JP2018027670A - Resin molding device and resin molded article production method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin molding device capable of reducing adverse effect by dust generated from a resin material.SOLUTION: Provided is a resin molding device 10 comprising: a first storage part 111 storing a granular or powdery resin material P; a second storage part 112 receiving the resin material P stored in the first storage part 111, temporarily storing the same, and falling off the resin material P, through a resin material feed passage, from an outlet (a second lower opening 132) of the resin material feed passage while measuring the same; second storage part covers (an upper cover 171, a lower cover 172) surrounding the circumference of the second storage part 112 including the outlet of the resin material feed passage; and a suction force variable dust collecting apparatus (a dust collector 18, a first suction tube 181, a second suction tube 182, a first suction force regulation part 1811, a second suction force regulation part 1811 and a second suction force regulation part 1821).SELECTED DRAWING: Figure 1

Description

  The present invention relates to a resin molding apparatus and a resin molded product manufacturing method for manufacturing a resin molded product such as a resin sealed product in which an electronic component such as a semiconductor chip is resin sealed.

  In order to protect an electronic component from an environment such as light, heat, and moisture, the electronic component is generally sealed with a resin. Examples of the resin sealing method include a compression molding method and a transfer molding method. In the compression molding method, a mold consisting of a lower mold and an upper mold is used, resin material is supplied to the cavity of the lower mold, a board with electronic components mounted is attached to the upper mold, and then the lower mold and the upper mold are heated. However, molding is performed by clamping both of them. In the transfer molding method, the substrate is attached to one of the upper mold and the lower mold, and then the lower mold and the upper mold are heated and both are clamped, and the resin is pressed into the cavity with a plunger. Done. In the transfer molding method, a part of the resin remains in the path for feeding the resin from the plunger to the cavity, resulting in waste, and the problem that the semiconductor substrate and wiring are damaged by the flow of the resin occurs. In recent years, compression molding has become the mainstream.

  In compression molding, in general, a granular resin material or a powder resin material is used as a resin material supplied to the lower mold because it is easy to handle. Here, there is no strict definition for “granular resin material” and “powder resin material”, but in general, a granular resin material having a particle size of 0.1 to 3.0 mm, a particle size of less than 0.1 mm. This is called a powdered resin material. When using a granular resin material or a powder resin material, the resin material must be supplied as evenly as possible into the cavity of the lower mold in order to reduce the flow of the resin material in the cavity during molding. In the compression molding apparatus described in Patent Document 1, after the resin material is supplied from the resin material supply unit to the resin material transfer tray corresponding to the shape of the cavity with a uniform thickness, the lower part provided in the mold clamping mechanism. By moving the resin material transfer tray over the mold and opening the shutter provided at the bottom of the resin material transfer tray, the resin material is supplied into the cavity of the lower mold. In the compression molding apparatus described in Patent Document 2, a release film is stretched instead of providing a shutter at the bottom of the resin material transfer tray, and the resin material transfer tray supplied with the resin material is placed on the lower mold in the same manner as described above. Then, the resin material in the resin material transfer tray is introduced into the lower mold cavity by sucking the release film from the lower mold side.

  In order to supply the resin material to the resin material transfer tray, for example, a powder supply device described in Patent Document 3 can be used. In Patent Document 3, although not limited to resin materials, various powders are targeted, but in the following, granular or powdery resin materials will be described. This apparatus has two storage parts (referred to as “first storage part” and “second storage part”) that store the resin material. The first container is disposed on the second container, and the second container is disposed on a container (resin material transfer tray in this case) to which the resin material is supplied. The resin material is supplied to the resin material transfer tray through the two accommodating portions. A first vibration applying unit that applies vibration to the first storage unit is connected to the first storage unit, and similarly, a second vibration applying unit that applies vibration to the second storage unit is connected to the second storage unit. Has been. The second storage part is provided with a measuring part for measuring the resin material stored in the second storage part.

  The operation of this powder supply apparatus will be described. First, the resin material transfer tray is disposed below the second storage part. Next, vibration is applied from the first vibration applying unit to the first storage unit in a state where a sufficient amount of the resin material is stored in the first storage unit. Thereby, the resin material accommodated in the 1st accommodating part falls to the 2nd accommodating part gradually. By stopping the application of vibration from the first vibration application unit to the first storage unit when a sufficiently large amount of resin material is supplied to the resin material transfer tray to the second storage unit, The supply of the resin material to the second housing part is stopped.

  Next, vibration is applied from the second vibration applying unit to the second housing unit. Thereby, the resin material accommodated in the 2nd accommodating part falls gradually, and is supplied to the resin material transfer tray. During this time, the resin material transfer tray is moved in a substantially horizontal direction so that the resin material is supplied to the resin material transfer tray with a uniform thickness. At the same time, the measuring unit measures the resin material in the second storage unit. And when the resin material in a 2nd accommodating part reduces by the quantity which should be supplied to a resin material transfer tray, a 2nd vibration provision part stops the provision of the vibration to a 2nd accommodating part. As a result, the resin material is supplied to the resin material transfer tray just in an amount to be supplied.

JP 2007-125783 A JP 2010-036542 JP 09-005148 A

  When the powdery resin material is supplied to the resin material supply unit resin material transfer tray, the resin material is vibrated by the first vibration applying unit or the second vibration applying unit, so that a part of the resin material generates dust. Occurs. In addition, when the granular resin material is supplied to the resin material transfer tray of the resin material supply unit, the powder may adhere to the surface of each granule during the production of the granular resin material. Dust is generated as in the case of the resin material.

  The problem to be solved by the present invention is to provide a resin molding apparatus and a resin molded product manufacturing method that can reduce the adverse effects of dust generated from a resin material.

In order to solve the above problems, the first aspect of the resin molding apparatus according to the present invention is:
a) a first housing part for housing a granular or powdery resin material;
b) a second storage portion that receives and temporarily stores the resin material stored in the first storage portion, and drops the resin material from the outlet of the resin material supply passage through the resin material supply passage while weighing the resin material; ,
c) a second housing portion cover surrounding the second housing portion including the outlet of the resin material supply passage;
d) A dust collecting device having a variable suction force that sucks dust in the internal space of the second housing portion cover.

The second aspect of the resin molding apparatus according to the present invention is:
a) a first housing part for housing a granular or powdery resin material;
b) a second storage portion that receives and temporarily stores the resin material stored in the first storage portion, and drops the resin material from the outlet of the resin material supply passage through the resin material supply passage while weighing the resin material; ,
c) a first accommodating portion outlet that is an outlet of the resin material for supplying the resin material accommodated in the second accommodating portion provided in the first accommodating portion;
d) a first housing part cover surrounding the first housing part including the first housing part outlet;
e) a second housing portion cover surrounding the second housing portion including the outlet of the resin material supply passage;
f) a first container-side dust collector that sucks dust in the internal space of the first container cover with a first suction force;
g) A second container-side dust collector that sucks dust in the internal space of the second container cover with a second suction force that is weaker than the first suction force.

According to a first aspect of the method for producing a resin molded product according to the present invention, the resin material transfer tray is moved to a mold after the granular or powdery resin material is supplied to the resin material transfer tray. A resin material supply step of supplying the resin material to the mold, and a resin molding step of performing resin molding by clamping the mold supplied with the resin material,
In the resin material supply step,
The granular or powdery resin material is accommodated in the first accommodating portion, the resin material accommodated in the first accommodating portion is received by the second accommodating portion, and temporarily accommodated, and the resin material is measured while measuring the resin material. Supplying the resin material transfer tray via the supply passage;
While supplying the resin material from the second container to the resin material transfer tray, dust in the internal space of the second container cover surrounding the second container including the outlet of the resin material supply passage, The resin material is not sucked and sucked by a suction force that sucks the dust.

According to a second aspect of the method for producing a resin molded product according to the present invention, after the granular or powdery resin material is supplied to the resin material transfer tray, the resin material transfer tray is moved to a molding die, and the resin material transfer tray is moved. A resin material supply step of supplying the resin material to the mold, and a resin molding step of performing resin molding by clamping the mold supplied with the resin material,
In the resin material supply step,
The granular or powdery resin material is accommodated in the first accommodating portion, the resin material accommodated in the first accommodating portion is received by the second accommodating portion, and temporarily accommodated, and the resin material is measured while measuring the resin material. Supplying the resin material transfer tray via the supply passage;
While supplying the resin material from the second storage portion to the resin material transfer tray, the first suction force sucks dust in the internal space of the first storage portion cover surrounding the first storage portion, and Dust in the internal space of the second housing part cover surrounding the second housing part including the outlet of the resin material supply passage is sucked with a second suction force that is weaker than the first suction force.

  By this invention, the bad influence by the dust which generate | occur | produces from a resin material can be reduced.

The longitudinal cross-sectional view which shows one Embodiment of the resin material supply part in the resin molding apparatus which concerns on this invention. The front view which shows the attraction | suction force adjustment part in the resin material supply part of this embodiment. Schematic which shows an example of a compression molding part. Schematic which shows the example of a resin molding apparatus provided with a material acceptance module, a shaping | molding module, and a payout module.

  According to the resin molding apparatus of the first and second aspects of the present invention, the resin material is dropped from the outlet while the resin material transfer tray is disposed immediately below the outlet of the resin material supply passage. Resin material is supplied to the material transfer tray. At that time, by surrounding the second housing portion including the outlet of the resin material supply passage with the second housing portion cover, by sucking the dust in the internal space of the second housing portion cover with a dust collector, Dust is prevented from scattering in the vicinity of the resin material transfer tray to which the resin material is supplied from the outlet.

  If dust is scattered in the vicinity of the resin material transfer tray, the powder derived from the resin material adheres to the resin material transfer tray. Then, when the resin material in the resin material transfer tray is introduced into the cavity of the lower mold, the powder is transferred to the mold (upper mold and / or lower mold). Adhesion may be hindered by the powder. On the other hand, in the resin molding apparatus according to the first and second aspects of the present invention, dust is prevented from scattering near the resin material transfer tray as described above. It is not disturbed by the powder derived from the material.

  However, if the suction force by the dust collector is too strong, not only dust scattered in the vicinity of the resin material transfer tray, but also granular or powdery resin material to be supplied from the second container to the resin material transfer tray The resin material is sucked, and the resin material cannot be supplied to the resin material transfer tray in the correct amount measured in the second storage unit. On the other hand, if the suction force is too weak, the dust cannot be sufficiently sucked. Therefore, in the resin molding apparatus according to the first aspect, a dust collecting apparatus having a variable suction force is used. The size of the suction force that causes the resin material itself to be sucked in, and the size of the suction force that cannot sufficiently suck dust, differ depending on the resin material, so it can be used by using a dust collector with variable suction force. Depending on the resin material to be used, the suction force can be set so that the resin material supplied to the resin material transfer tray is not sucked and dust scattered in the vicinity of the resin material transfer tray is sufficiently sucked.

In the resin molding apparatus according to the first aspect,
A first accommodating portion outlet which is an outlet of a resin material for supplying a resin material accommodated in the second accommodating portion provided in the first accommodating portion;
A first housing cover surrounding the first housing portion including the first housing portion outlet;
A first storage unit-side dust collector that sucks dust in the internal space of the first storage unit cover may be provided.

  With this configuration, dust is prevented from scattering from the resin material in the vicinity of the outlet of the first housing portion. Here, even if the first storage unit-side dust collecting device sucks the resin material, the first storage unit side dust collector measures the second storage unit in the subsequent stage, so that the correct amount of the resin material is applied to the mold through the resin material transfer tray. However, the suction force may be unchanged in that it is supplied. Of course, it is also possible to prevent the resin material from being sucked by using a first container-side dust collecting device having a variable suction force. In any case, the suction force of the dust collecting device (corresponding to the “second housing portion side dust collecting device” in the resin molding device of the second aspect) that sucks dust in the internal space of the second housing portion cover is used. By making it weaker than the suction force of the first storage unit-side dust collector, it is possible to more reliably prevent the resin material from being sucked in the internal space of the second storage unit cover, and thereby a correct amount of resin material can be obtained. The mold can be supplied. Further, a common suction device for sucking dust may be used for the dust collecting device for sucking dust in the internal space of the second housing portion cover and the first housing portion side dust collecting device. Different suction devices may be used for the dust devices. Furthermore, the first housing cover and the second housing cover may be an integral (one) cover. When such an integrated cover is used, the internal space of the cover is also integrated. However, dust may be sucked from the position close to the first storage portion and the position close to the second storage portion in the internal space. .

  On the other hand, in the resin molding apparatus according to the second aspect, the second storage part cover is surrounded by the second storage part cover as in the first aspect, and the first storage part including the first storage part outlet is further included. The periphery is surrounded by the first housing cover. In addition, the dust in the internal space of the first housing part cover is sucked by the first housing part-side dust collecting device with the first suction force, and the internal space of the second housing part cover that surrounds the second housing part to be measured is measured. Are sucked with a second suction force weaker than the first suction force by the second container-side dust collector. Thereby, it can suppress that the resin material supplied to the resin material transfer tray in the internal space of the 2nd accommodating part cover is attracted | sucked.

  In the resin molding apparatus according to the second aspect, it is desirable that the second suction force be variable. With this configuration, depending on the resin material to be used, the second suction force is set so that the resin material supplied to the resin material transfer tray is not sucked and dust scattered in the vicinity of the resin material transfer tray is sucked sufficiently. It becomes possible to set, and the suction of the resin material supplied to the resin material transfer tray is suppressed.

  In the resin molding apparatus according to the second aspect, even if the resin material is sucked in the internal space of the first housing portion cover, the second housing portion in the subsequent stage performs weighing, so that the resin material is transferred via the resin material transfer tray. Thus, the first suction force may be unchanged in terms of supplying a correct amount of resin material to the mold. Of course, the first suction force may be variable.

Of the resin molding device according to the first aspect and the resin molding device according to the second aspect, the second suction force is variable, and the dust collector (in the second aspect, the second container side dust collector). Is
A suction device for sucking air;
A suction pipe connecting the suction device and the internal space of the second housing cover;
An opening provided in the suction tube;
It is desirable to provide a lid provided in the opening, and a movable lid that adjusts an opening area of the opening according to the position of the lid.

  According to this configuration, by adjusting the opening area of the opening provided in the suction pipe with the movable lid, the suction force by the suction device can be reduced by the suction force sucked from the internal space of the second housing portion cover and the opening of the opening. It is divided into two suction forces called suction force that is sucked from the outer space. As a result, the larger the opening area of the opening, the smaller the suction force that is sucked from the internal space of the second housing portion cover. Therefore, the suction force from the internal space can be made variable by adjusting the opening area with the movable lid. Since the opening area can be easily and finely adjusted by the movable lid, the suction force can be easily and finely adjusted.

  The resin molding apparatus according to the first and second aspects may include a vibration applying unit that applies vibration to the resin material supply passage. By applying vibration to the resin material supply passage by the vibration applying unit, the resin material is supplied from the second housing unit to the resin material transfer tray. When such a vibration imparting part is used, a gap may be provided between the second accommodating part and the second accommodating part cover so that the vibration of the second accommodating part is not hindered. In this case, since dust easily leaks out of the second housing portion cover through the gap, it is particularly important to use a dust collector as in the present invention.

  Hereinafter, more specific embodiments of the resin molding apparatus and the resin molded product manufacturing method according to the present invention will be described with reference to FIGS.

  The resin molding apparatus according to this embodiment includes a resin material supply unit 10 illustrated in FIG. 1 and a compression molding unit 20 (described later) having a mold clamping device and the like. First, the configuration and operation of the resin material supply unit 10 will be described.

  The resin material supply unit 10 includes a first storage unit 111 and a second storage unit 112 that store the resin material P.

  The first accommodating part 111 includes a first upper opening 121 and an opening / closing lid 1211 for opening and closing the first upper opening 121 at the upper part, and a first lower opening 131 at a part of the lower part. In addition, the first accommodating portion 111 is in contact with a first vibration imparting portion 141 that imparts vibrations thereto.

  The second accommodating portion 112 is disposed below the first lower opening 131, includes the second upper opening 122 at a position facing the first lower opening 131, and the second lower opening 132 in a part of the lower portion. Is provided. The second housing portion 112 includes a resin material supply path 1121 extending substantially horizontally from directly below the second lower opening 132, and has a second lower opening 132 at the outlet of the resin material supply path 1121. Further, the second accommodating portion 112 is in contact with the second vibration imparting portion 142 at a position directly below the second upper opening 122, and includes the measuring portion 15 below the second vibration imparting portion 142. . The second vibration applying unit 142 applies vibration to the second storage unit 112 (particularly the resin material supply path 1121), and the measuring unit 15 measures the mass of the resin material in the second storage unit 112. .

  In addition, the resin material supply unit 10 includes a resin material transfer tray moving mechanism 16 that arranges the resin material transfer tray T below the second lower opening 132.

  The resin material supply unit 10 further includes an upper cover 171 that covers the top of the first storage unit 111 and the second storage unit 112, and a second lower opening 132 of the second storage unit 112. 2 A lower cover 172 that covers the path of dropping from the lower opening 132 to the resin material transfer tray T is provided. Between the upper cover 171 and the second housing portion 112 and between the lower cover 172 and the second housing portion 112, vibrations applied to the second housing portion 112 by the second vibration applying portion 142 are applied to these covers. A gap is provided to prevent conduction. For the same reason, a gap is also provided between the upper cover 171 and the first housing portion 111.

  Since both the upper cover 171 and the lower cover 172 cover a part of the second housing portion 112, they correspond to the second housing portion cover. Further, since the upper cover 171 covers not only the second housing portion 112 but also the first housing portion 111, it also corresponds to the first housing portion cover.

One end of the first suction tube 181 is connected to the upper cover 171 at the first connection portion 1711, and one end of the second suction tube 182 is connected to the lower cover 172 at the second connection portion 1721. The other end of the first suction pipe 181 and the other end of the second suction pipe 182 are both connected to a dust collector (suction device) 18. A first connecting portion 1711 shortest path L ₁₂ between the second housing section 112 includes a first connecting portion 1711 slightly longer than the shortest path L ₁₁ between the first lower opening 131, and the second connecting portion 1721 second lower It is longer than the shortest path L ₂ with the opening 132. Here, the first suction pipe 181 is configured to be included in the above-described first storage part-side dust collector, and the second suction pipe 182 is configured to include the above-described dust collector (first aspect) and the second storage part side. It is the structure contained in a dust collector (2nd aspect). In the following, for simplification, the dust collector of the first aspect is also referred to as a “second container side dust collector” as in the second aspect. The dust collector 18 is a component common to the first container side dust collector and the second container side dust collector. In addition, you may provide a dust collector in a 1st accommodating part side dust collector and a 2nd accommodating part side dust collector, respectively.

  The first suction pipe 181 is provided with a first suction force adjusting unit 1811 which is a component of the first storage unit side dust collector, and the second suction pipe 182 is a component of the second storage unit side dust collector. A certain second suction force adjusting unit 1821 is provided. The first suction force adjustment unit 1811 and the second suction force adjustment unit 1821 have the same configuration. As shown in FIG. 2, a part of the tube wall of the first suction tube 181 (second suction tube 182) is used. The flat base portion 184 includes a suction force adjustment portion opening 185 and a movable lid 186 that adjusts the opening area of the suction force adjustment portion opening 185 by sliding along the suction force adjustment portion opening 185. The movable lid 186 is composed of two plate-like members and is provided with two cuts 1861 along the sliding direction. On the tube wall of the first suction pipe 181 (second suction pipe 182), two bolts 1862 are attached so that two sets are in total, and the two sets of the bolts 1862 sandwich the suction force adjusting portion opening 185. The movable lid 186 is attached to the first suction pipe 181 (second suction pipe 182) by inserting two notches 1861 of one plate-like member into one set of bolts 1862. By moving these two plate-like members in the extending direction of the notch 1861, the opening area of the suction force adjusting portion opening 185 is adjusted as described above. The movable lid 186 is manually moved by the user in this embodiment, but may be moved using power such as a motor. When such power is used, the control unit 19 may control the opening area of the suction force adjusting unit opening 185.

  In addition to the first suction pipe 181 and the second suction pipe 182, a third suction pipe 183 is connected to the dust collector 18. Part of the third suction pipe 183 is a flexible tube, and a suction port 1831 that is not connected to a component of the resin molding apparatus including the resin material supply unit 10 is provided at the tip. Is provided. The user of the resin molding apparatus moves the suction port 1831 to a desired position in the resin molding apparatus while bending the flexible tube and sucks the dust collector 18 from the suction port 1831 through the third suction pipe 183 to be present at the position. Garbage can be removed.

  In addition, the resin material supply unit 10 is provided with a control unit 19 that controls the operation of the entire resin material supply unit 10.

The operation of the resin material supply unit 10 will be described.
Before the supply of the granular resin material P to the resin material transfer tray T is started, a sufficient amount of the resin material P is supplied from the first upper opening 121 into the first accommodating portion 111 and the dust collector 18 is supplied. To start suction in the upper cover 171 and the lower cover 172. Here, depending on the particle size and material of the granules of the resin material supplied to the resin material transfer tray T, and the particle size of the fine powder adhering to the granules of the resin material, the dust collector 18 causes the lower cover 172 to move from the second connection portion 1721. The opening area of the suction force adjusting portion opening 185 of the second suction force adjusting portion 1821 is adjusted so that the suction force for sucking the inside is such that fine particles of powder are sucked without sucking the granules of the resin material. Keep it. This adjustment may be performed based on the result of conducting a simple preliminary experiment in advance with the resin material actually used. On the other hand, since the shortest path L ₁₂ between the first connecting portion 1711 and the second housing section 112 is longer than the shortest path L ₂ between the second connecting portion 1721 and the second lower opening 132, the first connecting portion through a dust collector 18 The suction force for sucking the inside of the upper cover 171 from 1711 can be made stronger than the suction force for sucking the inside of the lower cover 172 from the second connection portion 1721. Of course, the resin material granules are finely powdered without being sucked. The dust is to be sucked.

  In this way, the following operations are performed while the inside of the upper cover 171 and the lower cover 172 is sucked by the dust collector 18. First, the resin material transfer tray T is moved by the resin material transfer tray moving mechanism 16 so as to be disposed below the second lower opening 132. Then, by applying vibration from the first vibration applying unit 141 to the first storage unit 111, the resin material P stored in the first storage unit 111 is transferred to the first lower opening 131 that is an outlet of the first storage unit 111. And is supplied from the second upper opening 122 into the second accommodating portion 112. At that time, dust due to fine powder particles adhering to the granules of the resin material P is scattered between the first lower opening 131 and the second upper opening 122. The dust moves toward the first connection portion 1711 by suction by the dust collector 18 in the upper cover 171 and is collected by the dust collector 18 through the first suction pipe 181. Therefore, the leakage of dust from the gap between the upper cover 171 and the first housing part 111 is suppressed.

  When a larger amount of the resin material P than the amount to be supplied to the resin material transfer tray T is supplied into the second storage unit 112, the first vibration applying unit 141 applies vibration to the first storage unit 111. By stopping, the supply of the resin material into the second housing portion 112 is temporarily stopped.

  Next, by applying vibration from the second vibration applying unit 142 to the second storage unit 112, the resin material P stored in the second storage unit 112 is gradually transferred from the second lower opening 132 to the resin material transfer tray T. Let fall. During this time, the resin material transfer tray T is moved in a substantially horizontal direction by the resin material transfer tray moving mechanism 16 so that the resin material P is supplied into the resin material transfer tray T with a uniform thickness.

  Further, while the vibration is applied from the second vibration applying unit 142 to the second storage unit 112, the resin material P in the second storage unit 112 should be measured by the measuring unit 15 and supplied to the resin material transfer tray T. When the amount of the resin material P in the second housing portion 112 decreases by the amount, the second vibration applying unit 142 stops applying vibration to the second housing portion 112. As a result, the resin material P is supplied just in an amount to be supplied, and the supply of the resin material P to the resin material transfer tray T is completed.

  In this way, while the resin material P is supplied to the resin material transfer tray T, in the vicinity of the second lower opening 132, dust due to fine powder particles is scattered upward and downward. The dust scattered above the second lower opening 132 moves toward the first connection portion 1711 by suction by the dust collector 18 in the upper cover 171 and is collected by the dust collector 18 through the first suction pipe 181. On the other hand, dust scattered below the second lower opening 132 moves toward the second connection portion 1721 by suction by the dust collector 18 in the lower cover 172, and is collected by the dust collector 18 through the second suction pipe 182.

  Here, the dust generated in the internal space of the upper cover 171 is scattered mainly when the resin material P is dropped from the first housing portion 111 and supplied into the second housing portion 112. Since the first container 111 does not measure the resin material, the supply amount of the resin material per unit time is relatively large, so that a relatively large amount of dust is scattered in the internal space of the upper cover 171. Further, the resin material P at the stage of being supplied from the first storage unit 111 into the second storage unit 112 is in a state before measurement. Therefore, by sucking the internal space of the upper cover 171 with a relatively strong suction force, the amount of resin actually used for resin molding is hardly affected, and contamination by dust can be efficiently reduced. On the other hand, the dust collected by sucking the internal space of the lower cover 172 drops the resin material P from the second lower opening 132 of the second housing portion 112 and supplies it to the resin material transfer tray T. Dust scattered on the surface. Since the second container 112 measures the resin material, the amount of resin material supplied per unit time is less than that of the first container 111, and the amount of dust scattered in the internal space of the lower cover 172 is thereby reduced. Less than 171 internal space. Furthermore, since the resin material P at the stage of being supplied from the second storage unit 112 into the resin material transfer tray T is in a state after measurement, when the internal space of the lower cover 172 is sucked with a relatively strong suction force, There is a possibility of affecting the amount of resin used for resin molding. Therefore, in order to collect only dust that contaminates the surroundings as much as possible without affecting the amount of resin actually used for resin molding, the second housing portion cover is more than the suction force to the internal space of the first housing portion cover. Reduce the suction force to the internal space of the.

  The resin material transfer tray T supplied with the resin material P is unloaded from the bottom of the second lower opening 132 by the resin material transfer tray moving mechanism 16 and transferred to the compression molding unit 20. Subsequently, the resin material transfer tray moving mechanism 16 moves the resin material transfer tray T that supplies the resin material P next below the second lower opening 132. Thereafter, the resin material P is supplied to the resin material transfer tray T by the same operation as described above.

  Although the compression molding part 20 is the same as that in the conventional resin molding apparatus, a structure and operation | movement are demonstrated easily using FIG. 3 below.

  In the compression molding unit 20, tie bars 22 (four in total) are erected at four corners of the lower fixed plate 211, and a rectangular upper fixed plate 212 is provided near the upper end of the tie bar 22. A rectangular movable platen 23 is provided between the lower fixed platen 211 and the upper fixed platen 212. The movable platen 23 is provided with holes through which the tie bars 22 pass at the four corners, and can move up and down along the tie bars 22. A mold clamping device 24 that is a device for moving the movable platen 23 up and down is provided on the lower fixed platen 211.

  A lower heater 251 is disposed on the upper surface of the movable platen 23, and a lower mold LM is provided on the lower heater 251. A release film coating device 26 is provided in the lower mold LM. The release film coating device 26 stretches the release film on the cavity MC, and then sucks it from the suction port (not shown) provided on the inner surface of the cavity MC, thereby releasing the mold onto the inner surface of the cavity MC. It covers the film.

  An upper heater 252 is disposed on the lower surface of the upper fixed platen 212, and an upper mold UM is attached below the upper heater 252. A substrate S on which a semiconductor chip is mounted can be attached to the lower surface of the upper mold UM.

  The operation of the compression molding unit 20 is as follows. First, the substrate S on which the semiconductor chip is mounted is attached to the lower surface of the upper mold UM by a substrate moving mechanism (not shown). At the same time, the release film coating device 26 stretches the release film on the inner surface of the cavity MC of the lower mold LM. Next, as described above, the resin material transfer tray T supplied with the resin material P in the resin material supply unit 10 is disposed immediately above the lower mold LM, and the shutter provided at the bottom of the resin material transfer tray T is opened. Thus, the resin material P in the resin material transfer tray T is supplied into the cavity MC. Note that the attachment of the substrate S to the upper mold UM and the supply of the resin material P to the lower mold LM may be performed in the reverse order.

  In this state, the lower heater 251 softens the resin material P in the cavity MC by heating, and the upper heater 252 heats the substrate S. While the resin material P and the substrate S are heated, the movable platen 23 is raised by the mold clamping device 24, the mold (upper mold UM and lower mold LM) is clamped, and the resin material P is cured. After the resin material P is cured, the mold is opened by lowering the movable platen 23 by the mold clamping device 24. Thereby, a resin-sealed product (resin-molded product) in which the semiconductor chip is resin-sealed is obtained. The obtained resin-sealed product is smoothly released from the lower mold LM because the inner surface of the lower mold LM is covered with the release film.

  Another embodiment of the resin molding apparatus according to the present invention will be described with reference to FIG. The resin molding apparatus 30 according to this embodiment includes a material receiving module 31, a molding module 32, and a dispensing module 33. The material receiving module 31 is a device for receiving the resin material P and the substrate S from the outside and sending them to the molding module 32. The material receiving module 31 includes the resin material supply unit 10 described above and a substrate receiving unit 311. One molding module 32 includes one set of the above-described compression molding section 20. Although three molding modules 32 are shown in FIG. 4, an arbitrary number of molding modules 32 can be provided in the resin molding apparatus 30. Even after the resin molding apparatus 30 is assembled and used, the number of molding modules 32 can be increased or decreased. The payout module 33 carries the resin molded product manufactured by the molding module 32 from the molding module 32 and holds it, and has a resin molded product holding portion 331.

  A main transfer device 36 for transferring the substrate S, the resin material transfer tray T, and the resin molded product is provided so as to penetrate the material receiving module 31, one or a plurality of molding modules 32, and the dispensing module 33. The above-described resin material transfer tray moving mechanism 16 is a part of the main transport device 36. In each module, a substrate S, a resin material transfer tray T, and a sub-transport device 37 for transporting a resin molded product are provided between the main transport device 36 and the devices in the module.

  In addition, the resin molding apparatus 30 includes a power source and a control unit (none of which are shown) for operating the modules.

  The operation of the resin molding apparatus 30 will be described. The board | substrate S is hold | maintained at the board | substrate receiving part 311 of the material reception module 31 by the user. The main transport device 36 and the sub transport device 37 transport the substrate S from the substrate receiving unit 311 to the compression molding unit 20 in one of the molding modules 32, and the substrate S is an upper mold UM of the compression molding unit 20. Attach to. Subsequently, the main transport device 36 and the sub transport device 37 carry the resin material transfer tray T into the resin material supply unit 10. The resin material supply unit 10 supplies the resin material P to the resin material transfer tray T as described above. The main transport device 36 and the sub transport device 37 transport the resin material transfer tray T supplied with the resin material P to the compression molding unit 20 of the molding module 32 in which the substrate S is attached to the upper mold UM, and perform the compression molding. After the resin material transfer tray T is arranged on the lower mold LM of the unit 20, the resin material P is supplied from the resin material transfer tray T to the cavity MC of the lower mold LM. After that, the resin material transfer tray T is unloaded from the compression molding unit 20 by the main conveyance device 36 and the sub conveyance device 37, and then the compression molding unit 20 performs compression molding. While the compression molding unit 20 is performing compression molding, by performing the same operation as before on the other compression molding units 20, the plurality of compression molding units 20 perform compression in parallel while shifting the time. Molding can be performed. The resin molded product obtained by the compression molding is carried out from the compression molding unit 20 by the main conveyance device 36 and the sub conveyance device 37, and carried into the resin molded product holding unit 331 of the dispensing module 33 and held therein. The user can appropriately take out the resin molded product from the resin molded product holding portion 331.

  Needless to say, the present invention is not limited to the above embodiments, and various modifications are possible.

DESCRIPTION OF SYMBOLS 10 ... Resin material supply part 111 ... 1st accommodating part 112 ... 2nd accommodating part 1121 ... Resin material supply path 121 ... 1st upper opening 1211 ... Opening and closing lid 122 ... 2nd upper opening 131 ... 1st lower opening 132 ... 2nd Lower opening 141 ... first vibration applying unit 142 ... second vibration applying unit 15 ... metering unit 16 ... resin material transfer tray moving mechanism 171 ... upper cover 1711 ... first connecting unit 172 ... lower cover 1721 ... second connecting unit 18 ... Dust collector (suction device)
181 ... 1st suction pipe 1811 ... 1st suction force adjustment part 182 ... 2nd suction pipe 1821 ... 2nd suction force adjustment part 183 ... 3rd suction pipe 1831 ... suction port 184 ... base part 185 ... suction force adjustment part opening 186 ... movable lid 1862 ... bolt 19 ... control unit 20 ... compression molding part 211 ... lower fixed platen 212 ... upper fixed platen 22 ... tie bar 23 ... movable platen 24 ... clamping device 251 ... lower heater 252 ... upper heater 26 ... release film Coating device 30 ... resin molding device 31 ... material receiving module 311 ... substrate receiving unit 32 ... molding module 33 ... dispensing module 331 ... resin molded product holding unit 36 ... main transport device 37 ... sub transport device LM ... lower mold UM ... upper mold MC ... cavity P ... resin material S ... substrate T ... resin material transfer tray

Claims (9)

a) a first housing part for housing a granular or powdery resin material;
b) a second storage portion that receives and temporarily stores the resin material stored in the first storage portion, and drops the resin material from the outlet of the resin material supply passage through the resin material supply passage while weighing the resin material; ,
c) a second housing portion cover surrounding the second housing portion including the outlet of the resin material supply passage;
d) a dust collector with variable suction force that sucks dust in the internal space of the second housing cover;
A resin molding apparatus comprising: The dust collector is
A suction device for sucking air;
A suction pipe connecting the suction device and the internal space of the second housing cover;
An opening provided in the suction tube;
The resin molding apparatus according to claim 1, further comprising: a lid provided in the opening, wherein the movable lid adjusts an opening area of the opening according to a position of the lid. A first accommodating portion outlet which is an outlet of a resin material for supplying a resin material accommodated in the second accommodating portion provided in the first accommodating portion;
A first housing cover surrounding the first housing portion including the first housing portion outlet;
The resin molding apparatus according to claim 1, further comprising: a first container side dust collecting device that sucks dust in an internal space of the first container part cover.   The suction force for sucking dust in the internal space of the second housing portion cover by the dust collecting device rather than the suction force for sucking dust in the internal space of the first housing portion cover by the first housing portion side dust collecting device. The resin molding apparatus according to claim 3, wherein is weaker. a) a first housing part for housing a granular or powdery resin material;
b) a second storage portion that receives and temporarily stores the resin material stored in the first storage portion, and drops the resin material from the outlet of the resin material supply passage through the resin material supply passage while weighing the resin material; ,
c) a first accommodating portion outlet that is an outlet of the resin material for supplying the resin material accommodated in the second accommodating portion provided in the first accommodating portion;
d) a first housing part cover surrounding the first housing part including the first housing part outlet;
e) a second housing portion cover surrounding the second housing portion including the outlet of the resin material supply passage;
f) a first container-side dust collector that sucks dust in the internal space of the first container cover with a first suction force;
g) A resin molding apparatus comprising: a second container-side dust collector that sucks dust in an internal space of the second container cover with a second suction force that is weaker than the first suction force. The second container side dust collector is
A suction device for sucking air;
A suction pipe connecting the suction device and the internal space of the second housing cover;
An opening provided in the suction tube;
The resin molding apparatus according to claim 5, further comprising: a lid provided at the opening, wherein the movable lid adjusts an opening area of the opening according to a position of the lid.   The resin molding apparatus according to claim 1, further comprising a vibration applying unit that applies vibration to the resin material supply passage. A resin material supply step of supplying the resin material in the resin material transfer tray to the mold by moving the resin material transfer tray to the mold after supplying the granular or powder resin material to the resin material transfer tray; And a resin molding step of performing resin molding by clamping a molding die supplied with the resin material,
In the resin material supply step,
The granular or powdery resin material is accommodated in the first accommodating portion, the resin material accommodated in the first accommodating portion is received by the second accommodating portion, and temporarily accommodated, and the resin material is measured while measuring the resin material. Supplying the resin material transfer tray via the supply passage;
While supplying the resin material from the second container to the resin material transfer tray, dust in the internal space of the second container cover surrounding the second container including the outlet of the resin material supply passage, A method for producing a resin molded product, wherein the resin material is not sucked and is sucked with a suction force by which the dust is sucked. A resin material supply step of supplying the resin material in the resin material transfer tray to the mold by moving the resin material transfer tray to the mold after supplying the granular or powder resin material to the resin material transfer tray; And a resin molding step of performing resin molding by clamping a molding die supplied with the resin material,
In the resin material supply step,
The granular or powdery resin material is accommodated in the first accommodating portion, the resin material accommodated in the first accommodating portion is received by the second accommodating portion, and temporarily accommodated, and the resin material is measured while measuring the resin material. Supplying the resin material transfer tray via the supply passage;
While supplying the resin material from the second storage portion to the resin material transfer tray, the first suction force sucks dust in the internal space of the first storage portion cover surrounding the first storage portion, and Resin molding characterized in that dust in the internal space of the second housing portion cover surrounding the second housing portion including the outlet of the resin material supply passage is sucked with a second suction force that is weaker than the first suction force. Product manufacturing method.

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