CN111380814A - Optical epoxy plastic packaging material for LED packaging and ink color measuring method thereof - Google Patents

Optical epoxy plastic packaging material for LED packaging and ink color measuring method thereof Download PDF

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Publication number
CN111380814A
CN111380814A CN202010338552.9A CN202010338552A CN111380814A CN 111380814 A CN111380814 A CN 111380814A CN 202010338552 A CN202010338552 A CN 202010338552A CN 111380814 A CN111380814 A CN 111380814A
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sample
value
optical epoxy
thickness
led
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于会云
孙绪筠
单秋菊
谭晓华
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Tecore Synchem Inc
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Tecore Synchem Inc
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Priority to CN202010338552.9A priority Critical patent/CN111380814A/en
Priority to PCT/CN2020/088764 priority patent/WO2021217689A1/en
Priority to JP2021561615A priority patent/JP2022533907A/en
Publication of CN111380814A publication Critical patent/CN111380814A/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/27—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands using photo-electric detection ; circuits for computing concentration
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/46—Measurement of colour; Colour measuring devices, e.g. colorimeters
    • G01J3/465—Measurement of colour; Colour measuring devices, e.g. colorimeters taking into account the colour perception of the eye; using tristimulus detection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/46—Measurement of colour; Colour measuring devices, e.g. colorimeters
    • G01J3/50—Measurement of colour; Colour measuring devices, e.g. colorimeters using electric radiation detectors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/36—Embedding or analogous mounting of samples
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2248—Oxides; Hydroxides of metals of copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/36—Embedding or analogous mounting of samples
    • G01N2001/366—Moulds; Demoulding

Abstract

The invention relates to the technical field of epoxy plastic packaging materials for LED packaging, in particular to an optical epoxy plastic packaging material for LED packaging and an ink color measuring method thereof. The method comprises the steps of preparing a sample and testing the sample; the testing of the sample comprises the following steps: cutting the prepared optical epoxy plastic packaging material sample for LED packaging, placing the sample on a standard white board, keeping the sample in a sealed and lightproof environment, and testing by using a color difference meter to obtain the color data of the L value, the a value and the b value of the ink color. The method provided by the invention can be used for accurately measuring the ink color of the optical epoxy plastic packaging material for LED packaging, accurately distinguishing and checking the color of the packaging resin, and judging whether the packaging resin is qualified or not and whether the packaging resin meets the requirements or not. In addition, the method provided by the invention has high detection accuracy and small measurement error, can accurately judge whether the color of the target epoxy molding compound meets the requirement by adopting a small amount of samples, and is efficient and economical.

Description

Optical epoxy plastic packaging material for LED packaging and ink color measuring method thereof
Technical Field
The invention relates to the technical field of epoxy plastic packaging materials for LED packaging, in particular to an optical epoxy plastic packaging material for LED packaging and an ink color measuring method thereof.
Background
At present, the epoxy molding compound mainly comprises epoxy resin, a crosslinking curing agent, a curing accelerator, an additive and the like. The material has many outstanding characteristics, such as good thermal stability, insulation property, adhesion, good mechanical property, excellent forming process property, low cost and the like, and is widely applied to the field of electronic component packaging, thereby becoming one of the most important electronic chemical materials at present. The main manufacturers of the optical epoxy molding compound used for packaging the light emitting device include Ridong electric company, Taiwan Changchun (including the well-known branch factories), HYSOL, etc. Generally, optical epoxy molding compounds require high transmittance, and no or a very small amount of pigment is added to distinguish product types, and no clear specification is required for the color of the optical epoxy molding compound. However, the yield of the plastic packaging material for LED packaging is gradually increased, the indoor and outdoor display markets are increasingly developed, and especially the increase of the yield of the plastic packaging material for RGB discrete device packaging as a display unit is particularly obvious, so that the optical epoxy plastic packaging material for LED packaging, especially for RGB discrete device packaging of a display screen, is more and more widespread.
In order to improve the application and improve the user experience and display effect, the display LED device generally needs to be added with melanin to achieve different display effects. Therefore, melanin is often added into the RGB discrete device packaging epoxy plastic packaging material, so that the contrast is improved, and the plastic packaging material has a specific ink color. Since the ink color of the existing packaging resin applied to many LED elements and RGB discrete devices is highly required, it is required to have a specific color and a specific accuracy. However, the sample amount required by the existing ink color measurement method is large, so that the accuracy of the measured color L, a and b values is low, and the use requirement under a high-accuracy environment is not met; or the measurement can be carried out only after the product is actually packaged, so that the risk of inconsistent ink color is brought to the manufacturing and packaging of the optical epoxy plastic packaging material. Therefore, it is necessary to research a simple method for measuring the ink color of the epoxy resin molding compound to determine whether the color is qualified or not, and whether the color is consistent with the actual inspection result of the customer.
