CN107756707A - Resin molding apparatus and resin forming product manufacture method - Google Patents
Resin molding apparatus and resin forming product manufacture method Download PDFInfo
- Publication number
- CN107756707A CN107756707A CN201710713650.4A CN201710713650A CN107756707A CN 107756707 A CN107756707 A CN 107756707A CN 201710713650 A CN201710713650 A CN 201710713650A CN 107756707 A CN107756707 A CN 107756707A
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- China
- Prior art keywords
- resin material
- resettlement section
- mentioned
- resin
- dust
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- 239000011347 resin Substances 0.000 title claims abstract description 381
- 229920005989 resin Polymers 0.000 title claims abstract description 381
- 238000000465 moulding Methods 0.000 title claims abstract description 52
- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 317
- 239000000428 dust Substances 0.000 claims abstract description 101
- 238000012546 transfer Methods 0.000 claims description 74
- 238000007493 shaping process Methods 0.000 claims description 33
- 150000002148 esters Chemical class 0.000 claims description 11
- 230000009931 harmful effect Effects 0.000 abstract description 2
- 238000000748 compression moulding Methods 0.000 description 24
- 239000000758 substrate Substances 0.000 description 19
- 239000002245 particle Substances 0.000 description 12
- 239000000843 powder Substances 0.000 description 11
- 238000005259 measurement Methods 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 239000002023 wood Substances 0.000 description 5
- 239000007888 film coating Substances 0.000 description 4
- 238000009501 film coating Methods 0.000 description 4
- 239000012260 resinous material Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 208000019901 Anxiety disease Diseases 0.000 description 1
- 208000036829 Device dislocation Diseases 0.000 description 1
- 230000036506 anxiety Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B13/00—Conditioning or physical treatment of the material to be shaped
- B29B13/10—Conditioning or physical treatment of the material to be shaped by grinding, e.g. by triturating; by sieving; by filtering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C2037/96—Filters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
- B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Abstract
The present invention relates to a kind of resin molding apparatus and resin forming product manufacture method, resin molding apparatus can be reduced from the harmful effect caused by dust caused by resin material.Resin molding apparatus has：1st resettlement section, it houses graininess or powdered resin material；2nd resettlement section, it receives and temporarily housed the resin material being housed in the 1st resettlement section, and metering is carried out to the resin material while making it be fallen via resin material supply passageway from the outlet of the resin material supply passageway (the 2nd lower openings)；(upper lid, lower cover) is covered in 2nd resettlement section, and it is enclosed in around the 2nd resettlement section of the outlet comprising above-mentioned resin material supply passageway；And the dust collect plant (precipitron, the 1st suction tube, the 2nd suction tube, the 1st attraction adjustment portion and the 2nd attraction adjustment portion) that attraction is variable, it attracts the dust of the inner space of above-mentioned 2nd resettlement section cover.
Description
Technical field
The present invention relates to a kind of close to manufacture the resin for forming the electronic components such as semiconductor chip progress resin seal
The resin molding apparatus and resin forming product manufacture method of the resin forming products such as envelope product.
Background technology
To protect the influence of the electronic component not environment such as light, heat, moisture, and electronic component is typically carried out by resin close
Envelope.In the method for resin seal, compression forming method or transfer forming process etc. be present.Compression forming method use is by lower mould and upper mould institute
The shaping dies of composition, and resin material is supplied to the die cavity of lower mould, by the substrate for being provided with electronic component be arranged on upper mould it
Afterwards, while carrying out heating while by both locked modes to lower mould and upper mould, thus, it is formed.Transfer forming process installs substrate
After the die cavity of one of upper mould and lower mould, while lower mould and upper mould are carried out heating on one side will both locked modes, utilize post
Resin is pressed into die cavity by plug, thus, is formed.Following problem is produced in forming process is transferred, not only a part for resin
Remain in from plunger and resin is delivered in the path of die cavity and produces waste, and cause semiconductor substrate because of resin flowing or match somebody with somebody
Line loss is hindered, so, compression forming method turns into main flow in recent years.
In compression molding, it is however generally that, as the resin material of supply to lower mould, according to maneuverable aspect, make
With particulate resins material or powdered resinous material." particulate resins material " and " powdered resinous material " have no sternly herein
The definition of lattice, but be in general that 0.1~3.0mm person is referred to as particulate resins material by particle diameter, particle diameter is not claimed up to 0.1mm person
For powdered resinous material.It is to make mould in shaping when using the situation of particulate resins material or powdered resinous material
The flowing of intracavitary resin material is reduced, and must be supplied resin material as equally as possible to the die cavity of lower mould.In patent
In compression molding apparatuss described in document 1, from resin material supply unit by resin material with uniform thickness supply to mould
Corresponding to the shape of chamber resin material transfer disk after, make resin material transfer disk be moved to be arranged on clamping mechanism lower mould it
On, and the baffle plate for the bottom for being arranged on resin material transfer disk is opened, thus resin material is supplied to the die cavity of lower mould.
In the compression molding apparatuss described in patent document 2, set mold release film in the bottom of resin material transfer disk and substitute setting
Baffle plate, and as described above by the resin material for being supplied to resin material transfer disk be transferred on lower mould after, from lower mould
Side attracts mold release film, thus the resin material that resin material is transferred in disk is directed into the die cavity of lower mould.
Disk is transferred for resin material is supplied to resin material, the powder supply for example described in patent document 3 can be used
Device.In addition, resin material is not limited to using various powders as object in patent document 3, but below by graininess or powder
The resin material of last shape illustrates as object.There are the device 2 resettlement sections for housing resin material (to be set to " the 1st collecting
Portion " and " the 2nd resettlement section ").1st resettlement section is configured on the 2nd resettlement section, and the configuration of the 2nd resettlement section is in supply resin material
On the container (herein be resin material transfer disk) of object, by resin material from the 1st resettlement section via the 2nd resettlement section supply to
Resin material transfers disk.The 1st vibration assigning unit that vibration is assigned to the 1st resettlement section is connected with the 1st resettlement section, is similarly existed
2nd resettlement section is connected with the 2nd vibration assigning unit that vibration is assigned to the 2nd resettlement section.In addition, in the 2nd resettlement section, meter is provided with
Amount is housed in the measurement unit of the resin material of the 2nd resettlement section.
