoplastic resin or a thermosetting resin. When the heating is performed, the viscosity of the thermosetting resin decreases, and when the heating is further performed, the thermosetting resin is converged and cured, thereby becoming a cured resin. As described below, when the package is formed by resin molding of a substrate before molding to which the semiconductor chip is connected, it is preferable to use a thermosetting resin.
[ integral Structure ]
Hereinafter, the resin molding device 30 of the transfer system will be described as an example. Fig. 1 shows a schematic plan view of a resin molding apparatus 30 according to the present embodiment. The resin molding device 30 includes a molding module 3, a supply module 4, a control unit 6, and a conveying mechanism. The molding module 3 is a part for resin-sealing a molding object, and includes a molding die including a molding die main body M for holding a pre-molding substrate Sa (molding object). The control unit 6 includes a program stored in hardware such as an HDD (Hard Disk Drive) and a memory, and is executed by a processor including an ASIC (Application Specific Integrated Circuit: application specific integrated circuit), an FPGA (Field Programmable Gate Array: field programmable gate array), a CPU (Central Processing Unit: central processing unit), or other hardware of a computer as software for controlling at least the operation of the resin molding apparatus 30.
The resin molding apparatus 30 in the present embodiment is an apparatus for resin molding a pre-molding substrate Sa to which a semiconductor chip or the like is connected.
The molding module 3 resin-encapsulates the substrate Sa (molding object) before molding by a molding die, thereby molding the molded substrate Sb (resin molded product). A plurality of (two in this embodiment) molding modules 3 are provided, and each molding module 3 can be independently attached or detached.
Details of the resin molding device 30 will be described later. The number of the molding modules 3 may be one or three or more.
The supply module 4 is configured to supply the pre-molding substrate Sa and the resin sheet T to the molding module 3 and to receive the molded substrate Sb from the molding module 3, and the supply module 4 includes a substrate supply mechanism 43, a substrate alignment mechanism 44, a resin supply mechanism 45, and a substrate receiving portion 46. The loader 41 and the unloader 42 included in the conveying mechanism stand by in the supply module 4. The substrate supply mechanism 43 delivers the pre-mold substrates Sa stored (stock) to the substrate alignment mechanism 44. In the pre-molding substrate Sa, a plurality of semiconductor chips are arranged in the longitudinal direction and/or the lateral direction and connected. The substrate arraying mechanism 44 brings the pre-mold substrates Sa delivered from the substrate supplying mechanism 43 into a state suitable for conveyance. The resin sheet T is stored in the resin supply mechanism 45, and the resin sheet T is placed in a state suitable for conveyance. The pre-molding substrate Sa may be a substrate to which one semiconductor chip is connected.
The conveying mechanism comprises: a loader 41 for conveying the pre-molding substrate Sa and the resin sheet T to which the semiconductor chips and the like are connected before resin encapsulation; and an unloader 42 for conveying the molded substrate Sb after resin encapsulation. The loader 41 can receive the pre-molding substrate Sa from the substrate arrangement mechanism 44, receive the resin sheet T from the resin supply mechanism 45, and then move on a rail from the supply module 4 to each molding module 3, and deliver the pre-molding substrate Sa and the resin sheet T to the molding die main body M (lower die LM) of each molding module 3. The unloader 42 can take out the molded substrate Sb from the molding modules 3, move the molded substrate Sb from each molding module 3 to the substrate accommodating portion 46 on a rail, and accommodate the molded substrate Sb in the substrate accommodating portion 46. In the molded substrate Sb, a semiconductor chip or the like is encapsulated with a cured resin obtained by curing a molten resin. The substrate accommodating portion 46 may be disposed on the opposite side of the supply module 4 with the mold module 3 interposed therebetween, and the arrangement of the respective mechanisms constituting the supply module 4 is not particularly limited.
The resin molding device 30 of the molding module 3 will be described in detail below.
As shown in fig. 2, the resin molding apparatus 30 includes: an upper die UM (an example of a depression block) in which an upper cavity MCa into which a molten resin (hereinafter referred to as "molten resin") obtained by heating and melting the resin sheet T is injected is formed; the lower mold LM, which is disposed opposite to the upper mold UM, is provided with a resin injection mechanism 7 for injecting molten resin into the upper cavity MCa; a mold clamping mechanism 5 for clamping the upper mold UM and the lower mold LM; and a release film supply mechanism 8 for supplying the release film F. The lower mold LM in the present embodiment is formed with a lower cavity MCb in which molten resin is injected from an upper cavity MCa through a resin flow hole (not shown) provided in the pre-molding substrate Sa. The operation of the clamping mechanism 5 is controlled by the control unit 6.
The upper die UM is held by an upper die holder 31, and the upper die holder 31 is fixed to an upper platen 32. Further, the upper die UM is fitted to the upper die holder 31 via the upper die base plate 33. The lower die LM is held by a lower die holder 34, and the lower die holder 34 is fixed to a movable platen 35 that is lifted and lowered by the clamping mechanism 5. The lower die LM is mounted on the lower die holder 34 via a lower die base plate 36. The clamping mechanism 5 in the present embodiment may be a mechanism in which a servo motor and a ball screw mechanism are combined, a mechanism in which a cylinder, a hydraulic cylinder and a rod are combined, or the like.
