CN107756707B - Resin molding apparatus and method for manufacturing resin molded product - Google Patents
Resin molding apparatus and method for manufacturing resin molded product Download PDFInfo
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- CN107756707B CN107756707B CN201710713650.4A CN201710713650A CN107756707B CN 107756707 B CN107756707 B CN 107756707B CN 201710713650 A CN201710713650 A CN 201710713650A CN 107756707 B CN107756707 B CN 107756707B
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- resin material
- housing part
- resin
- dust
- cover
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B13/00—Conditioning or physical treatment of the material to be shaped
- B29B13/10—Conditioning or physical treatment of the material to be shaped by grinding, e.g. by triturating; by sieving; by filtering
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C2037/96—Filters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
- B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
Abstract
The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded product, wherein the resin molding apparatus can reduce adverse effects caused by dust generated from a resin material. The resin molding apparatus includes: a 1 st container for containing a granular or powdery resin material; a 2 nd accommodating section that receives and temporarily accommodates the resin material accommodated in the 1 st accommodating section, and drops the resin material from an outlet (a 2 nd lower opening) of the resin material supply passage through the resin material supply passage while measuring the resin material; a 2 nd housing part cover (upper cover, lower cover) surrounding the 2 nd housing part including the outlet of the resin material supply passage; and a dust collecting device (a dust collector, a 1 st suction tube, a 2 nd suction tube, a 1 st suction force adjusting portion, and a 2 nd suction force adjusting portion) with variable suction force, which sucks the dust in the internal space of the 2 nd accommodating part cover.
Description
Technical Field
The present invention relates to a resin molding apparatus and a resin molded product manufacturing method for manufacturing a resin molded product such as a resin-sealed product in which an electronic component such as a semiconductor chip is resin-sealed.
Background
In order to protect electronic components from the environment such as light, heat, and moisture, the electronic components are generally sealed with a resin. As a method of resin sealing, there are compression molding, transfer molding, and the like. The compression molding method uses a molding die composed of a lower die and an upper die, supplies a resin material to a cavity of the lower die, mounts a substrate on which an electronic component is mounted on the upper die, and molds the lower die and the upper die while heating the two dies. The transfer molding method mounts a substrate in a cavity of one of an upper mold and a lower mold, molds both the lower mold and the upper mold while heating them, and presses a resin into the cavity by a plunger, thereby performing molding. In the transfer molding method, not only a part of the resin remains in a path for feeding the resin from the plunger to the cavity and is wasted, but also the resin flows and damages the semiconductor substrate and the wiring, and therefore, the compression molding method has become a mainstream in recent years.
In compression molding, generally, a granular resin material or a powdery resin material is used as a resin material to be supplied to a lower mold in terms of ease of handling. The "granular resin material" and the "powdery resin material" are not strictly defined, but generally, those having a particle size of 0.1 to 3.0mm are referred to as granular resin materials, and those having a particle size of less than 0.1mm are referred to as powdery resin materials. In the case of using a granular resin material or a powdery resin material, the resin material must be supplied into the cavity of the lower mold as uniformly as possible in order to reduce the flow of the resin material in the cavity during molding. In the compression molding apparatus described in patent document 1, after a resin material is supplied from a resin material supply portion to a resin material transfer tray having a uniform thickness corresponding to the shape of a cavity, the resin material transfer tray is moved to a position above a lower mold provided in a mold locking mechanism, and a flapper provided at the bottom of the resin material transfer tray is opened, thereby supplying the resin material into the cavity of the lower mold. In the compression molding apparatus described in patent document 2, a mold release film is stretched over the bottom of a resin material transfer tray instead of providing a baffle, and after the resin material transfer tray to which the resin material is supplied is transferred onto the lower mold in the same manner as described above, the mold release film is sucked from the lower mold side, whereby the resin material in the resin material transfer tray is introduced into the cavity of the lower mold.
For supplying the resin material to the resin material transfer tray, for example, a powder supply device described in patent document 3 can be used. In patent document 3, various powders are targeted for the resin material, but the resin material is not limited to the resin material, and granular or powdery resin materials will be described below. The apparatus has 2 accommodating portions (referred to as "1 st accommodating portion" and "2 nd accommodating portion") for accommodating the resin material. The 1 st receiving part is disposed above the 2 nd receiving part, the 2 nd receiving part is disposed above a container (here, a resin material transfer tray) to which a resin material is supplied, and the resin material is supplied from the 1 st receiving part to the resin material transfer tray via the 2 nd receiving part. A1 st vibration applying section for applying vibration to the 1 st accommodating section is connected to the 1 st accommodating section, and a 2 nd vibration applying section for applying vibration to the 2 nd accommodating section is similarly connected to the 2 nd accommodating section. Further, the 2 nd housing portion is provided with a measuring portion for measuring the resin material housed in the 2 nd housing portion.
The operation of the powder supply device will be described. First, the resin material transfer tray is disposed below the 2 nd accommodating portion. Then, in a state where a sufficient amount of the resin material is stored in the 1 st storage part, vibration is applied to the 1 st storage part from the 1 st vibration applying part. Thereby, the resin material stored in the 1 st storage portion slowly falls down to the 2 nd storage portion. At the time point when a sufficient amount of the resin material is supplied to the 2 nd accommodating part in comparison with the amount to be supplied to the resin material transfer tray, the supply of the resin material to the 2 nd accommodating part is stopped by stopping the application of the vibration to the 1 st accommodating part from the 1 st vibration applying part.
