CN107972220A - Resin material feedway and method, resin molding apparatus and resin forming product manufacture method - Google Patents
Resin material feedway and method, resin molding apparatus and resin forming product manufacture method Download PDFInfo
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- CN107972220A CN107972220A CN201710977144.6A CN201710977144A CN107972220A CN 107972220 A CN107972220 A CN 107972220A CN 201710977144 A CN201710977144 A CN 201710977144A CN 107972220 A CN107972220 A CN 107972220A
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- supply
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
- B29C31/04—Feeding of the material to be moulded, e.g. into a mould cavity
- B29C31/042—Feeding of the material to be moulded, e.g. into a mould cavity using dispensing heads, e.g. extruders, placed over or apart from the moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
- B29C31/04—Feeding of the material to be moulded, e.g. into a mould cavity
- B29C31/06—Feeding of the material to be moulded, e.g. into a mould cavity in measured doses, e.g. by weighting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
- B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
- B29C2043/3405—Feeding the material to the mould or the compression means using carrying means
- B29C2043/3427—Feeding the material to the mould or the compression means using carrying means hopper, vessel, chute, tube, conveying screw, for material in discrete form, e.g. particles or powder or fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
- B29C2043/3433—Feeding the material to the mould or the compression means using dispensing heads, e.g. extruders, placed over or apart from the moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
- B29C2043/3488—Feeding the material to the mould or the compression means uniformly distributed into the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
- B29C2043/5875—Measuring, controlling or regulating the material feed to the moulds or mould parts, e.g. controlling feed flow, velocity, weight, doses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3406—Components, e.g. resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
A kind of resin material feedway and method, resin molding apparatus and resin forming product manufacture method, resin material feedway possess：Object maintaining part is supplied, it keeps the supply object of the object as supply resin material；Resin material supply mouth, it is arranged on the top of the supply object maintaining part；Move portion, it makes resin material supply mouth be moved relative to the relative position of the horizontal direction for the supply object for being maintained at above-mentioned supply object maintaining part；And control unit, it is to make above-mentioned relative position not control move portion in a manner of Shangdi is back to the starting position by the entirety of the supply subject area of above-mentioned supply object by same position 2 times in mobile route from starting position.By making relative position be back to starting position, and resin material is nearby supplied again to being just initially supplied the less starting position of the quantity delivered of rear resin material, so that the amount of the resin material near starting position becomes near uniform.
Description
Technical field
The present invention relates to a kind of resin material feedway for supplying resin material and method, there is resin material supply
The resin molding apparatus of device and the resin forming product manufacture method using the resin material supply method.
Background technology
In order to which in the environmental protection electronic component such as light, heat, moisture, electronic component is generally by resin seal.Resin seal
There are compression forming method or transfer forming process etc. in method.Compression forming method is by using the finishing die being made of lower die and upper mold
Tool, supplies resin material to the die cavity of lower die, the substrate for being equiped with electronic component is installed to upper mold, one in face of lower die with it is upper
Mould is heated, and is simultaneously molded both and is formed.Transfer forming process is by being installed to the die cavity of one of upper mold and lower die
After substrate, one is heated in face of lower die with upper mold, simultaneously molds both, and is pressed into resin using plunger (plunger)
It is formed to die cavity.In forming process is transferred, a part for meeting cull in plunger is to the path of die cavity supply resin
And produce waste, and can produce because resin flows cause semiconductor substrate or distribution to damage the problem of, so press in recent years
Contracting forming process becomes mainstream.
In compression molding, it is however generally that, it is powdered to supply to the resin material of die cavity or graininess is (below, by it
Be referred to as powder shaped) it is or liquid.The resin material of powder shaped will not flow freely in die cavity after supply, on
Liquid resin material, the in general viscosity used in compression molding is higher, so less flowed in die cavity.Cause
This, in shaping, by causing sticky decline because being heated to resin material, resin flows in die cavity, and has to electricity
Sub- part applies the anxiety of load, so resin material is preferably supplied to die cavity as homogeneously as possible in advance before forming.Specially
Compression molding apparatuss described in sharp document 1 are that one side falls to resin material to be placed in the resin material supply mouth of saddle
Die cavity on XY platforms, simultaneously fixes the position of resin material supply mouth, make XY platforms take the shape of the letter U curve-like movement, it is thus right
Supply resin material in die cavity.Represent that resin material supply mouth is relative to die cavity in the existing compression molding apparatuss in fig. 11
The track 92 of 91 relative movement.During the curvilinear relative movement of the U-shaped, translational speed is simultaneously maintained fixed value,
Simultaneously resin material is supplied with fixed feed speed (quantity delivered of the resin material of time per unit), thus in die cavity 91
Resin material no matter which position to become uniform in.
[background technology document]
[patent document]
[patent document 1] Japanese Unexamined Patent Publication 2013-042017 publications.
The content of the invention
Problem to be solved by the invention：
In general, in the device to die cavity input resin material, to reaching after the supply action of resin material is started
The time (although only needing a little) is needed untill the feed speed of above-mentioned fixation, the feed speed after being just initially supplied is fixed compared with this
Feed speed it is low.Therefore, even if the translational speed of die cavity is set to fixed, in die cavity, the position after being just initially supplied (is opened
Beginning position) resin material amount also compared with the resin material in other positions amount reduce.Thus, the resin material in die cavity becomes
Obtain uneven.