The release film supply mechanism 8 supplies the release film F between the upper die UM and the lower die LM.
As a material of the release film F, a resin material having characteristics such as heat resistance, releasability, flexibility, and extensibility is used, and for example, PTFE (polytetrafluoroethylene), ETFE (ethylene/tetrafluoroethylene copolymer), PET (polyethylene terephthalate), FEP (tetrafluoroethylene/hexafluoropropylene copolymer), polypropylene, polystyrene, polyvinylidene chloride, and the like are used.
The release film supply mechanism 8 includes a delivery mechanism (not shown) that delivers the release film F and a recovery mechanism (not shown) that recovers the release film F. The delivery mechanism can deliver the pre-use release film F between the upper die UM and the lower die LM, and the recovery mechanism can recover the used release film F for resin molding. The lower die LM is provided with a suction mechanism (not shown) for sucking the release film F to the die parting surface by a vacuum pump or the like. The operation of the release film supply mechanism 8 is controlled by the control unit 6.
The resin injection mechanism 7 includes: the groove hole block 71 having a groove hole 71a for accommodating the resin sheet T; and a transmission mechanism 72 having a plunger 72a provided in the groove hole 71a. The groove hole 71a is formed by a cylindrical member 73 having a cylindrical shape, for example. The cylindrical member 73 is fitted into a through hole formed in the groove block 71.
The groove block 71 is elastically supported by an elastic member 74 so as to be capable of lifting and lowering with respect to the lower die LM. That is, the groove block 71 is provided to be liftable and lowerable with respect to the lower die LM by the elastic member 74. The elastic member 74 is provided below the groove block 71, and presses the groove block 71 in a direction away from the lower die LM.
Further, a protruding portion 71A (an example of a protruding portion) protruding toward the upper surface of the lower die LM, that is, the die parting surface is formed at the upper end portion of the groove hole block 71. The protruding portion 71A protrudes in a state where it can press the groove-hole side end portion of the opposed molding front substrate Sa, and a positioning pin 71Aa (an example of an insertion member) described later is formed on the lower surface. Further, a depression 71b, a runner 71c, and a gate 71d, which are resin flow paths for guiding the molten resin injected from the cavity 71a to the upper cavity MCa, are formed on the upper surface of the cavity block 71. In addition, in a state in which the upper die UM and the lower die LM are clamped, the upper surface of the protruding portion 71A is in contact with the upper die UM (depression block), and the lower surface of the protruding portion 71A sandwiches the pre-molding substrate Sa between it and the die parting surface of the lower die LM.
The transfer mechanism 72 moves the plunger 72a in a state where the upper mold UM and the lower mold LM are clamped, and injects the molten resin from the cavity 71a into the upper cavity MCa. The transmission mechanism 72 includes: a plunger 72a provided in the groove hole 71a for pressing and feeding the molten resin; a fixed block 72b to which the plunger 72a is fixed; and a plunger drive mechanism 72c that moves the plunger 72a via a fixed block 72b. The operation of the plunger drive mechanism 72c is controlled by the control unit 6.
The fixing block 72b has a substantially rectangular parallelepiped shape, and a plurality of plungers 72a are linearly fixed in a row on one rectangular surface (upper surface) of the fixing block 72b. The arrangement of the plurality of plungers 72a corresponds to the arrangement of the plurality of grooves 71a described later. The plurality of plungers 72a are fixed to the fixed block 72b by, for example, fixing screws or the like.
Further, the fixed block 72b may be provided with an isostatic mechanism using an elastic member or the like for equalizing the pressure at the time of injecting the molten resin into each plunger 72a.
The plunger driving mechanism 72c moves the fixed block 72b up and down with respect to the lower die LM to move the plurality of plungers 72a up and down with respect to the plurality of grooves 71a by the same amount of movement. The plunger drive mechanism 72c of the present embodiment is provided below the fixed block 72b. As the plunger driving mechanism 72c, for example, a mechanism in which a servo motor is combined with a ball screw mechanism, a mechanism in which a cylinder, a hydraulic cylinder, and a rod are combined, or the like can be used.
The upper mold UM is formed with an upper cavity MCa that accommodates the chip 13 of the pre-molding substrate Sa and into which the molten resin is injected. Further, a concave space 81 and a gate 82 connecting the depression 71b, the runner 71c, and the gate 71d of the cavity block 71 with the upper cavity MCa are formed in the upper UM. That is, a depression 71b, a runner 71c, a gate 71d, a concave space 81, and a gate 82, which are resin flow paths for flowing the molten resin from the cavity 71a to the cavity MCa, are formed between the upper die UM and the cavity block 71. In the upper UM, air holes (not shown) are formed on the side opposite to the groove hole block 71. The runner 71c may be omitted and the depression 71b may be directly connected to the upper cavity MCa via the gates 71d and 82. In the present embodiment, the concave space 81 is formed with a space for resin accumulation before the communication from the gate 71d to the upper cavity MCa, and the concave space 81 is connected to the upper cavity MCa from the resin accumulation space via the gate 82, but the resin accumulation space may be omitted.