Disclosure of Invention
In view of the above technical problems, an aspect of the present invention provides a method for measuring an ink color of an optical epoxy molding compound for LED packaging, which includes the steps of preparing a sample and testing the sample; the preparation method of the sample is a tablet pressing method or a transfer injection molding method:
the testing method of the sample comprises the following steps: and cutting the prepared sample, placing the sample on a standard white board, keeping the sample in a sealed and lightproof environment, and testing by using a color difference meter to obtain the color data of the L value, the a value and the b value of the ink color.
As a preferred technical scheme, the thickness of the sample is 0.2-0.6 mm; preferably, the thickness of the sample is 0.200-0.300 mm.
As a preferred technical scheme, the tabletting method comprises the following steps:
keeping the optical epoxy plastic packaging material applied to LED packaging at a high temperature in vacuum by using a gasket with a fixed thickness and a vacuum laminating machine, removing bubbles, then carrying out fusion laminating, and curing and forming to obtain the optical epoxy plastic packaging material, wherein the thickness of a cured and formed sample is 0.2-0.6 mm; preferably, the thickness is 0.200 to 0.300 mm.
As a preferred technical solution, the roll-over injection molding method comprises the following steps:
the method comprises the following steps of putting an optical epoxy plastic package material applied to LED packaging into an injection molding hole by using a mold with a fixed thickness (the design thickness is 0.200mm), applying pressure, and performing injection molding at the melting temperature of the plastic package material in a mode of rotating into injection molding to achieve the target thickness; wherein the thickness of the die is 0.2-0.6 mm; preferably, the thickness is 0.200 to 0.300 mm.
The second aspect of the present invention provides an optical epoxy molding compound for LED packaging, wherein when the thickness of a sample of the optical epoxy molding compound for LED packaging is 0.190-0.220 mm, the L value measured according to the ink color measurement method as described above is 59-69; the value of a is 1.6-2.6; the b value is 5.8 to 7.4.
As a preferable technical scheme, when the thickness of a sample of the optical epoxy molding compound for LED packaging is 0.195-0.215 mm, the L value measured according to the ink color measuring method is 61-67; the value of a is 1.7-2.5; the b value is 6.0 to 7.2.
As a preferable technical scheme, when the thickness of a sample of the optical epoxy molding compound for LED packaging is 0.240-0.260 mm, the L value measured according to the ink color measuring method is 54-64; the value of a is 2.1-3.1; the b value is 6.3 to 7.9.
As a preferable technical scheme, when the thickness of a sample of the optical epoxy molding compound for LED packaging is 0.245-0.255 mm, the L value measured by the ink color measuring method is 56-62; the value of a is 2.2-3.0; the b value is 6.5 to 7.7.
As a preferable technical scheme, when the thickness of a sample of the optical epoxy molding compound for LED packaging is 0.290-0.310 mm, the L value measured by the ink color measuring method is 50-60; the value of a is 2.4-3.4; the b value is 6.6-8.2.
As a preferable technical scheme, when the thickness of a sample of the optical epoxy molding compound for LED packaging is 0.295-0.305 mm, the L value measured according to the ink color measuring method is 52-58; the value of a is 2.5-3.3; the b value is 6.8 to 8.0.
The method provided by the invention can be used for accurately measuring the ink color of the optical epoxy plastic packaging material for LED packaging, accurately distinguishing and checking the color of the packaging resin, and judging whether the color is qualified or not and whether the color is consistent with the actual detection result of a client or not. In addition, the method provided by the invention has high detection accuracy and small measurement error, can adopt a small amount of samples, and can accurately judge whether the color of the optical epoxy molding compound packaged by the target LED (or RGB discrete device) meets the requirement within the range of 0.190-0.220 mm of the thickness of the sample, thereby being efficient and saving the energy.
Drawings
To further illustrate the method of preparing test samples according to the present invention, applicants provide the following figures for further illustration.
FIG. 1 is a schematic view of a structure of a rotating injection mold.
Wherein: 1-a first die locating hole; 2-injection molding holes; 3-sample sheet molding cavity; 11-second mold locating holes.