Then, vibration is applied to the 2 nd accommodating part from the 2 nd vibration applying part. Thus, the resin material accommodated in the 2 nd accommodating portion slowly drops and is continuously supplied to the resin material transfer tray. During this period, the resin material is supplied into the resin material transfer tray with a uniform thickness by moving the resin material transfer tray in a substantially horizontal direction. At the same time, the metering unit meters the resin material in the 2 nd container. Then, at a point in time when the amount of the resin material in the 2 nd accommodating portion decreases to be supplied to the resin material transfer tray, the 2 nd vibration applying portion stops applying the vibration to the 2 nd accommodating portion. Thereby, the resin material is supplied to the resin material transfer tray in an amount just enough to be supplied.
Background literature patent literature
Patent document 1: japanese laid-open patent publication No. 2007-125783
Patent document 2: japanese patent laid-open No. 2010-036542
Patent document 3: japanese laid-open patent publication No. H09-005148
Disclosure of Invention
Problems to be solved by the invention
When the powdery resin material is supplied from the resin material supply unit to the resin material transfer tray, vibration is applied to the resin material by the 1 st vibration applying unit or the 2 nd vibration applying unit, and dust is generated by a part of the resin material. Further, when the granular resin material is supplied from the resin material supply unit to the resin material transfer tray, the powder adheres to the surface of each granule at the time of producing the granular resin material, and therefore, the dust is generated similarly to the powder-shaped resin material.
The present invention addresses the problem of providing a resin molding apparatus and a method for manufacturing a resin molded article, which can reduce adverse effects caused by dust generated from a resin material.
Means for solving the problems
A 1 st example of the resin molding apparatus according to the present invention, which has been completed to solve the above problems, is characterized by including:
a 1 st container for containing a granular or powdery resin material;
a 2 nd accommodating unit that receives and temporarily accommodates the resin material accommodated in the 1 st accommodating unit, and drops the resin material from an outlet of the resin material supply passage through the resin material supply passage while measuring the resin material;
a 2 nd housing part cover surrounding the 2 nd housing part including an outlet of the resin material supply passage; and
and a dust collecting device with variable suction force, which sucks the dust in the inner space of the 2 nd accommodating part cover.
The invention according to claim 2 is a resin molding apparatus comprising:
a 1 st container for containing a granular or powdery resin material;
a 2 nd accommodating unit that receives and temporarily accommodates the resin material accommodated in the 1 st accommodating unit, and drops the resin material from an outlet of the resin material supply passage through the resin material supply passage while measuring the resin material;
a 1 st housing part outlet which is a resin material outlet provided in the 1 st housing part and through which the resin material housed in the 2 nd housing part is supplied;
a 1 st housing part cover surrounding the 1 st housing part including the 1 st housing part outlet;
a 2 nd housing part cover surrounding the 2 nd housing part including an outlet of the resin material supply passage;
a 1 st accommodating part side dust collecting device for sucking the dust in the internal space of the 1 st accommodating part cover by a 1 st suction force; and
and a 2 nd accommodating part side dust collecting device for sucking the dust in the inner space of the 2 nd accommodating part cover by a 2 nd suction force weaker than the 1 st suction force.
The 1 st example of the method for producing a resin molded article of the present invention includes: a resin material supply step of supplying a granular or powdery resin material to a resin material transfer tray, then moving the resin material transfer tray to a molding die, and supplying the resin material in the resin material transfer tray to the molding die; and a resin molding step of clamping the mold to which the resin material is supplied, and molding the resin; the method for producing a resin molded article is characterized in that:
in the above-mentioned resin material supplying step,
a granular or powdery resin material is accommodated in a 1 st accommodating part, the resin material accommodated in the 1 st accommodating part is received and temporarily accommodated in a 2 nd accommodating part, and the resin material is supplied to the resin material transfer tray through a resin material supply passage while being metered,
while the resin material is being supplied from the 2 nd container to the resin material transfer tray, the dust in the internal space of the 2 nd container cover surrounding the 2 nd container including the outlet of the resin material supply passage is sucked by a suction force with which the resin material is not sucked and the dust is sucked.
The 2 nd aspect of the method for producing a resin molded article of the present invention comprises: a resin material supply step of supplying a granular or powdery resin material to a resin material transfer tray, then moving the resin material transfer tray to a molding die, and supplying the resin material in the resin material transfer tray to the molding die; and a resin molding step of clamping the mold to which the resin material is supplied, and molding the resin; the method for producing a resin molded article is characterized in that:
in the above-mentioned resin material supplying step,
a granular or powdery resin material is accommodated in a 1 st accommodating part, the resin material accommodated in the 1 st accommodating part is received and temporarily accommodated in a 2 nd accommodating part, and the resin material is supplied to the resin material transfer tray through a resin material supply passage while being metered,
while the resin material is being supplied from the 2 nd accommodating part to the resin material transfer tray, the dust in the internal space of the 1 st accommodating part cover surrounding the 1 st accommodating part is sucked by the 1 st suction force, and the dust in the internal space of the 2 nd accommodating part cover surrounding the 2 nd accommodating part including the outlet of the resin material supply passage is sucked by the 2 nd suction force weaker than the 1 st suction force.
ADVANTAGEOUS EFFECTS OF INVENTION
The adverse effect caused by dust generated from the resin material can be reduced by the present invention.
Drawings
Fig. 1 is a vertical cross-sectional view showing an embodiment of a resin material supply unit in a resin molding apparatus according to the present invention.
Fig. 2 is a front view showing a suction force adjusting portion in the resin material supplying portion according to the present embodiment.
Fig. 3 is a schematic view showing an example of the compression-forming portion.
Fig. 4 is a schematic view showing an example of a resin molding apparatus having a material receiving module, a molding module, and a discharging module.
