TWI735629B - Frame jig, resin supply jig and its measuring method, molding resin metering device and method, resin supply device, resin supply metering device and method, and resin molding device and method - Google Patents

Abstract

Provided is a frame jig in which the opening on one side of the frame is covered with a single film without wrinkles, and a resin formed with a resin accommodating portion that can be accurately weighed without connecting an air hose, etc. Supply jig and its measurement method.

The frame jig is provided with: a frame (13a) with an opening of a predetermined shape on the inner surface corresponding to the cavity recess formed on the clamping surface of the molding die; and a film holding part (13c) for holding The outer peripheral edge of the single-piece film F assembled so as to cover one side of the opening of the frame (13a), and at least one pair is provided on the opposing side.

Description

Frame jig, resin supply jig and its measurement method, molding resin measurement device and method, resin supply device, resin supply measurement device and method, and resin molding device and method

The present invention relates to a frame jig for conveying a single piece of film together with a molding resin to a molding die, a resin supply jig and a measuring method thereof, a molding resin metering device and method, and a molding resin supply A resin supply device to a resin supply jig, a resin supply metering device and method using the same, and a resin molding device and method equipped with the same.

In addition, a single-piece film refers to a film formed by cutting a long or large-sized film into a predetermined size in addition to each film formed in a predetermined size in advance.

As a resin molding device used in semiconductor manufacturing plants today, in the molding of WLP (wafer level packaging) or PLP (panel level packaging) as a workpiece, for example, a semiconductor wafer with a diameter of 8 inches or a diameter of 12 inches is used Either a carrier is used for resin molding, or a workpiece (rectangular plate, substrate, carrier, etc.) with a size of 300 mm to 600 mm square (each side is 300 mm to 600 mm) is used for resin molding.

At this time, in the case of a molding die for compression molding using an upper die provided with a cavity recess in the upper die, a resin with high viscosity is generally placed at the center of the workpiece and supplied to the lower die at a time for molding. At this time, in order to fill the mold cavity with the resin supplied to the workpiece, it is necessary to make the molding resin flow to a large extent, so it is not suitable for the molding of electronic parts connected by wires. In this regard, resin molding by compression molding using a lower mold is also performed. A cavity recess is provided in the lower mold, and the clamping surface of the lower mold containing the cavity recess of the lower mold is covered with a film and molded with a uniform thickness. Resin, and soak the workpiece held in the upper mold in the molten molding resin.

In this way, when the film and the molding resin are supplied to the cavity recess of the lower mold by compression molding of the lower mold, it is necessary to measure and supply the resin required for one resin molding. Especially in the case of powdered resin or pelletized resin, since it starts to melt as it is injected into the mold, it is necessary to inject the molding resin at a time in order to reduce the time difference between when the injection is started and when the injection is completed. At this time, in the case of compression molding of the upper mold with the upper mold cavity, the resin can be loaded on the substrate and accurately measured and the resin can be injected into the mold at a time, but the lower mold with the lower mold cavity is compression molded. In this case, it can be considered to put the resin on the film and then inject the mold for the reason of injecting the resin once, and it is required to measure and transport the resin while keeping the resin on the film. In the case of high-viscosity resin, it can also be directly placed on the film for measurement, but in the case of granular resin or powdered resin, in order to prevent the resin from overflowing, it is necessary to fix the film on one side of the frame to form a resin container. And for measurement and transportation.

Therefore, for example, a release film is proposed to close the lower opening of the resin storage plate of the frame-shaped resin, and the plate is fixed to the periphery of the plate by the suction and fixation mechanism of the release film. The means (load unit) measures the amount of resin by measuring the weight before and after the pellet resin is supplied from the hopper (refer to Patent Document 1: Paragraph [0028] of the specification). It also proposes a technology for measuring the amount of resin by installing a plate-side measuring means (loading unit) on the receiving side of the resin material distribution means to measure the weight before and after the pellet resin is injected from the hopper (refer to Patent Document 1: Specification Paragraph [0041] ). Or propose to use them together.

It also proposes a device for supplying resin while measuring whether the resin supply amount has reached a target value relative to the initial value by installing an electronic balance directly below the resin supply device for supplying granular resin to the lower mold cavity (see Patent Document 2).

Prior art literature Patent literature

Patent Document 1 Japanese Patent Application Publication No. 2010-36542

Patent Document 2 Japanese Patent Application Publication No. 2005-335117

As in Patent Document 1, when the lower opening of the resin storage plate is closed with a release film and the release film suction and fixation mechanism is used for suction and fixation at the periphery of the plate, the film suction hose is always connected To the state of the board. Therefore, when the feeder-side measuring means provided in the injection-side distribution means or the receiving-side distribution means is used to measure the weight of the plate before and after the pellet resin is injected, the correct weight of the individual plate (frame and film) cannot be measured. Therefore, the amount of resin supplied to the resin storage plate cannot be accurately measured.

In addition, when an electronic balance for measuring the weight of the resin supply device itself is installed as in Patent Document 2, the device structure is enlarged and the weight increases, and there is an electromagnetic feeder for injecting pelletized resin, so it cannot be performed until the vibration is converged. Measurement, measurement will consume time, and there are also problems that are prone to errors.

If the molding resin cannot be accurately metered in this way, the molding quality may be degraded, and when the metering of the resin takes time, the time required for one resin molding is consumed, and the productivity is also reduced.

The purpose of the present invention is to solve the above-mentioned problems of the prior art, and to provide a frame jig in which one side opening of the frame is covered with a single film without wrinkles, and to use it without connecting an air hose, etc. A resin supply jig with a resin accommodating portion and its measuring method that can accurately measure the weight.

In addition, it also provides a metering device and method for accurately metering molded resin, uniformly supplying molded resin to the resin accommodating part of a resin supply jig without excess or deficiency, and a resin metering and supplying device provided with the same, and method.

A resin molding device and method that use the above resin supply and metering device and resin metering method to improve molding quality and productivity are also provided.

In order to achieve the above-mentioned object, the present invention has the following configuration.

A frame jig, which is characterized by comprising: a frame having an opening with a predetermined shape on its inner surface, the inner surface corresponding to a cavity recess formed on the clamping surface of a molding die; and a film holding portion for holding and covering the aforementioned The outer peripheral edge of the single-piece film assembled with the opening on one side of the frame is provided with at least a pair on the opposite side; and the tension maintaining mechanism can maintain the predetermined state while holding the outer peripheral edge of the aforementioned single-piece film tension.

According to this, the outer peripheral edge of the single-piece film assembled by covering the opening on one side of the frame can be grasped by the pair of film holding parts provided at least on the opposite sides, and the outer peripheral edge of the single-piece film can be gripped. In the state of the edge part, the predetermined tension is maintained by the tension maintaining mechanism, so the single film can be assembled without wrinkles.

Preferably, the aforementioned frame system is formed with a film that is difficult to adhere to the molding resin on the surface or a material that is difficult to adhere to using the molding resin. As an example of a coating film that is difficult for molding resin to adhere, hard chromium plating, fluorine-based coating, and yttrium-based ceramics can be used. In addition, an example of a material to which the molding resin is difficult to adhere, for example, may be ceramics, heat-resistant resin, and the like. Therefore, by making the surface properties of the frame surface a smooth surface, it is possible to make it difficult for the molding resin to adhere to the opening of the frame.

A resin supply jig, characterized by comprising: the above-mentioned frame jig; a single-piece film covering one side opening of the frame of the aforementioned frame jig; The outer peripheral edge portion is held by the film holding portion with a predetermined tension applied thereto, and the molded resin formed by blocking one side opening of the frame body is accommodated.

Thereby, the resin accommodating part which closes the opening part of one side of a frame body can be formed with a simple structure without generating a wrinkle in a single-layer laminated film. In addition, since the air suction hose for film adsorption is not connected to the frame, the weight of the frame and the film alone can be accurately measured before and after the molding resin is supplied.

A resin supply device characterized in that it scans at least in the XY direction while injecting the molded resin from the resin injection portion to the resin accommodating portion of the resin supply jig, and supplies a predetermined amount of the molded resin to a single sheet.膜上。 On the film.

According to the above configuration, by scanning at least the XY direction of the resin injection part, the resin accommodating part is uniformly supplied with the molding resin required for resin molding, and the molding resin can be uniformly supplied to the resin accommodating part with a wide area, especially The granular resin or powdered resin is supplied uniformly and without deviation without separately planarizing it.

Preferably, a baffle capable of opening and closing the injection port is provided in the resin injection portion. Therefore, when the granular resin or powdered resin is quantitatively conveyed by an electromagnetic feeder, etc., the resin exceeding the required amount can be prevented from being injected or diffused to the surroundings.

Preferably, an ionizer is provided in the resin injection portion, and the ionizer eliminates static electricity generated at the opening of the frame.

Thereby, even if the resin drops near the opening of the frame, there will be no adhesion due to static electricity.

Preferably, a film detection sensor is provided in the resin injection part, and the film detection sensor detects the tension setting state of the single film in the resin supply jig.

Thereby, the setting error of the single film in the resin supply jig can be prevented and the molding resin can be prevented from being injected by mistake.

The resin injection part may also be provided with a frame knocking part which knocks the frame so that the molded resin adhering to the inner surface of the opening containing the inclined part falls into the resin accommodating part.

Thereby, even if the molding resin adheres to the opening of the frame, the frame can be knocked by the frame knocking part to drop it into the resin accommodating part to perform resin molding.

A measuring device for molded resin, characterized by using the resin supply jig to measure the weight of the molded resin, wherein the weight of the resin supply jig before the resin supply jig is supplied to the resin accommodating portion and The weight of the resin supply jig after the molding resin is supplied to the resin accommodating portion, and the amount of resin required for resin molding is measured.

Thereby, since the air suction hose for film adsorption is not connected to the frame, the weight of the frame and the film alone can be accurately measured before and after the molding resin is supplied. Therefore, the amount of resin required for one resin molding can be accurately measured.