Detailed Description
The disclosure may be understood more readily by reference to the following detailed description of preferred embodiments of the invention and the examples included therein. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In case of conflict, the present specification, including definitions, will control.
The terms "comprises," "comprising," "including," "has," "having," "contains," or any other variation thereof, as used herein, are intended to cover a non-exclusive inclusion. For example, a composition, process, method, article, or apparatus that comprises a list of elements is not necessarily limited to only those elements but may include other elements not expressly listed or inherent to such composition, process, method, article, or apparatus.
When an amount, concentration, or other value or parameter is expressed as a range, preferred range, or as a range of values, with a range of upper preferable values and lower preferable values, this is to be understood as specifically disclosing all ranges formed from any pair of any upper range limit or preferred value and any lower range limit or preferred value, regardless of whether ranges are separately disclosed. For example, when a range of "1 to 5" is disclosed, the described range should be interpreted to include the ranges "1 to 4", "1 to 3", "1 to 2 and 4 to 5", "1 to 3 and 5", and the like. When a range of values is described herein, unless otherwise stated, the range is intended to include the endpoints thereof and all integers and fractions within the range.
In addition, the indefinite articles "a" and "an" preceding an element or component of the invention are not intended to limit the number requirement (i.e., the number of occurrences) of the element or component. Thus, "a" or "an" should be read to include one or at least one, and the singular form of an element or component also includes the plural unless the stated number clearly indicates that the singular form is intended.
The invention provides an ink color measurement method of an optical epoxy plastic package material for LED packaging, which comprises the steps of preparing a sample and testing the sample; the preparation method of the sample is a tablet pressing method or a transfer injection molding method:
the invention mainly adopts the principle of light reflection to measure the color of the sample. The testing method of the sample comprises the following steps: and cutting the prepared sample, placing the cut sample on a standard white board, keeping the sample in a sealed and lightproof environment, and testing the sample by using an electrical chromatic aberration instrument to obtain the color data of the L value, the a value and the b value of the ink color. The test method mainly adopts a method of spatial color coordinates L, a and b, compares the L, a and b values of the measured samples, and compares the difference of the L, a and b values with a specified central value. The central value is the average value.
The optical epoxy molding compound can be applied to LED packaging, wherein the packaging type of the LED comprises the packaging of RGB discrete devices, and the result obtained by testing according to the testing method does not have different results due to the difference of the LED and the RGB discrete devices.
In some embodiments, the prepared sample is cut into a square shape with sides less than 3mm by 3mm, or a circle with a diameter less than 3 mm.
Further, the minimum side length of the sample is not less than the testing caliber of the color difference meter.
In some embodiments, a Weifu photoelectric color difference meter (model WR-18, CIELAB is used as the color space to be tested, the color difference formula is Δ ELab, the light-containing mode is SCI, the light source type D65, and the measuring aperture is 8mm) is selected.
In some preferred embodiments, the sample (i.e., the optical epoxy molding compound used for encapsulation) has some transparency.
Further, the transparency of the sample (i.e. the optical epoxy molding compound for packaging) is at least 1%; preferably 2%, 3%, 4%, 5%, 6%, 10%, 15%, 20%.
The transparency in the present invention refers to the transmittance of a sample, and can be obtained by measuring the transmittance of the sample at a wavelength of 450nm using a spectrophotometer according to a method well known to those skilled in the art.
In some preferred embodiments, the sample (i.e., the optical epoxy molding compound for encapsulation) has a certain amount of melanin added.
Further, the mass of the melanin accounts for 0.01-0.1 wt% of the mass of the sample (namely the optical epoxy molding compound for packaging).
The melanin in the present invention is a component that enables a sample (i.e., an optical epoxy molding compound for encapsulation) to absorb visible light and to exhibit a black color. The type of the melanin is not particularly limited, and nano carbon black, nano copper oxide, nano manganese oxide and the like can be selected. Further, the nano carbon black has an average particle diameter of 15nm, and 2300# of Mitsubishi chemical corporation can be used. Further, the average particle size of the nano copper oxide is 40nm, and products of Beijing Dekko island technologies and Co can be selected. Further, the manganese oxide has an average particle size of 50nm, and Shanghai Bike New Material science and technology Co.
In some embodiments, the sample has a thickness of 0.2 to 0.6 mm; preferably, the thickness of the sample is 0.200-0.350 mm; further preferably, the thickness of the sample is 0.200-0.300 mm.
Further, the thickness of the sample is 0.190-0.220 mm; further, the thickness of the material is 0.195-0.215 mm.
Further, the thickness of the sample was 0.205 mm.
In some embodiments, the tableting method comprises the steps of:
keeping the packaging resin in vacuum at high temperature by using a gasket with fixed thickness and a vacuum pressing machine, removing bubbles, then melting and pressing, and curing and forming to obtain the packaging resin, wherein the thickness of a cured and formed sample is 0.2-0.6 mm; preferably, the thickness is 0.200 to 0.300 mm.
Specifically, the power supply of the vacuum pressing machine is opened, program parameters required by the pressing sheet are set, the upper cover plate and the lower cover plate are placed, the gasket with the required thickness is selected, the surfaces of the upper gasket, the lower gasket and the cover plate are clean and free of foreign matters, then release paper is placed on the gasket, a proper amount of resin powder is placed on the release paper, a layer of release paper is placed above the powder, the cover plate is covered, then the pressing sheet is pressed, and pressure maintaining and curing are carried out, so that the vacuum pressing machine is obtained.
Further, the optical epoxy molding compound for encapsulation is a powder sample with uniform particle size.
Further, the average particle size of the optical epoxy molding compound for packaging is not more than 1 mm. The applicant finds that if the particle size of the resin is too large, bubbles are generated in the sample, or the internal tissue structure of the sample is uneven, so that the ink color measurement of the sample is influenced.
In some embodiments, the roll-in injection molding process comprises the steps of:
the method comprises the following steps of putting epoxy plastic packaging materials applied to LED packaging into an injection molding hole by using a mold with a fixed thickness (the design thickness is 0.200mm), applying pressure, and performing injection molding at the melting temperature of the plastic packaging materials in a mode of rotating into injection molding to achieve the target thickness; wherein the thickness of the die is 0.2-0.6 mm; preferably, the thickness is 0.200 to 0.300 mm. The structure of the mold in which the injection molding is carried out is shown in FIG. 1.
The optical epoxy plastic package material applied to LED packaging is a resin material formed by mixing and melting components such as epoxy resin, melanin and the like and then curing under the action of a curing agent.
Specific components of the epoxy resin in the present invention are not particularly limited, and include, but are not limited to, alicyclic epoxy resin, bisphenol a type epoxy resin, hydrogenated bisphenol a type epoxy resin, bisphenol F type epoxy resin, epoxy silicone resin composite epoxy resin, and the like. These epoxy resins may be used alone or in combination of two or more.
Examples of the alicyclic epoxy resin include poly [ (2-oxiranyl) -1, 2-cyclohexanediol ] 2-ethyl-2- (hydroxymethyl) -1, 3-propanediol ether, and xylonite chemical industry co (EHPE-3150 epoxy equivalent: 177); 3, 4-epoxycyclohexylmethyl 3, 4-epoxycyclohexylformate, Daiiluo Chemicals Co., Ltd. (CELLOXIDE 2021P, epoxy equivalent weight 125); and (3) celluloid CELLOXIDE 8000 with an epoxy equivalent of 100, and celluloid chemical industry Co.
The bisphenol A epoxy resin includes, but is not limited to, JER1002, having an epoxy equivalent of 600 to 700, Mitsubishi chemical corporation; JER1004, epoxy equivalent 875-975, Mitsubishi chemical corporation; ER1007, having an epoxy equivalent of 1750 to 2200, manufactured by Mitsubishi chemical corporation; JER1009, epoxy equivalent of 2400-3300, Mitsubishi chemical corporation; JER1010, epoxy equivalent of 3000-5000, Mitsubishi chemical corporation; JER1003F, the epoxy equivalent is 700-800, Mitsubishi chemical corporation; NPES-301, epoxy equivalent of 450-500, south Asia plastics industries, Ltd; NPES-302, epoxy equivalent 600-700, south Asia plastics industries, Inc.; NPES-303, epoxy equivalent weight 800-900, south Asia plastics industries, Ltd; NPES-304, epoxy equivalent 900-1000, south Asia plastics industries GmbH; NPES-901, epoxy equivalent 450-500, south Asia plastics industries GmbH; NPES-902, epoxy equivalent 600-650, south Asia plastics industries GmbH; NPES-903, epoxy equivalent 70-750, south Asia plastics industries, Ltd; NPES-904, epoxy equivalent 780-850, south Asia plastics industries, Inc.; NPES-905, epoxy equivalent 930-960, south Asia plastics industries GmbH.
Examples of the hydrogenated bisphenol A epoxy resin include, but are not limited to, YX-8000, epoxy equivalent 205, Mitsubishi chemical corporation; YX-8040, epoxy equivalent 1000, Mitsubishi chemical corporation; YX-8034, epoxide equivalent 290, Mitsubishi chemical corporation; YL-6753, epoxy equivalent 180, Mitsubishi chemical corporation.
The bisphenol F epoxy resin includes but is not limited to NPEF-170, epoxy equivalent 160-180, Nanya Plastic industries, Ltd; NPEF-175, epoxy equivalent 160-180, southern Asia plastics industry Limited; NPEF-176, epoxy equivalent of 170-190, south Asia plastics industries, Ltd; NPEF-185, epoxy equivalent of 170-190, south Asia plastics industries, Ltd; NPEF-187, epoxy equivalent 175-185, south Asia plastics industries GmbH; NPEF-500, epoxy equivalent of 164-170, south Asia plastics industries, Ltd.
The epoxy silica gel composite epoxy resin comprises but is not limited to ERS-Si1200, epoxy equivalent weight is 1100-1200, Mitsubishi chemical corporation; ERS-Si1700, epoxy equivalent 200, Mitsubishi chemical corporation; XP833, epoxy equivalent 300, mitsubishi chemical co.
The curing agent for the epoxy resin is not particularly limited in the present invention, and an amine curing agent, an acid anhydride curing agent, and a polyhydric phenol curing agent can be selected. Including, but not limited to, aliphatic and alicyclic amines such as bis (4-aminocyclohexyl) methane, bis (aminomethyl) cyclohexane, o-tolylenediamine, 3, 9-bis (3-aminopropyl) -2,4,8, 10-tetraspiro [5,5] undecane, aromatic amines such as m-phenylenediamine, diaminodiphenylmethane, and diaminodiphenylsulfone, tertiary amines such as benzyldimethylamine, 2,4, 6-tris (dimethylaminomethyl) phenol, and 1, 8-diazabicyclo (5,4,0) -undecene-7, 1, 5-azabicyclo (4,3,0) -nonene-7, and salts thereof; aromatic anhydrides such as phthalic anhydride, trimellitic anhydride and pyromellitic anhydride, and cyclic aliphatic anhydrides such as tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, nadic methyl anhydride, dodecenyl succinic anhydride and trialkyltetrahydrophthalic anhydride; catechol, resorcinol, hydroquinone, bisphenol F, bisphenol a, bisphenol S, bisphenol, phenol novolak, cresol novolak, novolak of 2-membered phenol such as bisphenol a, trishydroxyphenylmethane, aralkylpolyphenols, dicyclopentadiene polyphenols; amine BF3 complex, aliphatic sulfonium salt, aromatic sulfonium salt, iodonium salt, phosphonium salt, and other Bronsted acid salts, dicyandiamide, adipic acid dihydrazide, phthalic acid dihydrazide and other organic acid hydrazides, resol resin, adipic acid, sebacic acid, terephthalic acid, trimellitic acid, carboxyl group-containing polyester and other polycarboxylic acids.
The second aspect of the present invention provides an optical epoxy molding compound for LED packaging, wherein when the thickness of a sample of the optical epoxy molding compound for LED packaging is 0.190-0.220 mm, the L value measured according to the ink color measurement method as described above is 59-69; the value of a is 1.6-2.6; the b value is 5.8 to 7.4.
In some embodiments, when the sample thickness of the optical epoxy molding compound for LED packaging is 0.195-0.215 mm, the measured L value according to the ink color measurement method is 61-67; the value of a is 1.7-2.5; the b value is 6.0 to 7.2.
In some embodiments, when the sample thickness of the optical epoxy molding compound for LED packaging is 0.240-0.260 mm, the measured L value according to the ink color measurement method is 54-64; the value of a is 2.1-3.1; the b value is 6.3 to 7.9.
In some embodiments, when the thickness of the sample of the optical epoxy molding compound for LED packaging is 0.245-0.255 mm, the L value measured according to the ink color measurement method as described above is 56-62; the value of a is 2.2-3.0; the b value is 6.5 to 7.7.
In some embodiments, when the sample thickness of the optical epoxy molding compound for LED packaging is 0.290-0.310 mm, the L value measured according to the ink color measurement method as described above is 50-60; the value of a is 2.4-3.4; the b value is 6.6-8.2.
In some embodiments, when the sample thickness of the optical epoxy molding compound for LED packaging is 0.295-0.305 mm, the measured L value according to the ink color measuring method is 52-58; the value of a is 2.5-3.3; the b value is 6.8 to 8.0.
Examples
The following examples were tested using a Wirfu photoelectric colorimeter (model WR-18, CIELAB for color space, color difference equation Δ ELab, light mode SCI, light source type D65, and measuring caliber 8 mm).
Example 1: the ink color of the optical epoxy plastic packaging material for LED (RGB discrete device) packaging is measured by adopting the following method, and the L value is 64 +/-5; a value: 2.1 plus or minus 0.5; b value: 6.6 +/-0.8.
The specific test method comprises the following steps:
1) opening a power supply of a vacuum pressing machine, setting program parameters required by pressing sheets, placing upper and lower cover plates, selecting a gasket with required thickness, wherein the surfaces of the upper and lower gaskets and the cover plate are clean without foreign matters, then placing release paper on the gasket, placing a proper amount of resin powder for an optical epoxy plastic packaging material for LED packaging on the release paper, placing a layer of release paper above the powder, covering the cover plate, closing the pressing sheets, and carrying out pressure maintaining and curing to obtain a sample;
2) and cutting the sample prepared in the previous step into squares with the edges of 2.8mm x 2.8mm, placing the sample on a standard white board, testing the color by using a Weifu photoelectric color difference meter under the condition of sealing and no light, and recording the measured L, a and b color data.
Wherein the test sample has a thickness of 0.205 ± 0.015 mm; the resin of the optical epoxy plastic packaging material for LED packaging is powder prepared by mixing 35 parts of alicyclic epoxy resin EHPE-3150, 30 parts of phthalic anhydride and a proper amount of melanin (a mixture of nano carbon black and nano copper oxide) and granulating, wherein the particle size of the powder is 0.5mm, and the light transmittance is 2%.
Example 2: the optical epoxy plastic packaging material for LED packaging and the ink color measuring method are provided, the ink color of the optical epoxy plastic packaging material for LED packaging is measured by the following method, and the L value is 64 +/-3; a value: 2.1 plus or minus 0.4; b value: 6.6 +/-0.6.
The specific test method comprises the following steps:
1) opening a power supply of a vacuum pressing machine, setting program parameters required by pressing sheets, placing upper and lower cover plates, selecting a gasket with required thickness, wherein the surfaces of the upper and lower gaskets and the cover plate are clean without foreign matters, then placing release paper on the gasket, placing a proper amount of resin powder for an optical epoxy plastic packaging material for LED packaging on the release paper, placing a layer of release paper above the powder, covering the cover plate, closing the pressing sheets, and carrying out pressure maintaining and curing to obtain a sample;
2) and cutting the sample prepared in the previous step into a circle with the diameter of 2.8mm, placing the sample on a standard white board, testing the color by using a Weifu photoelectric color difference meter under the condition of sealing and no light, and recording the measured L, a and b color data.
Wherein the test sample has a thickness of 0.205 ± 0.010 mm; the resin of the optical epoxy plastic packaging material for LED packaging is powder prepared by mixing 35 parts of alicyclic epoxy resin EHPE-3150, 30 parts of phthalic anhydride and a proper amount of melanin (a mixture of nano carbon black and nano copper oxide) and granulating, wherein the particle size of the powder is 0.5mm, and the light transmittance is 2%.
Example 3: the ink color of the optical epoxy plastic packaging material for LED packaging is measured by the following method, and the L value is as follows: 59 plus or minus 5; a value: 2.6 plus or minus 0.5; b value: 7.1 +/-0.8.
The specific test method comprises the following steps:
1) opening a power supply of a vacuum pressing machine, setting program parameters required by pressing sheets, placing upper and lower cover plates, selecting a gasket with required thickness, wherein the surfaces of the upper and lower gaskets and the cover plate are clean without foreign matters, then placing release paper on the gasket, placing a proper amount of resin powder for an optical epoxy plastic packaging material for LED packaging on the release paper, placing a layer of release paper above the powder, covering the cover plate, closing the pressing sheets, and carrying out pressure maintaining and curing to obtain a sample;
2) and cutting the sample prepared in the previous step into a circle with the diameter of 2.8mm, placing the sample on a standard white board, testing the color by using a Weifu photoelectric color difference meter under the condition of sealing and no light, and recording the measured L, a and b color data.
Wherein the thickness of the test sample is 0.250 + -0.010 mm; the resin of the optical epoxy plastic packaging material for LED packaging is powder prepared by mixing 35 parts of alicyclic epoxy resin EHPE-3150, 30 parts of phthalic anhydride and a proper amount of melanin (a mixture of nano carbon black and nano copper oxide) and granulating, wherein the particle size of the powder is 0.5mm, and the light transmittance is 2%.
Example 4: the ink color of the optical epoxy plastic packaging material for LED packaging is measured by the following method, and the L value is as follows: 59 plus or minus 3; a value: 2.6 plus or minus 0.4; b value: 7.1 +/-0.6.
The specific test method comprises the following steps:
1) opening a power supply of a vacuum pressing machine, setting program parameters required by pressing sheets, placing upper and lower cover plates, selecting a gasket with required thickness, wherein the surfaces of the upper and lower gaskets and the cover plate are clean without foreign matters, then placing release paper on the gasket, placing a proper amount of resin powder for an optical epoxy plastic packaging material for LED packaging on the release paper, placing a layer of release paper above the powder, covering the cover plate, closing the pressing sheets, and carrying out pressure maintaining and curing to obtain a sample;
2) and cutting the sample prepared in the previous step into a circle with the diameter of 2.8mm, placing the sample on a standard white board, testing the color by using a Weifu photoelectric color difference meter under the condition of sealing and no light, and recording the measured L, a and b color data.
Wherein the thickness of the test sample is 0.250 + -0.005 mm; the resin of the optical epoxy plastic packaging material for LED packaging is powder prepared by mixing 35 parts of alicyclic epoxy resin EHPE-3150, 30 parts of phthalic anhydride and a proper amount of melanin (a mixture of nano carbon black and nano copper oxide) and granulating, wherein the particle size of the powder is 0.5mm, and the light transmittance is 2%.
Example 5: the ink color of the optical epoxy plastic packaging material for LED packaging is measured by the following method, and the L value is as follows: 55 plus or minus 5; a value: 2.9 plus or minus 0.5; b value: 7.4 +/-0.8.
The specific test method comprises the following steps:
1) opening a power supply of a vacuum pressing machine, setting program parameters required by pressing sheets, placing upper and lower cover plates, selecting a gasket with required thickness, wherein the surfaces of the upper and lower gaskets and the cover plate are clean without foreign matters, then placing release paper on the gasket, placing a proper amount of resin powder for an optical epoxy plastic packaging material for LED packaging on the release paper, placing a layer of release paper above the powder, covering the cover plate, closing the pressing sheets, and carrying out pressure maintaining and curing to obtain a sample;
2) and cutting the sample prepared in the previous step into a circle with the diameter of 2.8mm, placing the sample on a standard white board, testing the color by using a Weifu photoelectric color difference meter under the condition of sealing and no light, and recording the measured L, a and b color data.
Wherein the thickness of the test sample is 0.300 + -0.010 mm; the resin of the optical epoxy plastic packaging material for LED packaging is powder prepared by mixing 35 parts of alicyclic epoxy resin EHPE-3150, 30 parts of phthalic anhydride and a proper amount of melanin (a mixture of nano carbon black and nano copper oxide) and granulating, wherein the particle size of the powder is 0.5mm, and the light transmittance is 2%.
Example 6: the ink color of the optical epoxy plastic packaging material for LED packaging is measured by the following method, and the L value is as follows: 55 +/-3; a value: 2.9 plus or minus 0.4; b value: 7.4 +/-0.6.
The specific test method comprises the following steps:
1) opening a power supply of a vacuum pressing machine, setting program parameters required by pressing sheets, placing upper and lower cover plates, selecting a gasket with required thickness, wherein the surfaces of the upper and lower gaskets and the cover plate are clean without foreign matters, then placing release paper on the gasket, placing a proper amount of resin powder for an optical epoxy plastic packaging material for LED packaging on the release paper, placing a layer of release paper above the powder, covering the cover plate, closing the pressing sheets, and carrying out pressure maintaining and curing to obtain a sample;
2) and cutting the sample prepared in the previous step into a circle with the diameter of 2.8mm, placing the sample on a standard white board, testing the color by using a Weifu photoelectric color difference meter under the condition of sealing and no light, and recording the measured L, a and b color data.
Wherein the thickness of the test sample is 0.300 + -0.005 mm; the resin of the optical epoxy plastic packaging material for LED packaging is powder prepared by mixing 35 parts of alicyclic epoxy resin EHPE-3150, 30 parts of phthalic anhydride and a proper amount of melanin (a mixture of nano carbon black and nano copper oxide) and granulating, wherein the particle size of the powder is 0.5mm, and the light transmittance is 2%.