10: resin material supply part
111: 1 st housing part
112: 2 nd accommodating part
1121: resin material supply path
121: 1 st upper opening
1211: opening and closing cover
122: 2 nd upper opening
131: 1 st lower opening
132: 2 nd lower opening
141: 1 st vibration applying part
142: 2 nd vibration applying part
15: measuring part
16: resin material transfer disk moving mechanism
171: upper cover
1711: 1 st connecting part
172: lower cover
1721: 2 nd connecting part
18: dust collector (suction device)
181: 1 st suction tube
1811: 1 st attractive force adjusting part
182: 2 nd suction tube
1821: 2 nd attractive force adjusting part
183: no. 3 suction tube
1831: suction port
184: base part
185: opening of attractive force adjusting part
186: movable cover
1862: bolt
19: control unit
20: compression molding part
211: lower fixing disc
212: upper fixing disc
22: connecting rod
23: movable pressure plate
24: mold locking device
251: lower heater
252: upper heater
26: mold release film coating device
30: resin molding apparatus
31: material receiving module
311: substrate receiving part
32: forming module
33: discharge module
331: resin molded product holding part
36: main conveying device
37: auxiliary conveying device
L11: shortest path
L12: shortest path
L2: shortest path
LM: lower die
UM: upper die
MC: die cavity
P: resin material
S: substrate
T: the resin material is transferred to the tray.
Detailed Description
According to the resin molding apparatus of the present invention according to the first and second aspects 1 and 2, in a state where the resin material transfer tray is disposed directly below the outlet of the resin material supply passage, the resin material is dropped from the outlet, and thereby the resin material is supplied to the resin material transfer tray. In this case, the 2 nd housing part cover surrounds the 2 nd housing part including the outlet of the resin material supply passage, and then the dust in the internal space of the 2 nd housing part cover is sucked by the dust collecting device, whereby the dust can be prevented from scattering in the vicinity of the resin material transfer tray to which the resin material is supplied from the outlet.
When the dust is scattered in the vicinity of the resin material transfer tray, the powder derived from the resin material adheres to the resin material transfer tray. In this way, when the resin material in the resin material transfer tray is introduced into the cavity of the lower mold, the powder moves to the molding die (upper die and/or lower die), and the powder may prevent the upper die and lower die from adhering to each other during clamping. In contrast, in the resin molding apparatus according to the first or second aspect of the present invention, since the scattering of the dust in the vicinity of the resin material transfer tray as described above can be prevented, the adhesion between the upper mold and the lower mold is not hindered by the powder derived from the resin material.
However, if the suction force of the dust collecting device is too strong, not only dust scattered in the vicinity of the resin material transfer tray is sucked, but also granular or powdery resin material to be supplied from the 2 nd storage portion to the resin material transfer tray is sucked, and thus the resin material cannot be supplied to the resin material transfer tray in an accurate amount measured by the 2 nd storage portion. On the other hand, if the suction force is too weak, dust cannot be sufficiently sucked. Therefore, in the resin molding apparatus of example 1, a suction force variable one is used as the dust collecting device. Since the size of the suction force for sucking the resin material itself or the size of the suction force for insufficiently sucking the dust varies depending on the resin material, the suction force can be set so that the dust scattered in the vicinity of the resin material transfer tray is sufficiently sucked without sucking the resin material supplied to the resin material transfer tray, depending on the resin material used, by using the dust collecting device whose suction force is variable.
The resin molding apparatus according to example 1 may include:
a 1 st housing part outlet which is a resin material outlet provided in the 1 st housing part and through which the resin material housed in the 2 nd housing part is supplied;
a 1 st housing part cover surrounding the 1 st housing part including the 1 st housing part outlet; and
and a 1 st accommodating part side dust collecting device for sucking the dust in the internal space of the 1 st accommodating part cover.
With this configuration, dust can be prevented from scattering from the resin material in the vicinity of the 1 st storage part outlet. Here, since the 1 st housing part side dust collecting device measures the resin material by the 2 nd housing part located at the subsequent stage thereof even if the resin material is sucked, the accurate amount of the resin material is supplied to the molding die via the resin material transfer tray without hindrance even if the suction force is not changed. Of course, the first housing section side dust collecting device 1 may be one having a variable suction force to prevent the resin material from being sucked. In either case, the suction force of the dust collecting device (corresponding to the "2 nd housing part side dust collecting device" in the resin molding device of the 2 nd aspect) that sucks the dust in the internal space of the 2 nd housing part cover can be made weaker than the suction force of the 1 st housing part side dust collecting device, and the resin material can be more reliably prevented from being sucked in the internal space of the 2 nd housing part cover, whereby an accurate amount of the resin material can be supplied to the molding die. In the dust collecting device for sucking the dust in the internal space of the 2 nd housing part cover and the 1 st housing part side dust collecting device, a common suction device for sucking the dust may be used, or different suction devices may be used for the 2 dust collecting devices. In addition, the 1 st housing portion cover and the 2 nd housing portion cover may be an integral (1) cover. In the case of using such an integrated cover, the internal space of the cover is also integrated, but the dust may be sucked from a position closer to the 1 st housing part and a position closer to the 2 nd housing part in the internal space.
On the other hand, in the resin molding apparatus according to claim 2, after the periphery of the 2 nd housing part is surrounded by the 2 nd housing part cover as in example 1, the periphery of the 1 st housing part including the outlet of the 1 st housing part is further surrounded by the 1 st housing part cover. Thus, the dust in the internal space of the 1 st housing part cover is sucked by the 1 st housing part side dust collecting device with the 1 st suction force, while the dust in the internal space of the 2 nd housing part cover surrounding the 2 nd housing part to be measured is sucked by the 2 nd housing part side dust collecting device with the 2 nd suction force weaker than the 1 st suction force. This can prevent the resin material supplied to the resin material transfer tray from being sucked into the internal space of the 2 nd accommodating unit cover.
In the resin molding apparatus according to claim 2, it is preferable that the 2 nd suction force is variable. With this configuration, the 2 nd suction force is set so that the resin material supplied to the resin material transfer tray is not sucked and the dust scattered in the vicinity of the resin material transfer tray is sufficiently sucked according to the resin material used, and the resin material supplied to the resin material transfer tray can be prevented from being sucked.
In the resin molding apparatus according to claim 2, even if the resin material is sucked into the internal space of the 1 st receiving portion cover, the resin material is measured by the 2 nd receiving portion located at the subsequent stage, so that the resin material is supplied to the molding die at an accurate amount via the resin material transfer tray without being hindered even if the 1 st suction force is not changed. Of course, the 1 st suction force may be made variable.
In the resin molding apparatus according to example 1 and the resin molding apparatus according to claim 2, wherein the 2 nd suction force is variable, the dust collecting device (the 2 nd housing part side dust collecting device according to claim 2) preferably includes:
a suction device which sucks air;
a suction tube connecting the suction device to an internal space of the 2 nd housing portion cover;
an opening provided in the suction tube; and
and a movable cover which is provided in the opening and which adjusts the opening area of the opening by the position of the cover.
According to this configuration, the suction force of the suction device is divided into 2 suction forces, that is, a suction force for performing suction from the internal space of the 2 nd accommodating unit cover and a suction force for performing suction from the space outside the opening, by adjusting the opening area of the opening provided in the suction tube by the movable cover. As a result, the larger the opening area of the opening, the smaller the suction force to suck from the internal space of the 2 nd housing unit cover. Therefore, the suction force from the internal space can be varied by adjusting the opening area with the movable lid. Since the opening area can be easily and finely adjusted by the movable cover, the suction force can be easily and finely adjusted.
The resin molding apparatus according to claim 1 or 2 may include a vibration applying portion for applying vibration to the resin material supply passage. The resin material is supplied from the 2 nd storage unit to the resin material transfer tray by applying vibration to the resin material supply passage by the vibration applying unit. When such a vibration applying portion is used, a gap may be provided between the 2 nd accommodating portion and the 2 nd accommodating portion cover so as not to inhibit the vibration of the 2 nd accommodating portion. In this case, the dust is likely to leak out of the 2 nd housing cover through the gap, and therefore, it is important to use the dust collecting device according to the present invention.
Hereinafter, a more specific embodiment of the resin molding apparatus and the method for producing a resin molded article according to the present invention will be described with reference to fig. 1 to 4.
The resin molding apparatus of the present embodiment includes a resin material supply unit 10 shown in fig. 1, a compression molding unit 20 (described below) having a mold clamping device and the like. First, the configuration and operation of the resin material supply unit 10 will be described.
The resin material supply part 10 has a 1 st housing part 111 and a 2 nd housing part 112 that house the resin material P.
The 1 st housing part 111 has a 1 st upper opening 121 and an opening/closing cover 1211 for opening and closing the 1 st upper opening 121 in an upper part thereof, and has a 1 st lower opening 131 in a part of a lower part thereof. Further, a 1 st vibration applying portion 141 that applies vibration to the 1 st housing portion 111 is in contact with the 1 st housing portion 111.
The 2 nd accommodating portion 112 is disposed below the 1 st lower opening 131, and has a 2 nd upper opening 122 at a position facing the 1 st lower opening 131, and a 2 nd lower opening 132 at a part of the lower portion. The 2 nd receiving portion 112 has a resin material supply path 1121 extending substantially horizontally from directly below the 2 nd upper opening 122, and has a 2 nd lower opening 132 at an outlet of the resin material supply path 1121. Further, the 2 nd accommodating portion 112 has a 2 nd vibration applying portion 142 in contact with a position right below the 2 nd upper opening 122 in a lower portion thereof, and has a measuring portion 15 below the 2 nd vibration applying portion 142. The 2 nd vibration applying unit 142 applies vibration to the 2 nd accommodating portion 112 (particularly, the resin material supply path 1121), and the measuring unit 15 measures the mass of the resin material in the 2 nd accommodating portion 112.
The resin material supply unit 10 further includes a resin material transfer tray moving mechanism 16 for disposing the resin material transfer tray T below the 2 nd lower opening 132.
The resin material supply unit 10 further includes: an upper cover 171 covering the upper sides of the 1 st and 2 nd receiving parts 111 and 112; and a lower cover 172 for covering a path below the 2 nd lower opening 132 of the 2 nd accommodating portion 112 and through which the resin material P falls from the 2 nd lower opening 132 to the resin material transfer tray T. Gaps are provided between the upper cover 171 and the 2 nd receiving portion 112 and between the lower cover 172 and the 2 nd receiving portion 112 to prevent the vibrations applied to the 2 nd receiving portion 112 by the 2 nd vibration applying portion 142 from being transmitted to the covers. For the same reason, a gap is provided between the upper cover 171 and the 1 st housing section 111.
The upper cover 171 and the lower cover 172 each cover a part of the 2 nd receiving portion 112, and thus correspond to the 2 nd receiving portion cover. The upper cover 171 covers not only the 2 nd receiving portion 112 but also the 1 st receiving portion 111, and thus corresponds to the 1 st receiving portion cover.
One end of the 1 st suction tube 181 is connected to the 1 st connection portion 1711 of the upper cover 171, and one end of the 2 nd suction tube 182 is connected to the 2 nd connection portion 1721 of the lower cover 172. The other end of the 1 st suction tube 181 and the other end of the 2 nd suction tube 182 are both connected to a dust collector (suction device) 18. Shortest path L between 1 st connecting part 1711 and 2 nd accommodating part 11212Slightly longer than the shortest path L between the 1 st connecting part 1711 and the 1 st lower opening 13111And is longer than the shortest path L between the 2 nd connecting portion 1721 and the 2 nd lower opening 1322. Here, the 1 st suction tube 181 is included in the configuration of the 1 st housing-side dust collecting device, and the 2 nd suction tube 182 is included in the configuration of the dust collecting device (example 1) and the 2 nd housing-side dust collecting device (aspect 2). Hereinafter, for the sake of simplicity, the dust collecting device of example 1 is also referred to as "2 nd housing part side dust collecting device" as in the case of the 2 nd aspect. The dust collector 18 is a component common to the 1 st housing part side dust collecting device and the 2 nd housing part side dust collecting device. Further, a dust collector may be provided in each of the 1 st and 2 nd accommodating section dust collecting devices.
The 1 st suction pipe 181 is provided with a 1 st suction force adjustment portion 1811 as a constituent element of the 1 st housing-side dust collecting device, and the 2 nd suction pipe 182 is provided with a 2 nd suction force adjustment portion 1821 as a constituent element of the 2 nd housing-side dust collecting device. The 1 st suction force adjustment portion 1811 and the 2 nd suction force adjustment portion 1821 have the same configuration, and as shown in fig. 2, a base 184 having a flat tube wall of the 1 st suction tube 181 (the 2 nd suction tube 182) has a suction force adjustment portion opening 185 and a movable cover 186 that slidably adjusts the opening area of the suction force adjustment portion opening 185 along the suction force adjustment portion opening 185. The movable cover 186 is formed of 2 plate-like members, and 2 slits 1861 are provided along the sliding direction. On the tube wall of the 1 st suction tube 181 (2 nd suction tube 182), 2 sets of 2 bolts 1862, each set of 2 bolts having 1, are attached so as to sandwich the suction force adjustment portion opening 185 by the 2 sets. The movable cap 186 is attached to the 1 st suction tube 181 (the 2 nd suction tube 182) by inserting the 2 slits 1861 of the 1-piece plate-shaped member into the 1 st set of bolts 1862. The opening area of the suction force adjustment portion opening 185 is adjusted as described above by the movement of the 2-piece plate-like member in the direction in which the cutout 1861 extends. In the present embodiment, the movable lid 186 is moved manually by the user, but may be moved by power of a motor or the like. In the case of using such power, the opening area of the suction force adjustment portion opening 185 may be controlled by the control portion 19.
The dust collector 18 is connected to not only the 1 st suction tube 181 and the 2 nd suction tube 182 but also the 3 rd suction tube 183. The 3 rd suction tube 183 is a flexible tube having flexibility in a part thereof, and is provided with a suction port 1831 at a tip end thereof, which is not connected to a component of the resin molding apparatus including the resin material supply unit 10. A user of the resin molding apparatus can move the suction port 1831 to a desired position in the resin molding apparatus while bending the flexible tube, and suck and remove dirt present at the desired position from the suction port 1831 through the 3 rd suction tube 183 to the dust collector 18.
The resin material supply unit 10 is provided with a control unit 19 that controls the operation of the entire resin material supply unit 10.
The operation of the resin material supply unit 10 will be described.
Before starting to supply the granular resin material P to the resin material transfer tray T, a sufficient amount of the resin material P is supplied from the 1 st upper opening 121 into the 1 st accommodating portion 111, and the dust collector 18 is started to start suction in the upper cover 171 and the lower cover 172. Here, the opening area of the suction force adjustment opening 185 of the 2 nd suction force adjustment portion 1821 is adjusted so that the suction force of the dust collector 18 sucking the inside of the lower cover 172 from the 2 nd connection portion 1721 becomes the non-suction resin according to the particle diameter or material of the resin material particles supplied to the resin material transfer tray T and the particle diameter of the fine powder of the particles adhering to the resin materialThe particles of material attract the dust of the micropowder. This adjustment may be performed by performing a simple preliminary experiment in advance using a resin material to be actually used, and based on the result. On the other hand, the shortest path L between the 1 st connecting part 1711 and the 2 nd accommodating part 11212Longer than the shortest path L between the 2 nd connecting portion 1721 and the 2 nd lower opening 1322Therefore, the suction force of the dust collector 18 for sucking the inside of the upper cover 171 from the 1 st connecting portion 1711 may be stronger than the suction force for sucking the inside of the lower cover 172 from the 2 nd connecting portion 1721, but it is needless to say that the suction force is not so strong as to suck the fine powder dust from the particles of the resin material.
In this way, the following operations are performed while the interior of the upper cover 171 and the lower cover 172 is sucked by the dust collector 18. First, the resin material transfer tray T is moved by the resin material transfer tray moving mechanism 16 so as to be disposed below the 2 nd lower opening 132. Next, vibration is applied to the 1 st housing part 111 from the 1 st vibration applying part 141, whereby the resin material P housed in the 1 st housing part 111 falls from the 1 st lower opening 131, which is an outlet of the 1 st housing part 111, and is supplied into the 2 nd housing part 112 from the 2 nd upper opening 122. At this time, dust formed of fine particles adhering to the resin material P particles is scattered between the 1 st lower opening 131 and the 2 nd upper opening 122. The dust moves toward the 1 st connecting portion 1711 by the suction of the dust collector 18 in the upper cover 171, and is collected by the dust collector 18 through the 1 st suction pipe 181. Therefore, the leakage of dust from the gap between the upper cover 171 and the 1 st housing part 111 can be suppressed.
At the time point when a larger amount of the resin material P than the amount to be supplied to the resin material transfer tray T is supplied into the 2 nd accommodating portion 112, the 1 st vibration applying portion 141 stops applying the vibration to the 1 st accommodating portion 111, thereby temporarily stopping the supply of the resin material into the 2 nd accommodating portion 112.
Next, vibration is applied to the 2 nd accommodating portion 112 from the 2 nd vibration applying portion 142, whereby the resin material P accommodated in the 2 nd accommodating portion 112 is gradually dropped from the 2 nd lower opening 132 to the resin material transfer tray T. During this time, the resin material transfer tray moving mechanism 16 moves the resin material transfer tray T in a substantially horizontal direction, thereby supplying the resin material P into the resin material transfer tray T with a uniform thickness.
While the 2 nd receiving portion 112 is being vibrated by the 2 nd vibration applying portion 142, the resin material P in the 2 nd receiving portion 112 is measured by the measuring portion 15, and the 2 nd vibration applying portion 142 stops applying vibration to the 2 nd receiving portion 112 at a time point when the amount of the resin material P in the 2 nd receiving portion 112 decreases by the amount to be supplied to the resin material transfer tray T. Thereby, the resin material P is supplied in an amount just enough to be supplied, and the supply of the resin material P to the resin material transfer tray T is completed.
While the resin material P is supplied to the resin material transfer tray T in this manner, the dust formed of the fine powder particles is scattered upward and downward in the vicinity of the 2 nd lower opening 132. The dust scattered above the 2 nd lower opening 132 moves toward the 1 st connecting portion 1711 by the suction of the dust collector 18 in the upper cover 171, and is collected by the dust collector 18 through the 1 st suction pipe 181. On the other hand, the dust scattered to the lower side of the 2 nd lower opening 132 moves toward the 2 nd connecting portion 1721 by the suction of the dust collector 18 in the lower cover 172, and is collected by the dust collector 18 through the 2 nd suction pipe 182.
Here, the dust generated in the internal space of the upper cover 171 is mainly dust scattered when the resin material P is dropped from the 1 st storage part 111 and supplied into the 2 nd storage part 112. Since the resin material is not metered into the 1 st housing section 111, the amount of the resin material supplied per unit time is relatively large, and thus relatively large amounts of dust are scattered into the internal space of the upper cover 171. The resin material P is supplied from the 1 st storage part 111 to the 2 nd storage part 112 before being measured. Therefore, since the internal space of the upper cover 171 is sucked by a relatively strong suction force, the amount of resin actually used for resin molding is not affected, and dust contamination can be efficiently reduced. On the other hand, the dust collected by sucking the internal space of the lower cover 172 is dust scattered when the resin material P is dropped from the 2 nd lower opening 132 of the 2 nd accommodating portion 112 and supplied into the resin material transfer tray T. Since the resin material is metered in the 2 nd storage part 112, the amount of the resin material supplied per unit time is smaller than that of the 1 st storage part 111, and thus the amount of the dust scattered into the internal space of the lower cover 172 is smaller than that of the internal space of the upper cover 171. Further, since the resin material P is metered at the stage of being supplied from the 2 nd storage portion 112 into the resin material transfer tray T, if the internal space of the lower cover 172 is sucked by a relatively strong suction force, the amount of resin actually used for resin molding may be affected. Therefore, in order to collect only dust contaminating the surroundings as much as possible without affecting the amount of resin actually used for resin molding, the suction force to the internal space of the 2 nd housing cover is set to be weaker than the suction force to the internal space of the 1 st housing cover.
The resin material transfer tray T supplied with the resin material P is carried out from below the lower opening 132 of the second mold 2 by the resin material transfer tray moving mechanism 16, and is transferred to the compression molding unit 20. Next, the resin material transfer tray moving mechanism 16 then moves the resin material transfer tray T supplied with the resin material P below the 2 nd lower opening 132. Thereafter, the resin material P is supplied to the resin material transfer tray T by the same operation as described above.
The compression molding section 20 is the same as a compression molding section of a conventional resin molding apparatus, and the configuration and operation will be briefly described below with reference to fig. 3.
The compression molding section 20 has tie bars (tie bars) 22 (4 in total) standing on each of the four corners of the lower fixed plate 211, and a rectangular upper fixed plate 212 provided near the upper ends of the tie bars 22. A rectangular movable presser (plate) 23 is provided between the lower fixed disk 211 and the upper fixed disk 212. The movable platen 23 has holes through which the links 22 pass at four corners, and is movable up and down along the links 22. A mold clamping device 24, which is a device for moving the movable platen 23 up and down, is provided on the lower fixed platen 211.
A lower heater 251 is disposed on the upper surface of the movable platen 23, and a lower mold LM is provided above the lower heater 251. The lower mold LM is provided with a mold release film coating device 26. The mold release film coating device 26 covers the inner surface of the cavity MC by applying a mold release film to the upper surface of the cavity MC and then sucking the mold release film through a suction port (not shown) provided in the inner surface of the cavity MC.
An upper heater 252 is disposed on a lower surface of the upper fixed tray 212, and an upper mold UM is mounted below the upper heater 252. On the lower surface of the upper mold UM, a substrate S on which a semiconductor chip is mounted may be mounted.
The operation of the compression molding section 20 is as follows. First, the substrate S on which the semiconductor chip is mounted on the lower surface of the upper mold UM by a substrate moving mechanism (not shown). At the same time, the release film is stretched on the inner surface of the cavity MC of the lower mold LM by the release film coating device 26. Next, as described above, the resin material feeding tray T to which the resin material P is fed is disposed directly above the lower mold LM in the resin material feeding unit 10, and the shutter provided at the bottom of the resin material feeding tray T is opened, whereby the resin material P in the resin material feeding tray T is fed into the cavity MC. The order of supplying the resin material P to the upper mold UM and the lower mold LM may be reversed.
In this state, the resin material P in the cavity MC is softened by heating with the lower heater 251, and the substrate S is heated with the upper heater 252. In a state where the resin material P and the substrate S are heated, the movable platen 23 is raised by the mold clamping device 24 to clamp the molding dies (the upper die UM and the lower die LM) and cure the resin material P. After the resin material P is cured, the movable platen 23 is lowered by the mold clamping device 24 to open the mold. Thus, a resin-sealed product (resin molded product) in which the semiconductor chip is resin-sealed is obtained. The resin-sealed product thus obtained can be smoothly released from the lower mold LM because the inner surface of the lower mold LM is covered with the release film.
Another embodiment of the resin molding apparatus of the present invention will be described with reference to fig. 4. The resin molding apparatus 30 of the present embodiment includes a material receiving module 31, a molding module 32, and a discharging module 33. The material receiving module 31 is a device for receiving the resin material P and the substrate S from the outside and sending them to the molding module 32, and includes the resin material supply unit 10 and a substrate receiving unit 311. The 1 molding module 32 has 1 set of the compression molding parts 20 described above. In fig. 4, 3 molding modules 32 are shown, but any number of molding modules 32 may be provided in the resin molding apparatus 30. Further, the molding modules 32 can be increased or decreased even after the assembled resin molding apparatus 30 is put into use. The discharge module 33 carries in and holds the resin molded product manufactured by the molding module 32 from the molding module 32, and has a resin molded product holding portion 331.
A main conveyance device 36 for conveying the substrate S, the resin material transfer tray T, and the resin molded product is provided so as to penetrate the material receiving module 31, the one or more molding modules 32, and the discharge module 33. The resin material transfer tray moving mechanism 16 is a part of the main conveyance device 36. In each module, a sub-conveyor 37 for conveying the substrate S, the resin material transfer tray T, and the resin molded product is provided between the main conveyor 36 and the devices in the module.
The resin molding apparatus 30 includes a power supply and a control unit (both not shown) for operating the modules.
The operation of the resin molding apparatus 30 will be described. The substrate S is held by the user at the substrate receiving portion 311 of the material receiving module 31. The main and sub-conveying devices 36 and 37 convey the substrate S from the substrate receiving section 311 to 1 compression molding section 20 in the molding module 32, and mount the substrate S on an upper mold UM of the compression molding section 20. Next, the main conveyor 36 and the sub conveyor 37 carry the resin material transfer tray T into the resin material supply unit 10. The resin material supply section 10 supplies the resin material P to the resin material transfer tray T as described above. The main and sub-conveying devices 36 and 37 convey the resin material transfer tray T supplied with the resin material P to the compression molding section 20 of the molding module 32 for mounting the substrate S on the upper mold UM, and after the resin material transfer tray T is disposed on the lower mold LM of the compression molding section 20, the resin material P is supplied from the resin material transfer tray T to the cavity MC of the lower mold LM. Thereafter, the resin material transfer tray T is carried out of the compression molding unit 20 by the main conveyor 36 and the sub conveyor 37, and then compression molding is performed in the compression molding unit 20. While the compression molding is performed in the compression molding section 20, the same operation as before is performed on the other compression molding sections 20, and thus the compression molding can be performed in parallel while shifting the timing among the plurality of compression molding sections 20. The resin molded product obtained by the compression molding is carried out of the compression molding section 20 by the main conveyor 36 and the sub conveyor 37, and carried into and held by the resin molded product holding section 331 of the discharge module 33. The user can suitably take out the resin molded product from the resin molded product holding portion 331.
The present invention is not limited to the above embodiments, and various modifications can be made.
Claims (9)
1. A resin molding apparatus, comprising:
a 1 st container for containing a granular or powdery resin material;
a 1 st housing part cover surrounding the 1 st housing part;
a 2 nd accommodating unit that receives and temporarily accommodates the resin material accommodated in the 1 st accommodating unit, and drops the resin material from an outlet of the resin material supply passage through the resin material supply passage while measuring the resin material;
a 2 nd housing part cover surrounding the 2 nd housing part including an outlet of the resin material supply passage; and
and a dust collecting device with variable suction force, which sucks the dust in the internal space of the 1 st accommodating part cover by a 1 st suction force and sucks the dust in the internal space of the 2 nd accommodating part cover by a 2 nd suction force weaker than the 1 st suction force.
2. The resin molding apparatus according to claim 1, wherein the dust collecting device includes:
a suction device which sucks air;
a suction tube connecting the suction device to an internal space of the 2 nd housing portion cover;
an opening provided in the suction tube; and
and a movable cover which is provided in the opening and which adjusts the opening area of the opening by the position of the cover.
3. A resin molding apparatus, comprising:
a 1 st container for containing a granular or powdery resin material;
a 2 nd accommodating unit that receives and temporarily accommodates the resin material accommodated in the 1 st accommodating unit, and drops the resin material from an outlet of the resin material supply passage through the resin material supply passage while measuring the resin material;
a 2 nd housing part cover surrounding the 2 nd housing part including an outlet of the resin material supply passage; and
a dust collecting device with variable suction force, which sucks the dust in the inner space of the 2 nd accommodating part cover;
a 1 st housing part outlet which is a resin material outlet provided in the 1 st housing part and through which the resin material housed in the 2 nd housing part is supplied;
a 1 st housing part cover surrounding the 1 st housing part including the 1 st housing part outlet; and
and a 1 st accommodating part side dust collecting device for sucking the dust in the internal space of the 1 st accommodating part cover.
4. The resin molding apparatus according to claim 3, wherein a suction force with which the dust collecting device sucks the dust in the internal space of the 2 nd housing part cover is weaker than a suction force with which the dust in the internal space of the 1 st housing part cover is sucked by the 1 st housing part side dust collecting device.
5. A resin molding apparatus, comprising:
a 1 st container for containing a granular or powdery resin material;
a 2 nd accommodating unit that receives and temporarily accommodates the resin material accommodated in the 1 st accommodating unit, and drops the resin material from an outlet of the resin material supply passage through the resin material supply passage while measuring the resin material;
a 1 st housing part outlet which is a resin material outlet provided in the 1 st housing part and through which the resin material housed in the 2 nd housing part is supplied;
a 1 st housing part cover surrounding the 1 st housing part including the 1 st housing part outlet;
a 2 nd housing part cover surrounding the 2 nd housing part including an outlet of the resin material supply passage;
a 1 st accommodating part side dust collecting device for sucking the dust in the internal space of the 1 st accommodating part cover by a 1 st suction force; and
and a 2 nd accommodating part side dust collecting device for sucking the dust in the inner space of the 2 nd accommodating part cover by a 2 nd suction force weaker than the 1 st suction force.
6. The resin molding apparatus according to claim 5, wherein the 2 nd housing part side dust collecting device includes:
a suction device which sucks air;
a suction tube connecting the suction device to an internal space of the 2 nd housing portion cover;
an opening provided in the suction tube; and
and a movable cover which is provided in the opening and which adjusts the opening area of the opening by the position of the cover.
7. A resin molding apparatus as defined in any one of claims 1 to 6, comprising a vibration applying section for applying vibration to the resin material supply passage.
8. A resin molding apparatus, comprising:
a 1 st container for containing a granular or powdery resin material;
a 2 nd accommodating unit that receives and temporarily accommodates the resin material accommodated in the 1 st accommodating unit, and drops the resin material from an outlet of the resin material supply passage through the resin material supply passage while measuring the resin material;
a 2 nd housing part cover surrounding the 2 nd housing part including an outlet of the resin material supply passage; and
a dust collecting device with variable suction force, which sucks the dust in the inner space of the 2 nd accommodating part cover;
and a vibration applying section for applying vibration to the resin material supply passage.
9. A method for producing a resin molded article, comprising:
a resin material supply step of supplying a granular or powdery resin material to a resin material transfer tray, then moving the resin material transfer tray to a molding die, and supplying the resin material in the resin material transfer tray to the molding die; and
a resin molding step of clamping a mold to which the resin material is supplied, and performing resin molding; the method is characterized in that:
in the above-mentioned resin material supplying step,
a granular or powdery resin material is accommodated in a 1 st accommodating part, the resin material accommodated in the 1 st accommodating part is received and temporarily accommodated by a 2 nd accommodating part, and the resin material is supplied to the resin material transfer tray through a resin material supply passage while being metered,
while the resin material is being supplied from the 2 nd accommodating part to the resin material transfer tray, the dust in the internal space of the 1 st accommodating part cover surrounding the 1 st accommodating part is sucked by the 1 st suction force, and the dust in the internal space of the 2 nd accommodating part cover surrounding the 2 nd accommodating part including the outlet of the resin material supply passage is sucked by the 2 nd suction force weaker than the 1 st suction force.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-161420 | 2016-08-19 | ||
| JP2016161420A JP6212609B1 (en) | 2016-08-19 | 2016-08-19 | Resin molding apparatus and resin molded product manufacturing method |
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| Publication Number | Publication Date |
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| CN107756707A CN107756707A (en) | 2018-03-06 |
| CN107756707B true CN107756707B (en) | 2020-02-28 |
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| CN201710713650.4A Active CN107756707B (en) | 2016-08-19 | 2017-08-18 | Resin molding apparatus and method for manufacturing resin molded product |
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| Country | Link |
|---|---|
| JP (1) | JP6212609B1 (en) |
| KR (1) | KR102053968B1 (en) |
| CN (1) | CN107756707B (en) |
| TW (1) | TWI680044B (en) |
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| JP6923423B2 (en) * | 2017-11-21 | 2021-08-18 | Ｔｏｗａ株式会社 | Manufacturing method of transport equipment, resin molding equipment and resin molded products |
| JP6894403B2 (en) * | 2018-05-24 | 2021-06-30 | Ｔｏｗａ株式会社 | Resin molding equipment and manufacturing method of resin molded products |
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- 2017-08-03 KR KR1020170098564A patent/KR102053968B1/en active IP Right Grant
- 2017-08-18 CN CN201710713650.4A patent/CN107756707B/en active Active
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Also Published As
| Publication number | Publication date |
|---|---|
| JP6212609B1 (en) | 2017-10-11 |
| CN107756707A (en) | 2018-03-06 |
| TW201806725A (en) | 2018-03-01 |
| TWI680044B (en) | 2019-12-21 |
| JP2018027670A (en) | 2018-02-22 |
| KR20180020884A (en) | 2018-02-28 |
| KR102053968B1 (en) | 2019-12-10 |
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