Further, the upper die UM is provided with a plurality of push pins 83 for releasing the molded substrate Sb from the upper die UM. These push pins 83 are provided so as to penetrate through a desired portion of the upper die UM and to be capable of being lifted and lowered relative to the upper die UM, and these push pins 83 are fixed to a push plate 84 provided on the upper side of the upper die UM. The push plate 84 is provided on the upper platen 32 and the like via an elastic member 85, and has a return pin 86. At the time of mold clamping, the return pins 86 contact with the outside of the mounting area of the pre-mold substrate Sa in the lower mold LM, whereby the push plate 84 is raised with respect to the upper mold UM. Thus, at the time of mold closing, the push pin 83 is in a state of being retracted to the mold parting surface of the upper mold UM. On the other hand, at the time of mold opening, as the lower mold LM descends, the push plate 84 descends with respect to the upper mold UM by the elastic force of the elastic member 85, and the push pins 83 release the molded substrate Sb from the upper mold UM.
When the upper mold UM and the lower mold LM are clamped by the clamping mechanism 5, the resin flow path formed by the depression portion 71b, the runner 71c, the gate 71d, the concave space 81, and the gate 82 communicates the plurality of groove cavities 71a with the upper cavity MCa, and the upper cavity MCa communicates with the lower cavity MCb via the resin flow holes provided in the pre-molding substrate Sa. Further, when the upper die UM and the lower die LM are clamped, the pocket side end portion of the pre-molding substrate Sa is sandwiched between the lower surface of the protruding portion 71A of the pocket block 71 and the die parting surface of the lower die LM. When the plunger 72a is raised by the plunger driving mechanism 72c in this state and the molten resin is injected into the upper cavity Mca and the lower cavity MCb, the chips 13 and the like of the pre-molding substrate Sa are encapsulated with the resin.
Next, the molding die will be described in detail with reference to fig. 3 to 5. Fig. 3 shows a perspective view of a cavity block 71 and an upper mold UM (depression block) included in the molding die when viewed from above. Fig. 4 is a perspective view of the groove block 71 and the lower die LM when seen from the side, and fig. 5 is an enlarged perspective view of the lower die LM on which the groove block 71 and the pre-molding substrate Sa are placed. The molding die includes a molding die body M, and the molding die body M includes: a groove hole block 71; a lower die LM to which the groove hole block 71 is provided in a liftable manner; and an upper module UM having a depression block.
As shown in fig. 3 (b), in the groove hole block 71 of the present embodiment, a plurality of groove holes 71a are formed in a line. In fig. 3 (b), an example in which eight grooves 71a are formed in one groove block 71 is shown, but the present invention is not limited thereto, and may be appropriately modified.
Further, a plurality of depression portions 71b are formed on the upper surface of the cavity block 71 so as to correspond to the plurality of cavities 71a, and a plurality of runners 71c and gates 71d are formed so as to correspond to the plurality of depression portions 71b, respectively.
The pocket block 71 has a plurality of pockets 71a to which the resin sheet T is supplied. Each of the groove holes 71a communicates with a depression portion 71b including a portion surrounding the groove hole 71a, a runner 71c which is a plurality of (four in the drawing) branches extending from the depression portion 71b, and a gate 71d which is a tip of the runner 71c in a plan view. After the resin molding of the pre-molding substrate Sa, unnecessary resin remains in the depressed portion 71b, the runner 71c, and the gate 71d of the cavity block 71. The unnecessary resin is a resin which remains between the upper die UM and the resin injection mechanism 7 after the resin molding and is cured, and in the present embodiment, remains on the groove hole block 71 and is cured.
As shown in fig. 3 (a), in the upper die UM, a portion of a concave space 81 is formed at a portion facing the depression portion 71b and the runner 71c of the cavity block 71, and a gate 82 is formed at a tip of a resin storage space of the concave space 81. As described above, the depression 71b, the runner 71c, the gate 71d, the concave space 81, and the gate 82 constitute a resin flow path for flowing the molten resin from the cavity 71a to the cavity MCa.
As shown in fig. 4, the pocket block 71 has a protruding portion 71A protruding in a state where the pocket side end portion of the pre-molding substrate Sa can be pressed. The protruding portion 71A in the present embodiment is continuously present so as to extend over the existing region of the pre-molding substrate Sa. A plurality of positioning pins 71Aa are formed on the lower surface of the protruding portion 71A, and the plurality of positioning pins 71Aa are inserted into a plurality of (three in the drawing) holes H formed in the groove-hole side end portion of the pre-mold substrate Sa, respectively, at the time of mold closing. The protruding portion 71A may be formed in a divided manner only at a portion where the positioning needle 71Aa is provided.