The method provided by the invention can measure, distinguish and check the color of the packaging resin, and judge whether the color is qualified or not and whether the color is consistent with the actual inspection result of a customer or not. In addition, the method provided by the invention has high detection accuracy and small measurement error, and can accurately judge whether the color of the epoxy plastic packaging material for the target RGB and LED meets the requirement or not by adopting a small amount of samples.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in other forms, and any person skilled in the art may modify or change the technical content of the above disclosed embodiment into equivalent embodiments with equivalent changes, but all those simple modifications, equivalent changes and modifications made to the above embodiments according to the technical spirit of the present invention still belong to the protection scope of the present invention.

Claims (10)

1. The ink color measuring method of the optical epoxy plastic packaging material for LED packaging is characterized by comprising the steps of preparing a sample and testing the sample; the preparation method of the sample is a tablet pressing method or a transfer injection molding method;
the testing of the sample comprises the following steps: cutting the prepared optical epoxy plastic packaging material sample for LED packaging, placing the sample on a standard white board, keeping the sample in a sealed and lightproof environment, and testing by using a color difference meter to obtain the color data of the L value, the a value and the b value of the ink color.
2. The method for measuring the ink color of the optical epoxy molding compound for LED packaging according to claim 1, wherein the thickness of the sample is 0.20 to 0.60 mm; preferably, the thickness of the sample is 0.20-0.30 mm.
3. The method for measuring the ink color of the optical epoxy molding compound for LED packaging according to claim 1 or 2, wherein the sheet pressing method comprises the steps of:
keeping the optical epoxy plastic packaging material applied to LED packaging in vacuum at high temperature by using a gasket with fixed thickness and a vacuum laminating machine, removing bubbles, then carrying out fusion lamination, and carrying out curing molding to obtain the sample; wherein the thickness of the cured and molded sample is 0.20-0.60 mm; preferably, the thickness of the film is 0.20-0.30 mm.
4. The method for measuring the ink color of the optical epoxy molding compound for LED package according to claim 1 or 2, wherein the roll-in injection molding method comprises the steps of:
putting the optical epoxy plastic packaging material applied to the LED packaging into an injection molding hole by using a mold with a fixed thickness, applying pressure, and performing injection molding at the melting temperature of the optical epoxy plastic packaging material applied to the LED packaging in a mode of transferring into injection molding to obtain the sample; wherein the thickness of the die is 0.20-0.60 mm; preferably, the thickness of the film is 0.20-0.30 mm.
5. An optical epoxy molding compound for LED packaging, characterized in that when the sample thickness of the optical epoxy molding compound for LED packaging is 0.190-0.220 mm, the L value measured by the ink color measurement method according to any one of claims 1-4 is 59-69; the value of a is 1.6-2.6; the b value is 5.8 to 7.4.
6. The optical epoxy molding compound for LED package according to claim 5, wherein when the sample thickness of the optical epoxy molding compound for LED package is 0.195 to 0.215mm, the L value measured by the ink color measurement method according to any one of claims 1 to 4 is 61 to 67; the value of a is 1.7-2.5; the b value is 6.0 to 7.2.
7. An optical epoxy molding compound for LED packaging, characterized in that when the sample thickness of the optical epoxy molding compound for LED packaging is 0.240-0.260 mm, the L value measured by the ink color measurement method according to any one of claims 1-4 is 54-64; the value of a is 2.1-3.1; the b value is 6.3 to 7.9.
8. The optical epoxy molding compound for LED packaging according to claim 7, wherein when the thickness of the sample for LED optical epoxy molding compound is 0.245 to 0.255mm, the L value measured by the ink color measurement method according to any one of claims 1 to 4 is 56 to 62; the value of a is 2.2-3.0; the b value is 6.5 to 7.7.
9. An optical epoxy molding compound for LED packaging, characterized in that when the thickness of a sample of the optical epoxy molding compound for LED is 0.290-0.310 mm, the L value measured by the ink color measurement method according to any one of claims 1-4 is 50-60; the value of a is 2.4-3.4; the b value is 6.6-8.2.
10. The optical epoxy molding compound for LED packaging according to claim 9, wherein when the sample thickness of the optical epoxy molding compound for LED packaging is 0.295 to 0.305mm, the L value measured by the ink color measurement method according to any one of claims 1 to 4 is 52 to 58; the value of a is 2.5-3.3; the b value is 6.8 to 8.0.
CN202010338552.9A 2020-04-26 2020-04-26 Optical epoxy plastic packaging material for LED packaging and ink color measuring method thereof Pending CN111380814A (en)

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