Action to the powder supply device illustrates.First, by resin material transfer disk configuration in the 2nd resettlement section
Bottom.Then, in the state of the resin material sufficiently measured is housed in into the 1st resettlement section, from the 1st vibration assigning unit to the 1st
Resettlement section assigns vibration.Thus, the resin material for being housed in the 1st resettlement section slowly falls to the 2nd resettlement section.Compared to should
Supply to the resin material of the fully more amount of the amount of resin material transfer disk and supply to the time point of the 2nd resettlement section, stop from the 1st
Vibrate assigning unit and the 1st resettlement section is assigned and vibrate, thus stop supplying resin material to the 2nd resettlement section.
Then, the 2nd resettlement section is assigned from the 2nd vibration assigning unit and vibrated.Thus, it is housed in the resinous wood of the 2nd resettlement section
Material is slowly fallen, and is continuously fed to resin material and is transferred disk.During this period, with by making resin material transfer disk substantially
Moved in horizontal direction, and resin material is adjusted in a manner of uniform thickness is supplied to resin material transfer disk.
At the same time, measurement unit measures the resin material in the 2nd resettlement section.Then, the resin material in the 2nd resettlement section, which reduces, answers
The time point of the amount to resin material transfer disk is supplied, the 2nd vibration assigning unit, which stops assigning the 2nd resettlement section, to be vibrated.Thus, will
Just the resin material of the amount for that should supply supplies to resin material and transfers disk.
Background technology document patent document
Patent document 1：Japanese Unexamined Patent Publication 2007-125783 publications
Patent document 2：Japanese Unexamined Patent Publication 2010-036542 publications
Patent document 3：Japanese Unexamined Patent Publication 09-005148 publications
The content of the invention
Invent the problem to be solved
When powdered resin material is supplied to resin material transfer disk from resin material supply unit, by the 1st vibration
Assigning unit or the 2nd vibration assigning unit are assigned to resin material and vibrated, and thus, dust are produced by a part for resin material.
In addition, also when granular resin material is supplied to resin material transfer disk from resin material supply unit, because granular
Powder is attached to the surface of each particle during the making of resin material, therefore produces dust in the same manner as powdered resin material.
The of the invention problem to be solved be to provide it is a kind of reduce from caused by dust caused by resin material not
The resin molding apparatus and resin forming product manufacture method of good influence.
Solves the technological means of problem
It is characterized by solve the 1st example of the resin molding apparatus of the invention that above-mentioned problem is completed：
1st resettlement section, it houses graininess or powdered resin material；
2nd resettlement section, it receives and temporarily housed the resin material for being housed in above-mentioned 1st resettlement section, and to the resin
Material carries out metering while making it be fallen via resin material supply passageway from the outlet of the resin material supply passageway；
2nd resettlement section is covered, and it is enclosed in the week of above-mentioned 2nd resettlement section of the outlet comprising above-mentioned resin material supply passageway
Enclose；And
The variable dust collect plant of attraction, it attracts the dust of the inner space of above-mentioned 2nd resettlement section cover.
2nd aspect of the resin molding apparatus of the present invention is characterized by：
1st resettlement section, it houses graininess or powdered resin material；
2nd resettlement section, it receives and temporarily housed the resin material for being housed in above-mentioned 1st resettlement section, and to the resin
Material carries out metering while making it be fallen via resin material supply passageway from the outlet of the resin material supply passageway；
1st resettlement section exports, its be arranged on above-mentioned 1st resettlement section be housed in above-mentioned 2nd resettlement section to supply
Resin material resin material outlet；
1st resettlement section is covered, and it is enclosed in around above-mentioned 1st resettlement section comprising the outlet of above-mentioned 1st resettlement section；
2nd resettlement section is covered, and it is enclosed in the week of above-mentioned 2nd resettlement section of the outlet comprising above-mentioned resin material supply passageway
Enclose；
1st resettlement section side dust collect plant, it is with the dust of the 1st inner space for attracting the above-mentioned 1st resettlement section cover of gravitational attraction；
And
2nd resettlement section side dust collect plant, it attracts gravitational attraction the above-mentioned 2nd to house with more above-mentioned 1st attraction the weaker 2nd
The dust of the inner space of portion's cover.
1st example of the resin forming product manufacture method of the present invention has：Resin material supplying step, by graininess or powder
The resin material of last shape is supplied to resin material transfer disk, resin material transfer disk is moved to shaping dies, by this
Resin material in resin material transfer disk is supplied to the shaping dies；And ester moulding step, the resin material will be supplied to
Shaping dies locked mode, carry out ester moulding；The resin forming product manufacture method is characterised by：
In above-mentioned resin material supplying step,
Graininess or powdered resin material are housed in the 1st resettlement section, is received by the 2nd resettlement section and temporarily houses quilt
The resin material of the 1st resettlement section is housed in, and metering is carried out to the resin material while it is supplied via resin material
Supplied to path to above-mentioned resin material and transfer disk,
During above-mentioned resin material is supplied to above-mentioned resin material transfer disk from above-mentioned 2nd resettlement section, to being enclosed in
The inner space of the 2nd resettlement section cover around above-mentioned 2nd resettlement section of outlet comprising above-mentioned resin material supply passageway
Dust, is not attracted with above-mentioned resin material and attraction that the dust is attracted is attracted.
2nd aspect of the resin forming product manufacture method of the present invention has：Resin material supplying step, by graininess or powder
The resin material of last shape is supplied to resin material transfer disk, resin material transfer disk is moved to shaping dies, by this
Resin material in resin material transfer disk is supplied to the shaping dies；And ester moulding step, the resin material will be supplied to
Shaping dies locked mode, carry out ester moulding；The resin forming product manufacture method is characterised by：
In above-mentioned resin material supplying step,
Graininess or powdered resin material are housed in the 1st resettlement section, is received by the 2nd resettlement section and temporarily houses quilt
The resin material of the 1st resettlement section is housed in, and metering is carried out to the resin material while it is supplied via resin material
Supplied to path to above-mentioned resin material and transfer disk,
During above-mentioned resin material is supplied to above-mentioned resin material transfer disk from above-mentioned 2nd resettlement section, attract with the 1st
The dust of the inner space for the 1st resettlement section cover that gravitational attraction is surrounded around above-mentioned 1st resettlement section, and inhaled with the more above-mentioned 1st
The weaker 2nd attraction gravitational attraction of gravitation is enclosed in above-mentioned 2nd resettlement section of the outlet comprising above-mentioned resin material supply passageway
The dust of the inner space of the 2nd resettlement section cover of surrounding.
The effect of invention
It can be reduced by the present invention from the harmful effect caused by dust caused by resin material.
Brief description of the drawings
Fig. 1 is the vertical section of an embodiment of the resin material supply unit in the resin molding apparatus of the display present invention
Figure.
Fig. 2 is the front view of the attraction adjustment portion in the resin material supply unit of display present embodiment.