The plurality of positioning pins 71Aa in the present embodiment are formed of a total of three columns at positions corresponding to the holes H formed in the center of the pocket-side end portion of the pre-mold substrate Sa and the holes H provided at the both ends of the pocket-side end portion of the pre-mold substrate Sa. The positioning pins 71Aa are formed in a truncated cone shape with a thin tip, and have the same shape. The number and arrangement of the positioning pins 71Aa are not particularly limited as long as they are provided in correspondence with the number and positions of the holes H of the substrate Sa before molding. Further, all the positioning pins 71Aa may be mixed with different shapes, instead of having all the positioning pins 71Aa in the same shape.
As shown in fig. 5, the positioning pin 71Aa is formed in a size of a hole H penetrating the pre-molding substrate Sa, and a groove 9 into which the positioning pin 71Aa is inserted is formed in the lower die LM. In a sectional view, the proximal side surface of the positioning needle 71Aa is a linear portion 75, the distal surface is a flat surface 76, and the linear portion 75 and the flat surface 76 are connected by a tapered portion 77 that narrows toward the flat surface 76. Preferably, the corners of the straight portions 75 and the flat surfaces 76 are rounded or chamfered for easy insertion into the hole H. When the positioning pin 71Aa is inserted into the hole H, the tapered portion 77 allows the pre-mold substrate Sa to move in any horizontal direction such as the front-rear direction, the left-right direction, etc., and the pre-mold substrate Sa is fixed by fitting the linear portion 75 having the same diameter as the hole H and the same thickness as the hole H into the hole H. At this time, the pre-molding substrate Sa is not damaged by the flat surface 76. The grooves 9 in the present embodiment are three bottomed holes provided corresponding to the number and positions of the positioning pins 71Aa and the holes H of the pre-molding substrate Sa. The groove 9 is provided with a taper in the side wall which decreases in diameter as going to the bottom wall. The plurality of grooves 9 provided in the lower die LM may be formed in a columnar shape in which the taper is eliminated, may be formed in a single long hole shape in which all the grooves 9 are connected, or may be formed in a long hole shape in which several grooves 9 are connected.
[ method for producing resin molded article ]
A method for producing a resin molded article (molded substrate Sb) will be described mainly with reference to fig. 1 and 6. The method for producing the resin molded article (molded substrate Sb) includes: a release film supply step of supplying a release film F to the lower die LM; a molding object supply step of supplying the pre-molding substrate Sa onto the release film F; a positioning step of relatively moving the groove hole block 71 and the lower die LM to insert the positioning pin 71Aa into the hole H of the pre-molding substrate Sa, thereby positioning the pre-molding substrate Sa; and a molding step of supplying the molten resin to the upper cavity MCa in a state where the molding die is clamped by the clamping mechanism 5, thereby performing resin molding of the pre-molding substrate Sa. The molding step is a step of resin-molding the pre-molded substrate Sa by the resin molding device 30 from the time when the pre-molded substrate Sa is carried into the molding module 3 until the molded substrate Sb is carried out from the molding module 3. In the molding step of the present embodiment, the molten resin is supplied to the upper cavity Mca and the lower cavity MCb to supply the molten resin to both sides of the pre-molding substrate Sa, thereby performing the double-sided molding.
As shown in fig. 1, the loader 41 is heated in advance while insulating the accommodating space of the resin sheet T, and the molding die main body M is also heated in advance. Then, the pre-mold substrate Sa taken out from the substrate supply mechanism 43 is placed on the loader 41. The resin sheets T aligned by the resin supply mechanism 45 are accommodated in the accommodating space of the resin sheets T of the loader 41. Then, the loader 41 conveys the pre-molding substrate Sa and the resin sheet T to the molding module 3, and accommodates the resin sheet T in the groove 71a of the lower die LM. By accommodating the resin sheet T in the groove hole 71a, the heater built in the lower die LM heats the resin sheet T to become molten resin.
The release film supply mechanism 8 supplies the release film F (see fig. 2) before use between the upper die UM and the lower die LM. Next, the lower mold LM is moved in the direction of the upper mold UM by the mold clamping mechanism 5 whose driving force is controlled by the control unit 6, and the mold release film F before use is brought into close contact with the lower mold LM. Then, the mold parting surface of the lower mold LM is sucked with the release film F by the suction mechanism, and the pre-mold substrate Sa is supplied onto the release film F. For example, a loader (not shown) described in japanese patent No. 6655148 can be used as a mechanism for supplying the pre-mold substrate Sa onto the release film F. When the pre-mold substrate Sa is supplied onto the release film F, the end surface of the pre-mold substrate Sa is pressed against the side surface of the pocket 71, whereby the pre-mold substrate Sa is positioned to some extent, but it is difficult to perform positioning with high accuracy due to the surface roughness of the end surface of the pre-mold substrate Sa, and the like.