In addition, a resin supply and metering device is characterized by comprising: any one of the aforementioned resin supply jigs, any one of the aforementioned resin supply devices, and the aforementioned molding resin metering device.

Therefore, the resin supply device is used to uniformly supply the molded resin to the resin accommodating part formed in the resin supply jig, and the weight of the resin supply jig before and after the molding resin supply is accurately measured, thereby accurately measuring the resin supply quantity.

A resin molding device characterized by: the resin supply and metering device described above, and a resin supply jig that supplies the molding resin required for the resin molding once to the resin accommodating portion is transported to the molding die and molded. .

Thereby, the molding resin required for resin molding is accurately and quickly measured and supplied to the resin receiving part formed in the resin supply jig, and the single film and the molded resin are transferred from the resin supply jig. Go to the molding die and perform molding, which can improve molding quality and productivity.

A method for measuring molded resin, which is characterized by the step of preparing a resin supply jig with a resin containing portion, the inner surface of which has an opening of a predetermined shape and the opening on one side of the frame is covered by a single sheet of film, and the inner surface Corresponding to the cavity recesses formed on the clamping surface of the molding die; and the measuring process, by directly supporting the resin supply jig before and after the molding resin is supplied to the measuring device to measure the weight of the molding resin .

Therefore, by directly supporting the resin supply jig before and after the molding resin supply by the measuring device, the supply amount of the molding resin can be accurately measured.

It can also be made: it further includes a step of uniformly supplying a predetermined amount of molding resin to the single-piece film from one side opening of the frame through a resin supply device to the resin accommodating portion, and supplying the obtained molding resin to A predetermined amount of resin measured by the difference between the weight of the resin supply jig before the resin accommodating portion and the weight of the resin supply jig after the molded resin is supplied to the resin accommodating portion is supplied from the resin supply device.

Alternatively, it can also be made: calculating the difference between the weight of the resin supply jig before the molding resin is supplied to the resin accommodating portion and the weight of the resin supply jig after the molding resin is supplied to the resin accommodating portion The amount of resin is measured by the aforementioned measuring device while the molding resin is supplied from the aforementioned resin supply device.

Thereby, it is possible to continuously measure and supply the molding resin at the same position, reduce the area of the device, and quickly perform the resin supply operation.

A resin supply and measurement method in which a predetermined amount of molded resin is supplied to a resin supply jig from one side of the opening and the resin supply jig is used to cover the other side of the opening. The single-piece film holds a frame with an opening of a predetermined shape on the inner surface to form a resin accommodating portion, and the inner surface corresponds to the cavity recess. The characteristics of the resin supply and measurement method include: the frame has an opening on the other side It is overlapped with the single-piece film in a covered manner, and at the same time, the resin supply having the resin containing portion is formed by holding at least the opposite side of the outer peripheral edge portion of the single-piece film in a state where a predetermined tension is applied to it. The process of the jig; the weighing process of measuring the weight of the resin supply jig by directly supporting the resin supply jig on the measuring device; the resin accommodating part is passed through the resin from the side opening of the frame The process of uniformly supplying a predetermined amount of molding resin to the single film by the supply device, from the weight of the resin supply jig before the molding resin is supplied to the resin accommodating part and the molding resin to the resin The weight of the resin supply jig after the accommodating part is supplied from the resin supply device by the amount of resin required for resin molding measured by the measurement device.

According to the aforementioned resin supply and measurement method, the molding resin can be supplied without causing wrinkles on the single film forming the resin containing portion. In addition, when the resin supply jig is not connected to the hose for air suction, the correct weight of the resin supply jig before and after the resin supply can be measured without excessive or insufficient supply of the amount of resin required for one resin molding.

Preferably, a platform portion is provided, and the frame body is overlapped on the single-piece film while maintaining the suction and holding of the single-piece film to cover the opening on the other side while maintaining and holding the single-piece film. The outer peripheral edge of the single-piece film is held in the frame while tension is applied to form a resin accommodating portion in the resin supply jig, a through hole or cut is provided in the platform portion, and the metering device is a metering pin The resin supply jig is supported from one side of the platform through the through hole or through the notch, so as to measure the weight of the resin supply jig.

As a result, it is possible to form a resin receiving part in the resin supply jig while maintaining the state of maintaining the single film sucked and held on the platform part, and to directly support the resin supply treatment by arranging the metering device directly under the platform part. It can be measured.

Therefore, the assembling operation of the resin supply jig and the metering operation of the resin supply jig and the molded resin can be performed quickly and accurately at the same position without requiring an installation area.

Since the resin supply device scans at least the XY direction of the resin injection portion and uniformly supplies the molding resin required for resin molding to the resin accommodating portion, the molding resin can be uniformly supplied to the resin accommodating portion having a wide area. In particular, the granular resin or powdered resin can be uniformly supplied without further flattening.

Preferably, the resin supply device repeats the operation of temporarily stopping the supply operation before the amount of resin supplied to the resin accommodating portion reaches a predetermined amount, and after measuring by the measuring device, the resin injection amount per unit time is changed to supply the operation.

Thereby, the molding resin can be supplied while fine-tuning so as to be as close to the target resin supply amount as possible.

In addition, the resin molding method is characterized in that it includes a resin supply jig that supplies the molding resin required for resin molding to the resin accommodating part by any one of the aforementioned resin supply and metering methods, and is transported by a resin supply loader. The process of molding a mold and transferring the monolithic film and molding resin to the aforementioned molding mold.

Thereby, the molding resin required for resin molding is accurately and quickly measured in one portion, and is supplied to the resin accommodating part formed in the resin supply jig without excessive or insufficient supply, and the single piece is transferred from the resin supply loader. The transfer of the film and molding resin to the molding die can improve molding quality and productivity.

If the frame jig as described above is used, the opening on one side of the frame can be covered with a single film without wrinkles.

In addition, according to the resin supply jig and its measuring method, the weight of the frame and the film monomer can be accurately measured before the molding resin is supplied without connecting the air hose or the like to the frame jig.

In addition, with regard to the measuring device and method of the molded resin, the molded resin can be accurately measured.

In addition, in the resin supply device, it is possible to uniformly supply molded resin (especially pellet resin, powdered resin, and liquid resin) to the resin accommodating portion of the resin supply jig having a wide area.

In addition, in the resin metering and supplying device and method provided with the same, the molding resin can be supplied without excess or deficiency at the metering position.

In addition, it is possible to provide a resin molding apparatus and method that use the above-mentioned resin supply and metering device and resin metering method to improve molding quality and productivity.

Ud‧‧‧distribution unit

Up‧‧‧Press unit

Uw‧‧‧Workpiece Processing Unit

W‧‧‧Workpiece

1‧‧‧Workpiece Supply Department

2‧‧‧Molding product storage section

M‧‧‧Molded product

3‧‧‧Hardening furnace

4‧‧‧Robot transport device

4a‧‧‧Robot arm

5‧‧‧Pressing part

5a‧‧‧Column

6‧‧‧Molding mold

6A‧‧‧Upper mold

6B‧‧‧Die

6C‧‧‧Lower mold cavity recess

6a: Upper die clamping surface

6b: Air adsorption hole

6c: Air suction path

6d: Workpiece holding pin

6e: Lower module

6f: Lower mold cavity parts

6g: Movable clamp for lower mold

6g1, 6g2: air suction path

6h: coil spring

6i: Sealing ring

6j: Pusher

8: Film supply department

8a: Film roll

F: Monolithic film

9: Distributor

9a: The first storage section

9b: The second storage section

9c: Extrusion mechanism

9d: Syringe

10: Workpiece loader

11: Resin supply loader

11a: Loader claw

12: Film Recycling Department

13: Resin supply fixture

13a: frame

13a1: Outer frame

13b: Fulcrum frame

13c: Film chuck

13d: Rotating rod

13e: Rotation axis

13f: Ratchet mechanism

13g: Inclined part

13n: locking hole

14: Rail

15: Upsell

16: slot

17: Platform Department

17a: Film adsorption hole

17b: Through hole

18: Tool

20: Film sag detection department

21: Metering device

21a: Metering pin

22: Resin Containment Department

23: Scanning agency

23a: X-axis drive guide

23b: Y-axis drive guide

23c: Z-axis drive guide

23d: scan axis

23e: Servo motor

24: bezel

24a: opening and closing cylinder

25: Waste resin recycling box

26: ionizer

27: Frame percussion part

27a: Percussion column

28: Thin film detection sensor

28a: Lifting cylinder

Fig. 1 is a plan view showing a schematic configuration of a resin molding apparatus.

Fig. 2 is an explanatory view showing a supply process of a single film and an assembly structure of a resin supply jig.

Fig. 3 is an explanatory diagram of a measuring step and a molding resin supply step before the resin supply of the resin supply jig following Fig. 2.

Fig. 4 is an explanatory diagram showing a measuring process after resin supply of the resin supply jig and a transport process of the resin supply jig following Fig. 3.

Fig. 5 is a plan view of a resin supply jig.

Fig. 6 is a cross-sectional view showing the structure of a molding die.

Fig. 7 is an explanatory diagram showing a process of supplying a single film and a molding resin to the lower mold of Fig. 6.

Fig. 8 is an explanatory diagram showing the supply process of the single-piece film and the molding resin following Fig. 7.

Fig. 9 is an explanatory diagram showing a resin molding process subsequent to Fig. 8.

Fig. 10 is an explanatory diagram showing an example in which a distributor supplies granular resin to a resin supply jig.

Fig. 11 is an explanatory view showing an example in which a dispenser supplies liquid resin to a resin supply jig.

Fig. 12 is an explanatory diagram showing a case where a plurality of distributors are installed.

Fig. 13 is a plan view of a resin supply jig related to another example.

Fig. 14 is an explanatory diagram showing an example of a distributor related to another example of Fig. 10.