Problem to be solved by this invention be to provide it is a kind of can be in a manner of becoming near uniform compared with existing pair
The resin material feedway and method of the supply object supply resin material such as die cavity of resin molding apparatus.
Technical means to solve problem：
The resin material feedway of the invention completed to solve the above-mentioned problems is characterized in that possessing：
A) object maintaining part is supplied, it keeps the supply object of the object of supply resin material；
B) resin material supply mouth, it is arranged at the top of the supply object maintaining part；
C) move portion, it makes above-mentioned resin material supply mouth relative to the supply for being held in above-mentioned supply object maintaining part
The relative position movement of the horizontal direction of object；And
D) control unit, it will not be in mobile route by same position 2 times from starting position with above-mentioned relative position
The above-mentioned move portion in the supply subject area of above-mentioned supply object is controlled in a manner of Shangdi is back to the starting position
It is mobile.
The resin material supply method of the present invention is characterized in that：Simultaneously make the supply pair of the object for supply resin material
As the relative position of thing and the horizontal direction of the resin material supply mouth for the top for being arranged at the supply object is with from start bit
Put will not in mobile route same position 2 times in a manner of Shangdi is back to the starting position in above-mentioned supply object
The supply subject area movement of thing, simultaneously supplies resin material from the resin material supply mouth to the supply object.
The resin molding apparatus of the present invention is characterized in that possessing：
Above-mentioned resin material feedway；
Compression molding portion, its with the 1st shaping dies, the 2nd shaping dies with die cavity and by the 1st shaping dies with
The clamping of 2nd shaping dies molding；And
Transferred unit, it will be transferred by above-mentioned resin material feedway to be supplied with the supply object of resin material
On to above-mentioned die cavity, the resin material is supplied to the die cavity from the supply object.
The resin forming product manufacture method of the present invention is characterized by having following steps：
The step of resin material is supplied to above-mentioned supply object by above-mentioned resin material supply method；
The supply object for being supplied with resin material is transferred to the die cavity of the 2nd shaping dies, and from the supply object
The step of thing supplies the resin material to the die cavity；And
The step of the 2nd shaping dies that resin material is supplied with 1st shaping dies and die cavity is molded.
The effect of invention：
In accordance with the invention it is possible to die cavity of resin molding apparatus etc. is supplied in a manner of becoming near uniform compared with existing
Resin material is supplied to object.
Brief description of the drawings
Fig. 1 is the schematic configuration diagram for an embodiment for representing the resin material feedway of the present invention.
Fig. 2 (a) is the figure for representing to be fed with the state of resin material in resin material transfer pallet, and Fig. 2 (b) is by resin
Material transfers tray lift and forms the figure of the state of resin material receiving space.
Fig. 3 transfers pallet and in the resin material feedway of the present embodiment to the resinous wood for expression resin material
The exemplary top view of the track of material transfer pallet supply resin material.
Fig. 4 is the resin material for representing to transfer the resin material resettlement section of pallet from resin material supply mouth towards resin material
Feed speed desired value and measured value time change curve map.
Fig. 5 (a) and Fig. 5 (b) be supply to resin material transfer pallet resin material resettlement section resin material with
The parallel profilograph of the moving direction of relative position, Fig. 5 (a) are to represent the state after being just initially supplied, and Fig. 5 (b) is represents
State at the end of supply.
Fig. 6 is the shifting with relative position of the resin material for the resin material resettlement section that pallet is transferred in supply to resin material
The vertical profilograph in dynamic direction.
Fig. 7 (a) and Fig. 7 (b) transfers pallet and the resin material feedway in the present embodiment for expression resin material
In to resin material transfer pallet supply resin material track another exemplary top view.
Fig. 8 is the schematic configuration diagram of the variation for the resin material feedway for representing the present embodiment.
Fig. 9 is an exemplary vertical section in the compression molding portion for the part for being expressed as the resin molding apparatus of the present invention
Figure.
Figure 10 is to represent possess material receiving module, shape module and discharge the exemplary general of the resin molding apparatus of module
Sketch map.
Figure 11 is the top view for representing to supply die cavity in existing compression molding apparatuss the track of resin material.
Symbol description：
10、10A：Resin material feedway
11：Resin material maintaining part
12：Groove
121：Resin material supply mouth
13：Excitation
14：Measurement unit
15：Former supply unit
151：Former supply mouth
152：Former supply unit excitation
16：Holding station
17：Move portion
18：Transferred unit
19：Control unit
191：Feed speed test section
192：Alarm sending part
20、20A：Resin material transfers pallet
21、21A：Resin material resettlement section
211：Resin material houses frame
2111：Stop
212：Layer tension frame material
2121：Protuberance
213：Film holding parts
22、22A：Starting position
23、23A1、23A2、92：The track of the movement of relative position
24、241、242、243、244：The edge of resin material resettlement section
245：The center at the edge of the long side of resin material resettlement section
25：The region in the outside of curve
30：Compression molding portion
311：Lower part fixed disk
312：Top fixed disk
32：Connecting rod
33：Movable platform
34：Mold closing mechanism
351：Lower heater
352：Upper portion heater
40：Resin molding apparatus
41：Material receiving module
411：Substrate receiving division
42：Shape module
43：Discharge module
431：Resin forming product maintaining part
46：Main carrying device
47：Secondary carrying device
91：Die cavity
F：From shape film
LM：Lower die (the 2nd shaping dies)
MC：Die cavity
P：Resin material
PA：Resin material receiving space
S：Substrate
UM：Upper mold (the 1st shaping dies).