Next, the upper mold UM and the lower mold LM are closed by the closing mechanism 5 whose driving force is controlled by the control unit 6, and the upper mold UM and the lower mold LM are moved closer to each other. At this time, the lower mold LM and the groove block 71 are raised by the mold clamping mechanism 5 (see fig. 6A), and when the upper surface of the groove block 71 contacts the upper mold UM, the raising of the groove block 71 is stopped (see fig. 6B). Then, by the mold clamping mechanism 5, the lower mold LM is further raised, and thereby the elastic member 74 (see fig. 2) is contracted, and the pocket block 71 is relatively lowered with respect to the lower mold LM (see fig. 6C to 6D), and the lower surface of the protruding portion 71A is brought into contact with the pocket side end portion of the pre-molding substrate Sa (see fig. 6E). Further, the lower surface of the upper die UM is in contact with the end of the pre-molding substrate Sa that is not in contact with the pocket side end.
When the groove hole block 71 is lowered relative to the lower die LM and the lower surface of the protruding portion 71A contacts the groove hole side end portion of the pre-molding substrate Sa, the positioning pin 71Aa penetrates the hole H of the pre-molding substrate Sa and is inserted into the groove 9 of the lower die LM (see fig. 6D to 6E). At this time, the release film F is deformed into a partially deflected state by being in contact with the flat surface 76 of the positioning needle 71Aa. In the present embodiment, since the positioning needle 71Aa is formed in a truncated cone shape with a thin tip, when the positioning needle 71Aa is inserted into the hole H of the pre-mold substrate Sa, the truncated cone-shaped tapered portion 77 contacts the side surface of the hole H to move the pre-mold substrate Sa to a correct position, and the truncated cone-shaped linear portion 75 is fitted into the hole H of the pre-mold substrate Sa, thereby fixing the position. Further, since the positioning needle 71Aa is formed in the size of the through hole H, positioning can be performed even when the thickness of the substrate Sa is small before molding. Further, the side wall of the groove 9 into which the positioning needle 71Aa is inserted has a tapered shape in which the diameter decreases as going toward the bottom wall, so that the positioning needle 71Aa does not interfere with the groove 9.
Next, the molten resin obtained by melting the resin sheet T accommodated in the lower die LM is injected into the cavities MCa, MCb by the control section 6 controlling the driving force transmission mechanism 72. Thus, the pre-mold substrate Sa is double-sided molded (see fig. 2). After the resin molding, the lower die LM is moved downward to open the molding die. In this mold opening operation, an operation (gate breaking operation) of separating the unnecessary resin formed in the depression portion 71b, the runner 71c, the gate 71d, and the like of the cavity block 71 from the pre-molding substrate Sa subjected to the double-sided molding is performed, and the molded substrate Sb and the unnecessary resin are separated. Then, the molded substrate Sb is released from the lower mold LM and the upper mold UM, and the molded substrate Sb is accommodated in the substrate accommodating portion 46 by the unloader 42 (see fig. 1). After the package substrate (molded substrate Sb) is manufactured by the resin molding device 30, the package substrate is cut (singulated) by a cutting device so as to remove unnecessary portions including the holes H, and the resulting cut product is used as an electronic component after quality inspection.
In this way, since the positioning needle 71Aa to be inserted into the hole H formed in the pre-molding substrate Sa is provided in the protruding portion 71A of the pocket block 71, the pre-molding substrate Sa can be guided and positioned at a correct position with respect to the molding die main body M. As a result, the filling position of the molten resin is accurate and the molding accuracy is improved when the pre-molding substrate Sa is resin molded. Further, since the precisely positioned pre-mold substrate Sa is pressed by the protruding portion 71A and the positioning needle 71Aa is inserted into the hole H of the pre-mold substrate Sa, there is no problem in that the pre-mold substrate Sa is moved by the resin pressure.
Further, the double-sided molding is performed by supplying the molten resin to both sides of the pre-molding substrate Sa in the molding step. In this double-sided molding, although the pre-mold substrate Sa is easily moved by the resin pressure, since the precisely positioned pre-mold substrate Sa is pressed by the protruding portion 71A and the positioning pin 71Aa is inserted into the hole H of the pre-mold substrate Sa, there is no problem that the pre-mold substrate Sa is moved by the resin pressure.
Other embodiments
In the following, for ease of understanding, the same terms and reference numerals are used for the same members as in the above embodiments.
In the above embodiment, the release film F is adsorbed to the lower die LM, but the release film F may be adsorbed to the upper die UM, or the release film F may be adsorbed to the upper die UM and the lower die LM. In the case where the release film F is adsorbed to the upper die UM, the push pin 83 according to the above embodiment is not required, and it is preferable to provide a mechanism for supplying the release film F to the upper die UM separately.
In the above embodiment, the lower cavity MCb is formed in the lower die LM, but the lower cavity MCb may be omitted in the case where resin encapsulation is not required for the lower surface of the pre-molding substrate Sa. In this case, resin molding is performed on only one surface (upper surface of the pre-molding substrate Sa) facing the upper mold UM, but in order to prevent contamination of the lower mold LM, it is preferable to supply the release film F to the lower mold LM.