Hereinafter, the preferred embodiments of the frame jig, resin supply jig and its measurement method, measurement device, resin supply device, resin supply measurement device and method, and resin molding device and method of the present invention, together with drawings Explain in detail together. In the following, a description will be given of using a resin molding apparatus that uses a rectangular workpiece with a side of approximately 600 mm as the workpiece and uses a single-piece film larger than the rectangular workpiece as a film to perform resin molding. Of course, as the workpiece, not only the large size as described above, but also a small short strip-shaped workpiece of about 300mm×100mm. Although an example of a workpiece is illustrated by a short rectangle, it is not necessarily limited by this, and it can also be a round wafer or carrier. In addition, as an example of a resin molding apparatus, it is assumed that the lower mold is a movable mold and the upper mold is a fixed mold. Although the resin molding apparatus is equipped with a mold opening and closing mechanism, the illustration is omitted and the description will be focused on the structure of the mold.

First, the schematic configuration of the resin molding apparatus will be described with reference to FIG. 1. In this resin molding apparatus, a control unit (not shown) controls various parts described later to perform various operations. The molding apparatus in this embodiment is a configuration in which a workpiece processing unit Uw, two press units Up, and a distribution unit Ud (supply unit) are connected, and the workpiece W in the apparatus is automatically resin-molded.

The workpiece processing unit Uw includes, for example, a workpiece supply unit 1, a molded product storage unit 2, a curing furnace 3, and a robot transport device 4. In the workpiece supply unit 1, for example, a workpiece (rectangular panel, substrate, carrier, etc.) having a size of approximately 600 mm on each side is accommodated in the workpiece W. In the molded product storage portion 2, a molded product M molded by resin is stored in a pressing portion 5 described later. In the curing furnace 3, molded products M molded into a semi-cured state by resin molding by a pressing part 5 described later are respectively housed in a multilayer rack provided in the furnace and post-cured to heat and harden the resin encapsulation part. The robot conveying device 4 performs transfer or conveyance of the workpiece W and the molded product M between the parts arranged around it. For example, the robot transport device 4 takes out the workpiece W from the workpiece supply unit 1 and supplies it, transports the molded product M to the curing furnace 3, and sequentially transports and stores the molded product M from the curing furnace 3 to the molded product storage unit 2. The robot conveying device 4 uses, for example, a vertical articulated type, a horizontal articulated type, or a combined articulated type robot, and is held by the robot arm 4a by sucking or holding the workpiece W and the molded product M and conveys it. . In addition, in the workpiece processing unit Uw, a cooling unit for cooling the molded product M, an inspection unit for performing appearance inspection of the molded product, etc., a data reading unit for reading the molding conditions associated with each workpiece W, and use A reversing part that reverses the front and back of the workpiece W or the molded product M is arranged around the robot conveying device 4. For example, in the workpiece supply unit 1, when the surface (molding surface) of the workpiece W to be resin-molded is supplied upward, the reversing portion turns the molding surface toward the lower surface. In addition, the inverted portion is inverted with the molding surface facing upward until the molded product M after the resin molding is completed is accommodated in the molded product storage portion 2.

The pressing part 5 in the press unit Up is equipped with molds 6 (upper mold 6A and lower mold B) for compression molding. 5a is opened and closed by a well-known mold opening and closing mechanism that moves up and down. In this embodiment, the press unit Up is arranged at two positions, but it can also be arranged at one position, or it may be arranged at three or more positions.

The resin supply jig 13 is used for supplying molding resin (such as pellet resin, powder resin, liquid resin, etc.) from the distributor 9 (resin supply device) to the single film F supplied from the film supply section 8 in the distribution unit Ud. ) Is supplied to the molding die 6 of the pressing portion 5. The film supply part 8 is provided with a film roll 8a in which a long roll film is wound. With the film end drawn from the film roll 8a to the platform portion 17 (see FIG. 2A), it is cut (cut) into a rectangle of any size by the cutter 18 and is sucked and held on the platform portion 17 as a single film F . On the platform portion 17, film suction holes 17a for film suction are provided on four sides (refer to FIG. 2A). And the platform part 17 is provided with the through-hole 17b for inserting the weighing pin 21a of the weighing device 21 (for example, an electronic balance) mentioned later at a plurality of positions. The measuring device 21 is arranged directly below the platform portion 17 (refer to FIG. 3H). In addition, a notch through which the metering pin 21a can pass may be provided instead of the through hole 17b provided in the platform portion 17, and the frame 13a may be supported from the outer peripheral side of the platform portion 17. The through hole 17b only needs to be at a position that can temporarily support the frame 13a, and the metering pin 21a does not necessarily need to be in the shape of a pin, and may be in a block shape. The configuration including the resin supply jig 13, the distributor 9 and the measuring device 21 described above is defined as a resin supply and measuring device.

The resin accommodating portion 22 is formed in the resin supply jig 13 by applying required tension to and supporting the single-piece film F covering the opening on one side of the frame 13a. The mold resin R (particulate resin) required for one-time resin molding is supplied to the resin accommodating portion 22 from the other side opening of the frame 13a by the dispenser 9. In addition, powder resin, liquid resin, monolithic resin, or a combination thereof may be used instead of granular resin.

Monolithic film F is heat-resistant and easy to peel off from the mold surface and resin surface after molding. It can be used with flexibility and ductility, such as PTFE, ETFE, PET, FEP film, fluorine-impregnated glass cloth, polypropylene film , A single-layer film or a multi-layer film with polyvinylidene chloride as the main component is preferred.

The workpiece loader 10 picks up the workpiece W from the robot arm 4a of the robot transport device 4 and carries it into the molding die 6 (upper die 6A) of the pressing part 5. In addition, the workpiece loader 10 receives the molded product M from the molding die 6 and transfers it to the robot arm 4 a of the robot transport device 4. When taking out the molded product M from the molding die 6, the work loader 10 also sucks and holds the used film F out, and the taken out single-piece film F is collected in the film collection part 12.

The resin supply loader 11 receives the single-piece film F held on the resin supply jig 13 and the molding resin R (pellet resin) supplied to the film F by applying the required tension to the mold 6 (Lower mold 6B) Transport. The resin supply jig 13 is as described later, and the weight before and after the molding resin R required for one-time resin molding is supplied is arranged under the platform part 17 (below the resin supply position in FIG. 1, refer to FIG. 3H) The metering device 21 is measured. The work loader 10 and the resin supply loader 11 are installed to reciprocate along a plurality of guide rails 14 laid along the longitudinal direction of the device. And it is formed to move the loader hand (not shown) to each part (for example, the pressing part 5) so that it may orthogonally cross from the position on the guide rail 14. In addition, the lower part of the loader hand of the resin supply loader 11 is provided with a loader claw 11a that can be opened and closed by an air cylinder or the like (see FIG. 2D).

Here, the configuration of the resin supply jig 13 will be described with reference to FIGS. 2 and 5.

As shown in FIG. 2D, the resin supply jig 13 is provided with a frame 13a having a predetermined shape (for example, a rectangular shape) on the inner surface, and the frame corresponds to the lower mold clamping surface surrounding the lower mold cavity recess 6C described later Plane shape. In the resin supply jig 13, a fulcrum frame 13b that provides tension to the single-piece film F as a fulcrum portion is provided in a rectangular shape along the frame 13a (see FIG. 5). As the fulcrum portion, the outer corner of the frame 13a may be used instead of providing the fulcrum frame 13b.

In addition, on the outside of the resin supply device 13, there are provided a plurality of film chucks 13c (film gripping portions) for gripping the outer peripheral edge portion of the single film F over the entire circumference (the frame body 13a is provided with a film clip The structure of the disk 13c (film gripping portion) is defined as a frame jig). Specifically, as shown in FIG. 2D, in order to hold and convey a rectangular single-piece film F, a pair of film chucks 13c that can be opened and closed are provided on the opposing sides. In this embodiment, although the film gripping portions are provided at four positions (XY directions) of the opposing sides of the frame jig, at least a pair of opposing sides may be provided. The pair of film chucks 13c uses an open-close type chuck, and clamps and holds the outer peripheral edge of the rectangular single-piece film F on each side. Both ends in the longitudinal direction of the pair of film chucks 13c are respectively supported by a pair of rotating rods 13d (rotating members). The pair of rotating rods 13d are provided in the frame 13a so as to be able to rotate around a rotating shaft 13e formed on the inner side of the film chuck 13c. Therefore, the pair of film chucks 13c become opposite sides of the rotating shaft 13e provided in the rotating rod 13d. The rotating rod 13d is provided with an offset mechanism that rotates only in a direction offsetting the fulcrum frame 13b. The pair of film chucks 13c are always in a separate state, and the film ends are sandwiched by the cam mechanism when the outer frame body 13a1 approaches the frame body 13a as described later.

Specifically, as shown in FIG. 5, the rotating shaft 13e of the film chuck 13c is provided with a ratchet mechanism (one-way clutch mechanism) 13f (tension maintaining mechanism) for engaging ratchet teeth and pawls. The ratchet mechanism 13f allows the film chuck 13c to rotate only by a predetermined angle in the direction separating from the fulcrum frame 13b with the rotating shaft 13e as the center (rotate and pull up in the arrow opening direction in FIG. 2F). With this, the film chuck 13c is stopped at a predetermined rotation position after rotating in one direction and locked in multiple stages, thereby allowing the conveyance to be carried out while maintaining the tension applied to the single film F, and it is in a situation where it is about to be released. This is a configuration that can be released when the rotation angle is greater than a certain level. In addition, the ratchet mechanism 13f can be replaced by a drive mechanism such as a servo motor or a torque motor to apply arbitrary tension to the single film and maintain the applied tension. In this case, the resin supply device 13 can be easily enlarged compared to the structure provided with the ratchet mechanism 13f. On the other hand, although the tension applied to the single film F can be adjusted at any time, it is ideal, but it is difficult to be The resin supply device alone makes it difficult to accurately complete the measurement described later.