Fig. 3 is the schematic diagram of an example in display compression molding portion.
Fig. 4 is showing for the example of resin molding apparatus of the display with material receiving module, shaping module and discharge module
It is intended to.
10：Resin material supply unit
111：1st resettlement section
112：2nd resettlement section
1121：Resin material feed path
121：1st upper opening
1211：Open-close lid
122：2nd upper opening
131：1st lower openings
132：2nd lower openings
141：1st vibration assigning unit
142：2nd vibration assigning unit
15：Measurement unit
16：Resin material transfer disk travel mechanism
171：Upper lid
1711：1st connecting portion
172：Lower cover
1721：2nd connecting portion
18：Precipitron (suction device)
181：1st suction tube
1811：1st attraction adjustment portion
182：2nd suction tube
1821：2nd attraction adjustment portion
183：3rd suction tube
1831：Suction port
184：Basal part
185：Attraction adjustment portion opening
186：Movable cover
1862：Bolt
19：Control unit
20：Compression molding portion
211：Bottom fixed disk
212：Top fixed disk
22：Connecting rod
23：Movable pressure plate
24：Clamping apparatus
251：Lower heater
252：Upper portion heater
26：Mold release film coating device
30：Resin molding apparatus
31：Material receiving module
311：Substrate acceptance division
32：Shaping module
33：Discharge module
331：Resin forming product maintaining part
36：Main carrying device
37：Secondary carrying device
L11：Shortest path
L12：Shortest path
L2：Shortest path
LM：Lower mould
UM：Upper mould
MC：Die cavity
P：Resin material
S：Substrate
T：Resin material transfers disk.
Embodiment
According to the resin molding apparatus of the 1st and the 2nd of the present invention the aspect, in the outlet of above-mentioned resin material supply passageway
Underface is configured with the state of resin material transfer disk, resin material is fallen from the outlet, is thus supplied resin material
Disk is transferred to resin material.Now, be enclosed in the outlet comprising resin material supply passageway by the 2nd resettlement section cover the 2nd houses
After around portion, attract the dust of the inner space of the 2nd resettlement section cover using dust collect plant, thus can prevent from going out from this
Mouth is supplied to dust near the resin material transfer disk of resin material and dispersed.
If dust disperses near resin material transfer disk, the powder from resin material is attached to resin material shifting
Send disk.Consequently, it is possible to when the resin material in by resin material transfer disk is directed into the die cavity of lower mould, the powder moving is extremely
Shaping dies (upper mould and/or lower mould), therefore in locked mode in the presence of the sorrow for the contiguity that mould and lower mould are hindered by the powder.Exist relatively
This, in the resin molding apparatus of the of the invention the 1st and the 2nd aspect, can prevent as described above near resin material transfer disk
Dust is dispersed, therefore the contiguity of upper mould and lower mould will not be hindered by the powder from resin material.
But if the attraction of dust collect plant is too strong, the dust quilt to be dispersed near disk is not only transferred in resin material
Attract, and should supply from the 2nd resettlement section to the graininess of resin material transfer disk or powdered resin material and also be attracted,
Disk is transferred so as to supply resin material to resin material with the correct amount obtained by the 2nd resettlement section First Astronautic Research Institute for Measurement and Test.The opposing party
Face, if attraction is excessively weak, it can not fully attract dust.Therefore, in the resin molding apparatus of the 1st example, as dust
Device uses the variable person of attraction.Attract the size of the attraction of resin material in itself or can not fully attract the attraction of dust
The size of power is different because of resin material, therefore can be by using the variable dust collect plant of attraction and by attraction according to using
Resin material is set as making supply not be attracted to the resin material of resin material transfer disk and in the attached of resin material transfer disk
The dust closely to disperse is fully attracted.
In the resin molding apparatus of the 1st example, can have：
1st resettlement section exports, its be arranged on above-mentioned 1st resettlement section be housed in above-mentioned 2nd resettlement section to supply
Resin material resin material outlet；
1st resettlement section is covered, and it is enclosed in around above-mentioned 1st resettlement section comprising the outlet of above-mentioned 1st resettlement section；And
1st resettlement section side dust collect plant, it attracts the dust of the inner space of above-mentioned 1st resettlement section cover.
According to this composition, it can prevent that dust disperses from resin material near the outlet of the 1st resettlement section.Herein, the 1st house
Portion side dust collect plant has attracted resin material because assuming, is also measured using the 2nd resettlement section of position section behind, therefore will be correct
Amount resin material via resin material transfer disk supply to the aspect of shaping dies, even and if even attraction is constant
Hinder.Certainly, the variable person of attraction can also be used in the 1st resettlement section side dust collect plant, to prevent the attraction of resin material.Any
, can be by the above-mentioned dust collect plant of the dust for the inner space for making the resettlement section of attraction the 2nd cover (equivalent to the 2nd aspect during situation
Resin molding apparatus in " the 2nd resettlement section side dust collect plant ") attraction compared with the 1st resettlement section side dust collect plant attraction
It is weak, and more reliably prevent from attracting resin material in the inner space of the 2nd resettlement section cover, thus, the resin that will can correctly measure
Material is supplied to shaping dies.In addition, attract the dust collect plant of the dust of the inner space of the 2nd resettlement section cover and above-mentioned 1st receipts
In appearance portion side dust collect plant, the common suction device for attracting dust both can be used, can also distinguish in 2 dust collect plants
Use different suction devices.In addition, the 1st resettlement section cover and the 2nd resettlement section cover or (1) cover of one.Using this
During the situation of the cover of kind one, the inner space of cover is also integrally formed, but the position of the 1st resettlement section is biased against from the inner space
Position with being biased against the 2nd resettlement section carries out the attraction of dust respectively.
On the other hand, in the resin molding apparatus of the 2nd aspect, the is surrounded by the 2nd resettlement section cover in the same manner as the 1st example
After around 2 resettlement sections, the week of the 1st resettlement section of the outlet comprising the 1st resettlement section is further enclosed in by the 1st resettlement section cover
Enclose.Thus, the dust for the inner space covered by the 1st resettlement section side dust collect plant with the 1st attraction gravitational attraction the 1st resettlement section, separately
On the one hand, the measured the 2nd is surrounded by the 2nd resettlement section side dust collect plant with the 2nd attraction gravitational attraction weak compared with the 1st attraction
The dust of the inner space of the 2nd resettlement section cover around resettlement section.Thus, the inner space that can be covered in the 2nd resettlement section suppresses
Supply to the resin material of resin material transfer disk and be attracted.