In the above embodiment, the example of supplying the pre-mold substrate Sa to the lower mold LM is shown, but the pre-mold substrate Sa may be supplied to the upper mold UM, and the pre-mold substrate Sa may be sandwiched between the upper surface of the protruding portion 71A of the pocket block 71 and the mold parting surface of the upper mold UM. In this case, the positioning pin 71Aa is provided on the upper surface of the protruding portion 71A, and the groove 9 is provided on the upper die UM.
As shown in FIG. 7, the positioning needle 71Aa (another example of an insertion member) may have a cylindrical base end side and a conical tip end side. Even in this case, the conical portion of the cone shape is brought into contact with the side surface of the hole H of the pre-mold substrate Sa to move the pre-mold substrate Sa to the correct position, and the position can be fixed by the columnar base end portion. The positioning needle 71Aa may be formed in a prism shape or the like and may have any shape as long as it can be inserted into the hole H of the pre-molding substrate Sa.
In the above embodiment, the height dimension of the hole H penetrating the pre-molding substrate Sa is used for the positioning pin 71Aa, but the height dimension of the positioning pin 71Aa may be smaller than the thickness of the pre-molding substrate Sa.
In the above embodiment, the depression block is integrally formed with the upper die UM, but the depression block may be provided separately from the upper die UM.
In the above embodiment, the groove block 71 is elastically supported by the elastic member 74 so as to be able to be lifted up and lowered down with respect to the lower die LM, but the groove block 71 may be fixed and a movable plate for supporting the pre-mold substrate Sa may be provided in the lower die LM. In this case, when the upper mold UM and the lower mold LM are relatively moved to perform mold clamping, the movable block is independently moved upward to relatively move the pocket block 71 and the lower mold LM, so that the positioning pin 71Aa is inserted into the hole H of the pre-mold substrate Sa.
< 8 > the pre-molding substrate Sa to be resin molded by the resin molding apparatus 30 in the above embodiment is, for example, a semiconductor substrate (silicon wafer or the like), a metal substrate (lead frame or the like), a glass substrate, a ceramic substrate, a resin substrate, or a wiring substrate.
[ summary of the above embodiment ]
Hereinafter, an outline of the resin molding apparatus 30 and the method for manufacturing a resin molded product described in the above embodiment will be described.
(1) The molding die is characterized by comprising a molding die body M that holds a molding object (a pre-molding substrate Sa), and has a cavity (an upper cavity MCa) to which a resin material (a molten resin obtained by melting a resin sheet T) is supplied, the molding die body M including: the pocket block 71 having a pocket 71a to which a resin material (resin sheet T) is supplied; and a depression block (upper die UM), a resin flow path (depression portion 71b, a runner 71c, a gate 71d, a concave space 81, and a gate 82) for flowing a resin material (molten resin) from the depression hole 71A to the cavity (upper die MCa) is formed between the depression block and the depression block 71, the depression block 71 has a protruding portion (protruding portion 71A) protruding in a state where the molding object (the pre-molding substrate Sa) can be pressed, and an insertion member (positioning pin 71 Aa) for insertion into a hole H formed in the molding object (the pre-molding substrate Sa) is formed in the protruding portion (protruding portion 71A).
In this configuration, the positioning pins 71Aa to be inserted into the holes H formed in the pre-molding substrate Sa are provided in the protruding portions 71A of the pocket block 71. Thereby, the pre-molding substrate Sa can be guided and positioned at a correct position with respect to the molding die main body M (lower die LM). As a result, the filling position of the molten resin is accurate and the molding accuracy is improved when the pre-molding substrate Sa is resin molded. Further, since the precisely positioned pre-mold substrate Sa is pressed by the protruding portion 71A and the positioning needle 71Aa is inserted into the hole H of the pre-mold substrate Sa, there is no problem in that the pre-mold substrate Sa is moved by the resin pressure.
(2) The insertion member (positioning needle 71 Aa) may be formed in a truncated cone shape with a thin tip.
If the positioning needle 71Aa is formed in a truncated cone shape with a thin tip as in the present configuration, the truncated cone-shaped tapered portion 77 can contact the side surface of the hole H to move the pre-mold substrate Sa to a correct position when the positioning needle 71Aa is inserted into the hole H of the pre-mold substrate Sa.
(3) The insertion member (positioning needle 71 Aa) may be formed in the size of the through hole H, and the molding die main body M (lower die LM) may be formed with a groove 9 into which the insertion member (positioning needle 71 Aa) is inserted.
When the positioning needle 71Aa is formed in the size of the through hole H in this configuration, positioning can be performed even when the thickness of the substrate Sa is small before molding. Further, if the lower die LM is provided with the groove 9 into which the positioning pin 71Aa is inserted, the positioning pin 71Aa does not need to be a movable member that can advance and retreat, and the manufacturing cost can be reduced.