In addition, the rotating rod 13d is supported by an outer frame body 13a1 provided to be movable outside the frame body 13a. The outer frame 13a1 is configured to engage with a locking portion that advances and retreats by a drive source such as an air cylinder (not shown) provided in the resin supply loader 11, so that it can contact each side of the frame 13a. Or leave. In addition, the pair of film chucks 13c are formed so that when the outer frame 13a1 moves in a direction approaching the frame 13a, the film chucks 13c are closed by a cam mechanism not shown. As a result, as described later, the outer peripheral edge portions of the single film F can be sandwiched by the pair of film chucks 13c (refer to FIG. 2E).

As shown in FIG. 2E, in a state where the outer peripheral edge (four sides) of the single film F is gripped by a pair of film chucks 13c, a lift drive mechanism (air cylinder drive, solenoid drive, The upward push pin 15 driven by a motor, etc.) pushes up the rotating rod 13d. At this time, the rotating rod 13d is rotated around the rotating shaft 13e to shift the film chuck 13c in the direction separating the fulcrum frame 13b (rotate and pull up in the direction where the arrow opens) to lock the film chuck 13c in multiple stages . Thereby, the ends of the single-piece film F covering the opening of the frame of the resin supply jig 13 are separated by increasing the amount of separation with the fulcrum frame 13b interposed therebetween, and are integrally held in a state where required tension is applied. In addition, in the case of returning the rotating rod 13d to its original position, when the rotating rod 13d is pushed up to a predetermined angle through the push-up pin 15 again, the engagement of the ratchet mechanism 13f (refer to FIG. 5) is released and the rotating rod 13d can be returned To the original location.

As shown in the same figure, by rotating the film chuck 13c around the rotation axis 13e to separate the film chuck 13c from the fulcrum frame 13b, the ends of the single film F can be separated from each other via the fulcrum frame 13b. The amount of separation increases to increase the tension. In particular, by rotating around the rotation axis 13e of the film chuck 13c arranged on the four sides, the tension of the single film F can be adjusted in multiple stages for each side, so that the single film F can be appropriately applied The resin supply jig 13 with high tension has a small and simple structure.

As described above, the resin accommodating portion 22 is formed by the frame-shaped resin supply jig 13 and the single-piece film F covering the opening on one side (lower side). From the distributor 9 (refer to FIG. 1) to the single film F to which the required tension has been applied, for example, from the distributor 9 (refer to FIG. 1) through the slot 16 (resin injection part) from the opening on the other side (upper side) The molding resin R (particulate resin) required for resin molding is supplied in one portion, and is uniformly (flat) supplied to the single-piece film F without bias (refer to FIG. 3J). In addition, the upper opening of the frame body 13a is formed with an inclined portion 13g having a rectangular shape in plan view, the diameter of which is wider toward the opening side. By supplying the molding resin R to the inside of the inclined portion 13g, the molding resin R can be supplied to the single-piece film F in any shape. In this case, the inclined portion 13g prevents the molding resin R supplied to the single-piece film F from riding on the frame 13a. In addition, by making the inner side of the frame 13a round including the inclined portion 13g, the mold resin R can also be supplied into the round area on the single-piece film F (see FIG. 13). According to this, just by changing the structure of the part, it is possible to use the same transport structure of the single-piece film F regardless of the shape of the cavity whose outer shape is a circle or a rectangle. In addition, it is preferable that the frame body 13a adopts a metal material (e.g., an aluminum material) and has a film formed on the surface of the metal base material that is difficult for resin to adhere. As an example of a coating film to which a molding resin is difficult to adhere, hard chromium plating, fluorine-based coating, and yttrium-based ceramics can be used. Furthermore, in addition to the metal base material, it is also possible to use a material in which the molding resin does not easily adhere to the base material itself. As an example of the material, for example, ceramics, heat-resistant resin, etc. can be used. Therefore, by making the surface characteristics of the surface of the frame body 13a smooth, the mold resin R can be made difficult to adhere.

In addition, locking holes 13n are provided in a plurality of positions of the frame body 13a for inserting and locking the loader claws 11a of the resin supply loader 11 (two on each side in FIG. 5). Then, as shown in FIG. 4N, the molded resin R is supplied to the single film F forming the resin accommodating portion 22, and in the state where the measurement is completed, the loader finger 11a of the resin supply loader 11 makes the resin supply jig 13 (frame 13a) is clamped and transported to the molding die 6.

Here, when the resin supply jig 13 is lifted from the platform portion 17 through the loader claw 11a of the resin supply loader 11 (refer to FIG. 4M), if the tension is insufficient, the single film F may be molded by the resin R It sags in the center and other places. Therefore, the film sag detection part 20 may be provided in the position close to the platform part 17 (refer FIG. 5). As the film sag detection part 20, it can be set as the structure provided with the optical or laser sensor which is equipped with the light-emitting part and the light-receiving part, and detects the shielding state or shielding position between them. As an example, a configuration in which a light-emitting part and a light-receiving part are provided at a position where the resin supply jig 13 is sandwiched can be provided. In addition, as the film sagging detection section 20, by detecting the shielding in the space on the platform section 17, it can be detected whether the single film F is sagging from an appropriate position when the resin supply jig 13 is lifted up (single film F's tension setting state). The film sagging detection unit 20 can be provided with only one pair to detect sagging in one direction, or two groups as shown in FIG. 5 to detect in two crossing directions. In addition, as the film sagging detection unit 20, any configuration can be adopted as long as the sagging of the single-piece film F can be detected. For example, it may be a touch sensor (switch), or it may be configured to detect whether or not the single film F that sags is in contact when the resin supply jig 13 is lifted to a predetermined height. In addition, the film sagging detection unit 20 is configured to be installed outside the resin supply jig 13 without installing electrical wiring on the resin supply jig 13.

In addition, the film chuck 13c holding each side of the rectangular single-piece film F shown in FIG. 3 may be made so that the pushing amount on each side is uniform or different. In this case, for example, by making the push-up amount of the push-up pins 15 provided on each side of the single-piece film F uniform, it is possible to apply tension corresponding to the amount of rotation centered on the rotating shaft 13e. In addition, the pushing amount of the pair of film chucks 13c on the opposite sides may be different. In this case, depending on the length of each side of the single film F or the ease of film stretching due to the direction in which the film is drawn from the film roll 8a, etc., the amount of pushing up of each group of film chucks 13c is different, The tension applied to each side of the single-piece film F can also be made uniform. In addition, when the rectangular single-piece film F is rectangular, the film chuck 13c may be provided with a pair of opposing sides at least on the short side.

For example, in the case of a horizontally elongated film as shown in FIG. 3, the amount of pushing up of a pair of film chucks 13c on both sides (right and left) pulled in the longitudinal direction (left and right in the same figure) is the same as The pushing amount of the pair of film chucks 13c on both sides (upper side and lower side) pulled in the short-side direction (up and down direction in the same figure) may be different. That is, the amount of pushing up of the film chuck 13c in the longitudinal direction may be larger than the amount of pushing up of the film chuck 13c in the short side direction. In other words, by stretching the long side with a large amount, regardless of the length of the side, it can be set in a uniformly stretched state. According to this, it is possible to equalize the tension applied to the film F in the long-side direction and the short-side direction.

In addition, as shown in the same figure, it is not limited to the case where the single film F is clamped integrally on each side, and the film chuck 13c may be divided into a plurality of pieces on one side. In this case, depending on the state (position) of the wrinkles generated on the single film F, the amount of rotation of the film chuck 13c at one side is changed, and tension is applied to twist the single film F so that it can be pulled. Maintain the stretched wrinkle state. For example, when a part of the tension is increased, wrinkles will be generated at positions other than that position. Therefore, the film chuck 13c can be uniformly pushed up and tension is applied, and then when wrinkles occur, the tension of this part is weakened or the tension outside the part can be increased. Furthermore, the film chuck 13c can also be made not only A structure to hold the side of the single-piece film F with a predetermined length in order to pull to cross the extending direction of the side, and to make it stretch in a direction that pulls away from the center at the corners of the single-piece film F To hold the corners of the single-piece film F in the same way.

Thereby, by changing the offset between the divided film chuck 13c and the fulcrum frame 13b, and applying tension by twisting the film F in accordance with the direction of the wrinkle or the size of the wrinkle generated in the single film F, It can eliminate the wrinkles inherent in the film.

Next, the structure of the mold 6 included in the pressing portion 5 will be described with reference to FIG. 6. This embodiment exemplifies the molding die 6 for compression molding. In this molding die 6, a heater (not shown) is installed at an arbitrary position to heat and harden the molding resin R, and then the workpiece W is resin-molded to produce a molded product M. In order to suck and hold the work W, an air suction hole 6b and an air suction path 6c communicating therewith are formed on the upper mold clamping surface 6a of the upper mold 6A. In addition, in the outer edge portion of the rectangular workpiece W, the workpiece holding pins 6d are provided at opposing positions at a plurality of positions. The work holding pin 6d presses and holds the outer peripheral surface of the work W. The workpiece holding pin 6d may be a cylindrical pin or an angular columnar pin, and is preferably formed to be pressed against the workpiece W via an elastic body. In addition, the workpiece holding pin 6d can also serve as a guide for centering the workpiece W when the workpiece W is sucked and held. According to such a configuration, for example, compared with a configuration in which the outer periphery of the workpiece W is held by the L-shaped claw hooks, the area of the cavity can be enlarged.