In the resin molding apparatus of the 2nd aspect, above-mentioned 2nd attraction is preferably set to variable.Can by this composition,
And it is set as making supply to transfer to resin material the resin material of disk according to the resin material used the 2nd attraction and is not attracted
And the dust to be dispersed near resin material transfer disk is fully attracted, disk is transferred so as to suppress supply to resin material
Resin material be attracted.
In addition, in the resin molding apparatus of the 2nd aspect, even if due to assuming to inhale in the inner space of the 1st resettlement section cover
Draw resin material, also measured using the 2nd resettlement section of position section behind, therefore by the resin material correctly measured via resin
Material transfer disk is supplied to the aspect of shaping dies, even and if hindering even the 1st attraction is constant.Certainly, the 1st can also be attracted
Power is set to variable.
The 2nd variable person of attraction in the resin molding apparatus of the 1st example and the resin molding apparatus of the 2nd aspect, on
Stating dust collect plant (the 2nd resettlement section side dust collect plant in the 2nd aspect) preferably has：
Suction device, it attracts air；
Suction tube, above-mentioned suction device is connected by it with the inner space that above-mentioned 2nd resettlement section is covered；
Opening, it is arranged on above-mentioned suction tube；And
Movable cover, it is the lid for being arranged on above-mentioned opening, and passes through the aperture area of the position adjustment of the lid opening.
According to this composition, the aperture area of the opening of suction tube is arranged on by using movable cover adjustment, and will attract to fill
The attraction put is assigned as the sky in the attraction attracted from the inner space of the 2nd resettlement section cover and the outside from the opening
Between 2 attractions of attraction for being attracted.As a result, the aperture area of the opening is bigger, then from the 2nd resettlement section cover
The attraction that inner space is attracted becomes smaller.Therefore, can be by adjusting above-mentioned aperture area with movable cover to make to come from
The attraction of the inner space is variable.The aperture area can by movable cover and easily and subtly adjust, therefore also can easily and
Subtly carry out the adjustment of attraction.
The resin molding apparatus of 1st and the 2nd aspect can have the vibration that vibration is assigned to above-mentioned resin material supply passageway
Assigning unit.Vibration is assigned to resin material supply passageway and supply resin material from the 2nd resettlement section by using vibration assigning unit
Disk is transferred to resin material.Using it is such a vibration assigning unit situation when, exist for not hindering the 2nd resettlement section vibration and
The situation in gap is set between the 2nd resettlement section and the 2nd resettlement section cover.In the situation, dust is easily by the clearance leakage
Outside being covered to the 2nd resettlement section, thus it is particularly important using dust collect plant as described herein.
Hereinafter, using Fig. 1~Fig. 4, to the more specific of resin molding apparatus and resin forming product manufacture method of the invention
Embodiment illustrate.
The resin molding apparatus of present embodiment is with the resin material supply unit 10 shown in Fig. 1 and with clamping apparatus
Deng compression molding portion 20 (following) etc..First, the composition and action of resin material supply unit 10 are illustrated.
Resin material supply unit 10 has the 1st resettlement section 111 and the 2nd resettlement section 112 for housing resin material P.
The open-close lid that 1st resettlement section 111 has the 1st upper opening 121 on top and is opened and closed the 1st upper opening 121
1211, and the part in bottom has the 1st lower openings 131.Received in addition, having in the contact of the 1st resettlement section 111 to the 1st
Appearance portion 111 assigns the 1st vibration assigning unit 141 of vibration.
2nd resettlement section 112 is configured in the downside of the 1st lower openings 131, and with the 1st lower openings 131 to position
With the 2nd upper opening 122, and the part in bottom has the 2nd lower openings 132.In addition, the 2nd resettlement section 112 has
The resin material feed path 1121 substantially horizontally extended from the underface of the 2nd upper opening 122, and supplied in resin material
The outlet in path 1121 has the 2nd lower openings 132.Further, the 2nd resettlement section 112 is in its underpart and the 2nd upper opening 122
Location directly below contact have the 2nd vibration assigning unit 142, and the 2nd vibration assigning unit 142 under there is measurement unit 15.2nd
Vibrate assigning unit 142 and the 2nd resettlement section 112 (especially resin material feed path 1121) is assigned and vibrate, measurement unit 15 is received to the 2nd
The quality of resin material in appearance portion 112 is measured.
In addition, resin material supply unit 10 has transfers disk T configurations under the 2nd lower openings 132 by resin material
Resin material transfer disk travel mechanism 16.
Resin material supply unit 10 has more：Upper lid 171, it covers the upper of the 1st resettlement section 111 and the 2nd resettlement section 112
Side；And lower cover 172, it opens the lower section of the 2nd lower openings 132 of the 2nd resettlement section 112 and resin material P from the 2nd bottom
Mouth 132 falls to resin material transfer disk T paths covering.Between the resettlement section 112 of upper lid 171 and the 2nd and lower cover
Gap is provided between 172 and the 2nd resettlement section 112, to prevent from the 2nd resettlement section 112 being assigned by the 2nd vibration assigning unit 142
The conduct vibrations given are to the cover.According to the reason for identical, between being also provided between the resettlement section 111 of upper lid 171 and the 1st
Gap.
The upper lid 171 and lower cover 172 cover a part for the 2nd resettlement section 112, therefore are received equivalent to the above-mentioned 2nd
Cover in appearance portion.In addition, upper lid 171 not only covers the 2nd resettlement section 112 but also the 1st resettlement section 111 of covering, therefore also correspond to
State the 1st resettlement section cover.
In upper lid 171, one end of the 1st suction tube 181 is connected with the 1st connecting portion 1711, and in lower cover 172,
One end of the 2nd suction tube 182 is connected with the 2nd connecting portion 1721.The other end and the 2nd suction tube 182 of 1st suction tube 181
The other end be both connected to precipitron (suction device) 18.1st connecting portion 1711 and the shortest path L of the 2nd resettlement section 11212Slightly
It is micro- to be longer than the 1st connecting portion 1711 and the shortest path L of the 1st lower openings 13111, and it is longer than the 2nd connecting portion 1721 and the 2nd bottom
The shortest path L of opening 1322.Herein, the 1st suction tube 181 is contained in the composition of above-mentioned 1st resettlement section side dust collect plant, and
2 suction tubes 182 are contained in the composition of above-mentioned dust collect plant (the 1st example) and the 2nd resettlement section side dust collect plant (the 2nd aspect).With
Under for simplicity, by the dust collect plant of the 1st example also with the 2nd aspect in the same manner as be referred to as " the 2nd resettlement section side dust collect plant ".This
Outside, precipitron 18 is for the common inscape of the 1st resettlement section side dust collect plant and the 2nd resettlement section side dust collect plant.In addition,
Also precipitron can be set in the 1st resettlement section side dust collect plant and the 2nd resettlement section side dust collect plant respectively.
1st suction tube 181 is provided with the 1st attraction adjustment as the inscape of the 1st resettlement section side dust collect plant
Portion 1811, and the 2nd suction tube 182 is provided with the 2nd attraction adjustment as the inscape of the 2nd resettlement section side dust collect plant
Portion 1821.1st attraction adjustment portion 1811 and the 2nd attraction adjustment portion 1821 are formed with identical, and as shown in Fig. 2
A part for the tube wall of 1st suction tube 181 (the 2nd suction tube 182) is set to flat basal part 184, attractive adjustment
Portion's opening 185 and pass through the aperture area that adjustment attraction adjustment portion opening 185 is slided along attraction adjustment portion opening 185
Movable cover 186.Movable cover 186 is made up of 2 tabular components, and is each provided with 2 otch 1861 along the direction of slip.
The tube wall of 1st suction tube 181 (the 2nd suction tube 182), by by 2 be 1 combination in terms of 2 groups bolt 1862 with utilize 2 groups of folders
Firmly the mode of attraction adjustment portion opening 185 is installed.Movable cover 186 is by the way that 2 otch 1861 of 1 tabular component are inserted into
1 group of bolt 1862 and be arranged on the 1st suction tube 181 (the 2nd suction tube 182).Prolonged by 2 tabular components in otch 1861
The direction stretched is mobile and adjusts the aperture area of attraction adjustment portion opening 185 as described above.In addition, movable cover 186 is at this
By user to move it manually in embodiment, but the power that motor etc. can also be used moves it.Using such a dynamic
During the situation of power, the aperture area of attraction adjustment portion opening 185 can be also controlled by control unit 19.
In precipitron 18, the 1st suction tube 181 and the 2nd suction tube 182 are not only connected with, and is connected with the 3rd suction tube
183.3rd suction tube 183, which turns into one part, has the flexible pipe of pliability, and be provided with its front end not with comprising resinous wood
Expect the suction port 1831 of the inscape connection of the resin molding apparatus of supply unit 10.The user of resin molding apparatus can be on one side
Make bending radius of flexible duct while the desired position for making suction port 1831 be moved in resin molding apparatus, will be present in the position
Dirt is attracted to precipitron 18 to remove by self-gravitation mouth 1831 by the 3rd suction tube 183.
In addition, in resin material supply unit 10, the control unit of 10 overall action of control resin material supply unit is provided with
19。
Action to resin material supply unit 10 illustrates.
Before starting to supply granular resin material P to resin material transfer disk T, in advance from the 1st upper opening 121
To an adequate amount of resin material P of supply in the 1st resettlement section 111, and start precipitron 18, proceed by upper lid 171 and under
Attraction in portion's cover 172.Herein, transferred according to supply to resin material the particle of disk T resin material particle diameter or material and
The particle diameter of the micropowder of the particle of resin material is attached to, by the attraction adjustment portion opening 185 of the 2nd attraction adjustment portion 1821
Aperture area be adjusted to turn into the attraction attracted in lower cover 172 from the 2nd connecting portion 1721 by precipitron 18
Do not attract the particle of resin material and attract the degree of the dust of micropowder.The adjustment is advance using the resin material of actual use
Simple preliminary experiment is carried out, and is implemented based on its result.On the other hand, the 1st connecting portion 1711 and the 2nd resettlement section 112
Shortest path L12It is longer than the 2nd connecting portion 1721 and the shortest path L of the 2nd lower openings 1322, therefore pass through precipitron 18 from the 1st
Connecting portion 1711 can be better than from the 2nd connecting portion 1721 to the attraction attracted in upper lid 171 to being carried out in lower cover 172
The attraction of attraction, but be set to not attract the particle of resin material and attract the degree of the dust of micropowder certainly.
In this way, while by precipitron 18 to attracting in upper lid 171 and lower cover 172, while carry out with
Under action.First, transferring disk travel mechanism 16 by resin material makes resin material transfer disk T be opened to configure in the 2nd bottom
Mode under mouth 132 moves.Then, the 1st resettlement section 111 is assigned from the 1st vibration assigning unit 141 and vibrated, thus make collecting
Resin material P in the 1st resettlement section 111 is fallen from the 1st lower openings 131 of the outlet as the 1st resettlement section 111, and from
2nd upper opening 122 is supplied to the 2nd resettlement section 112.Now, between the 1st lower openings 131 and the 2nd upper opening 122,
The dust that the particle of the micropowder of resin material P particle is formed is attached to disperse.The dust passes through in upper lid 171
The attraction of precipitron 18 and moved towards the 1st connecting portion 1711, and by the 1st suction tube 181 by the dust of precipitron 18.Therefore,
Dust can be suppressed to spill from upper lid 171 and the gap of the 1st resettlement section 111.
It will supply to the 2nd resettlement section 112 compared with the further amounts of resin material P of amount that transfers disk T should be supplied to resin material
At interior time point, the 1st vibration assigning unit 141, which stops assigning the 1st resettlement section 111, to be vibrated, and is thus temporarily ceased to the 2nd resettlement section
Supply resin material in 112.
Then, the 2nd resettlement section 112 is assigned from the 2nd vibration assigning unit 142 and vibrated, thus make to be housed in the 2nd resettlement section
112 resin material P slowly falls to resin material transfer disk T from the 2nd lower openings 132.During this period, with by using
Resin material transfer disk travel mechanism 16 makes resin material transfer disk T move in generally horizontal directions, makes resin material P with equal
Even thickness is supplied to the mode in resin material transfer disk T and is adjusted.
In addition, during vibration is assigned to the 2nd resettlement section 112 from the 2nd vibration assigning unit 142, counted by measurement unit 15
Resin material P in the resettlement section 112 of flow control 2, and the resin material P in the 2nd resettlement section 112 reduces and should supplied to resinous wood
At the time point of material transfer disk T amount, the 2nd vibration assigning unit 142, which stops assigning the 2nd resettlement section 112, to be vibrated.Thus, supply just
Good is the resin material P for the amount that should be supplied, and the supply for transferring disk T to resin material so as to resin material P is completed.
During disk T supply resin materials P is transferred to resin material in this way, near the 2nd lower openings 132,
The dust that the particle of micropowder is formed disperses to over and under.The dust to disperse to the top of the 2nd lower openings 132 is upper
Moved in portion's cover 171 by the attraction of precipitron 18 towards the 1st connecting portion 1711, and by the 1st suction tube 181 by precipitron
18 dusts.On the other hand, disperse to the dust of the lower section of the 2nd lower openings 132 in the interior suction by precipitron 18 of lower cover 172
Draw and moved towards the 2nd connecting portion 1721, and by the 2nd suction tube 182 by the dust of precipitron 18.
Herein, predominantly resin material P is made to fall from the 1st resettlement section 111 in dust caused by the inner space of upper lid 171
The dust to be dispersed when in lower supply to the 2nd resettlement section 112.Because of the metering in the 1st resettlement section 111 without resin material, therefore often
The quantity delivered of the resin material of one unit interval is relatively more, and thus, relatively large number of dust disperses to the inside of upper lid 171
Space.In addition, the resin material P supplied from the 1st resettlement section 111 to the stage in the 2nd resettlement section 112 is the state before metering.
So because with the relatively strong inner space for attracting gravitational attraction upper lid 171, therefore will not be to being practically used for ester moulding
Amount of resin impacts, so as to efficiently reduce the pollution of dust.In contrast, the inside by attracting lower cover 172
The dust of space and dust is resin material P is fallen supply to resin material from the 2nd lower openings 132 of the 2nd resettlement section 112
The dust to be dispersed when in transfer disk T.Because carrying out the metering of resin material, therefore the resin of per unit time in 2nd resettlement section 112
The quantity delivered of material is less than the 1st resettlement section 111, and thus, the amount dispersed to the dust of the inner space of lower cover 172 is less than top
The inner space of cover 171.Further, supplied from the 2nd resettlement section 112 to the resin material P in the stage in resin material transfer disk T
For the state after metering, if therefore with the relatively strong inner space for attracting gravitational attraction lower cover 172, exist to actually using
In the anxiety that the amount of resin of ester moulding impacts.Therefore, in order to not cause shadow to the amount of resin for being practically used for ester moulding
Ring, only collect the dust polluted to surrounding as much as possible, and the attraction for the inner space covered to the 2nd resettlement section is set to
It is relatively weaker to the attraction of the inner space of the 1st resettlement section cover.
It is supplied with resin material P resin material transfer disk T and disk travel mechanism 16 is transferred and from the 2nd by resin material
Taken out of under lower openings 132, and be transferred to compression molding portion 20.Then, resin material transfer disk travel mechanism 16 then makes
Supply resin material P resin material transfer disk T is moved under the 2nd lower openings 132.Hereinafter, by same as described above
Resin material P is supplied to resin material and is transferred disk T by action.
Compression molding portion 20 is identical with the compression molding portion of existing resin molding apparatus, Fig. 3 used below to form and
Action simply illustrates.
Compression molding portion 20 is erect respectively in four corners of bottom fixed disk 211 is provided with the (conjunction of connecting rod (tie bar) 22
Meter 4), and rectangular top fixed disk 212 is provided near the upper end of connecting rod 22.Fixed disk 211 and top in bottom
Rectangular movable pressure plate (platen) 23 is provided between fixed disk 212.Movable pressure plate 23 is provided with four corners for connecting
The hole that bar 22 passes through, and can be moved up and down along connecting rod 22.On bottom fixed disk 211, being provided with makes movable pressure plate 23
The device moved up and down i.e. clamping apparatus 24.
Lower heater 251 is configured with the upper surface of movable pressure plate 23, and under being provided with lower heater 251
Mould LM.Lower mould LM is provided with mold release film coating device 26.Mold release film coating device 26, die cavity MC upper set mold release film it
Afterwards, attracted mold release film being coated in die cavity MC by the suction port (not shown) for the inner face for being arranged on die cavity MC certainly
Face.
On top, the lower surface of fixed disk 212 is configured with upper portion heater 252, and is installed under upper portion heater 252
There is upper mould UM.In upper mould UM lower surface, the substrate S that structure is equipped with semiconductor chip can be installed.
The action in compression molding portion 20 is as described below.First, structure is equipped with by substrate travel mechanism (not shown) and partly led
The substrate S of body chip is arranged on upper mould UM lower surface.At the same time, mold release film is located at by mold release film coating device 26
Lower mould LM die cavity MC inner face.Then, resin material P resinous wood will be fed with resin material supply unit 10 as described above
Material transfer disk T configurations are opened, thus will in lower mould LM surface, the baffle plate that will be arranged on the bottom that resin material transfers disk T
Resin material P in resin material transfer disk T is supplied to die cavity MC.In addition, to upper mould UM installation base plates S with supplying lower mould LM
Order that can also be contrary to the above to resin material P is carried out.
In this condition, the resin material P in die cavity MC is heated by using lower heater 251 and makes its softening,
And substrate S is heated by upper portion heater 252.In the state of resin material P and substrate S is heated, pass through locked mode
Device 24 and movable pressure plate 23 is increased, by shaping dies (upper mould UM with lower mould LM) locked mode, harden resin material P.Setting
After fat material P hardening, decline movable pressure plate 23 by using clamping apparatus 24 and mold.Thus, obtain semiconductor core
The resin seal product (resin forming product) that piece resin seal forms.The resin seal product of gained are demolded film because of lower mould LM inner face
It is coated to and can be successfully stripped from lower mould LM.
Another embodiment of the resin molding apparatus of the present invention is illustrated using Fig. 4.The resin of present embodiment
Building mortion 30 has material receiving module 31, shaping module 32 and discharge module 33.Material receiving module 31 is to certainly outside
Receive resin material P and substrate S and by such device for being sent to shaping module 32, and there is above-mentioned resin material supply unit
10, and there is substrate acceptance division 311.1 shaping module 32 has 1 group of above-mentioned compression molding portion 20.Show in Fig. 4
3 shaping modules 32, but shaping module 32 can be set arbitrary number of units in resin molding apparatus 30.Even if in addition, filling
After beginning to use with resin molding apparatus 30, also changeable shaping module 32.Discharge module 33 will be manufactured by shaping module 32
Resin forming product move into and kept from shaping module 32, and there is resin forming product maintaining part 331.
It is provided with and is removed in a manner of material receiving module 31,1 or more shaping modules 32 and discharge module 33 are penetrated
Send substrate S, resin material transfer disk T and resin forming product main carrying device 36.Above-mentioned resin material transfer disk travel mechanism
16 be a part for main carrying device 36.In addition, in each module, set between the device in main carrying device 36 and the module
It is equipped with conveyance substrate S, resin material transfer disk T and resin forming product secondary carrying device 37.
In addition, resin molding apparatus 30 has to make the power supply of above-mentioned each module action and control unit (not shown).
Action to resin molding apparatus 30 illustrates.Substrate S is maintained at the base of material receiving module 31 by user
Plate acceptance division 311.Main carrying device 36 and secondary carrying device 37 transport substrate S to position in finishing die from substrate acceptance division 311
1 compression molding portion 20 in block 32, and the upper mould UM by substrate S installed in the compression molding portion 20.Then, main carrying device
36 and secondary carrying device 37 by resin material transfer disk T move into resin material supply unit 10.Resin material supply unit 10 is as above
Described supply resin material P to resin material transfers disk T.Main carrying device 36 and secondary carrying device 37 will be supplied with resin
Material P resin material transfer disk T is transported to the compression molding portion 20 for the shaping module 32 that substrate S is arranged on to upper mould UM, and
After resin material transfer disk T is configured on the lower mould LM in the compression molding portion 20, disk T is transferred by resinous wood from resin material
Material P is supplied to lower mould LM die cavity MC.Thereafter, resin material is transferred by disk T by main carrying device 36 and secondary carrying device 37
After being taken out of from compression molding portion 20, shaping is compressed in the compression molding portion 20.Carried out in the compression molding portion 20
During compression molding, other compression molding portions 20 operate with identical before this, thus can be in multiple compression molding portions
While will stagger the time is concurrently compressed shaping on one side in 20.Resin forming product as obtained by compression molding is removed by master
Send device 36 and secondary carrying device 37 and taken out of from compression molding portion 20, and move into the resin forming product of discharge module 33 and keep
Kept in portion 331.User suitably can take out resin forming product from resin forming product maintaining part 331.
The present invention is not limited to the respective embodiments described above certainly, and can carry out various modifications.
Claims (9)
1. a kind of resin molding apparatus, it is characterised in that have：
1st resettlement section, it houses graininess or powdered resin material；
2nd resettlement section, it receives and temporarily housed the resin material for being housed in above-mentioned 1st resettlement section, and to the resin material
Metering is carried out while making it be fallen via resin material supply passageway from the outlet of the resin material supply passageway；
2nd resettlement section is covered, and it is enclosed in around above-mentioned 2nd resettlement section of the outlet comprising above-mentioned resin material supply passageway；
And
The variable dust collect plant of attraction, it attracts the dust of the inner space of above-mentioned 2nd resettlement section cover.
2. resin molding apparatus according to claim 1, wherein, above-mentioned dust collect plant has：
Suction device, it attracts air；
Suction tube, above-mentioned suction device is connected by it with the inner space that above-mentioned 2nd resettlement section is covered；
Opening, it is arranged on above-mentioned suction tube；And
Movable cover, it is the lid for being arranged on above-mentioned opening, and passes through the aperture area of the position adjustment of the lid opening.
3. resin molding apparatus according to claim 1 or 2, it has：
1st resettlement section exports, its be arranged on above-mentioned 1st resettlement section be housed in the tree of above-mentioned 2nd resettlement section to supply
The resin material outlet of fat material；
1st resettlement section is covered, and it is enclosed in around above-mentioned 1st resettlement section comprising the outlet of above-mentioned 1st resettlement section；And
1st resettlement section side dust collect plant, it attracts the dust of the inner space of above-mentioned 1st resettlement section cover.
4. resin molding apparatus according to claim 3, wherein, above-mentioned 2nd resettlement section is attracted by above-mentioned dust collect plant
The attraction of the dust of the inner space of cover, attract what above-mentioned 1st resettlement section was covered compared with by above-mentioned 1st resettlement section side dust collect plant
The attraction of the dust of inner space is weaker.
5. a kind of resin molding apparatus, it is characterised in that have：
1st resettlement section, it houses graininess or powdered resin material；
2nd resettlement section, it receives and temporarily housed the resin material for being housed in above-mentioned 1st resettlement section, and to the resin material
Metering is carried out while making it be fallen via resin material supply passageway from the outlet of the resin material supply passageway；
1st resettlement section exports, its be arranged on above-mentioned 1st resettlement section be housed in the tree of above-mentioned 2nd resettlement section to supply
The resin material outlet of fat material；
1st resettlement section is covered, and it is enclosed in around above-mentioned 1st resettlement section comprising the outlet of above-mentioned 1st resettlement section；
2nd resettlement section is covered, and it is enclosed in around above-mentioned 2nd resettlement section of the outlet comprising above-mentioned resin material supply passageway；
1st resettlement section side dust collect plant, it is with the dust of the 1st inner space for attracting the above-mentioned 1st resettlement section cover of gravitational attraction；And
2nd resettlement section side dust collect plant, it attracts above-mentioned 2nd resettlement section of gravitational attraction to cover with more above-mentioned 1st attraction the weaker 2nd
Inner space dust.
6. resin molding apparatus according to claim 5, wherein, above-mentioned 2nd resettlement section side dust collect plant has：
Suction device, it attracts air；
Suction tube, above-mentioned suction device is connected by it with the inner space that above-mentioned 2nd resettlement section is covered；
Opening, it is arranged on above-mentioned suction tube；And
Movable cover, it is the lid for being arranged on above-mentioned opening, and passes through the aperture area of the position adjustment of the lid opening.
7. according to the resin molding apparatus any one of claim 1,2,5,6, it has supplies to above-mentioned resin material
Path assigns the vibration assigning unit of vibration.
8. a kind of resin forming product manufacture method, has：
Resin material supplying step, graininess or powdered resin material are supplied after transferring disk to resin material, make this
Resin material transfer disk is moved to shaping dies, and the resin material is transferred into the resin material in disk supplies to the shaping dies；
And
Ester moulding step, the shaping dies locked mode of the resin material will be supplied with, carries out ester moulding；It is characterized in that：
In above-mentioned resin material supplying step,
Graininess or powdered resin material are housed in the 1st resettlement section, is received by the 2nd resettlement section and temporarily housed and received
Hold the resin material in the 1st resettlement section, and metering is carried out to the resin material while it is supplied via resin material
Path supplies to above-mentioned resin material and transfers disk,
During above-mentioned resin material is supplied to above-mentioned resin material transfer disk from above-mentioned 2nd resettlement section, included to being enclosed in
The dust of the inner space of the 2nd resettlement section cover around above-mentioned 2nd resettlement section of the outlet of above-mentioned resin material supply passageway,
It is not attracted with above-mentioned resin material and attraction that the dust is attracted is attracted.
9. a kind of resin forming product manufacture method, has：
Resin material supplying step, graininess or powdered resin material are supplied after transferring disk to resin material, make this
Resin material transfer disk is moved to shaping dies, and the resin material is transferred into the resin material in disk supplies to the shaping dies；
And
Ester moulding step, the shaping dies locked mode of the resin material will be supplied with, carries out ester moulding；It is characterized in that：
In above-mentioned resin material supplying step,
Graininess or powdered resin material are housed in the 1st resettlement section, is received by the 2nd resettlement section and temporarily housed and received
Hold the resin material in the 1st resettlement section, and metering is carried out to the resin material while it is supplied via resin material
Path supplies to above-mentioned resin material and transfers disk,
During above-mentioned resin material is supplied to above-mentioned resin material transfer disk from above-mentioned 2nd resettlement section, inhaled with the 1st attraction
Draw the dust of the inner space for the 1st resettlement section cover being enclosed in around above-mentioned 1st resettlement section, and attract with the more above-mentioned 1st
The weaker 2nd attraction gravitational attraction of power is enclosed in the week of above-mentioned 2nd resettlement section of the outlet comprising above-mentioned resin material supply passageway
The dust of the inner space of the 2nd resettlement section cover enclosed.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-161420 | 2016-08-19 | ||
| JP2016161420A JP6212609B1 (en) | 2016-08-19 | 2016-08-19 | Resin molding apparatus and resin molded product manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107756707A true CN107756707A (en) | 2018-03-06 |
| CN107756707B CN107756707B (en) | 2020-02-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710713650.4A Active CN107756707B (en) | 2016-08-19 | 2017-08-18 | Resin molding apparatus and method for manufacturing resin molded product |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6212609B1 (en) |
| KR (1) | KR102053968B1 (en) |
| CN (1) | CN107756707B (en) |
| TW (1) | TWI680044B (en) |
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|---|---|---|---|---|
| JP6923423B2 (en) * | 2017-11-21 | 2021-08-18 | Ｔｏｗａ株式会社 | Manufacturing method of transport equipment, resin molding equipment and resin molded products |
| JP6894403B2 (en) * | 2018-05-24 | 2021-06-30 | Ｔｏｗａ株式会社 | Resin molding equipment and manufacturing method of resin molded products |
| CN111380814A (en) * | 2020-04-26 | 2020-07-07 | 天津德高化成新材料股份有限公司 | Optical epoxy plastic packaging material for LED packaging and ink color measuring method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB929324A (en) * | 1960-02-12 | 1963-06-19 | Indevco Ltd | Spray coating |
| JP2000006151A (en) * | 1998-06-29 | 2000-01-11 | Sony Corp | Resin pellet feed method into resin molding machine |
| CN1417015A (en) * | 2001-11-08 | 2003-05-14 | 上海欧亚合成材料有限公司 | Thermosetting plastic extruding and pelletizing process |
| CN1449326A (en) * | 2000-07-11 | 2003-10-15 | 格赖纳佩福马有限公司 | Method for producing foam products |
| CN101180170A (en) * | 2005-11-04 | 2008-05-14 | 东和株式会社 | Molding apparatus for resin encapsulation of electronic part |
| CN101495294A (en) * | 2006-05-26 | 2009-07-29 | Z公司 | Apparatus and methods for handling materials in a 3-d printer |
| CN204977139U (en) * | 2015-07-24 | 2016-01-20 | 苏州盈茂塑料有限公司 | A pipeline hoisting device for plastic particle |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3448858B2 (en) * | 1994-08-11 | 2003-09-22 | ソニー株式会社 | Resin material supply device in injection molding machine |
| JP3584343B2 (en) | 1995-06-21 | 2004-11-04 | 月島機械株式会社 | Powder supply method and supply device |
| JPH09219414A (en) * | 1996-02-09 | 1997-08-19 | Tsukuba Seiko Kk | Dust collector for encapsulation |
| JP3825160B2 (en) * | 1997-12-02 | 2006-09-20 | 株式会社サイネックス | Semiconductor resin sealing device |
| JP4327988B2 (en) * | 2000-04-24 | 2009-09-09 | アピックヤマダ株式会社 | Resin tablet feeding device and resin sealing device |
| TW509615B (en) * | 2000-04-21 | 2002-11-11 | Apic Yamada Corp | Resin molding machine and resin tablet feeding machine |
| JP5153509B2 (en) | 2008-08-08 | 2013-02-27 | Ｔｏｗａ株式会社 | Electronic component compression molding method and mold apparatus |
| JP5736142B2 (en) * | 2010-10-12 | 2015-06-17 | 株式会社カワタ | Fine powder removal device |
| WO2013069496A1 (en) * | 2011-11-08 | 2013-05-16 | アピックヤマダ株式会社 | Resin sealing device |
| JP5627619B2 (en) * | 2012-02-28 | 2014-11-19 | Ｔｏｗａ株式会社 | Resin sealing device and method for manufacturing resin sealing body |
-
2016
- 2016-08-19 JP JP2016161420A patent/JP6212609B1/en active Active
-
2017
- 2017-06-02 TW TW106118266A patent/TWI680044B/en active
- 2017-08-03 KR KR1020170098564A patent/KR102053968B1/en active IP Right Grant
- 2017-08-18 CN CN201710713650.4A patent/CN107756707B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB929324A (en) * | 1960-02-12 | 1963-06-19 | Indevco Ltd | Spray coating |
| JP2000006151A (en) * | 1998-06-29 | 2000-01-11 | Sony Corp | Resin pellet feed method into resin molding machine |
| CN1449326A (en) * | 2000-07-11 | 2003-10-15 | 格赖纳佩福马有限公司 | Method for producing foam products |
| CN1417015A (en) * | 2001-11-08 | 2003-05-14 | 上海欧亚合成材料有限公司 | Thermosetting plastic extruding and pelletizing process |
| CN101180170A (en) * | 2005-11-04 | 2008-05-14 | 东和株式会社 | Molding apparatus for resin encapsulation of electronic part |
| CN101495294A (en) * | 2006-05-26 | 2009-07-29 | Z公司 | Apparatus and methods for handling materials in a 3-d printer |
| CN204977139U (en) * | 2015-07-24 | 2016-01-20 | 苏州盈茂塑料有限公司 | A pipeline hoisting device for plastic particle |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2018027670A (en) | 2018-02-22 |
| JP6212609B1 (en) | 2017-10-11 |
| TW201806725A (en) | 2018-03-01 |
| TWI680044B (en) | 2019-12-21 |
| KR102053968B1 (en) | 2019-12-10 |
| KR20180020884A (en) | 2018-02-28 |
| CN107756707B (en) | 2020-02-28 |
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