(4) The resin molding device 30 is characterized by comprising: the molding die according to any one of the above (1) to (3); a release film supply mechanism 8 for supplying a release film F to a mold parting surface of a molding mold main body M (lower mold LM) to which a molding object (pre-molding substrate Sa) is to be supplied; and a clamping mechanism 5 for clamping the molding die.
As described above, the mold release film F can be supplied to the mold parting surface of the lower mold LM to be supplied with the pre-mold substrate Sa, not by providing the lower mold LM with the positioning pins, but by providing the protruding portion 71A of the groove hole block 71 with the positioning pins 71Aa. As a result, contamination of the molding die body M associated with resin molding can be prevented.
The method for producing a resin molded article (molded substrate Sb) using the resin molding apparatus 30 of the above (4) is characterized by comprising the steps of: a release film supply step of supplying a release film F to the molding die main body M (lower die LM); a molding object supply step of supplying a molding object (pre-molding substrate Sa) onto the release film F; a positioning step of relatively moving the pocket block 71 and the molding die main body M (lower die LM) to insert an insertion member (positioning needle 71 Aa) into the hole H of the pre-molding substrate Sa, thereby positioning the molding object (pre-molding substrate Sa); and a molding step of supplying a resin material (molten resin obtained by melting the resin sheet T) to the cavity (upper cavity MCa) in a state where the molding die is clamped by the clamping mechanism 5, and molding the resin of the molding object (pre-molding substrate Sa).
In this method, since the positioning step of inserting the positioning pin 71Aa into the hole H of the pre-molding substrate Sa by relatively moving the groove hole block 71 and the lower die LM is included, the filling position of the molten resin is accurate when the pre-molding substrate Sa is resin molded in the molding step, and the molding accuracy is improved.
(6) In the molding step, a resin material (molten resin) may be supplied to both sides of the object to be molded (the pre-molding substrate Sa) to perform the double-sided molding.
In the present method, the resin material is supplied to both sides of the pre-molding substrate Sa in the molding step, and the double-sided molding is performed. In this double-sided molding, although the pre-mold substrate Sa is easily moved by the resin pressure, since the precisely positioned pre-mold substrate Sa is pressed by the protruding portion 71A and the positioning pin 71Aa is inserted into the hole H of the pre-mold substrate Sa, there is no problem that the pre-mold substrate Sa is moved by the resin pressure.
The configurations disclosed in the above embodiments (including other embodiments, the same applies hereinafter) may be applied in combination with the configurations disclosed in other embodiments, as long as no contradiction occurs. Further, the embodiments disclosed in the present specification are examples, and the embodiments of the present disclosure are not limited thereto, and may be appropriately changed within a range not departing from the object of the present disclosure.
Industrial applicability
The present disclosure can be used for a molding die, a resin molding apparatus, and a method for manufacturing a resin molded product.
Description of the reference numerals
5: a mold closing mechanism;
8: a release film supply mechanism;
9: a groove;
30: a resin molding device;
71: a groove hole block;
71A: a protruding portion (protruding portion);
71Aa: a positioning needle (insertion member);
71a: a groove hole;
71b: a depression (resin flow path);
71c: flow channels (resin flow paths);
71d: a gate (resin flow path);
81: concave space (resin flow path);
82: a gate (resin flow path);
f: a release film;
h: a hole;
m: a molding die body;
MCa: an upper cavity (cavity);
MCb: a lower cavity (cavity);
sa: a molding front substrate (molding object);
sb: a molded substrate (resin molded article);
t: resin sheets (resin materials);
UM: upper die (depression block).

Claims (6)

1. A molding die, wherein,
comprises a molding die body for holding a molding object, having a cavity to which a resin material is supplied,
the molding die body includes: a cavity block having a cavity to which the resin material is supplied; and a depression block, wherein a resin flow path for flowing the resin material from the groove hole to the cavity is formed between the depression block and the groove hole block,
the groove hole block is provided with a protruding part protruding in a state of being capable of pressing the molding object,
an insertion member is formed at the protruding portion for insertion into a hole formed in the molding object.
2. The molding die according to claim 1, wherein,
the insertion member is formed in a truncated cone shape with a thin tip.
3. The molding die according to claim 1 or 2, wherein,
the insert member is formed with a hole therethrough,
a groove into which the insertion member is inserted is formed in the molding die body.
4. A resin molding device is provided with:
a molding die according to any one of claims 1 to 3;
a release film supply mechanism that supplies a release film to a mold parting surface of the molding die main body to which the molding object is to be supplied; and
and the mold clamping mechanism is used for clamping the molding mold.
5. A method for producing a resin molded article using the resin molding apparatus according to claim 4, wherein the method for producing a resin molded article comprises:
a release film supply step of supplying the release film to the molding die main body;
a molding object supply step of supplying the molding object onto the release film;
a positioning step of relatively moving the pocket block and the molding die main body to insert the insertion member into the hole, thereby positioning the molding object; and
and a molding step of supplying the resin material to the cavity to mold the molding object in a state in which the mold is clamped by the clamping mechanism.