The lower mold 6B is integrally supported on the lower module 6e to form a lower mold cavity piece 6f that forms the bottom of the lower mold cavity. The lower mold movable jig 6g that forms the side of the lower mold cavity around the lower mold cavity 6f is floatingly supported on the lower module 6e via a coil spring 6h. The lower mold cavity recess 6C is formed by the lower mold cavity 6f and the lower mold movable jig 6g. A sealing ring 6i (O-ring) is provided between the movable jig 6g of the lower mold and the cavity 6f of the lower mold to be sealed. In addition, the lower mold movable jig 6g is provided with air suction paths 6g1 and 6g2, respectively, for sucking and holding the single-piece film F on the lower mold surface including the lower mold cavity recess 6C. The air suction path 6g1 sucks the inner peripheral side of the film from the gap between the lower mold cavity 6f and the lower movable jig 6g, and the air suction path 6g2 sucks the outer circumferential side of the film on the clamping surface of the lower mold movable jig 6g. Therefore, the single-piece film F is sucked so as to follow the concave shape of the lower mold cavity recess 6C. In addition, between the upper mold 6A and the lower mold 6B, a pair of clamping blocks (not shown) for forming the next pair of pressure-reducing spaces in the mold when the mold clamping operation is started may also be provided.

In addition, a pusher 6j (tension application mechanism) is provided on the outer side of the lower mold movable jig 6g of the lower mold 6B. The pusher 6j is provided to further increase the tension toward the single-piece film F. For example, when the single film F is carried into the lower mold 6B together with the resin supply jig 13 through the resin supply loader 11, the single film F is stretched due to the radiant heat from the lower mold 6B and the tension is reduced. In this case When the tension of the single-piece film F is lowered and sag occurs, the center portion of the single-piece film F will sag due to the weight of the single-piece film F or the weight of the supplied molding resin R. In this case, when the single-piece film F is placed on the lower mold 6B, the sagging of the single-piece film F may be wrinkled. In addition, it is presumed that when the sag of the center portion of the single-piece film F becomes large, it is considered that the molding resin R is accumulated in the center, and it is difficult to uniformly supply the cavity resin R in the cavity. Therefore, the pusher 6j is configured to be installed at a position corresponding to the rotating rod 13d of the lower mold 6B, and is raised and lowered by, for example, a lifting drive mechanism (for example, a drive mechanism such as a cylinder drive, a solenoid drive, a motor drive, etc.) to rotate The rod 13d is rotatable. The pusher 6j is provided to increase the offset of the pair of film chucks 13c and further increase the tension toward the single film F. In addition, the pusher 6j can also be used to release the ratchet mechanism 13f.

When the single film F and the resin supply jig 13 are placed on the lower mold 6B (lower mold movable jig 6g) through the resin supply loader 11, the pusher 6j arranged directly under the rotating rod 13d operates to make the rotating rod 13d Rotate in a direction that increases the offset of the film chuck 13c. Thereby, it is possible to prevent the tension of the single film F from decreasing before the mold is clamped. Of course, when the film F approaches the lower mold 6B, it may be rotated in a direction that increases the offset of the film chuck 13c.

Next, referring to FIG. 2, the feeding process of the single film F and the assembling process of the resin feeding jig 13 will be described, and referring to Fig. 3, the measuring process before the resin feeding of the resin feeding jig and the molding resin feeding measurement process will be described. Description, with reference to FIG. 4, the measurement process after the resin supply of the resin supply jig and the transport process of the resin supply jig will be described.

In FIG. 2A, the film end is pulled from the film roll 8a in the film supply part 8 (refer to FIG. 1) to the upper side of the platform part 17. As shown in FIG. The film end is pulled out onto the platform portion 17 in a state of being held by a chuck hand not shown, for example.

Next, as shown in FIG. 2B, the platform portion 17 is raised so as to be in close contact with the long film F. Next, a suction device (not shown) is used to suck from the film suction holes 17a, and the film F is sucked and held at positions corresponding to the four sides of the rectangle of the platform portion 17 without wrinkles, and the cutter 18 is actuated to cut into a mold cavity. The recess is larger than the predetermined rectangular size. In this embodiment, it is cut into a rectangle larger than the outer shape of the lower mold movable jig 6g. Figure 2C shows the single film F after cutting. The single-piece film F is in a state of being sucked and held by the platform portion 17.

Next, in FIG. 2D, the frame body 13a held by the loader finger 11a of the resin supply loader 11 is superimposed on the cut single film F. The loader claw 11a is inserted into the locking hole 13n and placed on the single film F sucked and held on the platform part 17 while keeping the frame 13a locked. At this time, the outer frame body 13a1 is located further outward than the frame body 13a, and the film chuck 13c supported by the rotating rod 13d is opened outside the outer peripheral edge of the single film F.

In FIG. 2E, the outer frame body 13a1 is moved in the direction approaching the frame body 13a by the cylinder mechanism mounted on the resin supply loader 11 side, and the film chuck 13c held by the rotating rod 13d is in the single film F The four sides of the film chuck 13c and its outer peripheral edge part enters the state between the pair of film chucks 13c. At this time, a pair of film chucks 13c provided on each side are respectively closed by a cam mechanism not shown, so that the outer peripheral edge portions of each side of the single-piece film F are clamped. In addition, the suction operation by the film suction hole 17a of the platform portion 17 is canceled in advance. And the driving source not shown in the figure is actuated to start the push-up action of the push-up pin 15.

Next, in FIG. 2F, when the push-up pin 15 is in contact with the rotating rod 13d, the rotating rod 13d rotates in the arrow direction with the rotating shaft 13e as the center. The rotation direction is a direction in which the film chuck 13c is shifted (divided) from the fulcrum frame 13b. Thereby, because the single film F is stretched from both sides by the film chuck 13c, the end of the single film F is pulled apart by the fulcrum frame 13b, that is, the angle at which the single film F is wound Increase and increase the tension of the film between the fulcrum frame bodies 13b (rotate the rotating rod 13d in the opening direction and pull it up). At this time, the ratchet mechanism 13f shown in FIG. 5 is operated, and the rotating rod 13d is held in multiple stages in the rotating position, so it is maintained in a state where the tension of the film covering the frame opening of the frame 13a is strengthened. Therefore, the resin accommodating portion 22 in which one side opening (lower opening) of the frame 13a is covered with the single-piece film F is formed. In addition, since the suction of the single-piece film F toward the platform portion 17 is released, tension can be applied to the single-piece film F with any strength to stretch the wrinkles.

In this way, by making the film chuck 13c move up and down to the fulcrum frame 13b (fulcrum part) and shrink the single film F, for example, compared with the structure of pulling the film chuck 13c in the lateral direction and applying tension, it can be Tension is effectively applied to the single film F. In addition, the device configuration for applying tension to the single film F can be miniaturized in a plan view. In other words, the larger the size of the single film F, the greater the amount of stretching in order to apply the same tension. However, when the film chuck 13c is stretched in the transverse direction, it is necessary to ensure that the area in the device corresponds to the amount of stretching. It is unavoidable to increase the size of the device. In contrast, according to the configuration of the present embodiment described above, even if the stretching amount is increased to increase the tension toward the single-piece film F, the enlargement of the device can be effectively suppressed without increasing the area of the device. In addition, since the film chuck 13c is set to be rotatable about the rotating shaft 13e, and the push pin 15 on the side of the film chuck 13c of the rotating rod 13d is pushed up and rotated, it is possible to apply a small force to the single film F tension.

Next, in FIG. 3G, the loader claw 11a of the resin supply loader 11 releases the holding of the frame 13a and withdraws from the locking hole 13n. The loader claw 11a moves to the side of the resin supply loader 11 (refer to FIG. 1) and retreats from directly above the platform portion 17. In addition, by rotating the rotating rod 13d, the push-up pin 15 is stopped at a position where the film chuck 13c is shifted from the fulcrum frame 13b (a state where tension is applied to the single film F).

Next, in FIG. 3H, the upper push pin 15 is retracted so as to be separated from the rotating rod 13d, and the weighing device 21 arranged directly below the platform portion 17 is started to perform a weighing operation. The metering pin 21a is aligned with the through hole 17b and stands by, and the metering device 21 is installed so as to be capable of being raised and lowered by an elevating mechanism (not shown).

In this embodiment, because the single film F is to be cut at a location on the platform 17 and the single film F is held and measured toward the frame jig, it is necessary to place the metering pin 21a on the platform during measurement. The portion 17 is moved up and down through the through hole 17b, but the measuring device 21 may be arranged in another position for measuring. In addition, when the measurement is performed at another position, since there is no platform portion 17 either, the measurement pin 21a and the through hole 17b are also unnecessary.

Next, in FIG. 3I, the resin supply jig 13 (frame 13a) is pushed from the platform 17 by raising the metering device 21 and the metering pin 21a penetrates the through hole 17b of the platform 17 to measure before the resin is injected. The weight of the resin supply fixture 13 and the single film F. The initial weight measured at this time may be reset to zero and then the amount of resin described later may be measured, or the amount of resin may be measured by subtracting the initial weight from the weight after resin injection described later.

Next, in FIG. 3J, the metering pin 21a of the metering device 21 keeps the resin supply jig 13 (frame 13a) pushed up from the platform portion 17 and causes the distributor 9 (refer to FIG. 1) to be described later to scan to remove the pellets. The resin R is supplied to the resin accommodating part 22 of the frame 13a. The distributor 9 scans the groove 16 in the XY direction through a scanning mechanism 23 (scanning part) described later, and supplies the pellet resin R onto the single-piece film F continuously and uniformly (flat) by an electromagnetic feeder. The granular resin R is supplied in an amount required for one resin molding operation.

Next, in FIG. 4K, the state in which the pellet resin R is uniformly (flat) supplied to the resin storage portion 22 (on the single-piece film F) by the distributor 9 is shown. When the supply of the pellet resin R is stopped, the weight after the resin injection is measured by the measuring device 21. The weight of the frame body and the single-piece film F is single and can be directly and accurately measured under the resin supply jig 13 without connecting the electric wiring, the air suction hose, and the like. As a result, it is possible to immediately and accurately measure the resin amount of the pellet resin R required for one resin molding.

In addition, in terms of the method of supplying the resin storage portion 22 through the dispenser 9, it is possible to continuously supply while scanning the predetermined amount of resin. However, in order to perform accurate supply without excessive or insufficient amount, it can be temporarily stopped before the amount of resin reaches the predetermined amount. After the supply operation is measured by the measuring device 21, the resin injection amount per unit time is changed and the supply reaches a predetermined amount.

For example, when 100 g of pelletized resin R is supplied by the distributor 9, firstly, 90 g is continuously injected, and the electromagnetic feeder is temporarily stopped and measured. The change is made so that the resin injection amount per unit time is reduced by changing at least one of the amplitude or the number of vibrations of the electromagnetic feeder after measurement. Then, after changing the resin injection amount per unit time, a small amount is injected, the injection is stopped again, and the measurement is performed. By repeating this operation, the target value of 100 g can be supplied.

In the case of a round workpiece such as a wafer, after the resin is supplied in a circular shape along the outermost circumference of the housing, the resin supply is temporarily stopped and the distributor 9 is moved slightly inward from the outermost circumference. After the resin is measured during this movement, the resin is supplied while moving slightly to the inner circle along the outermost circle. It is also possible to change the resin injection amount every inner week according to the measurement result at this time. By repeating this operation, the resin can be uniformly supplied to the center.

In FIG. 4L, when the metering of the resin amount is completed, the metering device 21 is lowered and separated from the platform portion 17. At this time, the resin supply jig 13 (frame body 13a) supported by the metering pin 21a is transferred to the platform portion 17 again.

Next, in FIG. 4M, the resin supply loader 11 is moved to the resin supply jig 13, and the loader claw 11a enters the locking hole 13n to engage with the frame 13a.

Finally, in FIG. 4N, the loader claw 11a is raised to lift the resin supply jig 13 to which the pellet resin R is supplied from the platform portion 17 and is pulled into the side of the guide rail 14 where the resin supply loader 11 moves. At this time, for example, when the weight of the supplied molding resin R is too large and the tension applied to the single-piece film F cannot properly convey the molding resin R, the single-piece film F may sag at the center or the like. For this reason, the operation can be stopped while the resin supply jig 13 is lifted to an arbitrary detection position, and the shielding state in the space on the platform 17 can be detected by the film sagging detection unit 20 (refer to FIG. 5). That is, when the tension of the single-piece film F is insufficient and the single-piece film F sags at the center or the like, the upper push pin 15 is operated to lower the resin supply jig 13 and the tension is applied again. By appropriately repeating such operations as necessary, the single film F can be conveyed after applying an appropriate tension. In addition, when the film sagging detection unit 20 detects the sagging of the single-piece film F, a warning may be issued as an abnormal state and the apparatus may be stopped.

In addition, it is estimated that the molding resin R is biasedly supplied to the single-piece film F due to the mounting state of the wafer in the workpiece W, and the like. In this case, it is assumed that the non-central portion (a position deviated to one side) of the single-piece film F sags. Therefore, as shown in FIG. 5, when two sets of film sagging detection parts 20 are arranged in two crossing directions, even when the non-central part of the single film F is sagging, it can still be detected that the single film F is at that position. The state of sagging. Thereby, the sagging state of the single-piece film F can be appropriately detected, and the single-piece film F can be conveyed after applying an appropriate tension.

Next, the resin supply loader 11 is conveyed along the guide rail 14 in FIG. 1 while holding the resin supply jig 13 and is carried into the mold 6 (lower mold 6B) of the predetermined pressing portion 5. Here, the resin supply jig 13 is supplied to the molding die 6 through the gap of the column 5 a in the pressing portion 5. In this case, the resin supply jig 13 does not pull the film chuck 13c in the lateral direction, and moves the film chuck 13c in the vertical direction relative to the fulcrum frame 13b (fulcrum portion) to apply tension. The structure of (rotating the rotating rod 13d in the opening direction and pulling it upwards) allows the structure to be miniaturized, so the resin supply jig 13 can be carried into the molding die 6 through the limited gap of the column 5a. In addition, even when the column 5a is not used, the pressing portion 5 uses a frame plate to hold the side surface of the platen in the press structure, and the same effect can be obtained.

By using the resin supply jig 13 described above, since it can be conveyed while maintaining a predetermined tension, the single film F can be transferred to the mold 6 without wrinkles. In addition, since the pelletized resin R required for resin molding is accurately measured and supplied to the resin accommodating portion 22 at a time, the molding quality of the molded product can be improved.

Next, referring to FIGS. 7 and 8, the operation of supplying the single-piece film F and the molding resin R to the molding die 6 using the resin supply jig 13 will be described. Fig. 7 and Fig. 8 only illustrate the lower mold 6B for illustration.

In FIG. 7A, the resin supply loader 11 holding the resin supply jig 13 enters above the lower mold 6B of the mold 6 with the mold opened for positioning, and the pellet resin R of the single film F is mounted The surface overlaps with the upper surface of the lower mold cavity 6f, and alignment is performed so that the frame 13a overlaps with the lower mold movable jig 6g.

Next, as shown in FIG. 7B, the resin supply loader 11 is lowered, and the frame 13a is lowered until it comes into contact with the movable jig 6g of the lower mold. At this time, the pusher 6j provided in the lower mold 6B is arranged at a position corresponding to the rotating rod 13d.

When the single-piece film F is close to the lower mold 6B, the single-piece film F may stretch due to the radiant heat from the lower mold 6B and cause the above-mentioned film sag problem. Therefore, as shown in FIG. 7C, a driving source not shown is actuated to push up the pusher 6j, and the rotating rod 13d is further rotated around the rotating shaft 13e. The rotation direction is the direction in which the film chuck 13c is shifted (separated) from the fulcrum frame 13b. Thereby, since the single film F is further pulled from both sides by the film chuck 13c, the winding angle of the film F relative to the fulcrum frame 13b is further increased, in other words, the single film clamped by the film chuck 13c The end of F is shifted (away) from the fulcrum frame 13b (fulcrum portion), so that the single-piece film F is stretched inside the fulcrum frame 13b, and the film tension between the fulcrum frames 13b increases. At this time, since the ratchet mechanism 13f shown in FIG. 3 is actuated, the rotating rod 13d is held in the rotating position, and therefore, the tension of the film that closes the opening of the frame 13a is increased while being maintained.

In Fig. 8D, the suction operation is started from the air suction paths 6g1 and 6g2 provided in the movable jig 6g of the lower mold, and the inner and outer peripheries of the single film F are sucked and held along the cavity recess 6C of the lower mold. Since the single-piece film F is adsorbed and held in a state where the film tension is increased, the occurrence of wrinkles can be effectively prevented.

Next, in FIG. 8E, when the drive source not shown is actuated and the pusher 6j is pushed up to a predetermined height and then retracted downward, the ratchet mechanism 13f (refer to FIG. 3) will be released, so the rotating rod 13d will be It rotates in the direction (arrow direction) approaching the fulcrum frame 13b. At this time, the film chuck 13c returns to a horizontal posture parallel to the clamping surface of the lower mold movable jig 6g. In this state, by moving the outer frame 13a1 outward, a cam mechanism (not shown) is used to release the clamping of the film chuck 13c that clamps the outer peripheral edge of the single film F. Thereby, the monolithic film F can be transferred to the lower mold 6B while maintaining the state of being adsorbed and held together with the particulate resin R. During these operations, the single film F will be sucked and held in the lower mold cavity recess 6C by the suction of the movable clamp 6g of the lower mold, so even if the chuck is released, the sheet will not be damaged. The sheet film F is adsorbed and maintained.

Next, as shown in FIG. 8F, the resin supply loader 11 moves upward while keeping the resin supply jig 13 (frame body 13a) sandwiched therebetween, and is retracted from the pressing portion 5. As described above, the process of supplying the monolithic film F and the pellet resin R to the lower mold 6B is completed.

According to the supply operation of the single-piece film F to the molding die 6 as described above, the single-piece film F can be supplied to the molding die 6 without wrinkles. In addition, although the single film F may be stretched due to radiant heat when the single film F is loaded into the molding die 6, the tension is increased again by the pusher 6j (tension applying mechanism) to prevent the Wrinkles occur when the single-piece film F is set toward the molding die 6.

Next, an example of the resin molding operation subsequent to FIGS. 7 and 8 will be described with reference to FIG. 9. In FIG. 9A, as described above, it is assumed that the single-piece film F and the pellet resin R are carried in by the resin supply loader 11 in the lower mold 6B.

In FIG. 9A, a large workpiece W (workpiece, rectangular substrate, etc.) with a size of 600 mm on each side (workpiece, rectangular substrate, etc.) is loaded into the upper mold 6A through the workpiece loader 10 (refer to FIG. 1), and is provided in the air suction holes 6b of the upper mold clamping surface 6a. And the air suction path 6c is sucked and held. At this time, the outer peripheral surface of the rectangular workpiece W is positioned on the upper mold 6A and transferred by pressing and holding the outer peripheral surface of the workpiece W by the workpiece holding pins 6d provided at opposing positions at a plurality of positions. In addition, in the case of a workpiece having a positioning pin in the edge of the workpiece, the positioning pin can be used for positioning. In addition, the rectangular workpiece W is centered by the workpiece holding pins 6d when the outer peripheral surface of the workpiece W is uniformly pressed by the workpiece holding pins 6d. In addition, the loading of the single-piece film F and the pellet resin R and the loading of the workpiece W may be performed at the same time, or the single-piece film F and the pellet resin R may be loaded after the workpiece W is loaded.

Next, as shown in FIG. 9B, the molding die 6 is closed. For example, the lower mold 6B is raised, and the workpiece W is clamped between the upper mold 6A and the lower mold 6B. In addition, before the upper mold 6A and the lower mold 6B clamp the workpiece W, the mold space between the upper mold 6A and the lower mold 6B is closed to form a pressure-reduced space, which is preferable for molding under a pressure-reduced environment.

Next, by further clamping the mold 6 to compress the coil spring 6h, the movable clamp 6g of the lower mold moves to approach the lower module 6e. Therefore, the height (depth) of the cavity in the lower mold cavity recess 6C is reduced (shallow), the workpiece W is immersed in the pellet resin R melted in the lower mold cavity recess 6C, and resin pressure is applied to perform heating and pressurization. 9C shows a state in which the mold clamping action of the molding mold 6 is completed and the workpiece W is immersed in the pelletized resin R melted in the lower mold cavity recess 6C and heated and pressurized to harden it (compression molding).

After heating and hardening in the molding die 6 are completed, the molding die 6 is opened. Here, in a state where the molded product M is sucked and held on the upper mold holding surface 6a of the upper mold 6A and the single film F is held toward the lower mold holding surface including the lower mold cavity recess 6C, Open the mold. Therefore, as shown in FIG. 9D, when the mold is opened, the molded product M is sucked and held on the upper mold clamping surface 6a of the upper mold 6A, and the single film F is sucked and held on the mold containing the lower mold. The state of the lower mold clamping surface of the cavity 6C. In this way, by setting the molded product M and the used single film F in a separate mold, the process can be simplified in terms of taking them out from the pressing portion 5 and transporting them to each storage/receiving place.

Next, in FIG. 1, the molded product M is desorbed from the upper mold 6A and transferred to the work loader 10 (upper surface side). In addition, the used single-piece film F is transferred from the lower mold 6B by the work loader 10 (lower surface side). At this time, in order to transfer the molded product M from the upper mold clamping surface 6a to the workpiece loader 10, it is preferable to spray compressed air from the air suction hole 6b because the single film F is transferred from the lower mold surface to the workpiece loader 10 10. Therefore, it is better to spray compressed air from the air suction paths 6g1, 6g2. The molded product M is transferred from the workpiece loader 10 to the robot arm 4a of the robot transport device 4. The used single film F is discharged from the work loader 10 to the film recovery part 12 and recovered. The robot arm 4a holds the molded product M and carries it into the predetermined curing furnace 3. In the curing furnace 3, post-curing of the molded product M is performed. Subsequently, the robot arm 4a takes out the molded product M from the hardening furnace 3, completes all the processes for the workpiece W, and completes the manufacturing process of the molded product M. Next, the molded product M is carried into the molded product storage section 2 to store the molded product M.

In this way, according to this embodiment, by using the resin supply jig 13 that transports the single film F, the amount of film used can be reduced to reduce the running cost, and the molding quality of large-size molded products can be improved and the installation area can be reduced.

Next, a configuration example of the distributor 9 will be described with reference to FIGS. 10 to 12.

First, with reference to FIG. 10, the structure of the dispenser 9 which supplies the pellet resin R is demonstrated. The pellet resin R is stored in the first storage portion 9a fixed to the distribution unit Ud. A predetermined amount of pellet resin R is supplied from the first storage portion 9a to the second storage portion 9b located below the first storage portion 9a and temporarily stored. The pellet resin R is supplied from the first storage portion 9a to the second storage portion 9b, for example, an open baffle is opened and injected by an electromagnetic feeder. The tank 16 is connected to the second storage portion 9b, and a fixed amount of pellet resin R is fed by an electromagnetic feeder (not shown) and injected into the resin storage portion 22. In addition, the second storage portion 9b and the groove 16 scan the XYZ direction of the resin storage portion 22 through the scanning mechanism 23, and uniformly supply the molding resin required for one resin molding. In this case, it is also possible to make the groove 16 side move in the XY direction at least, and the resin accommodating portion 22 side may move in the Z direction through the elevation of the platform portion 17. The scanning mechanism 23 is that the Y-axis drive guide 23b is connected to the X-axis drive guide 23a so as to be movable in the X-axis direction, and the Z-axis drive guide 23c is connected to the Y-axis drive guide 23b so as to be able to move in the Y-axis direction. Move in the direction. And the scanning shaft 23d is connected to the Z-axis driving guide 23c so as to be movable in the Z-axis direction. The X-axis drive guide 23a, the Y-axis drive guide 23b, and the Z-axis drive guide 23c are equipped with a drive source (motor, air cylinder, etc.) and a drive transmission mechanism (ball screw and nut, guide rail, linear guide, etc.) and can be used along Reciprocating movement in each axis direction.

The second storage portion 9b and the groove 16 are integrally supported on the scanning shaft 23d. Therefore, the second storage portion 9b and the groove 16 are scanned in the XYZ direction with respect to the resin storage portion 22 formed in the resin supply jig 13, and the pellet resin R required for one resin molding is uniformly (flat) supplied. The pelletized resin having a uniform thickness can be supplied to the resin containing part of a wider area. The granular resin can be supplied in various ways, such as linear supply in a stroke, spiral supply, or supply in a manner of drawing concentric circles while changing the radial position.

In addition, it is preferable that an openable and closable baffle 24 is provided at the injection port of the tank 16. Because the pelletized resin is quantitatively sent out through the electromagnetic feeder, it can prevent the resin that is injected exceeding the required amount and the unnecessary resin from spreading around when it is desired to stop the injection immediately. The flap 24 is opened and closed by an opening and closing cylinder 24a supported by the scanning shaft 23d. In addition, although the molding resin required for one resin molding is loaded in the tank 16, because the resin injection can be stopped by changing the amplitude or frequency of the baffle 24 and the tank 16, it is also possible to mount the molding resin required for multiple times. Of resin. In addition, when the width of the baffle 24 becomes narrower toward the bottom of the injection port, the injection port can be used to block the molding resin without cutting or pushing in the molding resin, so it is better. .

In addition, it is preferable to provide a waste resin recovery box 25 below the injection port of the tank 16. At the beginning of supplying the pelletized resin R from the second storage portion 9b, the supply amount is likely to have an error. Therefore, the pelletized resin R immediately after the electromagnetic feeder is actuated is dropped onto the waste resin recovery box 25 and recovered until the resin supply amount is stabilized.

In addition, in front of the groove 16, an ionizer 26 for eliminating static electricity generated in the opening of the housing 13a is provided integrally with the scanning shaft 23d. Therefore, even if the pelletized resin R falls and adheres to the inclined portion 13g of the frame 13a, or even if the entire frame 13a reaches a predetermined weight and adheres to the frame 13a without falling to the lower mold, it can be It falls on the lower mold under static electricity and adhesion.

In addition, a frame knocking portion 27 may also be provided in front of the groove 16 for knocking the frame 13 a so that the pelletized resin R attached to the opening of the frame 13 a falls into the resin accommodating portion 22. The frame knocking portion 27 is moved up and down by, for example, a knocking column 27a provided integrally with the scanning shaft 23d. Thereby, even if the pellet resin R temporarily adheres to the inner surface of the opening including the inclined portion 13g of the frame 13a, the frame 13a is hit by the frame knocking portion 27, for example, to the particles attached to the inclined portion 13g. The resin R is vibrated and can be dropped into the resin accommodating portion 22 for resin molding.

In addition, a thin film detection sensor 28 (for example, a pressure sensor, a contact sensor, a height-restricted laser sensor, etc.) is provided in front of the groove 16. The film detection sensor 28 is supported so as to be liftable through the lift cylinder 28a provided integrally with the scanning shaft 23d. The film detection sensor 28 detects whether the single film F is tensioned and set in the tension setting state of the resin supply jig 13 with an appropriate tension. After the single film F is tensioned and set on the resin supply jig 13, before the granular resin R is injected by the dispenser 9, the scanning axis 23d is scanned in the XY direction on the resin accommodating part 22, and the film detection sensor 28 is used. Detect the tension of the film through contact pressure or reflected light. Thereby, it is possible to prevent the placement error of the single film F in the resin supply jig 13 and prevent the granular resin R from being injected by mistake.

Since the distributor 9 can move in at least the XY direction, it is better to spread the pellet resin R in a uniform manner when the resin is injected into the resin accommodating portion 22 than when it is flattened after being injected into one part of the resin accommodating portion 22. The granular resin can be flattened reliably and quickly.

In addition, as shown in FIG. 14, a servo motor 23e capable of rotating the scanning shaft 23d in the forward and reverse directions between the Z-axis drive guide 23c and the scanning shaft 23d may be installed in the distributor 9. With this, in the case of a round workpiece such as a wafer, the scanning axis 23d can be rotated in a predetermined direction by the servo motor 23e so that the exit direction of the groove 16 is always along the outer periphery of the frame 13a. , The molding resin is supplied with the direction of the groove 16 in the direction perpendicular to the outer circumference of the workpiece (radial direction) or parallel direction (tangential direction).

Next, the configuration of the dispenser 9 for supplying the liquid resin R will be described with reference to FIG. 11. The scanning mechanism 23 is the same as in FIG. 10.

In FIG. 11, the dispenser 9 includes a squeeze mechanism 9c having a piston and a syringe 9d with a built-in liquid resin R. The squeeze mechanism 9c has a cylinder, and is formed in the syringe 9d to press a piston connected to a cylinder rod to discharge the liquid resin R. The distributor 9 is exchangeably provided for the scanning axis 23d. The dispenser 9 is formed to be exchangeable with other dispensers 9 when the remaining amount of the liquid resin R contained in the syringe 9d decreases. A waste resin collection box 25 is provided below the syringe 9d. The liquid resin R immediately after the squeezing mechanism 9c is operated is dropped onto the waste resin recovery box 25 and recovered until the supply amount of the liquid resin from the syringe 9d is stabilized.

In addition, the distributor 9 is not limited to a singular number, and as shown in FIG. 12, it may be plural (for example, two), and supply the resin accommodating portion 22 formed in the resin supply jig 13. In this case, a plurality of distributors 9 can be made to share the resin injection area and be supplied separately, or a plurality of distributors 9 can be made to scan at least in the XY direction or XYZ according to the scanning mechanism 23 and supply to the resin storage.部22.

In addition, although the syringe 9d is exchanged in the embodiment shown in FIG. 11, when a large amount of the molded resin R is supplied to the resin accommodating portion 22, a resin supply tank may be provided outside, and a hose may be used to continue toward the syringe 9d. Ground supply molding resin R structure.

Next, referring to FIG. 13, another example of the resin supply jig 13 will be described. The same components as in FIG. 5 are given the same reference numerals and the description is cited. The resin supply jig 13 in FIG. 5 assumes that a substrate or plate is used as a workpiece, and the frame body 13a is formed in a rectangular shape with a rectangular hollow hole. However, as the workpiece, a semiconductor wafer or eWLB (embedded wafer level ball grid) is used. In the case of a circular workpiece such as an array), it is preferable to use a resin supply jig 13 with a circular inner surface, wherein the inner surface is formed with a circular hollow hole corresponding to the cavity recess and the shape of the workpiece. The outer shape of the frame 13a and the outer shape of the single-piece film F are rectangular in the same manner as in FIG. 5.

In addition, the above-mentioned embodiment describes the case where the molding resin R and the single film F are transported and transferred to the lower mold clamping surface of the mold 6 where the lower mold cavity recess 6C is formed, but it can also be used The upper mold compression molding only conveys and transfers the single film F to the upper mold clamping surface where the upper mold cavity recess is formed. Also in this case, the molding resin R system is placed on the workpiece and placed on the lower mold. In this case, the distributor 9 can also be made to scan the workpiece in the XY direction, and open and close the injection port of the groove 16 or the syringe 9d to inject molding resin (granular resin, powdered resin, liquid resin, etc.). Also in this case, compared with a long-size film, the operating cost can be reduced by reducing the amount of single-piece film F used. Similarly, it is also possible to make a pair of lower mold clamping surfaces where the lower mold cavity recesses are formed to convey and transfer only the single film F. In addition, it can also be made that the single film F is supplied to the upper mold and the lower mold in the same manner. In addition, the molding die 6 has been described using a compression molding die. But it can also be a mold for transfer molding.

In addition, according to the resin supply jig 13 as described above, in addition to the configuration of additionally applying tension to the single film F stretched by radiant heat in the molding die 6, it can also be made to be additionally performed before being supplied to the molding die 6. Applied composition. In this case, for example, even if it is necessary to preheat the resin that is difficult to transport, such as the powdered resin that may cause the powdery resin to spread due to the flow of the ambient gas during transport, if you supply and preheat the molding When the resin R is used, tension can be applied to the single-piece film F, and the slack of the single-piece film F can be eliminated by preheating before being transported.

In addition, although the distribution unit Ud can be used in combination with a resin molding device as described above, it can also be used as its monomer. In this case, it can be considered to prepare a resin supply jig 13 for holding the single film F to which a predetermined tension is applied in the distribution unit Ud, and to supply one of the resin supply jig 13 to the separately provided press unit Up. Process. Even in this case, the effect of using the distribution unit Ud and the resin supply jig 13 can be achieved as described above.

11a: Loader claw

13: Resin supply fixture

13a: frame

13a1: Outer frame

13b: Fulcrum frame

13c: Film chuck

13d: Rotating rod

13e: Rotation axis

13g: Inclined part

13n: locking hole

15: Upsell

16: slot

17: Platform Department

17a: Film adsorption hole

17b: Through hole

21: Metering device

21a: Metering pin

22: Resin Containment Department

F: Monolithic film

R: Molding resin

Claims (19)

A frame jig, which is characterized by comprising: a frame having an opening with a predetermined shape on the inner surface, the inner surface corresponding to a cavity recess formed on the clamping surface of a molding die; a film holding part, holding and covering the aforementioned The outer peripheral edge of the single-piece film assembled with one side opening of the frame body is provided with a pair at least on the opposite side; a fulcrum frame body, which is provided along the frame body and becomes a fulcrum portion that applies tension to the single-piece film ; And the offset mechanism to offset the film holding portion along the direction separating the fulcrum frame, and equipped with: tension maintaining mechanism, the outer peripheral edge portion of the single film can be grasped by the film holding portion In the state of, the state shifted along the direction of separating the fulcrum frame body is maintained and the predetermined tension of the single film is maintained. Such as the frame jig of claim 1, wherein the aforementioned frame system is formed with a film that is difficult to adhere to the mold resin on the surface or a material that is difficult to adhere to using the mold resin. A resin supply jig, which is characterized by comprising: a frame jig such as claim 1 or 2; a single-piece film covering one side opening of the frame of the frame jig; and a resin accommodating part Hold the outer peripheral edge of the aforementioned single-piece film with the film holding part and apply a predetermined tension. It holds and accommodates the molded resin formed by blocking the opening on one side of the aforementioned frame. A resin supply device that scans at least the XY direction while injecting the molded resin from the resin injection portion to the resin accommodating portion of the resin supply jig as in Claim 3, thereby supplying a predetermined amount of molded resin Onto a single piece of film. The resin supply device according to claim 4, wherein the resin injection portion is provided with a baffle capable of opening and closing the injection port. The resin supply device of claim 4, wherein an ionizer is provided in the resin injection portion, and the ionizer eliminates static electricity generated at the opening of the frame. The resin supply device of claim 4, wherein a film detection sensor is provided in the resin injection portion, and the film detection sensor detects the tension setting state of the single film in the resin supply jig. The resin supply device according to claim 4, wherein the resin injection part is provided with a frame knocking part, and the frame knocking part knocks the frame so as to be attached to the inner surface of the opening containing the inclined part. The resin falls into the resin accommodating part. A measuring device for molding resin, which uses the resin supply jig of claim 3 to measure the weight of the molded resin, wherein the resin supply jig before supplying the molded resin to the resin accommodating portion The weight and the weight of the resin supply jig after supplying the molding resin to the resin accommodating portion, and the amount of resin required for resin molding is measured. A resin supply metering device characterized by Resin supply jigs, such as the resin supply device of any one of claims 4 to 8, and the molding resin metering device of claim 9. A resin molding apparatus is provided with a resin supply and metering device as in claim 10, and a resin supply jig for molding resin required for resin molding is supplied to a resin accommodating portion once, and is transported to the molding die and molded Plastic molding. A method for measuring molded resin, which is characterized in that it includes the step of preparing a resin supply jig having a resin accommodating portion, and one side opening of a frame having an opening of a predetermined shape on the inner surface is covered by a single piece of film, and the inner The surface corresponds to the cavity recess formed on the clamping surface of the molding die; and the metering step is to directly support the resin supply jig before and after the molding resin is supplied to the metering device to measure the molding resin weight. The molding resin measuring method of claim 12, which further includes uniformly supplying a predetermined amount of molding resin to the single-piece film from the other side opening of the frame through a resin supply device to the resin accommodating portion The process of obtaining the predetermined difference between the weight of the resin supply jig before the molding resin is supplied to the resin accommodating portion and the weight of the resin supply jig after the molding resin is supplied to the resin accommodating portion The amount of resin is supplied from the aforementioned resin supply device. According to claim 12, the method for measuring molding resin, which further includes uniformly supplying a predetermined amount of molding resin from the other side opening of the frame to the resin accommodating portion through a resin supply device. The process on the sheet film, and obtain the difference between the weight of the resin supply jig before the molding resin is supplied to the resin accommodating portion and the weight of the resin supply jig after the molding resin is supplied to the resin accommodating portion The calculated amount of resin is measured by the aforementioned measuring device while the molding resin is supplied from the aforementioned resin supply device. A resin supply and measurement method in which a predetermined amount of molded resin is supplied to a resin supply jig from one side of the opening and the resin supply jig is used to cover the other side of the opening. The single-piece film holds a frame with an opening of a predetermined shape on the inner surface to form a resin accommodating portion. The inner surface corresponds to the cavity recess. The feature includes: overlapping the frame so that the other side of the opening is covered The step of forming the resin supply jig with the resin containing portion while holding the single-piece film in a state where at least the opposite side of the outer peripheral edge portion of the single-piece film is held and a predetermined tension is applied; The weighing process of measuring the weight of the resin supply jig by directly supporting the resin supply jig on the measuring device; for the resin accommodating part, the predetermined amount is measured by the resin supply device from the side opening of the frame. The process of uniformly supplying the molding resin to the single film from the weight of the resin supply jig before the molding resin is supplied to the resin accommodating part and the resin after the molding resin is supplied to the resin accommodating part The weight of the supplied jig, the amount of resin required for molding the resin measured by the aforementioned measuring device, is supplied from the aforementioned resin The device is supplied. The resin supply and measurement method of claim 15, which includes a platform part, and the frame is overlapped on the single film while maintaining the single film on one side so as to cover the opening on the other side At the same time, while maintaining the outer peripheral edge of the single film and applying tension, it is held in the frame to form a resin accommodating portion in the resin supply jig, and a through hole or cut is provided in the platform portion, In the metering device, a metering pin passes through the through hole from one side of the platform portion or supports the resin supply jig through a cutout portion to measure the weight of the resin supply jig. The resin supply metering method of claim 15, wherein the resin supply device scans at least the XY direction of the resin injection portion to uniformly supply the molding resin required for resin molding to the resin accommodating portion. The resin supply measurement method according to any one of claims 15 to 17, wherein the resin supply device repeats the operation of temporarily stopping the supply before the amount of resin supplied to the resin accommodating portion reaches a predetermined amount, and after the measurement by the measurement device, The operation of changing the resin injection amount per unit time to supply. A resin molding method comprising a resin supply jig for supplying molding resin required for resin molding to a resin accommodating portion by a resin supply metering method as in any one of claims 15 to 18, by resin supply The process of transporting the loader to the molding mold and transferring the single-piece film and molding resin to the aforementioned molding mold.

Images