Embodiment
In the resin material feedway of the present invention and method, simultaneously make resin material supply mouth relative to being held in confession
Relative position to the horizontal direction of the supply object of object maintaining part is with will not be in mobile route from starting position
Moved 2 supply subject areas in a manner of Shangdi is back to starting position in above-mentioned supply object of same position,
Simultaneously resin material is supplied to supply object from resin material supply mouth.Due to so as so that relative position is back to out
The beginning mode of position moves the relative position, so part or all by the resin material supplied at the end of movement supplies
To starting position.Thus, even if making confession because the feed speed of the resin material after just starting the supply of resin material is relatively slow
Quantitative change to the resin material to the starting position is few, can also pass through a part for the resin material supplied at the end of movement
Or be all supplied to starting position and made up, so the resin material of supply to supply object becomes near uniform.
In addition, in mobile route, relative position will not be more than 2 times by same position, so there is no same position is supplied to set
Fat material more than 2 times and make the situation more than the supply quantitative change of resin material.
In the resin material feedway of the present invention and method, above-mentioned relative position " being back to starting position " is except bag
Containing above-mentioned relative position be back to starting position for the situation of same position beyond, also comprising resin material extend and to reaching
The situation of following location, distance of the position far from starting position only separated by resin material to the degree for reaching starting position.
The movement of above-mentioned relative position can be the mobile person by supplying object maintaining part, also can be to pass through resin material
The mobile person of supply mouth, or also can be both mobile persons by supplying object maintaining part and resin material supply mouth.
Supply object may be, for example, the die cavity of resin molding apparatus, also can be to being arranged at from resin material feedway
The resin material transport tray of the die cavity conveyance resin material of resin molding apparatus.Alternatively, also can be pair for carrying out ester moulding
As thing that is, it is packaged with the substrate of electronic component.
Resin material can be powder shaped, also can be liquid.
In the resin material feedway of the present invention and method, in order to be supplied uniformly across resinous wood to supply object
Material, usually supplies supply object by the translational speed of relative position and from resin material supply mouth the supply speed of resin material
Degree is set to fixed.But such as when situation as shown below, can also make appointing in above-mentioned translational speed and above-mentioned feed speed
One or both is variable.When the situation, since translational speed is compared with feed speed easily control, so more satisfactory is by movement
Speed is set to variable and feed speed is set to constant speed.
Variable situation is set to as by translational speed and/or feed speed, following example can be enumerated.
When supplying resin material when the die cavity of the shape with corner to rectangle, if in order to make relative position successfully move
Move and the relative position is moved with the track of curve, then there is a situation where that resin material does not diffuse to adjacent corner fully.
Therefore, when making relative position curvilinear mobile in adjacent corner, by making translational speed slack-off compared with when linearly moving
(and/or accelerating feed speed), can make supply quantitative change of the resin material to adjacent corner more, so as to integrally make resin in die cavity
Material is more near uniform.
If in addition, making relative position be moved along the edge of die cavity, resin material will not be extended to compared with the edge more outward
Side, so the amount of the resin material of adjacent edges becomes more compared with other positions.Therefore, when making relative position be moved along the edge of die cavity
When, by making translational speed compared with the situation that the inside of die cavity is moved when accelerates (and/or make feed speed slack-off), can make
Resin material tails off to the quantity delivered of adjacent edges, so as to integrally make resin material more near uniform in die cavity.
The feed speed of resin material except in it is above-mentioned be just initially supplied it is rear it is slack-off in addition to, also exist because to resin material confession
Failure of device of resin material etc. is sent out to mouth and becomes unstable situation.Therefore, can be supplied in the resin material of the present invention
The feed speed test section of the feed speed of detection resin material is set to device., also can be further in tree when the situation
Fat material feeding apparatus is set detects that the exception of feed speed (exceedes or do not reach set setting by feed speed test section
Scope) when, the manager of device is made a sound, light or the warning for being shown in the image of display device (display) etc.
Warning portion.Alternatively, when the exception of feed speed is detected by feed speed test section, can also stop move portion action and
Supply of the resin material from resin material supply mouth., also similarly, can be to upper in the resin material supply method of the present invention
The feed speed of resin material is detected during stating supply object supply resin material, further, can also detect supply
Give a warning during the exception of speed or stop the supply of resin material.
Hereinafter, using Fig. 1~Figure 10, to the resin material feedway, resin material supply method, resin of the present invention into
Shape dress is put and the more particular embodiment of resin forming product manufacture method illustrates.
(1) composition of the resin material feedway of the present embodiment：
The schematic configuration of the resin material feedway 10 of the present embodiment is represented in Fig. 1.Resin material feedway
10 be the device to transferring the resin material P of the supply powder shaped of pallet 20 for the resin material of supply object.
Resin material feedway 10 has the resin material maintaining part 11 and groove 12 for keeping resin material P.The one of groove 12
End is connected to resin material maintaining part 11, and the other end sets the promising supply of the pallet 20 resin material P that transferred to resin material to open
The resin material supply mouth 121 of mouth.In addition, resin material feedway 10 has：Excitation 13, it makes resin material maintaining part
11 and groove 12 vibrate；And measurement unit 14, it measures the resin material maintaining part 11 comprising resin material P and the weight of groove 12.
The top of resin material maintaining part 11, has the former supply unit 15 to the resin material maintaining part 11 supply resin material P.Original supplies
To portion 15 be in its underpart set the promising opening that resin material P is supplied to resin material maintaining part 11 former supply mouth 151 and
The former supply unit excitation 152 for vibrating the original supply unit 15.Resin material maintaining part 11 is being arranged in former supply mouth 151 just
Lower section.
Holding station (the supply for keeping resin material transfer pallet 20 is configured with the underface of resin material supply mouth 121
Object maintaining part) 16.In the move portion 17 that makes the holding station 16 move in the horizontal direction of being arranged with of holding station 16.It is mobile
Portion 17 can make holding station 16 any one of (transverse direction of Fig. 1) and Y-direction (direction vertical with paper of Fig. 1) in X direction
With less than in the range of set maximum speed arbitrary speed move, and can make holding station 16 in X direction with Y-direction two
Person is mobile at the same time.Therefore, it can also make resin material supply mouth 121 and the relative position edge of the horizontal direction of holding station 16 any
Moved with arbitrary speed in direction.In addition, generally by holding station 16 merge with move portion 17 and winner be known as " XY platforms ".
Resin material feedway 10, which also has, moves into the resin material transfer pallet 20 before being supplied to resin material P
And be placed on holding station 16, and the resin material being supplied to after resin material P is transferred into 20 self-sustaining platform 16 of pallet
On the transferred unit 18 that takes out of.
Resin material feedway 10 further has control unit 19.Control unit 19 by the hardware and software of computer and
Realize, control from resin material supply mouth 121 by resin material P supply to resin material transfer pallet 20 when ON/OFF or confession
To speed, and control the action of move portion 17.Details on the control carried out using control unit 19, below with resin
The overall action of material feeding apparatus 10 illustrates in the lump.
As shown in Fig. 2 (a), resin material transfer pallet 20 possesses with the shaping dies corresponding to compression molding apparatuss
Shape, the size of die cavity, and equivalent to the resin material resettlement section 21 of above-mentioned supply subject area.Resin material resettlement section 21 by
The opening portion of frame 211 and covering resin material storage frame 211 is housed for the resin material of the frame material with rectangular opening portion
Below formed from shape film F.Suction air is provided with below resin material collecting frame 211 and is made thin from shape
Film F is adsorbed to the adsorbing mechanism (not shown) below this.The inner side of the opening portion of frame 211 is housed in resin material formed with inner circumferential
The end portion of side inwards protrudes the stop 2111 formed.It is provided with and corresponds in the inner side of resin material collecting frame 211
Resin material houses the rectangular frame material of the shape of the opening portion of frame 211, and is to have protuberance 2121, section in outer circumferential side
For the layer tension frame material 212 of inverted L-shaped ring.The side that resin material houses frame 211 is held by transferred unit 18.In transferred unit 18
Be arranged with fixing be located at resin material house frame 211 below the end from shape film F film holding parts 213.
Resin material transfer pallet 20 is to make resin material resettlement section 21 by resin material feedway 10 as following
After the supply (Fig. 2 (a)) for receiving resin material P, lifted by transferred unit 18, then layer tension frame material 212 is relative to resin material
Frame 211 is housed by conducting oneself with dignity relatively to decline untill protuberance 2121 is connected to stop 2111.Thus, formation corresponds to
The resin material receiving space PA (Fig. 2 (b)) of the shape of the die cavity of shaping dies.
(2) the resin material supply method of the action of the resin material feedway of the present embodiment and the present embodiment
Hereinafter, the action to resin material feedway 10 (the resin material supply method of the present embodiment) is said
It is bright.
Operator is in advance to former supply unit 15 supply resin material P.Then, operator's use is arranged at resin material supply
The input units such as the contact panel of device 10 are (not shown) to carry out set operation, thus starts resin material feedway 10
Action.
First, the resin material transfer pallet 20 before being supplied to resin material P is moved into and is placed in guarantor by transferred unit 18
Hold on platform 16.Then, resin material supply mouth 121 is configured at resinous wood by move portion 17 by the control of control unit 19
The mode of the surface of set starting position 22 (with reference to Fig. 3) in the resin material resettlement section 21 of material transfer pallet 20, makes
Holding station 16 moves in the horizontal direction.In the example of fig. 3, by the resin material resettlement section with generally rectangular upper surface
Position near the edge of 21 long side and near the center 245 of the long side is set to starting position 22, but starting position also may be used
For any position in resin material resettlement section 21.
Then, measurement unit 14 is measured resin material maintaining part 11 and groove 12 and the resin material P being contained in them
Weight after being added together.Due to resin material maintaining part 11 and the weight of groove 12 it is known that so passing through the measure of place since then
Weight subtracts the resin material maintaining part 11 and the weight of groove 12, can obtain the resin in resin material maintaining part 11 and groove 12
The weight of material P.In resin material P weight compared with should supply to resin material transfer pallet 20 resin material resettlement section 21
Resin material weight enough situation when, start the resinous wood to resin material resettlement section 21 described in next paragraph
Expect the supply action of P.On the other hand, the weight in resin material P it is insufficient or be zero situation when, control unit 19 with from
Former supply unit excitation 152 assigns former supply unit 15 mode of the vibration of given time, controls the original supply unit excitation
152.Thus, the resin material P in former supply unit 15 is only supplied set amount to resin material by former supply mouth 151 to keep
Portion 11.
Then, control unit 19 assigns vibration to resin material maintaining part 11 and groove 12 with autoexcitation portion 13 with fixed intensity
Mode control the excitation 13.Thus, the resin material of resin material transfer pallet 20 is received from resin material supply mouth 121
Appearance portion 21 is with fixed feed speed supply resin material P.Simultaneously, control unit 19 is so that tree for beginning with the imparting of the vibration
The mode that fat material supply mouth 121 is moved relative to the relative position of the horizontal direction of resin material resettlement section 21, control movement
Portion 17.
In Fig. 3, as an example, the track 23 that the relative position moves is represented.Relative position is first from starting position
22 edges 241 along a long side of resin material resettlement section 21 are moved near the edge 242 of a short side, are sentenced and are drawn in this
The mode of U-shaped, i.e. in a manner of turning U-bend, one facing to 243 side of edge of another long side along short side direction (short side extension side
To) the mobile distance for being of same size degree with resin material supply mouth 121, simultaneously make long side direction (direction of long side extension)
Movement direction reversion.In addition, the displacement distance of short side direction herein is if the tree supplied from resin material supply mouth 121
In the range of fat material P extensions, then it can also be grown compared with the width of resin material supply mouth 121.Thereafter, when relative position is back to length
When near the center 245 of edge direction, similarly turn U-bend and be moved near the edge 242 of an above-mentioned short side.By with this side
Formula nearby turns U-bend in the adjacent edges of a short side and the center of long side direction repeatedly, when to the edge 243 for reaching another long side
When neighbouring, relative position is moved near the edge 244 of another short side along the edge 243 of another long side.Therefore, relative position
One moves facing to 241 side of edge of an above-mentioned long side along short side direction and is of same size degree with resin material supply mouth 121
Distance, simultaneously make long side direction movement direction reversion (turning U-bend).After, relative position one side is in long side direction
Center 245 nearby nearby turns U-bend repeatedly with the edge 244 of another short side, is simultaneously moved near the edge 241 of a long side.
In this way, entirety of the relative position by the resin material resettlement section 21 for supply subject area, finally along the edge 241 of a long side
It is back to starting position 22.In the mobile period of above-described relative position, continue from resin material supply mouth 121 towards resin
Material storage portion 21 supplies resin material P.
Herein, relative position " by the entirety for the supply subject area for supplying object " is except comprising so that resin material
Supply mouth makes the track of relative movement (be supplied with resin material with being spaced closely together by supplying the overall mode of subject area
Mouthful width degree) beyond the situation filled up, also comprising the resin material expansion between track supply from resin material supply mouth
The situation opened up and separated throughout the degree to supply subject area entirety.Further, also comprising track and supply subject area
End between with supplied from resin material supply mouth resin material extension and throughout to supply subject area entirety degree
Situation about separating.
As shown in figure 4, the (" rising stage in figure during the feed speed of resin material P is certain from after being just initially supplied
Between ") interior miss the mark value.Therefore, as shown in Fig. 5 (a), supplied when being initially supplied to the resinous wood near starting position 22
The position that the quantity delivered of material P supplies more thereafter tails off.In addition, in Fig. 5 (a), observed from starting position 22, in relative position
Also there are resin material P, its reason for the opposite side of moving direction to be：Resin material supply mouth 121 has certain width, with
And resin material P extends when falling to resin material resettlement section 21 from resin material supply mouth 121 in the horizontal direction.Moreover, work as
When relative position is back to starting position 22 after the entirety by resin material resettlement section 21, to being just initially supplied rear resin material
The starting position 22 that the quantity delivered of P is less nearby supplies resin material P again, so the resin material P near starting position 22
Amount when the situation without the supply again compared with, become close to the amount of resin material P in other positions (that is, closely
Uniformly) (Fig. 5 (b)).
The speed (translational speed) that relative position moves both was fixed, can be also set to as illustrated in following according to position
It is variable.In addition, the translational speed on relative position, compared with during rising after just starting movement, the control after slightly moving
System is easier.Therefore, in the present embodiment, the translational speed of time after during relatively rising is set to variable.For example,
The position of 23 transfer U-bend of track, supply to the region in the outside of curve (in Fig. 3 label symbol 25 and represent region) tree
The amount of fat material P tails off compared with the position of straight line, so by becoming the translational speed of relative position at the position for turning U-bend
Slowly, and slightly morely to curved portion supply resin material P.Tree is extended in this way, slightly supply to the resin material P of curve more
The outside of the less curve of the amount of fat material P, thus enables that the quantity delivered of resin material P is near uniform.
In addition, as shown in fig. 6, because of the resin supplied when relative position is moved along the edge 24 of resin material resettlement section 21
Material P1 will not extend to 24 side of edge, if so making relative position become with constant speed movement compared with resin material resettlement section
The resin material P2 supplied during 21 inside movement is more.Therefore, by making relative position along resin material resettlement section 21
Translational speed when edge 24 moves is fast compared with the translational speed of other positions, and the quantity delivered of resin material P can be made almost equal
It is even.
The tree of the resin material transfer pallet of resin material is supplied using the resin material feedway 10 of the present embodiment
Fat material storage portion (and corresponding to its compression molding apparatuss shaping dies die cavity) flat shape be not limited to Fig. 3 institutes
The rectangle shown, can be set to the arbitrary shapes such as the quadrangle beyond rectangle, the polygon beyond quadrangle, circle.Such as
When the use of resin material resettlement section 21A being the situation that circular resin material transfers pallet 20A, relative position can be made along Fig. 7
(a) the track 23A1 movements shown in.In the movement, relative position be using the adjacent edges of resin material resettlement section 21A as
Starting position 22A, first, after moving nearly 90 ° in arc-shaped along the edge, one facing to round center movement equivalent to tree
The amount of the width of fat material supply mouth 121, simultaneously turns U-bend, in concentric circles (circular arc) shape in the opposite direction mobile nearly 90 ° it
Afterwards, further turn U-bend, the action is repeated until to the immediate vicinity for reaching the circle.Be set to " nearly 90 ° " herein and
The reason for non-90 degree, is：In order to ensure turning the region needed for U-bend.Then, relative position will in the immediate vicinity movement of the circle
Nearly 180 °, one facing to resin material resettlement section 21A edge movement equivalent to the width of resin material supply mouth 121 amount,
Simultaneously turn U-bend, after moving nearly 90 ° to opposite direction in concentric circles (circular arc) shape, further turn U-bend, be repeated
The action is until to reaching adjacent edges.Further, relative position in adjacent edges move nearly 180 ° after, carry out with before this
The identical operation from the center of adjacent edges direction circle, the followed by operation from round centrally directed adjacent edges.Then,
Relative position in the adjacent edges in arc-shaped move when to starting position 22A is reached, terminate a series of movement.
In the example of Fig. 7 (a), relative position turns U-bend whenever nearly 90 ° mobile, to reach round center or
Nearly 180 ° are moved during edge, but also can turn U-shaped whenever moving nearly 180 ° as shown in Fig. 7 (b) with track 23A2
It is curved, to when reaching round center or edge move nearly 360 °.
The schematic configuration of the resin material feedway 10A of variation is represented in fig. 8.The resin material supply of variation
Device 10A is also detected in addition to inscape possessed by above-mentioned resin material feedway 10 with feed speed
Portion 191 and alarm sending part 192.Feed speed test section 191 is to during supply object supply resin material, obtaining metering
The weight that portion 14 is measured, resin material is detected to the feed speed of supply object from the time change of the weight.Alarm is sent out
Portion 192 is sent to deviate the situation of given area in the feed speed using the resin material detected by feed speed test section 191
When send alarm tone.Alarm sending part 192 can also replace sending alarm tone, and send light or in showing image on picture.If for
Give speed deviations given area, then the amount of supply to the resin material of supply object can deviate desired value, so by with this
Mode sends alarm, can prevent from carrying out ester moulding with the amount of the resin material of mistake.In addition, it can also replace setting alarm to send out
Portion 192 is sent, and the feed speed for being arranged on the resin material detected using feed speed test section 191 deviates given area
The stop control unit for stopping device during situation.
In example more than, said exemplified by supplying the situation of resin material to resin material transfer pallet 20
It is bright, but also can be from resin material feedway 10 to the resin material transfer pallet supply resinous wood with composition other than the above
Material.In addition, can also be set to shaping dies to transport, tree is supplied to the die cavity of the shaping dies from resin material feedway 10
Fat material, also can supply resin material from resin material feedway 10 to the surface for being packaged with the substrate of electronic component.Resin
Material is not limited to powder shaped, also can be used liquid.
(3) resin molding apparatus (compression molding apparatuss) of the present embodiment and the embodiment party of resin forming product manufacture method
Case：
The resin molding apparatus of the present embodiment has above-mentioned resin material feedway 10 and compression molding portion 30.With
Under, the composition in compression molding portion 30 is illustrated using Fig. 9.
In compression molding portion 30, in lower part, the corner of fixed disk 311 is equipped with connecting rod 32 (altogether 4) respectively, even
The upper end of bar 32 is nearby provided with rectangular top fixed disk 312.Between lower part fixed disk 311 and top fixed disk 312
It is provided with rectangular movable platform 33.Movable platform 33 is provided with the hole passed through for connecting rod 32 in corner, can be along connecting rod 32
Lower movement.On lower part fixed disk 311, the mold closing mechanism 34 of the promising device for moving up and down movable platform 33 is set.
Lower heater 351 is configured with above movable platform 33, on lower heater 351, is provided with conduct
The lower die LM of above-mentioned 2nd shaping dies.
On top, the lower surface of fixed disk 312 is configured with upper portion heater 352, under upper portion heater 352, is provided with
For the upper mold UM of above-mentioned 1st shaping dies.Below upper mold UM, the substrate S for being packaged with semiconductor chip can be installed.Upper mold
UM and lower die LM systems to ground mutually to configuring.
The action in compression molding portion 30 is as follows.First, by substrate travel mechanism (not shown), pacify below upper mold UM
Dress is packaged with the substrate S of semiconductor chip.Then, as described above as will be supplied with resin in resin material feedway 10
The resin material transfer pallet 20 of material P is transferred to the surface of lower die LM by transferred unit 18, by resin material receiving space
Resin material P in PA with housing to die cavity MC in the lump from shape film F.In addition, to upper mold UM substrate S installation with downwards
The collecting of the resin material P of mould LM can also be contrary to the above order carry out.
In this condition, the resin material P in die cavity MC is heated by using lower heater 351 and makes its soft
Change, and substrate S is heated by upper portion heater 352.In the case where resin material P and substrate S are heated state, lead to
Crossing mold closing mechanism 34 rises movable platform 33, by shaping dies (upper mold UM and lower die LM) molding, hardens resin material P.
After resin material P hardening, decline movable platform 33 by using mold closing mechanism 34 and mold.
Pass through action (the resin forming product manufacturer in resin as described above material feeding apparatus 10 and compression molding portion 30
Method), and manufacturing resin seal has the resin seal product (resin forming product) of semiconductor chip.The resin seal strain obtained is led to
The inner face of lower die LM is crossed by being coated to from shape film F, and is successfully demoulded from lower die LM.
Then, using Figure 10, other embodiments of the resin molding apparatus of the present invention are illustrated.The present embodiment
Resin molding apparatus 40 have material receiving module 41, shaping module 42 and discharge module 43.Material receiving module 41 is to use
With from external reception resin material P and substrate S and be sent to shaping module 42 device, possess above-mentioned resin material feedway
10, and there is substrate receiving division 411.1 shaping module 42 possesses 1 group of above-mentioned compression molding portion 30.3 are indicated in Fig. 10
Platform shapes module 42, but the shaping module 42 of any number of units can be set in resin molding apparatus 40.Even if in addition, by resin
Building mortion 40 is completed after beginning to use, and can also increase and decrease shaping module 42.43 system of discharge module will utilize in advance
The resin forming product that shaping module 42 manufactures moves into simultaneously keeper, and have resin forming product maintaining part 431 from module 42 is shaped.
In a manner of through 41,1 or more shaping modules 42 of material receiving module and discharge module 43, conveyance base is provided with
The main carrying device 46 of plate S, resin material transfer pallet 20 and resin forming product.Above-mentioned transferred unit 18 forms main carrying device 46
A part.In addition, in each module, conveyance substrate S, tree are provided between the device in main carrying device 46 and the module
Fat material transfers the secondary carrying device 47 of pallet 20 and resin forming product.
In addition, resin molding apparatus 40 has to make the power supply and control unit (not shown) of above-mentioned each module action.
Action to resin molding apparatus 40 illustrates.Substrate S is to be held in material receiving module 41 by operator
Substrate receiving division 411.Main carrying device 46 and secondary carrying device 47 transport substrate S self-reference substrates receiving division 411 in shaping
The compression molding portion 30 in 1 in module 42, and substrate S is installed to the upper mold UM in the compression molding portion 30.Then, master removes
Device 46 and secondary carrying device 47 is sent to move into resin material transfer pallet 20 to resin material feedway 10.In resin material
In feedway 10, as described above as resin material P is supplied to resin material transfer pallet 20.Main carrying device 46 and secondary conveyance
Device 47 transports the resin material for being supplied with resin material P transfer pallet 20 to the shaping that substrate S is provided with upper mold UM
The compression molding portion 30 of module 42, after resin material transfer pallet 20 is configured on the lower die LM in the compression molding portion 30,
Resin material P is supplied to the die cavity MC of lower die LM from resin material transfer pallet 20.Thereafter, main carrying device 46 and pair are passed through
Carrying device 47 takes out of resin material transfer pallet 20 from compression molding portion 30, is pressed in the compression molding portion 30 thereafter
Shorten shape into.During shaping is compressed using the compression molding portion 30, to other compression molding portions 30 carry out with it is identical before this
Operation, thus a face staggering time one side can concurrently be compressed shaping between multiple compression molding portions 30.Pass through compression
The resin forming product being shaped to achieve is to be taken out of by main carrying device 46 and secondary carrying device 47 from compression molding portion 30, is moved into
To the resin forming product maintaining part 431 for discharging module 43 and keep.User suitably protects resin forming product from resin forming product
Portion 431 is held to take out.
The present invention is not limited to above-mentioned each embodiment certainly, in addition to the aspect described in described above, also can
Carry out various modifications.
Claims (10)
1. a kind of resin material feedway, it is characterised in that possess：
A) object maintaining part is supplied, it keeps the supply object of the object as supply resin material；
B) resin material supply mouth, it is arranged on the top of the supply object maintaining part；
C) move portion, it makes above-mentioned resin material supply mouth relative to the supply object for being maintained at above-mentioned supply object maintaining part
The relative position movement of the horizontal direction of thing；And
D) control unit, it will not be in mobile route by same position more than 2 times from starting position with above-mentioned relative position
The mode that ground is back to the starting position controls the movement of the above-mentioned move portion in the supply subject area of above-mentioned supply object.
2. resin material feedway according to claim 1, wherein, the translational speed of above-mentioned relative position and from above-mentioned
Any one of feed speed of resin material of resin material supply mouth supply or both is variable.
3. resin material feedway according to claim 2, wherein, above-mentioned translational speed is variable, and above-mentioned supply speed
Spend for constant speed.
4. resin material feedway according to any one of claim 1 to 3, it possesses feed speed test section, should
Feed speed of the feed speed test section detection from the resin material of above-mentioned resin material supply mouth supply.
A kind of 5. resin material supply method, it is characterised in that：Simultaneously make the supply object of the object for supply resin material
Relative position with the horizontal direction of the resin material supply mouth of the top that is arranged on the supply object is with from starting position
Will not in mobile route same position 2 times in a manner of Shangdi is back to the starting position in above-mentioned supply object
Subject area movement is supplied, resin material simultaneously is supplied to the supply object from the resin material supply mouth.
6. resin material supply method according to claim 5, wherein, the translational speed of above-mentioned relative position and from above-mentioned
Any one of feed speed of resin material of resin material supply mouth supply or both is variable.
7. resin material supply method according to claim 6, wherein, above-mentioned translational speed is variable, and above-mentioned supply speed
Spend for constant speed.
8. resin material supply method according to any one of claims 5 to 7, it is detected supplies from above-mentioned resin material
The feed speed of the resin material of mouth supply.
9. a kind of resin molding apparatus, it is characterised in that possess：
Resin material feedway according to any one of claim 1 to 4；
Compression molding portion, its 2nd shaping dies with the 1st shaping dies, with die cavity and by the 1st shaping dies and this
The clamping of 2 shaping dies molding；And
Transferred unit, it will be transferred to by above-mentioned resin material feedway to be supplied with the supply object of resin material
State on die cavity, the resin material is supplied to the die cavity from the supply object.
10. a kind of resin forming product manufacture method, it is characterised in that there are following steps：
Above-mentioned supply object is supplied by the resin material supply method according to any one of claim 5 to 8 and is set
The step of fat material；
The supply object for being supplied with resin material is transferred to the die cavity of the 2nd shaping dies, and from the supply object pair
The die cavity supplies the step of resin material；And
The step of the 2nd shaping dies that resin material is fed with 1st shaping dies and die cavity is molded.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016206633A JP6298871B1 (en) | 2016-10-21 | 2016-10-21 | Resin material supply device, resin material supply method, resin molding device, and resin molded product manufacturing method |
| JP2016-206633 | 2016-10-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107972220A true CN107972220A (en) | 2018-05-01 |
| CN107972220B CN107972220B (en) | 2019-12-27 |
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| CN201710977144.6A Active CN107972220B (en) | 2016-10-21 | 2017-10-19 | Resin material supply device and method, resin molding device, and resin molded product manufacturing method |
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| Country | Link |
|---|---|
| JP (1) | JP6298871B1 (en) |
| KR (1) | KR102074404B1 (en) |
| CN (1) | CN107972220B (en) |
| TW (1) | TWI656958B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112776241A (en) * | 2019-11-07 | 2021-05-11 | 东和株式会社 | Resin material supply device, resin molding device, and method for manufacturing molded article |
| CN112840441A (en) * | 2018-10-16 | 2021-05-25 | 东和株式会社 | Conveying device, resin molding device, conveying method, and method for manufacturing resin molded product |
| US11981059B2 (en) | 2018-10-16 | 2024-05-14 | Towa Corporation | Conveying apparatus and resin molding apparatus |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6894479B2 (en) * | 2018-04-16 | 2021-06-30 | Ｔｏｗａ株式会社 | Powder / granular material supply device, resin molding device, powder / granular material supply method, and method for manufacturing resin molded products |
| JP6598918B2 (en) * | 2018-04-16 | 2019-10-30 | Ｔｏｗａ株式会社 | Granule supply device, resin molding device, powder supply method, and method of manufacturing resin molded product |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1099189A (en) * | 1993-04-22 | 1995-02-22 | 东和株式会社 | Moulded resin is with the method and apparatus of seal electronic element |
| CN101460256A (en) * | 2006-06-02 | 2009-06-17 | 三键株式会社 | Material application device and material application method |
| CN104708734A (en) * | 2013-11-28 | 2015-06-17 | 东和株式会社 | Method and mechanism for supplying resin material of compression molding apparatus, compression molding method and compression molding apparatus |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5793806B2 (en) * | 2011-08-17 | 2015-10-14 | アピックヤマダ株式会社 | Resin molding equipment |
| JP5731009B2 (en) * | 2011-11-08 | 2015-06-10 | アピックヤマダ株式会社 | Resin sealing device and resin supply device |
| JP6057880B2 (en) * | 2013-11-28 | 2017-01-11 | Ｔｏｗａ株式会社 | Resin material supply method and supply device for compression molding apparatus |
| JP6612172B2 (en) * | 2016-04-25 | 2019-11-27 | Ｔｏｗａ株式会社 | Resin molding apparatus, resin molding method, resin molded product manufacturing method, and product manufacturing method |
-
2016
- 2016-10-21 JP JP2016206633A patent/JP6298871B1/en active Active
-
2017
- 2017-06-16 TW TW106120168A patent/TWI656958B/en active
- 2017-10-13 KR KR1020170133344A patent/KR102074404B1/en active IP Right Grant
- 2017-10-19 CN CN201710977144.6A patent/CN107972220B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1099189A (en) * | 1993-04-22 | 1995-02-22 | 东和株式会社 | Moulded resin is with the method and apparatus of seal electronic element |
| CN101460256A (en) * | 2006-06-02 | 2009-06-17 | 三键株式会社 | Material application device and material application method |
| CN104708734A (en) * | 2013-11-28 | 2015-06-17 | 东和株式会社 | Method and mechanism for supplying resin material of compression molding apparatus, compression molding method and compression molding apparatus |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112840441A (en) * | 2018-10-16 | 2021-05-25 | 东和株式会社 | Conveying device, resin molding device, conveying method, and method for manufacturing resin molded product |
| CN112840441B (en) * | 2018-10-16 | 2024-03-26 | 东和株式会社 | Conveying device, resin molding device, conveying method, and method for manufacturing resin molded product |
| US11981059B2 (en) | 2018-10-16 | 2024-05-14 | Towa Corporation | Conveying apparatus and resin molding apparatus |
| CN112776241A (en) * | 2019-11-07 | 2021-05-11 | 东和株式会社 | Resin material supply device, resin molding device, and method for manufacturing molded article |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201815546A (en) | 2018-05-01 |
| CN107972220B (en) | 2019-12-27 |
| TWI656958B (en) | 2019-04-21 |
| KR102074404B1 (en) | 2020-02-06 |
| JP6298871B1 (en) | 2018-03-20 |
| JP2018065335A (en) | 2018-04-26 |
| KR20180044190A (en) | 2018-05-02 |
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