6. The method for producing a resin molded article according to claim 5, wherein,
in the molding step, the resin material is supplied to both sides of the object to be molded to perform double-sided molding.
CN202180097206.9A 2021-04-21 2021-12-14 Forming die, resin forming device and method for manufacturing resin formed product Pending CN117177853A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-071908 2021-04-21
JP2021071908A JP7447050B2 (en) 2021-04-21 2021-04-21 Molding mold, resin molding equipment, and method for manufacturing resin molded products
PCT/JP2021/046086 WO2022224487A1 (en) 2021-04-21 2021-12-14 Molding die, resin molding device, and method for manufacturing resin molded article

Publications (1)

Publication Number Publication Date
CN117177853A true CN117177853A (en) 2023-12-05

Family

ID=83723434

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180097206.9A Pending CN117177853A (en) 2021-04-21 2021-12-14 Forming die, resin forming device and method for manufacturing resin formed product

Country Status (5)

Country Link
JP (1) JP7447050B2 (en)
KR (1) KR20230145466A (en)
CN (1) CN117177853A (en)
TW (1) TWI802220B (en)
WO (1) WO2022224487A1 (en)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3244519B2 (en) 1991-08-26 2002-01-07 昭和電工株式会社 Acrylic-functional methylfluoroalkylsilsesquioxane compounds
JP3278309B2 (en) * 1994-11-21 2002-04-30 アピックヤマダ株式会社 Resin molding apparatus, resin molding method, and release film for resin molding
JP2000043096A (en) 1998-07-28 2000-02-15 Sony Corp Resin sealing device
JP6058431B2 (en) * 2013-03-08 2017-01-11 アピックヤマダ株式会社 Resin molding apparatus and resin molding method
JP6244229B2 (en) 2014-03-07 2017-12-06 株式会社日立製作所 Charged particle beam irradiation system, synchrotron and beam extraction method thereof
JP6298719B2 (en) * 2014-06-09 2018-03-20 Ｔｏｗａ株式会社 Resin sealing device and resin sealing method
JP2019034445A (en) * 2017-08-10 2019-03-07 Ｔｏｗａ株式会社 Resin molding apparatus, and manufacturing method of resin molded product
JP7102238B2 (en) 2018-06-08 2022-07-19 Ｔｏｗａ株式会社 Resin molding equipment and manufacturing method of resin molded products
JP6981935B2 (en) 2018-08-23 2021-12-17 アピックヤマダ株式会社 Mold mold and resin molding device equipped with it
JP6655148B1 (en) * 2018-10-16 2020-02-26 Ｔｏｗａ株式会社 Transfer device, resin molding device, transfer method, and method of manufacturing resin molded product
JP7160770B2 (en) 2019-07-22 2022-10-25 アピックヤマダ株式会社 Resin molding equipment

Also Published As

Publication number Publication date
JP7447050B2 (en) 2024-03-11
TWI802220B (en) 2023-05-11
WO2022224487A1 (en) 2022-10-27
TW202241686A (en) 2022-11-01
JP2022166592A (en) 2022-11-02
KR20230145466A (en) 2023-10-17

Similar Documents

Publication Publication Date Title
KR102301482B1 (en) Resin-molding die and resin-molding device
CN117242557A (en) Compression molding device and compression molding method
US11969922B2 (en) Method for manufacturing resin molded product
US20080020510A1 (en) Fabrication method of semiconductor device
CN110621463B (en) Molding die and resin molding method
TW201741109A (en) Resin molding device and resin molding method
CN109383047B (en) Resin molding device and method for manufacturing resin molded product
TWI750369B (en) Resin molding die and resin molding device
CN112677422B (en) Method for producing resin molded article and resin molding apparatus
CN117177853A (en) Forming die, resin forming device and method for manufacturing resin formed product
WO2016125571A1 (en) Resin molding die, resin molding method, and method for producing resin molded article
CN113334667B (en) Resin molding device and resin molding method
JP6397808B2 (en) Resin molding die and resin molding method
CN113573867B (en) Resin molding device and method for manufacturing resin molded product
JP7360369B2 (en) Resin molding equipment and method for manufacturing resin molded products
JP2023072436A (en) Resin sealing device and resin sealing method
CN109689330B (en) Compression molding device, compression molding method, and method for manufacturing compression molded product
JP2004311855A (en) Mold for resin seal molding of electronic part
JP7430125B2 (en) Molding mold, resin molding equipment, and method for manufacturing resin molded products
WO2024034203A1 (en) Resin-material feeding mechanism, resin molding device, and method for producing molded resin article
WO2023105841A1 (en) Resin sealing device and sealing mold
WO2023144856A1 (en) Resin sealing device, sealing mold, and resin sealing method
JP2024011855A (en) Molding die, resin molding device, and method for producing resin molded article
KR20240012545A (en) Resin molding apparatus and method for manufacturing resin molded products

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination